CN102002336A - Solvent-free high-performance conductive adhesive - Google Patents
Solvent-free high-performance conductive adhesive Download PDFInfo
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- CN102002336A CN102002336A CN201010580604XA CN201010580604A CN102002336A CN 102002336 A CN102002336 A CN 102002336A CN 201010580604X A CN201010580604X A CN 201010580604XA CN 201010580604 A CN201010580604 A CN 201010580604A CN 102002336 A CN102002336 A CN 102002336A
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Abstract
The invention discloses a solvent-free high-performance conductive adhesive and belongs to the technical field of LED packaging materials. The conductive adhesive comprises the following raw materials in part by weight: 15 to 25 parts of epoxy resin, 1 to 2 parts of coupling agent, 1 to 2 parts of curing agent, 0.5 to 0.7 part of curing accelerator and 75 to 80 parts of conductive filler. The product is prepared by the following steps of: uniformly mixing and stirring the raw materials and performing vacuum defoaming. By adopting low-viscosity epoxy resin, the viscosity of a resin system is improved, the dispersion of the conductive filler is accelerated, and the electric conductivity and bonding strength of the conductive adhesive are improved when a low-melting point alloy is added. The product has the characteristics of simple preparation technology, low cost, environment friendliness and the like, and has higher conductive performance and shear strength.
Description
Technical field
The present invention relates to a kind of no-solvent type high-performance conducting resin, belong to LED packaged material technical field.
Background technology
Conductive resin is made up of resin, conductive filler material and additive, has high conductivity and cohesive strength preferably.Because it has the solidification value lower than traditional wiping solder, curing process is simple, simultaneously along with the development of microelectronics, wiping solder more and more can not satisfy the requirement of minuteness space interconnection technique, and plumbous as the use that has been under an embargo in the world of toxic metal element.In recent years, conductive resin begins to replace gradually traditional wiping solder in fields such as SMT, SMD, PCD.But conductive resin is compared with traditional wiping solder so far, still has certain disadvantages, and low as bonding strength, aspects such as electric conductivity, thermal conductivity all are lower than wiping solder, and uses the conductive resin major part all to contain organic solvent on the market.The volatilization of organic solvent can produce a very large impact environment, therefore reduce the usage quantity of organic solvent, the conductive resin of researching and developing solvent-free high-adhesive-strength, high conductivity and high thermal conductivity is the present focus direction of research, and the present invention is at above-mentioned 4 and invent.
Summary of the invention
The object of the present invention is to provide a kind of non-solvent single-component LED conductive resin, have that technology is simple, cost is low, characteristics such as environmental protection, prepared conductive resin has conductivity and shearing resistance preferably after solidifying.
To achieve these goals, technical scheme of the present invention is: a kind of no-solvent type high-performance conducting resin comprises the component of following weight part:
15～25 parts of Resins, epoxy
1～2 part in solidifying agent
0.5～0.7 part of curing catalyst
1～2 part of coupling agent KH560
75～80 parts of conductive filler materials
Above composition is mixed, and vacuum defoamation also is heating and curing.
Described Resins, epoxy is a kind of or blend in Bisphenol F type, bisphenol A-type, the aliphatic glycidyl ether based epoxy resin.
Described bisphenol f type epoxy resin is Bisphenol F 170 or Bisphenol F 862.
Described coupling agent is silane coupling agent or titante coupling agent.
Described silane coupling agent is KH550, KH560 or KH570.
Described solidifying agent is imidazole curing agent, Dyhard RU 100 or acid anhydride type curing agent.
Described curing catalyst is amides or imidazoles curing catalyst.
Described conductive filler material is the blend of silver powder, Sn/Bi alloy, and the blending ratio scope of silver powder and Sn/Bi alloy is 15: 1～5: 1.
Described silver powder is flake silver powder, and particle diameter is 2～5 μ m.
The present invention has following beneficial effect:
The present invention adopts bisphenol f type epoxy resin etc. to have the resin of the low and excellent water tolerance of viscosity, with its main component as this conductive resin resin system, guarantee that conductive resin has than low-viscosity, help the dispersion of conductive filler material in resin system, provide precondition for conductive resin reaches excellent conducting performance; Also avoided with an organic solvent making thinner, thereby guaranteed the feature of environmental protection of conductive resin.The low viscosity resin system has improved the bearing capacity of the metallic stuffing of conductive resin simultaneously, thereby improves the conduction and the thermal conductivity of conductive resin.
It is a kind of auxiliary agent that improves conductive filler material and resin boundary surface performance that the present invention adopts coupling agent, joins the dispersing property that can improve conductive filler material in the conductive resin, thereby improves conductivity.In addition, the adding of coupling agent can weaken metallic stuffing to the deterioration of resin system mechanical property, and then improves the mechanical property after conductive resin solidifies.
The present invention with silver powder as main conductive filler material, by adding a spot of low melting point alloy, low melting point alloy soaks around the silver powder particle in the solidification process, when solidifying the back, the low melting point alloy cooling forms the metallurgical connection of one deck around silver powder, thereby reduce the contact resistance of monolithic conductive glue, promote the raising of electric conductivity and thermal conductivity.And the Sn/Bi alloy is a kind of low melting point alloy, and fusing point is 140 ℃.The interpolation of Sn/Bi alloy can form the metallurgical connection of a cubic network in the conductive resin after curing, must improve the conductivity of conductive resin, the Sn/Bi alloy also can and be connected and forms a metallurgical binding between the surface metal simultaneously, thereby improves the bonding strength of conductive resin connector members.
Embodiment
In order to understand the present invention better, further illustrate content of the present invention below in conjunction with example, but the present invention not only is confined to the following examples.
A kind of no-solvent type high-performance conducting resin, form by following compositions in portion by weight:
15～25 parts of Resins, epoxy
1～2 part in solidifying agent
0.5～0.7 part of curing catalyst
1～2 part of coupling agent KH560
75～80 parts of conductive filler materials
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then.
Embodiment 1:
170 16 parts of Bisphenol F
1.4 parts of Dyhard RU 100s
0.6 part of amides curing catalyst
2 parts of coupling agent KH560
5 parts of Sn/Bi alloys
75 parts of flake silver powders
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then, and recording volume specific resistance is 4.9 * 10
-4Ω .cm, shear tension intensity is 12.5Mpa.
Embodiment 2:
170 18 parts of Bisphenol F
1.5 parts of Dyhard RU 100s
0.5 part of amides curing catalyst
2 parts of coupling agent KH560
8 parts of Sn/Bi alloys
70 parts of flake silver powders
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then, and recording volume specific resistance is 3.5 * 10
-4Ω .cm, shear tension intensity is 13.5MPa.
Example 3:
170 11 parts of Bisphenol F
5 parts of resin GE-31
1.4 parts of Dyhard RU 100s
0.6 part of amides curing catalyst
2 parts of coupling agent KH560
15 parts of Sn/Bi alloys
65 parts of flake silver powders
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then, and recording volume specific resistance is 2.1 * 10
-4Ω .cm, shear tension intensity is 13.0MPa
Embodiment 4:
862 20 parts of Bisphenol F
1.4 parts of Dyhard RU 100s
0.6 part of amides curing catalyst
2 parts of coupling agent KH560
11 parts of Sn/Bi alloys
65 parts of flake silver powders
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then, and recording volume specific resistance is 2.9 * 10
-4Ω .cm, shear tension intensity is 14.0MPa.
Example 5:
22 parts of resin GE-31
1.5 parts of Dyhard RU 100s
0.5 part of amides curing catalyst
1 part of coupling agent KH560
5 parts of Sn/Bi alloys
70 parts of flake silver powders
Above composition is mixed, and vacuum defoamation is solidified 1h down at 150 ℃ then, and recording volume specific resistance is 2.3 * 10
-4Ω .cm, shear tension intensity is 9.2MPa
The flake silver powder particle diameter is 2～5 μ m in the various embodiments described above; Bound, interval value by disclosed each raw material, and the bound of processing parameter (as temperature, time etc.), interval value, and the congener of each raw material replaces and can both realize the object of the invention, and Resins, epoxy as described also can be selected for use and be a kind of or blend in bisphenol A-type, the aliphatic glycidyl ether based epoxy resin.Described coupling agent also can be selected KH550, the KH570 etc. of silane coupling agent for use; Perhaps select titante coupling agent for use.Described solidifying agent also can be selected for use and be imidazole curing agent or acid anhydride type curing agent.Described curing catalyst also can be selected for use and be the imidazoles curing catalyst.Do not enumerate embodiment one by one at this.
Claims (9)
1. no-solvent type high-performance conducting resin is characterised in that it comprises the component of following weight part:
15～25 parts of Resins, epoxy
1～2 part in solidifying agent
0.5～0.7 part of curing catalyst
1～2 part of coupling agent
75～80 parts of conductive filler materials
With above mixing and stirring, vacuum defoamation also is heating and curing, and promptly gets described conductive resin.
2. a kind of no-solvent type high-performance conducting resin according to claim 1 is characterized in that: described Resins, epoxy is a kind of or its blend in Bisphenol F type, bisphenol A-type, the aliphatic glycidyl ether based epoxy resin.
3. a kind of no-solvent type high-performance conducting resin according to claim 2 is characterized in that: described bisphenol f type epoxy resin is Bisphenol F 170 or Bisphenol F 862 resins.
4. a kind of no-solvent type high-performance conducting resin according to claim 1 is characterized in that: described coupling agent is silane coupling agent or titante coupling agent.
5. a kind of no-solvent type high-performance conducting resin according to claim 4 is characterized in that: described silane coupling agent is KH550, KH560 or KH570.
6. a kind of no-solvent type high-performance conducting resin according to claim 1 is characterized in that: described solidifying agent is imidazole curing agent, Dyhard RU 100 or acid anhydride type curing agent.
7. a kind of no-solvent type high-performance conducting resin according to claim 1 is characterized in that: described curing catalyst is amides or imidazoles curing catalyst.
8. a kind of no-solvent type high-performance conducting resin according to claim 1 is characterized in that: described conductive filler material is the blend of silver powder, Sn/Bi alloy.
9. a kind of no-solvent type high-performance conducting resin according to claim 7 is characterized in that: described silver powder is flake silver powder, and particle diameter is 2～5 μ m.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010580604XA CN102002336A (en) | 2010-12-09 | 2010-12-09 | Solvent-free high-performance conductive adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010580604XA CN102002336A (en) | 2010-12-09 | 2010-12-09 | Solvent-free high-performance conductive adhesive |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102329587A (en) * | 2011-08-24 | 2012-01-25 | 贵州振华亚太高新电子材料有限公司 | Solvent-free conductive silver adhesive with stable contact resistance |
| CN102504741A (en) * | 2011-10-26 | 2012-06-20 | 中国电器科学研究院有限公司 | High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) |
| CN103547610A (en) * | 2011-05-19 | 2014-01-29 | 陶氏环球技术有限责任公司 | Novel structural adhesive and use thereof |
| CN103666316A (en) * | 2013-12-10 | 2014-03-26 | 江苏瑞德新能源科技有限公司 | High-temperature-repairable conductive adhesive and preparation method thereof |
| CN107825001A (en) * | 2017-11-22 | 2018-03-23 | 张家港市东大工业技术研究院 | Tin bismuth spray printing soldering paste that a kind of silver powder particles are modified and preparation method thereof |
| CN109054477A (en) * | 2018-07-12 | 2018-12-21 | 杨帮燕 | A kind of epoxy resin-matrix anti-static coatings |
| CN109401664A (en) * | 2017-08-15 | 2019-03-01 | 电子科技大学中山学院 | High-thermal-conductivity and electric-conductivity silver adhesive and preparation method thereof |
| CN109679552A (en) * | 2018-11-16 | 2019-04-26 | 云南科威液态金属谷研发有限公司 | A kind of liquid metal conducting resinl and its application |
| CN110875099A (en) * | 2018-08-31 | 2020-03-10 | 苏州晶银新材料股份有限公司 | Low-temperature conductive silver paste, preparation method thereof and product containing low-temperature conductive silver paste |
| CN111446020A (en) * | 2019-01-16 | 2020-07-24 | 北京氦舶科技有限责任公司 | Conductive silver paste, preparation method thereof and metal grid conductive film |
| CN113004830A (en) * | 2021-03-05 | 2021-06-22 | 常州烯奇新材料有限公司 | Weather-resistant high-thermal-conductivity graphene-based epoxy resin adhesive and preparation method thereof |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547610A (en) * | 2011-05-19 | 2014-01-29 | 陶氏环球技术有限责任公司 | Novel structural adhesive and use thereof |
| CN103547610B (en) * | 2011-05-19 | 2017-08-11 | 陶氏环球技术有限责任公司 | New construction adhesive and its application |
| CN102329587A (en) * | 2011-08-24 | 2012-01-25 | 贵州振华亚太高新电子材料有限公司 | Solvent-free conductive silver adhesive with stable contact resistance |
| CN102504741A (en) * | 2011-10-26 | 2012-06-20 | 中国电器科学研究院有限公司 | High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) |
| CN103666316A (en) * | 2013-12-10 | 2014-03-26 | 江苏瑞德新能源科技有限公司 | High-temperature-repairable conductive adhesive and preparation method thereof |
| CN103666316B (en) * | 2013-12-10 | 2016-05-18 | 江苏瑞德新能源科技有限公司 | A kind of high temperature can be repaired conducting resinl and preparation method thereof |
| CN109401664A (en) * | 2017-08-15 | 2019-03-01 | 电子科技大学中山学院 | High-thermal-conductivity and electric-conductivity silver adhesive and preparation method thereof |
| CN107825001A (en) * | 2017-11-22 | 2018-03-23 | 张家港市东大工业技术研究院 | Tin bismuth spray printing soldering paste that a kind of silver powder particles are modified and preparation method thereof |
| CN107825001B (en) * | 2017-11-22 | 2020-05-12 | 张家港市东大工业技术研究院 | Silver powder particle modified tin-bismuth jet printing soldering paste and preparation method thereof |
| CN109054477A (en) * | 2018-07-12 | 2018-12-21 | 杨帮燕 | A kind of epoxy resin-matrix anti-static coatings |
| CN110875099A (en) * | 2018-08-31 | 2020-03-10 | 苏州晶银新材料股份有限公司 | Low-temperature conductive silver paste, preparation method thereof and product containing low-temperature conductive silver paste |
| CN110875099B (en) * | 2018-08-31 | 2021-07-30 | 苏州晶银新材料股份有限公司 | Low-temperature conductive silver paste, preparation method thereof and product containing low-temperature conductive silver paste |
| CN109679552A (en) * | 2018-11-16 | 2019-04-26 | 云南科威液态金属谷研发有限公司 | A kind of liquid metal conducting resinl and its application |
| CN111446020A (en) * | 2019-01-16 | 2020-07-24 | 北京氦舶科技有限责任公司 | Conductive silver paste, preparation method thereof and metal grid conductive film |
| CN113004830A (en) * | 2021-03-05 | 2021-06-22 | 常州烯奇新材料有限公司 | Weather-resistant high-thermal-conductivity graphene-based epoxy resin adhesive and preparation method thereof |
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Application publication date: 20110406 |