JP2018129498A - Electronic component-mounted board, laminate, electromagnetic wave-shielding sheet and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component-mounted board with an electromagnetic wave-shielding layer, which is high in productivity, high in quality and high in coatability and scratch resistance, and others.SOLUTION: A component-mounted board 101 according to the present invention comprises a board 20, a component 30 mounted on the board 20, and an electromagnetic wave-shielding layer 1 covering them. The electromagnetic wave-shielding layer 1 is 3-100 N/mmin Martens hardness, and has a scale-like particle-containing layer showing an isotropic conductive property and including a conductive filler containing a cured product of a thermosetting resin and a curable compound, and scale-like particles, and has no anisotropic conductive layer. When the thickness of a part of the electromagnetic wave-shielding layer 1 covering an upper face of the component 30 is denoted by T1, and the thickness of a part of the electromagnetic wave-shielding layer 1, covering a side face of the component is denoted by T2, T1/T2 is 1.1-10. The scale-like particles have an average thickness of 0.05-2 μm. In a cross section of a cut portion of the scale-like particle-containing layer in a thickness direction, the conductive filler occupies an area of 20-50%.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting board having an electromagnetic wave shielding layer. The present invention also relates to an electromagnetic wave shielding sheet suitable for forming an electromagnetic wave shielding layer of the component mounting board, a laminate including the electromagnetic shielding sheet, and an electronic device on which the component mounting board is mounted.

  An electronic board equipped with electronic components such as IC chips is usually equipped with an electromagnetic shielding structure to prevent malfunctions caused by external magnetic fields and radio waves, and to reduce unnecessary radiation of electrical signals generated from the inside of the electronic board. Is provided. Conventionally, a sputtering method has been used for shielding an IC chip, but an alternative technology is required due to the problem of capital investment.

  Therefore, a method of providing a conductive shield layer by applying a conductive paste on a mold resin constituting the exoskeleton of an electronic component (Patent Document 1), or a method of covering an electromagnetic wave shield sheet (Patent Documents 2 to 6) Has been proposed.

JP 2013-207213 A International Publication No. 2014/027673 Japanese Patent Laying-Open No. 2015-162636 International Publication No. 2015/046063 International Publication No. 2015/186624 JP, 2014-110263, A

  There are a method of sputtering a metal foil on the surface of an electronic component in order to shield electromagnetic waves, a method of fitting a metal can, a method of plating, a method of applying a conductive paste as in Patent Document 1, etc. These have problems in versatility or complexity of processing steps. In addition, in the electromagnetic wave shielding film disclosed in Patent Document 2 or the like, the electromagnetic wave shielding layer is easily cracked at a stepped portion or an uneven portion of an electronic component, and there is a problem in the quality of electromagnetic wave shielding properties. In addition, there is a problem in the problem that the recessed portion is not easily embedded and the connectivity to the ground portion on the side surface. Furthermore, there is a problem that the electromagnetic wave shielding layer is easily damaged by contact with a carrier or the like in the process of conveying the IC chip after separation.

  The present invention has been made in view of the above-mentioned background, and is an electromagnetic wave shielding sheet and laminate capable of providing an electromagnetic wave shielding layer with high productivity, high quality, high covering properties and scratch resistance, and the electromagnetic wave shielding layer. An object of the present invention is to provide a component mounting board and an electronic apparatus having the above.

As a result of extensive studies by the present inventors, it has been found that the problems of the present invention can be solved in the following modes, and the present invention has been completed.
[1]: An electromagnetic wave shielding layer covering the exposed surface of the substrate, including a substrate, a component mounted on at least one surface of the substrate, and at least a part of a stepped portion formed by mounting the component. With
The electromagnetic wave shielding layer, Martens a hardness of 3~100N / mm ^2, further cured product of a curable compound and a thermosetting resin, and isotropic conductivity containing an electrically conductive filler comprising flaky particles Having a scaly particle-containing layer and not including an anisotropic conductive layer,
When the thickness of the electromagnetic wave shielding layer covering the upper surface of the component is T1, and the thickness of the electromagnetic wave shielding layer covering the side surface of the component is T2, T1 / T2 is 1.1 to 10,
The scaly particles have an average thickness of 0.05 to 2 μm,
The component mounting board whose exclusive area of the said conductive filler of the cut part cross section of the thickness direction of the said scaly particle content layer is 20 to 50%.
[2]: The component mounting board according to [1], wherein the electromagnetic wave shielding layer has a 20 ° surface glossiness of 0.1 to 20%.
[3] The component mounting substrate according to [1] or [2], wherein the scale-like particle-containing layer includes 50 to 95% by mass of the conductive filler with respect to the mass of the entire scale-like particle-containing layer.
[4] The component mounting board according to any one of [1] to [3], wherein the conductive filler is an electromagnetic wave absorbing filler.
[5] The component mounting board according to any one of [1] to [4], wherein the conductive filler further includes at least one of dendritic particles and spherical particles.
[6] The component according to any one of [1] to [5], wherein the electromagnetic wave shielding layer includes two isotropic conductive layers, and at least one of the isotropic conductive layers is the scaly particle-containing layer. Mounting board.
[7]: An electronic device comprising the component mounting board according to any one of [1] to [6].
[8] An electromagnetic wave shielding layer covering the exposed surface of the substrate, including a substrate, a component mounted on at least one surface of the substrate, and at least a part of a step formed by mounting the component. The electromagnetic wave shielding layer used in a component mounting board comprising a sheet before thermocompression bonding,
The tensile strain at break is 50-1500%,
It has a scale-like particle-containing layer showing isotropic conductivity containing a thermosetting resin, a curable compound and a conductive filler containing scale-like particles, and does not contain an anisotropic conductive layer,
The Martens hardness when heated and cured at 160 ° C. and 2 MPa for 20 minutes is 3 to 100 N / mm ² ,
The average thickness of the scaly particles is 0.05-2 μm,
The electromagnetic wave shielding sheet whose exclusive area of the said conductive filler of the cut part cross section of the thickness direction of the said scale-like particle content layer when it heat-hardens at 160 degreeC and 2 Mpa for 20 minutes is 20 to 50%.
[9] The electromagnetic wave shielding sheet according to [8], wherein the thermosetting resin is a resin selected from a polyurethane resin, a polyurethane urea resin, an acrylic resin, a polyester resin, and a polyamide resin.
[10]: The electromagnetic wave shielding sheet according to [8] or [9], wherein an average particle diameter D50 of the scaly particles is 2 to 100 μm.
[11] The electromagnetic wave shielding sheet according to any one of [8] to [10], wherein the acid value of the thermosetting resin is 3 to 20.
[12] The electromagnetic wave shielding sheet according to any one of [8] to [11], wherein the reactive functional group of the thermosetting resin includes at least one of a carboxyl group and a hydroxyl group.
[13]: The electromagnetic wave shielding sheet according to any one of [8] to [12], wherein the thermosetting resin has a weight average molecular weight of 20,000 to 150,000.
[14] The electromagnetic wave shielding sheet according to any one of [8] to [13], which has a linear expansion coefficient of 100 to 700 ppm / ° C.
[15]: The electromagnetic wave shielding sheet according to any one of [8] to [14], an adhesive resin layer formed on the electromagnetic wave shielding sheet, and a flexible separation formed on the adhesive resin layer. A laminate comprising a mold sheet.

  According to the present invention, it is possible to provide an electromagnetic wave shielding sheet and a laminate that can provide an electromagnetic wave shielding layer having high quality, high covering properties, and high scratch resistance, and an excellent effect that it is possible to provide a component mounting substrate and an electronic device having the electromagnetic wave shielding layer. Play.

The typical perspective view showing an example of the component mounting board concerning this embodiment. II-II cutting part sectional drawing of FIG. The typical sectional view showing another example of the component mounting board concerning this embodiment. The typical top view for demonstrating the measurement area | region of content of the conductive filler of a scale-like particle content layer. FIG. 5 is a cross-sectional view taken along a line VV in FIG. 4. The typical sectional view showing an example of the multilayer object with a releasable substrate concerning this embodiment. The typical sectional view showing an example of the layered product concerning this embodiment. Sectional drawing of the manufacturing process of the component mounting board which concerns on this embodiment. Sectional drawing of the manufacturing process (mounting process (i)) of the component mounting board which concerns on this embodiment. Sectional drawing of the manufacturing process (mounting process (ii)) of the component mounting board which concerns on this embodiment. The typical sectional view of the layered product used for the manufacturing process of the component mounting board concerning this embodiment. Sectional drawing of the manufacturing process (mounting process (iii)) of the component mounting board which concerns on this embodiment. Sectional drawing of the manufacturing process of the component mounting board which concerns on this embodiment. Sectional drawing of the manufacturing process of the component mounting board which concerns on this embodiment. Sectional drawing of the manufacturing process of the component mounting board which concerns on this modification. Sectional drawing of the manufacturing process of the component mounting board which concerns on this modification. Sectional drawing of the manufacturing process of the component mounting board which concerns on this modification. FIG. 5 is a schematic cross-sectional view showing another example of a component mounting board according to the present embodiment. The typical sectional view showing another example of the component mounting board concerning this example. The typical sectional view showing another example of the component mounting board concerning this example. Sectional drawing of the cutting | disconnection part of the electromagnetic wave shielding sheet which concerns on Example 14. FIG. Sectional drawing of the cutting part of the electromagnetic wave shielding layer which concerns on Example 14. FIG.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. In addition, the numerical value specified in this specification is a value calculated | required by the method disclosed by embodiment or an Example. In addition, the numerical values “A to B” specified in the present specification refer to ranges satisfying the numerical value A and the value larger than the numerical value A and the numerical value B and the value smaller than the numerical value B. The “sheet” in this specification includes not only “sheet” defined in JIS but also “film”. In order to clarify the explanation, the following description and drawings are simplified as appropriate. Moreover, the same element member is shown with the same code | symbol also in different embodiment. Unless otherwise noted, various components appearing in the present specification may be used independently or in combination of two or more.

[Component board]
FIG. 1 is a schematic perspective view of a component mounting board according to the present embodiment, and FIG. 2 is a sectional view taken along the line II-II in FIG. The component mounting substrate 101 includes a substrate 20, an electronic component 30 that is an example of a component, and the electromagnetic wave shielding layer 1.

  The board | substrate 20 should just be a board | substrate which can mount the electronic component 30 and can endure the thermocompression bonding process mentioned later, and can be selected arbitrarily. For example, a work board on which a conductive pattern made of copper foil or the like is formed on the surface or inside, a mounting module board, a printed wiring board, or a build-up board formed by a build-up method can be used. Moreover, you may use a film or a sheet-like flexible substrate. The conductive pattern is, for example, an electrode / wiring pattern (not shown) for electrical connection with the electronic component 30 and a ground pattern 22 for electrical connection with the electromagnetic wave shielding layer 1. An electrode / wiring pattern, a via (not shown) or the like can be arbitrarily provided in the substrate 20. The substrate 20 may be a flexible substrate as well as a rigid substrate.

  In the example of FIG. 1, the electronic components 30 are arranged in an array of 5 × 4 on the substrate 20. And the electromagnetic wave shielding layer 1 is provided so that the exposed surface of the board | substrate 20 and the electronic component 30 may be coat | covered. That is, the electromagnetic wave shielding layer 1 is coated so as to follow the unevenness formed by the electronic component 30. The electromagnetic wave shielding layer 1 can shield unnecessary radiation generated from the signal wiring or the like built in the electronic component 30 and / or the substrate 20, and can prevent malfunction due to an external magnetic field or radio wave.

  The number, arrangement, shape and type of the electronic component 30 are arbitrary. Instead of arranging the electronic components 30 in an array, the electronic components 30 may be arranged at arbitrary positions. When the component mounting substrate 101 is separated into unit modules, as shown in FIG. 2, half dicing grooves 25 may be provided so as to partition the unit modules in the thickness direction of the substrate from the upper surface of the substrate. The component mounting board according to the present embodiment includes both a board before being singulated into unit modules and a board after being singulated into unit modules. That is, in addition to the component mounting substrate 101 on which a plurality of unit modules (electronic components 30) as shown in FIGS. 1 and 2 are mounted, the component mounting substrate 102 after being separated into unit modules as shown in FIG. 3 is also included. Of course, a component mounting substrate in which one electronic component 30 is mounted on the substrate 20 without being separated into individual pieces and covered with an electromagnetic wave shielding layer is also included. That is, the component mounting substrate according to the present embodiment has a structure in which at least one electronic component is mounted on the substrate, and at least part of the stepped portion formed by mounting the electronic component is covered with the electromagnetic wave shielding layer. Comprehensive.

  The electronic component 30 includes all components in which electronic elements such as semiconductor integrated circuits are integrally covered with an insulator. For example, there is a mode in which a semiconductor chip 31 (see FIG. 3) on which an integrated circuit (not shown) is formed is molded with a sealing material (mold resin 32). The substrate 20 and the semiconductor chip 31 are electrically connected to wirings or electrodes 21 formed on the substrate 20 through these contact regions or via bonding wires 33, solder balls (not shown), or the like. Examples of the electronic component include a semiconductor chip, an inductor, a thermistor, a capacitor, and a resistor.

  The electronic component 30 and the substrate 20 according to the present embodiment can be widely applied to known aspects. In the example of FIG. 3, the semiconductor chip 31 is connected to the solder ball 24 on the back surface of the substrate 20 through the inner via 23. A ground pattern 22 for electrically connecting to the electromagnetic wave shielding layer 1 is formed in the substrate 20. Moreover, the some electronic component 30 may be mounted in the component mounting board | substrate after individualization. In addition, one or a plurality of electronic elements can be mounted in the electronic component 30.

<Electromagnetic wave shielding layer>
The electromagnetic wave shielding layer 1 is obtained by placing an electromagnetic wave shielding sheet, which will be described later, on the substrate 20 on which the electronic component 30 is mounted, and thermocompression bonding. The electromagnetic wave shielding layer 1 has a scale-like particle-containing layer containing a cured product of a thermosetting resin and a curable compound, and a conductive filler containing scale-like particles (flaky particles). Not included. When the thickness of the electromagnetic wave shielding layer 1 covering the upper surface of the electronic component 30 is T1, and the thickness of the electromagnetic wave shielding layer 1 covering the side surface of the electronic component 30 is T2, T1 / T2 is 1.1-10. And the Martens hardness of the electromagnetic wave shielding layer 1 is 3 to 100 N / mm ² . The average thickness of the scaly particles is in the range of 0.05 to 2 μm, and the exclusive area of the conductive filler in the cut section of the scaly particle-containing layer is 20 to 50%. The exclusive area of the conductive filler is preferably 25 to 45%, more preferably 30 to 40%. By being in the range of 20 to 50%, the scratch test and the ground connectivity can be improved. The conductive filler is continuously in contact with the scaly particle-containing layer and exhibits isotropic conductivity. In addition, the presence or absence of isotropic conductivity does not matter at the stage of the electromagnetic wave shielding sheet described later.

  The thickness direction of the scaly particles in the scaly particle-containing layer (the normal direction of the scaly particle main surface) with respect to the thickness direction of the scaly particle-containing layer (the normal direction of the main surface of the scaly particle-containing layer) It is preferable that a large number of scaly particles substantially coincide with each other when viewed as the whole scaly particle-containing layer. Here, “many” means that the scaly particles whose thickness direction of the scaly particle-containing layer and the thickness direction of the scaly particle-containing layer in the scaly particle-containing layer substantially coincide when viewed as the entire scaly particle-containing layer. It means more than half, and “substantially agree” includes that whose angle with a specific direction is within 35 °. That is, the angle formed by the thickness direction of the scaly particles with respect to the thickness direction of the scaly particle-containing layer and the thickness direction of the scaly particles containing layer is within 35 ° with respect to the thickness direction of the scaly particle-containing layer. Including some. The orientation of the scaly particles can be controlled by controlling the hot press conditions, changing the type of resin or coating method, or adjusting the addition of a metal filler dispersant or leveling agent.

  The covering region of the electromagnetic wave shielding layer 1 only needs to include at least a part of the stepped portion (uneven portion) formed by mounting the electronic component 30 and covers the entire surface on which the electronic component 30 is mounted. Is not required. The electromagnetic wave shielding layer 1 is configured to be connected to a ground pattern (not shown) such as a ground pattern 22 exposed on a side surface or an upper surface of the substrate 20 and / or a wiring for connecting an electronic component in order to sufficiently exert a shielding effect. preferable.

  When an anisotropic conductive layer is included in the electromagnetic wave shielding layer, cracks or wrinkles may enter the electromagnetic wave shielding layer, particularly at the corners, and there is a problem in coverage. Moreover, there existed a problem that the tensile fracture | rupture distortion of the electromagnetic wave shielding sheet before thermocompression bonding became low. On the other hand, in this embodiment, since the anisotropic conductive layer is not included in the electromagnetic wave shielding layer, there is no such problem. And since a scale-like particle content layer is an isotropic conductive layer, it can realize not only excellent shielding properties but also excellent covering properties. Moreover, the tensile breaking strain in the electromagnetic wave shielding sheet before the heat curing treatment can be increased.

  The electromagnetic wave shielding layer is a single layer or multiple layers. In the case of a multilayer, an embodiment in which two isotropic conductive layers are laminated is preferable. Examples of preferred multilayers include a laminate in which two scaly particle-containing layers are laminated, and a laminate of a scaly particle-containing layer and a fibrous (wire-like) conductive layer (isotropic conductive layer). Also, a scale-like particle-containing layer and a conductive filler-containing layer that functions as an isotropic conductive layer that is not classified as a scale-like particle-containing layer (for example, a conductive filler-containing layer in which dendritic particles and spherical particles are mixed, spherical particles For example, a conductive filler-containing layer containing a conductive filler-containing layer containing dendritic particles). When making it a multilayer, it is preferable to make the surface layer side into a scaly particle content layer from a viewpoint of improving scratch resistance. A preferred embodiment is a laminate of an electromagnetic wave reflecting layer and an electromagnetic wave absorbing layer that function as an isotropic conductive layer.

  Scale-like particle-containing layer in which the ratio T1 / T2 of the thickness of the electromagnetic wave shielding layer 1, the Martens hardness is in the above range, and the exclusive area of the conductive filler in the cut section showing the above isotropic conductivity is in the above range. By using an electromagnetic wave shielding layer that does not contain anisotropic conductivity, and the average thickness of the scaly particles is in the above range, the electromagnetic wave has high quality, high coverage, and excellent scratch resistance. A shielding layer can be provided. Moreover, the electromagnetic wave shielding layer excellent in tape adhesiveness can be provided. Here, the tape adhesion is a characteristic evaluated in Examples described later, and serves as an index of adhesion to an electronic component.

  T1 / T2 is preferably 1.3 to 7, more preferably 1.5 to 4, and still more preferably 1.8 to 3.8. T1 / T2 can be adjusted by controlling the conditions of the hot press process, the height of the component, and the width of the groove. When the outer surface of the electronic component 30 is a curved surface or the like and the upper surface and the side surface cannot be clearly defined, the thickness of the electromagnetic wave shielding layer 1 at the position farthest from the substrate 20 in the height direction is T1, and the surface of the T1 The film thickness of the electromagnetic wave shielding layer 1 in the plane direction that is at the most angle with the direction is defined as T2. Other conditions follow the method described in the examples.

Martens hardness, from the viewpoint of scratch resistance, 5N / mm ² or more preferably, 7N / mm ² or more, more preferably, 10 N / mm ² or more is more preferable. From the viewpoint of the tape adhesion, preferably 98 N / mm ² or less, more preferably 90 N / mm ² or less, 80 N / mm ² more preferably less, and particularly preferably 70N / mm ^2. Martens hardness can be adjusted with the hardness of a conductive filler and a binder component. The hardness of the binder component mainly depends on the hardness of the cured product of the thermosetting resin and the curable compound. Specifically, scale-like particles tend to have a high Martens hardness, and spherical and dendritic particles tend to have a low Martens hardness. Moreover, when the amount of the conductive filler increases, the Martens hardness tends to increase. Further, the higher the hardness of the cured resin, the higher the Martens hardness.

Average specific surface area of the flaky particles is preferably 1.40~2.50m ² / g, more preferably 1.60~2.30m ² / g, particularly preferably at 1.80~1.90m ² / g . Moreover, the tap density of scaly particles is preferably 0.50~0.80g / cm ^3, more preferably 0.60~0.70g / cm ^3, particularly preferably 0.66~0.69g / cm ³ It is.

  Examples of the conductive filler containing scale-like particles include metal fillers, conductive ceramic particles, and mixtures thereof. Examples of the metal filler include metal powder such as gold, silver, copper, and nickel, alloy powder such as solder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and core-shell type particles of gold-coated nickel powder. From the viewpoint of obtaining excellent conductive properties, a conductive filler containing silver is preferable. From the viewpoint of cost, silver-coated copper powder is particularly preferable. The silver content in the silver-coated copper is preferably 6 to 20% by mass, more preferably 8 to 17% by mass, and still more preferably 10 to 15% by mass. In the case of core-shell type particles, the average coverage of the coat layer with respect to the core part is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. The core portion may be non-metallic, but from the viewpoint of conductivity, a conductive material is preferable, and metal particles are more preferable.

  As the conductive filler, an electromagnetic wave absorbing filler may be used. For example, iron, Fe-Ni alloy, Fe-Co alloy, Fe-Cr alloy, Fe-Si alloy, Fe-Al alloy, Fe-Cr-Si alloy, Fe-Cr-Al alloy, Fe-Si-Al alloy, etc. Iron-based alloys, Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite and other ferrite materials, and carbon fillers. Examples of the carbon filler include acetylene black, ketjen black, furnace black, carbon black, carbon fiber, particles composed of carbon nano-nanotubes, graphene particles, graphite particles, and carbon nanowalls.

  As the conductive filler, scaly particles may be used exclusively, but scaly particles and particles of other shapes may be used in combination. The particle shape used in combination is not particularly limited, but particles selected from the group consisting of dendritic particles, fibrous particles, acicular particles and spherical particles are preferred. The particles used in combination are used alone or in combination. When used in combination, examples include a combination of scaly particles and dendritic particles, a combination of scaly particles, dendritic particles and spherical particles, and a combination of scaly particles and spherical particles. Among these, from the viewpoint of enhancing the covering property of the electromagnetic wave shielding layer and enhancing the shielding property, scaly particles alone or a combination of scaly particles and dendritic particles is more preferable.

  The mass ratio when the scaly particles and the dendritic particles are mixed in the scaly particle-containing layer is preferably 9: 1 to 1: 9, and more preferably 8: 2 to 2: 8. By setting it as said mixing mass ratio, ground connectivity and level | step difference followability improve more. The average particle diameter D50 of the scaly particles is preferably 2 to 100 μm, and more preferably 2 to 80 μm. More preferably, it is 3-50 micrometers, Most preferably, it is 5-20 micrometers. Similarly, the preferable range of the average particle diameter D50 of the dendritic particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. More preferably, it is 3-50 micrometers, Most preferably, it is 5-20 micrometers. By using the scaly particles and the dendritic particles in combination, the surface glossiness can be optimized, and the printing visibility can be improved when characters are directly printed on the electromagnetic wave shielding layer.

  Further, by using dendritic particles in combination, the number of contact points between the conductive fillers can be increased, and the shielding characteristics can be improved. Also, by using the dendritic particles in combination, the contact area with the binder component can be increased, so that the tensile breaking strain is effectively improved, the electromagnetic shielding sheet is stretched in the plane direction, and the electronic component is followed. It also has the merit that cracks and wrinkles can be effectively suppressed. An embodiment using a mixed system of micro-sized scaly particles and nano-sized spherical particles is also suitable. Note that the conductive filler may be melted by thermocompression bonding with other conductive fillers, particularly when the particle size is small.

  The thickness of the electromagnetic wave shielding layer 1 can be appropriately designed depending on the application. For applications where thinning is required, the thickness T1 of the electromagnetic wave shielding layer 1 covering the upper surface of the electronic component is preferably in the range of 1.1 to 75 μm, more preferably 1.5 to 65 μm, and more preferably 5 to 55 μm. Particularly preferred. In this case, the thickness T2 of the electromagnetic wave shielding layer 1 covering the side surface of the electronic component is preferably 1 to 68 μm, more preferably 1.1 to 59 μm, and particularly preferably 1.5 to 59 μm. For applications where high-frequency noise is shielded with high accuracy, the thickness T1 can be set to about 75 to 200 μm, for example.

The 20 ° surface glossiness of the electromagnetic wave shielding layer 1 is preferably in the range of 0.1 to 20% from the viewpoint of enhancing the visibility of product numbers and lot numbers printed on the outermost surface of the electromagnetic wave shielding layer 1. By setting it as such a range, glossiness is moderately suppressed and it becomes easy to see from various angles. By setting the 20 ° surface glossiness within this range and setting the Martens hardness to 3 to 100 N / mm ² or more, an excellent electromagnetic wave shielding layer having print visibility, scratch resistance and ground connection can be provided. A more preferable range of the 20 ° surface glossiness is 0.3 to 15%, and a more preferable range is 0.5 to 10%. The 20 ° surface glossiness can be easily controlled by using scaly particles.

The pencil hardness (hereinafter, also simply referred to as pencil hardness) of the electromagnetic wave shielding layer 1 according to a pencil hardness test in accordance with JIS K5600-5-4 is a viewpoint of providing a component mounting substrate in which the electromagnetic wave shielding layer is not easily broken against scratches and scratches. Therefore, 7B or more is preferable. More preferably, it is B or more. By setting the Martens hardness to 3 to 100 N / mm ² , T1 / T2 to 1.1 to 10, and the pencil hardness test to 7 B or more, more excellent scratch resistance and edge portion tear resistance can be obtained. A pencil hardness of 7B or more can be easily obtained by combining, for example, scaly particles, a thermosetting resin, and a curable compound.

  The content of the conductive filler in the scaly particle-containing layer is preferably 50 to 95% by mass with respect to the entire scaly particle-containing layer from the viewpoint of obtaining excellent electromagnetic wave shielding properties. The lower limit is more preferably 55% by mass, still more preferably 60% by mass, and particularly preferably 65% by mass.

  A place where the electromagnetic wave shielding layer 1 is easily cracked is a place where the edge part of the electronic component 30 is covered. If the electromagnetic wave shielding layer 1 is cracked at the edge part of the electronic component, the electromagnetic wave shielding effect is lowered, so that the coverage of the uneven part is particularly important. In the uneven part of the electromagnetic wave shielding layer 1, the content of the conductive filler is preferably 40% by mass or more and 95% by mass or less. As shown in FIG. 5 which is a partially enlarged top view of the electromagnetic wave shielding layer of FIG. 4 and a cross-sectional view of the VV cut portion of FIG. 4, the longitudinal line of the upper side constituting the edge of the electronic component 30 is measured. A value measured by measuring a range of 70% in the length direction from the center of the side of the electronic component 30, which is an electromagnetic wave shielding layer existing above a region up to 0.5 mm from the surface to the inner surface of the electronic component 30. To do.

  The component mounting board 101 may be further laminated with other layers such as a film showing scratch resistance, water vapor barrier property, and oxygen barrier property, a film for enhancing magnetic field cut, and the like.

[Electronics]
The component mounting board according to the present embodiment can be mounted on a mounting board via, for example, solder balls formed on the back surface of the board 20, and can be mounted on an electronic device. For example, the component mounting board according to the present embodiment can be used for various electronic devices such as a personal computer, a doublet terminal, and a smart phone.

[Electromagnetic wave shielding sheet]
The electromagnetic wave shielding sheet according to the present embodiment is a sheet before the thermocompression bonding of the electromagnetic wave shielding layer 1. That is, the electromagnetic wave shielding layer 1 can be obtained by heat-pressing the electromagnetic wave shielding sheet. The electromagnetic wave shielding sheet has an isotropic conductivity containing a conductive filler containing a thermosetting resin, a curable compound, and scaly particles having a tensile breaking strain of 50 to 1500% at room temperature and normal pressure. It has a containing layer. The electromagnetic wave shielding sheet does not include an anisotropic conductive layer. When the electromagnetic shielding sheet is heated and cured at 160 ° C. and 2 MPa for 20 minutes, the Martens hardness is in the range of ³ to 100 N / mm ² , and the scale shape is obtained when the electromagnetic shielding sheet is heated and cured at 160 ° C. and 2 MPa for 20 minutes. The exclusive area (A ′) of the conductive filler in the section of the cut portion in the thickness direction of the particle-containing layer is 20 to 50%. The average thickness of the scaly particles used is in the range of 0.05 to 2 μm. The thickness of the scaly particles of the electromagnetic wave shielding sheet before thermocompression bonding and the thickness of the scaly particles after thermocompression bonding are substantially the same. In addition, the scaly particle-containing layer of the electromagnetic wave shielding sheet is a layer before curing, and the thermosetting resin and a part of the curable compound react with the uncured layer at the stage of the electromagnetic wave shielding sheet. Including B stage (semi-cured state).

  In addition, it is sandwiched between the exclusive area (B)% of the conductive filler in the cross section of the scale-like particle-containing layer of the electromagnetic wave shielding sheet and two polyimide films (Kapton 200EN) at 160 ° C. and 2 MPa. The difference ((B) − (A ′)) from the exclusive area (A ′)% when thermocompression bonding for 20 minutes is preferably 1 to 5%. More preferably, it is 2 to 4%. In addition, the said thermocompression bonding conditions are conditions for calculating | requiring the difference of an exclusive area (A ') and an exclusive area ((B)-(A')), Comprising: The thermocompression bonding conditions of this embodiment are not limited to this. .

  Martens hardness and cut section cross section when the electromagnetic wave shielding sheet 2 has a tensile breaking strain within the above range, has the above-mentioned scaly particle-containing layer, does not include the anisotropic conductive layer, and is thermocompression bonded under predetermined conditions. By having the scale-like particle-containing layer before curing in the above-described range, the exclusive area of the conductive filler, and by making the average thickness of the scale-like particles in the above-mentioned range, high quality and high coverage, An electromagnetic wave shielding sheet capable of forming an electromagnetic wave shielding layer excellent in scratch resistance can be provided.

  By setting the tensile breaking strain of the electromagnetic wave shielding sheet 2 to 50 to 1500%, the uneven shape followability at the time of thermocompression bonding is improved, the electromagnetic wave shielding sheet 2 is effectively prevented from being broken by the step, and the electromagnetic wave at the step portion. The elongation of the shielding sheet 2 can be improved. Moreover, by using scale-like particles, the contact between the conductive fillers can be made good, and the resistance value at the step of an electronic component or the like can be made good. As a result, the covering property can be improved and the shielding property can be improved. A more preferable range of the tensile breaking strain is 100 to 1400%, a further preferable range is 150 to 1300%, and a particularly preferable range is 200 to 1000%.

  The preferred layer structure of the electromagnetic wave shielding sheet is as described in the electromagnetic wave shielding layer. The thermosetting resin before heat curing is a resin that functions as a binder in the electromagnetic wave shielding sheet. As shown in FIG. 6, the electromagnetic wave shielding sheet 2 is preferably a multilayer body 4 with a releasable substrate formed on one main surface of the releasable substrate 3 until use.

  The linear expansion coefficient of the electromagnetic wave shielding sheet 2 at 25 to 150 ° C. is preferably in the range of 100 to 700 ppm / ° C. By setting it as this range, the crack in a level | step difference can be prevented effectively and the problem of the curvature in the board | substrate after mounting by a thermal contraction difference can be eliminated. A more preferable range is 125 to 650 ppm / ° C, a further preferable range is 150 to 600 ppm / ° C, and a particularly preferable range is 175 to 550 ppm / ° C.

  As the thermosetting resin, a curable compound reaction type can be used. Furthermore, the thermosetting resin may be self-crosslinked. The thermosetting resin has a reactive functional group that can react with the curable compound.

  Suitable examples of thermosetting resins include polyurethane resins, polyurethane urea resins, acrylic resins, polyester resins, polyamide resins, epoxy resins, polystyrene, polycarbonate resins, polyamideimide resins, polyesteramide resins, polyetherester resins, and A polyimide resin is mentioned. The thermosetting resin may have a functional group capable of self-crosslinking. For example, the thermosetting resin when used under severe conditions during reflow includes at least one of an epoxy resin, an epoxy ester resin, a urethane resin, a urethane urea resin, and a polyamide. It is preferable. Moreover, if it is the range which can endure a heating process, a thermosetting resin and a thermoplastic resin can be used together.

Examples of the reactive functional group of the thermosetting resin include a carboxyl group, a hydroxyl group, and an epoxy group. It is preferable that the acid value of a thermosetting resin is 3-30. By setting the acid value within the above range, an effect that the edge portion breakage resistance is improved can be obtained. A more preferable range of the acid value is 4 to 20, and a more preferable range is 5 to 10.
The weight average molecular weight of the thermosetting resin is preferably 20,000 to 150,000. By setting it to 20,000 or more, scratch resistance can be effectively enhanced. Moreover, the effect that level | step difference followability improves by setting it as 150,000 or less is acquired.

  The curable compound has a functional group capable of crosslinking with the reactive functional group of the thermosetting resin. Curing compounds include epoxy compounds, acid anhydride group-containing compounds, isocyanate compounds, polycarbodiimide compounds, aziridine compounds, dicyandiamide compounds, aromatic diamine compounds and other amine compounds, phenol novolac resins and other phenolic compounds, organometallic compounds, and the like. preferable. The curable compound may be a resin. In this case, the thermosetting resin and the curable compound are distinguished from each other as a thermosetting resin having a higher content and as a curable compound having a lower content.

  The structure and molecular weight of the curable compound can be appropriately designed according to the application. From the viewpoint of effectively increasing the tensile breaking strain, it is preferable to use two or more curable compounds having different molecular weights. For example, a first curable compound having a molecular weight of 2,000 to 25,000 and a second curable compound having a molecular weight of 100 to 1,500 can be combined. By using the first curable compound and the second curable compound, the tensile breaking strain of the electromagnetic wave shielding sheet can be increased. From the viewpoint of more effectively increasing the covering property, the reactive functional group equivalent of the first curable compound is preferably 500 to 3000, and the reactive functional group equivalent of the second curable compound is 100 to 400. Is preferred.

  The curable compound is preferably contained in an amount of 1 to 70 parts by mass, more preferably 3 to 65 parts by mass, and still more preferably 3 to 60 parts by mass with respect to 100 parts by mass of the thermosetting resin. When using a 1st curable compound and a 2nd curable compound together, it is preferable that 5-50 mass parts is included with respect to 100 mass parts of thermosetting resins, and 10-40 mass parts is included. More preferably, it is more preferable to contain 20-30 mass parts. On the other hand, it is preferable to contain 0-40 mass parts with respect to 100 mass parts of thermosetting resins, it is more preferable to contain 5-30 mass parts, and it is still more preferable to contain 10-20 mass parts.

The epoxy compound is not particularly limited as long as it has an epoxy group, but is preferably a polyfunctional epoxy compound. Bifunctionality is particularly preferred from the viewpoint of effectively increasing the tensile breaking strain. In thermocompression bonding or the like, a crosslinked structure can be obtained by thermally crosslinking the epoxy group of the epoxy compound with the carboxyl group or hydroxyl group of the thermosetting resin. As the epoxy compound, an epoxy compound that is liquid at normal temperature and pressure is also suitable.
Examples of the epoxy compound include ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, bisphenol A / epichlorohydrin type epoxy resin, N, N, N ′, N′-tetra. Examples thereof include glycidyl-m-xylenediamine, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, N, N-diglycidylaniline, N, N-diglycidyltoluidine and the like. As a suitable example of an epoxy compound, EXA4850-150 (epoxy equivalent 450, molecular weight 900) manufactured by DIC, EPICLON 830, 840, 850, 860, 1050, 2050, 3050, 4050, 7050, HM-091, 101, Nagase Chem Denaxol EX-211, 212, 252, 711, 721 manufactured by Tex, JER828, 806, 807, 1750 manufactured by Mitsubishi Chemical Corporation, EHPE3150 which is a polymer alicyclic main chain epoxy resin manufactured by Daicel Chemical Industries, etc. .

Moreover, the compound represented by the following chemical formula can be illustrated.

  Examples of the isocyanate compound include tolylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetramethylxylylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, Polyisocyanate compounds such as polymethylene polyphenyl isocyanate, adducts of these polyisocyanate compounds and polyol compounds such as trimethylolpropane, burettes and isocyanurates of these polyisocyanate compounds, and these polyisocyanate compounds and known polyisocyanates. Ether polyol and polyester Polyols, acrylic polyols, polybutadiene polyols, adducts, etc. and polyisoprene polyol and the like.

  Examples of the polycarbodiimide include a carbodilite series manufactured by Nisshinbo Co., Ltd. Among these, Carbodilite V-01, 03, 05, 07, 09 is preferable because of its excellent compatibility with organic solvents.

  Examples of the aziridine compound include 2,2'-bishydroxymethylbutanol tris [3- (1-aziridinyl) propionate], 4,4'-bis (ethyleneiminocarbonylamino) diphenylmethane, and the like.

  As the resin, in addition to the above, a tackifier resin or a thermoplastic resin may be used. Preferable examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, ester amide resin, polyisoprene, and cellulose. Examples of tackifying resins include rosin resins, terpene resins, alicyclic petroleum resins, and aromatic petroleum resins. Further, a conductive polymer can be used. Examples of the conductive polymer include polyethylene dioxythiophene, polyacetylene, polypyrrole, polythiophene, and polyaniline. Preferable examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, ester amide resin, polyisoprene, and cellulose.

  The Tg of the thermosetting resin constituting the electromagnetic wave shielding sheet 2 is preferably -30 to 100 ° C, and more preferably -10 to 80 ° C. One type of binder resin may be used or a plurality of types may be used in combination. In the case of using a plurality of types, it is preferable that the main component (a component of 60% by mass or more of the thermosetting resin) contains Tg before mixing in the above range. The material of the electromagnetic wave shielding sheet 2 is not particularly limited as long as it has flexibility to follow the surface of the electronic component 30 and the exposed substrate 20 at the time of thermocompression bonding and has conductive characteristics that can exhibit electromagnetic wave shielding properties.

  From the viewpoint of improving shielding properties and covering properties, different average particle diameters D50 can be used in combination. From the viewpoint of effectively increasing the covering property, as preferred examples, flaky particles (A) having an average particle diameter D50 of 3 to 8 μm and flaky particles (B) having an average particle diameter D50 of 12 to 20 μm are shown in (A). : It is preferable to use in the range of 20: 80-80: 20 by mass ratio of (B).

  As a preferable example of the scale-like particles, particles obtained by flattening dendritic particles can be exemplified. For example, the particle | grains flattened so that at least one part of the dendrite trace of a dendritic particle may remain can be illustrated. Here, the trace of the resin refers to a shape in which a protrusion or a cut leaving a trace of a tree branch is formed on the outer edge of the flattened particle. A particle having such a shape over the entire outer edge of the flattened particle is more preferable. Thereby, the perimeter of the outer edge of the flattened surface can be lengthened. Moreover, the contact area of components, such as a thermosetting resin, and a conductive filler can be enlarged. Therefore, the tensile breaking strain can be effectively increased. Moreover, the coverage after a thermosetting process can be improved effectively. In particular, it is possible to effectively suppress cracks and wrinkles at the corner (edge) of the electronic component. Although the example which flattened the dendritic particle was demonstrated, it is not limited to this.

A conductive filler having a circularity coefficient of 0.15 or more and 0.4 or less obtained from the following formula (1) can be suitably used as the peripheral length of the outer edge of the flattened surface of the scaly particles. . Examples of such a conductive filler include particles described in International Publication No. WO2013 / 001351.
For the circularity coefficient here, use the analysis software of Mac-View Ver.4 (Mount Tech Co., Ltd.), read the electron microscopic image (about 1000 to 10,000 times) of the conductive filler, and conduct in manual recognition mode. About 20 sex particles are selected. When selecting leaf-like or scale-like particles, the entire particle shape in which the particles do not overlap each other can be confirmed, and those having an angle at which the plane plate is perpendicular are extracted and selected from the observation viewpoint. The particle reference data is a projected area equivalent circle diameter, the distribution is a volume distribution setting, the circularity coefficient and the circular coefficient are calculated, and the average value of 20 is obtained. In the above formula (1), the area is defined as the area inside the line forming the outer periphery when projected in two dimensions as a flat plate surface, and the circumference of the conductive filler when projecting the flat plate surface in two dimensions is the circumference. Long.

  By using such particles, it is possible to make the conductive properties more excellent and to reduce the thickness. Furthermore, since a contact area with binder components, such as a thermosetting resin and a curable compound, becomes large, it has the merit that a tensile fracture strain can be improved effectively. Further, the cost can be reduced by using a core-shell type conductive filler. The average value of the circularity degree coefficient obtained from the mathematical formula (1) is more preferably 0.15 or more and less than 0.3.

  In addition, the average particle diameter D50 in the case of using the particle | grains which satisfy | fill said numerical formula (1) says the value calculated | required by the method of the Example mentioned later. Here, the volume average particle diameter of the particles represents a particle diameter at which the cumulative volume calculated from the small diameter side becomes 50% in the particle diameter distribution measured by the laser diffraction method.

  The average particle diameter D50 of the scaly particles is preferably 2 to 100 μm. You may mix a nanosized electroconductive filler with scale-like particle | grains. Mixing nano-sized particles has the effect of improving the shielding properties by forming a metal-to-metal bond at the time of thermocompression using the melting point lowering phenomenon of nanoparticles.

  By using the scaly particles having a long peripheral length at the outer edge of the scaly particles, it is considered that the anchor effect with the binder resin works and the coverage is increased. Preferable scaly particles include, for example, particles satisfying an average particle diameter D50 of 15 to 18 μm, D90 of 30 to 34 μm, and D100 of 49 to 53 μm. The scale-like particles are preferably 100 to 900 parts by weight, more preferably 150 to 800 parts by weight, and still more preferably 180 to 400 parts by weight with respect to 100 parts by weight of the binder resin. The dendritic particles are preferably 0 to 200 parts by weight, more preferably 70 to 190 parts by weight, and still more preferably 90 to 185 parts by weight with respect to 100 parts by weight of the binder resin.

Furthermore, the composition constituting the electromagnetic wave shielding sheet may contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent, and the like.
Examples of the colorant include organic pigments, carbon black, ultramarine blue, petals, zinc white, titanium oxide, and graphite. Among these, the print visibility of the shield layer is improved by including a black colorant.
Examples of the flame retardant include a halogen-containing flame retardant, a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, and an inorganic flame retardant.
Examples of the inorganic additive include glass fiber, silica, talc, and ceramic.
Examples of the lubricant include fatty acid esters, hydrocarbon resins, paraffin, higher fatty acids, fatty acid amides, aliphatic alcohols, metal soaps, and modified silicones.
Examples of the anti-blocking agent include calcium carbonate, silica, polymethylsilsesquiosan, aluminum silicate salt and the like.

  The releasable base material 3 shown in FIG. 6 is a base material that has been subjected to a release treatment on one side or both sides, and is a sheet having a tensile breaking strain at 150 ° C. of less than 50%. The tensile breaking strain of the releasable substrate is a value determined by the same method (however, the temperature is 150 ° C.) as the tensile breaking strain of the electromagnetic wave shielding sheet described in the examples described later. The releasable substrate 3 also functions as a support in the multilayer body 4 with a releasable substrate. For example, polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, rigid polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene / vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutene, Soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane resin, ethylene vinyl acetate copolymer, plastic sheets such as polyvinyl acetate, paper such as glassine paper, fine paper, kraft paper, coated paper, various types Nonwoven fabric, synthetic paper, metal foil, a composite film combining these, and the like can be mentioned.

  The method for forming the multilayer body 4 with the releasable base material in which the releasable base material 3 and the electromagnetic wave shielding sheet 2 are laminated is not particularly limited, but the method of laminating these sheets, the electromagnetic wave shielding on the releasable base material 3 Examples thereof include a method for coating the composition for forming sheet 2 and a method for printing. Since the releasable substrate 3 is finally peeled off, a material having excellent releasability is preferable. As a suitable example, a polyester film provided with a release layer or the like of alkyd, silicone or fluorine can be exemplified. The thickness of the releasable substrate 3 is, for example, about 5 to 300 μm, and more preferably about 25 to 200 μm. The method for peeling the releasable base material 3 from the multilayer body 4 with the releasable base material is not particularly limited, and may be a machine or a manpower.

[Laminate]
As shown in FIG. 7, the laminate 10 according to the present embodiment includes an electromagnetic wave shielding sheet 2, an adhesive resin layer 9 formed on one main surface of the electromagnetic wave shielding sheet 2, and an adhesive resin layer 9. The formed flexible release sheet 5 is provided. On the other main surface of the electromagnetic wave shielding sheet 2, a releasable base material (not shown) may be laminated.

  The adhesive resin layer 9 has tackiness and plays a role of joining the flexible release sheet 5 and the electromagnetic wave shielding sheet 2. It is characterized by being cured and peeled from the flexible release sheet 5 or cohesive failure after hot pressing. That is, in the component mounting board, the adhesive resin layer 9 functions as a protective layer for the electromagnetic wave shielding layer 1. For the adhesive resin layer 9, the binder resin and the curable compound described in the electromagnetic wave shielding sheet 2 can be used. Among these, the binder resin is preferably a thermosetting resin. The curable compound is preferably a liquid epoxy compound from the viewpoint of imparting tackiness. 1-30 micrometers is preferable and, as for the thickness of the adhesive resin layer 9, 3-20 micrometers is more preferable. The adhesive resin layer 9 preferably uses a binder resin and a liquid epoxy compound in combination. The ratio (parts by mass) of the binder resin and the liquid epoxy compound is preferably 100: 50 to 100: 5. By adding 5 parts by mass or more of the liquid epoxy compound to 100 parts by mass of the epoxy resin, good tackiness can be imparted to the film. To the adhesive resin layer 9, a tackifier such as a tackifier may be added.

  The flexible release sheet 5 is a sheet that has a tensile breaking strain at 150 ° C. of 50% or more and can be flexibly deformed in accordance with the softening and deformation of the electromagnetic wave shielding sheet 2 during thermocompression bonding. There is a sheet. That is, it is set as the layer which can peel from the electromagnetic wave shielding sheet 2 after a thermocompression bonding process, without joining with the electromagnetic wave shielding sheet 2. The tensile breaking strain of the flexible release sheet is a value obtained by the same method (however, the temperature is 150 ° C.) as the tensile breaking strain of the electromagnetic wave shielding sheet described in the examples described later.

  As the flexible release sheet 5, polyethylene, polypropylene, polyether sulfone, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, cyclic olefin polymer, and silicone are preferable. Among these, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are more preferable. The flexible release sheet may be used in a single layer or multiple layers. In the case of multiple layers, the same or different types of sheets can be laminated.

  By subjecting the laminated body 10 to thermocompression bonding and peeling the flexible release sheet 5, the component mounting board of this embodiment can be easily provided. The adhesive resin layer 9 is suitably used as an insulating protective layer. The laminate 10 is suitably used for forming an electromagnetic wave shielding layer on the concavo-convex structure. In particular, it is suitably used for forming the electromagnetic wave shielding layer 1 of the component mounting board 101 according to the above embodiment.

[Manufacturing method of component mounting board]
The component mounting board according to the present embodiment includes a step (a) for mounting a component on the substrate, a mounting step for installing an electromagnetic wave shielding sheet on the substrate on which the component is mounted, and a step portion formed by mounting the component. A step (b) of obtaining an electromagnetic wave shielding layer by bonding by thermocompression bonding so that the electromagnetic wave shielding sheet follows the exposed surface of the substrate including at least a part of the substrate. Hereinafter, an example of a method for manufacturing the component mounting board according to the present embodiment will be described with reference to FIGS. However, the manufacturing method of the component mounting board of the present invention is not limited to the following manufacturing method.

<Process (a)>
First, the electronic component 30 is mounted on the substrate 20. FIG. 8 is an example of the substrate in the manufacturing process stage of the component mounting substrate according to the present embodiment obtained by the step (a). As shown in the figure, a semiconductor chip (not shown) is mounted on a substrate 20, and the substrate 20 on which the semiconductor chip is formed is molded with a sealing resin, and from above between the electronic components to the inside of the substrate 20. The mold resin and the substrate 20 are half-cut by dicing or the like so as to reach. A method of arranging electronic components in an array on a half-cut substrate may be used. In the example of FIG. 8, the electronic component refers to an integrated product obtained by molding a semiconductor chip, and refers to all electronic elements protected by an insulator. The half cut has a mode of cutting to the substrate surface in addition to a mode of reaching the inside of the substrate. Further, the entire substrate may be cut at this stage. In this case, it is preferable that the substrate is placed on the base with the adhesive tape so as not to be displaced.

  The material of the sealing resin for molding is not particularly limited, but a thermosetting resin is usually used. The formation method of sealing resin is not specifically limited, Printing, lamination, transfer molding, compression, casting, etc. are mentioned. Molding is optional, and the mounting method of the electronic component can be arbitrarily changed.

<Step (b)>
After the step (a), the electromagnetic wave shielding sheet 2 containing the binder resin and the conductive filler is placed on the substrate 20 on which the electronic component 30 is mounted. As a suitable example of the step (b), any one of the mounting steps (i) to (iii) described later can be exemplified. The electromagnetic wave shielding sheet 2 becomes an electromagnetic wave shielding layer after thermocompression bonding described later.

(Installation process (i))
The placing step (i) is characterized in that the electromagnetic wave shielding sheet 2 that is not bonded to at least the upper layer is used. A multilayer body 4 with a releasable base material is prepared, which comprises an electromagnetic wave shielding sheet 2 and a releasable base material 3 laminated on one surface of the electromagnetic wave shielding sheet 2. A protective film may be laminated on the other surface of the electromagnetic wave shielding sheet until just before use. Moreover, you may use the multilayer body 4 with a roll-shaped releasable base material. The multilayer body 4 with the releasable base material is temporarily pasted so that the electromagnetic wave shielding sheet 2 is disposed so as to face the bonding region of the substrate 20 with the electromagnetic wave shielding sheet 2 (see FIG. 9).

  Temporary pasting refers to a state in which the electromagnetic wave shielding sheet 2 is fixed to the adherend by the B stage, and is temporarily joined so as to be in contact with at least a part of the upper surface of the electronic component 30. As the peeling force, the peeling force with respect to Kapton 200 is preferably about 1 to 5 N / cm in a 90 ° peel test. As a method of temporarily attaching to a diced substrate, an electromagnetic wave shielding sheet with a releasable substrate is placed on the substrate, and lightly heated or pressure-bonded to the entire surface or edges with a heat source such as an iron, and then temporarily released. The method of peeling off can be illustrated. In order to prevent floating when peeling off the releasable substrate, it is preferable to heat-press the entire surface. For example, an apparatus such as a hot roll laminator for a rigid substrate can be used. Since the electromagnetic shielding sheet surface from which the releasable substrate has been peeled has no tackiness, the step following property can be improved without being pulled by the flexible release sheet described later in the thermocompression bonding step. Depending on the manufacturing equipment or the size of the substrate 20, a plurality of multilayer bodies 4 with a releasable base material are used for each region of the substrate 20, or a multilayer body 4 with a releasable base material is used for each electronic component 30. However, from the viewpoint of simplifying the manufacturing process, it is preferable to use one electromagnetic shielding sheet 2 for the entire plurality of electronic components 30 mounted on the substrate 20.

  Subsequently, the releasable substrate 3 is peeled off (see FIG. 9). Thereafter, the flexible release sheet 5 is placed on the electromagnetic wave shielding sheet 2, and at least the heat-meltable member 6 that is softened by heat is placed on the flexible release sheet 5 (see FIG. 9). The number of laminated layers of the heat-meltable member 6 may be one or more. In the example of FIG. 9 etc., the example which laminated | stacked three layers is shown. In the present embodiment, an example in which two cushion papers 11 are stacked is shown. By using the cushion paper 11, the press pressure can be made uniform.

  The heat-meltable member 6 is a layer that melts at the time of thermocompression bonding, and functions as a cushioning material that promotes followability of the electromagnetic wave shielding sheet 2 to the electronic component 30. Although the heat-meltable member 6 will not be specifically limited if it is a raw material which has thermoplasticity, It is preferable that it is resin with a high elongation rate at the time of a heating. Preferable examples include a methylpentene polymer film, a polybutylene terephthalate resin film, a polyolefin film, a vinyl chloride film, a PVA film, and a PET film. Although the thickness of the heat-meltable member 6 depends on the depth of the groove to be embedded, it is usually about 100 μm to 1 mm. When a plurality of the heat-meltable members 6 are stacked, the total thickness is preferably set within this range.

  It is preferable to further provide a protective layer on the heat-meltable member 6 so that the heat-meltable member 6 does not adhere to the press device during the heat-compression bonding.

  Unlike the method of the present embodiment, when using a multilayer body in which the electromagnetic wave shielding sheet 2, the flexible release sheet 5 and / or the heat-meltable member 6 are used, the electromagnetic wave shielding sheet 2 and the flexible Due to the difference in linear expansion coefficient between the adhesive release sheet 5 and the heat-meltable member 6, warpage and distortion are likely to occur in the multilayer body during thermocompression bonding. As a result, in the covering step, there are cases where the bonding with the electronic component becomes insufficient, or cracks or cracks occur. In particular, in the corner portion (edge portion) constituting the uneven portion of the electronic component, the electromagnetic wave shielding layer is easily cracked or easily broken. The flexible release sheet 5 refers to a non-foamable flexible release sheet that does not include a release foam base material to be described later.

  On the other hand, according to the manufacturing method of (i), the electromagnetic wave shielding sheet 2, the flexible release sheet 5, and the heat-meltable member 6 are not joined to each other and are stacked with separate sheets. Since the electromagnetic wave shielding sheet 2, the flexible release sheet 5 and the heat-meltable member 6 are only overlapped with each other and are not joined to each other, in the thermocompression bonding step (c) described later, the line between the sheets Generation of warpage or distortion due to the difference in expansion coefficient can be effectively prevented. As a result, it is possible to effectively prevent the electromagnetic wave shielding layer 1 from being cracked or torn and to realize excellent coverage. In particular, it is possible to effectively prevent cracking of the electromagnetic wave shielding layer 1 at the corner of the electronic component and form an electromagnetic wave shielding layer having excellent shielding characteristics.

(Installation process (ii))
The mounting step (ii) is different from the above-described mounting step (i) in that a multilayer body with a releasable foam base in which an electromagnetic wave shielding sheet and a releasable foam base material are laminated is used. The releasable foamed base material is a base material having releasability and foaming (having pores) at least on the joint surface with the electromagnetic wave shielding sheet. A releasable foam base material that foams as a whole is more preferred. The releasable foaming base material 7 refers to a base material having pores, a specific gravity of 0.3 to 1.2, and a 25% compressive stress (JIS K6767) of 10 to 140 kPa. A protective film may be laminated on the other surface of the electromagnetic wave shielding sheet 2 until just before use. First, the multilayer body 8 with a releasable foaming base material in which the electromagnetic wave shielding sheet 2 and the releasable foaming base material 7 laminated on one main surface thereof are laminated is prepared. And the multilayer body 8 with a releasable foaming base material is temporarily pasted so that the board | substrate 20 and the electromagnetic wave shielding sheet 2 may face each other (refer FIG. 10). Subsequently, at least the heat-meltable member 6 that is softened by heat is placed on the releasable foam base material 7 (see FIG. 10). Hereinafter, the description overlapping with the mounting step (i) described above will be omitted as appropriate (the same applies hereinafter).

The preferable range of the foaming density of the releasable foam substrate before thermocompression bonding is 200 to 600 kg / m ³ , and the preferable range of the compression hardness of the releasable foam substrate before thermocompression bonding is 40 to 140 kPa. What is necessary is just to design the thickness of the mold release foaming base material 7 with the groove | channel W suitably. For example, when the groove W is 100 to 750 mm, the thickness is about 50 to 1000 μm. Examples of the material of the releasable foam base 7 include a foamed polyethylene terephthalate film, a foamed polyethylene film, a foamed silicon film, a foamed polystyrene film, a foamed polypropylene film, and a foamed rubber sheet. Among these, foamed PET, foamed urethane film, and foamed polypropylene film are more preferable. The releasable foam substrate is obtained by foaming and forming a sheet of a releasable foam substrate forming composition. Here, the preferable foaming ratio is that the mass per 100 cc of the composition for forming a releasable foam base before foaming is M1, and the mass per 100 cc of the composition for forming a releasable foam base after foaming is M2. M1 / M2 is 1.1-10. More preferably, M1 / M2 is 2-7.

  The electromagnetic wave shielding sheet 2 and the releasable foaming base material 7 are a multilayer body 8 with a releasable foaming base material joined together. On the other hand, the releasable foamed base material 7 and the hot-melt member 6 placed thereon are formed by stacking other sheets that are not joined to each other. The releasable foamed base material 7 shows elasticity superior to that of an unfoamed releasable base material by enclosing air bubbles. For this reason, in the thermocompression bonding process of the process (c) mentioned later, extending | stretching of the electromagnetic wave shielding sheet 2 is promoted, and the linear expansion coefficient difference which generate | occur | produces between the electromagnetic wave shielding sheet 2 and the releasable foaming base material 7 can be absorbed. . As a result, the occurrence of warpage and distortion is effectively suppressed, and the coverage of the electromagnetic wave shielding layer 1 is excellent. In particular, it is possible to effectively prevent cracking of the electromagnetic wave shielding layer 1 at the corner of the electronic component and form an electromagnetic wave shielding layer having excellent shielding characteristics.

(Installation process (iii))
The placing step (iii) is different from the above placing steps (i) and (ii) in that a laminate in which an electromagnetic wave shielding sheet, a tackifying resin layer, and a flexible release sheet are formed in this order is used. To do. The tackifier resin exhibits tackiness at room temperature and exhibits thermosetting properties during thermocompression bonding.

  A multilayer body 4 with a releasable base material is prepared, which comprises an electromagnetic wave shielding sheet 2 and a releasable base material 3 laminated on one surface of the electromagnetic wave shielding sheet 2. And the flexible release sheet 5 is laminated | stacked through the adhesive resin layer 9 on the surface in which the release base 3 of the electromagnetic wave shielding sheet 2 in the multilayer body 4 with a release base is not bonded ( After that, the releasable substrate 3 is peeled off to obtain the laminate 10 (see FIG. 7). And the laminated body 10 is temporarily affixed so that the electromagnetic wave shielding sheet 2 may oppose and arrange | position in the joining area | region with the electromagnetic wave shielding sheet 2 of the board | substrate 20 (refer FIG. 12). Subsequently, at least the heat-meltable member 6 that is softened by heat is placed on the flexible release sheet 5 (see FIG. 12). The flexible release sheet 5 and the hot-melt member 6 placed on the flexible release sheet 5 are obtained by stacking other sheets that are not joined to each other. The laminate may be wound up in a roll until use.

  Thereby, generation | occurrence | production and distortion of a laminated body can be effectively prevented in the thermocompression-bonding process of the process (c) mentioned later. Moreover, although the electromagnetic wave shielding sheet 2 is joined via the flexible release sheet 5 and the adhesive resin layer 9, by using the adhesive resin layer 9 between them, the step (c) described later is performed. In the thermocompression bonding step, the coefficient of linear expansion generated between the electromagnetic wave shielding sheet 2 and the flexible release sheet 5 is absorbed, and the occurrence of warpage can be effectively suppressed. As a result, the coverage of the electromagnetic wave shielding layer 1 is excellent. In particular, it is possible to effectively prevent cracking of the electromagnetic wave shielding layer 1 at the corner of the electronic component and form an electromagnetic wave shielding layer having excellent shielding characteristics.

(Preferred example of step (b))
When the height of the electronic component 30 is H, and the total thickness of the flexible release sheet 5 or the releasable foaming base material 7 and the heat-meltable member 6 is T3 (see FIG. 10), T3 / H is It is preferable to be 0.2 or more. By setting it as this range, the substrate uneven | corrugated shape follow-up characteristic can be more effectively exhibited in the thermocompression bonding process of the process (c) mentioned later. A more preferable range of T3 / H is 0.5 or more, and a more preferable range is 0.7 or more. The upper limit of T3 / H is not particularly limited as long as it can be hot-pressed, but it is preferably 7 or less, more preferably 6 or less, still more preferably 5 or less, from the viewpoint of melting from the side during hot pressing and not contaminating the apparatus. Particularly preferably, it is 4 or less.

  The electronic components 30 are arranged on the substrate 20, the width between the electronic components 30 is W, and the total thickness of the flexible release sheet 5 or the releasable foamed base material 7 and the heat-meltable member 6 is T3 (FIG. 10), T3 / W is preferably 0.1-6. By setting it as this range, the substrate uneven | corrugated shape follow-up characteristic can be more effectively exhibited in the thermocompression bonding process of the process (c) mentioned later. A more preferable range of T3 / W is 0.2 to 5, and a more preferable range is 0.5 to 4. Note that the value of W does not need to be constant and can be changed depending on the location. Also in that case, T3 / W is preferably in the range of 0.1-6.

<Step (c)>
After the step (b), the production substrate obtained in the step (b) is sandwiched between a pair of press substrates 40 as shown in FIG. The electromagnetic wave shielding sheet 2 is stretched along a half-cut groove provided on the production substrate by pressing of the heat-meltable member 6 or the like, and is covered to follow the electronic component 30 and the substrate 20 to form an electromagnetic wave shielding layer. Is done. By releasing the press substrate 40, a manufacturing substrate as shown in FIG. 14 is obtained. Next, the layer coated on the layer above the electromagnetic wave shielding layer 1 is peeled off. Thereby, the component mounting board | substrate 101 which has the electromagnetic wave shielding layer 1 which coat | covers the electronic component 30 is obtained (refer FIG. 1, 2). The temperature and pressure in the thermocompression bonding step can be arbitrarily set independently within a range in which the coverage of the electromagnetic wave shielding sheet 2 can be secured according to the heat resistance, durability, manufacturing equipment or needs of the electronic component 30. The pressure range is not limited, but is preferably about 0.1 to 5.0 MPa, and more preferably 0.5 to 2.0 MPa. In addition, you may provide a protective layer etc. on an electromagnetic wave shielding layer as needed. The difference in film thickness before and after the hot pressing is preferably in the range of 1% or more and less than 5%, and more preferably in the range of 2% or more and less than 4%. By setting it to less than 5%, the amount of warpage of the electromagnetic wave shielding layer can be reduced. By setting it to 1% or more, the step following ability becomes good.

  The heating temperature in the thermocompression bonding step is preferably 100 ° C. or higher, more preferably 110 ° C. or higher, and further preferably 120 ° C. or higher. Moreover, although it depends on the heat resistance of the electronic component 30, as an upper limit, it is preferable that it is 220 degreeC, it is more preferable that it is 200 degreeC, and it is further more preferable that it is 180 degreeC.

  The thermocompression bonding time can be set according to the heat resistance of the electronic component, the binder resin used for the electromagnetic wave shielding sheet, the production process, and the like. The thermocompression bonding time is preferably in the range of about 1 minute to 2 hours. The thermocompression bonding time is more preferably about 1 minute to 1 hour. The thermosetting resin is cured by this thermocompression bonding. However, the thermosetting resin may be partially cured or substantially cured before thermocompression bonding, as long as it can flow.

  The thickness of the electromagnetic wave shielding sheet 2 before thermocompression bonding is a thickness that can cover the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20. Although it may vary depending on the fluidity of the binder resin used and the size of the distance W between the electronic components, it is usually preferably about 1 to 200 μm, more preferably about 5 to 100 μm, and further preferably about 10 to 70 μm. Thereby, the electromagnetic wave shielding property can be effectively exhibited while improving the covering property to the sealing resin.

  By using any one of (i) to (iii) as a mounting step and heat-pressing from above using a heat-meltable member functioning as a cushioning material, the heat-meltable member 6 is softened and shields against electromagnetic waves. The sheet 2 can be coated to cover the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20. The ground pattern 22 formed in the substrate 20 is electrically connected to the electromagnetic wave shielding layer 1.

  After the step (c), the substrate 20 is diced in the XY direction at a position corresponding to the product area of the component mounting substrate 101 on the substrate 20 by using a dicing blade or the like. As a result, a component mounting substrate in which the electronic component 30 is covered with the electromagnetic wave shielding layer 1 and the ground pattern 22 formed on the substrate 20 and the electromagnetic wave shielding layer 1 are electrically connected to each other is obtained.

  According to the manufacturing method according to the present embodiment, an electromagnetic wave shielding layer is formed through steps (a) to (c) using an electromagnetic wave shielding sheet having a tensile breaking strain of 50 to 1500%, and the obtained electromagnetic wave shielding layer The average thickness of the flaky filler on the cut surface is 0.05 to 2 μm, and the exclusive area of the conductive filler in the cut section cross section in the thickness direction of the flaky particle-containing layer is set to 20 to 50%. A component mounting board having a highly electromagnetic shielding layer can be manufactured. In addition, there is an advantage that capital investment such as sputtering is unnecessary. In the case of the sputtering apparatus, when the side surface is sputtered, it is necessary to change the angle of the pedestal. In addition, when the electromagnetic wave shielding layer is formed by sputtering, it is necessary to find an optimum condition depending on the shape and size of the electronic component and change the condition in order to suppress defects. According to this embodiment, since these steps are not required, the productivity is excellent. Moreover, since the electromagnetic wave shielding sheet having a tensile strain at break of 50 to 1500% is used, the coverage of the uneven parts of the electronic component is excellent. In addition, since a plurality of uneven electronic parts can be covered together, the productivity is excellent. In addition, since the electromagnetic wave shielding layer can be formed regardless of the arrangement position and shape of the components, versatility is high. It is easy to cut into an optimum size according to the size of the production substrate. In addition, by using the electromagnetic wave shielding sheet according to the present embodiment, a component mounting board having an electromagnetic wave shielding layer having excellent shape followability can be provided.

  Moreover, since the electromagnetic wave shielding sheet is pressed and pressed in the surface direction of the substrate, the smoothness of the electromagnetic wave shielding layer on the top surface of the electronic component is excellent. For this reason, when a product name or lot number is printed by an inkjet method or a laser marking method, a high-quality component mounting substrate with improved character visibility can be provided. Further, by controlling the conditions at the time of thermocompression bonding, there is an advantage that the thickness can be easily controlled and the thickness can be easily reduced.

<Modification>
Next, modifications of the component mounting board according to the present embodiment will be described. However, the present invention is not limited to the above-described embodiments and modifications, and it goes without saying that other embodiments can also belong to the category of the present invention as long as they match the gist of the present invention. Moreover, each embodiment and the modification are suitably combined with each other.

  In the above embodiment, an electronic component has been described as an example of a component. However, the present invention can be applied to all components that are desired to be shielded from electromagnetic waves. That is, the components mounted on the component mounting board are not limited to electronic components. Further, the shape of the part is not limited to a rectangular shape, and includes a part having a corner having an R shape, a part having an acute angle formed by an upper surface and a side surface of the part, and a part having an obtuse angle. Moreover, the case where the outer surface of the component having an uneven shape on the upper surface or the electronic component is a curved surface such as a spherical shape is included. Moreover, in the said embodiment, although the half dicing groove | channel 25 (refer FIG. 2) was formed in the board | substrate 20, the half dicing groove | channel 25 is not essential and mounts and coat | covers an electromagnetic wave shielding sheet | seat on a flat board | substrate. Also good. In addition, the component mounting board of the present invention includes, for example, a case where a component mounting board on which an electronic component obtained by dicing the substrate 20 into all pieces is mounted is placed on another holding substrate or the like.

  You may manufacture a component mounting board | substrate using a holding base material. 15 to 17 show an example of a method for manufacturing a component mounting board using a holding base material. First, as shown in the figure, the IC chip 50 or the like is mounted on the substrate 20, and then the IC chip 50 is collectively sealed using a mold resin 51. Next, the holding base 52 is attached to the main surface of the substrate 20 opposite to the IC chip mounting surface, and the top surface of the mold resin 51 is used to separate the electronic components 30 as shown in FIG. To the surface of the holding substrate 52. Thereby, the substrate 20 is also cut together with the electronic component 30.

  The obtained substrate 20 on which the electronic component 30 with the holding base 52 is mounted is accommodated in a holding base fixing jig 60 having a concave shape as shown in FIG. In addition, you may perform accommodation in the holding base material fixing jig 60 before dicing cut. Then, an electromagnetic wave shielding layer is formed. For example, the laminated body 10 is temporarily attached to the top surface of the electronic component 30, and the heat-meltable member 6 and the cushion paper 11 are sequentially stacked and thermocompression bonded. A component mounting board is obtained through these steps.

  The dicing may be performed up to the inside of the holding substrate 52 instead of the method of performing up to the surface of the holding substrate 52. Further, when the holding substrate 52 is so small that the size variation is negligible than the heat at the time of thermocompression bonding, the holding substrate fixing jig 60 may not be used. Examples of the holding substrate 52 include commercially available dicing tapes, metal substrate tapes, and glass epoxy substrates. A laminate of these materials is also preferably used.

  Even when a holding base material that is easily softened by heat, such as a dicing tape, is used by using the concave holding base material fixing jig 60, the side wall portion of the holding base material fixing jig 60 is used during hot pressing. Variations in the size of the holding base material can be suppressed, and displacement of the substrate 20 with the electronic component 30 can be suppressed. In addition, by adjusting the height of the holding substrate fixing jig 60 having a concave shape, it is possible to effectively prevent the heat-meltable member 6 from flowing out during hot pressing. The holding base material fixing jig 60 may be formed of a dedicated part, or a pedestal of a hot press machine may be used as a concave shape.

  The electromagnetic wave shielding layer 1 has been described as an example in which the entire surface exposed in the top view of the substrate 20 is covered. However, the electromagnetic shielding layer 1 covers a necessary portion of the exposed surface of the substrate including at least a part of the stepped portion formed by mounting components. It is only necessary to include a mode of partially covering and a mode of providing an opening or the like in a part of the coating layer. Moreover, as shown in FIG. 18, the aspect which forms components in both the main surfaces of the board | substrate 20 is also used suitably.

  The component mounting board according to the present embodiment is excellent in the coverage with respect to the concavo-convex structure, and is therefore suitable for a hard disk, a cable, a printed wiring board, and the like built in a personal computer, a mobile device, a digital camera, or the like. Moreover, the electromagnetic wave shielding sheet and laminate of the present invention can also be applied to a concavo-convex shape surface on which no component is mounted.

<< Example >>
EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to a following example. In the examples, “part” means “part by mass”, and “%” means “% by mass”. Moreover, the value described in the present invention was determined by the following method.

(1) Production of test substrate A substrate on which mold-sealed electronic components were mounted in an array on a glass epoxy substrate was prepared. The thickness of the substrate is 0.3 mm, and the mold sealing thickness, that is, the height (component height) H from the upper surface of the substrate to the top surface of the mold sealing material is 0.4 mm. Thereafter, half dicing was performed along a groove which is a gap between components, to obtain a test substrate (see FIG. 19). The half-cut groove depth was 0.5 mm (the cut groove depth of the substrate 20 was 0.1 mm), and the half-cut groove width was changed to 100 to 750 μm as shown in the table of Examples.

The materials used in the examples are shown below.
Conductive filler 1: “Scalar particle average particle diameter D50 = 11.0 μm, thickness 1.1 μm, circularity coefficient = 0.23 using copper for core and silver for coating layer” (Fukuda Metal Foil Powder Industry Co., Ltd.) Made)
Conductive filler 2: “dendritic particle average particle diameter D50 = 9.0 μm, circularity coefficient = 0.12 using copper for core and silver for coating layer” (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.)
Conductive filler 3: “Scalar particle average particle diameter D50 = 6.0 μm, thickness 0.8 μm, circularity coefficient = 0.19 using copper for core and silver for coating layer” (Fukuda Metal Foil Powder Industry Co., Ltd.) Made)
Conductive filler 4: “Scalar particle average particle diameter D50 = 19.0 μm, thickness 1.0 μm, circularity coefficient = 0.24 using copper for core and silver for coating layer” (Fukuda Metal Foil Powder Industry Co., Ltd.) Made)
Conductive filler 5: Fe—Si—Cr based scaly magnetic particles (average particle diameter D50: 9.8 μm, thickness 0.5 μm, circularity coefficient 0.43)
Conductive filler 6: Fe—Co scale-like magnetic particles (average particle diameter D50: 13 μm, thickness 0.6 μm, circularity coefficient 0.69)
Conductive filler 7: Mn—Zn scale-like magnetic particles (average particle diameter D50: 15 μm, thickness 0.9 μm, circularity coefficient 0.56)
Thermosetting resin: Urethane urea resin Acid value 5 [mgKOH / g] (manufactured by Toyochem)
Curing Compound 1: Epoxy Resin, “JER828” (Bisphenol A Type Epoxy Resin Epoxy Equivalent = 189 g / eq) Curing Compound 2: Epoxy Resin, “Denacol EX212” (Bifunctional Epoxy Resin Epoxy Equivalent = 151 g / eq) Curing compound 3 manufactured by Nagase ChemteX Corporation: Epoxy resin, “Adeka Resin EPR-1415-1” (rubber-modified epoxy resin epoxy equivalent = 400 g / eq) Curing compound 4: manufactured by Adeka Corporation: Epoxy resin, “HP-4032D (Naphthalene type epoxy resin, epoxy equivalent = 140 g / eq) DIC Corporation releasable base material: PET film releasable foam base material with a thickness of 50 μm coated with a silicone release agent A: Alkyd resin on the surface Coated thickness is 50 μm Foam density 110 kg / m ³ , Specific gravity 1.1, 25% foam PET film releasable foam base material B with compression stress of 0.09 MPa: Thickness of alkyd resin coated on the surface is 100 μm, foam density is 240 kg / m ³ , specific gravity is 0.5, 25% Foamed urethane film having a compressive stress of 0.05 MPa, releasable foamed base material C: foamed polypropylene having a thickness of 100 μm, a foam density of 220 kg / m ³ , a specific gravity of 0.6, and a 25% compressive stress of 0.04 MPa. Film flexible release sheet: “X-44B” (single-layer TPX film having a thickness of 50 μm) Hot-melt member made by Mitsui Chemicals, Inc .: Soft vinyl chloride sheet having a thickness of 80 μm

<Thickness measurement>
In order to measure the thicknesses T1 and T2 of the electromagnetic wave shielding layer, a cross section was obtained by a polishing method, and the cross section of the electromagnetic wave shielding layer was image-processed with a laser microscope. And the film thickness of the thickest location in each area | region of thickness T1, T2 was measured. Measurements were similarly made on five samples with different cross sections, and the average value was defined as thicknesses T1 and T2.

<Occupied area of conductive filler of scaly particle-containing layer>
In order to measure the area occupied by the scaly particles in the scaly particle-containing layer of the electromagnetic wave shielding layer, the electromagnetic wave shielding layer was cut using a cross section polisher (SM-09010, manufactured by JEOL Ltd.), and the cut surface Got. A laser microscope (manufactured by Keyence Corporation, VK-X100) was used for the obtained cut surface, and an enlarged screen with a magnification of 2000 times was obtained. Use the free software “GIMP 2.6.11” for the enlarged image obtained, read the image data, specify the cut surface in the scale-like particle-containing layer with a thickness of 10 μm and top view of 100 μm, and automatically adjust the threshold Thus, the conductive fine particles were converted to white, and the components other than the conductive fine particles were converted to black. Thereafter, a black region (0 to 254) was selected from the histogram to calculate a percentage of the number of white pixels, that is, a ratio of the exclusive area of the conductive filler in a thickness of 10 μm and a top view of 100 μm. The same measurement was performed at three different locations, and the average value was defined as the exclusive area (A) (%) of the conductive filler. The cut surface was cut out at the position e shown in FIG. 20 of the electronic component.

  The cut surface of the electromagnetic wave shielding sheet was formed, and the exclusive area (B) (%) of the scaly particle-containing layer before hot pressing was determined. The electromagnetic wave shielding sheet was sandwiched between two polyimide films (Kapton 200EN), and the exclusive area (A ′)% when thermocompression bonded at 160 ° C. and 2 MPa for 20 minutes was determined. The measurement method was the same as above. The difference ((B) − (A ′)) between the exclusive area (B) (%) and the exclusive area (A ′) (%) was defined as the film thickness difference (%) before and after the heating press.

<Average thickness of conductive filler>
About 10 to 20 different particles were measured on the basis of an image obtained by enlarging the cut surface image with an electron microscope to about 1,000 to 50,000 times, and the average value was used.
<Measurement of Martens hardness>
Martens hardness was measured with a Fischer scope H100C (Fischer Instruments) type hardness tester in accordance with ISO14577-1. The measurement is performed using a Vickers indenter (diamond indenter with a spherical tip of 100φ) on the e-plane (see FIG. 20) of the sample on the electronic component 30 in a constant temperature room at 25 ° C. with a test force of 0.3 N. The test was performed under the conditions of a force holding time of 20 seconds and a test force addition time of 5 seconds. The average value of the values obtained by repeatedly measuring the same cured film surface at 10 locations at random was defined as Martens hardness. The test force is adjusted according to the thickness of the electromagnetic wave shielding layer. Specifically, the test force was adjusted so that the maximum indentation depth was about 1/10 of the thickness of the electromagnetic wave shielding layer.

<20 ° surface gloss>
According to JIS Z8741, the 20 ° surface glossiness of the surface of the electromagnetic wave shielding layer is measured according to BYK. The measurement was performed at a measurement angle of 20 ° using a GARDNER micro-TRI-gloss surface gloss meter.

<Pencil hardness test (scratch test)>
The pencil hardness test was carried out at a load of 750 g based on JIS K5600-5-4 for the pencil hardness of the surface of the electromagnetic wave shielding layer. The evaluation criteria are as follows.
+ +: B or better.
+: 7B or more and less than B Good results.
*: Less than 7B.

<Measurement of tensile breaking strain>
The tensile breaking strain (%) obtained by the following method was defined as the tensile breaking strain. The electromagnetic wave shielding sheet was cut into a size of 200 mm wide × 600 mm long, and then the peelable sheet was peeled off from the electromagnetic wave shielding sheet to obtain a measurement sample. A tensile test (test speed 50 mm / min) was carried out under the conditions of a temperature of 25 ° C. and a relative humidity of 50% using a small desktop tester EZ-TEST (manufactured by Shimadzu Corporation). The tensile breaking strain (%) of the electromagnetic wave shielding sheet was calculated from the obtained SS curve (Stress-Strain curve).

<Linear expansion coefficient>
As the linear expansion coefficient of the present invention, a value measured by a linear expansion coefficient test method based on thermomechanical analysis of plastic described in JIS-K7197 is used.

<Storage modulus>
Using a dynamic elastic modulus measuring apparatus DVA-200 (made by IT Measurement Control Co., Ltd.), a deformation mode “tension”, a frequency of 10 Hz, a heating rate of 10 ° C./min, and a measurement temperature range of 25 ° C. with respect to the electromagnetic shielding sheet. Measurement was performed at a temperature of ˜300 ° C., and a storage elastic modulus at 150 ° C. was obtained.

<Measurement of content of conductive filler in electromagnetic wave shielding layer>
As shown in FIGS. 4 and 5, in the region partitioned from the edge portion of the upper surface to the inside of the region of 0.5 mm toward the inner surface of the electronic component 30, and from the center of the side of the electronic component 30. The electromagnetic wave shielding layer having a value measured in the range of 70% was scraped off. The mass of the conductive filler in the electromagnetic wave shielding layer relative to the total mass of the shaved electromagnetic wave shielding layer was determined by TG-DTA.

<Average particle diameter D50>
The average particle diameter is a numerical value of the average particle diameter D50 obtained by measuring conductive composite fine particles with a tornado dry powder sample module using a laser diffraction / scattering particle size distribution measuring device LS13320 (manufactured by Beckman Coulter). The cumulative value in the cumulative particle size distribution is a particle size of 50%. The distribution was volume distribution, and the refractive index was set to 1.6. Any particle size may be used, and either primary particles or secondary particles may be used.

<Measurement of acid value>
About 1 g of thermosetting resin is precisely weighed in a conical flask with a stopper, and 50 mL of a mixed solution of toluene / ethanol (volume ratio: toluene / ethanol = 2/1) is added and dissolved. To this is added phenolphthalein reagent as an indicator and held for 30 seconds. Thereafter, the solution is titrated with a 0.1 mol / L alcoholic potassium hydroxide solution until the solution becomes light red. The acid value was determined by the following formula. The acid value is a numerical value of the dry state of the resin.
Acid value (mgKOH / g) = (a × F × 56.1 × 0.1) / S
S: Amount of sample collected x (solid content of sample / 100) (g)
a: Titration volume of 0.1 mol / L alcoholic potassium hydroxide solution (mL)
F: Potency of 0.1 mol / L alcoholic potassium hydroxide solution

<Measurement of weight average molecular weight (Mw)>
For measurement of Mw, GPC (gel permeation chromatography) “HPC-8020” manufactured by Tosoh Corporation was used. GPC is liquid chromatography that separates and quantifies substances dissolved in a solvent (THF; tetrahydrofuran) based on the difference in molecular size. For the measurement, two columns, “LF-604” (manufactured by Showa Denko KK: GPC column for rapid analysis: 6 mm ID × 150 mm size) are connected in series, the flow rate is 0.6 mL / min, and the column temperature is 40 ° C. The weight average molecular weight (Mw) was determined in terms of polystyrene.

[Example 1] (Production method (i))
A container is charged with 100 parts of thermosetting resin (solid content), 25 parts of epoxy resin 1, 25 parts of epoxy resin 2, 185 parts of conductive filler 1, and 185 parts of conductive filler 2. Then, a mixed solvent of toluene: isopropyl alcohol (mass ratio 2: 1) was added so that the nonvolatile content concentration was 45% by mass, and the mixture was stirred for 10 minutes with a disper to obtain a resin composition.
This resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness was 60 μm. And the multilayer body with a releasable base material by which the releasable base material and the electromagnetic wave shielding sheet were laminated | stacked by drying at 100 degreeC for 2 minute (s) was obtained.
The multilayer body with a releasable substrate was cut into 10 × 10 cm, placed on a test substrate shown in FIG. Thereafter, the release substrate is peeled off, a flexible release sheet is placed on the removed surface, and further eight hot-melt members are placed thereon, so that a cushion laminate for hot pressing is used. Got the body. Hot pressing was performed for 20 minutes under the conditions of 2 MPa and 160 ° C. with respect to the substrate surface from above the cushion laminate. After the hot pressing, the component release substrate coated with the electromagnetic wave shielding layer was obtained by removing the flexible release sheet and the heat-meltable member.

[Examples 2-16, 19-21, 25-32 and Comparative Examples 1-4]
Except for changing each component and its blending amount (parts by mass), electronic component mounting interval, T3 thickness as shown in Tables 1 and 2 and mounting process as shown in Table 2, the same as in Example 1. Thus, a component mounting board was produced. The compounding quantity of the resin shown in Table 1 is solid content mass.

[Example 17] (Production method (ii))
A container is charged with 100 parts of thermosetting resin (solid content), 25 parts of epoxy resin 1, 25 parts of epoxy resin 2, 185 parts of conductive filler 1, and 185 parts of conductive filler 2. Then, a mixed solvent of toluene: isopropyl alcohol (mass ratio 2: 1) was added so that the nonvolatile content concentration was 45% by mass, and the mixture was stirred for 10 minutes with a disper to obtain a resin composition.
The resin composition is applied to the releasable foam base A using a doctor blade so that the dry thickness is 60 μm, and dried at 100 ° C. for 2 minutes, whereby the electromagnetic wave shielding sheet and the releasable foam base are obtained. A multilayer body with a releasable foam base material with A was obtained.
The multilayer body with a releasable foam substrate was cut to 10 × 10 cm, and placed and temporarily pasted so that the surface of the electromagnetic wave shielding sheet was in contact with the test substrate (upper surface of the electronic component 30) shown in FIG. Thereafter, eight heat-meltable members were stacked on the releasable foam substrate A. Hot pressing was performed for 20 minutes under the conditions of 2 MPa and 160 ° C. with respect to the substrate surface from above the cushion laminate. After the heat press, the part-mounting substrate coated with the electromagnetic wave shielding layer was obtained by removing the releasable foam base material A and the heat-meltable member.
[Examples 22 to 24] (Production method (ii))
A component mounting board was obtained in the same manner as in Example 17 except that the releasable foam base A was changed to a releasable base, a releasable foam base B, and a releasable foam base C.

[Example 18] (Production method (iii))
A container is charged with 100 parts of thermosetting resin (solid content), 25 parts of epoxy resin 1, 25 parts of epoxy resin 2, 185 parts of conductive filler 1, and 185 parts of conductive filler 2. Then, a mixed solvent of toluene: isopropyl alcohol (mass ratio 2: 1) was added so that the nonvolatile content concentration was 45% by mass, and the mixture was stirred for 10 minutes with a disper to obtain a resin composition.
This resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness was 60 μm. And it dried at 100 degreeC for 2 minute (s), and the multilayer body with a releasable base material with which the electromagnetic wave shielding sheet was laminated | stacked on one side of the releasable base material was obtained.
Separately, 100 parts of thermosetting resin (solid content), 25 parts of epoxy resin (jER828: manufactured by Mitsubishi Chemical Corporation), and 1 part of terpene resin (YS resin PX1250: manufactured by Yasuhara Chemical Co., Ltd.) are charged in a container. A pressure-sensitive adhesive resin composition was obtained by adding a mixed solvent of toluene: isopropyl alcohol (mass ratio 2: 1) so as to have a nonvolatile content concentration of 45% by mass and stirring with a disper for 10 minutes.
Next, the adhesive composition is applied to one surface of the flexible release sheet with a doctor blade so that the thickness after drying is 10 μm, and dried at 100 ° C. for 2 minutes, so that the adhesive resin layer is on one side. A flexible release sheet with an adhesive resin layer was obtained.
The electromagnetic wave shielding sheet surface of the multilayer body with the releasable substrate and the adhesive resin layer of the flexible release sheet with the adhesive resin layer are bonded with a laminator, and the releasable substrate on the electromagnetic wave shielding sheet side is peeled off. As a result, a laminate was obtained.
The laminated body was cut into 10 × 10 cm, placed so that the surface of the electromagnetic wave shielding sheet was in contact with the test substrate, and temporarily stuck. Thereafter, eight hot-melt members were placed on the flexible release sheet to obtain a cushion laminate for hot pressing. The cushion laminate was hot-pressed for 20 minutes on the entire surface from above at 2 MPa and 160 ° C. After the hot pressing, the component release substrate coated with the electromagnetic wave shielding layer was obtained by removing the flexible release sheet and the heat-meltable member.

  About the said Example and comparative example, it evaluated with the following measuring methods and evaluation criteria.

<Evaluation of warpage before and after coating of electromagnetic wave shielding layer>
A 125 μm-thick polyimide film (Kapton 500H manufactured by Toray DuPont) is cut into 11 cm × 11 cm, a 50 μm-thick electromagnetic shielding sheet is cut into 10 cm × 10 cm, and 160 ° C. and 2 MPa at the center of the polyimide film. After hot pressing, the edge was fixed and the amount of warpage of the opposite edge was measured.
++: The amount of warpage is less than 2 mm. Good results.
+: The amount of warpage is 2 mm or more and less than 5 mm.
NG: Warpage amount is 5 mm or more.

<Step following ability evaluation>
For the component mounting boards obtained in Examples 1 to 32 and Comparative Examples 1 to 4, the connection resistance value between the ground terminals ab at the bottom shown in the cross-sectional view of FIG. 20 was determined using RM3544 manufactured by HIOKI and a pin type lead probe. The step following ability was evaluated by measuring the above.
The evaluation criteria are as follows.
+ +: Connection resistance value is less than 200 mΩ. It is a good result.
+: Connection resistance value is 200 mΩ or more and less than 1000 mΩ. There is no problem in practical use.
NG: Connection resistance value is 1000 mΩ or more.

<Edge tear resistance>
The tear of the edge part of the component mounting board shown in FIG. 20 was observed and evaluated with a microscope. Observation evaluated four different edge portions.
The evaluation criteria are as follows.
+ +: No tearing. It is a good result.
+: Some parts are torn and the electronic parts are exposed, but there is no practical problem.
NG: Less than the above evaluation, or the entire edge is broken and the electronic parts are exposed in the entire area.

<Ground connection evaluation>
In connection with the component mounting boards obtained in Examples 1 to 32 and Comparative Examples 1 to 4, the connection resistance value between the ground terminals bc at the bottom shown in the sectional view of FIG. The ground connectivity was evaluated by using and measuring.
The evaluation criteria are as follows.
+ +: Connection resistance value is less than 200 mΩ. It is a good result.
+: Connection resistance value is 200 mΩ or more and less than 1000 mΩ. There is no problem in practical use.
NG: Connection resistance value is 1000 mΩ or more.

<Tape adhesion>
Twenty-five grids with an interval of 1 mm were created on the e-plane (see FIG. 20) of the obtained component mounting board using a cross-cut guide according to JISK5400. Then, the adhesive tape was strongly pressed on the grid area, and the end of the tape was peeled off at an angle of 45 °, and the grid pattern was judged according to the following criteria.
+ +: The eyes of any lattice are not peeled off.
+: The coating film is partially peeled along the cut line. The peeling rate is 15% or more and less than 35%.
NG: The coating film is peeled off partially or entirely along the cut line. Peeling rate of 35% or more.

<Print visibility>
It printed by screen printing using white ink (made by Toyo Ink Co., Ltd.) on the e surface (refer FIG. 20) of the obtained component mounting board | substrate. The printing size was 5 points. A 60 W LED light was applied to the printing unit in the dark room, and it was confirmed whether the printing was visually visible by opening a distance of 50 cm from printing at an angle of 20 °, 45 °, and 90 ° with respect to the horizontal plane. The evaluation criteria are as follows.
+ + +: Visible at 20 °, 45 °, and 90 °. Very good result.
++: Visible at 45 ° and 90 ° Good results.
+: Visible at 90 ° No problem in practical use.
NG: Less than the above-mentioned + evaluation or invisible at all angles.

  FIG. 21 is a cross-sectional view of the cut portion of the electromagnetic wave shielding sheet of Example 14, and FIG. 22 is a cross-sectional view of the cut portion of the electromagnetic wave shielding layer of Example 14.

  Tables 3 and 4 show the evaluation results of the component mounting boards according to the example and the comparative example. Table 1 shows the linear expansion coefficient, tensile breaking strain, and storage modulus of the electromagnetic wave shielding sheet.

In Comparative Example 1 where T1 / T2 was 0.9, the ground connectivity was out of the practical range. Further, in Comparative Example 2 where T1 / T2 was 12.0 and Martens hardness was 2 N / mm ² , the step followability, edge crack resistance, and scratch test were out of the practical range. Further, in Comparative Example 3 having a Martens hardness of 113 N / mm ² , the step following ability was outside the practical range, and the ground connectivity and the tape adhesion were also outside the practical range. Furthermore, Comparative Example 4 in which the area occupied by the conductive filler was 19% had problems in edge portion breakage resistance, ground connectivity, scratch test, warpage amount, and the like. On the other hand, according to the present example, excellent results were obtained in step followability, edge portion tear resistance, ground connectivity, tape adhesion, and print visibility, and the scratch test result was also good.

DESCRIPTION OF SYMBOLS 1 Electromagnetic wave shielding layer 2 Electromagnetic wave shielding sheet 3 Releasable base material 4 Multilayer body with releasable base material 5 Flexible release sheet 6 Hot melt member 7 Releasable foam base material 8 Multilayer with releasable foam base material Body 9 Adhesive resin layer 10 Laminate 11 Cushion paper 20 Substrate 21 Wiring or electrode 22 Ground pattern 23 Inner via 24 Solder ball 25 Half dicing groove 30 Electronic component 31 Semiconductor chip 32 Mold resin 33 Bonding wire 40 Press substrate 50 IC chip 51 Mold resin 52 Holding substrate 60 Holding substrate fixing jigs 101 to 103 Component mounting substrate

Martens hardness, from the viewpoint of scratch resistance, 5N / mm ² or more preferably, 7N / mm ² or more, more preferably, 10 N / mm ² or more is more preferable. From the viewpoint of the tape adhesion, preferably 98 N / mm ² or less, more preferably 90 N / mm ² or less, 80 N / mm ² more preferably less, and particularly preferably 70N / mm ^2. Martens hardness can be adjusted by the hardness of the hardened | cured material of a conductive filler and mainly a thermosetting resin and a curable compound . In concrete terms, scaly particles tend Martens hardness is increased, spherical, dendritic particles tend to Martens hardness is lowered. Moreover, when the amount of the conductive filler increases, the Martens hardness tends to increase. Further, the higher the hardness of the cured resin, the higher the Martens hardness.

[Electromagnetic wave shielding sheet]
The electromagnetic wave shielding sheet according to the present embodiment is a sheet before the thermocompression bonding of the electromagnetic wave shielding layer 1. That is, the electromagnetic wave shielding layer 1 can be obtained by heat-pressing the electromagnetic wave shielding sheet. The electromagnetic wave shielding sheet has an isotropic conductivity containing a conductive filler containing a thermosetting resin, a curable compound, and scaly particles having a tensile breaking strain of 50 to 1500% at room temperature and normal pressure. It has a containing layer. The electromagnetic wave shielding sheet does not include an anisotropic conductive layer. When the electromagnetic shielding sheet is heated and cured at 160 ° C. and 2 MPa for 20 minutes, the Martens hardness is in the range of ³ to 100 N / mm ² , and the scale shape is obtained when the electromagnetic shielding sheet is heated and cured at 160 ° C. and 2 MPa for 20 minutes. The exclusive area ( A) of the conductive filler in the section of the cut portion in the thickness direction of the particle-containing layer is 20 to 50%. The average thickness of the scaly particles used is in the range of 0.05 to 2 μm. The thickness of the scaly particles of the electromagnetic wave shielding sheet before thermocompression bonding and the thickness of the scaly particles after thermocompression bonding are substantially the same. In addition, the scaly particle-containing layer of the electromagnetic wave shielding sheet is a layer before curing, and the thermosetting resin and a part of the curable compound react with the uncured layer at the stage of the electromagnetic wave shielding sheet. Including B stage (semi-cured state).

Further, a dedicated closed area (B)% of the cut section in the thickness direction of the electromagnetic wave shielding sheet scaly particles-containing layer, was sandwiched between two sheets of polyimide film (Kapton 200EN), heat and pressure 160 ° C., 20 minutes at 2MPa The difference ((B) − (A ′)) from the exclusive area (A ′)% in this case is preferably 1 to 5%. More preferably, it is 2 to 4%. In addition, the said thermocompression bonding conditions are conditions for calculating | requiring the exclusive area (A ') and the difference ((B)-(A') ) of an exclusive area, Comprising: The thermocompression bonding conditions of this embodiment are not limited to this. .

<Step (c)>
After the step (b), the production substrate obtained in the step (b) is sandwiched between a pair of press substrates 40 as shown in FIG. The electromagnetic wave shielding sheet 2 is stretched along a half-cut groove provided on the production substrate by pressing of the heat-meltable member 6 or the like, and is covered to follow the electronic component 30 and the substrate 20 to form an electromagnetic wave shielding layer. Is done. By releasing the press substrate 40, a manufacturing substrate as shown in FIG. 14 is obtained. Next, the layer coated on the layer above the electromagnetic wave shielding layer 1 is peeled off. Thereby, the component mounting board | substrate 101 which has the electromagnetic wave shielding layer 1 which coat | covers the electronic component 30 is obtained (refer FIG. 1, 2). The temperature and pressure in the thermocompression bonding step can be arbitrarily set independently within a range in which the coverage of the electromagnetic wave shielding sheet 2 can be secured according to the heat resistance, durability, manufacturing equipment or needs of the electronic component 30. The pressure range is not limited, but is preferably about 0.1 to 5.0 MPa, and more preferably 0.5 to 2.0 MPa. In addition, you may provide a protective layer etc. on an electromagnetic wave shielding layer as needed. The difference in exclusive area before and after the heating press is preferably in the range of 1% or more and less than 5%, and more preferably in the range of 2% or more and less than 4%. By setting it to less than 5%, the amount of warpage of the electromagnetic wave shielding layer can be reduced. By setting it to 1% or more, the step following ability becomes good.

<Occupied area of conductive filler of scaly particle-containing layer>
In order to measure the area occupied by the conductive filler in the scaly particle-containing layer of the electromagnetic wave shielding layer, the electromagnetic wave shielding layer was cut using a cross-section polisher (manufactured by JEOL Ltd., SM-09010), and the cut surface Got. A laser microscope (manufactured by Keyence Corporation, VK-X100) was used for the obtained cut surface, and an enlarged screen with a magnification of 2000 times was obtained. Use the free software “GIMP 2.6.11” for the enlarged image obtained, read the image data, specify the cut surface in the scale-like particle-containing layer with a thickness of 10 μm and top view of 100 μm, and automatically adjust the threshold Thus, the conductive fine particles were converted to white, and the components other than the conductive fine particles were converted to black. Thereafter, a black region (0 to 254) was selected from the histogram to calculate a percentage of the number of white pixels, that is, a ratio of the exclusive area of the conductive filler in a thickness of 10 μm and a top view of 100 μm. The same measurement was performed at three different locations, and the average value was defined as the exclusive area (A) (%) of the conductive filler. The cut surface was cut out at the position e shown in FIG. 20 of the electronic component.

The cut surface of the electromagnetic wave shielding sheet was formed, and the exclusive area (B) (%) of the scaly particle-containing layer before hot pressing was determined. In addition, the electromagnetic wave shielding sheet was sandwiched between two polyimide films (Kapton 200EN), and the exclusive area (A ′)% when thermocompression bonded at 160 ° C. and 2 MPa for 20 minutes was determined. The measurement method was the same as above. And the difference ((B)-(A ')) of exclusive area (B) (%) and exclusive area (A') (%) was made into the difference (%) before and behind a hot press.

Claims (15)

A substrate,
Components mounted on at least one surface of the substrate;
Including an electromagnetic wave shielding layer covering the exposed surface of the substrate, including at least a part of the stepped portion formed by mounting the component;
The electromagnetic wave shielding layer is
Scale-like particles containing isotropic conductivity containing a Martens hardness of 3 to 100 N / mm ² and further containing a cured product of a thermosetting resin and a curable compound and a conductive filler containing scale-like particles Having a layer and not including an anisotropic conductive layer,
When the thickness of the electromagnetic wave shielding layer covering the upper surface of the component is T1, and the thickness of the electromagnetic wave shielding layer covering the side surface of the component is T2, T1 / T2 is 1.1 to 10,
The scaly particles have an average thickness of 0.05 to 2 μm,
The component mounting board whose exclusive area of the said conductive filler of the cut part cross section of the thickness direction of the said scaly particle content layer is 20 to 50%.   The component mounting board according to claim 1, wherein the electromagnetic wave shielding layer has a 20 ° surface glossiness of 0.1 to 20%.   The component mounting substrate according to claim 1, wherein the scale-like particle-containing layer includes 50 to 95% by mass of the conductive filler with respect to the mass of the entire scale-like particle-containing layer.   The component mounting board according to claim 1, wherein the conductive filler is an electromagnetic wave absorbing filler.   The component mounting substrate according to claim 1, wherein the conductive filler further includes at least one of dendritic particles and spherical particles.   The component mounting board according to claim 1, wherein the electromagnetic wave shielding layer includes two isotropic conductive layers, and at least one layer of the isotropic conductive layer is the scaly particle-containing layer.   The electronic device which comprises the component mounting board in any one of Claims 1-6. A component comprising: a substrate; a component mounted on at least one surface of the substrate; and an electromagnetic wave shielding layer that covers at least a part of a step formed by mounting the component and covers an exposed surface of the substrate. It is a sheet before thermocompression bonding of the electromagnetic shielding layer used for a mounting substrate,
The tensile strain at break is 50-1500%,
It has a scale-like particle-containing layer showing isotropic conductivity containing a thermosetting resin, a curable compound and a conductive filler containing scale-like particles, and does not contain an anisotropic conductive layer,
The Martens hardness when heated and cured at 160 ° C. and 2 MPa for 20 minutes is 3 to 100 N / mm ² ,
The average thickness of the scaly particles is 0.05-2 μm,
The electromagnetic wave shielding sheet whose exclusive area of the said conductive filler of the cut part cross section of the thickness direction of the said scale-like particle content layer when it heat-hardens at 160 degreeC and 2 Mpa for 20 minutes is 20 to 50%.   The electromagnetic wave shielding sheet according to claim 8, wherein the thermosetting resin is a resin selected from a polyurethane resin, a polyurethane urea resin, an acrylic resin, a polyester resin, and a polyamide resin.   The electromagnetic wave shielding sheet according to claim 8 or 9, wherein an average particle diameter D50 of the scaly particles is 2 to 100 µm.   The electromagnetic wave shielding sheet according to claim 8, wherein an acid value of the thermosetting resin is 3 to 20.   The electromagnetic wave shielding sheet according to claim 8, wherein the reactive functional group of the thermosetting resin contains at least one of a carboxyl group and a hydroxyl group.   The electromagnetic wave shielding sheet according to any one of claims 8 to 12, wherein the thermosetting resin has a weight average molecular weight of 20,000 to 150,000.   The electromagnetic wave shielding sheet according to any one of claims 8 to 13, having a linear expansion coefficient of 100 to 700 ppm / ° C. The electromagnetic wave shielding sheet according to any one of claims 8 to 14,
An adhesive resin layer formed on the electromagnetic wave shielding sheet;
A laminate comprising a flexible release sheet formed on the adhesive resin layer.