CN103865417A - Manufacture process of voltage-sensitive adhesive tape - Google Patents

Manufacture process of voltage-sensitive adhesive tape Download PDF

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Publication number
CN103865417A
CN103865417A CN201310749012.XA CN201310749012A CN103865417A CN 103865417 A CN103865417 A CN 103865417A CN 201310749012 A CN201310749012 A CN 201310749012A CN 103865417 A CN103865417 A CN 103865417A
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heat
parts
adhesion coating
conducting glue
glue adhesion
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CN103865417B (en
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金闯
梁豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Suzhou Sidike New Material Science and Technology Co Ltd
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Abstract

The invention discloses a manufacture process of a voltage-sensitive adhesive tape, and the manufacture process comprises the following steps: uniformly mixing 0.1-0.2 part of cross-linking agent with 135-150 parts of methylbenzene, 100-145 parts of ethyl acetate and 135-150 parts of butanone to obtain a dilution, uniformly mixing 55-100 parts of graphite powder with the dilution in the first step, mixing 100 parts of acrylic ester adhesive with the mixture liquor in the second step and dispersing by a high-speed agitator for 2-10 hours so as to uniformly mix to form a heat-conducting adhesive mixed solvent, adding 0.8-1 part of coupling agent into the adhesive and agitating for 0.5-1 hour, coating the heat-conducting adhesive mixed solvent obtained in the third step on the lower surface of a PET (Polyetherimide) thin film with an aluminum foil layer on the upper surface, baking the heat-conducting adhesive mixed solvent in the fourth step to form a heat-conducting adhesive layer, and gluing a release material on the other surface of the baked heat-conducting adhesive layer in the fifth step. The voltage-sensitive adhesive tape is capable of keeping the adhesion strength of the contact strength with electronic devices for a long time and has the advantage of overcoming the technical defect that the viscosity of the adhesive layer is greatly reduced during the heat conduction.

Description

The manufacturing process of pressure-sensitive adhesive tape
Technical field
The present invention relates to a kind of manufacturing process of pressure-sensitive adhesive tape, belong to adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause like this volume dwindling, function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating adopting in the past, because volume is large, can produce the problems such as noise, eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, good in also not imagining of radiating effect, slowly, is all finding new efficient heat sink material.Secondly, due to the diversity of electronic product, existing product often needs customization, thus the difficult popularization that is suitable for concrete use occasion and has limited its application; Therefore, if design a kind of for electronic product feature there is high-performance heat radiation adhesive tape, become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The object of the invention is to provide a kind of manufacturing process of pressure-sensitive adhesive tape, the manufacturing process of this pressure-sensitive adhesive tape has improved thermal conductivity greatly in length and thickness direction, and while having overcome long-time heat conduction, greatly reduce the technological deficiency of the viscosity of adhesive linkage, can keep for a long time the sticking strength with the contact strength of electron device, realize the stability of heat dispersion, thereby further improved the work-ing life of adhesive tape.
For achieving the above object, the technical solution used in the present invention is: a kind of manufacturing process of pressure-sensitive adhesive tape, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating obtains by following technique:
The first step, evenly mixes acquisition dilution by 0.1 ~ 0.2 part of linking agent with 135 ~ 150 parts of toluene, 100 ~ 145 parts of ethyl acetate and 135 ~ 150 parts of butanone, this linking agent be selected from following general formula (
Figure 201310749012X100002DEST_PATH_IMAGE001
) compound,
Figure 201310749012X100002DEST_PATH_IMAGE003
（
Figure 997418DEST_PATH_IMAGE001
）；
In formula, R 1, R 2, R 3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir and form mixed solution 84 ~ 86 DEG C of conditions;
The 3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and disperse 2 ~ 10 hours through high speed agitator, form the gluing mixed solvent of heat conduction thereby mix;
The 4th step: 0.8 ~ 1 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
The 5th step: the lower surface of the PET film of aluminium foil layer coated upper surface and have by the gluing mixed solvent of heat conduction that the 3rd step is obtained;
The 6th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 7th step: by another surface laminating separated type material of heat-conducting glue adhesion coating through overbaking in the 5th step;
The 8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
In technique scheme, further improved plan is as follows:
In such scheme, the whipping temp of described second step is 85 DEG C.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the manufacturing process of pressure-sensitive adhesive tape of the present invention, it has improved thermal conductivity greatly in length and thickness direction, and while having overcome long-time heat conduction, greatly reduce the technological deficiency of the viscosity of low adhesive linkage, can keep for a long time the sticking strength with the contact strength of electron device, realize the stability of heat dispersion, thereby further improved the work-ing life of adhesive tape.
2, in the formula of the manufacturing process of pressure-sensitive adhesive tape of the present invention, add specific linking agent, while having overcome long-time heat conduction, greatly reduce the technological deficiency of the viscosity of low adhesive linkage, can keep for a long time the sticking strength with the contact strength of electron device, realize the stability of heat dispersion, thereby further improved the work-ing life of adhesive tape
3, the present invention adopts the component of three kinds of certain content as solvent, has effectively avoided graphite granule agglomeration in the gluing system of subsequent technique acrylate, thereby is conducive to length and thickness direction heat conduction synchronously improves;
4, the present invention is specific according to its formula, adopting diameter is that the graphite of 4 ~ 4.2 microns and Thickness Ratio are the heat conduction pad pasting of 10:18:9 the PET film, heat-conducting glue adhesion coating and the aluminium foil layer that superpose successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thereby further avoid concentrating of adhesive tape amount of localized heat, the work-ing life of having improved product.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of manufacturing process of pressure-sensitive adhesive tape, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating obtains by following technique:
The first step, evenly mixes acquisition dilution by 0.2 part of linking agent with 150 parts of toluene, 125 parts of ethyl acetate and 150 parts of butanone, this linking agent be selected from following general formula (
Figure 914558DEST_PATH_IMAGE001
) compound,
Figure 694295DEST_PATH_IMAGE003
（
Figure 276455DEST_PATH_IMAGE001
）；
In formula, R 1, R 2, R 3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Fe or Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir and form mixed solution 84 ~ 86 DEG C of conditions;
The 3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and disperse 2 ~ 10 hours through high speed agitator, form the gluing mixed solvent of heat conduction thereby mix;
The 4th step: 0.8 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
The 5th step: the lower surface of the PET film of aluminium foil layer coated upper surface and have by the gluing mixed solvent of heat conduction that the 3rd step is obtained;
The 6th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 7th step: by another surface laminating separated type material of heat-conducting glue adhesion coating through overbaking in the 5th step;
The 8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
The whipping temp of above-mentioned second step is 85 DEG C.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.

Claims (2)

1. the manufacturing process of a pressure-sensitive adhesive tape, it is characterized in that: comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and described heat-conducting glue adhesion coating obtains by following technique:
The first step, evenly mixes acquisition dilution by 0.1 ~ 0.2 part of linking agent with 135 ~ 150 parts of toluene, 100 ~ 145 parts of ethyl acetate and 135 ~ 150 parts of butanone, this linking agent be selected from following general formula (
Figure 808254DEST_PATH_IMAGE002
) compound,
Figure DEST_PATH_IMAGE004A
（
Figure 36979DEST_PATH_IMAGE002
）；
In formula, R 1, R 2, R 3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Al;
Second step: 150 parts of Graphite Powder 99s are mixed with the first step dilution, and stir and form mixed solution 84 ~ 86 DEG C of conditions;
The 3rd step: 100 parts of acrylic ester adhesives are mixed with the mixed solution of second step, and disperse 2 ~ 10 hours through high speed agitator, form the gluing mixed solvent of heat conduction thereby mix;
The 4th step: 0.8 ~ 1 part of coupling agent adds sizing agent, stirs 0.5-1 hour;
The 5th step: the lower surface of the PET film of aluminium foil layer coated upper surface and have by the gluing mixed solvent of heat conduction that the 3rd step is obtained;
The 6th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 7th step: by another surface laminating separated type material of heat-conducting glue adhesion coating through overbaking in the 5th step;
The 8th step: rolling;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 10:18:9;
Described Graphite Powder 99 diameter is 4 ~ 4.2 microns.
2. the manufacturing process of pressure-sensitive adhesive tape according to claim 1, is characterized in that: the whipping temp of described second step is 85 DEG C.
CN201310749012.XA 2012-12-18 2012-12-18 The manufacturing process of acrylate sealing tape Active CN103865417B (en)

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CN201410357427.7A Active CN104152073B (en) 2012-12-18 2012-12-18 For the preparation method of electronic product pad pasting
CN201410356814.9A Active CN104152071B (en) 2012-12-18 2012-12-18 For the preparation method of high viscosity adhesive tape
CN201310749012.XA Active CN103865417B (en) 2012-12-18 2012-12-18 The manufacturing process of acrylate sealing tape
CN201210550169.5A Active CN103059758B (en) 2012-12-18 2012-12-18 Heat conducting adhesive tape for electronic device and preparation method thereof
CN201310751466.0A Active CN103911084B (en) 2012-12-18 2012-12-18 Acrylate adhesive tape
CN201310751336.7A Active CN103911083B (en) 2012-12-18 2012-12-18 Acrylate sealing tape

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CN201310751466.0A Active CN103911084B (en) 2012-12-18 2012-12-18 Acrylate adhesive tape
CN201310751336.7A Active CN103911083B (en) 2012-12-18 2012-12-18 Acrylate sealing tape

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CN106459685A (en) * 2015-12-29 2017-02-22 苏州斯迪克新材料科技股份有限公司 High thermal conductivity ultrathin adhesive tape based on synthetic graphite modification
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CN103059758A (en) 2013-04-24
CN103059758B (en) 2014-09-03
CN104152071B (en) 2016-04-27
CN103865417B (en) 2016-04-27
CN103911084B (en) 2016-03-02
CN103911083B (en) 2016-03-02
CN103911083A (en) 2014-07-09
CN104152071A (en) 2014-11-19
CN104152073A (en) 2014-11-19
CN103911084A (en) 2014-07-09
CN104152073B (en) 2016-01-13

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Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6

Patentee after: Jiangsu Stick new materials Polytron Technologies Inc

Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No.

Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd.

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Patentee before: Jiangsu Stick new materials Polytron Technologies Inc

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