WO2020129985A1

WO2020129985A1 - Electronic component mounting substrate and electronic apparatus

Info

Publication number: WO2020129985A1
Application number: PCT/JP2019/049435
Authority: WO
Inventors: 和規松戸; 健次安東; 努早坂; 玲季松尾
Original assignee: 東洋インキＳｃホールディングス株式会社; トーヨーケム株式会社
Priority date: 2018-12-18
Filing date: 2019-12-17
Publication date: 2020-06-25
Also published as: CN113196895B; CN113196895A; TW202038696A; KR20210094094A; KR102400969B1

Abstract

An electronic component mounting substrate (51) according to an embodiment of the present invention comprises: a substrate (20); an electronic component (30) mounted on at least one surface of the substrate (20); and an electromagnetic wave shield member (1) which is covered from the upper surface of the electronic component (30) to the substrate (20), and covers at least a part of the substrate (20) and the side surface of a stepped portion formed by mounting the electronic component (30). The electromagnetic wave shield member (1) has an electromagnetic wave shield layer (5) containing a binder resin and a conductive filler. The kurtosis of the surface layer of the electromagnetic wave shield member (1) is 1 to 8 as measured in accordance with JIS B0601; 2001.

Description

Electronic component mounting board and electronic device

The present invention relates to an electronic component mounting board having an electromagnetic wave shield member. The present invention also relates to an electromagnetic wave shielding laminate suitable for forming an electromagnetic wave shield member of the electronic component mounting board, and an electronic device on which the electronic component mounting board is mounted.

Electronic parts equipped with IC chips, etc. are usually provided with an electromagnetic wave shield structure in order to prevent malfunction due to external magnetic fields and radio waves. For example, a method of coating a conductive adhesive film made of an isotropic conductive adhesive and an anisotropic conductive adhesive on a substrate on which electronic components are mounted is disclosed (Patent Document 1). Further, a method of coating an electromagnetic wave shielding film having a conductive adhesive layer and a base material layer having a specific storage elastic modulus on a substrate on which an electronic component is mounted (Patent Document 2), and showing isotropic conductivity. A method (Patent Document 3) is disclosed in which an electromagnetic wave shield member having a specific tensile rupture strain and having a scale-like particle-containing layer is coated on a substrate on which electronic components are mounted.

International Publication No. 2015/186624 JP, 2014-57041, A International Publication No. 2018/147355

An electronic component mounting substrate is manufactured by coating the electromagnetic component shield member on the substrate on which the electronic component is mounted, for example, by the following method. First, as shown in FIG. 18, the electromagnetic wave shield laminate 104, which is a laminate of the electromagnetic wave shield member 102 and the releasable cushion member 103, is mounted on the top surfaces of the plurality of electronic components 130 mounted on the substrate 120. Place. Next, as shown in FIG. 19, the electromagnetic wave shielding laminate 104 is thermocompression bonded to partially cover the electronic component 130 and the substrate 120 with the electromagnetic wave shielding member 101. After that, as shown in FIG. 20, the releasable cushion member 103 is peeled off, and subsequently, as shown in FIG. 21, a step of dividing the substrate 120 into product units is performed. In this singulation step, for example, the electromagnetic wave shield member 101 is brought into contact with the dicing table 141, and while maintaining this contact state, a position facing the groove 125 which is the gap of the electronic component 130 from the substrate 120 side is set. This is performed by cutting the substrate 120 and the electromagnetic wave shield member 101 with the cutting tool 142.

Along with the recent strict demand for higher performance of electronic components, a technology for improving the performance of the electromagnetic wave shield member 101 of the electronic component mounting board is required.

The present invention has been made in view of the above background, and an object thereof is to provide an electronic component mounting board and an electronic device having a highly reliable electromagnetic wave shield member.

The inventors of the present invention have made extensive studies, and have found that the problems of the present invention can be solved in the following aspects, and have completed the present invention.
[1]: a substrate, an electronic component mounted on at least one surface of the substrate, a side surface of a step portion formed by mounting the electronic component and covering the substrate from the upper surface of the electronic component to the substrate, and An electromagnetic wave shield member covering at least a part of the substrate, wherein the electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and conforms to JIS B0601; 2001 of the surface layer of the electromagnetic wave shield member. An electronic component mounting board with a kurtosis of 1 to 8 measured by
[2]: The electronic component mounting board according to [1], which has a root mean square height Rq of 0.3 to 1.7 μm measured according to JIS B0601; 2001 on the surface of the electromagnetic wave shield member.
[3]: The electronic component mounting board according to [1] or [2], wherein the conductive filler contains at least one of a dendrite-shaped and needle-shaped conductive filler.
[4]: A substrate, an electronic component mounted on at least one surface of the substrate, a side surface of a step portion formed by mounting the electronic component and covering the substrate from the upper surface of the electronic component to the substrate, and An electromagnetic wave shield member that covers at least a part of the substrate,
The electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and has an indentation elastic modulus of 1 to 10 GPa.
[5]: The electronic component mounting board according to [4], wherein the surface layer of the electromagnetic wave shield member has a water contact angle of 70 to 110°.
[6]: In the tape adhesion test after the pressure cooker test based on JIS K5600 of the electromagnetic wave shield member, the electromagnetic wave shield member on the electronic component shows a crosscut residual rate of 23/25 or more [4] or [5]. ] Electronic component mounting substrate described in.
[7]: The electronic component mounting board according to any one of [4] to [6], which has a kurtosis of 1 to 8 measured according to JIS B0601; 2001 on the surface layer of the electromagnetic wave shield member.
[8]: The electronic component mounting board according to any one of [4] to [7], wherein the root mean square height of the surface of the electromagnetic wave shielding member is in the range of 0.4 to 1.6 μm.
[9]: The electronic component mounting board according to any one of [4] to [8], wherein the electromagnetic shield member has a Martens hardness of 50 to 312 N/mm ² .
[10]: The binder resin heats a binder resin precursor containing a thermosetting resin and a curable compound having a functional group capable of crosslinking with the reactive functional group of the thermosetting resin. The electronic component mounting board according to any one of [4] to [9], which is obtained by pressure bonding.
[11]: The electronic component mounting board according to any one of [4] to [10], wherein the electromagnetic wave shield member has a film thickness of 10 to 200 μm.
[12]: a substrate, an electronic component mounted on at least one surface of the substrate, a side surface of a step portion formed by mounting the electronic component and covering the substrate from the upper surface of the electronic component to the substrate, and An electromagnetic wave shield member covering at least a part of the substrate, wherein the electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and a root mean square height Rq of a surface layer of the electromagnetic wave shield member. An electronic component mounting board having a thickness of 0.05 μm or more and less than 0.3 μm.
[13]: The electronic component mounting board according to [12], wherein the surface layer of the electromagnetic wave shield member has a root mean square slope Rdq of 0.05 to 0.4.
[14]: The electronic component mounting board according to [12] or [13], wherein the surface layer of the electromagnetic wave shield member has a water contact angle of 90 to 130°.
[15]: The electronic component mounting according to any one of [12] to [14], wherein the conductive filler contains at least one of dendrite-shaped and needle-shaped conductive fillers and scale-shaped conductive fillers. substrate.
[16]: An electronic device on which the electronic component mounting board according to any one of [1] to [15] is mounted.

According to the present invention, it is possible to provide an electronic component mounting board having a highly reliable electromagnetic wave shielding member and an electronic device, which is an excellent effect.

FIG. 3 is a schematic perspective view showing an example of an electronic component mounting board according to embodiments A1, B1, and C1. FIG. 2 is a sectional view taken along the line II-II of FIG. 1. FIG. 9 is a schematic cross-sectional view showing another example of the electronic component mounting board according to the embodiments A1, B1, and C1. FIG. 3 is a schematic cross-sectional view showing an example of an electromagnetic wave shield laminate according to embodiments A1, B1, and C1. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A1, B1, and C1. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A1, B1, and C1. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A1, B1, and C1. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A1, B1, and C1. FIG. 3 is a schematic explanatory diagram for explaining a factor of fluctuation of kurtosis on the surface layer of the electromagnetic wave shield member. FIG. 3 is a schematic explanatory diagram for explaining a factor of fluctuation of kurtosis on the surface layer of the electromagnetic wave shield member. The typical sectional view showing an example of the layered product for electromagnetic wave shields concerning embodiments A2, B2, and C2. The typical sectional view showing an example of the layered product for electromagnetic wave shields concerning embodiments A3, B3, and C3. The typical sectional view showing an example of the layered product for electromagnetic wave shields concerning embodiments A4, B4, and C4. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A4, B4, and C4. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A4, B4, and C4. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A4, B4, and C4. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A5, B5, and C5. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A5, B5, and C5. FIG. 6 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to Embodiments A5, B5, and C5. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to a modification. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to a modification. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to a modification. FIG. 9 is a schematic cross-sectional view showing an example of a manufacturing process of an electronic component mounting board according to a modification. FIG. 3 is a schematic cross-sectional view showing an example of an electronic component mounting board according to the present embodiment. FIG. 5 is a schematic cross-sectional view illustrating a step of coating an electronic component or the like with an electromagnetic wave shield member. FIG. 5 is a schematic cross-sectional view illustrating a step of coating an electronic component or the like with an electromagnetic wave shield member. FIG. 5 is a schematic cross-sectional view illustrating a step of coating an electronic component or the like with an electromagnetic wave shield member. FIG. 5 is a schematic cross-sectional view illustrating a step of coating an electronic component or the like with an electromagnetic wave shield member. 10 is an optical microscope photograph of the side surface of the electronic component mounting board according to the present Example B3. An optical microscope photograph of the side surface of the electronic component mounting board according to Reference Example B1. Explanatory drawing of the evaluation method of the electronic component mounting board which concerns on this Example C.

An example of an embodiment to which the present invention is applied will be described below. The numerical values specified in this specification are values obtained by the method disclosed in the embodiment or the example. Further, the numerical values “A to B” specified in this specification refer to ranges satisfying the numerical values A and the values larger than the numerical value A and the numerical values B and the values smaller than the numerical value B. In addition, the sheet in this specification includes not only a sheet defined by JIS but also a film. For clarity of explanation, the following description and drawings are simplified as appropriate. Unless otherwise noted, the various components mentioned in the present specification may be used alone or in combination of two or more. Further, for convenience of description, the same element members are denoted by the same reference numerals in different embodiments.

The electronic component mounting boards according to Embodiments A to C are disclosed as the electronic component mounting boards according to the present invention.

[[Embodiment A]]
The electronic component mounting substrate of Embodiment A is formed by mounting a substrate, an electronic component mounted on at least one surface of the substrate, the electronic component upper surface to the substrate, and mounting the electronic component. The electromagnetic wave shield member covers the side surface of the step portion and at least a part of the substrate. The electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler. Then, the kurtosis measured according to JIS B0601; 2001 on the surface layer of this electromagnetic wave shielding member is set to 1 to 8.

According to the conventional technique, a residue as shown in (i) of FIG. 20 may be attached on the electromagnetic wave shield member 101 of the electronic component mounting board. This originates in the releasable cushion member 103 which is a constituent member of the electromagnetic wave shield laminate 104 used for forming the electromagnetic wave shield member 101. This is due to the anchoring effect in the groove 125 formed in the gap of the electronic component 130 at the stage of peeling off the releasable cushion member 103 after thermocompression bonding the electromagnetic wave shielding laminate 104. The releasable cushion member 103 is torn. This tearing becomes a factor that remains as a residue even after the individualization process. Such a residue on the electromagnetic wave shield member 101 causes not only a poor appearance but also a decrease in reliability of the electromagnetic wave shield property of the electronic device, which may be an obstacle when mounting on the circuit board.

As a method of avoiding such a problem, a method of widening the gap between the electronic components 130 or reducing the height of the electronic components 130 can be considered in order to reduce the anchoring effect of the groove 125. However, this method has a problem that the shape of the electronic component 130 is limited and cannot be applied to the electronic component 130 having complicated irregularities. Further, if the gap between the electronic components 130 mounted on the substrate 120 can be narrowed, the yield of the electronic components 130 obtained from one substrate 120 can be improved, and the manufacturing efficiency can be improved. Further, the electromagnetic wave shield member 101 is required to have high scratch resistance in order to prevent a decrease in reliability due to scratches of the electromagnetic wave shield member 101 during transportation or mounting of the electronic component 130.

According to the electronic component mounting board according to the embodiment A, it is possible to provide an electronic component mounting board having a highly reliable electromagnetic wave shield member which has a high degree of design freedom, suppresses adhesion of residues, and is excellent in scratch resistance. it can. Therefore, it is particularly suitable for use as an electronic component mounting board for which the degree of freedom in design is desired to be increased or an electronic component mounting board which is easily scratched.

[[Embodiment B]]
The electronic component mounting board of the embodiment B is formed by mounting a substrate, an electronic component mounted on at least one surface of the substrate, the electronic component upper surface to the substrate, and mounting the electronic component. The electromagnetic wave shield member covers the side surface of the step portion and at least a part of the substrate. This electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and has an indentation elastic modulus of 1 to 10 GPa.

According to the conventional technique, in the above-described individualizing step of the manufacturing process of the electronic component mounting board, there is a problem that a burr that is a curl of the electromagnetic wave shielding member 101 from the cut surface of the electromagnetic wave shielding member 101 is likely to occur. (Refer to a partially enlarged view (ii) in FIG. 21). The main cause of burrs of the electromagnetic wave shield member 101 is high-pressure water washing at the time of dicing in the individualizing step. Further, in the manufactured electronic component mounting substrate, the adhesion between the electromagnetic wave shield member 101 and the substrate 120 or the like may be deteriorated under high humidity and heat conditions. The occurrence of burrs and the decrease in the adhesion of the electromagnetic wave shield member 101 cause a decrease in the reliability of the electromagnetic wave shield property of the electronic device, which may be an obstacle when mounting on the circuit board.

According to the electronic component mounting board of the embodiment B, it is possible to provide an electronic component mounting board having a reliable and highly reliable electromagnetic wave shield member capable of suppressing the occurrence of burrs and having excellent pressure cooker test (PCT) resistance. .. Therefore, it is particularly suitable for applications in which severe conditions such as high-pressure water lines are used in the singulation process, or applications for electronic component mounting boards that require durability under high humidity and heat conditions.

[[Embodiment C]]
The electronic component mounting board of Embodiment C is formed by mounting a substrate, an electronic component mounted on at least one surface of the substrate, the electronic component upper surface to the substrate, and mounting the electronic component. The electromagnetic wave shield member covers the side surface of the step portion and at least a part of the substrate. This electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and the root mean square height Rq of the surface layer of the electromagnetic wave shield member is 0.05 μm or more and less than 0.3 μm.

According to the conventional technique, in the individualizing step, the electromagnetic wave shield member 101 is brought into contact with the dicing table 141 via a dicing tape (not shown) (see FIG. 21), and the substrate 120 is maintained while maintaining this contact state. The substrate 120 and the electromagnetic wave shield member 101 may be cut by the cutting tool 142 at a position facing the groove 125 which is the gap of the electronic component 130 from the side. In this case, the electronic component mounting board is manufactured through a step of separating the dicing tape and the electromagnetic wave shield member 101 after being separated into individual pieces. However, when the dicing tape is peeled off after being separated into pieces, the electromagnetic wave shield member 101 may float. Moreover, a part of the electromagnetic wave shield member may be peeled off. In addition, when the cooling/heating cycle test (−50° C. to 125° C.) is performed, cracks may occur in the electromagnetic wave shield member.

The floating and cracking of the electromagnetic wave shield member 101 as described above may cause various problems as well as a poor appearance. For example, when the electromagnetic wave shield member 101 and the housing are grounded with a conductive adhesive or a conductive adhesive, the adhesive force and the connection resistance are deteriorated, and the reliability of the electromagnetic wave shielding property of the electronic device is deteriorated. This can be an obstacle when mounting on a board. In addition, there may be a problem in reliability over time.

According to the electronic component mounting board according to the embodiment C, it is possible to provide an electronic component mounting board having a highly reliable and highly reliable electromagnetic wave shielding member having excellent coverage. Therefore, the application including the step of contacting the electromagnetic wave shield member and the dicing table with the dicing tape, or the application that needs to pass the thermal cycle test, for example, the severe temperature such as the electronic component mounting board mounted in the automobile. It is particularly suitable for applications that require the ability to withstand changes.

[[Embodiment A]]
Hereinafter, a specific example of the electronic component mounting board according to the embodiment A will be described.
[Embodiment A1]
<Electronic component mounting board>
FIG. 1 is a schematic perspective view showing an example of an electronic component mounting board according to Embodiment A1, and FIG. 2 is a sectional view taken along the line II-II of FIG. The electronic component mounting board 51 includes the substrate 20, the electronic component 30, the electromagnetic wave shield member 1, and the like.

The substrate 20 may be any substrate as long as it can mount the electronic component 30 and can withstand the thermocompression bonding process described later, and can be arbitrarily selected. Examples thereof include a work board having a conductive pattern made of copper foil or the like formed on the surface or inside thereof, a mounted module substrate, a printed wiring board, or a build-up substrate formed by a build-up method or the like. Alternatively, a film- or sheet-shaped flexible substrate may be used. The conductive pattern is, for example, an electrode/wiring pattern (not shown) for electrically connecting to the electronic component 30, and a ground pattern 22 for electrically connecting to the electromagnetic wave shield member 1. Electrodes/wiring patterns, vias (not shown) and the like can be arbitrarily provided inside the substrate 20. The substrate 20 may be not only a rigid substrate but also a flexible substrate.

The electronic components 30 are arranged in a 5×4 array on the substrate 20 in the example of FIG. The electromagnetic wave shield member 1 is provided so as to cover the exposed surfaces of the substrate 20 and the electronic component 30. That is, the electromagnetic wave shield member 1 is coated so as to follow the irregularities formed by the electronic component 30. The electromagnetic wave shield member 1 can shield unnecessary radiation generated from the signal wiring and the like built in the electronic component 30 and/or the substrate 20, and can prevent malfunction due to a magnetic field or radio waves from the outside.

The number, arrangement, shape and type of electronic components 30 are arbitrary. Instead of arranging the electronic components 30 in an array, the electronic components 30 may be arranged at arbitrary positions. When the electronic component mounting board 51 is divided into unit modules, as shown in FIG. 2, the half dicing grooves 25 may be provided so as to partition the unit modules in the thickness direction of the board from the upper surface of the board. The electronic component mounting board according to Embodiment A1 includes both a board before being singulated into unit modules and a board after being singulated into unit modules. That is, in addition to the electronic component mounting board 51 on which a plurality of unit modules (electronic components 30) are mounted as shown in FIGS. 1 and 2, the electronic component mounting board 52 after being divided into unit modules as shown in FIG. Including. Of course, an electronic component mounting substrate in which one electronic component 30 is mounted on the substrate 20 and covered with an electromagnetic wave shield member without going through the individualizing step is also included. That is, the electronic component mounting board according to Embodiment A1 has a structure in which at least one electronic component is mounted on the substrate, and at least a part of the step portion formed by mounting the electronic component is covered with the electromagnetic wave shield member. To include.

The electronic components 30 include all components in which electronic elements such as semiconductor integrated circuits are integrally covered with an insulator. For example, there is a mode in which a semiconductor chip 31 (see FIG. 3) on which an integrated circuit (not shown) is formed is molded with a sealing material (mold resin 32). The substrate 20 and the semiconductor chip 31 are electrically connected to the wiring or the electrode 21 formed on the substrate 20 via these contact areas or via the bonding wires 33, solder balls (not shown) and the like. Examples of electronic components include semiconductor chips, inductors, thermistors, capacitors, and resistors.

The electronic component 30 and the substrate 20 according to the embodiment A1 can be widely applied to known aspects. In the example of FIG. 3, the semiconductor chip 31 has solder balls 24 connected to the back surface of the substrate 20 via inner vias 23. In addition, a ground pattern 22 for electrically connecting to the electromagnetic wave shield member 1 is formed in the substrate 20. Further, as in embodiment A4 described later, a plurality of electronic components 30 may be mounted on the electronic component mounting substrate after being singulated or the electronic component mounting substrate that is not singulated (see FIG. 14C). In addition, a single or a plurality of electronic elements or the like can be mounted in the electronic component 30.

<Electromagnetic wave shield member>
The electromagnetic wave shield member 1 is obtained by placing the electromagnetic wave shielding laminate on the top surface of the electronic component 30 mounted on the substrate 20 and coating the electronic component 30 and the substrate 20 by thermocompression bonding. The electromagnetic wave shield member 1 is covered from the upper surface of the electronic component 30 to the substrate 20, and covers at least part of the substrate 20 and the side surface of the step portion formed by mounting the electronic component 30. The electromagnetic wave shield member 1 is connected to a ground pattern 22 exposed on the side surface or the upper surface of the substrate 20 and/or a ground pattern (not shown) such as a connection wiring of the electronic component 30 in order to sufficiently exert the shielding effect. Is preferred.

The electromagnetic wave shield member 1 can be formed by using an electromagnetic wave shield laminate. FIG. 4 shows a schematic sectional view of the electromagnetic wave shielding laminate. The electromagnetic wave shielding laminate 4 according to the embodiment A1 includes the electromagnetic wave shielding member 2 and the releasable cushion member 3. This electromagnetic wave shielding member 2 is composed of a single layer of the conductive adhesive layer 6 in the embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shield layer 5. In the embodiment A1, the electromagnetic wave shield layer 5 functions as the electromagnetic wave shield member 1.

The electromagnetic wave shielding member 2 is formed of a laminate of two or more conductive adhesive layers as in the embodiment A2 described later, or a laminate of a conductive adhesive layer and a hard coat layer as in the embodiment A3. Or a laminated body of other layers such as a laminated body of an insulating adhesive layer and a conductive adhesive layer as in the embodiment A4. The electromagnetic wave shield member 1 obtained by thermocompression bonding the electromagnetic wave shield member 2 is composed of a laminate of two or more electromagnetic wave shield layers in the embodiment A2, and is a laminate of the electromagnetic wave shield layer and the hard coat layer in the embodiment A3. In Embodiment A4, it is composed of a laminated body of an insulating coating layer and an electromagnetic wave shielding layer. Thus, the electromagnetic wave shield member may be composed of a laminate of the electromagnetic wave shield layer and other layers.

The electromagnetic wave shield layer 5 contains a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shield layer 5 is in continuous contact with the conductive filler and exhibits conductivity. From the viewpoint of enhancing the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1Ω/□ or less.

The electromagnetic wave shield member 1 has a kurtosis of 1 to 8 measured according to JIS B0601; 2001 on its surface layer. Kurtosis is an index showing the roughness curve of the surface unevenness represented by the mathematical expression (1), and represents the flatness and the sharpness of the height distribution.

Here, L is a reference length. Further, Rq is the root mean square height, and is represented by the following mathematical expression (2), where Z(x) is the change in surface height along one axis (x axis).

Kurtosis indicates the square root of Z(x) in the standard length made dimensionless by the square of the root mean square height Rq. When the kurtosis is 3, it indicates that the distribution of the sharpness of the convex portion (or the concave portion) is close to the normal distribution. The number of sharp pointed protrusions (or recesses) with respect to the reference height Rq increases as the kurtosis becomes larger than 3, and the steep pointed protrusions (or recesses) becomes smaller as the kurtosis becomes smaller than 3. Indicates that the number of

Although the manufacturing method will be described later, after the electromagnetic wave shielding laminate 4 is thermocompression bonded to the substrate on which the electronic component 30 is mounted, when the releasable cushion member 3 is separated from the electromagnetic wave shielding member 1, the half dicing groove 25 is separated. The shape cushion member 3 is torn off while sliding almost vertically. Since the releasable cushion member 3 easily breaks due to the anchoring effect, a technique for suppressing this is required. As a result of intensive studies by the present inventors, it has been found that the shape control of the contact interface of the electromagnetic wave shield member 1 is important, and the range of the above kurtosis is suitable for this shape.

By setting the kurtosis to 8 or less, the releasable cushion member 3 filled in the half dicing groove 25 of the electronic component 30 can be favorably separated from the electromagnetic wave shield member 1. It is considered that this is because the sharpness of the surface shape of the electromagnetic wave shield member 1 becomes appropriate and the releasable cushion member 3 and the electromagnetic wave shield member 1 are easily separated. On the other hand, by setting the kurtosis of the surface layer of the electromagnetic wave shield member 1 to 1 or more, the resistance to steel wool can be improved. As a result, it is possible to provide a highly reliable electronic component mounting board with enhanced scratch resistance. The preferable range of kurtosis of the electromagnetic wave shield member is 1.5 to 6.5, and the more preferable range is 2 to 4.

The root mean square height of the surface of the electromagnetic wave shield member 1 is preferably in the range of 0.4 to 1.6 μm, more preferably 0.5 to 1.5 μm, and 0.7 to 1.2 μm. More preferably. In the present specification, the kurtosis and the root mean square height refer to values obtained by the method described in Examples below.

The kurtosis on the surface of the electromagnetic wave shield member 1 can be adjusted by the manufacturing process of the electromagnetic wave shield member 2 in the electromagnetic wave shield laminate 4. Further, it can be adjusted by the type of each component in the composition of the electromagnetic wave shielding member before thermocompression bonding for forming the electromagnetic wave shielding member 1 and the compounding amount thereof. Details will be described later. Note that the inventors of the present invention have made extensive studies, and by incorporating an amount of a conductive filler capable of functioning as an electromagnetic wave shield layer, the value of kurtosis does not substantially change before or after the reflow treatment, or even if it changes. It was confirmed that the amount of change was small.

<Method for manufacturing electronic component mounting board>
Hereinafter, an example of a method for manufacturing the electronic component mounting board of Embodiment A1 will be described with reference to FIGS. However, the manufacturing method of the electronic component mounting board of the present invention is not limited to the following manufacturing method.

The method of manufacturing the electronic component mounting board 51 according to the embodiment A1 includes the step of [a] mounting the electronic component 30 on the substrate and [b] mounting the electromagnetic wave shielding laminate 4 on the substrate 20 on which the electronic component 30 is mounted. A step of placing, and [c] a step of joining the electromagnetic wave shield member 1 by thermocompression bonding so as to follow at least a part of the side surface of the step formed by mounting the electronic component 30 and the exposed surface of the substrate, d) A step of peeling the releasable cushion member 3 and a step [e] individualizing the electronic component mounting board 51. Hereinafter, each step will be described.

[A] Step of mounting electronic components on the substrate:
First, the electronic component 30 is mounted on the substrate 20. For example, a semiconductor chip (not shown) is mounted on the substrate 20, and the substrate 20 on which the semiconductor chip is formed is molded with a sealing resin so that the inside of the substrate 20 is reached from above the electronic components 30. The mold resin and the substrate 20 are half-cut by dicing or the like. A method of arranging the electronic components 30 in an array on the substrate 20 half-cut in advance may be used. Through these steps, for example, a substrate having an electronic component 30 as shown in FIG. 5 is obtained. The electronic component 30 in the example of FIG. 5 refers to an integrated body formed by molding a semiconductor chip, and refers to all electronic elements protected by an insulator. The half-cut includes a mode of reaching the inside of the substrate 20 and a mode of cutting to the surface of the substrate 20. Also, the entire substrate 20 may be cut at this stage. In this case, it is preferable that the substrate 20 is placed on the substrate with the adhesive tape so that the positional displacement does not occur. The material of the sealing resin for molding is not particularly limited, but a thermosetting resin is usually used. The method for forming the sealing resin is not particularly limited, and examples thereof include printing, laminating, transfer molding, compression, casting and the like. Molding is arbitrary, and the mounting method of the electronic component 30 can be changed arbitrarily.

[B] Step of placing the electromagnetic wave shielding laminate on the substrate:
Next, the electromagnetic wave shielding laminate 4 is prepared in which the substrate 20 on which the electronic component 30 is mounted is melted by thermocompression bonding and coated (see FIG. 4 ). The electromagnetic wave shielding laminate 4 is placed on the top surface of the electronic component 30 so that the conductive adhesive layer 6 of the electromagnetic wave shielding laminate 4 is on the electronic component 30 side. At this time, the electromagnetic wave shielding laminate 4 may be temporarily attached to a part or the whole surface of the electronic component 30. The term “temporary attachment” refers to a state in which the conductive adhesive layer 6 is fixed to the adherend at the B stage, which is temporarily joined so as to come into contact with the upper surface of at least a part of the electronic component 30. As the peeling force, it is preferable that the peeling force with respect to Kapton 200 is about 1 to 5 N/cm in the 90° peel test. An example of the temporary attachment method is a method of placing the electromagnetic wave shielding laminate 4 on the substrate 20 on which the electronic component 30 is mounted, lightly thermocompressing the entire surface or the end portion with a heat source such as an iron, and temporarily attaching. A plurality of electromagnetic wave shielding laminates 4 may be used for each region of the substrate 20 depending on the manufacturing equipment or the size of the substrate 20. Further, the electromagnetic wave shielding laminate 4 may be used for each electronic component 30. From the viewpoint of simplifying the manufacturing process, it is preferable to use one electromagnetic wave shielding laminate 4 for the entire plurality of electronic components 30 mounted on the substrate 20.

[C] Step of forming electromagnetic wave shield member:
Then, the electromagnetic wave shielding laminate 4 is sandwiched between the pair of press substrates 40 on the substrate 20 on which the electronic component 30 is mounted, and thermocompression bonded (see FIG. 6 ). In the electromagnetic wave shield laminate 4, the conductive adhesive layer 6 and the releasable cushion member 3 are melted by heat and stretched along the half-cut groove provided in the production substrate by pressing, and the electronic component 30 and the substrate are obtained. It is coated following 20. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 and also functions as the electromagnetic wave shield layer 5 by thermocompression bonding. In the embodiment A1, the electromagnetic wave shield member 1 is composed of a single layer of the electromagnetic wave shield layer 5, so that the electromagnetic wave shield member 1 is formed by thermocompression bonding the conductive adhesive layer 6. After the thermocompression bonding, a heat treatment may be separately performed for the purpose of promoting thermosetting.

When heat-pressing the electromagnetic wave shielding laminate 4, a heat softening member, cushion paper or the like may be used between the electromagnetic wave shielding laminate 4 and the press substrate 40, if necessary.

The temperature and pressure in the thermocompression bonding process can be arbitrarily set independently within the range in which the coverage of the conductive adhesive layer 6 can be secured, depending on the heat resistance and durability of the electronic component 30, the manufacturing equipment or needs. The pressure range is not limited, but is preferably about 0.1 to 5.0 MPa, more preferably 0.5 to 2.0 MPa. By releasing the press substrate 40, a production substrate as shown in FIG. 7 is obtained. In this way, the electromagnetic shield member 1 covers the top and side surfaces of the electronic component and the exposed surface of the substrate.

The heating temperature in the thermocompression bonding step is preferably 100°C or higher, more preferably 110°C or higher, and further preferably 120°C or higher. Although the upper limit value depends on the heat resistance of the electronic component 30, it is preferably 220° C., more preferably 200° C., and further preferably 180° C.

The thermocompression bonding time can be set according to the heat resistance of the electronic component 30, the binder resin used for the electromagnetic wave shield member 1, the production process, and the like. When a thermosetting resin is used as the binder resin precursor, the range of about 1 minute to 2 hours is suitable. The thermocompression bonding time is more preferably about 1 minute to 1 hour. The thermosetting resin is cured by this thermocompression bonding. However, the thermosetting resin may be partially or substantially completely cured before thermocompression bonding as long as it can flow.

The thickness of the conductive adhesive layer 6 is such that the electromagnetic shield layer 5 can be formed by covering the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20. Although it may vary depending on the fluidity of the binder resin precursor used and the distance and size between the electronic components 30, it is usually preferably about 10 to 200 μm. This makes it possible to effectively exhibit the electromagnetic wave shielding property while improving the coverage with the sealing resin.

The releasable cushion member 3 has a function of softening to promote the coating of the conductive adhesive layer 6 to cover the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20, and the releasability in the peeling step. It is possible to use a material having excellent properties. As an upper layer of the releasable cushion member 3, a heat softening member that functions as a cushion material may be used, if necessary. In the example of Embodiment A1, the coating of the electromagnetic wave shield member 1 electrically connects the ground pattern 22 formed in the substrate 20 and the electromagnetic wave shield member 1 (see FIG. 7).

The conductive adhesive layer 6 contains a binder resin precursor and a conductive filler. Examples of the binder resin precursor include a thermoplastic resin, a self-crosslinking resin, a plurality of types of reactive resins, and a mixture of a curable resin and a crosslinking agent. These may be used in combination. When a thermoplastic resin is exclusively used as the binder resin precursor, it can be said that the binder resin precursor and the binder resin are substantially the same in the sense that they do not have a crosslinked structure.

[D] Step of peeling the releasable cushion member:
The releasable cushion member 3 covering the upper layer of the electromagnetic wave shield member 1 is peeled off. As a result, an electronic component mounting board 51 having the electromagnetic wave shield member 1 that covers the electronic component 30 is obtained (see FIGS. 1 and 2). For example, the releasable cushion member 3 may be peeled off manually from the end portion, or the outer surface of the releasable cushion member 3 may be sucked and peeled off from the electromagnetic wave shield member 1. Peeling by suction is preferable from the viewpoint of improving the yield by automation.

[E] Process of dividing into individual pieces:
Using a cutting tool such as a dicing blade, dicing is performed in the X direction and the Y direction at a position corresponding to the product area of the individual product of the electronic component mounting board 51 (see FIG. 2). Through these steps, the electronic component 30 is covered with the electromagnetic wave shield member 1, and the ground pattern 22 formed on the substrate 20 and the electromagnetic wave shield member 1 are electrically connected to each other. 51 is obtained. The dicing method is not particularly limited as long as it can be separated into individual pieces. Dicing is performed from the substrate 20 side or the electromagnetic wave shielding laminate 4 side.

The peeling of the releasable cushion member 3 in the step (d) is carried out at an angle of, for example, 90° with respect to the substrate surface, so that the releasable cushion member 3 in the half dicing groove 25 and the side surface of the half dicing groove 25 are separated. Large friction occurs at the contact interface of the electromagnetic wave shield member 1. Therefore, it is technically difficult to cleanly separate the releasable cushion member 3 from the electromagnetic wave shield member 1, and as described with reference to FIG. 20, the releasable cushion member 3 is broken into the half dicing grooves 25. Residues may remain. This residue remains at some positions even after the singulation process, which leads to a decrease in reliability.

According to this embodiment A1, by setting the kurtosis of the electromagnetic wave shield member 1 to 1 to 8, in the process of forming the electromagnetic wave shield member of the electronic component mounting board, the electromagnetic wave shielding laminate is thermocompression bonded to the electronic component mounting board. After that, the releasability of the releasable cushion member with respect to the electromagnetic wave shield member can be enhanced. Further, it is possible to effectively suppress the phenomenon that a part of the electromagnetic wave shield member is peeled off together with the releasable cushion member and the part of the electromagnetic wave shield member is damaged. Therefore, it is possible to provide a highly reliable electronic component mounting board. Further, it is possible to increase the degree of freedom in designing the height of the electronic components mounted on the board and the degree of freedom in designing the width of the gap between the electronic components.

<Laminate for electromagnetic wave shield>
The electromagnetic wave shielding laminate of the embodiment A1 is composed of two layers of the electromagnetic wave shielding member 2 and the releasable cushion member 3, as described in FIG. In the embodiment A1, the electromagnetic wave shielding member 2 is composed of the single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression bonding process and functions as the electromagnetic wave shield layer 5.

(Conductive adhesive layer)
The conductive adhesive layer 6 is a layer formed from a resin composition containing a binder resin precursor and a conductive filler. The binder resin precursor contains at least a thermosoftening resin. Examples of the thermosoftening resin include a thermoplastic resin, a thermosetting resin and an actinic ray curable resin. The thermosetting resin and the actinic ray curable resin usually have a reactive functional group. When a thermosetting resin is used, a curable compound and a thermosetting auxiliary can be used together. When an actinic ray curable resin is used, a photopolymerization initiator, a sensitizer and the like can be used in combination. A thermosetting type that cures at the time of thermocompression bonding is preferable from the viewpoint of simplicity of the manufacturing process.
Alternatively, a self-crosslinking resin or a plurality of resins that crosslink each other may be used. In addition to these resins, a thermoplastic resin may be mixed. The components such as the resin and the curable compound may be used alone or in combination of two or more.
Incidentally, a part of the crosslinks may be formed at the stage of the conductive adhesive layer 6 to be in the B stage (semi-cured state). For example, a state in which the thermosetting resin and a part of the curable compound are reacted and semi-cured may be included.

Suitable examples of the heat softening resin, polyurethane resin, polycarbonate resin, styrene elastomer resin, phenoxy resin, polyurethane urea resin, polyimide resin, polyamide resin, polycarbonate imide resin, polyamide imide resin, epoxy resin, epoxy ester resin, Acrylic resins, polyester resins, polystyrene, polyesteramide resins and polyetherester resins can be mentioned. The thermosetting resin when used under severe conditions during reflow contains at least one of an epoxy resin, an epoxy ester resin, a urethane resin, a urethane urea resin, and a polyamide. preferable.

Among these, polyurethane resin, polycarbonate resin, styrene elastomer resin, phenoxy resin, polyamide resin, and polyimide resin are preferable. Further, a resin having a polycarbonate skeleton represented by the general formula (1) in the resin is preferable.
-RO-CO-O-... General formula (1)
In the formula, R is a divalent organic group.
The thermosoftening resin may be used alone or in combination of two or more at an arbitrary ratio.

Examples of the resin having a polycarbonate skeleton include a polycarbonate resin, a polyurethane resin having a polycarbonate skeleton, a polyamide resin, and a polyimide resin. For example, according to the polycarbonate imide resin, having a polyimide skeleton makes it possible to enhance heat resistance, insulation and chemical resistance. On the other hand, by having a polycarbonate skeleton, flexibility and adhesion can be effectively enhanced.

Examples of the polycarbonate urethane resin include 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,4-cyclohexanedimethanol, 1,9-nonanediol, and 2-methyl-1,8-octanediol. Polycarbonate polyols based on one or more diols such as the above can be used as the polyol component.

As the thermosetting resin, the thermosoftening resin may have a plurality of functional groups that can be used for a crosslinking reaction by heating. Functional groups include, for example, hydroxyl group, phenolic hydroxyl group, carboxyl group, amino group, epoxy group, oxetanyl group, oxazoline group, oxazine group, aziridine group, thiol group, isocyanate group, blocked isocyanate group, silanol group and the like. ..

The curable compound has a functional group capable of crosslinking with the reactive functional group of the thermosetting resin. Curable compounds include epoxy compounds, acid anhydride group-containing compounds, isocyanate compounds, polycarbodiimide compounds, aziridine compounds, dicyandiamide compounds, amine compounds such as aromatic diamine compounds, phenol compounds such as phenol novolac resins, and organometallic compounds. preferable. The curable compound may be a resin. In this case, in order to distinguish between the thermosetting resin and the curable compound, one having a larger content is a thermosetting resin and one having a smaller content is a curable compound.

The curable compound is preferably contained in an amount of 1 to 70 parts by mass, more preferably 3 to 65 parts by mass, still more preferably 3 to 60 parts by mass, based on 100 parts by mass of the thermosetting resin. The curable compound may be used alone or in combination of two or more.

Suitable examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, ester amide resin, polyisoprene, and cellulose. Examples of the tackifying resin include rosin-based resins, terpene-based resins, alicyclic petroleum resins, and aromatic petroleum resins. Moreover, a conductive polymer can be used. Examples of the conductive polymer include polyethylenedioxythiophene, polyacetylene, polypyrrole, polythiophene, and polyaniline. Preferable examples of the thermoplastic resin include polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, ester amide resin, polyisoprene, and cellulose.

Examples of the conductive filler include metal filler, conductive ceramic particles, and a mixture thereof. Examples of the metal filler include metal powders of gold, silver, copper, nickel and the like, alloy powders of solder and the like, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and core-shell type particles of gold-coated nickel powder. From the viewpoint of obtaining excellent conductive properties, a conductive filler containing silver is preferable. From the viewpoint of cost, silver-coated copper powder obtained by coating copper powder with silver is particularly preferable.

The silver content in the silver-coated copper is preferably 3 to 20% by mass, more preferably 8 to 17% by mass, and further preferably 10 to 15% by mass, based on the total 100% by mass of silver and copper. In the case of core-shell type particles, the coverage of the coating layer on the core part is preferably 60% or more on average, more preferably 70% or more, and further preferably 80% or more. The core part may be non-metal, but from the viewpoint of conductivity, a conductive substance is preferable, and metal particles are more preferable.

An electromagnetic wave absorbing filler may be used as the conductive filler. For example, iron, Fe-Ni alloy, Fe-Co alloy, Fe-Cr alloy, Fe-Si alloy, Fe-Al alloy, Fe-Cr-Si alloy, Fe-Cr-Al alloy, Fe-Si-Al alloy, etc. Examples thereof include iron alloys, Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite, and other ferrite-based materials, and carbon filler. Examples of the carbon filler include acetylene black, Ketjen black, furnace black, carbon black, carbon fiber, particles composed of carbon nano-nanotubes, graphene particles, graphite particles and carbon nanowalls.

The shape of the conductive filler used in the conductive adhesive layer can be exemplified by scale particles, dendrite (dendritic) particles, needle particles, plate particles, grape particles, fibrous particles, and spherical particles, From the viewpoint of adjusting the numerical value of the kurtosis, it is preferable to include a conductive filler of needle-shaped particles and/or dendrite-shaped particles. Here, the acicular shape means that the major axis is three times or more the minor axis, and includes a so-called needle shape, a spindle shape, a columnar shape and the like. The dendrite shape means a shape in which a plurality of branched branches extend two-dimensionally or three-dimensionally from a rod-shaped main axis when observed with an electron microscope (500 to 20,000 times). In the dendrite shape, the branched branch may be bent, or the branched branch may further extend from the branched branch.

Further, by containing the scale-like particles as the conductive filler, it is possible to provide an electromagnetic wave shield member having excellent coverage. Here, the scaly shape includes a thin shape and a plate shape. The conductive filler may have a scaly shape as a whole particle, and may have an elliptical shape, a circular shape, or cuts around the fine particles.

The conductive fillers may be used alone or as a mixture. When used in combination with a conductive filler, from the viewpoint of obtaining a desired kurtosis and providing a highly reliable electromagnetic wave shielding member, a combination of scale-like particles and dendrite-like particles, a combination of scale-like particles and acicular particles, and scale-like particles A combination of particles, dendrite-like particles and acicular particles is preferred. Particularly preferred is a combination of scale-like particles and acicular particles.

The content of the conductive filler is preferably 40 to 85% by mass, and more preferably 50 to 80% by mass in the solid content (100% by mass) of the thermosoftening resin composition layer.

It is preferable that the amount of needle-shaped particles and/or dendrite-shaped particles is 50% by mass or less based on 100% by mass of the conductive filler in the conductive adhesive layer. The amount is more preferably 0.5 to 40% by mass, and further preferably 2 to 27% by mass. When the content is 50% by mass or less, the releasability of the releasable cushion member can be enhanced, and the scratch resistance can be effectively enhanced.

The average particle diameter D50 of the acicular particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. Similarly, the preferable range of the average particle diameter D50 of the dendrite-shaped particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. The average particle diameter D50 of the scaly particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm.

The average particle diameter D50 can be measured by a laser diffraction/scattering method. Specifically, it is a numerical value obtained by measuring each conductive fine particle with a tornado dry powder sample module using a laser diffraction/scattering particle size distribution measuring device LS 13320 (manufactured by Beckman Coulter, Inc.). The average particle diameter is the diameter of the particle diameter for which the integrated value of the particles is 50%. The refractive index is set to 1.6 for measurement. The average particle diameter D50 of each particle in the electromagnetic wave shield member 1 can be obtained by measuring the particle size of 100 particles using a scanning electron microscope (SEM) and determining the frequency distribution. In the case of needle-shaped particles and dendrite-shaped particles, the longest length of each particle is used as the particle size.

By using dendrite-shaped particles and/or needle-shaped particles in combination with scale-shaped particles, it is possible to increase the number of contact points between the conductive fillers and improve the shielding property. In addition, the combined use of dendrite particles and/or acicular particles can increase the contact area with the binder component, facilitate adjustment of the kurtosis value, and further enhance scratch resistance. Therefore, a highly reliable electromagnetic wave shield member can be provided.

The composition forming the conductive adhesive layer may further contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent and the like.
Examples of the colorant include organic pigments, carbon black, ultramarine blue, red iron oxide, zinc white, titanium oxide, graphite and the like. Among these, the inclusion of the black colorant improves the print visibility of the shield layer.
Examples of the flame retardant include halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, inorganic flame retardants, and the like.
Examples of the inorganic additive include glass fiber, silica, talc, ceramics and the like.
Examples of the lubricant include fatty acid ester, hydrocarbon resin, paraffin, higher fatty acid, fatty acid amide, aliphatic alcohol, metal soap, modified silicone and the like.
Examples of the antiblocking agent include calcium carbonate, silica, polymethylsilsesquiosane, aluminum silicate and the like.

The conductive adhesive layer may be a layer having conductivity due to continuous contact of the conductive filler by thermocompression bonding, and does not necessarily have conductivity at the stage before thermocompression bonding. The conductive adhesive layer can be formed by mixing and stirring the above-described conductive filler and a composition containing a binder resin precursor, coating the composition on a releasable substrate, and then drying. Alternatively, the releasable cushion member 3 may be directly applied and dried.

After applying the coating liquid for the conductive adhesive layer, it is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably performed by heating (for example, 80 to 120° C.). In order to adjust the kurtosis of the electromagnetic wave shield member, it is preferable to perform drying at 25° C. (room temperature) and normal pressure for 1 to 10 minutes after applying the coating liquid and before heating and drying. More preferable drying time at 25° C. (room temperature) before heat drying is 2 to 6 minutes. The kurtosis value can be adjusted by providing a process of drying at room temperature before heat drying.

The influence of the viscosity of the coating liquid and the drying time at 25° C. before heating and drying on the kurtosis of the electromagnetic wave shield member 1 will be described with reference to the schematic diagram of FIG. 9. As shown in the figure, a coating liquid is applied to form the conductive adhesive layer 6 on the releasable base material 15. A conductive adhesive layer 6P that is in the process of drying and contains a solvent is obtained.

By setting a long drying time at 25° C. for the conductive adhesive layer 6P in the process of heating, as shown in FIG. 9, the state in which the evaporation rate of the solvent is slow is intentionally lengthened, thereby making the binder resin The subduction of the precursor 10 can be promoted. On the other hand, by setting the drying time at 25° C. short, the sinking of the binder resin precursor 10 to the lower side is suppressed as shown in FIG. 9, and the conductive filler 11 easily rises by heating and drying at that stage. Become. Moreover, foaming easily occurs due to evaporation of the solvent, and the surface tends to be rough.

The solid content of the coating liquid is preferably 20 to 50% in order to set the kurtosis value of the electromagnetic wave shield member 1 to 1 to 8. Further, in order to adjust the kurtosis of the electromagnetic wave shield member, it is preferable that the viscosity of the coating liquid measured with a B-type viscometer is in the range of 200 to 5000 mPa·s. Further, in order to adjust the kurtosis of the electromagnetic wave shield member, the thixotropy index of the coating liquid is preferably 1.2 to 2.0. In addition, the conductive filler 11 of FIG. 9 and FIG. 10 which will be described later is a scaly particle, and the figure is not a plan view of the main surface but shows a cross-sectional view taken along the thickness direction.

The value of kurtosis also changes depending on the viscosity of the coating liquid for forming the conductive adhesive layer. The higher the viscosity of the coating liquid, the more the fluidity of the conductive filler tends to be suppressed. Therefore, when the viscosity is high, the conductive fillers 11 tend not to be oriented and become random. On the other hand, when the viscosity is low, the scale-like particles tend to be oriented so that the main surface faces the substrate surface. Further, when the drying time at 25° C. is shortened to perform heat drying, when the viscosity is high, the surface roughness due to foaming tends to increase, and when the viscosity is low, the conductive filler tends to move in the vertical direction. ..
In this way, the kurtosis can be adjusted by adjusting the viscosity of the coating liquid and the drying time at 25°C.

The kurtosis of the electromagnetic wave shield member 1 can also be adjusted by the particle size of dendrite-shaped particles and/or needle-shaped particles. The effect of the particle size of the dendrite-shaped particles and/or the acicular particles on the kurtosis of the electromagnetic wave shield member 1 will be described with reference to the schematic explanatory view of FIG. 10. Similar to FIG. 9, by applying a coating liquid to form the conductive adhesive layer 6 on the releasable substrate 15, the conductive adhesive layer 6P in the process of being dried can be obtained. In FIG. 10, members and components common to FIG. 9 are given the same reference numerals. As shown in FIG. 10, when the average particle diameter D50 of the dendrite-like particles 12 which is a kind of conductive filler is small, the value of the kurtosis tends to decrease, and conversely, the average particle diameter D50 of the dendrite-like particles 12 is large. And the value of Kurtosis tends to increase. Depending on the thickness of the electrically conductive adhesive layer 6, when it is desired to reduce the value of kurtosis, for example, the average particle diameter D50 is 2 to 5 μm, and when it is desired to increase the value of the kurtosis, for example, the average particle diameter D50 is 20 to When it is desired to set 50 μm to an intermediate value between them, the average particle diameter D50 can be set to be more than 5 μm and less than 20 μm.

Further, in order to adjust the kurtosis of the electromagnetic wave shield member 1, after coating and drying a conductive adhesive composition for forming the conductive adhesive layer 6 which is the outermost layer of the electromagnetic wave shield member 2, the corona is applied. It is preferable to perform treatment or plasma treatment. In the corona treatment, the irradiation amount of corona discharge electrons is preferably 1 to 1,000 W/m ² /min, more preferably 10 to 100 W/m ² /min.

The kurtosis of the electromagnetic wave shield member 1 can be adjusted by increasing the amount of needle-like or dendrite-like conductive filler added to the composition forming the electromagnetic wave shield member 2 before thermocompression bonding. The kurtosis of the electromagnetic wave shield member 1 can also be adjusted by the average particle diameters D50 and D90 of the conductive filler.

In the embodiment A1, since the electromagnetic wave shielding member 2 is composed of a single layer of the conductive adhesive layer 6, the releasable cushion member 3 is laminated on the conductive adhesive layer 6. The laminating method includes a laminating method.

The releasable base material is a base material having releasability on one or both sides, and is a sheet having a tensile breaking strain of less than 50% at 150°C. Examples of the releasable substrate include polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, rigid polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene/vinyl alcohol copolymer, and polycarbonate. , Polyacrylonitrile, polybutene, soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane resin, ethylene vinyl acetate copolymer, plastic sheets such as polyvinyl acetate, glassine paper, fine paper, kraft paper, coated paper, etc. Papers, various non-woven fabrics, synthetic papers, metal foils, and composite films obtained by combining these.

(Releasable cushion member)
The releasable cushion member is a sheet that functions as a cushioning material that promotes the followability of the conductive adhesive layer to the electronic component and has releasability. That is, it is a layer that can be separated from the electromagnetic wave shield member 1 after the thermocompression bonding process. Further, it is preferable that the layer has a tensile breaking strain at 150° C. of 50% or more and melts during thermocompression bonding.

Note that the tensile breaking strains of the releasable base material and the releasable cushion member 3 are values obtained by the following method. The releasable base material and the releasable cushion member were cut into a size of width 200 mm×length 600 mm to obtain a measurement sample. A tensile test (test speed 50 mm/min) was performed on the measurement sample using a small bench tester EZ-TEST (manufactured by Shimadzu Corporation) under the conditions of a temperature of 25° C. and a relative humidity of 50%. The tensile breaking strain (%) was calculated from the obtained SS curve (Stress-Strain curve).

As the releasable cushion member 3, polyethylene, polypropylene, polyether sulfone, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, cyclic olefin polymer and silicone are preferable. Among these, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are more preferable from the viewpoint of achieving both embedding property and releasability. The releasable cushion member may be used in a single layer or multiple layers. In the case of multiple layers, sheets of the same type or different types can be laminated.

The method of laminating the releasable cushion member 3 and the conductive adhesive layer 6 is not particularly limited, but a method of laminating these sheets can be mentioned. Since the releasable cushion member 3 is finally peeled off, a material having excellent releasability is preferable. The thickness of the releasable cushion member is, for example, about 50 μm to 3 mm, more preferably about 100 μm to 1 mm.

[Embodiment A2]
Next, an example of an electronic component mounting board different from that of the embodiment A1 will be described. The electronic component mounting board according to the embodiment A2 is different from the embodiment A1 using the electromagnetic wave shield member composed of a single electromagnetic wave shield layer in that the electromagnetic wave shield member is composed of two electromagnetic wave shield layers, The other basic configuration and manufacturing method are the same as those of the embodiment A1. Note that the description overlapping with that of the embodiment A1 will be appropriately omitted.

As shown in FIG. 11, the electromagnetic wave shield member of Embodiment A2 is an electromagnetic wave shield member that is a conductive adhesive layer 6a composed of two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. 2a and an electromagnetic wave shielding laminate 4a including a releasable cushion member 3a. By thermocompression-bonding the electromagnetic wave shielding laminate 4a, the electromagnetic wave shielding member including the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer is coated on the substrate on which the electronic component is mounted. By comprising two electromagnetic wave shield layers, the degree of freedom in designing the electromagnetic wave shield member can be increased. The second conductive adhesive layer 6a2 as the upper layer is manufactured by the same composition and process as the embodiment A1, and the first conductive adhesive layer 6a1 as the lower layer is designed not to be limited to the range of kurtosis but to be designed according to needs. can do. For example, the conductive filler contained in the first conductive adhesive layer 6a1 may be a layer using a filler such as fibrous particles or spherical particles. It is also possible to design the first conductive adhesive layer 6a1 as an anisotropic conductive adhesive layer and the second conductive adhesive layer 6a2 as an isotropic conductive adhesive layer. Further, a mode in which a laminated body of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer is also preferable. You may laminate|stack three or more electromagnetic wave shield layers.

According to the electronic component mounting board of the embodiment A2, the same effect as that of the embodiment A1 can be obtained by using the electromagnetic wave shield member including the two electromagnetic wave shield layers. Further, by laminating two electromagnetic wave shield layers, the degree of freedom in designing each layer can be increased, and there is an advantage that it is easy to provide an electromagnetic wave shield member according to needs.

[Embodiment A3]
The electronic component mounting board according to Embodiment A3, in that the electromagnetic wave shield member is a laminate of an electromagnetic wave shield layer and a hard coat layer, Embodiment A1 using an electromagnetic wave shield member consisting of a single layer of the electromagnetic wave shield layer. Although different, the other basic structure and manufacturing method are the same.

As shown in FIG. 12, the electromagnetic wave shielding member according to the embodiment A3 includes an electromagnetic wave shielding member 2b and a releasable cushion member 3b which are a laminated body of one conductive adhesive layer 6b and an insulating resin layer 7b. It is formed by using the electromagnetic wave shielding laminate 4b. By thermocompression-bonding this electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding layer formed of a conductive adhesive layer 6b and a hard coat layer formed of an insulating resin layer 7b are formed on a substrate on which electronic components are mounted. An electromagnetic wave shield member consisting of is obtained. The electromagnetic wave shield member according to Embodiment A3 has a kurtosis of 1 to 8 when measured from the hard coat layer side.

The insulating resin layer 7b is a layer formed from a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosoftening resin. Examples of the heat softening resin, and examples and preferred examples of the binder resin precursor are the same as the composition of the conductive adhesive layer of the electromagnetic wave shielding member described in the embodiment A1. The binder resin precursors of the conductive adhesive layer and the insulating resin layer may be the same or different.

The inorganic filler does not have conductivity unlike the conductive adhesive layer of the embodiment A1, but preferable characteristics of the inorganic filler, for example, shape, blending amount, D50, D90, etc. are the same as the examples given for the conductive filler. Is. Examples of the inorganic filler include silica, alumina, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesium oxide, talc, kaolinite, mica, basic magnesium carbonate, sericite, montmoroli. Inorganic compounds such as knight, kaolinite and bentonite are mentioned.

The heat-softenable resin composition, and the heat-softenable resin composition layer, if necessary, a colorant, a silane coupling agent, an ion scavenger, an antioxidant, a tackifying resin, a plasticizer, an ultraviolet absorber, a leveling agent. Modifiers, flame retardants and the like can be included.

According to the electronic component mounting board according to the embodiment A3, by using the electromagnetic wave shield member having the hard coat layer, in addition to the effect described in the embodiment A1, it is excellent by covering the electromagnetic wave shield layer with the hard coat layer. An electromagnetic wave shield member having durability can be provided.

[Embodiment A4]
The electronic component mounting board according to the embodiment A4 is different from the embodiment A1 using the electromagnetic wave shield member composed of a single electromagnetic wave shield layer in that the electromagnetic wave shield member is a laminate of an electromagnetic wave shield layer and an insulating coating layer. However, the other basic configuration and manufacturing method are the same as in Embodiment A1.

As shown in FIG. 13, the electromagnetic wave shielding member according to the embodiment A4 is an electromagnetic wave composed of an electromagnetic wave shielding member 2c, which is a laminate of an insulating adhesive layer 8c and a conductive adhesive layer 6c, and a releasable cushion member 3c. It is formed using the shield laminate 4c.

In Embodiment A4, an example will be described in which the electromagnetic wave shield member is coated on a substrate on which a plurality of electronic components (for example, semiconductor packages) that have not been subjected to the individualization process or have been individualized have been formed. As shown in FIG. 14A, the electromagnetic wave shielding laminate 4c is arranged above the substrate 20 on which the electronic component 30 having the solder balls 24 functioning as connection terminals with the substrate 20 is mounted, and the releasable cushion member 3c. The substrate 20 on which the electronic component 30 is mounted is thermocompression bonded from the side (FIG. 14B). After that, the releasable cushion member 3c is peeled off to obtain the electronic component mounting board 53 in which the electromagnetic wave shield member 1c of FIG. 14C is laminated.

The obtained electronic component mounting substrate 53 can take GND from the upper surface of the electromagnetic wave shield layer 5c. In place of this method, a ground pattern is provided on the substrate 20, and in order to make the ground pattern and the electromagnetic wave shield layer 5c electrically conductive, the conductive pattern is penetrated through the insulating coating layer 9c on the ground pattern and electrically connected to the electromagnetic wave shield layer 5c. The connector part may be provided.

In the embodiment A4, the example of the method for manufacturing the electronic component mounting substrate which does not require the individualizing step has been described. However, the unit of the product unit of FIG. 14C is formed in an array on the mother substrate, and the electromagnetic wave shielding laminate is formed. It is also possible to obtain the electronic component mounting substrate shown in FIG. 14C by placing 4c and thermocompression-bonding it to form an electromagnetic wave shield layer, and then performing an individualizing step.

The insulating adhesive layer 8c is a layer formed of a resin composition containing a binder resin precursor. The binder resin precursor contains at least a thermosoftening resin. Examples and preferred examples of the binder resin precursor include the binder resin precursor of the conductive adhesive layer described in the embodiment A1. The binder resin precursors of the insulating adhesive layer 8c and the conductive adhesive layer 6c may be the same or different.

The heat-softenable resin composition and the heat-softenable resin composition layer, if necessary, a colorant, a silane coupling agent, an ion scavenger, an antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, and a leveling adjustment. Agents, flame retardants, inorganic fillers, etc. may be included.

According to the electronic component mounting board according to Embodiment A4, by using the electromagnetic wave shield member 1c having the insulating coating layer 9c, in addition to the effect described in Embodiment A1, a conductor portion such as a circuit other than the ground pattern or an electrode pattern is provided. It is possible to prevent a short circuit between the electromagnetic wave shield member and the electromagnetic wave shield member, and to enhance the reliability of bonding between the electronic component and the electromagnetic wave shield layer. Also, the insulation reliability of the electronic component can be improved. Therefore, the electromagnetic wave shield member having excellent durability can be provided. As a result, it is possible to provide an electronic component mounting board having excellent electromagnetic wave shielding properties. In addition, since the shield layer can be collectively formed on the entire substrate, the manufacturing process is simple, and the thickness can be remarkably reduced as compared with a shield can or the like.

In the embodiment A4, the example in which the insulating coating layer 9c is mainly used for strengthening the bonding between the electronic component and the electromagnetic wave shielding member has been described, but the insulating coating layer 9c can also be applied to the sealing material. When the insulating coating layer 9c is applied to the sealing material, there is an advantage that the sealing step of the semiconductor chip and the electromagnetic wave shielding member can be performed in the same step. That is, the electromagnetic wave shielding member according to the embodiment A4 is applied to an electronic component which is an insulator and is not integrally covered, and an insulating coating layer corresponding to an insulating adhesive layer to a sealing material (mold resin). You can also get In this case, in order to cover the electromagnetic wave shield member on the side surface of the electronic component, a press plate in which concave portions corresponding to the electronic component are formed in an array (a press portion having a convex portion for embedding the electromagnetic wave shield member in a gap between the electronic components is formed). A plate) may be used.

[Embodiment A5]
The electronic component mounting board according to the embodiment A5, the electromagnetic wave shield layer and the ground pattern are in direct contact with each other for conduction, and the conductive adhesive layer positioned in the inner layer of the electromagnetic wave shield laminate is a stage of the laminate body. An electromagnetic wave shield laminate having an exposed region is used. The exposed region is provided so that a conductive pattern such as a ground pattern formed on the substrate or the like and the electromagnetic wave shield layer come into contact with each other to establish electrical conduction. The embodiment A5 is different from the embodiment A4 in these points, but the other basic configuration and manufacturing method are the same.

The laminated body for electromagnetic wave shielding according to the embodiment A5 has the same laminated structure as that of the embodiment A4, but as shown in FIG. 15A, at a position corresponding to a region covering the ground pattern 22 formed on the substrate 20. The conductive adhesive layer 6d is exposed in the electromagnetic wave shielding laminate 4d. Specifically, the exposed region of the conductive adhesive layer 6d is provided in a top view from the insulating adhesive layer 8d side. In the example of the electromagnetic wave shielding laminate 4d of FIG. 15A, the size of the insulating adhesive layer 8d is made one size smaller than the size of the electromagnetic wave shielding laminate 4d, and the conductive adhesive is applied in the frame region of the electromagnetic wave shielding laminate 4d. The agent layer 6d is exposed. With such a configuration, as shown in FIGS. 15B and 15C, an electronic component mounting board 54 is obtained in which the ground pattern 22 and the electromagnetic wave shield layer 5d are brought into contact with each other by thermocompression to establish electrical conduction. The position of the exposed portion of the conductive adhesive layer 6d in the electromagnetic wave shielding laminate 4d is not limited to the example of FIG. 15A, and the exposed portion may be formed as an opening pattern.

[[Embodiment B]]
Hereinafter, a specific example of the electronic component mounting board according to the embodiment B will be described.
[Embodiment B1]
<Electronic component mounting board>
The electronic component mounting board of the embodiment B1 uses the electromagnetic wave shield member specified in the embodiment B instead of the electromagnetic wave shield member specified in the embodiment A. The electronic component mounting board and the manufacturing method thereof of the embodiment B1 are the same as those of the embodiment A1 except that the electromagnetic wave shielding member according to the embodiment B is used and the description thereof is omitted. Common. Therefore, the description of the overlapping portions will be omitted as appropriate.

As a preferable example of the basic configuration of the electronic component mounting board according to the embodiment B1, the basic configuration of the electronic component mounting board of the embodiment A1 described in FIGS. 1 to 10 can be exemplified. Hereinafter, the characteristic part of the embodiment B1 will be described with reference to these drawings.

<Electromagnetic wave shield member>
As described in the embodiment A1, the electromagnetic wave shielding member 1 according to the embodiment B1 has the electromagnetic wave shielding laminated body placed on the top surface of the electronic component 30 mounted on the substrate 20 and thermocompression bonded to the electronic component 30. And by coating the substrate 20. Since the coating mode of the electromagnetic wave shield member 1 is the same as that of the embodiment A1, the description thereof is omitted.

The electromagnetic wave shield member 1 of the embodiment B1 can be formed using the electromagnetic wave shielding laminate as in the embodiment A1. Then, as shown in FIG. 4, the electromagnetic wave shielding laminate 4 is composed of the electromagnetic wave shielding member 2 and the releasable cushion member 3. This electromagnetic wave shielding member 2 is composed of a single layer of the conductive adhesive layer 6 as in the embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shield layer 5. In the embodiment A1, the electromagnetic wave shield layer 5 functions as the electromagnetic wave shield member 1.
The electromagnetic wave shielding member 2 of Embodiment B1 is formed of a laminate of two or more conductive adhesive layers or a laminate of a conductive adhesive layer and a hard coat layer as described in Embodiment A1. It may be formed, or formed from a laminated body of other layers such as a laminated body of an insulating adhesive layer and a conductive adhesive layer.
The electromagnetic wave shield layer 5 of Embodiment B1 contains a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shield layer 5 is in continuous contact with the conductive filler and exhibits conductivity. From the viewpoint of enhancing the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1Ω/□ or less.

The electromagnetic wave shield member 1 of Embodiment B1 has an indentation elastic modulus of 1 to 10 GPa. By setting the indentation elastic modulus in this range, it is possible to suppress local minute deformation of the electromagnetic wave shield member 1 due to stress, and as a result, it is possible to effectively suppress damage due to the occurrence of burrs on the electromagnetic wave shield member 1. Furthermore, since it has excellent PCT resistance, it is possible to effectively suppress the decrease in adhesion after the reflow process. Therefore, a high quality electronic component mounting board can be provided.

By setting the indentation elastic modulus of the electromagnetic wave shield member 1 of Embodiment B1 to 1 GPa or more, deformation of the electromagnetic wave shield member 1 is suppressed against stress received from a cutting tool such as a dicing blade in the cutting process, and electromagnetic waves generated in the manufacturing process are suppressed. Burrs (see (i) of FIG. 23) of the shield member 1 can be effectively suppressed. The term “burr” as used herein refers to the turning of the electromagnetic wave shield member based on the cut surface of the electromagnetic wave shield member 1.

The indentation elastic modulus of the electromagnetic wave shield member 1 of Embodiment B1 can be adjusted by the composition of the electromagnetic wave shield member 2 in the electromagnetic wave shield laminate 4 described below before thermocompression bonding. More specifically, it can be adjusted by the kind of the binder resin precursor in the composition of the electromagnetic wave shielding member 2 before thermocompression bonding for forming the electromagnetic wave shielding member 1, the blending amount of each component, and the like. Specifically, the indentation elastic modulus tends to increase as the filler content increases. Further, the indentation elastic modulus tends to increase by increasing the number of functional groups of the resin used as the binder resin precursor or the content of the curable compound. Further, the higher the hardness of the binder resin, the larger the indentation elastic modulus tends to be. Therefore, it is preferable to make the kind of the binder resin precursor for forming the binder resin or the crosslink density of the binder resin appropriate. The crosslink density can be easily adjusted by the type of resin and curable compound and the number of functional groups.

Note that the indentation elastic modulus can be thought of as the Young's modulus that represents the property of the material to deform due to external stress. The “indentation elastic modulus” in the present specification refers to a value obtained by the measuring method and the measuring condition described in Examples described later.

A more preferable range of the indentation elastic modulus of the electromagnetic wave shield member 1 of Embodiment B1 is more than 1.5 GPa and 8 GPa or less, and a more preferable range is 2 GPa or more and 7.4 GPa or less.

The film thickness of the electromagnetic wave shield member 1 of Embodiment B1 can be appropriately selected depending on the application. For applications where thinning is required, the thickness T1 and T2 of the electromagnetic wave shield member 1 that covers the upper surface of the electronic component can be set to, for example, about 10 to 200 μm.

Product information may be stamped on the electronic component 30. In that case, there are a method of forming the electromagnetic wave shield member 1 after marking on the electronic component 30 and a method of forming the electromagnetic wave shield member 1 on the electronic component 30 and then marking on the electromagnetic wave shield member. In any case, good visibility of the marking is required while maintaining high shielding property. From the viewpoint of satisfying both characteristics, the thickness T1 of the electromagnetic wave shielding member is preferably 10 μm or more, more preferably 20 μm or more. In the latter marking method, that is, when marking is performed on the electromagnetic wave shield member, there is no upper limit of the film thickness of the electromagnetic wave shield member. On the other hand, in the former marking method, that is, when directly marking on an electronic component, the upper limit of the film thickness T1 of the electromagnetic wave shield member is preferably 50 μm or less, and more preferably 30 μm or less in order to maintain the visibility of the marking.

The water contact angle of the surface layer of the electromagnetic wave shield member 1 of Embodiment B1 is preferably 70 to 110°. By setting this range, it is possible to more effectively suppress damage to the electromagnetic wave shield layer during the manufacturing process. Further, it is possible to suppress the occurrence of burrs when the releasable cushion member filled in the groove-shaped recess formed in the half dicing groove 25 of the electronic component 30 is peeled off from the electromagnetic wave shield member 1. The more preferable range of the water contact angle of the electromagnetic wave shield member is 75 to 105°, and the more preferable range is 80 to 100°. The water contact angle of the electromagnetic wave shield member can be adjusted by adjusting the amount of the surface modifier added to the composition forming the electromagnetic wave shield member. The value of the water contact angle tends to increase as the amount of the surface modifier added to the electromagnetic wave shield member 1 increases.

In order to further improve the pressure cooker (hereinafter, also referred to as PCT) test resistance, it is preferable to set the Martens hardness of the electromagnetic wave shield member 1 of the embodiment B1 in the range of 50 N/mm ² or more. When the indentation elastic modulus of the electromagnetic wave shield member 1 is set within the range of 1 to 10 GPa and the Martens hardness of 50 N/mm ² or more is combined, the adhesion after the pressure cooker test becomes more excellent. As a result, it is possible to provide the electromagnetic wave shield member 1 having excellent adhesion even after reflow. Martens hardness is more preferably 60N / mm ² or more, 70N / mm ² or more is more preferable.

Martens hardness can be adjusted by the hardness of the conductive filler and binder component. The hardness of the binder component mainly depends on the hardness of the cured product of the thermosetting resin and the curable compound. Specifically, the addition of scale-like particles tends to increase the Martens hardness, and the addition of spherical or dendrite-like particles tends to decrease the Martens hardness. Further, as the amount of conductive filler increases, the Martens hardness tends to increase. Further, the higher the hardness of the cured resin, the harder the Martens hardness.

Although the manufacturing method will be described later, from the viewpoint of enhancing releasability when the releasable cushion member is peeled from the electromagnetic wave shield member 1 after the electromagnetic wave shield laminate 4 is thermocompression bonded to the substrate 20 on which the electronic component 30 is mounted. It is preferable that the kurtosis of the surface layer of the electromagnetic wave shield member 1 measured according to JIS B0601; 2001 is 8 or less. It is considered that when it is 8 or less, the sharpness of the surface shape of the electromagnetic wave shield member 1 becomes appropriate, and the release cushion member 3 and the electromagnetic wave shield member 1 are easily separated. As a result, it is possible to effectively suppress the phenomenon that the releasable cushion member 3 is torn in the half dicing groove 25 in the gap between the electronic components and remains as a residue. In the present specification, the "removable" means a releasable cushion member that is torn when the releasable cushion member is peeled and remains in a groove that is a gap between electronic components.

Further, from the viewpoint of enhancing scratch resistance, it is preferable that the electromagnetic wave shield member 1 of Embodiment B1 has a kurtosis of 1 or more. By setting it to 1 or more, the resistance to steel wool can be improved. The more preferable range of kurtosis of the electromagnetic wave shield member is 1.5 to 6.5, and the more preferable range thereof is 2 to 4. The method of adjusting the kurtosis on the surface of the electromagnetic wave shield member 1 is as described in the embodiment A1.

The root mean square height Rq of the surface of the electromagnetic wave shield member 1 of Embodiment B1 is preferably in the range of 0.4 to 1.6 μm, more preferably 0.5 to 1.5 μm, and 0.7 It is more preferable that the thickness is 1.2 μm. In the present specification, the kurtosis and the root mean square height refer to values obtained by the method described in Examples below.

<Method for manufacturing electronic component mounting board>
The method of manufacturing the electromagnetic wave shield member 1 of Embodiment B1 is basically the same as the method of manufacturing the electromagnetic wave shield member 1 of Embodiment A1. In the step (c), it is preferable that the binder resin forming the electromagnetic wave shield layer 5 has a three-dimensional crosslinked structure from the viewpoint of improving the tape adhesion after PCT. When dicing is performed in the step (e) of dividing into pieces, high-pressure water washing may be performed in order to cool the frictional heat due to dicing and to wash away the dicing dust generated by dicing. In the electronic component mounting board 51 according to the embodiment B, by setting the indentation elastic modulus to 1 to 10 GPa, the peeling of the electromagnetic wave shield member 1 due to the impact of high-pressure water washing can be significantly improved.

<Laminate for electromagnetic wave shield>
The electromagnetic wave shielding laminate of the embodiment B1 is composed of two layers of the electromagnetic wave shielding member 2 and the releasable cushion member 3, as described in FIG. In the embodiment B1, the electromagnetic wave shielding member 2 is composed of the single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression bonding process and functions as the electromagnetic wave shield layer 5.

A suitable example of the thermosoftening resin is the same as that of the embodiment A1. The thermosoftening resin, as a thermosetting resin, may have a plurality of functional groups that can be used for a crosslinking reaction by heating. Specific examples of the functional group are the same as in Embodiment A1.

The curable compound has a functional group capable of crosslinking with the reactive functional group of the thermosetting resin. By crosslinking, the adhesion can be made stronger and the water resistance can be improved. Curable compounds include epoxy compounds, acid anhydride group-containing compounds, isocyanate compounds, polycarbodiimide compounds, aziridine compounds, dicyandiamide compounds, amine compounds such as aromatic diamine compounds, phenol compounds such as phenol novolac resins, and organometallic compounds. preferable. The curable compound may be a resin. In this case, in order to distinguish between the thermosetting resin and the curable compound, one having a larger content is a thermosetting resin and one having a smaller content is a curable compound.

The above epoxy compound is a compound having two or more epoxy groups in one molecule. The properties of the epoxy compound may be liquid or solid. As the epoxy compound, for example, a glycidyl ether type epoxy compound, a glycidyl amine type epoxy compound, a glycidyl ester type epoxy compound, a cycloaliphatic (alicyclic) epoxy compound and the like are preferable.

Examples of the glycidyl ether type epoxy compound include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, a bisphenol AD type epoxy compound, a cresol novolac type epoxy compound, a phenol novolac type epoxy compound, and α-naphthol novolak. Type epoxy compound, bisphenol A type novolac type epoxy compound, dicyclopentadiene type epoxy compound, tetrabromobisphenol A type epoxy compound, brominated phenol novolac type epoxy compound, tris(glycidyloxyphenyl)methane, tetrakis(glycidyloxyphenyl)ethane Etc.

Examples of the glycidyl amine type epoxy compound include tetraglycidyl diaminodiphenylmethane, triglycidyl paraaminophenol, triglycidyl metaaminophenol, and tetraglycidyl metaxylylenediamine.

Examples of the glycidyl ester type epoxy compound include diglycidyl phthalate, diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate and the like.

Examples of the cycloaliphatic (alicyclic) epoxy compound include epoxycyclohexylmethyl-epoxycyclohexanecarboxylate, bis(epoxycyclohexyl)adipate, and the like. Further, a liquid epoxy compound can be preferably used.

Examples of the imidazole compound include imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2,4-dimethylimidazole and 2-phenylimidazole, and further imidazole compounds. There are latent curing accelerators having improved storage stability, such as a type in which an epoxy resin is reacted with a solvent to make them insoluble in a solvent, or a type in which an imidazole compound is encapsulated in microcapsules. Among these, a conductive adhesive layer The latent curing accelerator is preferable from the viewpoint of initiating the curing after the heat-melting.

The structure and molecular weight of the curable compound can be appropriately designed depending on the application. From the viewpoint of effectively suppressing burrs by adjusting the indentation elastic modulus in the range of 1 to 10 GPa, it is preferable to use two or more curable compounds having different molecular weights. The use of the first curable compound and the second curable compound also has the effect of increasing the tensile breaking strain of the electromagnetic wave shield layer.

The curable compound is preferably contained in an amount of 1 to 70 parts by mass, more preferably 3 to 65 parts by mass, still more preferably 3 to 60 parts by mass, based on 100 parts by mass of the thermosetting resin. When the first curable compound and the second curable compound are used in combination, the first curable compound is preferably contained in an amount of 5 to 50 parts by mass, preferably 10 to 40 parts by mass, based on 100 parts by mass of the thermosetting resin. More preferably, it is more preferable to contain 20 to 30 parts by mass. On the other hand, the second curable compound is preferably contained in an amount of 0 to 40 parts by mass, more preferably 5 to 30 parts by mass, and further preferably 10 to 20 parts by mass based on 100 parts by mass of the thermosetting resin.

A suitable example of the thermoplastic resin is the same as that of the embodiment A1. The conductive filler can be exemplified by metal filler, conductive ceramic particles and a mixture thereof. A suitable example of the metal filler is the same as that of the embodiment A1. Further, the content of silver in the silver-coated copper described above is also the same as that of the embodiment A1. Further, in the case of core-shell type particles, the preferable range of the coverage of the coat layer with respect to the core part is the same as that of the embodiment A1. The core part may be non-metal, but from the viewpoint of conductivity, a conductive substance is preferable, and metal particles are more preferable.

An electromagnetic wave absorbing filler may be used as the conductive filler, and its specific example is the same as that of the embodiment A1.

Examples of the shape of the conductive filler used in the conductive adhesive layer include scale particles, dendrite (dendritic) particles, needle particles, plate particles, grape particles, fibrous particles, and spherical particles. From the viewpoint of adjusting the numerical value of the kurtosis, it is preferable to include a conductive filler of needle-shaped particles and/or dendrite-shaped particles. Here, the acicular shape means that the major axis is three times or more the minor axis, and includes a so-called needle shape, a spindle shape, a columnar shape and the like. The dendrite shape means a shape in which a plurality of branched branches extend two-dimensionally or three-dimensionally from a rod-shaped main axis when observed with an electron microscope (500 to 20,000 times). In the dendrite shape, the branched branch may be bent, or the branched branch may further extend from the branched branch.

Further, by containing the scale-like particles as the conductive filler, it is possible to provide an electromagnetic wave shield member having excellent coverage. Here, the scaly shape includes a thin shape and a plate shape. The conductive filler may have a scaly shape as a whole particle, and may have an elliptical shape, a circular shape, or cuts around the fine particles. The scale-like particles tend to have a high Martens hardness, and the spherical and dendritic particles tend to have a low Martens hardness. Further, as the amount of conductive filler increases, the Martens hardness tends to increase. Further, the higher the hardness of the cured resin, the harder the Martens hardness.

The conductive fillers may be used alone or as a mixture. For example, a combination of scaly particles and spherical particles, a combination of scaly particles and dendrite particles, a combination of scaly particles and acicular particles, a combination of scaly particles, dendrite particles and acicular particles can be exemplified. These may also be used in combination with nano-sized spherical particles.

Also, by using dendrite-shaped particles and/or needle-shaped particles in combination, it is possible to increase the contact points between the conductive fillers and improve the shield characteristics. Further, the combined use of dendrite-like particles and/or acicular particles can increase the contact area with the binder component, so that a high-quality electromagnetic wave shield member can be provided.

It is preferable to contain 50% by mass or less of acicular particles and/or dendrite particles with respect to 100% by mass of the conductive filler in the conductive adhesive layer. The amount is more preferably 0.5 to 40% by mass, further preferably 1 to 35% by mass, and particularly preferably 1 to 30% by mass. By containing 50% by mass or less, it is possible to provide an electromagnetic wave shield member having more excellent scratch resistance.

The average particle diameter D50 of the scale-like particles is preferably 2 to 100 μm. A nano-sized conductive filler may be mixed with the scaly particles.

The average particle diameter D50 of the acicular particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. Similarly, the preferable range of the average particle diameter D50 of the dendrite-shaped particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. The average particle diameter D50 of the scaly particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. By using the scale-like particles and the dendrite-like particles together, the surface glossiness can be optimized and the print visibility can be improved when the characters are directly printed on the electromagnetic wave shield layer.

The method of measuring the average particle diameter D50 and the like are as described in Embodiment A1. The composition forming the conductive adhesive layer may include the additives described in Embodiment A1 (colorant, flame retardant, inorganic additive, lubricant, antiblocking agent, etc.). Each specific example is similar to that of the embodiment A1.

After applying the coating liquid for the conductive adhesive layer, it is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably performed by heating (for example, 80 to 120° C.). From the viewpoint of adjusting the kurtosis of the electromagnetic wave shield member, it is preferable to perform drying at 25° C. (room temperature) and normal pressure for 1 to 10 minutes after applying the coating liquid and before heating and drying. More preferable drying time at 25° C. (room temperature) before heat drying is 2 to 6 minutes. The kurtosis value can be adjusted by providing a process of drying at room temperature before heat drying.

The influence of the viscosity of the coating liquid and the drying time at 25° C. before heating and drying on the kurtosis of the electromagnetic wave shield member 1 will be described with reference to the schematic diagram of FIG. 9. As shown in the figure, a coating liquid is applied to form the conductive adhesive layer 6 on the releasable base material 15. A conductive adhesive layer 6P that is in the process of drying and contains a solvent is obtained. The electromagnetic wave shielding laminate can be manufactured by the same method as the electromagnetic wave shielding laminate of Embodiment A1.

[Embodiment B2]
Next, an example of an electronic component mounting board different from that of the embodiment B1 will be described. The electronic component mounting board according to the embodiment B2 is different from the embodiment B1 using the electromagnetic wave shield member composed of a single electromagnetic wave shield layer in that the electromagnetic wave shield member is composed of two electromagnetic wave shield layers, The other basic configuration and manufacturing method are the same as in Embodiment B1. Then, the basic configuration and the manufacturing method are the same as those of the embodiment A2 except that the electromagnetic wave shielding member according to the embodiment B is used instead of the electromagnetic wave shielding member according to the embodiment A and that it is described separately. Is. Overlapping description is omitted as appropriate.

As shown in FIG. 11, the electromagnetic wave shielding member of Embodiment B2 is an electromagnetic wave shielding member that is a conductive adhesive layer 6a composed of two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. 2a and an electromagnetic wave shielding laminate 4a including a releasable cushion member 3a. By thermocompression-bonding the electromagnetic wave shielding laminate 4a, the electromagnetic wave shielding member including the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer is coated on the substrate 20 on which the electronic component 30 is mounted. In the electromagnetic wave shield member, which is a laminate of the two electromagnetic wave shield layers, the indentation elastic modulus measured from the surface layer side is 1 to 10 GPa. By comprising two electromagnetic wave shield layers, the degree of freedom in designing the electromagnetic wave shield member can be increased. For example, a mode in which a laminate of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer is used can be exemplified. You may laminate|stack three or more electromagnetic wave shield layers.

According to the electronic component mounting board of the embodiment B2, the same effect as that of the embodiment B1 can be obtained by using the electromagnetic wave shield member including the two electromagnetic wave shield layers. Further, by laminating two electromagnetic wave shield layers, the degree of freedom in designing each layer can be increased, and there is an advantage that it is easy to provide an electromagnetic wave shield member according to needs.

[Embodiment B3 to Embodiment B5]
In the electronic component mounting board and the manufacturing method thereof according to the embodiments B3 to B5, the electromagnetic wave shield member according to the embodiment B (including the descriptions of the embodiments B1 and B2) is replaced with the electromagnetic wave shield member according to the embodiment A. The description of the above-described embodiments A3 to A5 can be applied except for the use. Therefore, the description of the electronic component mounting boards of Embodiments B3 to B5 and the manufacturing method thereof will be omitted.

[[Embodiment C]]
Hereinafter, a specific example of the electronic component mounting board according to the embodiment C will be described.
[Embodiment C1]
<Electronic component mounting board>
The electronic component mounting board of the embodiment C1 uses the electromagnetic wave shield member of the embodiment C instead of the electromagnetic wave shield member of the embodiment A. The electronic component mounting board and the manufacturing method thereof of the embodiment C1 have the same basic configuration and manufacturing method as that of the embodiment A1 except that the electromagnetic wave shield member of the embodiment C1 is described separately. Common description will be omitted as appropriate.

As a preferable example of the basic configuration of the electronic component mounting board according to the embodiment C1, the basic configuration of the electronic component mounting board of the embodiment A1 described in FIGS. 1 to 10 can be exemplified. Hereinafter, the characteristic part of the embodiment C1 will be described with reference to these drawings.

<Electromagnetic wave shield member>
As described in the embodiment A1, the electromagnetic wave shield member 1 of the embodiment C1 has the electromagnetic wave shielding laminate mounted on the top surface of the electronic component 30 mounted on the substrate 20 and thermocompression bonded to the electronic component 30. It is obtained by coating the substrate 20. Since the coating mode of the electromagnetic wave shield member 1 is the same as that of the embodiment A1, the description thereof is omitted.

The electromagnetic wave shield member 1 of the embodiment C1 can be formed using the electromagnetic wave shielding laminate as in the embodiment A1. Then, as shown in FIG. 4, the electromagnetic wave shielding laminate 4 is composed of the electromagnetic wave shielding member 2 and the releasable cushion member 3. This electromagnetic wave shielding member 2 is composed of a single layer of the conductive adhesive layer 6 as in the embodiment A1. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 by thermocompression bonding to form the electromagnetic wave shield layer 5. The electromagnetic wave shield layer 5 functions as the electromagnetic wave shield member 1.
The electromagnetic wave shielding member 2 of Embodiment C1 is formed of a laminate of two or more conductive adhesive layers or a laminate of a conductive adhesive layer and a hard coat layer, as described in Embodiment A1. It may be formed, or formed from a laminated body of other layers such as a laminated body of an insulating adhesive layer and a conductive adhesive layer.
The electromagnetic wave shield layer 5 of the embodiment C1 contains a binder resin and a conductive filler. The conductive filler in the electromagnetic wave shield layer 5 is in continuous contact with the conductive filler and exhibits conductivity. From the viewpoint of enhancing the electromagnetic wave shielding property, the sheet resistance value of the electromagnetic wave shielding layer 5 is preferably 1Ω/□ or less.

The electromagnetic wave shield member 1 has a root mean square height Rq of 0.05 μm or more and less than 0.3 μm measured according to JIS B0601; 2001 of the surface layer. The root mean square height Rq is a parameter corresponding to the standard deviation of the distance from the mean surface, which corresponds to the standard deviation of the height, and the height change of the surface along one axis (x axis) is Z( x) is expressed by the following mathematical expression (2). L is a reference length.

As a result of intensive studies by the present inventors, a cooling/heating cycle test was performed by setting the root mean square height Rq as the shape of the contact interface of the surface layer of the electromagnetic wave shield member 1 to a range of 0.05 μm or more and less than 0.3 μm. It has been found that, against (-50°C to 125°C), cracking of the electromagnetic wave shielding member can be effectively prevented and an electromagnetic wave shielding member having excellent coverage can be provided. Therefore, it is possible to provide a highly reliable electronic component mounting board. The electronic component mounting board of the present embodiment is particularly suitable as an electronic component mounting board used in an electronic device used in a severe environment with a large temperature difference (for example, an electronic component mounting board mounted in an automobile).

In the manufacturing process of electronic component mounting boards, there is a case in which the electromagnetic wave shield member is fixed to a dicing table via a dicing tape, and while maintaining this state, the board side is divided into individual products. In that case, the dicing tape and the electromagnetic wave shield member are peeled off after the process is finished, but at this time, floating (partial poor adhesion) or peeling may occur between the electromagnetic wave shield member and the electronic component. According to the electronic component mounting board of the present embodiment, by setting the root mean square height Rq of the surface layer of the electromagnetic wave shield member to be 0.05 μm or more and less than 0.3 μm, an excellent effect is achieved even with respect to such a problem. it can.

According to the present embodiment, since it has an electromagnetic wave shield layer having excellent coverage, which is excellent in thermal cycle resistance and in adhesion with the electronic component after the individualizing step, a highly reliable electronic component mounting board is provided. be able to.

Also, the electronic component mounting board may be subjected to high temperature processing such as a reflow process. At this time, a substance in the electronic component mounting board, for example, a component of solder flux may adhere to the electromagnetic wave shielding member 101. With respect to this problem as well, an excellent effect can be exhibited by setting the root mean square height Rq of the surface layer of the electromagnetic wave shielding member of Embodiment C1 to 0.05 μm or more and less than 0.3 μm. That is, there is an effect of effectively preventing the adhesion of the substance on the electromagnetic wave shield member 1. It is considered that this is because the unevenness on the surface of the electromagnetic wave shield member 1 can be made appropriate and substances such as the components of the solder flux can be effectively prevented from remaining on the uneven surface.

From the viewpoint of achieving excellent coverage with respect to the thermal cycle test described above, the preferred range of the root mean square height Rq of the electromagnetic wave shield member of Embodiment C1 is 0.05 to 0.29 μm, and the more preferred range is 0.05 to 0.27 μm, and a particularly preferable range is 0.05 to 0.25 μm.

The root mean square slope Rdq of the surface layer of the electromagnetic wave shield member 1 of Embodiment C1 is preferably in the range of 0.05 to 0.4, more preferably 0.05 to 0.37, and 0.1 to It is more preferable to set it to 0.35. In the present specification, the root mean square height Rq and the root mean square slope Rdq are values obtained according to JIS B0601; 2001, and are values obtained by the method described in Examples below. By setting the root mean square slope Rdq to be 0.05 to 0.4, the antifouling property and cracking can be more effectively improved.
The root mean square slope Rdq is the root mean square of the local slope dz/dx in the reference length, and is represented by the following mathematical expression (3).

Rdq can be calculated by processing the surface shape obtained by any one of an optical microscope, a laser microscope, and an electron microscope with analysis software. Rdq is a parameter expressing the degree of unevenness on the surface. Arithmetic mean height Ra and maximum heights Rz and Rq are used as parameters for expressing the surface property, but these are parameters expressing only the height of the unevenness, and to accurately express the state of the surface. Not suitable.
The larger the value of Rdq, the steeper the surface unevenness. That is, it is possible to judge the degree of the surface roughness by the numerical value of Rdq.

The root mean square height Rq and root mean square slope Rdq of the surface of the electromagnetic wave shield member 1 of Embodiment C1 can be adjusted by the manufacturing process of the electromagnetic wave shield member 2 in the electromagnetic wave shield laminate 4. Further, it can be adjusted by the components of the composition of the electromagnetic wave shielding member before thermocompression bonding for forming the electromagnetic wave shielding member 1 and the compounding amount thereof. Details will be described later. Note that the inventors of the present invention have made extensive studies and found that the values of the root mean square height Rq and the root mean square slope Rdq before and after the reflow treatment are improved by adding a conductive filler in an amount capable of functioning as an electromagnetic wave shield layer. It was confirmed that there was virtually no change, or the amount of change was small even if there was a change. By blending the inorganic filler also in the insulating layer such as the hard coat layer disclosed in the embodiment described below, the values of the root mean square height Rq and the root mean square slope Rdq do not substantially change before and after the reflow treatment, or It was confirmed that the amount of change was small even if it fluctuated.

The water contact angle of the surface layer of the electromagnetic wave shield member 1 of Embodiment C1 is preferably 90 to 130°. By setting it in this range, it is possible to suppress the floating more effectively and the antifouling property more effectively. A more preferable range of the water contact angle of the electromagnetic wave shield member is 95 to 125°, and a further preferable range is 100 to 120°. The water contact angle of the electromagnetic wave shield member can be adjusted by adjusting the amount of the surface modifier added to the composition forming the electromagnetic wave shield member. The value of the water contact angle tends to increase as the amount of the surface modifier added to the electromagnetic wave shield member 1 increases.

<Method for manufacturing electronic component mounting board>
The method of manufacturing the electromagnetic wave shield member 1 of Embodiment C1 is basically the same as the method of manufacturing the electromagnetic wave shield member 1 of Embodiment A1. The thickness of the conductive adhesive layer 6 is such that the electromagnetic wave shield layer 5 can be formed by covering the top and side surfaces of the electronic component 30 and the exposed surface of the substrate 20. Although it may vary depending on the fluidity of the binder resin precursor used and the distance and size between the electronic components 30, it is usually preferably about 10 to 200 μm, more preferably about 15 to 100 μm, and even more preferably about 20 to 70 μm.

In the embodiment C1, a case will be described in which the electromagnetic wave shield member 1 is fixed to a dicing table using a dicing tape and a dicing cut is performed from the substrate 20 side. This method is suitable when solder balls are bonded to the outer main surface of the substrate 20. According to the electromagnetic wave shield member 1 of Embodiment C1, the root mean square height Rq of the surface layer of the electromagnetic wave shield member 1 is set to be in the range of 0.05 μm or more and less than 0.3 μm, so that the electromagnetic wave shield is formed in the individualizing step. Even when the member 1 side is fixed with a dicing tape, the electromagnetic wave shield member is effectively prevented from floating (partial adhesion) and peeling off from the electronic component, and an electronic component mounting substrate having good coverage is provided. be able to.

<Laminate for electromagnetic wave shield>
The electromagnetic wave shielding laminate of Embodiment C1 is composed of two layers of the electromagnetic wave shielding member 2 and the releasable cushion member 3, as described in FIG. In the embodiment C1, the electromagnetic wave shielding member 2 is composed of the single-layer conductive adhesive layer 6. The conductive adhesive layer 6 is bonded to the electronic component 30 and the substrate 20 through a thermocompression bonding process and functions as the electromagnetic wave shield layer 5.

A suitable example of the heat softening resin is the same as that of the embodiment A1. The thermosoftening resin, as a thermosetting resin, may have a plurality of functional groups that can be used for a crosslinking reaction by heating. Specific examples of the functional group are the same as in Embodiment A1.

A suitable example and a suitable content of the curable compound are the same as those of the embodiment A1. Further, suitable examples of the thermoplastic resin, suitable examples of the tackifying resin, and the like are the same as those of the embodiment A1.

Further, the conductive filler can be exemplified by metal filler, conductive ceramic particles and a mixture thereof, and specific examples thereof are the same as those in the embodiment A1. Further, the preferable content of silver in the silver-coated copper is the same as that of the embodiment A1. Further, in the case of core-shell type particles, the preferable range of the coverage of the coat layer with respect to the core portion, etc. are the same as those of the embodiment A1.

An electromagnetic wave absorbing filler may be used as the conductive filler, and specific examples thereof include the same examples as in Embodiment A1.

Examples of the shape of the conductive filler used in the conductive adhesive layer include scale (flake) particles, dendrite (dendritic) particles, needle particles, plate particles, grape particles, fibrous particles, and spherical particles. The root mean square height Rq tends to decrease by increasing the ratio of the scaly particles, and the root mean square height Rq tends to increase by decreasing the ratio of the scaly particles. From the viewpoint of adjusting the desired values of the root mean square height Rq and the root mean square slope Rdq, it is preferable to contain a conductive filler of acicular particles and/or dendrite particles.

The conductive fillers may be used alone or as a mixture. When used in combination with a conductive filler, from the viewpoint of obtaining a desired root mean square height Rq and providing a highly reliable electromagnetic wave shielding member, a combination of scale-like particles and dendrite-like particles, scale-like particles and acicular particles. And a combination of scale-like particles, dendrite-like particles and needle-like particles. Particularly preferred is a combination of scaly particles and dendrite particles. Here, the scale-like particles preferably have a thickness of 0.2 μm or less.

The acicular particles and/or dendrite particles are preferably 30% by mass or less with respect to 100% by mass of the conductive filler in the conductive adhesive layer. A more preferred range is 0.1 to 20% by mass, a still more preferred range is 1 to 20% by mass, and a particularly preferred range is 3 to 16% by mass. There are various methods for adjusting the root mean square height Rq to be 0.05 μm or more and less than 0.3 μm and are not particularly limited. For example, the surface layer of the electromagnetic wave shield member, in the embodiment C1, the surface layer of the conductive adhesive layer 6 is pre-pressed with a roll before laminating the cushion member, and then bonded to the surface layer of the electromagnetic wave shield member of the cushion member. The root mean square height Rq can be easily adjusted by using the cushion member in which the root mean square height of the surface on the side to be filled is the desired Rq.

The average particle diameter D50 of the acicular particles is preferably 1 to 50 μm, more preferably 2 to 25 μm. More preferably, it is 5 to 15 μm. The preferable range of the average particle diameter D50 of the dendrite-shaped particles is preferably 2 to 100 μm, more preferably 2 to 80 μm. The thickness is more preferably 3 to 50 μm, and particularly preferably 5 to 20 μm. The average particle diameter D50 of the scaly particles is preferably 2 to 70 μm, more preferably 2 to 50 μm. The thickness is more preferably 3 to 25 μm, and particularly preferably 5 to 15 μm.

By using dendrite-shaped particles and/or needle-shaped particles in combination with scale-shaped particles, it is possible to increase the number of contact points between the conductive fillers and improve the shielding property. Further, the combined use of dendrite-like particles and/or needle-like particles can increase the contact area with the binder component and provide a highly reliable electromagnetic wave shield member.

The composition forming the conductive adhesive layer may contain a colorant, a flame retardant, an inorganic additive, a lubricant, an antiblocking agent and the like. Specific examples of these are similar to those of the embodiment A1.

After applying the coating liquid for the conductive adhesive layer, it is dried to form the conductive adhesive layer on the releasable substrate. The drying step is preferably performed by heating (for example, 80 to 120° C.). In order to adjust the root mean square height Rq of the electromagnetic wave shield member, it is preferable to perform drying at 25° C. (room temperature) and normal pressure for 1 to 17 minutes after applying the coating liquid and before heating and drying. More preferable drying time at 25° C. (room temperature) before heat drying is 2 to 14 minutes. The value of the root mean square height Rq can be adjusted by providing a process of drying at room temperature before heat drying.

Next, the influence of the viscosity of the coating liquid and the drying time at 25° C. before heating and drying on the root mean square height Rq and root mean square slope Rdq of the electromagnetic wave shield member 1 will be described. A coating liquid is applied to form a conductive adhesive layer on the releasable substrate. A dry conductive adhesive layer containing a solvent is obtained.

By setting a long drying time at 25° C. for the conductive adhesive layer in the middle of heating, the state where the evaporation rate of the solvent is slow is intentionally lengthened, whereby the binder resin precursor sinks downward. Can be encouraged. On the other hand, by setting the drying time at 25° C. short, it is possible to suppress the sinking of the binder resin precursor to the lower side, and to heat-dry at that stage to facilitate the rise of the conductive filler. Moreover, foaming easily occurs due to evaporation of the solvent, and the surface tends to be rough. It is needless to say that the temperature setting of 25° C. is an example and can be set appropriately.

The solid content of the coating liquid is preferably 20 to 30%. Further, in order to adjust the root mean square height Rq of the electromagnetic wave shield member, it is preferable that the coating liquid viscosity of the coating liquid measured with a B-type viscometer is in the range of 600 to 1800 mPa·s. Further, in order to adjust the root mean square height Rq of the electromagnetic wave shield member, it is preferable that the thixotropy index of the coating liquid is 1.2 to 1.5.

The values of the root mean square height Rq and the root mean square slope Rdq also change depending on the viscosity of the coating liquid for forming the conductive adhesive layer. The higher the viscosity of the coating liquid, the more the fluidity of the conductive filler tends to be suppressed. Therefore, when the viscosity is high, the conductive filler tends not to be oriented and becomes random. On the other hand, when the viscosity is low, the scale-like particles tend to be oriented so that the main surface faces the substrate surface. Further, when the drying time at 25° C. is shortened to perform heat drying, when the viscosity is high, the surface roughness due to foaming tends to increase, and when the viscosity is low, the conductive filler tends to move in the vertical direction. .. In this way, the root mean square height Rq can be adjusted by adjusting the viscosity of the coating liquid and the drying time at 25°C.

Further, the root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shield member 1 can be adjusted also by the particle diameter of the dendrite particles and/or the acicular particles. The influence of the particle diameter of the dendrite-shaped particles and/or the acicular particles on the root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shield member 1 will be described. By applying the coating liquid to form the conductive adhesive layer 6 on the releasable substrate, the conductive adhesive layer in the process of being dried can be obtained. When the average particle diameter D50 of the dendrite-like particles, which is a type of conductive filler, is small, the values of the root mean square height Rq and the root mean square slope Rdq tend to decrease, and conversely, the mean particle diameter D50 of the dendrite particles. Is larger, the values of the root mean square height Rq and the root mean square slope Rdq tend to be larger. The root mean square slope Rdq also depends on the shape of the acicular particles. If the particle diameter D50 of the acicular particles is large, Rdq becomes large. Further, when the particle diameter D50 of the acicular particles is small, Rdq becomes small.

The root mean square height Rq and the root mean square slope Rdq of the electromagnetic wave shield member 1 are scale-like conductive fillers in the composition forming the electromagnetic wave shield member 2 before thermocompression bonding, in addition to the adjusting method by the above-described process. And the needle-shaped and/or dendrite-shaped conductive filler can be adjusted by adjusting the addition amount ratio. The root mean square height Rq of the electromagnetic wave shield member 1 can also be adjusted by the average particle diameters D50 and D90 of the conductive filler.

In the embodiment C1, since the electromagnetic wave shielding member 2 is composed of a single layer of the conductive adhesive layer 6, the releasable cushion member 3 is bonded onto the conductive adhesive layer 6. As a joining method, there is a laminating method or the like.

The releasable base material is a base material having releasability on one or both sides, and is a sheet having a tensile breaking strain of less than 50% at 150°C. Specific examples of the releasable substrate are the same as those in Embodiment A1.

Also, the description of Embodiment A1 can be applied to the releasable cushion member.

[Embodiment C2]
Next, an example of an electronic component mounting board different from that of the embodiment C1 will be described. The electronic component mounting board according to the embodiment C2 is different from the embodiment C1 using the electromagnetic wave shield member composed of a single electromagnetic wave shield layer in that the electromagnetic wave shield member is composed of two electromagnetic wave shield layers, The other basic configuration and manufacturing method are the same as in Embodiment C1. Then, the basic configuration and manufacturing method are the same as those of the embodiment A2 except that the electromagnetic wave shielding member according to the embodiment C is used instead of the electromagnetic wave shielding member according to the embodiment A and that it is described separately. Is. Overlapping description is omitted as appropriate.

As shown in FIG. 11, the electromagnetic wave shielding member of Embodiment C2 is an electromagnetic wave shielding member that is a conductive adhesive layer 6a composed of two layers of a first conductive adhesive layer 6a1 and a second conductive adhesive layer 6a2. 2a and an electromagnetic wave shielding laminate 4a including a releasable cushion member 3a. By thermocompression bonding the electromagnetic wave shielding laminate 4a, the electromagnetic wave shielding member including the first electromagnetic wave shielding layer and the second electromagnetic wave shielding layer is coated on the substrate 20 on which the electronic component 30 is mounted. The second conductive adhesive layer 6a2 as the upper layer is manufactured by the same composition and process as the embodiment C1, and the first conductive adhesive layer 6a1 as the lower layer is not limited to the range of the root mean square height Rq and needs. It can be designed according to. For example, the conductive filler contained in the first conductive adhesive layer 6a1 may be a layer using a filler such as fibrous particles or spherical particles. It is also possible to design the first conductive adhesive layer 6a1 as an anisotropic conductive adhesive layer and the second conductive adhesive layer 6a2 as an isotropic conductive adhesive layer. Further, a mode in which a laminated body of an electromagnetic wave reflection layer and an electromagnetic wave absorption layer is also preferable. You may laminate|stack three or more electromagnetic wave shield layers.

According to the electronic component mounting board of the embodiment C2, the same effect as that of the embodiment C1 can be obtained by using the electromagnetic wave shield member including the two electromagnetic wave shield layers. Further, by laminating two electromagnetic wave shield layers, the degree of freedom in designing each layer can be increased, and there is an advantage that it is easy to provide an electromagnetic wave shield member according to needs.

[Embodiment C3]
The electronic component mounting board according to the embodiment C3, in that the electromagnetic wave shield member is a laminate of an electromagnetic wave shield layer and a hard coat layer, an embodiment C1 using an electromagnetic wave shield member composed of a single electromagnetic wave shield layer. Although different, the other basic structure and manufacturing method are the same.

As shown in FIG. 12, the electromagnetic wave shielding member according to the embodiment C3 includes an electromagnetic wave shielding member 2b and a releasable cushion member 3b which are a laminate of a single conductive adhesive layer 6b and an insulating resin layer 7b. It is formed by using the electromagnetic wave shielding laminate 4b. By thermocompression-bonding this electromagnetic wave shielding laminate 4b, an electromagnetic wave shielding layer formed of a conductive adhesive layer 6b and a hard coat layer formed of an insulating resin layer 7b are formed on a substrate on which electronic components are mounted. An electromagnetic wave shield member consisting of is obtained. The electromagnetic wave shield member of Embodiment C3 has a root mean square height Rq measured from the hard coat layer side of 0.05 μm or more and less than 0.3 μm.

The insulating resin layer 7b is a layer formed from a resin composition containing a binder resin precursor and an inorganic filler. The binder resin precursor contains at least a thermosoftening resin. Examples and preferred examples of the binder resin precursor are the same as those of the conductive adhesive layer of the electromagnetic wave shielding member described in Embodiment A1. The binder resin precursors of the conductive adhesive layer and the insulating resin layer may be the same or different.

The inorganic filler does not have conductivity unlike the conductive adhesive layer of the embodiment C1, but preferable characteristics of the inorganic filler, such as shape, blending amount, D50 and D90 are the same as the examples given for the conductive filler. Is. Examples of the inorganic filler include silica (fused silica, crystalline silica, non-crystalline silica), beryllia, alumina, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, antimony oxide, and oxide. Magnesium, talc, kaolinite, mica, basic magnesium carbonate, sericite, montmorolinite, kaolinite, bentonite, kaolin, clay, hydrotalcite, wollastonite, zonotolite, silicon nitride, boron nitride, aluminum nitride, phosphoric acid Calcium hydrogen, calcium phosphate, glass flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, calcium oxide, tin oxide, aluminum oxide, zirconium oxide, oxidation Examples thereof include inorganic compounds such as molybdenum, nickel oxide, zinc carbonate, magnesium carbonate, barium carbonate, zinc borate, aluminum borate, calcium silicate, silicon carbide, titanium carbide, diamond, graphite and graphene.
By using the heat conductive filler as the inorganic filler, the hard coat layer can also function as the heat conductive layer. Depending on the application, it can be used as a hard coat layer, a heat conductive layer (for example, a heat dissipation layer), or a layer having the functions of both.

The preferable examples of the preferable blending component and the blending amount of the binder resin precursor used for the insulating resin layer are the same as those of the conductive adhesive layer of the embodiment C1. Further, the preferable shape of the inorganic filler used for the insulating resin layer, the preferable average particle diameter D50, and the like are the same as those of the conductive filler of Embodiment C1. The description of Embodiment 1C can be applied to the heat-softenable resin composition and the additive that can be applied to the heat-softenable resin composition layer.

According to the electronic component mounting board according to Embodiment C1, by using the electromagnetic wave shield member having a hard coat layer, in addition to the effect described in Embodiment C1, by coating the electromagnetic wave shield layer with a hard coat layer, more An electromagnetic wave shield member having excellent durability can be provided.

[Embodiment C4, Embodiment C5]
The electronic component mounting boards of Embodiments C4 and C5 are the same as those of Embodiments A4 and Embodiments described above, except that the electromagnetic wave shield member according to Embodiment C is used instead of the electromagnetic wave shield member according to Embodiment A. The explanation in A5 can be used.

<Modification>
Next, modifications of the electronic component mounting board and the like according to the present embodiment will be described. However, the present invention is not limited to the above-described embodiments and modifications, and other embodiments may be included in the scope of the present invention as long as they match the gist of the present invention. Further, the respective embodiments and modified examples are preferably combined with each other.

In the embodiments A4, A5, B4, B5, C4, C5, an example using an electromagnetic wave shield laminate composed of a laminate of an insulating adhesive layer, a conductive adhesive layer and a releasable cushion member was described. However, it is also possible to manufacture as follows. That is, as shown in FIG. 16A, first, as shown in FIG. 16B, the insulating coating layer 9e is formed on the substrate 20 on which the plurality of electronic components 30 are mounted. This insulating coating layer 9e is obtained by hot pressing a sheet containing an insulating adhesive layer. After that, the electromagnetic wave shield layer 5e is formed by using the electromagnetic wave shield laminate 4e which is a laminate of the conductive adhesive layer 6e and the releasable cushion member 3e (FIGS. 16C and 16D). Through these steps, the electronic component mounting board 55 on which the electromagnetic wave shield member is formed is obtained. The insulating coating layer 9e can be exemplified by a method of applying a solution resin and a method of spraying a solution resin, instead of the method of hot pressing the sheet.

In the above embodiment, an electronic component was described as an example of the component, but the present invention can be applied to all components that are desired to be shielded from electromagnetic waves. Further, the shape of the component is not limited to the rectangular shape, and includes a component having an R-shaped corner, a component having an acute angle between the top surface and the side surface of the component, and a component having an obtuse angle. It also includes a case where the top surface is uneven, and the case where the outer surface of the electronic part is a curved surface such as a sphere. Further, in the above-described embodiment, the half dicing groove 25 (see FIG. 2) is formed on the substrate 20, but the half dicing groove 25 is not essential, and the electromagnetic wave shield member may be placed and covered on a flat substrate. Good. In addition, in the electronic component mounting substrate of the present invention, for example, when the electronic component mounting substrate on which the electronic component obtained by all-dicing the substrate 20 is mounted is mounted on another holding base material or the like. Including.

Also, the electromagnetic wave shield laminate is not limited to the laminate form of the above embodiment. For example, a support substrate may be laminated on the releasable cushion member. By stacking the support substrates, it is possible to easily prevent the device from being soiled during thermocompression bonding. In addition, the support substrate has an advantage that the step of attaching the electromagnetic wave shielding laminate is facilitated. Further, the electronic components can be mounted not only on one side of the substrate but also on both sides, and the electromagnetic wave shield member can be formed on each electronic component.

According to the electronic component mounting board of the present embodiment, since it has excellent coverage with respect to the concavo-convex structure, it can be suitably applied to various electronic devices such as personal computers, mobile devices, and digital cameras.

<<Example>>
Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples. In addition, "part" in the examples means "part by mass", and "%" means "% by mass". The values described in the present invention were determined by the following method.

[[Embodiment A]]
(Test board 1)
A substrate was prepared in which 5×5 array of mold-sealed electronic components (1 cm×1 cm) were mounted on a substrate made of glass epoxy. The thickness of the substrate is 0.3 mm, and the mold sealing thickness, that is, the height (component height) H from the upper surface of the substrate to the top surface of the mold sealing material is 0.7 mm. After that, half dicing was performed along the groove that is a gap between the components to obtain a test substrate (see FIG. 17). The half-cut groove depth was 0.8 mm (the cut groove depth of the substrate 20 was 0.1 mm), and the half-cut groove width was 200 μm.

(Test boards 2 and 3)
A test substrate 2 was prepared in the same manner as the test substrate 1 except that the half-cut groove width was changed to 150 μm. Further, a test substrate 3 was produced in the same manner as the test substrate except that the half cut groove width was changed to 150 μm and the groove depth was changed to 1000 μm.

The materials used in the examples are shown below.
-Binder resin precursor Resin 1: Polycarbonate resin (manufactured by Toyochem Co., Ltd.)
Resin 2: Phenoxy resin (manufactured by Toyochem Co., Ltd.)
Curable compound 1: Deconal EX830, (manufactured by Nagase Chemtech)
Curable compound 2: jERYX8000, (manufactured by Mitsubishi Chemical Corporation)
Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)
・Curing accelerator: PZ-33 (manufactured by Nippon Shokubai Co., Ltd.)
-Conductive filler 1: flake Ag (average particle size D50: 11 μm) (manufactured by Fukuda Metal Co., Ltd.)
-Conductive filler 2: acicular silver-coated copper (average particle diameter D50: 7.5 μm) (manufactured by Fukuda Metal Co., Ltd.)
-Additive 1: BYK322 (manufactured by BYK Chemie)
-Additive 2: BYK337 (manufactured by BYK Chemie)

[Example A1]
(Preparation of Resin Composition of Conductive Adhesive Layer)
As shown in Table 1, as a binder resin precursor, 20 parts (solid content) of resin 1 (polycarbonate resin), 80 parts (solid content) of resin 4 (phenoxy resin), and curable compound 1 (epoxy resin) 20 parts, curable compound 2 (epoxy resin) 15 parts, curable compound 3 (epoxy resin) 10 parts, conductive filler 1 (flake-like Ag) 320 parts, conductive filler 2 ( 5 parts of acicular Ag coat Cu), 1 part of curing accelerator, and 0.4 part of additive 1 were charged into a container, and toluene:isopropyl alcohol (mass ratio was adjusted so that the solid content concentration became 25% by mass). The mixed solvent of 2:1) was added and the mixture was stirred with a disper for 10 minutes to obtain a resin composition for forming a conductive adhesive layer.

(Production of laminate for electromagnetic wave shield)
This resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness would be 50 μm. Then, it was dried at 25° C. for 14 minutes at room temperature and then at 100° C. for 2 minutes to obtain an electromagnetic wave shielding member (conductive adhesive layer). Thereafter, a releasable cushion member (CR1040), a layer structure (thickness 150 μm) in which both surfaces of the soft resin layer were sandwiched by polymethylpentene, manufactured by Mitsui Chemicals Tohcello Co., Ltd. were prepared and laminated with a member for electromagnetic wave shielding. An electromagnetic wave shielding laminate according to Example A1 was obtained on a shaped substrate.

[Examples A2 to A5, Reference Example A1]
A resin composition of a conductive adhesive layer and a laminate for electromagnetic wave shielding were obtained in the same manner as in Example A1 except that the composition shown in Table 1 was changed.

[Examples A6 to A10, Reference Example A2]
Conductivity was changed in the same manner as in Example A1 except that the composition shown in Table 1 was changed and a mixed solvent of toluene:isopropyl alcohol (mass ratio 2:1) was added so that the solid content concentration became 29 mass %. A resin composition for an adhesive layer and a laminate for electromagnetic wave shielding were obtained.

<Kurtosis>
The electromagnetic wave shield laminates of Examples A1 to A10 and Reference Examples A1 and A2 were prepared, placed on a FR4 substrate having a thickness of 300 μm, and heated at 170° C. for 5 minutes from the releasable cushion member side in the surface direction at 8 MPa. Crimping was performed. After that, the releasable cushion member was peeled off and heating was performed at 180° C. for 2 hours. Then, the releasable cushion member was peeled off to obtain a test piece on which an electromagnetic wave shield member was formed.

In the above test piece, the surface of the electromagnetic wave shield member from which the releasable cushion member was peeled off was subjected to metal sputtering treatment. As for the metal sputter processing conditions, a sputtering device “Smart Coater” manufactured by JEOL Ltd. was used, gold was used as a target, and the separation distance between the target and the sample surface was 2 cm, and sputtering was performed for 0.5 minutes. For the metal sputtered surface of the obtained sample, kurtosis was determined using a laser microscope (VK-X100 manufactured by Keyence Corporation) according to JIS B 0601:2001. The measurement conditions were such that the measurement magnification was 1000 times in the shape measurement mode and the surface shape was acquired. The obtained surface shape image was subjected to surface roughness measurement of an analysis application to select the entire region, and the λs contour curve filter was set to 2.5 μm and the λc contour curve filter was set to 0.8 mm, and kurtosis was measured. The above measurement was carried out at five different points, and the average value of the measured values was used as the kurtosis value.
In the measurement of the kurtosis of the electromagnetic wave shield member, when measuring the electromagnetic wave shield member actually coated on the electronic component mounting substrate, the electromagnetic wave shield member coated on the electronic component substrate may be directly measured. ..

<Viscosity of coating liquid and thixotropic index>
The obtained conductive resin composition was allowed to stand in a water bath at 25° C. for 30 minutes, and then, with a “B type viscometer” (manufactured by Toki Sangyo Co., Ltd.), a viscosity (v1) at a rotation speed of 6 rpm and a rotation speed of 60 rpm. The viscosity (v2) of was measured. The value obtained by dividing (v1) by (v2) was used as a thixotropic index.

<Evaluation of releasability of half dicing groove of releasable cushion member after thermocompression bonding>
The electromagnetic wave shielding laminates of Examples and Reference Examples were thermocompression bonded to each of the test substrates 1 to 3 under conditions of 8 MPa and 170° C. for 5 minutes, and the releasable cushion member was peeled by hand. Then, the number of residues of the releasable cushion member that was broken and left in the groove in the gap between the electronic components was visually confirmed. The evaluation criteria are as follows: +++: No residue is observed.
++: 1 or more residue and less than 3 residue.
+: 3 or more residues and less than 5 residues.
NG: 5 or more residues, or a residue remains in the entire groove.

<Steel wool resistance>
A 125 μm thick polyimide film (“Kapton 500H” manufactured by Toray-DuPont) was placed on each of the electromagnetic wave shielding laminates of Examples and Reference Examples cut into 5×15 cm, and the conditions were 180° C. and 2 MPa. A hot press was performed for 10 minutes, and a test substrate was obtained by curing at 180° C. for 2 hours. Then, the releasable cushion member was peeled off. Next, the electromagnetic wave shield member was set on a Gakushin type abrasion tester (manufactured by Tester Sangyo Co., Ltd.), and the electromagnetic wave shield member was abraded and the polyimide film was formed under the conditions of a load of 200 gf, a stroke of 120 mm, and a reciprocating speed of 30 times/min. The number of academic achievements until exposure was calculated. The evaluation criteria are as follows.
+++: 20,000 times or more.
++: 10,000 times or more and less than 20,000 times.
+: 5,000 times or more and less than 10,000 times (practical level).
NG: less than 5,000 times.

Table 1 shows the evaluation results of Examples A1 to A10 and Reference Examples A1 and A2.

As shown in the example in Table 1, the electronic component mounting board using the electromagnetic wave shielding member of Reference Example A1 having a kurtosis of less than 1 did not reach the acceptable level of steel wool resistance. On the other hand, it was confirmed that all the electromagnetic wave shielding members of the electronic component mounting board of the present invention reached the acceptable level and were excellent in steel wool resistance. In addition, the electromagnetic wave shield member of Reference Example A2 in which the kurtosis was more than 8, the peelability of the groove portion did not reach the acceptable level. On the other hand, it was confirmed that all the electromagnetic wave shielding members of the electronic component mounting substrate of the present invention were excellent in the peelability of the groove portion of the releasable cushion member after thermocompression bonding.

[[Embodiment B]]
(Test board)
The test substrate according to the embodiment B was obtained by the same manufacturing method as the test substrate 1 of the embodiment A.

The materials used in the examples are shown below.
・Binder resin precursor Resin 1: Urethane resin (manufactured by Toyochem Co., Ltd.)
Resin 2: Polycarbonate resin (manufactured by Toyochem Co., Ltd.)
Resin 3: Styrene elastomer resin (manufactured by Toyochem Co., Ltd.)
Resin 4: Phenoxy resin, (manufactured by Toyochem Co., Ltd.)
Curable compound 1: Deconal EX830 (manufactured by Nagase Chemtech)
Curable compound 2: jERYX8000, (manufactured by Mitsubishi Chemical Corporation)
Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)
・Curing accelerator: PZ-33 (manufactured by Nippon Shokubai Co., Ltd.)
Conductive filler Conductive filler 1: Flake Ag (average particle diameter D50: 11 μm) (manufactured by Fukuda Metal Co., Ltd.)
Conductive filler 2: acicular silver-coated copper (average particle diameter D50: 7.5 μm) (manufactured by Fukuda Metal Co., Ltd.)
・Additive Additive 1: BYK322 (manufactured by BYK Chemie)
Additive 2: BYK337 (manufactured by BYK Chemie)

[Example B1]
(Preparation of Resin Composition of Conductive Adhesive Layer)
As shown in Table 2, 70 parts (solid content) of resin 1 (urethane resin), 30 parts (solid content) of resin 2 (polycarbonate resin), and curable compound 1 (epoxy resin) as a binder resin precursor. 30 parts, 15 parts of curable compound 2 (epoxy resin), 280 parts of conductive filler 1 (flake-like Ag), 50 parts of conductive filler 2 (acicular Ag coat Cu), and curing acceleration. 1 part of the agent and 0.4 part of the additive 1 are charged into a container, a mixed solvent of toluene:isopropyl alcohol (mass ratio 2:1) is added so that the solid content concentration becomes 35% by mass, and 10 minutes by a disper. A resin composition for forming a conductive adhesive layer was obtained by stirring.

(Production of laminate for electromagnetic wave shield)
This resin composition was applied to a releasable substrate using a doctor blade so that the dry thickness would be 50 μm. Then, it was dried at room temperature for 12 minutes at 25° C. and then at 100° C. for 2 minutes to obtain an electromagnetic wave shielding member (conductive adhesive layer). Thereafter, a releasable cushion member CR1040, a layer configuration (thickness 150 μm) in which both surfaces of the soft resin layer are sandwiched by polymethylpentene, manufactured by Mitsui Chemicals Tohcello Co., Ltd. are prepared, and releasability is obtained by laminating with a member for electromagnetic wave shielding. An electromagnetic wave shielding laminate according to Example B1 was obtained on the substrate.

(Preparation of test pieces for electronic component mounting boards)
Next, the laminate for electromagnetic wave shielding on the releasable substrate was cut into 10×10 cm, the releasable substrate was peeled off, and then the laminate for electromagnetic wave shielding was placed on the test substrate (see FIG. 17). It was placed and temporarily attached so that the conductive adhesive layer surface side of the body was in contact. Then, thermocompression bonding was performed from above the electromagnetic wave shielding laminate to the substrate surface under conditions of 2 MPa and 180° C. for 2 hours. After the thermocompression bonding, the releasable cushion member was peeled off to obtain an electronic component mounting substrate (test piece) according to Example 1 covered with the electromagnetic wave shielding member.

[Examples B2 to B19, Reference Examples B1 and B2]
The resin composition of the conductive adhesive layer, the electromagnetic wave shielding laminate, and the electronic component mounting substrate of each of the examples and reference examples, except that the compositions shown in Tables 2 and 3 were changed. The test piece of was obtained.

<Indentation elastic modulus>
The electromagnetic wave shield laminates of Examples B1 to B19 and Reference Examples B1 and B2 were prepared and placed on a FR4 substrate having a thickness of 300 μm, and 180° C. for 2 hours under the condition of 2 MPa in the surface direction from the releasable cushion member side. Heating was performed. Then, the releasable cushion member was peeled off to obtain a test piece of FR4 substrate on which the electromagnetic wave shield member was formed. Then, the indentation elastic modulus was measured from the side where the releasable cushion member was laminated by the following method.
That is, using a Fischer Scope H100C (manufactured by Fischer Instruments Co.) type hardness meter, using a Vickers indenter (diamond indenter having a spherical tip of 100φ), a test force of 0.3N and a test force of 25N in a thermostatic chamber. Was held for 20 seconds, and the test force required time was 5 seconds. The indentation elastic modulus was determined by averaging the values obtained by repeatedly measuring the same film surface of the electromagnetic wave shield member at 5 locations.

Note that in measuring the indentation elastic modulus of the electromagnetic wave shield member, it is possible to measure the electromagnetic wave shield member that is actually coated on the electronic component mounting board. In this case, the Vickers indenter is brought into direct contact with the electromagnetic wave shield member coated on the electronic component substrate for measurement. Also in the case of Kurtosis and water contact angle described later, the electromagnetic shield member actually coated on the electronic component mounting substrate can be measured in the same manner.

<Kurtosis>
A test board of FR4 board was obtained by the same method as described in Embodiment A, and kurtosis was determined by the same method.

<Water contact angle>
For the test piece of FR4 substrate prepared in the same manner as the sample for measuring the indentation elastic modulus, "Automatic contact angle meter DM-501/Analysis software FAMAS" manufactured by Kyowa Interface Science Co., Ltd. was used for the surface of the electromagnetic wave shield layer. Then, the water contact angle of the electromagnetic wave shield member was measured. The measurement was performed by a liquid method.

<Measurement of Martens hardness>
The test pieces of the electronic component mounting boards of the respective examples and reference examples were prepared, and the Martens hardness was measured with a Fischer Scope H100C (manufactured by Fischer Instruments Co., Ltd.) type hardness meter in accordance with ISO14577-1. For the measurement, a Vickers indenter (diamond indenter having a spherical tip of 100φ) with a test force of 0.3 N, a test force holding time of 20 seconds, and a test were applied to the upper surface of the electronic component 30 in a thermostatic chamber at 25°C. It was performed under the condition that the time required to apply force was 5 seconds. The average value of the values obtained by repeatedly measuring the same cured film surface at 10 locations randomly was defined as Martens hardness. The test force is adjusted according to the thickness of the electromagnetic wave shield layer. Specifically, the test force was adjusted so that the maximum indentation depth was about 1/10 of the thickness of the electromagnetic wave shield member.

<Viscosity of coating liquid and thixotropic index>
The viscosity (v1) at a rotation speed of 6 rpm and the viscosity (v2) at a rotation speed of 60 rpm were measured by the same method as that described in the embodiment A. Further, the thixotropy index was obtained by the same method.

<Burr during full dicing>
The electromagnetic wave shielding laminates of Examples and Reference Examples were thermocompression-bonded to the above-mentioned test substrates (substrates on which electronic components were mounted in an array of 5×5) under conditions of 8 MPa and 170° C. for 5 minutes, and releasability was improved. The cushion member was peeled off by hand. Then, it was cured at 180° C. for 2 hours to obtain a test sample coated with the electromagnetic wave shield member. With respect to the obtained test sample, the occurrence state of burrs when an individualizing step (full dicing) was performed was evaluated by the following criteria using a laser microscope.
+++: No burr is confirmed.
++: Less than 2 out of 25 electronic components in which burrs are generated.
+: 2 or more and less than 5 out of 25 electronic components in which burrs are generated.
NG: 5 or more out of 25 electronic components in which burrs are generated.

<Tape adhesion>
The FR4 substrate having a thickness of 300 μm was mounted with the electromagnetic wave shielding laminates of Examples and Reference Examples, each of which was cut into 5×5 cm, and heat-pressed at 170° C. for 8 minutes at 8 MPa for 2 hours at 180° C. A test substrate was obtained by curing. Then, the releasable cushion member was peeled off. Then, the obtained test substrate was subjected to a pressure cooker test at 130° C., a humidity of 85%, and a pressure of 0.23 MPa. The test time was 96 hours, and the adhesive tape used was a Nichiban adhesive tape having a width of 18 mm. Then, using a cross-cut guide in accordance with JIS K5600, 25 grids having a distance of 1 mm were produced on the electromagnetic wave shield member. After that, an adhesive tape was pressure-bonded to the cross-cut portion of the electromagnetic wave shield member, the end of the tape was peeled off at an angle of 45°, and a tape adhesion test was performed. The cross-cut condition (crosscut residual rate) of the electromagnetic wave shield member was judged according to the following criteria.
+++: Shows the residual rate of 25/25.
++: Shows the residual rate of 24/25.
+: The residual rate of 23/25 is shown.
NG: less than the remaining rate of 23/25.

<Evaluation of releasability of half dicing groove of releasable cushion member after thermocompression bonding>
The electromagnetic wave shielding laminates of Examples and Reference Examples were thermocompression-bonded to the test substrate (half dicing groove depth 800 μm, groove width 200 μm) under conditions of 8 MPa and 170° C. for 5 minutes to form a releasable cushion. The member was peeled off by hand. Then, the number of releasable cushion members torn and left in the groove in the gap between the electronic components was visually confirmed. The evaluation criteria are as follows.
+++: No residue is observed.
++: 1 or more residue and less than 3 residue.
+: 3 or more residues and less than 5 residues.
NG: 5 or more residues, or a residue remains in the entire groove.

<Steel wool resistance>
A test substrate was obtained by the same method as described in Embodiment A, and steel wool resistance was evaluated by the same measurement method. The evaluation criteria are also the same.

Tables 2 and 3 show the above evaluation results of Examples B1 to B19 and Reference Examples B1 and B2.

As shown in the examples of Tables 2 and 3, the electronic component mounting board using the electromagnetic wave shield member of Reference Example B1 having an indentation elastic modulus of less than 1 did not reach the acceptable level of burrs during full dicing. On the other hand, all the electromagnetic wave shielding members of the electronic component mounting board of the present invention have reached the acceptable level, and it has been confirmed that the occurrence of burrs can be suppressed. Further, the electronic component mounting board using the electromagnetic wave shield member of Reference Example B2 having the indentation elastic modulus of more than 10 GPa did not reach the pass level in the tape adhesion after the PCT test. On the other hand, it was confirmed that all the electromagnetic wave shielding members of the electronic component mounting substrate of the present invention had a pass level of tape adhesion after the PCT test and were excellent in PCT resistance.

FIG. 22 shows an image obtained by observing the side surface of the electronic component mounting board of Example B3 after singulation with a microscope. As shown in the figure, no burr was observed. On the other hand, FIG. 23 shows an image obtained by observing the side surface of the electronic component mounting substrate of Reference Example B1 after being singulated with a microscope. As shown in the figure, the occurrence of burrs was recognized.

[[Embodiment C]]
(Test board 1)
A test board was obtained by the same method as the method of manufacturing the test board 1 of the embodiment A.

The materials used in the examples are shown below.
Binder resin precursor Thermosetting resin 1: Polycarbonate resin (manufactured by Toyochem Co., Ltd.)
Thermosetting resin 2: Phenoxy resin (manufactured by Toyochem Co., Ltd.)
Curable compound 1: Deconal EX830 (manufactured by Nagase Chemtech)
Curable compound 2: jERYX8000 (manufactured by Mitsubishi Chemical Corporation)
Curable compound 3: jER157S70 (manufactured by Mitsubishi Chemical Corporation)
・Curing accelerator: PZ-33
-Conductive filler 1: scaly Ag (average particle diameter D50: 9.5 μm, D90=19 μm, thickness 0.1 μm)
-Conductive filler 2: dendrite-like silver-coated copper (average particle diameter D50: 7.1 μm, D90 = 15.1 μm)
・Additive 1: BYK337

[Example C1]
(Preparation of Resin Composition of Conductive Adhesive Layer)
As shown in Table 4, thermosetting resin 1 (polycarbonate resin) as a binder resin precursor is 20 parts (solid content), thermosetting resin 2 (phenoxy resin) is 80 parts (solid content), and curability 20 parts of compound 1 (epoxy resin), 15 parts of curable compound 2 (epoxy resin), 10 parts of curable compound 3 (epoxy resin), and 365 parts of conductive filler 1 (scaly Ag). , 5 parts of the conductive filler 2 (dendritic Ag coat Cu) and 1 part of the curing accelerator were charged in a container, and toluene:isopropyl alcohol (mass ratio 2: mass ratio: 2: The mixed solvent of 1) was added and the mixture was stirred with a disper for 10 minutes to obtain a resin composition for forming a conductive adhesive layer.

(Production of laminate for electromagnetic wave shield)
By the same method as in Embodiment A, an electromagnetic wave shielding laminate according to Example C1 was obtained.

(Preparation of test pieces for electronic component mounting boards)
Next, the laminate for electromagnetic wave shielding on the releasable substrate was cut into 10×10 cm, the releasable substrate was peeled off, and then the laminate for electromagnetic wave shielding was placed on the test substrate (see FIG. 17). It was placed and temporarily attached so that the conductive adhesive layer surface side of the body was in contact. Then, thermocompression bonding was performed from above the electromagnetic wave shielding laminate to the substrate surface under conditions of 2 MPa and 180° C. for 2 hours. After thermocompression bonding, the releasable cushion member was peeled off to obtain an electronic component mounting substrate (test piece) according to Example C1 covered with the electromagnetic wave shielding member.

[Examples C2 to C9, Reference Example C1]
A resin composition of a conductive adhesive layer and a laminate for electromagnetic wave shielding were obtained in the same manner as in Example C1 except that the composition shown in Table 4 was changed.

<Root Mean Square Height Rq>
The electromagnetic wave shielding laminates of Examples C1 to C9 and Reference Example C1 were prepared, placed on a FR4 substrate having a thickness of 300 μm, and heat-pressed at 170° C. for 5 minutes under the condition of 8 MPa in the surface direction from the releasable cushion member side. went. Then, the releasable cushion member was peeled off and heated at 180° C. for 2 hours to obtain a test piece on which an electromagnetic wave shield member was formed.

In the above test piece, the surface of the electromagnetic wave shield member from which the releasable cushion member was peeled off was subjected to metal sputtering treatment. As for the metal sputter processing conditions, a sputtering device “Smart Coater” manufactured by JEOL Ltd. was used, gold was used as a target, and the separation distance between the target and the sample surface was 2 cm, and sputtering was performed for 0.5 minutes. The root mean square height Rq was determined for the metal sputtered surface of the obtained sample using a laser microscope (VK-X100 manufactured by Keyence Corporation) according to JIS B 0601:2001. The measurement conditions were such that the measurement magnification was 1000 times in the shape measurement mode and the surface shape was acquired. The obtained surface shape image was subjected to surface roughness measurement of an analysis application to select the entire area, set the λs contour curve filter to 2.5 μm and the λc contour curve filter to 0.8 mm, and measure the root mean square height Rq. .. The above measurement was performed at five different points, and the average value of the measured values was taken as the value of the root mean square height Rq.
In the measurement of the root mean square height Rq of the electromagnetic wave shield member, when measuring the electromagnetic wave shield member actually coated on the electronic component mounting substrate, the electromagnetic wave shield member coated on the electronic component substrate is It can be measured directly.

<Square root mean square slope Rdq>
Using the surface profile image obtained by the measurement of Rq, in the line roughness measurement of the analysis application, 20 two-dot lines are uniformly drawn over the entire image, the λ0026s contour curve filter is 2.5 μm, and the λc contour curve filter is 0. The root mean square slope Rdq was measured at 0.8 mm. The above measurement was carried out at five different points, and the average value of the measured values was taken as the value of the root mean square slope Rdq.

<Water contact angle>
The electromagnetic wave shield laminates of the respective examples and reference examples were prepared, and placed on a test piece of an FR4 substrate prepared in the same manner as a 300 μm thick indentation elastic modulus measurement sample, and the surface direction from the releasable cushion member side. Further, heating was performed at 180° C. for 2 hours under the condition of 2 MPa. Then, the releasable cushion member was peeled off to obtain a test piece of FR4 substrate on which the electromagnetic wave shield member was formed. Then, the water contact angle was measured from the side where the releasable cushion member was laminated by the following method. That is, the water contact angle of the electromagnetic wave shield member was measured on the surface of the electromagnetic wave shield layer using "Automatic contact angle meter DM-501/Analysis software FAMAS" manufactured by Kyowa Interface Science Co., Ltd. The measurement was performed by a liquid method.

<Tape coverage>
The FR4 substrate having a thickness of 300 μm was mounted with the electromagnetic wave shielding laminates of Examples and Reference Examples, each of which was cut into 5×5 cm, and heat-pressed at 170° C. for 8 minutes at 8 MPa for 2 hours at 180° C. A test substrate was obtained by curing. Then, the releasable cushion member was peeled off. Then, the obtained test substrate was bonded to an electromagnetic wave shielding member with a dicing tape (UHP-110AT (UV type, substrate PET, total thickness 110 μm (including adhesive layer thickness 10 μm)), manufactured by Denka), and the substrate 20 The electronic component mounting board was divided into individual pieces by dicing cutting from the outer surface. After separating into pieces, the dicing tape was peeled off from the electromagnetic wave shield member, and the state of the electromagnetic wave shield member was observed with an optical microscope (magnification: 200 times) and judged according to the following criteria.
+++: No abnormality in appearance.
++: 1 to ² floats having a diameter of 0.5 mm or less are generated on the electromagnetic wave shield member per 1 cm ² .
+: 3 to 4 floats having a diameter of 0.5 mm or less occur on the electromagnetic wave shield member per 1 cm ² .
NG: 5 or more floats having a diameter of more than 0.5 mm, peeling, or floats having a diameter of 0.5 mm or less occurred on the electromagnetic wave shield member per 1 cm ² .

<Evaluation of antifouling property>
A 125 μm thick polyimide film (“Kapton 500H” manufactured by Toray-DuPont) was placed on each of the electromagnetic wave shielding laminates of Examples and Reference Examples cut into 5×15 cm, and the conditions were 180° C. and 2 MPa. A hot press was performed for 10 minutes, and a test substrate was obtained by curing at 180° C. for 2 hours. Then, the releasable cushion member was peeled off. As a pseudo flux, n-octanoic acid was applied to the top surface of the electromagnetic wave shield member. Then, it was immersed in a cleaning liquid in which dioxolane and isopropanol were mixed at 8/2 and ultrasonically cleaned. After washing, the antifouling property was evaluated using an optical microscope (magnification: 200 times). The evaluation criteria are as follows.
+++: No residue after washing for 3 minutes.
++: No residue after washing for 5 minutes.
+: After washing for 5 minutes, 1 to 2 places of residue remain on 1 cm ^{2 of the} surface of the electromagnetic wave shield member.
NG: After washing for 5 minutes, there are residues at 2 places per cm ² of the electromagnetic wave shield member surface.

<Cooling cycle test>
An electronic component mounting substrate (test piece) coated with an electronic component mounting substrate (test piece) electromagnetic wave shielding member according to Example C1 was prepared for the test substrate shown in FIG. The initial connection resistance value between the two top surfaces (arrows in FIG. 24) of the component was measured using a BSP probe of “Lorester GP” manufactured by Mitsubishi Chemical Analytech. Then, put into a thermal shock device ("TSE-11-A", manufactured by ESPEC Co., Ltd.) and exposed to high temperature: 125°C for 15 minutes, low temperature exposure: -50°C for 15 minutes, and alternately exposed 1000 times. Carried out. After that, the connection resistance value of the sample was measured in the same manner as in the initial stage.
The evaluation standard of the thermal cycle reliability is as follows. The measured value was measured at three points and the average value was used.
When an insulating layer such as a hard coat layer is laminated on the outermost surface, the measurement point of the insulating layer is removed after the thermal cycle test, the electromagnetic wave shield layer 5 is exposed, and the same test as above is performed. .. In this case, the connection resistance value of the electromagnetic wave shield layer 5 before the cooling/heating cycle test is obtained by removing the measurement point of the insulating layer at the other place of the sample by the same method as described above.
+++: (connection resistance value after alternate exposure)/(initial connection resistance value) is less than 1.5, which is extremely good.
++: (connection resistance value after alternate exposure)/(initial connection resistance value) is 1.5 or more and less than 3.0, which is good.
+: (connection resistance value after alternate exposure)/(initial connection resistance value) is 3.0 or more and less than 5.0.
NG: (connection resistance value after alternate exposure)/(initial connection resistance value) is 5.0 or more.

Table 4 shows the evaluation results of Examples C1 to C9 and Reference Example C1.

As shown in the example of Table 4, the electronic component mounting board using the electromagnetic wave shield member of Reference Example 1 having a root mean square height Rq of 0.3 or more did not reach the pass level in the thermal cycle test. On the other hand, all the electromagnetic wave shielding members of the electronic component mounting board of the present invention have reached the pass level, and it was confirmed that the electromagnetic wave shielding member has excellent coverage even under severe conditions of the thermal cycle test. Further, it was confirmed that in the individualizing step, it is possible to effectively prevent the coverage defect such as floating or peeling on the electromagnetic wave shield member. In addition, it was confirmed that the electromagnetic wave shielding member of the electronic component mounting substrate of the present invention is excellent in antifouling property.

This application was filed on Dec. 18, 2018 in Japanese Patent Application No. 2018-236541 and Japanese Patent Application No. 2018-236542, and in Japanese application in Japanese Patent Application No. 2019-063673 filed on Mar. 28, 2019. Claiming priority based on Japanese Patent Application No. 2019-206612 filed on Dec. 5, 2019, 2019-0636674, the entire disclosure of which is incorporated herein.

1 Electromagnetic Wave Shielding Member 2 Electromagnetic Wave Shielding Member 3 Releasable Cushion Member 4 Electromagnetic Wave Shielding Laminate 5 Electromagnetic Wave Shielding Layer 6 Conductive Adhesive Layer 6P Conductive Adhesive Layer 7b Insulating Resin Layer 8c Insulating Adhesive Layer 9c Insulating coating layer 10 Binder resin precursor 11 Conductive filler 12 Dendritic particles 15 Releasable substrate 20 Substrate 21 Electrode 22 Ground pattern 23 Inner via 24 Solder ball 25 Half dicing groove 30 Electronic component 31 Semiconductor chip 32 Mold resin 33 Bonding Wire 40

Press Substrate

51, 52 Electronic Component Mounting Substrate

Claims

Board,
An electronic component mounted on at least one surface of the substrate,
An electromagnetic wave shield member that covers from the upper surface of the electronic component to the substrate, and that covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate,
The electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler,
An electronic component mounting board having a kurtosis of 1 to 8 measured according to JIS B0601; 2001 on the surface layer of the electromagnetic wave shield member.
The electronic component mounting board according to claim 1, wherein the root mean square height Rq measured according to JIS B0601; 2001 of the surface layer of the electromagnetic wave shielding member is 0.3 to 1.7 μm.
The conductive filler,
The electronic component mounting board according to claim 1, which contains at least one of a dendrite-shaped and needle-shaped conductive filler.
Board,
An electronic component mounted on at least one surface of the substrate,
An electromagnetic wave shield member that covers from the upper surface of the electronic component to the substrate, and that covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate,
The electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler, and has an indentation elastic modulus of 1 to 10 GPa.
The electronic component mounting board according to claim 4, wherein the water contact angle of the surface layer of the electromagnetic wave shield member is 70 to 110°.
The electronic component according to claim 4 or 5, wherein the electromagnetic shield member on the electronic component shows a crosscut residual ratio of 23/25 or more in a tape adhesion test after a pressure cooker test based on JIS K5600 of the electromagnetic shield member. Mounting board.
The electronic component mounting substrate according to any one of claims 4 to 6, wherein the surface layer of the electromagnetic wave shield member has a kurtosis of 1 to 8 measured according to JIS B0601; 2001.
The electronic component mounting board according to any one of claims 4 to 7, wherein a root mean square height of the surface of the electromagnetic wave shield member is in a range of 0.4 to 1.6 µm.
9. The electronic component mounting board according to claim 4, wherein the electromagnetic wave shielding member has a Martens hardness of 50 to 312 N/mm 2 .
The binder resin is obtained by thermocompression bonding a thermosetting resin and a binder resin precursor containing a curable compound having a functional group capable of crosslinking with the reactive functional group of the thermosetting resin. The electronic component mounting board according to any one of claims 4 to 9.
The electronic component mounting board according to any one of claims 4 to 10, wherein a film thickness of the electromagnetic wave shield member is 10 to 200 µm.
Board,
An electronic component mounted on at least one surface of the substrate,
An electromagnetic wave shield member that covers from the upper surface of the electronic component to the substrate, and that covers at least a part of the side surface of the step portion formed by mounting the electronic component and the substrate,
The electromagnetic wave shield member has an electromagnetic wave shield layer containing a binder resin and a conductive filler,
An electronic component mounting board in which the root mean square height Rq of the surface layer of the electromagnetic wave shield member is 0.05 μm or more and less than 0.3 μm.
The electronic component mounting board according to claim 12, wherein the root mean square slope Rdq of the surface layer of the electromagnetic wave shield member is 0.05 to 0.4.
The electronic component mounting board according to claim 12 or 13, wherein a water contact angle of the surface layer of the electromagnetic wave shield member is 90 to 130°.
The conductive filler,
The electronic component mounting board according to any one of claims 12 to 14, which contains at least one of a dendrite-shaped and needle-shaped conductive filler and a scale-shaped conductive filler.
An electronic device on which the electronic component mounting board according to any one of claims 1 to 15 is mounted.