CN105542673B - A kind of light-shielding conductive adhesive and adhesive tape and preparation method with strong shielding properties - Google Patents
A kind of light-shielding conductive adhesive and adhesive tape and preparation method with strong shielding properties Download PDFInfo
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- CN105542673B CN105542673B CN201510968738.1A CN201510968738A CN105542673B CN 105542673 B CN105542673 B CN 105542673B CN 201510968738 A CN201510968738 A CN 201510968738A CN 105542673 B CN105542673 B CN 105542673B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Abstract
The present invention relates to a kind of light-shielding conductive Adhesive compositions, are made of following components and mass fraction：100 parts of acrylate pressure-sensitive adhesive, 0.5~4 part of isocyanates system curing agent, carbon black color slurry 1~15,5~50 parts of part carbonyl nickel powder, 10~100 parts of ethyl acetate；The preparation method for further relating to the Adhesive composition, using having the light-shielding conductive adhesive tape of the light-shielding conductive Adhesive composition and the preparation method of the adhesive tape.Compared with prior art, the present invention in acrylate pressure-sensitive adhesive by being added isocyanates system curing agent, carbon black color slurry and carbonyl nickel powder etc., so that the light-shielding conductive Adhesive composition and adhesive tape that prepare have good electromagnet shield effect, to obtain the strong shielding to electromagnetic wave.
Description
Technical field
The present invention relates to adhesive tape area more particularly to a kind of light-shielding conductive adhesive and adhesive tape with strong shielding properties and
Preparation method.
Background technology
It with scientific and technological level continues to develop, the 3C Products such as laptop, GPS, IPAD and mobile phone have become
An indispensable part in people's daily life, while they offer convenience to our life, also to people's health
Hidden danger is buried.These electronic products emit frequency electromagnetic waves when in use, if human body is exposed to for a long time under powerful electromagnetic wave,
The health of body can be then influenced, or even induces cancerous lesion.In addition, since modern electronic product working site environment is increasingly multiple
It is miscellaneous, many electronic products itself again be one possess the number of numerous systems, mould mixing complication system, so come from these products
Between external electromagnetic radiation and built-in system, the electromagnetic interference between each transmission channel between internal component produces these
Harm, has seriously threaten the stability, reliability and safety of its work, therefore caused by all kinds of useful information of product
Anti- electromagnetic interference has been one of people increasingly focus of attention.
Adhesive tape is that one of tool that is fixed and covering is commonly used in daily life and work, can be divided into high-temp glue by its function
Band, double faced adhesive tape, conductive tape, specialty tape, pressure sensitive adhesive tape, cross cutting adhesive tape etc..Conductive tape have heat preservation, it is heat-insulated, fire prevention,
It is cold-resistant to wait feature performance benefits, electromagnetic radiation, harm of the isolating electromagnetic to human body and the shadow to ambient electron component can be eliminated
It rings.Conductive tape generally comprises release layer, substrate layer and conductive adhesive layer, and existing conducting resinl is dilute generally by performed polymer (matrix)
Agent, crosslinking agent, metal powder and some other additive composition, performed polymer is released to contain active group as key component, be
Polymer after solidification provides molecular skeleton, and the mechanical property and adhesive property of conducting resinl are mainly determined by polymeric matrix, dilute
It releases agent and is mainly used to regulation system viscosity, be allowed to be suitble to technological requirement, crosslinking agent is polyfunctional compound, can connect performed polymer
And network structure is formed, while being also a part for system after solidification.Wherein conductive filler generally has carbon, metal, metal oxidation
Object three categories, conductive filler are scattered in spherical, sheet or fiber in matrix, composition conductive path, in traditional conductive tape
The conductive filler generally added is：The metal powders such as carbon black, metal oxide, Au, Ag, Cu, nickel, such as application No. is
The Chinese invention patent of (201410698095.9 104449449 A of application publication number CN)《Conductive magneto-conductive adhesive tape and its processing side
Method》, application No. is the Chinese invention patents of 201310188275.8 (103265900 A of application publication number CN)《One kind having electricity
The adhesive tape of magnetic wave function of shielding》Deng.
Although various in the market be known as the conductive tape with electro-magnetic screen function and emerge one after another, existing conductive tape
Actual electromagnetic shield effectiveness it is often relatively low, radiation screening effect truly cannot be played.
Invention content
First technical problem to be solved by this invention is provided a kind of with good electromagnetism for the prior art
The light-shielding conductive Adhesive composition of shield effectiveness.
Second technical problem to be solved by this invention is to provide a kind of system of above-mentioned light-shielding conductive Adhesive composition
Preparation Method.
Third technical problem to be solved by this invention is provided a kind of with strong shielding properties for the prior art
Light-shielding conductive adhesive tape, the conductive tape have good electromagnet shield effect.
4th technical problem to be solved by this invention is provided a kind of above-mentioned with strong shielding for the prior art
The preparation method of the light-shielding conductive adhesive tape of performance.
Technical solution is used by the present invention solves first technical problem：A kind of light-shielding conductive Adhesive composition,
It is characterized in that, being made of following components and mass fraction：
Preferably, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm, is made in the carbonyl nickel powder
Contact between nickel particle close, reduce in conducting channel and the probability of bridge cut-off occur, to make conductive shield superior performance, steady
It is fixed.
Preferably, the content of carbon black is 30~50% in the carbon black color slurry, the carbon black for being 0.5 μm by grain size is by grinding
It is made after mill, dispersion, dissolving, what wherein carbon black color slurry and adhesive occurred, which react, belongs to physical reactions.
Preferably, the acrylate pressure-sensitive adhesive is acrylic polymer, the mean molecule of the polymer
It is -20 DEG C~-50 DEG C that amount, which is 5~300,000, Tg, and it is 4~17 Arrcostabs that acrylate pressure-sensitive adhesive, which selects carbon atom number,
For principal monomer, pass through addition monomer AA (acrylic acid), 2-HEA (- 2 hydroxyl ethyl ester of acrylic acid) etc. and initiator (mistake
Oxide or azodiisobutyronitrile) polymerisation is carried out at 60~100 DEG C, then add the trees such as rosin, terpenes, oil in the later stage
Solution uniformly, stable is formed after being stirred after fat.
Preferably, isocyanates system curing agent be toluene di-isocyanate(TDI) and trimethylolpropane addition product or
The derivative of pregnancy alkenyl diisocyanate.
Technical solution is used by the present invention solves second technical problem：Above-mentioned light-shielding conductive Adhesive composition
Preparation method, it is characterised in that include the following steps：Isocyanates system curing agent and carbon black color slurry are added by above-mentioned mass fraction
Enter in acrylate pressure-sensitive adhesive, stir 10~30min and form mixture, carbonyl nickel is moistened with 10~30 parts of ethyl acetate
Then carbonyl nickel powder after wetting is added in said mixture by powder, remaining ethyl acetate is added, continue stirring 10~
20min obtains uniform and stable light-shielding conductive Adhesive composition.
Technical solution is used by the present invention solves third technical problem：A kind of above-mentioned light-shielding conductive adhesive of application
The light-shielding conductive adhesive tape with strong shielding properties of composition, including release layer and conductive adhesive layer, which is characterized in that the conduction
Glue-line uses above-mentioned light-shielding conductive Adhesive composition for conductive adhesive.
Further, further include substrate layer, which selects aluminum-plastic composite membrane, electrolytic copper foil, soft rolling aluminum foil, gold
Belong to one kind in the conductive non-woven fabrics inlayed and grid or plain weave conductive polyester fiber cloth, the release layer selects silicon systems release
One kind in paper, silicon systems PET release films or silicon systems PE release films, the release layer thickness are 10~150 μm, the base material thickness
Degree is 5~200 μm.
Technical solution is used by the present invention solves the 4th technical problem：A kind of above-mentioned screening with strong shielding properties
The preparation method of photoconductive adhesive tape, the light-shielding conductive adhesive tape are one-faced tapes comprising following steps：
(1) prepared by coating fluid：Acrylate is added in isocyanates system curing agent and carbon black color slurry by above-mentioned mass fraction
It in pressure-sensitive adhesive agent, stirs 10~30min and forms mixture, moisten carbonyl nickel powder with 10~30 parts of ethyl acetate, then will
Carbonyl nickel powder after wetting is added in said mixture, and 10~20min of stirring obtains uniform and stable light-shielding conductive adhesive group
Object is closed to get required coating fluid；
(2) coating fluid obtained is equably coated on release layer after the filter screen filtration of 200~400 mesh, is coated with
Thickness is 5~100 μm, and then dry 1~8min in 50~130 DEG C of drying tunnel, is then bonded with substrate layer, is batched,
Up to the required light-shielding conductive one-faced tapes with strong shielding properties.
Alternatively, a kind of preparation method of the above-mentioned light-shielding conductive adhesive tape with strong shielding properties, the light-shielding conductive adhesive tape are
Double faced adhesive tape, it is characterised in that include the following steps,
(1) prepared by coating fluid：Acrylate is added in isocyanates system curing agent and carbon black color slurry by above-mentioned mass fraction
It in pressure-sensitive adhesive agent, stirs 10~30min and forms mixture, moisten carbonyl nickel powder with 10~30 parts of ethyl acetate, then will
Carbonyl nickel powder after wetting is added in said mixture, and 10~20min of stirring obtains uniform and stable light-shielding conductive adhesive group
Object is closed to get required coating fluid；
(2) coating fluid obtained is equably coated on release layer after the filter screen filtration of 200~400 mesh, is coated with
Thickness is 5~100 μm, then dry 1~8min in 50~130 DEG C of drying tunnel, is then carried out with the wherein one side of substrate layer
It is bonded, batches；
(3) filtered coating fluid being spread evenly across on another release layer, coating thickness is 5~100 μm, through 50~
Dry 1~8min is bonded with the another side of above-mentioned substrate layer, batches in 130 DEG C of drying tunnel, obtains required having and shields by force
The light-shielding conductive double faced adhesive tape of performance.
Compared with the prior art, the advantages of the present invention are as follows：The present invention in acrylate pressure-sensitive adhesive by being added
Isocyanates system curing agent, carbon black color slurry and carbonyl nickel powder etc. so that the light-shielding conductive Adhesive composition and adhesive tape of preparation
It is tested using ASTM D4935-2010 with good electromagnet shield effect to obtain the strong shielding to electromagnetic wave
When, electromagnet shield effect is：When 30MH >=114dB, when 700MH >=99.8dB, when 1500MH >=96.3dB, sheet resistance is surveyed
Examination value is in 50m Ω；Wherein select carbonyl nickel powder as conductive filler, carbonyl nickel powder particle diameter distribution is relatively narrow, can make conducting particles it
Between be fully in close contact, reduce conducting channel in there is the probability of bridge cut-off, be conducive to the stability of sheet resistance test value, to
Make conductive shield superior performance, stabilization.
Description of the drawings
Fig. 1 is conductive tape sheet resistance test schematic diagram in the present invention.
Specific implementation mode
Below in conjunction with attached drawing embodiment, present invention is further described in detail.
Embodiment 1：
The preparation of light-shielding conductive Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.5 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 1 part of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) is added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 10min and forms mixture, use
10 parts of ethyl acetate moisten 5 parts of carbonyl nickel powder T123 (Brazilian vale production), then by the carbonyl nickel powder after wetting
It is added in said mixture, remaining 10 parts of ethyl acetate is added, stirring 10min obtains uniform and stable light-shielding conductive adhesive
Composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color
The content of carbon black is 30% in slurry, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, Acrylate pressure sensitive
Adhesive is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Using light-shielding conductive Adhesive composition obtained above as coating fluid, by it after the filter screen filtration of 200 mesh,
It is equably coated in the silicon systems release paper that thickness is 10 μm, coating thickness is 20 μm, then dry in 50 DEG C of drying tunnel
8min is then bonded with 30 μm of aluminum-plastic composite membranes, is batched to get the required light-shielding conductive single side with strong shielding properties
Adhesive tape.
Embodiment 2：
The preparation of light-shielding conductive Adhesive composition：
By the addition product of 1 part of toluene di-isocyanate(TDI) and trimethylolpropane, (TDI-DMP addition products, German BASF are public
Department's production, model：L-75) and 3 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of acrylic acid
Ester pressure-sensitive sticks in agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 15min and forms mixture, with 10
Part ethyl acetate moistens 10 parts of carbonyl nickel powder T123 (Brazilian vale production), then adds the carbonyl nickel powder after wetting
Enter into said mixture, stirring 15min obtains uniform and stable light-shielding conductive Adhesive composition.Wherein, above-mentioned carbonyl nickel powder
For middle nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm；The content of carbon black is 40% in carbon black color slurry, by grain
The carbon black that diameter is 0.5 μm is made after grinding, dispersion, dissolving, and acrylate pressure-sensitive adhesive is acrylic polymer,
The average molecular weight of the polymer is that 5~300,000, Tg is -20 DEG C~-50 DEG C.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained above as coating fluid, it is equably coated on 20 μm of silicon
Be that coating thickness is 5 μm on PET release films, the then dry 6min in 70 DEG C of drying tunnel, then with 5 μm of aluminum-plastic composite membranes
Wherein it is bonded on one side；
Step 2：Filtered coating fluid is spread evenly across on another 20 μm of silicon systems PET release films, coating thickness is 5 μ
M be bonded with the another side of above-mentioned aluminum-plastic composite membrane through dry 6min in 70 DEG C of drying tunnels, batches, and obtains required with by force
The light-shielding conductive double faced adhesive tape of shielding properties.
Embodiment 3：
The preparation of light-shielding conductive Adhesive composition：
By the derivative (model of 0.9 part of pregnancy alkenyl diisocyanate：BASONAT HB-175, BASF Aktiengesellschaft
Production) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) be added to 100 parts of acrylate pressure-sensitive adhesives
In (Ningbo Soken Chemical Co., Ltd.'s production), stirs 20min and form mixture, it is wet with 20 parts of ethyl acetate
Moisten 15 parts of carbonyl nickel powder T123 (Brazilian vale production), the carbonyl nickel powder after wetting is then added to above-mentioned mixing
In object, remaining 10 parts of ethyl acetate is added, stirring 20min obtains uniform and stable light-shielding conductive Adhesive composition.Wherein, on
Stating nickel particle content in carbonyl nickel powder, up to 98.5% or more, the grain size of nickel particle is 3~5 μm；The content of carbon black in carbon black color slurry
It is 45%, the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, and acrylate pressure-sensitive adhesive is acrylic acid
Esters polymer, it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained above as coating fluid, it is equably coated on 50 μm of silicon
Be that coating thickness is 5 μm on PE release films, the then dry 5min in 80 DEG C of drying tunnel, then with 50 μm of electrolytic copper foils its
It is middle to be bonded on one side；
Step 2：Filtered coating fluid is spread evenly across on another 50 μm of silicon systems PE release films, coating thickness is 5 μ
M is bonded with the another side of above-mentioned electrolytic copper foil through dry 5min in 80 DEG C of drying tunnels, batches, and obtains required having and shields by force
Cover the light-shielding conductive double faced adhesive tape of performance.
Embodiment 4：
The preparation of light-shielding conductive Adhesive composition：
By the addition product of 2 parts of toluene di-isocyanate(TDI)s and trimethylolpropane, (TDI-DMP addition products, German BASF are public
Department's production, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of acrylic acid
Ester pressure-sensitive sticks in agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 30min and forms mixture, with 20
Part ethyl acetate moistens 20 parts of carbonyl nickel powder T123 (Brazilian vale production), then adds the carbonyl nickel powder after wetting
Enter into said mixture, remaining 20 parts of ethyl acetate is added, stirring 20min obtains uniform and stable light-shielding conductive adhesive group
Close object.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color slurry
The content of middle carbon black is 50%, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, acrylate pressure-sensitive adhesive
Glutinous agent is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained as coating fluid, by its filter screen filtration through 400 mesh
Afterwards, it being equably coated on 70 μm of silicon systems PE release films, coating thickness is 30 μm, then the dry 3min in 100 DEG C of drying tunnel,
Then soft rolling aluminum foil with 70 μm is wherein bonded on one side；
Step 2：Filtered coating fluid is spread evenly across on another release layer, coating thickness is 30 μm, through 100 DEG C
Drying tunnel in dry 3min be bonded, batch with the another side of above-mentioned aluminium foil, obtain the required shading with strong shielding properties
Conductive double-sided tape.
Embodiment 5：
The preparation of light-shielding conductive Adhesive composition：
By the derivative (model of 1 part of pregnancy alkenyl diisocyanate：BASONAT HB-175, BASF Aktiengesellschaft's life
Production) and 10 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) be added to 100 parts of acrylate pressure-sensitive adhesives
In (Ningbo Soken Chemical Co., Ltd.'s production), stirs 15min and form mixture, it is wet with 10 parts of ethyl acetate
Moisten 5~50 parts of carbonyl nickel powder T123 (Brazilian vale production), is then added to the carbonyl nickel powder after wetting above-mentioned
In mixture, remaining 40 parts of ethyl acetate is added, stirring 10min obtains uniform and stable light-shielding conductive Adhesive composition.Its
In, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black in carbon black color slurry
Content is 30%, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, acrylate pressure-sensitive adhesive third
Olefin(e) acid esters polymer, it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Using light-shielding conductive Adhesive composition obtained as coating fluid, by it after the filter screen filtration of 300 mesh, uniformly
Ground is coated in 100 μm of silicon systems release papers, and coating thickness is 50 μm, then the dry 2min in 110 DEG C of drying tunnel, then with
100 μm of aluminum-plastic composite membranes are bonded, are batched to get the required light-shielding conductive one-faced tapes with strong shielding properties.
Embodiment 6：
The preparation of light-shielding conductive Adhesive composition：
By the addition product of 3 parts of toluene di-isocyanate(TDI)s and trimethylolpropane, (TDI-DMP addition products, German BASF are public
Department's production, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of acrylic acid
Ester pressure-sensitive sticks in agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 10~30min and forms mixture,
30 parts of carbonyl nickel powder T123 (Brazilian vale production) are moistened with 30 parts of ethyl acetate, then by the carbonyl nickel after wetting
Powder is added in said mixture, and remaining 30 parts of ethyl acetate is added, and stirring 15min obtains uniform and stable light-shielding conductive gluing
Agent composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black
The content of carbon black is 40% in mill base, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, acrylate pressure
Quick adhesive is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained as coating fluid, by its filter screen filtration through 300 mesh
Afterwards, it is equably coated on 120 μm of silicon systems PET release films, coating thickness is 70 μm, then dry in 130 DEG C of drying tunnel
1min is then bonded with the wherein one side of 130 μm of aluminum-plastic composite membrane；
Step 2：Filtered coating fluid is spread evenly across on another silicon systems PET release films, coating thickness is 70 μm,
It is bonded, batches with the another side of above-mentioned aluminum-plastic composite membrane through dry 1min in 130 DEG C of drying tunnels, obtain required having and shield by force
Cover the light-shielding conductive double faced adhesive tape of performance.
Embodiment 7：
The preparation of light-shielding conductive Adhesive composition：
By the addition product of 4 parts of toluene di-isocyanate(TDI)s and trimethylolpropane, (TDI-DMP addition products, German BASF are public
Department's production, model：L-75) and 15 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 30min and forms mixture, use
15 parts of ethyl acetate moisten 35 parts of carbonyl nickel powder T123 (Brazilian vale production), then by the carbonyl nickel powder after wetting
It is added in said mixture, remaining 55 parts of ethyl acetate is added, stirring 20min obtains uniform and stable light-shielding conductive adhesive
Composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color
The content of carbon black is 50% in slurry, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, Acrylate pressure sensitive
Adhesive is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained as coating fluid, by its filter screen filtration through 200 mesh
Afterwards, it is equably coated on 150 μm of silicon systems PET release films, coating thickness is 100 μm, then dry in 90 DEG C of drying tunnel
4min is then bonded with the wherein one side of 150 μm of aluminum-plastic composite membrane；
Step 3：Filtered coating fluid is spread evenly across on another release layer, coating thickness is 100 μm, through 90 DEG C
Drying tunnel in dry 4min be bonded, batch with the another side of above-mentioned aluminum-plastic composite membrane, obtain required with strong shielding properties
Light-shielding conductive double faced adhesive tape.
Embodiment 8：
The preparation of light-shielding conductive Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.9 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 25min and forms mixture, use
30 parts of ethyl acetate moisten 40 parts of carbonyl nickel powder T123 (Brazilian vale production), then by the carbonyl nickel powder after wetting
It is added in said mixture, remaining 50 parts of ethyl acetate is added, stirring 15min obtains uniform and stable light-shielding conductive adhesive
Composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color
The content of carbon black is 30% in slurry, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, Acrylate pressure sensitive
Adhesive is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained as coating fluid, by its filter screen filtration through 300 mesh
Afterwards, it being equably coated on 20 μm of silicon systems PET release films, coating thickness is 20 μm, then the dry 3min in 80 DEG C of drying tunnel,
Then it is bonded with the wherein one side of 170 μm of aluminum-plastic composite membranes；
Step 2：Filtered coating fluid is spread evenly across on another release layer, coating thickness is 20 μm, through 80 DEG C
Dry 3min is bonded with the another side of above-mentioned aluminum-plastic composite membrane, batches in drying tunnel, and obtaining required has strong shielding properties
Light-shielding conductive double faced adhesive tape.
Embodiment 9：
The preparation of light-shielding conductive Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.9 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 20min and forms mixture, use
20 parts of ethyl acetate moisten 45 parts of carbonyl nickel powder T123 (Brazilian vale production), then by the carbonyl nickel powder after wetting
It is added in said mixture, remaining 70 parts of ethyl acetate is added, stirring 10min obtains uniform and stable light-shielding conductive adhesive
Composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color
The content of carbon black is 30% in slurry, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, Acrylate pressure sensitive
Adhesive is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Step 1：Using light-shielding conductive Adhesive composition obtained as coating fluid, by its filter screen filtration through 300 mesh
Afterwards, it being equably coated on 50 μm of silicon systems PET release films, coating thickness is 20 μm, then the dry 3min in 80 DEG C of drying tunnel,
Then it is bonded with the wherein one side of 200 μm of aluminum-plastic composite membranes；
Step 2：Filtered coating fluid is spread evenly across on another 50 μm of silicon systems PET release films, coating thickness 20
μm, it is bonded, batches with the another side of aluminum-plastic composite membrane through dry 3min in 80 DEG C of drying tunnels, obtain required having and shield by force
The light-shielding conductive double faced adhesive tape of performance.
Embodiment 10：
The preparation of light-shielding conductive Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.9 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 20min and forms mixture, use
30 parts of ethyl acetate moisten 50 parts of carbonyl nickel powder T123 (Brazilian vale production), then by the carbonyl nickel powder after wetting
It is added in said mixture, remaining 70 parts of ethyl acetate is added, stirring 20min obtains uniform and stable light-shielding conductive adhesive
Composition.Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in above-mentioned carbonyl nickel powder；Carbon black color
The content of carbon black is 30~50% in slurry, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, acrylate
Pressure-sensitive adhesive agent is acrylic polymer, and it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by light-shielding conductive adhesive tape：
Using light-shielding conductive Adhesive composition obtained as coating fluid, by it after the filter screen filtration of 200 mesh, uniformly
Ground is coated on 80 μm of silicon systems PET release films, and coating thickness is 20 μm, then the dry 3min in 80 DEG C of drying tunnel, then with
150 μm of aluminum-plastic composite membranes are bonded, are batched to get the required light-shielding conductive one-faced tapes with strong shielding properties.
Comparative example 1：
The preparation of Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.9 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 10min and forms mixture, use
5 parts of ethyl acetate moisten 5 parts of Ag powder, and then the Ag powder after wetting is added in said mixture, and remaining 5 parts of acetic acid is added
Ethyl ester, stirring 10min obtain uniform and stable Adhesive composition.Wherein, the content of carbon black is 30~50% in carbon black color slurry, by
The carbon black that grain size is 0.5 μm is made after grinding, dispersion, dissolving, and acrylate pressure-sensitive adhesive polymerize for esters of acrylic acid
Object, it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by adhesive tape：
It is equably applied by it after the filter screen filtration of 200 mesh using the Adhesive composition of above-mentioned preparation as coating fluid
Be distributed in 10 μm of silicon systems release paper, coating thickness is 20 μm, then the dry 3min in 80 DEG C of drying tunnel, then with 30 μm of aluminium
Modeling composite membrane is bonded, is batched to get required one-faced tapes.
Comparative example 2：
The preparation of Adhesive composition：
By addition product (TDI-DMP addition products, the German BASF of 0.9 part of toluene di-isocyanate(TDI) and trimethylolpropane
Company produces, model：L-75) and 7 parts of carbon black color slurry B807 (production of Suzhou Shi Min Science and Technology Ltd.s) are added to 100 parts of propylene
It in acid esters pressure-sensitive adhesive agent (Ningbo Soken Chemical Co., Ltd.'s production), stirs 30min and forms mixture, use
10 parts of ethyl acetate moisten 10 parts of Ag powder, and then the Ag powder after wetting is added in said mixture, are added remaining 10 parts
Ethyl acetate, stirring 10min obtain uniform and stable Adhesive composition.Wherein, in carbon black color slurry carbon black content be 30~
50%, the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving, and acrylate pressure-sensitive adhesive is acrylate
Type of Collective object, it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
It is prepared by adhesive tape：
Step 1：Using Adhesive composition obtained as coating fluid, by it after the filter screen filtration of 200 mesh, uniformly
Ground is coated on 20 μm of silicon systems PET release films, and coating thickness is 20 μm, then the dry 3min in 80 DEG C of drying tunnel, then with
30 μm of aluminum-plastic composite membranes are wherein bonded on one side；
Step 3：Filtered coating fluid is spread evenly across on another silicon systems PET release films, coating thickness is 20 μm,
It is bonded, batches with the another side of above-mentioned aluminum-plastic composite membrane through dry 3min in 80 DEG C of drying tunnels, obtain required double faced adhesive tape.
Sheet resistance test is carried out to the adhesive tape obtained in Examples 1 to 10, comparative example 1~2 and electromagnet shield effect is surveyed
Examination, test process is as follows, and test result is as described in Table 1.
1) sheet resistance is tested
Test equipment：(the Ningbo Economic and Technological Development Zone is double and High Seience Technology Co., Ltd. gives birth to for the digital micro-ohm tables of DM-500A
Production)；
Test method：Open micro-ohm ohmmeter, connect circuit as shown in Figure 1, then by two pieces of length of sides be 1inch just
Rectangular copper foil tape attaches on material to be tested and centre-to-centre spacing is 100mm, then by two probe short circuits, after micro-ohm table is zeroed
It turns on the power switch, two probes is contacted with copper foil tape respectively, according to the data shown on micro-ohm table, read resistance value.
2) electromagnet shield effect is tested
Measuring unit：Beijing Ding Rong Real Technology Co., Ltd；
Testing standard：ASTM D4935-2010 are carried out, test according to the test method of planar materials electromagnet shield effect
When conductive tape tear release layer off, be positioned over two and half coaxial intermediate, pressure force about 80N, shield effectiveness according to following formula into
Row calculates：
(1) SE=20Log10E1/E2dB, in formula：SE indicates that the shield effectiveness to electric field, E1 expressions do not take electromagnetic shielding
Electric field strength before, E2 indicate to have taken the electric field strength after electromagnetic shielding.
(2) SH=20Log10H1/H2 dB, in formula：SH indicates that the shield effectiveness to magnetic field, H1 expressions do not take electromagnetic screen
Magnetic field intensity before covering, H2 indicate to have taken the magnetic field intensity after electromagnetic shielding, and the value of SE, SH are bigger in above-mentioned formula,
It is better to represent shield effectiveness.
Table 1 is the sheet resistance and electromagnetic shielding test result of each adhesive tape
By table 1 as it can be seen that the light-shielding conductive adhesive tape in the present invention has good electromagnet shield effect, electromagnetism can be really played
Shield effectiveness.
Claims (9)
1. a kind of light-shielding conductive Adhesive composition, which is characterized in that be made of following components and mass fraction：
Wherein, for nickel particle content up to 98.5% or more, the grain size of nickel particle is 3~5 μm in the carbonyl nickel powder.
2. light-shielding conductive Adhesive composition as described in claim 1, which is characterized in that carbon black contains in the carbon black color slurry
Amount is 30~50%, and the carbon black for being 0.5 μm by grain size is made after grinding, dispersion, dissolving.
3. light-shielding conductive Adhesive composition as described in claim 1, which is characterized in that the acrylate pressure-sensitive adhesive
For acrylic polymer, it is -20 DEG C~-50 DEG C that the average molecular weight of the polymer, which is 5~300,000, Tg,.
4. light-shielding conductive Adhesive composition as described in claim 1, which is characterized in that isocyanates system curing agent is
The derivative of the addition product or pregnancy alkenyl diisocyanate of toluene di-isocyanate(TDI) and trimethylolpropane.
5. a kind of preparation method of light-shielding conductive Adhesive composition as described in any claim in Claims 1 to 4,
Characterized by the following steps：Acrylate is added in isocyanates system curing agent and carbon black color slurry by above-mentioned mass fraction
It in pressure-sensitive adhesive agent, stirs 10~30min and forms mixture, moisten carbonyl nickel powder with 10~30 parts of ethyl acetate, then will
Carbonyl nickel powder after wetting is added in said mixture, and remaining ethyl acetate is added, and is continued 10~20min of stirring and is obtained uniformly
Stable light-shielding conductive Adhesive composition.
6. a kind of having for light-shielding conductive Adhesive composition of application as described in any claim in Claims 1 to 4 is strong
The light-shielding conductive adhesive tape of shielding properties, including release layer and conductive adhesive layer, which is characterized in that the conductive adhesive layer uses above-mentioned screening
Photoconductive Adhesive composition is conductive adhesive.
7. light-shielding conductive adhesive tape as claimed in claim 6, which is characterized in that further include substrate layer, which selects plastic-aluminum
Composite membrane, electrolytic copper foil, soft rolling aluminum foil, the conductive non-woven fabrics of damascene and grid, plain weave conductive polyester fiber
One kind in cloth, the release layer selects one kind in silicon systems release paper, silicon systems PET release films or silicon systems PE release films, described
Release layer thickness is 10~150 μm, and the base material layer thickness is 5~200 μm.
8. a kind of preparation method of light-shielding conductive adhesive tape as claimed in claim 7, which is one-faced tapes,
It is characterized in that including the following steps：
(1) prepared by coating fluid：Acrylate pressure sensitive is added in isocyanates system curing agent and carbon black color slurry by above-mentioned mass fraction
It in adhesive, stirs 10~30min and forms mixture, carbonyl nickel powder is moistened with 10~30 parts of ethyl acetate, it then will wetting
Carbonyl nickel powder afterwards is added in said mixture, and remaining ethyl acetate is added, continue 10~20min of stirring obtain it is uniform and stable
Light-shielding conductive Adhesive composition to get required coating fluid；
(2) coating fluid obtained is equably coated on release layer after the filter screen filtration of 200~400 mesh, coating thickness
Be 5~100 μm, then dry 1~8min in 50~130 DEG C of drying tunnel, be then bonded with substrate layer, batch to get
The required light-shielding conductive one-faced tapes with strong shielding properties.
9. a kind of preparation method of light-shielding conductive adhesive tape as claimed in claim 7, which is double faced adhesive tape,
It is characterized in that including the following steps,
(1) prepared by coating fluid：Acrylate pressure sensitive is added in isocyanates system curing agent and carbon black color slurry by above-mentioned mass fraction
It in adhesive, stirs 10~30min and forms mixture, carbonyl nickel powder is moistened with 10~30 parts of ethyl acetate, it then will wetting
Carbonyl nickel powder afterwards is added in said mixture, and remaining ethyl acetate is added, and 10~20min of stirring obtains uniform and stable screening
Photoconductive Adhesive composition is to get required coating fluid；
(2) coating fluid obtained is equably coated on release layer after the filter screen filtration of 200~400 mesh, coating thickness
Be 5~100 μm, then dry 1~8min in 50~130 DEG C of drying tunnel, then with being wherein bonded on one side of substrate layer,
It batches；
(3) filtered coating fluid is spread evenly across on another release layer, coating thickness is 5~100 μm, through 50~130 DEG C
Drying tunnel in dry 1~8min be bonded, batch with the another side of above-mentioned substrate layer, obtaining required has strong shielding properties
Light-shielding conductive double faced adhesive tape.
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| WO2017170371A1 (en) * | 2016-03-30 | 2017-10-05 | 積水化学工業株式会社 | Electroconductive adhesive tape |
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| CN111394007A (en) * | 2020-04-30 | 2020-07-10 | 张家港保税区汇英聚福材料科技合伙企业(有限合伙) | High-conductivity adhesive tape |
| CN111777959B (en) * | 2020-07-10 | 2022-07-29 | 广东弘擎电子材料科技有限公司 | Polyurethane foaming double-sided adhesive tape and preparation method thereof |
| CN112080240A (en) * | 2020-09-17 | 2020-12-15 | 镝普材料(深圳)有限公司 | Low-resistance conductive adhesive and manufacturing method of conductive adhesive tape |
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| CN114029218A (en) * | 2021-11-05 | 2022-02-11 | 苏州赛伍应用技术股份有限公司 | Preparation method of electromagnetic shielding adhesive tape |
| CN113927992A (en) * | 2021-11-12 | 2022-01-14 | 凯仁精密材料(江苏)有限公司 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
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