CN106281203A - A kind of preparation technology of LED high viscosity conducting resinl - Google Patents
A kind of preparation technology of LED high viscosity conducting resinl Download PDFInfo
- Publication number
- CN106281203A CN106281203A CN201610654943.5A CN201610654943A CN106281203A CN 106281203 A CN106281203 A CN 106281203A CN 201610654943 A CN201610654943 A CN 201610654943A CN 106281203 A CN106281203 A CN 106281203A
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- Prior art keywords
- conducting resinl
- high viscosity
- preparation
- parts
- led high
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Die Bonding (AREA)
Abstract
The present invention relates to the preparation technology of a kind of LED high viscosity conducting resinl, preparation process is as follows: the 1) preparation of alloyed powder, weighs nanometer silver powder, silicon dioxide, nano oxidized barium, zinc powder, MTES, graphite；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10‑3The vacuum of torr is smelted into homogeneous alloy solution, and the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；2) preparation of conducting resinl, based on weight/mass percentage composition, by organic siliconresin, polyurethane, polyimide resin, toughener, firming agent, stirs, is slowly added to alloyed powder, stir, froth in vacuum, prepares described LED high viscosity conducting resinl.The technological merit of the present invention is: the alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization, and prepared conducting resinl resistivity is low, thermal conductivity is high, adhesive property is good, service life is long.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to the preparation technology of a kind of LED high viscosity conducting resinl.
Background technology
LED conducting resinl, is the connection for LED chip and base material, it is possible to realize the function of heat conduction and conduction simultaneously.Lead
Electric adhesive is also referred to as conducting resinl, is the solidification at a certain temperature being made up of matrix resin, firming agent and conductive filler or dry
After dry can adhesive base plate material effectively, can have again the special adhesive of electric conductivity.Conducting resinl can be divided by matrix composition
For structural type and the big class of filled-type two.Structural type refers to that the macromolecular material as conducting resinl matrix itself i.e. has electric conductivity
Conducting resinl；Filled-type refer to usual adhesive as matrix, and rely on interpolation electroconductive stuffing make glue have electric action
Conducting resinl.The preparation of conducting polymer composite at present also has bigger distance from reality application, and the most widely used being is filled out
Fill type conducting resinl.As epoxy resin adhesive can solidify in room temperature to 150 DEG C, far below more than 200 DEG C of tin-lead welding
Welding temperature, avoiding problems material deformation, the hot injury of electronic device and the formation of internal stress that welding high temperature may cause.
Simultaneously as the developing rapidly of the densification of the miniaturization of electronic component, miniaturization and printed circuit board (PCB) and Highgrade integration,
The minimum pitch of the 0.65mm of slicker solder welding can not meet far away the actual demand being conductively connected, and conducting resinl can make slurry
Material, it is achieved the highest linear resolution.
The developing direction of LED industry is to develop towards the high-power direction of high brightness, super brightness, thus proposes conducting resinl
Higher requirement, the great power LED thermal diffusivity to conducting resinl, traditional heat-conducting glue thermal conductivity is less than 10W/m K, and highlighted
The cooling requirements of degree high-power LED chip is higher than 20W/m K；Develop suitable curing system, make the conducting resinl can be the longest
Time stores, it is to avoid high cost of transportation and storage cost；The stability of contact resistance and the reliability of electric property.Cause
How this, develop the LED conducting resinl that resistivity is low, thermal conductivity is high, adhesive property is good the most urgent.
Summary of the invention
It is an object of the invention to provide the preparation technology of a kind of LED high viscosity conducting resinl, effectively solve great power LED
Thermal diffusivity problem after chip long-term work.
The technical scheme realizing the purpose of the present invention is: the preparation technology of a kind of LED high viscosity conducting resinl, preparation process
As follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80～100 parts, silicon dioxide 8～15 parts, Barium monoxide 20～30 parts, zinc powder 40～50 parts, first
Ethyl triethoxy silicane alkane 10～15 parts, graphite 6～10 parts；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3torr
Vacuum be smelted into homogeneous alloy solution, make with moment atomization with the pressure peening of 20～30atm with the low gas of activity
Obtain alloyed powder；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by organic siliconresin 10%～15%, polyurethane 2%～5%, polyimide resin
4%～6%, toughener 0.3%～0.7%, firming agent 3%～8%, stir, be slowly added to step 1) obtained by conjunction
Bronze 65%～75%, stirs, froth in vacuum, prepares described LED high viscosity conducting resinl.
Preferably, firming agent of the present invention is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrobenzene
One or more mixture in acid anhydride, methylnadic anhydride, dodecyl maleic anhydride.
Preferably, toughener of the present invention is thermal shrinkage type resin, rubber elastomer and the one of acrylate apoplexy due to endogenous wind
Or multiple mixture.
Preferably, step 1 of the present invention) gas that the activity that uses is low is selected from argon or nitrogen.
The technological merit of the present invention is: the alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization,
The conducting resinl resistivity prepared is low, thermal conductivity is high, adhesive property is good, service life is long.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be further described.
A kind of preparation technology of LED high viscosity conducting resinl, preparation process is as follows:
Embodiment 1:
1) preparation of alloyed powder
Weigh nanometer silver powder 80 parts, silicon dioxide 8 parts, Barium monoxide 20 parts, zinc powder 40 parts, MTES 10
Part, 6 parts of graphite；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3It is molten that the vacuum of torr is smelted into homogeneous alloy
Liquid, the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by organic siliconresin 10%, polyurethane 2%, polyimide resin 4%, toughener
0.3%, firming agent 3%, stirs, and is slowly added to step 1) obtained by alloyed powder 65%, stir, froth in vacuum,
Prepare described LED high viscosity conducting resinl.
Embodiment 2
1) preparation of alloyed powder
Weigh nanometer silver powder 100 parts, silica 15 parts, Barium monoxide 30 parts, zinc powder 50 parts, MTES 15
Part, 10 parts of graphite；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3The vacuum of torr is smelted into homogeneous alloy
Solution, the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by organic siliconresin 15%, polyurethane 5%, polyimide resin 6%, toughener
0.7%, firming agent 8%, stirs, and is slowly added to step 1) obtained by alloyed powder 75%, stir, froth in vacuum,
Prepare described LED high viscosity conducting resinl.
In above-described embodiment 1～2, selected firming agent is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl six
One or more mixture in hydrogen phthalic anhydride, methylnadic anhydride, dodecyl maleic anhydride.Selected toughener is
One or more mixture of thermal shrinkage type resin, rubber elastomer and acrylate apoplexy due to endogenous wind.The gas that selected activity is low is choosing
From argon or nitrogen.
Conducting resinl obtained by embodiment 1～2 is carried out the test of performance, specific insulation about 10-5～10-4Ω cm,
Heat conductivity about 24.0W/m K, viscosity about 48000mPa.s.
Meanwhile, carrying out the test of viscosity after the conducting resinl room temperature obtained by embodiment 1～2 being placed 2 months, viscosity is about
48100mPa.s, it can be seen that prepared conducting resinl has good viscosity stability.
Above-mentioned each embodiment is further illustrating of making of the foregoing to the present invention, but should not be construed as the present invention
The scope of above-mentioned theme is only limitted to above-described embodiment.It should be pointed out that, for those skilled in the art, not
On the premise of departing from the technology of the present invention principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as this
The protection domain of invention.
Claims (4)
1. the LED preparation technology of high viscosity conducting resinl, it is characterised in that preparation process is as follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80～100 parts, silicon dioxide 8～15 parts, Barium monoxide 20～30 parts, zinc powder 40～50 parts, methyl three
Ethoxysilane 10～15 parts, graphite 6～10 parts；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3Torr's is true
Reciprocal of duty cycle is smelted into homogeneous alloy solution, and the gas low by activity prepares with the pressure peening of 20～30atm close with moment atomization
Bronze；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by organic siliconresin 10%～15%, polyurethane 2%～5%, polyimide resin 4%～
6%, toughener 0.3%～0.7%, firming agent 3%～8%, stir, be slowly added to step 1) obtained by alloyed powder
65%～75%, stir, froth in vacuum, prepare described LED high viscosity conducting resinl.
The preparation technology of one or more mixture LED high viscosity conducting resinl the most according to claim 1, its feature exists
In step 2) described in firming agent be that THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methyl receive enlightening
One or more mixture in gram anhydride, dodecyl maleic anhydride.
The preparation technology of one or more mixture LED high viscosity conducting resinl the most according to claim 1, its feature exists
In step 2) described in one or more mixing that toughener is thermal shrinkage type resin, rubber elastomer and acrylate apoplexy due to endogenous wind
Thing.
The preparation technology of one or more mixture LED high viscosity conducting resinl the most according to claim 1, its feature exists
In described step 1) gas that the activity that uses is low is selected from argon or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654943.5A CN106281203A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED high viscosity conducting resinl |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654943.5A CN106281203A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED high viscosity conducting resinl |
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| CN106281203A true CN106281203A (en) | 2017-01-04 |
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| CN201610654943.5A Withdrawn CN106281203A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED high viscosity conducting resinl |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112143235A (en) * | 2020-09-26 | 2020-12-29 | 追信数字科技有限公司 | Alloy corrosion-resistant heat exchange tube and manufacturing method thereof |
| CN114015410A (en) * | 2021-11-12 | 2022-02-08 | 凯仁精密材料(江苏)有限公司 | Premixing method of conductive glue, conductive adhesive tape and preparation method of conductive adhesive tape |
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| CN102108277A (en) * | 2011-01-20 | 2011-06-29 | 黄元盛 | Entropy alloy powder conductive adhesive and manufacturing method thereof |
| CN102162078A (en) * | 2011-03-30 | 2011-08-24 | 北京矿冶研究总院 | AgZnCu alloy powder for thermal spraying and preparation method thereof |
| CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
| CN102747248A (en) * | 2012-07-20 | 2012-10-24 | 浙江乐银合金有限公司 | Sliver-oxide ternary alloy electrical contact material and production method thereof |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
| CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
-
2016
- 2016-08-11 CN CN201610654943.5A patent/CN106281203A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102108277A (en) * | 2011-01-20 | 2011-06-29 | 黄元盛 | Entropy alloy powder conductive adhesive and manufacturing method thereof |
| CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
| CN102162078A (en) * | 2011-03-30 | 2011-08-24 | 北京矿冶研究总院 | AgZnCu alloy powder for thermal spraying and preparation method thereof |
| CN102747248A (en) * | 2012-07-20 | 2012-10-24 | 浙江乐银合金有限公司 | Sliver-oxide ternary alloy electrical contact material and production method thereof |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
| CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112143235A (en) * | 2020-09-26 | 2020-12-29 | 追信数字科技有限公司 | Alloy corrosion-resistant heat exchange tube and manufacturing method thereof |
| CN114015410A (en) * | 2021-11-12 | 2022-02-08 | 凯仁精密材料(江苏)有限公司 | Premixing method of conductive glue, conductive adhesive tape and preparation method of conductive adhesive tape |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170104 |
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