CN113534525A

CN113534525A - Vehicle-mounted LED high-brightness backlight source

Info

Publication number: CN113534525A
Application number: CN202110773495.1A
Authority: CN
Inventors: 郑伟锋; 张美还
Original assignee: Shenzhen Esen Photoelectric Technology Co ltd
Current assignee: Shenzhen Esen Photoelectric Technology Co ltd
Priority date: 2021-07-08
Filing date: 2021-07-08
Publication date: 2021-10-22
Anticipated expiration: 2041-07-08
Also published as: CN113534525B

Abstract

The application relates to the technical field of LED backlight sources, in particular to a vehicle-mounted LED high-brightness backlight source. A vehicle-mounted LED high-brightness backlight source comprises a high-heat-dissipation backlight plate, a reflecting film and LED lamps, wherein the LED lamps are fixedly connected to the high-heat-dissipation backlight plate in a dot matrix manner; a metal heat conducting plate is integrally formed at the bottom of the LED lamp; the metal heat conducting plate is fixedly connected with an insulating high heat conducting glue layer; the surface of the insulating high-heat-conduction adhesive layer, which is back to the metal heat-conducting plate, is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflective film is fixedly connected to the upper surface of the high-heat-dissipation backlight plate. The backlight module has better heat dissipation performance, can avoid the local heat accumulation of the backlight plate, and improves the reliability of the vehicle-mounted backlight source and prolongs the service life of the vehicle-mounted backlight source.

Description

Vehicle-mounted LED high-brightness backlight source

Technical Field

The application relates to the technical field of LED backlight sources, in particular to a vehicle-mounted LED high-brightness backlight source.

Background

The backlight source is an optical component in the LCD product, and its quality determines the important parameters of the LCD, such as brightness, uniformity, and color level, so the quality of the backlight source determines the display effect of the LCD. With the widespread use of liquid crystal display screens, the application range of backlight is spread over industrial equipment, bank terminals, office automation, communication, electronic toys, and the like.

The vehicle-mounted backlight source is an optical component for providing a back light source for the vehicle-mounted display screen, and the requirement of a vehicle-mounted backlight source product on brightness is relatively high due to the influence of the driving conditions of an automobile. In order to meet the brightness requirement of the vehicle-mounted backlight, the conventional means for increasing the brightness of the vehicle-mounted display screen currently includes increasing the number of LED lamps in the backlight or increasing the current used by the LED lamps.

Referring to fig. 1, a vehicle-mounted backlight source in the related art includes a backlight plate 9 and LED lamps 100, the backlight plate 9 is a PCB made of FR-4 material, the LED lamps 100 are fixedly connected to the upper surface of the backlight plate 9, the LED lamps 100 and pins are welded to a printing wire of the backlight plate 9, and the LED lamps 100 are arranged on the upper surface of the backlight plate 9 in a dot matrix manner.

With respect to the vehicle-mounted backlight in the above related art, the inventors found that the above related art has the following drawbacks: although the display brightness of the vehicle-mounted display screen can be enhanced by means of increasing the number of LEDs in the backlight or increasing the current, the problems that the local heat of the vehicle-mounted backlight is seriously accumulated and is difficult to effectively dissipate, the reliability of the vehicle-mounted backlight is poor, and the service life of the vehicle-mounted backlight is short are caused.

Disclosure of Invention

In order to solve the problem of poor heat dissipation performance existing in the related art, the application aims to provide a vehicle-mounted LED high-brightness backlight source.

The application purpose of the application is realized by the following technical scheme:

a vehicle-mounted LED high-brightness backlight source comprises a high-heat-dissipation backlight plate, a reflecting film and LED lamps, wherein the LED lamps are fixedly connected to the high-heat-dissipation backlight plate in a dot matrix manner; the bottom of the LED lamp is fixedly connected with a metal heat-conducting plate; the metal heat conducting plate is integrally formed with an insulating high heat conducting glue layer; the surface of the insulating high-heat-conduction adhesive layer, which is back to the metal heat-conducting plate, is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflecting film is fixedly connected to the upper surface of the high-heat-dissipation backlight plate; the reflecting film is integrally formed with a mounting area for fixedly connecting the LED lamp with the high-heat-dissipation backlight plate.

Through adopting above-mentioned technical scheme, this application adopts insulating high heat-conducting adhesive layer to consolidate the LED lamp, can strengthen the heat-conduction efficiency between LED lamp and the high heat dissipation backlight, can be comparatively fast conduct the heat energy that the LED lamp produced to the high heat dissipation backlight, release the heat to the environment in through the high heat dissipation backlight, realized comparatively fast in releasing the heat energy that the LED lamp produced to the environment, therefore, this application has better heat dispersion, can avoid the excessive gathering of backlight local heat, the reliability of vehicle-mounted backlight and the life of extension vehicle-mounted backlight have been promoted.

Preferably, the insulating high-thermal-conductivity adhesive layer is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles and 5-25 parts of enhanced heat-conducting powder.

Through adopting above-mentioned technical scheme, adopt heat conduction framework to fill granule and found formation heat conduction framework body in heat conduction silica gel, can be comparatively fast with the heat-conduction that the LED lamp produced to high heat dissipation backlight, the reinforcing heat conduction powder that fills in the heat conduction silica gel distributes between the heat conduction framework body that the granule formed is filled to the heat conduction framework, can strengthen the heat conductivility of heat conduction framework body to obtain the heat conductivility that promotes insulating high heat conduction glue film, realized the purpose that promotes the reliability of on-vehicle backlight and the life of extension on-vehicle backlight.

Preferably, the heat conducting framework is filled with a mixture of spherical alumina granules with the particle size of 240-400 meshes and spherical alumina granules with the particle size of 2000-5000 meshes; the mass ratio of the spherical alumina granules with 400 meshes and the spherical alumina granules with 5000 meshes is (4-7): 1; the enhanced heat-conducting powder is high heat-conducting graphene with the particle size less than or equal to 10 microns.

By adopting the technical scheme, the insulating high-thermal-conductivity adhesive with good thermal conductivity can be obtained, so that the reliability of the vehicle-mounted backlight source is improved, and the service life of the vehicle-mounted backlight source is prolonged.

Preferably, the insulating high-thermal-conductivity adhesive layer is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles, 5-25 parts of enhanced heat-conducting powder and 5-25 parts of phase-change particles.

Through adopting above-mentioned technical scheme, the phase change granule absorbs the heat energy that the LED lamp produced through self phase transition and self physical form does not change, consequently, the temperature of LED lamp itself not only can be reduced to the interpolation of phase change granule, improves the bulk temperature of backlight, can reduce the temperature of insulating high thermal conductive adhesive layer moreover, has guaranteed the structural stability and the life of insulating high thermal conductive adhesive layer.

Preferably, the phase-change particles are prepared from the following raw materials: high thermal conductivity conductive media, phase change wax pellets; the high heat conduction and conduction medium accounts for 5-20% of the total mass of the phase change particles; the grain size of the phase-change particles is 0.2-0.8 mm.

Through adopting above-mentioned technical scheme, adopt high heat conduction medium to lead to the heat energy that the LED lamp produced in the phase transition granule fast, the phase transition granule absorbs the heat energy of LED lamp conduction, can reduce the temperature of insulating high heat conduction glue film and the temperature of LED lamp itself, promotes the radiating efficiency and the life of on-vehicle backlight.

Preferably, the high thermal conductivity and conduction medium is silver tungsten carbide graphene or MWNT carbon nanotube.

Through adopting above-mentioned technical scheme, silver tungsten carbide graphite alkene or MWNT carbon nanotube can conduct the heat energy that the LED lamp produced in the phase transition granule fast, and the phase transition granule of being convenient for absorbs the heat energy that the LED lamp conducted fast is favorable to reducing the temperature of LED lamp itself, promotes the continuous life of on-vehicle backlight.

Preferably, the preparation method of the insulating high thermal conductive adhesive layer comprises the following steps:

step 1, stirring accurately-metered heat-conducting silica gel at the speed of 100 plus 150rpm under the protection of nitrogen, dividing the filling particles of the heat-conducting framework into three parts during stirring, adding the three parts into the heat-conducting silica gel at intervals, and obtaining a semi-finished product at the interval time of 120 plus 200s for each time; step 2, placing the accurately measured enhanced heat conduction powder in a graphene feeding device, inputting the enhanced heat conduction powder into a semi-finished product by taking nitrogen as a carrier, conveying the enhanced heat conduction powder with the content of 200-600mg/L in the nitrogen, and conveying the nitrogen at the flow speed of 0.2-0.8 m/s;

and step 3, after the addition of the enhanced heat conduction powder is finished, adjusting the rotating speed to be 300-350rpm, stirring for 200-240 seconds, and blanking to obtain the insulating high heat conduction adhesive.

Through adopting above-mentioned technical scheme, adopt the mode of nitrogen gas transport reinforcing nature heat conduction powder, realized the comparatively evenly distributed in the inside purpose of heat conduction silica gel of reinforcing nature heat conduction powder to the preparation obtains insulating high heat conduction glue that has good heat conductivility, promotes the reliability of on-vehicle backlight and prolongs the life of on-vehicle backlight.

Preferably, the preparation method of the phase-change particles comprises the following steps:

step 1, under the protection of nitrogen, heating accurately-measured phase-change wax granules to be molten, and stirring and mixing at 50-80rpm for 30-40s to obtain a mixture;

step 2, placing the high-heat-conductivity conducting medium with accurate measurement in a graphene feeding device, inputting the high-heat-conductivity conducting medium into the mixture by taking nitrogen as a carrier, wherein the content of the high-heat-conductivity conducting medium in the conveyed nitrogen is 200-400mg/L, the flow rate of the conveyed nitrogen is 0.6-0.9m/s, and the addition amount of the high-heat-conductivity conducting medium is 0.8-2.8 g/s;

step 3, after the addition of the high heat conduction and conduction medium is finished, adjusting the rotating speed to be 200-240rpm, stirring for 5min, and blanking to obtain a semi-finished product;

and 4, performing injection molding on the semi-finished product, cooling and demolding to obtain the phase change particles with the particle size of 0.2-0.8 mm.

Through adopting above-mentioned technical scheme, adopt nitrogen gas load high heat conduction medium to mix high heat conduction medium in melting phase transition wax, can make the comparatively evenly distributed of high heat conduction medium inside phase transition wax to the preparation obtains the phase transition granule that has better heat absorption accuse temperature effect, promotes the structural stability and the life of insulating high heat conduction glue film, guarantees the reliability and the life of on-vehicle backlight.

step 1, stirring accurately-metered heat-conducting silica gel at the speed of 100-plus-150 rpm under the protection of nitrogen, dividing the filling particles of the heat-conducting framework into three parts during stirring, adding the three parts into the heat-conducting silica gel at intervals, and obtaining a component A at the interval time of 120-plus-200 s for each time;

step 2, equally dividing the accurately-measured phase change particles into three parts, adding the three parts into the component A at intervals, wherein the interval feeding time is 200 plus 240s, and obtaining a semi-finished product;

step 3, placing the high-heat-conductivity conducting medium with accurate measurement in a graphene feeding device, inputting the high-heat-conductivity conducting medium into the semi-finished product by taking nitrogen as a carrier, conveying the nitrogen with the content of the high-heat-conductivity conducting medium of 200-600mg/L and the flow speed of conveying the nitrogen of 0.2-0.8 m/s;

and 4, after the high-heat-conductivity conductive medium is added, adjusting the rotating speed to be 350rpm, stirring for 200 seconds and 240 seconds, and blanking to obtain the insulating high-heat-conductivity adhesive.

By adopting the technical scheme, the high-heat-conductivity conducting medium and the phase-change particles can be uniformly dispersed in the heat-conducting silica gel, the insulating high-heat-conductivity adhesive with good heat-conducting property, heat absorption temperature control property and heat stability can be prepared, and the reliability and the service life of the vehicle-mounted backlight source can be further ensured.

In summary, the present application has the following advantages:

1. the backlight module has better heat dissipation performance, can avoid excessive accumulation of local heat of the backlight plate, and improves the reliability of the vehicle-mounted backlight source and prolongs the service life of the vehicle-mounted backlight source.

2. The phase change particles prepared in the application can absorb heat energy generated by the LED lamp, and the physical form of the phase change particles is not changed, so that the overall temperature of the backlight source can be reduced, the size stability and the service life of the insulating high-heat-conductivity adhesive layer are ensured, and the reliability and the service life of the vehicle-mounted backlight source are ensured.

Drawings

Fig. 1 is a schematic view of an overall structure of a vehicle-mounted backlight in the related art.

Fig. 2 is a schematic view of an overall structure of the graphene charging device in the present application.

Fig. 3 is a schematic structural diagram of a gas distributor in the graphene charging device according to the present application.

Fig. 4 is a schematic view of an overall structure of an on-vehicle LED high-brightness backlight in embodiment 1 of the present application.

Fig. 5 is a partially enlarged view of a portion a in fig. 4.

In the figure, 1, a high heat dissipation backlight plate; 10. a reflective film; 100. an LED lamp; 101. a metal heat-conducting plate; 102. an installation area; 11. an insulating resistance film layer; 111. a round hole area; 12. a copper foil layer; 13. a thermally conductive insulating layer; 14. an aluminum plate layer; 15. a heat dissipating fin; 151. a copper substrate; 152. a heat dissipating copper foil; 2. a heat-dissipating metal outer frame; 20. an insulating high thermal conductive adhesive layer; 200. heat dissipation holes; 21. an aluminum alloy outer frame main body; 22. an aluminum alloy spacing body; 221. a heat dissipation pore channel; 3. a heat dissipation metal card frame set; 31. a first aluminum alloy heat dissipation frame; 32. a second aluminum alloy heat dissipation frame; 4. a thermally conductive silicone frame body; 40. a light-shielding tape; 5. a silver tin layer; 6. an optical film layer; 61. a first diffusion film; 62. a brightness enhancement film; 63. a second diffusion film; 9. a main body of the stirring tank; 90. a filling opening; 91. a stirrer; 911. a drive motor; 912. a rotating shaft; 913. a stirrer; 92. a discharge pipe; 93. a gas distributor; 931. an arc-shaped gas distributor main body; 932. a cavity; 933. an air inlet duct; 94. a gas input pipe; 95. a pulse valve.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples.

Raw materials

Device

Referring to fig. 2, the graphene feeding device includes a stirring tank main body 9, and the stirring tank main body 9 is rotatably connected with a stirrer 91. The agitator 91 includes a driving motor 911, a rotation shaft 912, and three agitators 913, and the driving motor 911 is fixedly connected to the top of the agitator tank main body 9. An output shaft of the driving motor 911 is fixedly connected with the rotating shaft 912 through a coupler. The agitator 913 is a turbine agitator that allows the material to flow axially. The stirrers 913 are fixedly connected to the rotating shaft 912 in the circumferential direction, and the adjacent stirrers 913 are spaced at equal intervals.

Referring to fig. 2, the top of the stirring tank main body 9 is fixedly communicated with a filling opening 90. The fixed discharging pipe 92 that has even in the middle part of the 9 outside of agitator tank main part, discharging pipe 92 are used for the intercommunication to prepare insulating high heat conduction glue's reation kettle or the reation kettle of preparing the phase transition granule, carry high heat conduction graphite alkene to reation kettle or transmit high heat conduction medium to reation kettle.

Referring to fig. 2, a gas distributor 93 is fixedly connected to the lower portion of the inner wall of the stirring tank main body 9. The gas distributor 93 is fixedly communicated with a gas input pipe 94, and the gas input pipe 94 is fixedly communicated with a pulse valve 95. One end of the gas input pipe 94 is communicated with the nitrogen gas cylinder and the other end is communicated with the gas distributor 93.

Referring to fig. 3, the specific structure of the gas distributor 93 is: the gas distributor 93 comprises an arc gas distributor main body 931 which is attached to and fixedly connected with the inner wall of the stirring tank main body 9, a cavity 932 is integrally formed in the arc gas distributor main body 931, and the surface of the arc gas distributor main body 931, facing the inner wall of the stirring tank main body 9, is fixedly communicated with the gas input pipe 94. The surface of the arc-shaped gas distributor main body 931, which faces away from the inner wall of the stirring tank main body 9, is provided with a plurality of gas inlet channels 933, and the gas inlet channels 933 are distributed on the surface of the arc-shaped gas distributor main body 931 in a dot matrix manner.

The graphene feeding device is used in a mode that: add high heat conduction medium to agitator tank main part 9 in through filler hole 90, open agitator 91 and stir, then open pulse valve 95, the pulse cycle is 0.5s, and nitrogen gas gets into agitator tank main part 9 through gas distributor 93 and mixes with high heat conduction graphite alkene or high heat conduction medium, opens gas input tube 94, can realize using nitrogen gas as carrying carrier gas, transmits high heat conduction graphite alkene in stirred tank or transmits high heat conduction medium in reation kettle.

Preparation example

Preparation example 1

The insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-thermal-conductivity graphene.

The preparation method of the insulating high-thermal-conductivity glue comprises the following steps:

step 1, weighing 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules and 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns according to the proportion, putting 10kg of electronic liquid silica gel into a stirring kettle, stirring at the rotating speed of 120rpm under the protection of nitrogen, dividing 1.6kg of 300-mesh spherical alumina granules into three parts, adding the three parts into the stirring kettle at intervals, wherein the feeding interval time is 60s, after the 300-mesh spherical alumina granules are added, dividing 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns into three parts, adding the three parts into the stirring kettle at intervals, and the feeding interval time is 150 s;

step 2, adding accurately metered 0.5kg of high thermal conductivity graphene into a stirring tank main body 9 through a filling port 90, inputting the high thermal conductivity graphene into a stirring kettle by taking nitrogen as a carrier, conveying the content of the high thermal conductivity graphene in the nitrogen as a range value, controlling the content of the high thermal conductivity graphene in a range of 200 plus 240mg/L, stabilizing the flow rate of conveying the nitrogen in a range of 0.7-0.8m/s, and adding the high thermal conductivity graphene in the stirring kettle in an amount of 1.2-1.7 g/s;

and 3, after the addition of the high-thermal-conductivity graphene is completed, adjusting the rotating speed to 320rpm, stirring for 240s, and blanking to obtain the insulating high-thermal-conductivity adhesive.

Preparation example 2

Preparation 2 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.75kg of 300-mesh spherical alumina granules, 0.25kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-thermal-conductivity graphene.

Preparation example 3

Preparation 3 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-thermal-conductivity graphene.

Preparation example 4

Preparation 4 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 2.5kg of high-thermal-conductivity graphene.

Preparation example 5

Preparation 5 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 1.2kg of high-thermal-conductivity graphene.

Preparation example 6

The insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 0.5kg of phase-change particles.

The phase change particles are prepared from the following raw materials: 25g of silver tungsten carbide graphene and 475g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax (Shanghai Joule wax industry Co., Ltd.).

The preparation method of the phase-change particles comprises the following steps:

step 1, adding accurately measured 0.5kg of shaped phase change energy storage wax raw material into a reaction kettle, introducing nitrogen into the reaction kettle for protection, heating to be molten, and stirring at 50rpm for 100 seconds for later use;

step 2, adding 25g of silver tungsten carbide graphene with accurate measurement into a graphene feeding device, inputting the silver tungsten carbide graphene into a reaction kettle by taking nitrogen as a carrier, wherein the content of the silver tungsten carbide graphene in conveying air is 240-280mg/L, the flow rate of the conveying air is 0.7-0.9m/s, the air inflow of the reaction kettle is 5.5-7.1L/s, and the addition amount of a high-heat-conduction medium in the reaction kettle is 1.32-1.98 g/s;

step 3, after the silver tungsten carbide graphene is added, adjusting the rotating speed to 240rpm, stirring for 5min, and blanking to obtain a semi-finished product;

and 4, performing injection molding on the semi-finished product, cooling and demolding to obtain the phase change particles with the particle size of 0.5 mm.

The preparation method of the insulating high-thermal-conductivity adhesive layer comprises the following steps:

step 1, weighing 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules and 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns according to the proportion, placing 10kg of electronic liquid silica gel in a stirring kettle, stirring at the rotating speed of 120rpm under the protection of nitrogen, dividing 1.65kg of 300-mesh spherical alumina granules into three parts, adding the three parts at intervals into the stirring kettle, wherein the feeding interval time is 60s, after the addition of the 300-mesh spherical alumina granules is completed, dividing 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns into three parts, adding the three parts at intervals into the stirring kettle, and the feeding interval time is 150 s;

step 2, maintaining the stirring speed at 120rpm, equally dividing 0.5kg of phase change particles into three parts, and adding the three parts into the stirring kettle at intervals, wherein the time interval between the feeding is 200 s;

step 3, placing 1.2kg of high thermal conductivity graphene with accurate measurement in a graphene feeding device, inputting the high thermal conductivity graphene into a stirring kettle by taking nitrogen as a carrier, wherein the content of the high thermal conductivity graphene in the nitrogen is within a range value, the content of the high thermal conductivity graphene in the nitrogen is within a range of 200 and 240mg/L, the flow rate of the nitrogen is stabilized within a range of 0.7-0.8m/s, and the addition amount of the high thermal conductivity graphene in the stirring kettle is 1.1-1.7 g/s;

and 4, after the addition of the high-thermal-conductivity graphene is completed, adjusting the rotating speed to 320rpm, stirring for 240s, and blanking to obtain the insulating high-thermal-conductivity adhesive.

Preparation example 7

Preparation 7 differs from preparation 6 in that: the phase change particles are prepared from the following raw materials: 100g of high-silver tungsten carbide graphene and 400g of phase-change wax granules, wherein the granularity of phase-change particles is 0.5mm, and the phase-change particles are formed by using the fixed phase-change energy-storage wax.

Preparation example 8

Preparation 8 differs from preparation 6 in that: the phase change particles are prepared from the following raw materials: 50g of silver tungsten carbide graphene and 450g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax.

Preparation example 9

Preparation 9 differs from preparation 6 in that: the phase change particles are prepared from the following raw materials: 25g of MWNT carbon nano tube and 475g of phase change wax granules, wherein the particle size of the phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax.

Preparation example 10

Preparation 10 differs from preparation 6 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 2.5kg of phase-change particles. The phase change particles are prepared from the following raw materials: 250g of silver tungsten carbide graphene and 2250g of phase change wax granules, wherein the granularity of the phase change granules is 0.5mm, and the phase change granules are formed phase change energy storage wax.

Preparation example 11

Preparation 11 differs from preparation 6 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 0.8kg of phase-change particles. The phase change particles are prepared from the following raw materials: 80g of silver tungsten carbide graphene and 720g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax.

Preparation example 12

Preparation 12 differs from preparation 6 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 1.8kg of phase-change particles. The phase change particles are prepared from the following raw materials: 180g of silver tungsten carbide graphene and 1620g of phase change wax granules, wherein the particle size of the phase change granules is 0.5mm, and the phase change granules are formed by using the fixed phase change energy storage wax.

Preparation example 13

Preparation 13 differs from preparation 1 in that: the preparation method of the insulating high-thermal-conductivity glue comprises the following steps:

step 1, weighing 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules and 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns according to the proportion, placing 10kg of electronic liquid silica gel in a stirring kettle, stirring at the rotating speed of 120rpm under the protection of nitrogen, dividing 1.6kg of 300-mesh spherical alumina granules into three parts, adding the three parts at intervals into the stirring kettle, wherein the feeding interval time is 60s, after the addition of the 300-mesh spherical alumina granules is completed, dividing 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 microns into three parts, adding the three parts at intervals into the stirring kettle, and the feeding interval time is 150 s;

and 2, putting 0.5kg of high-thermal-conductivity graphene which is accurately measured into a stirring kettle, adjusting the rotating speed to 320rpm, stirring for 240s, and blanking to obtain the insulating high-thermal-conductivity adhesive.

Preparation example 14

Preparation 14 differs from preparation 6 in that: the preparation method of the insulating high-thermal-conductivity adhesive layer comprises the following steps:

step 2, equally dividing the accurately-measured phase change particles into three parts, adding the three parts into a stirring kettle at intervals, wherein the feeding interval time is 200s, and the stirring rotating speed is maintained at 120 rpm;

and 3, putting 1.2kg of high-thermal-conductivity graphene which is accurately measured into a stirring kettle, adjusting the rotating speed to 320rpm, stirring for 240s, and blanking to obtain the insulating high-thermal-conductivity adhesive.

Preparation example 15

Preparation 15 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.2kg of 300-mesh spherical alumina granules, 0.8kg of spherical alumina granules with primary crystal size of 2.8-3.2 mu m and 0.5kg of high-thermal conductivity graphene.

Preparation example 16

Preparation 16 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.8kg of 300-mesh spherical alumina granules, 0.2kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.5kg of high-thermal-conductivity graphene.

Preparation example 17

Preparation 17 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 0.3kg of high-thermal conductivity graphene.

Preparation example 18

Preparation 18 differs from preparation 1 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.6kg of 300-mesh spherical alumina granules, 0.4kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m and 3.2kg of high-thermal conductivity graphene.

Preparation example 19

Preparation 19 differs from preparation 6 in that: the phase change particles are prepared from the following raw materials: 15g of silver tungsten carbide graphene and 485g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed by using the fixed phase change energy storage wax.

Preparation example 20

Preparation 20 differs from preparation 6 in that: the phase change particles are prepared from the following raw materials: 150g of silver tungsten carbide graphene and 350g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax.

Preparation example 21

Preparation 21 differs from preparation 6 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 0.3kg of phase-change particles. The phase change particles are prepared from the following raw materials: 30g of silver tungsten carbide graphene and 220g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax. .

Preparation example 22

Preparation 22 differs from preparation 6 in that: the insulating high-heat-conductivity glue is prepared from the following raw materials in parts by weight: 10kg of electronic liquid silica gel, 1.65kg of 300-mesh spherical alumina granules, 0.35kg of spherical alumina granules with the primary crystal size of 2.8-3.2 mu m, 1.2kg of high-thermal-conductivity graphene and 3.0kg of phase-change particles. The phase change particles are prepared from the following raw materials: 300g of silver tungsten carbide graphene and 2700g of phase change wax granules, wherein the granularity of phase change particles is 0.5mm, and the phase change particles are formed phase change energy storage wax.

Examples

Example 1

Referring to fig. 4, the vehicle-mounted LED high-brightness backlight disclosed by the present application includes an LED lamp 100, a reflective film 10, an optical film layer 6 and a high heat dissipation backlight board 1, the LED lamp 100 is a white LED produced by Lumileds, and has a power limit of 1W, a typical current of 350mA and a typical luminance of 2000mcd, and when in use, the current of the LED lamp 100 is 180 and 200mA, so as to ensure the electric energy utilization rate and reduce the heat release. The LED lamps 100 are welded on the upper surface of the high heat dissipation backlight plate 1, and in order to ensure the light emitting uniformity and brightness of the backlight source, the LED lamps 100 are distributed in a dot matrix manner, and the distance between adjacent LED lamps 100 is 18 mm.

Referring to fig. 4, the reflective film 10 is a backlight reflective film, and is specifically an LED lamp reflective film purchased from lujia reflective material ltd, guan city. The reflective film 10 is adhered to the upper surface of the high heat dissipation backlight board 1 by a polyurethane hot melt adhesive. The reflective film 10 is integrally formed with a mounting region 102 for fixedly attaching the LED lamp 100 to the high heat dissipation backlight panel 1. The optical film layer 6 comprises a first diffusion film 61, a brightness enhancement film 62 and a second diffusion film 63 which are sequentially arranged on the upper part of the reflecting film 10, wherein the first diffusion film 61 and the second diffusion film 63 are commercially conventional diffusion films, and the brightness enhancement film 62 is a commercially conventional brightness enhancement film.

Referring to fig. 5, in order to improve the overall heat dissipation performance, the high heat dissipation backlight board 1 is connected to a heat dissipation metal outer frame 2, and a heat dissipation metal card frame set 3 is clamped in the heat dissipation metal outer frame 2. During installation, the heat dissipation metal card frame group 3 is fixedly connected in the heat dissipation metal outer frame 2 through frictional force clamping, the high heat dissipation backlight plate 1 and the optical film layer 6 are fixedly connected between the heat dissipation metal outer frame 2 and the heat dissipation metal card frame group 3, and the optical film layer 6 is positioned on the upper portion of the high heat dissipation backlight plate 1 and the optical film layer 6 is also positioned on the upper portion of the reflecting film 10.

Referring to fig. 4 and 5, the heat-dissipating metal frame 2 is composed of an aluminum alloy frame main body 21 and an aluminum alloy stopper 22. In order to ensure the overall heat dissipation performance, the aluminum alloy outer frame body 21 is provided with a plurality of heat dissipation holes 200. The aluminum alloy limiting body 22 is integrally formed on the inner wall of the aluminum alloy outer frame main body 21, and the lower surface of the aluminum alloy limiting body 22 is flush with the lower surface of the aluminum alloy outer frame main body 21. In order to improve the overall heat dissipation performance, the aluminum alloy stopper 22 has a plurality of heat dissipation channels 221 through the upper and lower surfaces thereof, and the heat dissipation channels 221 are distributed on the surface of the aluminum alloy stopper 22 in a dot matrix.

Referring to fig. 4 and 5, the high heat dissipation backlight plate 1 is circumferentially wrapped with a heat-conducting silica gel frame body 4, the outer side wall of the heat-conducting silica gel frame body 4 is wrapped with a shading band 40, and the heat-conducting silica gel frame body 4 is clamped to the aluminum alloy outer frame main body 21. The heat-conducting silica gel frame body 4 is prepared by using the insulating high heat-conducting adhesive in the preparation example 1, specifically, the length of the heat-conducting silica gel frame body 4 is 0.6mm greater than that of the aluminum alloy limiting body 22, and the width of the heat-conducting silica gel frame body 4 is 0.6mm greater than that of the aluminum alloy limiting body 22.

Referring to fig. 4 and 5, the heat-conducting silica gel frame body 4 is installed in the aluminum alloy outer frame main body 21, the shading band 40 on the heat-conducting silica gel frame body 4 is tightly abutted against the inner wall of the aluminum alloy outer frame main body 21, the lower surface of the heat-conducting silica gel frame body 4 is abutted against the upper surface of the aluminum alloy limiting body 22, and the upper surface of the heat-conducting silica gel frame body 4 is abutted against the lower surface of the heat-dissipating metal card frame group 3, so that the heat energy of the high-heat-dissipation backlight plate 1 can be rapidly conducted to the heat-dissipating metal outer frame 2, and the overall heat dissipation performance is improved.

Referring to fig. 4 and 5, the heat dissipation metal card frame set 3 includes a first aluminum alloy heat dissipation frame 31 and a second aluminum alloy heat dissipation frame 32, and the first aluminum alloy heat dissipation frame 31 is connected to the aluminum alloy outer frame main body 21 by friction. The heat-conducting silica gel frame body 4 is arranged on the aluminum alloy outer frame main body 21, and the upper surface of the heat-conducting silica gel frame body 4 is abutted against the lower surface of the first aluminum alloy heat dissipation frame 31, so that the heat energy of the high-heat-dissipation backlight plate 1 can be rapidly conducted to the heat dissipation metal card frame group 3, and the heat dissipation performance of the whole body is improved. The second aluminum alloy heat dissipation frame 32 is connected to the aluminum alloy outer frame body 21 by friction. The second aluminum alloy heat dissipation frame 32 is located on the upper portion of the first aluminum alloy heat dissipation frame 31, and the upper surface of the second aluminum alloy heat dissipation frame 32 is flush with the upper surface of the aluminum alloy outer frame main body 21. The optical film layer 6 is fixedly connected between the first aluminum alloy heat dissipation frame 31 and the second aluminum alloy heat dissipation frame 32, so that the optical film layer 6 is fixedly connected to the aluminum alloy outer frame main body 21. When the optical film layer 6 is fixedly connected to the aluminum alloy outer frame body 21, the upper surface of the second diffusion film 63 in the optical film layer 6 abuts against the lower surface of the second aluminum alloy heat dissipation frame 32, and the lower surface of the first diffusion film 61 in the optical film layer 6 abuts against the upper surface of the first aluminum alloy heat dissipation frame 31.

Referring to fig. 4 and 5, the high heat dissipation backlight plate 1 includes an insulation resistance film layer 11, a copper foil layer 12, a thermal conductive insulation layer 13, an aluminum plate layer 14, and heat dissipation fins 15, where the insulation resistance film layer 11 is a flame retardant PC film (shenzhen baoan zhuoli adhesive product factory). The reflective film 10 is fixedly attached to the upper surface of the insulating resistance film layer 11 by means of a polyurethane hot melt adhesive. The insulating resistance film layer 11 is also reserved with a circular hole area 111 having the same size as the mounting area 102. The insulation resistance film layer 11 is fixedly connected to the upper surface of the copper foil layer 12 through electronic liquid silica gel. The lower surface of the copper foil layer 12 is fixedly connected to the upper surface of the heat-conducting insulating layer 13. The heat conducting insulation layer 13 is made of electronic liquid silica gel, and can play an insulation role and can lead out heat energy emitted by the copper foil layer 12. Printed wires are formed on the copper foil layer 12, and the leads of the LED lamp 100 are fixedly connected to the wires on the copper foil layer 12.

Referring to fig. 4 and 5, the lower surface of the thermal insulation layer 13 is fixedly connected to the upper surface of the aluminum plate layer 14. The bottom of the LED lamp 100 is fixedly connected with a metal heat-conducting plate 101; the metal heat conducting plate 101 is fixedly connected with an insulating high heat conducting glue layer 20. The insulating high thermal conductive adhesive layer 20 is prepared by using the insulating high thermal conductive adhesive in preparation example 1. The upper surface of the insulating high thermal conductive adhesive layer 20 is fixedly connected to the lower surface of the LED lamp 100, and the lower surface of the insulating high thermal conductive adhesive layer 20 is fixedly connected to the upper surface of the copper foil layer 12.

Referring to fig. 4 and 5, the insulating high thermal conductive adhesive layer 20 has good thermal conductivity, and can conduct heat energy generated by the LED lamp 100 to the copper foil layer 12 more quickly, so as to reduce the temperature of the LED lamp 100, thereby ensuring the overall stability and the service life. The silver-tin layer 5 fixedly connected with the copper foil layer 12 is formed on the LED lamp 100 and the pins in a welding mode, and the printed wire path of the LED lamp 100 and the pins connected with the copper foil layer 12 is formed through the silver-tin layer 5. Silver-tin layer 5's heat conductivity is good, and has increased LED lamp 100's heat radiating area, can conduct the heat energy that LED lamp 100 produced to copper foil layer 12 more fast, reduces the temperature of LED lamp 100 self, guarantees holistic stability and life.

Referring to fig. 4 and 5, the specific structure of the heat dissipating fin 15 is as follows: the heat dissipation fin 15 includes a copper base plate 151 and a heat dissipation copper foil 152, and the heat dissipation copper foil 152 is integrally formed on a lower surface of the copper base plate 151. The heat sink copper foil 152 has a size of 1.2mm 0.5mm 0.2 mm. The spacing between adjacent heat dissipating copper foils 152 is 1 mm. The upper surface of copper base plate 151 passes through heat conduction silica gel fixed connection in the lower surface of aluminium sheet layer 14, can release the heat energy that LED lamp 100 conduction was come comparatively fast, reduces the temperature of LED lamp 100 self, guarantees holistic stability and life.

Example 2

Example 2 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 2.

Example 3

Example 3 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 3.

Example 4

Example 4 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 4.

Example 5

Example 5 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 5.

Example 6

Example 6 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 6.

Example 7

Example 7 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 7.

Example 8

Example 8 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 8.

Example 9

Example 9 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 9.

Example 10

Example 10 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 10.

Example 11

Example 11 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 11.

Example 12

Example 12 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 12.

Comparative example

Comparative example 1

Comparative example 1 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 13.

Comparative example 2

Comparative example 1 differs from example 6 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 14.

Comparative example 3

Comparative example 3 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 15.

Comparative example 4

Comparative example 4 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 16.

Comparative example 5

Comparative example 5 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 17.

Comparative example 6

Comparative example 6 differs from example 1 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 18.

Comparative example 7

Comparative example 7 differs from example 6 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 19.

Comparative example 8

Comparative example 8 differs from example 6 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 20.

Comparative example 9

Comparative example 9 differs from example 6 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 21.

Comparative example 10

Comparative example 10 differs from example 6 in that: the insulating high thermal conductive paste used in example 1 in preparation example 1 was replaced with the insulating high thermal conductive paste used in preparation example 22.

Performance test

1. And (3) testing the thermal conductivity of the insulating high-thermal-conductivity adhesive by referring to an ASTM D5470 standard, wherein the testing instrument is a Taiwan Rui neck heat conductivity testing instrument LW-9389.

2. Measuring the surface temperature of the vehicle-mounted LED high-brightness backlight: the test environment is 20 +/-0.1 ℃, the humidity is 40 +/-3%, the rated current of the LED lamp is 200mA, the temperature of four corners of the heat-dissipation metal outer frame after 1 hour and 4 hours of light emission is respectively measured, a JK-16 multi-path temperature polling instrument is adopted for testing, five times of testing are carried out on a single corner, five groups of data are obtained, the average value is the temperature of the single corner, and the average value of the testing temperature of the four corners is the temperature of the heat-dissipation metal outer frame.

Detection method

Table 1 shows experimental test parameters of examples 1 to 12 and comparative examples 1 to 10

Table 2 shows experimental test parameters of examples 1 to 12 and comparative examples 1 to 10

Test items	The temperature of the metal outer frame is 1 h/DEG C	The temperature of the metal outer frame is 4 h/DEG C
			Example 1	23.11	26.46
Example 2	22.94	25.74
			Example 3	22.81	25.39
Example 4	22.65	25.17
			Example 5	22.68	25.21
Example 6	22.45	24.87
			Example 7	22.38	24.69
Example 8	22.18	24.24
			Example 9	22.31	24.72
Example 10	22.04	24.05
			Example 11	22.36	24.63
Example 12	22.16	24.13
			Comparative example 1	23.71	27.25
Comparative example 2	22.63	25.12
			Comparative example 3	23.43	27.02
Comparative example 4	23.51	27.11
			Comparative example 5	23.35	26.93
Comparative example 6	23.01	26.81
			Comparative example 7	22.77	25.41
Comparative example 8	22.53	25.38
			Comparative example 9	22.52	25.34
Comparative example 10	22.37	25.23

As can be seen by combining preparation examples 1 to 12 and preparation examples 13 to 22 and combining table 1, the thermal conductivity of the insulating high thermal conductive adhesive in preparation example 1 is greater than that of the insulating high thermal conductive adhesive in preparation example 13, and the thermal conductivity of the insulating high thermal conductive adhesive in preparation example 6 is greater than that of the insulating high thermal conductive adhesive in preparation example 14, so that the high thermal conductive graphene is uniformly dispersed in the thermal conductive silica gel by using the graphene feeding device and inputting the high thermal conductive graphene into the reaction kettle by using nitrogen as a carrier gas to mix with the thermal conductive silica gel, and the thermal conductivity of the prepared insulating high thermal conductive adhesive is improved.

As can be seen by combining preparation examples 1-12 and preparation examples 13-22 and combining Table 1, the thermal conductivity of the insulating high thermal conductive adhesive in preparation examples 1-3 is greater than that of the insulating high thermal conductive adhesive in preparation examples 15-16, and therefore, the mass ratio of the spherical alumina granules of 240-400 meshes to the spherical alumina granules of 2000-5000 meshes is (4-7): 1, the prepared insulating high-thermal-conductivity adhesive has a good thermal conductivity coefficient.

It can be seen from the combination of preparation examples 1 to 12 and preparation examples 13 to 22 and the combination of table 1 that the thermal conductivity of the insulating high thermal conductive adhesive in preparation examples 4 to 5 is greater than that of the insulating high thermal conductive adhesive in preparation examples 17 to 18, and therefore, when the amount of the reinforcing thermal conductive powder is 5 to 25 parts, the thermal conductivity of the prepared insulating high thermal conductive adhesive is better and the production cost is lower.

It can be seen from the combination of the preparation examples 1 to 12 and the preparation examples 13 to 22 and the combination of table 1 that the thermal conductivity of the insulating high thermal conductive adhesive in the preparation examples 10 to 12 is greater than that of the insulating high thermal conductive adhesive in the preparation examples 21 to 22, and therefore, when the amount of the phase change particles is 5 to 25 parts, the prepared insulating high thermal conductive adhesive has a better thermal conductivity and a lower production cost.

By combining examples 1-12, comparative examples 1-10, and preparation examples 1-22, and by combining tables 1-2, it can be seen that the backlight prepared by using the insulating high thermal conductive adhesive in the present application has good heat dissipation performance, can avoid excessive local heat accumulation of the backlight plate, improves the reliability of the vehicle-mounted backlight, and prolongs the service life of the vehicle-mounted backlight. In particular, a comparison between example 1 and example 6 shows that the addition of the phase change particles reduces the thermal conductivity of the insulating high thermal conductive adhesive, but has a positive effect on the heat dissipation of the prepared vehicle-mounted backlight, and a vehicle-mounted LED high-brightness backlight with more excellent performance is obtained.

The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a high bright backlight of on-vehicle LED which characterized in that: the LED backlight module comprises a high-heat-dissipation backlight plate (1), a reflecting film (10) and LED lamps (100), wherein the LED lamps (100) are fixedly connected to the high-heat-dissipation backlight plate (1) in a dot matrix manner; a metal heat-conducting plate (101) is integrally formed at the bottom of the LED lamp (100); the metal heat-conducting plate (101) is fixedly connected with an insulating high heat-conducting glue layer (20); the surface of the insulating high-heat-conduction adhesive layer (20) back to the metal heat-conducting plate (101) is fixedly connected to the upper surface of the high-heat-dissipation backlight plate (1); the reflecting film (10) is fixedly connected to the upper surface of the high-heat-dissipation backlight plate (1); the reflecting film (10) is integrally formed with a mounting area (102) for fixedly connecting the LED lamp (100) to the high-heat-dissipation backlight plate (1).

2. The vehicle-mounted LED high-brightness backlight source according to claim 1, characterized in that: the insulating high-thermal-conductivity adhesive layer (20) is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles and 5-25 parts of enhanced heat-conducting powder.

3. The vehicle-mounted LED high-brightness backlight source according to claim 2, characterized in that: the heat conducting framework is filled with a mixture of spherical alumina granules with the particle size of 240-400 meshes and spherical alumina granules with the particle size of 2000-5000 meshes; the mass ratio of the spherical alumina granules with 400 meshes and the spherical alumina granules with 5000 meshes is (4-7): 1; the enhanced heat-conducting powder is high heat-conducting graphene with the granularity less than or equal to 10 microns.

4. The vehicle-mounted LED high-brightness backlight source according to claim 2, characterized in that: the insulating high-thermal-conductivity adhesive layer (20) is prepared from the following raw materials in parts by weight: 100 parts of heat-conducting silica gel, 20-40 parts of heat-conducting framework filling particles, 5-25 parts of enhanced heat-conducting powder and 5-25 parts of phase-change particles.

5. The vehicle-mounted LED high-brightness backlight source according to claim 4, characterized in that: the phase change particles are prepared from the following raw materials: high thermal conductivity conductive media, phase change wax pellets; the high heat conduction and conduction medium accounts for 5-20% of the total mass of the phase change particles; the grain size of the phase-change particles is 0.2-0.8 mm.

6. The vehicle-mounted LED high-brightness backlight source according to claim 5, characterized in that: the high heat conduction and conduction medium is silver tungsten carbide graphene or MWNT carbon nano tube.

7. The vehicle-mounted LED high-brightness backlight source according to claim 2, characterized in that: the preparation method of the insulating high-thermal-conductivity adhesive layer (20) comprises the following steps:

step 1, stirring accurately-metered heat-conducting silica gel at the speed of 100 plus 150rpm under the protection of nitrogen, dividing the filling particles of the heat-conducting framework into three parts during stirring, adding the three parts into the heat-conducting silica gel at intervals, and obtaining a semi-finished product at the interval time of 120 plus 200s for each time;

step 2, placing the accurately measured enhanced heat conduction powder in a graphene feeding device, inputting the enhanced heat conduction powder into a semi-finished product by taking nitrogen as a carrier, conveying the enhanced heat conduction powder with the content of 200-600mg/L in the nitrogen, and conveying the nitrogen at the flow speed of 0.2-0.8 m/s;

8. The vehicle-mounted LED high-brightness backlight source according to claim 5, characterized in that: the preparation method of the phase-change particles comprises the following steps:

9. The vehicle-mounted LED high-brightness backlight source according to claim 8, characterized in that: the preparation method of the insulating high-thermal-conductivity adhesive layer (20) comprises the following steps: