CN104059556B - Adhesive tape for electronic devices and components - Google Patents
Adhesive tape for electronic devices and components Download PDFInfo
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- CN104059556B CN104059556B CN201410265282.8A CN201410265282A CN104059556B CN 104059556 B CN104059556 B CN 104059556B CN 201410265282 A CN201410265282 A CN 201410265282A CN 104059556 B CN104059556 B CN 104059556B
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- heat
- adhesive layer
- adhesive tape
- pet film
- conductivity conducting
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Abstract
The present invention discloses a kind of adhesive tape for electronic devices and components, including PET film, PET film lower surface is coated with heat-conductivity conducting adhesive layer, one release paper is covered on another surface of heat-conductivity conducting adhesive layer, and described heat-conductivity conducting adhesive layer is made up of following parts by weight of component: graphite powder 50 ~ 115, organosilicon 95 ~ 125, cross-linking agent 0.3 ~ 0.4, polyfunctional acrylate monomer 70 ~ 100, initiator 0.7 ~ 0.9, solvent 50 ~ 300；The component composition of the following weight/mass percentage composition of described solvent: toluene 10 ~ 20%, ethyl acetate 40 ~ 90%, butanone 30 ~ 60%.Adhesive tape of the present invention is taking into account existing tape performance simultaneously, is more beneficial for heat dispersion and the transmission of electronic device, thus further avoid the concentration of adhesive tape amount of localized heat, improves the service life of product.
Description
Technical field
The present invention relates to a kind of adhesive tape for electronic devices and components, belong to tape technology field.
Background technology
Owing to skill innovation is advanced by leaps and bounds, electronic product carries increasingly lighting, and volume is more and more less, and function is more and more stronger
Greatly, so cause integrated level more and more higher.So causing volume reducing, function becomes powerful, directly results in electronic devices and components
Cooling requirements is more and more higher.The fan type radiating used before and, owing to volume is big, can produce the problems such as noise, gradually by city
Field is eliminated.And then create other heat sink material, such as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and price is held high
Expensive, radiating effect the most do not imagine in good, slowly, all finding new efficient heat sink material.Secondly as electronics produces
The multiformity of product, existing product generally requires customization, thus difficulty is suitable for concrete use occasion and limits pushing away of its application
Extensively；Therefore, if the feature coexisted for electronic device heat and electrostatic, design one can heat conduction, there is again static electricity resistance
The pressure sensitive adhesive tape of energy, becomes the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
It is an object of the present invention to provide a kind of adhesive tape for electronic devices and components, this adhesive tape being used for electronic devices and components is being taken into account
Existing tape performance simultaneously, is more beneficial for heat dispersion and the transmission of electronic device, thus further avoid adhesive tape localized heat
The concentration of amount, improves the service life of product.
For reaching above-mentioned purpose, the first technical scheme that the present invention uses is: a kind of adhesive tape for electronic devices and components,
Including PET film, this PET thin film upper surface is plated with an aluminium foil layer, and PET film lower surface is coated with heat-conductivity conducting adhesive layer,
One release paper is covered on another surface of heat-conductivity conducting adhesive layer, and described heat-conductivity conducting adhesive layer is made up of following parts by weight of component:
Graphite powder 50 ~ 115,
Organosilicon 95 ~ 125,
Cross-linking agent 0.3 ~ 0.4,
Polyfunctional acrylate monomer 70 ~ 100,
Initiator 0.7 ~ 0.9,
Solvent 50 ~ 300；
Described organosilicon is the alkylsilanol meeting formula (1),
(1)；
In formula, R represents the alkyl that carbon number is 3 ~ 8, and n is more than or equal to 1；
Described cross-linking agent is selected from the compound of below general formula (2),
(2)；
In formula, R1、R2、R3Represent independently of one another after removing a hydrogen atom in the carbochain of the ketone that carbon number is 3 ~ 8
Residue, M represents Al；
The mixture that described initiator is made up of azodiisobutyronitrile and benzoyl peroxide, in this initiator, azo two is different
Butyronitrile and benzoyl peroxide weight part ratio are 10:20；
The component composition of the following weight/mass percentage composition of described solvent:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%；
The thickness of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is than for 100:100 ~ 300:10 ~ 100；
A diameter of 3 ~ 6 microns of described graphite powder.
In technique scheme, further improved plan is as follows:
1, in such scheme, the thickness of described PET film is 0.004mm ~ 0.025mm.
2, in such scheme, described PET film upper surface is plated with an aluminium foil layer.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1, the present invention is directed to electronic device heat and feature that electrostatic coexists, both achieved at length and thickness direction significantly
Improve heat conductivity simultaneously, have so that pressure sensitive adhesive tape is provided with antistatic performance, can keep for a long time and the contacting of electronic device
The sticking strength of intensity, it is achieved that the stability of heat dispersion, thus improve further the service life of adhesive tape, improve PET thin
The antistatic effect of film base material, can make the substrate surface resistance after process decline more than two orders of magnitude, and inventive formulation
Product, under relatively dry environment, remains to keep good antistatic property.
2, the present invention is for the adhesive tape of electronic devices and components, and it uses the component of three kinds of certain content as solvent, effectively keeps away
Exempt from graphite granule agglomeration in the gluing system of subsequent technique acrylate, thus beneficially length and thickness direction heat conduction
Synchronize to improve；
3, the present invention is for the adhesive tape of electronic devices and components, and it is specific according to its formula, uses the graphite of a diameter of 3 ~ 6 microns
With thickness than the heat conduction adhesive tape of the PET film being sequentially overlapped for 10:10 ~ 30:1 ~ 10, heat-conducting glue adhesion coating and aluminium foil layer, taking into account
Existing tape performance simultaneously, is more beneficial for heat dispersion and the transmission of electronic device, thus further avoid adhesive tape localized heat
The concentration of amount, improves the service life of product.
Accompanying drawing explanation
Accompanying drawing 1 is used for the adhesive tape structure schematic diagram of electronic devices and components for the present invention；
Accompanying drawing 2 is the content of the toluene influence curve figure to heat conductivity in mixed solvent of the present invention；
Accompanying drawing 3 is the content of the ethyl ester influence curve figure to heat conductivity in mixed solvent of the present invention；
Accompanying drawing 4 is the content of the butanone curve chart to heat conductivity in mixed solvent of the present invention.
In the figures above: 1, PET film；2, aluminium foil layer；3, heat-conducting glue adhesion coating；4, release paper.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of adhesive tape for electronic devices and components, including PET film, this PET thin film upper surface is plated with one
Aluminium foil layer, PET film lower surface is coated with heat-conductivity conducting adhesive layer, and a release paper is covered on another table of heat-conductivity conducting adhesive layer
Face, described heat-conductivity conducting adhesive layer is made up of following parts by weight of component:
Graphite powder 115,
Organosilicon 95,
Cross-linking agent 0.3,
Polyfunctional acrylate monomer 70,
Initiator 0.7,
Solvent 50 ~ 300；
Described organosilicon is the alkylsilanol meeting formula (1),
(1)；
In formula, R represents the alkyl that carbon number is 3 ~ 8, and n is more than or equal to 1；
Described cross-linking agent is selected from the compound of below general formula (2),
(2)；
In formula, R1、R2、R3Represent independently of one another after removing a hydrogen atom in the carbochain of the ketone that carbon number is 3 ~ 8
Residue, M represents Al；
The mixture that described initiator is made up of azodiisobutyronitrile and benzoyl peroxide, in this initiator, azo two is different
Butyronitrile and benzoyl peroxide weight part ratio are 10:20；
The component composition of the following weight/mass percentage composition of described solvent:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%；
The thickness of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is than for 100:100 ~ 300:10 ~ 100；
A diameter of 3 ~ 6 microns of described graphite powder.
The thickness of above-mentioned PET film is 0.004mm ~ 0.025mm；Above-mentioned PET film upper surface is plated with an aluminium foil layer.
A kind of above-mentioned adhesive tape for electronic devices and components, comprises the following steps:
The first step: there is lower surface one layer of heat-conductivity conducting adhesive layer of coating of the PET film of aluminium foil layer at upper surface；
Second step: use ultraviolet that described antistatic hard coat is irradiated, make described organosilicon and described many officials
Can react under the effect of initiator by acrylate monomer.
The thickness of above-mentioned PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is than for 100:150:50；Described graphite powder diameter
It it is 3 ~ 6 microns.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention
The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.
Claims (2)
1. the adhesive tape for electronic devices and components, it is characterised in that: including PET film, this PET thin film upper surface is plated with
One aluminium foil layer, PET film lower surface is coated with heat-conductivity conducting adhesive layer, and a release paper is covered on another table of heat-conductivity conducting adhesive layer
Face, described heat-conductivity conducting adhesive layer is made up of following parts by weight of component:
Graphite powder 50 ~ 115,
Organosilicon 95 ~ 125,
Cross-linking agent 0.3 ~ 0.4,
Polyfunctional acrylate monomer 70 ~ 100,
Initiator 0.7 ~ 0.9,
Solvent 50 ~ 300；
Described organosilicon is the alkylsilanol meeting formula (1),
(1)；
In formula, R represents the alkyl that carbon number is 3 ~ 8, and n is more than or equal to 1；
Described cross-linking agent is selected from the compound of below general formula (2),
(2)；
In formula, R1、R2、R3Represent remove after a hydrogen atom in the carbochain of the ketone that carbon number is 3 ~ 8 residual independently of one another
Base, M represents Al；
The mixture that described initiator is made up of azodiisobutyronitrile and benzoyl peroxide, azodiisobutyronitrile in this initiator
It is 10:20 with benzoyl peroxide weight part ratio；
Described solvent is made up of the component of following weight/mass percentage composition:
Toluene 10 ~ 20%,
Ethyl acetate 40 ~ 90%,
Butanone 30 ~ 60%；
In described solvent, each component sum is 100%；
The thickness of described PET film, heat-conductivity conducting adhesive layer and aluminium foil layer is than for 100:100 ~ 300:10 ~ 100；
A diameter of 3 ~ 6 microns of described graphite powder.
Adhesive tape for electronic devices and components the most according to claim 1, it is characterised in that: the thickness of described PET film is
0.004mm~0.025mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410265282.8A CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550167.6A CN103059757B (en) | 2012-12-18 | 2012-12-18 | Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof |
| CN201410265282.8A CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210550167.6A Division CN103059757B (en) | 2012-12-18 | 2012-12-18 | Pressure-sensitive adhesive tape for heat dissipation and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104059556A CN104059556A (en) | 2014-09-24 |
| CN104059556B true CN104059556B (en) | 2016-08-24 |
Family
ID=51547495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410265282.8A Active CN104059556B (en) | 2012-12-18 | 2012-12-18 | Adhesive tape for electronic devices and components |
Country Status (1)
| Country | Link |
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| CN (1) | CN104059556B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281995A (en) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | Thermally conductive adhesive film and semiconductor device |
| CN1312242C (en) * | 2005-05-26 | 2007-04-25 | 厦门丰友胶粘制品有限公司 | Laminated adhesive aluminium foil band and it mfg. process |
| CN101693817A (en) * | 2009-09-30 | 2010-04-14 | 东莞市富邦科技应用材料有限公司 | Superconductivity copper foil tape |
| KR101151599B1 (en) * | 2010-03-26 | 2012-05-31 | 율촌화학 주식회사 | Heat radiation tape and manufacturing method thereof |
| JP5760572B2 (en) * | 2011-03-24 | 2015-08-12 | Dic株式会社 | Double-sided adhesive tape |
| CN202374617U (en) * | 2011-11-02 | 2012-08-08 | 杜明亮 | Ultrathin heat radiation film having electromagnetic shielding function |
| CN102757741B (en) * | 2012-07-09 | 2014-03-26 | 苏州斯迪克新材料科技股份有限公司 | Frosted release material |
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2012
- 2012-12-18 CN CN201410265282.8A patent/CN104059556B/en active Active
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| CN104059556A (en) | 2014-09-24 |
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Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang Economic Development Zone, Jiangsu, Qingdao West Road, No. 11, No. Patentee before: Suzhou Sidike New Material Science & Technology Co., Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20170707 Address after: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee after: Taicang Stick new Mstar Technology Ltd Address before: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee before: Jiangsu Stick new materials Polytron Technologies Inc |