KR20120078080A - Anisotropic conductive film - Google Patents

Abstract

PURPOSE: An anisotropic conductive film is provided to have excellent adhesion and improved reliability, to improve adhesion with a substrate without degrading physical properties like moisture permeability, reliability, etc. CONSTITUTION: An anisotropic conductive film comprises one or more kinds selected from a group consisting of a conductive adhesive layer, and an insulating adhesive layer. On the one side or both sides of the conductive adhesive film or the insulating adhesive layer, a layer comprising a silane coupling agent is laminated. A manufacturing method of the anisotropic conductive film comprises: a step of forming a conductive adhesive layer by spreading a composition for forming the conductive adhesive layer on a base film; and a step of spraying solution comprising the silane coupling agent on the conductive adhesive layer, and drying the sprayed solution.

Description

Anisotropic conductive film

The present invention relates to an anisotropic conductive film. More specifically, the present invention relates to an anisotropic conductive film which improves the adhesion and pressure adhesion of the anisotropic conductive film and improves reliability by forming a layer containing a silane coupling agent on one or both surfaces of the anisotropic conductive film.

The anisotropic conductive film refers to a film-like adhesive obtained by dispersing conductive particles such as metal particles such as nickel and gold or polymer particles coated with such metals. When the anisotropic conductive film is positioned between the circuits to be connected and heated and pressurized under certain conditions, the circuit terminals are electrically connected by conductive particles, and an insulating adhesive resin is formed at a pitch between adjacent circuits. Filling causes conductive particles to be independent of each other, thereby providing high insulation.

In the case of an anisotropic conductive film used as a connection material of a display device panel, the first substrate circuit and the second substrate circuit should be electrically connected and the two substrates should be able to be connected with a predetermined level or more of adhesive force. For this purpose, the anisotropic conductive film basically consists of conductive particles and an insulating resin. The conductive particles are in the form of carbon fibers, solder balls, or the like, and are currently used with nickel, silver balls, or spherical resin particles coated with nickel, gold, or palladium or insulated thereon. As the insulating resin, the two substrates of different materials may be bonded by heat curing or ultraviolet curing using an acrylic adhesive system or an epoxy adhesive system.

The anisotropic conductive film may further include a silane coupling agent in addition to the conductive particles and the insulating resin in order to further secure a high adhesive strength in addition to the insulating resin in the adhesion of the substrate. The silane coupling agent may be used to increase the adhesion of an anisotropic conductive film to a glass substrate or an IC chip by chemically bonding with a substrate including silicon such as silicon, glass, silicon nitride, or the like.

It is generally known to include a silane coupling agent together with an insulating resin in the manufacturing process of the anisotropic conductive film. However, since the physical properties such as moisture permeability and reliability of the anisotropic conductive film may be lowered when included at a predetermined concentration or more, there is a limit in the amount of addition for adhesion to the substrate. Generally the silane coupling agent is included in an amount of up to 3% by weight. For this reason, there exists a problem that it is difficult to add a silane coupling agent further, even when the adhesive force of an anisotropic conductive film does not reach a target value.

An object of the present invention is to provide an anisotropic conductive film having high adhesion to a substrate and improved reliability.

Another object of the present invention is to provide an anisotropic conductive film which does not lower physical properties such as moisture permeability and reliability of the film while increasing adhesion to the substrate.

An anisotropic conductive film, which is an aspect of the present invention, includes at least one selected from the group consisting of a conductive adhesive layer and an insulating adhesive layer, and a layer containing a silane coupling agent is laminated on one or both surfaces of the conductive adhesive layer or the insulating adhesive layer. Can be.

In one embodiment, the anisotropic conductive film may include the conductive adhesive layer and a layer including the silane coupling agent may be stacked on one or both surfaces of the conductive adhesive layer.

In an embodiment, the anisotropic conductive film may have the insulating adhesive layer laminated on the conductive adhesive layer, and the layer including the silane coupling agent may be laminated on one or more surfaces selected from the group consisting of the conductive adhesive layer and the insulating adhesive layer. have.

In one embodiment, the silane coupling agent may be a silane coupling agent having at least one member selected from the group consisting of a polymerizable unsaturated group, an epoxy group and an amino group.

In one embodiment, the conductive adhesive layer and the insulating adhesive layer may or may not include a silane coupling agent.

In one embodiment, at least one member selected from the group consisting of a conductive adhesive layer and an insulating adhesive layer may include 3% by weight or less of a silane coupling agent.

Another method of manufacturing an anisotropic conductive film of the present invention comprises spraying a solution containing a silane coupling agent on the base film to form a layer comprising the silane coupling agent; And applying a composition for forming a conductive adhesive layer on the layer including the silane coupling agent and drying the composition.

Another aspect of the present invention is a method for producing an anisotropic conductive film is a step of forming a conductive adhesive layer by applying a composition for forming a conductive adhesive layer on a base film; And spraying and drying a solution including a silane coupling agent on the conductive adhesive layer.

In one embodiment, the method may further include removing the base film and spraying a solution including a silane coupling agent.

The present invention provides an anisotropic conductive film having high adhesion to a substrate and improved reliability. In addition, the present invention provides an anisotropic conductive film that does not lower the physical properties of the film while increasing the adhesion to the substrate.

1 and 2 show an anisotropic conductive film according to an embodiment of the present invention.
3 to 5 show an anisotropic conductive film according to another embodiment of the present invention.
1: conductive particles, 2: conductive adhesive layer, 3,3 ': layer comprising silane coupling agent, 4: insulating adhesive layer

The anisotropic conductive film which is one aspect of this invention contains 1 or more types chosen from the group which consists of a conductive adhesive layer and an insulating adhesive layer, and the layer containing a silane coupling agent is laminated | stacked on the one or both surfaces of the said conductive adhesive layer or an insulating adhesive layer. .

In one embodiment, the anisotropic conductive film includes a conductive adhesive layer, and a layer including a silane coupling agent is laminated on one or both surfaces of the conductive adhesive layer. 1 and 2 show one specific example of the anisotropic conductive film. In the anisotropic conductive film, a layer 3 containing a silane coupling agent may be formed on one surface of the conductive adhesive layer 2 containing the conductive particles 1. In the anisotropic conductive film, layers 3 and 3 'containing a silane coupling agent may be formed on both surfaces of the conductive adhesive layer 2 containing the conductive particles 1.

In another embodiment, the anisotropic conductive film includes a conductive adhesive layer and an insulating adhesive layer, and a layer including a silane coupling agent is laminated on one surface of the conductive adhesive layer and the insulating adhesive layer. 3 to 5 show another specific example of the anisotropic conductive film. In the anisotropic conductive film, an insulating adhesive layer 4 is laminated on the conductive adhesive layer 2 including the conductive particles 1, and a layer containing a silane coupling agent on one surface of the conductive adhesive layer 2 or the insulating adhesive layer 4 ( 3) may be formed. In addition, the anisotropically conductive film has the insulating adhesive layer 4 laminated | stacked on the conductive adhesive layer 2 containing the electroconductive particle 1, and includes the silane coupling agent in the one surface of the conductive adhesive layer 2 and the insulating adhesive layer 4. Layers 3 and 3 'may be formed.

In another embodiment, the anisotropic conductive film comprises a conductive adhesive layer, a first insulating adhesive layer and a second insulating adhesive layer, the conductive adhesive layer is laminated on the first insulating adhesive layer, the second insulating adhesive layer is laminated on the conductive adhesive layer, A layer containing a silane coupling agent may be stacked on one or more surfaces selected from the group consisting of a first insulating adhesive layer and a second insulating adhesive layer.

In the anisotropic conductive film, the layer including the silane coupling agent may be 10% or less or 0.001-2 μm of the thickness of the conductive adhesive layer or the insulating adhesive layer. Within this range, it is possible to obtain the effect of raising the adhesive force only within the limit of maintaining the physical properties of the anisotropic conductive adhesive film.

The silane coupling agent in the layer comprising the silane coupling agent may be a silane coupling agent having at least one member selected from the group consisting of a polymerizable unsaturated group, an epoxy group and an amino group. For example, the silane coupling agent is 3-glycidoxy propylmethyl dimethoxysilane, 3-glycidoxy propylmethyl trimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl trimethoxysilane, vinyl trimeth Methoxy silane, vinyl triethoxy silane, (meth) acryloxy propyl trimethoxysilane, 3-aminopropyl trimethoxysilane, N- (2-aminoethyl) -3-aminopropyl trimethoxysilane, N- ( It may be one or more selected from the group consisting of 2-aminoethyl) -3-aminopropyl methyl dimethoxysilane and 3-chloro propyl trimethoxysilane, but is not limited thereto.

The layer containing the silane coupling agent may be formed from a silane coupling agent alone, a solution in which the silane coupling agent is dissolved, or a solution containing a silane coupling agent, a low molecular weight resin and a solvent. The low molecular weight resin may have a weight average molecular weight of 300-10,000 g / mol, but is not limited thereto. Specific examples of the resin of low molecular weight may be at least one selected from the group consisting of biphenyl-type epoxy and novolak type epoxy, but, not limited to this. Examples of the solvent include methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, acetone, diacetone alcohol or polyhydric alcohol, ether as methyl cellosolve, ethyl cellosolve, butyl cellosolve or cellosolve acetate, and esters. Methyl acetate, ethyl acetate or butyl acetate, chloroform, methylene chloride or tetrachloroethane as halogenated hydrocarbons, nitromethane, acetonitrile, N-methylpyrrolidone, N, N-dimethylformamide as nitrogen-containing compounds, and these One or two or more of them may be used in combination, but is not limited thereto.

The layer containing the silane coupling agent may be prepared by applying a solution containing the silane coupling agent to an anisotropic conductive film made of a conductive adhesive layer or an insulating adhesive layer, or by applying a pretreatment method on a release film to which the film is coated. It may also be prepared.

Hereinafter, the conductive adhesive layer and the insulating adhesive layer in the anisotropic conductive film of the present invention will be described in detail.

Conductive Adhesive Layer

The conductive adhesive layer may include a binder portion, a cured portion, conductive particles, hydrophobic nano silica, and a curing agent.

The binder portion may be a polymer resin commonly known in the art, for example, phenoxy, epoxy, acrylonitrile, styrene-acrylonitrile, methyl methacrylate-butadiene-styrene, butadiene, acrylic , Urethane-based, polyamide-based, olefin-based and silicone-based resins may be used. Preferably, a phenoxy clock polymer resin can be used. The phenoxy clock polymer resin may be one or more selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolak type epoxy resins, and cresol novolak type epoxy resins, but is not limited thereto. .

The polymer resin constituting the binder portion may have a weight average molecular weight of 1,000-1,000,000 g / mol. Within this range, film molding can be performed properly and compatibility with the epoxy resin and the like participating in the curing reaction does not occur phase separation occurs.

The binder part may be included in an amount of 10-40 wt% based on solids in the conductive adhesive layer. Within this range, film formation can be performed properly and the flowability is not lowered under high temperature / high pressure conditions so that the conductive particles can be sufficiently connected.

A hardening part hardens | cures reaction and ensures the adhesive force and connection reliability between connection layers. The hardening unit may use one or more radically curable units selected from monofunctional or polyfunctional (meth) acrylate oligomers and monomers. Preferably bifunctional (meth) acrylate monomers or oligomers can be used.

Although the hardening part is not specifically limited, Bisphenols, such as 2-bromohydroquinone, resorcinol, catechol, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, as an epoxy (meth) acrylate type, 4 Those having a skeleton such as 4'-dihydroxybiphenyl, bis (4-hydroxyphenyl) ether, alkyl group, aryl group, methylol group, allyl group, cyclic aliphatic group, halogen (tetrabromobisphenol A), (Meth) acrylate oligomers or polycyclic aromatic ring-containing epoxy resins composed of nitro groups or the like can be used.

The hardened part may be included in an amount of 10-50% by weight based on solids in the conductive adhesive layer.

Electroconductive particle is a filler for giving electroconductive performance, As electroconductive particle, Metal particle containing gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, etc .; carbon; Resin including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like, and modified resin thereof include gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, and the like. Coated with metal; Insulated electroconductive particle etc. which coated and added the insulating particle on it can be used 1 or more types.

The conductive particles may be included in 1-40% by weight based on solids in the conductive adhesive layer. Within this range, stable conductivity is given to the circuit according to the area of the electrode to be energized. Preferably it may be included in 5-30% by weight.

The size of the conductive particles is not particularly limited, but the diameter may be 1 μm to 20 μm for adhesion and connection reliability.

Hydrophobic nano-silica induces smooth control of flow characteristics different from process conditions and hardening structure of hardened anisotropic conductive film to prevent expansion at high temperature, thereby exhibiting excellent initial adhesion and low connection resistance, The connection and adhesion reliability can be maintained even under high temperature / high humidity and thermal shock conditions to provide an anisotropic conductive film with excellent long term reliability.

Hydrophobic nano silica particles are particles having a size of 5-20 nm and a specific surface area of 100-300 m 2 / g surface-treated with an organic silane. The silica particles may be used by mixing one or more selected from the group consisting of Aerosil R-812, Aerosil R-972, Aerosil R-805, Aerosil R-202, Aerosil R-8200 (above Degussa), It is not limited.

The organic silanes that hydrophobically modify the surface of the nano silica particles include vinyl trichlorosilane, vinyl trimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, dimethyldichlorosilane, From the group consisting of all organic silanes such as octylsilane, hexamethyldisilazane, octamethylchlorotetrasiloxane, polydimethylsiloxane, 2-aminoethyl-3-aminopropylmethyldimethoxysilane and 3-ureidopropyltriethoxysilane It may be one or more selected.

Hydrophobic nano silica particles may be included in 0.1-10% by weight based on solids in the conductive adhesive layer. Within this range, the conductive particles can be sufficiently brought into contact with each other when connected to the substrate without deteriorating the adhesive strength and the reliability after curing.

The latent curing agent is not particularly limited but may include a thermosetting agent for epoxy. The thermosetting agent for epoxy can be used without limitation so long as it is a thermosetting agent of the conventionally known epoxy curing type. As a specific example, an imidazole series, an acid anhydride, an amine series, a hydrazide series, a cation hardening | curing agent, etc. can be used individually or in mixture of 2 or more types.

The latent curing agent may be included in an amount of 5-30% by weight based on solids in the conductive adhesive layer.

The conductive adhesive layer may or may not contain a silane coupling agent. When the conductive adhesive layer includes a silane coupling agent, the content thereof is not particularly limited, but may be added in an amount of 3 wt% or less in the conductive adhesive layer. Within this range, the moisture permeability, adhesion, pressure adhesion and reliability of the anisotropic conductive film do not deteriorate. The silane coupling agent can use 1 or more types chosen from the kind described above.

The thickness of the conductive adhesive layer is not particularly limited, but may be preferably 4-15 μm.

Insulating adhesive layer

The insulating adhesive layer may include a binder portion, a curing portion, hydrophobic silica, and a curing agent.

The binder portion may preferably comprise a thermoplastic resin. As the thermoplastic resin, at least one selected from the group consisting of acrylonitrile, phenoxy, butadiene, acryl, urethane, polyamide, olefin, silicone and NBR (Nitrile butadiene rubber) resins can be used. It is not limited to these.

The thermoplastic resin preferably has a weight average molecular weight of 1,000-1,000,000 g / mol. Within this range, the film may have an appropriate film strength, no phase separation occurs, and the adhesion to the adherend is poor, and thus the adhesion does not decrease.

The binder part may be included in an amount of 10-30% by weight based on solids in the insulating adhesive layer. Within the above range, the film formability is excellent while

The hardening part can use 1 or more types chosen from the group which consists of a (meth) acrylate oligomer and a (meth) acrylate monomer. The (meth) acrylate oligomer is not particularly limited, but the intermediate molecular structure as the epoxy (meth) acrylate type is 2-bromohydroquinone, resorcinol, catechol, bisphenol A, bisphenol F, bisphenol AD, bisphenol S and the like. Bisphenols, 4,4'-dihydroxybiphenyl, bis (4-hydroxyphenyl) ether and the like, alkyl groups, aryl groups, methylol groups, allyl groups, cyclic aliphatic groups, halogens (tetrabro) The (meth) acrylate oligomer which consists of mobisphenol A), a nitro group, etc. can be used. The (meth) acrylate monomer is not particularly limited, but 6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (Meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, 2-hydroxyalkyl (meth) acryloyl phosphate, 4-hydroxy Cyclohexyl (meth) acrylate, neopentyl glycol mono (meth) acrylate, trimethylol ethanedi (meth) acrylate, trimethylolpropanedi (meth) acrylate, pentaerythritol tri (meth) acrylate, dipenta Erythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerin di (meth) acrylate, T-hydrofurfuryl (meth) acrylate, iso Decyl (meta) Acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl ( Meth) acrylate, tridecyl (meth) acrylate, ethoxy addition type nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) Acrylate, t-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, ethoxy addition type Bisphenol-A di (meth) acrylate, cyclohexane dimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyl oxyethyl phosphate, dimethylol tricyclodecane di ( Meta) acrylate, It may be at least one selected from the group consisting of trimethylolpropanebenzoate acrylate, acid phosphoxy ethyl (meth) acrylate, 2-acryloyloxyethyl phthalate, and combinations thereof.

The hardened part may be included in an amount of 15 to 74 wt% based on solids in the insulating adhesive layer. It shows stable adhesion within the above range.

Details of the hydrophobic silica are as described above in the conductive adhesive layer.

Hydrophobic silica may be included in 1-15% by weight based on solids in the insulating adhesive layer.

The curing agent is as described in the above conductive adhesive layer. The curing agent may be included in an amount of 15 to 40% by weight based on solids in the insulating adhesive layer.

The insulating adhesive layer may or may not include a silane coupling agent. If the insulating adhesive layer includes a silane coupling agent, the content thereof is not particularly limited, but may be added in an amount of 3 wt% or less in the conductive adhesive layer. Within this range, the moisture permeability, adhesion, pressure adhesion and reliability of the anisotropic conductive film do not deteriorate. The silane coupling agent can use 1 or more types chosen from the kind described above.

Another aspect of the present invention relates to a method for producing the anisotropic conductive film.

In one embodiment, a method of manufacturing an anisotropic conductive film (method 1) comprises spraying a solution comprising a silane coupling agent on a base film to form a layer comprising the silane coupling agent; Applying a composition for forming a conductive adhesive layer on the layer including the silane coupling agent; And drying.

Although there is no restriction | limiting in particular as a base film, Polyolefin films, such as polyethylene, a polypropylene, ethylene / propylene copolymer, polybutene-1, ethylene / vinyl acetate copolymer, a mixture of polyethylene / styrene-butadiene rubber, and polyvinyl chloride, are mainly Can be used. In addition, polymers such as polyethylene terephthalate, polycarbonate, poly (methyl methacrylate), thermoplastic elastomers such as polyurethane and polyamide-polyol copolymers, and mixtures thereof can be used, but are not limited thereto. The thickness of the base film may be selected from an appropriate range, for example, may be 10-20㎛.

The solution containing the silane coupling agent is prepared by dissolving the silane coupling agent in a solvent capable of dissolving the silane coupling agent described above. The solvent may be one or more selected from the group consisting of alcohols and ethers, but is not limited thereto. The concentration of the silane coupling agent in the solution comprising the silane coupling agent may preferably be 5-20%.

There is no restriction | limiting in particular as a method of spraying the solution containing a silane coupling agent on a base film, Machines with fine spray nozzles that produce ultra-fine particle sizes can be used.

The composition for forming the conductive adhesive layer applied on the layer containing the silane coupling agent may include the binder portion, the hardened portion, the hydrophobic nano silica, and the conductive particles described above. The composition may include a solvent selected from the group consisting of toluene, xylene, propylene glycol monomethyl ether acetate, benzene, acetone, methyl ethyl ketone, tetrahydrofuran, dimethylformaldehyde and cyclohexanone for ease of application. have. In addition, a latent curing agent may be further included to cure the curing unit. The latent curing agent is not particularly limited but may include a thermosetting agent for epoxy. The thermosetting agent for epoxy can be used without limitation so long as it is a thermosetting agent of the conventionally known epoxy curing type. As a specific example, an imidazole series, an acid anhydride, an amine series, a hydrazide series, a cation hardening | curing agent, etc. can be used individually or in mixture of 2 or more types.

The drying method in the step of drying the composition for forming the conductive adhesive layer is not particularly limited, but may be dried at 60-80 ° C. for 3-10 minutes.

The method may further comprise the step of removing the base film and spraying and drying the solution containing the silane coupling agent. The drying method is not particularly limited in the step of drying the solution containing the silane coupling agent, it may be dried for 3-10 minutes at 60-80 ℃.

The method may further include applying an insulating adhesive layer-forming composition after applying the conductive adhesive layer-forming composition.

In another embodiment, a method (method 2) of manufacturing an anisotropic conductive film includes applying a composition for forming a conductive adhesive layer on a base film to form a conductive adhesive layer; And spraying and drying a solution including a silane coupling agent on the conductive adhesive layer. Details of the production method are the same as those described in the first method.

The method may further include applying a composition for forming an insulating adhesive layer after forming the conductive adhesive layer.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Specific specifications of the components used in the following examples and comparative examples are as follows.

1.Binder part: Bisphenol A epoxy resin (YP-50, Kukdo Chemical)

2. Curing part: Polycyclic aromatic ring-containing epoxy resin (HP4032D, Nippon Ink Chemical)

3.hydrophobic nano silica: nanosilica (R812, Degussa)

4.Potential curing agent: Imidazole type microcapsule type (HX3922HP, Asahi Kasei)

5.Conductive particle: Nickel coated polymer resin particle (Sekisui)

6.silane coupling agent: gamma-glycidoxypropyltrimethoxysilane

7.Silane surface treatment solution: A solution in which the binder portion and gamma-glycidoxypropyltrimethoxysilane are diluted to 10% concentration in a mixing ratio of 2: 1 in a solvent.

Example 1-2 Preparation of Anisotropic Conductive Films

A binder portion, a curing portion, silica, a latent curing agent, conductive particles and a silane coupling agent were added in the amounts shown in Table 1 below, and 50 parts by weight of a solvent (PGMEA) was mixed to prepare an anisotropic conductive film composition. The anisotropic conductive film composition was coated on a base film with a thickness of 20 μm, and 0.1 ml of the silane surface treatment solution was sprayed onto the film surface to disperse it. It was dried for 5 minutes at 70 ℃ to prepare an anisotropic conductive film.

Example 3 Preparation of Anisotropic Conductive Film

After spraying and dispersing 0.1 ml of the silane surface treatment solution onto the film surface on the base film, the conductive adhesive layer composition prepared in Example 1 was coated with 10 μm. It dried at 70 degreeC for 5 minutes, and prepared the conductive adhesive film.

In addition, a binder portion, a curing portion, silica, a latent curing agent and a silane coupling agent were added in the amounts described in Example 3 in Table 1 below, and 50 parts by weight of a solvent (PGMEA) was mixed to coat the insulating adhesive layer composition with 10 μm. After drying for 5 minutes at 70 ℃ was laminated with the conductive adhesive layer.

Comparative Example 1-3: Preparation of Anisotropic Conductive Film

In Example 1-2, the binder portion, the curing portion, silica, the latent curing agent, the conductive particles and the silane coupling agent were added in the amounts shown in Table 1, except that the silane surface treatment solution was not sprayed on the film surface. And the same method was carried out to produce an anisotropic conductive film.

Comparative Example 4: Preparation of Anisotropic Conductive Film

An anisotropic conductive film was prepared by the same method as in Comparative Example 1, except that the insulating adhesive layer prepared in Example 3 was laminated, but the silane surface treatment solution was not sprayed on the film surface. The units in Table 1 are parts by weight.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Conductive layer Conductive layer Conductive layer Insulation layer Conductive layer Conductive layer Conductive layer Conductive layer Insulation layer Binder section 16 15.5 16 30 16 15.5 13.5 16 30 Curing Part 16 15.5 16 30 16 15.5 13.5 16 30 Silica 4 4 4 2 4 4 4 4 2 Hardener 35 35 35 38 35 35 35 35 38 Conductive particles 29 29 29 0 29 29 29 29 0 Silane coupling agent 0 One 0 0 0 One 5 0 0 Silane Surface Treatment ○ ○ ○ ○ X X X X X all 100 100 100 100 100 100 100 100 100

Experimental Example: Measurement of physical properties of anisotropic conductive film

The physical properties described in Table 2 below were measured for the anisotropic conductive films prepared in Examples and Comparative Examples, and the results are shown in Table 2 below.

<Measurement method of physical property>

1. Adhesion and Reliability: The anisotropic conductive films prepared in Examples and Comparative Examples were left at 25 ° C. for 1 hour. A glass substrate with an indium tin oxide (ITO) circuit having a bump area of 2500 μm 2 and a thickness of 2000 μs and a chip having a bump area of 2000 μm 2 and a thickness of 0.5 mm were pressed and heated at a temperature of 210 ° C. and a pressure of 70 MPa for 3.5 seconds. Six pieces per sample were adhered. The adhesion of the finished sample was measured at 25 ° C. by using a shear gauge (Dage-4000 Die Shear Tester) of Dage, the initial adhesion was measured by a shear (shear) adhesion measurement method. In order to evaluate the reliability, the anisotropic conductive film was placed at 85 ° C. under a high temperature and high humidity of 85% of relative humidity, and then the film was taken out to measure adhesive strength in the same manner as described above.

2. Pressure adhesion: The lowest pressure possible temperature was measured to evaluate the pressure adhesion. Pressing temperature is based on the temperature measured by inserting a thermocouple between the ACF and the glass substrate. A glass substrate having an indium tin oxide (ITO) circuit having a bump area of 2500 mu m 2 and a thickness of 2000 mu m is used. The anisotropic conductive film prepared in the above Examples and Comparative Examples were pressed at a temperature of 30 ° C., 40 ° C., 50 ° C., 60 ° C., 70 ° C., and 80 ° C. for 1 second using a pressure-adhesive single-actuator. The lowest of the temperatures was recorded.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Initial Adhesion (MPa) 27 38 34 8 29 30 9 Reliability Adhesion (MPa) 25 33 30 4 24 18 3 Minimum Pressurization Temperature (℃) 40 40 40 60 60 50 60

As shown in Table 2, the anisotropic conductive film of the present invention can improve the adhesion, pressure adhesion of the anisotropic conductive film and increase the reliability. On the other hand, Comparative Examples 1-4, which do not include a silane coupling agent on the surface, it can be seen that the adhesion, pressure adhesion and reliability all lowered.

Claims (17)

An anisotropic conductive film comprising at least one member selected from the group consisting of a conductive adhesive layer and an insulating adhesive layer, wherein a layer containing a silane coupling agent is laminated on one or both surfaces of the conductive adhesive layer or the insulating adhesive layer.
The anisotropic conductive film of claim 1, wherein the anisotropic conductive film comprises the conductive adhesive layer, and a layer containing the silane coupling agent is laminated on one or both surfaces of the conductive adhesive layer.
The method of claim 1, wherein the anisotropic conductive film is laminated with the insulating adhesive layer on the conductive adhesive layer, and a layer containing the silane coupling agent is laminated on at least one surface selected from the group consisting of the conductive adhesive layer and the insulating adhesive layer. There is an anisotropic conductive film characterized by the above-mentioned.
The method of claim 1, wherein the anisotropic conductive film comprises the conductive adhesive layer, the first insulating adhesive layer, and the second insulating adhesive layer, wherein the conductive adhesive layer is laminated on the first insulating adhesive layer, and the second insulating adhesive layer is formed on the conductive adhesive layer. The anisotropic conductive film which is laminated | stacked and the layer containing a silane coupling agent is laminated | stacked on the 1 or more surface chosen from the group which consists of said 1st insulating adhesive layer and a 2nd insulating adhesive layer.
The anisotropic conductive film according to claim 1, wherein the silane coupling agent is a silane coupling agent having at least one member selected from the group consisting of a polymerizable unsaturated group, an epoxy group and an amino group.
The method of claim 1, wherein the silane coupling agent is 3-glycidoxy propylmethyl dimethoxysilane, 3-glycidoxy propylmethyl dimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl trimethoxysilane, vinyl Trimethoxy silane, vinyl triethoxy silane, (meth) acryloxy propyl trimethoxysilane, 3-aminopropyl trimethoxysilane, N- (2-aminoethyl) -3-aminopropyl trimethoxysilane, N -(2-aminoethyl) -3-aminopropyl methyl dimethoxysilane and 3-chloropropyl trimethoxysilane. The anisotropic conductive film characterized by the above-mentioned.
The anisotropic conductive film according to claim 1, wherein the layer containing the silane coupling agent is 10% or less of the thickness of the conductive adhesive layer or the insulating adhesive layer.
The thickness of the layer containing the said silane coupling agent is 0.001-2 micrometers, The anisotropic conductive film of Claim 1 characterized by the above-mentioned.
The anisotropic conductive film according to claim 1, wherein the conductive adhesive layer and the insulating adhesive layer do not contain or contain a silane coupling agent.
The anisotropic conductive film according to claim 1, wherein at least one member selected from the group consisting of the conductive adhesive layer and the insulating adhesive layer contains 3% by weight or less of a silane coupling agent.
The anisotropic conductive film according to claim 1, wherein the conductive adhesive layer comprises a binder portion, a hardened portion, conductive particles, and hydrophobic nano silica.
The anisotropic conductive film of claim 1, wherein the insulating adhesive layer comprises a binder portion, a curing portion, a hydrophobic nano silica, and a curing agent.
Spraying a solution containing a silane coupling agent on the base film to form a layer including the silane coupling agent;
Applying a composition for forming a conductive adhesive layer on the layer including the silane coupling agent; And
Method for producing an anisotropic conductive film comprising the step of drying.
Forming a conductive adhesive layer by applying a composition for forming a conductive adhesive layer on the base film; And
Spraying and drying a solution containing a silane coupling agent on the conductive adhesive layer, the manufacturing method of the anisotropic conductive film.
15. The method of claim 13 or 14, further comprising the step of removing the base film and spraying a solution containing a silane coupling agent.
The method of manufacturing an anisotropic conductive film according to claim 13, further comprising applying an insulating adhesive layer-forming composition after applying the conductive adhesive layer-forming composition.
15. The method of claim 14, further comprising applying a composition for forming an insulating adhesive layer after forming the conductive adhesive layer.

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