CN104059556A - Film for electronic components - Google Patents
Film for electronic components Download PDFInfo
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- CN104059556A CN104059556A CN201410265282.8A CN201410265282A CN104059556A CN 104059556 A CN104059556 A CN 104059556A CN 201410265282 A CN201410265282 A CN 201410265282A CN 104059556 A CN104059556 A CN 104059556A
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- heat
- adhesive layer
- pet film
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- film
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a film for electronic components. The film comprises a PET (Polyethylene Terephthalate) thin film, wherein the lower surface of the PET thin film is coated with a heat conductive electric conductive adhesive layer and release paper is adhered to the other surface of the heat conductive electric conductive adhesive layer. The heat conductive electric conductive adhesive layer is prepared from the following components in parts by weight: 80-145 parts of graphite powder, 80-125 parts of organosilicone, 0.2-0.4 part of a crosslinking agent, 40-95 parts of a multifunctional acrylate monomer, 0.5-0.9 part of an initiator and 50-300 parts of a solvent. The solvent is prepared from the following components in percentage by weight: 10-20% of methylbenzene, 40-90% of ethyl acetate and 30-60% of butanone. The film disclosed by the invention considers existing film performance and further facilitates heat dispersion and transmission of electronic components so as to further avoid centralization of local heat of an adhesive tape, thus, the service life of the product is prolonged.
Description
Technical field
The present invention relates to a kind of pad pasting for electronic devices and components, belong to Filming Technology field.
Background technology
Because skill innovation is advanced by leaps and bounds, electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause like this volume dwindling, function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating adopting in the past, because volume is large, can produce the problems such as noise, by market, eliminated gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all finding new efficient heat sink material.Secondly, due to the diversity of electronic product, existing product often needs customization, thus the difficult popularization that is suitable for concrete use occasion and has limited its application; Therefore, if the feature coexisting for electron device heat and static, design a kind of can heat conduction, there is again the Pressuresensitive Tape of antistatic performance, become the direction that those of ordinary skills make great efforts.
Summary of the invention
The object of the invention is to provide a kind of pad pasting for electronic devices and components, should take into account existing pad pasting performance simultaneously for the pad pasting of electronic devices and components, more be conducive to spread heat and the transmission of electron device, thereby further avoided concentrating of adhesive tape amount of localized heat, the work-ing life of having improved product.
For achieving the above object, the first technical scheme that the present invention adopts is: a kind of pad pasting for electronic devices and components, comprise PET film, PET film lower surface is coated with heat-conductivity conducting adhesive layer, one interleaving paper is covered on another surface of heat-conductivity conducting adhesive layer, and described heat-conductivity conducting adhesive layer is comprised of following parts by weight of component:
Graphite Powder 99 80 ~ 145,
Organosilicon 80 ~ 125,
Linking agent 0.2 ~ 0.4,
Polyfunctional acrylic ester monomer 40 ~ 95,
Initiator 0.5 ~ 0.9,
Solvent 50 ~ 300;
Described organosilicon is the alkylsilanol that meets general formula (1),
（1）；
In formula, R represents that carbonatoms is 3 ~ 8 alkyl, and n is more than or equal to 1;
Described linking agent is selected from the compound of following general formula (2),
（2）；
In formula, R
1, R
2, R
3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Al;
The mixture that described initiator is comprised of Diisopropyl azodicarboxylate and benzoyl peroxide, in this initiator, Diisopropyl azodicarboxylate and benzoyl peroxide weight part ratio are 10:20;
The component of the following quality percentage composition of described solvent forms:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%;
The Thickness Ratio of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
In technique scheme, further improved plan is as follows:
1,, in such scheme, the thickness of described PET film is 0.004mm ~ 0.025mm.
2,, in such scheme, described PET film upper surface plating has an aluminium foil layer.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the present invention is directed to the feature that electron device heat and static coexist, both realized in length and thickness direction and greatly improved thermal conductivity simultaneously, make Pressuresensitive Tape there is antistatic performance, can keep for a long time the sticking strength with the contact strength of electron device, realized the stability of heat dispersion, thereby further improve the work-ing life of adhesive tape, improve the antistatic effect of PET film substrate, can make the substrate surface resistance after processing decline two more than the order of magnitude, and the product of the present invention formula is compared with under dry environment, still can keep good antistatic property.
2, the present invention is for the pad pasting of electronic devices and components, and it adopts the component of three kinds of certain content as solvent, has effectively avoided graphite granule agglomeration in the gluing system of subsequent technique acrylate, thereby is conducive to length and thickness direction heat conduction synchronously improves;
3, the present invention is for the pad pasting of electronic devices and components, it is specific according to its formula, adopting diameter is that the graphite of 3 ~ 6 microns and Thickness Ratio are the heat conduction pad pasting of 10:10 ~ 30:1 ~ 10 the PET film, heat-conducting glue adhesion coating and the aluminium foil layer that superpose successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thereby further avoided concentrating of adhesive tape amount of localized heat, the work-ing life of having improved product.
Accompanying drawing explanation
Accompanying drawing 1 is the film structure schematic diagram of the present invention for electronic devices and components;
The influence curve figure of the content that accompanying drawing 2 is toluene in mixed solvent of the present invention to thermal conductivity;
The influence curve figure of the content that accompanying drawing 3 is ethyl ester in mixed solvent of the present invention to thermal conductivity;
The graphic representation of the content that accompanying drawing 4 is butanone in mixed solvent of the present invention to thermal conductivity.
In above accompanying drawing: 1, PET film; 2, aluminium foil layer; 3, heat-conducting glue adhesion coating; 4, interleaving paper.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of pad pasting for electronic devices and components, comprise PET film, PET film lower surface is coated with heat-conductivity conducting adhesive layer, and an interleaving paper is covered on another surface of heat-conductivity conducting adhesive layer, and described heat-conductivity conducting adhesive layer is comprised of following parts by weight of component:
Graphite Powder 99 115,
Organosilicon 95,
Linking agent 0.3,
Polyfunctional acrylic ester monomer 70,
Initiator 0.7,
Solvent 50 ~ 300;
Described organosilicon is the alkylsilanol that meets general formula (1),
（1）；
In formula, R represents that carbonatoms is 3 ~ 8 alkyl, and n is more than or equal to 1;
Described linking agent is selected from the compound of following general formula (2),
（2）；
In formula, R
1, R
2, R
3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Al;
The mixture that described initiator is comprised of Diisopropyl azodicarboxylate and benzoyl peroxide, in this initiator, Diisopropyl azodicarboxylate and benzoyl peroxide weight part ratio are 10:20;
The component of the following quality percentage composition of described solvent forms:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%;
The Thickness Ratio of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
The thickness of above-mentioned PET film is 0.004mm ~ 0.025mm; Above-mentioned PET film upper surface plating has an aluminium foil layer.
An above-mentioned pad pasting for electronic devices and components, comprises the following steps:
The first step: the lower surface at upper surface with the PET film of aluminium foil layer applies one deck heat-conductivity conducting adhesive layer;
Second step: adopt ultraviolet ray to irradiate described antistatic hard coating, described organosilicon is reacted under the effect of initiator with described polyfunctional acrylic ester monomer.
The Thickness Ratio of above-mentioned PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is 100:150:50; Described Graphite Powder 99 diameter is 3 ~ 6 microns.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. the pad pasting for electronic devices and components, it is characterized in that: comprise PET film, PET film lower surface is coated with heat-conductivity conducting adhesive layer, and an interleaving paper is covered on another surface of heat-conductivity conducting adhesive layer, and described heat-conductivity conducting adhesive layer is comprised of following parts by weight of component:
Graphite Powder 99 80 ~ 145,
Organosilicon 80 ~ 125,
Linking agent 0.2 ~ 0.4,
Polyfunctional acrylic ester monomer 40 ~ 95,
Initiator 0.5 ~ 0.9,
Solvent 50 ~ 300;
Described organosilicon is the alkylsilanol that meets general formula (1),
（1）；
In formula, R represents that carbonatoms is 3 ~ 8 alkyl, and n is more than or equal to 1;
Described linking agent is selected from the compound of following general formula (2),
（2）；
In formula, R
1, R
2, R
3represent that independently of one another carbonatoms is to remove a residue after hydrogen atom in the carbochain of 3 ~ 8 ketone, M represents Al;
The mixture that described initiator is comprised of Diisopropyl azodicarboxylate and benzoyl peroxide, in this initiator, Diisopropyl azodicarboxylate and benzoyl peroxide weight part ratio are 10:20;
The component of the following quality percentage composition of described solvent forms:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%;
The Thickness Ratio of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
2. the pad pasting for electronic devices and components according to claim 1, is characterized in that: the thickness of described PET film is 0.004mm ~ 0.025mm.
3. the pad pasting for electronic devices and components according to claim 1, is characterized in that: described PET film upper surface plating has an aluminium foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265282.8A CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265282.8A CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
| CN201210550167.6A CN103059757B (en) | 2012-12-18 | 2012-12-18 | Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550167.6A Division CN103059757B (en) | 2012-12-18 | 2012-12-18 | Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104059556A true CN104059556A (en) | 2014-09-24 |
| CN104059556B CN104059556B (en) | 2016-08-24 |
Family
ID=51547495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410265282.8A Active CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104059556B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281995A (en) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | Thermally conductive adhesive film and semiconductor device |
| CN1693400A (en) * | 2005-05-26 | 2005-11-09 | 厦门丰友胶粘制品有限公司 | Laminated adhesive aluminium foil band and it mfg. process |
| CN101693817A (en) * | 2009-09-30 | 2010-04-14 | 东莞市富邦科技应用材料有限公司 | Superconductivity copper foil tape |
| CN202374617U (en) * | 2011-11-02 | 2012-08-08 | 杜明亮 | Ultrathin heat radiation film having electromagnetic shielding function |
| JP2012201735A (en) * | 2011-03-24 | 2012-10-22 | Dic Corp | Double-sided pressure-sensitive adhesive tape |
| CN102757741A (en) * | 2012-07-09 | 2012-10-31 | 苏州斯迪克新材料科技股份有限公司 | Frosted release material |
| CN102782068A (en) * | 2010-03-26 | 2012-11-14 | 栗村化学株式会社 | Heat-dissipating tape and method for manufacturing same |
-
2012
- 2012-12-18 CN CN201410265282.8A patent/CN104059556B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281995A (en) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | Thermally conductive adhesive film and semiconductor device |
| CN1693400A (en) * | 2005-05-26 | 2005-11-09 | 厦门丰友胶粘制品有限公司 | Laminated adhesive aluminium foil band and it mfg. process |
| CN101693817A (en) * | 2009-09-30 | 2010-04-14 | 东莞市富邦科技应用材料有限公司 | Superconductivity copper foil tape |
| CN102782068A (en) * | 2010-03-26 | 2012-11-14 | 栗村化学株式会社 | Heat-dissipating tape and method for manufacturing same |
| JP2012201735A (en) * | 2011-03-24 | 2012-10-22 | Dic Corp | Double-sided pressure-sensitive adhesive tape |
| CN202374617U (en) * | 2011-11-02 | 2012-08-08 | 杜明亮 | Ultrathin heat radiation film having electromagnetic shielding function |
| CN102757741A (en) * | 2012-07-09 | 2012-10-31 | 苏州斯迪克新材料科技股份有限公司 | Frosted release material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104059556B (en) | 2016-08-24 |
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang Economic Development Zone, Jiangsu, Qingdao West Road, No. 11, No. Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170707 Address after: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee after: Taicang Stick new Mstar Technology Ltd Address before: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee before: Jiangsu Stick new materials Polytron Technologies Inc |
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| TR01 | Transfer of patent right |