TW201524284A - Electronic element and sheet material - Google Patents

Abstract

An electronic element of the invention has: an electronic substrate, which has a wiring substrate having a mounting surface, and a plurality of electronic components mounted on the mounting surface of the wiring substrate; a sheet material, which is laminated on the electronic substrate, and has a sheet-typed base material having conductivity, and at least one insulating layer disposed at the electronic substrate side of the base material and having a size including at least one of the electronic component; and a grounding portion, which grounds the base material of the sheet material, and fixes the sheet material and the electronic substrate. From this, an electronic element of easily removed heat-release from the electronic component, thin type and high reliability is provided.

Description

Electronic components and sheets

The present invention relates to an electronic component and a sheet.

In an electronic device such as a smart phone, in order to protect an electronic component mounted on a wiring board from electromagnetic waves or the like, the following operation is performed: a conductive box-shaped shield can is covered to cover the electronic component. The method is provided on the wiring board (for example, refer to Patent Document 1).

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent No. 4857927

However, the shield can is usually made of metal, so there is a limit in reducing the size (especially thinning). Therefore, there is a problem in that it is impossible to cope with the demand for further thinning of an electronic component in which a shield can is provided on a wiring substrate and an electronic device in which an electronic component is incorporated.

In addition, the metal shield can is hard and has no softness or softness. Very low. Therefore, when the shield can is placed (joined) on the wiring board, in order to prevent the electronic component from being damaged, it is necessary to provide a gap having a certain size between the shield can and the electronic component. This also hinders the thinning of electronic components.

Further, this electronic component has a problem in that it is difficult to effectively remove the heat release of the electronic component by providing the gap.

Therefore, the present invention provides a sheet which is easy to remove heat from an electronic component, is thin and highly reliable, and exhibits a sufficient electromagnetic wave shielding effect and can reduce the thickness of the obtained electronic component.

This object is achieved by the present invention below.

An electronic component according to the present invention includes an electronic substrate including a wiring substrate having a mounting surface, and a plurality of electronic components mounted on the mounting surface of the wiring substrate; and a sheet laminated on the electronic substrate And a sheet-like substrate having conductivity and at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one of the electronic components; and a ground portion for the sheet The substrate is grounded and the sheet is fixed to the electronic substrate.

In the electronic component of the present invention, preferably, the ground portion includes a ground wiring provided on the mounting surface side of the wiring substrate, and the insulating layer has a size smaller than a size of the substrate in a plan view, and the substrate is In the exposed area exposed from the insulating layer and the ground wiring contact.

In the electronic component of the present invention, it is preferable that the mounting surface of the wiring board includes a plurality of mounting regions that are divided by the ground wiring and that mount the predetermined electronic component, and the at least one insulating layer includes Each of the mounting regions corresponds to a plurality of the insulating layers.

In the electronic component of the present invention, it is preferable that the substrate contains a cured product of a curable resin and conductive particles dispersed in the cured product.

In the electronic component of the present invention, it is preferable that the curable resin is at least one of a thermosetting resin and a photocurable resin.

In the electronic component of the present invention, it is preferable that the conductive particles have an average particle diameter of from 1 μm to 100 μm.

In the electronic component of the present invention, it is preferable that the substrate includes a cured portion containing the curable resin, a main portion of the conductive particles, and a metal film provided in contact with the main portion.

In the electronic component of the present invention, it is preferable that the metal film has a size that is substantially equal to the insulating layer in plan view.

In the electronic component of the present invention, it is preferable that the metal film has a size that is substantially equal to the main body portion in plan view.

In the electronic component of the present invention, it is preferable that the average thickness of the metal film is 0.004% to 2500% of the average thickness of the substrate.

In the electronic component of the present invention, preferably, the substrate has a first portion and In a second aspect, the first portion is provided in contact with the insulating layer and includes first conductive particles, and the second portion is opposite to the insulating layer provided on the first portion The second conductive particles are contained in an amount larger than the content of the first conductive particles in the first portion.

In the electronic component of the present invention, it is preferred that the substrate has an average thickness of from 2 μm to 500 μm.

In the electronic component of the present invention, it is preferable that the surface of the insulating layer on the side of the electronic substrate is composed of a smooth surface.

In the electronic component of the present invention, it is preferable that the surface of the insulating layer on the side of the electronic substrate is composed of a rough surface.

In the electronic component of the present invention, when the average thickness of the substrate is set to 100, the average thickness of the insulating layer is preferably 50 to 200.

In the electronic component of the present invention, it is preferable that the insulating layer contains a resin and thermally conductive particles dispersed in the resin and having a thermal conductivity higher than a thermal conductivity of the resin.

In the electronic component of the present invention, it is preferable that the constituent material of the thermally conductive particles contains at least one of alumina, aluminum nitride, and boron nitride.

In the electronic component of the present invention, it is preferable that the content of the thermally conductive particles in the insulating layer is 25% by weight to 95% by weight.

In the electronic component of the present invention, it is preferable to further have a protective layer which is provided on the opposite side of the substrate from the electronic substrate and has a function of protecting the substrate.

In the electronic component of the present invention, it is preferred that the sheet is constructed as follows In a state before being laminated on the electronic substrate, an average thickness of the first region in contact with the edge portion of the electronic component is larger than an average thickness of the second region other than the first region.

In the electronic component of the present invention, preferably, the plurality of electronic components include two or more of the electronic components arranged in parallel, and the sheet is configured in a state before being laminated on the electronic substrate. Next, the average thickness of the linear first region that continuously contacts the edge portion of the electronic component arranged in parallel is larger than the average thickness of the second region other than the first region.

In the electronic component of the present invention, it is preferable that the average thickness of the first region of the sheet is set to A [μm] in a state before the sheet is laminated on the electronic substrate. When the average thickness of the second region is set to B [μm], A/B is 1.05 to 3.

In the electronic component of the present invention, it is preferable that the sheet has at least one insulating portion provided at a position corresponding to an edge portion of the substrate on the electronic substrate side and separated from the insulating layer. .

In the electronic component of the present invention, it is preferable that the at least one insulating portion includes a plurality of the insulating portions which are provided at intervals along an edge portion of the base material.

In the electronic component of the present invention, it is preferable that the insulating portion is formed in a frame shape along an edge portion of the base material.

In the electronic component of the present invention, it is preferable that an average thickness of the insulating portion is smaller than an average thickness of the insulating layer.

In the electronic component of the present invention, it is preferable that a portion of the sheet on which the insulating portion is provided constitutes a grip portion that is held when the sheet is separated from the electronic substrate.

Further, the sheet of the present invention is a sheet which is laminated on an electronic substrate and is fixed to the electronic substrate via a ground portion, wherein the electronic substrate has a wiring board having a mounting surface, and is mounted on a plurality of electronic components on the mounting surface of the wiring substrate, and the sheet is characterized by: a sheet-shaped substrate, in a state in which the sheet is laminated on the electronic substrate, and The grounding portion is in contact with and electrically conductive; and at least one insulating layer is disposed on the electronic substrate side of the substrate in a state in which the sheet is laminated on the electronic substrate, and is provided with at least one of the electrons The size of the part.

In the sheet of the present invention, it is preferable that the substrate has a first portion which is provided in contact with the insulating layer and has adhesiveness, and a side opposite to the insulating layer which is provided on the first portion. part 2.

In the sheet of the present invention, it is preferable that the first portion contains a first resin and first conductive particles dispersed in the first resin, and the second portion contains a second resin and The second electroconductive particle in which the content of the first electroconductive particle is more than the content in the first portion is dispersed in the second resin.

In the sheet of the present invention, the content of the first conductive particles in the first portion is preferably from 1 part by weight to 100 parts by weight based on 100 parts by weight of the first resin.

The sheet of the present invention preferably has a weight of 100% relative to the second resin. The content of the second conductive particles in the second portion is from 100 parts by weight to 1,500 parts by weight.

In the sheet of the present invention, it is preferable that the shape of the first conductive particles is different from the shape of the second conductive particles.

In the sheet of the present invention, it is preferable that the shape of the first conductive particles is dendritic or spherical.

According to the present invention having the above configuration, by using a sheet having high flexibility, it is not necessary to consider damage of the electronic component when the sheet is laminated on the wiring board. Therefore, the interval between the sheet and the electronic component can be reduced until the members are in close contact or contact. Thereby, it is possible to further reduce the thickness of the electronic component in which the sheet is laminated on the electronic substrate. Further, the heat release of the electronic component can be efficiently removed via the sheet.

Therefore, according to the present invention, it is possible to provide an electronic component which is easy to remove heat from the electronic component, is thin and highly reliable, and has a sufficient electromagnetic wave shielding effect and can realize a thinning of the obtained electronic component.

1‧‧‧Sheet

2‧‧‧Substrate

2a‧‧‧ exposed area

2X‧‧‧Under

2Y‧‧‧Upper

20‧‧‧ Body Department

21‧‧‧Resin

22‧‧‧Electrical particles

23‧‧‧Metal film

24‧‧ Ears

25‧‧‧Resin

26‧‧‧Electrical particles

3‧‧‧Insulation

3a‧‧‧1st insulation layer

3b‧‧‧2nd insulation layer

3c‧‧‧3rd insulation layer

31‧‧‧Resin

32‧‧‧thermal particles

33‧‧‧1st area

34‧‧‧2nd area

35‧‧‧Insulation

4‧‧‧hard coating

10‧‧‧Electronic components

100‧‧‧Electronic substrate

110‧‧‧Wiring substrate

101‧‧‧Installation surface

101a‧‧‧1st installation area

101b‧‧‧2nd installation area

101c‧‧‧3rd installation area

111‧‧‧Substrate

112‧‧‧Wiring

113‧‧‧ Grounding Wiring

114‧‧‧Electrical sales

120‧‧‧Semiconductor wafer

Fig. 1 is an exploded perspective view showing the configuration of an electronic component of the present invention.

2 is a longitudinal cross-sectional view (a cross-sectional view taken along line A-A in FIG. 1) showing a configuration of a sheet according to the first embodiment (a state joined to an electronic substrate).

3 is an enlarged cross-sectional view showing a configuration of a sheet according to a second embodiment (a state before being bonded to an electronic substrate).

4(a) and 4(b) are enlarged cross-sectional views showing a configuration of a sheet according to a third embodiment (a state before being bonded to an electronic board).

5(a) and 5(b) are views showing a configuration of a sheet according to a fourth embodiment (a state before being bonded to an electronic substrate) (Fig. 5(a) is a plan view showing the vicinity of the insulating layer, Fig. 5; (b) is a figure which shows the center part of the cross section of the BB line in FIG. 5 (a).

Fig. 6 is a plan view showing another configuration of the sheet according to the fourth embodiment (a state before being bonded to the electronic board).

7(a) and 7(b) are views showing a configuration of a sheet according to a fifth embodiment (a state before being bonded to an electronic substrate) (Fig. 7(a) is a plan view, and Fig. 7(b) is a view Fig. 7(a) is a view showing a central portion and an end portion of a CC line cross section).

8 is a plan view showing another configuration (a state before being bonded to an electronic substrate) of the sheet according to the fifth embodiment.

(a) and (b) of FIG. 9 are longitudinal cross-sectional views showing a configuration of an end portion of an electronic component according to a sixth embodiment.

Fig. 10 is an enlarged cross-sectional view showing a configuration of a sheet according to a seventh embodiment (a state before being bonded to an electronic board).

Hereinafter, the electronic component and sheet of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

Fig. 1 is an exploded perspective view showing the configuration of an electronic component of the present invention. In addition, for convenience of explanation, the upper side in FIG. 1 is set to "up", and the lower side is set to "under".

The electronic component 10 of the present invention has an electronic substrate 100 and a sheet 1 bonded (laminated) on the electronic substrate 100. First, the electronic substrate 100 will be described before the description of the sheet 1. In addition, examples of the electronic substrate 100 include a flexible printed circuit board, a rigid printed circuit board, and a rigid flexible board.

The electronic substrate 100 includes a wiring substrate 110 having a mounting surface 101 and a plurality of semiconductor wafers (electronic components) 120 mounted on the mounting surface 101 of the wiring substrate 110. Further, examples of the semiconductor wafer 120 include a central processing unit (CPU) chip, a memory chip, a power supply chip, and a sound source wafer.

The wiring board 110 is composed of a substrate 111, a wiring 112 formed on the substrate 111, and a ground wiring (ground portion) 113. One end of the wiring 112 is connected to the power source, and the other end is connected to the terminal of the semiconductor wafer 120. The ground wiring 113 is formed in a frame shape so as to avoid the wiring 112, and is grounded. In the present embodiment, as shown in FIG. 1, the mounting surface 101 is divided into the first mounting region 101a, the second mounting region 101b, and the third mounting region 101c by the ground wiring 113. A predetermined semiconductor wafer 120 is mounted in each of the first mounting region 101a to the third mounting region 101c.

The sheet 1 is bonded to the electronic substrate 100 of this configuration. Hereinafter, the sheet 1 will be described.

<First embodiment>

First, the first embodiment of the sheet 1 will be described.

2 is a longitudinal cross-sectional view (a cross-sectional view taken along line A-A in FIG. 1) showing a configuration of a sheet according to the first embodiment (a state joined to an electronic substrate). In the following, for convenience of explanation, the upper side in FIG. 2 is set to "up" and the lower side is set to "down".

As shown in FIG. 2, the sheet 1 has a sheet-like base material 2 having an electric conductivity, an insulating layer 3 provided on a lower surface (one surface) of the base material 2, and an upper surface provided on the base material 2 (another Hard coating 4 on one side). This sheet 1 is bonded to the electronic substrate 100 by placing the insulating layer 3 on the side of the electronic substrate 100.

The base material 2 may be formed of a metal film as long as it has conductivity. However, it is preferably composed of a resin film containing a cured product or a cured product of the resin 21 and the conductive particles 22 as in the present embodiment. Further, the substrate 2 may be a combination of the metal film and the film of the resin film, or a combination of two or more different resin films. The configuration of such a combination will be shown in the following embodiments. Further, in the case where the substrate 2 is composed of a metal film, the metal film can be formed using the same metal as that exemplified for the conductive particles 22.

Further, the base material 2 can be set to have an isotropic conductivity or an anisotropic conductivity depending on the type (purpose) of the wiring substrate 110. In addition, the isotropic conductivity means that the base material 2 has electrical conductivity in the thickness direction and the surface direction, and the term "isotropic conductivity" means that the base material 2 has conductivity only in the thickness direction thereof.

The resin 21 may, for example, be a thermoplastic resin or a curable resin, and one of these resins may be used or two or more types may be used in combination. In addition, examples of the curable resin include a thermosetting resin, a photocurable resin, an anaerobic curable resin, and a reaction curable resin, and are preferably a thermosetting resin or a photocurable resin. One less. The effect of using at least one of a curable resin, particularly a thermosetting resin and a photocurable resin, as the resin 21 will be described later.

Examples of the thermoplastic resin include a polyolefin resin, an ethylene resin, a styrene-acrylic resin, a diene resin, a terpene resin, a petroleum resin, a cellulose resin, a polyamide resin, and a polyamine group. A formate resin, a polyester resin, a polycarbonate resin, a fluorine resin, or the like.

The thermosetting resin may be one which has one or more functional groups which can be used for a crosslinking reaction by heating in one molecule. Examples of the functional group include a hydroxyl group, a phenolic hydroxyl group, a methoxymethyl group, a carboxyl group, an amine group, an epoxy group, an oxetanyl group, an oxazolinyl group, an oxazinyl group, an aziridine group, and sulfur. An alcohol group, an isocyanato group, a blocked isocyanate group, a blocked carboxyl group, a stanol group or the like.

Specific examples of the thermosetting resin include an acrylic resin, a maleic resin, a polybutadiene resin, a polyester resin, a polyurethane resin, a urea resin, and an epoxy resin. Resin, oxetane resin, phenoxy resin, polyimide resin, polyamine resin, polyamidoximine resin, phenol resin, cresol resin, melamine resin, An alkyd resin, an amine resin, a polylactic acid resin, an oxazoline resin, a benzoxazine resin, an anthrone resin, a fluorine resin, or the like.

Further, in the case of using a thermosetting resin, the substrate 2 preferably contains a resin or a low molecular compound which reacts with the functional group to form a chemical crosslinking, in addition to the thermosetting resin. Agent. The curing agent is not particularly limited, and examples thereof include a phenolic curing agent such as a phenol novolak resin, and dicyandiamide. a curing agent capable of curing at a relatively high temperature like an amine-based curing agent such as dicyandiamide or an aromatic diamine, an isocyanate-based curing agent, an epoxy-based curing agent, and an aziridine-based curing agent. A metal chelate-based hardener or the like which can be subjected to a hardening reaction at a relatively low temperature (for example, 120 ° C or lower).

Further, one of the hardeners may be used alone, or two or more of them may be used in combination. The degree of hardening of the substrate 2 in the sheet 1 before (before use) laminated on the electronic substrate 100 can be controlled by appropriately selecting the kind of the curing agent, the combination and content of the curing agents, and the like (completely hardened state or half) At least one of a hardened state, a degree of fluidity (solid state or gel state), and a degree of adhesiveness (high adhesion, low adhesion, or non-adhesiveness).

On the other hand, the photocurable resin may be one which has one or more unsaturated bonds which cause a crosslinking reaction by light in one molecule. Specific examples of the photocurable resin include an acrylic resin, a maleic resin, a polybutadiene resin, a polyester resin, a polyurethane resin, an epoxy resin, and an oxygen heterocycle. Butane resin, phenoxy resin, polyamidene resin, polyamine resin, phenol resin, alkyd resin, amine resin, polylactic acid resin, oxazoline resin, benzo An oxazine resin, an anthrone resin, a fluorine resin, or the like.

In the base material 2 of the present embodiment, the conductive particles 22 are dispersed in the cured product or the cured product of the resin 21. With this configuration, the substrate 2 (sheet 1) exerts an electromagnetic wave shielding effect. Examples of the conductive particles 22 include metal particles, carbon particles, conductive resin particles, and the like, and one type of these particles may be used or two or more types may be used in combination.

Examples of the metal constituting the metal particles include gold, platinum, silver, copper, nickel, aluminum, iron, or an alloy of these metals, or indium tin oxide (ITO), antimony tin Oxide (ATO). ), etc., copper is preferred in terms of price and conductivity. Further, the metal particles may be particles having a core body made of a metal and a coating layer made of a metal and covering the core body. Examples of the metal particles include silver-coated copper particles obtained by coating a core body made of copper with a coating layer made of silver.

Further, examples of the carbon constituting the carbon particles include acetylene black, Ketjen black, furnace black, carbon nanotube, carbon nanofiber, graphite, fullerene, and graphene. Wait. In addition, examples of the conductive resin constituting the conductive resin particles include poly(3,4-extended ethyldioxythiophene), polyacetylene, and polythiophene.

The average particle diameter of the conductive particles 22 is preferably about 1 μm to 100 μm, more preferably about 3 μm to 75 μm, and still more preferably about 5 μm to 50 μm. By setting the average particle diameter of the conductive particles 22 to the above range, the filling rate of the conductive particles 22 in the substrate 2 can be increased. Therefore, the electromagnetic wave shielding effect of the substrate 2 (sheet 1) can be further improved. Further, for example, when the resin composition is prepared by mixing with the resin 21, the fluidity thereof is improved, so that the moldability of the base material 2 is improved.

Further, the shape of the conductive particles 22 may be any shape such as a spherical shape, a needle shape, a scale shape, or a dendritic shape. Further, the average particle diameter of the conductive particles 22 can be obtained by measurement by a normal laser diffraction method, a scattering method, or the like, and the average diameter of a circle which is assumed to be equal to the projected area of the fine particle assembly can be obtained. The value is set to the average particle diameter.

The content of the conductive particles 22 in the substrate 2 is not particularly limited, and is preferably from 100 parts by weight to 1,500 parts by weight, more preferably from 100 parts by weight to 1000 parts by weight, per 100 parts by weight of the resin 21 . By setting the content of the conductive particles 22 in the substrate 2 to the above range, the substrate 2 can be provided with necessary and sufficient conductivity regardless of the type of the conductive particles 22, and the substrate 2 can be sufficiently improved. Electromagnetic wave shielding effect. Further, the resin composition containing the resin 21 and the conductive particles 22 is improved in fluidity and is more likely to form the substrate 2, which is also preferable.

Further, the average thickness of the substrate 2 is not particularly limited, but is preferably about 2 μm to 500 μm, more preferably about 5 μm to 100 μm. By setting the average thickness of the substrate 2 to the above range, it is possible to prevent the mechanical strength of the substrate 2 from being lowered and to reduce the thickness of the substrate 2.

Further, the substrate 2 may further contain, for example, a coloring agent (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal deactivator, a tackifier, a dispersing agent, a decane couple. Mixture, rust inhibitor, copper inhibitor, reducing agent, antioxidant, thickening resin, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, etc.

Examples of the colorant include organic pigments, carbon black, ultramarine blue, iron oxide, zinc white, titanium oxide, graphite, and the like. Examples of the flame retardant include a halogen-containing flame retardant, a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, and an inorganic flame retardant. Examples of the filler include glass fiber, cerium oxide, talc, ceramics, and the like.

Further, examples of the lubricant include a fatty acid ester, a hydrocarbon resin, a paraffin wax, a higher fatty acid, a fatty acid decylamine, an aliphatic alcohol, a metal soap, a modified fluorenone, and the like. anti- Examples of the binder include calcium carbonate, cerium oxide, polymethylsesquioxanes, and aluminum citrate.

An insulating layer 3 is provided on the lower surface (surface on the side of the electronic substrate 100) of the substrate 2. In the present embodiment, as shown in FIG. 1, the first insulating layer 3a corresponding to the first mounting region 100a of the mounting surface 101 (wiring substrate 110) and the second mounting are provided on the lower surface of the substrate 2. The second insulating layer 3b corresponding to the region 100b and the third insulating layer 3c corresponding to the third mounting region 100c.

Each of the first insulating layer 3a to the third insulating layer 3c (hereinafter, collectively referred to as "insulating layer 3") may be provided in a plan view smaller than the substrate 2, and the sheet 1 may be laminated on the electronic substrate. The size of one or more semiconductor wafers 120 is included in the state of 100. With this configuration, the strip-shaped exposed region 2a exposed from the first insulating layer 3a to the third insulating layer 3c is formed on the lower surface of the substrate 2. Therefore, the exposed region 2a has a shape corresponding to the shape of the ground wiring 113 of the wiring substrate 110. In a state where the sheet 1 is bonded to the wiring substrate 110, the exposed region 2a is in contact with the ground wiring 113, and the substrate 2 is grounded. In other words, the exposed region 2a of the substrate 2 constitutes a connection portion (joining portion) that connects (joins) the sheet 1 to the wiring substrate 110.

For example, when the base material 2 contains a curable resin as the resin 21, the curable resin can be hardened by bringing the exposed region 2a of the base material 2 into contact with the ground wiring 113 of the wiring substrate 110. The sheet 1 is bonded (fixed) to the electronic substrate 100 in the contact portion.

The insulating layer 3 may be formed of a hard resin or a curable resin (particularly, a thermosetting resin) as long as it has sufficient insulating properties. Hard resin specific Examples thereof include acrylic, polyurethane, polyurethane urea, epoxy, epoxy ester, polyester, polycarbonate, and polyphenylene sulfide. One of these resins may be used in combination of two or more. On the other hand, as the curable resin, the same resin as the curable resin exemplified in the resin 21 can be used.

Further, when a thermosetting resin is used as the curable resin, the insulating layer 3 may contain the same curing agent as the curing agent described in the substrate 2. Thereby, the degree of hardening (completely hardened state or semi-hardened state) of the insulating layer 3 in the sheet 1 before (before use) laminated on the electronic substrate 100, the degree of fluidity (solid state or gel state) can be controlled. And at least one of the degree of adhesion (high adhesion, low adhesion or non-adhesiveness).

In addition, the insulating layer 3 may also contain, for example, a coloring agent (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal deactivator, a tackifier, a dispersing agent, a decane coupling agent. , rust inhibitors, copper inhibitors, reducing agents, antioxidants, thickening resins, plasticizers, UV absorbers, defoamers, leveling agents, etc.

The average thickness of the insulating layer 3 is not particularly limited. When the average thickness of the substrate 2 is set to 100, the ratio is preferably about 50 to 200, and more preferably about 75 to 150. Specifically, the average thickness of the insulating layer 3 is preferably from about 1 μm to about 1000 μm, more preferably from about 3 μm to about 200 μm. Thereby, the insulating layer 3 can maintain sufficient insulation and impart excellent followability to the surface of the electronic substrate 100 to the insulating layer 3 (sheet 1).

In addition, as far as promotion of heat release from the semiconductor wafer 120 is concerned, As shown in FIG. 2, the insulating layer 3 is in close contact with the surface of the semiconductor wafer 120, and by setting the relationship between the average thickness of the insulating layer 3 and the average thickness of the substrate 2 to the above range, the insulating layer 3 can be further improved. Adhesion of the surface of the semiconductor wafer 120. Further, in order to adhere the insulating layer 3 to the surface of the semiconductor wafer 120, the operation may be performed under reduced pressure or under vacuum when the sheet 1 is bonded to the electronic substrate 100.

Further, the lower surface (contact surface with the semiconductor wafer 120) of the insulating layer 3 may be composed of a smooth surface or a rough surface. When the lower surface (the surface on the electronic substrate 100 side) of the insulating layer 3 is formed by the smooth surface, the contact area between the insulating layer 3 and the surface of the semiconductor wafer 120 can be increased, and the heat radiation effect by the sheet 1 can be improved. On the other hand, if the lower surface of the insulating layer 3 is formed of a rough surface, the contact area of the insulating layer 3 with the surface of the semiconductor wafer 120 can be slightly reduced, and the insulating layer 3 can be more easily removed during the recovery of the electronic substrate 100 ( Sheet 1) is removed from the semiconductor wafer 120.

On the other hand, a hard coat layer (protective layer) 4 having a function of protecting the substrate 2 is provided on the upper surface of the substrate 2 (the surface opposite to the electronic substrate 100). Thereby, damage of the substrate 2 can be preferably prevented.

Such a hard coat layer 4 is preferably, for example, a difunctional or higher polyfunctional or monofunctional monomer having an α,β-unsaturated double bond, a vinyl monomer, an allyl monomer, and a monofunctional (methyl group). A polymer (cured product) of a radical polymerizable monomer such as an acrylate monomer or a polyfunctional (meth) acrylate monomer. By forming the hard coat layer 4 from the polymer of the monomer, the strength of the hard coat layer 4 is increased, and the effect of preventing breakage of the substrate 2 is further improved.

Further, the difunctional or higher monomer having an α,β-unsaturated double bond may be, for example, a monomer having a relatively low molecular weight of less than 1000 (so-called narrowly defined monomer), and may have, for example, a weight average molecular weight of 1,000. An oligomer or prepolymer having a relatively high molecular weight of less than 10,000 above. Here, examples of the oligomer having an α,β-unsaturated double bond include polyester (meth) acrylate, poly(meth) acrylate urethane, and epoxy (meth) acrylate. (Meth)acrylated maleic acid modified polybutadiene and the like.

Examples of the vinyl monomer include styrene, α-methylstyrene, divinylbenzene, N-vinylpyrrolidone, vinyl acetate, N-vinylformaldehyde, and N-vinylcaprolactam. Alkyl vinyl ether and the like. Further, examples of the allyl type monomer include triisomeric cyanuric acid trimethacrylate and triallyl cyanurate.

Examples of the monofunctional (meth) acrylate monomer include 2-(meth) propylene oxiranyl ethyl phthalate and 2-(methyl) propylene methoxyethyl 2- hydroxyethyl Phthalates, 2-(methyl)propenyloxyethylhexahydrophthalate, 2-(meth)acryloxypropyl phthalate, (A) 2-ethylhexyl acrylate, 2-ethylhexyl carbitol (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate Ester, benzyl (meth) acrylate, butanediol mono (meth) acrylate, butoxyethyl (meth) acrylate, butyl (meth) acrylate, caprolactone (meth) acrylate, Cetyl (meth)acrylate, cresol (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, (a) Dicyclopentenyloxyethyl acrylate, diethylene glycol monoethyl ether (meth) acrylate, dimethyl (meth) acrylate Aminoethyl ester, dipropylene glycol (meth) acrylate, phenyl (meth) acrylate, ethyl (meth) acrylate, isoamyl (meth) acrylate, isobornyl (meth) acrylate, ( Isobutyl methacrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, isostearyl (meth) acrylate, isomyristyl (meth) acrylate, lauric oxy-poly Ethylene glycol (meth) acrylate, lauryl (meth) acrylate, methoxy dipropylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate, methoxy polyethylene glycol ( Methyl) acrylate, methoxytriethylene glycol (meth) acrylate, methyl (meth) acrylate, neopentyl glycol benzoate (meth) acrylate, nonyl phenoxy polyethyl b Glycol (meth) acrylate, nonyl phenoxy polypropylene glycol (meth) acrylate, octafluoropentyl (meth) acrylate, octyloxy polyethylene glycol - polypropylene glycol (meth) acrylate, Octyl (meth)acrylate, p-cumylphenoxyethylene glycol (meth)acrylate, perfluorooctylethyl (meth)acrylate, phenoxy (meth)acrylate, phenoxydiethyl Glycol Acrylate, phenoxyethyl (meth)acrylate, phenoxy hexaethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, polyethylene glycol (A) Acrylate, stearyl (meth) acrylate, methacrylate (meth) acrylate, tert-butyl (meth) acrylate, t-butyl cyclohexyl (meth) acrylate, (methyl) Tetrafluoropropyl acrylate, tetrahydrofurfuryl (meth) acrylate, tribromophenyl (meth) acrylate, tridecyl (meth) acrylate, trifluoroethyl (meth) acrylate, (methyl) Acrylic acid-β-carboxyethyl ester, ω-carboxy-polycaprolactone (meth) acrylate, or derivatives or modified products of these monomers.

Examples of the polyfunctional (meth) acrylate monomer include 1,3-butylene glycol di(meth) acrylate, 1,4-butanediol di(meth) acrylate, and 1,6-hexane. Alcohol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, bisphenol A di(meth)propene Acid ester, bisphenol F di(meth) acrylate, diethylene glycol di(meth) acrylate, hexahydrophthalic acid di(meth) acrylate, hydroxy trimethyl acetic acid neopentyl glycol (Meth) acrylate, neopentyl glycol di(meth) acrylate, hydroxytrimethyl acetate neopentyl glycol di(meth) acrylate, pentaerythritol di(meth) acrylate, phthalic acid Di(meth)acrylate formic acid, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A Glycidyl ether di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, two Hydroxymethyldicyclopentane di(meth)acrylate, neopentyl glycol modified trimethylolpropane di(meth)acrylate, tripropylene glycol di(meth)acrylate, triglycerin di(methyl) Acrylate, dipropylene glycol di(meth)acrylate, tris(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(meth)acrylate,trimethylol Alkane tri(meth)acrylate, trimethylolpropane benzoate tri(meth)acrylate, tris((meth)propenyloxyethyl)isocyanate, di(methyl) Acrylic isocyanurate, dipentaerythritol hexa(meth) acrylate, dipentaerythritol hydroxypenta(meth) acrylate, di-trimethylolpropane tetra(meth) acrylate, pentaerythritol tetra (a) Acrylate, or a derivative or modified product of the monomers.

Further, the hard coat layer 4 may be, for example, a polyethylene terephthalate (PET), a polybutylene terephthalate (PBT)-like polyester resin, or a polymethacrylic acid. A thermoplastic resin such as a methyl ester-like acrylic resin, a polyolefin resin such as polyethylene, polypropylene or an ethylene-vinyl acetate copolymer.

In addition, the hard coat layer 4 may also contain, for example, a colorant (pigment, dye), a flame retardant, a filler (inorganic additive), a lubricant, an anti-blocking agent, a metal passivating agent, a tackifier, a dispersing agent, a decane couple. Mixture, rust inhibitor, copper inhibitor, reducing agent, antioxidant, thickening resin, plasticizer, ultraviolet absorber, antifoaming agent, leveling agent, etc.

When the hard coat layer 4 is composed of a polymer (cured material) of a monomer, the average thickness of the hard coat layer 4 is not particularly limited, but is preferably about 0.1 μm to 10 μm, more preferably about 0.5 μm to 5 μm. . On the other hand, when the hard coat layer 4 is composed of a cured product of a thermoplastic resin, the average thickness of the hard coat layer 4 is preferably from about 1 μm to about 50 μm, more preferably from about 5 μm to about 30 μm. By setting the average thickness of the hard coat layer 4 to the above range, the flexibility of the sheet 1 can be maintained, and the damage of the substrate 2 can be more reliably prevented.

Further, the protective layer is not limited to the hard coat layer 4, and may be a buffer layer or a printed layer that absorbs stress or impact from the outside, or may be a laminated body in which the layers are combined.

The sheet 1 as described above can be produced, for example, in the following manner.

First, the resin composition for a hard coat layer is applied onto a release sheet, and then cured or cured. Thereby, the hard coat layer 4 is obtained.

Then, after the base resin composition is applied onto the hard coat layer 4, it is semi-hardened, hardened, or cured. Thereby, the substrate 2 was obtained. In this state, the substrate 2 may have adhesiveness or may not have adhesiveness.

Then, the resin composition for the insulating layer is applied onto the substrate 2, and then Semi-hardened, hardened or cured. Thereby, the insulating layer 3 is obtained. In this state, the insulating layer 3 may have adhesiveness or may not have adhesiveness.

The method of applying each resin composition can be, for example, a gravure coating method, an anastomosis coating method, a die coating method, a slit coating method, a comma coat method, a blade method, or a roll coating method. The method, the knife coating method, the spray coating method, the bar coating method, the spin coating method, the dip coating method, and the like.

Further, the sheet 1 may be formed by separately forming the respective layers and joining the layers.

Further, in the sheet 1, between the substrate 2 and the hard coat layer (protective layer) 4, for example, a heat conductive layer, a water vapor barrier layer, an oxygen barrier layer, a low dielectric constant layer, and a high dielectric constant may be provided. One or more layers of a layer, a low dielectric tangent layer, a high dielectric tangent layer, a heat resistant layer, and the like.

This sheet 1 is bonded to the electronic substrate 100 in the following manner.

First, the insulating layer 3 is placed on the electronic substrate 100 side, and is set in a state in which the sheet 1 is laminated on the electronic substrate 100. Then, in this state, the pressure-bonding sheet 1 is heated to the electronic substrate 100, and as a result, the insulating layer 3 is in close contact with the surface of the semiconductor wafer 120, and the exposed region 2a of the substrate 2 is in contact with the ground wiring 113 to fix the sheet 1 ( Bonded to the electronic substrate 100. Thereby the electronic component 10 is obtained. Further, the adhesion of the insulating layer 3 to the surface of the semiconductor wafer 120 is improved by heating and pressure bonding under reduced pressure or under vacuum. As a result, not only the electromagnetic wave shielding effect obtained by the sheet 1 but also a good heat release effect is exhibited.

Furthermore, the substrate 2 contains a thermosetting resin and is semi-hardened. In the case of the shape, the thermosetting resin is cured by the heating and pressing, and the exposed region 2a of the substrate 2 is firmly bonded to the ground wiring 113 by the cured product. Further, the mechanical strength of the base material 2 (sheet 1) itself is also improved by the hardening of the thermosetting resin. In the case where the base material 2 contains a photocurable resin, light (active radiation) is applied to the exposed region 2a of the substrate 2 after the heating and pressure bonding. Thereby, the photocurable resin is cured, and the exposed region 2a of the substrate 2 is firmly bonded to the ground wiring 113 by the cured product. Further, when the base material 2 is composed of a metal film, a solder material (solder) is provided on the ground wiring 113 before the heat sealing, whereby the exposed region 2a of the substrate 2 is firmly fixed via the solder material. It is bonded to the ground wiring 113.

Such an electronic component 10 is easy to remove the heat release from the semiconductor wafer 120, and is thin and has high reliability, and can be used, for example, in a mobile phone such as a smart phone, a personal computer, a tablet terminal, and a light-emitting diode ( Light Emitting Diode, LED) lighting, organic electroluminescence (EL) lighting, LCD TVs, organic EL TVs, digital cameras, digital cameras, automotive parts, etc.

<Second embodiment>

Next, a second embodiment of the present invention will be described.

3 is an enlarged cross-sectional view showing a configuration of a sheet according to a second embodiment (a state before being bonded to an electronic substrate). In the following, the second embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIG. 3 is set to "up" and the lower side is set to "down".

In the sheet material 1 of the second embodiment, the configuration of the insulating layer 3 (the first insulating layer 3a to the third insulating layer 3c) is the same as that of the first embodiment. That is, as shown in FIG. 3, the insulating layer 3 of the second embodiment contains the resin 31 and the thermally conductive particles 32 dispersed in the resin 31 and having a thermal conductivity higher than that of the resin 31. When the insulating layer 3 contains the thermally conductive particles 32, the thermal conductivity of the sheet 1 is improved, and the heat releasing effect by the sheet 1 is further increased.

Examples of the constituent material of the thermally conductive particles 32 include metal oxides such as calcium oxide, magnesium oxide, and aluminum oxide, metal hydroxides such as aluminum hydroxide and magnesium hydroxide, and metal nitrogens such as aluminum nitride and boron nitride. Compounds, calcium carbonate, magnesium carbonate-like metal carbonates, calcium citrate-like metal silicates, crystalline cerium oxide, amorphous cerium oxide, cerium carbide-like cerium compounds, etc., can be used in these materials. One type or a combination of two or more types.

Among these materials, the constituent material of the thermally conductive particles 32 is preferably at least one of alumina, aluminum nitride, and boron nitride, and more preferably alumina in terms of heat resistance and high insulation reliability. Further, the spherical alumina can be excellent in the most dense filling of the insulating layer 3, and even when the filling amount is increased, the elastic modulus of the insulating layer 3 can be prevented from undesirably rising, in this respect, Especially good. Further, the thermally conductive particles 32 may contain a plurality of types of particles.

The average particle diameter of the thermally conductive particles 32 is not particularly limited, but is preferably about 0.1 μm to 250 μm, more preferably about 0.5 μm to 100 μm. Since the thermally conductive particles 32 having the average particle diameter are easily dispersed uniformly in the insulating layer 3, the thermal conductivity of the insulating layer 3 can be further improved.

Further, the shape of the thermally conductive particles 32 may be any shape such as a spherical shape, a needle shape, a scale shape, or a dendritic shape. In addition, the average particle diameter of the thermally conductive particles 32 can be determined by a normal laser diffraction method, a scattering method, or the like, and the average value of the diameters of a circle which is assumed to be equal to the projected area of the fine particle assembly can be obtained. Set to the average particle size.

The content of the thermally conductive particles 32 in the insulating layer 3 is not particularly limited, but is preferably about 25% by weight to about 95% by weight, more preferably about 35% by weight to about 85% by weight. By setting the content of the thermally conductive particles 32 in the insulating layer 3 to the above range, the mechanical strength of the insulating layer 3 can be prevented from being lowered, and the thermal conductivity of the insulating layer 3 can be sufficiently improved.

Further, as the resin 31, the same resin as that which can be used in the insulating layer 3 in the first embodiment can be used. Further, the insulating layer 3 may contain the same curing agent as the curing agent described in the first embodiment.

In the second embodiment as described above, the same actions and effects as those of the first embodiment are also exhibited.

<Third embodiment>

Next, a third embodiment of the present invention will be described.

4(a) and 4(b) are enlarged cross-sectional views showing a configuration of a sheet according to a third embodiment (a state before being bonded to an electronic board). In the following, the third embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIGS. 4(a) and 4(b) is set to "up" and the lower side is set to "down".

The sheet material 1 of the third embodiment is the same as the first embodiment except that the structure of the base material 2 is different. That is, as shown in FIGS. 4(a) and 4(b), the base material 2 of the third embodiment includes the main body portion 20 including the resin 21 and the conductive particles 22, and the insulating layer 3 side of the main body portion 20. A metal film 23 provided in contact with the body portion 20. When the base material 2 contains the metal film 23, the electromagnetic wave shielding effect and the heat radiation effect of the base material 2 (sheet 1) are more preferably exhibited.

The metal film 23 can be obtained by a method of attaching (bonding) a metal foil formed of a metal exemplified by the conductive particles 22 to the body portion 20; a metal oxide exemplified for the conductive particles 22 (For example, ITO or ATO), a method of forming a vapor deposited film or a sputter film on the main body portion 20 by vapor deposition or sputtering, and printing a conductive paste (for example, silver paste) to form a printed film on the main body portion 20 Method, etc. Further, in the case where the metal film 23 is composed of a metal foil, various copper foils are preferable in terms of conductivity and cost, and more preferably rolled copper foil or electrolytic copper foil.

Further, the average thickness of the metal film 23 is not particularly limited, but is preferably about 0.004% to 2500%, more preferably about 0.025% to 75%, of the average thickness of the substrate 2. By setting the average thickness of the metal film 23 to the above range, it is possible to prevent the flexibility of the base material 2 (sheet 1) from being lowered, and to sufficiently exhibit the electromagnetic wave shielding effect and the heat radiation effect of the substrate 2.

The specific average thickness of the metal film 23 is preferably as follows. For example, when the metal film 23 is formed of a vapor deposited film, the average thickness thereof is preferably about 50 nm to 300 nm, more preferably about 75 nm to 200 nm. In the case where the metal film 23 is formed of a sputter film, the average thickness thereof is preferably about 20 nm to 80 nm, more preferably 25 nm. ~70nm or so. Further, when the metal film 23 is formed of a metal foil or a printed film, the average thickness thereof is preferably about 0.01 μm to 20 μm, more preferably about 0.1 μm to 15 μm.

Further, as shown in FIG. 4(a), the metal film 23 may have a size substantially equal to that of the insulating layer 3 in plan view, or may be substantially equal to the main body portion 20 in plan view as shown in FIG. 4(b). In the case of the configuration shown in FIG. 4(a), the sheet 1 can be firmly bonded to the electronic substrate 100 by the main body portion 20 of the exposed region 2a. On the other hand, in the case of the configuration shown in FIG. 4(b), the metal film 23 of the exposed region 2a and the ground wiring 113 of the wiring substrate 110 can be metal-bonded by, for example, laser irradiation. Therefore, extremely high bonding between the sheet 1 and the electronic substrate 100 can be achieved.

Further, the metal film 23 may have a mesh shape and a shape having a plurality of through holes formed by punching. By having such a shape, the metal film 23 can be imparted with water vapor permeability.

In the third embodiment as described above, the same actions and effects as those of the first embodiment are also exhibited.

In addition, the metal film 23 may be provided so as to be in contact with the main body portion 20, and may be provided on the hard coat layer 4 side instead of the insulating layer 3 side, or may be provided at any position in the middle of the thickness direction of the main body portion 20. It can also be a combination of these.

<Fourth embodiment>

Next, a fourth embodiment of the present invention will be described.

(a) and (b) of FIG. 5 are views showing a configuration of a sheet according to a fourth embodiment (a state before being bonded to an electronic substrate) (Fig. 5(a) shows an insulating layer Fig. 5(b) is a plan view showing a central portion of a cross section taken along the line BB in Fig. 5(a), and Fig. 6 is a view showing another configuration of the sheet according to the fourth embodiment (before joining on an electronic substrate) Top view of the state). In the following, the fourth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIGS. 5(b) and 6 is set to "up" and the lower side is set to "down".

In the state before the sheet 1 is bonded to the electronic substrate 100 (the state before use of the sheet 1), the thickness of the insulating layer 3 is not uniform, and the first sheet is the same as the first one. The embodiment is the same. In other words, as shown in FIGS. 5(a) and 5(b), when the insulating layer 3 of the fourth embodiment is bonded (laminated) on the electronic substrate 100, the first region 33 where the edge portion of the semiconductor wafer 120 contacts The average thickness is larger than the average thickness of the second region 34 other than the first region 33. In the configuration of FIGS. 5(a) and 5(b), the first region 33 corresponds to the outer peripheral shape of the semiconductor wafer 120, and has a rectangular frame shape in plan view.

With this configuration, in the portion (first region 33) of the sheet 1 that is extruded by the edge portion of the semiconductor wafer 120, a sufficient thickness can be secured only for the amount of extrusion. Therefore, when the sheet 1 is bonded to the electronic substrate 100, even if the sheet 1 is extruded in the first region 33, the sheet 1 can be prevented from being broken.

When the average thickness of the first region 33 of the sheet 1 is set to A [μm] and the average thickness of the second region 34 is set to B [μm] in a state before the sheet 1 is bonded to the electronic substrate 100, A/B is preferably about 1.05~3, more preferably about 1.05~1.4, and then about 1.1~1.25. Thereby, insulation can be prevented more reliably Breaking of layer 3 (sheet 1).

Such an insulating layer 3 can be obtained by forming a portion of the insulating layer 3 having a uniform thickness on the side of the substrate 2 by the method described in the first embodiment, and then depositing it on the first region 33 of the portion. A square frame shape is formed.

In the fourth embodiment as described above, the same actions and effects as those of the first embodiment are exhibited.

In addition, the first region 33 is not limited to the region shown in FIG. 5( a ), and may be set to a region where the sheet 1 is particularly likely to be broken. For example, in the electronic substrate 100 shown in FIG. 1, two semiconductor wafers 120 are arranged side by side in the left-right direction on the front side of the paper surface. In this case, the first region 33 can be set as the edge as shown in FIG. A linear region in which the edge portions of the two semiconductor wafers 120 arranged in parallel are continuously in contact with each other. Generally, the extent to which the sheet 1 is extruded is increased at a portion where the semiconductor wafer 120 is densely arranged. Therefore, by setting the linear region across the two semiconductor wafers 120 as shown in FIG. 6 as the first region 33, the thickness of the insulating layer 3 (sheet 1) in the first region 33 is increased. The breakage of the sheet 1 can be sufficiently prevented.

Further, in a state before the sheet 1 is bonded to the electronic substrate 100, the sheet 1 may have an average thickness of the first region 33 larger than the average thickness of the second region 34, and the configuration may be realized by the following means. Instead of partially forming the thickness of the insulating layer 3, the thickness of the substrate 2 is partially formed large, or the thickness of the hard coat layer 4 is locally formed large, or a combination of the above.

<Fifth Embodiment>

Next, a fifth embodiment of the present invention will be described.

7(a) and 7(b) are views showing a configuration of a sheet according to a fifth embodiment (a state before being bonded to an electronic substrate) (Fig. 7(a) is a plan view, and Fig. 7(b) is a view Fig. 8 is a plan view showing another configuration (a state before being bonded to the electronic substrate) of the sheet according to the fifth embodiment, in the center portion and the end portion of the CC line cross section in Fig. 7(a). In the following, the fifth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIG. 7(b) is set to "up" and the lower side is set to "down".

The sheet 1 of the fifth embodiment has the insulating portion 35 which is provided apart from the insulating layer 3 along the edge portion of the lower surface of the base material 2, and is the same as the above-described first embodiment. That is, as shown in FIGS. 7(a) and 7(b), the insulating portion 35 surrounds the lower surface of the substrate 2 so as to surround the first to third insulating layers (3a to 3c). The part is formed into a square frame shape. With this configuration, in a state where the sheet 1 is joined (laminated) on the electronic substrate 100, the substrate 2 can be prevented from directly contacting the mounting surface 101 of the wiring substrate 110 at the edge portion of the sheet 1. Therefore, an unintentional short circuit between the substrate 2 and the wiring substrate 110 can be prevented, and the highly reliable electronic component 10 can be obtained.

In addition, when the sheet 1 is peeled off from the electronic substrate 100 at the time of collection of the electronic substrate 100, the portion of the sheet 1 on which the insulating portion 35 is formed is used as a starting point of the peeling operation, and the peeling can be easily performed. operating. That is, the portion of the sheet 1 on which the insulating portion 35 is provided constitutes the separated sheet 1 on the electronic substrate 100 from which the sheet 1 is laminated. Hold the grip. In particular, in the configuration shown in FIG. 7(a), since the insulating portion 35 is formed in a frame shape along the edge portion of the substrate 2, the peeling operation can be started from any portion of the entire circumference of the sheet 1.

The constituent material of the insulating portion 35 is preferably the same material as the hard resin exemplified in the insulating layer 3 of the first embodiment. By forming the insulating portion 35 with a hard resin, it is possible to prevent the insulating portion 35 from being bonded to the mounting surface 101 of the wiring substrate 110. Therefore, when the sheet 1 is peeled off from the electronic substrate 100, the portion of the sheet 1 on which the insulating portion 35 is formed can be gripped more easily and reliably.

Further, the average thickness of the insulating portion 35 is preferably set to be smaller than the average thickness of the insulating layer 3. Thereby, the insulating portion 35 can be set to be in light contact with the mounting surface 101 of the wiring substrate 110. Therefore, when the sheet 1 is peeled off from the electronic substrate 100, the portion of the sheet 1 on which the insulating portion 35 is formed is more easily held.

Further, the insulating portion 35 can be formed by the same method as the insulating layer 3, for example, by the same steps as the insulating layer 3, or by a step different from the insulating layer 3.

In the fifth embodiment as described above, the same actions and effects as those of the first embodiment are also exhibited.

Further, as shown in FIG. 8, a plurality of ear portions 24 which are formed to be spaced apart from each other along the edge portion thereof may be provided on the base material 2, and an insulating portion 35 may be provided on the lower surface of each of the ear portions 24. That is, a plurality of insulating portions 35 may be provided along the edge portions of the base material 2 at intervals. According to this configuration, the electronic substrate 100 can be housed in the casing of the electronic device in a state where the ear portion 24 is bent. Therefore, it can be prevented from being used in electronic equipment The ear portion 24 becomes an obstacle in the assembly work.

In addition, as for the starting point of the peeling operation at the time of collecting the electronic substrate 100, only one ear portion 24 (insulating portion 35) may be provided.

<Sixth embodiment>

Next, a sixth embodiment of the present invention will be described.

(a) and (b) of FIG. 9 are longitudinal cross-sectional views showing a configuration of an end portion of an electronic component according to a sixth embodiment. In the following, the sixth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIGS. 9(a) and 9(b) is set to "up" and the lower side is set to "down".

As shown in Fig. 9 (a), the sheet 1 of the sixth embodiment may be a substrate 2 having a metal film and an insulating layer 3 provided on the lower surface (one side) of the substrate 2. Layer composition. Further, on the upper surface of the ground wiring 113, a plurality of conductive pins 114 are provided at predetermined intervals along the longitudinal direction of the ground wiring 113. Each of the conductive pins 114 is disposed such that the needle tip (top portion) faces upward.

According to this configuration, when the sheet 1 is laminated on the electronic substrate 100, the exposed region 2a of the substrate 2 is pierced by the conductive pin 114 to be in contact with the ground wiring 113. Thereby, the substrate 2 can be grounded, and the sheet 1 can be fixed to the electronic substrate 100. Therefore, in the present embodiment, the grounding portion is formed by the ground wiring 113 and the conductive pin 114.

Further, the conductive pin 114 may be formed integrally with the ground wiring 113. Further, the ground wiring 113 may be omitted and the conductive pin 114 may be directly grounded. The guide The electric pin 114 can be formed using the same metal as the metal exemplified in the conductive particles 22 of the first embodiment.

Further, as shown in FIG. 9(b), the exposed region 2a of the substrate 2 may be brought into contact with the ground wiring 113, and then exposed by the conductive pin 114 toward the wiring substrate 110 (substrate 111). Area 2a.

In the sixth embodiment as described above, the same actions and effects as those of the first embodiment are also exhibited. Further, the sheet 1 may of course have the same configuration as the sheet 1 of the first embodiment to the fifth embodiment.

<Seventh embodiment>

Next, a seventh embodiment of the present invention will be described.

Fig. 10 is an enlarged cross-sectional view showing a configuration of a sheet according to a seventh embodiment (a state before being bonded to an electronic board). In the following, the seventh embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted. In the following, for convenience of explanation, the upper side in FIG. 10 is set to "up" and the lower side is set to "down".

The sheet material 1 of the seventh embodiment is the same as the first embodiment except that the structure of the base material 2 is different. That is, as shown in FIG. 10, the base material 2 of the seventh embodiment has a lower layer (first portion) 2X provided in contact with the insulating layer 3, and a lower layer 2X provided on the lower layer 2X (opposite to the insulating layer 3). The upper level (part 2) 2Y.

The lower layer 2X contains a resin (first resin) 25 and conductive particles (first conductive particles) 26 dispersed in the resin 25, and the upper layer 2Y contains a resin (second Resin) 21 and conductive particles (second conductive particles) 22 dispersed in the resin 21. Further, the content of the conductive particles 22 in the upper layer 2Y is set to be larger than the content of the conductive particles 25 in the lower layer 2X.

With this configuration, the upper layer 2Y can exhibit high electromagnetic wave shielding properties, and the lower layer 2X can be provided with adhesiveness depending on the type of the resin 25 or the like. Therefore, when the sheet 1 of the present embodiment is laminated on the electronic substrate 100, the exposed region 2a of the sheet 1 (substrate 2) can be attached and fixed to the ground wiring 113 by the adhesiveness of the lower layer 2X. .

Therefore, the operation of heating the pressure-bonding sheet 1 to the electronic substrate 100 as in the first embodiment can be omitted, that is, the sheet 1 can be attached to the electronic substrate 100 by manual operation by an operator. Therefore, the production efficiency of the electronic substrate 100 can be improved. Further, since the operation of the thermocompression bonding can be omitted, it is possible to prevent the semiconductor wafer 120 from being deteriorated by the heating at this time, and the electronic component 10 having higher reliability can be obtained.

The resin 25 is preferably a resin having a glass transition temperature of 0 ° C or lower (including rubber), and more preferably a resin having a glass transition temperature of -10 ° C or less, from the viewpoint of imparting higher adhesion to the lower layer 2X. Containing rubber), and preferably a resin (including rubber) having a glass transition temperature of -20 ° C or lower. Specific examples of the resin (including rubber) include various resins such as an acrylic resin and an urethane resin, various rubbers such as natural rubber and synthetic rubber, and various thermoplastic elastomers such as styrene block copolymers. Body and so on. Further, the lower layer 2X may contain the same curing agent as the curing agent described in the first embodiment.

The lower layer 2X may also have any conductivity of isotropic conductivity or anisotropic conductivity. Electrically, it is preferred to have anisotropic conductivity. Thereby, the current flowing through the upper layer 2Y can be more smoothly transmitted to the ground wiring 113 via the lower layer 2X, and the electromagnetic wave shielding effect of the substrate 2 (sheet 1) can be more effectively exhibited. The conductive particles 26 dispersed in the resin 25 can be the same as those of the conductive particles 22 described in the first embodiment.

The shape of the conductive particles 26 may be the same as that of the conductive particles 22 described in the first embodiment, and is preferably dendritic or spherical. When the conductive particles 26 are dendritic or spherical, even if the content in the lower layer 2X is relatively small, necessary and sufficient conductivity can be imparted to the lower layer 2X. Further, by setting the content of the conductive particles 26 in the lower layer 2X to a small amount, the adhesion of the lower layer 2X can be further improved. Further, by using the dendritic or spherical conductive particles 26, it is easy to impart anisotropic conductivity to the lower layer 2X. Further, the dendritic conductive particles 26 and the spherical conductive particles 26 may be used alone or in combination of the two.

The content of the conductive particles 26 in the lower layer 2X is preferably from 1 part by weight to 100 parts by weight, more preferably from 10 parts by weight to 50 parts by weight, per 100 parts by weight of the resin 25 . By setting the content of the conductive particles 26 in the lower layer 2X to the above range, necessary and sufficient conductivity can be imparted to the lower layer 2X, and the electromagnetic wave shielding effect of the substrate 2 can be sufficiently improved. Further, the resin composition containing the resin 25 and the conductive particles 26 is improved in fluidity, and it is more preferable to form the lower layer 2X.

On the other hand, the resin 21 and the conductive particles 22 contained in the upper layer 2Y provided on the lower layer 2X can be set to be the same as those described in the first embodiment. Composition. Further, the upper layer 2Y may contain the same curing agent as the curing agent described in the first embodiment.

The upper layer 2Y may have any conductivity of isotropic conductivity or anisotropic conductivity, and is preferably isotropic conductivity. Thereby, electromagnetic waves can be reliably captured by the upper layer 2Y, and the converted current can be quickly transmitted to the lower layer 2X. In particular, by setting the lower layer 2X to an isotropic conductivity which is different from the isotropic conductivity of the upper layer 2Y, the lower layer 2X and the upper layer 2Y can share different functions, and the substrate 2 (sheet 1) can be more effectively exhibited. Electromagnetic wave shielding effect.

The shape of the conductive particles 22 is preferably a shape different from the conductive particles 26 (particularly, a scaly shape) from the viewpoint of imparting an isotropic conductivity to the upper layer 2Y. In the case of the scaly conductive particles 22, the upper layer 2Y can contain a large amount of the conductive particles 22, and can have sufficient isotropic conductivity.

The content of the conductive particles 22 in the upper layer 2Y is preferably from 100 parts by weight to 1,500 parts by weight, more preferably from 100 parts by weight to 1000 parts by weight, per 100 parts by weight of the resin 21 . By setting the content of the conductive particles 22 in the upper layer 2Y to the above range, it is possible to impart necessary and sufficient conductivity to the upper layer 2Y, and the electromagnetic wave shielding effect of the substrate 2 can be sufficiently improved. Further, the resin composition containing the resin 21 and the conductive particles 21 is improved in fluidity, and it is more preferable to form the upper layer 2Y.

Further, in the substrate 2 of the present embodiment, when the average thickness of the lower layer 2X is set to Tx [μm] and the average thickness of the upper layer 2Y is set to Ty [μm], the ratio of the thicknesses Ty/Tx is not particularly large. The limit is preferably about 1 to 7.5, more preferably about 2 to 5. By setting the ratio Ty/Tx to the above range, it is possible to obtain a higher electromagnetic force. The substrate 2 of the wave shielding effect. Specifically, the average thickness of the lower layer 2X is preferably about 0.5 μm to 150 μm, more preferably about 1.5 μm to 25 μm, and the average thickness of the upper layer 2Y is preferably about 1.5 μm to 350 μm, more preferably about 3.5 μm to 75 μm.

Further, the upper layer 2Y may be composed of the same metal film as the metal film described in the third embodiment and the sixth embodiment.

An insulating layer 3 is provided on the lower surface (surface on the side of the electronic substrate 100) of the substrate 2. The insulating layer 3 can be configured in the same manner as the insulating layer described in the first embodiment or the second embodiment, and a resin containing a resin 21 and a curing agent similar to the upper layer 2Y can be used. Things are formed. Furthermore, the insulating layer 3 may have adhesiveness or may not have adhesiveness.

As described above, the sheet 1 of the present embodiment is preferably attached to the electronic substrate 100 by manual operation by an operator. At this time, if the insulating layer 3 has adhesiveness, the positioning of the sheet 1 on the electronic substrate 100 can be easily performed, and the production efficiency of the electronic component 10 can be further improved. On the other hand, if the insulating layer 3 does not have adhesiveness, Even if the sheet 1 is attached to the electronic substrate 100 for a while, it is easy to peel off from the electronic substrate 100, and the positional correction of the sheet 1 to the electronic substrate 100 can be easily performed.

Further, when at least one of the lower layer 2X, the upper layer 2Y, and the insulating layer 3 is in a semi-hardened state and/or a gel state, the sheet 1 may be fixed (laminated) on the electronic substrate 100, and then The layer in this state is post-hardened. Thereby, the sheet 1 can be bonded to the electronic substrate 100, and the mechanical strength of the sheet 1 can also be improved.

For example, a resin containing a glass transition temperature of 0 ° C or lower (including rubber) can be used at a relatively low temperature as described in the first embodiment. The first curing agent that is subjected to the hardening reaction, the second curing agent that can perform the curing reaction at a higher temperature than the first curing agent, and the resin composition of the conductive particles 26 form the lower layer 2X, and the sheet can be formed on the sheet. Before the use of the first layer 2X, the lower layer 2X is set to a gel state (semi-solid state), and the sheet 1 is fixed (laminated) on the electronic substrate 100, and then cured. The action of the hardener sets the lower layer 2X to a solid state.

In addition, the sheet 1 can be produced by sequentially coating the resin composition constituting each layer in the same manner as in the first embodiment to form the hard coat layer 4, the upper layer 2Y, the lower layer 2X, and the insulating layer 3. Further, in the present embodiment, since the lower layer 2X has adhesiveness, the sheet 1 can be produced by preliminarily producing a laminate in which the hard coat layer 4, the upper layer 2Y, and the lower layer 2X are laminated. The insulating layer 3 is attached to the lower layer 2X of the laminated body.

In the seventh embodiment as described above, the same actions and effects as those of the first embodiment are also exhibited.

Further, an intermediate layer of one or more arbitrary purposes may be provided between the lower layer 2X and the upper layer 2Y. The intermediate layer may, for example, be an adhesive layer for improving the adhesion between the lower layer 2X and the upper layer 2Y, the metal film 23 of the third embodiment, or the like. In the case where the adhesion layer is provided as the intermediate layer, the adhesion layer is preferably composed of, for example, a mixture of the resin composition constituting the lower layer 2X and the resin composition constituting the upper layer 2Y.

Although the electronic component and the sheet of the present invention have been described above based on the illustrated embodiment, the present invention is not limited to the embodiments. For example, forming an electronic The components and the parts of the sheet may be replaced by any constituents that can perform the same function. Further, any constituent may be added.

Further, the electronic component and the sheet may be combined with any of the first to seventh embodiments. Further, the sheet of each of the above embodiments has a hard coat layer (protective layer), but the hard coat layer (protective layer) may be provided as needed, and may be omitted. In addition, the ground portion may be grounded (connected to a reference potential) of the substrate of the sheet, and the form or shape thereof is not particularly limited.

In addition, the sheet may have a configuration in which one insulating layer is provided and the entire electronic component is covered by the one insulating layer, and one sheet may be used to cover one electronic component.

In addition, in each of the portions (each layer) constituting the sheet, a portion which is slightly extruded when bonded (laminated) on the electronic substrate is used. However, when the thickness of each portion is defined by an average value (average thickness), The values are substantially equal before and after bonding to the electronic substrate.

[Industrial availability]

An electronic component of the present invention includes an electronic substrate including a wiring substrate having a mounting surface, and a plurality of electronic components mounted on the mounting surface of the wiring substrate; and a sheet laminated on the electronic substrate and having a conductive a substrate having a sheet shape and at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one of the electronic components; and a ground portion, the substrate of the sheet Grounding and fixing the sheet to the electronic substrate. Thereby, it is possible to provide an electronic element which is easy to remove the heat release from the electronic component, and is thin and highly reliable. Pieces. Therefore, the present invention has industrial applicability.

1‧‧‧Sheet

2a‧‧‧ exposed area

3a‧‧‧1st insulation layer

3b‧‧‧2nd insulation layer

3c‧‧‧3rd insulation layer

10‧‧‧Electronic components

100‧‧‧Electronic substrate

110‧‧‧Wiring substrate

101‧‧‧Installation surface

101a‧‧‧1st installation area

101b‧‧‧2nd installation area

101c‧‧‧3rd installation area

111‧‧‧Substrate

113‧‧‧ Grounding Wiring

120‧‧‧Semiconductor wafer

Claims (17)

An electronic component comprising: an electronic substrate; a wiring board having a mounting surface; and a plurality of electronic components mounted on the mounting surface of the wiring substrate; and a sheet laminated on the electronic substrate Providing a sheet-like substrate having conductivity and at least one insulating layer provided on the electronic substrate side of the substrate and having a size including at least one of the electronic components; and a ground portion The substrate of the material is grounded and the sheet is fixed to the electronic substrate. The electronic component according to claim 1, wherein the ground portion includes a ground wiring provided on the mounting surface side of the wiring substrate, and the insulating layer has a size smaller than a size of the substrate in a plan view. The substrate is in contact with the ground wiring in an exposed region exposed from the insulating layer. The electronic component according to claim 2, wherein the mounting surface of the wiring substrate includes a plurality of mounting regions divided by the ground wiring and mounted with the predetermined electronic component, the at least one The insulating layer includes a plurality of the insulating layers provided corresponding to the respective mounting regions. The electronic component according to claim 1, wherein the substrate contains a cured product of a curable resin and conductive particles dispersed in the cured product. The electronic component of claim 4, wherein the substrate has A cured body containing the curable resin, a main body portion of the conductive particles, and a metal film provided in contact with the main body portion. The electronic component according to claim 1, wherein the substrate has a first portion and a second portion, wherein the first portion is provided in contact with the insulating layer and contains the first conductive particles The second portion is provided on the opposite side of the insulating layer from the first portion, and is contained in an amount larger than the content of the first conductive particles in the first portion. The second conductive particles. The electronic component according to claim 1, wherein the insulating layer contains a resin and thermally conductive particles dispersed in the resin and having a thermal conductivity higher than a thermal conductivity of the resin. The electronic component according to claim 1, further comprising a protective layer provided on a side opposite to the electronic substrate of the substrate and having a function of protecting the substrate. The electronic component according to claim 1, wherein the sheet is further provided at a position corresponding to an edge portion of the substrate on the electronic substrate side and separated from the insulating layer. At least one insulating portion. The electronic component according to claim 9, wherein the portion of the sheet on which the insulating portion is provided constitutes a grip portion that is held when the sheet is separated from the electronic substrate. A sheet used for laminating on an electronic substrate and fixed to the electronic substrate via a ground portion, wherein the electronic substrate includes a wiring substrate having a mounting surface, and is mounted on the sheet The mounting surface of the wiring substrate And a plurality of electronic components; and the sheet material is characterized in that: a sheet-shaped base material is in contact with the ground portion and has conductivity in a state in which the sheet material is laminated on the electronic substrate; And at least one insulating layer is disposed on the electronic substrate side of the substrate in a state where the sheet is laminated on the electronic substrate, and has a size including at least one of the electronic components. The sheet according to claim 11, wherein the substrate has a first portion provided in contact with the insulating layer and having adhesiveness, and the insulating layer disposed on the first portion The second part of the opposite side. The sheet according to claim 12, wherein the first portion contains a first resin and first conductive particles dispersed in the first resin, and the second portion contains a second resin. And the second conductive particles dispersed in the second resin in an amount larger than the content of the first conductive particles in the first portion. The sheet according to claim 13, wherein the content of the first conductive particles in the first portion is from 1 part by weight to 100 parts by weight based on 100 parts by weight of the first resin. The sheet according to claim 13, wherein the content of the second conductive particles in the second portion is from 100 parts by weight to 1,500 parts by weight based on 100 parts by weight of the second resin. The sheet of claim 13, wherein the first conductive material The shape of the particles is different from the shape of the second conductive particles. The sheet according to claim 13, wherein the first conductive particles have a dendritic shape or a spherical shape.