TW201403749A - Method of setting conduct in through holes of substrate - Google Patents

Abstract

The present invention relates to a conduct installation method of through holes in the substrate which comprises a blank ceramic substrate with excellent dissipation effect prepared at first, one or more than one through holes molded on the ceramic substrate by a processing means to fill the conductor slurry into through holes of the ceramic substrate through process operation. The conductor slurry in the through holes of ceramic substrate can be molded and solidified in the through holes by sintering or solidifying process. Then coating can be proceeded in the surface of the ceramic surface to mold the coating layer. The predetermined layout can be proceeded on both the top and bottom surfaces of the coating layer on the ceramic substrate through yellow microfilm process to complete the conduct installation process on the through holes of ceramic substrate and achieves the aims of ceramic substrate having effect of excellent electric conductivities.

Description

Method for providing a conductor through a through hole of a substrate

The present invention provides a method for providing a conductor through a through hole of a substrate, in particular, a method of forming a conductive paste, a coating layer, and a wiring layout by providing a through hole in a heat dissipation type ceramic substrate, and manufacturing the upper and lower layers through the ceramic substrate. The surface of the preset circuit layout is conductive, and the ceramic substrate with good electrical conductivity and miniaturization.

According to the increasing technology of electronic/electrical products, the popularity of various wireless signal transmission products is prevalent, and the usage rates of various wireless signal transmission devices such as wireless LAN and wireless modem are relatively high. The number of circuit boards and requirements for wireless devices is also relatively high. For example, high-frequency, high-power, and low-loss characteristics are required. For circuit board characteristics, it is necessary to manufacture circuit boards that meet the characteristics of the circuit board. In the conventional thin film process, the circuit substrate is placed in a vacuum environment, and a special metal mesh cover is used for vapor deposition or sputtering processing, and then a circuit is formed on the surface of the circuit substrate, although a thin straight line can be formed and sputter formed. The thickness of the circuit is not uniform, but because the line is thin and contains oxide or nitride impurities, the coating forming the line is granular, easily contains impurities, and has more impurities at the thinner position of the line. The transmission efficiency is poor, and the heat dissipation effect is not satisfactory.

Another industry adopts a thick film process with lower manufacturing cost, but the flatness of the fabricated circuit is not good enough to meet the requirements of high frequency lines; A plurality of through holes are drilled in the plate, and then sputtered in each through hole, and metallization is formed in the through hole of the circuit substrate by vacuum sputtering, and then the plated sweet hole is used to achieve the upper and lower conduction. If the thickness of the copper plating is insufficient and the hole is too large to be matched, it may easily cause the hole to be filled and the subsequent process may occur, causing the phenomenon of the upper and lower leakage, or the hole diameter of the through hole on the circuit substrate is too small, so that the hole is filled when the hole is filled. Air, forming pores, affecting problems such as poor electrical conduction and reduced product reliability.

Therefore, how to solve the problem of the poor wiring conduction caused by the filler processing operation of the through hole in the current process of the circuit substrate, and the problem and trouble of being susceptible to impurities, pores or bubbles in the filling processing operation is to engage in The direction that the industry is eager to improve.

Therefore, in view of the above-mentioned problems and deficiencies, the inventors have collected relevant information, evaluated and considered them through multiple parties, and through years of experience in the industry, through continuous trial and modification, they have designed such good electrical continuity. A patent for the invention of a method for setting a conductor in a through-hole of a substrate for an electronic or electrical product mounting application.

The main object of the present invention is to provide a conductor for the through hole of the substrate, first obtaining a ceramic substrate having a heat dissipation effect, and forming one or more through holes on the ceramic substrate by using a processing method, and then conducting the electrical conductor through the processing operation. The slurry is filled in the through hole of the ceramic substrate, and the conductive paste is molded and fixed in the through hole by the sintering or curing process, that is, the ceramic substrate can be The surface is subjected to a coating process to form a plating layer, and a surface layer and a bottom layer line are formed on the surface of the ceramic substrate through a yellow lithography process to complete the operation of the ceramic substrate by providing a conductive body for the ceramic substrate to have a good electrical conduction effect.

A secondary object of the present invention is to form one or more through holes on the substrate by means of drilling, laser processing, water jet machining or other mechanical processing, and the through holes may be circular, rectangular or triangular. Polygon or geometry, etc., for filling the conductor paste, the conductor paste can be made of silver, copper or tin, and then filling the substrate with the conductive paste by thick film printing or filling. Within each through hole.

A further object of the present invention is that the substrate can be permeable to sintering (temperature system can be between 400 ° C and 1100 ° C) or curing mode after the conductor paste is filled in one or more through holes (the temperature system is between 100 ° C ~ 250 ° C), the conductive paste is formed in one or more through holes, and then by vacuum plating or electroless plating, using vapor deposition, sputtering or ion plating processing, on the ceramic substrate, under The surface forming coating layer can be used to make a predetermined line layout of the coating layer on the upper and lower surfaces of the ceramic substrate through the yellow lithography process.

In order to achieve the above objects and effects, the technical means and the configuration of the present invention will be described in detail with reference to the preferred embodiments of the present invention.

Please refer to the first, second, third and fourth figures, which are a process flow diagram of the present invention, a three-dimensional appearance of a through-hole on a substrate, a side cross-sectional view of a preferred embodiment, and a side view of another embodiment. In the cross-sectional view, it can be clearly seen from the figure that the method of providing a conductor in the through hole of the substrate of the present invention is as follows:

(100) First, a ceramic substrate 1 having a blank heat dissipation effect is obtained.

(101) One or more formed through-holes 10 are formed on the ceramic substrate 1 by means of processing means.

(102) The conductor paste 2 is filled into the through hole 10 of the ceramic substrate 1 by a processing operation.

(103) The conductive paste 2 in the through hole 10 of the ceramic substrate 1 is molded and fixed in the through hole by a sintering or curing method.

(104) A vacuum plating or a chemical plating process is performed on the surface of the ceramic substrate 1.

(105) A surface layer and a bottom layer are formed on the ceramic substrate 1 via a yellow light lithography process.

(106) The through hole 10 of the ceramic substrate 1 is completed to provide a conductor operation.

On the ceramic substrate 1, one or more through holes 10 are formed by processing means, and are formed on the ceramic substrate 1 by drilling, laser processing, water jet machining or milling cutter processing or other mechanical processing. a circular hole, a rectangular hole, a triangular hole, a polygonal hole or a geometric hole, etc., various shapes of the through hole 10; and one or more through holes 10 of the ceramic substrate 1 are printed by thick film printing or perfusion Body slurry 2 is filled in In the perforation 10, the electroconductive paste 2 can be filled into the through hole 10 by the screen printing or the screen printing type screen 32 or the scraper 33 by means of the auxiliary tool 3 through the thick film printing system. The vacuum aspirator 31 assists the conductive paste 2 to enter the through hole 10, and can also directly pass the screen printing or the steel plate printing operation with the mesh plate 32 or the scraper 33, without the assistance of the vacuum suction device 31, and the electric conductor paste. 2 is smoothly filled into the through hole 10; the conductive paste 2 may be filled into the one or more through holes 10 of the ceramic substrate 1 through the needle 34 by using a dispensing operation or a syringe injection method, as the conductive paste The 2 series may be made of a metal material such as silver, copper or tin; and in the one or more through holes 10 of the ceramic substrate 1, the conductor paste 2 is filled without causing bubbles or pores, and there is no thickness. There is a phenomenon of unevenness or unevenness, and the conductor paste 2 is molded and fixed in one or more through holes.

Please refer to the fifth, sixth and seventh figures, which are side cross-sectional views, side cross-sectional views and side cross-sectional views of still another embodiment of the present invention, which can be clearly seen from the figure. After the conductor paste 2 is filled into one or more through holes 10 of the ceramic substrate 1, the conductor paste 2 can be molded and fixed in the through hole 10 by high-temperature sintering or solidification processing, and the temperature is high. The sintering temperature may be between 400 ° C and 1100 ° C, and the curing processing temperature is between 100 ° C and 250 ° C, and the ceramic substrate 1 is made of a machine material or an inorganic material, and the through hole of the ceramic substrate 1 is used. The inner conductor paste 2 is subjected to different molding and fixing processes, and the ceramic substrate 1 can be utilized if it is made of a material containing an organic material (for example, phenol resin). In the high-temperature sintering process, the conductor paste 2 is molded into the through hole 10; if the ceramic substrate 1 is made of an inorganic material (for example, glass fiber or alumina, aluminum nitride or tantalum nitride), The conductive paste 2 is molded into the through hole 10 by a curing process; if the ceramic substrate 1 is made of a metal substrate (for example, an aluminum substrate or a copper substrate), high-temperature sintering processing or curing processing can be utilized. The conductor paste 2 is molded into the through hole 10.

And the conductive paste 2 is formed and fixed in the through hole 10, so that the conductive paste 2 can be slightly overflowed to form an arc convex shape on the outer side of the through hole 10, and the surface of the ceramic substrate 1 is slightly protruded; or the conductive body slurry is provided. The material 2 is filled in the through hole 10, and the two sides are flat with the surface of the ceramic substrate 1. The conductive paste 2 can also be slightly concave in the through hole 10, and the two sides are slightly lower into the ceramic substrate. When the surface of the ceramic substrate 1 is subjected to a plating process on the surface of the ceramic substrate 1, the plating film layer 4 can be electrically and electrically connected to the conductive paste 2 of various forms at the through hole 10 of the ceramic substrate 1.

After forming the conductive paste 2 in one or more through holes 10 of the ceramic substrate 1, the upper and lower surfaces of the ceramic substrate 1 are subjected to vacuum deposition or electroless plating, and vapor deposition, sputtering or ion plating may be used. In the processing method, a coating operation is performed on the upper and lower surfaces of the ceramic substrate 1 to form a coating layer 4, and then a yellow lithography operation is performed to form and form a coating layer 4 on the upper and lower surfaces of the ceramic substrate 1. The circuit layout is arranged, and the predetermined circuit layout of the coating layer 4 on the upper and lower surfaces of the ceramic substrate 1 can be electrically conductive through the conductive paste 2 in one or more through holes 10; The upper and lower surfaces of the ceramic substrate 1 are processed in a planar manner, and the conductive paste 2 and the plating layer 4 are molded to maintain the thinness and small volume of the ceramic substrate 1. However, one or more ceramic substrates 1 are provided. The through hole 10 is filled with the electric conductor paste 2, and has a good electric conductive effect. The predetermined circuit layout for forming the upper and lower surface coating layers 4 of the ceramic substrate 1 passes through the electric conductor paste 2 in the through hole 10. A good electrical conduction is achieved.

Therefore, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The method of arranging a conductor in a through hole of a substrate of the present invention is one or more processes formed on the ceramic substrate 1. In the through hole 10, the conductive paste 2 is filled in the through hole 10 by a processing operation, and the conductive paste 2 is molded and fixed in the through hole 10 by a high-temperature sintering or curing method, and is formed on the ceramic substrate. 1 The upper and lower surfaces are subjected to coating processing, and the plating layer 4 is formed, and the predetermined wiring layout of the upper and lower surfaces of the ceramic substrate 1 is formed through the yellow lithography process, and the conductive holes filled in the through holes 10 of the ceramic substrate 1 are used. The body slurry 2 is electrically connected to the predetermined circuit layout of the upper and lower surface coating layers 4, and can achieve the purpose of forming the ceramic substrate 1 having a small volume and good electrical conductivity, and transmitting one or more through the ceramic substrate 1. The through hole 10 is internally filled with the conductor paste 2, and can form good electrical contact with the coating layer 4 on the upper and lower surfaces of the ceramic substrate 1 for the predetermined circuit layout of the upper and lower surfaces of the ceramic substrate 1. A good electrical conduction is achieved, and the effect of the circuit layout application of the ceramic substrate 1 is improved. Therefore, any structure and device that can achieve the aforementioned effects are covered by the present invention, and such simple modification and equivalent knot The structural changes are all included in the scope of the patent of the present invention and are combined with Chen Ming.

The method for arranging a conductor in the through hole of the substrate of the present invention has the following advantages in practical application and implementation, such as:

(1) One or more through holes 10 are formed on the ceramic substrate 1 by drilling, laser processing, water jet machining or milling cutter milling or other mechanical processing methods, and processed by thick film printing in the through hole 10 Or filling mode, filling the electrical conductor paste 2, the predetermined circuit layout of the upper and lower surfaces of the ceramic substrate 1 can be achieved, and good electrical conduction is achieved.

(2) One or more through holes 10 are formed on the ceramic substrate 1. After the conductive paste 2 is filled through the processing, the through hole 10 can be completely filled by the conductive paste 2 without causing pores or bubbles. Moreover, the case where the thickness is not uniform is formed, that is, the conductive paste 2 can be formed into a good electrical conduction function in the through hole 10.

Therefore, the present invention is mainly designed for electrical conduction of a ceramic substrate, wherein one or more through holes are formed by using a ceramic substrate, and the conductive paste is filled through a thick film printing or infusion method in the through hole. And the conductive paste is molded and fixed in the through hole of the ceramic substrate, and then the upper and lower surfaces of the ceramic substrate are processed by coating, and the coating layer is formed, that is, the yellow light lithography process is used to form a preset on the ceramic substrate and the lower surface. The layout of the circuit can reach the preset circuit layout of the upper and lower surfaces of the ceramic substrate, and the formation of good electrical conduction through the conductive paste in the through hole is the main protection focus, and the volume thickness of the ceramic substrate can be reduced, Excellent conductivity and miniaturization And can meet the modern electronic and electrical products, light, thin, short, and small design concepts and demands, but the above is only the preferred embodiment of the present invention, and thus does not limit the patent scope of the present invention. The simple modifications and equivalent structural changes that are made by using the specification and the drawings of the present invention are all included in the scope of the patent of the present invention and are combined with Chen Ming.

In summary, the method for arranging a conductor in the through hole of the substrate of the present invention can achieve its efficacy and purpose during implementation and manufacture. Therefore, the present invention is an excellent application for research and development, and is an application for the invention patent. The requirements, 提出 提出 提出 提出 提出 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审 审

1‧‧‧ceramic substrate

10‧‧‧through holes

2‧‧‧Electrical fluid paste

3‧‧‧Accessories

31‧‧‧Vacuum suction device

32‧‧‧ stencil

33‧‧‧ scraper

34‧‧‧ needle

4‧‧‧ coating layer

The first figure is a process flow chart of the present invention.

The second figure is a perspective view of the through-hole formed on the substrate of the present invention.

The third drawing is a side cross-sectional view of a preferred embodiment of the invention.

Figure 4 is a side cross-sectional view showing another embodiment of the present invention.

Figure 5 is a side cross-sectional view showing still another embodiment of the present invention.

Figure 6 is a side cross-sectional view of the present invention.

Figure 7 is a side cross-sectional view showing still another embodiment of the present invention.

Claims (10)

A method for providing a conductor through a through hole of a substrate, wherein: (a) obtaining a ceramic substrate; (b) forming a through hole on the ceramic substrate by using a processing means; (c) filling the conductive paste into the ceramic substrate through a processing operation; (d) forming and fixing the conductor paste in the through hole of the ceramic substrate in the through hole; (e) coating the surface of the ceramic substrate; (f) fabricating the ceramic substrate by a yellow lithography process The surface layer and the bottom layer line; (g) completing the operation of providing a conductor for the through hole of the ceramic substrate. The method of providing a conductor through a through hole of a substrate according to claim 1, wherein the ceramic substrate of the step (a) is a ceramic plate having a heat dissipation effect. The method for setting a conductor through a through hole of a substrate according to claim 1, wherein the processing method of the step (b) is drilling, laser processing, water jet machining or milling, milling machining or machining; And forming one or more through holes on the ceramic substrate. The method of providing a conductor through a through hole of a substrate according to claim 3, wherein one or more through holes are formed on the ceramic substrate, and the through holes are circular holes, rectangular holes, triangular holes, polygonal holes or Geometric holes. A method of providing a conductor in a through hole of a substrate according to claim 1 of the patent application, The processing operation in the step (c) is to print the conductive paste into the through hole of the ceramic substrate by a screen printing operation or a steel plate printing operation of a thick film printing method, and apply a vacuum suction operation to the through hole. The auxiliary conductive paste enters the through hole. The method of providing a conductor through a through hole of a substrate according to claim 1, wherein the processing operation of the step (c) is to print the conductive paste by a screen printing operation or a steel plate printing operation of a thick film printing method. Inside the through hole of the ceramic substrate. The method of placing a conductor through a through hole of a substrate according to claim 1, wherein the processing operation of the step (c) is performed by injecting a potting method or a syringe injection process to inject a conductive paste into the ceramic. Inside the through hole of the substrate. The method of providing a conductor through a through hole of a substrate according to the first aspect of the invention, wherein the conductive paste in the through hole of the ceramic substrate in the step (d) is passed through a high temperature sintering method or a curing method, and the conductive paste is used. The material is formed and fixed in the through hole; the temperature of the high temperature sintering is between 400 ° C and 1100 ° C; and the curing processing temperature is between 100 ° C and 250 ° C. The method for providing a conductor through a through hole of a substrate according to claim 1, wherein the ceramic substrate of the step (e) is subjected to a vacuum coating, an electroless plating, an evaporation coating or a sputtering or ion plating process to perform ceramic processing. Coating on the upper and lower surfaces of the substrate, forming a coating layer. Method for providing a conductor in a through hole of a substrate according to claim 1 of the patent application The conductive paste of the step (c) or (d) is a slurry made of silver, copper or tin.