201207606 六、發枬說明： 【發明所屬之技術領域】 本發明涉及一種散熱帶及其製造方法， ^ 【先前技術】 備等電音響、制、醫療11械、辦公賊、通信設 電子用或汽車用的部件缝置，其複雜性正在逐 Ο Ο 求，曰使件等的複雜化’由於小型化、高性能化的需201207606 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating belt and a method of manufacturing the same, ^ [Prior Art] Preparing an electric sound, system, medical equipment, office thief, communication electronic device or automobile The use of the components is being sewn, and the complexity is becoming more and more complicated, and the complexity of the components is becoming more complicated due to miniaturization and high performance.
Li于面積摘縮小、組裝的電子部件個數逐漸增加，而部件 狀t呈現小型化的趨勢。因此，為了防止各個電子部件 ，的熱1導致產品輯或不良，如何有效消除， 性正在逐漸增強。 '、戈 以在的散熱帶其基材採用塑膠、紙、無紡布等材料，此 料的熱傳導率低，具有降低散熱帶散熱效果的缺點。 並J_ ’以往魄鱗通常使用;5墨構件，其具有良好的熱傳 ^ 石墨構件本身呈薄板形狀’為了形成散熱機制而進行組 裝時，，存在易碎或易毁損的問題；根據散熱原理，熱傳導向水準 方向形成，存在散熱效率降低的問題。 尤其是，近年來經常使用的電子產品，其發熱量非常高，當 無法有效處理發熱現象時，將會導致產品使用壽命縮短或產品發 生不良。因此，需要一種具有良好的散熱效果的散熱方法。 【發明内容】 本發明的目的在於，提供一種散熱效果良好且粘貼力良好的 散熱帶及其製造方法。 根據本發明的一個實施例，提供一種散熱帶，其特徵在於， 包含.金屬基材、石墨墨水(graphite丨业)層、粘貼層及離型層；上 100123443 1003297556-0 201207606 墨水層形成於金屬基材的—面，上述艇 :另一面’上述離型層形成在_層的另-面，以 方法實Ϊ例’提供—種散熱帶的製造方法，該 在卜、驟·在金屬基材的"'面形成石墨墨水層的步驟； 步驟以!一面形成由熱傳導性粘貼劑形成的粘貼層的 驟-。，’及為了使離型層直接與上述祕賴編進行層壓的步 向ϋί據散熱帶’其熱料及分賴時向轉和垂直方 其枯；I力綱，賴嶋舰進行散熱， ㈣涉及的散熱帶料適驗各種電子產品，例如：The number of electronic components that Li is reduced in size and assembled is gradually increased, and the component shape t tends to be miniaturized. Therefore, in order to prevent the heat 1 of each electronic component from causing a product to be complicated or defective, how to effectively eliminate it, the sex is gradually increasing. ', Ge's heat-dissipating belt is made of plastic, paper, non-woven fabric, etc. The material has low thermal conductivity and has the disadvantage of reducing the heat dissipation effect of the heat-dissipating belt. And J_ 'In the past, the scales are usually used; 5 ink members, which have good heat transfer. The graphite members themselves are in the shape of a thin plate. When assembling for forming a heat dissipation mechanism, there is a problem of fragility or damage; according to the principle of heat dissipation, The heat conduction is formed in the horizontal direction, and there is a problem that the heat dissipation efficiency is lowered. In particular, electronic products that have been frequently used in recent years have a very high calorific value, and when the heat generation cannot be effectively handled, the life of the product is shortened or the product is defective. Therefore, there is a need for a heat dissipation method that has a good heat dissipation effect. SUMMARY OF THE INVENTION An object of the present invention is to provide a heat dissipation belt having a good heat dissipation effect and a good adhesion, and a method of manufacturing the same. According to an embodiment of the present invention, a heat dissipation tape is provided, comprising: a metal substrate, a graphite ink layer, an adhesive layer, and a release layer; and an ink layer formed on the metal The surface of the substrate, the above-mentioned boat: the other side of the above-mentioned release layer is formed on the other side of the layer, and the method for manufacturing the heat dissipation belt is provided by the method example, which is in the metal substrate. The step of forming a graphite ink layer; the step of forming an adhesive layer formed of a thermally conductive adhesive on one side. , 'In order to make the release layer directly laminated with the above-mentioned secret 编 ϋ 据 according to the heat-dissipation belt's hot material and the separation of the turn and the vertical side; I force, Lai 嶋 ship to heat, (4) The heat-dissipating tapes involved are suitable for various electronic products, such as:
Ϊ a Ϊ ΐίίη ^ CPU f曰曰顯不器（LCD)、發光二極體(LED)或有機發光二極體(〇l 等的發熱部位，發熱元件並聯連接的PCB或半導體存儲模組等。 【實施方式】 下面’對本發明的例示性實施例進行說明。 根據本發明的一個實施例，提供一種散熱帶，其特徵 、包含.金屬基材1〇、石墨墨水層2〇、粘貼層3〇及離型層4〇 述水層2G形成於金屬基材1G的—面，上述艇層曰30形成 於金屬基材10的另一面，上述離型層4〇形成在粘貼層3〇 面’以便與粘貼層30接觸。 上述離型層具有保護枯貼層的枯貼性的效果，拆裝自由，可 以使用塑膠薄膜、聚g旨薄膜、塗有離型性被覆物的紙、、布 性材貝，只要疋能夠拆裝自由的材質均不受限制，根據盤 生產者的選擇合理使用。 以有取 根據本發明的一個實施例，還包含底膠層5〇，其形成在上、來 金屬基材10與石墨墨水層20之間，以便與金屬基材1〇和石墨^ 100123443 1003297556-0 4 201207606 水層20接觸9 上述底膠具有提高金屬基材與石墨墨水層之間粘貼力的效 ^。，此’使用底膠的本發明中的散熱帶，相比未使用底膠的本 發明中的散熱帶，其層間粘貼力增加3〜7倍。 根據本發明的一個實施例’上述底膠能夠選自由聚氨酯系、 丙烯酸系及環氧系組成的群中，但是，不限於此。 根據本發明的一個實施例，上述金屬能夠使用選自由鋁、金、 銀、銅、錄、鐵、錫、鋅及鎢組成的群中的一種或兩種以上的合 金，優選使用銘。Ϊ a Ϊ ΐίίη ^ CPU f曰曰 display (LCD), light-emitting diode (LED) or organic light-emitting diode (such as 发热l heating parts, PCBs or semiconductor memory modules connected in parallel with heating elements. [Embodiment] Hereinafter, an exemplary embodiment of the present invention will be described. According to an embodiment of the present invention, a heat dissipating belt is provided, comprising: a metal substrate 1 石墨, a graphite ink layer 2 〇, an adhesive layer 3 〇 And the release layer 4, wherein the water layer 2G is formed on the surface of the metal substrate 1G, the boat layer 30 is formed on the other surface of the metal substrate 10, and the release layer 4 is formed on the surface of the adhesive layer 3 The release layer is in contact with the adhesive layer 30. The release layer has the effect of protecting the dryness of the adhesive layer, and is freely attachable and detachable, and a plastic film, a film for coating, a paper coated with a release coating, and a cloth material can be used. As long as the material that can be disassembled and freely free is not limited, it is reasonably used according to the choice of the disc manufacturer. In accordance with an embodiment of the present invention, a primer layer 5〇 is also formed, which is formed on the metal. Between the substrate 10 and the graphite ink layer 20, so that Contact with metal substrate 1 石墨 and graphite ^ 100123443 1003297556-0 4 201207606 Water layer 20 contact 9 The above primer has the effect of improving the adhesion between the metal substrate and the graphite ink layer, which is used in the present invention using a primer. The heat dissipating tape can increase the interlayer adhesive force by 3 to 7 times compared with the heat dissipating tape of the present invention which does not use the primer. According to an embodiment of the present invention, the primer can be selected from the group consisting of polyurethane, acrylic and epoxy. In the group consisting of, but not limited to. According to an embodiment of the present invention, the above metal can use one selected from the group consisting of aluminum, gold, silver, copper, nickel, tin, zinc, and tungsten or Two or more alloys are preferably used.
a關於現有熱傳導率降低的基材，例如：將現有塑膠、紙、無 纺布等作絲材來使用的情況下，通過紐熱雜制熱向水準 方向散開和向發熱源的周圍散開，進而降低熱部位的溫度，而 根據本發明，使用金屬基材的情況下，由發熱源傳達的熱同時向 水準及垂直方向散開。這種垂直熱傳導原理下的熱傳導效率遠比 水準傳導效率高，散熱效果也非常出色。 根據本發明的一個實施例，上述金屬基材的厚度，根據使用 的產品’合理選擇使用，並無厚度限制。優選的厚度為15〜12〇卿， 更加優選的厚度為60〜100泖。不足15卿時，水準熱傳導效果甚 微；超過120柳時，存在作業效率及成本負擔問題。 根據本發明的一個實施例，上述石墨墨水層由包含石墨的墨 水組合物組成。 這種情況下，由於它是墨水，能夠採用塗敷於金屬方法，進 而確保薄的厚度。同時，能夠克服現有的薄板形狀的石墨散熱構 件易碎或易毀損的缺點以及易沾染的現象。 上述石墨墨水組合物，在墨水化過程中被壓時，石墨的板狀 結構破碎並形成不規則形狀的結構。相比現有石墨薄板中，僅水 準方向具有良好熱傳導性的現象，本發明中隨著石墨的板狀結構 破碎’水準和垂直方向同時具備優秀的熱傳導性。因此，在金屬 100123443 1003297556--0 201207606 基材上進衍石墨墨水組合物塗敷的情況下，通過金屬基材傳導的 熱，在石墨層向水準方向和垂直方向傳導，表現出優秀的散熱效 果。 根據本發明的一個實施例’上述石墨墨水層的厚度可以根據 使用的產品合理調整’優選厚度為1〇〜9〇娜。更為優選的厚度為 20〜60卿。不足10 _的情況下，當受到外部衝擊形成劃痕時，將 導敢部分散熱效果的下降；超過9〇 _的情況下’將會出現製造費 用的增加所帶來的非效率性。 根據本發明的一個實施例，上述石墨墨水層表面能夠形成為 粗糖狀態。石墨墨水層的表面是與金屬基材相接觸的面的另一 面。粗糙的表面具有增加表面積的效果，其放射率高，能夠將更 多的熱發散至空氣。進而能夠進一步提高散熱效果。 根據本發明的一個實施例，上述粘貼層由熱傳導性粘貼劑構 成。上述熱傳導性粘貼劑包含粘貼性樹脂及金屬性填料仰㈣或埶 傳導性填料。 根據本發明的一個實施例，上述粘貼性樹脂，只要是具備粘 貝樹脂，均無限制地使用。例如，能夠使用丙烯酸系粘貼劑、 聚氨酯系粘貼劑或矽酮系粘貼劑，優選地使用丙烯酸系粘貼劑。 根據本發明的一個實施例，本發明的熱傳導性粘貼劑，為了增加 散熱塗料的分散效果，能夠使用分散劑。 並且本發明的熱傳導性粘貼劑，為了調節粘貼特性，還包含 任意交聯劑。 並且，本發明的熱傳導性粘貼劑，在不影響本發明效果的前 ill,包含光引發劑、色素、抗氧化劑、增白劑、紫外線穩定劑、 鋪、增關、阻帽、偶聯劑、發泡劑或高分子微 2甲二球f添加劑。上述添加劑只要是相關行業通常使用的物 質’則不受限制。 ，據本發明的一個實施例，上述枯貼層的優選的厚度為5〜⑼ _ ’更加優選的厚度為1G〜4G _。不;^ 5卿的情況下，由於點貼 100123443 6 1003297556-0 201207606 導致雜力下降；超過6G卿的情況下，由於枯貼劑 或石墨墨水，其熱傳導性相對較低，枯貼層的厚度 增加，則散熱效果就降低。 ㈣ίί本發卿—個實關’本㈣涉及的散熱帶能夠適用于 或PC的CUP等發熱部位，等離子顯示面板（pDp)、 i=i:器(LCD)、發光二極體(LED)或有機發光二極體(〇led ) =^熱雜’發熱元件並聯連接的PCB或半導體存儲模組等的 =產品的部件或汽車部件等。本發明涉及的散熱帶，根據使用 產α口，以合理大小裁剪使用。a. For a substrate having a reduced thermal conductivity, for example, when a conventional plastic, paper, nonwoven fabric or the like is used as a wire material, it is dispersed in the horizontal direction by the heat of the neon heat and spreads around the heat source, and further When the temperature of the hot portion is lowered, according to the present invention, when the metal substrate is used, the heat transmitted from the heat source is simultaneously dispersed in the horizontal and vertical directions. The heat transfer efficiency under this principle of vertical heat conduction is much higher than that of the level conduction, and the heat dissipation effect is also excellent. According to an embodiment of the present invention, the thickness of the above metal substrate is appropriately selected depending on the product used, and there is no thickness limitation. A preferred thickness is 15 to 12 Å, and a more preferred thickness is 60 to 100 Å. When less than 15 qing, the level of heat conduction is very small; when it exceeds 120 sen, there is a problem of work efficiency and cost burden. According to an embodiment of the present invention, the graphite ink layer is composed of an ink composition comprising graphite. In this case, since it is ink, it can be applied to a metal method to ensure a thin thickness. At the same time, it is possible to overcome the disadvantages of the existing thin-plate shaped graphite heat dissipating members which are fragile or easily damaged, and the phenomenon of being easily contaminated. In the above graphite ink composition, when pressed during the ink application, the plate-like structure of graphite is broken and an irregularly shaped structure is formed. Compared with the conventional graphite sheets, only the level direction has a good thermal conductivity. In the present invention, the graphite plate-like structure is broken, and the level and the vertical direction simultaneously have excellent thermal conductivity. Therefore, in the case where the graphite graphite ink composition is coated on the substrate 100123443 1003297556--0 201207606, the heat conducted through the metal substrate is conducted in the graphite layer in the horizontal direction and the vertical direction, exhibiting excellent heat dissipation effect. . According to an embodiment of the present invention, the thickness of the above graphite ink layer can be appropriately adjusted according to the product to be used, and the thickness is preferably 1 〇 to 9 〇. A more preferred thickness is 20 to 60 qing. In the case of less than 10 _, when a scratch is formed by an external impact, the heat dissipation effect of the guide portion is lowered; in the case of more than 9 〇 _, there is an inefficiency caused by an increase in manufacturing cost. According to an embodiment of the present invention, the surface of the graphite ink layer can be formed into a crude sugar state. The surface of the graphite ink layer is the other side of the surface in contact with the metal substrate. Rough surfaces have the effect of increasing the surface area, which has a high emissivity and is capable of dissipating more heat to the air. Further, the heat dissipation effect can be further improved. According to an embodiment of the invention, the adhesive layer is composed of a thermally conductive adhesive. The thermally conductive adhesive contains an adhesive resin and a metallic filler (IV) or a conductive filler. According to an embodiment of the present invention, the adhesive resin is used without limitation as long as it has a adhesive resin. For example, an acrylic adhesive, a urethane adhesive, or an ketone adhesive can be used, and an acrylic adhesive is preferably used. According to an embodiment of the present invention, in the heat conductive adhesive of the present invention, a dispersing agent can be used in order to increase the dispersion effect of the heat-dissipating paint. Further, the thermally conductive adhesive of the present invention further contains an optional crosslinking agent in order to adjust the adhesive properties. Further, the thermally conductive adhesive of the present invention contains a photoinitiator, a dye, an antioxidant, a whitening agent, a UV stabilizer, a coating, a barrier, a cap, a coupling agent, and the like, without affecting the effects of the present invention. A foaming agent or a polymer micro 2 alpha two ball f additive. The above-mentioned additives are not limited as long as they are commonly used in the related industries. According to an embodiment of the present invention, a preferred thickness of the above-mentioned adhesive layer is 5 to (9) _ '. More preferably, the thickness is 1 G to 4 G _. No; ^ 5 Qing's case, due to the point stickers 100123443 6 1003297556-0 201207606 caused the loss of friction; in the case of more than 6G Qing, due to the dry patch or graphite ink, its thermal conductivity is relatively low, the thickness of the layer When added, the heat dissipation effect is reduced. (4) ίί本发卿—一实关' The heat dissipation belts involved in this (4) can be applied to the heating parts such as the CPU of the PC, plasma display panel (pDp), i=i: (LCD), LED (LED) or Organic light-emitting diodes (〇led) = ^ Hot-mixed 'heat-emitting elements connected in parallel with PCBs or semiconductor memory modules, etc. = product parts or automotive parts. The heat dissipating belt according to the present invention is cut and used in a reasonable size according to the use of the alpha port.
根據本發明的一個實施例，提供一種散熱帶的製造方法，包 ，如下步驟：在金屬基材1〇的一面形成石墨墨水層2〇的步驟； ，上述金屬基材10的另一面形成由熱傳導性粘貼劑形成的粘貼層 30的步驟；以及為了使離型層40直接與上述點貼層30接觸而進 行層壓的步驟。 根據本發明的一個實施例，提供一種散熱帶的製造方法，包 括如下步驟：在金屬基材10的一面形成底膠層5〇的步驟；在上 述底膠層50的另一面形成石墨墨水層2〇的步驟；在上述金屬基 材10的另一面形成由熱傳導性粘貼劑形成的粘貼層30的步驟； 以及為了使離型層40直接與上述粘貼層30接觸而進行層壓的步 驟。 在上述散熱帶的製造方法中，上述底膠層50、石墨層20及 枯貼層30的形成，能夠使用選自由凹印印刷塗敷(识狀肌 coating)、微凹版塗敷(Micro gravure coating)、凹印吻塗敷(Kjss gravure coating)、逗號刀塗敷(Comma Knife coating)、軋輥塗敷(r〇ii coating)、喷塗(Spray coating)、線棒式塗敷(Meyer Bar coating)、槽 模塗敷(Slot Die coating)、反向塗敷(Reverser coating)、柔印和膠印 方式組成的群中的一種方式，優選地使用凹印印刷塗敷方式。 在上述散熱帶的製造方法中，上述層壓方式，不受限制，例 如’可以使用濕法層壓（wet lamination )或無溶劑幹覆膜 100123443 1003297556-0 7 201207606 (noh_s〇lvent .dry lamination )方式。 德蚀熱帶完成上述—㈣工賴，触適當大小裁剪 曼使用或利用繞線機軋輥卷起保管。按照通常的方式完成即可。 口田照本發明的實施例進行本發明的詳細說明。本實施例 Πΐί本發明的公開内容’本發明不局限於以下所述的實施 見的3f+於本發明所屬技術領域的普通技術人員來說是顯而易 [實驗1]散熱水平的測定 上，粘貼去除離型層 在粘貼有熱源的鋁底盤構成的棒（bar) 的散熱帶，進行散熱水平試驗。 黑度的铭基材的一* ’利用凹印印刷塗敷機器，將石 ί―聚合物，DajinkemiS公司)按照25赠度進行凹印 敷。基材的其他面上’按照2〇卿厚度進行凹印印刷塗 〇/.、β ^制使用將丙烯酸樹脂50重量％與熱傳導性填料50重量 的熱料絲關進行錄。通過上述玉序製造的 例1) 〇棒（bar) ’經過1小時後測定棒（bar)的溫度（實施 膠松日度的銘基材的一面’利用凹印印刷塗敷機器，將底 ^、隹j 度進行凹印印刷塗敷’在底膠層上面，按照25赠 J進=墨墨水(D-接枝聚合物，Dajinkemis公司）的凹印印刷塗 s貼i=r其他面上’按照2。順進行“印:= ㈣酸樹脂5G重量％與熱傳導性填料5G重量％混 熱，導性祕劑進行塗敷。通過上述工序製造的散 …帶貼至棒（bar)，經過Η、時後測雄的溫度（實施例2)。 =往的散熱帶（SPREADERSHIELD美國E_Graft公司產 :i小時後測定棒的溫度（比較例1)。另外，僅將 矣1 '二^至棒，經過卜]、時後測定棒的溫度（比較例2)。下 表1為上述實施例卜2與比較例丨、2的結果。 100123443 8 1003297556-0 201207606 表1 散熱帶粘 貼前 實施例1 實施例2 比較例1 比較例2 熱源的溫度 (°C) 100 71 71 76 65According to an embodiment of the present invention, there is provided a method of manufacturing a heat dissipation tape, comprising the steps of: forming a graphite ink layer 2 on one side of a metal substrate 1; and forming the other surface of the metal substrate 10 by heat conduction a step of attaching the adhesive layer 30 formed by the adhesive; and a step of laminating the release layer 40 directly in contact with the above-mentioned spot bonding layer 30. According to an embodiment of the present invention, there is provided a method of manufacturing a heat dissipation tape comprising the steps of: forming a primer layer 5 on one side of a metal substrate 10; and forming a graphite ink layer 2 on the other side of the primer layer 50; a step of forming a bonding layer 30 formed of a thermally conductive adhesive on the other surface of the metal substrate 10; and a step of laminating the release layer 40 directly in contact with the bonding layer 30. In the method for producing a heat dissipation tape, the formation of the primer layer 50, the graphite layer 20, and the dry layer 30 can be selected from a gravure coating or a micro gravure coating. ), Kjss gravure coating, Comma Knife coating, r〇ii coating, Spray coating, Meyer Bar coating One of a group consisting of Slot Die coating, Reverser coating, flexo and offset printing, preferably using a gravure printing coating. In the above method for manufacturing the heat dissipating belt, the lamination method is not limited, and for example, 'wet lamination or solventless dry film 100123443 1003297556-0 7 201207606 (noh_s〇lvent.dry lamination) may be used. the way. The German eclipse has completed the above-mentioned (4) work, and the appropriate size is cut and used by Man or rolled up by the winding machine. It can be done in the usual way. The invention is described in detail with reference to the embodiments of the invention. The present invention is not limited to the following description of the present invention. 3f+ is obvious to those skilled in the art to which the present invention pertains. [Experiment 1] Determination of heat dissipation level, pasting The heat dissipation zone of the bar formed of the aluminum chassis to which the heat source is attached is removed from the release layer, and the heat dissipation level test is performed. A * of the blackness of the substrate was gravure printed on a 25-degree basis using a gravure printing coating machine using a gravure printing coating machine. On the other side of the substrate, gravure printing was carried out in accordance with the thickness of 2 Å. The film was used to record 50% by weight of the acrylic resin and 50 parts by weight of the heat conductive filler. Example 1) manufactured by the above-mentioned jade order) Bar "After 1 hour, the temperature of the bar (the side of the substrate on which the rubber is applied) is coated with a gravure printing machine, and the bottom is ^隹j degree gravure printing coating 'on the underlying layer, according to 25 get J = ink (D-graft polymer, Dajinkemis)) gravure printing s paste i = r other surface ' According to 2. "Print: = (4) acid resin 5G wt% and 5G% by weight of the heat conductive filler, and the conductive agent is applied. The tape produced by the above process is attached to the bar and passed through the crucible. Temperature after the measurement (Example 2). = Heat dissipation tape (SPREADERSHIELD US E_Graft Co., Ltd.: I measured the temperature of the rod after 1 hour (Comparative Example 1). In addition, only 矣1 '2^ to the rod, The temperature of the rod was measured after the measurement (Comparative Example 2). Table 1 below shows the results of the above Example 2 and Comparative Examples 丨, 2. 100123443 8 1003297556-0 201207606 Table 1 Example 1 before the heat dissipation tape was pasted Example 2 Comparative Example 1 Comparative Example 2 Temperature of heat source (°C) 100 71 71 76 65
實施例1的散熱帶相比於比較例1，其表現出降溫5〜6t的散 熱效果。比較例2相比於比較例1，表現出降溫1〇〜llC>c的效果， 但這種情況下塗敷易脫或者賴力不好，散熱效果無法持續。 相比以往的散熱帶，即便只有rc的差異，對於使用散熱帶 的產品來說，對其使用壽命將會產生巨大影響，因此，5〜6 異說明性能大幅改善和提高。 以上對本發明的特定部分進行了詳細說明，但應當指出，對 技術領域时通技術來說，上述僅為本發 ，的優選實_，本發_細不局限於·實麵。因此 發明的實質性細根據賴的權項及其等價物而決定。 【圖式簡單說明】 :3示根據本發明的一個實施例的散熱帶結構的簡要圖。 圖為表不根據本發明的一個實施例的散熱帶結構的簡要圖。 【主要元件符號說明】 10金屬基材 2〇石墨墨水層 3〇粘貼層 40離型層 5〇底膠層 100123443 1003297556-0The heat dissipating belt of Example 1 exhibited a heat radiating effect of a temperature drop of 5 to 6 t as compared with Comparative Example 1. In Comparative Example 2, compared with Comparative Example 1, the effect of lowering the temperature of 1 〇 to ll C > c was exhibited, but in this case, the coating was easy to peel off or the repulsion was not good, and the heat dissipation effect could not be sustained. Compared with the previous heat-dissipating belt, even if only the difference of rc, the product using the heat-dissipating belt will have a huge impact on its service life. Therefore, 5 to 6 different performances indicate a significant improvement and improvement. The specific portions of the present invention have been described in detail above, but it should be noted that, in the technical field, the above is only the preferred embodiment of the present invention, and the present invention is not limited to the actual surface. Therefore, the substantive details of the invention are determined based on the rights and equivalents of the invention. BRIEF DESCRIPTION OF THE DRAWINGS: 3 is a schematic view showing a heat dissipation belt structure according to an embodiment of the present invention. The drawing is a schematic view showing a heat dissipating belt structure according to an embodiment of the present invention. [Main component symbol description] 10 metal substrate 2 〇 graphite ink layer 3 〇 adhesive layer 40 release layer 5 〇 primer layer 100123443 1003297556-0