CN102384697B - Heat radiation tape and manufacturing method thereof - Google Patents
Heat radiation tape and manufacturing method thereof Download PDFInfo
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- CN102384697B CN102384697B CN201110188323.4A CN201110188323A CN102384697B CN 102384697 B CN102384697 B CN 102384697B CN 201110188323 A CN201110188323 A CN 201110188323A CN 102384697 B CN102384697 B CN 102384697B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a heat radiation tape for heat radiation of various electronic products and a manufacture method, characterized in that the heat radiation tape comprises a metal base material, a graphite ink layer, a binding layer and a releasing layer, the graphite ink layer is formed on one side of the metal base material, the binding layer is formed on the other side of the metal base material, and the releasing layer is formed in order to contact the binding layer from the other side of the binding layer. The heat radiation tape enables heat conduction and dispersion to perform simultaneously in horizontal and vertical directions, thereby being provided with not only excellent heat conducting rate but also effectively performing heat radiation.
Description
Technical field
The present invention relates to a kind of heat-radiation belt and manufacture method thereof, at length relate to heat-radiation belt and the manufacture method thereof of a kind of parts for radiating electronic product or device, the parts of automobile or the heating position of device.
Background technology
In recent years, the up-to-date electrical equipment such as TV, sound equipment, computer, medicine equipment, office apparatus, communication equipment, electronics is used or automobile is used parts or device, its complexity increases gradually.Complicated along with electronic unit etc., due to the demand of miniaturization, high performance, dwindles area gradually, and the electronic unit number of assembling increases gradually, and the shape of parts itself also presents the trend of miniaturization.Therefore, in order to prevent that the heat that each electronic unit produces from causing product bug or bad, how effectively to eliminate heat, its necessity strengthens gradually.
Its base material of heat-radiation belt in the past adopts the materials such as plastics, paper, nonwoven, and the pyroconductivity of these materials is low, has the shortcoming that reduces heat-radiation belt radiating effect.
And heat-radiation belt in the past uses graphite component conventionally, it has good heat conductivity, but graphite component itself is thin sheet form, while assembling, has the problem of frangible or easy damage in order to form cooling mechanism; According to radiating principle, heat conduction forms to horizontal direction, the problem that exists radiating efficiency to reduce.
Especially, the electronic product often using in recent years, its caloric value is very high, in the time cannot effectively processing fever phenomenon, will cause product shortening in service life or product to occur bad.Therefore, need a kind of heat dissipating method with good radiating effect.
Summary of the invention
The object of the invention is to, a kind of radiating effect is good and adherence force is good heat-radiation belt and manufacture method thereof are provided.
According to one embodiment of present invention, provide a kind of heat-radiation belt, it is characterized in that, comprise: metal base, Graphite ink (graphite ink) layer, adhered layer and release layer; Above-mentioned Graphite ink layer is formed at the one side of metal base, and above-mentioned adhered layer is formed at the another side of metal base, and above-mentioned release layer is formed on the another side of adhered layer, to contact with adhered layer.
According to another embodiment of the present invention, provide a kind of manufacture method of heat-radiation belt, the method comprises the steps: to form in the one side of metal base the step of Graphite ink layer; Form the step of the adhered layer being formed by heat conductivity alite paste at the another side of above-mentioned metal base; And for directly being contacted with above-mentioned adhered layer, release layer carries out the step of lamination.
According to heat-radiation belt of the present invention, its heat conduction and dispersion are carried out to horizontal and vertical direction simultaneously, not only have outstanding pyroconductivity, can also effectively dispel the heat simultaneously, and its adherence force is also very outstanding.
Therefore, the heat-radiation belt the present invention relates to is highly suitable for various electronic products, for example: the heating positions such as ultra-thin notebook or the CPU of PC, the heating position of Plasmia indicating panel (PDP), liquid crystal display (LCD), light emitting diode (LED) or Organic Light Emitting Diode (OLED) etc., PCB or semi-conductor memory module etc. that heater element is connected in parallel.
Brief description of the drawings
Fig. 1 is the concise and to the point figure that represents heat-radiation belt structure according to an embodiment of the invention.
Fig. 2 is the concise and to the point figure that represents heat-radiation belt structure according to an embodiment of the invention.
The explanation of Reference numeral
10: metal base 20: Graphite ink layer
30: adhered layer 40: release layer
50: primer layer
Detailed description of the invention
Below, exemplary embodiments of the present invention is described.
According to one embodiment of present invention, provide a kind of heat-radiation belt, it is characterized in that, comprise: metal base 10, Graphite ink layer 20, adhered layer 30 and release layer 40; Above-mentioned Graphite ink layer 20 is formed at the one side of metal base 10, and above-mentioned adhered layer 30 is formed at the another side of metal base 10, and above-mentioned release layer 40 is formed on the another side of adhered layer 30, to contact with adhered layer 30.
Above-mentioned release layer has the effect of the adhibit quality of protection adhered layer; dismounting freely; can use plastic sheeting, polyester film, scribble the soft materials such as paper, cloth of release coil serving; material is all unrestricted freely as long as can dismounting, rationally uses according to producer or the producer's selection.
According to one embodiment of present invention, also comprise primer layer 50, it is formed between above-mentioned metal base 10 and Graphite ink layer 20, to contact with Graphite ink layer 20 with metal base 10.
Above-mentioned primer has the effect that improves adherence force between metal base and Graphite ink layer.Therefore, the heat-radiation belt in the present invention of use primer, compares the heat-radiation belt in the present invention who does not use primer, and its interlayer adherence force increases by 3～7 times.
According to one embodiment of present invention, above-mentioned primer can select in the group of free polyurethane series, acrylic acid series and epoxy system composition, still, is not limited to this.
According to one embodiment of present invention, above-mentioned metal can use one or more the alloy in the group who selects free aluminium, gold, silver, copper, nickel, iron, tin, zinc and tungsten composition, preferably uses aluminium.
The base material reducing about existing pyroconductivity, for example: in the situation that existing plastics, paper, nonwoven etc. are used as base material, scatter and scatter to the surrounding of pyrotoxin to horizontal direction by the heat that pyrotoxin is passed on, and then the temperature of reduction heating position, and according to the present invention, use in the situation of metal base, the heat of being passed on by pyrotoxin is scattered to level and vertical direction simultaneously.Heat conduction efficiency under this vertical thermal conduction principle is high more than horizontal conductive efficiency, and radiating effect is also very outstanding.
According to one embodiment of present invention, the thickness of above-mentioned metal base, according to the product using, choose reasonable is used, and there is no thickness limits.Preferred thickness is 15～120 μ m, and the thickness being more preferably is 60～100 μ m.When less than 15 μ m, horizontal thermal conduction effect is very micro-; While exceeding 120 μ m, there is operating efficiency and cost burden problem.
According to one embodiment of present invention, above-mentioned Graphite ink layer is made up of the composition for ink that comprises graphite.
In this case, because it is ink, can adopt and be coated on metal process, and then guarantee thin thickness.Meanwhile, can overcome the graphite radiating member of existing thin sheet form frangible or the shortcoming of easy damage and the phenomenon of being easily infected with.
Above-mentioned Graphite ink composition, while pressure in black hydration process, the platy structure fragmentation of graphite also forms erose structure.Compare in existing graphite thin plate, only horizontal direction has the phenomenon of good heat conductivity, and in the present invention, along with the platy structure fragmentation of graphite, horizontal and vertical direction possesses outstanding heat conductivity simultaneously.Therefore,, the in the situation that of carrying out the coating of Graphite ink composition on metal base, the heat of conducting by metal base, to horizontal direction and vertical direction conduction, shows outstanding radiating effect in graphite linings.
According to one embodiment of present invention, the thickness of above-mentioned Graphite ink layer can rationally be adjusted according to the product using, and preferred thickness is 10～90 μ m.More preferred thickness is 20～60 μ m.In the situation of less than 10 μ m, in the time being subject to external impact formation cut, the decline of part radiating effect will be caused; Exceed in the situation of 90 μ m the non-efficiency that the increase that there will be manufacturing expense is brought.
According to one embodiment of present invention, above-mentioned Graphite ink layer surface can be formed as coarse state.The surface of Graphite ink layer is the another side of the face that contacts with metal base.Coarse surface has the effect that increases surface area, and its emissivity is high, can be by more thermal transpiration to air.And then can further improve radiating effect.
According to one embodiment of present invention, above-mentioned adhered layer is made up of heat conductivity alite paste.Above-mentioned heat conductivity alite paste comprises adhibit quality resin and metallic filler (filler) or heat conductivity filler.
According to one embodiment of present invention, above-mentioned adhibit quality resin, as long as possessing the resin of adhibit quality, all unrestrictedly uses.For example, can use acrylic acid series alite paste, polyurethane series alite paste or silicone-based alite paste, preferably use acrylic acid series alite paste.According to one embodiment of present invention, heat conductivity alite paste of the present invention, in order to increase the dispersion effect of heat radiation coating, can use dispersant.
And heat conductivity alite paste of the present invention, in order to regulate stickup characteristic, also comprises any crosslinking agent.
And, heat conductivity alite paste of the present invention, do not affecting under the prerequisite of effect of the present invention, comprising the additives such as light trigger, pigment, antioxidant, brightening agent, ultra-violet stabilizer, defoamer, thickener, plasticizer, fire retardant, coupling agent, blowing agent or the small hollow ball of macromolecule.Above-mentioned additive is as long as the normally used material of relevant industries, unrestricted.
According to one embodiment of present invention, the preferred thickness of above-mentioned adhered layer is 5～60 μ m, and the thickness being more preferably is 10～40 μ m.In the situation of less than 5 μ m, due to the quantity not sufficient of alite paste, cause adherence force to decline; Exceed in the situation of 60 μ m, because alite paste is compared metal base or Graphite ink, its heat conductivity is relatively low, and the thickness of adhered layer increases, and radiating effect just reduces.
According to one embodiment of present invention, the heat-radiation belt the present invention relates to can be applicable to the heating positions such as the CUP of ultra-thin notebook or PC, the heating position of Plasmia indicating panel (PDP), liquid crystal display (LCD), light emitting diode (LED) or Organic Light Emitting Diode (OLED) etc., parts or the automobile component etc. of the electronic product of PCB or semi-conductor memory module etc. that heater element is connected in parallel.The heat-radiation belt the present invention relates to, according to using product, uses with fair-sized cutting.
According to one embodiment of present invention, provide a kind of manufacture method of heat-radiation belt, comprise the steps: to form in the one side of metal base 10 step of Graphite ink layer 20; Form the step of the adhered layer 30 being formed by heat conductivity alite paste at the another side of above-mentioned metal base 10; And for directly being contacted with above-mentioned adhered layer 30, release layer 40 carries out the step of lamination.
According to one embodiment of present invention, provide a kind of manufacture method of heat-radiation belt, comprise the steps: to form in the one side of metal base 10 step of primer layer 50; Form the step of Graphite ink layer 20 at the another side of above-mentioned primer layer 50; Form the step of the adhered layer 30 being formed by heat conductivity alite paste at the another side of above-mentioned metal base 10; And for directly being contacted with above-mentioned adhered layer 30, release layer 40 carries out the step of lamination.
In the manufacture method of above-mentioned heat-radiation belt, above-mentioned primer layer 50, the formation of graphite linings 20 and adhered layer 30, can use and select free gravure printing coating (gravure coating), micro-gravure coating (Micro gravure coating), gravure kiss coating (Kiss gravure coating), comma cutter coating (Comma Knife coating), roll coating (Roll coating), spraying (Spray coating), line bar type coating (Meyer Bar coating), channel mould coating (Slot Die coating), oppositely coating (Reverser coating), a kind of mode in the group that flexo and offset printing mode form, preferably use gravure printing application pattern.
In the manufacture method of above-mentioned heat-radiation belt, above-mentioned lamination mode, unrestricted, for example, can use wet method lamination (wet lamination) or solvent-free dry overlay film (non-solvent dry lamination) mode.
Heat-radiation belt of the present invention completes after above-mentioned series of processes, according to using or utilize coil winding machine roll to roll keeping after suitable big or small cutting.Complete according to common mode.
Carry out detailed description of the present invention referring to embodiments of the invention.The present embodiment is only for improving disclosure of the present invention, and the present invention is not limited to the embodiment of the following stated, and these are apparent for general technical staff of the technical field of the invention.
The mensuration of [experiment 1] heat radiation level
The rod (bar) forming at the aluminum chassis that is pasted with thermal source is upper, pastes the heat-radiation belt of removing release layer, the hydraulic test of dispelling the heat.
In the one side of the aluminium base of 80 μ m thickness, utilize gravure printing coating machine, Graphite ink (D-graft polymers, Dajin kemis company) is carried out to gravure printing coating according to 25 μ m thickness, on other faces of aluminium base, carry out gravure printing coating according to 20 μ m thickness.Adhered layer uses acrylic resin 50 % by weight to mix with heat conductivity filler 50 % by weight and manufactures the heat conductivity alite paste that forms and apply.The heat-radiation belt of manufacturing by above-mentioned operation is labelled to rod (bar), measures the temperature (embodiment 1) of rod (bar) after 1 hour.
In the one side of the aluminium base of 80 μ m thickness, utilize gravure printing coating machine, primer is carried out to gravure printing coating according to 1 μ m thickness, on primer layer, carry out Graphite ink (D-graft polymers according to 25 μ m thickness, Dajin kemis company) gravure printing coating, and on other faces of aluminium base, carry out gravure printing coating according to 20 μ m thickness.Adhered layer uses acrylic resin 50 % by weight to mix with heat conductivity filler 50 % by weight and manufactures the heat conductivity alite paste that forms and apply.The heat-radiation belt of manufacturing by above-mentioned operation is labelled to rod (bar), measures excellent temperature (embodiment 2) after 1 hour.
Heat-radiation belt in the past (E-Graft company of SPREADERSHIELD U.S. product) is labelled to rod, after 1 hour, measures excellent temperature (comparative example 1).In addition, only Graphite ink is applied to rod, after 1 hour, measures excellent temperature (comparative example 2).Following table 1 is the result of above-described embodiment 1,2 and comparative example 1,2.
Table 1
The heat-radiation belt of embodiment 1 is than comparative example 1, and it shows the radiating effect of 5～6 DEG C of coolings.Comparative example 2, than comparative example 1, shows the effect of 10～11 DEG C of coolings, but coating easily comes off in this case, or adherence force is bad, and radiating effect cannot continue.
Compare heat-radiation belt in the past, even if only have the difference of 1 DEG C, for the product that uses heat-radiation belt, to having an immense impact on its service life, therefore, the Discrepancy Description performance of 5～6 DEG C is significantly improved.
Above specific part of the present invention is had been described in detail, but it should be pointed out that for general technical staff of the technical field of the invention, above-mentioned explanation is only the preferred embodiments of the present invention, and scope of the present invention is not limited to described embodiment.Therefore, essential scope of the present invention determines according to appended claim and equivalent thereof.
Claims (11)
1. a heat-radiation belt, is characterized in that, comprising:
Metal base, Graphite ink layer, adhered layer, and release layer;
Described Graphite ink layer is formed at the one side of metal base;
Described adhered layer is formed at the another side of metal base;
Described release layer is formed on the another side of adhered layer, to contact with adhered layer;
Wherein, described Graphite ink layer is made up of the composition for ink that comprises graphite, in ink group
In compound, the platy structure of graphite is broken and forms erose structure.
2. heat-radiation belt according to claim 1, is characterized in that, also comprises primer layer, and it is formed between described metal base and Graphite ink layer, to contact with Graphite ink layer with metal base.
3. heat-radiation belt according to claim 1, is characterized in that, described metal is one or more the alloy selecting in the group of free aluminium, gold, silver, copper, nickel, iron, tin, zinc and tungsten composition.
4. heat-radiation belt according to claim 1, is characterized in that, the thickness of described metal base is 15～120 μ m.
5. heat-radiation belt according to claim 1, is characterized in that, the thickness of described Graphite ink layer is 10～90 μ m.
6. heat-radiation belt according to claim 1, is characterized in that, the surface of described Graphite ink layer is formed as coarse.
7. heat-radiation belt according to claim 1, is characterized in that, described adhered layer is formed by heat conductivity alite paste.
8. heat-radiation belt according to claim 1, is characterized in that, the thickness of described adhered layer is 5～60 μ m.
9. a manufacture method for heat-radiation belt, is characterized in that, comprises the steps:
Form the step of Graphite ink layer in the one side of metal base;
Form the step of the adhered layer being formed by heat conductivity alite paste at the another side of described metal base; And
For directly being contacted with described adhered layer, release layer carries out the step of lamination;
Wherein, described Graphite ink layer is made up of the composition for ink that comprises graphite, in ink group
In compound, the platy structure of graphite is broken and forms erose structure.
10. a manufacture method for heat-radiation belt, is characterized in that, comprises the steps:
Form the step of primer layer in the one side of metal base;
Form the step of Graphite ink layer at the another side of described primer layer;
Form the step of the adhered layer being formed by heat conductivity alite paste at the another side of described metal base; And
For directly being contacted with described adhered layer, release layer carries out the step of lamination;
Wherein, described Graphite ink layer is made up of the composition for ink that comprises graphite, in ink group
In compound, the platy structure of graphite is broken and forms erose structure.
The manufacture method of 11. heat-radiation belts according to claim 10, it is characterized in that, the formation of described primer layer, Graphite ink layer and adhered layer, select by use that free gravure printing coating, micro-gravure coating, the coating of gravure kiss, the coating of comma cutter, roll coating, spraying, the coating of line bar type, channel mould coating, reverse coating, flexo and offset printing mode form group in a kind of mode carry out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0064409 | 2010-07-05 | ||
| KR1020100064409A KR101189990B1 (en) | 2010-07-05 | 2010-07-05 | Heat radiation tape and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN102384697A CN102384697A (en) | 2012-03-21 |
| CN102384697B true CN102384697B (en) | 2014-06-25 |
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| CN201110188323.4A Active CN102384697B (en) | 2010-07-05 | 2011-07-04 | Heat radiation tape and manufacturing method thereof |
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| Country | Link |
|---|---|
| KR (1) | KR101189990B1 (en) |
| CN (1) | CN102384697B (en) |
| TW (1) | TWI476572B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102022511B1 (en) * | 2012-08-28 | 2019-09-18 | 엘지디스플레이 주식회사 | liquid crystal display module |
| CN103025127A (en) * | 2012-12-05 | 2013-04-03 | 吴江朗恩电子科技有限公司 | Radiating film |
| CN104152071B (en) * | 2012-12-18 | 2016-04-27 | 苏州斯迪克新材料科技股份有限公司 | For the preparation method of high viscosity adhesive tape |
| CN103756584B (en) * | 2012-12-18 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | The preparation method of heat radiation type acrylate adhesive tape |
| KR101707042B1 (en) * | 2013-06-19 | 2017-02-17 | 일진머티리얼즈 주식회사 | Conducting heart dissipating sheet, electric component and electronics device comprising the sheet |
| CN104302148A (en) * | 2013-07-18 | 2015-01-21 | 苏州沛德导热材料有限公司 | Heat conduction and radiation device |
| KR101706756B1 (en) * | 2015-04-21 | 2017-02-15 | 한국교통대학교산학협력단 | Heat-spreading adhesive tape and method of the same |
| KR20160139203A (en) | 2015-05-27 | 2016-12-07 | 이영옥 | Adhesive agent for heat radiation tape and heat radiation tape manufactured by the same |
| CN104918468B (en) * | 2015-06-29 | 2018-06-19 | 华为技术有限公司 | Thermally conductive sheet and electronic equipment |
| KR101870644B1 (en) * | 2016-03-22 | 2018-06-25 | 주식회사 솔루에타 | Heat releasing sheet having an excellent heat releasing property and manufacturing method there of |
| CN106189913B (en) * | 2016-08-24 | 2018-11-23 | 湖南省普瑞达内装材料有限公司 | Heat-conducting glue band and heat-conducting double-sided adhesive tape |
| KR101766869B1 (en) * | 2017-05-02 | 2017-08-10 | 주식회사 세명산업 | A flame retardant tape for ship |
| KR102253189B1 (en) * | 2020-06-08 | 2021-05-18 | 주식회사 누리온 | Heat radiant bonding agent for heat sink body of light apparatus and manufacturing method thereof |
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| TWI224384B (en) | 2002-01-22 | 2004-11-21 | Shinetsu Chemical Co | Heat-dissipating member, manufacturing method and installation method |
| KR100554097B1 (en) | 2004-04-23 | 2006-02-22 | 자화전자 주식회사 | Radiation sheet for plasma display panel |
| KR200422459Y1 (en) | 2006-05-10 | 2006-07-26 | 김재준 | Heat-radiaton sheet |
| TW200904934A (en) * | 2007-07-24 | 2009-02-01 | Univacco Technology Inc | Thermally conductive adhesive and its binding method applied to conduct heat |
| JP2009282515A (en) | 2008-05-20 | 2009-12-03 | Samsung Sdi Co Ltd | Method for manufacturing plasma display device, and plasma display using the same |
| TWM378601U (en) * | 2009-12-09 | 2010-04-11 | Asia Electronic Material Co | Thermally conductive covering membrane |
-
2010
- 2010-07-05 KR KR1020100064409A patent/KR101189990B1/en active IP Right Grant
-
2011
- 2011-07-04 TW TW100123443A patent/TWI476572B/en not_active IP Right Cessation
- 2011-07-04 CN CN201110188323.4A patent/CN102384697B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100407415C (en) * | 2003-04-03 | 2008-07-30 | 信越化学工业株式会社 | Heat conduction composite chip and its mfg. method |
| CN1878456A (en) * | 2006-07-14 | 2006-12-13 | 陈鸿文 | Heat conductive caulking pad with composite structure |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI476572B (en) | 2015-03-11 |
| CN102384697A (en) | 2012-03-21 |
| KR101189990B1 (en) | 2012-10-12 |
| TW201207606A (en) | 2012-02-16 |
| KR20120003676A (en) | 2012-01-11 |
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