CN105794331A - Electronic element and sheet material - Google Patents
Electronic element and sheet material Download PDFInfo
- Publication number
- CN105794331A CN105794331A CN201480065951.5A CN201480065951A CN105794331A CN 105794331 A CN105794331 A CN 105794331A CN 201480065951 A CN201480065951 A CN 201480065951A CN 105794331 A CN105794331 A CN 105794331A
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- China
- Prior art keywords
- sheet material
- resin
- base material
- insulating barrier
- mentioned
- Prior art date
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229920001427 mPEG Polymers 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005447 octyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This electronic element has: an electronic substrate provided with a wiring substrate, which is provided with a mounting surface, and a plurality of electronic components mounted on the mounting surface of the wiring substrate; a sheet material provided with a sheet-shaped base material, which is provided with conductivity and is laminated to the electronic substrate, and at least one insulating layer provided to the electronic-substrate-side of the base material and provided with a size that encapsulates at least one of the electronic components; and a ground section that grounds the base material of the sheet material and affixes the sheet material and the electronic substrate. As a result, it is possible to provide an electronic element that his highly reliable, is thin, and from which the elimination of heat generated by the electronic components is easy.
Description
Technical field
The present invention relates to electronic component and sheet material.
Background technology
In the electronic equipments such as smart mobile phone; in order to protect the electronic unit carried on wiring substrate from the infringement of such as electromagnetic wave etc., the radome (such as referenced patent document 1) of the box like with electric conductivity is set in the way of overlay electronic parts on wiring substrate.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Patent the 4857927th
Summary of the invention
Invent problem to be solved
But, this radome is generally made up of metal, therefore, there is limitation for minification (carrying out slimming especially).Thus, the requirement of the electronic component arranging radome on wiring substrate and the further slimming of the electronic equipment being mounted with electronic component cannot be satisfied.
It addition, metal radome is hard, not there is flexibility or flexibility is extremely low.Therefore, when wiring substrate arranges (joint) radome, in order to prevent electronic unit damaged, between radome and electronic unit, it is necessary to arrange the gap possessing certain size.This also becomes the obstacle of electronic component slimming.
Additionally, above-mentioned electronic component there is also the problem removing the heating of electronic unit with being difficult to owing to arranging above-mentioned gap.
Thus, it is an object of the invention to provide the electronic component being prone to remove heating, the high reliability slimming of electronic unit, and be obtained in that sufficient electromagnetic shielding effect and obtained electronic component can be made to realize the sheet material of slimming.
Means for solving the above
Above-mentioned purpose is realized by the following present invention.
The electronic component of the present invention, it is characterised in that have:
Electric substrate, it possesses: possess the wiring substrate of installed surface；And the electronic unit on the multiple above-mentioned installed surface being arranged on this wiring substrate,
Sheet material, it possesses: the base material of the lamellar of the electric conductivity being layered on this electric substrate；And be arranged on this base material above-mentioned electric substrate side, at least one insulating barrier with the size comprising at least one above-mentioned electronic unit；And
Grounding parts, it is by the above-mentioned base material ground connection of this sheet material fixing above-mentioned sheet material and above-mentioned electric substrate.
In the electronic component of the present invention, it is preferred that above-mentioned grounding parts is included in the ground connection distribution that the above-mentioned installed surface side of above-mentioned wiring substrate is arranged,
Above-mentioned insulating barrier has the size less than above-mentioned base material when top view,
Above-mentioned base material in the exposed area exposed from above-mentioned insulating barrier with above-mentioned ground connection wiring contacts.
In the electronic component of the present invention, it is preferred that the above-mentioned installed surface of above-mentioned wiring substrate possesses multiple installation region, the plurality of installation region is divided by above-mentioned ground connection distribution and is used for installing predetermined above-mentioned electronic unit,
At least one insulating barrier above-mentioned includes the above-mentioned insulating barrier that multiple and each above-mentioned installation region is correspondingly arranged.
In the electronic component of the present invention, it is preferred that above-mentioned base material comprise curable resin solidfied material and in this solidfied material scattered electroconductive particle.
In the electronic component of the present invention, it is preferred that above-mentioned curable resin is at least one in thermosetting resin and photo-curable resin.
In the electronic component of the present invention, it is preferred that the mean diameter of above-mentioned electroconductive particle is 1～100 μm.
In the electronic component of the present invention, it is preferred that above-mentioned base material possesses: comprise the solidfied material of above-mentioned curable resin and the main part of above-mentioned electroconductive particle；And the metal film arranged is contacted with this main part.
In the electronic component of the present invention, it is preferred that there is during above-mentioned metal film top view the size almost identical with above-mentioned insulating barrier.
In the electronic component of the present invention, it is preferred that there is during above-mentioned metal film top view the size almost equal with aforementioned body portion.
In the electronic component of the present invention, it is preferred that the average thickness of above-mentioned metal film is the 0.004～2500% of the average thickness of above-mentioned base material.
In the electronic component of the present invention, it is preferred that above-mentioned base material has: contact part 1 that arrange, containing the 1st electroconductive particle with above-mentioned insulating barrier；And arrange in the above-mentioned insulating barrier opposite side with this part 1, with the part 2 containing the 2nd electroconductive particle of the amount more than above-mentioned 1st electroconductive particle content in above-mentioned part 1.
In the electronic component of the present invention, it is preferred that the average thickness of above-mentioned base material is 2～500 μm.
In the electronic component of the present invention, it is preferred that the face of the above-mentioned electric substrate side of above-mentioned insulating barrier is made up of even surface.
In the electronic component of the present invention, it is preferred that the face of the above-mentioned electric substrate side of above-mentioned insulating barrier is made up of matsurface.
In the electronic component of the present invention, it is preferred that the average thickness of above-mentioned insulating barrier is the ratio of 50～200 when the average thickness of above-mentioned base material is set to 100.
In the electronic component of the present invention, it is preferred that above-mentioned insulating barrier comprises: resin；, thermal conductivity scattered with in this resin is higher than the heat conductivity particle of the thermal conductivity of above-mentioned resin.
In the electronic component of the present invention, it is preferred that the constituent material of above-mentioned heat conductivity particle contains at least one in aluminium oxide, aluminium nitride, boron nitride.
In the electronic component of the present invention, it is preferred that above-mentioned heat conductivity particle content in above-mentioned insulating barrier is 25～95 weight %.
In the electronic component of the present invention, it is preferred that also there is protective layer that arrange in the side contrary with above-mentioned electric substrate of above-mentioned base material, that possess the function protecting above-mentioned base material.
In the electronic component of the present invention, it is preferred that above-mentioned sheet material is when being not yet laminated in above-mentioned electric substrate, and the average thickness in the 1st region of the edge part contact of above-mentioned electronic unit is more than the average thickness in the 2nd region beyond above-mentioned 1st region.
In the electronic component of the present invention, it is preferred that above-mentioned multiple electronic units comprise the above-mentioned electronic unit of more than 2 simultaneously arranged,
Above-mentioned sheet material is when being not yet laminated in above-mentioned electric substrate, and the average thickness in the 1st region forming linearity contacted continuously with the edge part of the above-mentioned electronic unit arranged simultaneously is more than the average thickness in the 2nd region beyond above-mentioned 1st region.
In the electronic component of the present invention, preferably, when above-mentioned sheet material is not yet laminated in above-mentioned electric substrate, when being set to A [μm], the average thickness in above-mentioned 2nd region is set to B [μm] by the average thickness in above-mentioned 1st region of above-mentioned sheet material, A/B is 1.05～3.
In the electronic component of the present invention, it is preferred that above-mentioned sheet material also has at least one insulation division, this at least one insulation division is separately positioned with above-mentioned insulating barrier on above-mentioned electric substrate side and the position corresponding with the edge part of above-mentioned base material.
In the electronic component of the present invention, it is preferred that at least one insulation division above-mentioned comprises multiple above-mentioned insulation division being intervally installed along the edge part of above-mentioned base material.
In the electronic component of the present invention, it is preferred that above-mentioned insulation division is formed as frame-shaped along the edge part of above-mentioned base material.
In the electronic component of the present invention, it is preferred that the average thickness of above-mentioned insulation division is less than the average thickness of above-mentioned insulating barrier.
In the electronic component of the present invention, it is preferred that the part being provided with above-mentioned insulation division of above-mentioned sheet material constitutes handle part, and this handle part is for holding above-mentioned sheet material when separating above-mentioned sheet material from above-mentioned electric substrate.
It addition, the sheet material of the present invention is to be laminated in electric substrate and be fixed on, by grounding parts, the sheet material that above-mentioned electric substrate carries out using, above-mentioned electric substrate has: possess the wiring substrate of installed surface；And the electronic unit on the multiple above-mentioned installed surface being arranged on this wiring substrate, it is characterised in that have:
The base material of the lamellar of electric conductivity, when being laminated on above-mentioned electric substrate by this sheet layer, contacts with above-mentioned grounding parts；With
At least one insulating barrier, when being laminated on above-mentioned electric substrate by this sheet layer, is positioned at the above-mentioned electric substrate side of above-mentioned base material, has the size comprising at least one above-mentioned electronic unit.
In the sheet material of the present invention, it is preferred that above-mentioned base material has: what contact setting with above-mentioned insulating barrier possesses fusible part 1 and the part 2 arranged in the above-mentioned insulating barrier opposite side with this part 1.
In the sheet material of the present invention, preferably, above-mentioned part 1 contains the 1st resin and the 1st electroconductive particle being distributed in the 1st resin, and above-mentioned part 2 contains the 2nd resin and with scattered 2nd electroconductive particle of amount more than above-mentioned 1st electroconductive particle content in above-mentioned part 1 in the 2nd resin.
In the sheet material of the present invention, it is preferred that above-mentioned 1st electroconductive particle content in above-mentioned part 1 is 1～100 weight portion relative to above-mentioned 1st resin 100 weight portion.
In the sheet material of the present invention, it is preferred that above-mentioned 2nd electroconductive particle content in above-mentioned part 2 is 100～1500 weight portions relative to above-mentioned 2nd resin 100 weight portion.
In the sheet material of the present invention, it is preferred that the shape of above-mentioned 1st electroconductive particle is different from the shape of above-mentioned 2nd electroconductive particle.
In the sheet material of the present invention, it is preferred that above-mentioned 1st electroconductive particle be shaped as dendroid or spherical.
Invention effect
The present invention according to above-mentioned composition, by using the sheet material possessing high flexibility, when being laminated on wiring substrate by this sheet layer, it is not necessary to considers the breakage of electronic unit.Therefore, until sheet material is closely sealed with electronic unit or contact, it is possible to reduce their interval.Thus, the electronic component being laminated to by sheet layer on electric substrate can realize slimming further.And then it also is able to effectively be removed the heating of electronic unit by sheet material.
Thus, in accordance with the invention it is possible to provide the slimming electronic component of the high reliability of the heating easily removing electronic unit and sufficient electromagnetic shielding effect can be obtained and obtained electronic component can be made to realize the sheet material of slimming.
Accompanying drawing explanation
Fig. 1 indicates that the exploded perspective view of the composition of the electronic component of the present invention.
Fig. 2 indicates that the longitdinal cross-section diagram (the line A-A sectional view in Fig. 1) of the composition (state engaged with electric substrate) of the sheet material of the 1st embodiment.
Fig. 3 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 2nd embodiment with electric substrate.
Fig. 4 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 3rd embodiment with electric substrate.
Fig. 5 indicates that the figure ((a) represents the top view near insulating barrier, and (b) is the figure representing the central part in the line B-B cross section in (a)) of the composition (state before engaging) of the sheet material of the 4th embodiment with electric substrate.
Fig. 6 indicates that the top view of other compositions (state before engaging) of the sheet material of the 4th embodiment with electric substrate.
Fig. 7 indicates that the figure ((a) is top view, and (b) is the figure representing central part and end in the line C-C cross section in (a)) of the composition (state before engaging) of the sheet material of the 5th embodiment with electric substrate.
Fig. 8 indicates that the top view of other compositions (state before engaging) of the sheet material of the 5th embodiment with electric substrate.
Fig. 9 indicates that the longitdinal cross-section diagram of the composition of the end of the electronic component of the 6th embodiment.
Figure 10 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 7th embodiment with electric substrate.
Detailed description of the invention
Hereinafter, about electronic component and the sheet material of the present invention, it is described in detail based on preferred implementation shown in the drawings.
Fig. 1 indicates that the exploded perspective view of the composition of the electronic component of the present invention.It should be noted that below, illustrate in order to convenient, the upside in Fig. 1 is set to " on ", downside is set to D score.
The electronic component 10 of the present invention has: electric substrate 100 and the sheet material 1 of joint (stacking) on electric substrate 100.First, before the explanation of sheet material 1, electric substrate 100 is illustrated.It should be noted that as electric substrate 100, for instance, it is possible to list flexible printing substrate, rigidity printed base plate, rigid-flex substrate etc..
Electric substrate 100 possesses: the wiring substrate 110 with installed surface 101 and the multiple semiconductor chips (electronic unit) 120 installed on the installed surface 101 of this wiring substrate 110.It should be noted that as semiconductor chip 120, for instance, it is possible to list cpu chip, storage chip, power supply chip, sound source chip etc..
Wiring substrate 110 is made up of substrate 111 and distribution 112 and the ground connection distribution (grounding parts) 113 formed on this substrate 111.One end of distribution 112 is connected with power supply, and the other end is connected with the terminal of semiconductor chip 120.Ground connection distribution 113 is formed as frame-shaped in the way of avoiding distribution 112 and carries out ground connection.In present embodiment, as it is shown in figure 1, by this ground connection distribution 113, installed surface 101 is divided into the 1st～the 3rd installation region 101a～101c.These installation regions 101a～101c is respectively mounted predetermined semiconductor chip 120.
The joining sheet material 1 on the electric substrate 100 of this composition.Hereinafter, sheet material 1 is illustrated.
<the 1st embodiment>
First, the 1st embodiment of sheet material 1 is illustrated.
Fig. 2 indicates that the longitdinal cross-section diagram (the line A-A sectional view in Fig. 1) of the composition (state engaged with electric substrate) of the sheet material of the 1st embodiment.It should be noted that below, illustrate in order to convenient, the upside in Fig. 2 is set to " on ", downside is set to D score.
As in figure 2 it is shown, sheet material 1 has: possess the base material 2 of the lamellar of electric conductivity, the insulating barrier 3 above arranged in the bottom surface (face) of base material 2 and the upper hard conating 4 arranged of end face (another face) at base material 2.This sheet material 1 makes insulating barrier 3 be in electric substrate 100 side and be bonded together with electric substrate 100.
As long as base material 2 has electric conductivity, it is also possible to be made up of metal film, as shown in the embodiment, it is preferable that be made up of the resin molding of the hardening thing comprising resin 21 or solidfied material and electroconductive particle 22.It should be noted that base material 2 can be the combination of these metal films and the film of resin molding, it is also possible to for the combination of two or more different resin molding.About the composition of combinations thereof, embodiment later illustrates.It addition, when being made up of base material 2 metal film, this metal film can use the metal same with the metal enumerated in electroconductive particle 22 to be formed.
It addition, the kind (purpose) that base material 2 is according to wiring substrate 110, it is possible to its electric conductivity is set to isotropic conductivity or anisotropic conductive.It should be noted that isotropic conductivity refers to that base material 2 has electric conductivity on its thickness direction and direction, face, anisotropic conductive refers to that base material 2 only has electric conductivity in the thickness direction thereof.
As resin 21, for instance, it is possible to list thermoplastic resin, curable resin etc., it is possible to combination uses one or more in these.It addition, as curable resin, for instance, it is possible to list thermosetting resin, photo-curable resin, anaerobically curable resin, reaction curable resin etc., it is preferred to thermosetting resin and at least one in photo-curable resin.Illustrate after the effect using at least one in curable resin, extreme heat thermosetting resin and photo-curable resin as resin 21 and produce.
As thermoplastic resin, for example, it is possible to list polyolefin-based resins, vinyl resin, styrene acrylic system resin, diolefin resins, terpenic series resin, petroleum line resin, cellulose-based resin, polyamide series resin, polyurethane series resin, polyester based resin, polycarbonate-based resin, fluorine resin etc..
As thermosetting resin, as long as have the resin of more than 1 functional group that can be used for by adding thermogenetic cross-linking reaction in 1 molecule.As this functional group, for example, it is possible to list hydroxyl, phenolic hydroxyl group, methoxy, carboxyl, amino, epoxy radicals, oxetanyl, azoles quinoline base, piperazine base, '-aziridino, sulfydryl, NCO, blocked isocyanates base, blocked carboxyl, silanol base etc..
Concrete example as this thermosetting resin, for example, it is possible to list acrylic resin, maleic acid system resin, polybutadiene system resin, polyester based resin, polyurethane series resin, Urea Series resin, epoxy system resin, oxetanes system resin, phenoxy group system resin, polyimides system resin, polyamide series resin, polyamidoimide system resin, phenol resin, first phenol resin, melamine series resin, alkyd system resin, amino system resin, polylactic acid based resin, azoles quinoline system resin, benzimidazole dihydrochloride system resin, silicon-type resin, fluorine resin etc..
It addition, when using thermosetting resin, it is preferred that as required, base material 2 also comprise except thermosetting resin with above-mentioned functional group reactions and form resin or the such firming agent of low molecular compound of chemical crosslinking.As above-mentioned firming agent, it is not particularly limited, for example, it is possible to list the such firming agent of curing reaction, isocyanate-based firming agent, epoxy firming agent, aziridine system firming agent, the metal-chelating system firming agent etc. of can carrying out at relatively high temperatures of the amine system firming agent such as phenol system firming agent, dicyandiamide, the aromatic diamines such as phenol resol resins can carry out the firming agent of curing reaction under lower temperature (such as less than 120 DEG C).
It should be noted that the one in these firming agent can be used, it is also possible to combination uses two or more.By suitably selecting the kind of firming agent, their combination and content etc., it is possible to control at least one in the degree (being fully cured state or semi-cured state) of solidification of base material 2 in the sheet material 1 on electric substrate 100 upper strata prestack (before use), the degree (solid state or gel state) of mobility and fusible degree (high adherence, low adhesion or non-adhesive).
On the other hand, as photo-curable resin, as long as have the resin that 1 light utilized above causes the unsaturated bond of cross-linking reaction in 1 molecule.Concrete example as photo-curable resin, for example, it is possible to list acrylic resin, maleic acid system resin, polybutadiene system resin, polyester based resin, polyurethane series resin, epoxy system resin, oxetanes system resin, phenoxy group system resin, polyimides system resin, polyamide series resin, phenol resin, alkyd system resin, amino system resin, polylactic acid based resin, azoles quinoline system resin, benzimidazole dihydrochloride system resin, silicon-type resin, fluorine resin etc..
In the base material 2 of present embodiment, electroconductive particle 22 is dispersed in hardening thing or the solidfied material of above-mentioned resin 21.By this composition, base material 2 (sheet material 1) plays electromagnetic shielding effect.As electroconductive particle 22, for instance, it is possible to list metallic, carbon particle, electroconductive resin particle etc., it is possible to combination uses one or more in these.
As the metal constituting metallic, for instance, it is possible to list gold, platinum, silver, copper, nickel, aluminum, ferrum or their alloy or ITO, ATO etc., be preferably copper from price and electric conductivity aspect.It addition, metallic can be possess the nucleome being made up of metal and be coated with this nucleome the particle of clad being made up of metal.As this metallic, for instance, it is possible to list the copper particle etc. covering silver being coated with, with the clad being made up of silver, the nucleome being made up of copper and obtain.
It addition, as the carbon constituting carbon particle, for instance, it is possible to list acetylene black, Ketjen black, furnace black, CNT, carbon nano-fiber, graphite, fullerene, Graphene etc..It addition, as the electroconductive resin constituting electroconductive resin particle, for instance, it is possible to list poly-(3,4-rthylene dioxythiophene), polyacetylene, polythiophene etc..
The mean diameter of electroconductive particle 22 is preferably from about 1～about 100 μm, more preferably about 3～about 75 μm, more preferably about 5～about 50 μm.By making the mean diameter of electroconductive particle 22 in above-mentioned scope, it is possible to increase the electroconductive particle 22 filling rate in base material 2.Therefore, it can improve further the electromagnetic shielding effect of base material 2 (sheet material 1).It addition, such as, when being mixed with resin combination with resin 21, its good fluidity, therefore, the formability of base material 2 is improved.
It addition, the shape of electroconductive particle 22 can be the arbitrary shapes such as spherical, needle-like, flake, dendroid.It should be noted that the mean diameter of electroconductive particle 22 can utilize common laser diffractometry, scattering method etc. to be measured and try to achieve, it can be assumed that for the circle equal with the projected area of above-mentioned Collections of microparticles body and using the meansigma methods of its diameter as mean diameter.
The electroconductive particle 22 content in base material 2, it does not have be particularly limited to, it is preferable that be 100～1500 weight portions relative to 100 weight portions of resin 21, more preferably 100～1000 weight portions.By making the electroconductive particle 22 content in base material 2 in above-mentioned scope, no matter the kind of electroconductive particle 22, base material 2 can be given necessity and sufficient electric conductivity such that it is able to improve the electromagnetic shielding effect of base material 2 fully.Further, since the mobility containing resin 21 and the resin combination of electroconductive particle 22 improves, it is more prone to form base material 2, it is thus preferred to.
It addition, the average thickness of base material 2 is also without being particularly limited to, it is preferred to about 2～about 500 μm, more preferably about 5～about 100 μm.By making the average thickness of base material 2 in above-mentioned scope, it is prevented that the mechanical strength of base material 2 reduces, further, it is possible to realize the slimming of base material 2.
It should be noted that base material 2 can also contain such as coloring agent (pigment, dyestuff), fire retardant, filler (inorganic additive), lubricant, antiblocking agent, matal deactivator, thickening agent, dispersant, silane coupler, antirust agent, copper evil inhibitor, reducing agent, antioxidant, tackifying resin, plasticizer, UV absorbent, defoamer, levelling regulator etc..
As coloring agent, for instance, it is possible to list organic pigment, carbon black, ultramarine, ferrum oxide, zinc oxide, titanium oxide, graphite etc..As fire retardant, for instance, it is possible to list halogen-containing fire retardant, phosphorous fire retardant, nitrogenous fire retardant, inorganic combustion inhibitor etc..As filler, for instance, it is possible to list glass fibre, silicon dioxide, Talcum, pottery etc..
It addition, as lubricant, for instance, it is possible to list fatty acid ester, hydrocarbon resin, paraffin, higher fatty acids, fatty acid amide, aliphatic alcohol, metallic soap, modified organic silicon etc..As antiblocking agent, for instance, it is possible to list calcium carbonate, silicon dioxide, poly methyl silsesquioxane, aluminium silicate salt etc..The bottom surface (one side of electric substrate 100 side) of above-mentioned base material 2 is provided with insulating barrier 3.In present embodiment, as it is shown in figure 1, be provided with 1st corresponding for installation region 100a with the 1st of installed surface 101 (wiring substrate 110) the 2nd corresponding for insulating barrier 3a and the 2 installation region 100b insulating barrier 3b and the 3rd insulating barrier 3c corresponding for installation region 100c with the 3rd on the bottom surface of base material 2.
1st～the 3rd insulating barrier 3a～3c is (following, sometimes " insulating barrier 3 " it is referred to collectively merely as) possess following size respectively, it may be assumed that when top view less than base material 2, and, when sheet material 1 has been laminated in electric substrate 100, comprise more than one semiconductor chip 120.By this composition, the bottom surface of base material 2 is formed with the exposed area 2a from the 1st～the 3rd insulating barrier 3a～3c banding exposed.Thus, this exposed area 2a forms the shape corresponding with the shape of the ground connection distribution 113 of wiring substrate 110.When sheet material 1 engages with wiring substrate 110, exposed area 2a contacts with ground connection distribution 113, base material 2 ground connection.That is, the exposed area 2a of base material 2 constitutes the connecting portion (junction surface) that sheet material 1 is connected (joint) with wiring substrate 110.
Such as, when base material 2 contains curable resin as resin 21, after the ground connection distribution 113 of the exposed area 2a with wiring substrate 110 that make base material 2 contacts, by making curable resin solidify, utilize this solidfied material can carry out engaging (fixing) with electric substrate 100 by sheet material 1 in this contact portion.
As long as insulating barrier 3 has sufficient insulating properties, it is possible to use hard resin or curable resin (particularly thermosetting resin) are formed.Concrete example as hard resin, for instance, it is possible to list acrylic acid, polyurethane, polyurethane-urea, epoxy resin, epoxy-ester, polyester, Merlon, polyphenylene sulfide etc., it is possible to combination uses one or more in these.On the other hand, as curable resin, it is possible to use the resin same with the curable resin listed in resin 21.
It addition, when using thermosetting resin as curable resin, insulating barrier 3 can also contain the firming agent same with the firming agent recorded in base material 2.Thus, it is possible at least one in the degree (solid state or gel state) of the degree (being fully cured state or semi-cured state) of the solidification of the insulating barrier 3 controlled in the sheet material 1 on electric substrate 100 upper strata prestack (before use), mobility and fusible degree (high adherence, low adhesion or non-adhesive).
It addition, insulating barrier 3 can also contain such as coloring agent (pigment, dyestuff), fire retardant, filler (inorganic additive), lubricant, antiblocking agent, matal deactivator, thickening agent, dispersant, silane coupler, antirust agent, copper evil inhibitor, reducing agent, antioxidant, tackifying resin, plasticizer, UV absorbent, defoamer, levelling regulator etc..
The average thickness of insulating barrier 3, it does not have be particularly limited to, is preferably from about the ratio of 50～about 200 when the average thickness of base material 2 is set to 100, more preferably the ratio of about 75～about 150.Specifically, the average thickness of insulating barrier 3 is preferably from about 1～about 1000 μm, more preferably about 3～about 200 μm.Thus, insulating barrier 3 is while keeping sufficient insulating properties, it is possible to give the tracing ability excellent for the surface of electric substrate 100 to insulating barrier 3 (sheet material 1).
Additionally, from the view point of promote the heat radiation of semiconductor chip 120, as shown in Figure 2, preferred insulating barrier 3 is closely sealed with the surface of semiconductor chip 120, tie up in above-mentioned scope by the pass of the average thickness of the average thickness Yu base material 2 that make insulating barrier 3, it is possible to improve the adaptation between insulating barrier 3 and the surface of semiconductor chip 120 further.It should be noted that in order to make insulating barrier 3 closely sealed with the surface of semiconductor chip 120, when sheet material 1 is engaged with electric substrate 100, under reduced pressure or under vacuum, carry out this operation.
It addition, the bottom surface of insulating barrier 3 (contact surface with semiconductor chip 120) can be made up of even surface, it is also possible to be made up of matsurface.If be made up of the bottom surface (face of electric substrate 100 side) of insulating barrier 3 even surface, then can make the contact area increase of insulating barrier 3 and the surface of semiconductor chip 120 such that it is able to improve the radiating effect that sheet material 1 produces.On the other hand, if be made up of the bottom surface of insulating barrier 3 matsurface, the contact area that then can make insulating barrier 3 and the surface of semiconductor chip 120 slightly reduces, during the regeneration of electric substrate 100, it is possible to remove insulating barrier 3 (sheet material 1) from semiconductor chip 120 more easily.
On the other hand, on the end face (face with electric substrate 100 opposition side) of base material 2, the hard conating (protective layer) 4 of the function with protection base material 2 is set.Thereby, it is possible to prevent the breakage of base material 2 aptly.
Above-mentioned hard conating 4 preferably by such as have α, β-unsaturated double-bond 2 officials can above multifunctional or monofunctional monomer, vinyl type monomer, allylic monomers, simple function (methyl) acrylate monomer, the such radical polymerization syzygy monomer of multifunctional (methyl) acrylate monomer polymer (solidfied material) constitute.By being made up of hard conating 4 polymer of this monomer, the intensity of hard conating 4 increases, it is prevented that the effect of base material 2 breakage improves further.
It should be noted that, there is α, 2 officials of β-unsaturated double-bond can monomer above can be the relatively low monomer of the such as molecular weight molecular weight less than 1000 (monomer of so-called narrow sense), it is also possible to be such as weight average molecular weight be 1000 less than the higher oligomer of the molecular weight of 10000 or prepolymer.At this; as having α; the oligomer of β-unsaturated double-bond; for example, it is possible to list polyester (methyl) acrylate, polyurethane (methyl) acrylate, epoxy (methyl) acrylate, (methyl) acrylated maleic acid modified polybutadiene etc..
As vinyl type monomer, for instance, it is possible to list styrene, α-methyl styrene, divinylbenzene, NVP, vinyl acetate, N-vinyl formal, N-caprolactam, alkyl vinyl ether etc..It addition, as allylic monomers, for instance, it is possible to list trimethacrylate acyl group isocyanuric acid ester, triallylcyanurate etc..nullAs simple function (methyl) acrylate monomer，Such as，2-(methyl) acryloyl-oxyethyl phthalic acid ester can be listed、2-(methyl) acryloyl-oxyethyl-2-hydroxyethyl phthalic acid ester、2-(methyl) acryloyl-oxyethyl hexahydrophthalic acid ester、2-(methyl) acryloxypropyl phthalic acid ester、2-ethylhexyl (methyl) acrylate、2-ethylhexyl carbitol (methyl) acrylate、2-hydroxybutyl (methyl) acrylate、2-hydroxyethyl (methyl) acrylate、2-hydroxypropyl (methyl) acrylate、2-methoxy ethyl (methyl) acrylate、3-methoxybutyl (methyl) acrylate、4-hydroxybutyl (methyl) acrylate、Benzyl (methyl) acrylate、Butanediol list (methyl) acrylate、Butoxyethyl group (methyl) acrylate、Butyl (methyl) acrylate、Caprolactone (methyl) acrylate、Cetyl (methyl) acrylate、Cresol (methyl) acrylate、Cyclohexyl (methyl) acrylate、Bicyclopentyl (methyl) acrylate、Dicyclopentenyl (methyl) acrylate、Dicyclopentenyl oxygen base ethyl (methyl) acrylate、TC (methyl) acrylate、Dimethyl aminoethyl (methyl) acrylate、Dipropylene glycol (methyl) acrylate、Phenyl (methyl) acrylate、Ethyl (methyl) acrylate、Isopentyl (methyl) acrylate、Isobornyl (methyl) acrylate、Isobutyl group (methyl) acrylate、Isodecyl (methyl) acrylate、Iso-octyl (methyl) acrylate、Iso stearyl (methyl) acrylate、Different myristyl (methyl) acrylate、Dodecyloxy Polyethylene Glycol (methyl) acrylate、Dodecyl (methyl) acrylate、Methoxyl group dipropylene glycol (methyl) acrylate、Methoxyl group tripropylene glycol (methyl) acrylate、Methoxy poly (ethylene glycol) (methyl) acrylate、Methoxy triethylene (methyl) acrylate、Methyl (methyl) acrylate、Neopentyl glycol benzoate (methyl) acrylate、Nonylphenoxy Polyethylene Glycol (methyl) acrylate、Nonylphenoxy polypropylene glycol (methyl) acrylate、Octafluoro amyl group (methyl) acrylate、Octyloxy polyethylene glycol propylene glycol (methyl) acrylate、Octyl group (methyl) acrylate、To cumylphenoxy ethylene glycol (methyl) acrylate、Perfluorooctylethyl group (methyl) acrylate、Phenoxy group (methyl) acrylate、Phenoxy group diethylene glycol (methyl) acrylate、Phenoxyethyl (methyl) acrylate、Phenoxy group six ethylene glycol (methyl) acrylate、Phenoxy group TEG (methyl) acrylate、Polyethylene Glycol (methyl) acrylate、Stearyl (methyl) acrylate、Succinic acid (methyl) acrylate、The tert-butyl group (methyl) acrylate、Tert-butylcyclohexyl (methyl) acrylate、Four fluoropropyls (methyl) acrylate、Tetrahydrofurfuryl (methyl) acrylate、Tribromo phenyl (methyl) acrylate、Three decyls (methyl) acrylate、Trifluoroethyl (methyl) acrylate、β-carboxy ethyl (methyl) acrylate、ω-carboxyl-polycaprolactone (methyl) acrylate、Or their derivant and modifier etc..
nullAs multifunctional (methyl) acrylate monomer，Such as，1 can be listed,3-butanediol two (methyl) acrylate、1,4-butanediol two (methyl) acrylate、1,6-hexanediol two (methyl) acrylate、1,9-nonanediol two (methyl) acrylate、Bisphenol-A two (methyl) acrylate、Bisphenol F two (methyl) acrylate、Diethylene glycol two (methyl) acrylate、Hexahydrophthalic acid two (methyl) acrylate、3-hydroxypivalic acid neopentyl glycol two (methyl) acrylate、Neopentyl glycol two (methyl) acrylate、3-hydroxypivalic acid ester neopentyl glycol two (methyl) acrylate、Tetramethylolmethane two (methyl) acrylate、Phthalic acid two (methyl) acrylate、Polyethylene Glycol two (methyl) acrylate、Polypropylene glycol two (methyl) acrylate、Polytetramethylene glycol two (methyl) acrylate、Bisphenol-A diglycidyl ether two (methyl) acrylate、Triethylene glycol two (methyl) acrylate、TEG two (methyl) acrylate、Tricyclodecane Dimethanol two (methyl) acrylate、Dihydroxymethyl bicyclopentane two (methyl) acrylate、Neopentyl glycol modifiies trimethylolpropane two (methyl) acrylate、Tripropylene glycol two (methyl) acrylate、Triglycerin two (methyl) acrylate、Dipropylene glycol two (methyl) acrylate、Glycerol three (methyl) acrylate、Tetramethylolmethane three (methyl) acrylate、Tricresyl phosphate (methyl) acrylate、Trimethylolpropane tris (methyl) acrylate、Trimethylolpropane benzoate three (methyl) acrylate、Three ((methyl) acrylyl oxy-ethyl) isocyanuric acid ester、Two (methyl) acrylated isocyanuric acid ester、Dipentaerythritol six (methyl) acrylate、Dipentaerythritol hydroxyl five (methyl) acrylate、Two trimethylolpropane four (methyl) acrylate、Tetramethylolmethane four (methyl) acrylate、Or their derivant and modifier etc..
It should be noted that hard conating 4 can also be made up of thermoplastic resins such as such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT) (PBT) such polyester based resin, the such acrylic resin of polymethyl methacrylate, polyethylene, polypropylene, the such polyolefin-based resins of vinyl-vinyl acetate copolymer.
It addition, hard conating 4 can also contain such as coloring agent (pigment, dyestuff), fire retardant, filler (inorganic additive), lubricant, antiblocking agent, matal deactivator, thickening agent, dispersant, silane coupler, antirust agent, copper evil inhibitor, reducing agent, antioxidant, tackifying resin, plasticizer, UV absorbent, defoamer, levelling regulator etc..
When being constituted hard conating 4 by the polymer (solidfied material) of monomer, the average thickness of hard conating 4, it does not have be particularly limited to, it is preferred to about 0.1～about 10 μm, more preferably about 0.5～about 5 μm.On the other hand, the solidfied material of thermoplastic resin when constituting hard conating 4, the average thickness of hard conating 4 is preferably from about 1～about 50 μm, more preferably about 5～about 30 μm.By making the average thickness of hard conating 4 in above-mentioned scope, keeping the flexual meanwhile, it is capable to more reliably prevent the breakage of base material 2 of sheet material 1.
It should be noted that protective layer is not limited to hard conating 4, it is possible to be absorb cushion from outside stress and shock, printing layer etc., it is also possible to be the duplexer being combined with these layers.
Sheet material 1 as above such as can operate as follows and manufacture.
First, after stripping film being coated with hard conating resin combination so that it is hardening or solidification.Thus, hard conating 4 is obtained.
Then, after hard conating 4 being coated with base material resin combination so that it is semi-harden, hardening or solidification.Thus, base material 2 is obtained.In this condition, base material 2 can have cohesive, it is also possible to does not have.
Then, after base material 2 being coated with resin compositions for insulating layer so that it is semi-harden, hardening or solidification.Thus, insulating barrier 3 is obtained.In this condition, insulating barrier 3 can have cohesive, it is also possible to does not have.
As the method being coated with each resin combination, it is possible to use such as plate gravure coating method, contact coating method, die coating mode, lip coating method, comma coating method, scraper plate mode, roll coating model, scraper for coating mode, spraying method, roll coating model, spin coating mode, dip coated mode etc..
It should be noted that these layers after forming each layer respectively, can be formed by sheet material 1 with being engaged with each other.
Additionally; in sheet material 1, it is also possible to 1 layer above in such as heat-conducting layer, vapor water barriers layer, oxygen barrier layer, low-dielectric constant layer, high dielectric constant layer, low dielectric loss tangent layer, high Dielectric loss tangent layer, thermostability layer etc. is set between base material 2 and hard conating (protective layer) 4.
Above-mentioned sheet material 1 is as follows to be engaged with electric substrate 100.
First, insulating barrier 3 is made to be in electric substrate 100 side and be laminated on electric substrate 100 by sheet material 1.Then, in this condition, when electric substrate 100 is received in sheet material 1 hot pressing, insulating barrier 3 is closely sealed with the surface of semiconductor chip 120, further, the exposed area 2a of base material 2 contacts with ground connection distribution 113, thus sheet material 1 is fixed (joint) on electric substrate 100.Thus, electronic component 10 is obtained.It should be noted that pass through under reduced pressure or carry out thermo-compressed under vacuum, the adaptation between the surface of insulating barrier 3 and semiconductor chip 120 improves.It is as a result, it is possible to realize electromagnetic shielding effect by sheet material 1, but also can obtain good radiating effect.
It should be noted that base material 2 is containing thermosetting resin and when semi-cured state, being pressurizeed by above-mentioned heating, thermosetting resin cured, by this solidfied material, the exposed area 2a of base material 2 engages strongly with ground connection distribution 113.It addition, by the solidification of thermosetting resin, the mechanical strength of base material 2 (sheet material 1) self also improves.It addition, when base material 2 is containing photo-curable resin, after above-mentioned thermo-compressed, the exposed area 2a of base material 2 is irradiated light (activity lonizing radiation).Thus, photo-curable resin solidifies, and by this solidfied material, the exposed area 2a of base material 2 engages strongly with ground connection distribution 113.It addition, when base material 2 is made up of metal film, before above-mentioned thermo-compressed, by arranging solder (soldering) on ground connection distribution 113, the exposed area 2a of base material 2 and ground connection distribution 113 are by the strong joint of solder.
Above-mentioned electronic component 10 easily removes the heating of semiconductor chip 120, slimming can be realized, and there is high reliability, it is possible to for the on-vehicle parts etc. of mobile phone, notebook computer, tablet terminal, LED illumination, organic EL illuminating, LCD TV, organic EL TV, digital camera, DV, the automobiles etc. such as such as smart mobile phone.
<the 2nd embodiment>
Then, the 2nd embodiment of the present invention is illustrated.
Fig. 3 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 2nd embodiment with electric substrate.Hereinafter, the 2nd embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Fig. 3 is set to " on ", downside is set to D score.
The composition of the insulating barrier 3 (the 1st～the 3rd insulating barrier 3a～3c) of the sheet material 1 of the 2nd embodiment is different, in addition, same with above-mentioned 1st embodiment.That is, as it is shown on figure 3, the insulating barrier 3 of the 2nd embodiment comprises: resin 31 and the high heat conductivity particle 32 of thermal conductivity scattered in this resin 31, thermal conductivity ratio resin 31.By insulating barrier 3 containing heat conductivity particle 32, the heat conductivity of sheet material 1 improves, sheet material 1 radiating effect produced increases further.
Constituent material as heat conductivity particle 32, such as, calcium oxide, magnesium oxide, the such metal-oxide of aluminium oxide can be listed, the such metal hydroxides of aluminium hydroxide, magnesium hydroxide, the such metal nitride of aluminium nitride, boron nitride, the such metal carbonate of calcium carbonate, magnesium carbonate, the such metal silicate of calcium silicates, crystallinity silicon dioxide, amorphism silicon dioxide, the such silicon compound of carborundum etc., it is possible to combination uses one or more in these.
Wherein, as the constituent material of heat conductivity particle 32, it is preferred at least one in aluminium oxide, aluminium nitride and boron nitride, from the view point of thermostability and insulation high reliability, more preferably aluminium oxide.It addition, spherical alumina can be filled in insulating barrier 3 the most densely, even if also being able to when increasing loading prevent the elastic modelling quantity of insulating barrier 3 from unnecessarily rising, therefore particularly preferably.It should be noted that heat conductivity particle 32 can contain multiple particle.
The mean diameter of heat conductivity particle 32, it does not have be particularly limited to, it is preferred to about 0.1～about 250 μm, more preferably about 0.5～about 100 μm.The heat conductivity particle 32 of this mean diameter is easily evenly dispersed in insulating barrier 3, therefore, it can improve further the heat conductivity of insulating barrier 3.
It addition, the shape of heat conductivity particle 32 can be spherical, the arbitrary shape such as needle-like, flake, dendroid.It should be noted that the mean diameter of heat conductivity particle 32 can utilize common laser diffractometry, scattering method etc. to be measured and try to achieve, it can be assumed that for the bowlder equal with the projected area of its Collections of microparticles body and using the meansigma methods of its diameter as mean diameter.
The heat conductivity particle 32 content in insulating barrier 3, it does not have be particularly limited to, it is preferred to about 25～about 95 weight %, more preferably about 35～about 85 weight %.By making the heat conductivity particle 32 content in insulating barrier 3 in above-mentioned scope, it is prevented that the mechanical strength of insulating barrier 3 reduces, and it is possible to improve the heat conductivity of insulating barrier 3 fully.
It should be noted that as resin 31, it is possible to use the resin same with the resin that can use in insulating barrier 3 in above-mentioned 1st embodiment.It addition, insulating barrier 3 can also contain the firming agent same with the firming agent recorded in above-mentioned 1st embodiment.
In 2nd embodiment as above, it is also possible to realize the effect same with above-mentioned 1st embodiment and effect.
<the 3rd embodiment>
Then, the 3rd embodiment of the present invention is illustrated.
Fig. 4 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 3rd embodiment with electric substrate.Hereinafter, the 3rd embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Fig. 4 is set to " on ", downside is set to D score.
The sheet material 1 of the 3rd embodiment is except the composition difference of base material 2, same with above-mentioned 1st embodiment.That is, as shown in Fig. 4 (a) and (b), the base material 2 of the 3rd embodiment possesses: contact, with insulating barrier 3 side at this main part 20, the metal film 23 arranged with the main part 20 of electroconductive particle 22 with main part 20 containing resin 21.Base material 2 is by containing metal film 23, more appropriately playing electromagnetic shielding effect and the radiating effect of base material 2 (sheet material 1).
This metal film 23 can obtain by the following method: by metal forming laminating (joint) that formed by the metal listed in electroconductive particle 22 to the method on main part 20；By being undertaken being deposited with or sputtering by the metal-oxide listed in electroconductive particle 22 (such as ITO, ATO), thus the method forming evaporation film or sputtered film on main part 20；By printing conductive paste (such as silver paste), main part 20 forms the method etc. of print film.It should be noted that when being constituted metal film 23 by metal forming, from electric conductivity with become present aspect, it is preferred to various Copper Foils, more preferably rolled copper foil or electrolytic copper foil.
It addition, the average thickness of metal film 23, it does not have it is particularly limited to, it is preferred to about the 0.004～about 2500% of the average thickness of base material 2, more preferably about 0.025～about 75%.By making the average thickness of metal film 23 in above-mentioned scope, it is prevented that the pliability of base material 2 (sheet material 1) reduces, and, give full play to electromagnetic shielding effect and the radiating effect of base material 2.
The concrete average thickness of metal film 23 is preferably as follows.Such as, when being constituted metal film 23 by evaporation film, its average thickness is preferably from about 50～about 300nm, more preferably about 75～about 200nm.When being made up of metal film 23 sputtered film, its average thickness is preferably from about 20～about 80nm, more preferably about 25～about 70nm.It addition, when being constituted metal film 23 by metal forming or print film, its average thickness is preferably from about 0.01～about 20 μm, more preferably about 0.1～about 15 μm.
It should be noted that metal film 23 is as shown in Fig. 4 (a), it is possible to size almost equal with insulating barrier 3 during for top view, as shown in Fig. 4 (b), it is possible to size almost equal with main part 20 during for top view.When composition shown in Fig. 4 (a), it is possible to use the main part 20 of exposed area 2a, engage strong with electric substrate 100 for sheet material 1.On the other hand, when composition shown in Fig. 4 (b), for instance the modes such as the laser irradiation ground connection distribution 113 to the metal film 23 in exposed area 2a with wiring substrate 110 can be passed through and carry out metal joint.Therefore, splendid joint it is capable of between sheet material 1 and electric substrate 100.
It addition, the shape of multiple through holes that above-mentioned metal film 23 can be formed as shape of a mesh, be formed by punching.By forming this shape, it is possible to give water vapo(u)r transmission to metal film 23.
In the 3rd embodiment as above, it is also possible to play the effect same with above-mentioned 1st embodiment and effect.
It should be noted that, as long as metal film 23 is arranged in the way of contacting with main part 20, hard conating 4 side can also be arranged on and non-insulated layer 3 side, it is possible to be arranged on the optional position of mid portion of the thickness direction of main part 20, it is also possible to be these combination.
<the 4th embodiment>
Then, the 4th embodiment of the present invention is illustrated.
Fig. 5 indicates that the figure figure of the central part in the line B-B cross section that the top view near insulating barrier 3a, (b) indicate that in (a) ((a) indicate that), Fig. 6 of the composition (state before engaging with electric substrate) of the sheet material of the 4th embodiment indicate that other of the sheet material of the 4th embodiment constitute the top view of (state before engaging) with electric substrate.Hereinafter, the 4th embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Fig. 5 (b) and Fig. 6 is set to " on ", downside is set to D score.
The sheet material 1 of the 4th embodiment, under the state (state before the use of sheet material 1) before sheet material 1 engages with electric substrate 100, insulating barrier 3 in uneven thickness, in addition, same with above-mentioned 1st embodiment.Namely, as shown in Fig. 5 (a) and (b), the insulating barrier 3 of the 4th embodiment when engaging (stacking) with electric substrate 100, and the average thickness in the 1st region 33 of the edge part contact of semiconductor chip 120 is more than the average thickness in the 2nd region 34 beyond the 1st region 33.In the composition of Fig. 5 (a) and (b), the 1st region 33 is corresponding with the peripheral shape of semiconductor chip 120, forms the frame-shaped of tetragon during top view.
According to this composition, it is possible to the part (the 1st region 33) at the sheet material 1 being stretched owing to the edge part of semiconductor chip 120 contacts guarantees to supplement the sufficient thickness of amount of tension.Therefore, when sheet material 1 is engaged with electric substrate 100, for instance, even if sheet material 1 is stretched in the 1st region 33, it is also possible to prevent sheet material 1 from rupturing.
When before sheet material 1 engages with electric substrate 100, when average thickness in 1st region 33 of sheet material 1 is set to A [μm], the average thickness in the 2nd region 34 is set to B [μm], A/B is preferably from about 1.05～about 3, even more preferably about 1.05～about 1.4, more preferably about 1.1～about 1.25.Thereby, it is possible to more reliably prevent the fracture of insulating barrier 3 (sheet material 1).
By the method recorded in above-mentioned 1st embodiment, form the part of the uniform thickness of base material 2 side of insulating barrier 3, then, the 1st region 33 of this part overlaps to form the frame-shaped of tetragon, thus above-mentioned insulating barrier 3 can be obtained.
In 4th embodiment as above, it is also possible to play the effect same with above-mentioned 1st embodiment and effect.
It should be noted that the 1st region 33 is not limited to the region shown in Fig. 5 (a), as long as the region of the especially easy fracture of sheet material 1.Such as, in the electric substrate 100 shown in Fig. 1, in the nearby side of paper, 2 semiconductor chips 120 are set in the lateral direction simultaneously, but in this situation, as shown in Figure 6, the 1st region 33 can set that the region for the linearity contacted continuously along the edge part of 2 semiconductor chips 120 arranged simultaneously.Generally, in the position that semiconductor chip 120 configures thick and fast, the degree that sheet material 1 is stretched increases.Therefore, the region of the linearity striding across 2 semiconductor chips 120 as shown in Figure 6 is set to the 1st region 33, by increasing the thickness of the insulating barrier 3 (sheet material 1) in the 1st region 33, it is possible to prevent the fracture of sheet material 1 fully.
It addition, when before sheet material 1 engages with electric substrate 100, the average thickness in the 1st region 33 of sheet material 1 is more than the average thickness in the 2nd region 34.Increase the thickness of hard conating 4 by the thickness of local increase base material 2, local or adopt the combination of both modes, to replace the thickness of local increase insulating barrier 3, also so being able to realize above-mentioned composition.
<the 5th embodiment>
Then, the 5th embodiment of the present invention is illustrated.
Fig. 7 indicates that ((a) is top view for the figure of the composition (state before engaging with electric substrate) of the sheet material of the 5th embodiment, b () is the figure of the central part in the line C-C cross section in expression (a) and end), Fig. 8 indicates that the top view of other compositions (state before engaging) of the sheet material of the 5th embodiment with electric substrate.Hereinafter, the 5th embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Fig. 7 (b) is set to " on ", downside is set to D score.
The sheet material 1 of the 5th embodiment has the edge part of the bottom surface along base material 2 and the insulation division 35 that insulating barrier 3 is separately positioned, in addition, same with above-mentioned 1st embodiment.That is, as shown in Fig. 7 (a) and (b), insulation division 35 is in the way of surrounding the 1st～the 3rd insulating barrier (3a～3c), and the edge part along the bottom surface of base material 2 is formed as the frame-shaped of tetragon.By this composition, it is possible to prevent the base material 2 when sheet material 1 engages (stacking) with electric substrate 100 from directly contacting at the edge part of sheet material 1 with the installed surface 101 of wiring substrate 110.Can prevent from occurring between base material 2 and wiring substrate 110 electronic component 10 of the high reliability of accidental short circuit therefore, it is possible to obtain.
It addition, when electric substrate 100 regeneration, by sheet material 1 from when electric substrate 100 is peeled off, by holding the part being formed with insulation division 35 of sheet material 1, by this origin or beginning partly as strip operation such that it is able to easily carry out this strip operation.That is, the part being provided with insulation division 35 of sheet material 1 is constituted from the handle part held during separator sheet 1 electric substrate 100 being laminated with sheet material 1.Especially in the composition as shown in Fig. 7 (a), insulation division 35 is formed as frame-shaped along the edge part of base material 2, therefore, can start strip operation from the whole any part around of sheet material 1.
The constituent material of this insulation division 35 is preferably used the material same with the hard resin listed in the insulating barrier 3 of above-mentioned 1st embodiment.By being made up of insulation division 35 hard resin, it is possible to prevent insulation division 35 from engaging with the installed surface 101 of wiring substrate 110.Therefore, when by sheet material 1 from stripping electric substrate 100, it is possible to be more prone to and reliably hold the part being formed with insulation division 35 of sheet material 1.
It addition, the average thickness of insulation division 35 is preferably set to the average thickness less than insulating barrier 3.Thus, it is possible to obtain the state making insulation division 35 with installed surface 101 gentle touchdown of wiring substrate 110.Therefore, when by sheet material 1 from stripping electric substrate 100, it is more prone to hold the part being formed with insulation division 35 of sheet material 1.
It should be noted that this insulation division 35 such as can be formed by the method same with insulating barrier 3, it is possible to by being formed with the same operation of insulating barrier 3, it is also possible to formed by the operation different from insulating barrier 3.
In 5th embodiment as above, it is also possible to play the effect same with above-mentioned 1st embodiment and effect.
It addition, as shown in Figure 8, on base material 2, the multiple ears 24 formed at each interval are set along its edge part, it is also possible to arrange insulation division 35 in the bottom surface of each ear 24.I.e., it is possible to along the edge part of base material 2, arrange multiple insulation division 35 at each interval.According to this composition, it is possible to bend the state housing electronic substrate 100 of ear 24 in the framework of electronic equipment.Therefore, it is possible to prevent ear 24 in the assembling operation of electronic equipment from becoming obstacle.
It should be noted that set out based on the purpose that ear 24 (insulation division 35) is set to the strip operation origin or beginning when electric substrate 100 regeneration, it is possible to only arrange 1 ear 24 (insulation division 35).
<the 6th embodiment>
Then, the 6th embodiment of the present invention is illustrated.
Fig. 9 indicates that the longitdinal cross-section diagram of the composition of the end of the electronic component of the 6th embodiment.Hereinafter, the 6th embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Fig. 9 is set to " on ", downside is set to D score.
As shown in Fig. 9 (a), the sheet material 1 of the 6th embodiment is 2 layers of composition, has the base material 2 being made up of metal film and the insulating barrier 3 above arranged in the bottom surface (face) of base material 2.It addition, on the end face of ground connection distribution 113, multiple conductive pins 114 are configured at a predetermined interval along the length direction of ground connection distribution 113.Each conductive pin 114 by needle point (top) upward in the way of configure.
According to this composition, on electric substrate 100 during laminated sheet 1, the exposed area 2a of conductive pin 114 transfixation base material 2 so that it is contact with ground connection distribution 113.Thereby, it is possible to make base material 2 ground connection and sheet material 1 and electric substrate 100 fixed.Thus, in present embodiment, constitute grounding parts by ground connection distribution 113 and conductive pin 114.
It should be noted that conductive pin 114 can form with ground connection distribution 113.Alternatively, it is also possible to omit ground connection distribution 113, conductive pin 114 is directly grounded.This conductive pin 114 can use the metal same with the metal listed in the electroconductive particle 22 of the 1st embodiment to be formed.
Alternatively, it is also possible to as shown in Fig. 9 (b), after the exposed area 2a of base material 2 contacts with ground connection distribution 113, make exposed area 2a towards wiring substrate 110 (substrate 111) and with conductive pin 114 by its transfixation.
In 6th embodiment as above, it is also possible to play the effect same with above-mentioned 1st embodiment and effect.It should be noted that sheet material 1 is it is of course possible to be the composition same with the sheet material 1 of the 1st～the 5th embodiment.
<the 7th embodiment>
Then, the 7th embodiment of the present invention is illustrated.
Figure 10 indicates that the amplification sectional view of the composition (state before engaging) of the sheet material of the 7th embodiment with electric substrate.Hereinafter, the 7th embodiment is illustrated, by with the difference of above-mentioned 1st embodiment centered by illustrate, about same item, the description thereof will be omitted.It should be noted that below, illustrate in order to convenient, the upside in Figure 10 is set to " on ", downside is set to D score.
The sheet material 1 of the 7th embodiment is except the composition difference of base material 2, same with above-mentioned 1st embodiment.That is, as shown in Figure 10, the base material 2 of the 7th embodiment has: contact lower floor (part 1) 2X arranged and upper strata (part 2) 2Y arranged on this lower floor 2X (with insulating barrier 3 opposition side) with insulating barrier 3.
Lower floor 2X contains: resin (the 1st resin) 25 and scattered electroconductive particle (the 1st electroconductive particle) 26 in this resin 25, upper strata 2Y contain resin (the 2nd resin) 21 and in this resin 21 scattered electroconductive particle (the 2nd electroconductive particle) 22.It addition, the content that electroconductive particle 22 is in the 2Y of upper strata is more than the electroconductive particle 25 content in lower floor 2X.
By this composition, it is possible to make upper strata 2Y play high electromagnetic wave shielding performance, and it is possible to lower floor 2X is given cohesive by the kind etc. according to resin 25.Thus, on the electric substrate 100 of present embodiment during laminated sheet 1, by utilizing the cohesive of lower floor 2X, it is possible to the exposed area 2a of sheet material 1 (base material 2) is fixed with ground connection distribution 113 laminating.
Therefore, it can omit as the 1st embodiment by the operation on electric substrate 100 of sheet material 1 thermo-compressed, i.e. fitted on electric substrate 100 by sheet material 1 by the manual work of operator.Thus, it is possible to improve the production efficiency of electric substrate 100.Further, since the operation of thermo-compressed can be omitted, accordingly it is possible to prevent the semiconductor chip 120 that the heating during due to thermo-compressed causes deteriorates such that it is able to obtain the higher electronic component of reliability 10.
As resin 25, higher fusible viewpoint is given to lower floor 2X, preferred glass transition temperature is the resin (including rubber) of less than 0 DEG C, more preferably glass transition temperature is the resin (including rubber) of less than-10 DEG C, it is preferred that the resin that glass transition temperature is less than-20 DEG C (including rubber).Concrete example as this resin (including rubber), for example, it is possible to list acrylic resin, the such various resins of carbamate system resin, natural rubber, the such various rubber of synthetic rubber, the such various thermoplastic elastomer (TPE)s of styrene block copolymer etc..It addition, lower floor 2X can also contain the firming agent same with the firming agent recorded in above-mentioned 1st embodiment.
Lower floor 2X can have any one electric conductivity in isotropic conductivity or anisotropic conductive, but preferably has anisotropic conductive.Thus, in the 2Y of upper strata, the electric current of circulation more successfully can be conducted to ground connection distribution 113 by lower floor 2X, thus more appropriately playing the electromagnetic shielding effect of base material 2 (sheet material 1).As electroconductive particle 26 scattered in resin 25, it is possible to use the kind same with the electroconductive particle 22 recorded in above-mentioned 1st embodiment and the particle of mean diameter.
The shape of electroconductive particle 26 can also be set as the shape same with the electroconductive particle 22 recorded in above-mentioned 1st embodiment, but is preferably dendroid or spherical.If dendroid or spherical electroconductive particle 26, even if then its comparision contents in lower floor 2X is few, it is also possible to lower floor 2X to be given necessary and sufficient electric conductivity.It addition, be a small amount of by making the electroconductive particle 26 content in lower floor 2X, it is possible to improve the cohesive of lower floor 2X further.It addition, by using dendroid or spherical electroconductive particle 26, it is easy to give anisotropic conductive to lower floor 2X.It should be noted that any one that can only use in dendritic electroconductive particle 26 and spherical electroconductive particle 26, it is also possible to combination uses the two.
The electroconductive particle 26 content in lower floor 2X is 1～100 weight portion preferably with respect to 100 weight portions of resin 25, more preferably 10～50 weight portions.By making the electroconductive particle 26 content in lower floor 2X in above-mentioned scope, it is possible to lower floor 2X is given necessary and sufficient electric conductivity such that it is able to improve the electromagnetic shielding effect of base material 2 fully.It addition, the mobility of the resin combination containing resin 25 and electroconductive particle 26 improves, be more prone to form lower floor 2X, based on this point it is also preferred that it.
On the other hand, the resin 21 that contains of upper strata 2Y arranged on lower floor 2X and electroconductive particle 22 can be set to and the same composition recorded in above-mentioned 1st embodiment.It addition, upper strata 2Y can also contain the firming agent same with the firming agent recorded in above-mentioned 1st embodiment.
Upper strata 2Y can have any one electric conductivity in isotropic conductivity or anisotropic conductive, but preferably has isotropic conductivity.Thus, it is possible to reliably catch electromagnetic wave in the 2Y of upper strata, and the electric current after conversion is promptly conducted to lower floor 2X.Particularly, by lower floor 2X being set as the electric conductivity different from the isotropic conductivity of upper strata 2Y and anisotropic conductive, lower floor 2X and upper strata 2Y can be made to share different effects, thus more appropriately playing the electromagnetic shielding effect of base material 2 (sheet material 1).
From the view point of give isotropic conductivity to upper strata 2Y, electroconductive particle 22 be preferably shaped to the shape different from electroconductive particle 26 (particularly flake).If laminar electroconductive particle 22, then upper strata 2Y can contain electroconductive particle 22 in large quantities such that it is able to has sufficient isotropic conductivity.
The electroconductive particle 22 content in the 2Y of upper strata, is preferably 100～1500 weight portions relative to 100 weight portions of resin 21, more preferably 100～1000 weight portions.By making the electroconductive particle 22 content in the 2Y of upper strata in above-mentioned scope, it is possible to upper strata 2Y is given necessary and sufficient electric conductivity such that it is able to improve the electromagnetic shielding effect of base material 2 fully.It addition, the mobility of the resin combination containing resin 21 and electroconductive particle 21 improves, be more prone to form upper strata 2Y, based on this point it is also preferred that it.
It should be noted that when in the base material 2 of present embodiment, the average thickness of lower floor 2X being set to Tx [μm], the average thickness of upper strata 2Y is set to Ty [μm], their ratio Ty/Tx, it is not particularly limited, it is preferred to about 1～about 7.5, more preferably about 2～about 5.By making than Ty/Tx in above-mentioned scope, the base material 2 of higher electromagnetic shielding effect can be obtained.Specifically, the average thickness of lower floor 2X is preferably from about 0.5～about 150 μm, more preferably about 1.5～about 25 μm, and the average thickness of upper strata 2Y is preferably from about 1.5～about 350 μm, more preferably about 3.5～about 75 μm.
It addition, upper strata 2Y can be made up of the metal film same with the metal film recorded in above-mentioned 3rd and the 6th embodiment.
The bottom surface (face of electric substrate 100 side) of above-mentioned base material 2 is provided with insulating barrier 3.This insulating barrier 3 can adopt the composition same with the composition recorded in above-mentioned 1st or the 2nd embodiment, in addition it is possible to use containing being formed with the resin combination of above-mentioned resin 21 same for upper strata 2Y and firming agent.It should be noted that insulating barrier 3 can have cohesive, it is also possible to do not have cohesive.
As it has been described above, the sheet material 1 of present embodiment fits on electric substrate 100 preferably by the manual work of operator.Now, if insulating barrier 3 has cohesive, sheet material 1 makes it easy to realize relative to the location of electric substrate 100, it also is able to make the production efficiency of electronic component 10 improve further, on the other hand, if insulating barrier 3 does not have cohesive, even if sheet material 1 fits on electric substrate 100, being also easy to from electric substrate 100 and peel off, therefore, sheet material 1 is also easy to carry out relative to the position correction of electric substrate 100.
It should be noted that when at least one layer in lower floor 2X, upper strata 2Y and insulating barrier 3 is semi-cured state and/or gel state, it is possible to by sheet material 1 fixing (stacking) on electric substrate 100 after, solidify after making the layer of this state.Thereby, it is possible to sheet material 1 is engaged with electric substrate 100, and, it is also possible to improve the mechanical strength of sheet material 1.
Such as, if using and wherein containing the resin (including rubber) that glass transition temperature is less than 0 DEG C, the 1st firming agent that can carry out curing reaction at a lower temperature recorded in above-mentioned 1st embodiment, the 2nd firming agent of curing reaction can be carried out at the temperature higher than the 1st firming agent, and the resin combination of electroconductive particle 26 forms lower floor 2X, then can before the use of sheet material 1, lower floor 2X is made to reach gel state (semi-solid state) by the effect of the 1st firming agent, by sheet material 1 fixing (stacking) on electric substrate 100, solidify after carrying out afterwards, thus, lower floor 2X is made to reach solid state by the effect of the 2nd firming agent.
Furthermore it is possible to operate in the same manner as above-mentioned 1st embodiment, by being coated with the resin combination constituting each layer, sequentially form hard conating 4, upper strata 2Y, lower floor 2X and insulating barrier 3 to manufacture sheet material 1.It should be noted that, in present embodiment, in view of lower floor 2X has cohesive, therefore, can also be laminated with the duplexer of hard conating 4, upper strata 2Y and lower floor 2X by making layer in advance, then the insulating barrier 3 additionally made be fitted to the lower floor 2X of duplexer to manufacture sheet material 1.
In 7th embodiment as above, it is also possible to play the effect same with above-mentioned 1st embodiment and effect.
It should be noted that the intermediate layer of any purpose of more than 1 layer between lower floor 2X and upper strata 2Y, can also be arranged.As this intermediate layer, for instance, it is possible to list the metal film 23 etc. for improving lower floor 2X and the close binder of adaptation of upper strata 2Y, above-mentioned 3rd embodiment.When arranging close binder as intermediate layer, this close binder is such as preferably made up of the mixture of the resin combination constituting lower floor 2X with the resin combination constituting upper strata 2Y.
Above, it is illustrated based on the embodiment illustrated electronic component to the present invention and sheet material, but the present invention is not limited to these.Such as, each several part constituting electronic component and sheet material can be replaced with the arbitrary composition that can play same function.Alternatively, it is also possible to additional arbitrary construct.
It should be noted that electronic component and sheet material can combine being formed arbitrarily in above-mentioned 1st～the 7th embodiment.It addition, the sheet material of the respective embodiments described above has hard conating (protective layer), but, hard conating (protective layer) can be configured as required, it is also possible to omits it.It addition, as long as grounding parts can by the base material ground connection (being connected with reference potential) of sheet material, its form and shape are not particularly limited.
It addition, sheet material can be have 1 insulating barrier and cover the composition of all electronic units with this 1 insulating barrier, it is also possible to be formed as covering the composition of 1 electronic unit with 1 sheet material.
It addition, in each portion (each layer) constituting sheet material, there is also the position that can somewhat occur to stretch when engaging (stacking) with electric substrate.When being specified with the form of meansigma methods (average thickness) by the thickness in each portion, this value is almost equal before and after engaging with electric substrate.
Industrial Availability
The electronic component of the present invention has: electric substrate, and it possesses: the wiring substrate possessing installed surface and the multiple electronic units installed on the above-mentioned installed surface of this wiring substrate；Sheet material, it possesses: on this electric substrate the base material of the lamellar of the electric conductivity of stacking and arrange in the above-mentioned electric substrate side of this base material, at least one insulating barrier with the size comprising at least one above-mentioned electronic unit；And grounding parts, it is by the above-mentioned base material ground connection of this sheet material, and fixes above-mentioned sheet material and above-mentioned electric substrate.Thereby, it is possible to provide heating, slimming and the high reliability electronic component of a kind of easy removing electronic unit.Thus, the present invention has Industrial Availability.
Label declaration
1 sheet material
2 base materials
2a exposed area
2X lower floor
2Y upper strata
20 main parts
21 resins
22 electroconductive particles
23 metal films
24 ears
25 resins
26 electroconductive particles
3 insulating barriers
3a the 1st insulating barrier
3b the 2nd insulating barrier
3c the 3rd insulating barrier
31 resins
32 heat conductivity particles
33 the 1st regions
34 the 2nd regions
35 insulation divisions
4 hard conatings
10 electronic components
100 electric substrates
110 wiring substrates
101 installed surfaces
101a the 1st installation region
101b the 2nd installation region
101c the 3rd installation region
111 substrates
112 distributions
113 ground connection distributions
114 conductive pins
120 semiconductor chips
Claims (17)
1. an electronic component, it is characterised in that have:
Electric substrate, possesses: have the wiring substrate of installed surface；And the electronic unit on the multiple described installed surface being arranged on this wiring substrate；
Sheet material, possesses: the base material of the lamellar of the electric conductivity being layered on this electric substrate；And at least one insulating barrier, it is arranged on the described electric substrate side of this base material and there is the size comprising at least one described electronic unit；And
Grounding parts, by the described base material ground connection of this sheet material fixing described sheet material and described electric substrate.
2. electronic component according to claim 1, wherein, described grounding parts comprises the ground connection distribution of the described installed surface side being arranged on described wiring substrate,
Described insulating barrier has the size less than described base material when top view,
Described base material in the exposed area exposed from described insulating barrier with described ground connection wiring contacts.
3. electronic component according to claim 2, wherein, the described installed surface of described wiring substrate possesses multiple installation region, and the plurality of installation region is divided by described ground connection distribution and is used for installing predetermined described electronic unit,
At least one insulating barrier described includes the multiple described insulating barrier being correspondingly arranged with each described installation region.
4. electronic component according to claim 1, wherein, described base material comprise curable resin solidfied material and in this solidfied material scattered electroconductive particle.
5. the electronic component according to claim 4, wherein, described base material possesses: comprise the solidfied material of described curable resin and the main part of described electroconductive particle；And the metal film arranged is contacted with this main part.
6. electronic component according to claim 1, wherein, described base material has: contact part 1 that arrange, containing the 1st electroconductive particle with described insulating barrier；And be arranged on described insulating barrier with this part 1 opposition side, with the part 2 containing the 2nd electroconductive particle of the amount more than described 1st electroconductive particle content in described part 1.
7. electronic component according to claim 1, wherein, described insulating barrier comprises: resin；And the heat conductivity particle of the thermal conductivity scattered in this resin, thermal conductivity is higher than described resin.
8. electronic component according to claim 1, wherein, also have be arranged on described base material with described electric substrate opposite side, the protective layer that possesses the function protecting described base material.
9. electronic component according to claim 1, wherein, described sheet material also has at least one insulation division, and this at least one insulation division is separately positioned with described insulating barrier on described electric substrate side the position corresponding with the edge part of described base material.
10. electronic component according to claim 9, wherein, the part being provided with described insulation division of described sheet material constitutes handle part, for described sheet material being held when separating described sheet material from described electric substrate.
11. a sheet material, it is layered on electric substrate and is fixed on this electric substrate by grounding parts, and described electric substrate has: possess the wiring substrate of installed surface；And the electronic unit on the multiple described installed surface being arranged on this wiring substrate, described sheet material is characterised by having:
The base material of the lamellar of electric conductivity, when described sheet layer is laminated on described electric substrate, described base material contacts with described grounding parts；And
At least one insulating barrier, when described sheet layer is laminated on described electric substrate, is positioned at the described electric substrate side of described base material, and has the size comprising at least one described electronic unit.
12. sheet material according to claim 11, wherein, described base material has: contact with described insulating barrier arrange, possess fusible part 1；And in the part 2 that the described insulating barrier opposite side with this part 1 is arranged.
13. sheet material according to claim 12, wherein, described part 1 contains the 1st resin and the 1st electroconductive particle being distributed in the 1st resin, and described part 2 contains the 2nd resin and with scattered 2nd electroconductive particle of amount more than described 1st electroconductive particle content in described part 1 in the 2nd resin.
14. sheet material according to claim 13, wherein, described 1st electroconductive particle content in described part 1 is 1～100 weight portion relative to described 1st resin 100 weight portion.
15. sheet material according to claim 13, wherein, described 2nd electroconductive particle content in described part 2 is 100～1500 weight portions relative to described 2nd resin 100 weight portion.
16. sheet material according to claim 13, wherein, the shape of described 1st electroconductive particle is different from the shape of described 2nd electroconductive particle.
17. sheet material according to claim 13, wherein, described 1st electroconductive particle be shaped as dendroid or spherical.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013249809 | 2013-12-03 | ||
| JP2013-249809 | 2013-12-03 | ||
| PCT/JP2014/079573 WO2015083491A1 (en) | 2013-12-03 | 2014-11-07 | Electronic element and sheet material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105794331A true CN105794331A (en) | 2016-07-20 |
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ID=53273262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480065951.5A Pending CN105794331A (en) | 2013-12-03 | 2014-11-07 | Electronic element and sheet material |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6623513B2 (en) |
| KR (2) | KR102150258B1 (en) |
| CN (1) | CN105794331A (en) |
| TW (1) | TW201524284A (en) |
| WO (1) | WO2015083491A1 (en) |
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| CN114207743A (en) * | 2019-07-31 | 2022-03-18 | 株式会社自动网络技术研究所 | Wiring member |
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| TWI744556B (en) * | 2017-10-13 | 2021-11-01 | 日商拓自達電線股份有限公司 | Shielded package |
| CN114207743A (en) * | 2019-07-31 | 2022-03-18 | 株式会社自动网络技术研究所 | Wiring member |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160074559A (en) | 2016-06-28 |
| WO2015083491A1 (en) | 2015-06-11 |
| KR102150258B1 (en) | 2020-09-01 |
| JP2015130484A (en) | 2015-07-16 |
| JP6623513B2 (en) | 2019-12-25 |
| KR20180059952A (en) | 2018-06-05 |
| TW201524284A (en) | 2015-06-16 |
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