KR101798532B1 - Adhesive Composition for Heat Dissipation Sheet and Heat Dissipation Sheet Using the Same - Google Patents
Adhesive Composition for Heat Dissipation Sheet and Heat Dissipation Sheet Using the Same Download PDFInfo
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- KR101798532B1 KR101798532B1 KR1020120008612A KR20120008612A KR101798532B1 KR 101798532 B1 KR101798532 B1 KR 101798532B1 KR 1020120008612 A KR1020120008612 A KR 1020120008612A KR 20120008612 A KR20120008612 A KR 20120008612A KR 101798532 B1 KR101798532 B1 KR 101798532B1
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Abstract
The present invention relates to a pressure-sensitive adhesive resin composition excellent in thermal conductivity and reworkability, and a heat-radiating sheet using the same, which comprises a mixture of an acrylic copolymer, a crosslinking agent, an inorganic particle and a plasticizer, To 15 parts by weight of a plasticizer having an ester value of 200 or more.
The heat-radiating sheet according to the present invention effectively controls heat conductivity and adhesive force, and is used as a heat-radiating member of an electronic product with a high heat generation, so that heat can be effectively emitted. In addition, due to the strong adhesive force, the heating element and the heat sink can be firmly adhered to each other, thereby eliminating other bonding materials such as bolts and nuts, thereby simplifying the process. In addition, the pressure-sensitive adhesive composition of the present invention is advantageous for high-speed peeling and can increase reworkability. The resistance to high-speed peeling is small, and the reworkability is excellent, so that the working efficiency can be improved.
Description
The present invention relates to a pressure-sensitive adhesive composition for a heat-radiating sheet and a heat-radiating sheet using the same, and more particularly to a pressure-sensitive adhesive sheet for a heat-radiating sheet which comprises an acrylic copolymer resin, a crosslinking agent, a mixture of thermally conductive inorganic particles and a plasticizer, And releasing heat to the outside, and a heat-radiating sheet using the same.
The heat dissipation sheet is a member used for facilitating the release of heat. In recent years, the importance of the heat dissipation sheet has been increased in accordance with the tendency of thinning of electronic equipment such as a display, a portable personal terminal, and the like, have.
Generally, when an electronic product such as a display or a portable personal terminal can not adequately diffuse the heat generated from the inside to the outside, it may cause occurrence of a screen afterimage due to excessive accumulated heat, a collision with a system failure, and the like. Particularly, the most problematic part in the recent application of LEDs is that only about 15 ~ 25% of the power supplied by the heat is converted into light and emitted only about 75 ~ 85% Is consumed as heat. The consumption of heat to a large part of such electric power leads to heat generation and raises the temperature of the LED module, which affects the luminous efficiency and life span and causes a problem that the overall reliability of the product such as durability of the package is lowered.
Therefore, the heat generated inside must be discharged to the outside. Such a heat dissipating method is generally performed by providing a heat sink or a heat dissipating fan. The heat sink has a principle of maximizing the contact area with the outside air to radiate heat to the outside, while the radiating fan has a principle of forcibly discharging the heat to the outside through the fan. Particularly, in terms of heat dissipation efficiency, . Therefore, heat-dissipating fans are mainly used for parts such as automobile light LEDs.
However, in the case of LEDs used in electronic products such as displays and tablet PCs, it is impossible to mount heat sinks and heat sinks according to the demand for light and short cuts, so heat generated from the LEDs is directly discharged to the aluminum plate. At this time, a heat dissipating member is necessarily required for efficient heat transfer between the LED and the aluminum plate.
In this case, an adhesive sheet having a thickness of about 0.01 to 3 W / mK can be used as a heat dissipating member used. In this case, the adhesive sheet strongly bonds the LED and the aluminum plate and does not require other bonding materials such as bolts and nuts The use thereof is increased, but there is a limitation in exhibiting a high thermal conductivity and an adhesive force at the same time, and there is a disadvantage in that re-workability such as peeling and reattaching is lowered when the adhesive strength is high.
Patent Document 1 attempts to satisfy both thermal conductivity and wettability by using a first adhesive layer having a porous structure, a second adhesive layer having a non-porous structure, and a thermally conductive filler dispersed in the adhesive. However, the thermal conductivity is not as high as 0.5 W / mK, so it is difficult to effectively discharge heat. It is difficult to say that the adhesive property is evaluated only by the measure of wettability, and thus the evaluation is accurate. Generally, heating elements such as LEDs are heated up to 80 ~ 90 ℃. The adhesive properties of the heat-radiating sheet should be evaluated at such a high temperature. Specifically, peeling force and holding force should be evaluated. This is because the pressure-sensitive adhesive has fluidity at room temperature, and as the temperature increases, the flowability is doubled, so that if stress such as shear force is applied, peeling may occur.
In Patent Document 2, a thermally conductive inorganic filler is mixed with a modified epoxy resin to secure a relatively high thermal conductivity and a good adhesive force. However, this patent document also has a problem that evaluation of changes in the physical properties of the adhesive at high temperatures has not been made. Basically, the heat-radiating sheet is applied at a high temperature. Therefore, the change in the physical properties at high temperature is an important factor, and evaluation thereof must be made.
In addition, since the heat-radiating sheet requires a high adhesive force, excellent reworkability is required in order to facilitate peeling and reattachment in case of an operation failure. When reworkability is poor, problems such as damage to the LED and deterioration of working efficiency due to residues may occur during peeling.
In order to meet the various conditions, it is required to satisfy the thermal conductivity, adhesion and reworkability of the heat-radiating sheet at the same time.
Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a thermosetting resin composition which comprises an acrylic copolymer resin, a crosslinking agent, a thermally conductive inorganic particle mixture and a plasticizer, Which is capable of releasing the pressure-sensitive adhesive composition to the outside.
Another object of the present invention is to provide a heat-radiating sheet excellent in thermal conductivity by using the pressure-sensitive adhesive composition.
In order to achieve the above objects, the present invention provides a plasticizer comprising a mixture of an acrylic copolymer, a crosslinking agent, an inorganic particle and a plasticizer, wherein 0.1 to 15 parts by weight, based on 100 parts by weight of the acrylic copolymer, of a plasticizer having an ester value of 200 or more The pressure-sensitive adhesive composition for a heat-radiating sheet according to claim 1,
According to the present invention, it is preferable that the acrylic copolymer contains a copolymer obtained by copolymerizing three or more kinds of monomers selected from the group consisting of a monomer having no crosslinkable functional group and a monomer having crosslinkable functional group.
According to the present invention, it is preferable that the acrylic copolymer contains 85% by weight to 99% by weight of a monomer having no crosslinkable functional group, based on the total weight of the monomers constituting the acrylic copolymer, By weight to 15% by weight.
According to the present invention, it is preferable that the crosslinking agent is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the acrylic copolymer and is a mixture of an epoxy crosslinking agent, a polyfunctional isocyanate crosslinking agent or an epoxy crosslinking agent and a polyfunctional isocyanate crosslinking agent .
According to the present invention, the inorganic particles contain 50 to 300 parts by weight based on 100 parts by weight of the acrylic copolymer, and the inorganic particles have a particle diameter of 10 to 50 μm, such as nitrides, hydroxides, oxides, carbides, And a mixture of one or more selected from the group consisting of metals.
According to the present invention, the plasticizer is selected from the group consisting of trioctyltrimellitate, dibutyl phthalate, diisononyl adipate, bis (2-butoxyethyl) adipate, acetyl tributyl citrate and bis ) Phthalate. ≪ / RTI >
The present invention also provides a heat-radiating sheet having a pressure-sensitive adhesive sheet obtained by coating the pressure-sensitive adhesive composition for a heat-radiating sheet according to any one of claims 1 to 6 on one surface or both surfaces of a heat-
The heat-radiating sheet according to the present invention effectively controls heat conductivity and adhesive force, and is used as a heat-radiating member of an electronic product with a high heat generation, so that heat can be effectively emitted. In addition, due to the strong adhesive force, the heating element and the heat sink can be firmly adhered to each other, thereby eliminating other bonding materials such as bolts and nuts, thereby simplifying the process. In addition, the pressure-sensitive adhesive composition of the present invention is advantageous for high-speed peeling and can increase reworkability.
The first aspect of the present invention provides a pressure-sensitive adhesive composition for a heat-radiating sheet comprising a mixture of an acrylic copolymer, a crosslinking agent, an inorganic particle and a plasticizer.
Each component of the pressure-sensitive adhesive composition for a heat-radiating sheet of the present invention will be described in more detail below.
The pressure-sensitive adhesive composition for a heat-radiating sheet of the present invention may contain one or a combination of two or more selected from the group consisting of natural rubber, synthetic rubber, acrylic or silicone resin as a base material of such a composition, And it is preferable to contain an acrylic resin.
The acrylic resin is composed of an acrylate copolymer. More specifically, based on the total weight of the monomers constituting the acrylic copolymer, 85 to 99% by weight of a monomer having no cross-linkable functional group, 1 to 15 By weight based on the total weight of the copolymer. When the amount of the monomer having no functional group in the pressure-sensitive adhesive composition is less than 85% by weight, the problem of the storage stability of the pressure-sensitive adhesive due to the relatively large number of functional groups and the deterioration of the cohesive force of the pressure- On the other hand, when it exceeds 99% by weight, the reactivity of the functional group is remarkably lowered, so that the reaction may not be performed well and the cohesion is deteriorated due to the decrease of the degree of crosslinking.
The acrylic copolymer preferably has a weight average molecular weight of 100,000 to 3,000,000, more preferably 40,000 to 1,000,000. When the weight-average molecular weight is less than 100,000, cohesive failure may occur. On the other hand, when the weight average molecular weight exceeds 3,000,000, viscosity may be increased and workability may be deteriorated.
The monomer having no crosslinkable functional group which can be used in the present invention is (meth) acrylic acid ester monomer, but it is not particularly limited thereto. Preferably, the monomer having no crosslinkable functional group includes (meth) acrylic acid ester having 1 to 20 carbon atoms in the alkyl moiety of the ester moiety. Examples of the (meth) acrylic acid ester having 1 to 20 carbon atoms in the alkyl moiety of the ester moiety include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) (Meth) acrylate, hexyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl Acrylate, dodecyl (meth) acrylate, dodecyl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate and stearyl (meth) acrylate. These may be used alone or in combination of two or more.
The monomer containing a crosslinkable functional group preferably contains at least one of a hydroxyl group, a carboxyl group, an amino group and an amide group as a functional group. Specific examples of such a monomer include 2-hydroxyethyl (meth) acrylic acid, 2-hydroxy (Meth) acrylic acid such as propyl (meth) acrylic acid, 3-hydroxypropyl (meth) acrylic acid, 2- hydroxybutyl (meth) acrylic acid, 3- hydroxybutyl (meth) acrylic acid, Acrylic acid hydroxyalkyl esters; Acrylamides such as N-methyl (meth) acrylamide, N-methyl (meth) acrylamide and N-methylol (meth) acrylamide; Monomethylaminoethyl (meth) acrylate, monoalkylamino (meth) acrylate; And ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid and citraconic acid. These monomers may be used alone or in combination of two or more.
As a second component of the pressure-sensitive adhesive composition for a heat-radiating sheet of the present invention, a crosslinking agent is contained in order to enhance the durability of the acrylate-based copolymer of the present invention.
The cross-linking agent used in the present invention is characterized by containing 1 to 10 parts by weight of an epoxy cross-linking agent or a polyfunctional isocyanate cross-linking agent in 100 parts by weight of an acrylate-based copolymer. If the crosslinking agent is contained in an amount of less than 1 part by weight, the reaction with the functional group contained in the acrylic copolymer can not be performed well and the cohesive force of the adhesive can not be strengthened. On the other hand, when the cross-linking agent exceeds 10 parts by weight, it is necessary to add a retarding agent which can not exhibit a constant physical property due to the change of the pressure-sensitive adhesive over time due to the increase in reactivity, This is not appropriate because it involves additional management.
Examples of the epoxy crosslinking agent include epoxy resin of bisphenol A-epichlorohydrin type, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1 , 6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, N, N, N ', N'-tetraglycidyl-m-xylenediamine or mixtures thereof Can be used. Examples of the polyfunctional isocyanate crosslinking agent include toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, trimethylol propane adduct of toluene diisocyanate, and mixtures thereof.
The pressure-sensitive adhesive composition for a heat-radiating sheet according to the present invention contains inorganic particles for imparting thermal conductivity as a third constituent component.
It is preferable that such inorganic particles have a size within the range of 10 to 50 mu m. When the particle size is less than 10 탆, the particles are difficult to be dispersed and the aggregation of the particles may occur, resulting in a decrease in thermal conductivity and adhesiveness. On the other hand, when the particle size is larger than 50 탆, So that there is a problem that the adhesion area and the adhesive strength are lowered. It is also preferable to use particles having different sizes in order to increase the particle filling density inside the adhesive resin.
The thermally conductive inorganic particles are preferably contained in the pressure-sensitive adhesive composition for a heat-radiating sheet in an amount of 50 to 300 parts by weight based on 100 parts by weight of the acrylic copolymer. When the content of the inorganic particles is less than 50 parts by weight, the filling density of the particles is low, and it is difficult to exhibit excellent thermal conductivity. On the other hand, when the content of the inorganic particles exceeds 300 parts by weight, the filling density is high, And the surface of the adhesive layer is not smooth, so that it is difficult to sufficiently adhere to the adherend.
The thermally conductive inorganic particles that can be used in the present invention include nitrides, hydroxides, oxides, carbides, carbonates, metal salts, and metal particles. Specific examples thereof include boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum hydroxide, magnesium hydroxide, silicon oxide, aluminum oxide, titanium oxide, zinc oxide, tin oxide, copper oxide, nickel carbonate, calcium carbonate, Barium, potassium titanate, copper, silver, gold, nickel, aluminum, and platinum. These particles may be used singly or in combination of two or more.
The pressure-sensitive adhesive composition for a heat-radiating sheet according to the present invention is a fourth component, and a plasticizer is used to increase the high-speed peelability.
The plasticizer that can be used in the present invention has an ester value of 200 or more and preferably 0.1 to 15 parts by weight based on 100 parts by weight of the acrylic copolymer. When the content of the plasticizer is more than 15 parts by weight, the elasticity of the pressure-sensitive adhesive layer is lowered and the holding power is lowered at a high temperature, resulting in peeling or slipping at the time of use for a long time and the plasticizer can be eluted onto the surface of the adhesive agent. If it is less than the weight part, the high-speed peeling is disadvantageous and the reworkability is deteriorated.
The plasticizer preferably has an ester value of 200 or more. Here, the ester value is defined as the number of mg of potassium hydroxide needed to completely saponify the ester contained in 1 g of the sample. When the plasticizer having an ester value of 200 or more is mixed with the pressure-sensitive adhesive composition, the compatibility is excellent and there is almost no transfer to the surface of the adherend, so that the surface of the adherend is not contaminated.
Specific examples of the plasticizer include trioctyltrimellitate, dibutyl phthalate, diisononyl adipate, bis (2-butoxyethyl) adipate, acetyl tributyl citrate, bis (2-butoxyethyl) phthalate . These may be used alone or in combination of two or more.
The heat-radiating sheet produced by the pressure-sensitive adhesive composition for a heat-radiating sheet of the present invention may be an inorganic material type in which the base film is not present and a double-sided tape type in which an adhesive layer is coated on both sides of the base film. Preferably, a double-sided tape type is preferred due to its ease of handling during operation.
As the base film, a heat resistant film having a thickness of 1 to 200 m is used. Examples of the base film include polyester resins such as polyethylene terephthalate, polybutylene terephthalide, polyethylene naphthalate and polybutylene naphthalate; Polyimide resin; Acrylic resin; Styrenic resins such as polystyrene and acrylonitrile-styrene; Polycarbonate resin; Polylactic acid resin; Polyurethane resin; Etc. may be used. Further, polyolefin resins such as polyethylene, polypropylene and ethylene-propylene copolymer; Vinyl resins such as polyvinyl chloride and polyvinylidene chloride; Polyamide resins; Sulfonic resin; Polyether-ether ketone resin; Allylate series resin; Or a blend of the above-mentioned resins. Among them, it is most preferable to use a polyethylene terephthalate (PET) film.
The pressure-sensitive adhesive sheet composition for a heat-radiating sheet of the present invention is put on one side or both sides of the base film in the composition, mixed at appropriate time / temperature conditions, and then applied to produce a heat-radiating sheet of the present invention. The pressure-sensitive adhesive composition should be a solvent in consideration of workability in coating. Solvent used should be one capable of dissolving the pressure-sensitive adhesive composition. Examples of the solvent include acetone, toluene, xylene, ethanol, isobutanol, isopropanol, cyclohexanone , Methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate and the like. These solvents may be used alone or in combination of two or more.
There is no particular limitation on the method of applying the pressure-sensitive adhesive composition, and it is possible to use a coating method known in the art such as a die coating method, a gravure coating method, a knife coating method and a bar coating method and the thickness uniformity of the pressure- It is preferable to select it by considering it. The drying conditions should be such that the heat resistance of the solvent and the resin used, the reaction conditions, and the degree of drying are taken into consideration. Usually, the adhesive layer can be formed by treating at a temperature of 100 ° C or more for 1 minute or more.
Hereinafter, the structure and effect of the present invention will be described in more detail with reference to examples and comparative examples. However, this embodiment is only an example for explaining the present invention in more detail, and the scope of the present invention is not limited to these embodiments.
< Example >
1. Synthesis of Acrylic Copolymer
A monomer containing no cross-linkable functional group and a functional group capable of cross-linking was added to the 1 L reactor equipped with a stirrer, a reflux condenser, a thermometer and a nitrogen injecting apparatus in the same amounts as shown in Table 1, and ethyl acetate 300 parts by weight based on 100 parts by weight of the monomer were added, and 0.02 part by weight of azobisisonitrile (AIBN) was added as a reaction initiator based on 100 parts by weight of the monomer, followed by polymerization reaction at 60 DEG C for 10 hours in a nitrogen stream, To synthesize a copolymer.
EA 17 parts by weight
IOA 5 parts by weight
EA 20 parts by weight
IOA 4.5 parts by weight
IOA: isooctyl acrylate, 4-HBA: 2-hydroxybutyl acrylate
2. Manufacture of heat-radiating sheet
Examples 1 to 3 and Comparative Examples 1 to 4
Hexamethylene diisocyanate (HDI, Cosmotech, NA-24T) as the crosslinking agent, aluminum hydroxide (Al (OH) 3 , C25, emulsion MS ), Magnesium hydroxide (Mg (OH) 2 , S155, emulsified MS) having an average particle diameter of 18 탆 and trioctyl trimellitate as a plasticizer were added, respectively, and diluted with methyl ethyl ketone (MEK) Respectively.
The mixture was coated on both sides of a 12 占 퐉 biaxially stretched polyethylene terephthalate film (trade name: XG533, manufactured by Toray Industries, Ltd.) to prepare a heat radiation sheet having a thickness of 200 占 퐉. Thereafter, a polyethylene terephthalate film (trade name: RPK-101, manufactured by Toray Industries, Ltd.) which had been subjected to release treatment on both sides of the heat-radiating sheet was laminated and sufficiently aged at 50 캜 for 3 days to complete the heat-radiating sheet of the present invention.
The properties and properties of the heat-radiating sheet prepared in the examples and comparative examples were checked using the following experimental methods, and the results are summarized in Table 3.
≪ Evaluation of physical properties &
1. High temperature Peel force Measure
The heat-radiating sheet prepared in the above-mentioned Examples and Comparative Examples was cut into 25x250 mm and attached to the aluminum plate by reciprocating 3 times with a 2 kg rubber roller. Thereafter, the substrate was heated in an oven at 100 ° C for 60 minutes, subjected to a 180 ° peel test, and a peeling speed of 0.3 m / min.
2. Low speed and high speed Peel force Measure
The heat-radiating sheet was cut into 25 x 250 mm and attached to the aluminum plate three times by a 2-kg rubber roller. After that, the sample was left at room temperature for 60 minutes and subjected to a 180 ° peel test. The peeling speed was set at a low speed of 0.3 m / min and a high speed of 1 m / min.
3. High speed Peel strength sleaze Exfoliation Ratio comparison
The values obtained in the high speed and the low speed were set to the values defined in the following equation (1) to obtain the ratio F 1 of the peeling force:
[Equation 1]
F = A / B (A: high-speed peeling force, B: low-speed peeling force)
4. Maintenance rate measurement
The heat-radiating sheet was laminated to a 100 mu m PET film, and then left at room temperature for 1 day. Thereafter, the heat-radiating sheet was cut to a width of 25x50 mm and attached to an aluminum plate three times with a 2 kg roller. Thereafter, a 1 kg weight was placed on the sample, and the sample was allowed to stand at 80 ° C for 48 hours, and then the distance at which the sample moved was measured by a microscope.
5. Measurement of thermal conductivity
The heat-radiating sheet was cut into a size of 100x50 mm and the thermal conductivity was measured by a rapid thermal conductivity meter QTM-500 (Kyoto Electronics Co., Ltd.).
6. Elution of Plasticizer
The heat-radiating sheet was cut into a size of 100x50 mm and lapped on an aluminum plate. After leaving for 7 days at room temperature, the heat-radiating sheet was peeled off from the aluminum plate to visually confirm whether the plasticizer was eluted on the aluminum plate.
○: No evidence of dissolution when checked with naked eyes
Ⅹ: There is evidence of dissolution
(kgf / 25 mm)
(gf / 25 mm)
(gf / 25 mm)
Peel strength ratio
(mm)
(W / mK)
From the above Table 3, it can be confirmed that the heat radiation sheets of Examples 1 to 4 according to the present invention are superior in overall adhesive properties and heat conduction characteristics as compared with Comparative Examples 1 to 5. In addition, it has excellent high-speed peelability, which will greatly improve rework efficiency.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious that the present invention belongs to the appended claims.
The present invention relates to a heat-dissipative adhesive sheet capable of effectively dissipating heat by being combined with an electronic component having a high heat generation, and can be used as a heat dissipation application by being variously bonded to any product having a high heat generation.
Claims (10)
A plurality of first electrodes formed on one or both surfaces of the substrate,
An acrylic copolymer, a crosslinking agent, a mixture of inorganic particles and a plasticizer,
The acrylic copolymer has a weight average molecular weight of 100,000 to 3,000,000,
Wherein the inorganic particles contain 50 to 300 parts by weight based on 100 parts by weight of the acrylic copolymer and the inorganic particles are selected from the group consisting of nitrides, hydroxides, oxides, carbides, carbonates, metalates and metals having a particle diameter of 10 to 50 μm One or a mixture of two or more thereof,
A pressure-sensitive adhesive sheet obtained by coating a pressure-sensitive adhesive composition containing a plasticizer having an ester value of 200 or more, in an amount of 0.1 to 15 parts by weight based on 100 parts by weight of the acrylic copolymer as the plasticizer;
.
Wherein the monomer having a crosslinkable functional group is selected from the group consisting of 2-hydroxyethyl (meth) acrylic acid, 2-hydroxypropyl (meth) acrylic acid, 3- hydroxypropyl (meth) acrylic acid, 2- (Meth) acrylate, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, monomethyl (meth) acrylate Ethyl acrylate, monoalkylamino (meth) acrylate, acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, or citraconic acid.
Wherein the polyfunctional isocyanate crosslinking agent is a trimethylol propane adduct of toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, toluene diisocyanate, or a mixture thereof.
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| WO2021006646A1 (en) * | 2019-07-10 | 2021-01-14 | 주식회사 엘지화학 | Composition and heat dissipation sheet manufactured therefrom |
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| KR101713698B1 (en) * | 2015-07-27 | 2017-03-08 | 서울시립대학교 산학협력단 | Acrylate copolymer adhesive comprising inorganic fillers and method for maunfacturing thereof |
| KR101907466B1 (en) * | 2016-11-03 | 2018-10-12 | 버사플렉스 주식회사 | Preparing method of heat radiating powder and film using diffusion and scattering of heat and heat radiating powder and film prepared thereby |
| KR102178497B1 (en) * | 2017-03-03 | 2020-11-13 | 주식회사 엘지화학 | Composition for acrylic heat emission pad and acrylic heat emission pad comporising cured product thereof |
| KR102050826B1 (en) * | 2017-03-28 | 2019-12-02 | 금오공과대학교 산학협력단 | Adhesive dissipation sheet having 3-dimension dissipation structure and manufacturing method for adhesive dissipation sheet having 3-dimension dissipation structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021006646A1 (en) * | 2019-07-10 | 2021-01-14 | 주식회사 엘지화학 | Composition and heat dissipation sheet manufactured therefrom |
| KR20210008184A (en) * | 2019-07-10 | 2021-01-21 | 주식회사 엘지화학 | Composition for thermally conductive sheet and thermally conductive sheet prepared therefrom |
| KR102476584B1 (en) * | 2019-07-10 | 2022-12-13 | 주식회사 엘지화학 | Composition for thermally conductive sheet and thermally conductive sheet prepared therefrom |
| US12012490B2 (en) | 2019-07-10 | 2024-06-18 | Lg Chem, Ltd. | Composition and heat radiation sheet manufactured therefrom |
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