KR102400969B1 - Electronic component mounting board and electronic device - Google Patents

Abstract

The electronic component mounting board 51 according to an embodiment of the present invention includes a board 20 , an electronic component 30 mounted on at least one surface of the board 20 , and an upper surface of the electronic component 30 . and an electromagnetic wave shielding member 1 covering at least a portion of the substrate 20 and a side surface of a stepped portion formed by mounting the electronic component 30 and covering the substrate 20 in the substrate 20 . The electromagnetic wave shielding member 1 has an electromagnetic wave shielding layer 5 containing a binder resin and a conductive filler. The kurtosis of the surface layer of the electromagnetic wave shielding member 1 is 1 to 8 when measured according to JIS B0601;2001.

Description

Electronic component mounting board and electronic device

The present invention relates to an electronic component mounting board having an electromagnetic wave shielding member. It also includes an electromagnetic wave shielding laminate suitable for forming an electromagnetic wave shielding member of an electronic component mounting board and an electronic device on which the electronic component mounting board is mounted.

Electronic components on which IC chips and the like are mounted are generally provided with an electromagnetic wave shielding structure in order to prevent malfunction due to external magnetic fields and radio waves. For example, a method is disclosed in which a conductive adhesive film composed of an isotropic conductive adhesive and an anisotropic conductive adhesive is coated on a substrate on which electronic components are mounted (Patent Document 1). In addition, a method for coating an electromagnetic wave shielding film having a conductive adhesive layer and a substrate layer having a specific storage elastic modulus on a substrate on which an electronic component is mounted (Patent Document 2), and having a layer containing scaly particles exhibiting isotropic conductivity, A method (patent document 3) is disclosed in which an electromagnetic wave shielding member having a specific tensile rupture strain is coated on a substrate on which an electronic component is mounted.

International Patent Publication No. 2015/186624 Japanese Patent Laid-Open No. 2014-57041 International Patent Publication No. 2018/147355

With respect to the board|substrate on which an electronic component is mounted, the electromagnetic wave shielding member is coat|covered by the following method, for example, and an electronic component mounting board|substrate is manufactured. First, as shown in FIG. 18, on the upper surface of the plurality of electronic components 130 mounted on the substrate 120, the electromagnetic wave shielding laminate, which is a laminate of the electromagnetic wave shielding member 102 and the releasable cushion member 103 ( 104) is placed. Next, as shown in FIG. 19 , the electromagnetic wave shielding laminate 104 is thermocompressed to cover a part of the electronic component 130 and the substrate 120 with the electromagnetic wave shielding member 101 . Then, as shown in FIG. 21 , after peeling the releasable cushion member 103 as shown in FIG. 20 , a process of dividing the substrate 120 into unit products is performed. In this dividing process, for example, the electromagnetic wave shielding member 101 is brought into contact with the dicing table 141 , and while maintaining this contacting state, from the substrate 120 side to the groove 125 , which is a gap of the electronic component 130 . This is achieved by cutting the substrate 120 and the electromagnetic wave shielding member 101 by the cutting tool 142 to the opposing positions.

In recent years, in accordance with the stringent demand for high performance of electronic components, a technique for improving the performance of the electromagnetic wave shielding member 101 of the electronic component mounting board is required.

The present invention has been made in view of the above background, and an object of the present invention is to provide an electronic component mounting board and an electronic device having a stable electromagnetic wave shielding member.

As a result of the present inventors repeating earnest examination, in the following example, it discovered that the subject of this invention was solved, and came to complete this invention.

[1]: a substrate, an electronic component mounted on at least one surface of the substrate, and at least a part of the substrate and a side surface of the step portion formed by mounting the electronic component from the upper surface of the electronic component to the substrate JISB0601 of the surface layer of the electromagnetic wave shielding member provided with the electromagnetic wave shielding member for covering, the said electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler; An electronic component mounting board whose kurtosis measured by 2001 is 1 to 8.

[2]: JISB0601 of the surface layer of the electromagnetic wave shielding member; The electronic component mounting board|substrate as described in [1] whose root mean square height Rq measured by 2001 is 0.3-1.7 micrometers.

[3]: The electronic component mounting substrate according to [1] or [2], wherein the conductive filler contains at least one of dendrite-shaped and needle-shaped conductive fillers.

[4]: a substrate, an electronic component mounted on at least one surface of the substrate, and a side surface of a step formed by mounting the electronic component and at least a part of the substrate covered over the substrate from the upper surface of the electronic component provided with an electromagnetic wave shielding member to cover;

The electromagnetic wave shielding member includes an electromagnetic wave shielding layer comprising a binder resin and a conductive filler, and an electronic component mounting substrate having an indentation modulus of 1 to 10 GPa.

[5]: The electronic component mounting substrate according to [4], wherein a water contact angle of the surface layer of the electromagnetic wave shielding member is 70 to 110°.

[6]: In the tape adhesion test after the pressure cooker test according to JIS K5600 of the electromagnetic shielding member, the electromagnetic shielding member on the electronic component exhibits a cross-cut residual ratio of 23/25 or more, in [4] or [5] The described electronic component mounting board.

[7]: JISB0601 of the surface layer of the electromagnetic wave shielding member; The electronic component mounting board according to any one of [4] to [6], wherein the kurtosis measured in 2001 is 1 to 8.

[8]: The electronic component mounting board according to any one of [4] to [7], wherein the root mean square height of the surface of the electromagnetic wave shielding member is in the range of 0.4 to 1.6 µm.

[9]: The electronic component mounting board according to any one of [4] to [8], wherein the Martens hardness of the electromagnetic wave shielding member is 50 to 312 N/mm 2 .

[10]: The binder resin is obtained by thermocompressing a thermosetting resin and a binder resin precursor containing a curable compound having a reactive functional group and a crosslinkable functional group of the thermosetting resin, characterized in that it is obtained by thermocompression, [4] to [9] The electronic component mounting board according to any one of ].

[11]: The electronic component mounting board according to any one of [4] to [10], wherein the electromagnetic wave shielding member has a film thickness of 10 to 200 µm.

[12]: a substrate, an electronic component mounted on at least one surface of the substrate, and a side surface of a step formed by mounting the electronic component and at least a portion of the substrate covered over the substrate from the upper surface of the electronic component Mounting an electronic component comprising an electromagnetic wave shielding member covering the electromagnetic wave shielding member, the electromagnetic wave shielding member having an electromagnetic wave shielding layer comprising a binder resin and a conductive filler, wherein the root mean square height Rq of the surface layer of the electromagnetic wave shielding member is 0.05 µm or more and less than 0.3 µm Board.

[13]: The electronic component mounting substrate according to [12], wherein the root mean square inclination Rdq of the surface layer of the electromagnetic wave shielding member is 0.05 to 0.4.

[14]: The electronic component mounting substrate according to [12] or [13], wherein a water contact angle of the surface layer of the electromagnetic wave shielding member is 90 to 130°.

[15]: The electronic component mounting substrate according to any one of [12] to [14], wherein the conductive filler contains at least one of dendrite-shaped and needle-shaped conductive fillers and a scaly conductive filler.

[16]: An electronic device on which the electronic component mounting board according to any one of [1] to [15] is mounted.

ADVANTAGE OF THE INVENTION According to this invention, the outstanding effect of being able to provide the electronic component mounting board|substrate and electronic device which have a highly reliable electromagnetic wave shielding member is shown.

BRIEF DESCRIPTION OF THE DRAWINGS A schematic perspective view which shows an example of the electronic component mounting board|substrate which concerns on Embodiment A1, B1, and C1.
[FIG. 2] A cross-sectional view of the II-II section of FIG. 1 .
Fig. 3 is a schematic cross-sectional view showing another example of the electronic component mounting board according to the embodiments A1, B1, and C1.
Fig. 4 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to the embodiments A1, B1, and C1.
Fig. 5 is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting substrate according to the embodiments A1, B1, and C1.
Fig. 6 is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting board according to the embodiments A1, B1, and C1.
Fig. 7 is a schematic cross-sectional view showing an example of a manufacturing process of the electronic component mounting substrate according to the embodiments A1, B1, and C1.
Fig. 8 is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting substrate according to the embodiments A1, B1, and C1.
[FIG. 9] A schematic explanatory diagram for explaining the fluctuation factors of the surface layer kurtosis of the electromagnetic wave shielding member.
[FIG. 10] A schematic explanatory diagram for explaining a factor of variation in surface kurtosis of an electromagnetic wave shielding member.
Fig. 11 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to the embodiments A2, B2, and C2.
Fig. 12 is a schematic cross-sectional view showing an example of a laminate for electromagnetic wave shielding according to the embodiments A3, B3, and C3.
Fig. 13 is a schematic cross-sectional view showing an example of the electromagnetic wave shielding laminate according to the embodiments A4, B4, and C4.
Fig. 14A is a schematic cross-sectional view showing an example of a manufacturing process for an electronic component mounting substrate according to the embodiments A4, B4, and C4.
Fig. 14B is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting board according to the embodiments A4, B4, and C4.
Fig. 14C is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting substrate according to the embodiments A4, B4, and C4.
Fig. 15A is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting substrate according to the embodiments A5, B5, and C5.
Fig. 15B is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component mounting board according to the embodiments A5, B5, and C5.
Fig. 15C is a schematic cross-sectional view showing an example of a manufacturing process for an electronic component mounting substrate according to the embodiments A5, B5, and C5.
Fig. 16A is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting substrate according to a modification.
Fig. 16B is a schematic cross-sectional view showing an example of a manufacturing process for an electronic component mounting substrate according to a modification.
Fig. 16C is a schematic cross-sectional view showing an example of a manufacturing process for an electronic component mounting substrate according to a modification.
[FIG. 16D] A schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to a modification.
17 is a schematic cross-sectional view showing an example of an electronic component mounting board according to the present embodiment.
Fig. 18 is a schematic cross-sectional view for explaining a step of coating an electromagnetic wave shielding member on an electronic component or the like.
Fig. 19 is a schematic cross-sectional view for explaining a step of coating an electromagnetic wave shielding member on an electronic component or the like.
Fig. 20 is a schematic cross-sectional view for explaining a step of coating an electromagnetic wave shielding member on an electronic component or the like.
Fig. 21 is a schematic cross-sectional view for explaining a step of coating an electromagnetic wave shielding member on an electronic component or the like.
[Fig. 22] An optical micrograph of the side of the electronic component mounting substrate according to the present embodiment B3.
[ Fig. 23 ] An optical micrograph of the side surface of the electronic component mounting substrate according to the present embodiment B1.
[ Fig. 24] An explanatory view of an evaluation method of an electronic component mounting substrate according to the present embodiment C. [Fig.

Hereinafter, an example of embodiment to which this invention is applied is demonstrated. In addition, the number specified in this specification is a value calculated|required by the method disclosed in embodiment or an Example. In addition, in the present specification, the specific numerical values "A to B" refer to a range that satisfies a value greater than the numerical value A and the numerical value A and a value smaller than the numerical value B and the numerical value B. In addition, in this specification, the sheet|seat shall include not only the sheet|seat defined by JIS but a film. For clarity of explanation, the following description and drawings have been suitably simplified. The various components shown in the present specification may be used in combination of two or more types independently of each other, unless particularly noted. In addition, for the convenience of description, the same code|symbol is attached|subjected to the same element member also in another embodiment.

As an electronic component mounting board according to the present invention, an electronic component mounting board according to Embodiment A-C is disclosed.

[Embodiment A]

The electronic component mounting board of Embodiment A includes a board, an electronic component mounted on at least one surface of the board, and a side surface of a stepped portion formed by mounting the electronic component from the upper surface of the electronic component to the substrate, and and an electromagnetic wave shielding member covering at least a portion of the substrate. The electromagnetic wave shielding member has an electromagnetic wave shielding layer including a binder resin and a conductive filler. And JISB0601 of the surface layer of this electromagnetic wave shielding member; Let the kurtosis measured according to 2001 be 1-8.

According to the prior art, residues as shown in FIG. 20(i) may be deposited on the electromagnetic wave shielding member 101 of the electronic component mounting board. This originates in the releasable cushion member 103 which is a structural member of the laminated body 104 for electromagnetic wave shielding used for forming the electromagnetic wave shielding member 101. As shown in FIG. In the step of peeling the releasable cushion member 103 after thermo-compressing the electromagnetic wave shielding laminate 104 , it is due to the anchor effect in the groove 125 formed in the gap between the electronic component 130 . It is a fragment of the releasable cushion member 103 . This fragment is a factor that remains as a residue even after the process of dividing it into unit products. Residues of the electromagnetic wave shielding member 101 may cause not only poor appearance, but also a decrease in the reliability of electromagnetic wave shielding properties of electronic devices, and may become an obstacle when mounted on a circuit board.

As a method of solving the related problem, in order to reduce the anchor effect of the groove 125 , a method of increasing the width of the gap between the electronic components 130 and lowering the height of the electronic component 130 may be considered. However, this method has a problem in that the shape of the electronic component 130 is limited and cannot be applied to the electronic component 130 having complex irregularities. In addition, if the gap between the electronic components 130 mounted on the substrate 120 can be narrowed, the number of electronic components 130 obtained from one substrate 120 can be improved, thereby contributing to production efficiency. In addition, the electromagnetic wave shielding member 101 is required to have high friction damage resistance in order to prevent a decrease in reliability due to friction damage of the electromagnetic wave shielding member 101 during transport and mounting of the electronic component 130 .

According to the electronic component mounting substrate according to Embodiment A, it is possible to provide an electronic component mounting substrate having a stable electromagnetic wave shielding member that has a high degree of design freedom, suppresses adhesion of residues, and is excellent in friction damage resistance. Therefore, it is particularly suitable for the use of an electronic component mounting board for which the degree of design freedom is to be increased, or a sensitive electronic component mounting board which is prone to friction damage.

[Embodiment B]

The electronic component mounting board of Embodiment B includes a board, an electronic component mounted on at least one surface of the board, and a side surface of a stepped portion formed by mounting the electronic component from an upper surface of the electronic component to the substrate, and and an electromagnetic wave shielding member covering at least a portion of the substrate. This electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and has an indentation modulus of 1 to 10 GPa.

According to the prior art, in the step of dividing the above-described unit product in the manufacturing process of the electronic component mounting board, peeling burrs of the electromagnetic wave shielding member 101 with the cut surface of the electromagnetic wave shielding member 101 as a starting point are generated. There is a problem that it is easy (refer to the partially enlarged view (ii) of FIG. 21 ). The main cause of the burr of the electromagnetic wave shielding member 101 is high-pressure water washing during the dicing process of dividing the product into unit products. In addition, the adhesion between the electromagnetic wave shielding member 101 and the substrate 120 and the like may be lowered in the case of the electronic component mounting board after manufacturing under high heat and humidity conditions. The occurrence of burrs and deterioration in adhesion of the electromagnetic shielding member 101 may cause a decrease in the reliability of electromagnetic shielding properties of electronic devices, and may become an obstacle when mounted on a circuit board.

According to the electronic component mounting board|substrate concerning Embodiment B, generation|occurrence|production of a burr can be suppressed and it is excellent in pressure cooker test (PCT) resistance, and it can provide the electronic component mounting board|substrate which has a highly reliable electromagnetic wave shielding member. Therefore, it is particularly suitable for use in severe conditions such as high-pressure water washing in the process of dividing the product into unit products, or for the use of electronic component mounting boards requiring durability in high heat and humidity conditions.

[Embodiment C]

The electronic component mounting board of Embodiment C includes: a board; an electronic component mounted on at least one surface of the board; and an electromagnetic wave shielding member covering at least a portion of the substrate. This electromagnetic wave shielding member has an electromagnetic wave shielding layer containing a binder resin and a conductive filler, and the root mean square height Rq of the surface layer of the electromagnetic wave shielding member is set to 0.05 µm or more and 0.3 µm or less.

According to the prior art, in the process of dividing the product into unit products, the electromagnetic wave shielding member 101 is brought into contact with the dicing stand 141 through a dicing tape (not shown) (see FIG. 21 ), while maintaining the contact state. In some cases, the substrate 120 and the electromagnetic wave shielding member 101 are cut by the cutting tool 142 at a position opposite to the groove 125 , which is a gap between the electronic components 130 on the substrate 120 side. In this case, after dividing into unit products, the electronic component mounting board is manufactured through a process of peeling the dicing tape and the electromagnetic wave shielding member 101 . However, when the dicing tape is peeled off after being divided into unit products, the electromagnetic wave shielding member 101 may generate . Moreover, a part of electromagnetic wave shielding member may peel. In addition, if a cold-heat cycle test (-50°C to 125°C) is performed, the electromagnetic wave shielding member may be cracked.

Lifting and cracking of the electromagnetic wave shielding member 101 may cause various problems as well as poor appearance. For example, when the electromagnetic wave shielding member 101 and the case are grounded with a conductive adhesive and a conductive adhesive, the adhesive force and connection resistance deteriorate and the reliability of the electromagnetic wave shielding property of the electronic device deteriorates, causing obstacles in mounting on the circuit board. this can be There may also be issues with reliability over time.

According to the electronic component mounting board|substrate which concerns on Embodiment C, the electronic component mounting board|substrate which has a highly reliable electromagnetic wave shielding member excellent in covering property can be provided. Therefore, applications including a step of contacting the electromagnetic wave shielding member and the dicing table using a dicing tape, or applications requiring passing a cooling/heating cycle test, for example, harsh temperatures such as electronic component mounting substrates mounted in automobiles It is particularly suitable for applications requiring the ability to withstand changes.

[Embodiment A]

Hereinafter, a specific example of the electronic component mounting board|substrate which concerns on Embodiment A is demonstrated.

[Embodiment A1]

<Board with Electronic Components>

Fig. 1 is a schematic perspective view showing an example of an electronic component mounting board according to Embodiment A1, and Fig. 2 is a cross-sectional view taken along section II-II of Fig. 1 . The electronic component mounting board 51 includes a board 20 , an electronic component 30 , an electromagnetic wave shielding member 1 , and the like.

The substrate 20 can mount the electronic component 30 and may be any substrate capable of withstanding a thermocompression process described later, and may be arbitrarily selected. For example, a work board in which a conductive pattern made of copper foil or the like is formed on the surface or inside, a mounting module board, a printed wiring board, or a build-up board formed by a build-up method or the like is mentioned. Moreover, you may use the flexible board|substrate of a film or sheet form. The conductive pattern is, for example, an electrode/wiring pattern (not shown) for electrically connecting to the electronic component 30 , and a ground pattern 22 for electrically connecting to the electromagnetic wave shielding member 1 . Electrodes/wiring patterns, vias (not shown), and the like can be arbitrarily provided inside the substrate 20 . The substrate 20 may be a flexible substrate as well as a rigid substrate.

In the example of FIG. 1, the electronic component 30 is arrange|positioned on the board|substrate 20 in 5x4 array shape. And the electromagnetic wave shielding member 1 is installed so that the exposed surface of the board|substrate 20 and the electronic component 30 may be covered. That is, the electromagnetic wave shielding member 1 is coated according to the unevenness formed by the electronic component 30 . By the electromagnetic wave shielding member 1, unnecessary radiation generated in the signal wiring, etc. built into the electronic component 30 and/or the board 20 can be shielded, and malfunction due to external magnetic fields and radio waves can be prevented. .

The number, arrangement, shape, and type of the electronic components 30 may be arbitrarily set. Instead of arranging the electronic components 30 in an array form, the electronic components 30 may be arranged at a desired position. When dividing the electronic component mounting board 51 into unit modules, as shown in FIG. 2 , half-dicing grooves 25 may be provided so as to partition the unit modules in the thickness direction of the board from the upper surface of the board. Moreover, the electronic component mounting board|substrate which concerns on Embodiment A1 includes both the board|substrate before division into unit modules, and the board|substrate after division into unit modules. That is, in addition to the electronic component mounting board 51 on which several unit modules (electronic component 30) are mounted as shown in FIGS. 1 and 2, the electronic component mounting board 52 is also included after being divided into unit modules as shown in FIG. do. Of course, an electronic component mounting board coated with an electromagnetic wave shielding member by mounting one electronic component 30 on the board 20 without going through a process of dividing the product into unit products is also included. That is, the electronic component mounting substrate according to Embodiment A1 encompasses a structure in which at least one electronic component is mounted on the substrate, and the electromagnetic wave shielding member is coated on at least a portion of the step portion formed by the mounting of the electronic component.

The electronic component 30 includes the overall component in which an electronic device such as a semiconductor integrated circuit is integrally covered with an insulator. For example, there exists an aspect in which the semiconductor chip 31 (refer FIG. 3) in which the integrated circuit (not shown) was formed is mold-molded with the sealing material (molding resin 32). The substrate 20 and the semiconductor chip 31 are electrically connected to the wiring or electrode 21 formed on the substrate 20 through the contact region or through the bonding wire 33 , a solder ball (not shown), or the like. connected The electronic component may include an inductor, a thermistor, a capacitor, and a resistor in addition to the semiconductor chip.

The electronic component 30 and the board|substrate 20 which concern on Embodiment A1 are widely applicable about a well-known aspect. In the example of FIG. 3 , the semiconductor chip 31 has a solder ball 24 connected to the back surface of the substrate 20 through an internal via 23 . In addition, a ground pattern 22 for electrically connecting to the electromagnetic wave shielding member 1 is formed on the substrate 20 . In addition, as in Embodiment A4 described later, several electronic components 30 may be mounted on an electronic component mounting board after being divided into unit products or on an electronic component mounting board not divided into unit products (refer to Fig. 14C). In addition, a single or a plurality of electronic devices may be mounted in the electronic component 30 .

<Electromagnetic wave shielding member>

The electromagnetic wave shielding member 1 is obtained by placing an electromagnetic wave shielding laminate on the upper surface of the electronic component 30 mounted on the substrate 20 and coating the electronic component 30 and the substrate 20 by thermocompression bonding. . The electromagnetic wave shielding member 1 covers the upper surface of the electronic component 30 over the substrate 20 , and covers at least a portion of the substrate 20 and the side surface of the step formed by the mounting of the electronic component 30 . In order to sufficiently exhibit the shielding effect, the electromagnetic wave shielding member 1 includes a ground pattern 22 exposed on the side or upper surface of the substrate 20 and/or a ground pattern (not shown) such as wiring for connecting the electronic component 30 . not) is preferred.

The electromagnetic wave shielding member 1 may be formed using a laminate for electromagnetic wave shielding. 4 shows a schematic cross-section of a laminate for electromagnetic wave shielding. The laminated body 4 for electromagnetic wave shielding which concerns on Embodiment A1 is comprised from the member 2 for electromagnetic wave shielding and the releasable cushion member 3. As shown in FIG. This electromagnetic wave shielding member 2 is comprised by the single layer of the electrically conductive adhesive agent layer 6 in Embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermal compression to form the electromagnetic wave shielding layer 5 . In Embodiment A1, the electromagnetic wave shielding layer 5 functions as the electromagnetic wave shielding member 1 .

The electromagnetic wave shielding member 2 is formed from a laminate of two or more conductive adhesive layers as in Embodiment A2 described later, is formed from a laminate of a conductive adhesive layer and a hard coat layer as in Embodiment A3, or is formed from a laminate of a conductive adhesive layer and a hard coat layer, as in Embodiment A4 As described above, it may be formed from a laminate of different layers, such as formed from a laminate of an insulating adhesive layer and a conductive adhesive layer. The electromagnetic wave shielding member 1 obtained by thermocompressing the electromagnetic wave shielding member 2 by thermocompression is constituted by a laminate of two or more electromagnetic wave shielding layers in Embodiment A2, and is composed of a laminate of an electromagnetic wave shielding layer and a hard coat layer in Embodiment A3. In Embodiment A4, it is comprised by the laminated body of an insulating layer and an electromagnetic wave shielding layer. Therefore, the electromagnetic wave shielding member may be composed of a laminate of the electromagnetic wave shielding layer and another layer.

The electromagnetic wave shielding layer 5 includes a binder resin and a conductive filler. The conductive fillers in the electromagnetic wave shielding layer 5 are continuously contacted to exhibit conductivity. As for the sheet resistance of the electromagnetic wave shielding layer 5 from a viewpoint of improving electromagnetic wave shielding property, 1 ohm/square or less is preferable.

The electromagnetic wave shielding member 1 is JISB0601 of the upper surface; The kurtosis measured according to 2001 shall be 1-8. The kurtosis is an index indicating the surface roughness curve expressed by Equation (1), and indicates the flatness of the height distribution and the degree of sharpness.

Here, L is the reference length. In addition, Rq is the root mean square height, and it is expressed by the following Equation (2) by taking the height change of the surface along one axis (x-axis) as Z(x).

Kurtosis represents the mean of four squares of Z(x), at a reference length dimensioned by the four powers of the root-mean-square height Rq. When the kurtosis is 3, it indicates that the sharp distribution of the convex portion (or the concave portion) is close to the normal distribution. As the kurtosis becomes greater than 3, the number of steep and sharp ridges (or recesses) for a reference height Rq increases, and kurtosis less than 3 indicates that the number of steep and sharp ridges (or recesses) decreases.

Although the manufacturing method will be described later, when the electromagnetic wave shielding laminate 4 is thermocompressed to the substrate on which the electronic component 30 is mounted, and then the electromagnetic wave shielding member 1 and the releasable cushion member 3 are peeled off, half-dicing The releasable cushion member 3 of the groove 25 is pulled off while being taken almost vertically. Since the releasable cushion member 3 is easy to break due to the anchoring effect, a technique for suppressing this is required. As a result of the present inventors' earnest examination, it was discovered that control of the shape of the contact interface of the electromagnetic wave shielding member 1 is important, and the range of the above kurtosis is preferable for this shape.

By setting the kurtosis to 8 or less, the releasable cushion member 3 filled in the half-dicing grooves 25 of the electronic component 30 can be easily peeled from the electromagnetic wave shielding member 1 . It is thought that this is because the kurtosis of the surface shape of the electromagnetic wave shielding member 1 became appropriate, and peeling of the releasable cushion member 3 and the electromagnetic wave shielding member 1 became easy. On the other hand, by making the surface layer kurtosis of the electromagnetic wave shielding member 1 into 1 or more, steel wool resistance can be improved. As a result, it is possible to increase the friction damage resistance and provide a stable electronic component mounting substrate. A preferable range of the kurtosis of the electromagnetic wave shielding member is 1.5 to 6.5, and a more preferable range is 2 to 4.

It is preferable that the root mean square height of the surface of the electromagnetic wave shielding member 1 shall be in the range of 0.4-1.6 micrometers, It is more preferable to set it as 0.5-1.5 micrometers, It is more preferable to set it as 0.7-1.2 micrometers. In the present specification, the kurtosis and the root mean square height refer to values obtained by the method described in Examples to be described later.

The surface kurtosis of the electromagnetic wave shielding member 1 can be adjusted according to the manufacturing process of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminated body 4 . Moreover, it can adjust with the kind of each component of the composition of the member for electromagnetic wave shielding before thermocompression bonding for forming the electromagnetic wave shielding member 1, and its compounding quantity. The details will be described later. In addition, as a result of repeated studies by the present inventors, it was confirmed that the kurtosis value does not substantially fluctuate before and after the reflow treatment, or the amount of change is small even if it fluctuates by adding a conductive filler in an amount that can function as an electromagnetic wave shielding layer did.

<Method for manufacturing electronic component mounting board>

Hereinafter, an example of the manufacturing method of the electronic component mounting board|substrate of Embodiment A1 is demonstrated using FIGS. However, the manufacturing method of the electronic component mounting board|substrate of this invention is not limited to the following manufacturing method.

The manufacturing method of the electronic component mounting board|substrate 51 which concerns on Embodiment A1 is (a) the process of mounting the electronic component 30 on a board|substrate, [b] electromagnetic wave on the board|substrate 20 on which the electronic component 30 was mounted. Step of loading the shielding laminate 4, [c] bonding the electromagnetic wave shielding member 1 by thermocompression to at least a part of the side surface of the step formed by the mounting of the electronic component 30 and the exposed surface of the substrate Process, [d] The process of peeling the releasable cushion member 3, and [e] The process of dividing the electronic component mounting board|substrate 51 into unit products is included. Hereinafter, each process is demonstrated.

[a] The process of mounting the electronic component on the board:

First, the electronic component 30 is mounted on the board 20 . For example, a semiconductor chip (not shown) is mounted on the substrate 20 , the substrate 20 on which the semiconductor chip is formed is molded with a sealing resin, and the substrate is positioned above between the electronic components 30 . (20) The encapsulating resin and the substrate 20 are cut in half by dicing or the like so as to reach the inside. There is also a method of arranging the electronic components 30 in an array shape on the pre-half-cut substrate 20 . Through this process, for example, as shown in FIG. 5 , a substrate on which the electronic component 30 is mounted is obtained. In addition, in the example of FIG. 5 , the electronic component 30 refers to an integrated type formed by molding a semiconductor chip, and refers to the overall electronic device protected by an insulator. In the half-cutting, in addition to reaching the inside of the substrate 20 , there is an aspect of cutting to the surface of the substrate 20 . In addition, you may cut out the whole board|substrate 20 at this stage. In this case, it is preferable to mount the board|substrate 20 on the base|substrate with an adhesive tape, and to prevent a position shift from occurring. Although the material of the sealing resin in the case of mold molding is not specifically limited, A thermosetting resin is generally used. The formation method of sealing resin is not specifically limited, Printing, lamination, transfer molding, compression, a casting_mold|template, etc. are mentioned. Molding can be performed arbitrarily, and the mounting method of the electronic component 30 can also be changed arbitrarily.

[b] Loading process for electromagnetic wave shielding on the substrate:

Next, a laminate 4 for electromagnetic wave shielding is prepared, in which the substrate 20 on which the electronic component 30 is mounted is thermally compressed, melted and coated (see FIG. 4 ). The electromagnetic wave shielding laminate 4 is mounted on the upper surface of the electronic component 30 so that the conductive adhesive layer 6 of the electromagnetic wave shielding laminate 4 is on the electronic component 30 side. In this case, the electromagnetic wave shielding laminate 4 may be temporarily attached to a part or the entire surface of the electronic component 30 . Temporary attachment is temporary bonding so as to come into contact with at least a portion of the upper surface of the electronic component 30, and refers to a state in which the conductive adhesive layer 6 is fixed to the adherend at the B stage. As the peeling force, it is preferable that the peeling force for Kapton 200 in the 90° peeling test is about 1 to 5N/cm. An example of a temporary attachment method is to place the electromagnetic wave shielding laminate 4 on the board 20 on which the electronic component 30 is mounted, and to temporarily attach the front or end part by thermocompression lightly with a heat source such as an iron. can do. Depending on the manufacturing equipment or the size of the substrate 20 , a plurality of electromagnetic wave shielding laminates 4 may be used for each region of the substrate 20 . Moreover, you may use the laminated body 4 for electromagnetic wave shielding for every electronic component 30. From the viewpoint of simplification of the manufacturing process, it is preferable to use one electromagnetic wave shielding laminate 4 for all of the plurality of electronic components 30 mounted on the substrate 20 .

[c] forming an electromagnetic wave shielding member:

Next, on the substrate 20 on which the electronic component 30 is mounted, the electromagnetic wave shielding laminate 4 is sandwiched between a pair of press substrates 40 and thermocompressed (see FIG. 6 ). In the electromagnetic wave shielding laminate 4, the conductive adhesive layer 6 and the releasable cushion member 3 are melted by heat, and stretched along the half-cut groove formed in the manufacturing substrate by pressing, the electronic component 30 and It is coated along the substrate 20 . The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 and functions as an electromagnetic wave shielding layer 5 by thermal compression. In Embodiment A1, since the electromagnetic wave shielding member 1 is a single layer of the electromagnetic wave shielding layer 5, the electromagnetic wave shielding layer 5 which is the electromagnetic wave shielding member 1 by thermocompression-bonding the conductive adhesive layer 6 is made. After thermocompression bonding, heat treatment may be separately performed for the purpose of accelerating thermosetting or the like.

When hot-pressing the electromagnetic wave shielding laminated body 4, you may use a thermosoftening member, cushioning paper, etc. between this electromagnetic wave shielding laminated body 4 and the press board|substrate 40 as needed.

The temperature and pressure of the thermocompression bonding step can be arbitrarily set independently of each other within the range that can ensure the coverability of the conductive adhesive layer 6 according to the heat resistance, durability, manufacturing facility, or necessity of the electronic component 30 . Although it does not limit as a pressure range, About 0.1-5.0 MPa is preferable, and the range of 0.5-2.0 MPa is more preferable. By releasing the press substrate 40, a manufacturing substrate as shown in Fig. 7 is obtained. In this way, the upper and side surfaces of the electronic component and the exposed surface of the substrate are covered by the electromagnetic wave shielding member 1 .

It is preferable that the heating temperature of a thermocompression-bonding process is 100 degreeC or more, More preferably, it is 110 degreeC or more, More preferably, it is 120 degreeC or more. Moreover, as an upper limit, although it depends on the heat resistance of the electronic component 30, it is preferable that it is 220 degreeC, It is more preferable that it is 200 degreeC, It is still more preferable that it is 180 degreeC.

The thermocompression time period can be set according to the heat resistance of the electronic component 30 , the binder resin used for the electromagnetic wave shielding member 1 , the production process, and the like. When using a thermosetting resin as a binder resin precursor, the range of about 1 minute - about 2 hours is preferable. Moreover, as for thermocompression bonding time, about 1 minute - about 1 hour are more preferable. By this thermocompression bonding, a thermosetting resin hardens. However, if the thermosetting resin can flow, it may be partially cured or substantially cured before thermocompression.

The thickness of the conductive adhesive layer 6 is set to a thickness capable of forming the electromagnetic wave shielding layer 5 by covering the upper and side surfaces of the electronic component 30 and the exposed surface of the substrate 20 . It may vary depending on the fluidity of the binder resin precursor used and the distance and size between the electronic components 30, but in general, about 10 to 200 μm is preferable. Electromagnetic wave shielding property can be exhibited effectively, making the coatability to sealing resin favorable by this.

The releasable cushion member 3 softens to promote the coating of the conductive adhesive layer 6 and has a function of covering the upper and side surfaces of the electronic component 30 and the exposed surface of the substrate 20, and at the same time, in the peeling process A material excellent in releasability can be used. In the upper layer of the releasable cushion member 3, you may use the thermosoftening member which functions as a cushioning material as needed. In the example of Embodiment A1, the ground pattern 22 formed on the board|substrate 20 and the electromagnetic wave shielding member 1 are electrically connected by the covering of the electromagnetic wave shielding member 1 (refer FIG. 7).

The conductive adhesive layer 6 contains a binder resin precursor and a conductive filler. As the binder resin precursor, a thermoplastic resin, a self-crosslinking resin, several kinds of reactive resins, and a mixture of a thermosetting resin and a crosslinking agent can be exemplified. These may be used in combination. When the thermoplastic resin is entirely used as the binder resin precursor, the binder resin precursor and the binder resin may be substantially the same in the sense that they do not have a crosslinked structure.

[d] Step of peeling the releasable cushion member:

The releasable cushion member 3 coated on the upper layer of the electromagnetic wave shielding member 1 is peeled off. Thereby, the electronic component mounting board|substrate 51 which has the electromagnetic wave shielding member 1 which coat|covers the electronic component 30 is obtained (refer FIG. 1, FIG. 2). For example, peeling of the releasable cushion member 3 may be peeled off by human force at the tip, or may be removed from the electromagnetic wave shielding member 1 by sucking the outer surface of the releasable cushion member 3 . In view of the improvement of yield through automation, peeling by suction is preferable.

[e] The process of dividing into unit products:

Using a cutting tool such as a dicing blade, dicing is performed in the X direction and the Y direction at a position corresponding to the unit product area of the electronic component mounting board 51 (see FIG. 2 ). Through this process, the electronic component 30 is covered with the electromagnetic wave shielding member 1, and the ground pattern 22 formed on the substrate 20 and the electromagnetic wave shielding member 1 are electrically connected to each other, divided into unit products. An electronic component mounting board 51 is obtained. The dicing method is not particularly limited as long as it can be divided into unit products. Dicing is performed on the substrate 20 side or the electromagnetic wave shielding laminate 4 side.

Since the peeling of the releasable cushion member 3 in the step (d) is peeled off at, for example, a 90° angle with respect to the upper surface of the substrate, the releasable cushion member 3 and the half-dicing are performed in the half-dicing groove 25 . A large friction occurs at the contact interface of the electromagnetic wave shielding member 1 on the side of the groove 25 . Therefore, it is technically difficult to cleanly peel the releasable cushion member 3 from the electromagnetic wave shielding member 1, and as described using FIG. may remain Since this residue remains depending on the position even after the division into unit products, reliability is lowered.

According to the present embodiment A1, by setting the kurtosis of the electromagnetic wave shielding member 1 to 1-8, in the step of forming the electromagnetic wave shielding member of the electronic component mounting substrate, the electromagnetic wave shielding laminate is thermocompressed to the electronic component mounting substrate. Then, the releasability of the cushion member with respect to the electromagnetic wave shielding member is improved. In addition, it is possible to effectively suppress a phenomenon in which a part of the electromagnetic wave shielding member is peeled off together with the releasable cushion member and a part of the electromagnetic wave shielding member is damaged. Therefore, a reliable electronic component mounting board can be provided. In addition, it is possible to increase the design freedom of the height of the electronic component mounted on the substrate and the design freedom of the gap width between the electronic components.

<Laminate for electromagnetic wave shielding>

As demonstrated in FIG. 4, the laminated body for electromagnetic wave shield of Embodiment A1 is comprised from the two layers of the member 2 for electromagnetic wave shielding and the releasable cushion member 3. As shown in FIG. In Embodiment A1, the member 2 for electromagnetic wave shield consists of the conductive adhesive layer 6 of a single layer. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression process to function as the electromagnetic wave shielding layer 5 .

(conductive adhesive layer)

The conductive adhesive layer 6 is a layer formed from a resin composition containing a binder resin precursor and a conductive filler. The binder resin precursor contains at least a thermosoftening resin. Thermosoftening resin can illustrate a thermoplastic resin, a thermosetting resin, and actinic-ray-curable resin. Thermosetting resins and actinic-ray-curable resins generally have a reactive functional group. When using a thermosetting resin, a sclerosing|hardenable compound and a thermosetting adjuvant can be used together. Moreover, when using actinic-ray-curable resin, a photoinitiator, a sensitizer, etc. can be used together. From the viewpoint of the simplicity of the manufacturing process, the thermosetting type which cures at the time of thermocompression bonding is preferable.

In addition, a self-crosslinking resin or various resins that crosslink each other may be used. Moreover, you may mix a thermoplastic resin other than these resin. Compounding components, such as resin and a curable compound, can each independently be made into individual or a plurality of combinations.

In addition, in the stage of the conductive adhesive layer 6, bridge|crosslinking may be partially formed and it may become B-stage (semi-hardened state). For example, a thermosetting resin and a part of the curable compound may react to form a semi-cured state.

Preferred examples of the thermosoftening resin include a polyurethane resin, a polycarbonate resin, a styrene elastomer resin, a phenoxy resin, a polyurethane urea resin, a polyimide resin, a polyamide resin, a polycarbonate imide resin, a polyamideimide resin, an epoxy resin, Epoxy ester resin, acrylic resin, polyester resin, polystyrene, polyester amide resin, and polyether ester resin are mentioned. The thermosetting resin when used under severe conditions during reflow preferably includes at least one of an epoxy resin, an epoxy ester-based resin, a urethane-based resin, a urethane-urea-based resin, and a polyamide.

Among these, polyurethane resin, polycarbonate resin, styrene elastomer resin, phenoxy resin, polyamide resin, and polyimide resin are preferable. Moreover, resin which has polycarbonate frame|skeleton represented by General formula (1) in resin is preferable.

-R-O-CO-O- ... General formula (1)

In the formula, R is a divalent organic group.

The thermosoftening resin can be used individually by 1 type or in mixture of 2 or more types in arbitrary ratios.

As resin which has polycarbonate frame|skeleton, the polyurethane resin which has polycarbonate frame|skeleton other than polycarbonate resin, polyamide resin, and polyimide resin can be illustrated. For example, according to polycarbonate-imide resin, heat resistance, insulation, and chemical-resistance can be improved by having a polyimide skeleton. On the other hand, by having polycarbonate skeleton, flexibility and adhesiveness can be improved effectively.

Examples of the polycarbonate urethane resin include 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,4-cyclohexanedimethanol, 1,9-nonanediol, or 2-methyl-1,8- A polycarbonate polyol based on one or two or more diols such as octanediol may be used as the polyol component.

The said thermosoftening resin may have two or more functional groups which can be used for the crosslinking reaction by heating as a thermosetting resin. The functional group includes, for example, a hydroxyl group, a phenolic hydroxyl group, a carboxyl group, an amino group, an epoxy group, an oxetanyl group, an oxazoline group, an oxazine group, an aziridine group, a thiol group, an isocyanate group, a blocked isocyanate group, and a silanol group.

The curable compound has a reactive functional group and a crosslinkable functional group of the thermosetting resin. The curable compound includes an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, a polycarbodiimide compound, an azirazine compound, a dicyandiamide compound, an amine compound such as an aromatic diamine compound, a phenol compound such as a phenol novolac resin, and an organometallic compound etc. are preferable. The curable compound may be a resin. In this case, as for the division of a thermosetting resin and a sclerosing|hardenable compound, the one with a large content is distinguished as a thermosetting resin, and the one with little content is distinguished as a curable compound.

It is preferable that 1-70 mass parts is included with respect to 100 mass parts of thermosetting resins, as for a sclerosing|hardenable compound, 3-65 mass parts is more preferable, 3-60 mass parts is still more preferable. A sclerosing|hardenable compound can be used individually by 1 type or in combination of multiple types.

Preferred examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, esteramide resin, polyisoprene and cellulose. Examples of the tackifying resin include rosin-based resins, terpene-based resins, alicyclic petroleum resins, and aromatic petroleum resins. In addition, a conductive polymer can be used. Examples of the conductive polymer include polyethylenedioxythiophene, polyacetylene, polypyrrole, polythiophene, and polyaniline. Preferred examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, esteramide resin, polyisoprene and cellulose.

As the conductive filler, a metal filler, conductive ceramic particles, and mixtures thereof can be exemplified. Examples of the metal filler include core-shell particles of metal powders such as gold, silver, copper and nickel, alloy powders such as solder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder. From a viewpoint of obtaining the outstanding electroconductive property, the electroconductive filler containing silver is preferable. From the viewpoint of cost, a silver-coated copper powder in which the copper powder is coated with silver is particularly preferable.

As for the silver content of silver-coated copper powder, 3-20 mass % is preferable in 100 mass % of total of silver and copper, More preferably, it is 8-17 mass %, More preferably, it is 10-15 mass %. In the case of core-shell particles, the average coverage of the coating layer on the core portion is preferably 60% or more, more preferably 70% or more, and still more preferably 80% or more. Although a non-metal may be sufficient as a core part, an electroconductive substance is preferable from a viewpoint of electroconductivity, and a metal particle is more preferable.

As the conductive filler, an electromagnetic wave absorbing filler may be used. For example, iron, Fe-Ni alloy, Fe-Co alloy, Fe-Cr alloy, Fe-Si alloy, Fe-Al alloy, Fe-Cr-Si alloy, Fe-Cr-Al alloy, Fe-Si-Al alloy Ferritic materials, such as ferrite alloys, such as an alloy, Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite, carbon filler, etc. are mentioned. Examples of the carbon filler include acetylene black, ketjen black, furnace black, carbon black, carbon fibers, carbon nanotubes, graphene particles, graphite particles, and carbon nanowalls.

The shape of the conductive filler used in the conductive adhesive layer can be exemplified by particles, dendrite (resin) particles, needle-shaped particles, plate-shaped particles, grape-shaped particles, fibrous particles, and spherical particles, but the numerical value of the desired kurtosis It is preferable to contain a conductive filler of needle-shaped particles and/or dendrite-shaped particles from the viewpoint of controlling the . Here, the needle refers to a needle having a major diameter of at least three times the short diameter, and includes a spindle shape, a columnar shape, and the like, in addition to the so-called needle shape. In addition, the dendrite shape refers to a shape in which a plurality of branching branches extend in two or three dimensions from the main axis of the rod shape when observed with an electron microscope (500 to 20,000 times). The dendrite shape may be such that the branching branches are curved or extend from branching branches back to branching branches.

Further, by containing the scaly particles as the conductive filler, it is possible to provide an electromagnetic wave shielding member excellent in coating properties. Here, scaly, flaky, and plate-shaped are also included. The conductive filler may be scaly in its entirety, and may have an elliptical shape, a circular shape, or a cut mark or the like around the fine particles.

Conductive fillers are used individually or in mixture. When a conductive filler is used together, from the viewpoint of obtaining a desired kurtosis and providing a highly reliable electromagnetic wave shielding member, a combination of scaly particles and dendrite particles, a combination of scaly particles and needle particles, scaly particles, dendrites A combination of shaped particles and acicular particles is preferred. Particularly preferred is a combination of scaly particles and needle-like particles.

The content of the conductive filler is preferably 40 to 85% by mass, more preferably 50 to 80% by mass, based on the solid content (100% by mass) of the thermosoftening resin composition layer.

It is preferable to make needle-shaped particle|grains or/and dendrite-shaped particle|grains into 50 mass % or less with respect to 100 mass % of electroconductive fillers in a conductive adhesive layer. More preferably, it is 0.5-40 mass %, More preferably, it is 2-27 mass %. By setting it as 50 mass % or less, the peelability of a releasable cushion member can be improved, and friction damage resistance can be improved effectively.

2-100 micrometers is preferable and, as for average particle diameter D50 of acicular particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. Similarly, 2-100 micrometers is preferable and, as for the preferable range of average particle diameter D50 of dendrite-like particle|grains, it is more preferable than 2-80 micrometers. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. 2-100 micrometers is preferable and, as for the average particle diameter D50 of scaly particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers.

The average particle diameter D50 can be measured by a laser diffraction/scattering method. Specifically, for example, it is a numerical value obtained by measuring each conductive fine particle in a tornado dry powder sample module using a laser diffraction/scattering method particle size distribution measuring device LS 13320 (manufactured by Beckman Coulter), and the cumulative value of the particles is 50% It is the average particle diameter of the diameter of the particle size. In addition, the refractive index is measured as 1.6. The average particle diameter D50 of each particle of the electromagnetic wave shielding member 1 can measure 100 particle diameters using a scanning electron microscope (SEM), and can calculate|require a frequency distribution. For needle-shaped particles and dendrite-shaped particles, the particles use the maximum length of each particle.

By using the dendrite particles and/or acicular particles together with the scaly particles, the contact points between the conductive fillers can be increased and the shielding properties can be improved. In addition, by using the dendrite-like particles and/or the needle-like particles together, the contact area with the binder component is increased, the kurtosis value can be easily adjusted, and the friction damage resistance can be improved. Therefore, it is possible to provide a highly reliable electromagnetic wave shielding member.

The composition constituting the conductive adhesive layer may also contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent, and the like.

As a colorant, an organic pigment, carbon black, ultramarine blue, red iron oxide, zinc oxide, titanium oxide, graphite etc. are mentioned, for example. Among these, the printing visibility of the shielding layer is improved by including a black colorant.

Examples of the flame retardant include a halogen-containing flame retardant, a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, and an inorganic flame retardant.

Examples of the inorganic additive include glass fiber, silica, talc, and ceramics.

Examples of the lubricant include fatty acid esters, hydrocarbon resins, paraffin, higher fatty acids, fatty acid amides, aliphatic alcohols, metal soaps, and modified silicones.

Examples of the antiblocking agent include calcium carbonate, silica, polymethylsilsesquioxane, and aluminum silicate salt.

The conductive adhesive layer may be a layer having conductivity by continuously contacting conductive fillers by thermal compression, and may not necessarily have conductivity in the step prior to thermal compression. The conductive adhesive layer may be formed by mixing and stirring the composition containing the above-described conductive filler and the binder resin precursor, coating the composition on a releasable substrate, and then drying the mixture. Moreover, it can form also by the method of coating-drying directly on the cushion member 3 of releasability.

After coating the coating liquid of a conductive adhesive layer, a conductive adhesive layer is formed on a dry releasability base material. It is preferable to heat (for example, 80-120 degreeC) in a drying process. In order to adjust the kurtosis of the electromagnetic shielding member, it is preferable to dry the coating solution at 25° C. (room temperature) and atmospheric pressure for 1 to 10 minutes before heating and drying after coating. More preferably, the drying time at 25° C. (room temperature) before drying by heat is 2 to 6 minutes. The kurtosis value can be adjusted by drying at room temperature before heat drying.

The effect of the viscosity of the coating solution and the drying time at 25° C. before drying by heat on the kurtosis of the electromagnetic wave shielding member 1 will be described using the schematic diagram of FIG. 9 . As shown, a coating liquid is applied to form a conductive adhesive layer 6 on the releasable substrate 15 . A dry conductive adhesive layer 6P containing a solvent can be obtained.

By setting a long drying time at 25° C. for the dry conductive adhesive layer 6P, as shown in FIG. 9, the state in which the evaporation rate of the solvent is slow is intentionally lengthened, and thus the binder resin precursor 10 is It can promote not going down. On the other hand, by setting the drying time to be short at 25°C, as shown in FIG. 9 , it is suppressed from sinking to the bottom of the binder resin precursor 10, and by heating and drying at that stage, the conductive filler 11 is Easier to stand up In addition, foaming due to evaporation of the solvent tends to occur, and the upper surface tends to be rough.

The solid content of the coating liquid is preferably 20 to 50% in order to set the kurtosis value of the electromagnetic wave shielding member 1 to 1-8. Moreover, in order to adjust the kurtosis of an electromagnetic wave shielding member, it is preferable to make the coating liquid viscosity measured with the B-type viscometer of the said coating liquid into the range of 200-5000 mPa*s. In addition, in order to adjust the kurtosis of the electromagnetic wave shielding member, it is preferable to set the thixotropy index of the coating solution to 1.2 to 2.0. In addition, the conductive filler 11 of FIG. 9 and FIG. 10 mentioned later is a scaly particle, and the figure has shown the sectional drawing of the cut part in the thickness direction rather than the planar view with respect to the main surface.

The kurtosis value varies depending on the viscosity of the coating liquid for forming the conductive adhesive layer. There exists a tendency for the fluidity|liquidity of an electroconductive filler to be suppressed for a thing with a high coating-liquid viscosity. Therefore, when the viscosity is high, the conductive filler 11 tends to be random without orientation. On the other hand, when the viscosity is low, the scaly particles tend to be oriented so that the main surface is usually opposite to the substrate surface. In addition, when the drying time is shortened at 25° C. and heat-dried, if the viscosity is high, the surface roughness due to foaming tends to increase, and if the viscosity is low, the conductive filler tends to move in the vertical direction.

In this way, the kurtosis can be adjusted by adjusting the viscosity of the coating solution and the drying time at 25°C.

In addition, the kurtosis of the electromagnetic wave shielding member 1 can be adjusted according to the particle diameter of dendrite-shaped particle|grains and/or needle-shaped particle|grains. The effect of the particle diameter of the dendrite-shaped particles and/or the needle-shaped particles on the kurtosis of the electromagnetic wave shielding member 1 will be described with reference to the schematic explanatory diagram of FIG. 10 . A dry conductive adhesive layer 6P can be obtained by apply|coating a coating liquid in order to form the conductive adhesive layer 6 on the releasable base material 15 like FIG. In Fig. 10, members and components common to Fig. 9 are denoted by the same reference numerals. As shown in FIG. 10 , when the average particle diameter D50 of the dendrite particles 12, which is a kind of conductive filler, is small, the kurtosis value tends to be small, and conversely, the average particle diameter D50 of the dendrite particles 12 is small. When this value is large, the kurtosis value tends to become large. Although it varies with the thickness of the conductive adhesive layer 6, when it is desired to make the value of kurtosis small, for example, when the average particle diameter D50 is 2-5 micrometers and wants to increase the value of kurtosis, for example, average particle size If the diameter D50 is set to 20-50 μm, and such an intermediate value is desired, the average particle diameter D50 can be set to more than 5 μm and less than 20 μm.

In addition, in order to adjust the kurtosis of the electromagnetic wave shielding member 1, after coating and drying the conductive adhesive composition for forming the conductive adhesive layer 6 which is the outermost layer of the electromagnetic wave shielding member 2, corona treatment and plasma treatment It is preferable to do As for corona treatment, it is preferable that the irradiation amount of corona discharge electrons is 1-1,000 W/m<2>/min, and it is preferable to set it as 10-100 W/m<2>/min.

The kurtosis of the electromagnetic wave shielding member 1 can be adjusted by increasing the addition amount of the needle-shaped or dendrite-shaped conductive filler in the composition for forming the electromagnetic wave shielding member 2 before thermocompression bonding. In addition, the kurtosis of the electromagnetic wave shielding member 1 can be adjusted also with the average particle diameters D50 and D90 of an electroconductive filler.

In Embodiment A1, since the member 2 for electromagnetic wave shielding consists of a single layer of the conductive adhesive layer 6, the releasable cushioning member 3 is laminated|stacked on this conductive adhesive layer 6. The lamination method includes a method by lamination and the like.

The releasable substrate is a substrate having releasability on one or both sides, and is a sheet having a tensile strain at break of less than 50% at 150°C. The releasable base material is, for example, polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, hard polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene/vinyl alcohol air Synthetic, polycarbonate, polyacrylonitrile, polybutene, soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane resin, ethylene vinyl acetate copolymer, polyvinyl acetate, etc. plastic sheet, etc. Glassine paper, top and papers such as paper, kraft paper, and coated paper, various nonwoven fabrics, synthetic paper, metal foil, or a composite film in which these are combined.

(Without releasable cushioning)

The releasability cushion member serves as a cushion for promoting the followability of the conductive adhesive layer to the electronic component, and is a sheet having releasability. That is, it is a layer that can be peeled from the electromagnetic wave shielding member 1 after the thermal compression process. Moreover, it is preferable that it is a layer which melts at the time of thermocompression compression when the tensile rupture strain at 150 degreeC is 50 % or more.

In addition, the tensile rupture strain of the releasable base material and the releasable cushion member 3 are the values calculated|required by the following method. The releasability base material and the releasability cushion member were cut into the size of 200 mm width x length 600 mm, and it was set as the measurement sample. A tensile test (test speed of 50 mm/min) was implemented on the measurement sample on the conditions of the temperature of 25 degreeC, and 50% of relative humidity using the small tabletop tester EZ-TEST (made by Shimadzu Corporation) about the measurement sample. Tensile rupture strain (%) was calculated from the obtained S - S curve (stress-strain curve).

As the releasability cushion member 3, polyethylene, polypropylene, polyether sulfone, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, a cyclic olefin polymer, and silicone are preferable. Among these, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are more preferable from a viewpoint of making embedding property and peelability compatible. The release property cushion member may be used in a single layer, or may be used in multiple layers. In the case of multiple layers, the same or different types of sheets may be laminated.

Although the lamination method of the releasable cushion member 3 and the conductive adhesive layer 6 is not specifically limited, The method of laminating such a sheet|seat is mentioned. Since the releasability cushion member 3 finally peels, a material excellent in releasability is preferable. The thickness of the releasable cushion member is, for example, about 50 µm to 3 mm, and more preferably about 100 µm to 1 mm.

[Embodiment A2]

Next, the example of the electronic component mounting board|substrate different from Embodiment A1 is demonstrated. The electronic component mounting board according to Embodiment A2 differs from Embodiment A1 using the electromagnetic wave shielding member comprising a single electromagnetic wave shielding layer in that the electromagnetic wave shielding member is composed of two electromagnetic wave shielding layers, but other basic structures and manufacturing methods are It is the same as that of Embodiment A1. In addition, embodiment A1 and overlapping description are abbreviate|omitted suitably.

As shown in Fig. 11, the electromagnetic wave shielding member of Embodiment A2 is an electromagnetic wave shielding member (6a) comprising two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. It is formed using the laminated body 4a for electromagnetic wave shielding which contains 2a) and the releasable cushion member 3a. By thermocompressing this electromagnetic wave shielding laminate 4a, the electromagnetic wave shielding member which consists of a 1st electromagnetic wave shielding layer and a 2nd electromagnetic wave shielding layer is coat|covered on the board|substrate on which an electronic component was mounted. It is possible to increase the degree of freedom in designing the electromagnetic wave shielding member by configuring it with two electromagnetic wave shielding layers. The upper second conductive adhesive layer 6a2 is manufactured with the same composition and process as in Embodiment A1, and the lower first conductive adhesive layer 6a1 is not limited to the range of kurtosis and can be designed as needed. For example, it can be set as the layer using fillers, such as a fibrous particle spherical particle, as a conductive filler contained in the 1st conductive adhesive layer 6a1. It is also possible to design the first conductive adhesive layer 6a1 as an anisotropic conductive adhesive layer and the second conductive adhesive layer 6a2 as an isotropic conductive adhesive layer. Moreover, the aspect which sets it as the laminated body of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer is also preferable. You may laminate|stack three or more layers of electromagnetic wave shielding layers.

According to the electronic component mounting board|substrate concerning Embodiment A2, the effect similar to Embodiment A1 can be acquired using the electromagnetic wave shielding member which consists of two electromagnetic wave shielding layers. In addition, since the degree of design freedom of each layer can be increased by laminating two electromagnetic wave shielding layers, there is an advantage in that it is easy to provide an electromagnetic wave shielding member if necessary.

[Embodiment A3]

The electronic component mounting board according to Embodiment A3 differs from Embodiment A1 in that the electromagnetic wave shielding member consists of a laminate of an electromagnetic wave shielding layer and a hard coat layer, but has a different basic configuration and the manufacturing method is the same.

As shown in FIG. 12, the electromagnetic wave shielding member according to Embodiment A3 is a laminate of a single conductive adhesive layer 6b and an insulating resin layer 7b, an electromagnetic wave shielding member 2b and a releasable cushion member 3b. It is formed using the electromagnetic wave shielding laminated body (4b) which consists of. By thermocompressing this electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding layer formed of a conductive adhesive layer 6b and a hard coat layer formed of an insulating resin layer 7b on a substrate on which an electronic component is mounted. An electromagnetic wave shielding member can be obtained. The electromagnetic wave shielding member according to Embodiment A3 has a kurtosis of 1-8 when measured from the hard coat layer side.

The insulating resin layer 7b is a layer formed from a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosoftening resin. Examples of the thermosoftening resin and the examples and preferred examples of the binder resin precursor are the same as in the composition of the conductive adhesive layer of the electromagnetic wave shielding member mentioned in Embodiment A1. The binder resin precursor of the conductive adhesive layer and the insulating resin layer may be the same or different.

Unlike the conductive adhesive layer of Embodiment A1, the inorganic filler does not have conductivity, but preferable characteristics of the inorganic filler, such as shape, compounding amount, D50 and D90, etc., are the same as in the example listed in the conductive filler. Examples of the inorganic filler include silica, alumina, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesium oxide, talc, kaolinite, mica, basic magnesium carbonate, sericite, montmorillonite, bentonite. Inorganic compounds, such as these are mentioned.

The heat-softening resin composition and the heat-softening resin composition layer may contain a colorant, a silane coupling agent, an ion scavenger, an antioxidant, a tackifying resin, a plasticizer, an ultraviolet absorber, a leveling agent, a flame retardant, and the like, if necessary.

According to the electronic component mounting board|substrate concerning Embodiment A3, the electromagnetic wave shielding member excellent in durability by covering the electromagnetic wave shielding layer with a hard coat layer in addition to the effect mentioned in Embodiment A1 by using the electromagnetic wave shielding member which has a hard coat layer can provide

[Embodiment A4]

The electronic component mounting board according to Embodiment A4 differs from Embodiment A1 using an electromagnetic wave shielding member comprising a single-layer electromagnetic wave shielding layer in that the electromagnetic wave shielding member is formed of a laminate of an electromagnetic wave shielding layer and an insulating coating layer, but has a different basic configuration and manufacturing The method is the same as that of Embodiment A1.

As shown in Fig. 13, the electromagnetic wave shielding member according to Embodiment A4 includes an electromagnetic wave shielding member 2c that is a laminate of an insulating adhesive layer 8c and a conductive adhesive layer 6c, and a releasable cushion member 3c. It is formed using the laminated body 4c for electromagnetic wave shielding.

In Embodiment A4, a method of coating an electromagnetic wave shielding member on a substrate on which a plurality of electronic components (eg, semiconductor packages) that have not been divided into unit products or have been divided into unit products are formed will be described. As shown in FIG. 14A, the electromagnetic wave shielding laminate 4c is placed above the board 20 on which the electronic component 30 having the solder ball 24 serving as a connection terminal with the board 20 is mounted. and thermocompression is performed on the substrate 20 on which the electronic component 30 is mounted from the releasable cushion member 3c side (FIG. 14B). Then, the releasable cushion member 3c is peeled off, and the electronic component mounting board|substrate 53 on which the electromagnetic wave shielding member 1c of FIG. 14C was laminated|stacked is obtained.

The obtained electronic component mounting board|substrate 53 can take GND from the upper surface of the electromagnetic wave shielding layer 5c. Instead of this method, a ground pattern is provided on the substrate 20, and in order to conduct the ground pattern and the electromagnetic wave shielding layer 5c, an insulating coating layer 9c is drilled through the ground pattern to conduct the electromagnetic wave shielding layer 5c. A conductive connector portion may be provided.

In Embodiment A4, an example of a method for manufacturing an electronic component mounting board that does not require a step of dividing into unit products has been described. However, on a motherboard, product unit units shown in Fig. 14C are formed in an array form to form an electromagnetic wave shielding laminate 4c. The electronic component mounting board shown in FIG. 14C can also be obtained by carrying out the process of dividing into unit products after forming an electromagnetic wave shielding layer by putting it on and thermocompressing it.

The insulating adhesive layer 8c is a layer formed from a resin composition containing a binder resin precursor. The binder resin precursor contains at least a thermosoftening resin. Examples and preferred examples of the binder resin precursor include the binder resin precursor of the conductive adhesive layer mentioned in Embodiment A1. The binder resin precursors of the insulating adhesive layer 8c and the conductive adhesive layer 6c may be the same or different.

The thermosoftening resin composition and the thermosoftening resin composition layer may contain, if necessary, a colorant, a silane coupling agent, an ion scavenger, an antioxidant, a tackifying resin, a plasticizer, an ultraviolet absorber, a leveling agent, a flame retardant, an inorganic filler, and the like. .

According to the electronic component mounting board according to Embodiment A4, by using the electromagnetic wave shielding member 1c having the insulating layer 9c, in addition to the effects mentioned in Embodiment A1, circuits other than the ground pattern or conductor parts such as electrode patterns And it is possible to prevent a short circuit of the electromagnetic wave shielding member, and to improve bonding reliability between the electronic component and the electromagnetic wave shielding layer. In addition, the insulation reliability of the electronic component can be improved. Therefore, it is possible to provide an electromagnetic wave shielding member having excellent durability. As a result, the electronic component mounting board|substrate which has the outstanding electromagnetic wave shielding property can be provided. In addition, since the shielding layer can be collectively formed on the entire substrate, the manufacturing process is simple and the thickness can be significantly reduced compared to the shielding can.

In addition, although the example in which the insulating layer 9c is mainly used for reinforcing the bonding of an electronic component and an electromagnetic wave shielding member in Embodiment A4 is given, the insulating layer 9c can also be applied to a sealing material. When the insulating layer 9c is applied to the encapsulant, there is an advantage that the encapsulation process of a semiconductor chip and the like and the coating of the electromagnetic wave shielding member can be performed in the same process. That is, the electromagnetic wave shielding member according to Embodiment A4 is applied to an electronic component that is not integrally covered with an insulator, and an insulating coating layer corresponding to the encapsulant (molding resin) can be obtained from the insulating adhesive layer. In this case, in order to cover the electromagnetic wave shielding member on the side surface of the electronic part, a press plate in which recesses corresponding to the electronic parts are formed in an array shape (a press plate with protrusions for embedding the electromagnetic wave shielding member in the gap between the electronic parts) may be used. good night.

[Embodiment A5]

In the electronic component mounting substrate according to Embodiment A5, the electromagnetic wave shielding layer and the ground pattern are in direct contact with each other, and the conductive adhesive layer located in the inner layer of the electromagnetic wave shielding laminate is exposed at the stage of the laminate. Use a laminate for electromagnetic wave shielding having This exposed region is provided so that the electromagnetic wave shielding layer contacts and conducts with a conductive pattern such as a ground pattern formed on a substrate or the like. Embodiment A5 differs from Embodiment A4 in this respect, but other basic structure and manufacturing method are the same.

The laminated body for electromagnetic wave shielding according to Embodiment A5 has the same laminated structure as Embodiment A4, but electromagnetic waves at positions corresponding to the regions covering the ground pattern 22 formed on the substrate 20 as shown in FIG. 15A In the shielding laminate 4d, the conductive adhesive layer 6d is exposed. Specifically, when viewed from above from the insulating adhesive layer 8d side, the exposed region of the conductive adhesive layer 6d is provided. In the example of the electromagnetic wave shielding laminate 4d in Fig. 15A, the size of the insulating adhesive layer 8d is made smaller than that of the electromagnetic wave shielding laminate 4d, and in the frame region of the electromagnetic wave shielding laminate 4d. The conductive adhesive layer 6d is exposed. In the related configuration, as shown in Figs. 15B and 15C, the electronic component mounting substrate 54 in which the ground pattern 22 and the electromagnetic wave shielding layer 5d are in contact and conduction by thermocompression is obtained. The position of the exposed portion of the conductive adhesive layer 6d of the electromagnetic wave shielding laminate 4d is not limited to the example of Fig. 15A, and the exposed portion may be formed in an opening pattern.

[Embodiment B]]

Hereinafter, a specific example of the electronic component mounting board|substrate which concerns on Embodiment B is demonstrated.

<Board with Electronic Components>

In the electronic component mounting board of Embodiment B1, the electromagnetic wave shielding member specified in Embodiment B is used instead of the electromagnetic wave shielding member specified in Embodiment A above. The electronic component mounting substrate of Embodiment B1 and its manufacturing method have the same basic configuration and manufacturing method as Embodiment A1 except that the electromagnetic wave shielding member according to Embodiment B is used and the points are separately described. Therefore, descriptions of overlapping parts are omitted appropriately.

As a preferable example of the basic structure of the electronic component mounting board|substrate concerning Embodiment B1, the basic structure of the electronic component mounting board|substrate of Embodiment A1 demonstrated with reference to FIGS. 1-10 mentioned above can be illustrated. Hereinafter, the characteristic part of Embodiment B1 is demonstrated using these drawings.

<Electromagnetic wave shielding member>

In the electromagnetic wave shielding member 1 according to the embodiment B1, as described in the embodiment A1, the electromagnetic wave shielding laminate is placed on the upper surface of the electronic component 30 mounted on the substrate 20 and the electronic component is thermally compressed by thermal compression. (30) and by coating the substrate (20). Since the coating form of the electromagnetic wave shielding member 1 is the same as that of Embodiment A1, it abbreviate|omits.

The electromagnetic wave shielding member 1 of Embodiment B1 can be formed using the laminated body for electromagnetic wave shielding similarly to Embodiment A1. And as shown in FIG. 4, the laminated body 4 for electromagnetic wave shielding is comprised with the member 2 for electromagnetic wave shielding and the releasable cushion member 3. As shown in FIG. This electromagnetic wave shielding member 2 is comprised by the single layer of the conductive adhesive agent layer 6 similarly to Embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermal compression to form the electromagnetic wave shielding layer 5 . In Embodiment B1, this electromagnetic wave shielding layer 5 functions as an electromagnetic wave shielding member.

As described in Embodiment A1, the electromagnetic wave shielding member 2 of Embodiment B1 is formed from a laminate of two or more conductive adhesive layers, is formed from a laminate of a conductive adhesive layer and a hard coat layer, or is an insulating adhesive layer You may form from the laminated body of another layer, such as forming from the laminated body of a and conductive adhesive layer.

The electromagnetic wave shielding layer 5 of Embodiment B1 contains binder resin and an electroconductive filler. The conductive fillers in the electromagnetic wave shielding layer 5 are continuously contacted to exhibit electrical conductivity. As for the sheet resistance of the electromagnetic wave shielding layer 5 from a viewpoint of improving electromagnetic wave shielding property, 1 ohm/square or less is preferable.

The electromagnetic wave shielding member 1 of Embodiment B1 sets the indentation elastic modulus to 1-10 GPa. By setting the indentation elastic modulus within this range, it becomes possible to suppress small local deformations with respect to the stress of the electromagnetic wave shielding member 1, and as a result, it is possible to effectively suppress the damage caused by burrs of the electromagnetic wave shielding member 1 have. Moreover, since it is excellent in PCT resistance, the fall of the adhesive force after a reflow process can be suppressed effectively. Therefore, a high-quality electronic component mounting board can be provided.

By setting the indentation elastic modulus of the electromagnetic wave shielding member 1 of Embodiment B1 to 1 GPa or more, deformation of the electromagnetic wave shielding member 1 with respect to the stress received by a cutting tool such as a dicing blade or the like in the cutting process is suppressed, and by the manufacturing process The burr (refer FIG. 21(ii)) of the electromagnetic wave shielding member 1 generated can be suppressed effectively. In addition, the burr referred to in this specification means peeling of the electromagnetic wave shielding member with the cut surface of the electromagnetic wave shielding member 1 as a starting point.

The press-fitting elastic modulus of the electromagnetic wave shielding member 1 of Embodiment B1 can be adjusted by the composition of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminated body 4 mentioned later before thermocompression bonding. More specifically, it can be adjusted by the type of the binder resin precursor of the composition of the electromagnetic wave shielding member 2 before thermocompression to form the electromagnetic wave shielding member 1, the blending amount of each component, and the like. Specifically, the indentation modulus tends to increase as the content of the filler increases. In addition, the indentation modulus tends to increase by increasing the content of the functional group and the curable compound of the resin used as the binder resin precursor. Moreover, there exists a tendency for an indentation elastic modulus to become large, so that the hardness of binder resin is high. Therefore, it is preferable to make appropriate the kind of binder resin precursor for forming binder resin, or the crosslinking density of binder resin. The crosslinking density can be easily adjusted by the kind or functional group of the resin and the curable compound.

In addition, the indentation modulus can be thought of as a Young's modulus indicating a characteristic with respect to deformation of a material due to external stress. The "indentation modulus" in the present specification refers to a value obtained by the measurement method and measurement conditions described in Examples to be described later.

A more preferable range than the indentation elastic modulus of the electromagnetic wave shielding member 1 of Embodiment B1 is more than 1.5 GPa and 8 GPa or less, and a more preferable range is 2 GPa or more and 7.4 GPa or less.

The film thickness of the electromagnetic wave shielding member 1 of Embodiment B1 can be suitably selected according to a use. For the use in which thickness reduction is requested|required, thickness T1 and T2 of the electromagnetic wave shielding member 1 which coat|covers the upper surface of an electronic component can be made into about 10-200 micrometers, for example.

Product information may be engraved on the electronic component 30 . In this case, there is a method of forming the electromagnetic wave shielding member 1 after engraving on the electronic component 30 , and a method of engraving on the electromagnetic wave shielding member after forming the electromagnetic wave shielding member 1 on the electronic component 30 . In either case, good visibility of the engraving is required while maintaining high shielding properties. From the viewpoint of satisfying both characteristics, the film thickness T1 of the electromagnetic wave shielding member is preferably 10 µm or more, and more preferably 20 µm or more. There is no upper limit on the film thickness of the electromagnetic wave shielding member in the latter engraving method, ie, in the case of imprinting on the electromagnetic wave shielding member. On the other hand, the upper limit of the film thickness T1 of the electromagnetic wave shielding member is preferably 50 µm or less, and more preferably 30 µm or less in the former method of engraving, that is, when engraving directly on an electronic component, in order to maintain the visibility of the engraving.

It is preferable that the water contact angle of the surface layer of the electromagnetic wave shielding member 1 of Embodiment B1 shall be 70-110 degrees. By setting it as this range, damage to the electromagnetic wave shielding layer at the time of a manufacturing process can be suppressed more effectively. In addition, generation of burrs can be suppressed when the releasable cushion member filled in the groove-shaped recesses formed in the half-dicing grooves 25 of the electronic component 30 is removed from the electromagnetic wave shielding member 1 . A more preferable range of the water contact angle of the electromagnetic wave shielding member is 75 to 105 degrees, and a more preferable range is 80 to 100 degrees. The water contact angle of the electromagnetic wave shielding member may be adjusted according to the amount of the surface conditioning agent added in the composition forming the electromagnetic wave shielding member. The value of the water contact angle tends to increase as the addition amount of the surface conditioning agent of the electromagnetic wave shielding member 1 increases.

In order to make the pressure cooker test (hereinafter also referred to as PCT) resistance more excellent, it is preferable to set the Martens hardness of the electromagnetic wave shielding member 1 of Embodiment B1 to 50 N/mm 2 or more. By making the indentation elastic modulus of the electromagnetic wave shielding member 1 into the range of 1-10 GPa, and combining Martens hardness of 50 N/mm<2> or more further, it becomes the thing excellent in the adhesiveness after a pressure cooker test. As a result, even after reflow, the electromagnetic wave shielding member 1 excellent in adhesiveness can be provided. As for Martens hardness, 60N/mm<2> or more is more preferable, and 70N/mm<2> or more is still more preferable.

The Martens hardness can be adjusted according to the hardness of the conductive filler and the binder component. The hardness of the binder component mainly depends on the hardness of the cured product of the thermosetting resin and the curable compound. Specifically, the addition of scaly particles tends to increase the Martens hardness, and the addition of spherical or dendrite particles tends to decrease the Martens hardness. In addition, as the amount of the conductive filler increases, the Martens hardness tends to increase. In addition, the higher the hardness of the resin after curing, the harder the Martens hardness.

Although the manufacturing method will be described later, the electromagnetic wave shielding member 1 releasability after thermal compression of the electromagnetic wave shielding laminate 4 to the substrate 20 on which the electronic component 30 is mounted. In JISB0601 of the surface layer of the electromagnetic wave shielding member 1; It is preferable that the kurtosis measured according to 2001 be 8 or less. By setting it as 8 or less, the kurtosis of the surface shape of the electromagnetic wave shielding member 1 becomes an appropriate thing, and it is thought that peeling of the releasable cushion member 3 and the electromagnetic wave shielding member 1 becomes easy. As a result, it is possible to effectively suppress a phenomenon in which the releasable cushion member 3 is cut in the half-dicing groove 25 in the gap between the electronic components and remains as a residue. In addition, in this specification, a broken piece means the releasable cushioning member which broke when peeling the releasable cushioning member, and has remained in the groove|channel which is a gap|interval of an electronic component.

In addition, from the viewpoint of improving the friction damage resistance, it is preferable that the kurtosis of the electromagnetic wave shielding member 1 of Embodiment B1 is 1 or more. By setting it as 1 or more, steel-wool resistance can be improved. A more preferable range of the kurtosis of the electromagnetic wave shielding member is 1.5 to 6.5, and a more preferable range is 2 to 4. In addition, the adjustment method of the electromagnetic wave shielding member 1 surface is as mentioned in Embodiment A1.

The root mean square height Rq of the surface of the electromagnetic wave shielding member 1 of Embodiment B1 is preferably in the range of 0.4 to 1.6 µm, more preferably 0.5 to 1.5 µm, still more preferably 0.7 to 1.2 µm. do. In the present specification, the kurtosis and the root mean square height refer to values obtained by the method described in Examples to be described later.

<Method for manufacturing electronic component mounting board>

The manufacturing method of the electromagnetic wave shielding member 1 of Embodiment B1 is basically the same as the manufacturing method of the electromagnetic wave shielding member 1 of Embodiment A1. From the viewpoint of increasing the adhesive strength of the tape after PCT in the step (c), it is preferable that the binder resin constituting the electromagnetic wave shielding layer 5 has a three-dimensional crosslinked structure. When dicing is performed in the process of dividing the product into unit products in step (e), high-pressure water washing may be performed to cool the frictional heat caused by dicing and wash away the dicing waste generated by dicing. In the electronic component mounting board|substrate 51 which concerns on Embodiment B, peeling of the electromagnetic wave shielding member 1 by the impact of high pressure water washing can be improved remarkably by making the indentation elastic modulus into 1-10 GPa.

<Laminate for electromagnetic wave shielding>

As demonstrated in FIG. 4, the laminated body for electromagnetic wave shield of Embodiment B1 is comprised from the two layers of the member 2 for electromagnetic wave shielding and the releasable cushion member 3. As shown in FIG. In Embodiment B1, the member 2 for electromagnetic wave shield consists of the conductive adhesive layer 6 of a single layer. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression process to function as the electromagnetic wave shielding layer 5 .

(conductive adhesive layer)

The conductive adhesive layer 6 is a layer formed from a resin composition containing a binder resin precursor and a conductive filler. The binder resin precursor contains at least a thermosoftening resin. As thermosoftening resin, a thermoplastic resin, a thermosetting resin, and actinic-ray-curable resin can be illustrated. Thermosetting resins and actinic-ray-curable resins generally have a reactive functional group. When using a thermosetting resin, a sclerosing|hardenable compound and a thermosetting adjuvant can be used together. Moreover, when using actinic-ray-curable resin, a photoinitiator, a sensitizer, etc. can be used together. From the viewpoint of the simplicity of the manufacturing process, the thermosetting type which cures at the time of thermocompression bonding is preferable.

In addition, a self-crosslinking resin or various resins that crosslink each other may be used. Moreover, you may mix a thermoplastic resin other than these resin. Mixing components, such as resin and a sclerosing|hardenable compound, can each independently be used individually or in multiple combinations.

In addition, in the stage of the conductive adhesive layer 6, bridge|crosslinking may be partially formed and it may become B-stage (semi-hardened state). For example, the thermosetting resin and a portion of the curable compound may react to form a semi-cured state.

Preferred examples of the thermosoftening resin are the same as in Embodiment A1. The said thermosoftening resin may have several functional groups which can be used for the crosslinking reaction by heating as a thermosetting resin. Specific examples of the functional group are the same as in Embodiment A1.

The curable compound has a reactive functional group and a crosslinkable functional group of the thermosetting resin. By crosslinking, adhesiveness can be further strengthened and water resistance can also be improved. The curable compound includes an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, a polycarbodiimide compound, an aziridine compound, a dicyandiamide compound, an amine compound such as an aromatic diamine compound, a phenol compound such as a phenol novolac resin, and an organometallic compound etc. are preferable. The curable compound may be a resin. In this case, as for the division of a thermosetting resin and a sclerosing|hardenable compound, the one with a large content is distinguished as a thermosetting resin, and the one with little content is distinguished as a curable compound.

The said epoxy compound is a compound which has two or more epoxy groups in 1 molecule. The properties of the epoxy compound may be liquid or solid. As an epoxy compound, a glycidyl ether type epoxy compound, a glycidylamine type epoxy compound, a glycidyl ester type epoxy compound, a cyclic aliphatic (alicyclic) epoxy compound, etc. are preferable, for example.

As a glycidyl ether type epoxy compound, For example, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, a bisphenol AD type epoxy compound, a cresol novolak type epoxy compound, a phenol novolak type epoxy compound Compound, α-naphthol novolac type epoxy compound, bisphenol A novolac type epoxy compound, dicyclopentadiene type epoxy compound, tetrabrombisphenol A type epoxy compound, brominated phenol novolak type epoxy compound, tris(glycidyloxy) phenyl)methane, tetrakis(glycidyloxyphenyl)ethane, etc. are mentioned.

Examples of the glycidylamine-type epoxy compound include tetraglycidyl diaminodiphenylmethane, triglycidyl paraaminophenol, triglycidyl metaaminophenol, and tetraglycidyl metaxylenediamine. .

As a glycidyl ester type epoxy compound, glycidyl phthalate, diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate, etc. are mentioned, for example.

Examples of the cyclic aliphatic (alicyclic) epoxy compound include epoxycyclohexylmethyl-epoxycyclohexane carboxylate and bis(epoxycyclohexyl) adipate. Moreover, a liquid epoxy compound can be used preferably.

Examples of the imidazole compound include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, and the like. imidazole compounds, and further, latent curing accelerators with improved storage stability, such as a type insolubilized in a solvent by reacting an imidazole compound with an epoxy resin, or a type in which the imidazole compound is encapsulated in microcapsules. However, among these, a latent hardening accelerator is preferable from a viewpoint of starting hardening after thermal melting of a conductive adhesive layer.

The structure and molecular weight of a sclerosing|hardenable compound can be designed suitably according to a use. It is preferable to use two or more types of sclerosing|hardenable compounds from which molecular weight differs from a viewpoint of effectively suppressing a burr|burr by adjusting an indentation elastic modulus in the range of 1-10 GPa. There is also an effect of increasing the tensile rupture strain of the electromagnetic wave shielding layer by using the first curable compound and the second curable compound.

It is preferable that 1-70 mass parts is included with respect to 100 mass parts of thermosetting resins, as for a sclerosing|hardenable compound, 3-65 mass parts is more preferable, 3-60 mass parts is still more preferable. When using together a 1st curable compound and a 2nd curable compound, it is preferable to contain 5-50 mass parts of 1st curable compound with respect to 100 mass parts of thermosetting resin, It is more preferable to contain 10-40 mass parts, It is more preferable to contain 20-30 mass parts. On the other hand, it is preferable to contain 0-40 mass parts with respect to 100 mass parts of thermosetting resins of 2nd sclerosing|hardenable compound, It is more preferable that 5-30 mass parts is included, It is more preferable that 10-20 mass parts is included.

Preferred examples of the thermoplastic resin are the same as in Embodiment A1. In addition, as an electroconductive filler, a metal filler, electroconductive ceramic particle|grains, and a mixture thereof can be illustrated. The preferable example of a metal filler is the same as that of Embodiment A1. In addition, the silver content of the above-mentioned silver-coated copper powder is also the same as that of Embodiment A1. Moreover, in the case of core-shell-type particle|grains, the preferable range of the coverage of the coating layer with respect to a core part is also the same as that of Embodiment A1. Although a non-metal may be sufficient as a core part, an electroconductive substance is preferable from a viewpoint of electroconductivity, and a metal particle is more preferable.

An electromagnetic wave absorbing filler may be used as an electroconductive filler, and the specific example is the same as that of Embodiment A1.

Examples of the shape of the conductive filler used in the conductive adhesive layer include scaly particles, dendrite particles, needle-like particles, plate-like particles, grape-like particles, fibrous particles, and spherical particles. It is preferable to contain a conductive filler of needle-shaped particles and/or dendrite-shaped particles from the viewpoint of controlling the value of kurtosis. Here, the needle shape means that the long diameter is three times or more of the short diameter, and includes a spindle shape, a column shape, etc. in addition to the so-called needle shape. In addition, the dendrite shape refers to a shape in which a plurality of branch branches extend in two or three dimensions from the main axis of the rod shape when observed with an electron microscope (500 to 20,000 times). The dendrite shape may be such that the branching branches are curved or extend from branching branches back to branching branches.

Further, by containing the scaly particles as the conductive filler, it is possible to provide an electromagnetic wave shielding member excellent in covering properties. Here, scaly, flaky, and plate-shaped are also included. The conductive filler may be scaly in its entirety, and may have an elliptical shape, a circular shape, or a cut mark or the like around the fine particles. The scaly particles tend to have a high Martens hardness, and the spherical and resinous particles tend to have a low Martens hardness. In addition, as the amount of the conductive filler increases, the Martens hardness tends to increase. In addition, the higher the hardness of the resin after curing, the harder the Martens hardness.

Conductive fillers are used individually or in mixture. For example, a combination of scaly and spherical particles, a combination of scaly and dendrite particles, a combination of scaly and acicular particles, a combination of scaly and acicular particles, and a combination of scaly and dendrite particles can do. In addition, nano-sized spherical particles may be used in combination.

Moreover, by using together dendrite-like particle|grains and/or acicular particle|grains, the contact point of electroconductive fillers can be increased, and a shielding characteristic can be improved. In addition, since the contact area with the binder component can be increased by using the dendrite-shaped particles and/or the needle-shaped particles together, it is possible to provide a high-quality electromagnetic wave shielding member.

The content of the conductive filler is preferably 40 to 85% by mass, more preferably 50 to 80% by mass, based on the solid content (100% by mass) of the thermosoftening resin composition layer.

It is preferable to contain 50 mass % or less of needle-shaped particle|grains or/and dendrite-shaped particle|grains with respect to 100 mass % of electroconductive fillers in a conductive adhesive layer. More preferably, it is 0.5-40 mass %, More preferably, it is 1-35 mass %, Especially preferably, it is 1-30 mass %. By containing 50 mass % or less, the electromagnetic wave shielding member excellent in friction damage resistance can be provided.

The average particle diameter D50 of the scaly particles is preferably 2 to 100 µm. A nano-sized conductive filler may be mixed with the scaly particles.

2-100 micrometers is preferable and, as for average particle diameter D50 of acicular particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. Similarly, 2-100 micrometers is preferable and, as for the preferable range of average particle diameter D50 of dendrite-like particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. 2-100 micrometers is preferable and, as for the average particle diameter D50 of scaly particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. By using the scaly particles and dendrite particles together, the surface gloss can be optimized and the print visibility can be improved when characters are directly printed on the electromagnetic wave shielding layer.

The measuring method of the average particle diameter D50, etc. are as mentioned in Embodiment A1. The composition constituting the conductive adhesive layer contains the additives (colorant, flame retardant, inorganic additive, lubricant, antiblocking agent, etc.) mentioned in Embodiment A1. Each specific example is the same as Embodiment A1.

The conductive adhesive layer may be a layer having conductivity by continuously contacting conductive fillers by thermal compression, and may not necessarily have conductivity in the step prior to thermal compression. The conductive adhesive layer may be formed by mixing and stirring the composition containing the above-described conductive filler and the binder resin precursor, coating the composition on a releasable substrate, and then drying the mixture. Moreover, it can form also by the method of coating-drying directly on the cushion member 3 of releasability.

After coating the coating liquid of the conductive adhesive layer, it is dried to form a conductive adhesive layer on the releasable substrate. It is preferable to heat (for example, 80-120 degreeC) in a drying process. From a viewpoint of adjusting the kurtosis of an electromagnetic wave shielding member, it is preferable to carry out drying at 25 degreeC (room temperature) and atmospheric pressure for 1 to 10 minutes before heat-drying after coating a coating liquid. More preferably, drying time at 25 degreeC (room temperature) before heat-drying is 2 to 6 minutes. The kurtosis value can be adjusted by providing a process of drying at room temperature before drying by heating.

The effect of the viscosity of the coating liquid and the drying time at 25° C. before drying by heat on the kurtosis of the electromagnetic wave shielding member 1 will be described using the schematic diagram of FIG. 9 . As shown, a coating liquid is applied to form a conductive adhesive layer 6 on the releasable substrate 15 . A dry conductive adhesive layer 6P containing a solvent can be obtained. The laminate for electromagnetic wave shielding can be manufactured by the same method as the laminate for electromagnetic wave shielding of Embodiment A1.

[Embodiment B2]

Next, an example of the electronic component mounting board|substrate different from Embodiment B1 is demonstrated. The electronic component mounting board according to Embodiment B2 differs from Embodiment B1 using an electromagnetic wave shielding member comprising a single electromagnetic wave shielding layer in that the electromagnetic wave shielding member is composed of two electromagnetic wave shielding layers, but other basic structures and manufacturing methods are It is the same as Embodiment B1. In addition, the basic configuration and manufacturing method of Embodiment A2 are the same as those of Embodiment A2, except that the electromagnetic wave shielding member according to Embodiment B is used instead of the electromagnetic wave shielding member according to Embodiment A and the points are separately described. Duplicate descriptions are appropriately omitted.

The electromagnetic wave shielding member of Embodiment B2, as shown in FIG. 11, is an electromagnetic wave shielding member (6a) comprising two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. It is formed using the laminated body 4a for electromagnetic wave shielding which contains 2a) and the releasable cushion member 3a. The electromagnetic wave shielding member composed of the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer is coated on the substrate 20 on which the electronic component 30 is mounted by thermocompressing the electromagnetic wave shielding laminate 4a. Let the indentation elastic modulus when measured from the surface layer side in the electromagnetic wave shielding member which is a laminated body of this two-layer electromagnetic wave shielding layer be 1-10 GPa. It is possible to increase the degree of freedom in designing the electromagnetic wave shielding member by configuring it with two electromagnetic wave shielding layers. For example, a form of a laminate of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer may be exemplified. You may laminate|stack three or more layers of electromagnetic wave shielding layers.

According to the electronic component mounting board|substrate concerning Embodiment B2, the effect similar to Embodiment B1 can be acquired using the electromagnetic wave shielding member which consists of two electromagnetic wave shielding layers. In addition, since the degree of design freedom of each layer can be increased by stacking two electromagnetic wave shielding layers, there is an advantage in that it is easy to provide an electromagnetic wave shielding member if necessary.

[Embodiment B3 - Embodiment B5]

The electronic component mounting board according to the embodiments B3 to B5 and the method for manufacturing the same, in which the electromagnetic wave shielding member according to the embodiment B (including the description of the embodiments B1 and B2) is used instead of the electromagnetic wave shielding member according to the embodiment A Except for the above, description of Embodiment A3 - Embodiment A5 mentioned above can be invoked. Therefore, description of the electronic component mounting board|substrate of Embodiment B3 to B5 and its manufacturing method is abbreviate|omitted.

[Embodiment C]

Hereinafter, a specific example of the electronic component mounting board|substrate which concerns on Embodiment C is demonstrated.

[Embodiment C1]

<Board with Electronic Components>

In the electronic component mounting board of Embodiment C1, the electromagnetic wave shielding member of Embodiment C is used instead of the electromagnetic wave shielding member of Embodiment A. Except for the electromagnetic wave shielding member of Embodiment C1 and the point separately described, the electronic component mounting board|substrate of Embodiment C1 and its manufacturing method have the same basic structure and manufacturing method as Embodiment A1. A general description is appropriately omitted.

As a preferable example of the basic structure of the electronic component mounting board|substrate which concerns on Embodiment C1, the basic structure of the electronic component mounting board|substrate of Embodiment A1 demonstrated with reference to FIGS. 1-10 mentioned above can be illustrated. Hereinafter, the characteristic part of Embodiment C1 is demonstrated using these drawings.

<Electromagnetic wave shielding member>

As described in Embodiment A1, the electromagnetic wave shielding member 1 of Embodiment C1 is, as described in Embodiment A1, an electronic component ( 30) and the substrate 20 are obtained by coating. Since the coating form of the electromagnetic wave shielding member 1 is the same as that of Embodiment A1, it abbreviate|omits.

The electromagnetic wave shielding member 1 of Embodiment C1 can be formed using the laminated body for electromagnetic wave shielding similarly to Embodiment A1. And as shown in FIG. 4, the laminated body 4 for electromagnetic wave shielding is comprised from the member 2 for electromagnetic wave shielding and the cushioning member 3 with a release property. This electromagnetic wave shielding member 2 is comprised by the single layer of the conductive adhesive agent layer 6 similarly to Embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermal compression to form the electromagnetic wave shielding layer 5 . This electromagnetic wave shielding layer 5 functions as the electromagnetic wave shielding member 1 .

As described in Embodiment A1, the member 2 for electromagnetic wave shielding of Embodiment C1 is formed from a laminate of two or more conductive adhesive layers, formed from a laminate of a conductive adhesive layer and a hard coat layer, or an insulating adhesive It can be formed from the laminated body of another layer, such as forming from the laminated body of a layer and a conductive adhesive layer.

The electromagnetic wave shielding layer 5 of Embodiment C1 contains binder resin and an electroconductive filler. The conductive fillers in the electromagnetic wave shielding layer 5 are continuously contacted to exhibit conductivity. As for the sheet resistance of the electromagnetic wave shielding layer 5 from a viewpoint of improving electromagnetic wave shielding property, 1 ohm/square or less is preferable.

The electromagnetic wave shielding member 1 is JISB0601 of the surface layer; Let the root mean square height Rq measured according to 2001 be 0.05 micrometer or more and 0.3 micrometer or less. The root mean square height Rq is a parameter corresponding to the standard deviation of the distance from the mean plane, and corresponds to the standard deviation of the height. It is expressed by Equation (2). L is the reference length.

As a result of repeated studies by the inventors of the present inventors, the shape of the contact interface of the surface layer of the electromagnetic wave shielding member 1 made the root mean square height Rq in the range of 0.05 µm or more and 0.3 µm or less, and the cold-heat cycle test (-50 ° C. to 125 µm) ℃) can effectively prevent cracking of the electromagnetic wave shielding member, and it has been shown that an electromagnetic wave shielding member having excellent coverage can be provided. Therefore, a highly reliable mounting electronic component mounting board can be provided. The electronic component mounting board|substrate of this embodiment is especially suitable as an electronic component mounting board|substrate (for example, the electronic component mounting board|substrate mounted in an automobile) used for the electronic device used in the harsh environment with a large temperature difference.

In the manufacturing process of the electronic component mounting board, the electromagnetic wave shielding member is fixed to the dicing table through a dicing tape, and while maintaining this state, a process of dividing each product into unit products from the board side may be performed. In this case, the dicing tape and the electromagnetic wave shielding member are peeled off after the process is finished. In this case, lifting (partial adhesion failure) or peeling may occur between the electromagnetic wave shielding member and the electronic component. According to the electronic component mounting board|substrate of this embodiment, when the root mean square height Rq of the surface layer of an electromagnetic wave shielding member shall be 0.05 micrometer or more and 0.3 micrometer or less, the outstanding effect can be exhibited also with respect to a related problem.

According to this embodiment, since it has the electromagnetic wave shielding layer excellent in coating property which is excellent in cooling-heat cycle resistance and adhesiveness with the electronic component after the process of dividing into unit products, a highly reliable electronic component mounting board|substrate can be provided.

In addition, the electronic component mounting board may be subjected to a high-temperature treatment such as a reflow process. In this case, the material of the electronic component mounting board, for example, a component of a solder flux may adhere to the electromagnetic wave shielding member 101 . Also about the related problem, the outstanding effect can be exhibited by setting the root mean square height Rq of the surface layer of the electromagnetic wave shielding member of Embodiment C1 to 0.05 micrometer or more and 0.3 micrometer or less. That is, there is an effect of effectively preventing the adhesion of substances on the electromagnetic wave shielding member 1 . This is considered to be because it is possible to effectively prevent substances such as components of soldering flux from remaining on the uneven surface by making the surface unevenness of the electromagnetic wave shielding member 1 appropriate.

From the viewpoint of realizing excellent coverage in the above cold-heat cycle test, the preferred range of the root mean square height Rq of the electromagnetic wave shielding member of Embodiment C1 is 0.05 to 0.29 µm, more preferably 0.05 to 0.27 µm, particularly preferred range is 0.05~0.25㎛.

The root mean square inclination Rdq of the surface layer of the electromagnetic wave shielding member 1 of Embodiment C1 is preferably in the range of 0.05 to 0.4, more preferably 0.05 to 0.37, and still more preferably 0.1 to 0.35. In the present specification, the root mean square height Rq and the root mean square slope Rdq are JISB0601; It is a result value measured according to 2001, and refers to a value obtained by the method described in Examples to be described later. By setting the root mean square inclination Rdq to 0.05 to 0.4, the antifouling performance can be improved more effectively.

The root mean square slope Rdq is the root mean square root of the local slope dz/dx in the reference length, and is expressed by the following formula (3).

Rdq can be calculated by processing the surface shape obtained in one of an optical microscope, a laser microscope, and an electron microscope with analysis software. Rdq This is a parameter that expresses the roughness of the upper surface. Although the arithmetic mean height Ra and the maximum height Rz and Rq are used as parameters for expressing the properties of the upper surface, these parameters represent only the height of the irregularities and are not suitable for accurately expressing the state of the surface.

The larger the value of Rdq, the steeper the surface asperity becomes. That is, the degree of roughness of the surface asperity can be judged by the numerical value of Rdq.

The root mean square height Rq and the root mean square inclination Rdq of the surface of the electromagnetic wave shielding member 1 of Embodiment C1 can be adjusted according to the manufacturing process of the electromagnetic wave shielding member 2 in the electromagnetic wave shielding laminated body 4 . In addition, for forming the electromagnetic wave shielding member 1, it can adjust with the component and compounding quantity of the composition of the member for electromagnetic wave shield before thermocompression bonding. Details will be described later. In addition, as a result of repeated studies by the present inventors, by mixing an amount of a conductive filler capable of functioning as an electromagnetic wave shielding layer, the values of the root mean square height Rq and the root mean square inclination Rdq before and after the reflow treatment do not substantially change or It was confirmed that the amount of change was small even if it fluctuated. By blending the inorganic filler in the insulating layer such as the hard coat layer disclosed in the examples to be described later, the values of the root mean square height Rq and the root mean square inclination Rdq before and after the reflow treatment do not substantially fluctuate or the amount of change even if they fluctuate confirmed that it is small.

It is preferable that the water contact angle of the surface layer of the electromagnetic wave shielding member 1 of Embodiment C1 sets it as 90-130 degrees. By setting it as this range, a float can be suppressed more effectively and antifouling property can be improved more effectively. A more preferable range of the water contact angle of the electromagnetic wave shielding member is 95 to 125°, and a more preferable range is 100 to 120°. The water contact angle of the electromagnetic wave shielding member may be adjusted according to the amount of the surface conditioning agent added in the composition forming the electromagnetic wave shielding member. As the addition amount of the surface conditioning agent of the electromagnetic wave shielding member 1 increases, the value of the water contact angle tends to become large.

<Method for manufacturing electronic component mounting board>

The manufacturing method of the electromagnetic wave shielding member 1 of Embodiment C1 is basically the same as the manufacturing method of the electromagnetic wave shielding member 1 of Embodiment A1. The thickness of the conductive adhesive layer 6 is such that the upper and side surfaces of the electronic component 30 and the exposed surface of the substrate 20 are covered, and the electromagnetic wave shielding layer 5 can be formed. Although it may vary depending on the fluidity of the binder resin precursor used and the distance and size between the electronic components 30, in general, about 10 to 200 μm is preferable, more preferably about 15 to 100 μm, and 20 to 70 μm degree is more preferable.

In Embodiment C1, the case where the electromagnetic wave shielding member 1 is fixed to a dicing stand using a dicing tape, and dicing is performed from the board|substrate 20 side is demonstrated. This method is suitable when the solder ball is bonded to the outer main surface of the substrate 20 . According to the electromagnetic wave shielding member 1 according to Embodiment C1, the electromagnetic wave shielding in the step of dividing into unit products by setting the root mean square height Rq of the surface layer of the electromagnetic wave shielding member 1 in the range of 0.05 µm or more and 0.3 µm or less Even when the member 1 side is fixed with a dicing tape, it is possible to effectively prevent lifting (poor adhesiveness) and peeling of electronic components of the electromagnetic wave shielding member, thereby providing an electronic component mounting substrate with good coverage.

<Laminate for electromagnetic wave shielding>

As demonstrated in FIG. 4, the laminated body for electromagnetic wave shields of Embodiment C1 is comprised from the two layers of the member 2 for electromagnetic wave shields and the releasable cushion member 3. As shown in FIG. In Embodiment C1, the member 2 for electromagnetic wave shield consists of the conductive adhesive layer 6 of a single layer. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression process to function as the electromagnetic wave shielding layer 5 .

(conductive adhesive layer)

The conductive adhesive layer 6 is a layer formed from a resin composition containing a binder resin precursor and a conductive filler. The binder resin precursor contains at least a thermosoftening resin. Thermosoftening resin can illustrate a thermoplastic resin, a thermosetting resin, and actinic-ray-curable resin. Thermosetting resins and actinic-ray-curable resins generally have a reactive functional group. When using a thermosetting resin, a sclerosing|hardenable compound and a thermosetting adjuvant can be used together. Moreover, when using actinic-ray-curable resin, a photoinitiator, a sensitizer, etc. can be used together. From the viewpoint of the simplicity of the manufacturing process, a thermosetting type that cures at the time of thermocompression is preferable.

Moreover, you may use a self-crosslinking resin and various resin which crosslinks with each other. Moreover, you may mix a thermoplastic resin other than these resin. Mixing components, such as resin and a sclerosing|hardenable compound, can each independently be used individually or in multiple combinations.

In addition, in the stage of the conductive adhesive layer 6, bridge|crosslinking may be partially formed and it may become B-stage (semi-hardened state). For example, a thermosetting resin and a part of the curable compound may react to form a semi-cured state.

Preferred examples of the thermosoftening resin are the same as in Embodiment A1. The said thermosoftening resin may have several functional groups which can be used for the crosslinking reaction by heating as a thermosetting resin. Specific examples of the functional group are the same as in Embodiment A1.

Preferred examples and preferred contents of the curable compound are the same as in Embodiment A1. In addition, the preferable example of a thermoplastic resin, the preferable example of a tackifying resin, etc. are the same as that of Embodiment A1.

In addition, as an electroconductive filler, a metallic filler, electroconductive ceramic particle|grains, and a mixture thereof can be illustrated, These specific examples are the same as that of Embodiment A1. Moreover, the preferable content of silver in the silver-coated copper powder is also the same as that of Embodiment A1. Moreover, in the case of core-shell-type particle|grains, the preferable range etc. of the coverage of the coating layer with respect to a core part are also the same as that of Embodiment A1.

An electromagnetic wave absorbing filler may be used as an electroconductive filler, and the example similar to Embodiment A1 is given as a specific example.

The shape of the conductive filler used in the conductive adhesive layer can be exemplified by scaly particles, dendrite particles, needle-like particles, plate-like particles, grape-like particles, fibrous particles, and spherical particles, By increasing the proportion of scaly particles, the root mean square height Rq tends to decrease, and by decreasing the proportion of scaly particles, the root mean square height Rq tends to increase. From the viewpoint of adjusting the desired values of the root mean square height Rq and the root mean square inclination Rdq, it is preferable to contain a conductive filler of needle-shaped particles or/and dendrite-shaped particles.

Conductive fillers are used individually or in mixture. Combination of scaly particles and dendrite particles, a combination of scaly particles and needle-like particles, scaly particles, den A combination of dry and acicular particles is preferred. Particularly preferred is a combination of scaly particles and dendrite-like particles. Here, it is preferable that the scaly particles have a thickness of 0.2 µm or less.

The content of the conductive filler is preferably 40 to 85% by mass, more preferably 50 to 80% by mass, based on the solid content (100% by mass) of the thermosoftening resin composition layer.

It is preferable to make needle-shaped particle|grains or/and dendrite-shaped particle|grains into 30 mass % or less with respect to 100 mass % of electroconductive fillers in a conductive adhesive layer. More preferably, it is 0.1-20 mass %, More preferably, it is 1-20 mass %, The especially preferable range is 3-16 mass %. The method of adjusting the root mean square height Rq to 0.05 micrometer or more and 0.3 micrometer or less has various methods, and is not specifically limited. For example, in the surface layer of the electromagnetic wave shielding member, in Embodiment C1, the surface layer of the conductive adhesive layer 6 is pre-pressurized with a roll before laminating the cushion member, and then the cushion member on the side to be joined with the surface layer of the electromagnetic wave shielding member By using the cushion member whose surface root mean square height is desired Rq, the root mean square height Rq can be adjusted easily.

1-50 micrometers is preferable and, as for average particle diameter D50 of acicular particle|grains, 2-25 micrometers is more preferable. More preferably, it is 5-15 micrometers. 2-100 micrometers is preferable and, as for the preferable range of average particle diameter D50 of a dendrite-like particle|grains, 2-80 micrometers is more preferable. More preferably, it is 3-50 micrometers, Especially preferably, it is 5-20 micrometers. 2-70 micrometers is preferable and, as for the average particle diameter D50 of scaly particle|grains, 2-50 micrometers is more preferable. More preferably, it is 3-25 micrometers, Especially preferably, it is 5-15 micrometers.

By using the dendrite particles and/or acicular particles together with the scaly particles, the contact points between the conductive fillers can be increased and the shielding properties can be improved. In addition, by using the dendrite-shaped particles and/or the needle-shaped particles together, it is possible to increase the contact area with the binder component to provide an electromagnetic wave shielding member with high reliability.

The composition constituting the conductive adhesive layer may include a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent, and the like. This specific example is the same as that of Embodiment A1.

The conductive adhesive layer may be a layer having conductivity by continuously contacting conductive fillers by thermal compression, and may not necessarily have conductivity in the step prior to thermal compression. The conductive adhesive layer may be formed by mixing and stirring the composition containing the above-described conductive filler and the binder resin precursor, coating the composition on a releasable substrate, and then drying the mixture. Moreover, it can form also by the method of coating-drying directly on the cushion member 3 of releasability.

After coating the coating liquid of the conductive adhesive layer, it is dried to form a conductive adhesive layer on the releasable substrate. It is preferable to heat (for example, 80-120 degreeC) in a drying process. In order to adjust the root mean square height Rq of an electromagnetic wave shielding member, it is preferable to carry out 25 degreeC (room temperature) and atmospheric pressure drying for 1-17 minutes before heat-drying after coating a coating liquid. More preferable drying time is 2 to 14 minutes at 25 degreeC (room temperature) before heat-drying. The root mean square height Rq value can be adjusted by providing a process of drying at room temperature before heat drying.

Next, the effect of the viscosity of the coating liquid and the drying time at 25°C before drying by heat on the root mean square height Rq and the root mean square inclination Rdq of the electromagnetic wave shielding member 1 is described. A coating solution is applied to form a conductive adhesive layer on the releasable substrate. A dry conductive adhesive layer containing a solvent is obtained.

By setting a long drying time at 25° C. for the dry conductive adhesive layer, it is possible to intentionally lengthen the state in which the solvent evaporation rate is slow, thus promoting that the binder resin precursor does not sink downward. On the other hand, by setting the drying time short at 25 degreeC, it suppresses that the binder resin precursor does not sink down, and by heating and drying at that stage, an electroconductive filler becomes easy to stand up. In addition, foaming due to evaporation of the solvent tends to occur, and the upper surface tends to be rough. In addition, 25 degreeC temperature setting is an example, and it goes without saying that it can be set suitably.

It is preferable to set the solid content of the said coating liquid to 20 to 30%. Moreover, in order to adjust the root mean square height Rq of an electromagnetic wave shielding member, it is preferable to make the coating liquid viscosity measured with the B-type viscometer of the said coating liquid into the range of 600-1800 mPa*s. Moreover, in order to adjust the root mean square height Rq of an electromagnetic wave shielding member, it is preferable to set the thixotropy index of the said coating liquid to 1.2-1.5.

The values of the root mean square height Rq and the root mean square slope Rdq depend on the viscosity of the coating liquid forming the conductive adhesive layer. There exists a tendency for the fluidity|liquidity of an electroconductive filler to be suppressed for a thing with a high coating-liquid viscosity. Therefore, when the viscosity is high, the conductive filler tends to be random without orientation. On the other hand, when the viscosity is low, the scaly particles tend to be random with respect to the surface of the substrate. On the other hand, when the viscosity is low, the scaly particles tend to be oriented so that the main surface is usually opposite to the substrate surface. In addition, when the drying time is shortened at 25° C. and heat-dried, when the viscosity is high, the surface roughness due to foaming tends to increase, and when the viscosity is low, the conductive filler tends to move in the vertical direction. In this way, the root mean square height Rq can be adjusted by adjusting the viscosity of the coating solution and the drying time at 25°C.

In addition, the root mean square height Rq and the root mean square inclination Rdq of the electromagnetic wave shielding member 1 can be adjusted according to the particle diameter of dendrite-shaped particle|grains and/or needle-shaped particle|grains. The influence of the particle diameter of dendrite-shaped particles and/or needle-shaped particles on the root-mean-square height Rq and the root-mean-square inclination Rdq of the electromagnetic wave shielding member 1 is explained. A coating liquid is applied to form the conductive adhesive layer 6 on the releasable substrate to obtain a dry conductive adhesive layer. When the average particle diameter D50 of dendrite particles, which is a kind of conductive filler, is small, the root mean square height Rq and the root mean square inclination Rdq values tend to decrease. Conversely, when the average particle diameter D50 of the dendrite particles is large, the square The root-mean-square height Rq and the root-mean-square slope Rdq tend to be large. The root mean square slope Rdq also depends on the shape of the needle-shaped particle. When the particle size D50 of the needle-shaped particles is large, Rdq becomes large. In addition, when the particle diameter D50 of the needle-like particles is small, Rdq becomes small.

The root mean square height Rq and the root mean square inclination Rdq of the electromagnetic wave shielding member 1 are, in addition to the adjustment method through the above-described process, a scaly conductive filler in the composition for forming the electromagnetic wave shielding member 2 before thermocompression; It can be adjusted by adjustment of the addition amount ratio of a needle or/and dendrite-shaped electroconductive filler. In addition, the root mean square height Rq of the electromagnetic wave shielding member 1 can be adjusted also with the average particle diameters D50 and D90 of an electroconductive filler.

In Embodiment C1, since the member 2 for electromagnetic wave shielding consists of a single layer of the conductive adhesive layer 6, the releasable cushioning member 3 is joined on this conductive adhesive layer 6. The bonding method includes a method by lamination and the like.

The releasable substrate is a substrate having releasability on one or both sides, and is a sheet having a tensile strain at break of less than 50% at 150°C. Specific examples and the like of the releasable substrate are the same as in Embodiment A1.

In addition, the description of Embodiment A1 can also be used for a releasable cushion member.

[Embodiment C2]

Next, the example of the electronic component mounting board|substrate different from Embodiment C1 is demonstrated. The electronic component mounting board according to Embodiment C2 differs from Embodiment C1 using the electromagnetic wave shielding member comprising a single electromagnetic wave shielding layer in that the electromagnetic wave shielding member is composed of two electromagnetic wave shielding layers, but the other basic configuration and manufacturing method are It is the same as Embodiment C1. In addition, the basic configuration and manufacturing method of Embodiment A2 are the same as those of Embodiment A2, except that the electromagnetic wave shielding member according to Embodiment C is used instead of the electromagnetic wave shielding member according to Embodiment A and the points are separately described. Duplicate descriptions are appropriately omitted.

The electromagnetic wave shielding member of Embodiment C2, as shown in FIG. 11, is an electromagnetic wave shielding member (6a) comprising two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. It is formed using the laminated body 4a for electromagnetic wave shielding which contains 2a) and the releasable cushion member 3a. By thermocompressing the electromagnetic wave shielding laminate 4a, the electromagnetic wave shielding member composed of the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer is coated on the substrate 20 on which the electronic component 30 is mounted. The upper second conductive adhesive layer 6a2 is manufactured with the same composition and process as in Embodiment C1, and the lower first conductive adhesive layer 6a1 is not limited to the range of the root mean square height Rq, and can be designed as needed. can For example, it can be set as the layer using fillers, such as fibrous particle and spherical particle, as a conductive filler contained in the 1st conductive adhesive layer 6a1. It is also possible to design the first conductive adhesive layer 6a1 as an anisotropic conductive adhesive layer and the second conductive adhesive layer 6a2 as an isotropic conductive adhesive layer. Moreover, the aspect which sets it as the laminated body of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer is also preferable. You may laminate|stack three or more layers of electromagnetic wave shielding layers.

According to the electronic component mounting board|substrate concerning Embodiment C2, the effect similar to Embodiment C1 can be acquired using the electromagnetic wave shielding member which consists of two electromagnetic wave shielding layers. In addition, since the degree of design freedom of each layer can be increased by stacking two electromagnetic wave shielding layers, there is an advantage in that it is easy to provide an electromagnetic wave shielding member if necessary.

[Embodiment C3]

The electronic component mounting board according to Embodiment C3 differs from Embodiment C1 using an electromagnetic wave shielding member comprising a single-layer electromagnetic wave shielding layer in that the electromagnetic wave shielding member is composed of a laminate of an electromagnetic wave shielding layer and a hard coat layer, but has a different basic configuration and The manufacturing method is the same.

As shown in FIG. 12, the electromagnetic wave shielding member according to Embodiment C3 is a laminate of a one-layer conductive adhesive layer 6b and an insulating resin layer 7b, an electromagnetic wave shielding member 2b and a releasable cushion member 3b. It is formed using the electromagnetic wave shielding laminated body (4b) which consists of. By thermocompressing this electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding layer formed from a conductive adhesive layer 6b and a hard coat layer formed from an insulating resin layer 7b on a substrate on which an electronic component is mounted. An electromagnetic wave shielding member can be obtained. The electromagnetic wave shielding member of Embodiment C3 sets the root mean square height Rq when measured from the hard-coat layer side to 0.05 micrometer or more and 0.3 micrometer or less.

The insulating resin layer 7b is a layer formed from a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosoftening resin. Examples and preferred examples of the binder resin precursor are the same as the conductive adhesive layer of the electromagnetic wave shielding member mentioned in Embodiment A1. The binder resin precursor of the conductive adhesive layer and the insulating resin layer may be the same or different.

Unlike the conductive adhesive layer of Embodiment C1, the inorganic filler does not have conductivity, but preferable characteristics of the inorganic filler, such as shape, blending amount, D50 and D90, etc., are the same as in the example mentioned for the conductive filler. Examples of the inorganic filler include silica (fused silica, crystalline silica, amorphous silica), beryllia, alumina, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, antimony oxide, magnesium oxide. , talc, kaolinite, mica, base magnesium carbonate, sericite, montmorillonite, bentonite, kaolin, clay, hydrotalcite, wollastonite, zonotorite, silicon nitride, boron nitride, aluminum nitride, calcium hydrogen phosphate, calcium phosphate, glass Flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, calcium oxide, tin oxide, aluminum oxide, zirconium oxide, molybdenum oxide, nickel oxide, zinc carbonate, magnesium carbonate, and inorganic compounds such as barium carbonate, zinc borate, aluminum borate, calcium silicate, silicon carbide, titanium carbide, diamond, graphite, and graphene.

By using the thermally conductive filler as the inorganic filler, the hard coat layer can also function as the thermally conductive layer. Depending on the application, it can be used as a hard coat layer, a heat conductive layer (for example, a heat dissipation layer), or a layer having both functions.

The preferable example of the preferable compounding component and compounding quantity of the binder resin precursor used for an insulating resin layer is the same as that of the conductive adhesive layer of Embodiment C1. In addition, the preferable shape of the inorganic filler used for an insulating resin layer, preferable average particle diameter D50, etc. are the same as that of the electroconductive filler of Embodiment C1. In addition, as for the thermosoftening resin composition and the additive applicable to the thermosoftening resin composition layer, the description of Example C1 can be referred.

According to the electronic component mounting board|substrate according to Embodiment C3, by using the electromagnetic wave shielding member which has a hard coat layer, in addition to the effect mentioned in Embodiment C1, the electromagnetic wave which has more outstanding durability by covering the electromagnetic wave shielding layer with a hard coat layer A shielding member may be provided.

[Embodiment C4, Embodiment C5]

The electronic component mounting boards of Embodiments C4 and C5 are those of Embodiments A4 and A5 described above, except that the electromagnetic wave shielding member according to Embodiment C is used instead of the electromagnetic wave shielding member according to Embodiment A. explanation can be used.

<Modified example>

Next, a modified example of the electronic component mounting board, etc. according to the present embodiment will be described. However, the present invention is not limited to the above embodiments and modified examples, and other embodiments are also included in the scope of the present invention as long as they are consistent with the spirit of the present invention. In addition, each of the embodiments and modifications are appropriately combined with each other.

In Embodiments A4, A5, B4, B5, C4, and C5, examples of using a laminate for electromagnetic wave shielding including a laminate of an insulating adhesive layer, a conductive adhesive layer, and a releasable cushion member have been described, but it is also possible to manufacture as follows do. That is, as shown in FIG. 16A, the insulating layer 9e is first formed on the substrate 20 on which the plurality of electronic components 30 are mounted, as shown in FIG. 16B. This insulating layer 9e can be obtained by hot pressing a sheet comprising an insulating adhesive layer. Thereafter, the electromagnetic wave shielding layer 5e is formed using the electromagnetic wave shielding laminate 4e including the conductive adhesive layer 6e and the releasable cushion member 3e (FIGS. 16C and 16D). Through such a process, the electronic component mounting board|substrate 55 in which the electromagnetic wave shielding member was formed is obtained. Further, the insulating layer 9e may exemplify a method of applying a solution resin and a method of spraying a solution resin instead of a method of hot pressing the sheet.

Although the electronic component was demonstrated as an example as an example of a component in the said embodiment, this invention can be applied with respect to the component in general to be shielded from electromagnetic waves. In addition, the shape of the part is not limited to a rectangle, and includes a part having an R-shaped corner, a part having an acute angle between the upper surface and the side surface of the part, and an obtuse part having an obtuse angle. Moreover, the case where the outer surface of the component with an uneven|corrugated shape on the upper surface becomes a curved surface, such as a spherical shape, is also included. Further, in the above embodiment, although the half-dicing groove 25 (refer to FIG. 2) is formed in the substrate 20, the half-dicing groove 25 is not essential, and the electromagnetic wave shielding member is mounted on the flat substrate. can be covered. Further, the electronic component mounting substrate of the present invention includes, for example, a case in which the electronic component mounting substrate on which the electronic component is mounted by dicing all of the substrate 20 and dividing it into individual product units is mounted on a separate holding material or the like. .

In addition, the laminated body for electromagnetic wave shielding is not limited to the laminated form of the said embodiment. For example, the support substrate may be laminated|stacked on the releasable cushion member. By laminating the support substrate, contamination of the device during thermocompression can be easily prevented. Moreover, there exists an advantage that the attachment process of the laminated body for electromagnetic wave shielding becomes easy with a support substrate. In addition, the electronic component may be mounted on both sides as well as one side of the substrate, and an electromagnetic wave shielding member may be formed on each electronic component.

According to the electronic component mounting board according to the present embodiment, the coating property to the uneven structure is excellent, and thus it can be suitably applied to various electronic devices such as personal computers and mobile devices or digital cameras.

≪Example≫

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples. In addition, in Examples, "part" represents "part by mass" and "%" represents "mass %", respectively. In addition, the value described in this invention was calculated|required by the following method.

[Embodiment A]

(Test board 1)

A substrate was prepared in which mold-sealed electronic components (1 cm × 1 cm) were mounted in an array of 5 × 5 on a substrate made of glass epoxy. The thickness of the substrate is 0.3 mm, and the mold sealing thickness, that is, the height from the upper surface of the substrate to the upper surface of the mold sealant (component height) H, is 0.7 mm. Then, half dicing was performed along the groove|channel which is a clearance gap between components, and the test board|substrate was obtained (refer FIG. 17). The half-cut groove depth was 0.8 mm (the cut groove depth of the substrate 20 was 0.1 mm), and the half-cut groove width was 200 µm.

(test board 2,3)

A test board 2 was produced in the same manner as in the test board 1 except that the half-cut groove width was changed to 150 µm. Further, a test board 3 was produced in the same manner as in the test board 1 except that the half-cut groove width was changed to 150 µm and the groove depth was changed to 1000 µm.

Hereinafter, materials used in Examples are shown.

・Binder resin precursor

Resin 1: Polycarbonate resin (manufactured by Toyochem)

Resin 2: Phenoxy resin (manufactured by Toyochem)

Curable compound 1: Denacol EX830 (manufactured by Nagase Chemtech)

Curable compound 2: jERYX8000 (manufactured by Mitsubishi Chemical Corporation)

Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)

・Cure accelerator: PZ-33 (manufactured by Nihon Shokubai)

Conductive filler 1: flake-like Ag (average particle diameter D50: 11 µm) (manufactured by Fukuda Kinzoku Corporation)

Conductive filler 2: needle-shaped silver-coated copper (average particle diameter D50: 7.5 µm) (manufactured by Fukuda Kinzoku Corporation)

Additive 1: BYK322 (manufactured by Big Chemie)

Additive 2: BYK337 (manufactured by Big Chemie)

[Example A1]

(Preparation of the resin composition of the conductive adhesive layer)

As shown in Table 1, as a binder resin precursor, Resin 1 (polycarbonate resin) 20 parts (solid content), Resin 2 (phenoxy resin) 80 parts (solid content), Curable Compound 1 (epoxy resin) 20 parts, Curable Compound 2 (epoxy resin) 15 parts, curable compound 3 (epoxy resin) 10 parts, conductive filler 1 (flaky Ag) 320 parts, conductive filler 2 (needle-shaped Ag coated Cu) 5 parts, curing accelerator 1 part, additive 1 0.4 parts It put in a container, toluene : isopropyl alcohol (mass ratio 2:1) mixed solvent was added so that solid content concentration might be 25 mass %, The resin composition which forms a conductive adhesive layer by stirring in a disper for 10 minutes was obtained.

(Production of laminate for electromagnetic wave shielding)

This resin composition was coated on a releasable base material using a doctor blade so that the dry thickness might be set to 50 micrometers. Then, after drying at room temperature for 14 minutes at 25° C., it was dried at 100° C. for 2 minutes to obtain a member for electromagnetic wave shielding (conductive adhesive layer). After that, a release cushioning member (CR1040, a layered configuration (thickness 150 μm) sandwiched by polymethylpentene on both sides of a soft resin layer, manufactured by Mitsui Chemicals Co., Ltd.) is prepared, and laminated with a member for electromagnetic wave shielding on the release property substrate A laminate for electromagnetic wave shielding according to Embodiment A1 was obtained.

[Examples A2 to A5, Reference Example A1]

Except having changed into the composition of Table 1, it carried out similarly to Example A1, and obtained the resin composition of a conductive adhesive layer, and the laminated body for electromagnetic wave shielding.

[Examples A6 to A10, Reference Example A2]

The resin composition of the conductive adhesive layer was changed to the composition shown in Table 1, except that a mixed solvent of toluene: isopropyl alcohol (weight ratio 2: 1) was added so that the solid content concentration was 29 mass%. , a laminate for electromagnetic wave shielding was obtained.

<Kurtosis>

Prepare the electromagnetic wave shielding laminates of Examples A1 to A10 and Reference Examples A1 and A2, place them on an FR4 substrate with a thickness of 300 μm, and heat press at 170° C. for 5 minutes at 8 MPa in the surface direction from the release cushion member side. did. Thereafter, the releasable cushion member was removed and heated at 180°C for 2 hours. Then, the test piece in which the releasability cushion member was peeled and the electromagnetic wave shielding member was formed was obtained.

The metal sputtering process was performed on the surface of the electromagnetic wave shielding member which peeled the releasable cushion member from the said test piece. The metal sputtering treatment conditions used sputtering apparatus "Smart Coater" by Nippon Electronics Co., Ltd., gold was used as the target, and the separation distance between the target and the sample surface was 2 cm and sputtered for 0.5 minutes. About the metal sputtering-processed surface of the obtained sample, the kurtosis was calculated|required using the laser microscope (made by Keyence Corporation (VK-X100)) conforming to JIS B 0601:2001. As for the measurement conditions, the surface shape was acquired by setting the measurement magnification to 1000 times in the shape measurement mode. The obtained surface shape image was subjected to surface roughness measurement in the analysis application, and the entire area was selected, the λs contour filter was set to 2.5 µm and the λc contour curve filter was set to 0.8 mm, and kurtosis was measured. The above measurement was performed at five other locations, and the average value of the measured values was taken as the kurtosis value.

In addition, when measuring the electromagnetic wave shielding member actually coated on the electronic component mounting board in the kurtosis measurement of the electromagnetic wave shielding member, it is sufficient to directly measure the electromagnetic wave shielding member coated on the electronic component board|substrate.

<Paint solution viscosity and thixotropy index>

After leaving the obtained conductive resin composition in a water bath at 25° C. for 30 minutes, the viscosity (v1) at 6 rpm and the viscosity (v2) at 60 rpm were measured with a "B-type viscometer" (manufactured by Toki Industries, Ltd.). A value obtained by dividing (v1) by (v2) was used as the thixotropy index.

<Evaluation of peelability of half-dicing grooves of releasable cushion member after thermal compression>

For each of the test boards 1 to 3, each of the electromagnetic wave shielding laminates of each Example and Reference Example was thermocompressed under the condition of 8 MPa and 170° C. for 5 minutes, and the releasable cushion member was peeled off by hand. And the number of residues of the releasable cushion member which broke off in the groove|channel of the clearance gap between electronic components and remained was confirmed visually. The evaluation criteria were as follows.

+++ : No residue.

++ : 1 or more and less than 3 residues.

+ : 3 or more and less than 5 residues.

NG: There are 5 or more residues or residues remain in the entire groove.

<Steel Wool Resistance>

On a polyimide film having a thickness of 125 μm (“Kafton 500H” manufactured by Toray DuPont Co., Ltd.), the electromagnetic wave shielding laminates of each example and reference example cut to 5 × 15 cm were placed on each, and heated at 180 ° C. at 2 MPa for 10 minutes. It pressed and hardened|cured at 180 degreeC for 2 hours, and the test board|substrate was obtained. Thereafter, the releasable cushion member was peeled off. Next, the electromagnetic wave shielding member is set in the Hakjin type abrasion tester (manufactured by Tester Industry Co., Ltd.), and under the conditions of a load of 200 gf, a stroke of 120 mm, and a reciprocating speed of 30 times/min, the electromagnetic wave shielding member wears out until the polyimide film is exposed. I found the number of school trips. The evaluation criteria are as follows.

+++ : More than 20,000 times.

++ : More than 10,000 times and less than 20,000 times.

+ : 5,000 or more but less than 10,000 (practical level).

NG: less than 5,000 times.

Table 1 shows the evaluation results of Examples A1 to A10 and Reference Examples A1 and A2.

[Table 1]

As in the example in Table 1, in the electronic component mounting board using the electromagnetic wave shielding member of Reference Example A1 having a kurtosis of less than 1, the steel wool resistance did not reach the pass level. On the other hand, all the electromagnetic wave shielding members of the electronic component mounting board|substrate of this invention reached the pass level, and confirmed that it was excellent in steel wool tolerance. In addition, in the electromagnetic wave shielding member of Reference Example A2 having a kurtosis exceeding 8, the releasability of the groove portion did not reach the pass level. On the other hand, it was confirmed that all the electromagnetic wave shielding members of the electronic component mounting board|substrate of this invention were excellent in the peelability of the groove part of the releasable cushion member after thermocompression bonding.

[Embodiment B]

(test board)

A test substrate according to Embodiment B was obtained by the same manufacturing method as that of Test substrate 1 of Embodiment A.

Hereinafter, materials used in Examples are shown.

・Binder resin precursor

Resin 1: Urethane resin (manufactured by Toyochem)

Resin 2: polycarbonate resin (manufactured by Toyochem)

Resin 3: Styrene elastomer resin (manufactured by Toyo Chem)

Resin 4: Phenoxy resin (manufactured by Toyochem)

Curable compound 1: Denacol EX830 (manufactured by Nagase Chemtech)

Curable compound 2: jERYX8000 (manufactured by Mitsubishi Chemical Corporation)

Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)

・Cure accelerator: PZ-33 (manufactured by Nihon Shokubai)

· Conductive filler

Conductive filler 1: flaky Ag (average particle diameter D50: 11 µm) (manufactured by Fukuda Kinzoku Corporation)

Conductive filler 2: needle-shaped silver-coated copper (average particle diameter D50: 7.5 µm) (manufactured by Fukuda Kinzoku Corporation)

· additive

Additive 1: BYK322 (manufactured by Big Chemie)

Additive 2: BYK337 (manufactured by Big Chemie)

[Example B1] (Preparation of the resin composition of the conductive adhesive layer)

As shown in Table 2, as a binder resin precursor, resin 1 (urethane resin) 70 parts (solid content), resin 2 (polycarbonate resin) 30 parts (solid content), curable compound 1 (epoxy resin) 30 parts, curable compound 2 ( Epoxy resin) 15 parts, conductive filler 1 (flake-shaped Ag) 280 parts, conductive filler 2 (needle-shaped Ag coated Cu) 50 parts, curing accelerator 1 part and additive 1 0.4 parts are placed in a container so that the solid content concentration is 35 mass%. Toluene: A mixed solvent of isopropyl alcohol (weight ratio 2:1) was added and stirred in a disper for 10 minutes to obtain a resin composition for forming a conductive adhesive layer.

(Production of laminate for electromagnetic wave shielding)

This resin composition was coated on a releasable base material using a doctor blade so that the dry thickness might be set to 50 micrometers. Then, after drying at room temperature for 12 minutes at 25° C., it was dried at 100° C. for 2 minutes to obtain a member for electromagnetic wave shielding (conductive adhesive layer). Thereafter, a mold release cushion member (CR1040, a layered configuration (thickness 150 μm) sandwiched by polymethylpentene on both sides of a soft resin layer, manufactured by Mitsui Chemicals Co., Ltd.) was prepared, and laminated with a member for electromagnetic wave shielding on the mold release substrate. A laminate for electromagnetic wave shielding according to Example B1 was obtained.

(Production of test pieces for electronic component mounting boards)

Then, on this releasable substrate, the electromagnetic wave shielding laminate is cut to 10 x 10 cm, and after peeling the releasable substrate, the conductive adhesive layer side of the electromagnetic wave shielding laminate is in contact with the test substrate (see Fig. 17). It was placed on the table and temporarily attached. And it was thermocompression-bonded with respect to the board|substrate surface under the conditions of 2 MPa and 180 degreeC from the upper side of this laminated body for electromagnetic wave shielding for 2 hours. After thermocompression bonding, the releasable cushion member was peeled off to obtain an electronic component mounting board (test piece) according to Example B1 coated with an electromagnetic wave shielding member.

[Examples B2 to B19, Reference Examples B1, B2]

Except for changing the composition shown in Tables 2 and 3, in the same manner as in Example B1, the resin composition of the conductive adhesive layer of each Example and Reference Example, a laminate for electromagnetic wave shielding, and an electronic component mounting substrate test piece were obtained.

<Indentation modulus>

Electromagnetic wave shielding laminates of Examples B1 to B19 and Reference Examples B1 and B2 were prepared, placed on an FR4 substrate with a thickness of 300 μm, and heated at 180° C. for 2 hours at 2 MPa in the surface direction from the release cushion member side. did. Then, the release property cushion member was peeled, and the test piece of the FR4 board|substrate on which the electromagnetic wave shielding member was formed was obtained. And the indentation elastic modulus was measured by the following method on the side where the releasable cushion member was laminated|stacked.

That is, using a Fischer Scope H100C (Fischer Instruments Co., Ltd.) type hardness tester, using a Vickers indenter (a diamond indenter with a round tip of 100φ), in a constant temperature room at 25° C. The addition was performed in 5 seconds of required time. The indentation modulus was obtained by averaging the values obtained by randomly repeating measurements on the same film surface of the electromagnetic wave shielding member at five locations.

In addition, in the measurement of the indentation modulus of the electromagnetic wave shielding member, the electromagnetic wave shielding member actually coated on the electronic component mounting substrate may be measured. In this case, the measurement is made by directly contacting the Vickers indenter to the electromagnetic wave shielding member coated on the electronic component substrate. In the kurtosis and water contact angle described later, the electromagnetic wave shielding member actually coated on the electronic component mounting substrate can be measured in a similar manner.

<Kurtosis>

By the method similar to the method demonstrated in Embodiment A, the test board|substrate of the FR4 board|substrate was obtained, and the kurtosis was calculated|required by the same method.

<Water contact angle>

With respect to the test piece of the FR4 substrate prepared in the same way as the measurement sample for the indentation modulus, the surface of the electromagnetic wave shielding layer was shielded from electromagnetic waves using Kyowa Keimen Chemical Co., Ltd. "Automatic Contact Angle Measuring Machine DM-501/Analysis Software" The water contact angle of the member was measured. The measurement was performed by the droplet method.

<Measurement of Martens hardness>

The test piece of the electronic component mounting board|substrate of each Example and reference example was prepared, and according to ISO14577-1, Martens hardness was measured with the Fischer Scope H100C (Fischer Instruments company) type hardness meter. The measurement was performed on the upper surface of the electronic component 30 using a Vickers indenter (a diamond indenter with a round tip of 100φ) in a constant temperature room at 25° C. for a test force of 0.3 N, a test force holding time of 20 seconds, and an additional time required for the test force. It carried out on condition of 5 second. The average of the values obtained by repeating measurements on the same cured film surface at random 10 places was taken as the Martens hardness. In addition, the test force is adjusted according to the thickness of the electromagnetic wave shielding layer. Specifically, the test force was adjusted so that the maximum press-in depth was about 1/10 of the thickness of the electromagnetic wave shielding member.

<Paint solution viscosity and thixotropy index>

The viscosity (v1) at a rotation speed of 6 rpm and the viscosity (v2) at a rotation speed of 60 rpm were measured by the same method as that described in Embodiment A. In addition, the thixotropy index was obtained in the same way.

<Burs at the time of full dicing>

To the test board (a board on which electronic components are mounted in the form of 5×5 arrays), the electromagnetic wave shielding laminates of each example and reference example were thermocompressed under the conditions of 8 MPa and 170° C. for 5 minutes, and the release cushion member was hand peeled off with Then, the test sample which coat|covered the electromagnetic wave shielding member was obtained by hardening at 180 degreeC for 2 hours. With respect to the obtained test sample, the condition of the occurrence of burrs when the process of dividing into unit products (full dicing) was performed was evaluated using a laser microscope according to the following criteria.

+++ : The burr is not checked.

++ Less than 2 out of 25 electronic components with burr occurrence divided into unit products.

+ : The occurrence of burrs is more than 2 but less than 5 out of 25 electronic components divided into unit products.

NG: occurrence of burrs more than 5 out of 25 electronic components divided into unit products.

<Tape Adhesion>

On an FR4 substrate having a thickness of 300 μm, each of the laminates for electromagnetic wave shielding of each example and reference example cut to 5 × 5 cm was placed on each, and heat pressed at 170° C. at 8 MPa for 5 minutes, and cured at 180° C. for 2 hours. A test board was obtained. Next, the releasable cushion member was peeled off. Then, the pressure cooker test of 130 degreeC, 85% of humidity, and 0.23 MPa was done for the obtained test board|substrate. The test time was 96 hours, and the Nichiban adhesive tape having a width of 18 mm was used as the adhesive tape. And according to JISK5600, using a cross-cut guide, 25 checkerboard scales with an interval of 1 mm were produced on the electromagnetic wave shielding member. After that, the adhesive tape was pressed on the grid scale of the electromagnetic wave shielding member, the tip of the tape was peeled off at a 45° angle, and a tape adhesion test was performed. The state (cross-cut residual rate) of the checkerboard scale of the electromagnetic wave shielding member was judged by the following reference|standard.

+++ : Represents the 25/25 residual rate.

++ Represents the 24/25 residual rate.

+ : Represents the 23/25 residual ratio.

NG: It is less than 23/25 residual ratio.

<Evaluation of peelability of half-dicing grooves of releasable cushion member after thermal compression>

To the test board (half-dicing groove depth 800 μm, groove width 200 μm), each of the electromagnetic wave shielding laminates of Examples and Reference Examples were thermocompressed at 8 MPa and 170° C. for 5 minutes, and a release cushion member was applied. peeled off by hand. And the number of objects of the releasable cushion member which broke in the groove|channel of the clearance gap between electronic components and remained was confirmed visually. The evaluation criteria were as follows.

+++ : No residue.

++ More than 1 residue but less than 3 residues.

+ : 3 or more and less than 5 residues.

NG: There are 5 or more residues or residues remain in the entire groove.

<Steel Wool Resistance>

A test board was obtained by the same method as that described in Embodiment A, and steel wool resistance was evaluated according to the same measurement method. The same is true for evaluation criteria.

Tables 2 and 3 show the evaluation results of Examples B1 to B19 and Reference Examples B1 and B2.

[Table 2]

[Table 3]

As in the examples of Tables 2 and 3, the burrs at the time of dicing the entire electronic component mounting substrate using the electromagnetic wave shielding member of Reference Example B1 having an indentation modulus of less than 1 did not reach the pass level. On the other hand, all the electromagnetic wave shielding members of the electronic component mounting board|substrate of this invention reached the pass level, and it was confirmed that generation|occurrence|production of a burr could be suppressed. In addition, in the electronic component mounting board|substrate using the electromagnetic wave shielding member of reference example B2 whose indentation elastic modulus exceeds 10 GPa, the tape adhesiveness did not reach the pass level after PCT test. On the other hand, all the electromagnetic wave shielding members of the electronic component mounting board|substrate of this invention confirmed that the tape adhesiveness after a PCT test was a passing level, and was excellent in PCT tolerance.

22 is a photograph of a side surface of an electronic component mounting substrate observed under a microscope after being divided into unit products of Example B3. As shown in this figure, no burrs were recognized. On the other hand, FIG. 23 shows a photograph of the side surface of the electronic component mounting board observed under a microscope after being divided into unit products of Reference Example B1. As shown in this figure, the occurrence of burrs was observed.

[Embodiment C]

(Test board 1)

A test board was obtained in the same manner as in the manufacturing method of test board 1 of Embodiment A.

Hereinafter, materials used in Examples are shown.

・Binder resin precursor

Thermosetting resin 1: Polycarbonate resin (manufactured by Toyochem)

Thermosetting resin 2: Phenoxy resin (manufactured by Toyochem)

Curable compound 1: Denacol EX830 (manufactured by Nagase Chemtech)

Curable compound 2: jERYX8000 (manufactured by Mitsubishi Chemical Corporation)

Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)

・Cure accelerator: PZ-33

Conductive filler 1: scaly Ag (average particle diameter D50: 9.5 µm, D90 = 19 µm, thickness 0.1 µm)

Conductive filler 2: dendrite-shaped silver-coated copper (average particle diameter D50: 7.1㎛, D90 = 15.1㎛)

Additive 1: BYK337

[Example C1]

(Preparation of the resin composition of the conductive adhesive layer)

As shown in Table 4, as a binder resin precursor, thermosetting resin 1 (polycarbonate resin) 20 parts (solid content), thermosetting resin 2 (phenoxy resin) 80 parts (solid content), curable compound 1 (epoxy resin) 20 parts, curable 15 parts of compound 2 (epoxy resin), 10 parts of curable compound 3 (epoxy resin), 365 parts of conductive filler 1 (scaly Ag), 5 parts of conductive filler 2 (dendrite-like Ag coat Cu) and 1 part of curing accelerator in a container Toluene:isopropyl alcohol (weight ratio 2:1) mixed solvent was added so that solid content concentration might be 23 mass %, and it stirred in the disper for 10 minutes, and obtained the resin composition which forms a conductive adhesive layer.

(Production of laminate for electromagnetic wave shielding)

An electromagnetic wave shielding laminate according to Example C1 was obtained in the same manner as in Embodiment A.

(Production of test pieces for electronic component mounting boards)

Then, on this releasable substrate, the electromagnetic wave shielding laminate was cut to 10 x 10 cm, and the releasable substrate was peeled off. It was placed on the table and temporarily attached. And it was thermocompression-bonded with respect to the board|substrate surface under the conditions of 2 MPa and 180 degreeC from the upper side of this laminated body for electromagnetic wave shielding for 2 hours. After thermocompression, the releasable cushion member was peeled off to obtain an electronic component mounting board (test piece) according to Example C1 coated with an electromagnetic wave shielding member.

[Example C2-C9, Reference Example C1]

Except having changed into the composition shown in Table 4, it carried out similarly to Example C1, and obtained the resin composition of a conductive adhesive layer, and the laminated body for electromagnetic wave shielding.

<root mean square height Rq>

Electromagnetic wave shielding laminates of Examples C1 to C9 and Reference Example C1 were prepared, placed on an FR4 substrate having a thickness of 300 μm, and heat-pressed at 170° C. for 5 minutes under the condition of 8 MPa in the surface direction from the releasable cushion member side. Then, the release property cushion member was removed, and it heated at 180 degreeC for 2 hours, and obtained the test piece in which the electromagnetic wave shielding member was formed.

The metal sputtering process was performed on the surface of the electromagnetic wave shielding member which peeled the releasable cushion member from the said test piece. For the metal sputtering treatment conditions, sputtering equipment "Smart Coater" manufactured by Nippon Electronics Co., Ltd. was used, gold was used as the target, the separation distance between the target and the sample surface was 2 cm, and sputtering was carried out for 0.5 minutes. About the metal sputtering-processed surface of the obtained sample, the root mean square height Rq was calculated|required using the laser microscope (made by Keyence Corporation (VK-X100)) conforming to JISB0601:2001. As for the measurement conditions, the measurement magnification was made 1000 times in the shape measurement mode, and the surface shape was acquired. The obtained surface shape was subjected to surface roughness measurement in an image analysis application, the entire area was selected, the λs contour filter was set to 2.5 µm and the λc contour curve filter was set to 0.8 mm, and the root mean square height Rq was measured. The above measurement was performed at five other locations, and the average value of the measurements was taken as the root mean square height Rq value.

In the case of measuring the electromagnetic wave shielding member actually coated on the electronic component mounting board in the measurement of the root mean square height Rq of the electromagnetic wave shielding member, the electromagnetic wave shielding member coated on the electronic component substrate may be directly measured.

<root mean square slope Rdq>

Using the surface shape image obtained in the measurement of Rq, in the line roughness measurement of the analysis application, two dotted lines are drawn uniformly over the image by 20, the λs contour curve filter is 2.5 μm, the λc contour curve filter is 0.8 mm, The root mean square slope Rdq was measured. The above measurement was performed at five other locations, and the average value of the measurements was taken as the root mean square slope Rdq value.

<Water contact angle>

Prepare the electromagnetic wave shielding laminate of each Example and Reference Example, place it on a test piece of an FR4 substrate prepared in the same way as the 300 μm thick indentation modulus measurement sample, and under the condition of 2 MPa in the plane direction from the release property cushion member side. It was heat-pressed at 180°C for 2 hours. Then, the release property cushion member was peeled, and the test piece of the FR4 board|substrate on which the electromagnetic wave shielding member was formed was obtained. And the water contact angle was measured by the following method on the side where the releasable cushion member was laminated|stacked. That is, with respect to the surface of the electromagnetic wave shielding layer, the water contact angle of the electromagnetic wave shielding member was measured using "automatic contact angle measuring instrument DM-501/analysis software FAMAS" manufactured by Kyowa Keimen Chemical Co., Ltd. The measurement was performed by the droplet method.

<Paint solution viscosity and thixotropy index>

The viscosity (v1) at a rotation speed of 6 rpm and the viscosity (v2) at a rotation speed of 60 rpm were measured by the same method as that described in Embodiment A. In addition, the thixopropy index was obtained in the same way.

<Tape coating properties>

On an FR4 substrate having a thickness of 300 μm, each of the laminates for electromagnetic wave shielding of each example and reference example cut to 5 × 5 cm was placed on each, and heat pressed at 170° C. at 8 MPa for 5 minutes, and cured at 180° C. for 2 hours. Thus, a test board was obtained. Next, the releasable cushion member was peeled off. Thereafter, the obtained test substrate was adhered with an electromagnetic wave shielding member with a dicing tape (UHP-110AT (UV-type substrate PET, total thickness of 110 µm (including adhesive layer thickness of 10 µm), manufactured by Denka Corporation)), and the substrate 20 ) The outer surface was diced and divided into unit products of the electronic component mounting board. After being divided into unit products, the dicing tape was peeled off from the electromagnetic shielding member, and the state of the electromagnetic shielding member was observed with an optical microscope (magnification 200 times), and judged according to the following criteria.

+++ : No abnormality in appearance.

++: 1~2 pieces of lifting with a diameter of 0.5mm or less occur on the electromagnetic shielding member per 1cm2.

+ : 3~4 pieces of lifting with a diameter of 0.5mm or less occur on the electromagnetic shielding member per 1cm2.

NG: 5 or more floating, peeling, or 0.5 mm or less in diameter on the electromagnetic shielding member per 1 cm2.

<Evaluation of antifouling properties>

On a polyimide film having a thickness of 125 μm (“Kafton 500H” manufactured by Toray DuPont Co., Ltd.), the laminates for electromagnetic wave shielding of each example and reference example cut to 5×15 cm were placed on each, and placed at 180° C. under the condition of 2 MPa for 10 minutes. It hot-pressed, it hardened|cured at 180 degreeC for 2 hours, and obtained the test board|substrate. Thereafter, the releasable cushion member was peeled off. n-octanoic acid was coated on the upper surface of the electromagnetic wave shielding member with a pseudo flux. Thereafter, it was immersed in a cleaning solution in which dioxolane and isopropanol were mixed at an ratio of 8/2, followed by ultrasonic cleaning. After washing, the antifouling property was evaluated using an optical microscope (magnification 200 times). The evaluation criteria are as follows.

+++: After 3 minutes of washing, there is no residue.

++: After washing for 5 minutes, there is no residue.

+: After washing for 5 minutes, there are 1-2 residues per 1 cm2 of the upper surface of the electromagnetic wave shielding member.

NG: There are more than 2 residues per 1cm 2 of the upper surface of the electromagnetic wave shielding member after washing for 5 minutes.

<Cold-heat cycle test>

For the test board shown in FIG. 17, an electronic component mounting board (test piece) coated with an electromagnetic wave shielding member according to Example C1 was prepared, and two upper surfaces of the electronic component coated with the electromagnetic wave shielding member 1 (arrows in FIG. 24) ) was measured using the BSP probe of "Loresta GP" manufactured by Mitsubishi Chemical Analytech. Next, it was put into a thermal shock device ("TSE-11-A", manufactured by SPEC Co., Ltd.), and exposure was alternately performed 1000 times under exposure conditions of high temperature exposure: 125 ° C., 15 minutes, low temperature exposure: -50 ° C., 15 minutes. . Then, the connection resistance value of the sample was measured similarly to the initial stage.

Cooling cycle reliability evaluation criteria are as follows. The measured value was measured in three places, and it was set as the average value.

In addition, when an insulating layer such as a hard coat layer is laminated on the outermost surface, the measurement location of the insulating layer is removed after the cold-heat cycle test, and the electromagnetic wave shielding layer 5 is exposed to perform the same test as above. In this case, the connection resistance value of the electromagnetic wave shielding layer 5 before the cooling/heating cycle test is obtained by removing the measurement location of the insulating layer at different positions of the same sample in the same manner as above.

+++ :(Connection resistance value after exposure alternately)/(Initial connection resistance value) less than 1.5 Very good.

++ : (connection resistance value after exposure alternately)/(initial connection resistance value) 1.5 or more and less than 3.0 good.

+ : (connection resistance value after exposure alternately)/(initial connection resistance value) is 3.0 or more and less than 5.0 Practical.

NG: (connection resistance value after alternate exposure)/(initial connection resistance value) is 5.0 or more.

Table 4 shows the evaluation results of Examples C1 to C9 and Reference Example C1.

[Table 4]

As in the example of Table 4, the electronic component mounting board using the electromagnetic wave shielding member of Reference Example 1 having a root mean square height Rq of 0.3 or more did not reach the pass level of the cooling/heating cycle test. On the other hand, it was confirmed that all the electromagnetic wave shielding members of the electronic component mounting board|substrate of this invention reached the pass level, and were excellent in covering property also in the severe conditions of a cold-heat cycle test. In addition, it was confirmed that in the process of dividing the product into unit products, it is possible to effectively prevent coating defects such as floating or peeling of the electromagnetic wave shielding member. Furthermore, it was confirmed that the electromagnetic wave shielding member of the electronic component mounting board|substrate of this invention was excellent in antifouling property.

This application is a Japanese Patent Application No. 2018-236541 filed on December 18, 2018 and Japanese Patent Application No. 2018-236542 filed on December 18, 2018, Japanese Patent Application No. 2019-063673 and Japanese Patent Application No. 2019-0636734 filed on March 28, 2019, and December 2019 Priority is claimed on the basis of Japanese Patent Application No. 2019-220612 filed on the 5th, and the entire disclosure is incorporated herein.

1: Electromagnetic wave shielding member
2: Electromagnetic wave shielding member
3: No releasable cushioning
4: Electromagnetic wave shielding laminate
5: electromagnetic wave shielding layer
6: conductive adhesive layer
6P: conductive adhesive layer in dry phase
7b: insulating resin layer
8c: insulating adhesive layer
9c: insulating coating layer
10: binder resin precursor
11: Conductive filler
12: dendrite-shaped particles
15: releasable substrate
20: substrate
21: electrode
22: ground pattern
23: internal via
24: solder ball
25: half-dicing groove
30: electronic components
31: semiconductor chip
32: mold resin
33: bonding wire
40: press board
51,52: electronic component mounting board

Claims (16)

board and
an electronic component mounted on at least one surface of the substrate;
an electromagnetic wave shielding member covering the upper surface of the electronic component over the substrate and covering at least a portion of the substrate and a side surface of a step formed by mounting the electronic component;
The electromagnetic wave shielding member has an electromagnetic wave shielding layer comprising a binder resin and a conductive filler,
The kurtosis (kurtosis, 尖度) measured according to JISB0601; 2001 of the surface layer of the electromagnetic wave shielding member is 1 to 8,
The electronic component mounting board|substrate whose root mean square height of the surface of the said electromagnetic wave shielding member is in the range of 0.4-1.6 micrometers. delete According to claim 1,
The electronic component mounting substrate, wherein the conductive filler contains at least one of a dendrite-shaped and a needle-shaped conductive filler. board and
an electronic component mounted on at least one surface of the substrate;
an electromagnetic wave shielding member covering the upper surface of the electronic component over the substrate and covering at least a portion of the substrate and a side surface of a step formed by mounting the electronic component;
The electromagnetic wave shielding member has an electromagnetic wave shielding layer including a binder resin and a conductive filler, and has an indentation modulus of 1 to 10 GPa,
JISB0601 of the surface layer of the said electromagnetic wave shielding member; The kurtosis measured by 2001 is 1 to 8,
The electronic component mounting board|substrate whose root mean square height of the surface of the said electromagnetic wave shielding member is in the range of 0.4-1.6 micrometers. 5. The method of claim 4,
A water contact angle of the surface layer of the electromagnetic wave shielding member is 70 to 110°, an electronic component mounting substrate. 5. The method of claim 4,
In the tape adhesion test after the pressure cooker test according to JIS K5600 of the electromagnetic wave shielding member, the electromagnetic wave shielding member on the electronic component exhibits a crosscut residual ratio of 23/25 or more. delete 5. The method of claim 4,
The Martens hardness of the electromagnetic wave shielding member is 50 to 312N/mm 2 , an electronic component mounting board. 5. The method of claim 4,
The binder resin is obtained by thermocompressing a thermosetting resin and a binder resin precursor containing a curable compound having a reactive functional group and a crosslinkable functional group of the thermosetting resin. 5. The method of claim 4,
A film thickness of the electromagnetic wave shielding member is 10-200 μm, an electronic component mounting substrate. The electronic device in which the electronic component mounting board|substrate in any one of Claims 1, 3-6, and 8-10 was mounted. delete delete delete delete delete

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