CN110240874B - Antistatic electromagnetic shielding adhesive tape and preparation method thereof - Google Patents
Antistatic electromagnetic shielding adhesive tape and preparation method thereof Download PDFInfo
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- CN110240874B CN110240874B CN201910561384.7A CN201910561384A CN110240874B CN 110240874 B CN110240874 B CN 110240874B CN 201910561384 A CN201910561384 A CN 201910561384A CN 110240874 B CN110240874 B CN 110240874B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 239000002390 adhesive tape Substances 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000002904 solvent Substances 0.000 claims abstract description 29
- 238000001723 curing Methods 0.000 claims description 92
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 66
- 230000001070 adhesive effect Effects 0.000 claims description 61
- 239000000853 adhesive Substances 0.000 claims description 60
- 239000003921 oil Substances 0.000 claims description 56
- 239000011888 foil Substances 0.000 claims description 33
- 229920002635 polyurethane Polymers 0.000 claims description 30
- 239000004814 polyurethane Substances 0.000 claims description 30
- 238000013329 compounding Methods 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000004593 Epoxy Substances 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 16
- 239000002270 dispersing agent Substances 0.000 claims description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000012948 isocyanate Substances 0.000 claims description 13
- 150000002513 isocyanates Chemical class 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- 229920000058 polyacrylate Polymers 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 229920002545 silicone oil Polymers 0.000 claims description 9
- 229920002799 BoPET Polymers 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 230000003666 anti-fingerprint Effects 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 4
- 239000010410 layer Substances 0.000 abstract description 215
- 239000012790 adhesive layer Substances 0.000 abstract description 25
- 238000012360 testing method Methods 0.000 description 64
- 239000010408 film Substances 0.000 description 59
- 239000002131 composite material Substances 0.000 description 35
- 239000000463 material Substances 0.000 description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000011231 conductive filler Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000032683 aging Effects 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 238000013215 result calculation Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- 238000009864 tensile test Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000011086 glassine Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 229920006158 high molecular weight polymer Polymers 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical class O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an electromagnetic shielding tape and a preparation method thereof, wherein the electromagnetic shielding tape comprises the following components: a substrate layer having opposite first and second sides; the release layer is arranged on the first side of the substrate layer, and a conductive adhesive layer is arranged between the release layer and the substrate layer; the printing ink layer is arranged on the second side of the substrate layer and comprises a black ink layer and an antistatic gloss oil layer which are arranged in a stacked mode; wherein the black ink layer is located between the antistatic gloss oil layer and the substrate layer. The printing layer has the appearance of matte black color and solvent resistance of a common ink layer and also has antistatic capability.
Description
Technical Field
The invention relates to an antistatic electromagnetic shielding tape and a preparation method of the antistatic electromagnetic shielding tape.
Background
With the continuous development of the technological level, 3C products such as notebook computers, GPS, IPAD and mobile phones become an indispensable part of daily life of people, bring convenience to our lives and simultaneously, also put hidden trouble into health of people. When the electronic products are used, high-frequency electromagnetic waves are emitted, and if a human body is exposed to strong electromagnetic waves for a long time, the health of the body can be influenced, and even cancer lesions are induced. In addition, as the working field environment of modern electronic products is increasingly complex, many electronic products are complex systems with mixed digital and analog systems, so that electromagnetic radiation from outside the products and electromagnetic interference between internal systems, between transmission channels and between internal components are harmful to various useful information of the products, the stability, reliability and safety of the work of the products are seriously threatened, and thus, the electromagnetic interference prevention is one of the focuses of increasing attention.
The adhesive tape is one of the tools commonly used for fixing and shielding in daily life and work, and can be classified into a high-temperature adhesive tape, a double-sided adhesive tape, a conductive adhesive tape, a special adhesive tape, a pressure-sensitive adhesive tape, a die-cutting adhesive tape and the like according to the functions thereof. The conductive adhesive tape has the advantages of heat preservation, heat insulation, fire prevention, cold resistance and the like, and can eliminate electromagnetic radiation, isolate the harm of electromagnetic waves to human bodies and influence on surrounding electronic components. The conductive adhesive tape generally comprises a release layer, a substrate layer and a conductive adhesive layer, is of a multi-layer structure, the stability of the interlayer structure directly influences the service performance of the conductive adhesive tape, and is a difficult problem in manufacturing the conductive adhesive tape.
Disclosure of Invention
The invention provides an antistatic electromagnetic shielding adhesive tape and a preparation method thereof, which are used for solving the problems.
The application provides an electromagnetic shielding tape, comprising:
A substrate layer having opposite first and second sides;
the release layer is arranged on the first side of the substrate layer, and a conductive adhesive layer is arranged between the release layer and the substrate layer;
The printing ink layer is arranged on the second side of the substrate layer and comprises a black ink layer and an antistatic gloss oil layer which are arranged in a stacked mode; wherein the black ink layer is located between the antistatic gloss oil layer and the substrate layer.
Preferably, the substrate layer comprises a film layer, metal layers arranged on two sides of the film layer and an adhesive layer arranged between the film layer and the metal layers, wherein the thickness of the substrate layer is 15-50 mu m, and the adhesive layer adopts epoxy modified polyurethane composite adhesive; preferably, the epoxy modified polyurethane composite glue comprises epoxy resin, polyurethane composite glue and isocyanate curing agent; preferably, the film layer is a polyethylene terephthalate film, a polyacrylic acid film, a polyvinyl chloride film or a polyamide film; preferably, the metal layer is an aluminum foil, a copper foil, a silver foil or an iron foil.
Preferably, the black ink layer is gravure ink, offset ink, doctor ink or silk screen ink in a polyurethane system; the thickness of the black ink layer is 2-4 mu m.
Preferably, the antistatic gloss oil layer comprises matte oil and conductive filler, and the conductive filler is slurry or powder.
Preferably, the conductive filler comprises one or more of nickel powder, carbonyl nickel powder, conductive silver paste, silver coated copper powder, silver coated glass, carbon nanotubes, conductive carbon black, conductive graphite and polythiophene, and preferably, the conductive filler comprises carbonyl nickel powder and conductive carbon black.
Preferably, a surface of a side of the printing ink layer facing away from the base material layer has a resistance value of 1×10 8 Ω/≡or less.
Preferably, the release layer adopts a release film of polyethylene terephthalate, a release film of polyacrylic acid, a release film of polyethylene, PE coated release paper or glassine release paper, the release force of the release material is between 1 and 50gf/inch, and the residual adhesion rate of the release material is more than or equal to 80 percent.
The embodiment of the application also discloses a preparation method of the electromagnetic shielding tape, which comprises the following steps:
(1) Coating an adhesive layer between two opposite sides of the film layer and the corresponding metal layer to prepare a metal layer/film layer/metal layer three-layer structure composite material;
(2) Printing a black ink layer on the outer side surface of one side of the three-layer structure composite material, and printing an antistatic gloss oil layer on the outer side surface of the black ink layer to prepare an antistatic gloss oil layer/black ink layer/metal layer/film layer/metal layer multi-layer structure composite material;
(3) Drying, curing and molding the composite material with the multilayer structure;
(4) And coating the conductive adhesive on the release material, and bonding the release material with one side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer, after drying to form a release layer and a conductive adhesive layer.
Preferably, the step of coating the conductive adhesive on the release material, and bonding the release layer and the conductive adhesive layer to a side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer, after drying, includes:
Adding conductive filler, curing agent, black filler and dispersing agent into the solvent-type acrylate pressure-sensitive adhesive, and stirring for 10-30 min by adopting a high-speed dispersing machine to obtain the conductive adhesive.
Preferably, the method further comprises: the step of coating the conductive adhesive on the release material, and bonding the release layer and the conductive adhesive layer with one side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer, after drying, wherein the step of forming the release layer and the conductive adhesive layer comprises the following steps:
And setting the bonded electromagnetic shielding adhesive tape to be molded in a constant-temperature oven for curing.
Compared with the prior art, the invention has the following advantages: the electromagnetic shielding adhesive tape comprises a substrate layer, a release layer arranged on one side of the substrate layer and a conductive adhesive layer arranged between the substrate layer and the release layer, wherein the substrate layer comprises a film layer, a metal layer arranged on two sides of the film layer, an adhesive layer arranged between the film layer and the metal layer and an antistatic printing ink layer on the surface of the metal layer on any side, the substrate structure is a printing layer/metal layer/film layer/metal layer, the expansion coefficients and the elastic moduli of the two materials are very different, and the structure solves the problem that the curling is caused by different shrinkage rates of the printing film layer and the metal layer when being heated, so that the product has better anti-warping performance when being attached to the surface with a larger curved surface.
The antistatic electromagnetic shielding adhesive tape has the printing layer, so that the antistatic electromagnetic shielding adhesive tape not only has the matte black appearance and solvent resistance of a common ink layer, but also has antistatic capability. Delamination of the substrate layer of the multilayer structure due to tensile deformation is also a major problem. The metal foil adopted by the metal layer is produced by adopting a calendaring process, and the oil residue on the surface of the metal foil cannot be completely ensured due to different treatment degrees of deoiling (annealing) processes, so that the surface energy difference of the metal foil is larger. Therefore, the composition of the multi-layer structure has high requirements on the bonding strength, the damp-heat resistance and the bending resistance of the composite adhesive. The invention adopts the epoxy modified polyurethane composite adhesive, has the flexibility of polyurethane, has good adhesiveness to various base materials, can be cured at room temperature, has poor temperature resistance of polyurethane adhesive, has good high temperature resistance of epoxy, has good supplement to polyurethane structural adhesive, and ensures that the strength between composite layers is stable at high temperature.
Compared with the prior art, the invention has the following advantages: the preparation method of the electromagnetic shielding tape has simple steps and simple production process.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electromagnetic shielding tape according to an embodiment of the present application.
Reference numerals of the above drawings: 1. a thin film layer; 2. an adhesive layer; 3. a metal layer; 4. a black ink layer; 5. antistatic gloss oil layer; 6. a conductive adhesive layer; 7. and (5) a release layer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, an embodiment of the present application discloses an electromagnetic shielding tape, including: a substrate layer having opposite first and second sides;
The release layer 7 is arranged on the first side of the substrate layer, and a conductive adhesive layer 6 is arranged between the release layer 7 and the substrate layer;
A printing ink layer, wherein the printing ink layer is arranged on the second side of the substrate layer, and comprises a black ink layer 4 and an antistatic gloss oil layer 5 which are arranged in a stacked manner; wherein the black ink layer 4 is located between the antistatic gloss oil layer 5 and the substrate layer.
Wherein the thickness of the substrate layer is 15-50 μm. The substrate layer comprises a film layer 1, metal layers 3 arranged on two sides of the film layer 1, and an adhesive layer 2 arranged between the film layer 1 and the metal layers 3. The adhesive layer 2 is made of epoxy modified polyurethane composite adhesive. Preferably, the epoxy modified polyurethane composite glue comprises epoxy resin, polyurethane composite glue and isocyanate curing agent; preferably, the film layer 1 is a polyethylene terephthalate film, a polyacrylic acid film, a polyvinyl chloride film or a polyamide film; preferably, the metal layer 3 is an aluminum foil, a copper foil, a silver foil or an iron foil. More preferably, the film layer 1 is a polyethylene terephthalate film; the thickness of the film layer 1 is between 2 and 36 mu m.
The adhesive layer 2 is an epoxy modified polyurethane composite adhesive, the epoxy modified polyurethane composite adhesive comprises epoxy resin, polyurethane composite adhesive and isocyanate curing agent, the antistatic printing layer is coated with a black ink layer 4 and an antistatic gloss oil layer 5, the film layer 1 is a PET film, a PP film, a PVC film or a PI film, and the metal layer 3 is an aluminum foil, a copper foil, a silver foil or an iron foil.
Wherein the black ink layer 4 is gravure ink, offset ink, doctor ink or silk screen ink in a polyurethane system; the thickness of the black ink layer 4 is 2 μm to 4 μm. The antistatic gloss oil layer 5 comprises a matte oil and a conductive filler.
Preferably, the antistatic gloss oil layer 5 comprises the following components in percentage by mass:
Matte oil 80-95%
5-20% Of conductive filler.
The conductive filler is slurry or powder. The conductive filler comprises one or more of nickel powder, carbonyl nickel powder, conductive silver paste, silver coated copper powder, silver coated glass, carbon nano tubes, conductive carbon black, conductive graphite and polythiophene, and preferably comprises one or more of carbonyl nickel powder and conductive carbon black. The thickness of the antistatic gloss oil layer 5 is between 2 and 6 mu m.
The conductive adhesive layer 6 comprises the following components in percentage by mass:
the conductive adhesive is characterized in that the adhesive is an acrylic polymer and comprises a high molecular weight polymer and a low molecular weight polymer, wherein the weight average molecular weight of the high molecular weight polymer is 100-150 ten thousand, the weight average molecular weight of the low molecular weight polymer is 50-80 ten thousand, the solvent acrylic pressure-sensitive adhesive has high temperature resistance, excellent ageing resistance and good cohesive force, the acrylic polymer in the solvent acrylic pressure-sensitive adhesive has wide molecular weight distribution, the acrylic polymer with relatively high molecular weight has high temperature resistance, excellent ageing resistance and good cohesive force, the acrylic polymer with relatively low molecular weight provides good initial adhesive force and good rough surface filling property, and the combination of the high molecular weight and the low molecular weight provides respective advantages, so that the adhesive has good adhesive strength, curved surface resistance and ageing resistance; the conductive filler is at least one of nickel powder (including reduced nickel powder, carbonyl nickel powder and electrolytic nickel powder), silver powder, copper powder and aluminum powder, preferably, the conductive filler is carbonyl nickel powder and silver powder, the carbonyl nickel powder is chain-shaped carbonyl nickel powder, and the chain-shaped carbonyl nickel powder has a long-chain structure, so that the conduction of the solvent-type acrylate pressure-sensitive adhesive is facilitated, the conductivity of the conductive adhesive composition is more stable, the silver powder or copper powder is added, the linking parts among long chains of the carbonyl nickel powder are filled, and the conductivity of the conductive adhesive composition is better increased; the black filler is carbon black, titanium black, aniline black and the like, and preferably, the black filler is carbon black; the curing agent is at least one of isocyanate curing agent, epoxy curing agent, metal salt curing agent and aziridine curing agent, and the isocyanate curing agent can effectively improve cohesive force of the adhesive, but has general high temperature resistance. The epoxy curing agent can improve the high temperature resistance of the adhesive very well, but has a great influence on the initial adhesion of the adhesive. The metal salt curing agent has certain help to cohesive force of the adhesive, basically has no influence to the maintenance of initial cohesive force, comprehensively considers that the three-force balance of the adhesive tape is controlled, and selects the content of the curing agent in a compromise to be 0.5-2%, preferably, the curing agent is isocyanate curing agent, such as an adduct of toluene diisocyanate and trimethylolpropane or a derivative of hexamethylene diisocyanate; the dispersing agent is at least one of polyacrylic dispersing agent, polycarboxylic dispersing agent and polyurethane dispersing agent, and preferably the dispersing agent is polyacrylic dispersing agent.
The release profile adopted by the release layer 7 is PET release film, PP release film, polyethylene (PE) release film, PE coated release paper or glassine release paper, and preferably PET release film or PE coated release paper is adopted. The release force of the release material is 1-50 gf/inch, preferably, the release force is 1-20 gf/inch, more preferably, the release force is 5-15 gf/inch; the residual adhesion rate of the release profile is more than or equal to 80%, preferably more than or equal to 85%, and more preferably more than or equal to 90%.
Compared with the prior art, the invention has the following advantages: the electromagnetic shielding adhesive tape comprises a substrate layer, a release layer 7 arranged on one side of the substrate layer and a conductive adhesive layer 6 arranged between the substrate layer and the release layer 7, wherein the substrate layer comprises a film layer 1, a metal layer 3 arranged on two sides of the film layer 1, an adhesive layer 2 arranged between the film layer 1 and the metal layer 3, and an antistatic printing ink layer arranged on the surface of the metal layer 3 on any side, the substrate structure is a printing layer/the metal layer 3/the film layer 1/the metal layer 3, the expansion coefficients and the elastic moduli of the two materials are very different, and the problem that the printing film layer 1 and the metal layer 3 have different shrinkage rates to cause curling when heated is solved.
Delamination of the substrate layer of the multilayer structure due to tensile deformation is also a major problem. The metal foil adopted by the metal layer 3 is produced by adopting a calendaring process, and the oil residue on the surface of the metal foil cannot be completely ensured due to different treatment degrees of degreasing (annealing) processes, so that the surface energy difference of the metal foil is large. Therefore, the composition of the multi-layer structure has high requirements on the bonding strength, the damp-heat resistance and the bending resistance of the composite adhesive. The invention adopts the epoxy modified polyurethane composite adhesive, has the flexibility of polyurethane, has good adhesiveness to various base materials, can be cured at room temperature, has poor temperature resistance of polyurethane adhesive, has good high temperature resistance of epoxy, has good supplement to polyurethane structural adhesive, and ensures that the strength between composite layers is stable at high temperature.
The embodiment of the application also discloses a preparation method of the electromagnetic shielding tape, which comprises the following steps:
(1) Coating an adhesive layer 2 between two opposite sides of the film layer 1 and the corresponding metal layer 3 to prepare a metal layer 3/film layer 1/metal layer 3 three-layer structure composite material;
(2) Printing a black ink layer 4 on the outer side surface of one side of the three-layer structure composite material, and printing an antistatic gloss oil layer 5 on the outer side surface of the black ink layer 4 to prepare the antistatic gloss oil layer 5/black ink layer 4/metal layer 3/film layer 1/metal layer 3 multi-layer structure composite material;
(3) And drying, curing and molding the composite material with the multilayer structure.
And coating the conductive adhesive on the release material, and bonding the release material with one side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer 5, to form a release layer 7 and a conductive adhesive layer 6 after drying.
The step of coating the conductive adhesive on the release material, and bonding the release layer 7 and the conductive adhesive layer 6 which are formed by bonding the release material and one side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer 5, after drying, comprises the following steps:
Adding conductive filler, curing agent, black filler and dispersing agent into the solvent-type acrylate pressure-sensitive adhesive, and stirring for 10-30 min by adopting a high-speed dispersing machine to obtain the conductive adhesive.
The step of coating the conductive adhesive on the release material, and bonding the release layer 7 and the conductive adhesive layer 6 which are formed by bonding the release material and one side of the multilayer structure composite material, which is opposite to the antistatic gloss oil layer 5, after drying, comprises the following steps:
And setting the bonded electromagnetic shielding adhesive tape to be molded in a constant-temperature oven for curing. The method comprises the following specific steps: the electromagnetic shielding tape is arranged in a constant temperature oven for curing, wherein the curing temperature is 23 ℃, the curing time is 168 hours, the curing temperature is 40 ℃, the curing time is 72 hours, the curing temperature is 50 ℃, the curing time is 48 hours, the curing temperature is 70 ℃, the curing time is 24 hours, preferably the curing temperature is 40 ℃, the curing time is 72 hours, or the curing temperature is 50 ℃, the curing time is 24 hours, more preferably the curing temperature is 40 ℃, and the curing time is 72 hours. Then the coiled material with standard breadth and length is cut by rewinding to obtain the finished product.
Delamination of the substrate layer of the multilayer structure due to tensile deformation is also a major problem. The metal foil adopted by the metal layer 3 is produced by adopting a calendaring process, and the oil residue on the surface of the metal foil cannot be completely ensured due to different treatment degrees of degreasing (annealing) processes, so that the surface energy difference of the metal foil is large. Therefore, the composition of the multi-layer structure has high requirements on the bonding strength, the damp-heat resistance and the bending resistance of the composite adhesive. The epoxy modified polyurethane composite adhesive is adopted, has the flexibility of polyurethane, has good adhesion to various base materials, can be cured at room temperature, has poor temperature resistance, has good epoxy high temperature resistance, has good supplement to polyurethane structural adhesive, and ensures that the strength between composite layers is stable at high temperature.
Compared with the prior art, the invention has the following advantages: the preparation method of the electromagnetic shielding tape has simple steps and simple production process.
Preparation of a substrate layer
Example 1
The metal layer 3 is an AL foil base material with the thickness of 7 mu m, the film is a transparent PET film with the thickness of 12 mu m, epoxy modified polyurethane composite glue is adopted between the film layer 1 and the AL foil for compounding, curing is carried out for 72 hours at 50 ℃ after compounding is completed, a structure of compounding two metal layers 3 and one film layer 1 is prepared, a black ink layer 4 with the thickness of 3-5 mu m is printed on the surface of the AL foil, curing is carried out for 24 hours at 50 ℃ after printing is completed, solvent-resistant antistatic fingerprint gloss oil is printed on the ink layer after curing is completed, and the formula of the antistatic fingerprint gloss oil is as follows: 95% of fingerprint-proof gloss oil and 5% of conductive carbon black, and curing the substrate after finishing printing the gloss oil layer at 50 ℃ for 72 hours to obtain a substrate layer with the thickness of 35 mu m.
Example two
The metal layer 3 is an AL foil base material with the thickness of 7 mu m, the film is a transparent PET film with the thickness of 9 mu m, epoxy modified polyurethane composite glue is adopted between the film layer 1 and the AL foil for compounding, curing is carried out for 72 hours at 50 ℃ after compounding is completed, a structure of compounding two metal layers 3 and one film layer 1 is prepared, a black ink layer 4 with the thickness of 3-5 mu m is printed on the surface of the AL foil, curing is carried out for 24 hours at 50 ℃ after printing is completed, solvent-resistant antistatic fingerprint gloss oil is printed on the ink layer after curing is completed, and the formula of the antistatic fingerprint gloss oil is as follows: 90% of fingerprint-proof gloss oil, 10% of conductive carbon black, and curing the substrate after finishing printing the gloss oil layer at 50 ℃ for 72 hours to obtain a substrate layer with the thickness of 32 mu m.
Example III
The metal layer 3 is an AL foil base material with the thickness of 12 mu m, the film is a transparent PET film with the thickness of 9 mu m, epoxy modified polyurethane composite glue is adopted between the film layer 1 and the AL foil for compounding, curing is carried out for 72 hours at 50 ℃ after compounding is completed, a structure of compounding two metal layers 3 and one film layer 1 is prepared, a black ink layer 4 with the thickness of 3-5 mu m is printed on the surface of the AL foil, curing is carried out for 24 hours at 50 ℃ after printing is completed, solvent-resistant antistatic fingerprint gloss oil is printed on the ink layer after curing is completed, and the formula of the antistatic fingerprint gloss oil is as follows: 85% of fingerprint-proof gloss oil, 15% of conductive carbon black, and curing the substrate after finishing printing the gloss oil layer at 50 ℃ for 72 hours to obtain a substrate layer with the thickness of 42 mu m.
Preparation of conductive adhesive composition
Example 1
81.5 Mass percent of solvent type polyacrylate pressure-sensitive adhesive with the molecular weight of 60 ten thousand is selected; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by a high-speed dispersing machine for later use, and filtering by a 200-mesh filter screen for later use.
Example two
81.5 Mass percent of solvent type polyacrylate pressure-sensitive adhesive with the molecular weight of 120 ten thousand is selected; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by a high-speed dispersing machine for later use, and filtering by a 200-mesh filter screen for later use.
Example III
81.5 Mass percent of solvent type acrylic acid ester pressure-sensitive adhesive is selected, wherein the solvent type acrylic acid ester pressure-sensitive adhesive comprises 50 mass percent of solvent type polyacrylate pressure-sensitive adhesive with the molecular weight of 120 ten thousand and 31.5 mass percent of solvent type polyacrylate pressure-sensitive adhesive with the molecular weight of 60 ten thousand; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by a high-speed dispersing machine, and filtering by a 200-mesh filter screen for later use.
Preparation of antistatic electromagnetic shielding adhesive tape
Example 1
And (3) selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and release by single-sided silicon coating, coating a mixture of the conductive adhesive embodiment I on the silicone oil surface, drying in an oven, compounding the mixture with the metal layer 3 surface of the base material layer preparation embodiment I, rolling to prepare an antistatic electromagnetic shielding tape with thickness of 60 mu m, curing in a constant-temperature oven, selecting curing temperature of 40 ℃ for 3 days, and cutting into different specifications according to customer requirements after curing.
Example two
And (3) selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and release by single-sided silicon coating, coating a conductive adhesive on the surface of silicone oil, drying in an oven, compounding the conductive adhesive with the surface of the metal layer 3 of the preparation example II of a substrate layer, rolling to prepare an antistatic electromagnetic shielding tape with thickness of 60 mu m, curing in a constant-temperature oven, selecting curing temperature of 40 ℃ for 3 days, and cutting into different specifications according to the requirements of customers after curing.
Example III
And (3) selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and release by single-sided silicon coating, coating a preparation example III of conductive adhesive on the silicone oil surface, drying in an oven, compounding the silicone oil surface with the metal layer 3 surface of the preparation example III of the substrate layer with the thickness of 18 mu m, rolling to prepare an antistatic electromagnetic shielding tape with thickness of 60 mu m, curing in a constant-temperature oven, selecting curing temperature of 40 ℃ for 3 days, and cutting into different specifications according to the requirements of customers after curing.
Example IV
And (3) selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and release by single-sided silicon coating, coating a conductive adhesive on the silicone oil surface, drying in an oven, compounding the conductive adhesive with the metal layer 3 surface of the first preparation example of a substrate layer with the thickness of 28 mu m, rolling to prepare an antistatic electromagnetic shielding tape with the thickness of 60 mu m, curing in a constant-temperature oven, selecting curing temperature of 40 ℃ for 3 days, and cutting into different specifications according to the requirements of customers after curing.
The electromagnetic shielding tape prepared was subjected to the following test:
Adhesion test:
1. instrument and equipment
Tensile testing machine: the constant-speed stretching type tensile testing machine has a stretching speed of 300+/-10 mm/min and is provided with a tension sensor with a measurement of 5 kg;
And (3) a pressing device: the steel roller with rubber coated on the surface has the weight of 2000+/-50 g and has a handle and can reciprocate.
Test plate: SUS mirror-surface steel plates (roughness 50.+ -.30 nm) and GLASS (GLASS) clean test plates (150 mm long, 50mm wide, 3mm thick) were wiped clean with absolute ethyl alcohol on their surfaces.
2. Cutting test piece
A test piece 25mm wide and about 200mm long was cut.
3. Experimental environmental conditions
The test environment should be kept at 23+ -2deg.C, 65+ -5% RH standard state
4. Test procedure
Attaching the cut test piece to the middle part of the test board along the longitudinal direction of the test board, then slowly and reciprocally rolling for three times by using a pressing device, and placing for 20 minutes in the standard experimental environment state; the test board is arranged on a tensile testing machine, the lower bending angle of the test piece is 180 degrees, and the test board is fixed on the upper clamping head; stripping is carried out at the speed of 300+/-10 mm/min, the effective test length is more than 100mm, and the test data is automatically recorded on a computer of a point tester. The same samples were tested in triplicate.
5. Result calculation
The average value was read in the range recorded on the recording paper, with the unit of N/25mm being the standard.
6. By testing the adhesive force of the adhesive with aging resistance
Calculated according to the Alrhenii Wu Sigong formula: the test tape samples were aged for two months at 70 ℃ and equal to two years at ambient temperature. After aging is completed, the adhesion is tested, as described above.
Holding force
1. Instrument and equipment
And (3) a dryer: a circulating type blast drier capable of keeping the temperature of 80+/-2 ℃ is characterized in that a test surface of a test plate is vertically placed at 180 degrees relative to the horizontal ground, and the lower end of a sample is hung with a load of 1000+/-10 g;
And (3) a pressing device: the steel roller with rubber coated on the surface has the weight of 2000+/-50 g and has a handle and can reciprocate.
Test plate: SUS mirror plate (60 mm long, 50mm wide, 3mm thick), the surface of the test plate was wiped clean with absolute ethyl alcohol in the longitudinal direction.
2. Cutting test piece
A test piece 25mm wide and about 70mm long was cut.
3. Experimental environmental conditions
The test environment should be kept at 23+ -2deg.C, 65+ -5% RH standard state
4. Test procedure
At the position of the test plate close to the edge, effectively attaching the test piece and the steel plate to the area of 25X 25mm 2, and then repeatedly rolling for three times by using a pressing device; and (5) scribing the rough surface of the test board at the original joint position of the adhesive tape and the test board by using an oil pen. The test was carried out by placing it in a circulating forced-air dryer capable of maintaining 80.+ -. 2 ℃ and after 20 minutes starting to hang a weight of 1000.+ -.10 g. After 1h, the distance of displacement was read or the time for which the test piece was dropped was recorded.
5. Result calculation
The holding force is the displacement distance of the test piece after 1h, the unit is mm, and the precision is 0.1mm. When the test piece was dropped from the test plate, the time of dropping was recorded in min.
Fixed load
1. Instrument and equipment
And (3) a dryer: a circulating type blast drier capable of keeping the temperature of 50+/-2 ℃ is arranged on the ground of the water product of the test plate in parallel, and one end of the test sample is hung with a load of 100+/-5 g;
And (3) a pressing device: the steel roller with rubber coated on the surface has the weight of 2000+/-50 g and has a handle and can reciprocate.
Test plate: SUS mirror-surface steel plates (roughness 50.+ -.30 nm) and GLASS (GLASS) clean test plates (150 mm long, 50mm wide, 3mm thick) were wiped clean with absolute ethyl alcohol on their surfaces.
2. Cutting test piece
A test piece 20mm wide and about 200mm long was cut.
3. Experimental environmental conditions
The test environment should be kept at 23+ -2deg.C, 65+ -5% RH standard state
4. Test procedure
Attaching a test piece with an area of 20X 100mm 2 at the position of the test board near the edge, then repeatedly rolling for three times by using a pressing device, and standing for 2 hours; and (5) scribing the rough surface of the test board at the original joint position of the adhesive tape and the test board by using an oil pen. The test pieces were placed in a circulating forced air dryer capable of maintaining 50.+ -. 2 ℃ and a weight of 100.+ -. 5g was hung for testing. After 1h, the distance of displacement was read or the time for which the test piece was dropped was recorded.
5. Result calculation
The displacement unit is mm and the precision is 0.1mm. When the test piece was dropped from the test plate, the time of dropping was recorded in min.
Surface resistor (rubber surface)
1. Instrument and equipment
Micro resistance tester: model HIOKI RM3544, test jig weight 500g;
2. Cutting test piece
The test piece 50mm x 75mm was cut and placed in a laboratory standard environment for more than 2 hours.
3. Experimental environmental conditions
The test environment should be kept at 23+ -2deg.C, 65+ -5% RH standard state
4. Test procedure
The 50mm x 75mm sample was horizontally placed on glass, 500g jig was gently placed on the surface of the sample to be tested, the readings were displayed on a microresistance tester, and after 30s the data were read and recorded.
5. Result calculation
Unit, Ω/sq, the same sample, at least 3 times (if there is abnormal data, the number of tests needs to be increased), and arithmetic average processing is performed on 3 sets of data, and the final result is averaged.
Surface resistance (ink surface)
1. Instrument and equipment
Micro resistance tester: model SIMCO ST-4;
2. Cutting test piece
Test pieces 100mm x 100mm were cut and left to stand in a laboratory standard environment for more than 2 hours.
3. Experimental environmental conditions
The test environment should be kept at 23+ -2deg.C, 65+ -5% RH standard state
4. Test procedure
A 100mm x 100mm sample was placed horizontally on glass, the test instrument was gently placed on the surface of the sample to be tested, the readings were displayed on the test instrument and recorded.
5. Result calculation
The same sample is tested for at least 3 times (if abnormal data exist, the test times are increased), arithmetic average processing is carried out on 3 groups of data, and the final result is averaged.
Reworkability of
To SUS304 mirror surface, SGLC (hot dip zinc aluminium alloy plate) and GLASS, the sample length is 150mm, bordures the dress (one side stays 2mm wide, one side stays 5mm wide), and after the laminating is good put into 50 ℃ oven and is dried 4 hours, take out and heat and cool at normal atmospheric temperature after 1 hour whole strip with 180 angle stripping in the middle speed with the hand, observe whether up to standard, the standard is: the residual glue area is less than 30%, the ink layer is free from falling off, and other anomalies are avoided.
Solvent resistance (isopropanol resistance test)
The cotton swab is dipped in isopropanol and the printing surface is wiped for 5 times under the condition of no pressure, so that the printing surface is a qualified product without demoulding phenomenon.
The test results are recorded in table 1 below:
TABLE 1
From the above table, in terms of adhesive force performance, the performances of the electromagnetic shielding adhesive tapes of the third embodiment and the fourth embodiment are all optimal, the adhesive force performance is continuously observed after the aging resistance test, and the electromagnetic shielding adhesive tapes of the second embodiment, the third embodiment and the fourth embodiment meet the characteristic of stable adhesive force after aging, so that the long-term adhesive property can be ensured. The electromagnetic shielding adhesive tapes of the third and fourth embodiments have the best performance as seen from the fixed load test data representing the anti-warping property. In terms of adhesive surface resistance, the electromagnetic shielding adhesive tapes of the first embodiment, the third embodiment and the fourth embodiment have the best performance. In terms of reworkability, the electromagnetic shielding tapes of the first and fourth embodiments perform optimally. In terms of solvent resistance, the electromagnetic shielding tapes of the first and fourth embodiments perform best, and the electromagnetic shielding tape of the 3 embodiment is worst. The antistatic effect of the ink surface is less than or equal to 10 8 ohm/mouth, and all products have excellent antistatic property. In summary, the electromagnetic shielding tape of the fourth embodiment has excellent comprehensive performance among various performance indexes, and meets the design requirement.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
Claims (4)
1. An electromagnetic shielding adhesive tape is characterized in that a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and single-sided silicon coating release is selected, and a conductive adhesive is coated on the surface of silicone oil, wherein the preparation method of the conductive adhesive comprises the following steps of selecting 81.5% by mass of a solvent polyacrylate pressure-sensitive adhesive with molecular weight of 120 ten thousand; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by a high-speed dispersing machine for later use, and filtering by a 200-mesh filter screen for later use; the preparation method of the substrate layer comprises the steps of drying in an oven, compounding the substrate layer with a metal layer surface with the thickness of 28 mu m, wherein the metal layer is an AL foil substrate with the thickness of 7 mu m, the film layer is a transparent PET film with the thickness of 9 mu m, compounding the film layer with the AL foil by adopting epoxy modified polyurethane compound adhesive, curing at 50 ℃ for 72 hours after compounding is finished, preparing a structure with two layers of the metal layer and one layer of the film layer, printing a black ink layer with the thickness of 3-5 mu m on the surface of the AL foil, curing at 50 ℃ for 24 hours after printing is finished, and printing solvent-resistant antistatic anti-fingerprint gloss oil on the black ink layer after curing is finished, wherein the formula of the antistatic anti-fingerprint gloss oil is as follows: 90 mass percent of fingerprint-proof gloss oil and 10 mass percent of conductive carbon black, and curing the substrate layer after finishing printing the gloss oil layer at 50 ℃ for 72 hours to prepare the substrate layer with the thickness of 32 mu m; the antistatic electromagnetic shielding tape with the thickness of 60 mu m is manufactured by rolling, then the antistatic electromagnetic shielding tape is cured in a constant-temperature oven, the curing temperature is selected to be 40 ℃, the curing time is 3 days, and the finished product is manufactured by cutting the antistatic electromagnetic shielding tape into different specifications according to the requirements of customers.
2. An electromagnetic shielding adhesive tape is characterized in that a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and single-sided silicon coating release is selected, and a conductive adhesive is coated on the surface of silicone oil, wherein the conductive adhesive is prepared by selecting 81.5 mass percent of solvent type acrylic pressure-sensitive adhesive, wherein the solvent type acrylic pressure-sensitive adhesive comprises 50 mass percent of solvent type acrylic pressure-sensitive adhesive with molecular weight of 120 ten thousand and 31.5 mass percent of solvent type acrylic pressure-sensitive adhesive with molecular weight of 60 ten thousand; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by adopting a high-speed dispersing machine, and filtering by a 200-mesh filter screen for later use; the preparation method of the substrate layer comprises the steps of drying in an oven, compounding the substrate layer with a metal layer surface with the thickness of 28 mu m, wherein the metal layer is an AL foil substrate with the thickness of 7 mu m, the film layer is a transparent PET film with the thickness of 12 mu m, compounding the film layer with the AL foil by adopting epoxy modified polyurethane compound adhesive, curing at 50 ℃ for 72 hours after compounding is finished, preparing a structure with two layers of the metal layer and one layer of the film layer, printing a black ink layer with the thickness of 3-5 mu m on the surface of the AL foil, curing at 50 ℃ for 24 hours after printing is finished, and printing solvent-resistant antistatic anti-fingerprint gloss oil on the black ink layer after curing is finished, wherein the formula of the antistatic anti-fingerprint gloss oil is as follows: 95% of fingerprint-proof gloss oil, 5% of conductive carbon black, and curing the substrate layer after finishing printing the gloss oil layer at 50 ℃ for 72 hours to prepare a substrate layer with the thickness of 35 mu m; the antistatic electromagnetic shielding tape with the thickness of 60 mu m is manufactured by rolling, then the antistatic electromagnetic shielding tape is cured in a constant-temperature oven, the curing temperature is selected to be 40 ℃, the curing time is 3 days, and the finished product is manufactured by cutting the antistatic electromagnetic shielding tape into different specifications according to the requirements of customers.
3. A preparation method of an electromagnetic shielding adhesive tape is characterized by selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and single-sided silicon-coated release, and coating a conductive adhesive on the silicone oil surface, wherein the preparation method of the conductive adhesive comprises the following steps of selecting 81.5 mass% of solvent polyacrylate pressure-sensitive adhesive with molecular weight of 120 ten thousand; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by a high-speed dispersing machine for later use, and filtering by a 200-mesh filter screen for later use; the preparation method of the substrate layer comprises the steps of drying in an oven, compounding the substrate layer with a metal layer surface with the thickness of 28 mu m, wherein the metal layer is an AL foil substrate with the thickness of 7 mu m, the film layer is a transparent PET film with the thickness of 9 mu m, compounding the film layer with the AL foil by adopting epoxy modified polyurethane compound adhesive, curing at 50 ℃ for 72 hours after compounding is finished, preparing a structure with two layers of the metal layer and one layer of the film layer, printing a black ink layer with the thickness of 3-5 mu m on the surface of the AL foil, curing at 50 ℃ for 24 hours after printing is finished, and printing solvent-resistant antistatic anti-fingerprint gloss oil on the black ink layer after curing is finished, wherein the formula of the antistatic anti-fingerprint gloss oil is as follows: 90 mass percent of fingerprint-proof gloss oil and 10 mass percent of conductive carbon black, and curing the substrate layer after finishing printing the gloss oil layer at 50 ℃ for 72 hours to prepare the substrate layer with the thickness of 32 mu m; the antistatic electromagnetic shielding adhesive tape with the thickness of 60 mu m is manufactured by rolling, then the antistatic electromagnetic shielding adhesive tape is cured in a constant-temperature oven, the curing temperature is selected to be 40 ℃, the curing time is 3 days, and the curing is completed, and the antistatic electromagnetic shielding adhesive tape is cut into different specifications according to the requirements of customers, thus obtaining the finished product.
4. A preparation method of an electromagnetic shielding adhesive tape is characterized by selecting a transparent PET release film with release force of 8-12 gf/inch, residual adhesion rate of more than or equal to 90%, thickness of 36 mu m and single-sided silicon-coated release, and coating a conductive adhesive on a silicone oil surface, wherein the preparation method of the conductive adhesive comprises the steps of selecting 81.5 mass% of a solvent type acrylic pressure-sensitive adhesive, wherein the solvent type acrylic pressure-sensitive adhesive comprises 50 mass% of a solvent type acrylic pressure-sensitive adhesive with a molecular weight of 120 ten thousand and 31.5 mass% of a solvent type acrylic pressure-sensitive adhesive with a molecular weight of 60 ten thousand; 1% by mass of a polyacrylic dispersant; 8 mass% of carbon black; 8 mass% of nickel carbonyl powder; 1.5 mass% of isocyanate curing agent; uniformly mixing by adopting a high-speed dispersing machine, and filtering by a 200-mesh filter screen for later use; the preparation method of the substrate layer comprises the steps of drying in an oven, compounding the substrate layer with a metal layer surface with the thickness of 28 mu m, wherein the metal layer is an AL foil substrate with the thickness of 7 mu m, the film layer is a transparent PET film with the thickness of 12 mu m, compounding the film layer with the AL foil by adopting epoxy modified polyurethane compound adhesive, curing at 50 ℃ for 72 hours after compounding is finished, preparing a structure with two layers of the metal layer and one layer of the film layer, printing a black ink layer with the thickness of 3-5 mu m on the surface of the AL foil, curing at 50 ℃ for 24 hours after printing is finished, and printing solvent-resistant antistatic anti-fingerprint gloss oil on the black ink layer after curing is finished, wherein the formula of the antistatic anti-fingerprint gloss oil is as follows: 95% of fingerprint-proof gloss oil, 5% of conductive carbon black, and curing the substrate layer after finishing printing the gloss oil layer at 50 ℃ for 72 hours to prepare a substrate layer with the thickness of 35 mu m; the antistatic electromagnetic shielding adhesive tape with the thickness of 60 mu m is manufactured by rolling, then the antistatic electromagnetic shielding adhesive tape is cured in a constant-temperature oven, the curing temperature is selected to be 40 ℃, the curing time is 3 days, and the curing is completed, and the antistatic electromagnetic shielding adhesive tape is cut into different specifications according to the requirements of customers, thus obtaining the finished product.
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| CN110862781B (en) * | 2019-11-14 | 2024-01-23 | 广东弘擎电子材料科技有限公司 | Conductive shading adhesive tape and preparation method thereof |
| CN114394368B (en) * | 2020-01-03 | 2024-01-19 | 河源轩朗光电科技有限公司 | Cutting machine, conveying mechanism, conveying belt and manufacturing method thereof |
| CN111394007A (en) * | 2020-04-30 | 2020-07-10 | 张家港保税区汇英聚福材料科技合伙企业(有限合伙) | High-conductivity adhesive tape |
| CN112735629B (en) * | 2020-12-01 | 2022-04-12 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Low-temperature polymer conductive silver paste with low silver content and preparation method thereof |
| CN112735628B (en) * | 2020-12-01 | 2022-03-29 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | Low-temperature polymer conductive silver paste and preparation method thereof |
| CN113799455A (en) * | 2021-08-09 | 2021-12-17 | 广东兆美新材料科技有限公司 | Double-aluminum mylar electronic film |
| CN114148068A (en) * | 2021-11-12 | 2022-03-08 | 凯仁精密材料(江苏)有限公司 | Shielding adhesive tape and preparation method thereof |
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