CN111128440A - Liquid metal conductive slurry, preparation method thereof and electronic device - Google Patents
Liquid metal conductive slurry, preparation method thereof and electronic device Download PDFInfo
- Publication number
- CN111128440A CN111128440A CN202010013925.5A CN202010013925A CN111128440A CN 111128440 A CN111128440 A CN 111128440A CN 202010013925 A CN202010013925 A CN 202010013925A CN 111128440 A CN111128440 A CN 111128440A
- Authority
- CN
- China
- Prior art keywords
- liquid metal
- conductive paste
- metal conductive
- powder
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
The invention provides liquid metal conductive slurry, a preparation method thereof and an electronic device, and relates to the technical field of new materials. The liquid metal conductive paste provided by the invention comprises the following components in percentage by weight: 5-30% of main resin, 10-60% of conductive filler, 2-30% of electron irradiation curing agent, 1-40% of liquid metal, 10-30% of reactive diluent and 0-10% of auxiliary agent, wherein the liquid metal is a metal simple substance or alloy with the melting point lower than room temperature. The technical scheme of the invention can reduce pollution in the forming process of the conductive circuit, and the conductive circuit can be manufactured on the non-temperature-resistant base material.
Description
Technical Field
The invention relates to the technical field of new materials, in particular to liquid metal conductive slurry, a preparation method thereof and an electronic device.
Background
In recent years, with the rapid development of electronic information technology, the market has increasingly strict requirements on the specificity and functionality of printed conductive materials. The conductive material is gradually developed into the composite conductive paste from a single material such as the original metal, carbon and the like.
Most of the conductive paste at the present stage adopts a thermal curing mode to prepare conductive circuits in electronic devices. Common thermosetting conductive pastes can be classified into oil-based pastes and aqueous-based pastes depending on the type of solvent used. After the forming, the contained solvent is gradually volatilized or absorbed, so that the conductive particles are mutually contacted to realize the conductive function. The oily slurry contains a large amount of organic solvent, which causes air pollution and damages to operators. Although the aqueous slurry does not cause damage to people, the aqueous slurry has the defects of long baking time, high energy consumption, incapability of meeting the molding requirement on a non-temperature-resistant base material, serious pollution and low efficiency due to high specific heat of water.
Disclosure of Invention
The invention provides liquid metal conductive slurry, a preparation method thereof and an electronic device, which can reduce pollution in the forming process of a conductive circuit and can manufacture the conductive circuit on a non-temperature-resistant base material.
In a first aspect, the invention provides a liquid metal conductive paste, which adopts the following technical scheme:
the liquid metal conductive paste comprises the following components in percentage by weight: 5-30% of main resin, 10-60% of conductive filler, 2-30% of electron irradiation curing agent, 1-40% of liquid metal, 10-30% of reactive diluent and 0-10% of auxiliary agent, wherein the liquid metal is a metal simple substance or alloy with the melting point lower than room temperature.
Optionally, the main body resin comprises one or more of silicone resin, acrylic resin, polyurethane modified acrylic resin and epoxy acrylate.
Optionally, the conductive filler includes one or more of silver powder, copper powder, silver-copper powder, carbon powder, gold powder, palladium powder, platinum powder, and nickel powder.
Optionally, the reactive diluent comprises one or more of methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, hydroxyethyl methacrylate, tetrahydrofurfuryl acrylate, lauryl acrylate, methoxyethyl acrylate, isobornyl acrylate.
Optionally, the liquid metal includes one or more of gallium indium alloy, gallium tin alloy, gallium simple substance, gallium indium tin alloy, and gallium indium tin zinc alloy.
Optionally, the electron irradiation curing agent comprises one or more of hexanediol diacrylate, tripropylene glycol diacrylate and trimethylolpropane triacrylate.
Optionally, the auxiliary agent comprises one or more of a plasticizer, an anti-aging agent, an ultraviolet absorber and an antifoaming agent.
Optionally, the liquid metal is present in the liquid metal conductive paste in the form of liquid metal droplets and/or liquid metal microcapsules.
Optionally, the wall of the liquid metal microcapsule is a coating polymer, and the core is the liquid metal.
In a second aspect, the invention provides a preparation method of liquid metal conductive paste, which adopts the following technical scheme:
the preparation method of the liquid metal conductive paste comprises the following steps:
step S1, dissolving the main resin by using a reactive diluent;
s2, adding an electron irradiation curing agent and an auxiliary agent into the material obtained in the S1;
s3, weighing liquid metal and conductive filler, and putting the liquid metal and the conductive filler and the material obtained in the step S2 into a closed container;
step S4, pre-dispersing by using a stirrer;
step S5, after the mixing is finished, processing the materials by using a three-shaft rolling mill to obtain liquid metal conductive slurry;
wherein the liquid metal is a simple metal or an alloy with the melting point lower than room temperature.
In a third aspect, the present invention provides an electronic device comprising a conductive line made from the liquid metal conductive paste of any one of the above.
The invention provides a liquid metal conductive paste, a preparation method thereof and an electronic device, wherein the liquid metal conductive paste comprises the following components: 5% -30% of main resin, 10% -60% of conductive filler, 2% -30% of electron irradiation curing agent, 1% -40% of liquid metal, 10% -30% of active diluent and 0% -10% of auxiliary agent, in the curing process of the conductive circuit made of the liquid metal conductive slurry, due to the existence of the electron irradiation curing agent, the main resin can be polymerized and crosslinked through electron beam irradiation, and then the main resin is converted into solid, the curing of the conductive circuit is realized, and the conductive function is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a scanning electron microscope image of a liquid metal conductive paste provided in an embodiment of the present invention after being printed and cured;
fig. 2 is a flowchart of a method for preparing a liquid metal conductive paste according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention provides a liquid metal conductive paste, which comprises the following components in percentage by weight: 5-30% of main resin, 10-60% of conductive filler, 2-30% of electron irradiation curing agent, 1-40% of liquid metal, 10-30% of reactive diluent and 0-10% of auxiliary agent, wherein the liquid metal is a metal simple substance or alloy with the melting point lower than room temperature.
The main resin is used as a film forming matter, the conductive filler and the liquid metal are used as a conductive functional phase, the electron irradiation curing agent is used for promoting the curing of the main resin, the reactive diluent is used for dissolving the main resin to the required viscosity, and the auxiliary agent is used for promoting the comprehensive performance of the liquid metal conductive slurry.
Illustratively, the weight percentage of the host resin in the liquid metal conductive paste is 5%, 10%, 15%, 20%, 25%, or 30%; the weight percentage of the conductive filler in the liquid metal conductive paste is 10%, 20%, 30%, 40%, 50% or 60%; the weight percentage of the electron irradiation curing agent in the liquid metal conductive slurry is 2%, 5%, 10%, 15%, 20%, 25% or 30%; the weight percentage of the liquid metal in the liquid metal conductive paste is 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35% or 40%; the weight percentage of the reactive diluent in the liquid metal conductive paste is 10%, 15%, 20%, 25% or 30%; the weight percentage of the auxiliary agent in the liquid metal conductive paste is 0%, 2%, 4%, 6%, 8% or 10%.
In the curing process of the conductive circuit made of the liquid metal conductive paste, due to the existence of the electron radiation curing agent, the main resin can be polymerized and crosslinked by electron beam irradiation, and then the main resin is converted into a solid, the curing of the conductive circuit is realized, and further the conductive function is realized, and because the liquid metal is in a liquid state at room temperature and has good fluidity, the cured conductive circuit can have good flexibility, can be stretched and bent, and can keep good resistance stability, the microstructure of the conductive circuit can be seen in fig. 1, and fig. 1 is a scanning electron microscope image printed and cured by the liquid metal conductive paste provided by the embodiment of the invention.
In addition, the conductive circuit made of the liquid metal conductive paste can be cured by electron beam irradiation for 20-60 s, and is very suitable for the RFID electronic tag with extremely high production rate requirement.
The radiation curing process includes infrared radiation curing, ultraviolet radiation curing, visible light curing, electron beam radiation curing, gamma ray radiation curing and other steps, and compared with other radiation curing modes, the electron beam radiation curing mode has the advantages that ① electron beam radiation consists of one set of accelerated electron flow, and under the action of high energy electron beam, free radicals or ionic radicals are produced and cross-linked with other matters to form netted polymer, ② electron beam has high penetrating capacity, usually only relevant to matter density, at most several centimeters, high solid content, high conductive filler filling amount, complete satisfaction of curing depth of electronic paste printing, ③ no need of photoinitiator, and no by-product produced by using photoinitiator in light curing conductive paste.
The conductive circuit prepared by the liquid metal conductive paste provided by the embodiment of the invention can reach 3 x 10 at most6The conductivity of S/m can resist the resistance change of more than 10 ten thousand times without exceeding 50 percent and resist the disconnection of more than 100 ten thousand times.
The liquid metal conductive paste in the embodiment of the invention can be suitable for forming processes such as screen printing, flexography, transfer printing, extrusion type dispensing, steel mesh printing and the like, and can be cured by heating after forming. The liquid metal in the liquid metal conductive paste in the embodiment of the invention is uniformly dispersed before forming, and no phase separation or metal overflow phenomenon is generated in the forming process.
The liquid metal conductive paste in the embodiment of the invention can be printed on various nonmetal base materials such as PET, PVC, PI, PMMA, PC, ABS, PE, PP, PU and the like, and can meet the requirements of different fields of modern industry on the functionality of the liquid metal conductive paste.
The following examples are provided to illustrate the components of the above-described liquid metal conductive paste in detail for the convenience of those skilled in the art to understand and practice the present invention.
Optionally, the main body resin in the embodiment of the present invention includes one or a combination of several of a silicone resin, an acrylic resin, a polyurethane-modified acrylic resin, and an epoxy acrylate.
Optionally, the conductive filler in the embodiment of the present invention includes one or more of silver powder, copper powder, silver-copper powder, carbon powder, gold powder, palladium powder, platinum powder, and nickel powder.
Optionally, the reactive diluent in the embodiment of the present invention includes one or more of methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, hydroxyethyl methacrylate, tetrahydrofuran acrylate, lauryl acrylate, methoxyethyl acrylate, and isobornyl acrylate.
Optionally, the liquid metal in the embodiment of the present invention includes one or more of a gallium indium alloy, a gallium tin alloy, a gallium simple substance, a gallium indium tin alloy, and a gallium indium tin zinc alloy.
Optionally, in the embodiment of the present invention, the liquid metal is uniformly dispersed in the liquid metal conductive paste in the form of liquid metal droplets and/or liquid metal microcapsules, so that each position of the conductive line made of the liquid metal conductive paste has better flexibility. The above includes a variety of cases: firstly, liquid metal is uniformly dispersed in the liquid metal conductive paste only in the form of liquid metal droplets; secondly, the liquid metal is uniformly dispersed in the liquid metal conductive paste only in the form of liquid metal microcapsules; thirdly, the liquid metal is uniformly dispersed in the liquid metal conductive paste in the form of liquid metal droplets and liquid metal microcapsules at the same time. The skilled person can select the desired one according to the actual need.
When the liquid metal is at least partially uniformly dispersed in the liquid metal conductive paste in the form of liquid metal microcapsules, when the conductive circuit is bent, stretched or twisted and deformed, the liquid metal microcapsules can be deformed and broken to release the liquid metal coated in the liquid metal microcapsules, the liquid metal is in a liquid state, and further has better fluidity and deformability, and the liquid metal can fill up a conductive passage, so that the conductive circuit has better flexibility.
Optionally, in the embodiment of the present invention, the capsule wall of the liquid metal microcapsule is a coating polymer, and the capsule core is a liquid metal. Wherein the coating polymer can be vinyl chloride-vinyl acetate copolymer resin, carboxyl modified vinyl chloride-vinyl acetate; one kind of hydroxyl modified vinyl chloride-vinyl acetate copolymer resin. Further, the average molecular weight of the coating polymer is 2 to 4 ten thousand, because the solid content is too high when the resin with too low molecular weight is adjusted to a proper viscosity, which causes a decrease in conductivity, and the resin with too high molecular weight shrinks significantly in size when cured, which easily causes exudation of liquid metal. Optionally, the elongation at break of the coating polymer is 150-250%, and the hardness is Shore A70-100 degrees. The solid content of the coating polymer mixed solution is between 20 and 40 percent, and the viscosity is between 400 and 1200 cp.
Further, the liquid metal droplets or liquid metal microcapsules have a diameter of 3 to 10 microns. When the diameter of the liquid metal liquid drop or the liquid metal microcapsule is smaller than 3 microns, the liquid metal flows less or the capsule wall of the liquid metal microcapsule is not damaged under the bending destructive force, so that a large number of gaps formed among the conductive fillers due to external force deformation cannot be filled, and the resistance rise caused by the effective contact reduction of the conductive fillers cannot be compensated; when the diameter of the liquid metal liquid drop or the liquid metal microcapsule is larger than 10 micrometers, the specific gravity of the liquid metal liquid drop or the liquid metal microcapsule is larger, the phase separation is serious, the liquid metal liquid drop or the liquid metal microcapsule is mainly deposited at the bottom of a printing coating, the surface distribution amount is too small, and in addition, the liquid metal liquid drop or the liquid metal microcapsule with the overlarge diameter is easy to polymerize, so that the stability of the liquid metal conductive paste is poor, in addition, the liquid metal is easy to seep out in the screen printing process, and the short circuit risk is caused when a pattern with complex and low line spacing is.
Optionally, the electron irradiation curing agent in the embodiment of the present invention includes one or more of hexanediol diacrylate, tripropylene glycol diacrylate, and trimethylol triacrylate.
The auxiliary agent in the embodiment of the invention can be comprehensively determined according to the target performance, the forming process and the like of the liquid metal conductive paste, and the auxiliary agent in the embodiment of the invention can comprise one or more of a plasticizer, an anti-aging agent, an ultraviolet absorbent and a defoaming agent.
In addition, the embodiment of the invention also provides a preparation method of the liquid metal conductive paste, which is used for manufacturing the liquid metal conductive paste. Specifically, as shown in fig. 2, fig. 2 is a flowchart of a method for preparing a liquid metal conductive paste according to an embodiment of the present invention, where the method for preparing a liquid metal conductive paste includes:
step S1, dissolving the host resin with a reactive diluent.
It should be noted that, when the liquid metal conductive paste further includes an auxiliary agent, the auxiliary agent may be added after the main resin is dissolved in step S1, and then step S2 is performed.
And S2, adding an electron irradiation curing agent and an auxiliary agent into the material obtained in the S1.
And step S3, weighing the liquid metal and the conductive filler, and putting the liquid metal and the conductive filler into a closed container together with the material obtained in the step S2.
Wherein the liquid metal is a simple metal or an alloy with the melting point lower than room temperature.
Optionally, the container is made of 304 or 316 stainless steel to prevent the liquid metal from reacting with the container. The purpose of sealing the container is to prevent the liquid metal from being oxidized so as to ensure that the liquid metal conductive paste has proper viscosity and better conductivity.
It should be noted that, when the liquid metal exists in the liquid metal conductive paste in the form of liquid metal droplets and/or liquid metal microcapsules, the liquid metal droplets and the liquid metal microcapsules may be prepared, and then mixed with the conductive filler and the material obtained in step S2.
Step S4, pre-dispersing with a stirrer.
Optionally, the stirring paddle is made of 304 or 316 stainless steel to prevent the liquid metal from reacting with the container. The rotating speed of the stirring paddle in the pre-dispersion process is 50r/min to 2000 r/min. The stirring paddle used in the pre-dispersion process can be one of a rotating belt type, a toothed sheet type and an anchor type.
And step S5, after the mixing is finished, processing the materials by using a three-shaft rolling mill to obtain the liquid metal conductive slurry.
Optionally, the material of the roller in the three-shaft rolling mill is zirconia, and the rotating speed ratio of the roller is 1: 3: 9.
illustratively, liquid metal microcapsules can be prepared in two ways:
in a first example, a method of making a liquid metal microcapsule comprises:
dissolving the coating polymer into a uniform solution, weighing the solution according to the proportion and uniformly mixing the solution;
weighing liquid metal, and putting the liquid metal and the uniform solution into a closed container which can be inserted into an ultrasonic probe and has a stirring function;
inserting an ultrasonic probe, filling protective gas, performing ultrasonic oscillation, and simultaneously starting stirring for mixing;
after the mixing is finished, the materials are stirred and defoamed by a planetary homogenizer to obtain the liquid metal microcapsule.
Optionally, the ultrasonic probe has power of 550W and frequency of 10KHz-50 KHz. The ultrasonic treatment time is 10-100 min. The rotation speed range of the planetary homogenizer is 500-1500rpm, and the liquid metal microcapsule has too small size and light specific gravity when the rotation speed exceeds 1500rpm, more liquid metal microcapsules float on the surface in the molding process, insufficient dispersion when the rotation speed is lower than 500rpm, and overlarge liquid metal microcapsule size. The optimal time for the treatment of the planetary homogenizer is 3-10 minutes, and the treatment is preferably interrupted for 30-120 seconds every 30-60 seconds, so that the adverse effect caused by overhigh temperature is avoided.
In a second example, a method of making a liquid metal microcapsule comprises:
dissolving the coating polymer into a uniform solution, weighing liquid metal according to a proportion and uniformly mixing;
adding the mixed materials into a ball milling tank for ball milling;
wherein, according to the volume ratio of the materials to the grinding balls being 3: 1 to 1: 3 adding grinding balls; selecting the particle size of the grinding balls to be 0.2-3.0mm, wherein when the diameter of the grinding balls is too large, liquid metal microcapsules with the size less than 5 microns cannot be obtained, and when the diameter of the grinding balls is too small, the ball milling dispersion energy is reduced, and the size uniformity of the liquid metal microcapsules is poor; selecting a revolution rotation speed to perform ball milling for 5-30min under the conditions of 900-;
filtering, discharging and weighing.
In addition, the embodiment of the invention also provides an electronic device, which comprises a conductive circuit, wherein the conductive circuit is made of the liquid metal conductive paste. The electronic device can be any electronic device needing a conductive circuit, such as a flexible sensor, wearable equipment, a flexible electronic tag, an FPC (flexible printed circuit) board and the like, and is particularly suitable for electronic devices needing a flexible conductive circuit.
In order to facilitate a better working of the liquid metal conductive paste of the present invention, several specific examples are provided below to illustrate the invention.
Example 1:
liquid metal conductive paste:
| composition of | Type (B) | Dosage (g) |
| Host resin | Polyurethane modified acrylic resin | 3 |
| Conductive filler | Flake silver powder | 12 |
| Liquid metal | Gallium indium tin eutectic alloy | 6 |
| Reactive diluent | Methacrylic acid methyl ester | 5 |
| Electron irradiation curing agent | Hexanediol diacrylate | 3 |
| Defoaming agent | BYK028 | 0.5 |
Example 2:
liquid metal conductive paste:
the test initial resistance and the bending resistance data of the conductive circuit made of the liquid metal conductive paste in the embodiments 1 and 2 and the test initial resistance and the bending resistance data of the conductive circuit made of the conventional rolled copper foil are as follows (the conductive circuits are different only in material, and the parameters such as other lengths, widths, thicknesses and the like are the same, and in the embodiment of the present invention, the thickness of each conductive circuit is 0.05 mm, the width is 5 mm, and the length (the linear length or the extension length) is 200 mm):
| example 1 | Example 2 | Rolled copper foil | |
| Initial resistance | 6.7,6.7 | 7.2,7.4 | 0.3 |
| 1 ten thousand times | 7.0,6.9 | 7.4,7.6 | 0.6 |
| 2 ten thousand times | 6.8,6.8 | 7.3,7.6 | 2.8 |
| 3 ten thousand times | 6.9,6.8 | 7.6,7.7 | 11.8 |
| 4 ten thousand times | 6.9,6.9 | 7.7,7.7 | 82.6 |
| 5 ten thousand times | 7.0,7.1 | 7.6,7.7 | 85.4 |
| 6 ten thousand times | 6.9,6.9 | 7.7,7.7 | 90.8 |
| 7 ten thousand times | 7.1,7.2 | 7.6,7.7 | Fracture of |
| 8 ten thousand times | 7.0,7.1 | 7.6,7.7 | Fracture of |
| 9 ten thousand times | 7.0,7.1 | 7.8,7.8 | Fracture of |
| 10 ten thousand times | 7.0,7.1 | 7.7,7.8 | Fracture of |
| Recovery | 6.9,7.0 | 7.7,7.9 | Fracture of |
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The liquid metal conductive paste is characterized by comprising the following components in percentage by weight: 5 to 30 percent of main resin, 10 to 60 percent of conductive filler, 2 to 30 percent of electron irradiation curing agent, 1 to 40 percent of liquid metal, 10 to 30 percent of reactive diluent and 0 to 10 percent of auxiliary agent; wherein the liquid metal is a simple metal or an alloy with the melting point lower than room temperature.
2. The liquid metal conductive paste according to claim 1, wherein the main resin comprises one or more of silicone resin, acrylic resin, polyurethane-modified acrylic resin, and epoxy acrylate.
3. The liquid metal conductive paste according to claim 1, wherein the conductive filler comprises one or more of silver powder, copper powder, silver-copper powder, carbon powder, gold powder, palladium powder, platinum powder and nickel powder.
4. The liquid metal conductive paste according to claim 1, wherein the liquid metal comprises one or more of gallium-indium alloy, gallium-tin alloy, gallium simple substance, gallium-indium-tin alloy and gallium-indium-tin-zinc alloy.
5. The liquid metal conductive paste according to claim 1, wherein the electron irradiation curing agent comprises one or more of hexanediol diacrylate, tripropylene glycol diacrylate and trimethylol triacrylate.
6. The liquid metal conductive paste according to claim 1, wherein the auxiliary agent comprises one or more of a plasticizer, an anti-aging agent, an ultraviolet absorber and an antifoaming agent.
7. The liquid metal conductive paste according to claim 1, wherein the liquid metal is present in the liquid metal conductive paste in the form of liquid metal droplets and/or liquid metal microcapsules.
8. The liquid metal conductive paste according to claim 7, wherein the wall of the liquid metal microcapsule is a coating polymer, and the core is the liquid metal.
9. A preparation method of liquid metal conductive paste is characterized by comprising the following steps:
step S1, dissolving the main resin by using a reactive diluent;
s2, adding an electron irradiation curing agent and an auxiliary agent into the material obtained in the S1;
s3, weighing liquid metal and conductive filler, and putting the liquid metal and the conductive filler and the material obtained in the step S2 into a closed container;
step S4, pre-dispersing by using a stirrer;
step S5, after the mixing is finished, processing the materials by using a three-shaft rolling mill to obtain liquid metal conductive slurry;
wherein the liquid metal is a simple metal or an alloy with the melting point lower than room temperature.
10. An electronic device, characterized in that the electronic device comprises a conductive line made of the liquid metal conductive paste according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013925.5A CN111128440A (en) | 2020-01-07 | 2020-01-07 | Liquid metal conductive slurry, preparation method thereof and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013925.5A CN111128440A (en) | 2020-01-07 | 2020-01-07 | Liquid metal conductive slurry, preparation method thereof and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111128440A true CN111128440A (en) | 2020-05-08 |
Family
ID=70487267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010013925.5A Pending CN111128440A (en) | 2020-01-07 | 2020-01-07 | Liquid metal conductive slurry, preparation method thereof and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128440A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864329A (en) * | 2020-08-03 | 2020-10-30 | 江西沃格光电股份有限公司 | Dielectric resonator, preparation method thereof, dielectric filter and communication equipment |
| CN113963841A (en) * | 2021-12-23 | 2022-01-21 | 西安宏星电子浆料科技股份有限公司 | Flexible liquid metal copper-clad conductive slurry for RFID antenna |
| CN114574039A (en) * | 2020-11-30 | 2022-06-03 | 北京梦之墨科技有限公司 | Cylindrical ink and printing ink tube |
| CN114724741A (en) * | 2021-01-06 | 2022-07-08 | 北京梦之墨科技有限公司 | Liquid metal microcapsule, conductive paste, preparation method of conductive paste and electronic device |
| CN116153558A (en) * | 2022-09-08 | 2023-05-23 | 北京梦之墨科技有限公司 | High-elastic conductive paste and preparation method and application thereof |
| CN116313218A (en) * | 2023-02-20 | 2023-06-23 | 北京梦之墨科技有限公司 | Ultralow-temperature-cured wear-resistant conductive paste and preparation method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5275736B2 (en) * | 2008-09-25 | 2013-08-28 | 積水化学工業株式会社 | Method for producing conductive fine particles, conductive fine particles, anisotropic conductive material, and conductive connection structure |
| CN104342011A (en) * | 2014-10-22 | 2015-02-11 | 湖北久瑞核技术股份有限公司 | Nitrogen-gas-protection-free electron-beam-cured coating/ink and preparation and curing methods thereof |
| CN106833353A (en) * | 2016-12-21 | 2017-06-13 | 华南理工大学 | A kind of touch-screen UV curing nano silver wire slurries and preparation method thereof |
| CN109135611A (en) * | 2018-08-07 | 2019-01-04 | 云南科威液态金属谷研发有限公司 | One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof |
| CN109570515A (en) * | 2018-11-14 | 2019-04-05 | 中国科学院理化技术研究所 | Liquid metal microparticle with core-shell structure and preparation method and application thereof |
| CN109627829A (en) * | 2018-11-15 | 2019-04-16 | 云南科威液态金属谷研发有限公司 | A kind of liquid metal conductive coating and its preparation method and application |
-
2020
- 2020-01-07 CN CN202010013925.5A patent/CN111128440A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5275736B2 (en) * | 2008-09-25 | 2013-08-28 | 積水化学工業株式会社 | Method for producing conductive fine particles, conductive fine particles, anisotropic conductive material, and conductive connection structure |
| CN104342011A (en) * | 2014-10-22 | 2015-02-11 | 湖北久瑞核技术股份有限公司 | Nitrogen-gas-protection-free electron-beam-cured coating/ink and preparation and curing methods thereof |
| CN106833353A (en) * | 2016-12-21 | 2017-06-13 | 华南理工大学 | A kind of touch-screen UV curing nano silver wire slurries and preparation method thereof |
| CN109135611A (en) * | 2018-08-07 | 2019-01-04 | 云南科威液态金属谷研发有限公司 | One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof |
| CN109570515A (en) * | 2018-11-14 | 2019-04-05 | 中国科学院理化技术研究所 | Liquid metal microparticle with core-shell structure and preparation method and application thereof |
| CN109627829A (en) * | 2018-11-15 | 2019-04-16 | 云南科威液态金属谷研发有限公司 | A kind of liquid metal conductive coating and its preparation method and application |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864329A (en) * | 2020-08-03 | 2020-10-30 | 江西沃格光电股份有限公司 | Dielectric resonator, preparation method thereof, dielectric filter and communication equipment |
| CN114574039A (en) * | 2020-11-30 | 2022-06-03 | 北京梦之墨科技有限公司 | Cylindrical ink and printing ink tube |
| CN114724741A (en) * | 2021-01-06 | 2022-07-08 | 北京梦之墨科技有限公司 | Liquid metal microcapsule, conductive paste, preparation method of conductive paste and electronic device |
| WO2022217920A1 (en) * | 2021-01-06 | 2022-10-20 | 北京梦之墨科技有限公司 | Liquid metal microcapsule, conductive paste and preparation method therefor, and electronic device |
| CN114724741B (en) * | 2021-01-06 | 2022-12-30 | 北京梦之墨科技有限公司 | Liquid metal microcapsule, conductive paste, preparation method of conductive paste and electronic device |
| CN113963841A (en) * | 2021-12-23 | 2022-01-21 | 西安宏星电子浆料科技股份有限公司 | Flexible liquid metal copper-clad conductive slurry for RFID antenna |
| CN116153558A (en) * | 2022-09-08 | 2023-05-23 | 北京梦之墨科技有限公司 | High-elastic conductive paste and preparation method and application thereof |
| CN116313218A (en) * | 2023-02-20 | 2023-06-23 | 北京梦之墨科技有限公司 | Ultralow-temperature-cured wear-resistant conductive paste and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111128440A (en) | Liquid metal conductive slurry, preparation method thereof and electronic device | |
| US11776708B2 (en) | Liquid metal conductive paste and electronic device | |
| JP4669905B2 (en) | Conductive particles, anisotropic conductive materials, and connection structures | |
| TWI498921B (en) | A low-temperature sintered conductive paste and a method of forming the conductive film and the conductive film | |
| EP2371472A2 (en) | Low temperature sinterable metal nanoparticle composition and electronic article formed using the composition | |
| JP5831762B2 (en) | Thermosetting conductive paste | |
| CN101308710A (en) | Conductive materials | |
| JP4985700B2 (en) | Adhesive reel | |
| KR20170006000A (en) | Photosensitive paste with low temperature hardening and method for forming electrode using the same | |
| US20100206623A1 (en) | Nonconductive adhesive composition and film and methods of making | |
| CN111192705A (en) | Liquid metal conductive paste, electronic device and manufacturing method thereof | |
| JP2011040189A (en) | Conductive particle, anisotropic conductive material, and connection structure | |
| CN112349447B (en) | Conductive material, preparation method thereof and electronic device | |
| DE112010003095T5 (en) | Thermosetting, sinterable at low temperature electrode paste | |
| CN113496787A (en) | Low-temperature cured liquid metal conductive paste and electronic device | |
| CN101472704B (en) | Solder paste and method for forming solder bumps using the same | |
| JP2011134630A (en) | Conductive paste | |
| US20130160836A1 (en) | Solar cell electrode, and method for manufacturing the same | |
| CN111128441A (en) | Liquid metal conductive paste and electronic device | |
| JP5982217B2 (en) | Conductive particles, anisotropic conductive materials, and connection structures | |
| JP5535507B2 (en) | Conductive particles and manufacturing method thereof | |
| JP2016041803A (en) | Base particle, conductive particle, conductive material, and connection structure | |
| JPWO2012124527A1 (en) | Resin paste composition for bonding semiconductor elements and semiconductor device | |
| JP2016201104A (en) | Composition for forming touch panel electrode lines, method for forming touch panel electrode lines, and touch panel | |
| JP2011122129A (en) | Inorganic fine particle dispersed paste composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200508 |