CN106961826A - The electromagnetic wave proof film that a kind of repeatable attachment is used - Google Patents
The electromagnetic wave proof film that a kind of repeatable attachment is used Download PDFInfo
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- CN106961826A CN106961826A CN201710186385.9A CN201710186385A CN106961826A CN 106961826 A CN106961826 A CN 106961826A CN 201710186385 A CN201710186385 A CN 201710186385A CN 106961826 A CN106961826 A CN 106961826A
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- electromagnetic wave
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- wave proof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Abstract
The invention provides the electromagnetic wave proof film that a kind of repeatable attachment is used; the electromagnetic wave proof film sets one layer of flexible adhesive linkage of insulation on the surface of base material; insulating, flexible bonding layer surface sets at least one layer of metal level; one layer of pressure sensitive conductive adhesive layer is set in layer on surface of metal, diaphragm is set on pressure sensitive conductive adhesive layer surface；The present invention is relative to cumbersome heated lamination solidify afterwards technique, and the present invention, which need to be only aligned, needs the position finger pressure of electromagnetic wave proof film, and processing and application technology is simple, without equipment such as excessive laminating machine, baking ovens；Set without lengthy and jumbled personnel and complicated operating procedure, serious forgiveness is high and can effectively reduce the possibility for occurring danger in energy loss and subsequent operation, above all, after actual location attachment mistake, resetting can be peeled off to use, the generation of useless version will not be caused because of attachment mistake.Can be widely applied to mobile phone, camera, medicine equipment, notebook etc. needs the position of electromagnetic protection, such as FPC soft boards, PCB hardboards.
Description
Technical field
The present invention relates to thin film technique field, particularly a kind of electromagnetic wave proof film.
Background technology
Since 21 century, with the arriving of information age, progressively civilian FPC industries have been transferred to it from military and have welcome greatly
Opportunity to develop, it is widely used in the consumer electronics such as computer, camera, printer, automobile audio, and with
Under the background that light, thin, short, small design is pursued in consumption electronic product, FPC applications are generalized to new field including intelligence
Mobile phone, PDA, notebook computer, digital camera, LCDs etc. minimize terminal electronic product.And from whole electronic product
Trend analysis, following product be increasingly intended to it is thin, it is gently, highly integrated, 3 D stereo mobilism development, group line between
And layer it is other between electromagnetic interference problem can more increase dependence of the FPC products for electromagnetic protection.Existing electromagnetic protection means
In, attachment electromagnetic wave proof film because have more preferable practicality, preferably operability, have more cost advantage, can more meet slim
Change and require and more favored by major electronics firms.Therefore the benign development situation of FPC FPCs can further promote electromagnetism
The application and demand of ripple protecting film.
Existing electromagnetic wave proof film mainly has following several structures：
The first structure is as follows：
The Chinese patent of Application No. 200680016573.7 discloses screened film, shielded printed circuit board, shielded flexible
Printed circuit board (PCB), method of manufacturing shielding film and method of manufacturing shielded printed circuit board, shield membrane structure, by resistance to it discloses one kind
Hard formation and flexible soft formation composition insulating barrier are ground, metal level is formed on, one layer of heat cure is then formed on the metal layer
Conductive adhesive layer.The shielding can realize 50dB shield effectiveness in wider frequency range.
Second of structure is as follows：
Application No. 200680005088.X Chinese patent disclose electromagnetic wave shielding film, its preparation method and
The electromagnetic shielding method of adherend, shields membrane structure, by insulating barrier and isotropism conductive adhesive layer it discloses one kind
Composition, the screened film only has 40dB shield effectiveness in high band.
The third structure is as follows：
The Chinese patent of Application No. 201220297494.0 discloses a kind of ultra-thin shielding film of high shield effectiveness, its by
Insulating barrier, two or more different materials metal levels, conductive adhesive layer composition, it utilizes many of the metal level of two or more different materials
Secondary reflection, has reached 60dB high shield effectiveness.
What electromagnetic wave proof film (screened film) processed and applied of above-mentioned three kinds of structures was used to the process of FPC
That known heated lamination solidify afterwards technique carries out DEG C precuring 30s of laminating assembling, i.e., 180 in industry, after under 2Mpa pressure,
Be laminated 2min, after be transferred in 160 DEG C of baking ovens and solidify 30min.The processing technology needs rigorous positioning action, prevents electromagnetic wave
There is mistake in protecting film mounting position, once there is mounting position mistake, electromagnetic wave easily occurs when peeling off electromagnetic wave proof film
There is breakage in the coating of protecting film, influences electromagnetic protection characteristic, and serious forgiveness is relatively low, and the electromagnetic wave after heated lamination solidification is prevented
Cuticula forever can be mounted on FPC, and not reproducible attachment is used, in addition, known heated lamination curing process is also deposited
In following defect：
(1) the step of cumbersome, demand and laminating machine, baking oven etc., more, the demand operating personnel of equipment were more
(2) energy resource consumption situation is more serious, high expensive
(3) there is certain danger, such as high-temperature operation, high temperature heating product produce poisonous and harmful substance
The content of the invention
The technical problem to be solved in the present invention is for repeatable there is provided one kind in place of deficiencies of the prior art
Electromagnetic wave proof film that attachment is used and preparation method thereof.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
The electromagnetic wave proof film that a kind of repeatable attachment is used, one layer of flexible adhesive linkage of insulation is set on the surface of base material,
Insulating, flexible bonding layer surface sets at least one layer of metal level, and one layer of pressure sensitive conductive adhesive layer is set in layer on surface of metal,
Pressure sensitive conductive adhesive layer surface sets diaphragm.
Another technical scheme is：
The electromagnetic wave proof film that a kind of repeatable attachment is used, the flexible adhesive linkage of insulation is coated with the side of metal foil,
Metal foil opposite side is coated with pressure sensitive conductive adhesive layer, respectively in the insulate another side and pressure-sensitive adhesive type conductive adhesive layer of flexible adhesive linkage
Surface pass through certain temperature and pressure composite base material and diaphragm.
Above-mentioned electromagnetic wave proof film, the flexible adhesive linkage of insulation by cementability the parts by weight of resin 100；Carbon black filler
10-50 parts by weight；Curing agent 5-20 parts by weight；The coating liquid dry solidification institute of the material compositions such as auxiliary agent 0.5-10 parts by weight
, insulate flexible preferred 3-8 μm of thickness of adhibited layer.
Above-mentioned electromagnetic wave proof film, the resin preferred epoxy of the cementability, polyester resin, polyurethane resin, third
One kind of the modified resinoid such as olefin(e) acid resin, polyamide, organic siliconresin or similar polyurethane modified epoxy resin or
Several mixing compositions of person.
Curing agent can be selected as polyamide curing agent, miaow in above-mentioned electromagnetic wave proof film, the flexible adhesive linkage of insulation
One or several kinds in azoles curing agent, isocyano curing agent, anhydride curing agent are used cooperatively.
Above-mentioned electromagnetic wave proof film, the metal layer thickness is 0.05 μm -0.5 μm.
Above-mentioned electromagnetic wave proof film, the metal foil thickness is 5 μm -15 μm.
Above-mentioned electromagnetic wave proof film, the pressure sensitive conductive adhesive layer is by the material composition containing following weight percentage
Coating liquid solidification is obtained：Conductive metal powder 20%-60%, pressure-sensitive gum resin 35%-78%, other auxiliary agents 2%-5%.
Above-mentioned electromagnetic wave proof film, the pressure-sensitive gum resin is rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive, organosilicon pressure
At least one in quick glue, polyurethanes pressure sensitive adhesive.
Above-mentioned electromagnetic wave proof film, the conductive metal powder be silver powder, copper powder, nickel powder, CNT, silver-coated copper powder,
At least one in silver coated nickel powder, silver-colored bag CNT, silver-colored bag resin balls, preferably 10 μm -20 μm of particle diameter
Above-mentioned electromagnetic wave proof film, the pressure sensitive conductive adhesive layer thickness is 5-15 μm.
Beneficial effect
The present invention both ensure that product surface insulating properties and flexible by setting the flexible adhesive linkage of insulation in the product
Performance, further through using adhering resin so that base material is not readily separated with metal level or metal foil layer；In addition, by setting at least
Layer of metal layer or metal foil layer and pressure sensitive conductive adhesive layer, both cooperate, that is, meet the high shield effectiveness of product, again full
Foot product ground connection use requirement, so as to play anti-interference and protective effect to the position for needing to carry out electromagnetic protection；It is most important
A bit, by setting pressure sensitive conductive adhesive layer in metal level or metal foil layer surface, with existing heated lamination solidify afterwards technique
Compare, only need to need the position of laminating electromagnetic wave proof film, finger pressure slightly pressure by being aligned in actual use.If gone out
Mistake is now mounted, easily electromagnetic wave proof film can be peeled off from pressure sensitive conducting resinl aspect, and is not in coating damage, so that
Ensure that FPC soft boards are not contaminated；Had using the electromagnetic wave proof film of said structure " it is viscous it is easily throw off and be not difficult, stripping without
Damage " the characteristics of, electromagnetic wave proof film has been reached the effect that repeatable attachment uses minimum 3 times.
Using product of the present invention, with later processing operation is simple, personnel, device requirement is less, save the energy, cost drop
It is low substantially, after operational error repeat attachment use, it is dangerous relatively low the advantages of.
Using product of the present invention, fit on FPC, shielded flexible wiring board can be obtained.
Brief description of the drawings
Fig. 1 is the product structure schematic diagram of the embodiment of the present invention 1 and embodiment 5；
Fig. 2 is the product structure schematic diagram of the embodiment of the present invention 2；
Fig. 3 is the product structure schematic diagram of the embodiment of the present invention 3 and embodiment 4.
Each label is expressed as in figure：1 base material；The 2 flexible adhesive linkages of insulation；3-1,3-2 metal level；3-3 metal foil layers；
4 pressure sensitive conductive adhesive layers；5 metal dusts；6 diaphragms.
Embodiment
The electromagnetic wave proof film that the repeatable attachment that the present invention is provided is used is by base material, insulate flexible adhesive linkage, at least one
Layer metal level or metal foil layer, pressure sensitive conductive adhesive layer and diaphragm composition, wherein the flexible adhesive linkage that insulate is arranged on base material
Surface, metal level or metal foil layer, which are located at, to insulate between flexible adhesive linkage and pressure sensitive conductive adhesive layer, and diaphragm is located at electromagnetic wave
The outermost of protecting film.
The present invention is to base material without special requirement, and it can select known engineering plastics film, for example：Polyester film,
Kapton, polyimide amide film, PPS films, polypropylene film etc..Because following process process is related to
Known reflow soldering process, heat resistance and insulation electrical performance require higher, preferably Kapton, the preferred 30-100 of thickness
μm, when base material thickness is less than 30 μm, substrate intensity is smaller, is difficult from FPC to peel off electromagnetic wave proof film, loses
The effect reused, when base material thickness is more than 100 μm, cost is higher.From heat-resisting and cost consideration, preferably polyphenylene sulfide
Ether film, preferred 40-100 μm of thickness, when base material thickness is less than 40 μm, the resistance to heat differential of base material is yielding, when base material thickness is more than
At 100 μm, cost is higher.
Insulated in the present invention flexible adhesive linkage effect mainly form a connecting link cemented with base material and metal level, so as to protect
The phenomenon of coating layering is less prone to during card attachment electromagnetic wave proof film, and uses flexible insulating resin, that is, be ensure that
Insulation characterisitic requirement, in turn ensure that the shielded flexible wiring board for being pasted with this electromagnetic wave proof film is less prone to when sliding test
Metal level or the phenomenon of metal foil layer fracture, thus ensure that it is actually used in lasting excellent shield effectiveness.Described is exhausted
The flexible adhesive linkage of edge by cementability the parts by weight of resin 100；Carbon black filler 10-50 parts by weight；Curing agent 5-20 parts by weight；Auxiliary agent
Obtained by the coating liquid dry solidification of the material compositions such as 0.5-10 parts by weight, insulate flexible preferred 3-8 μm of thickness of adhibited layer.
The resin preferred epoxy of the cementability insulated in the present invention in flexible adhesive linkage, polyester resin, polyurethane tree
The one of the modified resinoid such as fat, acrylic resin, polyamide, organic siliconresin or similar polyurethane modified epoxy resin
Plant or several mixing compositions.Such as Commercial epoxy resins E-20, polyester resin 50175.
The effect of the carbon black filler in flexible adhesive linkage of being insulated in the present invention is to provide the apparent of black, with base material it is compound after
The insulaion resistance of coating can be reduced by reaching that dull gray black is apparent (industry public requirement), and adding carbon black, play anti-quiet
The effect of electricity.Commercially available various carbon black fillers, preferably high-carbon black pigment filler, such as Degussa high-carbon black pigment can be selected
Special Black 250 etc..The content of carbon black filler relative to 100 parts by weight adhesive resins, preferably 10-50 parts by weight,
When ratio is less than 10 parts by weight, coating blackness is smaller, obvious dull gray black can not be obtained after being combined with base material, when ratio is big
When 50 parts by weight, carbon black filler is difficult to be uniformly dispersed, and caking, sedimentation easily occurs.
The curing agent in flexible adhesive linkage that insulated in the present invention can be selected as polyamide curing agent, imidazole curing agent, isocyanide
One or several kinds in acid group curing agent, anhydride curing agent are used cooperatively, the 650NET that such as canal material scientific ＆ technical corporation sells
Insulate curing agent in flexible adhesive linkage in polyamide curing agent, BASF BASF HDI class curing agent HI-190 etc., the present invention
Selection and actually used amount are compatible with the species of the resin of cementability, resin total amount, molecular structure, activity group content, resin
Property etc. factor it is related.
During the auxiliary agent in flexible adhesive linkage that insulated in the present invention is dispersant, anti-settling agent, levelling agent, tackifier, thickener etc.
At least one, such as Germany's Bi Ke chemical productions dispersant B YK-163.Insulated in the present invention choosing of auxiliary agent in flexible adhesive linkage
Select related to the factor such as actually used amount and the species of carbon black, the total amount of carbon black, the species of resin, the compatibility of resin.
Insulate preferably 3~8 μm of flexible thickness of adhibited layer in the present invention, if thickness is less than 3 μm, insulate flexible adhesive linkage
With metal level and base material attachment loosely, easily there is lamination, if thickness is big 8 μm, pliability declines, and is pasted with this electromagnetism
The shielded flexible wiring board of ripple protecting film easily occurs the phenomenon of metal level or metal foil layer fracture when sliding flexure test.
The effect of metal level is reflection electromagnetic wave signal in the present invention, is electromagnetic wave so as to obtain excellent shield effectiveness
The core layer of protecting film.As the metal material for forming metal level can be in aluminium, nickel, copper, silver, gold, chromium it is a kind of either
There is the metal alloy layer of above two or several materials formation, consider from price, preferably silver layer or layers of copper, can also basis
The selection metal material of required shielding character suitably.Metal level passes through vacuum evaporation, water in the flexible bonding layer surface that insulate
The methods such as plating, sputtering, chemical deposition are formed.
Preferably 0.05 μm -0.5 μm of the thickness of metal level, when metal layer thickness is less than 0.05 μm, shield effectiveness is poor, works as gold
When belonging to thickness degree more than 0.5 μm, metal layer stress is larger, easy fracture when sliding flexure test.
Metal level in the present invention is not limited only to the coat of metal or metal foil, if using metal foil material, from
Cost and the consideration of the flexible ductility of material, preferably Copper Foil.Preferably 5 μm -15 μm of the thickness of metal foil, when the thickness of metal foil is small
When 5 μm, the poor and thinner metal foil process technology of shield effectiveness requires higher, is difficult stable acquisition, and high cost works as metal
When the thickness of paper tinsel is more than 15 μm, the pliability of integral material declines, easy fracture when sliding flexure test.
Pressure sensitive conductive adhesive layer is to dry institute by the coating liquid of the material composition of following weight percentage in the present invention
：Conductive metal powder 20%-60%.Pressure-sensitive gum resin 35%-78%.Other auxiliary agent 2%-5%, by above-mentioned substance with mixing
Formed after the toluene butanone equal solvent of a certain amount of ratio by the way that the techniques such as known high-speed stirred, ball milling, quick worker, grinding are scattered,
Its thickness control is at 5~15 μm.Thickness is less than 5 μm.Then attachment fastness is poor, easily the separation that comes off occurs during long-term use, such as
Fruit thickness is more than 15 μm, then pliability declines, and slides flexure and tests not good, and is unsatisfactory for the demand of ultrathin development.
Pressure sensitive conductive adhesive layer can mounted by the slightly stressed mode of finger pressure and arrived on FPC in the present invention
Need the position of electromagnetic protection, pressure sensitive conductive adhesive layer surface and polyimides auxiliary material (the industry public affairs of FPC flexible circuitry plate surfaces
Know) 180 ° of preferred 2.0N/cm-4.0N/cm of peeling force；When peeling force is less than 2.0N/cm, electromagnetic wave proof film and FPC
Surface cements difference, easy to fall off, and when peeling force is more than 4.0N/cm, electromagnetic wave proof film is cemented preferably with polyimides, if gone out
Now after the error of attachment positioning action, it is not easily stripped, it is impossible to reach the requirement reused well.
Suitable for the present invention the conductive metal powder of pressure sensitive conductive adhesive layer can be commercially available silver powder, copper powder, nickel powder,
CNT, silver-coated copper powder, silver coated nickel powder, silver-colored bag CNT, the one or several kinds of silver-colored bag resin balls.Suitable for the present invention
Conductive metal powder shape can be one or several kinds of mixing groups in spherical, needle-like, flake, threadiness or dendroid
Into, it is contemplated that electromagnetic wave proof film is often mounted to (known) on earthed circuit in industry, it is desirable to be connected with earthed circuit
Connect resistance small, therefore the preferred needle-like of shape, spherical or dendroid, such as Shenzhen Nan Xiang conductive materials Science and Technology Ltd. are given birth to
The NX-503 dendroid silver-bearing copper conducting powders of production.Suitable for preferably 10 μm -20 μm of the conductive metal powder particle diameter of the present invention, because of metal
The particle diameter of powder is suitable with the thickness of pressure sensitive conductive adhesive layer, and during finger pressure attachment, metal dust easily pierces through coating with connecing
Ground circuit is connected so that ground connection is unimpeded.When metal dust particle diameter be less than 10 μm when, metal dust easily by pressure sensitive adhesive resin dispersion,
Cause the connection resistance being connected with ground connection bigger than normal, in addition, metal dust particle diameter is small, finger pressure pressure can not make its pierce through pressure sensitive adhesive
Resin, and be difficult to be connected with metal level, connection resistance can be caused bigger than normal.When metal dust particle diameter is more than 20 μm, by pressure sensitive adhesive
Resin mixes apparent difference after the coating liquid constituted is dried with metal dust, uneven.
Suitable for the present invention pressure-sensitive gum resin be rubber pressure-sensitive adhesive, it is acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, poly-
At least one in urethane class pressure sensitive adhesive.When to step fillibility and the higher conductive requirement of aperture ground connection, preferred rubber type pressure
Quick glue, when the heat resistant requirements in follow-up known reflow soldering process are higher, preferred organic pressure-sensitive gel.Including but not
It is limited to following known materials：No-solvent type organic pressure-sensitive gel DOW CORNING2013 adhesives, Beijing brilliant century produce
SBS series pressure-sensitives (rubber pressure-sensitive adhesive) etc.；
Suitable for the present invention other auxiliary agents be dispersant, it is antioxidant, catalyst, age resister, antistatic agent, anti-settling
At least one in agent, levelling agent etc., including but not limited to following known materials：It is dispersant 163, antioxidant 168, anti-oxidant
Agent 1010, thickener RM-8W, toughener AX8900 etc..
Protection membrane material in the present invention is without particular/special requirement, and it can select known engineering plastics film, for example：Polyester
Film, Kapton, polyimide amide film, PPS films, polypropylene film etc..It is preferred that cheap is poly-
Ester film.Preferably 40 μm -100 μm of the thickness of diaphragm, when protecting film thickness to be less than 40 μm, easily by follow-up known blanker
Skill is punched fracture completely, and when protecting film thickness to be more than 100 μm, cost is higher.Diaphragm in the present invention need to be by known
Temperature and pressure is compounded in the surface of pressure sensitive conductive adhesive layer.
The preparation method of the electromagnetic wave proof film of the present invention is as follows：
Use the preparation method of the electromagnetic wave proof film of metal level：In the flexible adhesive linkage of substrate surface coating insulation, exhausted
On the flexible adhesive linkage of edge vacuum evaporation at least one layer metal level, layer on surface of metal be coated with pressure sensitive conductive adhesive layer, after by one
Fixed temperature and pressure composite protection film obtains the electromagnetic wave proof film of the high shield effectiveness used with repeatable attachment.
Use the preparation method of the electromagnetic wave proof film of metal foil：In the flexible adhesive linkage of side coating insulation of metal foil,
Pressure sensitive conductive adhesive layer is coated with metal foil opposite side, respectively in the insulate another side and pressure-sensitive adhesive type conducting resinl of flexible adhesive linkage
The surface of layer obtains preventing with the electromagnetic wave that repeatable attachment is used by certain temperature and pressure composite base material and diaphragm
Cuticula.
Coating method is using known coating method, such as extrusion coated, nozzle coating, three-roll coating, anilox roll coating, print
Brush cloth etc..
When the electromagnetic wave proof film that the present invention is provided is used for FPC or flex circuit application, it is only necessary to first peeled off when using
Diaphragm, it is rear to be directed at finger pressure behind the position for needing to install electromagnetic wave proof film, set without excessive laminating machine, baking oven etc.
It is standby；Set without lengthy and jumbled personnel and complicated operating procedure, and energy loss and follow-up behaviour can be effectively reduced
Occurs the possibility of danger in work.If the problems such as Wrong localization occur during attachment, electromagnetic wave can be peeled off from base material side
Protecting film, repositions attachment, reaches the effect of reuse.
With reference to embodiment and comparative example, the present invention will be further described.
Embodiment 1
1. the preparation of the flexible coating fluid of adhesive linkage 2 of insulation
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
2. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 4
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
3. the preparation for the electromagnetic wave proof film that repeatable attachment is used
The flexible coating fluid of adhesive linkage 2 of insulation of above-mentioned preparation, shape after solidification are coated with 30 μm of the surfaces of Kapton 1
Into the flexible adhesive linkage 2 of insulation that thickness is 3 μm, 0.1 μm of silver coating 3-1 is deposited with the flexible adhesive linkage surface vacuum that insulate,
Silver-plated layer surface is coated with the conductive adhesive layer coating fluid of above-mentioned configuration, and the pressure sensitive conductive adhesive layer 4 that thickness is 5 μm is formed after drying,
The electromagnetic wave proof film that repeatable attachment is used is obtained by certain temperature and pressure composite protection film 6.
Embodiment 2
1. the preparation of the flexible coating fluid of adhesive linkage 2 of insulation
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
2. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 4
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
3. the preparation for the electromagnetic wave proof film that repeatable attachment is used
The flexible coating fluid of adhesive linkage 2 of insulation of above-mentioned preparation is coated with 100 μm of the surfaces of Kapton 1, after solidification
The flexible adhesive linkage 2 of insulation that thickness is 8 μm is formed, 0.05 μm of silver coating 3-1 is deposited with the flexible adhesive linkage surface vacuum that insulate,
0.05 μm of copper plate 3-2 is deposited with silver coating surface vacuum, the conductive adhesive layer coating fluid of above-mentioned configuration is coated with copper facing layer surface,
The pressure sensitive conductive adhesive layer 4 that thickness is 15 μm is formed after drying, obtains weighing by certain temperature and pressure composite protection film 6
The electromagnetic wave proof film used is mounted again.
Embodiment 3
1. the preparation of the flexible coating fluid of adhesive linkage 2 of insulation
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
2. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 4
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
3. the preparation for the electromagnetic wave proof film that repeatable attachment is used
The flexible coating fluid of adhesive linkage 2 of insulation of above-mentioned configuration is coated with 5 μm of commercially available Copper Foil 3-3 sides, is formed after solidification
Thickness is 5 μm of insulation adhesive linkage 2, in the conductive adhesive layer coating fluid of another layer of above-mentioned configuration of coating of Copper Foil, forms thick after drying
The pressure sensitive conductive adhesive layer 4 for 10 μm is spent, respectively in the another side of flexible adhesive linkage and the table of pressure-sensitive adhesive type conductive adhesive layer of insulating
Face obtains having what repeatable attachment was used by the compound 40 μm PPS films 1 of certain temperature and pressure and diaphragm 6
Electromagnetic wave proof film.
Embodiment 4
1. the preparation of the flexible coating fluid of adhesive linkage 2 of insulation
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
2. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 4
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
3. the preparation for the electromagnetic wave proof film that repeatable attachment is used
The flexible coating fluid of adhesive linkage 2 of insulation of above-mentioned configuration is coated with 15 μm of commercially available Copper Foil 3-3 sides, is formed after solidification
Thickness is 5 μm of insulation adhesive linkage 2, in the conductive adhesive layer coating fluid of another layer of above-mentioned configuration of coating of Copper Foil, forms thick after drying
The pressure sensitive conductive adhesive layer 4 for 10 μm is spent, respectively in the another side of flexible adhesive linkage and the table of pressure-sensitive adhesive type conductive adhesive layer of insulating
Face obtains that there is repeatable attachment to use by the compound 60 μm PPS films 1 of certain temperature and pressure and diaphragm 6
Electromagnetic wave proof film.
Embodiment 5
1. the preparation of the flexible coating fluid of adhesive linkage 2 of insulation
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
2. the preparation of the coating fluid of pressure sensitive conductive adhesive layer 4
By above-mentioned substance mix after a certain proportion of toluene butanone equal solvent by known high-speed stirred, ball milling, quick worker,
The techniques such as grinding are scattered to be made coating fluid, remains follow-up coating.
3. the preparation for the electromagnetic wave proof film that repeatable attachment is used
The flexible coating fluid of adhesive linkage 2 of insulation of above-mentioned preparation is coated with 100 μm of the surfaces of PPS films 1, after solidification
The flexible adhesive linkage 2 of insulation that thickness is 5 μm is formed, in method formation 0.5 μ of the flexible bonding layer surface by chemical deposition that insulate
M silver layer 3-1, the conductive adhesive layer coating fluid of above-mentioned configuration is coated with silver layer surface, thickness is formed after drying pressure-sensitive for 10 μm
Type conductive adhesive layer 4, the electromagnetic wave proof film that repeatable attachment is used is obtained by certain temperature and pressure composite protection film 6.
The mode of electromagnetic wave proof film finger pressure prepared by above-described embodiment sticks in one with KAPTON 100H pressings
Rise, test performance.
Comparative example 1：
The purple by 100 parts by weight ultra-violet curing polyfunctional acrylic esters and 50 parts by weight is coated with 50 micron polyestef films
The coating fluid that outer solidification bifunctional acrylate is mutually mixed, 2 μm of hard formations are obtained through ultra-violet curing, and on hard formation surface, coating is by changing
Property the coating fluid that is made of epoxy resin, obtain the soft formation of 3 μm of thickness, the silver layer of 0.15 μ m thick be deposited with soft formation surface, steaming
Silver-plated layer surface is coated with 20 μm of conductive adhesive layer, obtains comparative example 1.
Comparative example 2：
20 parts of commercially available bisphenol A type epoxy resins are added in 333 parts by weight of polyurethane carbamide resin solution, adhesive is obtained
Composition, adds the flake silver powder of 180 parts by weight in the adhesive composition, and stirring mixing obtains curing type electric conductivity group
Compound.
Be coated with heat-resisting modified epoxy coating fluid in 125 μm of polyphenylene sulfides (PPS), 2 μm of thickness, in uniform temperature and
Under pressure condition with 9 μm of polyphenylene sulfides are laminated obtains lamilate, used in the lamilate matrix surface in comma coating machine coating
Curing type conductive composition is stated, comparative example 2 is dried to obtain.
Comparative example 3：
Heat-resisting modified epoxy coating fluid is coated with 50 μm of polyester films, 3 μ m thick insulating film layers are obtained, at this
Insulating film layer surface obtains the first solid shielding silver layer of 0.1 μm of thickness by chemical plating method, in the first solid screen layer table
Face is by the second solid shielding layers of copper of the method for chemical deposition to 1 μm of thickness, in the second solid shielding layers of copper coating by 100 weights
The mixed liquor of part modified epoxy and the combination of 100 parts by weight conducting particles is measured, the conductive adhesive layer of 15 μ m thicks is obtained, and carry out
Precuring, obtains comparative example 3.
By the electromagnetic shielding film of above three comparative example and Du Pont Kapton KAPTON 100H with known technique
Be processed, i.e., 180 DEG C precuring 30s, after under 2Mpa pressure, be laminated 2min, after be transferred in 160 DEG C of baking ovens solidify
30min。
Tables 1 and 2 is shown in specific performance test
Table 1
| Test model | Shield effectiveness | Viscosity fastness | Heat resistance | Slide flexibility |
| Comparative example 1 | 50dB | It is not stratified not fall off | Surface is unchanged | It is unbroken |
| Comparative example 2 | 41dB | It is not stratified not fall off | Surface is unchanged | It is unbroken |
| Comparative example 3 | 62dB | It is not stratified not fall off | Surface is unchanged | It is unbroken |
| Embodiment 1 | 52dB | It is not stratified not fall off | The not contracted deformation of base material | It is unbroken |
| Embodiment 2 | 47dB | It is not stratified not fall off | The not contracted deformation of base material | It is unbroken |
| Embodiment 3 | 65dB | It is not stratified not fall off | The not contracted deformation of base material | It is unbroken |
| Embodiment 4 | 84dB | It is not stratified not fall off | The not contracted deformation of base material | It is unbroken |
| Embodiment 5 | 80dB | It is not stratified not fall off | The not contracted deformation of base material | It is unbroken |
Table 2
1. shield effectiveness method of testing：According to GJB 6190-2008《Electromagnetic shielding material shield effectiveness measuring method》Survey
Examination.Resulting result is the average shield effectiveness in 300MHz-4GHz frequency ranges.
2. viscosity fastness method of testing：The adhesion of 3M600 adhesive tapes is tested
3. heat resistance method of testing：265 DEG C of Reflow Soldering curve tests of the highest temperature.
4. slide flexibility:Under the conditions of crooked process radius is 0.1mm, 100,000 tests are moved back and forth, micro- sem observation is applied
Whether layer is broken.
5.180 ° of peel tests：The Intelligent electronic tensil testing machine produced using Labthink Instruments Co., Ltd.
XLW (B), by the 180 ° of strippings of electromagnetic wave proof film and KAPTON 100H films, speed 50mm/min, the value of thrust of stable testing.
6. connect method for testing resistance：Tested with four-wire type milliohmmeter.
7. repeat to mount after peeling off：Electromagnetic wave proof film after will be machined is peeled off from KAPTON 100H films, according to
Original technique carries out repeating processing on Du Pont Kapton KAPTON 100H, is tested.
Knowable to above-mentioned test result, using the embodiment of the invention, shield effectiveness, viscosity fastness, heat resistance, slip flexure
Property, connection resistance it is suitable with comparative example, the peeling forces of 180 ° of peel tests better than comparative example test data, in stripping, no
Coating damage occurs and the effect of repeatable attachment can be reached.
Claims (12)
1. the electromagnetic wave proof film that a kind of repeatable attachment is used, it is characterised in that set one layer of insulation soft on the surface of base material
Tough adhesive linkage, insulating, flexible bonding layer surface sets at least one layer of metal level, sets one layer of pressure sensitive to lead in layer on surface of metal
Electric glue-line, diaphragm is set on pressure sensitive conductive adhesive layer surface.
2. the electromagnetic wave proof film that a kind of repeatable attachment is used, it is characterised in that flexible in the side coating insulation of metal foil
Adhesive linkage, pressure sensitive conductive adhesive layer is coated with metal foil opposite side, respectively in the insulate another side and pressure sensitive adhesive of flexible adhesive linkage
The surface of type conductive adhesive layer passes through certain temperature and pressure composite base material and diaphragm.
3. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that the flexible adhesive linkage of described insulation by by
The parts by weight of resin 100 of cementability；Carbon black filler 10-50 parts by weight；Curing agent 5-20 parts by weight；Auxiliary agent 0.5-10 parts by weight
Etc. the coating liquid dry solidification gained of material composition, insulate flexible preferred 3-8 μm of thickness of adhibited layer.
4. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that the preferred ring of resin of described cementability
Oxygen tree fat, polyester resin, polyurethane resin, acrylic resin, polyamide, organic siliconresin or similar polyurethane-modified
One or several kinds of mixing compositions of the modified resinoid such as epoxy resin.
5. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that solid in the flexible adhesive linkage of described insulation
Agent can be selected to be a kind of or several in polyamide curing agent, imidazole curing agent, isocyano curing agent, anhydride curing agent
Plant and use cooperatively.
6. electromagnetic wave proof film according to claim 1, it is characterised in that the thickness of the metal level is 0.05~0.5 μ
m。
7. electromagnetic wave proof film according to claim 2, it is characterised in that the thickness of the metal foil is 5~15 μm.
8. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that described pressure sensitive conductive adhesive layer by containing
The coating liquid solidification for having the material composition of following weight percentage is obtained：Conductive metal powder 20%-60%, pressure-sensitive gum
Fat 35%-78%, other auxiliary agents 2%-5%.
9. electromagnetic wave proof film according to claim 8, it is characterised in that the pressure-sensitive gum resin is that rubber-type is pressure-sensitive
At least one in glue, acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, polyurethanes pressure sensitive adhesive.
10. electromagnetic wave proof film according to claim 8, it is characterised in that the conductive metal powder is silver powder, copper
At least one in powder, nickel powder, CNT, silver-coated copper powder, silver coated nickel powder, silver-colored bag CNT, silver-colored bag resin balls, particle diameter is excellent
Select 10 μm -20 μm.
11. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that the pressure sensitive conductive adhesive layer thickness is
5-15μm。
12. the electromagnetic wave proof film according to claim 1 and 2, it is characterised in that its attachment is worked into FPC flexible circuitries
After plate surface, pressure sensitive conductive adhesive layer and the preferred 2.0N/cm-4.0N/cm of peeling force of 180 ° of peel tests of base material.
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| CN110113925A (en) * | 2019-05-10 | 2019-08-09 | 保定乐凯新材料股份有限公司 | Electromagnetic shielding film |
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| CN110358466A (en) * | 2019-07-10 | 2019-10-22 | 深圳市美信电子有限公司 | A kind of anti-oxidant tinfoil paper adhesive tape and preparation method thereof |
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| CN112533465B (en) * | 2020-11-27 | 2023-08-01 | 南昌正业科技有限公司 | Preparation method of electromagnetic wave protective film for FPC |
| CN112852328A (en) * | 2021-01-11 | 2021-05-28 | 常州威斯双联科技有限公司 | Superconducting film and preparation process thereof |
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