WO2020095919A1 - Electromagnetic shielding film, method for manufacturing electromagnetic shielding film, and method for manufacturing shielded printed wiring board - Google Patents

Electromagnetic shielding film, method for manufacturing electromagnetic shielding film, and method for manufacturing shielded printed wiring board Download PDF

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Publication number
WO2020095919A1
WO2020095919A1 PCT/JP2019/043375 JP2019043375W WO2020095919A1 WO 2020095919 A1 WO2020095919 A1 WO 2020095919A1 JP 2019043375 W JP2019043375 W JP 2019043375W WO 2020095919 A1 WO2020095919 A1 WO 2020095919A1
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Prior art keywords
adhesive layer
electromagnetic wave
resin
film
pressure
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PCT/JP2019/043375
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French (fr)
Japanese (ja)
Inventor
祥久 山本
上農　憲治
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タツタ電線株式会社
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Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to JP2020556099A priority Critical patent/JP7096905B2/en
Priority to CN201980073294.1A priority patent/CN112930378B/en
Priority to KR1020217013988A priority patent/KR102572058B1/en
Publication of WO2020095919A1 publication Critical patent/WO2020095919A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • the present invention relates to an electromagnetic wave shielding film, a method for manufacturing an electromagnetic wave shielding film, and a method for manufacturing a shield printed wiring board.
  • Flexible printed wiring boards are widely used in electronic devices such as mobile phones, video cameras, and notebook computers, which are rapidly becoming smaller and more sophisticated, in order to incorporate a circuit into a complicated mechanism. Further, by taking advantage of its excellent flexibility, it is also used for connecting a movable part such as a printer head and a control part. Electromagnetic wave shielding measures are essential for these electronic devices, and flexible printed wiring boards used in the equipment also have flexible printed wiring boards with electromagnetic wave shielding measures (hereinafter also referred to as “shield printed wiring boards”). Has been used.
  • a general shielded printed wiring board is usually a printed wiring board in which a printed circuit and an insulating film are sequentially provided on a base film, an adhesive layer, a shield layer laminated on the adhesive layer, and a laminated layer on the shield layer. It is composed of an electromagnetic wave shielding film composed of the insulating layer. The electromagnetic wave shielding film is laminated on the printed wiring board so that the adhesive layer contacts the printed wiring board, and the adhesive layer is bonded to the printed wiring board to obtain a shielded printed wiring board.
  • Patent Document 1 describes an example of such an electromagnetic wave shielding film having a protective film (peelable sheet) on the adhesive layer.
  • the adhesive layer contains a thermosetting resin and has a property of exhibiting an adhesive force with the printed wiring board by thermosetting the thermosetting resin
  • the adhesive layer does not have much adhesiveness at room temperature. It becomes a layer that does not have it, and it is difficult to bond the protective film to the thermosetting resin as it is.
  • the present invention is capable of bonding at room temperature, does not peel off from the adhesive layer at the time of distribution, and an electromagnetic wave shielding film provided with a protective film having a property of being easily peeled off from the adhesive layer at the time of use.
  • the purpose is to provide.
  • the present inventors have found that the adhesive strength between the protective film and the adhesive layer is insufficient in the bonding at room temperature utilizing the adhesive strength of the adhesive layer, so that a pressure-sensitive adhesive layer is provided between the protective film and the adhesive layer. It was examined to bond the adhesive layer and the protective film with each other by using the adhesive force of the adhesive layer. Then, by determining the surface state of the adhesive layer and the characteristics of the pressure-sensitive adhesive layer, the protective film can be attached at room temperature, and it was found that the protective film can be easily peeled from the adhesive layer during use, Was completed.
  • the electromagnetic wave shielding film of the present invention an adhesive layer, a shield film portion comprising a shield layer laminated on the adhesive layer, an insulating layer laminated on the shield layer, A protective film, an electromagnetic wave shielding film comprising a protective portion comprising a pressure-sensitive adhesive layer laminated on the protective film,
  • the adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m
  • the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  • the adhesive layer of the shield film portion and the protective film can be bonded together by utilizing the adhesive force of the pressure-sensitive adhesive layer.
  • the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 ⁇ m, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer. When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer.
  • the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
  • the adhesive layer preferably contains a resin having Tg of 0 to 100 ° C.
  • Tg of the resin contained in the adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
  • the Tg of the adhesive layer is less than 0 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 100 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film. ..
  • the pressure-sensitive adhesive layer preferably contains a resin having Tg of ⁇ 60 to 0 ° C.
  • Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
  • the Tg of the pressure-sensitive adhesive layer is less than ⁇ 60 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 0 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film.
  • the adhesive layer contains a thermosetting resin containing at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin.
  • a thermosetting resin containing at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin.
  • the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
  • the pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
  • the pressure-sensitive adhesive layer contains the above resin, the pressure-sensitive adhesive property is exhibited.
  • the adhesive layer is preferably an electrically conductive adhesive layer.
  • a ground circuit is also provided in the electronic circuit of the printed wiring board.
  • a transfer film is provided on the surface of the insulating layer opposite to the surface on which the shield layer is laminated.
  • the transfer film is provided, the insulating layer can be protected when the electromagnetic wave shielding film is distributed.
  • Another electromagnetic wave shield film of the present invention functions as a shield layer, an adhesive layer having conductivity, and a shield film portion including an insulating layer laminated on the adhesive layer,
  • the adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m
  • the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  • the adhesive layer has conductivity, and the adhesive layer also functions as a shield layer. Even for such an adhesive layer, by providing an adhesive layer on the protective part, it is possible to bond the adhesive layer of the shield film part and the protective film by using the adhesive force of the adhesive layer. it can.
  • the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 ⁇ m, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer. When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off.
  • the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
  • the adhesive layer preferably contains a resin having Tg of 0 to 100 ° C.
  • Tg of the resin contained in the adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
  • the Tg of the adhesive layer is less than 0 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 100 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film. ..
  • the pressure-sensitive adhesive layer preferably contains a resin having Tg of ⁇ 60 to 0 ° C.
  • Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
  • the Tg of the pressure-sensitive adhesive layer is less than ⁇ 60 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 0 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film.
  • the adhesive layer contains at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin, and is thermoset. It is preferably sex.
  • the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
  • the pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
  • the pressure-sensitive adhesive layer contains the above resin, the pressure-sensitive adhesive property is exhibited.
  • a transfer film is provided on the surface of the insulating layer opposite to the surface on which the adhesive layer is laminated.
  • the transfer film is provided, the insulating layer can be protected when the electromagnetic wave shielding film is distributed.
  • the method for producing an electromagnetic wave shield film of the present invention comprises a step of producing a shield film portion by sequentially forming an insulating layer, a shield layer and an adhesive layer on a transfer film,
  • a method for producing an electromagnetic wave shield film which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m
  • the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  • an electromagnetic wave shielding film including the protective film can be manufactured. Since the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the adhesive layer is 50% and the storage elastic modulus of the resin constituting the adhesive layer are set in a suitable range. , The protective film is provided on the surface of the adhesive layer with appropriate adhesive strength by bonding. Further, when the electromagnetic wave shielding film is used, the protective portion including the protective film can be easily peeled off from the adhesive layer. If the height c at which the load area ratio Smr (c) is 50% is less than 2 ⁇ m, the protective film can be attached, but the protective film is difficult to peel off.
  • the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer.
  • the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off.
  • the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
  • the step of attaching the protective film to the adhesive layer Form the pressure-sensitive adhesive layer on the surface of the adhesive layer, It is preferable that the protective film be attached to the pressure-sensitive adhesive layer.
  • the step of attaching the protective film to the adhesive layer Form the pressure-sensitive adhesive layer on the surface of the protective film, It is preferable to carry out by adhering the protective film with the pressure-sensitive adhesive layer facing the adhesive layer.
  • the pressure-sensitive adhesive layer may be provided on the surface of the adhesive layer or on the surface of the protective film, and in any case, the adhesive layer and the protective film can be attached via the pressure-sensitive adhesive layer.
  • the step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C. Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than the Tg of the resin contained in the adhesive layer. If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost. Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than the Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
  • Another method for producing an electromagnetic wave shield film of the present invention is a step of producing a shield film portion by sequentially forming an insulating layer and a conductive adhesive layer on the transfer film,
  • a method for producing an electromagnetic wave shield film which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m
  • the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  • the shield film portion is produced by forming an insulating layer and an adhesive layer having conductivity on the transfer film.
  • the electromagnetic wave shield film including the protective film can also be manufactured by bonding the adhesive layer and the protective film of the shield film portion having such a configuration via the adhesive layer. Since the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the adhesive layer is 50% and the storage elastic modulus of the resin constituting the adhesive layer are set in a suitable range. , The protective film is provided on the surface of the adhesive layer with appropriate adhesive strength by bonding. Further, when the electromagnetic wave shielding film is used, the protective portion including the protective film can be easily peeled off from the adhesive layer.
  • the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 ⁇ m, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer. When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off.
  • the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
  • the step of attaching the protective film to the adhesive layer, Form the pressure-sensitive adhesive layer on the surface of the protective film It is preferable to carry out by adhering the protective film with the pressure-sensitive adhesive layer facing the adhesive layer.
  • the pressure-sensitive adhesive layer may be provided on the surface of the adhesive layer or on the surface of the protective film, and in any case, the adhesive layer and the protective film can be attached via the pressure-sensitive adhesive layer.
  • the step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C. Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than the Tg of the resin contained in the adhesive layer. If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost. Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than the Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
  • the method for producing a shielded printed wiring board of the present invention comprises a step of preparing the electromagnetic wave shielding film of the present invention, A step of peeling the protective portion from the electromagnetic wave shielding film, Bonding the shield film portion to the printed wiring board by bringing the adhesive layer exposed by peeling off the protection portion into contact with the printed wiring board, and adhering the shield film portion to the printed wiring board.
  • the adhesive layer of the shield film portion can be protected by the protective portion until just before it is brought into contact with the printed wiring board. Therefore, problems such as contamination entering the adhesive layer are prevented, and the reliability of the shield printed wiring board can be improved. Further, since the protective portion can be easily peeled off, workability is also good.
  • the adhesive layer contains a thermosetting resin, It is preferable that the adhesive layer is brought into contact with the printed wiring board, and then heat is applied to cure the thermosetting resin to bond the shield film portion and the printed wiring board.
  • thermosetting resin of the adhesive layer is cured at the time of bonding with the printed wiring board, the shield film portion and the printed wiring board are firmly bonded, and the shield printed wiring board with high reliability is provided. can do.
  • the adhesive force of the adhesive layer can be used to bond the adhesive layer of the shield film portion and the protective film together.
  • the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • FIG. 1 is a cross-sectional view schematically showing an example of a cross section of the electromagnetic wave shielding film according to the first embodiment of the present invention.
  • FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D are process diagrams schematically showing an example of the method for producing an electromagnetic wave shield film of the present invention.
  • FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D are process diagrams schematically showing another example of the method for producing an electromagnetic wave shielding film of the present invention.
  • 4A, 4B, and 4C are process diagrams schematically showing an example of the method for manufacturing a shielded printed wiring board of the present invention.
  • FIG. 5: is sectional drawing which shows typically an example of the cross section of the electromagnetic wave shielding film which concerns on 2nd Embodiment of this invention.
  • the electromagnetic wave shielding film the method of manufacturing the electromagnetic wave shielding film and the method of manufacturing the shield printed wiring board of the present invention will be specifically described.
  • the present invention is not limited to the following embodiments, and can be appropriately modified and applied without departing from the scope of the present invention.
  • the adhesive layer of the shield film portion and the protective film can be bonded by utilizing the adhesive force of the pressure-sensitive adhesive layer.
  • the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • the electromagnetic wave shield film according to the first embodiment of the present invention includes three layers, the shield film portion being an adhesive layer, a shield layer laminated on the adhesive layer, and an insulating layer laminated on the shield layer.
  • FIG. 1 is a cross-sectional view schematically showing an example of a cross section of the electromagnetic wave shielding film according to the first embodiment of the present invention.
  • the electromagnetic wave shield film 1 includes a shield film portion 10 and a protection portion 20.
  • the shield film portion 10 includes an adhesive layer 11, a shield layer 12, and an insulating layer 13.
  • the protective section 20 includes a protective film 21 and an adhesive layer 22.
  • each component of the electromagnetic wave shielding film 1 will be described in detail.
  • the shield film portion 10 is a portion for exhibiting electromagnetic wave shielding properties.
  • the adhesive layer 11 is a layer for exerting an adhesive force to the printed wiring board when the electromagnetic wave shielding film is attached to the printed wiring board.
  • the adhesive layer is preferably a layer containing a thermosetting resin, which contains at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin. It is more preferably curable. When the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
  • the adhesive layer preferably contains a resin having a Tg of 0 to 100 ° C.
  • the Tg of the resin in the present specification is the glass transition point of the resin and can be measured as follows. First, with a differential scanning calorimeter (for example, Seiko Denshi Kogyo Co., Ltd., trade name "DSC220 type"), 5 mg of a measurement sample is put in an aluminum pan, and a lid is pressed to seal it. Next, the sample is completely melted by maintaining it at 220 ° C. for 5 minutes, then quenched with liquid nitrogen, and then heated from ⁇ 150 ° C. to 250 ° C. at a temperature rising rate of 20 ° C./min. Then, the obtained data is plotted on a coordinate where the horizontal axis is the temperature raising time and the vertical axis is the sample temperature, and a curve is drawn. The inflection point of the curve is defined as the glass transition point Tg.
  • the adhesive layer has a height c of 2 to 15 ⁇ m at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50%.
  • the arithmetic mean roughness Ra of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is preferably 0.7 to 1.2 ⁇ m. When the arithmetic average roughness Ra of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is less than 0.7 ⁇ m, the protective film can be attached, but the protective film is difficult to peel off.
  • the height c at which the load area ratio Smr (c) on the surface of the adhesive layer is 50% is a parameter of the three-dimensional surface texture defined by ISO 25718-6 (2010).
  • the arithmetic average roughness Ra of the surface of the adhesive layer is a surface roughness parameter defined by JIS B 0601 (2001).
  • the adhesive layer in the electromagnetic wave shielding film of the present invention is in a state where it has not been cured so as to exert an adhesive force with the printed wiring board, that is, an uncured state.
  • the gel fraction of the adhesive layer is measured and the gel fraction in the adhesive layer is 10 to 50% by mass, it can be said that the adhesive layer is in an uncured state, so that the gel fraction of the adhesive layer is 10%. It is preferably ⁇ 50% by mass, and more preferably the gel fraction of the adhesive layer is 10 ⁇ 30% by mass.
  • the "gel fraction" of the adhesive layer can be obtained as follows. A wire mesh of 100 mesh is cut into a width of 30 mm and a length of 100 mm, and the weight (W1) is measured. Then, the adhesive layer having a length of 10 mm and a length of 80 mm is wrapped with the above-mentioned wire mesh to form a test piece, and the weight (W2) is measured. The prepared test piece is immersed in THF (tetrahydrofuran), shaken at 25 ° C. for 1 hour, taken out from THF, dried at 150 ° C. for 10 minutes, and then the weight (W3) is measured. Using the following calculation formula [2], the weight fraction of the components remaining in the wire net without being dissolved is calculated as the gel fraction. (W3-W1) / (W2-W1) ⁇ 100 [%] [2]
  • a curing accelerator if necessary, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity adjusting agent. Agents and the like may be included.
  • the adhesive layer is an adhesive layer having conductivity (hereinafter, also referred to as a conductive adhesive layer).
  • a conductive adhesive layer the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave shielding film and the external ground.
  • the conductive adhesive layer may be composed of conductive particles and a resin. As the resin, the above resins can be used.
  • the conductive particles are not particularly limited, but may be fine metal particles, carbon nanotubes, carbon fibers, metal fibers and the like.
  • the fine metal particles are not particularly limited, but include silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by silver-plating copper powder, and polymer particles. Fine particles obtained by coating glass beads or the like with a metal may also be used. Among these, from the viewpoint of economy, it is desirable to use copper powder or silver-coated copper powder that can be obtained at low cost.
  • the shape of the conductive particles is not particularly limited, but can be appropriately selected from spherical, flat, flaky, dendrite, rod-like, fibrous and the like.
  • the conductive adhesive layer may have anisotropic conductivity or isotropic conductivity.
  • the shield layer 12 is a layer having conductivity and is preferably made of metal.
  • the shield layer may include a layer made of a material such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, or zinc, and preferably includes a copper layer. Copper is a suitable material for the shield layer in terms of conductivity and economy.
  • the shield layer may include a layer made of an alloy of the above metals. Further, a metal foil may be used as the shield layer, or a metal film formed by a method such as sputtering, electroless plating or electrolytic plating may be used.
  • the shield layer may be a conductive adhesive layer.
  • the adhesive layer may be an insulating adhesive layer, and the adhesive layer may be a conductive adhesive layer.
  • both the shield layer and the adhesive layer are conductive adhesive layers, their compositions may be the same or different.
  • the insulating layer 13 has sufficient insulating properties and is not particularly limited as long as it can protect the adhesive layer 11 and the shield layer 12, but examples thereof include a thermoplastic resin composition, a thermosetting resin composition, and an active energy ray curable composition. It is desirable to be composed of etc.
  • the thermoplastic resin composition is not particularly limited, but is a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition. , Acrylic resin compositions and the like.
  • thermosetting resin composition is not particularly limited, but an epoxy resin composition, a urethane resin composition, a urethane urea resin composition, a styrene resin composition, a phenol resin composition, a melamine resin composition. And at least one resin composition selected from the group consisting of acrylic resin compositions and alkyd resin compositions.
  • the active energy ray-curable composition is not particularly limited, and examples thereof include a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule.
  • the insulating layer may be composed of one material alone or may be composed of two or more materials.
  • a curing accelerator if necessary, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier. , An anti-blocking agent, etc. may be contained.
  • the thickness of the insulating layer is not particularly limited and may be appropriately set as necessary, but is preferably 1 to 15 ⁇ m, more preferably 3 to 10 ⁇ m. If the thickness of the insulating layer is less than 1 ⁇ m, the adhesive layer and the shield layer cannot be sufficiently protected because they are too thin. If the thickness of the insulating layer exceeds 15 ⁇ m, the electromagnetic wave shielding film is difficult to bend because the thickness is too thick, and the insulating layer itself is easily damaged. Therefore, it becomes difficult to apply it to a member that requires bending resistance.
  • an anchor coat layer may be formed between the shield layer and the insulating layer.
  • the material of the anchor coat layer is urethane resin, acrylic resin, core-shell type composite resin having urethane resin as shell and acrylic resin as core, epoxy resin, imide resin, amide resin, melamine resin, phenol resin, urea formaldehyde resin Blocked isocyanates obtained by reacting polyisocyanate with a blocking agent such as phenol, polyvinyl alcohol, polyvinyl pyrrolidone, and the like.
  • the protective part 20 includes a protective film 21 and a pressure-sensitive adhesive layer 22, and is a part that is bonded to the adhesive layer in order to protect the adhesive layer of the electromagnetic wave shielding film during distribution.
  • a polyester film (PET film or the like), a polypropylene film (OPP film or the like), a PEN film, a PPS film, a polyimide film or the like can be used as the protective film 21 .
  • the thickness of the protective film is preferably 10 to 125 ⁇ m, more preferably 20 to 100 ⁇ m, even more preferably 50 to 100 ⁇ m.
  • the pressure-sensitive adhesive layer 22 is a layer for bonding the protective film to the adhesive layer of the shield film portion by the adhesive force of the pressure-sensitive adhesive layer. From the viewpoint of improving the workability of attaching the protective film, it is preferable that the pressure-sensitive adhesive layer has a pressure-sensitive adhesive property at around room temperature.
  • the pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
  • the pressure-sensitive adhesive layer preferably contains a resin having Tg of ⁇ 60 to 0 ° C. When the Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
  • the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of the resin constituting the pressure-sensitive adhesive layer of 0.1 to 0.5 MPa.
  • the storage elastic modulus of the resin can be measured by a dynamic viscoelasticity measuring device (rheometer).
  • the thickness of the pressure-sensitive adhesive layer is preferably 10 to 50 ⁇ m, more preferably 15 to 30 ⁇ m.
  • a transfer film may be provided on the surface of the insulating layer opposite to the surface on which the shield layer is laminated (the exposed surface above the insulating layer 13 in FIG. 1).
  • the transfer film is a film that serves as a base when laminating each layer constituting the electromagnetic wave shielding film in the method for producing an electromagnetic wave shielding film of the present invention described later (see FIGS. 2A, 2B, 2C and 2D).
  • the transfer film polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, hard polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile , Polybutene, soft polyvinyl chloride, polyethylene, polypropylene, polyurethane, ethylene vinyl acetate copolymer, plastic sheets such as polyvinyl acetate, glassine paper, high-quality paper, kraft paper, coated paper, and other non-woven fabrics, Examples include synthetic papers, metal foils, and composite films combining these.
  • the transfer film may be a film having a release treatment on one side or both sides, and as a release treatment method, a method of applying a release agent on one side or both sides of the film or physically matting treatment is used. Can be mentioned.
  • a pressure-sensitive adhesive layer for a transfer film may be provided between the transfer film and the insulating layer.
  • the transfer film is in a state of being stuck by the transfer film pressure-sensitive adhesive layer.
  • the transfer film needs to be easily peelable from the electromagnetic wave shielding film when the electromagnetic wave shielding film is used, and the pressure-sensitive adhesive layer for the transfer film is preferably left on the transfer film side when the transfer film is peeled.
  • the same material as the pressure-sensitive adhesive layer used in the protective part can be used.
  • the pressure-sensitive adhesive layer in the protective part and the pressure-sensitive adhesive layer for the transfer film may be the same material or different materials.
  • the electromagnetic wave shielding film of the present invention is not limited to the one manufactured by the method described below.
  • FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D are process diagrams schematically showing an example of the method for producing an electromagnetic wave shield film of the present invention.
  • a transfer film is prepared as shown in FIG. 2A.
  • FIG. 2A shows an example in which a transfer film 30 provided with a transfer film adhesive layer 31 is used as the transfer film.
  • the insulating layer 13, the shield layer 12, and the adhesive layer 11 are sequentially formed on the transfer film to produce the shield film unit 10.
  • the insulating layer can be formed by applying the resin composition forming the insulating layer.
  • the shield layer can be formed by pasting the metal foil, and when the shield layer is a metal film, a film forming method such as sputtering, electroless plating or electrolytic plating. Can be done by. If a resin-coated copper foil is used, the insulating layer and the shield layer can be formed at the same time.
  • the adhesive layer can be formed by applying an adhesive layer composition containing a material forming the adhesive layer.
  • a coating method a conventionally known coating method, for example, a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade coating method, a roll coating method, a knife coating method, a spray coating method, a bar coating method. , A spin coating method, a dip coating method and the like.
  • the surface state of the adhesive layer is adjusted by performing an appropriate treatment to adjust the height c at which the surface load area ratio Smr (c) becomes 50%. Is 2 to 15 ⁇ m.
  • the surface condition of the adhesive layer can be controlled by changing the concentration of the resin component in the adhesive layer composition.
  • the surface condition of the adhesive layer can be controlled by changing the thickness of the adhesive layer.
  • the surface state of the adhesive layer can be controlled by changing the average particle diameter of the conductive particles and the compounding amount of the conductive particles.
  • the surface state of the adhesive layer can be controlled by using insulating particles (silica or resin particles) or the like instead of the conductive particles and changing the average particle diameter and the compounding amount of these particles. ..
  • FIG. 2C shows a protective film 21 to be the protective portion 20.
  • FIG. 2C shows a protective portion in which the pressure-sensitive adhesive layer 22 is formed on the surface of the protective film 21.
  • the pressure-sensitive adhesive layer 22 can be formed on the surface of the protective film 21 by applying a composition containing a resin forming the pressure-sensitive adhesive layer by the known coating method described above as a method for forming the adhesive layer. ..
  • a composition containing a resin having a storage elastic modulus of 0.1 to 0.5 MPa is used as the adhesive layer.
  • the pressure-sensitive adhesive layer 22 is directed toward the adhesive layer 11, and the protective film 21 is attached via the pressure-sensitive adhesive layer 22.
  • the electromagnetic wave shield film 1 formed on the transfer film 30 can be manufactured.
  • the step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C. Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than Tg of the resin contained in the adhesive layer. If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost. Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer which is in contact with the adhesive layer is 50% is 2 to 15 ⁇ m, and the resin forming the adhesive layer is Since the storage elastic modulus of is 0.1 to 0.5 MPa, the protective film can be attached at room temperature. Further, the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • the production method including the step of forming a pressure-sensitive adhesive layer on the surface of the protective film and bonding the protective film to the adhesive layer has been described. May be provided on the surface of the adhesive layer. The method will be described below.
  • FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D are process diagrams schematically showing another example of the method for producing an electromagnetic wave shielding film of the present invention.
  • a transfer film 30 provided with a transfer film pressure-sensitive adhesive layer 31 is prepared. This is the same as shown in FIG. 2A.
  • the insulating layer 13, the shield layer 12, and the adhesive layer 11 are sequentially formed on the transfer film to produce the shield film unit 10. Up to this point, the process is the same as that shown in FIG. 2B. Then, after the shield film portion 10 is manufactured, the adhesive layer 22 is formed on the surface of the adhesive layer 11.
  • the pressure-sensitive adhesive layer 22 is formed on the surface of the adhesive layer 11 by applying a composition containing a resin forming the pressure-sensitive adhesive layer by the known coating method described above as a method for forming the adhesive layer. it can.
  • the protective film 21 is prepared as shown in FIG. 3C. No adhesive layer is provided on the protective film 21.
  • the protective film 21 is attached to the adhesive layer 22 to form the protective portion 20.
  • the electromagnetic wave shield film 1 formed on the transfer film 30 can be manufactured.
  • FIG. 4A, 4B, and 4C are process diagrams schematically showing an example of the method for manufacturing a shielded printed wiring board of the present invention.
  • FIG. 4A shows the electromagnetic wave shielding film 1 of the present invention.
  • the protection part 20 is peeled off from the electromagnetic wave shield film 1.
  • the height c at which the load area ratio Smr (c) of the surface of the adhesive layer which is in contact with the adhesive layer is 50% is 2 to 15 ⁇ m, and the resin forming the adhesive layer is Since the storage elastic modulus of is 0.1 to 0.5 MPa, the protective portion including the protective film can be easily peeled from the adhesive layer.
  • FIG. 4B shows the electromagnetic wave shield film from which the protective portion is peeled off, that is, the shield film portion 10.
  • a printed wiring board 40 is shown as an example of the printed wiring board to which the electromagnetic wave shielding film is attached.
  • the printed wiring board 40 includes a base film 41, a printed circuit 42 formed on the base film 41, and a cover lay 43 formed so as to cover the printed circuit 42.
  • the materials of the base film 41 and the cover lay 43 that form the printed wiring board 40 are not particularly limited, but are preferably made of engineering plastic.
  • engineering plastics include resins such as polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, and polyphenylene sulfide.
  • a polyphenylene sulfide film is preferable when flame retardancy is required, and a polyimide film is preferable when heat resistance is required.
  • the thickness of the base film 41 is preferably 10 to 40 ⁇ m.
  • the coverlay 43 preferably has a thickness of 10 to 30 ⁇ m.
  • the printed circuit 42 constituting the printed wiring board 40 is not particularly limited, but can be formed by etching a conductive material or the like.
  • the conductive material include copper, nickel, silver, gold and the like.
  • the shielded printed wiring board 50 as shown in FIG. 4C is obtained by bringing the adhesive layer 11 exposed by peeling of the protective portion into contact with the printed wiring board 40 and adhering the shielded film portion 10 to the printed wiring board 40. Is obtained.
  • the adhesive layer contains a thermosetting resin
  • a shielded printed wiring board can be manufactured using the electromagnetic wave shielding film of the present invention.
  • the shield film part includes two layers of an adhesive layer which functions as a shield layer and has conductivity, and an insulating layer laminated on the adhesive layer. There is.
  • the configuration other than the shield film part is the same as the electromagnetic wave shield film according to the first embodiment of the present invention.
  • FIG. 5 is sectional drawing which shows typically an example of the cross section of the electromagnetic wave shielding film which concerns on 2nd Embodiment of this invention.
  • the electromagnetic wave shield film 101 includes a shield film portion 110 and a protection portion 120.
  • the shield film part 110 includes an adhesive layer 111 having conductivity and an insulating layer 113.
  • the protective part 120 includes a protective film 121 and an adhesive layer 122.
  • the conductive adhesive layer 111 exerts an adhesive force to the printed wiring board when the electromagnetic wave shielding film is attached to the printed wiring board. It is a layer for making it. Further, since it has conductivity, it functions as a shield layer for exhibiting electromagnetic wave shielding properties.
  • the configuration of the conductive adhesive layer the configuration described as the configuration of the conductive adhesive layer in the description of the adhesive layer of the electromagnetic wave shielding film according to the first embodiment of the present invention can be used.
  • the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 ⁇ m, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
  • the configurations of the insulating layer 113, the protective film 121, and the adhesive layer 122 As the configurations of the insulating layer 113, the protective film 121, and the adhesive layer 122, the configurations described as the configurations of the insulating layer 13, the protective film 21, and the adhesive layer 22 in the electromagnetic wave shielding film according to the first embodiment of the present invention are used. be able to. Further, similarly to the electromagnetic wave shielding film according to the first embodiment of the present invention, a transfer film may be provided on the surface of the insulating layer opposite to the surface on which the adhesive layer is laminated. The structure of the transfer film can be the same as that of the electromagnetic wave shielding film according to the first embodiment of the present invention.
  • the electromagnetic wave shielding film according to the second exemplary embodiment of the present invention is the electromagnetic wave shielding film manufacturing method according to the first exemplary embodiment of the present invention, in which an insulating layer and a conductive adhesive layer are sequentially formed on the transfer film. It can be manufactured by manufacturing the shield film part.
  • an adhesive layer composition containing conductive particles and a resin may be used so that the adhesive layer becomes a conductive adhesive layer.
  • the other steps are the same as the method for producing the electromagnetic wave shielding film according to the first embodiment of the present invention except that the shield layer is not formed, thereby producing the electromagnetic wave shielding film according to the second embodiment of the present invention. You can
  • the electromagnetic wave shielding film according to the second embodiment of the present invention can also be used for manufacturing a shielded printed wiring board in the same manner as when using the electromagnetic wave shielding film according to the first embodiment of the present invention. That is, from the electromagnetic wave shielding film according to the second embodiment of the present invention, the protective portion is peeled off to expose the adhesive layer, and the adhesive layer is brought into contact with the printed wiring board to contact the shield film portion with the printed wiring board.
  • a shield printed wiring board can be manufactured by bonding.
  • Example 1 First, as a transfer film, a polyethylene terephthalate film having a release treatment on one surface was prepared. Next, an epoxy resin was applied to the release-treated surface of the transfer film and heated at 100 ° C. for 2 minutes using an electric oven to form an insulating layer having a thickness of 5 ⁇ m. Then, a copper layer of 2 ⁇ m was formed on the insulating layer by electroless plating. The copper layer becomes a shield layer.
  • the load area ratio and arithmetic mean roughness of the surface of the adhesive layer were measured at any 5 points on the surface of the insulating layer of the electromagnetic wave shielding film.
  • the inclination of the surface was corrected using the data analysis software (LMeye7), and the surface property was measured according to ISO 25178-6: 2010, and the arithmetic mean thereof was obtained.
  • the cutoff wavelength of the S filter was 0.0025 mm, and the cutoff wavelength of the L filter was 0.8 mm.
  • the height c at which the load area ratio Smr (c) was 50% was 8.26 ⁇ m.
  • a polyethylene terephthalate film having a thickness of 100 ⁇ m was prepared as a protective film.
  • An acrylic pressure-sensitive adhesive having a storage elastic modulus at 20 ° C. of 0.232 MPa pressure-sensitive adhesive A-1: Tg ⁇ 20 ° C. was applied to the protective film to form a pressure-sensitive adhesive layer.
  • the protective film was laminated with the pressure-sensitive adhesive layer facing the adhesive layer, and the protective film was laminated using a hot roll laminator at a temperature of 40 ° C. and a pressure of 0.4 MPa.
  • An electromagnetic wave shielding film was manufactured by the above process.
  • Example 2 to 14 Materials of protective film, material of pressure-sensitive adhesive used for pressure-sensitive adhesive layer, average particle diameter of conductive particles (silver-coated copper powder) contained in composition for adhesive layer, compounding amount of conductive particles, for adhesive layer
  • the target coating thickness of the composition was changed as shown in Table 1 to produce an electromagnetic wave shielding film.
  • the materials of the adhesive used are as follows.
  • Adhesive A-1 Acrylic adhesive, storage elastic modulus 0.232 MPa, Tg ⁇ 20 ° C.
  • Adhesive A-2 Acrylic adhesive, storage elastic modulus 0.187 MPa, Tg ⁇ 20 ° C.
  • Adhesive A-3 Acrylic adhesive, storage elastic modulus 0.411 MPa, Tg -25 ° C
  • Adhesive B-1 Acrylic adhesive, storage elastic modulus 0.081 MPa, Tg ⁇ 40 ° C.
  • Adhesive B-2 Acrylic adhesive, storage elastic modulus 2.520 MPa, Tg ⁇ 5 ° C.
  • the material of the protective film used is as follows. PET: Polyethylene terephthalate film (thickness 100 ⁇ m) OPP: Biaxially oriented polypropylene film (thickness 100 ⁇ m)
  • Electromagnetic wave shield film 10 110 Shield film part 11, 111 Adhesive layer 12 Shield layer 13, 113 Insulating layer 20, 120 Protective part 21, 121 Protective film 22, 122 Adhesive layer 30 Transfer film 31 Transfer film adhesive Agent layer 40 Printed wiring board 41 Base film 42 Printed circuit 43 Coverlay 50 Shield printed wiring board

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprising a protective film and a pressure-sensitive-adhesive layer; the electromagnetic shielding film being characterized in that the pressure-sensitive-adhesive layer of the protective part is bonded to the adhesive layer of the shielding film part, the height c at which the load area ratio Smr(c) of the surface of the adhesive layer in contact with the pressure-sensitive-adhesive layer is 50% is 2-15 µm, and the storage modulus at 20°C of a resin constituting the pressure-sensitive-adhesive layer is 0.1-0.5 MPa.

Description

電磁波シールドフィルム、電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法Electromagnetic wave shield film, method for producing electromagnetic wave shield film, and method for producing shielded printed wiring board
本発明は、電磁波シールドフィルム、電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法に関する。 The present invention relates to an electromagnetic wave shielding film, a method for manufacturing an electromagnetic wave shielding film, and a method for manufacturing a shield printed wiring board.
フレキシブルプリント配線板は、小型化、高機能化が急速に進む携帯電話、ビデオカメラ、ノートパソコンなどの電子機器において、複雑な機構の中に回路を組み込むために多用されている。さらに、その優れた可撓性を生かして、プリンタヘッドのような可動部と制御部との接続にも利用されている。これらの電子機器では、電磁波シールド対策が必須となっており、装置内で使用されるフレキシブルプリント配線板においても、電磁波シールド対策を施したフレキシブルプリント配線板（以下、「シールドプリント配線板」とも記載する）が用いられるようになってきた。 Flexible printed wiring boards are widely used in electronic devices such as mobile phones, video cameras, and notebook computers, which are rapidly becoming smaller and more sophisticated, in order to incorporate a circuit into a complicated mechanism. Further, by taking advantage of its excellent flexibility, it is also used for connecting a movable part such as a printer head and a control part. Electromagnetic wave shielding measures are essential for these electronic devices, and flexible printed wiring boards used in the equipment also have flexible printed wiring boards with electromagnetic wave shielding measures (hereinafter also referred to as “shield printed wiring boards”). Has been used.
一般的なシールドプリント配線板は、通常、ベースフィルム上にプリント回路と絶縁フィルムを順次設けてなるプリント配線板と、接着剤層、接着剤層に積層されたシールド層、及び、シールド層に積層された絶縁層からなる電磁波シールドフィルムから構成される。
電磁波シールドフィルムは、接着剤層がプリント配線板と接するようにプリント配線板に積層され、接着剤層がプリント配線板と接着されることによりシールドプリント配線板が得られる。 A general shielded printed wiring board is usually a printed wiring board in which a printed circuit and an insulating film are sequentially provided on a base film, an adhesive layer, a shield layer laminated on the adhesive layer, and a laminated layer on the shield layer. It is composed of an electromagnetic wave shielding film composed of the insulating layer.
The electromagnetic wave shielding film is laminated on the printed wiring board so that the adhesive layer contacts the printed wiring board, and the adhesive layer is bonded to the printed wiring board to obtain a shielded printed wiring board.
電磁波シールドフィルムをプリント配線板に接着する前には電磁波シールドフィルムそれ自体を流通させることがあるが、流通時に電磁波シールドフィルムの接着剤層を保護するために接着剤層に保護フィルムを貼り合わせた構成とすることがある。
特許文献１には、このような、接着剤層上に保護フィルム（剥離性シート）を備えた電磁波シールドフィルムの一例が記載されている。 Before adhering the electromagnetic wave shielding film to the printed wiring board, the electromagnetic wave shielding film itself may be distributed, but a protective film was attached to the adhesive layer to protect the adhesive layer of the electromagnetic wave shielding film during distribution. May be configured.
Patent Document 1 describes an example of such an electromagnetic wave shielding film having a protective film (peelable sheet) on the adhesive layer.
特許第５８６１７９０号公報Japanese Patent No. 5861790
接着剤層が熱硬化性樹脂を含み、熱硬化性樹脂の熱硬化によりプリント配線板との接着力を発揮する性質の層であるような場合には、接着剤層は常温ではあまり接着性を有しない層となってしまい、保護フィルムを熱硬化性樹脂にそのまま貼り合わせることは難しい。
一方、保護フィルムと接着剤層とを重ねて熱ラミネートを行うことにより、熱硬化性樹脂の接着力を発揮させて保護フィルムと接着剤層を貼り合わせることは可能だが、このようにすると本来プリント配線板との接着力を発揮させるための熱硬化が先に進んでしまうので、プリント配線板と接着させた際の接着性が低下する。
また、保護フィルムと接着剤層の剥離が難しくなるという問題もある。 When the adhesive layer contains a thermosetting resin and has a property of exhibiting an adhesive force with the printed wiring board by thermosetting the thermosetting resin, the adhesive layer does not have much adhesiveness at room temperature. It becomes a layer that does not have it, and it is difficult to bond the protective film to the thermosetting resin as it is.
On the other hand, it is possible to bond the protective film and the adhesive layer by demonstrating the adhesive force of the thermosetting resin by laminating the protective film and the adhesive layer and then performing thermal lamination, but if this is done, the original print Since the heat curing for exerting the adhesive force with the wiring board progresses first, the adhesiveness at the time of being adhered with the printed wiring board deteriorates.
There is also a problem that it becomes difficult to separate the protective film and the adhesive layer.
以上の背景を踏まえ、本発明は、常温での貼り合わせが可能で、流通時には接着剤層から剥がれることがなく、使用時には接着剤層から剥がしやすい特性を有する保護フィルムを備えた電磁波シールドフィルムを提供することを目的とする。 Based on the above background, the present invention is capable of bonding at room temperature, does not peel off from the adhesive layer at the time of distribution, and an electromagnetic wave shielding film provided with a protective film having a property of being easily peeled off from the adhesive layer at the time of use. The purpose is to provide.
本発明者らは、接着剤層の接着力を利用する常温での貼り合わせでは保護フィルムと接着剤層との接着力が不足することから、保護フィルムと接着剤層の間に粘着剤層を設けておき粘着剤層の粘着力により接着剤層と保護フィルムとの貼り合わせを行うことについて検討した。
そして、接着剤層の表面状態と粘着剤層の特性を定めることにより、保護フィルムを常温で貼り合わせることができ、使用時に保護フィルムを接着剤層から剥がしやすくすることができることを見出し、本発明を完成させた。 The present inventors have found that the adhesive strength between the protective film and the adhesive layer is insufficient in the bonding at room temperature utilizing the adhesive strength of the adhesive layer, so that a pressure-sensitive adhesive layer is provided between the protective film and the adhesive layer. It was examined to bond the adhesive layer and the protective film with each other by using the adhesive force of the adhesive layer.
Then, by determining the surface state of the adhesive layer and the characteristics of the pressure-sensitive adhesive layer, the protective film can be attached at room temperature, and it was found that the protective film can be easily peeled from the adhesive layer during use, Was completed.
すなわち、本発明の電磁波シールドフィルムは、接着剤層と、上記接着剤層に積層されたシールド層と、上記シールド層に積層された絶縁層とを備えたシールドフィルム部と、
保護フィルムと、上記保護フィルムに積層された粘着剤層とからなる保護部と、を備えた電磁波シールドフィルムであって、
上記シールドフィルム部の上記接着剤層に上記保護部の上記粘着剤層が貼り合わされており、
上記接着剤層の、上記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
上記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする。 That is, the electromagnetic wave shielding film of the present invention, an adhesive layer, a shield film portion comprising a shield layer laminated on the adhesive layer, an insulating layer laminated on the shield layer,
A protective film, an electromagnetic wave shielding film comprising a protective portion comprising a pressure-sensitive adhesive layer laminated on the protective film,
The adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
The resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
保護部に粘着剤層を設けることにより、粘着剤層の粘着力を利用してシールドフィルム部の接着剤層と保護フィルムとの貼り合わせを行うことができる。
そして、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができ、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。
負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２μｍ未満であると、保護フィルムの貼り合わせはできるが、保護フィルムを剥がしにくくなる。また、負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが１５μｍを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。
粘着剤層を構成する樹脂の貯蔵弾性率が０．１ＭＰａ未満であると粘着剤層を構成する樹脂が接着剤層から剥がれにくくなる。また、粘着剤層を構成する樹脂の貯蔵弾性率が０．５ＭＰａを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。 By providing the pressure-sensitive adhesive layer on the protective portion, the adhesive layer of the shield film portion and the protective film can be bonded together by utilizing the adhesive force of the pressure-sensitive adhesive layer.
The height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
If the height c at which the load area ratio Smr (c) is 50% is less than 2 μm, the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 μm, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer.
When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. Further, when the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
本発明の電磁波シールドフィルムにおいて、上記接着剤層は、Ｔｇが０～１００℃である樹脂を含むことが好ましい。
接着剤層に含まれる樹脂のＴｇが上記範囲内であると、保護フィルムの貼り合わせ及び剥離がより容易になる。
接着剤層のＴｇが０℃未満であると粘着剤層が接着剤層から剥がれにくくなる。また、接着剤層のＴｇが１００℃を超えると粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなることがある。 In the electromagnetic wave shielding film of the present invention, the adhesive layer preferably contains a resin having Tg of 0 to 100 ° C.
When the Tg of the resin contained in the adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
When the Tg of the adhesive layer is less than 0 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 100 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film. ..
本発明の電磁波シールドフィルムにおいて、上記粘着剤層は、Ｔｇが－６０～０℃である樹脂を含むことが好ましい。
粘着剤層に含まれる樹脂のＴｇが上記範囲内であると、保護フィルムの貼り合わせ及び剥離がより容易になる。
粘着剤層のＴｇが－６０℃未満であると粘着剤層が接着剤層から剥がれにくくなる。また、粘着層のＴｇが０℃を超えると粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなることがある。 In the electromagnetic wave shielding film of the present invention, the pressure-sensitive adhesive layer preferably contains a resin having Tg of −60 to 0 ° C.
When the Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
When the Tg of the pressure-sensitive adhesive layer is less than −60 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 0 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film.
本発明の電磁波シールドフィルムにおいて、上記接着剤層は、ポリアミド樹脂、ポリウレタン樹脂、ポリウレタンウレア樹脂、ポリエステル樹脂、アクリル樹脂及びエポキシ樹脂からなる群から選択される少なくとも１種の樹脂を含み熱硬化性であることが好ましい。
接着剤層が上記樹脂を含み熱硬化性であると、耐熱性が良好である。 In the electromagnetic wave shielding film of the present invention, the adhesive layer contains a thermosetting resin containing at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin. Preferably.
When the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
本発明の電磁波シールドフィルムにおいて、上記粘着剤層は、天然ゴム、アクリル樹脂、ポリウレタン樹脂、シリコーン樹脂及びポリエステル樹脂からなる群から選択される少なくとも１種の樹脂を含むことが好ましい。
粘着剤層が上記樹脂を含むと、粘着性を発現する。 In the electromagnetic wave shielding film of the present invention, the pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
When the pressure-sensitive adhesive layer contains the above resin, the pressure-sensitive adhesive property is exhibited.
本発明の電磁波シールドフィルムでは、上記接着剤層が導電性を有する接着剤層であることが好ましい。
通常、プリント配線板の電子回路には、グランド回路も設けられる。本発明の電磁波シールドフィルムの接着剤層が、導電性を有する場合、電磁波シールドフィルムの接着剤層をグランド回路と接触させるように電磁波シールドフィルムをプリント配線板に配置することにより、これらが電気的に接続する。さらに、電磁波シールドフィルムの接着剤層と外部グランドとを電気的に接続させることにより、グランド回路と外部グランドとを電気的に接続させることができる。 In the electromagnetic wave shielding film of the present invention, the adhesive layer is preferably an electrically conductive adhesive layer.
Usually, a ground circuit is also provided in the electronic circuit of the printed wiring board. When the adhesive layer of the electromagnetic wave shielding film of the present invention has conductivity, by placing the electromagnetic wave shielding film on the printed wiring board so that the adhesive layer of the electromagnetic wave shielding film is brought into contact with the ground circuit, these are electrically connected. Connect to. Furthermore, by electrically connecting the adhesive layer of the electromagnetic wave shielding film and the external ground, the ground circuit and the external ground can be electrically connected.
本発明の電磁波シールドフィルムにおいて、上記絶縁層の上記シールド層が積層された面と反対側の面には、転写フィルムが設けられていることが好ましい。
転写フィルムが設けられていると電磁波シールドフィルムの流通時に絶縁層を保護することができる。 In the electromagnetic wave shield film of the present invention, it is preferable that a transfer film is provided on the surface of the insulating layer opposite to the surface on which the shield layer is laminated.
When the transfer film is provided, the insulating layer can be protected when the electromagnetic wave shielding film is distributed.
本発明の別の電磁波シールドフィルムは、シールド層として機能し、導電性を有する接着剤層と、上記接着剤層に積層された絶縁層とを備えたシールドフィルム部と、
保護フィルムと、上記保護フィルムに積層された粘着剤層とからなる保護部と、を備えた電磁波シールドフィルムであって、
上記シールドフィルム部の上記接着剤層に上記保護部の上記粘着剤層が貼り合わされており、
上記接着剤層の、上記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
上記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする。 Another electromagnetic wave shield film of the present invention functions as a shield layer, an adhesive layer having conductivity, and a shield film portion including an insulating layer laminated on the adhesive layer,
A protective film, an electromagnetic wave shielding film comprising a protective portion comprising a pressure-sensitive adhesive layer laminated on the protective film,
The adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
The resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
上記構成の電磁波シールドフィルムは、接着剤層が導電性を有しており、接着剤層がシールド層としても機能する。
このような接着剤層に対しても、保護部に粘着剤層を設けることにより、粘着剤層の粘着力を利用してシールドフィルム部の接着剤層と保護フィルムとの貼り合わせを行うことができる。
そして、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができ、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。
負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２μｍ未満であると、保護フィルムの貼り合わせはできるが、保護フィルムを剥がしにくくなる。また、負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが１５μｍを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。
粘着剤層を構成する樹脂の貯蔵弾性率が０．１ＭＰａ未満であると粘着剤層を構成する樹脂が剥がれにくくなる。また、粘着剤層を構成する樹脂の貯蔵弾性率が０．５ＭＰａを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。 In the electromagnetic wave shielding film having the above structure, the adhesive layer has conductivity, and the adhesive layer also functions as a shield layer.
Even for such an adhesive layer, by providing an adhesive layer on the protective part, it is possible to bond the adhesive layer of the shield film part and the protective film by using the adhesive force of the adhesive layer. it can.
The height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
If the height c at which the load area ratio Smr (c) is 50% is less than 2 μm, the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 μm, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer.
When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off. Further, when the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
本発明の別の電磁波シールドフィルムでは、上記接着剤層は、Ｔｇが０～１００℃である樹脂を含むことが好ましい。
接着剤層に含まれる樹脂のＴｇが上記範囲内であると、保護フィルムの貼り合わせ及び剥離がより容易になる。
接着剤層のＴｇが０℃未満であると粘着剤層が接着剤層から剥がれにくくなる。また、接着剤層のＴｇが１００℃を超えると粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなることがある。 In another electromagnetic wave shielding film of the present invention, the adhesive layer preferably contains a resin having Tg of 0 to 100 ° C.
When the Tg of the resin contained in the adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
When the Tg of the adhesive layer is less than 0 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 100 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film. ..
本発明の別の電磁波シールドフィルムでは、上記粘着剤層は、Ｔｇが－６０～０℃である樹脂を含むことが好ましい。
粘着剤層に含まれる樹脂のＴｇが上記範囲内であると、保護フィルムの貼り合わせ及び剥離がより容易になる。
粘着剤層のＴｇが－６０℃未満であると粘着剤層が接着剤層から剥がれにくくなる。また、粘着層のＴｇが０℃を超えると粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなることがある。 In another electromagnetic wave shielding film of the present invention, the pressure-sensitive adhesive layer preferably contains a resin having Tg of −60 to 0 ° C.
When the Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
When the Tg of the pressure-sensitive adhesive layer is less than −60 ° C., the pressure-sensitive adhesive layer is less likely to peel off from the adhesive layer. If the Tg of the adhesive layer exceeds 0 ° C., the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film may easily fall off from the adhesive layer when handling the electromagnetic wave shielding film.
本発明の別の電磁波シールドフィルムでは、上記接着剤層は、ポリアミド樹脂、ポリウレタン樹脂、ポリウレタンウレア樹脂、ポリエステル樹脂、アクリル樹脂及びエポキシ樹脂からなる群から選択される少なくとも１種の樹脂を含み熱硬化性であることが好ましい。
接着剤層が上記樹脂を含み熱硬化性であると、耐熱性が良好である。 In another electromagnetic wave shielding film of the present invention, the adhesive layer contains at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin, and is thermoset. It is preferably sex.
When the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
本発明の別の電磁波シールドフィルムでは、上記粘着剤層は、天然ゴム、アクリル樹脂、ポリウレタン樹脂、シリコーン樹脂及びポリエステル樹脂からなる群から選択される少なくとも１種の樹脂を含むことが好ましい。
粘着剤層が上記樹脂を含むと、粘着性を発現する。 In another electromagnetic wave shielding film of the present invention, the pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
When the pressure-sensitive adhesive layer contains the above resin, the pressure-sensitive adhesive property is exhibited.
本発明の別の電磁波シールドフィルムでは、上記絶縁層の上記接着剤層が積層された面と反対側の面には、転写フィルムが設けられていることが好ましい。
転写フィルムが設けられていると電磁波シールドフィルムの流通時に絶縁層を保護することができる。 In another electromagnetic wave shielding film of the present invention, it is preferable that a transfer film is provided on the surface of the insulating layer opposite to the surface on which the adhesive layer is laminated.
When the transfer film is provided, the insulating layer can be protected when the electromagnetic wave shielding film is distributed.
本発明の電磁波シールドフィルムの製造方法は、転写フィルムに絶縁層、シールド層、接着剤層を順次形成してシールドフィルム部を作製する工程と、
保護フィルムを、上記接着剤層に粘着剤層を介して貼り合わせる工程とを含む電磁波シールドフィルムの製造方法であって、
上記接着剤層の、上記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
上記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする。 The method for producing an electromagnetic wave shield film of the present invention comprises a step of producing a shield film portion by sequentially forming an insulating layer, a shield layer and an adhesive layer on a transfer film,
A method for producing an electromagnetic wave shield film, which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
The resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
シールドフィルム部の接着剤層と保護フィルムを粘着剤層を介して貼り合わせることによって、保護フィルムを備える電磁波シールドフィルムを製造することができる。
粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃと粘着剤層を構成する樹脂の貯蔵弾性率が好適な範囲に定められているので、貼り合わせにより保護フィルムが適度な接着強度で接着剤層の表面に設けられる。
また、電磁波シールドフィルムの使用時には保護フィルムを含む保護部を容易に接着剤層から剥離することができる。
負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２μｍ未満であると、保護フィルムの貼り合わせはできるが、保護フィルムを剥がしにくくなる。また、負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが１５μｍを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。
粘着剤層を構成する樹脂の貯蔵弾性率が０．１ＭＰａ未満であると粘着剤層を構成する樹脂が剥がれにくくなる。また、粘着剤層を構成する樹脂の貯蔵弾性率が０．５ＭＰａを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。 By adhering the adhesive layer of the shield film portion and the protective film via the pressure-sensitive adhesive layer, an electromagnetic wave shielding film including the protective film can be manufactured.
Since the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the adhesive layer is 50% and the storage elastic modulus of the resin constituting the adhesive layer are set in a suitable range. , The protective film is provided on the surface of the adhesive layer with appropriate adhesive strength by bonding.
Further, when the electromagnetic wave shielding film is used, the protective portion including the protective film can be easily peeled off from the adhesive layer.
If the height c at which the load area ratio Smr (c) is 50% is less than 2 μm, the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 μm, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer.
When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off. Further, when the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
本発明の電磁波シールドフィルムの製造方法において、上記接着剤層に上記保護フィルムを貼り合わせる工程は、
上記接着剤層の表面に上記粘着剤層を形成し、
上記粘着剤層に上記保護フィルムを貼り合わせることにより行うことが好ましい。
また、本発明の電磁波シールドフィルムの製造方法において、上記接着剤層に上記保護フィルムを貼り合わせる工程は、
上記保護フィルムの表面に上記粘着剤層を形成し、
上記粘着剤層を上記接着剤層に向けて上記保護フィルムを貼り合わせることにより行うことが好ましい。
粘着剤層は接着剤層の表面に設けても、保護フィルムの表面に設けてもよく、いずれの場合であっても接着剤層と保護フィルムを粘着剤層を介して貼り合わせることができる。 In the method for producing an electromagnetic wave shielding film of the present invention, the step of attaching the protective film to the adhesive layer,
Form the pressure-sensitive adhesive layer on the surface of the adhesive layer,
It is preferable that the protective film be attached to the pressure-sensitive adhesive layer.
Further, in the method for producing an electromagnetic wave shielding film of the present invention, the step of attaching the protective film to the adhesive layer,
Form the pressure-sensitive adhesive layer on the surface of the protective film,
It is preferable to carry out by adhering the protective film with the pressure-sensitive adhesive layer facing the adhesive layer.
The pressure-sensitive adhesive layer may be provided on the surface of the adhesive layer or on the surface of the protective film, and in any case, the adhesive layer and the protective film can be attached via the pressure-sensitive adhesive layer.
本発明の電磁波シールドフィルムの製造方法では、上記接着剤層に上記保護フィルムを貼り合わせる工程は、１０～６０℃で行うことが好ましい。
また、上記接着剤層に上記保護フィルムを貼り合わせる工程は、上記粘着剤層に含まれる樹脂のＴｇより高い温度で行うことが好ましい。
接着剤層に保護フィルムを貼り合わせる工程が１０～６０℃で行われると、常温付近での作業になるのでシールドフィルム部を構成する接着剤層が熱硬化性樹脂からなる場合に接着剤層の熱硬化が進まず、接着剤層の接着性が失われないために好ましい。
また、接着剤層に保護フィルムを貼り合わせる工程が粘着剤層に含まれる樹脂のＴｇより高い温度で行われると、粘着剤層による粘着力が良好に発揮されるために好ましい。 In the method for producing an electromagnetic wave shielding film of the present invention, the step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C.
Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than the Tg of the resin contained in the adhesive layer.
If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost.
Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than the Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
本発明の別の電磁波シールドフィルムの製造方法は、転写フィルムに絶縁層、導電性を有する接着剤層を順次形成してシールドフィルム部を作製する工程と、
保護フィルムを、上記接着剤層に粘着剤層を介して貼り合わせる工程とを含む電磁波シールドフィルムの製造方法であって、
上記接着剤層の、上記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
上記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする。 Another method for producing an electromagnetic wave shield film of the present invention is a step of producing a shield film portion by sequentially forming an insulating layer and a conductive adhesive layer on the transfer film,
A method for producing an electromagnetic wave shield film, which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
The resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
上記製造工程では、転写フィルムに絶縁層と導電性を有する接着剤層を形成することでシールドフィルム部を作製する。
このような構成のシールドフィルム部の接着剤層と保護フィルムを粘着剤層を介して貼り合わせることによっても、保護フィルムを備える電磁波シールドフィルムを製造することができる。
粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃと粘着剤層を構成する樹脂の貯蔵弾性率が好適な範囲に定められているので、貼り合わせにより保護フィルムが適度な接着強度で接着剤層の表面に設けられる。
また、電磁波シールドフィルムの使用時には保護フィルムを含む保護部を容易に接着剤層から剥離することができる。
負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２μｍ未満であると、保護フィルムの貼り合わせはできるが、保護フィルムを剥がしにくくなる。また、負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが１５μｍを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。
粘着剤層を構成する樹脂の貯蔵弾性率が０．１ＭＰａ未満であると粘着剤層を構成する樹脂が剥がれにくくなる。また、粘着剤層を構成する樹脂の貯蔵弾性率が０．５ＭＰａを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。 In the above manufacturing process, the shield film portion is produced by forming an insulating layer and an adhesive layer having conductivity on the transfer film.
The electromagnetic wave shield film including the protective film can also be manufactured by bonding the adhesive layer and the protective film of the shield film portion having such a configuration via the adhesive layer.
Since the height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the adhesive layer is 50% and the storage elastic modulus of the resin constituting the adhesive layer are set in a suitable range. , The protective film is provided on the surface of the adhesive layer with appropriate adhesive strength by bonding.
Further, when the electromagnetic wave shielding film is used, the protective portion including the protective film can be easily peeled off from the adhesive layer.
If the height c at which the load area ratio Smr (c) is 50% is less than 2 μm, the protective film can be attached, but the protective film is difficult to peel off. Further, when the height c at which the load area ratio Smr (c) becomes 50% exceeds 15 μm, the adhesiveness between the adhesive layer and the adhesive layer cannot be maintained, and the protective film adheres when handling the electromagnetic wave shielding film. It becomes easy to fall off from the agent layer.
When the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is less than 0.1 MPa, the resin forming the pressure-sensitive adhesive layer is less likely to peel off. Further, when the storage elastic modulus of the resin constituting the pressure-sensitive adhesive layer exceeds 0.5 MPa, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and the protective film becomes the adhesive layer when the electromagnetic wave shielding film is handled. It becomes easy to fall out of.
本発明の別の電磁波シールドフィルムの製造方法において、上記接着剤層に上記保護フィルムを貼り合わせる工程は、
上記接着剤層の表面に上記粘着剤層を形成し、
上記粘着剤層に上記保護フィルムを貼り合わせることにより行うことが好ましい。
また、本発明の別の電磁波シールドフィルムの製造方法において、上記接着剤層に上記保護フィルムを貼り合わせる工程は、
上記保護フィルムの表面に上記粘着剤層を形成し、
上記粘着剤層を上記接着剤層に向けて上記保護フィルムを貼り合わせることにより行うことが好ましい。
粘着剤層は接着剤層の表面に設けても、保護フィルムの表面に設けてもよく、いずれの場合であっても接着剤層と保護フィルムを粘着剤層を介して貼り合わせることができる。 In another method for producing an electromagnetic shielding film of the present invention, the step of attaching the protective film to the adhesive layer,
Form the pressure-sensitive adhesive layer on the surface of the adhesive layer,
It is preferable that the protective film be attached to the pressure-sensitive adhesive layer.
Further, in another method for producing an electromagnetic wave shielding film of the present invention, the step of attaching the protective film to the adhesive layer,
Form the pressure-sensitive adhesive layer on the surface of the protective film,
It is preferable to carry out by adhering the protective film with the pressure-sensitive adhesive layer facing the adhesive layer.
The pressure-sensitive adhesive layer may be provided on the surface of the adhesive layer or on the surface of the protective film, and in any case, the adhesive layer and the protective film can be attached via the pressure-sensitive adhesive layer.
本発明の別の電磁波シールドフィルムの製造方法において、上記接着剤層に上記保護フィルムを貼り合わせる工程は、１０～６０℃で行うことが好ましい。
また、上記接着剤層に上記保護フィルムを貼り合わせる工程は、上記粘着剤層に含まれる樹脂のＴｇより高い温度で行うことが好ましい。
接着剤層に保護フィルムを貼り合わせる工程が１０～６０℃で行われると、常温付近での作業になるのでシールドフィルム部を構成する接着剤層が熱硬化性樹脂からなる場合に接着剤層の熱硬化が進まず、接着剤層の接着性が失われないために好ましい。
また、接着剤層に保護フィルムを貼り合わせる工程が粘着剤層に含まれる樹脂のＴｇより高い温度で行われると、粘着剤層による粘着力が良好に発揮されるために好ましい。 In another method for producing an electromagnetic wave shielding film of the present invention, the step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C.
Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than the Tg of the resin contained in the adhesive layer.
If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost.
Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than the Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
本発明のシールドプリント配線板の製造方法は、本発明の電磁波シールドフィルムを準備する工程と、
上記電磁波シールドフィルムから保護部を剥離する工程と、
上記保護部の剥離によって露出した接着剤層をプリント配線板に向けて接触させて、シールドフィルム部をプリント配線板に接着する工程と、を含むことを特徴とする。 The method for producing a shielded printed wiring board of the present invention comprises a step of preparing the electromagnetic wave shielding film of the present invention,
A step of peeling the protective portion from the electromagnetic wave shielding film,
Bonding the shield film portion to the printed wiring board by bringing the adhesive layer exposed by peeling off the protection portion into contact with the printed wiring board, and adhering the shield film portion to the printed wiring board.
上記方法では、シールドフィルム部の接着剤層はプリント配線板に接触される直前まで保護部によって保護させておくことができる。そのため接着剤層にコンタミが侵入する等の不具合が防止され、シールドプリント配線板の信頼性を高めることができる。
また、保護部の剥離は容易に行うことができるので、作業性も良好である。 In the above method, the adhesive layer of the shield film portion can be protected by the protective portion until just before it is brought into contact with the printed wiring board. Therefore, problems such as contamination entering the adhesive layer are prevented, and the reliability of the shield printed wiring board can be improved.
Further, since the protective portion can be easily peeled off, workability is also good.
本発明のシールドプリント配線板の製造方法では、上記接着剤層が熱硬化性樹脂を含み、
上記接着剤層を上記プリント配線板に向けて接触させたのちに熱を加えて上記熱硬化性樹脂を硬化させて、上記シールドフィルム部と上記プリント配線板の接着を行うことが好ましい。 In the method for producing a shielded printed wiring board of the present invention, the adhesive layer contains a thermosetting resin,
It is preferable that the adhesive layer is brought into contact with the printed wiring board, and then heat is applied to cure the thermosetting resin to bond the shield film portion and the printed wiring board.
上記方法では、接着剤層の熱硬化性樹脂の硬化がプリント配線板との接着の際に行われるので、シールドフィルム部とプリント配線板が強固に接着し、信頼性の高いシールドプリント配線板とすることができる。 In the above method, since the thermosetting resin of the adhesive layer is cured at the time of bonding with the printed wiring board, the shield film portion and the printed wiring board are firmly bonded, and the shield printed wiring board with high reliability is provided. can do.
本発明の電磁波シールドフィルムでは、粘着剤層の粘着力を利用してシールドフィルム部の接着剤層と保護フィルムとの貼り合わせを行うことができる。
そして、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができ、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。 In the electromagnetic wave shielding film of the present invention, the adhesive force of the adhesive layer can be used to bond the adhesive layer of the shield film portion and the protective film together.
The height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
図１は、本発明の第１実施形態に係る電磁波シールドフィルムの断面の一例を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing an example of a cross section of the electromagnetic wave shielding film according to the first embodiment of the present invention. 図２Ａ、図２Ｂ、図２Ｃ及び図２Ｄは、本発明の電磁波シールドフィルムの製造方法の一例を模式的に示す工程図である。FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D are process diagrams schematically showing an example of the method for producing an electromagnetic wave shield film of the present invention. 図３Ａ、図３Ｂ、図３Ｃ及び図３Ｄは、本発明の電磁波シールドフィルムの製造方法の別の一例を模式的に示す工程図である。FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D are process diagrams schematically showing another example of the method for producing an electromagnetic wave shielding film of the present invention. 図４Ａ、図４Ｂ及び図４Ｃは、本発明のシールドプリント配線板の製造方法の一例を模式的に示す工程図である。4A, 4B, and 4C are process diagrams schematically showing an example of the method for manufacturing a shielded printed wiring board of the present invention. 図５は、本発明の第２実施形態に係る電磁波シールドフィルムの断面の一例を模式的に示す断面図である。FIG. 5: is sectional drawing which shows typically an example of the cross section of the electromagnetic wave shielding film which concerns on 2nd Embodiment of this invention.
以下、本発明の電磁波シールドフィルム、電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法について具体的に説明する。しかしながら、本発明は、以下の実施形態に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。 Hereinafter, the electromagnetic wave shielding film, the method of manufacturing the electromagnetic wave shielding film and the method of manufacturing the shield printed wiring board of the present invention will be specifically described. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied without departing from the scope of the present invention.
本発明の電磁波シールドフィルムは、保護フィルムに粘着剤層を設けることにより、粘着剤層の粘着力を利用してシールドフィルム部の接着剤層と保護フィルムとの貼り合わせを行うことができる。
そして、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができ、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。 In the electromagnetic wave shielding film of the present invention, by providing the pressure-sensitive adhesive layer on the protective film, the adhesive layer of the shield film portion and the protective film can be bonded by utilizing the adhesive force of the pressure-sensitive adhesive layer.
The height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
（第１実施形態）
本発明の第１実施形態に係る電磁波シールドフィルムは、シールドフィルム部が接着剤層と、接着剤層に積層されたシールド層と、シールド層に積層された絶縁層の３層を備えている。 (First embodiment)
The electromagnetic wave shield film according to the first embodiment of the present invention includes three layers, the shield film portion being an adhesive layer, a shield layer laminated on the adhesive layer, and an insulating layer laminated on the shield layer.
図１は、本発明の第１実施形態に係る電磁波シールドフィルムの断面の一例を模式的に示す断面図である。
図１に示すように、電磁波シールドフィルム１は、シールドフィルム部１０と保護部２０を備えている。
シールドフィルム部１０は、接着剤層１１、シールド層１２及び絶縁層１３を備えている。
保護部２０は、保護フィルム２１及び粘着剤層２２を備えている。
以下、電磁波シールドフィルム１の各構成について詳述する。 FIG. 1 is a cross-sectional view schematically showing an example of a cross section of the electromagnetic wave shielding film according to the first embodiment of the present invention.
As shown in FIG. 1, the electromagnetic wave shield film 1 includes a shield film portion 10 and a protection portion 20.
The shield film portion 10 includes an adhesive layer 11, a shield layer 12, and an insulating layer 13.
The protective section 20 includes a protective film 21 and an adhesive layer 22.
Hereinafter, each component of the electromagnetic wave shielding film 1 will be described in detail.
（シールドフィルム部）
シールドフィルム部１０は、電磁波シールド性を発揮させるための部分である。
接着剤層１１は、プリント配線板に電磁波シールドフィルムを貼り付ける際にプリント配線板に対する接着力を発揮させるための層である。
接着剤層は熱硬化性樹脂を含む層であることが好ましく、ポリアミド樹脂、ポリウレタン樹脂、ポリウレタンウレア樹脂、ポリエステル樹脂、アクリル樹脂及びエポキシ樹脂からなる群から選択される少なくとも１種の樹脂を含み熱硬化性であることがより好ましい。
接着剤層が上記樹脂を含み熱硬化性であると、耐熱性が良好である。 (Shield film part)
The shield film portion 10 is a portion for exhibiting electromagnetic wave shielding properties.
The adhesive layer 11 is a layer for exerting an adhesive force to the printed wiring board when the electromagnetic wave shielding film is attached to the printed wiring board.
The adhesive layer is preferably a layer containing a thermosetting resin, which contains at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin. It is more preferably curable.
When the adhesive layer contains the above resin and is thermosetting, the heat resistance is good.
接着剤層は、そのＴｇが０～１００℃である樹脂を含むことが好ましい。
本明細書における樹脂のＴｇは樹脂のガラス転移点であり、以下のようにして測定することができる。
まず、示差走査熱量分析計（例えば、セイコー電子工業株式会社製、商品名「ＤＳＣ２２０型」）にて、測定試料５ｍｇをアルミパンに入れ、蓋を押さえて密封する。次に、２２０℃で５分間維持して試料を完全に溶融させた後、液体窒素で急冷し、その後－１５０℃から２５０℃まで、２０℃／分の昇温速度で加熱する。そして、横軸を昇温時間、縦軸を試料の温度とした座標に得られたデータをプロットして曲線を描く。当該曲線の変曲点をガラス転移点Ｔｇとする。 The adhesive layer preferably contains a resin having a Tg of 0 to 100 ° C.
The Tg of the resin in the present specification is the glass transition point of the resin and can be measured as follows.
First, with a differential scanning calorimeter (for example, Seiko Denshi Kogyo Co., Ltd., trade name "DSC220 type"), 5 mg of a measurement sample is put in an aluminum pan, and a lid is pressed to seal it. Next, the sample is completely melted by maintaining it at 220 ° C. for 5 minutes, then quenched with liquid nitrogen, and then heated from −150 ° C. to 250 ° C. at a temperature rising rate of 20 ° C./min. Then, the obtained data is plotted on a coordinate where the horizontal axis is the temperature raising time and the vertical axis is the sample temperature, and a curve is drawn. The inflection point of the curve is defined as the glass transition point Tg.
接着剤層は、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍである。
また、粘着剤層と接する側の接着剤層の表面の算術平均粗さＲａが０．７～１．２μｍであることが好ましい。粘着剤層と接する側の接着剤層の表面の算術平均粗さＲａが０．７μｍ未満であると、保護フィルムの貼り合わせはできるが、保護フィルムを剥がしにくくなる。また、粘着剤層と接する側の接着剤層の表面の算術平均粗さＲａが１．２μｍを超えると、粘着剤層と接着剤層の密着性が保てなくなり、電磁波シールドフィルムを取扱う際に、保護フィルムが接着剤層から脱落し易くなる。
接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃは、ＩＳＯ　２５７１８－６（２０１０）で定められる３次元表面性状のパラメータである。また、接着剤層の表面の算術平均粗さＲａは、ＪＩＳ　Ｂ　０６０１（２００１）で定められる表面粗さパラメータである。
これらのパラメータは、コンフォーカル顕微鏡（Ｌａｓｅｒｔｅｃ社製、ＯＰＴＥＬＩＣＳ　ＨＹＢＲＩＤ）等の表面形状測定機に付随する解析ソフトウェアを用いて測定することができる。 The adhesive layer has a height c of 2 to 15 μm at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50%.
The arithmetic mean roughness Ra of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is preferably 0.7 to 1.2 μm. When the arithmetic average roughness Ra of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is less than 0.7 μm, the protective film can be attached, but the protective film is difficult to peel off. If the arithmetic mean roughness Ra of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer exceeds 1.2 μm, the adhesiveness between the pressure-sensitive adhesive layer and the adhesive layer cannot be maintained, and when handling the electromagnetic wave shielding film. The protective film easily comes off from the adhesive layer.
The height c at which the load area ratio Smr (c) on the surface of the adhesive layer is 50% is a parameter of the three-dimensional surface texture defined by ISO 25718-6 (2010). The arithmetic average roughness Ra of the surface of the adhesive layer is a surface roughness parameter defined by JIS B 0601 (2001).
These parameters can be measured using analysis software attached to a surface profiler such as a confocal microscope (Latertec, OPTELICS HYBRID).
本発明の電磁波シールドフィルムにおける接着剤層は、プリント配線板との接着力を発揮させるための硬化が進んでいない状態、すなわち未硬化状態であることが好ましい。
接着剤層のゲル分率を測定して接着剤層中のゲル分率が１０～５０質量％であれば接着剤層が未硬化状態であるといえるので、接着剤層のゲル分率が１０～５０質量％であることが好ましく、接着剤層のゲル分率が１０～３０質量％であることがより好ましい。 It is preferable that the adhesive layer in the electromagnetic wave shielding film of the present invention is in a state where it has not been cured so as to exert an adhesive force with the printed wiring board, that is, an uncured state.
When the gel fraction of the adhesive layer is measured and the gel fraction in the adhesive layer is 10 to 50% by mass, it can be said that the adhesive layer is in an uncured state, so that the gel fraction of the adhesive layer is 10%. It is preferably ˜50% by mass, and more preferably the gel fraction of the adhesive layer is 10˜30% by mass.
なお、接着剤層の「ゲル分率」とは以下のようにして求めることができる。
１００メッシュの金網を幅３０ｍｍ、長さ１００ｍｍに裁断し、重量（Ｗ１）を測定する。続いて、１０ｍｍ、長さ８０ｍｍの接着剤層を前述の金網で包み試験片とし、重量（Ｗ２）を測定する。作製した試験片をＴＨＦ（テトラヒドロフラン）中に侵漬させて、２５℃で１時間振とう後、試験片をＴＨＦから取り出し、１５０℃で１０分間乾燥したあと、重量（Ｗ３）を測定する。下記計算式[２]を用いて、溶解せずに金網に残った成分の重量分率をゲル分率として算出する。
　　　　　　（Ｗ３－Ｗ１）／（Ｗ２－Ｗ１）×１００　[％] [２] The "gel fraction" of the adhesive layer can be obtained as follows.
A wire mesh of 100 mesh is cut into a width of 30 mm and a length of 100 mm, and the weight (W1) is measured. Then, the adhesive layer having a length of 10 mm and a length of 80 mm is wrapped with the above-mentioned wire mesh to form a test piece, and the weight (W2) is measured. The prepared test piece is immersed in THF (tetrahydrofuran), shaken at 25 ° C. for 1 hour, taken out from THF, dried at 150 ° C. for 10 minutes, and then the weight (W3) is measured. Using the following calculation formula [2], the weight fraction of the components remaining in the wire net without being dissolved is calculated as the gel fraction.
(W3-W1) / (W2-W1) × 100 [%] [2]
接着剤層には、必要に応じて、硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、粘度調節剤等が含まれていてもよい。 In the adhesive layer, if necessary, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity adjusting agent. Agents and the like may be included.
また、接着剤層は、導電性を有する接着剤層（以下、導電性接着剤層ともいう）であることも好ましい。
接着剤層が導電性接着剤層であると、電磁波シールドフィルムの接着剤層と外部グランドとを電気的に接続させることにより、グランド回路と外部グランドとを電気的に接続させることができる。
接着剤層が導電性接着剤層である場合、導電性接着剤層は導電性粒子と樹脂から構成されていてもよい。
樹脂としては上記した樹脂を使用することができる。 It is also preferable that the adhesive layer is an adhesive layer having conductivity (hereinafter, also referred to as a conductive adhesive layer).
When the adhesive layer is a conductive adhesive layer, the ground circuit and the external ground can be electrically connected by electrically connecting the adhesive layer of the electromagnetic wave shielding film and the external ground.
When the adhesive layer is a conductive adhesive layer, the conductive adhesive layer may be composed of conductive particles and a resin.
As the resin, the above resins can be used.
導電性粒子としては、特に限定されないが、金属微粒子、カーボンナノチューブ、炭素繊維、金属繊維等であってもよい。 The conductive particles are not particularly limited, but may be fine metal particles, carbon nanotubes, carbon fibers, metal fibers and the like.
導電性粒子が金属微粒子である場合、金属微粒子としては、特に限定されないが、銀粉、銅粉、ニッケル粉、ハンダ粉、アルミニウム粉、銅粉に銀めっきを施した銀コート銅粉、高分子微粒子やガラスビーズ等を金属で被覆した微粒子等であってもよい。
これらの中では、経済性の観点から、安価に入手できる銅粉又は銀コート銅粉であることが望ましい。 When the conductive particles are fine metal particles, the fine metal particles are not particularly limited, but include silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by silver-plating copper powder, and polymer particles. Fine particles obtained by coating glass beads or the like with a metal may also be used.
Among these, from the viewpoint of economy, it is desirable to use copper powder or silver-coated copper powder that can be obtained at low cost.
導電性粒子の形状は、特に限定されないが、球状、扁平状、リン片状、デンドライト状、棒状、繊維状等から適宜選択することができる。
導電性接着剤層は、異方導電性を有していても、等方導電性を有していてもよい。 The shape of the conductive particles is not particularly limited, but can be appropriately selected from spherical, flat, flaky, dendrite, rod-like, fibrous and the like.
The conductive adhesive layer may have anisotropic conductivity or isotropic conductivity.
シールド層１２は、導電性を有する層であり、金属からなることが好ましい。
シールド層は、金、銀、銅、アルミニウム、ニッケル、スズ、パラジウム、クロム、チタン、亜鉛等の材料からなる層を含んでいてもよく、銅層を含むことが望ましい。
銅は、導電性及び経済性の観点からシールド層にとって好適な材料である。
なお、シールド層は、上記金属の合金からなる層を含んでいてもよい。
また、シールド層としては金属箔を用いてもよく、スパッタリングや無電解めっき、電解めっき等の方法で形成された金属膜であってもよい。 The shield layer 12 is a layer having conductivity and is preferably made of metal.
The shield layer may include a layer made of a material such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, or zinc, and preferably includes a copper layer.
Copper is a suitable material for the shield layer in terms of conductivity and economy.
The shield layer may include a layer made of an alloy of the above metals.
Further, a metal foil may be used as the shield layer, or a metal film formed by a method such as sputtering, electroless plating or electrolytic plating may be used.
また、シールド層が導電性接着剤層であってもよい。シールド層が導電性接着剤層である場合、接着剤層は絶縁性の接着剤層であってもよく、接着剤層も導電性接着剤層であってもよい。
シールド層及び接着剤層がいずれも導電性接着剤層である場合、その組成は同じであっても異なっていてもよい。 Further, the shield layer may be a conductive adhesive layer. When the shield layer is a conductive adhesive layer, the adhesive layer may be an insulating adhesive layer, and the adhesive layer may be a conductive adhesive layer.
When both the shield layer and the adhesive layer are conductive adhesive layers, their compositions may be the same or different.
絶縁層１３は充分な絶縁性を有し、接着剤層１１及びシールド層１２を保護できれば特に限定されないが、例えば、熱可塑性樹脂組成物、熱硬化性樹脂組成物、活性エネルギー線硬化性組成物等から構成されていることが望ましい。
上記熱可塑性樹脂組成物としては、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アクリル系樹脂組成物等が挙げられる。 The insulating layer 13 has sufficient insulating properties and is not particularly limited as long as it can protect the adhesive layer 11 and the shield layer 12, but examples thereof include a thermoplastic resin composition, a thermosetting resin composition, and an active energy ray curable composition. It is desirable to be composed of etc.
The thermoplastic resin composition is not particularly limited, but is a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition. , Acrylic resin compositions and the like.
上記熱硬化性樹脂組成物としては、特に限定されないが、エポキシ系樹脂組成物、ウレタン系樹脂組成物、ウレタンウレア系樹脂組成物、スチレン系樹脂組成物、フェノール系樹脂組成物、メラミン系樹脂組成物、アクリル系樹脂組成物及びアルキッド系樹脂組成物からなる群から選択される少なくとも１種の樹脂組成物が挙げられる。 The thermosetting resin composition is not particularly limited, but an epoxy resin composition, a urethane resin composition, a urethane urea resin composition, a styrene resin composition, a phenol resin composition, a melamine resin composition. And at least one resin composition selected from the group consisting of acrylic resin compositions and alkyd resin compositions.
上記活性エネルギー線硬化性組成物としては、特に限定されないが、例えば、分子中に少なくとも２個の（メタ）アクリロイルオキシ基を有する重合性化合物等が挙げられる。 The active energy ray-curable composition is not particularly limited, and examples thereof include a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule.
絶縁層は、１種単独の材料から構成されていてもよく、２種以上の材料から構成されていてもよい。 The insulating layer may be composed of one material alone or may be composed of two or more materials.
絶縁層には、必要に応じて、硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、粘度調節剤、ブロッキング防止剤等が含まれていてもよい。 In the insulating layer, if necessary, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier. , An anti-blocking agent, etc. may be contained.
絶縁層の厚さは、特に限定されず、必要に応じて適宜設定することができるが、１～１５μｍであることが望ましく、３～１０μｍであることがより望ましい。
絶縁層の厚さが１μｍ未満であると、薄すぎるので接着剤層及びシールド層を充分に保護しにくくなる。
絶縁層の厚さが１５μｍを超えると、厚すぎるので電磁波シールドフィルムが折り曲がりにくくなり、また、絶縁層自身が破損しやすくなる。そのため、耐折り曲げ性が要求される部材へ適用しにくくなる。 The thickness of the insulating layer is not particularly limited and may be appropriately set as necessary, but is preferably 1 to 15 μm, more preferably 3 to 10 μm.
If the thickness of the insulating layer is less than 1 μm, the adhesive layer and the shield layer cannot be sufficiently protected because they are too thin.
If the thickness of the insulating layer exceeds 15 μm, the electromagnetic wave shielding film is difficult to bend because the thickness is too thick, and the insulating layer itself is easily damaged. Therefore, it becomes difficult to apply it to a member that requires bending resistance.
シールドフィルム部においては、シールド層と絶縁層との間にアンカーコート層が形成されていてもよい。
アンカーコート層の材料としては、ウレタン樹脂、アクリル樹脂、ウレタン樹脂をシェルとしアクリル樹脂をコアとするコア・シェル型複合樹脂、エポキシ樹脂、イミド樹脂、アミド樹脂、メラミン樹脂、フェノール樹脂、尿素ホルムアルデヒド樹脂、ポリイソシアネートにフェノール等のブロック化剤を反応させて得られたブロックイソシアネート、ポリビニルアルコール、ポリビニルピロリドン等が挙げられる。 In the shield film part, an anchor coat layer may be formed between the shield layer and the insulating layer.
The material of the anchor coat layer is urethane resin, acrylic resin, core-shell type composite resin having urethane resin as shell and acrylic resin as core, epoxy resin, imide resin, amide resin, melamine resin, phenol resin, urea formaldehyde resin Blocked isocyanates obtained by reacting polyisocyanate with a blocking agent such as phenol, polyvinyl alcohol, polyvinyl pyrrolidone, and the like.
（保護部）
保護部２０は、保護フィルム２１及び粘着剤層２２を含み、流通時に電磁波シールドフィルムの接着剤層を保護するために接着剤層に貼り合わせられる部分である。
保護フィルム２１としては、ポリエステルフィルム（ＰＥＴフィルム等）、ポリプロピレンフィルム（ＯＰＰフィルム等）、ＰＥＮフィルム、ＰＰＳフィルム、ポリイミドフィルム等を使用することができる。
保護フィルムの厚さは１０～１２５μｍであることが好ましく、２０～１００μｍがより好ましく、５０～１００μｍがさらに好ましい。 (Protection part)
The protective part 20 includes a protective film 21 and a pressure-sensitive adhesive layer 22, and is a part that is bonded to the adhesive layer in order to protect the adhesive layer of the electromagnetic wave shielding film during distribution.
As the protective film 21, a polyester film (PET film or the like), a polypropylene film (OPP film or the like), a PEN film, a PPS film, a polyimide film or the like can be used.
The thickness of the protective film is preferably 10 to 125 μm, more preferably 20 to 100 μm, even more preferably 50 to 100 μm.
粘着剤層２２は、シールドフィルム部の接着剤層に対して粘着剤層の粘着力により保護フィルムを貼り合わせるための層である。
保護フィルムの貼り合わせの作業性を向上させる観点から、粘着剤層は常温付近で粘着性を有していることが好ましい。
粘着剤層は、天然ゴム、アクリル樹脂、ポリウレタン樹脂、シリコーン樹脂及びポリエステル樹脂からなる群から選択される少なくとも１種の樹脂を含むことが好ましい。
また、粘着剤層はＴｇが－６０～０℃である樹脂を含むことが好ましい。
粘着剤層に含まれる樹脂のＴｇが上記範囲内であると、保護フィルムの貼り合わせ及び剥離がより容易になる。 The pressure-sensitive adhesive layer 22 is a layer for bonding the protective film to the adhesive layer of the shield film portion by the adhesive force of the pressure-sensitive adhesive layer.
From the viewpoint of improving the workability of attaching the protective film, it is preferable that the pressure-sensitive adhesive layer has a pressure-sensitive adhesive property at around room temperature.
The pressure-sensitive adhesive layer preferably contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
The pressure-sensitive adhesive layer preferably contains a resin having Tg of −60 to 0 ° C.
When the Tg of the resin contained in the pressure-sensitive adhesive layer is within the above range, it becomes easier to attach and peel the protective film.
粘着剤層は、粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａである。
樹脂の貯蔵弾性率は、動的粘弾性測定装置（レオメーター）によって測定することができる。
また、粘着剤層の厚さは１０～５０μｍであることが好ましく、１５～３０μｍがより好ましい。 The pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of the resin constituting the pressure-sensitive adhesive layer of 0.1 to 0.5 MPa.
The storage elastic modulus of the resin can be measured by a dynamic viscoelasticity measuring device (rheometer).
The thickness of the pressure-sensitive adhesive layer is preferably 10 to 50 μm, more preferably 15 to 30 μm.
（転写フィルム）
本発明の電磁波シールドフィルムにおいて、絶縁層のシールド層が積層された面と反対側の面（図１における絶縁層１３の上側の露出面）には、転写フィルムが設けられていてもよい。
転写フィルムは、後述する本発明の電磁波シールドフィルムの製造方法において電磁波シールドフィルムを構成する各層を積層する際のベースとなるフィルムである（図２Ａ、図２Ｂ、図２Ｃ及び図２Ｄ参照）。 (Transfer film)
In the electromagnetic wave shielding film of the present invention, a transfer film may be provided on the surface of the insulating layer opposite to the surface on which the shield layer is laminated (the exposed surface above the insulating layer 13 in FIG. 1).
The transfer film is a film that serves as a base when laminating each layer constituting the electromagnetic wave shielding film in the method for producing an electromagnetic wave shielding film of the present invention described later (see FIGS. 2A, 2B, 2C and 2D).
転写フィルムとしては、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリフッ化ビニル、ポリフッ化ビニリデン、硬質ポリ塩化ビニル、ポリ塩化ビニリデン、ナイロン、ポリイミド、ポリスチレン、ポリビニルアルコール、エチレン・ビニルアルコール共重合体、ポリカーボネート、ポリアクリロニトリル、ポリブテン、軟質ポリ塩化ビニル、ポリエチレン、ポリプロピレン、ポリウレタン、エチレン酢酸ビニル共重合体、ポリ酢酸ビニル等のプラスチックシート等、グラシン紙、上質紙、クラフト紙、コート紙等の紙類、各種の不織布、合成紙、金属箔や、これらを組み合わせた複合フィルムなどが挙げられる。
転写フィルムは片面又は両面に離型処理をされたフィルムであってもよく、離型処理方法としては、離型剤をフィルムの片面又は両面に塗布したり、物理的にマット化処理する方法が挙げられる。 As the transfer film, polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, hard polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile , Polybutene, soft polyvinyl chloride, polyethylene, polypropylene, polyurethane, ethylene vinyl acetate copolymer, plastic sheets such as polyvinyl acetate, glassine paper, high-quality paper, kraft paper, coated paper, and other non-woven fabrics, Examples include synthetic papers, metal foils, and composite films combining these.
The transfer film may be a film having a release treatment on one side or both sides, and as a release treatment method, a method of applying a release agent on one side or both sides of the film or physically matting treatment is used. Can be mentioned.
転写フィルムと絶縁層の間には転写フィルム用粘着剤層が設けられていてもよい。この場合転写フィルムは転写フィルム用粘着剤層により貼り合わせられた状態となる。転写フィルムは電磁波シールドフィルムの使用時には電磁波シールドフィルムから容易に剥離することができる必要があり、転写フィルム用粘着剤層は転写フィルムの剥離時に転写フィルム側に残るようにすることが好ましい。 A pressure-sensitive adhesive layer for a transfer film may be provided between the transfer film and the insulating layer. In this case, the transfer film is in a state of being stuck by the transfer film pressure-sensitive adhesive layer. The transfer film needs to be easily peelable from the electromagnetic wave shielding film when the electromagnetic wave shielding film is used, and the pressure-sensitive adhesive layer for the transfer film is preferably left on the transfer film side when the transfer film is peeled.
転写フィルム用粘着剤層としては、保護部において使用する粘着剤層と同様の材料を使用することができる。電磁波シールドフィルムにおいて保護部における粘着剤層と転写フィルム用粘着剤層は同じ材料であってもよく、異なる材料であってもよい。 As the pressure-sensitive adhesive layer for the transfer film, the same material as the pressure-sensitive adhesive layer used in the protective part can be used. In the electromagnetic wave shielding film, the pressure-sensitive adhesive layer in the protective part and the pressure-sensitive adhesive layer for the transfer film may be the same material or different materials.
（電磁波シールドフィルムの製造方法）
次に、本発明の電磁波シールドフィルムの製造方法について説明する。なお、本発明の電磁波シールドフィルムは、以下に示す方法で製造されたものに限定されない。 (Method for manufacturing electromagnetic wave shielding film)
Next, a method for manufacturing the electromagnetic wave shielding film of the present invention will be described. The electromagnetic wave shielding film of the present invention is not limited to the one manufactured by the method described below.
図２Ａ、図２Ｂ、図２Ｃ及び図２Ｄは、本発明の電磁波シールドフィルムの製造方法の一例を模式的に示す工程図である。
まず、図２Ａに示すように転写フィルムを準備する。図２Ａには転写フィルムとして、転写フィルム３０に転写フィルム用粘着剤層３１が設けられたものを使用する例を示している。 FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D are process diagrams schematically showing an example of the method for producing an electromagnetic wave shield film of the present invention.
First, a transfer film is prepared as shown in FIG. 2A. FIG. 2A shows an example in which a transfer film 30 provided with a transfer film adhesive layer 31 is used as the transfer film.
続いて、図２Ｂに示すように転写フィルム上に絶縁層１３、シールド層１２、接着剤層１１を順次形成してシールドフィルム部１０を作製する。
絶縁層の形成は、絶縁層を構成する樹脂組成物を塗布することにより行うことができる。
シールド層の形成は、シールド層が金属箔である場合は、金属箔の貼り付けにより行うことができ、シールド層が金属膜である場合は、スパッタリングや無電解めっき、電解めっき等の製膜方法により行うことができる。
また、樹脂付き銅箔のようなものを使用すれば、絶縁層の形成とシールド層の形成を同時に行うこともできる。
接着剤層の形成は、接着剤層を構成する材料を含む接着剤層用組成物を塗布することにより行うことができる。塗布方式としては、従来公知のコーティング方法、例えば、グラビアコート方式、キスコート方式、ダイコート方式、リップコート方式、コンマコート方式、ブレードコート方式、ロールコート方式、ナイフコート方式、スプレーコート方式、バーコート方式、スピンコート方式、ディップコート方式等が挙げられる。 Subsequently, as shown in FIG. 2B, the insulating layer 13, the shield layer 12, and the adhesive layer 11 are sequentially formed on the transfer film to produce the shield film unit 10.
The insulating layer can be formed by applying the resin composition forming the insulating layer.
When the shield layer is a metal foil, the shield layer can be formed by pasting the metal foil, and when the shield layer is a metal film, a film forming method such as sputtering, electroless plating or electrolytic plating. Can be done by.
If a resin-coated copper foil is used, the insulating layer and the shield layer can be formed at the same time.
The adhesive layer can be formed by applying an adhesive layer composition containing a material forming the adhesive layer. As a coating method, a conventionally known coating method, for example, a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade coating method, a roll coating method, a knife coating method, a spray coating method, a bar coating method. , A spin coating method, a dip coating method and the like.
接着剤層を形成する際又は接着剤層の形成後に、適切な処理を行うことにより、接着剤層の表面状態を調整して表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍになるようにする。
例えば、接着剤層用組成物中の樹脂成分の濃度を変更することにより接着剤層の表面状態を制御することができる。
また、接着剤層の厚さを変更することによって接着剤層の表面状態を制御することができる。
また、導電性粒子を含む接着剤層とする場合、導電性粒子の平均粒子径、導電性粒子の配合量を変えることによって接着剤層の表面状態を制御することができる。
さらに、導電性粒子に代えて、絶縁性粒子（シリカや樹脂粒子）等を使用してこれらの粒子の平均粒子径、配合量を変えることによっても接着剤層の表面状態を制御することができる。 When the adhesive layer is formed or after the adhesive layer is formed, the surface state of the adhesive layer is adjusted by performing an appropriate treatment to adjust the height c at which the surface load area ratio Smr (c) becomes 50%. Is 2 to 15 μm.
For example, the surface condition of the adhesive layer can be controlled by changing the concentration of the resin component in the adhesive layer composition.
Further, the surface condition of the adhesive layer can be controlled by changing the thickness of the adhesive layer.
Further, when the adhesive layer contains conductive particles, the surface state of the adhesive layer can be controlled by changing the average particle diameter of the conductive particles and the compounding amount of the conductive particles.
Further, the surface state of the adhesive layer can be controlled by using insulating particles (silica or resin particles) or the like instead of the conductive particles and changing the average particle diameter and the compounding amount of these particles. ..
別途、図２Ｃに示すように保護部２０となる保護フィルム２１を準備する。図２Ｃには保護フィルム２１の表面に粘着剤層２２を形成した保護部を示している。
保護フィルム２１の表面への粘着剤層２２の形成は、接着剤層の形成方法として上記した公知の塗布方式により、粘着剤層を構成する樹脂を含む組成物を塗布することにより行うことができる。
また、粘着剤層としては粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａである樹脂を含む組成物を使用する。 Separately, as shown in FIG. 2C, a protective film 21 to be the protective portion 20 is prepared. FIG. 2C shows a protective portion in which the pressure-sensitive adhesive layer 22 is formed on the surface of the protective film 21.
The pressure-sensitive adhesive layer 22 can be formed on the surface of the protective film 21 by applying a composition containing a resin forming the pressure-sensitive adhesive layer by the known coating method described above as a method for forming the adhesive layer. ..
As the adhesive layer, a composition containing a resin having a storage elastic modulus of 0.1 to 0.5 MPa is used.
次に、図２Ｄに示すように、粘着剤層２２を接着剤層１１に向けて保護フィルム２１を粘着剤層２２を介して貼り合わせる。
上記工程により、転写フィルム３０上に形成された電磁波シールドフィルム１を製造することができる。 Next, as shown in FIG. 2D, the pressure-sensitive adhesive layer 22 is directed toward the adhesive layer 11, and the protective film 21 is attached via the pressure-sensitive adhesive layer 22.
Through the above steps, the electromagnetic wave shield film 1 formed on the transfer film 30 can be manufactured.
接着剤層に保護フィルムを貼り合わせる工程は、１０～６０℃で行うことが好ましい。
また、接着剤層に保護フィルムを貼り合わせる工程は、粘着剤層に含まれる樹脂のＴｇより高い温度で行うことが好ましい。
接着剤層に保護フィルムを貼り合わせる工程が１０～６０℃で行われると、常温付近での作業になるのでシールドフィルム部を構成する接着剤層が熱硬化性樹脂からなる場合に接着剤層の熱硬化が進まず、接着剤層の接着性が失われないために好ましい。
また、接着剤層に上記保護フィルムを貼り合わせる工程が粘着剤層に含まれる樹脂のＴｇより高い温度で行われると、粘着剤層による粘着力が良好に発揮されるために好ましい。 The step of attaching the protective film to the adhesive layer is preferably performed at 10 to 60 ° C.
Further, the step of attaching the protective film to the adhesive layer is preferably performed at a temperature higher than Tg of the resin contained in the adhesive layer.
If the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C., the operation is performed at around room temperature, so that when the adhesive layer forming the shield film part is made of a thermosetting resin, This is preferable because heat curing does not proceed and the adhesiveness of the adhesive layer is not lost.
Further, it is preferable that the step of attaching the protective film to the adhesive layer is performed at a temperature higher than Tg of the resin contained in the adhesive layer, because the adhesive force of the adhesive layer can be exhibited well.
本発明の電磁波シールドフィルムでは、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができる。
また、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。 In the electromagnetic wave shielding film of the present invention, the height c at which the load area ratio Smr (c) of the surface of the adhesive layer which is in contact with the adhesive layer is 50% is 2 to 15 μm, and the resin forming the adhesive layer is Since the storage elastic modulus of is 0.1 to 0.5 MPa, the protective film can be attached at room temperature.
Further, the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
ここまで、本発明の電磁波シールドフィルムの製造方法の一例として、保護フィルムの表面に粘着剤層を形成し、保護フィルムを接着剤層に貼り合わせる工程を含む製造方法を説明したが、粘着剤層は接着剤層の表面に設けてもよい。以下、その方法について説明する。 So far, as an example of the method for producing the electromagnetic wave shielding film of the present invention, the production method including the step of forming a pressure-sensitive adhesive layer on the surface of the protective film and bonding the protective film to the adhesive layer has been described. May be provided on the surface of the adhesive layer. The method will be described below.
図３Ａ、図３Ｂ、図３Ｃ及び図３Ｄは、本発明の電磁波シールドフィルムの製造方法の別の一例を模式的に示す工程図である。
まず、図３Ａに示すように転写フィルム３０に転写フィルム用粘着剤層３１が設けられたものを準備する。これは図２Ａに示すものと同じである。 FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D are process diagrams schematically showing another example of the method for producing an electromagnetic wave shielding film of the present invention.
First, as shown in FIG. 3A, a transfer film 30 provided with a transfer film pressure-sensitive adhesive layer 31 is prepared. This is the same as shown in FIG. 2A.
次に、図３Ｂに示すように転写フィルム上に絶縁層１３、シールド層１２、接着剤層１１を順次形成してシールドフィルム部１０を作製する。ここまでは図２Ｂに示す工程と同じである。
そして、シールドフィルム部１０の作製後、接着剤層１１の表面に粘着剤層２２を形成する。
接着剤層１１の表面への粘着剤層２２の形成は、接着剤層の形成方法として上記した公知の塗布方式により、粘着剤層を構成する樹脂を含む組成物を塗布することにより行うことができる。 Next, as shown in FIG. 3B, the insulating layer 13, the shield layer 12, and the adhesive layer 11 are sequentially formed on the transfer film to produce the shield film unit 10. Up to this point, the process is the same as that shown in FIG. 2B.
Then, after the shield film portion 10 is manufactured, the adhesive layer 22 is formed on the surface of the adhesive layer 11.
The pressure-sensitive adhesive layer 22 is formed on the surface of the adhesive layer 11 by applying a composition containing a resin forming the pressure-sensitive adhesive layer by the known coating method described above as a method for forming the adhesive layer. it can.
別途、図３Ｃに示すように保護フィルム２１を準備する。この保護フィルム２１には粘着剤層は設けられていない。 Separately, the protective film 21 is prepared as shown in FIG. 3C. No adhesive layer is provided on the protective film 21.
次に、図３Ｄに示すように、粘着剤層２２に保護フィルム２１を貼り合わせて保護部２０を形成する。
上記工程により、転写フィルム３０上に形成された電磁波シールドフィルム１を製造することができる。 Next, as shown in FIG. 3D, the protective film 21 is attached to the adhesive layer 22 to form the protective portion 20.
Through the above steps, the electromagnetic wave shield film 1 formed on the transfer film 30 can be manufactured.
（シールドプリント配線板の製造方法）
次に、本発明のシールドプリント配線板の製造方法について説明する。
本発明のシールドプリント配線板の製造方法では、本発明の電磁波シールドフィルムを使用する。 (Manufacturing method of shield printed wiring board)
Next, a method for manufacturing the shield printed wiring board of the present invention will be described.
In the method for producing a shielded printed wiring board of the present invention, the electromagnetic wave shielding film of the present invention is used.
図４Ａ、図４Ｂ及び図４Ｃは、本発明のシールドプリント配線板の製造方法の一例を模式的に示す工程図である。
図４Ａには本発明の電磁波シールドフィルム１を示している。
まず、保護部２０を電磁波シールドフィルム１から剥離する。
本発明の電磁波シールドフィルムでは、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを含む保護部を接着剤層から容易に剥離することができる。 4A, 4B, and 4C are process diagrams schematically showing an example of the method for manufacturing a shielded printed wiring board of the present invention.
FIG. 4A shows the electromagnetic wave shielding film 1 of the present invention.
First, the protection part 20 is peeled off from the electromagnetic wave shield film 1.
In the electromagnetic wave shielding film of the present invention, the height c at which the load area ratio Smr (c) of the surface of the adhesive layer which is in contact with the adhesive layer is 50% is 2 to 15 μm, and the resin forming the adhesive layer is Since the storage elastic modulus of is 0.1 to 0.5 MPa, the protective portion including the protective film can be easily peeled from the adhesive layer.
図４Ｂには保護部を剥離した電磁波シールドフィルム、すなわちシールドフィルム部１０を示している。また、電磁波シールドフィルムを接着する対象となるプリント配線板の一例としてのプリント配線板４０を示している。
プリント配線板４０は、ベースフィルム４１と、ベースフィルム４１上に形成されたプリント回路４２と、プリント回路４２を覆うように形成されたカバーレイ４３からなる。 FIG. 4B shows the electromagnetic wave shield film from which the protective portion is peeled off, that is, the shield film portion 10. Further, a printed wiring board 40 is shown as an example of the printed wiring board to which the electromagnetic wave shielding film is attached.
The printed wiring board 40 includes a base film 41, a printed circuit 42 formed on the base film 41, and a cover lay 43 formed so as to cover the printed circuit 42.
プリント配線板４０を構成するベースフィルム４１及びカバーレイ４３の材料は、特に限定されないが、エンジニアリングプラスチックからなることが望ましい。このようなエンジニアリングプラスチックとしては、例えば、ポリエチレンテレフタレート、ポリプロピレン、架橋ポリエチレン、ポリエステル、ポリベンズイミダゾール、ポリイミド、ポリイミドアミド、ポリエーテルイミド、ポリフェニレンサルファイドなどの樹脂が挙げられる。
また、これらのエンジニアリングプラスチックの内、難燃性が要求される場合には、ポリフェニレンサルファイドフィルムが望ましく、耐熱性が要求される場合にはポリイミドフィルムが望ましい。なお、ベースフィルム４１の厚みは、１０～４０μｍであることが望ましい。また、カバーレイ４３の厚みは、１０～３０μｍであることが望ましい。 The materials of the base film 41 and the cover lay 43 that form the printed wiring board 40 are not particularly limited, but are preferably made of engineering plastic. Examples of such engineering plastics include resins such as polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, and polyphenylene sulfide.
Among these engineering plastics, a polyphenylene sulfide film is preferable when flame retardancy is required, and a polyimide film is preferable when heat resistance is required. The thickness of the base film 41 is preferably 10 to 40 μm. The coverlay 43 preferably has a thickness of 10 to 30 μm.
プリント配線板４０を構成するプリント回路４２は、特に限定されないが、導電性材料をエッチング処理すること等により形成することができる。
導電材料としては、銅、ニッケル、銀、金等が挙げられる。 The printed circuit 42 constituting the printed wiring board 40 is not particularly limited, but can be formed by etching a conductive material or the like.
Examples of the conductive material include copper, nickel, silver, gold and the like.
保護部の剥離によって露出した接着剤層１１をプリント配線板４０に向けて接触させて、シールルドフィルム部１０をプリント配線板４０に接着することで、図４Ｃに示すようなシールドプリント配線板５０が得られる。 The shielded printed wiring board 50 as shown in FIG. 4C is obtained by bringing the adhesive layer 11 exposed by peeling of the protective portion into contact with the printed wiring board 40 and adhering the shielded film portion 10 to the printed wiring board 40. Is obtained.
接着剤層が熱硬化性樹脂を含む場合には、シールドフィルム部をプリント配線板に接触させた後に熱を加えて熱硬化性樹脂を硬化させてシールドフィルム部とプリント配線板の接着を行うことが好ましい。
上記工程により、本発明の電磁波シールドフィルムを使用してシールドプリント配線板を製造することができる。 If the adhesive layer contains a thermosetting resin, contact the shield film with the printed wiring board and then apply heat to cure the thermosetting resin and bond the shield film to the printed wiring board. Is preferred.
Through the above steps, a shielded printed wiring board can be manufactured using the electromagnetic wave shielding film of the present invention.
（第２実施形態）
本発明の第２実施形態に係る電磁波シールドフィルムは、シールドフィルム部が、シールド層として機能し、導電性を有する接着剤層と、上記接着剤層に積層された絶縁層の２層を備えている。
シールドフィルム部以外の構成は本発明の第１実施形態に係る電磁波シールドフィルムと同様である。 (Second embodiment)
In the electromagnetic wave shielding film according to the second embodiment of the present invention, the shield film part includes two layers of an adhesive layer which functions as a shield layer and has conductivity, and an insulating layer laminated on the adhesive layer. There is.
The configuration other than the shield film part is the same as the electromagnetic wave shield film according to the first embodiment of the present invention.
図５は、本発明の第２実施形態に係る電磁波シールドフィルムの断面の一例を模式的に示す断面図である。
図５に示すように、電磁波シールドフィルム１０１は、シールドフィルム部１１０と保護部１２０を備えている。
シールドフィルム部１１０は、導電性を有する接着剤層１１１及び絶縁層１１３を備えている。
保護部１２０は、保護フィルム１２１及び粘着剤層１２２を備えている。 FIG. 5: is sectional drawing which shows typically an example of the cross section of the electromagnetic wave shielding film which concerns on 2nd Embodiment of this invention.
As shown in FIG. 5, the electromagnetic wave shield film 101 includes a shield film portion 110 and a protection portion 120.
The shield film part 110 includes an adhesive layer 111 having conductivity and an insulating layer 113.
The protective part 120 includes a protective film 121 and an adhesive layer 122.
導電性を有する接着剤層１１１は、本発明の第１実施形態に係る電磁波シールドフィルムの接着剤層と同様に、プリント配線板に電磁波シールドフィルムを貼り付ける際にプリント配線板に対する接着力を発揮させるための層である。
また、導電性を有するため、電磁波シールド性を発揮させるためのシールド層として機能する。
導電性を有する接着剤層の構成は、本発明の第１実施形態に係る電磁波シールドフィルムの接着剤層の説明において導電性接着剤層の構成として説明した構成を使用することができる。 Like the adhesive layer of the electromagnetic wave shielding film according to the first embodiment of the present invention, the conductive adhesive layer 111 exerts an adhesive force to the printed wiring board when the electromagnetic wave shielding film is attached to the printed wiring board. It is a layer for making it.
Further, since it has conductivity, it functions as a shield layer for exhibiting electromagnetic wave shielding properties.
As the configuration of the conductive adhesive layer, the configuration described as the configuration of the conductive adhesive layer in the description of the adhesive layer of the electromagnetic wave shielding film according to the first embodiment of the present invention can be used.
このような接着剤層に対しても、保護部に粘着剤層を設けることにより、粘着剤層の粘着力を利用してシールドフィルム部の接着剤層と保護フィルムとの貼り合わせを行うことができる。
そして、粘着剤層と接する側の接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、粘着剤層を構成する樹脂の貯蔵弾性率が０．１～０．５ＭＰａであるので、保護フィルムを常温で貼り合わせることができ、電磁波シールドフィルムの使用時に保護フィルムを含む保護部を接着剤層から容易に剥離することができる。 Even for such an adhesive layer, by providing an adhesive layer on the protective part, it is possible to bond the adhesive layer of the shield film part and the protective film by using the adhesive force of the adhesive layer. it can.
The height c at which the surface area Smr (c) of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm, and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is 0. Since it is 1 to 0.5 MPa, the protective film can be attached at room temperature, and the protective portion including the protective film can be easily peeled off from the adhesive layer when the electromagnetic wave shielding film is used.
絶縁層１１３、保護フィルム１２１及び粘着剤層１２２の構成は、本発明の第１実施形態に係る電磁波シールドフィルムにおいて絶縁層１３、保護フィルム２１及び粘着剤層２２の構成として説明した構成を使用することができる。
また、本発明の第１実施形態に係る電磁波シールドフィルムと同様に、絶縁層の接着剤層が積層された面と反対側の面に転写フィルムが設けられていてもよい。転写フィルムの構成も本発明の第１実施形態に係る電磁波シールドフィルムと同様とすることができる。 As the configurations of the insulating layer 113, the protective film 121, and the adhesive layer 122, the configurations described as the configurations of the insulating layer 13, the protective film 21, and the adhesive layer 22 in the electromagnetic wave shielding film according to the first embodiment of the present invention are used. be able to.
Further, similarly to the electromagnetic wave shielding film according to the first embodiment of the present invention, a transfer film may be provided on the surface of the insulating layer opposite to the surface on which the adhesive layer is laminated. The structure of the transfer film can be the same as that of the electromagnetic wave shielding film according to the first embodiment of the present invention.
本発明の第２実施形態に係る電磁波シールドフィルムは、上述した本発明の第１実施形態に係る電磁波シールドフィルムの製造方法において、転写フィルムに絶縁層と導電性を有する接着剤層を順次形成してシールドフィルム部を作製することにより製造することができる。
接着剤層の形成の際に、接着剤層が導電性接着剤層になるように、導電性粒子と樹脂とを含む接着剤層用組成物を使用すればよい。
その他の工程は、シールド層を形成しない他は本発明の第１実施形態に係る電磁波シールドフィルムの製造方法と同様にすることによって、本発明の第２実施形態に係る電磁波シールドフィルムを製造することができる。 The electromagnetic wave shielding film according to the second exemplary embodiment of the present invention is the electromagnetic wave shielding film manufacturing method according to the first exemplary embodiment of the present invention, in which an insulating layer and a conductive adhesive layer are sequentially formed on the transfer film. It can be manufactured by manufacturing the shield film part.
When forming the adhesive layer, an adhesive layer composition containing conductive particles and a resin may be used so that the adhesive layer becomes a conductive adhesive layer.
The other steps are the same as the method for producing the electromagnetic wave shielding film according to the first embodiment of the present invention except that the shield layer is not formed, thereby producing the electromagnetic wave shielding film according to the second embodiment of the present invention. You can
本発明の第２実施形態に係る電磁波シールドフィルムも、本発明の第１実施形態に係る電磁波シールドフィルムを使用する場合と同様にして、シールドプリント配線板の製造に使用することができる。
すなわち、本発明の第２実施形態に係る電磁波シールドフィルムから、保護部を剥離して接着剤層を露出させ、接着剤層をプリント配線板に向けて接触させてシールドフィルム部をプリント配線板に接着することによりシールドプリント配線板を製造することができる。 The electromagnetic wave shielding film according to the second embodiment of the present invention can also be used for manufacturing a shielded printed wiring board in the same manner as when using the electromagnetic wave shielding film according to the first embodiment of the present invention.
That is, from the electromagnetic wave shielding film according to the second embodiment of the present invention, the protective portion is peeled off to expose the adhesive layer, and the adhesive layer is brought into contact with the printed wiring board to contact the shield film portion with the printed wiring board. A shield printed wiring board can be manufactured by bonding.
以下に本発明をより具体的に説明する実施例を示すが、本発明はこれらの実施例に限定されるものではない。 Examples that more specifically describe the present invention will be shown below, but the present invention is not limited to these examples.
（実施例１）
まず、転写フィルムとして、片面に剥離処理を施したポリエチレンテレフタレートフィルムを準備した。
次に、転写フィルムの剥離処理面にエポキシ樹脂を塗工し、電気オーブンを用い、１００℃で２分間加熱し、厚さ５μｍの絶縁層を作製した。
その後、絶縁層の上に、無電解めっきにより２μｍの銅層を形成した。当該銅層は、シールド層となる。 (Example 1)
First, as a transfer film, a polyethylene terephthalate film having a release treatment on one surface was prepared.
Next, an epoxy resin was applied to the release-treated surface of the transfer film and heated at 100 ° C. for 2 minutes using an electric oven to form an insulating layer having a thickness of 5 μm.
Then, a copper layer of 2 μm was formed on the insulating layer by electroless plating. The copper layer becomes a shield layer.
次に、アミド変性エポキシ樹脂１００．０部（Ｔｇ：６０℃）、銀コート銅粉（平均粒子径Ｄ５０：１５μｍ）４９．６部、及び、有機リン系難燃剤（クラリアントケミカル製、ＯＰ９３５）４９．６部を混合し、接着剤層用組成物を作製した。
この接着剤層用組成物を銅層の上に塗工し、電気オーブンを用い、１００℃で２分間加熱し、厚さ１５μｍの接着剤層を作製した。
上記工程によってシールドフィルム部を作製した。 Next, 100.0 parts (Tg: 60 ° C.) of amide-modified epoxy resin, 49.6 parts of silver-coated copper powder (average particle diameter D 50 : 15 μm), and organic phosphorus flame retardant (CL935, OP935). 49.6 parts were mixed and the composition for adhesive layers was produced.
The composition for an adhesive layer was applied onto the copper layer and heated at 100 ° C. for 2 minutes using an electric oven to prepare an adhesive layer having a thickness of 15 μm.
The shield film part was produced by the above process.
接着剤層の表面の負荷面積率及び算術平均粗さをコンフォーカル顕微鏡（Ｌａｓｅｒｔｅｃ社製、ＯＰＴＥＬＩＣＳ　ＨＹＢＲＩＤ、対物レンズ２０倍）を用いて、電磁波シールドフィルムの絶縁層の表面の任意の５か所を測定した後、データ解析ソフト（ＬＭｅｙｅ７）を用いて表面の傾き補正を行い、ＩＳＯ　２５１７８－６：２０１０に準拠して表面性状を測定し、その算術平均を得た。なお、Ｓフィルタのカットオフ波長は０．００２５ｍｍ、Ｌフィルタのカットオフ波長は０．８ｍｍとした。その結果、負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが８．２６μｍであった。 Using a confocal microscope (Lasertec, OPTELICS HYBRID, objective lens 20 times), the load area ratio and arithmetic mean roughness of the surface of the adhesive layer were measured at any 5 points on the surface of the insulating layer of the electromagnetic wave shielding film. After the measurement, the inclination of the surface was corrected using the data analysis software (LMeye7), and the surface property was measured according to ISO 25178-6: 2010, and the arithmetic mean thereof was obtained. The cutoff wavelength of the S filter was 0.0025 mm, and the cutoff wavelength of the L filter was 0.8 mm. As a result, the height c at which the load area ratio Smr (c) was 50% was 8.26 μm.
次に、保護フィルムとして、厚み１００μｍのポリエチレンテレフタレートフィルムを準備した。
保護フィルムに、２０℃での貯蔵弾性率が０．２３２ＭＰａであるアクリル系粘着剤（粘着剤Ａ－１：Ｔｇ　－２０℃）を塗工して粘着剤層を形成した。 Next, a polyethylene terephthalate film having a thickness of 100 μm was prepared as a protective film.
An acrylic pressure-sensitive adhesive having a storage elastic modulus at 20 ° C. of 0.232 MPa (pressure-sensitive adhesive A-1: Tg −20 ° C.) was applied to the protective film to form a pressure-sensitive adhesive layer.
粘着剤層を接着剤層に向けて保護フィルムを重ね合わせ、熱ロールラミネーターを用いて、温度４０℃、圧力０．４ＭＰａで保護フィルムの貼り合わせを行った。
上記工程により電磁波シールドフィルムを製造した。 The protective film was laminated with the pressure-sensitive adhesive layer facing the adhesive layer, and the protective film was laminated using a hot roll laminator at a temperature of 40 ° C. and a pressure of 0.4 MPa.
An electromagnetic wave shielding film was manufactured by the above process.
（実施例２～１４）及び（比較例１～８）
保護フィルムの材質、粘着剤層に使用する粘着剤の材質、接着剤層用組成物に含有させる導電性粒子（銀コート銅粉）の平均粒子径、導電性粒子の配合量、接着剤層用組成物の狙い塗布厚みを表１に示すように変更して電磁波シールドフィルムを製造した。
使用した粘着剤の材質は下記の通りである。
粘着剤Ａ－１：アクリル系粘着剤、貯蔵弾性率０．２３２ＭＰａ、Ｔｇ　－２０℃
粘着剤Ａ－２：アクリル系粘着剤、貯蔵弾性率０．１８７ＭＰａ、Ｔｇ　－２０℃
粘着剤Ａ－３：アクリル系粘着剤、貯蔵弾性率０．４１１ＭＰａ、Ｔｇ　－２５℃
粘着剤Ｂ－１：アクリル系粘着剤、貯蔵弾性率０．０８１ＭＰａ、Ｔｇ　－４０℃
粘着剤Ｂ－２：アクリル系粘着剤、貯蔵弾性率２．５２０ＭＰａ、Ｔｇ　－５℃
使用した保護フィルムの材質は下記の通りである。
ＰＥＴ：ポリエチレンテレフタレートフィルム（厚さ１００μｍ）
ＯＰＰ：２軸延伸ポリプロピレンフィルム（厚さ１００μｍ） (Examples 2 to 14) and (Comparative Examples 1 to 8)
Material of protective film, material of pressure-sensitive adhesive used for pressure-sensitive adhesive layer, average particle diameter of conductive particles (silver-coated copper powder) contained in composition for adhesive layer, compounding amount of conductive particles, for adhesive layer The target coating thickness of the composition was changed as shown in Table 1 to produce an electromagnetic wave shielding film.
The materials of the adhesive used are as follows.
Adhesive A-1: Acrylic adhesive, storage elastic modulus 0.232 MPa, Tg −20 ° C.
Adhesive A-2: Acrylic adhesive, storage elastic modulus 0.187 MPa, Tg −20 ° C.
Adhesive A-3: Acrylic adhesive, storage elastic modulus 0.411 MPa, Tg -25 ° C
Adhesive B-1: Acrylic adhesive, storage elastic modulus 0.081 MPa, Tg −40 ° C.
Adhesive B-2: Acrylic adhesive, storage elastic modulus 2.520 MPa, Tg −5 ° C.
The material of the protective film used is as follows.
PET: Polyethylene terephthalate film (thickness 100 μm)
OPP: Biaxially oriented polypropylene film (thickness 100 μm)
各実施例及び比較例で製造した電磁波シールドフィルムにつき、各種評価を行った。結果はまとめて表１に示した。 Various evaluations were carried out on the electromagnetic wave shielding films produced in the respective examples and comparative examples. The results are summarized in Table 1.
（保護フィルム貼り合わせの評価）
製造した電磁波シールドフィルムにおいて、保護フィルムが接着剤層に充分に貼り合わされている場合、評価を良好として表１に○と示した。保護フィルムが接着剤層から剥がれている場合、評価を不良として表１に×と示した。 (Evaluation of bonding protective film)
In the produced electromagnetic wave shielding film, when the protective film was sufficiently adhered to the adhesive layer, the evaluation was evaluated as good and shown in Table 1 as ◯. When the protective film was peeled off from the adhesive layer, the evaluation was evaluated as poor and shown in Table 1 as x.
（保護フィルム剥離の評価）
製造した電磁波シールドフィルムの保護フィルムの端を手でつまみ、保護フィルムを剥離する方向に力を加えてスムーズに保護フィルムの剥離ができた場合、評価を良好として表１に○と示した。保護フィルムが接着剤層から剥離できなかった場合、評価を不良として表１に×と示した。 (Evaluation of protective film peeling)
When the edge of the protective film of the produced electromagnetic wave shielding film was pinched by hand and a force was applied in the direction of peeling the protective film to allow the protective film to be peeled off smoothly, the evaluation was evaluated as good, and a mark of O was shown in Table 1. When the protective film could not be peeled off from the adhesive layer, the evaluation was evaluated as poor and shown in Table 1 as x.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
表１に示すように、接着剤層の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さと粘着剤層を構成する樹脂の貯蔵弾性率が所定の範囲内となっていると、保護フィルムの貼り合わせと剥離を良好に行うことができることがわかる。 As shown in Table 1, when the load area ratio Smr (c) on the surface of the adhesive layer is 50% and the storage elastic modulus of the resin forming the pressure-sensitive adhesive layer is within a predetermined range, protection is performed. It can be seen that the films can be bonded and peeled well.
１、１０１　電磁波シールドフィルム
１０、１１０　シールドフィルム部
１１、１１１　接着剤層
１２　シールド層
１３、１１３　絶縁層
２０、１２０　保護部
２１、１２１　保護フィルム
２２、１２２　粘着剤層
３０　転写フィルム
３１　転写フィルム用粘着剤層
４０　プリント配線板
４１　ベースフィルム
４２　プリント回路
４３　カバーレイ
５０　シールドプリント配線板 1, 101 Electromagnetic wave shield film 10, 110 Shield film part 11, 111 Adhesive layer 12 Shield layer 13, 113 Insulating layer 20, 120 Protective part 21, 121 Protective film 22, 122 Adhesive layer 30 Transfer film 31 Transfer film adhesive Agent layer 40 Printed wiring board 41 Base film 42 Printed circuit 43 Coverlay 50 Shield printed wiring board

Claims (25)

  1. 接着剤層と、前記接着剤層に積層されたシールド層と、前記シールド層に積層された絶縁層とを備えたシールドフィルム部と、
    保護フィルムと、前記保護フィルムに積層された粘着剤層とからなる保護部と、を備えた電磁波シールドフィルムであって、
    前記シールドフィルム部の前記接着剤層に前記保護部の前記粘着剤層が貼り合わされており、
    前記接着剤層の、前記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
    前記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする、電磁波シールドフィルム。     An adhesive layer, a shield layer laminated on the adhesive layer, and a shield film portion including an insulating layer laminated on the shield layer,
    A protective film, an electromagnetic wave shielding film having a protective portion comprising a pressure-sensitive adhesive layer laminated on the protective film,
    The adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
    The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
    An electromagnetic wave shield film, wherein the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  2. 前記接着剤層は、Ｔｇが０～１００℃である樹脂を含む請求項１に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 1, wherein the adhesive layer contains a resin having Tg of 0 to 100 ° C.
  3. 前記粘着剤層は、Ｔｇが－６０～０℃である樹脂を含む請求項１又は２に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 1 or 2, wherein the pressure-sensitive adhesive layer contains a resin having Tg of -60 to 0 ° C.
  4. 前記接着剤層は、ポリアミド樹脂、ポリウレタン樹脂、ポリウレタンウレア樹脂、ポリエステル樹脂、アクリル樹脂及びエポキシ樹脂からなる群から選択される少なくとも１種の樹脂を含み熱硬化性である請求項１～３のいずれかに記載の電磁波シールドフィルム。 4. The adhesive layer is thermosetting, containing at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin. The electromagnetic wave shielding film according to Crab.
  5. 前記粘着剤層は、天然ゴム、アクリル樹脂、ポリウレタン樹脂、シリコーン樹脂及びポリエステル樹脂からなる群から選択される少なくとも１種の樹脂を含む請求項１～４のいずれかに記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive layer contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
  6. 前記接着剤層が導電性を有する接着剤層である請求項１～５のいずれかに記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 1 to 5, wherein the adhesive layer is an electrically conductive adhesive layer.
  7. 前記絶縁層の前記シールド層が積層された面と反対側の面には、転写フィルムが設けられている請求項１～６のいずれかに記載の電磁波シールドフィルム。 The electromagnetic wave shield film according to any one of claims 1 to 6, wherein a transfer film is provided on a surface of the insulating layer opposite to a surface on which the shield layer is laminated.
  8. シールド層として機能し、導電性を有する接着剤層と、前記接着剤層に積層された絶縁層とを備えたシールドフィルム部と、
    保護フィルムと、前記保護フィルムに積層された粘着剤層とからなる保護部と、を備えた電磁波シールドフィルムであって、
    前記シールドフィルム部の前記接着剤層に前記保護部の前記粘着剤層が貼り合わされており、
    前記接着剤層の、前記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
    前記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする、電磁波シールドフィルム。     A shield film portion that functions as a shield layer and has an electrically conductive adhesive layer, and an insulating layer laminated on the adhesive layer,
    A protective film, an electromagnetic wave shielding film having a protective portion comprising a pressure-sensitive adhesive layer laminated on the protective film,
    The adhesive layer of the protective part is attached to the adhesive layer of the shield film part,
    The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
    An electromagnetic wave shield film, wherein the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  9. 前記接着剤層は、Ｔｇが０～１００℃である樹脂を含む請求項８に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 8, wherein the adhesive layer contains a resin having Tg of 0 to 100 ° C.
  10. 前記粘着剤層は、Ｔｇが－６０～０℃である樹脂を含む請求項８又は９に記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to claim 8 or 9, wherein the pressure-sensitive adhesive layer contains a resin having Tg of -60 to 0 ° C.
  11. 前記接着剤層は、ポリアミド樹脂、ポリウレタン樹脂、ポリウレタンウレア樹脂、ポリエステル樹脂、アクリル樹脂及びエポキシ樹脂からなる群から選択される少なくとも１種の樹脂を含み熱硬化性である請求項８～１０のいずれかに記載の電磁波シールドフィルム。 11. The adhesive layer is thermosetting, containing at least one resin selected from the group consisting of polyamide resin, polyurethane resin, polyurethane urea resin, polyester resin, acrylic resin and epoxy resin. The electromagnetic wave shielding film according to Crab.
  12. 前記粘着剤層は、天然ゴム、アクリル樹脂、ポリウレタン樹脂、シリコーン樹脂及びポリエステル樹脂からなる群から選択される少なくとも１種の樹脂を含む請求項８～１１のいずれかに記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 8 to 11, wherein the pressure-sensitive adhesive layer contains at least one resin selected from the group consisting of natural rubber, acrylic resin, polyurethane resin, silicone resin and polyester resin.
  13. 前記絶縁層の前記接着剤層が積層された面と反対側の面には、転写フィルムが設けられている請求項８～１２のいずれかに記載の電磁波シールドフィルム。 The electromagnetic wave shielding film according to any one of claims 8 to 12, wherein a transfer film is provided on the surface of the insulating layer opposite to the surface on which the adhesive layer is laminated.
  14. 転写フィルムに絶縁層、シールド層、接着剤層を順次形成してシールドフィルム部を作製する工程と、
    保護フィルムを、前記接着剤層に粘着剤層を介して貼り合わせる工程とを含む電磁波シールドフィルムの製造方法であって、
    前記接着剤層の、前記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
    前記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする、電磁波シールドフィルムの製造方法。     A step of sequentially forming an insulating layer, a shield layer, and an adhesive layer on the transfer film to produce a shield film portion,
    A method for producing an electromagnetic wave shielding film, which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
    The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
    A method for producing an electromagnetic wave shielding film, wherein the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  15. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、
    前記接着剤層の表面に前記粘着剤層を形成し、
    前記粘着剤層に前記保護フィルムを貼り合わせることにより行う請求項１４に記載の電磁波シールドフィルムの製造方法。     The step of attaching the protective film to the adhesive layer,
    Forming the pressure-sensitive adhesive layer on the surface of the adhesive layer,
    The method for producing an electromagnetic wave shielding film according to claim 14, wherein the protective film is attached to the pressure-sensitive adhesive layer.
  16. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、
    前記保護フィルムの表面に前記粘着剤層を形成し、
    前記粘着剤層を前記接着剤層に向けて前記保護フィルムを貼り合わせることにより行う請求項１４に記載の電磁波シールドフィルムの製造方法。     The step of attaching the protective film to the adhesive layer,
    Forming the pressure-sensitive adhesive layer on the surface of the protective film,
    The method for producing an electromagnetic wave shield film according to claim 14, wherein the pressure-sensitive adhesive layer is attached to the adhesive layer and the protective film is attached thereto.
  17. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、１０～６０℃で行う請求項１４～１６のいずれかに記載の電磁波シールドフィルムの製造方法。 The method of manufacturing an electromagnetic wave shield film according to any one of claims 14 to 16, wherein the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C.
  18. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、前記粘着剤層に含まれる樹脂のＴｇより高い温度で行う請求項１４～１７のいずれかに記載の電磁波シールドフィルムの製造方法。 The method of manufacturing an electromagnetic wave shield film according to any one of claims 14 to 17, wherein the step of attaching the protective film to the adhesive layer is performed at a temperature higher than Tg of the resin contained in the adhesive layer.
  19. 転写フィルムに絶縁層、導電性を有する接着剤層を順次形成してシールドフィルム部を作製する工程と、
    保護フィルムを、前記接着剤層に粘着剤層を介して貼り合わせる工程とを含む電磁波シールドフィルムの製造方法であって、
    前記接着剤層の、前記粘着剤層と接する側の表面の負荷面積率Ｓｍｒ（ｃ）が５０％となる高さｃが２～１５μｍであり、
    前記粘着剤層を構成する樹脂の２０℃での貯蔵弾性率が０．１～０．５ＭＰａであることを特徴とする、電磁波シールドフィルムの製造方法。     An insulating layer on the transfer film, a step of sequentially forming an adhesive layer having conductivity, to produce a shield film portion,
    A method for producing an electromagnetic wave shielding film, which comprises a step of attaching a protective film to the adhesive layer via a pressure-sensitive adhesive layer,
    The height c at which the load area ratio Smr (c) of the surface of the adhesive layer on the side in contact with the pressure-sensitive adhesive layer is 50% is 2 to 15 μm,
    A method for producing an electromagnetic wave shielding film, wherein the resin constituting the pressure-sensitive adhesive layer has a storage elastic modulus at 20 ° C. of 0.1 to 0.5 MPa.
  20. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、
    前記接着剤層の表面に前記粘着剤層を形成し、
    前記粘着剤層に前記保護フィルムを貼り合わせることにより行う請求項１９に記載の電磁波シールドフィルムの製造方法。     The step of attaching the protective film to the adhesive layer,
    Forming the pressure-sensitive adhesive layer on the surface of the adhesive layer,
    The method for producing an electromagnetic wave shielding film according to claim 19, which is carried out by bonding the protective film to the adhesive layer.
  21. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、
    前記保護フィルムの表面に前記粘着剤層を形成し、
    前記粘着剤層を前記接着剤層に向けて前記保護フィルムを貼り合わせることにより行う請求項１９に記載の電磁波シールドフィルムの製造方法。     The step of attaching the protective film to the adhesive layer,
    Forming the pressure-sensitive adhesive layer on the surface of the protective film,
    20. The method for producing an electromagnetic wave shielding film according to claim 19, wherein the pressure-sensitive adhesive layer is directed toward the adhesive layer and the protective film is attached thereto.
  22. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、１０～６０℃で行う請求項１９～２１のいずれかに記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shielding film according to any one of claims 19 to 21, wherein the step of attaching the protective film to the adhesive layer is performed at 10 to 60 ° C.
  23. 前記接着剤層に前記保護フィルムを貼り合わせる工程は、前記粘着剤層に含まれる樹脂のＴｇより高い温度で行う請求項１９～２２のいずれかに記載の電磁波シールドフィルムの製造方法。 The method for producing an electromagnetic wave shield film according to any one of claims 19 to 22, wherein the step of attaching the protective film to the adhesive layer is performed at a temperature higher than Tg of the resin contained in the adhesive layer.
  24. 請求項１～１３のいずれかに記載の電磁波シールドフィルムを準備する工程と、
    前記電磁波シールドフィルムから保護部を剥離する工程と、
    前記保護部の剥離によって露出した接着剤層をプリント配線板に向けて接触させて、シールドフィルム部をプリント配線板に接着する工程と、を含むことを特徴とするシールドプリント配線板の製造方法。     A step of preparing the electromagnetic wave shielding film according to any one of claims 1 to 13,
    A step of peeling the protective portion from the electromagnetic wave shielding film,
    And a step of bringing the adhesive layer exposed by peeling of the protective portion into contact with the printed wiring board and adhering the shield film portion to the printed wiring board, the method for manufacturing a shielded printed wiring board.
  25. 前記接着剤層が熱硬化性樹脂を含み、
    前記接着剤層を前記プリント配線板に向けて接触させたのちに熱を加えて前記熱硬化性樹脂を硬化させて、前記シールドフィルム部と前記プリント配線板の接着を行う、請求項２４に記載のシールドプリント配線板の製造方法。     The adhesive layer contains a thermosetting resin,
    The contact between the adhesive layer and the printed wiring board, and then heat is applied to cure the thermosetting resin to bond the shield film portion and the printed wiring board. Manufacturing method of shielded printed wiring board.
PCT/JP2019/043375 2018-11-08 2019-11-06 Electromagnetic shielding film, method for manufacturing electromagnetic shielding film, and method for manufacturing shielded printed wiring board WO2020095919A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210145510A (en) * 2020-05-25 2021-12-02 이주호 Method for forming EMI shield structure of semiconductor package
WO2023153409A1 (en) * 2022-02-08 2023-08-17 株式会社巴川製紙所 Bonded laminate and electronic device housing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329314B2 (en) * 1980-10-13 1988-06-13 Fuji Electric Co Ltd
WO2014077406A1 (en) * 2012-11-19 2014-05-22 タツタ電線株式会社 Multilayer film and shielded printed wiring board
JP2018056330A (en) * 2016-09-29 2018-04-05 信越ポリマー株式会社 Electromagnetic wave shield film, method of manufacturing electromagnetic wave shield film and method of manufacturing printed wiring board with electromagnetic wave shield film
JP2018166180A (en) * 2017-03-28 2018-10-25 信越ポリマー株式会社 Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047556B2 (en) * 2006-07-26 2012-10-10 リンテック株式会社 Adhesive for bonding optical functional film, optical functional film with adhesive, and method for producing the same
JP2015065343A (en) * 2013-09-25 2015-04-09 タツタ電線株式会社 Shield housing body, printed circuit board, electronic apparatus and method for manufacturing shield housing body
JP5861790B1 (en) 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding sheet, electromagnetic shielding wiring circuit board, and electronic equipment
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
JP6329314B1 (en) * 2017-09-28 2018-05-23 タツタ電線株式会社 Conductive adhesive sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329314B2 (en) * 1980-10-13 1988-06-13 Fuji Electric Co Ltd
WO2014077406A1 (en) * 2012-11-19 2014-05-22 タツタ電線株式会社 Multilayer film and shielded printed wiring board
JP2018056330A (en) * 2016-09-29 2018-04-05 信越ポリマー株式会社 Electromagnetic wave shield film, method of manufacturing electromagnetic wave shield film and method of manufacturing printed wiring board with electromagnetic wave shield film
JP2018166180A (en) * 2017-03-28 2018-10-25 信越ポリマー株式会社 Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210145510A (en) * 2020-05-25 2021-12-02 이주호 Method for forming EMI shield structure of semiconductor package
KR102459794B1 (en) * 2020-05-25 2022-10-28 이주호 Method for forming EMI shield structure of semiconductor package
WO2023153409A1 (en) * 2022-02-08 2023-08-17 株式会社巴川製紙所 Bonded laminate and electronic device housing

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