KR102150258B1 - Electronic element and sheet material - Google Patents

Abstract

The electronic device of the present invention includes a wiring board having a mounting surface, an electronic board including a plurality of electronic components mounted on the mounting surface of the wiring board, and a sheet-like layer laminated on the electronic board and having conductivity. A sheet material having a substrate, at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one electronic component, and the substrate of the sheet material are grounded, and the It has a sheet member and a ground portion for fixing the electronic substrate. Thereby, it is easy to remove heat generation from an electronic component, and it is possible to provide a thin, highly reliable electronic element.

Description

Electronic element and sheet material {ELECTRONIC ELEMENT AND SHEET MATERIAL}

The present invention relates to an electronic device and a sheet material.

In electronic devices such as smartphones, in order to protect electronic components mounted on a wiring board from, for example, electromagnetic waves, a conductive box-shaped shield tube is provided to cover the electronic components. It is provided on the substrate (see, for example, Patent Document 1).

Japanese Patent No. 4 579 927

However, since such a shield tube is generally made of metal, there is a limit to reducing the size (especially, thinning). Accordingly, there is a problem in that it cannot further meet the demand for thinning of an electronic device formed by mounting a shield tube on a wiring board or an electronic device in which the electronic device is assembled.

Further, the shield pipe made of metal is rigid and has no or very low flexibility. For this reason, when installing (joining) the shield tube to the wiring board, it is necessary to provide a gap having a certain size between the shield tube and the electronic component so as to prevent damage to the electronic component. There is. This is also an obstacle to thinning of electronic devices.

In addition, in such an electronic device, there is also a problem that it is difficult to efficiently remove heat from the electronic component by providing the gap.

Accordingly, the present invention is to provide an electronic element that is easy to remove heat from an electronic component and is thin and highly reliable, and a sheet material capable of exhibiting a sufficient electromagnetic wave shielding effect and reducing the thickness of the obtained electronic element.

This object is achieved by the following invention.

The electronic device of the present invention includes a wiring board having a mounting surface, an electronic board having a plurality of electronic components mounted on the mounting surface of the wiring board,

A sheet material comprising a sheet-like substrate laminated on the electronic substrate and having conductivity, and at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one electronic component;

And a ground portion for fixing the sheet member and the electronic substrate while grounding the substrate of the sheet member.

In the electronic device of the present invention, the ground portion includes a ground wiring provided on the mounting surface side of the wiring board,

The insulating layer has a size smaller than that of the substrate in plan view,

It is preferable that the base material is in contact with the ground wiring in an exposed area exposed from the insulating layer.

In the electronic device of the present invention, the mounting surface of the wiring board is partitioned by the ground wiring and includes a plurality of mounting regions for mounting the predetermined electronic component,

It is preferable that the at least one insulating layer includes a plurality of the insulating layers provided corresponding to each of the mounting regions.

In the electronic device of the present invention, it is preferable that the substrate includes a cured product of a curable resin and conductive particles dispersed in the cured product.

In the electronic device of the present invention, the curable resin is preferably at least one of a thermosetting resin and a photocurable resin.

In the electronic device of the present invention, the average particle diameter of the conductive particles is preferably 1 to 100 µm.

In the electronic device of the present invention, it is preferable that the substrate includes a body portion including the cured product of the curable resin and the conductive particles, and a metal film provided in contact with the body portion.

In the electronic device of the present invention, it is preferable that the metal film has substantially the same size as the insulating layer in plan view.

In the electronic device of the present invention, it is preferable that the metal film has substantially the same size as the body portion in plan view.

In the electronic device of the present invention, the average thickness of the metal film is preferably 0.004 to 2500% of the average thickness of the substrate.

In the electronic device of the present invention, the substrate is provided in contact with the insulating layer and provided with a first portion containing a first conductive particle, and a first portion of the first portion disposed on a side opposite to the insulating layer and formed of the first conductive particle. It is preferable to have a second portion containing the second conductive particles in an amount greater than the content in the first portion.

In the electronic device of the present invention, the average thickness of the substrate is preferably 2 to 500 µm.

In the electronic device of the present invention, it is preferable that the surface of the insulating layer on the side of the electronic substrate is formed of a smooth surface.

In the electronic device of the present invention, it is preferable that the surface of the insulating layer on the side of the electronic substrate is formed of a rough surface.

In the electronic device of the present invention, the average thickness of the insulating layer is preferably a ratio of 50 to 200 when the average thickness of the substrate is 100.

In the electronic device of the present invention, the insulating layer preferably includes a resin and thermally conductive particles dispersed in the resin and having a higher thermal conductivity than the thermal conductivity of the resin.

In the electronic device of the present invention, it is preferable that the material constituting the thermally conductive particles contains at least one of aluminum oxide, aluminum nitride, and boron nitride.

In the electronic device of the present invention, the content of the thermally conductive particles in the insulating layer is preferably 25 to 95% by weight.

In the electronic device of the present invention, it is preferable to further have a protective layer provided on the side opposite to the electronic substrate of the substrate and having a function of protecting the substrate.

In the electronic device of the present invention, in the state before the sheet material is laminated on the electronic substrate, the average thickness of the first region where the edge of the electronic component contacts is greater than the average thickness of the second region other than the first region. It is preferable that it is configured to be large.

In the electronic device of the present invention, the plurality of electronic components include two or more of the electronic components arranged in parallel,

In the state before the sheet material is laminated on the electronic substrate, the average thickness of the first region forming a straight line continuously in contact with the edge of the parallel electronic component is an average of the second regions other than the first region. It is preferable to be configured to be larger than the thickness.

In the electronic device of the present invention, in the state before the sheet material is laminated on the electronic substrate, the average thickness of the sheet material in the first region is A [µm], and the average thickness in the second region is B When it is set as [micrometer], it is preferable that A/B is 1.05-3.

In the electronic device of the present invention, it is preferable that the sheet material further has at least one insulating portion provided separately from the insulating layer at a position corresponding to the edge of the substrate on the side of the electronic substrate.

In the electronic device of the present invention, it is preferable that the at least one insulating portion includes a plurality of the insulating portions provided at intervals from each other along the edge of the substrate.

In the electronic device of the present invention, it is preferable that the insulating portion is formed in a frame shape along the edge of the substrate.

In the electronic device of the present invention, it is preferable that the average thickness of the insulating portion is smaller than the average thickness of the insulating layer.

In the electronic device of the present invention, it is preferable that the portion of the sheet material provided with the insulating portion constitutes a gripping portion that is gripped when the sheet material is separated from the electronic substrate.

In addition, the sheet material of the present invention is laminated on a wiring board having a mounting surface and an electronic board including a plurality of electronic components mounted on the mounting surface of the wiring board, and fixed to the electronic board through a ground portion. It is a sheet material used by

A sheet-like substrate having conductivity in contact with the ground portion in a state in which the sheet material is laminated on the electronic substrate;

In a state in which the sheet material is laminated on the electronic substrate, it is characterized in that it has at least one insulating layer positioned on the side of the electronic substrate of the substrate and having a size including at least one of the electronic components.

In the sheet material of the present invention, it is preferable that the substrate has a first portion provided in contact with the insulating layer and provided with adhesiveness, and a second portion provided on a side opposite to the insulating layer of the first portion. .

In the sheet material of the present invention, the first portion contains a first resin and first conductive particles dispersed in the first resin, and the second portion is the second resin and the second resin. It is preferable to contain the second conductive particles dispersed in an amount larger than the content in the first portion of the first conductive particles.

In the sheet material of the present invention, the content of the first conductive particles in the first portion is preferably 1 to 100 parts by weight based on 100 parts by weight of the first resin.

In the sheet material of the present invention, the content of the second conductive particles in the second portion is preferably 100 to 1500 parts by weight based on 100 parts by weight of the second resin.

In the sheet material of the present invention, it is preferable that the shape of the first conductive particles and the shape of the second conductive particles are different.

In the sheet material of the present invention, it is preferable that the shape of the first conductive particles be resinous or spherical.

According to the present invention having the above configuration, when a sheet material having high flexibility is used, it is not necessary to consider damage to an electronic component when the sheet material is laminated on a wiring board. For this reason, it becomes possible to narrow such an interval until the sheet material and the electronic component come into close contact with each other. Thereby, it is possible to further reduce the thickness of the electronic device formed by laminating the sheet material on the electronic substrate. In addition, heat generation of electronic components can be efficiently removed through a sheet material.

Accordingly, according to the present invention, it is possible to provide an electronic device that is easy to remove heat from an electronic component, is thin and has high reliability, and a sheet material capable of exhibiting a sufficient electromagnetic shielding effect and reducing the thickness of the obtained electronic device. I can.

1 is an exploded perspective view showing the configuration of an electronic device of the present invention.
Fig. 2 is a longitudinal sectional view (a cross-sectional view taken along line AA in Fig. 1) showing the configuration of the sheet material of the first embodiment (a state bonded to an electronic substrate).
Fig. 3 is an enlarged cross-sectional view showing the configuration of a sheet material according to a second embodiment (state before being bonded to an electronic substrate).
Fig. 4 is an enlarged cross-sectional view showing the configuration of a sheet material according to the third embodiment (a state before being bonded to an electronic substrate).
Fig. 5 is a diagram showing the configuration of the sheet material of the fourth embodiment (a state before being bonded to the electronic substrate) ((a) is a plan view showing the vicinity of the insulating layer, and (b) is a central part of the cross section taken along line BB in (a) Is shown).
6 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet material of the fourth embodiment.
Fig. 7 is a diagram showing the configuration of a sheet material of the fifth embodiment (a state before being bonded to an electronic substrate) ((a) is a plan view, (b) is a view showing the center and end portions in the cross section of the CC line in (a)) to be.
Fig. 8 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet material according to the fifth embodiment.
9 is a longitudinal sectional view showing the configuration of an end portion of an electronic element according to a sixth embodiment.
Fig. 10 is an enlarged cross-sectional view showing the configuration of a sheet material according to the seventh embodiment (a state before being bonded to an electronic substrate).

Hereinafter, the electronic device and sheet material of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

1 is an exploded perspective view showing the configuration of an electronic device of the present invention. In the following, for convenience of explanation, the upper side is referred to as "upper" and the lower side is referred to as "lower" in FIG. 1.

The electronic device 10 of the present invention has an electronic substrate 100 and a sheet material 1 bonded (laminated) to the electronic substrate 100. First, prior to the description of the sheet material 1, the electronic substrate 100 will be described. Moreover, as the electronic board 100, a flexible printed circuit board, a rigid printed circuit board, a rigid flexible board, etc. are mentioned, for example.

The electronic board 100 includes a wiring board 110 having a mounting surface 101 and a plurality of semiconductor chips (electronic components) 120 mounted on the mounting surface 101 of the wiring board 110 Are doing. Moreover, as the semiconductor chip 120, a CPU chip, a memory chip, a power supply chip, a sound source chip, etc. are mentioned, for example.

The wiring board 110 is composed of a substrate 111, a wiring 112 formed on the substrate 111 and a ground wiring (grand portion) 113. One end of the wiring 112 is connected to a power supply, and the other end is connected to a terminal of the semiconductor chip 120. The ground wiring 113 is formed in a frame shape so as to avoid the wiring 112 and is grounded. In this embodiment, as shown in FIG. 1, the mounting surface 101 is divided into first to third mounting regions 101a to 101c by the ground wiring 113. In these mounting regions 101a to 101c, predetermined semiconductor chips 120 are mounted, respectively.

The sheet material 1 is bonded to the electronic substrate 100 having such a configuration. Hereinafter, the sheet member 1 will be described.

<First Embodiment>

First, a first embodiment of the sheet member 1 will be described.

Fig. 2 is a longitudinal sectional view (a cross-sectional view taken along line A-A in Fig. 1) showing a configuration (a state of being bonded to an electronic substrate) of a sheet material according to the first embodiment. In addition, hereinafter, for convenience of explanation, the upper side in FIG. 2 is referred to as "upper" and the lower side is referred to as "lower".

As shown in Fig. 2, the sheet material 1 includes a sheet-like substrate 2 having conductivity, an insulating layer 3 provided on the lower surface (one side) of the substrate 2, and the substrate 2 It has a hard coat layer 4 provided on the upper surface (the other side). This sheet material 1 is bonded to the electronic substrate 100 with the insulating layer 3 on the side of the electronic substrate 100.

The substrate 2 may be formed of a metal film as long as it has conductivity, but, as in the present embodiment, a resin film comprising a solid or cured product of the resin 21 and conductive particles 22 It is desirable. Further, the base material 2 may be a combination of such a metal film and a resin film, or a combination of two or more different resin films. The configuration of such a combination is shown in the following embodiments. In addition, when the base material 2 is constituted by a metal film, the metal film can be formed using the same metal as the electroconductive particle 22.

In addition, the substrate 2 may have an isotropic conductivity or anisotropic conductivity according to the type (purpose) of the wiring substrate 110. In addition, isotropic conductivity means that the substrate 2 has conductivity in its thickness direction and in the plane direction, and anisotropic conductivity means that the substrate 2 has conductivity only in its thickness direction.

As the resin 21, for example, a thermoplastic resin, a curable resin, or the like can be exemplified, and one or two or more of them can be used in combination. In addition, examples of the curable resin include a thermosetting resin, a photocurable resin, an anaerobic curable resin, a reaction curable resin, and the like, but at least one of a thermosetting resin and a photocurable resin is preferable. The effect of using at least one of a curable resin, particularly a thermosetting resin and a photocurable resin, as the resin 21 will be described later.

As a thermoplastic resin, for example, polyolefin resin, vinyl resin, styrene/acrylic resin, diene resin, terpene resin, petroleum resin, cellulose resin, polyamide resin, polyurethane resin, polyester resin , Polycarbonate resin, fluorine resin, and the like.

The thermosetting resin may be a resin having one or more functional groups per molecule that can be used for a crosslinking reaction by heating. As this functional group, for example, a hydroxyl group, a phenolic hydroxyl group, a methoxymethyl group, a carboxyl group, an amino group, an epoxy group, an oxetanyl group, an oxazoline group, an oxazine group, azilidin group, thiol group, isocyanate group, blocked isocyanate group, blocked Carboxyl group, silanol group, etc. are mentioned.

Specific examples of such thermosetting resins include acrylic resins, maleic acid resins, polybutadiene resins, polyester resins, polyurethane resins, urea resins, epoxy resins, oxetane resins, phenoxy resins, and polyimide. Resin, polyamide resin, polyamideimide resin, phenol resin, cresol resin, melamine resin, alkyd resin, amino resin, polylactic acid resin, oxazoline resin, benzoxazine resin, silicone resin Resin, fluorine resin, etc. are mentioned.

Further, in the case of using a thermosetting resin, it is preferable that the base material 2 includes a curing agent such as a resin or a low molecular compound that reacts with the functional group to form a chemical crosslinking, as needed, in addition to the thermosetting resin. Although not particularly limited as such a curing agent, for example, a phenolic curing agent such as a phenol novolak resin, a curing agent capable of advancing the curing reaction at a relatively high temperature such as an amine curing agent such as dicyandiamide and an aromatic diamine, and isocyanate-based A curing agent capable of advancing the curing reaction at a relatively low temperature (for example, 120° C. or less), such as a curing agent, an epoxy curing agent, an aziridine curing agent, and a metal chelate curing agent, may be mentioned.

In addition, one of these curing agents may be used alone, or two or more of these curing agents may be used in combination. The degree of curing of the substrate 2 in the sheet material 1 before lamination on the electronic substrate 100 (before use) (fully cured state or radius) by appropriately selecting the type of curing agent, their combination and content, etc. It is possible to control at least one of the degree of formation), the degree of fluidity (solid state or gel state), and the degree of tackiness (high tack, low tack, or non-tack).

On the other hand, the photocurable resin may be a resin having one or more unsaturated bonds causing a crosslinking reaction by light. Specific examples of the photocurable resin include, for example, acrylic resins, maleic acid resins, polybutadiene resins, polyester resins, polyurethane resins, epoxy resins, oxetane resins, phenoxy resins, polyimide resins, poly Amide resins, phenol resins, alkyd resins, amino resins, polylactic acid resins, oxazoline resins, benzoxazine resins, silicone resins, and fluorine resins.

In the base material 2 of this embodiment, the electroconductive particle 22 is dispersed in the solidified product or hardened|cured material of such resin 21. With such a configuration, the substrate 2 (sheet material 1) exhibits an electromagnetic wave shielding effect. Examples of the conductive particles 22 include metal particles, carbon particles, conductive resin particles, and the like, and one type or two or more of them can be used in combination.

Examples of the metal constituting the metal particles include gold, platinum, silver, copper, nickel, aluminum, iron, or an alloy thereof, or ITO, ATO, etc., but copper is preferable in terms of price and conductivity. . Further, the metal particles may be particles having a nucleus body composed of a metal, and a coating layer composed of a metal covering the nucleus body. Examples of such metal particles include silver-coated copper particles formed by covering a nucleus body composed of copper with a coating layer composed of silver.

Further, examples of carbon constituting the carbon particles include acetylene black, Ketjen black, furnace black, carbon nanotube, carbon nanofiber, graphite, fullerene, graphene, and the like. Further, examples of the conductive resin constituting the conductive resin particles include poly(3,4-ethylenedioxythiophene), polyacetylene, and polythiophene.

The average particle diameter of the conductive particles 22 is preferably about 1 to 100 µm, more preferably about 3 to 75 µm, and even more preferably about 5 to 50 µm. By making the average particle diameter of the electroconductive particle 22 into the said range, the filling rate of the electroconductive particle 22 in the base material 2 can be improved. For this reason, the electromagnetic wave shielding effect of the substrate 2 (sheet material 1) can be further enhanced. In addition, for example, when the resin composition is mixed with the resin 21 to prepare a resin composition, the fluidity thereof becomes good, so that the moldability to the substrate 2 is improved.

In addition, the shape of the electroconductive particle 22 may be any shape, such as a spherical shape, a needle shape, a flake shape, and a resin shape. In addition, the average particle diameter of the conductive particles 22 can be measured and obtained by a general laser diffraction method, a scattering method, etc., and the average diameter value when the same circle is assumed for the projected area of the fine particle aggregate can be taken as the average particle diameter. have.

Although the content of the conductive particles 22 in the substrate 2 is not particularly limited, it is preferably 100 to 1500 parts by weight, more preferably 100 to 1000 parts by weight, based on 100 parts by weight of the resin 21. By making the content of the conductive particles 22 in the substrate 2 within the above range, it is possible to impart necessary and sufficient conductivity to the substrate 2 regardless of the type of the conductive particles 22, thereby shielding the electromagnetic wave of the substrate 2 The effect can be sufficiently increased. Moreover, since the fluidity of the resin composition containing the resin 21 and the electroconductive particle 22 becomes high, and the base material 2 becomes easier to form, it is preferable.

Further, the average thickness of the substrate 2 is also not particularly limited, but it is preferably about 2 to 500 µm, and more preferably about 5 to 100 µm. By setting the average thickness of the substrate 2 in the above range, it is possible to reduce the thickness of the substrate 2 while preventing a decrease in the mechanical strength of the substrate 2.

In addition, the base material 2 is, for example, a colorant (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal deactivator, a thickener, a dispersant, a silane coupling agent, a rust inhibitor, an antifreeze agent, a reducing agent. , Antioxidants, tackifying resins, plasticizers, ultraviolet absorbers, antifoaming agents, leveling adjusters, and the like may be contained.

Examples of the colorant include organic pigments, carbon black, ultramarine blue, stool, zinc oxide, titanium oxide, graphite, and the like. Examples of the flame retardant include halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, and inorganic flame retardants. Examples of the filler include glass fiber, silica, talc, and ceramic.

In addition, examples of the lubricant include fatty acid esters, hydrocarbon resins, paraffins, higher fatty acids, fatty acid amides, aliphatic alcohols, metal soaps, and modified silicones. Examples of the blocking inhibitor include calcium carbonate, silica, polymethylsilsesquioxane, and aluminum silicate salts.

An insulating layer 3 is provided on the lower surface of the substrate 2 (the surface on the electronic substrate 100 side). In this embodiment, as shown in FIG. 1, on the lower surface of the base material 2, a first insulating layer 3a corresponding to the first mounting region 100a of the mounting surface 101 (wiring substrate 110) And, a second insulating layer 3b corresponding to the second mounting region 100b; A third insulating layer 3c corresponding to the third mounting region 100c is provided.

The first to third insulating layers 3a to 3c (hereinafter collectively referred to as "insulation layer 3") are each smaller than the base material 2 in plan view, and the sheet material 1 is used as an electronic substrate. In the state of being stacked on (100), a size including one or more semiconductor chips 120 is provided. With such a configuration, on the lower surface of the substrate 2, a band-shaped exposed region 2a exposed from the first to third insulating layers 3a to 3c is formed. Accordingly, this exposed region 2a has a shape corresponding to the shape of the ground wiring 113 of the wiring board 110. With the sheet material 1 bonded to the wiring board 110, the exposed area 2a contacts the ground wiring 113, and the base material 2 is grounded. That is, the exposed region 2a of the substrate 2 constitutes a connection portion (joining portion) that connects (joins) the sheet material 1 to the wiring board 110.

For example, when the substrate 2 contains a curable resin as the resin 21, the exposed region 2a of the substrate 2 is brought into contact with the ground wiring 113 of the wiring board 110, and then curable resin By curing, the sheet material 1 and the electronic substrate 100 can be bonded (fixed) to the contact portion by the cured product.

The insulating layer 3 just needs to have sufficient insulation, and can be formed using a hard resin or a curable resin (in particular, a thermosetting resin). Specific examples of the hard resin include, for example, acrylic, polyurethane, polyurethaneurea, epoxy, epoxy ester, polyester, polycarbonate, polyphenylene sulfide, and the like, and one or two or more of them are combined. It can be used. On the other hand, as the curable resin, the same curable resin as the resin 21 can be used.

Further, when a thermosetting resin is used as the curable resin, the insulating layer 3 may contain a curing agent similar to that described for the base material 2. Thereby, the degree of curing of the insulating layer 3 in the sheet material 1 before lamination on the electronic substrate 100 (before use) (fully cured state or semi-cured state), and the degree of fluidity (solid state) Alternatively, at least one of the gel state) and the degree of tackiness (high tackiness, low tackiness, or non-tackiness) can be controlled.

In addition, the insulating layer 3 is, for example, a colorant (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal deactivator, a thickener, a dispersant, a silane coupling agent, a rust inhibitor, an antifreeze agent, You may contain a reducing agent, an antioxidant, a tackifying resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling adjuster, and the like.

The average thickness of the insulating layer 3 is not particularly limited, but when the average thickness of the substrate 2 is 100, it is preferably a ratio of about 50 to 200, and more preferably a ratio of about 75 to 150. Specifically, the average thickness of the insulating layer 3 is preferably about 1 to 1000 µm, more preferably about 3 to 200 µm. Thereby, the insulating layer 3 can give the insulating layer 3 (sheet material 1) excellent followability with respect to the surface of the electronic substrate 100 while maintaining sufficient insulating property.

In addition, from the viewpoint of promoting heat dissipation from the semiconductor chip 120, as shown in FIG. 2, it is preferable that the surfaces of the insulating layer 3 and the semiconductor chip 120 are in close contact. By setting the relationship between the average thickness and the average thickness of the substrate 2 in the above range, the adhesion of the insulating layer 3 to the surface of the semiconductor chip 120 can be further improved. Further, in order to bring the insulating layer 3 into close contact with the surface of the semiconductor chip 120, when bonding the sheet material 1 to the electronic substrate 100, this operation may be performed under reduced pressure or under vacuum.

Further, the lower surface of the insulating layer 3 (a contact surface with the semiconductor chip 120) may be formed of a smooth surface or a rough surface. When the lower surface of the insulating layer 3 (the surface on the side of the electronic substrate 100) is configured as a smooth surface, the contact area between the insulating layer 3 and the surface of the semiconductor chip 120 can be increased, and the sheet material 1 It is possible to improve the heat dissipation effect. On the other hand, if the lower surface of the insulating layer 3 is made of a rough surface, the contact area between the insulating layer 3 and the surface of the semiconductor chip 120 can be slightly reduced, and thus, when the electronic substrate 100 is recycled, the semiconductor chip The insulating layer 3 (sheet material 1) can be more easily removed from the 120.

On the other hand, a hard coat layer (protective layer) 4 having a function of protecting the substrate 2 is provided on the upper surface of the substrate 2 (the surface opposite to the electronic substrate 100 ). Thereby, damage to the base material 2 can be suitably prevented.

Such a hard coat layer 4 is, for example, a bifunctional or more polyfunctional or monofunctional monomer having an α,β-unsaturated double bond, a vinyl type monomer, an aryl type monomer, a monofunctional (meth)acrylic monomer, a polyfunctional It is preferably composed of a polymer (cured product) of a radical polymerization monomer such as a (meth)acrylic monomer. By constituting the hard coat layer 4 from a polymer of such a monomer, the strength of the hard coat layer 4 increases, and the effect of preventing the substrate 2 from being damaged is further improved.

In addition, a bifunctional or higher monomer having an α,β-unsaturated double bond is, for example, a relatively low molecular weight monomer with a molecular weight of less than 1000 (so-called a narrow monomer), for example, a relatively high molecular weight of 1000 or more and less than 10,000. It may be an oligomer or prepolymer of molecular weight. Here, as an oligomer having an α,β-unsaturated double bond, for example, polyester (meth)acrylate, polyurethane (meth)acrylate, epoxy (meth)acrylate, (meth)acrylate maleic acid-modified polybutadiene, etc. Can be mentioned.

Examples of vinyl-type monomers include styrene, α-methylstyrene, divinyl benzene, N-vinylpyrrolidone, vinyl acetate, N-vinyl formaldehyde, N-vinyl caprolactam, and alkyl vinyl ether. . Moreover, as an aryl-type monomer, trimethacryl isocyanurate, triaryl cyanurate, etc. are mentioned, for example.

As a monofunctional (meth)acrylic monomer, for example, 2-(meth)acryloyloxyethylphthalate, 2-(meth)acryloyloxyethyl 2-hydroxyethyl phthalate, and 2-(meth)acryloyl Oxyethyl hexahydrophthalate, 2-(meth)acryloyloxypropyl phthalate, 2-ethylhexyl (meth)acrylate, 2-ethylhexyl carbitol (meth)acrylate, 2-hydroxybutyl (meth)acrylate , 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 4-hydroxybutyl (Meth)acrylate, benzyl (meth)acrylate, butanediol mono (meth)acrylate, butoxy ethyl (meth)acrylate, butyl (meth)acrylate, caprolactone (meth)acrylate, cetyl (meth)acrylic Rate, cresol (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl oxyethyl (meth)acrylate, diethylene Glycol monoethyl ether (meth)acrylate, dimethylaminoethyl (meth)acrylate, dipropylene glycol (meth)acrylate, phenyl (meth)acrylate, ethyl (meth)acrylate, isoamyl (meth)acrylate, Isobornyl (meth)acrylate, isobutyl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, isostearyl (meth)acrylate, isomiristyl (meth)acrylate, Lauroxy polyethylene glycol (meth)acrylate, lauryl (meth)acrylate, methoxy dipropylene glycol (meth)acrylate, methoxy tripropylene glycol (meth)acrylate, methoxy polyethylene glycol (meth)acrylate, Methoxy triethylene glycol (meth) acrylate, methyl (meth) acrylate, neopentyl glycol benzoate (meth) acrylate, nonyl phenoxy polyethylene glycol (meth) acrylate, nonyl phenoxy polypropylene glycol (meth) acrylic Rate, octafluoropentyl (meth)acrylate, octoxypolyethylene glycol Polypropylene glycol (meth)acrylate, octyl (meth)acrylate, paracumyl phenoxy ethylene glycol (meth)acrylate, perfluoro octyl ethyl (meth)acrylate, phenoxy (meth)acrylate, phenoxy di Ethylene glycol (meth)acrylate, phenoxy ethyl (meth)acrylate, phenoxy hexa ethylene glycol (meth)acrylate, phenoxy tetraethylene glycol (meth)acrylate, polyethylene glycol (meth)acrylate, stearyl ( Meth)acrylate, succinic acid (meth)acrylate, t-butyl (meth)acrylate, t-butylcyclohexyl (meth)acrylate, tetrafluoropropyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylic Rate, tribromophenyl (meth)acrylate, tridecyl (meth)acrylate, trifluoroethyl (meth)acrylate, β-carboxyethyl (meth)acrylate, ω-carboxy-polycaprolactone (meth) Acrylates, or derivatives and modified products thereof.

As a polyfunctional (meth)acrylic monomer, for example, 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylic Rate, 1,9-nonandiol di(meth)acrylate, bisphenol A di(meth)acrylate, bisphenol F di(meth)acrylate, diethylene glycol di(meth)acrylate, hexahydrophthalic acid di(meth) )Acrylate, hydroxypibaric acid neopentyl glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, hydroxypibaric acid ester neopentyl glycol di(meth)acrylate, pentaerythritol di(meth) )Acrylate, di(meth)acrylate of futal acid, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A diglycidyl ether Di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, dimethyloldicyclopentane di(meth)acrylate, Neopentyl glycol modified trimethylolpropane di(meth)acrylate, tripropylene glycol di(meth)acrylate, triglycerol di(meth)acrylate, dipropylene glycol di(meth)acrylate, glycerol tri(meth)acrylate , Pentaerythritol tri(meth)acrylate, phosphoric acid tri(meth)acrylate, trimethyrolpropane tri(meth)acrylate, trimethyrolpropane benzoate tri(meth)acrylate, tris((meth)acryloyl Oxyethyl) isocyanurate, di(meth)acrylated isocyanurate, dipentaerythritol hexa(meth)acrylate, dipentaerythritolhydroxy penta(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate , Pentaerythritol tetra(meth)acrylate, or derivatives or modified products thereof, and the like.

In addition, the hard coat layer 4 is, for example, a polyester resin such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), an acrylic resin such as polymethyl metaacrylate, polyethylene, and polypropylene. , And a thermoplastic resin such as a polyolefin resin such as an ethylene-vinyl acetate copolymer.

In addition, the hard coat layer 4 is, for example, a colorant (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal deactivator, a thickener, a dispersant, a silane coupling agent, a rust inhibitor, an antifreeze agent. , A reducing agent, an antioxidant, a tackifying resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling adjuster, and the like.

When the hard coat layer 4 is composed of a polymer (cured product) of a monomer, the average thickness of the hard coat layer 4 is not particularly limited, but is preferably about 0.1 to 10 μm, and about 0.5 to 5 μm It is more preferable that it is. On the other hand, when the hard coat layer 4 is composed of a solidified product of a thermoplastic resin, the average thickness of the hard coat layer 4 is preferably about 1 to 50 µm, more preferably about 5 to 30 µm. . By making the average thickness of the hard coat layer 4 into the said range, damage of the base material 2 can be prevented more reliably, while maintaining the potency of the sheet material 1.

In addition, the protective layer is not limited to the hard coat layer 4, and may be a cushion layer, a printing layer, or the like absorbing external stress or impact, or a laminate in which these layers are combined.

The sheet material 1 as described above can be manufactured as follows, for example.

First, after coating the resin composition for a hard coat layer on a release sheet, it is made to harden or solidify. Thereby, the hard coat layer 4 is obtained.

Next, after coating the resin composition for a base material on the hard coat layer 4, it is made to semi-harden, harden, or solidify. Thereby, the base material 2 is obtained. In this state, the base material 2 may or may not have adhesiveness.

Next, after coating the resin composition for an insulating layer on the substrate 2, it is semi-cured, cured or solidified. Thereby, the insulating layer 3 is obtained. In this state, the insulating layer 3 may or may not have adhesiveness.

As a method of coating each resin composition, for example, gravure coat method, kiss coat method, die coat method, lip coat method, comma coat method, braid method, roll coat method, knife coat method, spray coat method, bar coat A method, a speed coat method, a deep coat method, or the like can be used.

Further, the sheet material 1 may be formed by bonding these layers together after forming each layer individually.

In addition, in the sheet material 1, between the substrate 2 and the hard coat layer (protective layer) 4, for example, a heat conductive layer, a water vapor barrier layer, an oxygen barrier layer, a low dielectric constant layer, and a high dielectric constant layer , A low dielectric loss tangent layer, a high dielectric loss tangent layer, and a heat-resistant layer may be provided.

This sheet material 1 is bonded to the electronic substrate 100 as follows.

First, the insulating layer 3 is placed on the electronic substrate 100 and the sheet material 1 is laminated on the electronic substrate 100. Next, when the sheet material 1 is heated and pressed against the electronic substrate 100 in this state, the insulating layer 3 comes into close contact with the surface of the semiconductor chip 120 and the exposed area of the substrate 2 ( 2a) contacts the ground wiring 113 and the sheet material 1 is fixed (bonded) to the electronic substrate 100. Thereby, the electronic element 10 can be obtained. Further, by performing heat compression bonding under reduced pressure or under vacuum, the degree of adhesion of the insulating layer 3 to the surface of the semiconductor chip 120 is increased. As a result, not only the electromagnetic wave shielding effect by the sheet material 1 but also a good heat dissipation effect is exhibited.

In addition, when the substrate 2 contains a thermosetting resin and is in a semi-cured state, the thermosetting resin is cured by the above heating and pressurization, and the exposed region 2a of the substrate 2 is formed by the cured product. Is firmly bonded to Further, the mechanical strength of the substrate 2 (sheet material 1) itself is improved by curing the thermosetting resin. Further, when the substrate 2 contains a photocurable resin, light (activating radiation) is irradiated to the exposed region 2a of the substrate 2 after the above heating and compression bonding. Thereby, the photocurable resin is cured, and the exposed region 2a of the substrate 2 is firmly bonded to the ground wiring 113 by the cured product. In addition, when the base material 2 is made of a metal film, prior to the heating and compression bonding, a brazing (solder) is provided on the ground wiring 113 so that the exposed area 2a of the base material 2 becomes the ground wiring ( 113) is firmly bonded through a braid.

Such an electronic device 10 is easy to remove heat from the semiconductor chip 120, is thin, and has high reliability, and, for example, mobile phones such as smartphones, personal computers, tablet terminals, LED lighting , Organic EL lighting, liquid crystal TV, organic ELTV, digital camera, digital video camera, can be used for automotive parts such as automobiles.

<Second Embodiment>

Next, a second embodiment of the present invention will be described.

Fig. 3 is an enlarged cross-sectional view showing the configuration of a sheet material according to a second embodiment (state before being bonded to an electronic substrate). Hereinafter, although the 2nd embodiment is demonstrated, it demonstrates centering on the difference with the said 1st embodiment, and the description is abbreviate|omitted about the same thing. In addition, in the following, for convenience of explanation, the upper side in FIG. 3 is referred to as "upper", and the lower side is referred to as "lower".

The sheet material 1 of the second embodiment is the same as the first embodiment, except that the configuration of the insulating layer 3 (first to third insulating layers 3a to 3c) is different. That is, as shown in Fig. 3, the insulating layer 3 of the second embodiment is a resin 31 and thermally conductive particles 32 that are dispersed in the resin 31 and have a higher thermal conductivity than the thermal conductivity of the resin 31. Includes. When the insulating layer 3 contains the thermally conductive particles 32, the thermal conductivity of the sheet material 1 is improved, and the heat dissipation effect by the sheet material 1 is further increased.

As a constituent material of the thermally conductive particles 32, for example, metal oxides such as calcium oxide, magnesium oxide, and aluminum oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, metal nitrides such as aluminum nitride and boron nitride, and calcium carbonate. , Metal carbonates such as magnesium carbonate, metal silicates such as calcium silicate, crystalline silica, amorphous silica, silicon compounds such as silicon carbide, and the like, and one or two or more of them may be used in combination.

Among these, as the constituent material of the thermally conductive particles 32, at least one of aluminum oxide, aluminum nitride, and boron nitride is preferable, and aluminum oxide is more preferable because of high heat resistance and insulation reliability. In addition, spherical aluminum oxide is excellent in that it can be filled in the insulating layer 3 as closely as possible, and even when the amount of filling is increased, the elastic modulus of the insulating layer 3 can be prevented from unnecessarily increasing. desirable. In addition, the thermally conductive particles 32 may contain a plurality of types of particles.

Although the average particle diameter of the thermally conductive particles 32 is not particularly limited, it is preferably about 0.1 to 250 µm, more preferably about 0.5 to 100 µm. Since the thermally conductive particles 32 of such average particle diameter are easily uniformly dispersed in the insulating layer 3, the thermal conductivity of the insulating layer 3 can be further improved.

In addition, the shape of the thermally conductive particles 32 may be any of a spherical shape, a needle shape, a flake shape, and a resin shape. In addition, the average particle diameter of the thermally conductive particles 32 can be measured and obtained by a general laser diffraction method, a scattering method, etc., and the average particle diameter can be taken as the average particle diameter when the same circle is assumed for the projected area of the particle aggregate. have.

Although the content of the thermally conductive particles 32 in the insulating layer 3 is not particularly limited, it is preferably about 25 to 95% by weight, and more preferably about 35 to 85% by weight. By setting the content of the thermally conductive particles 32 in the insulating layer 3 in the above range, the thermal conductivity of the insulating layer 3 can be sufficiently improved while preventing the mechanical strength of the insulating layer 3 from lowering.

In addition, as the resin 31, the same resin that can be used for the insulating layer 3 in the first embodiment can be used. Further, the insulating layer 3 may contain the same curing agent as described in the first embodiment.

Also in the second embodiment as described above, the same functions and effects as in the first embodiment are exhibited.

<Third Embodiment>

Next, a third embodiment of the present invention will be described.

Fig. 4 is an enlarged cross-sectional view showing the configuration of a sheet material according to a third embodiment (state before being bonded to an electronic substrate). Hereinafter, a third embodiment will be described, but a description will be given focusing on differences from the first embodiment, and the description will be omitted for similar matters. In addition, in the following, for convenience of explanation, the upper side in FIG. 4 is referred to as "upper" and the lower side is referred to as "lower".

The sheet member 1 of the third embodiment is the same as the first embodiment, except that the configuration of the base material 2 is different. That is, as shown in Figs. 4(a) and (b), the substrate 2 of the third embodiment includes a main body 20 including a resin 21 and conductive particles 22, and the main body ( The metal film 23 is provided in contact with the main body 20 from the insulating layer 3 side of 20). When the base material 2 contains the metal film 23, the electromagnetic wave shielding effect and the heat dissipation effect of the base material 2 (sheet material 1) are more suitably exhibited.

The metal film 23 is a method of adhering (bonding) a metal foil formed of metal picked into the conductive particles 22 to the body part 20, metal oxide picked up by the conductive particles 22 (for example, ITO, ATO). By evaporating or sputtering, a method of forming a vapor-deposited film or sputtering film on the body part 20, a method of forming a printing film on the body part 20 by printing a conductive paste (for example, silver paste), etc. I can. In addition, when the metal film 23 is made of a metal foil, various copper foils are preferable from the viewpoint of conductivity and cost, and rolled copper foil or electrolytic copper foil is more preferable.

In addition, the average thickness of the metal film 23 is not particularly limited, but it is preferably about 0.004 to 2500%, and preferably about 0.025 to 75% of the average thickness of the substrate 2. By making the average thickness of the metal film 23 in the above range, the electromagnetic shielding effect and the heat dissipation effect of the substrate 2 are sufficiently exhibited while preventing the potency of the substrate 2 (sheet material 1) from deteriorating. .

It is preferable that the specific average thickness of the metal film 23 is as follows. For example, when the metal film 23 is formed of a vapor deposition film, the average thickness is preferably about 50 to 300 nm, more preferably about 75 to 200 nm. When the metal film 23 is composed of a sputtering film, the average thickness is preferably about 20 to 80 nm, more preferably about 25 to 70 nm. In addition, when the metal film 23 is composed of a metal foil or a printing film, the average thickness is preferably about 0.01 to 20 µm, more preferably about 0.1 to 15 µm.

In addition, the metal film 23 may be substantially the same size as the insulating layer 3 in a plan view, as shown in Fig. 4(a), and as shown in Fig. 4(b), the main body 20 ) May be about the same size. In the case of the configuration shown in FIG. 4A, the sheet material 1 can be firmly bonded to the electronic substrate 100 by using the body portion 20 of the exposed region 2a. On the other hand, in the case of the configuration shown in Fig. 4(b), the metal film 23 in the exposed region 2a is metal-bonded with the ground wiring 113 of the wiring board 110 by, for example, laser irradiation. I can. For this reason, very high bonding between the sheet material 1 and the electronic substrate 100 becomes possible.

Further, such a metal film 23 may have a mesh shape or a shape having a plurality of through holes formed by punching. By achieving such a shape, it is possible to impart water vapor permeability to the metal film 23.

Also in the third embodiment as described above, the same actions and effects as in the first embodiment are exhibited.

In addition, the metal film 23 may be provided so as to be in contact with the main body 20, and may be provided on the hard coat layer 4 side instead of the insulating layer 3 side. It may be provided at an arbitrary position in the middle of the thickness direction, or a combination thereof may be used.

<Fourth Embodiment>

Next, a fourth embodiment of the present invention will be described.

5 is a diagram showing the configuration of the sheet material of the fourth embodiment (a state before being bonded to the electronic substrate) ((a) is a plan view showing the vicinity of the insulating layer 3a, and (b) is a cross section taken along line BB in (a). FIG. 6 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet material of the fourth embodiment. Hereinafter, although the 4th embodiment is demonstrated, it demonstrates centering on the difference with the said 1st embodiment, and the description is abbreviate|omitted about the same thing. In the following, for convenience of explanation, the upper side is referred to as "upper" and the lower side is referred to as "lower" in FIGS. 5(b) and 6.

The sheet material 1 of the fourth embodiment is in a state before the sheet material 1 is bonded to the electronic substrate 100 (the state before the use of the sheet material 1), and the thickness of the insulating layer 3 is uneven. It is the same as the first embodiment except for the above. That is, as shown in Figs. 5 (a) and (b), when the insulating layer 3 of the fourth embodiment is bonded (laminated) to the electronic substrate 100, the edge of the semiconductor chip 120 is in contact. The average thickness of the first region 33 is greater than the average thickness of the second regions 34 other than the first region 33. In the configurations of FIGS. 5A and 5B, the first region 33 has a rectangular frame shape in plan view corresponding to the outer circumferential shape of the semiconductor chip 120.

With this configuration, a thickness sufficient to compensate for the amount of extension is ensured in the portion of the sheet material 1 (first region 33) that extends by contacting the edge of the semiconductor chip 120. For this reason, when bonding the sheet material 1 to the electronic substrate 100, even if the sheet material 1 extends from the first region 33, for example, it is possible to prevent the sheet material 1 from being broken.

In the state before the sheet material 1 is bonded to the electronic substrate 100, the average thickness in the first area 33 of the sheet material 1 is set to A [µm], and in the second area 34 When the average thickness is set to B [µm], A/B is preferably about 1.05 to 3, more preferably about 1.05 to 1.4, and still more preferably about 1.1 to 1.25. Thereby, fracture of the insulating layer 3 (sheet material 1) can be prevented more reliably.

This insulating layer 3 is formed on the first region 33 of the insulating layer 3 after forming a uniform thickness portion of the insulating layer 3 on the substrate 2 side by the method described in the first embodiment. In addition, it can be obtained by stacking and forming a rectangular frame shape.

Also in the fourth embodiment as described above, the same functions and effects as in the first embodiment are exhibited.

In addition, the first region 33 is not limited to the region shown in Fig. 5A, and may be a region in which the sheet material 1 is particularly easily fractured. For example, in the electronic substrate 100 shown in FIG. 1, two semiconductor chips 120 are arranged side by side in the left and right directions on the front side of the paper, but in this case, the first region 33 is as shown in FIG. , It can be set as a linear region which is in continuous contact along the edge of the two semiconductor chips 120 arranged in parallel. In general, in a location where the semiconductor chips 120 are densely arranged, the extent to which the sheet material 1 is extended increases. For this reason, the linear region beyond the two semiconductor chips 120 shown in Fig. 6 is set as the first region 33, and the insulating layer 3 (sheet material 1) in the first region 33 By increasing the thickness of the sheet material 1, fracture of the sheet material 1 can be sufficiently prevented.

In addition, in the state before the sheet material 1 is bonded to the electronic substrate 100, the sheet material 1 needs to have the average thickness of the first region 33 larger than the average thickness of the second region 34 , This configuration is to partially increase the thickness of the substrate 2, instead of forming a partially larger thickness of the insulating layer 3, to partially increase the thickness of the hard coat layer 4 Thing, or it may be realized by such a combination.

<Fifth Embodiment>

Next, a fifth embodiment of the present invention will be described.

Fig. 7 is a diagram showing the configuration of a sheet material of the fifth embodiment (a state before being bonded to an electronic substrate) ((a) is a plan view, (b) is a view showing the center and end portions in the cross section of the CC line in (a)) 8 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet material of the fifth embodiment. Hereinafter, the fifth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description will be omitted for similar matters. In the following, for convenience of explanation, the upper side is referred to as "upper" and the lower side is referred to as "lower" in FIG. 7B.

The sheet material 1 of the fifth embodiment is the same as the first embodiment except that it has an insulating portion 35 separated and provided by an insulating layer 3 along the edge of the lower surface of the base material 2. That is, as shown in Figs. 7(a) and (b), the insulating portion 35 is at the edge of the lower surface of the substrate 2 so as to surround the first to third insulating layers 3a to 3c. Therefore, it is formed in the shape of a square frame. With this configuration, in a state in which the sheet material 1 is bonded (laminated) to the electronic board 100, the substrate 2 and the mounting surface 101 of the wiring board 110 at the edge of the sheet material 1 Direct contact can be prevented. For this reason, an unintentional short circuit between the substrate 2 and the wiring board 110 can be prevented, and the electronic device 10 with high reliability can be obtained.

In addition, when the electronic substrate 100 is recycled, when the sheet material 1 is removed from the electronic substrate 100, by maintaining the portion where the insulating portion 35 of the sheet material 1 is formed, As an opportunity, it becomes possible to easily perform the operation to remove it. That is, the portion of the sheet material 1 in which the insulating portion 35 is provided constitutes a gripping portion that is gripped when the sheet material 1 is separated from the electronic substrate 100 on which the sheet material 1 is stacked. In particular, in the configuration shown in Fig. 7(a), since the insulating portion 35 is formed in a frame shape along the edge of the base material 2, the operation to remove the sheet material 1 from any point on all sides. Can be initiated.

It is preferable to use the same material as the hard resin used in the insulating layer 3 of the first embodiment as a material for the insulating portion 35. By constituting the insulating portion 35 with a hard resin, it is possible to prevent the insulating portion 35 from being bonded to the mounting surface 101 of the wiring board 110. For this reason, when removing the sheet material 1 from the electronic substrate 100, the portion of the sheet material 1 where the insulating portion 35 is formed can be more easily and reliably gripped.

In addition, it is preferable that the average thickness of the insulating portion 35 is set smaller than the average thickness of the insulating layer 3. In this way, the insulating portion 35 can be brought into light contact with the mounting surface 101 of the wiring board 110. For this reason, when removing the sheet material 1 from the electronic substrate 100, it becomes easier to grip the portion of the sheet material 1 where the insulating portion 35 is formed.

In addition, such an insulating portion 35 can be formed by the same method as the insulating layer 3, for example, may be formed by the same process as the insulating layer 3, and different from the insulating layer 3 You may make it form by process.

Also in the fifth embodiment as described above, the same actions and effects as in the first embodiment are exhibited.

In addition, as shown in Fig. 8, a plurality of teeth 24 formed at intervals from each other along the edges of the substrate 2 are provided, and insulated on the lower surface of each teeth 24 You may make it provide the part 35. That is, along the edge of the substrate 2, a plurality of insulating portions 35 may be provided at intervals from each other. According to this configuration, the electronic substrate 100 can be accommodated in the case of the electronic device in a state where the tooth portion 24 is folded and bent. For this reason, it is possible to prevent the ear part 24 from being disturbed in the assembly work of the electronic device.

In addition, from the viewpoint of triggering an operation to be removed at the time of recycling of the electronic substrate 100, only one tooth portion 24 (insulation portion 35) may be provided.

<Sixth Embodiment>

Next, a sixth embodiment of the present invention will be described.

9 is a longitudinal sectional view showing the configuration of an end portion of an electronic element according to a sixth embodiment. Hereinafter, a sixth embodiment will be described, but a description will be given focusing on differences from the first embodiment, and the description will be omitted for similar matters. In addition, in the following, for convenience of explanation, the upper side in FIG. 9 is referred to as "upper" and the lower side is referred to as "lower".

As shown in Fig. 9(a), the sheet material 1 of the sixth embodiment includes a substrate 2 made of a metal film and an insulating layer 3 provided on the lower surface (one side) of the substrate 2 Eggplant is a two-tiered structure. Further, on the upper surface of the ground wiring 113, a plurality of conductive pins 114 are provided at predetermined intervals along the long direction of the ground wiring 113. Each of the conductive pins 114 is arranged with a needle wire (top) facing upward.

According to this configuration, when the sheet material 1 is laminated on the electronic substrate 100, the exposed region 2a of the substrate 2 is pierced with the conductive pin 114 and brought into contact with the ground wiring 113. Thereby, while the base material 2 is grounded, the sheet material 1 and the electronic board 100 can be fixed. Therefore, in this embodiment, a ground portion is constituted by the ground wiring 113 and the conductive pin 114.

Further, the conductive pin 114 may be formed integrally with the ground wiring 113. Further, the ground wiring 113 may be omitted and the conductive pin 114 may be directly grounded. Such a conductive pin 114 can be formed using the same metal as the metal inserted into the conductive particles 22 of the first embodiment.

In addition, as shown in Fig. 9(b), after the exposed region 2a of the substrate 2 is brought into contact with the ground wiring 113, the exposed region 2a is connected to the wiring board 110 by conductive pins 114. ) (Substrate 111).

Also in the sixth embodiment as described above, the same actions and effects as in the first embodiment are exhibited. In addition, it goes without saying that the sheet member 1 may have the same configuration as the sheet member 1 of the first to fifth embodiments.

<Seventh embodiment>

Next, a seventh embodiment of the present invention will be described.

Fig. 10 is an enlarged cross-sectional view showing the configuration of a sheet material according to the seventh embodiment (a state before being bonded to an electronic substrate). Hereinafter, a seventh embodiment will be described, but a description will be given focusing on differences from the first embodiment, and the description will be omitted for similar matters. In addition, in the following, for convenience of explanation, the upper side in FIG. 10 is referred to as "upper" and the lower side is referred to as "lower".

The sheet member 1 of the seventh embodiment is the same as that of the first embodiment except that the configuration of the base material 2 is different. That is, as shown in FIG. 10, the base material 2 of the seventh embodiment includes a lower layer (first part) 2X provided in contact with the insulating layer 3, and the upper (insulating layer) 2X. It has an upper layer (second part) (2Y) installed on the opposite side of (3).

The lower layer 2X contains a resin (first resin) 25, and the conductive particles (first conductive particles) 26 dispersed in the resin 25, and the upper layer 2Y contains a resin (second resin). (21) and electroconductive particle (second electroconductive particle) 22 dispersed in this resin 21 are contained. In addition, the content in the upper layer 2Y of the electroconductive particle 22 is set to be greater than the content in the lower layer 2X of the electroconductive particle 25.

With such a configuration, high electromagnetic wave shielding properties can be exhibited to the upper layer 2Y, and adhesiveness can be imparted to the lower layer 2X depending on the type of the resin 25 or the like. Therefore, when laminating the sheet material 1 of the present embodiment on the electronic substrate 100, by using the adhesiveness of the lower layer 2X, the exposed area 2a of the sheet material 1 (substrate 2) is It can be fixed by adhering to the ground wiring 113.

For this reason, as in the first embodiment, the operation of heat-pressing the sheet material 1 to the electronic substrate 100 is omitted, that is, the sheet material 1 is transferred to the electronic substrate 100 manually by an operator. It can stick. Accordingly, the production efficiency of the electronic substrate 100 can be improved. In addition, since the heating and compression bonding can be omitted, the semiconductor chip 120 can be prevented from deteriorating due to heating at this time, and the electronic element 10 with higher reliability can be obtained.

As the resin 25, from the viewpoint of imparting high tackiness by the lower layer 2X, a resin having a glass transition temperature of 0°C or less (including rubber) is preferable, and a resin having a glass transition temperature of -10°C or less ( Rubber) is more preferable, and a resin (including rubber) having a glass transition temperature of -20°C or less is still more preferable. Specific examples of such resins (including rubber) include, for example, various resins such as acrylic resins and urethane resins, various rubbers such as natural rubber and synthetic rubber, and various thermoplastic elastomers such as styrene block copolymers. . Further, the lower layer 2X may contain a curing agent similar to that described in the first embodiment.

Although the lower layer 2X may have either isotropic conductivity or anisotropic conductivity, it is preferable to have anisotropic conductivity. Thereby, the current flowing in the upper layer 2Y can be smoothly transmitted through the ground wiring 113 through the lower layer 2X, and the electromagnetic shielding effect of the substrate 2 (sheet material 1) is more suitably exhibited. do. As the conductive particles 26 dispersed in the resin 25, particles of the same type and average particle diameter as the conductive particles 22 described in the first embodiment can be used.

The shape of the electroconductive particle 26 can also be made into the same shape as the electroconductive particle 22 described in the said 1st Embodiment, but it is preferable that it is a resin shape or spherical shape. If it is the dendritic or spherical electroconductive particle 26, the content in the lower layer 2X is relatively at least, and necessary and sufficient electroconductivity can be provided to the lower layer 2X. Moreover, by making the content in the lower layer 2X of the electroconductive particle 26 into a small amount, the adhesiveness of the lower layer 2X can be improved more. Moreover, by using the resinous or spherical electroconductive particle 26, it becomes easy to impart anisotropic conductivity to the lower layer 2X. Moreover, the dendritic electroconductive particle 26 and the spherical electroconductive particle 26 may use only either one of these, and may be used combining both.

The content in the lower layer 2X of the electroconductive particle 26 is preferably 1 to 100 parts by weight, and more preferably 10 to 50 parts by weight with respect to 100 parts by weight of the resin 25. By making the content in the lower layer 2X of the electroconductive particle 26 into the said range, necessary and sufficient electroconductivity can be provided to the lower layer 2X, and the electromagnetic wave shielding effect of the base material 2 can be fully improved. Moreover, since the fluidity of the resin composition containing the resin 25 and the electroconductive particle 26 becomes high, and it becomes easier to form the lower layer 2X, it is preferable.

On the other hand, the resin 21 and the conductive particles 22 contained in the upper layer 2Y provided on the lower layer 2X can have the same configuration as described in the first embodiment. Further, the upper layer 2Y may contain a curing agent similar to that described in the first embodiment.

The upper layer 2Y may also have either isotropic conductivity or anisotropic conductivity, but it is preferable to have isotropic conductivity. Thereby, electromagnetic waves can be reliably captured by the upper layer 2Y, and the converted current can be quickly transmitted to the lower layer 2X. In particular, by making the lower layer 2X an anisotropic conductivity that is different from the isotropic conductivity of the upper layer 2Y, different roles can be assigned to the lower layer 2X and the upper layer 2Y, and the base material 2 (sheet material 1 )), the electromagnetic shielding effect is more appropriately exhibited.

From the viewpoint of imparting isotropic conductivity to the upper layer 2Y, it is preferable that the shape of the electroconductive particle 22 is a shape different from that of the electroconductive particle 26 (particularly, a flake shape). If it is the flake-shaped electroconductive particle 22, the upper layer 2Y can contain the electroconductive particle 22 in a large amount, and can have sufficient isotropic conductivity.

The content in the upper layer 2Y of the conductive particles 22 is preferably 100 to 1500 parts by weight, and more preferably 100 to 1000 parts by weight with respect to 100 parts by weight of the resin 21. By setting the content in the upper layer 2Y of the electroconductive particle 22 in the above range, necessary and sufficient conductivity can be provided to the upper layer 2Y, and the electromagnetic wave shielding effect of the substrate 2 can be sufficiently increased. Moreover, since the fluidity of the resin composition containing the resin 21 and the electroconductive particle 21 becomes high, and it becomes easier to form the upper layer 2Y, it is preferable.

In addition, in the base material 2 of the present embodiment, when the average thickness of the lower layer 2X is Tx [µm] and the average thickness Ty [µm] of the upper layer 2Y, such a ratio Ty/Tx is: Although it does not specifically limit, it is preferable that it is about 1 to 7.5, and it is more preferable that it is about 2-5. By setting the ratio Ty/Tx to the above range, the substrate 2 exhibiting a higher electromagnetic shielding effect can be obtained. Specifically, the average thickness of the lower layer 2X is preferably about 0.5 to 150 µm, more preferably about 1.5 to 25 µm, and the average thickness of the upper layer 2Y is about 1.5 to 350 µm. It is preferable, and it is more preferable that it is about 3.5-75 micrometers.

Further, the upper layer 2Y may be formed of a metal film similar to that described in the third and sixth embodiments.

An insulating layer 3 is provided on the lower surface of the substrate 2 (the surface on the electronic substrate 100 side). This insulating layer 3 is formed using a resin composition containing the same resin 21 and a curing agent as the upper layer 2Y in addition to having the same configuration as described in the first or second embodiment. can do. In addition, the insulating layer 3 may or may not have adhesiveness.

As described above, the sheet material 1 of the present embodiment is preferably adhered to the electronic substrate 100 manually by an operator. At this time, if the insulating layer 3 has adhesiveness, the positioning of the sheet material 1 with respect to the electronic substrate 100 can be easily performed, and thus the production efficiency of the electronic device 10 can be further improved. On the other hand, if the insulating layer 3 does not have adhesiveness, it is easy to remove from the electronic substrate 100 even if the sheet material 1 is adhered to the electronic substrate 100 once, and the sheet material 1 is easily removed from the electronic substrate 100. It is possible to easily perform position correction.

In addition, when at least one of the lower layer 2X, the upper layer 2Y, and the insulating layer 3 is in a semi-cured state and/or a gel state, the sheet material 1 is fixed to the electronic substrate 100 (lamination). After that, the layer in this state may be post-cured. Thereby, the sheet material 1 can be bonded to the electronic substrate 100 and the mechanical strength of the sheet material 1 can be improved.

For example, the lower layer (2X), a resin (including rubber) having a glass transition temperature of 0°C or less, and a first curing agent capable of advancing the curing reaction at a relatively low temperature as described in the first embodiment. Wow, when formed using a resin composition containing a second curing agent capable of advancing a curing reaction at a higher temperature than the first curing agent and the conductive particles 26, prior to use of the sheet material 1, the first curing agent is The lower layer 2X is made into a gel state (semi-solid state) by the action, and the sheet material 1 is fixed (laminated) to the electronic substrate 100, and then post-cured, by the action of the second curing agent. ) Can be made into a solid state.

In addition, the sheet material 1 is a resin composition constituting each layer in the same manner as in the first embodiment, the hard coat layer 4, the upper layer 2Y, the lower layer 2X, and the insulating layer 3 in sequence. Can be formed by coating and manufactured. In addition, in this embodiment, since the lower layer 2X has adhesiveness, the sheet material 1 has prepared a laminate in which the hard coat layer 4, the upper layer 2Y, and the lower layer 2X are laminated in advance, You may manufacture by bonding the separately created insulating layer 3 to the lower layer 2X of a laminated body.

Also in the seventh embodiment as described above, the same actions and effects as in the first embodiment are exhibited.

In addition, one or more intermediate layers for any purpose may be provided between the lower layer 2X and the upper layer 2Y. Examples of such an intermediate layer include an adhesion layer for improving the adhesion between the lower layer 2X and the upper layer 2Y, the metal film 23 of the third embodiment, and the like. In the case of providing an adhesive layer as an intermediate layer, it is preferable that such an adhesive layer is constituted by, for example, a mixture of a resin composition constituting the lower layer 2X and a resin composition constituting the upper layer 2Y.

As mentioned above, although the electronic element and the sheet material of this invention were demonstrated based on the illustrated embodiment, this invention is not limited to these. For example, each part constituting the electronic element and the sheet material can be replaced with an arbitrary configuration capable of exhibiting the same function. In addition, an arbitrary structure may be added.

In addition, the electronic element and the sheet material may be combined with any of the configurations of the first to seventh embodiments. In addition, although the sheet material of each of the above embodiments has a hard coat layer (protective layer), a hard coat layer (protective layer) may be provided as necessary or may be omitted. In addition, the ground portion should be capable of grounding (connecting at a reference potential) the base material of the sheet material, and the shape or shape is not particularly limited.

In addition, the sheet material may have one insulating layer, and may be configured to cover all electronic components with one insulating layer, or may be configured to cover one electronic component with one sheet material.

*In addition, in each portion (each layer) constituting the sheet material, when bonding (laminating) to an electronic substrate, there is also a portion extending slightly, but when the thickness of each portion is defined as an average value (average thickness), the value is: It is almost the same before and after bonding to the electronic substrate.

(Industrial availability)

The electronic device of the present invention includes a wiring board having a mounting surface, an electronic board having a plurality of electronic components mounted on the mounting surface of the wiring board, and a sheet-like substrate laminated on the electronic board and having conductivity And, a sheet material provided on the side of the electronic substrate of the substrate and having at least one insulating layer having a size including at least one of the electronic components, and at the same time as grounding the substrate of the sheet material, the sheet It has a ground portion fixing the material and the electronic substrate. Thereby, it is easy to remove heat generation from an electronic component, and it is possible to provide a thin, highly reliable electronic element. Therefore, the present invention has industrial applicability.

1 sheet material
2 description
2a exposed area
2X lower floor
2Y upper floor
20 Body
21 resin
22 conductive particles
23 metal film
24 two parts
25 resin
26 conductive particles
3 insulation layer
3a first insulating layer
3b second insulating layer
3c third insulating layer
31 Suzy
32 thermally conductive particles
33 First Area
34 second area
35 Insulation
4 hard coat layer
10 electronic elements
100 electronic board
110 wiring board
101 mounting surface
101a 1st mounting area
101b 2nd mounting area
101c 3rd mounting area
111 substrate
112 wiring
113 ground wiring
114 conductive pin
120 semiconductor chips

Claims (18)

An electronic board including a wiring board having a mounting surface, and a plurality of electronic components mounted on the mounting surface of the wiring board,
A sheet material laminated on the electronic substrate, wherein the sheet material is a sheet-like substrate having conductivity and at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one electronic component And a ground portion for fixing the sheet material and the electronic substrate while grounding the substrate of the sheet material to the electronic substrate,
The substrate includes a cured product of a curable resin and conductive particles dispersed in the cured product, and the exposed region exposed from the insulating layer of the substrate is directly bonded to the ground part, and at the same time, exhibits an electromagnetic shielding effect,
The substrate is provided in contact with the insulating layer, the first part containing the first conductive particles, the first part is provided on the opposite side of the insulating layer, the first part of the first part of the conductive particles An electronic device having a second portion containing the second conductive particles in an amount greater than the content.
The method of claim 1,
The average thickness of the substrate is 5 to 100 ㎛, electronic device.
The method of claim 1,
The ground portion includes a ground wiring installed on the mounting surface side of the wiring board,
The electronic device, wherein the insulating layer has a size smaller than that of the substrate in plan view.
The method of claim 3,
The mounting surface of the wiring board is partitioned by the ground wiring, and includes a plurality of mounting regions for mounting the predetermined electronic component,
The at least one insulating layer includes an insulating layer provided corresponding to the plurality of mounting regions.
The method of claim 1,
The substrate is a body portion comprising a cured product of the curable resin and the conductive particles, and
An electronic device comprising a metal film installed in contact with the main body.
delete The method of claim 1,
The insulating layer is an electronic device comprising a resin and thermally conductive particles dispersed in the resin and having a higher thermal conductivity than the thermal conductivity of the resin.
The method of claim 1,
An electronic device further comprising a protective layer provided on a side opposite to the electronic substrate of the substrate and having a function of protecting the substrate.
The method of claim 1,
The sheet material further has at least one insulating portion provided separately from the insulating layer on the electronic substrate side of the edge portion of the substrate.
The method of claim 9,
The electronic device, wherein the edge portion and the insulating portion of the substrate constitute a holding portion that is gripped when separating the sheet material from the electronic substrate.
A sheet material laminated on an electronic board including a wiring board having a mounting surface and a plurality of electronic components mounted on the mounting surface of the wiring board,
The sheet material is used to be fixed to the electronic substrate by interposing a ground portion,
A sheet-like substrate having conductivity in contact with the ground portion in a state in which the sheet material is laminated on the electronic substrate, and
In a state in which the sheet material is stacked on the electronic substrate, it has at least one insulating layer positioned on the electronic substrate side of the substrate and having a size including at least one electronic component,
The substrate includes a cured product of a curable resin and conductive particles dispersed in the cured product, and the exposed region exposed from the insulating layer of the substrate is directly bonded to the ground part, and at the same time, exhibits an electromagnetic shielding effect. ,
The substrate has a first portion installed in contact with the insulating layer and having adhesiveness, and a second portion disposed on the first portion opposite to the insulating layer,
The first portion contains a first resin and first conductive particles dispersed in the first resin, and the second portion contains a second resin and a content of the first conductive particles in the second resin in the first portion A sheet material comprising the second conductive particles dispersed in a larger amount.
The method of claim 11,
The average thickness of the substrate is 5 to 100 ㎛, sheet material.
delete delete The method of claim 11,
The content of the first conductive particles in the first portion is 1 to 100 parts by weight based on 100 parts by weight of the first resin.
The method of claim 11,
The content of the second conductive particles in the second portion is 100 to 1500 parts by weight based on 100 parts by weight of the second resin.
The method of claim 11,
A sheet material in which the shape of the first conductive particles and the shape of the second conductive particles are different.
The method of claim 11,
The shape of the first conductive particles is a resin or spherical sheet material.

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