CN105163478A - Pressure-sensitive electromagnetic protection film - Google Patents
Pressure-sensitive electromagnetic protection film Download PDFInfo
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- CN105163478A CN105163478A CN201510397839.8A CN201510397839A CN105163478A CN 105163478 A CN105163478 A CN 105163478A CN 201510397839 A CN201510397839 A CN 201510397839A CN 105163478 A CN105163478 A CN 105163478A
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- protection film
- pressure sensitive
- electromagnetic protection
- pressure
- conductive adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a pressure-sensitive electromagnetic protection film. According to the pressure-sensitive electromagnetic protection film, a surface of a base material is provided with a separation type layer, the surface of the separation type layer is provided with a blocking insulation layer, the surface of the blocking insulation layer is provided with at least one metal layer, the surface of the metal layer is provided with a pressure-sensitive conductive adhesive layer, and the surface of the pressure-sensitive conductive adhesive layer is provided with a protection film. The pressure-sensitive conductive adhesive layer has properties of excellent electromagnetic wave signal shielding reflection capability and simple processing technology, requires no extra laminators and oven equipment, requires no extra personnel and complex operation steps, can effectively reduce energy consumption and danger possibility in subsequent operation and can be widely applied to mobile phones, cameras, medical apparatuses and note computers which require electromagnetic protection.
Description
Technical field
The present invention relates to wiring board electromagnetism protecting film field, particularly a kind of pressure sensitive electromagnetic protection film.
Background technology
Along with the theory of electronic product " frivolous, three-D volumes is little, anti-interference " gos deep into Ge great electronics firm and general public, ultrathin, flexible folding, that winding displacement packaging density is high functional flexible circuit board obtains more wide use, and namely an important indicator of its functional flexible circuit board is anti-interference.
But along with the high frequency of the device interior assemblies such as mobile phone, notebook, panel computer, display screen, the anti-interference demand of flexible circuit board is urgent, and attachment electromagnetic protection film is because having better practicality, better operability, having more cost advantage, more meeting slimming requirement and more be favored by Ge great electronics firm.
Existing electromagnetic protection film mainly contains following several structure:
The first structure
Application number be 200680016573.7 Chinese patent disclose and relate to screened film, shielded printed circuit board, shielded flexible printed circuit board and corresponding manufacture method, the structure of this screened film constitutes an insulating barrier by wear-resisting hard formation and pliable and tough soft formation, form metal level more thereon, then form the conductive adhesive layer of one deck hot curing on the metal layer.This shielding can realize the screening effectiveness of 50dB in wider frequency range.
The second structure
Application number is the electromagnetic shielding method that the Chinese patent of 200680005088.X discloses electromagnetic wave shielding film, preparation method and adherend thereof, the structure of this screened film is made up of insulating barrier and isotropism conductive adhesive layer, and this screened film only has the screening effectiveness of 40dB at high band.
The third structure
Application number be 201220297494.0 Chinese patent disclose a kind of ultra-thin shielding film of high screening effectiveness, it is made up of insulating barrier, two or more different materials metal level and conductive adhesive layer, it utilizes the multiple reflections of the metal level of two or more different materials, reaches the high screening effectiveness of 60dB.
The electromagnetic protection film (screened film) of above-mentioned three kinds of structures is when being applied to flexible circuit board, all adopt heated lamination Post RDBMS technique to carry out laminating to assemble, i.e. 180 DEG C of precuring 30s, after under 2Mpa pressure, lamination 2min, after be transferred in 160 DEG C of baking ovens and solidify 30min.
There is following defect in above-mentioned heated lamination curing process:
A. complex operation, needs step and the equipment such as laminating machine, baking oven is more, need operating personnel more;
B. comparatively serious, the high expensive of energy resource consumption;
C. there is certain danger, as high-temperature operation, high temperature heating product produce poisonous and harmful substance etc.;
If D. mount mistake, the Product Activity radical reaction that has been heating and curing is complete, not easy to clean, if the cleaning of the flexible circuit board space of a whole page is unclean, then flexible circuit board may be caused to scrap.
Summary of the invention
Technical problem to be solved by this invention be for prior art exist deficiency, a kind of pressure sensitive electromagnetic protection film is provided; not easily there is the defects such as layering, foaming, projection in product of the present invention in preparation process; product has higher screening effectiveness and ground connection electric conductivity; effectively anti-interference and protective effect can be played to electronic instrument, use simple to operate, understandable; saving personnel and equipment; when the problem of generation, peel off easily, improve the scope of application of electromagnetic protection film.
Technical problem of the present invention solves by following technical solution:
A kind of pressure sensitive electromagnetic protection film; set gradually release layer on the surface of base material, intercept insulating barrier, at least one deck metal level, pressure sensitive conductive adhesive layer, diaphragm; the coating liquid solidification that described pressure sensitive conductive adhesive layer is made up of the material containing following weight percentage obtains: conductive metal powder 20%-70%; pressure sensitive adhesive resin 25%-78%, auxiliary agent 2%-5%.
Above-mentioned pressure sensitive electromagnetic protection film, described conductive metal powder is at least one in silver powder, copper powder, nickel powder, silver-coated copper powder, silver coated nickel powder, carbon nano-tube, silver-colored bag carbon nano-tube.
Above-mentioned pressure sensitive electromagnetic protection film, described pressure sensitive adhesive resin is at least one in rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, polyurethanes pressure sensitive adhesive.
Above-mentioned pressure sensitive electromagnetic protection film, described auxiliary agent be dispersant, antioxidant, catalyst, aging dose, antistatic agent, anti-settling agent, at least one in levelling agent etc.
Above-mentioned pressure sensitive electromagnetic protection film, described pressure sensitive conductive adhesive layer thickness is 8-15 μm.
Above-mentioned pressure sensitive electromagnetic protection film, described pressure sensitive conductive adhesive layer 180 ° of peeling forces are 1.5N/cm-4N/cm.
Above-mentioned pressure sensitive electromagnetic protection film, the coating liquid that described obstruct insulating barrier is made up of resistant to elevated temperatures resin and carbon black filler solidify to form, and the thickness intercepting insulating barrier is 4 ~ 6 μm.
Above-mentioned pressure sensitive electromagnetic protection film, the thickness of described metal level is 0.05 ~ 0.5 μm.
Above-mentioned pressure sensitive electromagnetic protection film, the off-type force of described release layer is 0.1N/cm-1N/cm.
Beneficial effect
Compared with existing heated lamination curing process, the present invention is by arranging pressure sensitive conductive adhesive layer in the product, only product need be aimed at the position needing laminating electromagnetic protection film, finger pressure is pressure a little, there is later processing operation simple, personnel, device requirement is less, energy savings, cost reduces obviously, and the advantage such as danger is lower, and if there is phenomenon such as attachment electromagnetic protection film mistake or Wrong localization etc., traditional method for cleaning is by alcohol wipe process, but it is complete through the Product Activity radical reaction of heated lamination Post RDBMS technique, adhere to good with flexible circuit board, alcohol not easily wiping cleaning, flexible circuit board may be caused to scrap, and the pressure sensitive electromagnetic protection film product using the present invention to design, if there is phenomenons such as attachment mistake or Wrong localization, only need peel off product with hand, ensure that the cleaning of flexible circuit board can utilize.
Arrange at least one deck metal level and pressure sensitive conductive adhesive layer in addition to cooperatively interact, meet the instructions for use of product ground connection, intercept insulating barrier and intercepted extraneous water, gas, heat to the damage of electric elements; By the cooperation between each layer, make product not only have higher screening effectiveness but also the demand of ground connection conduction can be met, thus anti-interference and protective effect is served to electronic instrument part.
The conductive adhesive layer of existing electromagnetic protection film is the coating solution gained by utilizing the materials such as thermosetting resin, conductive metal powder, curing agent to prepare, and the coating solution gained that conductive adhesive layer of the present invention adopts the materials such as pressure sensitive resin, conductive metal powder, auxiliary agent to prepare, its protecting film prepared uses simple to operate, understandable, save personnel and equipment.In addition, the shortcoming of pressure sensitive adhesive class material ubiquity heat resistance difference, the pressure sensitive electromagnetic protection film prepared is caused easily to occur the open defects such as foaming, layering, projection like this in follow-up reflow soldering process and dip brazing tin technique, and the present invention is by screening silicone pressure sensitive glue material, both improve the heat resistant type of product, turn improve the scope of application of product.
Accompanying drawing explanation
Fig. 1 is the product structure schematic diagram of the embodiment of the present invention 1,3,4;
Fig. 2 is the product structure schematic diagram of the embodiment of the present invention 2.
In figure, each label is expressed as: 1, base material; 2, release layer; 3, insulating barrier is intercepted; 4,5, metal level; 6, pressure-sensitive adhesive type conductive adhesive layer; 7, protective layer.
Embodiment
Pressure sensitive electromagnetic protection film provided by the invention is made up of base material, release layer, obstruct insulating barrier, at least one deck metal level, pressure sensitive conductive adhesive layer and diaphragm; wherein release layer is arranged on the surface of base material; intercept insulating barrier between release layer and metal level; arrange pressure sensitive conductive adhesive layer at layer on surface of metal, diaphragm is positioned at the outermost of electromagnetic protection film.
The present invention is to base material without special requirement, and it can select known engineering plastics film, such as: polyester film, polyimide film, polyimide amide film, polyphenylene sulfide film, polypropylene film etc.Because adopting novel finger pressure technique, preferred low-cost polyester film.
The present invention can be peeled off by cold after finger pressure the material requirements of release layer, preferably without silicon release layer, off-type force preferred 0.1N/cm-1N/cm when 180 ° of stripping tests of described release layer, when off-type force is greater than 1N/cm, subsequent operation not easily peels off tape base, when off-type force is less than 0.1N/cm, easily there is the phenomenon of coating shedding.
There is provided excellent wear-resisting when the effect intercepting insulating barrier in the present invention is mainly in electromagnetic protection film processed and applied to wiring board, heat insulation, water proof, trapping, the functions such as insulation, the coating liquid that described obstruct insulating barrier is made up of resistant to elevated temperatures resin and carbon black filler solidify to form, its fire resistant resin can by epoxylite, mylar, polyurethane resin, one or several compositions of the thermosetting resins such as polyamide, or acrylic compounds, methacrylic, one or several compositions of polyurethane-modified acrylic compounds ultraviolet-curing resin, as Commercial epoxy resins E-20 etc.
Intercepting thickness of insulating layer in the present invention is 4-6 μm, if thickness of insulating layer is less than 4 μm, then the poor performance such as wear-resisting, heat insulation, water proof, trapping, insulation, if intercept thickness of insulating layer to be greater than 6 μm, then its pliability declines, flexibility and bending resistance folding endurance not good.
The effect of carbon black filler of the present invention is to provide the apparent of black, and reduces the insulation resistance on surface, plays the effect of antistatic.Its carbon black addition accounts for the 5%-40% of solid content, preferred 10%-40%.When being greater than 40%, decreasing insulating, coating becomes fragile, and flexibility declines.When being less than 5%, blackness does not reach requirement, can not meet the opaque requirement of following process (generally acknowledged).
In the present invention, the effect of metal level is reflection electromagnetic wave signal, and its material can be chosen as aluminium, nickel, copper, silver, gold, or is combined to form by above two kinds or several materials, is preferably silver layer or layers of copper.Its thickness is 0.05 ~ 0.5 μm, preferred 0.1-0.2 μm.When metal layer thickness is less than 0.1um, screening effectiveness is less than 50dB, and when metal layer thickness is greater than 0.2 μm, this ply stress is comparatively large, metal level easy fracture during flexibility experiment.Metal level adopts the technique such as vacuum evaporation, sputtering to be formed on obstruct surface of insulating layer.
In the present invention, pressure sensitive conductive adhesive layer had both met the demand of product ground connection conductive and heat-conductive, in turn simplify processing technology, and compared with existing heated lamination curing process, product need be aimed at the position needing laminating electromagnetic protection film by it, and finger pressure is pressure a little.The coating liquid solidification that it is made up of the material of following weight percentage obtains: conductive metal powder 20%-70%, pressure sensitive adhesive resin 25%-78%, other auxiliary agents 2%-5%.Above-mentioned substance is disperseed to form by techniques such as known high-speed stirred, ball milling, quick worker, grindings with after the toluene butanone equal solvent mixing a certain amount of ratio.Its THICKNESS CONTROL is at 8 ~ 15 μm.If pressure-sensitive adhesive type conductive adhesive layer thickness is less than 8 μm, then attachment fastness is poor, easily occurs the separation that comes off in Long-Time Service process; If pressure sensitive conductive adhesive layer thickness is greater than 15 μm, then pliability declines, and flexibility is not good, and does not meet the demand of ultrathin development.
Under follow-up reflow soldering process and dip brazing tin technique, easily there is the open defects such as foaming, layering, projection in the poor product of conductive adhesive layer, and to be applicable to pressure sensitive adhesive resin of the present invention be at least one in rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, polyurethanes pressure sensitive adhesive.Because of follow-up known reflow soldering process and dip brazing tin technique, require higher to the heat resistance of product, preferred organic pressure-sensitive gel.In addition, for meeting step fillibility and the requirement of aperture ground connection conduction, can mix and dose into rubber pressure-sensitive adhesive.Include but not limited to following known material: the SBS series pressure-sensitive (rubber pressure-sensitive adhesive) etc. that no-solvent type organic pressure-sensitive gel DOW CORNING adhesive, Beijing radiance century produce; The pressure sensitive electromagnetic protection film using above-mentioned preferred material to prepare both had improve the heat resistance of product, turn improved the scope of application of product.
Be applicable to conductive metal powder of the present invention can be selected from commercially available silver powder, copper powder, nickel powder, silver-coated copper powder, silver coated nickel powder one or several.The shape being applicable to conductive metal powder of the present invention is dendroid, sheet, bar-shaped, spherical one or more mix applicable, preferred dendroid conductive metal powder when higher to conduction needs, as the ALAX-225 dendroid silver-coated copper powder that Industrial Co., Ltd of Mitsui Metal Co., Ltd. produces; Be applicable to other auxiliary agents of the present invention be dispersant, antioxidant, catalyst, aging dose, antistatic agent, at least one in anti-settling agent or levelling agent etc., include but not limited to following known material: dispersant 163, antioxidant 168, antioxidant 1010 etc.
Pressure sensitive conductive adhesive layer of the present invention, fitted to after in flexible circuit board by finger pressure, 180 ° of preferred 1.5N/cm-4N/cm of test peeling force, when peeling force is less than 1.5N/cm, easily occur during peeling base that Bulk coat does not cement with flexible circuit board, thus occur the phenomenon that comes off, and 3M adhesive tape is sticky easily comes off.When peeling force is greater than 4N/cm, not easy to clean after attachment mistake, causes flexible circuit board to be scrapped.
Diaphragm of the present invention is without particular/special requirement, and it can select known engineering plastics film, such as: polyester film, polyimide film, polyimide amide film, polyphenylene sulfide film, polypropylene film etc.Preferred low-cost polyester film.Diaphragm of the present invention need be compounded in the outside of pressure sensitive conductive adhesive layer through known temperature and pressure.
The manufacture method of pressure sensitive electromagnetic protection film provided by the invention is as follows:
Base material is coated with release layer; after overcuring; insulating barrier is intercepted in the coating of release layer surface; vacuum evaporation at least one deck metal level on obstruct insulating barrier; at layer on surface of metal coating pressure sensitive conductive adhesive layer, after obtain the pressure sensitive electromagnetic protection film with high screening effectiveness through certain temperature and pressure composite protection film.
Coating method adopts known coating process, as extrusion coated, nozzle coating, the coating of three roller coat cloth, anilox roll, printing coating etc.
When pressure sensitive electromagnetic protection film provided by the invention is used for flexible circuit board or flex circuit application, only need first to peel off diaphragm when using, rear aligning needs finger pressure behind the position of installation electromagnetic protection film, then throws off base material and release layer, without the need to equipment such as too much laminating machine, baking ovens; Arrange and complicated operating procedure without the need to lengthy and jumbled personnel, and the possibility occurring danger in energy loss and subsequent operation can be effectively reduced.
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1
1. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 6
The ALAX-225 dendroid silver-coated copper powder 20g that Industrial Co., Ltd of Mitsui Metal Co., Ltd. produces
The organic pressure-sensitive gel DOW CORNING adhesive 78g that Dow Corning Corporation produces
The BYK-1631g of Germany Bi Ke chemical production
The antioxidant BASF1680.5g that Germany's BASF is produced
The antioxidant BASF10100.5g that Germany's BASF is produced;
Above-mentioned substance is disperseed to form by techniques such as known high-speed stirred, ball milling, quick worker, grindings with after the toluene butanone equal solvent mixing a certain amount of ratio.
2. the preparation of pressure-sensitive adhesive type electromagnetic protection film
Acrylic resins of painting release layer 2 on the pet vector film 1 of 50 μm; be coated with on release layer surface the coating fluid be made up of epoxide modified polyurethane resin and carbon black filler after solidification; form the obstruct insulating barrier 3 that thickness is 4 μm; intercepting the silver coating 4 of surface of insulating layer vacuum evaporation 0.1 μm; at the pressure sensitive conducting resinl coating fluid of the above-mentioned configuration of silver coating surface coating; form the pressure sensitive conductive adhesive layer 6 that build is 8 μm, after solidification, obtain pressure sensitive electromagnetic protection film through certain temperature and pressure composite protection film 7.
Test correlated performance, lists in table 1.
Embodiment 2
1. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 6
The ALAX-225 dendroid silver-coated copper powder 30g that Industrial Co., Ltd of Mitsui Metal Co., Ltd. produces
The organic pressure-sensitive gel DOW CORNING adhesive 68g that Dow Corning Corporation produces
The BYK-1631g of Germany Bi Ke chemical production
The antioxidant BASF1680.5g that Germany's BASF is produced
The antioxidant BASF10100.5g that Germany's BASF is produced;
Above-mentioned substance is disperseed to form by techniques such as known high-speed stirred, ball milling, quick worker, grindings with after the toluene butanone equal solvent mixing a certain amount of ratio.
2. the preparation of pressure-sensitive adhesive type electromagnetic protection film
Acrylic resins of painting release layer 2 on the pet vector film 1 of 50 μm, be coated with on release layer surface the coating fluid be made up of epoxide modified polyurethane resin and carbon black filler after solidification, form the obstruct insulating barrier 3 that thickness is 4 μm, intercepting the silver coating 4 of surface of insulating layer vacuum evaporation 0.05 μm, at silver coating surface vacuum evaporation 0.05 μm of copper plate 5, at the pressure sensitive conducting resinl coating fluid of the above-mentioned configuration of copper plate surface coating, form the pressure sensitive conductive adhesive layer 6 that build is 8 μm, pressure sensitive electromagnetic protection film is obtained through certain temperature and pressure complex protection 7 film after solidification.
Test correlated performance, lists in table 1.
Embodiment 3
1. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 6
The ALAX-225 dendroid silver-coated copper powder 50g that Industrial Co., Ltd of Mitsui Metal Co., Ltd. produces
The organic pressure-sensitive gel DOW CORNING adhesive 46g that Dow Corning Corporation produces
The BYK-1632.5g of Germany Bi Ke chemical production
The antioxidant BASF1680.75g that Germany's BASF is produced
The antioxidant BASF10100.75g that Germany's BASF is produced;
Above-mentioned substance is disperseed to form by techniques such as known high-speed stirred, ball milling, quick worker, grindings with after the toluene butanone equal solvent mixing a certain amount of ratio.
2. the preparation of pressure-sensitive adhesive type electromagnetic protection film
Acrylic resins of painting release layer 2 on the pet vector film 1 of 50 μm; be coated with on release layer surface the coating fluid be made up of epoxide modified polyurethane resin and carbon black filler after solidification; form the obstruct insulating barrier 3 that thickness is 6 μm; intercepting the silver coating 4 of surface of insulating layer vacuum evaporation 0.2 μm; at the pressure sensitive conducting resinl coating fluid of the above-mentioned configuration of silver coating surface coating; form the pressure sensitive conductive adhesive layer 6 that build is 15 μm, after solidification, obtain pressure sensitive electromagnetic protection film through certain temperature and pressure composite protection film 7.
Test correlated performance, lists in table 1.
Embodiment 4
1. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 6
The ALAX-225 dendroid silver-coated copper powder 70g that Industrial Co., Ltd of Mitsui Metal Co., Ltd. produces
The organic pressure-sensitive gel DOW CORNING adhesive 25g that Dow Corning Corporation produces
The BYK-1633g of Germany Bi Ke chemical production
The antioxidant BASF1681g that Germany's BASF is produced
The antioxidant BASF10101g that Germany's BASF is produced;
Above-mentioned substance is disperseed to form by techniques such as known high-speed stirred, ball milling, quick worker, grindings with after the toluene butanone equal solvent mixing a certain amount of ratio.
2. the preparation of pressure-sensitive adhesive type electromagnetic protection film
Acrylic resins of painting release layer 2 on the pet vector film 1 of 50 μm; be coated with on release layer surface the coating fluid be made up of epoxide modified polyurethane resin and carbon black filler after solidification; form the obstruct insulating barrier 3 that thickness is 4 μm; intercepting the silver coating 4 of surface of insulating layer vacuum evaporation 0.1 μm; at the pressure sensitive conducting resinl coating fluid of the above-mentioned configuration of silver coating surface coating; form the pressure sensitive conductive adhesive layer 6 that build is 15 μm, after solidification, obtain pressure sensitive electromagnetic protection film through certain temperature and pressure composite protection film 7.
Test correlated performance, lists in table 1.
Mode and the KAPTON100H pressing of the pressure sensitive electromagnetic protection film finger pressure obtained by above-described embodiment are sticked together, test performance.
Comparative example 1: be coated with fluorine resin release layer on the pet vector film of 50 μm; at release layer surface coated UV curing resin layer after solidification; the hard formation of build 2 μm is formed after ultra-violet curing; at the polyurethane soft formation that the coating of hard formation surface is pliable and tough; build 3 μm, pliable and tough soft formation sputters 0.1 μm of evaporation silver coating, at silver coating surface epoxy resin coating conductive adhesive layer; build 17 μm, obtains electromagnetic wave proof film through uniform temperature and pressure bonding diaphragm.
The electromagnetic wave proof film of above-mentioned preparation and Du Pont polyimide film KAPTON100H are processed with known technique, namely at 180 DEG C of precuring 30s, after under 2Mpa pressure, lamination 2min, after be transferred in 160 DEG C of baking ovens and solidify 30min.
Comparative example 2: be coated with acrylic acid release layer on the pet vector film of 50 μm; at release layer surface coating polyurethane polyureas carbamide resin after solidification; form the insulating barrier of 7 μm; isotropic polyurethane-polyurea resin conductive glue-line is coated with at surface of insulating layer; build is 15 μm, obtains electromagnetic wave proof film through uniform temperature and pressure bonding diaphragm.
The electromagnetic wave proof film of above-mentioned preparation and Du Pont polyimide film KAPTON100H are processed with known technique, namely at 180 DEG C of precuring 30s, after under 2Mpa pressure, lamination 2min, after be transferred in 160 DEG C of baking ovens and solidify 30min.
Comparative example 3:; the pet vector film of 50 μm is coated with acrylic acid release layer; at release layer surface epoxy resin coating after solidification; form the insulating barrier of 4 μm; at surface of insulating layer vacuum evaporation 0.1 μm of silver coating, at silver coating surface vacuum evaporation 0.2 μm of copper plate, at copper plate surface epoxy resin coating conductive adhesive layer; build 15 μm, obtains electromagnetic wave proof film through uniform temperature and pressure bonding diaphragm.
By the electromagnetic wave proof film of above-mentioned preparation for process with known technique with Du Pont polyimide film KAPTON100H, namely at 180 DEG C of precuring 30s, after under 2Mpa pressure, lamination 2min, after be transferred in 160 DEG C of baking ovens and solidify 30min.
Table 1 performance test table
1. screening effectiveness method of testing:
Test according to GJB6190-2008 " electromagnetic shielding material screening effectiveness method of measurement ".
2. viscosity fastness method of testing:
Known 3M600 adhesive tape adhesion test in industry
3. contact resistance method of testing:
Test with four-wire type milliohmmeter.
4. bending resistance folding endurance method of testing:
Under crooked process radius is 0.1mm condition, reciprocating motion 100,000 tests, whether microscopic examination coating ruptures
5. reflow soldering process and dip brazing tin technique test method
Reflow soldering process: carry out reflow soldering process test under the highest temperature is 265 DEG C and continues the thermal reflow profile of 20s under temperature conditions more than 220 DEG C
Dip brazing tin process test: 288 DEG C are soaked tin liquor 10s, test.From the above results, adopt the embodiment prepared of the present invention suitable with the electromagnetic protection film properties of comparative example on screening effectiveness, contact resistance, viscosity fastness, bending resistance folding endurance, reflux-resisting welded and dip brazing tin, and in follow-up operation processing and had very large improvement in correction after there is attachment or Wrong localization.
Claims (9)
1. a pressure sensitive electromagnetic protection film; set gradually release layer on the surface of base material, intercept insulating barrier, at least one deck metal level, pressure sensitive conductive adhesive layer, diaphragm; it is characterized in that; the coating liquid solidification that described pressure sensitive conductive adhesive layer is made up of the material containing following weight percentage obtains: conductive metal powder 20%-70%; pressure sensitive adhesive resin 25%-78%, auxiliary agent 2%-5%.
2. electromagnetic protection film according to claim 1, is characterized in that, described conductive metal powder is at least one in silver powder, copper powder, nickel powder, silver-coated copper powder, silver coated nickel powder, carbon nano-tube, silver-colored bag carbon nano-tube.
3. electromagnetic protection film according to claim 2, is characterized in that, described pressure sensitive adhesive resin is at least one in rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, polyurethanes pressure sensitive adhesive.
4. electromagnetic protection film according to claim 3, is characterized in that, described auxiliary agent be dispersant, antioxidant, catalyst, aging dose, antistatic agent, at least one in anti-settling agent or levelling agent etc.
5. electromagnetic protection film according to claim 4, is characterized in that, described pressure sensitive conductive adhesive layer thickness is 8-15 μm.
6. electromagnetic protection film according to claim 5, is characterized in that, described pressure sensitive conductive adhesive layer 180 ° of peeling forces are 1.5N/cm-4N/cm.
7. electromagnetic protection film according to claim 6, is characterized in that, the coating liquid that described obstruct insulating barrier is made up of resistant to elevated temperatures resin and carbon black filler solidify to form, and the thickness intercepting insulating barrier is 4 ~ 6 μm.
8. electromagnetic protection film according to claim 7, is characterized in that, the thickness of described metal level is 0.05 ~ 0.5 μm.
9. electromagnetic protection film according to claim 8, is characterized in that, the off-type force of described release layer is 0.1N/cm-1N/cm.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003959A (en) * | 2016-05-17 | 2016-10-12 | 胡银坤 | Electromagnetic shielding film and preparation method thereof |
| CN106328252A (en) * | 2016-10-24 | 2017-01-11 | 昆山峰实电子科技有限公司 | Silver nanowire conducting transparent film and manufacture method thereof |
| CN106961826A (en) * | 2017-03-27 | 2017-07-18 | 保定乐凯新材料股份有限公司 | The electromagnetic wave proof film that a kind of repeatable attachment is used |
| CN108274838A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof that exempting from punching, application |
| CN110602876A (en) * | 2019-10-25 | 2019-12-20 | 四川普瑞森电子有限公司 | Thin circuit board and manufacturing method thereof |
| CN112533465A (en) * | 2020-11-27 | 2021-03-19 | 南昌正业科技有限公司 | Electromagnetic wave protective film for FPC |
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| CN106328252A (en) * | 2016-10-24 | 2017-01-11 | 昆山峰实电子科技有限公司 | Silver nanowire conducting transparent film and manufacture method thereof |
| CN106961826A (en) * | 2017-03-27 | 2017-07-18 | 保定乐凯新材料股份有限公司 | The electromagnetic wave proof film that a kind of repeatable attachment is used |
| CN108274838A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film and preparation method thereof that exempting from punching, application |
| CN108274838B (en) * | 2018-02-02 | 2024-04-16 | 福州恒美光电材料有限公司 | Punching-free electromagnetic shielding film and preparation method and application thereof |
| CN110602876A (en) * | 2019-10-25 | 2019-12-20 | 四川普瑞森电子有限公司 | Thin circuit board and manufacturing method thereof |
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| CN112533465A (en) * | 2020-11-27 | 2021-03-19 | 南昌正业科技有限公司 | Electromagnetic wave protective film for FPC |
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Application publication date: 20151216 |