KR20180059952A - Electronic element and sheet material - Google Patents

Abstract

An electronic device of the present invention includes an electronic board having a wiring board having a mounting surface and a plurality of electronic components mounted on the mounting surface of the wiring board, A sheet material comprising: a base material; at least one insulating layer provided on the base material side of the base material and having a size including at least one of the electronic components; And a ground portion for fixing the sheet member and the electronic substrate. As a result, it is possible to provide an electronic device which is easy to remove heat from electronic components and is thin and highly reliable.

Description

[0001] ELECTRONIC ELEMENT AND SHEET MATERIAL [0002]

The present invention relates to an electronic element and a sheet member.

BACKGROUND ART In an electronic device such as a smart phone, a shield tube (can) on a box having conductivity to protect an electronic part mounted on a wiring board from, for example, electromagnetic waves, (For example, refer to Patent Document 1).

Japanese Patent No. 4857927

However, since such a shield tube is generally made of metal, there is a limitation in reducing the size (in particular, making it thin). Therefore, there is a problem that it is not possible to meet the demand for thinning of an electronic device in which a shield tube is provided on a wiring board or an electronic device in which an electronic device is assembled.

Further, the metal shielding tube is rigid, has no flexibility or is very low. Therefore, it is necessary to provide a clearance (gap) having a predetermined size between the shield tube and the electronic component so as to prevent the electronic component from being damaged when the shield tube is installed (joined) to the wiring board . This also hinders the thinning of electronic devices.

In addition, in such an electronic device, there is a problem that it is difficult to efficiently remove the heat generation of the electronic component by providing the gap.

Accordingly, it is an object of the present invention to provide an electronic device which is easy to remove heat from an electronic component, which is thin and highly reliable, and which can exhibit sufficient electromagnetic wave shielding effect and can be made thinner.

This object is achieved by the following invention.

An electronic device of the present invention includes an electronic board including a wiring board having a mounting surface, a plurality of electronic components mounted on the mounting surface of the wiring board,

A sheet member having a sheet-like base material laminated on the electronic substrate and having conductivity, and at least one insulating layer provided on the electronic substrate side of the base material and having a size including at least one of the electronic components;

And a ground portion for grounding the base material of the sheet material and fixing the sheet material and the electronic substrate.

In the electronic device of the present invention, the ground portion includes a ground wiring provided on the side of the mounting surface of the wiring board,

Wherein the insulating layer has a size smaller than that of the substrate in plan view,

And the substrate is preferably in contact with the ground wiring in an exposed region exposed from the insulating layer.

In the electronic device of the present invention, the mounting surface of the wiring board has a plurality of mounting areas partitioned by the ground wiring and mounting predetermined electronic components,

The at least one insulating layer preferably includes a plurality of the insulating layers provided corresponding to the respective mounting regions.

In the electronic device of the present invention, it is preferable that the base material includes a cured product of the curable resin and conductive particles dispersed in the cured product.

In the electronic device of the present invention, it is preferable that the curable resin is at least one of a thermosetting resin and a photocurable resin.

In the electronic device of the present invention, the average particle diameter of the conductive particles is preferably 1 to 100 mu m.

In the electronic device of the present invention, it is preferable that the base material has a body portion including the cured product of the curable resin and the conductive particles, and a metal film provided in contact with the body portion.

In the electronic device of the present invention, it is preferable that the metal film has substantially the same size as that of the insulating layer in plan view.

In the electronic device of the present invention, it is preferable that the metal film has substantially the same size as that of the main body portion in plan view.

In the electronic device of the present invention, the average thickness of the metal film is preferably 0.004 to 2500% of the average thickness of the substrate.

In the electronic device of the present invention, the substrate may include a first portion provided in contact with the insulating layer and containing the first conductive particles, and a second portion provided on the side opposite to the insulating layer of the first portion, And a second portion containing the second conductive particles in an amount larger than the content of the first portion.

In the electronic device of the present invention, the average thickness of the substrate is preferably 2 to 500 mu m.

In the electronic device of the present invention, it is preferable that the surface of the insulating layer on the electronic substrate side is formed of a smooth surface.

In the electronic device of the present invention, it is preferable that the surface of the insulating layer on the electronic substrate side is formed of a rough surface.

In the electronic device of the present invention, it is preferable that the average thickness of the insulating layer is in the range of 50 to 200 when the average thickness of the substrate is 100.

In the electronic device of the present invention, it is preferable that the insulating layer includes a resin and thermally conductive particles dispersed in the resin and having a higher thermal conductivity than the thermal conductivity of the resin.

In the electronic device of the present invention, the constituent material of the thermally conductive particle preferably contains at least one of aluminum oxide, aluminum nitride and boron nitride.

In the electronic device of the present invention, the content of the thermally conductive particles in the insulating layer is preferably 25 to 95% by weight.

In the electronic device of the present invention, it is preferable to further include a protective layer provided on the side of the substrate opposite to the electronic substrate and having a function of protecting the substrate.

In the electronic device of the present invention, in the state before the sheet member is laminated on the electronic substrate, the average thickness of the first region where the edge of the electronic component is in contact is larger than the average thickness of the second region other than the first region It is preferable that it is configured to be larger.

In the electronic device of the present invention, the plurality of electronic parts include two or more of the electronic parts juxtaposed,

Wherein the sheet member has an average thickness of a first region which is in a straight line contacting continuously with the edge portion of the electronic component in the state before lamination on the electronic substrate is larger than an average thickness of the second region other than the first region It is preferable that the thickness is larger than the thickness.

In the electronic device of the present invention, in the state before the sheet member is laminated on the electronic substrate, the average thickness of the sheet member in the first region is A [占 퐉 and the average thickness in the second region is B [Mu m], it is preferable that A / B is 1.05 to 3.

In the electronic device of the present invention, it is preferable that the sheet member further includes at least one insulating portion provided on the electronic board side, at a position corresponding to the edge portion of the substrate, separately from the insulating layer.

In the electronic device of the present invention, it is preferable that the at least one insulating portion includes a plurality of the insulating portions provided at intervals from each other along the edge of the substrate.

In the electronic device of the present invention, it is preferable that the insulating portion is formed in a frame shape along the edge portion of the substrate.

In the electronic device of the present invention, it is preferable that the average thickness of the insulating portion is smaller than the average thickness of the insulating layer.

In the electronic device of the present invention, it is preferable that the portion of the sheet member on which the insulating portion is provided constitutes a grip portion gripped when the sheet member is separated from the electronic substrate.

Further, the sheet material of the present invention is laminated on an electronic board including a wiring board having a mounting surface and a plurality of electronic components mounted on the mounting surface of the wiring board, and fixed to the electronic board via a ground portion As a sheet member to be used,

A sheet-like base material having conductivity and in contact with the ground portion in a state where the sheet material is laminated on the electronic substrate,

And at least one insulating layer located on the electronic substrate side of the substrate in a state where the sheet member is laminated on the electronic substrate and having a size including at least one electronic component.

In the sheet member of the present invention, it is preferable that the substrate has a first portion provided in contact with the insulating layer and having tackiness, and a second portion provided on the side opposite to the insulating layer of the first portion .

In the sheet member of the present invention, the first portion may include a first resin and first conductive particles dispersed in the first resin, the second portion may include a second resin, And the second conductive particles are dispersed in an amount larger than the content of the first conductive particles in the first portion.

In the sheet member of the present invention, the content of the first conductive particles in the first portion is preferably 1 to 100 parts by weight based on 100 parts by weight of the first resin.

In the sheet material of the present invention, the content of the second conductive particles in the second portion is preferably 100 to 1500 parts by weight based on 100 parts by weight of the second resin.

In the sheet member of the present invention, the shape of the first conductive particles and the shape of the second conductive particles are preferably different.

In the sheet member of the present invention, it is preferable that the shape of the first conductive particles is resin (s) or sphere.

According to the present invention having the above-described configuration, when the sheet member having high flexibility is used, it is not necessary to consider breakage of the electronic component when the sheet member is laminated on the wiring board. Therefore, it becomes possible to narrow such a gap until the sheet member and the electronic component make close contact or contact with each other. This makes it possible to further reduce the thickness of the electronic device formed by laminating the sheet member on the electronic substrate. In addition, the heat generation of the electronic component can be efficiently removed through the sheet member.

Therefore, according to the present invention, it is possible to provide an electronic device which is easy to remove heat from an electronic component, is thin and highly reliable, and capable of exhibiting a sufficient electromagnetic wave shielding effect and capable of reducing the thickness of an obtained electronic device .

1 is an exploded perspective view showing a configuration of an electronic device of the present invention.
Fig. 2 is a longitudinal sectional view (cross-sectional view taken along the line AA in Fig. 1) showing the configuration of the sheet member of the first embodiment (a state joined to the electronic substrate).
3 is an enlarged cross-sectional view showing a configuration of the sheet member of the second embodiment (a state before it is bonded to the electronic substrate).
Fig. 4 is an enlarged cross-sectional view showing a configuration of the sheet member of the third embodiment (a state before bonding to the electronic substrate). Fig.
(A) is a plan view showing the vicinity of an insulating layer, and Fig. 5 (b) is a cross-sectional view taken along the line BB in Fig. 5 Fig.
6 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet member of the fourth embodiment.
(A) is a plan view (b) is a view showing a central portion and an end portion in the CC line section in (a) of Fig. 5) of the sheet member according to the fifth embodiment to be.
8 is a plan view showing another configuration (a state before being bonded to the electronic substrate) of the sheet member of the fifth embodiment.
9 is a longitudinal sectional view showing the configuration of the end portion of the electronic device of the sixth embodiment.
10 is an enlarged cross-sectional view showing a configuration of a sheet member of the seventh embodiment (a state before bonding to an electronic substrate).

Hereinafter, the electronic element and the sheet member of the present invention will be described in detail with reference to a preferred embodiment shown in the accompanying drawings.

1 is an exploded perspective view showing a configuration of an electronic device of the present invention. Hereinafter, for convenience of explanation, the upper side in Fig. 1 is referred to as " upper " and the lower side is referred to as " lower ".

An electronic device (10) of the present invention has an electronic substrate (100) and a sheet member (1) bonded (laminated) to the electronic substrate (100). First, prior to the description of the sheet member 1, the electronic substrate 100 will be described. Examples of the electronic substrate 100 include a flexible printed substrate, a rigid printed substrate, and a rigid flexible substrate.

The electronic board 100 includes a wiring board 110 having a mounting surface 101 and a plurality of semiconductor chips (electronic components) 120 mounted on the mounting surface 101 of the wiring board 110 . The semiconductor chip 120 may be, for example, a CPU chip, a memory chip, a power supply chip, or a sound source chip.

The wiring substrate 110 is composed of a substrate 111 and wirings 112 and a ground wiring (ground portion) 113 formed on the substrate 111. One end of the wiring 112 is connected to the power source, and the other end is connected to the terminal of the semiconductor chip 120. The ground wiring 113 is formed in a frame shape so as to avoid the wiring 112 and is grounded. In this embodiment, as shown in Fig. 1, the ground wiring 113 divides the mounting surface 101 into the first to third mounting regions 101a to 101c. In each of the mounting regions 101a to 101c, predetermined semiconductor chips 120 are mounted.

The sheet member 1 is bonded to the electronic substrate 100 having such a configuration. Hereinafter, the sheet member 1 will be described.

≪ First Embodiment >

First, the first embodiment of the sheet member 1 will be described.

2 is a longitudinal sectional view (cross-sectional view taken along line A-A in Fig. 1) showing the configuration of the sheet member of the first embodiment (a state joined to the electronic board). In the following description, the upper side in Fig. 2 is referred to as " upper " and the lower side is referred to as " lower "

2, the sheet member 1 includes a sheet-like base material 2 having conductivity, an insulating layer 3 provided on the lower surface (one surface) of the base material 2, And a hard coat layer 4 provided on the upper surface (the other surface). The sheet member 1 is bonded to the electronic substrate 100 with the insulating layer 3 on the electronic substrate 100 side.

The base material 2 may be made of a metal film as long as it has conductivity. However, as in the present embodiment, the base material 2 is composed of a resin film containing the solidified or hardened material of the resin 21 and the conductive particles 22 . The base material 2 may be a combination of such a metal film and a film of a resin film, or a combination of two or more different resin films. The configuration of such a combination is shown in a later embodiment. When the base material 2 is formed of a metal film, the metal film can be formed using the same metal as the conductive particles 22.

Further, the substrate 2 can be set to have isotropic conductivity or anisotropic conductivity depending on the type (purpose) of the wiring substrate 110. [ The isotropic conductivity means that the base material 2 has conductivity in the thickness direction and the plane direction, and the anisotropic conductivity means that the base material 2 has conductivity only in the thickness direction thereof.

As the resin (21), for example, a thermoplastic resin, a curable resin and the like can be enumerated, and one kind or two or more kinds of them can be used in combination. As the curable resin, for example, a thermosetting resin, a photo-curable resin, an anaerobic curable resin, a reactive curable resin and the like can be mentioned, but at least one of a thermosetting resin and a photo-curable resin is preferable. The effect of using at least one of the curable resin, particularly, the thermosetting resin and the photo-curable resin as the resin (21) will be described later.

Examples of the thermoplastic resin include a polyolefin resin, a vinyl resin, a styrene / acrylic resin, a diene resin, a terpene resin, a petroleum resin, a cellulose resin, a polyamide resin, a polyurethane resin, , A polycarbonate-based resin, and a fluorine-based resin.

The thermosetting resin may be a resin having at least one functional group usable for crosslinking reaction by heating in one molecule. Examples of the functional group include a hydroxyl group, a phenolic hydroxyl group, a methoxymethyl group, a carboxyl group, an amino group, an epoxy group, an oxetanyl group, an oxazoline group, an oxazine group, an aziridine group, a thiol group, an isocyanate group, a blocked isocyanate group, A carboxyl group, and a silanol group.

Specific examples of the thermosetting resin include acrylic resin, maleic acid resin, polybutadiene resin, polyester resin, polyurethane resin, urea resin, epoxy resin, oxetane resin, phenoxy resin, polyimide Based resin, a melamine-based resin, an amino-based resin, a polylactic acid-based resin, an oxazoline-based resin, a benzoxazine-based resin, a silicone-based resin, a silicone- Resins, and fluorine-based resins.

When a thermosetting resin is used, the substrate 2 preferably contains a curing agent such as a resin or a low-molecular compound which reacts with the functional group to form a chemical crosslink, if necessary, in addition to the thermosetting resin. Examples of such a curing agent include, but are not limited to, a phenol type curing agent such as phenol novolac resin, a curing agent capable of promoting the curing reaction at a relatively high temperature such as an amine type curing agent such as dicyandiamide, aromatic diamine, A curing agent capable of promoting the curing reaction at a relatively low temperature (for example, 120 ° C or less) such as a curing agent, an epoxy curing agent, an aziridine curing agent, and a metal chelating curing agent.

Further, one of these curing agents may be used alone, or two or more kinds thereof may be used in combination. The degree of curing of the base material 2 in the sheet member 1 (before use) before lamination (before use) on the electronic substrate 100 (the fully cured state or the radius (Solid state or gel state) and the degree of stickiness (high stickiness, low stickiness, or non-stickiness) can be controlled.

On the other hand, the photo-curing resin may be a resin having at least one unsaturated bond capable of causing a crosslinking reaction by light. Specific examples of the photocurable resin include acrylic resin, maleic acid resin, polybutadiene resin, polyester resin, polyurethane resin, epoxy resin, oxetane resin, phenoxy resin, polyimide resin, poly Amide resins, phenol resins, alkyd resins, amino resins, polylactic acid resins, oxazoline resins, benzoxazine resins, silicone resins and fluorine resins.

In the base material (2) of the present embodiment, the conductive particles (22) are dispersed in the solidified or cured product of the resin (21). With this configuration, the substrate 2 (sheet member 1) exerts an electromagnetic wave shielding effect. As the conductive particles 22, for example, metal particles, carbon particles, conductive resin particles and the like can be cited. One or more of these conductive particles can be used in combination.

Examples of the metal constituting the metal particles include gold, platinum, silver, copper, nickel, aluminum, iron or an alloy thereof, or ITO and ATO. . Further, the metal particles may be particles comprising a core composed of a metal and a coating layer covering the core and composed of a metal. Examples of such metal particles include silver-coated copper particles obtained by coating a copper-based core with a coating layer composed of silver and the like.

Examples of the carbon constituting the carbon particles include acetylene black, Ketchen black, furnace black, carbon nanotube, carbon nanofiber, graphite, fullerene, and graphene. Examples of the conductive resin constituting the conductive resin particles include poly (3,4-ethylenedioxythiophene), polyacetylene, and polythiophene.

The average particle diameter of the conductive particles 22 is preferably about 1 to 100 mu m, more preferably about 3 to 75 mu m, and even more preferably about 5 to 50 mu m. By setting the average particle diameter of the conductive particles 22 within the above range, the filling rate of the conductive particles 22 in the base material 2 can be improved. Therefore, the electromagnetic wave shielding effect of the base material 2 (sheet member 1) can be further enhanced. Further, when the resin composition is prepared by mixing with, for example, the resin (21), the fluidity is improved, so that the moldability to the base material (2) improves.

The shape of the conductive particles 22 may be any of spherical, acicular, flaky, and dendritic shapes. The average particle diameter of the conductive particles 22 can be measured by a general laser diffraction method, a scattering method, etc., and the average value of the diameters when assuming the same circle as the projected area of the fine particle aggregate can be regarded as the average particle diameter have.

The content of the conductive particles 22 in the base material 2 is not particularly limited, but is preferably 100 to 1500 parts by weight, more preferably 100 to 1000 parts by weight, based on 100 parts by weight of the resin (21). When the content of the conductive particles 22 in the base material 2 is in the above range, it is possible to impart sufficient conductivity to the base material 2 regardless of the kind of the conductive particles 22, The effect can be sufficiently enhanced. Further, the fluidity of the resin composition containing the resin (21) and the conductive particles (22) is increased, so that the base material (2) is more easily formed.

The average thickness of the base material 2 is not particularly limited, but is preferably about 2 to 500 탆, more preferably about 5 to 100 탆. By setting the average thickness of the substrate 2 within the above range, it is possible to reduce the thickness of the substrate 2 while preventing deterioration of the mechanical strength of the substrate 2.

The base material 2 can also be used in the form of a coating solution containing a coloring agent (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an antiblocking agent, a metal deactivating agent, a thickener, a dispersant, a silane coupling agent, , An antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling regulator, and the like.

Examples of the coloring agent include organic pigments, carbon black, gray pigments, zinc pigments, titanium oxide, graphite and the like. Examples of the flame retardant include halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, and inorganic flame retardants. Examples of the filler include glass fiber, silica, talc, and ceramics.

Examples of lubricants include fatty acid esters, hydrocarbon resins, paraffin, higher fatty acids, fatty acid amides, aliphatic alcohols, metal soaps, and modified silicones. Examples of the antiblocking agent include calcium carbonate, silica, polymethylsilsesquioxane, aluminum silicate and the like.

An insulating layer 3 is provided on the lower surface (the surface on the electronic substrate 100 side) of the substrate 2. 1, a first insulating layer 3a corresponding to the first mounting region 100a of the mounting surface 101 (wiring board 110) is formed on the lower surface of the base member 2, And a second insulating layer 3b corresponding to the second mounting region 100b. A third insulating layer 3c corresponding to the third mounting region 100c is provided.

The first to third insulating layers 3a to 3c (hereinafter collectively referred to simply as " insulating layer 3 ") are each smaller in plane than the substrate 2, (120) in a state of being stacked on the semiconductor chip (100). With this configuration, the lower surface of the base material 2 is provided with a band-shaped exposed region 2a exposed from the first to third insulating layers 3a to 3c. Therefore, the exposed region 2a has a shape corresponding to the shape of the ground wiring 113 of the wiring board 110. [ The exposed region 2a is in contact with the ground wiring 113 and the base material 2 is grounded while the sheet member 1 is bonded to the wiring board 110. [ That is, the exposed region 2a of the base material 2 constitutes a connecting portion (bonded portion) for connecting (joining) the sheet material 1 to the wiring substrate 110.

For example, when the base material 2 contains a curable resin as the resin 21, the exposed region 2a of the base material 2 is brought into contact with the ground wiring 113 of the wiring substrate 110, The sheet member 1 and the electronic substrate 100 can be bonded (fixed) at the contact portion by the cured product.

The insulating layer 3 may be formed by using a hard resin or a hardening resin (in particular, a thermosetting resin). Specific examples of the hard resin include acrylic, polyurethane, polyurethaneurea, epoxy, epoxy ester, polyester, polycarbonate, polyphenylene sulfide and the like, and one kind or two or more kinds Can be used. On the other hand, as the curable resin, the same resins as the curable resins put into the resin (21) can be used.

When a thermosetting resin is used as the curing resin, the insulating layer 3 may contain the same curing agent as described for the substrate 2. As a result, the degree of curing (completely cured state or semi-cured state) of the insulating layer 3 in the sheet member 1 before lamination (before use) on the electronic substrate 100, Or gel state) and the degree of stickiness (high stickiness, low stickiness or non-stickiness) can be controlled.

In addition, the insulating layer 3 can be formed, for example, of a coloring agent (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an antiblocking agent, a metal deactivator, a thickener, a dispersing agent, a silane coupling agent, A reducing agent, an antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling agent, and the like.

The average thickness of the insulating layer 3 is not particularly limited, but it is preferable that the average thickness of the insulating layer 3 is about 50 to 200, and more preferably about 75 to 150, when the average thickness of the substrate 2 is 100. Specifically, the average thickness of the insulating layer 3 is preferably about 1 to 1000 占 퐉, and more preferably about 3 to 200 占 퐉. Thereby, the insulating layer 3 can impart excellent followability to the surface of the electronic substrate 100 to the insulating layer 3 (sheet member 1) while maintaining sufficient insulating property.

2, it is preferable that the insulating layer 3 and the surface of the semiconductor chip 120 are in close contact with each other. However, it is preferable that the surface of the insulating layer 3 is in contact with the surface of the semiconductor chip 120 By making the relation between the average thickness and the average thickness of the substrate 2 within the above range, the adhesion of the insulating layer 3 to the surface of the semiconductor chip 120 can be further improved. In order to adhere the insulating layer 3 to the surface of the semiconductor chip 120, this operation may be performed under reduced pressure or under vacuum when the sheet member 1 is bonded to the electronic substrate 100.

The lower surface of the insulating layer 3 (the contact surface with the semiconductor chip 120) may be formed of a smooth surface or a rough surface. The contact area between the insulating layer 3 and the surface of the semiconductor chip 120 can be increased by forming the lower surface (the surface on the electronic substrate 100 side) of the insulating layer 3 as a smooth surface, It is possible to improve the heat dissipation effect. On the other hand, when the lower surface of the insulating layer 3 is formed as a rough surface, the contact area between the insulating layer 3 and the surface of the semiconductor chip 120 can be slightly reduced, It becomes possible to more easily remove the insulating layer 3 (sheet member 1) from the insulating layer 120.

On the other hand, a hard coat layer (protective layer) 4 having a function of protecting the substrate 2 is provided on the upper surface (the surface opposite to the electronic substrate 100) of the substrate 2. Thus, breakage of the substrate 2 can be suitably prevented.

Such a hard coat layer 4 can be formed by, for example, a bifunctional or multifunctional or monofunctional monomer having an?,? - unsaturated double bond, a vinyl type monomer, an aryl type monomer, a monofunctional (meth) (Cured product) of a radical polymerization-type monomer such as a (meth) acrylic monomer. By constituting the hard coat layer 4 as a polymer of such a monomer, the strength of the hard coat layer 4 is increased, and the effect of preventing breakage of the base material 2 is further improved.

The bifunctional or higher functional monomer having an?,? - unsaturated double bond is, for example, a relatively low molecular weight monomer having a molecular weight of less than 1000 (so-called narrow monomer), for example, a relatively high molecular weight having a weight average molecular weight of from 1,000 to less than 10000 Or an oligomer or prepolymer having a molecular weight. Examples of the oligomer having an?,? - unsaturated double bond include polyester (meth) acrylate, polyurethane (meth) acrylate, epoxy (meth) acrylate, maleic acid modified polybutadiene .

Examples of the vinyl type monomer include styrene,? -Methylstyrene, divinylbenzene, N-vinylpyrrolidone, vinyl acetate, N-vinylformaldehyde, N-vinylcaprolactam and alkyl vinyl ether . Examples of the aryl type monomer include trimethacryl isocyanurate and triaryl cyanurate.

Examples of monofunctional (meth) acrylic monomers include 2- (meth) acryloyloxyethyl phthalate, 2- (meth) acryloyloxyethyl 2-hydroxyethyl phthalate, 2- (meth) (Meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylhexylcarbitol (meth) acrylate, 2-hydroxybutyl (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2- (Meth) acrylate, benzyl (meth) acrylate, butanediol mono (meth) acrylate, butoxyethyl (meth) acrylate, butyl (meth) acrylate, caprolactone Cresol (meth) acrylate, cyclo (Meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, diethylene glycol monoethyl ether (Meth) acrylate, isobutyl (meth) acrylate, isobutyl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, isostearyl (meth) acrylate, isomyristyl (meth) acrylate, lauryloxypolyethylene glycol (Meth) acrylate, methoxy dipropylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate, methoxypoly (Meth) acrylate, methoxytriethylene glycol (meth) acrylate, methyl (meth) acrylate, neopentyl glycol benzoate (meth) acrylate, nonylphenoxypolyethylene glycol (Meth) acrylate, octafluoropentyl (meth) acrylate, octoxypolyethylene glycol polypropylene glycol (meth) acrylate, octyl (meth) acrylate, para-cumylphenoxyethylene glycol Acrylate, phenoxyethyl (meth) acrylate, phenoxyhexaethylene glycol (meth) acrylate, phenoxyethyl (meth) acrylate, (Meth) acrylate, polyethylene glycol (meth) acrylate, stearyl (meth) acrylate, (Meth) acrylate, tetrafluoropropyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, t-butyl (meth) acrylate, (Meth) acrylate,? -Carboxyethyl (meth) acrylate,? -Carboxy-polycaprolactone (meth) acrylate, tri-decyl Acrylate, derivatives thereof, and modified products thereof.

Examples of the polyfunctional (meth) acrylic monomer include 1,3-butylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6- (Meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, bisphenol A di (meth) acrylate, bisphenol F di Acrylate, neopentyl glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, pentaerythritol di (Meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, bisphenol A diglycidyl ether D Acrylate, trimethylolpropane di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, tricyclodecane dimethanol di (Meth) acrylate, dipropylene glycol di (meth) acrylate, glycerol tri (meth) acrylate, triethylene glycol di (meth) acrylate, (Meth) acrylate, trimethylolpropane triocte (meth) acrylate, tri (meth) acryloyloxy (meth) acrylate, trimethylolpropane tri Ethyl) isocyanurate, di (meth) acrylated isocyanurate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol Tall hydroxide may be mentioned hydroxy penta (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, or, derivatives thereof or side character and the like.

The hard coat layer 4 may be formed of, for example, a polyester resin such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), an acrylic resin such as polymethylmethacrylate, a polyethylene, a polypropylene , A polyolefin-based resin such as an ethylene-vinyl acetate copolymer, or the like.

In addition, the hard coat layer 4 can be formed by using, for example, a coloring agent (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an antiblocking agent, a metal deactivating agent, a thickening agent, a dispersing agent, a silane coupling agent, , A reducing agent, an antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling regulator and the like.

When the hard coat layer 4 is composed of a polymer (cured product) of a monomer, the average thickness of the hard coat layer 4 is not particularly limited, but is preferably about 0.1 to 10 탆, more preferably about 0.5 to 5 탆 Is more preferable. On the other hand, when the hard coat layer 4 is composed of solidified thermoplastic resin, the average thickness of the hard coat layer 4 is preferably about 1 to 50 μm, more preferably about 5 to 30 μm . By setting the average thickness of the hard coat layer 4 within the above range, breakage of the base material 2 can be more reliably prevented while maintaining the viability of the sheet material 1.

The protective layer is not limited to the hard coat layer 4, but may be a cushion layer, a print layer, or the like, which absorbs stress or impact from the outside, or may be a laminate obtained by combining these layers.

The sheet member 1 as described above can be manufactured, for example, as follows.

First, the resin composition for a hard coat layer is coated on a release sheet, and then hardened or solidified. Thus, the hard coat layer 4 is obtained.

Next, the base resin composition is coated on the hard coat layer 4 and then semi-cured, hardened or solidified. Thus, the base material 2 is obtained. In this state, the base material 2 may or may not have adhesiveness.

Next, the resin composition for an insulating layer is coated on the base material 2, followed by semi-curing, curing or solidifying. Thus, the insulating layer 3 is obtained. In this state, the insulating layer 3 may or may not have adhesiveness.

Examples of the method for coating each resin composition include a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a braiding method, a roll coating method, a knife coating method, A spin coating method, a dip coating method, or the like can be used.

Further, the sheet member 1 may be formed by separately forming respective layers, and then bonding these layers to each other.

In the sheet member 1, a heat conductive layer, a water vapor barrier layer, an oxygen barrier layer, a low dielectric constant layer, a high dielectric constant layer, a high dielectric constant layer, and a high dielectric constant layer are interposed between the substrate 2 and the hard coat layer , A low dielectric loss toughening layer (low dielectric loss toughening layer), a high dielectric constant toughening layer (high dielectric constant toughening layer), and a heat resistant layer.

The sheet member 1 is bonded to the electronic substrate 100 in the following manner.

First, the insulating sheet 3 is laminated on the electronic substrate 100 to the electronic substrate 100 side. Next, in this state, when the sheet member 1 is heat-pressed against the electronic board 100, the insulating layer 3 is brought into close contact with the surface of the semiconductor chip 120, 2a are brought into contact with the ground wiring 113 and the sheet member 1 is fixed (joined) to the electronic board 100. [ As a result, the electronic device 10 can be obtained. Further, by performing the heat press bonding under reduced pressure or under vacuum, the degree of adhesion of the insulating layer 3 to the surface of the semiconductor chip 120 is increased. As a result, not only the electromagnetic shielding effect by the sheet member 1 but also a good heat radiating effect is exerted.

When the substrate 2 contains a thermosetting resin and is in a semi-cured state, the thermosetting resin is cured by the heating and pressing so that the exposed region 2a of the substrate 2 is bonded to the ground wiring 113 by the cured product. As shown in Fig. Further, the curing of the thermosetting resin improves the mechanical strength of the base material 2 (the sheet material 1) itself. When the substrate 2 contains a photocurable resin, light (active radiation) is irradiated to the exposed region 2a of the base material 2 after the hot pressing. As a result, the photocurable resin is cured, and the exposed region 2a of the substrate 2 is firmly bonded to the ground wiring 113 by the cured product. In addition, in the case where the substrate 2 is formed of a metal film, the solder can be provided on the ground wiring 113 prior to the above hot pressing so that the exposed region 2a of the base material 2 is electrically connected to the ground wiring 113).

The electronic device 10 is easy to remove heat from the semiconductor chip 120, is thin, has high reliability, and can be used as a portable phone such as a smart phone, a personal computer, a tablet terminal, , Organic EL lighting, liquid crystal TV, organic ELTV, digital camera, digital video camera, and automobile.

≪ Second Embodiment >

Next, a second embodiment of the present invention will be described.

3 is an enlarged cross-sectional view showing a configuration of the sheet member of the second embodiment (a state before it is bonded to the electronic substrate). Hereinafter, the second embodiment will be described, but differences from the first embodiment will be mainly described, and description of the same matters will be omitted. 3, the upper side is referred to as " upper " and the lower side is referred to as " lower ".

The sheet member 1 of the second embodiment is the same as the first embodiment except that the constitution of the insulating layer 3 (the first to third insulating layers 3a to 3c) is different. 3, the insulating layer 3 of the second embodiment includes the resin 31 and the thermally conductive particles 32 dispersed in the resin 31 and having a thermal conductivity higher than that of the resin 31, . Since the insulating layer 3 includes the thermally conductive particles 32, the thermal conductivity of the sheet material 1 is improved, and the heat radiation effect by the sheet material 1 is further increased.

Examples of the constituent material of the thermally conductive particles 32 include metal oxides such as calcium oxide, magnesium oxide and aluminum oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, metal nitrides such as aluminum nitride and boron nitride, , Metal carbonate such as magnesium carbonate, metal silicate such as calcium silicate, crystalline silica, amorphous silica, and silicon compounds such as silicon carbide. One or more of these may be used in combination.

Of these, at least one of aluminum oxide, aluminum nitride and boron nitride is preferable as the constituent material of the thermally conductive particles 32, and aluminum oxide is more preferable because of high heat resistance and insulation reliability. In addition, spherical aluminum oxide is excellent in that it can be packed finely in the insulating layer 3, and even when the filling amount is increased, it is possible to prevent the unnecessary increase in the elastic modulus of the insulating layer 3 desirable. The thermally conductive particles 32 may contain a plurality of kinds of particles.

The average particle diameter of the thermally conductive particles 32 is not particularly limited, but is preferably about 0.1 to 250 탆, and more preferably about 0.5 to 100 탆. Since the thermally conductive particles 32 having such an average particle size are easily dispersed uniformly in the insulating layer 3, the thermal conductivity of the insulating layer 3 can be further increased.

The shape of the thermally conductive particles 32 may be any of spherical, acicular, flaky, and dendritic shapes. The average particle diameter of the thermally conductive particles 32 can be obtained by measurement using a general laser diffraction method, a scattering method, or the like, and the average value of the diameters when assuming the same circle as the projected area of the fine particle aggregate can be regarded as the average particle diameter have.

The content of the thermally conductive particles 32 in the insulating layer 3 is not particularly limited, but is preferably about 25 to 95% by weight, and more preferably about 35 to 85% by weight. By setting the content of the thermally conductive particles 32 in the insulating layer 3 within the above range, it is possible to sufficiently improve the thermal conductivity of the insulating layer 3 while preventing the mechanical strength of the insulating layer 3 from being lowered.

As the resin 31, the same resin as that usable as the insulating layer 3 in the first embodiment can be used. The insulating layer 3 may contain a curing agent similar to that described in the first embodiment.

In the second embodiment as described above, the same operations and effects as those of the first embodiment are exhibited.

≪ Third Embodiment >

Next, a third embodiment of the present invention will be described.

Fig. 4 is an enlarged cross-sectional view showing a configuration of the sheet member of the third embodiment (a state before bonding to the electronic substrate). Fig. Hereinafter, the third embodiment will be described, but differences from the first embodiment will be mainly described, and description of the same matters will be omitted. In the following description, the upper side in Fig. 4 is referred to as " upper " and the lower side is referred to as " lower "

The sheet member 1 of the third embodiment is the same as the first embodiment except that the structure of the base member 2 is different. 4A and 4B, the base material 2 of the third embodiment includes a main body portion 20 including a resin 21 and conductive particles 22, And a metal film 23 provided in contact with the main body portion 20 on the insulating layer 3 side of the main body portion 20. The electromagnetic shielding effect and the heat radiation effect of the base material 2 (the sheet material 1) are more suitably exhibited by the base material 2 including the metal film 23. [

The metal film 23 is formed by adhering (bonding) a metal foil formed of a metal selected from the conductive particles 22 to the main body portion 20, a metal oxide (for example, ITO, ATO) A method of forming a vapor deposition film or a sputtering film on the main body 20 by vapor deposition or sputtering or a method of forming a printing film on the main body 20 by printing a conductive paste (for example, silver paste) . When the metal film 23 is formed of a metal foil, various copper foils are preferable in terms of conductivity and cost, and a rolled copper foil or an electrolytic copper foil is more preferable.

The average thickness of the metal film 23 is not particularly limited, but is preferably about 0.004 to 2500%, more preferably about 0.025 to 75% of the average thickness of the base material 2. By setting the average thickness of the metal film 23 within the above range, the electromagnetic wave shielding effect and the heat radiation effect of the base material 2 are sufficiently exhibited while preventing the viability of the base material 2 (the sheet material 1) from being lowered .

The specific average thickness of the metal film 23 is preferably as follows. For example, when the metal film 23 is formed of a vapor deposition film, the average thickness is preferably about 50 to 300 nm, more preferably about 75 to 200 nm. When the metal film 23 is formed of a sputtering film, the average thickness is preferably about 20 to 80 nm, and more preferably about 25 to 70 nm. When the metal film 23 is formed of a metal foil or a printed film, the average thickness is preferably about 0.01 to 20 mu m, more preferably about 0.1 to 15 mu m.

4 (a), the metal film 23 may have substantially the same size as the insulating layer 3 in plan view, and the metal film 23 may be substantially the same size as the insulating layer 3 as shown in Fig. 4 (b) May be approximately the same size. In the case of the configuration shown in Fig. 4 (a), the sheet member 1 can be firmly bonded to the electronic substrate 100 by using the main body portion 20 of the exposed region 2a. On the other hand, in the case of the configuration shown in Fig. 4 (b), the metal film 23 in the exposed region 2a is metal-bonded to the ground wiring 113 of the wiring substrate 110 by, . Therefore, very high bonding between the sheet member 1 and the electronic substrate 100 becomes possible.

The metal film 23 may have a shape having a plurality of through holes formed by a mesh shape or punching. By forming this shape, water vapor permeability can be imparted to the metal film 23.

In the third embodiment as described above, the same operations and effects as those of the first embodiment are exhibited.

The metal film 23 may be provided so as to be in contact with the main body portion 20. The metal film 23 may be provided on the hard coat layer 4 side instead of the insulating layer 3 side, It may be provided at an arbitrary position in the thickness direction, or a combination thereof may be used.

≪ Fourth Embodiment &

Next, a fourth embodiment of the present invention will be described.

5A is a plan view showing the vicinity of the insulating layer 3a, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A; FIG. 5A is a plan view showing the vicinity of the insulating layer 3a, Fig. 6 is a plan view showing another configuration of the sheet member of the fourth embodiment (a state before it is joined to the electronic substrate); Fig. Hereinafter, the fourth embodiment will be described, but differences from the first embodiment will be mainly described, and a description of the same matters will be omitted. Hereinafter, for convenience of explanation, the upper side in Fig. 5 (b) and Fig. 6 will be referred to as " upper side "

The sheet member 1 of the fourth embodiment is a sheet member 1 in which the thickness of the insulating layer 3 is not uniform in the state before the sheet member 1 is bonded to the electronic substrate 100 (state before use of the sheet member 1) The same as the first embodiment. 5 (a) and 5 (b), when the insulating layer 3 of the fourth embodiment is bonded (laminated) to the electronic substrate 100, the edge of the semiconductor chip 120 is in contact with The average thickness of the first region 33 is larger than the average thickness of the second region 34 other than the first region 33. 5 (a) and 5 (b), the first region 33 has a quadrangular frame shape in plan view corresponding to the outer shape of the semiconductor chip 120.

With such a configuration, a sufficient thickness is secured in the portion (first region 33) of the sheet material 1 that extends when the edge of the semiconductor chip 120 touches, so as to compensate for the amount of extension. Therefore, when the sheet member 1 is bonded to the electronic substrate 100, for example, even if the sheet member 1 is extended in the first region 33, the sheet member 1 can be prevented from being broken.

The average thickness in the first region 33 of the sheet member 1 is A 占 퐉 and the thickness of the first region 33 in the second region 34 in the state before the sheet member 1 is bonded to the electronic substrate 100 A / B is preferably about 1.05 to about 3, more preferably about 1.05 to about 1.4, and even more preferably about 1.1 to about 1.25, when the average thickness is B [占 퐉. This makes it possible to more reliably prevent the insulating layer 3 (sheet member 1) from being broken.

The insulating layer 3 is formed by forming a uniform thickness portion of the insulating layer 3 on the substrate 2 side by the method described in the first embodiment and then forming the insulating layer 3 on the first region 33 In the form of a rectangular frame shape.

In the fourth embodiment as described above, the same actions and effects as those of the first embodiment are exhibited.

The first region 33 is not limited to the region shown in Fig. 5 (a), but may be a region in which the sheet material 1 is likely to break particularly easily. For example, in the electronic board 100 shown in Fig. 1, two semiconductor chips 120 are juxtaposed in the lateral direction on the front side of the paper. In this case, the first region 33 is formed as shown in Fig. 6 , And a straight line region continuously contacting the edge portions of the two adjacent semiconductor chips 120. Generally, the extent to which the sheet material 1 is extended is increased at a location where the semiconductor chips 120 are arranged closely. 6 is a first region 33 and the insulating layer 3 (the sheet material 1) in the first region 33 is a straight region above the two semiconductor chips 120, It is possible to sufficiently prevent the sheet member 1 from being broken.

In the state before the sheet member 1 is bonded to the electronic substrate 100, it is sufficient if the average thickness of the first region 33 of the sheet member 1 is larger than the average thickness of the second region 34 This configuration can be achieved by forming the substrate 2 partially thicker or partially forming the thickness of the hard coat layer 4 instead of partially forming the insulating layer 3 to a greater thickness Or may be realized by such a combination.

≪ Embodiment 5 >

Next, a fifth embodiment of the present invention will be described.

(A) is a plan view (b) is a view showing a central portion and an end portion in the CC line section in (a) of Fig. 5) of the sheet member according to the fifth embodiment And FIG. 8 is a plan view showing another configuration (a state before being bonded to the electronic substrate) of the sheet member of the fifth embodiment. Hereinafter, the fifth embodiment will be described, but differences from the first embodiment will be mainly described, and description of the same matters will be omitted. Hereinafter, for convenience of explanation, the upper side in Fig. 7 (b) is referred to as "upper" and the lower side as "lower".

The sheet member 1 of the fifth embodiment is the same as that of the first embodiment except that the sheet member 1 has the insulating portion 35 separately provided in the insulating layer 3 along the edge portion of the lower surface of the base member 2. 7 (a) and 7 (b), the insulating portion 35 surrounds the edge portion of the lower surface of the substrate 2 so as to surround the first to third insulating layers 3 a to 3 c Therefore, it is formed into a square frame shape. With this configuration, the base material 2 and the mounting surface 101 of the wiring substrate 110 at the edge of the sheet member 1 are bonded to the electronic substrate 100 (laminated) It is possible to prevent direct contact. As a result, a short circuit between the substrate 2 and the wiring board 110 is prevented, and a highly reliable electronic device 10 can be obtained.

When the sheet member 1 is removed from the electronic board 100 at the time of recycling the electronic board 100, the portion of the sheet member 1 where the insulating portion 35 is formed is held, So that it becomes easy to carry out the detachment operation. That is, the portion of the sheet member 1 on which the insulating portion 35 is provided constitutes a grip portion to be gripped when the sheet member 1 is separated from the electronic substrate 100 on which the sheet member 1 is stacked. Particularly, in the structure shown in Fig. 7 (a), since the insulating portion 35 is formed in a frame shape along the edge portion of the base material 2, Lt; / RTI >

As the constituent material of such an insulating portion 35, it is preferable to use the same material as the hard resin put in the insulating layer 3 of the first embodiment. It is possible to prevent the insulating portion 35 from being bonded to the mounting surface 101 of the wiring board 110 by making the insulating portion 35 of hard resin. Therefore, when the sheet member 1 is detached from the electronic substrate 100, the portion of the sheet member 1 where the insulating portion 35 is formed can be held easily and reliably.

It is preferable that the average thickness of the insulating portion 35 is set to be smaller than the average thickness of the insulating layer 3. Thus, the insulating portion 35 can be lightly brought into contact with the mounting surface 101 of the wiring board 110. Therefore, when the sheet member 1 is detached from the electronic board 100, it becomes easier to grasp the portion of the sheet member 1 on which the insulating portion 35 is formed.

The insulating portion 35 may be formed by the same method as that of the insulating layer 3 and may be formed in the same process as the insulating layer 3, Process.

In the fifth embodiment as described above, the same actions and effects as those of the first embodiment are exhibited.

8, the base material 2 is provided with a plurality of ear portions 24 formed at intervals from each other along the edge portion thereof, and the bottom surface of each of the ear portions 24 is insulated Section 35 may be provided. That is, a plurality of insulating portions 35 may be provided at intervals from each other along the edge portion of the substrate 2. According to such a configuration, the electronic board 100 can be folded and housed in the case of the electronic device by folding the folded portion 24. Therefore, it is possible to prevent the lead portion 24 from being disturbed in the assembling work of the electronic apparatus.

Also, from the viewpoint of an operation of detaching the electronic substrate 100 at the time of recycling, only one of the portions 24 (the insulating portions 35) may be provided.

≪ Sixth Embodiment &

Next, a sixth embodiment of the present invention will be described.

9 is a longitudinal sectional view showing the configuration of an end portion of an electronic device according to the sixth embodiment. Hereinafter, the sixth embodiment will be described, but differences from the first embodiment will be mainly described, and description of the same matters will be omitted. In the following description, the upper side in Fig. 9 is referred to as " upper " and the lower side is referred to as " lower "

9A, the sheet member 1 of the sixth embodiment comprises a substrate 2 made of a metal film, and an insulating layer 3 provided on the lower surface (one surface) of the substrate 2 The branch is a two-layer structure. On the upper surface of the ground wiring 113, a plurality of conductive fins 114 are provided at predetermined intervals along the long direction of the ground wiring 113. Each of the conductive pins 114 is disposed so as to face upward at the needle tip (top).

According to this structure, when the sheet material 1 is laminated on the electronic substrate 100, the exposed region 2a of the base material 2 is penetrated by the conductive pin 114 and brought into contact with the ground wiring 113. As a result, the base material 2 can be grounded and the sheet member 1 and the electronic substrate 100 can be fixed. Therefore, in the present embodiment, the ground wiring 113 and the conductive pin 114 constitute a grand part.

Further, the conductive pin 114 may be integrally formed with the ground wiring 113. Further, the ground wiring 113 may be omitted and the conductive pin 114 may be directly grounded. Such a conductive pin 114 can be formed using the same metal as the conductive particles 22 of the first embodiment.

9 (b), after the exposed region 2a of the base material 2 is brought into contact with the ground wiring 113, the exposed region 2a is electrically connected to the wiring substrate 110 (The substrate 111).

In the sixth embodiment as described above, the same actions and effects as those of the first embodiment are exhibited. It is needless to say that the sheet material 1 may have the same configuration as that of the sheet material 1 of the first to fifth embodiments.

≪ Seventh Embodiment &

Next, a seventh embodiment of the present invention will be described.

10 is an enlarged cross-sectional view showing the configuration of the sheet member of the seventh embodiment (a state before bonding to the electronic substrate). Hereinafter, the seventh embodiment will be described, but differences from the first embodiment will be mainly described, and a description of the same matters will be omitted. In the following description, the upper side in Fig. 10 is referred to as " upper " and the lower side is referred to as " lower "

The sheet member 1 of the seventh embodiment is the same as the first embodiment except that the structure of the base member 2 is different. 10, the base material 2 of the seventh embodiment includes a lower layer (first portion) 2X provided in contact with the insulating layer 3, and a lower layer (Second portion) 2Y provided on the side opposite to the first side (the third side).

The lower layer 2X contains a resin (first resin) 25 and conductive particles (first conductive particles) 26 dispersed in the resin 25 and the upper layer 2Y contains a resin (second resin) (21), and conductive particles (second conductive particles) 22 dispersed in the resin (21). The content of the conductive particles 22 in the upper layer 2Y is set to be larger than the content of the conductive particles 25 in the lower layer 2X.

With this structure, high electromagnetic shielding properties can be exhibited in the upper layer 2Y, and adhesiveness can be imparted to the lower layer 2X in accordance with the type of the resin 25 or the like. Therefore, when the sheet member 1 of the present embodiment is laminated on the electronic substrate 100, the exposed region 2a of the sheet member 1 (base member 2) It can be fixedly attached to the ground wiring 113.

Therefore, it is possible to omit the step of heating and pressing the sheet member 1 to the electronic substrate 100, that is, to perform the heat pressing operation on the sheet member 1 by hand of the operator It can be adhered. Therefore, the production efficiency of the electronic substrate 100 can be improved. Further, since the heat compression bonding can be omitted, the semiconductor chip 120 can be prevented from being deteriorated by the heating at this time, and the electronic device 10 with higher reliability can be obtained.

As the resin 25, a resin (including rubber) having a glass transition temperature of 0 占 폚 or lower is preferable and a resin having a glass transition temperature of -10 占 폚 or lower Rubber) is more preferable, and a resin having a glass transition temperature of -20 占 폚 or lower (including rubber) is more preferable. Specific examples of such resin (including rubber) include various resins such as acrylic resin and urethane resin, various rubbers such as natural rubber and synthetic rubber, and various thermoplastic elastomers such as styrene block copolymer . The lower layer 2X may contain a curing agent similar to that described in the first embodiment.

The lower layer 2X may have any conductivity among isotropic conductivity and anisotropic conductivity, but it is preferable that the lower layer 2X has anisotropic conductivity. As a result, the current flowing in the upper layer 2Y can be smoothly conducted by the ground wiring 113 through the lower layer 2X, and the electromagnetic wave shielding effect of the base material 2 (the sheet material 1) do. As the conductive particles 26 dispersed in the resin 25, particles of the same kind and average particle diameter as those of the conductive particles 22 described in the first embodiment can be used.

The shape of the conductive particles 26 may be similar to that of the conductive particles 22 described in the first embodiment, but it is preferably a resinous or spherical shape. If the dendritic or spherical conductive particles 26 are contained, the lower layer 2X needs to have a relatively low content in the lower layer 2X, and sufficient conductivity can be imparted to the lower layer 2X. Further, by setting the content of the conductive particles 26 in the lower layer 2X to a small amount, the adhesion of the lower layer 2X can be further improved. In addition, by using the dendritic or spherical conductive particles 26, anisotropic conductivity can easily be imparted to the lower layer 2X. The dendritic conductive particles 26 and the spherical conductive particles 26 may be used either alone or in combination.

The content of the conductive particles 26 in the lower layer 2X is preferably 1 to 100 parts by weight, more preferably 10 to 50 parts by weight, based on 100 parts by weight of the resin (25). By setting the content in the lower layer 2X of the conductive particles 26 within the above range, the necessary and sufficient conductivity can be imparted to the lower layer 2X, and the electromagnetic shielding effect of the substrate 2 can be sufficiently enhanced. Further, the resin composition including the resin 25 and the conductive particles 26 has high fluidity and is easier to form than the lower layer 2X, which is preferable.

On the other hand, the resin 21 and the conductive particles 22 contained in the upper layer 2Y provided on the lower layer 2X can have the same configuration as described in the first embodiment. The upper layer 2Y may contain a curing agent similar to that described in the first embodiment.

The upper layer 2Y may have any conductivity, such as isotropic conductivity or anisotropic conductivity, but preferably has an isotropic conductivity. As a result, electromagnetic waves can be reliably captured in the upper layer 2Y, and the converted current can be quickly transferred to the lower layer 2X. Particularly, by making the lower layer 2X serve as an anisotropic conductive material different from the isotropic conductivity of the upper layer 2Y, the lower layer 2X and the upper layer 2Y can share different roles and the substrate 2 ) Can more suitably be exhibited.

From the viewpoint of imparting isotropic conductivity to the upper layer 2Y, it is preferable that the shape of the conductive particles 22 is different from that of the conductive particles 26 (in particular, in the form of flakes). If the conductive particles 22 are in the form of a flake, the upper layer 2Y can contain a large amount of the conductive particles 22 and can have sufficient isotropic conductivity.

The content of the conductive particles 22 in the upper layer 2Y is preferably 100 to 1500 parts by weight, more preferably 100 to 1000 parts by weight, based on 100 parts by weight of the resin (21). By setting the content of the conductive particles 22 in the upper layer 2Y within the above range, the necessary and sufficient conductivity can be imparted to the upper layer 2Y, and the electromagnetic shielding effect of the base material 2 can be sufficiently enhanced. It is also preferable that the resin composition containing the resin 21 and the conductive particles 21 has higher fluidity and is easier to form than the upper layer 2Y.

Further, in the base material 2 of the present embodiment, when the average thickness of the lower layer 2X is Tx [占 퐉] and the average thickness Ty [占 퐉] of the upper layer 2Y, But it is preferably about 1 to about 7.5, more preferably about 2 to about 5. By setting the ratio Ty / Tx to the above range, the base material 2 exhibiting a higher electromagnetic wave shielding effect can be obtained. Specifically, the average thickness of the lower layer 2X is preferably about 0.5 to 150 mu m, more preferably about 1.5 to 25 mu m, and the average thickness of the upper layer 2Y is about 1.5 to 350 mu m And more preferably about 3.5 to 75 mu m.

The upper layer 2Y may be made of a metal film similar to that described in the third and sixth embodiments.

An insulating layer 3 is provided on the lower surface (the surface on the electronic substrate 100 side) of the substrate 2. The insulating layer 3 may be formed in the same manner as described in the first or second embodiment, but may be formed using a resin composition containing a resin 21 similar to that of the upper layer 2Y and a curing agent can do. The insulating layer 3 may or may not have adhesiveness.

As described above, the sheet member 1 of the present embodiment is preferably adhered to the electronic substrate 100 by the manual operation of the operator. At this time, if the insulating layer 3 has adhesiveness, positioning of the sheet member 1 with respect to the electronic board 100 can be easily performed, and the production efficiency of the electronic element 10 can be further improved On the other hand, if the insulating layer 3 does not have tackiness, the sheet member 1 can be easily detached from the electronic substrate 100 even once the sheet member 1 is adhered to the electronic substrate 100, It is possible to easily carry out the positional correction.

The sheet member 1 is fixed (laminated) on the electronic substrate 100 when at least one of the lower layer 2X, the upper layer 2Y and the insulating layer 3 is in a semi-cured state and / After that, the layer in this state may be post-cured. Thereby, the sheet member 1 can be bonded to the electronic substrate 100, and at the same time, the mechanical strength of the sheet member 1 can be improved.

For example, the lower layer 2X may be formed by mixing a resin (including rubber) having a glass transition temperature of 0 占 폚 or lower and a first curing agent capable of promoting the curing reaction at a relatively low temperature as described in the first embodiment And a second curing agent capable of promoting the curing reaction at a higher temperature than the first curing agent and a resin composition containing the conductive particles 26 can be used before the use of the sheet material 1, (Laminated) the sheet member 1 to the electronic substrate 100 with the lower layer 2X made into a gel state (semi-solid state) by the action of the second curing agent, ) Can be made into a solid state.

The sheet material 1 is obtained by sequentially forming the hard coat layer 4, the upper layer 2Y, the lower layer 2X and the insulating layer 3 in the same manner as the first embodiment except that the resin composition To form a coating layer. In the present embodiment, since the lower layer 2X has adhesiveness, the sheet member 1 is prepared by forming a laminate in which the hard coat layer 4, the upper layer 2Y and the lower layer 2X are laminated in advance, Or by separately attaching an insulating layer 3 to the lower layer 2X of the laminate.

In the seventh embodiment as described above, the same operations and effects as those of the first embodiment are exhibited.

Further, at least one intermediate layer of any desired purpose may be provided between the lower layer 2X and the upper layer 2Y. Examples of such an intermediate layer include an adhesion layer for improving the adhesion between the lower layer 2X and the upper layer 2Y, and the metal film 23 of the third embodiment. In the case of providing the adhesion layer as the intermediate layer, it is preferable that the adhesion layer is composed of, for example, a mixture of the resin composition constituting the lower layer 2X and the resin composition constituting the upper layer 2Y.

The electronic element and the sheet member of the present invention have been described based on the embodiments described above, but the present invention is not limited thereto. For example, the constituent parts of the electronic element and the sheet member can be replaced with any constitution capable of exhibiting similar functions. In addition, an optional component may be added.

The electronic element and the sheet member may be combined with any of the first to seventh embodiments. The sheet material of each of the above embodiments has a hard coat layer (protective layer), but a hard coat layer (protective layer) may be provided if necessary, and may be omitted. Further, the ground portion is not particularly limited as long as the base material of the sheet material can be grounded (connected with a reference electric potential), and its shape and shape are not particularly limited.

The sheet material may have a single insulating layer and cover all the electronic parts in the single insulating layer or may be configured to cover one electronic part with one sheet material.

The corner portions (layers) constituting the sheet member also have portions that extend slightly when joined (laminated) to the electronic substrate. However, when the thickness of each portion is defined as an average value (average thickness) Almost the same before and after bonding to the electronic substrate.

(Industrial availability)

An electronic element of the present invention includes an electronic board including a wiring board having a mounting surface, a plurality of electronic components mounted on the mounting surface of the wiring board, and a sheet-like substrate And at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one of the electronic components; a grounding member for grounding the substrate of the sheet member, And a ground portion for fixing the ash and the electronic substrate. As a result, it is possible to provide an electronic device which is easy to remove heat from electronic components and is thin and highly reliable. Therefore, the present invention has industrial applicability.

1 sheet material
2 substrate
2a exposed area
2X lower layer
2Y upper layer
20 body part
21 resin
22 conductive particles
23 metal film
24 ebbs
25 resin
26 conductive particles
3 insulating layer
3a First insulation layer
3b second insulating layer
3c third insulating layer
31 resin
32 thermally conductive particles
33 First area
34 Second area
35 insulation part
4 hard coat layer
10 Electronic devices
100 electronic substrate
110 wiring board
101 room scene
101a First mounting area
101b Second mounting area
101c Third mounting area
111 substrate
112 wiring
113 Grand wiring
114 conductive pin
120 semiconductor chip

Claims (18)

An electronic board having a plurality of electronic components mounted on the mounting surface of the wiring board,
Wherein the sheet member comprises a sheet-shaped substrate having conductivity, at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one of the electronic components, And a ground portion that grounds the base material of the sheet material to the electronic substrate and fixes the sheet material and the electronic substrate,
Wherein the base material is composed of a single layer including a cured product of a curable resin and conductive particles dispersed in the cured product and directly bonded to the ground portion and exhibiting an electromagnetic shielding effect.
The method according to claim 1,
Wherein an average thickness of the substrate is 5 to 100 占 퐉.
The method according to claim 1,
Wherein the ground portion includes a ground wiring provided on the side of the mounting surface of the wiring board,
Wherein the insulating layer has a smaller size than the base material when viewed in a plan view,
Wherein the substrate has an exposed region exposed from the insulating layer bonded to the ground wiring.
The method of claim 3,
Wherein the mounting surface of the wiring board is divided by the ground wiring and has a plurality of mounting areas for mounting predetermined electronic components,
Wherein the at least one insulating layer includes an insulating layer provided corresponding to the plurality of mounting regions.
The method according to claim 1,
Wherein the substrate comprises a body portion including the cured product of the curable resin and the conductive particles,
And a metal film provided in contact with the main body portion.
The method according to claim 1,
Wherein the substrate is provided in contact with the insulating layer and includes a first portion containing first conductive particles and a second portion provided on the side opposite to the insulating layer of the first portion, And a second portion containing the second conductive particles in an amount larger than the content of the second conductive particles.
The method according to claim 1,
Wherein the insulating layer comprises a resin and thermally conductive particles dispersed in the resin and having a thermal conductivity higher than that of the resin.
The method according to claim 1,
Further comprising a protective layer provided on a side of the substrate opposite to the electronic substrate and having a function of protecting the substrate.
The method according to claim 1,
Wherein the sheet member further has at least one insulating portion provided separately from the insulating layer on the electronic substrate side of the edge portion of the substrate.
10. The method of claim 9,
Wherein an edge portion of the substrate and the insulating portion constitute a grip portion gripped when the sheet member is separated from the electronic substrate.
A sheet member laminated on an electronic board including a wiring board having a mounting surface and a plurality of electronic components mounted on the mounting surface of the wiring board,
Wherein the sheet member is used by being fixed to the electronic substrate via a ground portion,
A sheet-like base material having conductivity that contacts the ground portion in a state where the sheet material is laminated on the electronic substrate, and
At least one insulating layer located on the electronic substrate side of the substrate and having a size including at least one electronic component in a state where the sheet member is laminated on the electronic substrate,
Wherein the substrate is composed of a cured product of a curable resin and conductive particles dispersed in the cured product and is formed of a single layer directly bonded to the ground portion and exhibiting electromagnetic shielding tabular portions.
12. The method of claim 11,
Wherein the average thickness of the substrate is 5 to 100 占 퐉.
12. The method of claim 11,
Wherein the base material has a first portion provided in contact with the insulating layer and having adhesiveness and a second portion provided on the first portion so as to be opposite to the insulating layer.
14. The method of claim 13,
Wherein the first portion contains a first resin and first conductive particles dispersed in the first resin, and the second portion comprises a second resin and a second resin, wherein the content of the first portion of the first conductive particles Wherein the second conductive particles are dispersed in a larger amount.
15. The method of claim 14,
Wherein the content of the first conductive particles in the first portion is 1 to 100 parts by weight based on 100 parts by weight of the first resin.
15. The method of claim 14,
Wherein the content of the second conductive particles in the second portion is 100 to 1500 parts by weight based on 100 parts by weight of the second resin.
15. The method of claim 14,
Wherein the shape of the first conductive particles and the shape of the second conductive particles are different.
15. The method of claim 14,
The shape of the first conductive particles may be resin (tree) or spherical.

Images