WO2017170371A1 - Electroconductive adhesive tape - Google Patents

Electroconductive adhesive tape Download PDF

Info

Publication number
WO2017170371A1
WO2017170371A1 PCT/JP2017/012342 JP2017012342W WO2017170371A1 WO 2017170371 A1 WO2017170371 A1 WO 2017170371A1 JP 2017012342 W JP2017012342 W JP 2017012342W WO 2017170371 A1 WO2017170371 A1 WO 2017170371A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive layer
conductive
weight
Prior art date
Application number
PCT/JP2017/012342
Other languages
French (fr)
Japanese (ja)
Inventor
桃子 伊達木
徳之 内田
耕平 丸尾
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2017518180A priority Critical patent/JPWO2017170371A1/en
Publication of WO2017170371A1 publication Critical patent/WO2017170371A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Definitions

  • the present invention relates to a conductive adhesive tape in which an adhesive layer is disposed on the surface of a conductive substrate.
  • conductive adhesive tape is used for the purpose of shielding electromagnetic waves and grounding for preventing static electricity.
  • Patent Documents 1 and 2 disclose a conductive pressure-sensitive adhesive tape including a conductive base material and a conductive pressure-sensitive adhesive layer containing conductive particles.
  • the total thickness of the conductive adhesive tape is 40 ⁇ m or less.
  • the particle diameter d50 of the conductive particles is 4 to 12 ⁇ m, and the thickness of the conductive pressure-sensitive adhesive layer is 6 to 12 ⁇ m.
  • the total thickness of the conductive adhesive tape is 30 ⁇ m or less.
  • the particle diameter d50 of the conductive particles is preferably 3 to 6 ⁇ m, and the thickness of the conductive pressure-sensitive adhesive layer is 1 to 6 ⁇ m.
  • An object of the present invention is to provide a conductive pressure-sensitive adhesive tape that can achieve both high resilience and electrical characteristics at a high level.
  • a conductive substrate and a pressure-sensitive adhesive layer disposed on the surface of the substrate are provided, and the pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive and metal particles.
  • the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive, and the average thickness of the pressure-sensitive adhesive layer is 5 ⁇ m or more and 20 ⁇ m or less.
  • a conductive pressure-sensitive adhesive tape is provided in which the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less.
  • the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive.
  • the pressure-sensitive adhesive is a (meth) acrylic adhesive.
  • the metal particles are nickel particles.
  • the base material is a metal foil.
  • the conductive pressure-sensitive adhesive tape is suitably used for a protective material for protecting an electronic device from ESD, a conductive material for grounding, or an electromagnetic wave shielding material.
  • the conductive pressure-sensitive adhesive tape according to the present invention includes a conductive base material and a pressure-sensitive adhesive layer disposed on the surface of the base material.
  • the pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive, metal particles, and the like.
  • the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive, and the average thickness of the pressure-sensitive adhesive layer is 5 ⁇ m or more and 20 ⁇ m or less.
  • the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less, both resilience resistance and electrical characteristics can be achieved at a high level. .
  • FIG. 1 is a cross-sectional view schematically showing a conductive pressure-sensitive adhesive tape according to an embodiment of the present invention.
  • FIG. 1 is a cross-sectional view schematically showing a conductive adhesive tape according to an embodiment of the present invention.
  • the base material 11 has conductivity.
  • the base material 11 is a conductive base material.
  • the pressure-sensitive adhesive layer 12 has adhesiveness.
  • the pressure-sensitive adhesive layer 12 is disposed on the surface of the substrate 11.
  • the pressure-sensitive adhesive layer 12 includes a pressure-sensitive pressure-sensitive adhesive 21 and a plurality of metal particles 22.
  • the metal particles 22 have conductivity.
  • the metal particles 22 are conductive particles.
  • the content of the metal particles 22 is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive 21.
  • the average thickness of the pressure-sensitive adhesive layer 12 is 5 ⁇ m or more and 20 ⁇ m or less.
  • the ratio of the average particle diameter of the metal particles 22 to the average thickness of the pressure-sensitive adhesive layer 12 is 0.5 or more and 2.5 or less.
  • the conductive pressure-sensitive adhesive tape includes a base material having conductivity and a pressure-sensitive adhesive layer disposed on the surface of the base material.
  • the pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive and metal particles.
  • the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive.
  • the average thickness of the pressure-sensitive adhesive layer is 5 ⁇ m or more and 20 ⁇ m or less.
  • the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less.
  • the adhesiveness can be increased while maintaining the electrical characteristics. Furthermore, in the present invention, since the above-described configuration is provided, even when exposed to high temperature or high humidity after pasting, it is possible to make it difficult to lift and peel, and to improve repulsion resistance (flip-up) Can be suppressed).
  • the thickness of the pressure-sensitive adhesive layer is thin, even if it is exposed to high temperature or high humidity after pasting, it can be made difficult to float and peel off, and repulsion resistance can be improved.
  • the content of a metal particle is comparatively small, the outstanding electrical property can be expressed.
  • the conductive pressure-sensitive adhesive tape of the present invention can achieve both high resilience and electrical characteristics, 1) a protective material for protecting an electronic device from ESD, 2) a grounding conductive material, or 3) an electromagnetic wave shield. It can be suitably used for the material.
  • the base material is a support for supporting the pressure-sensitive adhesive layer.
  • the substrate include a metal foil, a conductive resin material, a film on which a metal is deposited, a film on which a metal is sputtered, or a nonwoven fabric. From the viewpoint of further improving the electrical characteristics of the conductive adhesive tape, the substrate is preferably a metal foil.
  • the material of the metal foil examples include gold, silver, copper, nickel, iron, tin, aluminum, and a graphite sheet.
  • the metal foil is preferably a gold foil, a copper foil, or an aluminum foil, and more preferably a copper foil or an aluminum foil.
  • a copper foil is preferable.
  • an aluminum foil is preferable.
  • the thermal conductivity of the substrate is preferably 90 W / m ⁇ K or more, more preferably 100 W / m ⁇ K or more.
  • the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive.
  • the content of the metal particles in the pressure-sensitive adhesive layer is preferably 0.1 weight with respect to 100 parts by weight of the pressure-sensitive adhesive.
  • the adhesive layer contains the metal particles with respect to 100 parts by weight of the component excluding the solvent and the metal particles in the adhesive layer.
  • the amount is preferably 0.1 parts by weight or more, more preferably 0.75 parts by weight or more, further preferably 1 part by weight or more, preferably less than 25 parts by weight, more preferably 22 parts by weight or less, still more preferably 15 parts by weight.
  • the amount is not more than parts by weight, particularly preferably not more than 10 parts by weight, most preferably not more than 5 parts by weight.
  • the resilience resistance is further enhanced.
  • the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the component excluding the solvent of the pressure-sensitive adhesive layer and the metal particles, the resilience resistance is further increased.
  • the average thickness of the pressure-sensitive adhesive layer is 5 ⁇ m or more and 20 ⁇ m or less.
  • the average thickness of the pressure-sensitive adhesive layer is preferably 7 ⁇ m or more, more preferably 8 ⁇ m or more, preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and even more preferably 10 ⁇ m or less.
  • the average thickness of the pressure-sensitive adhesive layer is not less than the above lower limit, the pressure-sensitive adhesiveness and repulsion resistance are further enhanced.
  • the average thickness of the pressure-sensitive adhesive layer is not more than the above upper limit, the electrical characteristics are further enhanced.
  • adhesiveness and resilience can be fully improved.
  • the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less. From the viewpoint of achieving both higher resilience and electrical properties at a higher level, the above ratio (average particle diameter / average thickness) is preferably 0.6 or more, more preferably 0.7 or more, preferably 2 0.0 or less, more preferably 1.8 or less, still more preferably 1.5 or less, and particularly preferably 1.2 or less.
  • the average particle diameter means an average volume particle diameter, and can be measured by a laser diffraction / scattering particle diameter distribution measuring apparatus. In Examples described later, the average volume particle size was measured with a particle size distribution measuring device (manufactured by Shimadzu Corporation, product number “SALD-3100”).
  • the pressure-sensitive adhesive layer may contain a solvent separately from the pressure-sensitive pressure-sensitive adhesive and the metal particles.
  • the solvent can be removed by volatilization, for example, by heating at 100 ° C. or higher.
  • Pressure sensitive adhesive examples include (meth) acrylic adhesives, rubber adhesives, urethane adhesives, epoxy adhesives, and silicone adhesives. From the viewpoint of suppressing an excessive increase in adhesive strength at high temperatures, the pressure-sensitive adhesive is preferably a (meth) acrylic adhesive.
  • the above (meth) acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive obtained by adding a crosslinking agent, a tackifying resin, various stabilizers and the like to a (meth) acrylic polymer as necessary.
  • the (meth) acrylic polymer is not particularly limited, but a (meth) acrylic copolymer obtained by copolymerization of a mixed monomer containing a (meth) acrylic acid ester monomer and another copolymerizable monomer. It is preferable that
  • the (meth) acrylic acid ester monomer is not particularly limited, but is an esterification reaction product of a primary or secondary alkyl alcohol having 1 to 12 carbon atoms in the alkyl group and (meth) acrylic acid ( A meth) acrylic acid ester monomer is preferred.
  • Specific examples of the (meth) acrylic acid ester monomer include ethyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
  • the said (meth) acrylic acid ester monomer only 1 type may be used and 2 or more types may be used together.
  • Examples of the other copolymerizable polymerizable monomer include hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate; Isobornyl (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, malein Examples thereof include functional monomers such as acid and fumaric acid.
  • the other copolymerizable polymerizable monomer only one kind may be used, or two or more kinds may be used in combination.
  • the crosslinking agent is not particularly limited, and for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent.
  • the said crosslinking agent only 1 type may be used and 2 or more types may be used together.
  • the tackifying resin is not particularly limited, and examples thereof include petroleum resins such as aliphatic copolymers, aromatic copolymers, aliphatic / aromatic copolymers, and alicyclic copolymers.
  • the tackifying resin may be a hydrogenated resin. As for the said tackifier resin, only 1 type may be used and 2 or more types may be used together.
  • Metal particles examples include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, Examples thereof include cadmium, tungsten, molybdenum, silicon, and alloys thereof.
  • Examples of the metal include tin-doped indium oxide (ITO) and solder. From the viewpoint of effectively improving the electrical characteristics, an alloy containing tin, nickel, palladium, copper or gold is preferable, nickel or palladium is more preferable, and nickel is further preferable.
  • the metal particles may be metal particles whose metal particle body is coated with another metal.
  • the average particle diameter of the metal particles is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, preferably 40 ⁇ m or less, more preferably 15 ⁇ m or less, and even more preferably 10 ⁇ m or less.
  • the electrical characteristics are further enhanced.
  • the average particle diameter of the metal particles is not more than the above upper limit, the adhesiveness and repulsion resistance are further enhanced.
  • Adhesive layer material Adhesive solution (1): In a reactor equipped with a thermometer, a stirrer and a condenser, butyl acrylate 60 parts by weight, 2-ethylhexyl acrylate 36.9 parts by weight, acrylic acid 3 parts by weight, 2-hydroxyethyl acrylate 0. After 1 part by weight and 80 parts by weight of ethyl acetate were added and the atmosphere was replaced with nitrogen, the reactor was heated to start refluxing. Subsequently, 0.1 part by weight of azobisisobutyronitrile was added as a polymerization initiator in the reactor. The solution was refluxed for 5 hours to obtain a solution of the acrylic copolymer (a). About the obtained acrylic copolymer (a), the weight average molecular weight measured by GPC method using "2690 Separations Model" made from Water as a column was 1.4 million.
  • Examples 1 to 8 and Comparative Examples 1 to 4 The metal particles shown in Tables 1 and 2 were blended with the adhesive solutions shown in Tables 1 and 2 to obtain blends.
  • the compounding quantity of a metal particle is a compounding quantity from which the content of a metal particle turns into the quantity shown in Tables 1 and 2 with respect to 100 weight part of pressure sensitive adhesives in the adhesive layer obtained.
  • a PET separator having a thickness of 25 ⁇ m was prepared, the compound was applied to the release-treated surface of this separator, and dried at 100 ° C. for 3 minutes to form an adhesive layer.
  • this pressure-sensitive adhesive layer was formed to the base materials shown in Tables 1 and 2, a conductive pressure-sensitive adhesive tape in which the pressure-sensitive adhesive layer having the average thickness shown in Tables 1 and 2 was formed was obtained.
  • the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer was a value shown in Tables 1 and 2.
  • the conductive adhesive tape piece After leaving for 20 minutes in the same environment, the conductive adhesive tape piece is peeled off 180 degrees from the SUS plate at a pulling speed of 300 mm / min, and the force required for the peeling is measured. Evaluated.
  • the adhesive strength was determined according to the following criteria.
  • Adhesion criteria ⁇ : Adhesive strength is 13 N / 25 mm or more ⁇ : Adhesive strength is less than 13 N / 25 mm
  • Resistance value ( ⁇ ) (Electrical characteristics)
  • the obtained conductive adhesive tape was cut into a size of 10 mm ⁇ 10 mm, and the separator was peeled off to obtain a conductive adhesive tape piece.
  • a piece of conductive adhesive tape was attached to two aluminum plate electrodes having a width of 1 mm by applying a pressure of 3 kg / cm 2 for 5 seconds.
  • the affixing area to each electrode was 1 mm ⁇ 10 mm.
  • the resistance value after the pressure release was read 60 times every 5 seconds and averaged to evaluate the resistance value.
  • the resistance value was determined according to the following criteria. In addition, it is excellent in the electrical property, so that resistance value is low.
  • the resistance value “OL” means a state where the measurement value exceeds the measurement limit (1 G ⁇ ) and the resistance value cannot be measured.
  • Resistance value is 1 ⁇ or less ⁇ : Resistance value exceeds 1 ⁇ , 3.1 ⁇ or less ⁇ : Resistance value exceeds 3.1 ⁇
  • the obtained conductive adhesive tape was cut into a size of 20 mm ⁇ 20 mm, and the separator was peeled off to obtain a conductive adhesive tape piece. From the adhesive layer side of the conductive adhesive tape piece, 5mm to the right from the sticking start point to the sticking end point in plan view, 2mm to bend at a right angle, 13mm to the left bend at a right angle, and stick to a glass plate (thickness 2mm) As a result, a laminate was obtained. A pasting surface of 20 mm ⁇ 20 mm was cut to be 1 mm or 1.5 mm width ⁇ 20 mm, and unnecessary portions cut were peeled off to obtain evaluation samples.
  • the 1 mm or 1.5 mm width ⁇ 20 mm pasting surface was crimped by reciprocating a 2 kg rubber roller once. After crimping, the laminate was allowed to stand for 20 minutes, and the resulting laminate was left for 72 hours under conditions of a temperature of 60 ° C. and a humidity of 90% RH. After leaving, the floating and peeling of the conductive adhesive tape were observed, and the resilience resistance was judged according to the following criteria.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is provided with an electroconductive substrate 11 and an adhesive layer 12 disposed on the surface of the substrate 11, the adhesive layer 12 including a pressure-sensitive adhesive 21 and metal particles 22, the content of the metal particles 22 with respect to 100 parts by weight of the pressure-sensitive adhesive 21 being less than 25 parts by weight in the adhesive layer 12, the average thickness of the adhesive layer 12 being 5 µm to 20 µm, and the ratio of the average particle diameter of the metal particles 22 to the average thickness of the adhesive layer 12 being 0.5 to 2.5.

Description

導電性粘着テープConductive adhesive tape
　本発明は、導電性を有する基材の表面上に、粘着剤層が配置されている導電性粘着テープに関する。 The present invention relates to a conductive adhesive tape in which an adhesive layer is disposed on the surface of a conductive substrate.
　電子機器及び通信機器では、電磁波の遮蔽、及び静電気防止のグランド用途などを目的として、導電性粘着テープが用いられている。 In electronic devices and communication devices, conductive adhesive tape is used for the purpose of shielding electromagnetic waves and grounding for preventing static electricity.
　下記の特許文献１，２には、導電性基材と、導電性粒子を含有する導電性粘着剤層とを備える導電性粘着テープが開示されている。 The following Patent Documents 1 and 2 disclose a conductive pressure-sensitive adhesive tape including a conductive base material and a conductive pressure-sensitive adhesive layer containing conductive particles.
　特許文献１では、導電性粘着テープの総厚みが４０μｍ以下である。また、特許文献１では、導電性粒子の粒子径ｄ５０が、４～１２μｍであり、導電性粘着剤層の厚みが、６～１２μｍである。 In Patent Document 1, the total thickness of the conductive adhesive tape is 40 μm or less. In Patent Document 1, the particle diameter d50 of the conductive particles is 4 to 12 μm, and the thickness of the conductive pressure-sensitive adhesive layer is 6 to 12 μm.
　特許文献２では、導電性粘着テープの総厚みが３０μｍ以下である。また、特許文献２では、導電性粒子の粒子径ｄ５０が、好ましくは３～６μｍであり、導電性粘着剤層の厚みが、１～６μｍである。 In Patent Document 2, the total thickness of the conductive adhesive tape is 30 μm or less. In Patent Document 2, the particle diameter d50 of the conductive particles is preferably 3 to 6 μm, and the thickness of the conductive pressure-sensitive adhesive layer is 1 to 6 μm.
特開２０１３－２４５２３４号公報JP 2013-245234 A ＷＯ２０１５／０７６１７４Ａ１WO2015 / 076174A1
　近年、電子機器及び通信機器の小型化に伴い、導電性粘着テープにおいても、薄膜化が求められている。 In recent years, with the miniaturization of electronic devices and communication devices, thinning is also required for conductive adhesive tapes.
　しかしながら、特許文献１や特許文献２のような薄膜化された導電性粘着テープにおいては、貼り付け後に高温又は高湿下に晒されると、浮き及び剥離が発生しやすく、耐反発性が低下しやすい（フリップアップしやすい）という問題がある。 However, in a thin conductive adhesive tape such as Patent Document 1 and Patent Document 2, if it is exposed to high temperature or high humidity after being applied, it tends to float and peel, and the resilience resistance decreases. There is a problem that it is easy (it is easy to flip up).
　また、耐反発性の低下を抑えるために、導電性粘着剤層における導電性粒子の含有量を少なくすると、電気特性が低くなりやすいという問題がある。 Also, there is a problem that if the content of the conductive particles in the conductive pressure-sensitive adhesive layer is reduced in order to suppress a decrease in resilience resistance, the electrical characteristics are likely to be lowered.
　本発明の目的は、耐反発性と電気特性とを高いレベルで両立することができる導電性粘着テープを提供することである。 An object of the present invention is to provide a conductive pressure-sensitive adhesive tape that can achieve both high resilience and electrical characteristics at a high level.
　本発明の広い局面によれば、導電性を有する基材と、前記基材の表面上に配置された粘着剤層とを備え、前記粘着剤層は、感圧粘着剤と、金属粒子とを含み、前記粘着剤層において、前記感圧粘着剤１００重量部に対して、前記金属粒子の含有量が２５重量部未満であり、前記粘着剤層の平均厚みが、５μｍ以上、２０μｍ以下であり、前記粘着剤層の平均厚みに対する前記金属粒子の平均粒子径の比が、０．５以上、２．５以下である、導電性粘着テープが提供される。 According to a wide aspect of the present invention, a conductive substrate and a pressure-sensitive adhesive layer disposed on the surface of the substrate are provided, and the pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive and metal particles. In addition, in the pressure-sensitive adhesive layer, the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive, and the average thickness of the pressure-sensitive adhesive layer is 5 μm or more and 20 μm or less. A conductive pressure-sensitive adhesive tape is provided in which the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less.
　本発明に係る導電性粘着テープのある特定の局面では、前記粘着剤層において、前記感圧粘着剤１００重量部に対して、前記金属粒子の含有量が１０重量部以下である。 In a specific aspect of the conductive pressure-sensitive adhesive tape according to the present invention, in the pressure-sensitive adhesive layer, the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive.
　本発明に係る導電性粘着テープのある特定の局面では、前記感圧粘着剤が、（メタ）アクリル系粘着剤である。 In a specific aspect of the conductive adhesive tape according to the present invention, the pressure-sensitive adhesive is a (meth) acrylic adhesive.
　本発明に係る導電性粘着テープのある特定の局面では、前記金属粒子が、ニッケル粒子である。 In a specific aspect of the conductive adhesive tape according to the present invention, the metal particles are nickel particles.
　本発明に係る導電性粘着テープのある特定の局面では、前記基材が、金属箔である。 In a specific aspect of the conductive adhesive tape according to the present invention, the base material is a metal foil.
　本発明に係る導電性粘着テープのある特定の局面では、前記導電性粘着テープは、ＥＳＤから電子機器を保護するための保護材、グランディング用導通材又は電磁波シールド材に好適に用いられる。 In a specific aspect of the conductive pressure-sensitive adhesive tape according to the present invention, the conductive pressure-sensitive adhesive tape is suitably used for a protective material for protecting an electronic device from ESD, a conductive material for grounding, or an electromagnetic wave shielding material.
　本発明に係る導電性粘着テープは、導電性を有する基材と、上記基材の表面上に配置された粘着剤層とを備え、上記粘着剤層は、感圧粘着剤と、金属粒子とを含み、上記粘着剤層において、上記感圧粘着剤１００重量部に対して、上記金属粒子の含有量が２５重量部未満であり、上記粘着剤層の平均厚みが、５μｍ以上、２０μｍ以下であり、上記粘着剤層の平均厚みに対する上記金属粒子の平均粒子径の比が、０．５以上、２．５以下であるので、耐反発性と電気特性とを高いレベルで両立することができる。 The conductive pressure-sensitive adhesive tape according to the present invention includes a conductive base material and a pressure-sensitive adhesive layer disposed on the surface of the base material. The pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive, metal particles, and the like. In the pressure-sensitive adhesive layer, the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive, and the average thickness of the pressure-sensitive adhesive layer is 5 μm or more and 20 μm or less. In addition, since the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less, both resilience resistance and electrical characteristics can be achieved at a high level. .
図１は、本発明の一実施形態に係る導電性粘着テープを模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing a conductive pressure-sensitive adhesive tape according to an embodiment of the present invention.
　以下、本発明を詳細に説明する。 Hereinafter, the present invention will be described in detail.
　図１は、本発明の一実施形態に係る導電性粘着テープを模式的に示す断面図である。 FIG. 1 is a cross-sectional view schematically showing a conductive adhesive tape according to an embodiment of the present invention.
　図１に示す導電性粘着テープ１は、基材１１と、粘着剤層１２とを備える。基材１１は、導電性を有する。基材１１は、導電性基材である。粘着剤層１２は、粘着性を有する。粘着剤層１２は、基材１１の表面上に配置されている。粘着剤層１２は、感圧粘着剤２１と、複数の金属粒子２２とを含んでいる。金属粒子２２は、導電性を有する。金属粒子２２は、導電性粒子である。 1 includes a base material 11 and an adhesive layer 12. The conductive adhesive tape 1 shown in FIG. The base material 11 has conductivity. The base material 11 is a conductive base material. The pressure-sensitive adhesive layer 12 has adhesiveness. The pressure-sensitive adhesive layer 12 is disposed on the surface of the substrate 11. The pressure-sensitive adhesive layer 12 includes a pressure-sensitive pressure-sensitive adhesive 21 and a plurality of metal particles 22. The metal particles 22 have conductivity. The metal particles 22 are conductive particles.
　粘着剤層１２において、感圧粘着剤２１の含有量１００重量部に対して、金属粒子２２の含有量は２５重量部未満である。粘着剤層１２の平均厚みは、５μｍ以上、２０μｍ以下である。また、粘着剤層１２の平均厚みに対する金属粒子２２の平均粒子径の比は、０．５以上、２．５以下である。 In the pressure-sensitive adhesive layer 12, the content of the metal particles 22 is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive 21. The average thickness of the pressure-sensitive adhesive layer 12 is 5 μm or more and 20 μm or less. The ratio of the average particle diameter of the metal particles 22 to the average thickness of the pressure-sensitive adhesive layer 12 is 0.5 or more and 2.5 or less.
　導電性粘着テープ１のように、本発明に係る導電性粘着テープは、導電性を有する基材と、上記基材の表面上に配置された粘着剤層とを備える。上記粘着剤層は、感圧粘着剤と、金属粒子とを含む。上記感圧粘着剤１００重量部に対して、上記金属粒子の含有量は２５重量部未満である。上記粘着剤層の平均厚みは、５μｍ以上、２０μｍ以下である。上記粘着剤層の平均厚みに対する上記金属粒子の平均粒子径の比は、０．５以上、２．５以下である。 Like the conductive pressure-sensitive adhesive tape 1, the conductive pressure-sensitive adhesive tape according to the present invention includes a base material having conductivity and a pressure-sensitive adhesive layer disposed on the surface of the base material. The pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive and metal particles. The content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive. The average thickness of the pressure-sensitive adhesive layer is 5 μm or more and 20 μm or less. The ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer is 0.5 or more and 2.5 or less.
　本発明では、上記の構成が備えられているので、電気特性を維持したままで粘着性を高めることができる。さらに、本発明では、上記の構成が備えられているので、貼り付け後に高温又は高湿下に晒されても、浮き及び剥離を生じ難くすることができ、耐反発性を高めること（フリップアップを抑制すること）ができる。本発明では、粘着剤層の厚みが薄いにも関わらず、貼り付け後に高温又は高湿下に晒されても、浮き及び剥離を生じ難くすることができ、耐反発性を高めることができる。また、本発明では、金属粒子の含有量が比較的少ないにもかかわらず、優れた電気特性を発現させることができる。 In the present invention, since the above-described configuration is provided, the adhesiveness can be increased while maintaining the electrical characteristics. Furthermore, in the present invention, since the above-described configuration is provided, even when exposed to high temperature or high humidity after pasting, it is possible to make it difficult to lift and peel, and to improve repulsion resistance (flip-up) Can be suppressed). In the present invention, although the thickness of the pressure-sensitive adhesive layer is thin, even if it is exposed to high temperature or high humidity after pasting, it can be made difficult to float and peel off, and repulsion resistance can be improved. Moreover, in this invention, although the content of a metal particle is comparatively small, the outstanding electrical property can be expressed.
　上述した課題に対して、本発明者らが鋭意検討した結果、金属粒子の含有量、粘着剤層の平均厚み、及び、粘着剤層の平均厚みに対する金属粒子の平均粒子径の比を上記特定の範囲とすることで、耐反発性と電気特性とを高いレベルで両立できることを見出した。 As a result of intensive studies by the present inventors on the above-mentioned problems, the above-mentioned specification of the metal particle content, the average thickness of the pressure-sensitive adhesive layer, and the ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer It was found that the rebound resistance and the electrical characteristics can be achieved at a high level by setting the above range.
　本発明の導電性粘着テープは、耐反発性と電気特性とを高いレベルで両立できるので、１）ＥＳＤから電子機器を保護するための保護材、２）グランディング用導通材又は３）電磁波シールド材に好適に用いることができる。 Since the conductive pressure-sensitive adhesive tape of the present invention can achieve both high resilience and electrical characteristics, 1) a protective material for protecting an electronic device from ESD, 2) a grounding conductive material, or 3) an electromagnetic wave shield. It can be suitably used for the material.
　以下、導電性粘着テープの他の詳細を説明する。 Hereinafter, other details of the conductive adhesive tape will be described.
　（基材）
　上記基材は、上記粘着剤層を支持するための支持体である。上記基材としては、金属箔、導電性樹脂材、金属が蒸着されたフィルム、金属がスパッタリングされたフィルム、又は不織布等が挙げられる。導電性粘着テープの電気特性をより一層高める観点からは、上記基材は金属箔であることが好ましい。 (Base material)
The base material is a support for supporting the pressure-sensitive adhesive layer. Examples of the substrate include a metal foil, a conductive resin material, a film on which a metal is deposited, a film on which a metal is sputtered, or a nonwoven fabric. From the viewpoint of further improving the electrical characteristics of the conductive adhesive tape, the substrate is preferably a metal foil.
　上記金属箔の材質としては、金、銀、銅、ニッケル、鉄、錫、アルミニウム、及びグラファイトシート等が挙げられる。電気特性をより一層高める観点からは、上記金属箔は、金箔、銅箔又はアルミニウム箔であることが好ましく、銅箔又はアルミニウム箔であることがより好ましい。加工性をより一層高める観点からは、銅箔が好ましい。耐腐食性をより一層高める観点からは、アルミニウム箔が好ましい。 Examples of the material of the metal foil include gold, silver, copper, nickel, iron, tin, aluminum, and a graphite sheet. From the viewpoint of further improving the electrical characteristics, the metal foil is preferably a gold foil, a copper foil, or an aluminum foil, and more preferably a copper foil or an aluminum foil. From the viewpoint of further improving the workability, a copper foil is preferable. From the viewpoint of further increasing the corrosion resistance, an aluminum foil is preferable.
　電気特性をより一層高める観点からは、上記基材の熱伝導率は好ましくは９０Ｗ／ｍ・Ｋ以上、より好ましくは１００Ｗ／ｍ・Ｋ以上である。 From the viewpoint of further improving the electrical characteristics, the thermal conductivity of the substrate is preferably 90 W / m · K or more, more preferably 100 W / m · K or more.
　（粘着剤層）
　上記粘着剤層において、上記感圧粘着剤１００重量部に対して、上記金属粒子の含有量は２５重量部未満である。電気特性、粘着性、及び、耐反発性をバランスよく高める観点からは、上記粘着剤層において、上記感圧粘着剤１００重量部に対して、上記金属粒子の含有量は好ましくは０．１重量部以上、より好ましくは０．７５重量部以上、更に好ましくは１重量部以上であり、好ましくは２２重量部以下、より好ましくは１５重量部以下、更に好ましくは１０重量部以下、特に好ましくは５重量部以下である。電気特性、粘着性、及び、耐反発性をバランスよく高める観点からは、上記粘着剤層において、上記粘着剤層の溶剤及び上記金属粒子を除く成分１００重量部に対して、上記金属粒子の含有量は好ましくは０．１重量部以上、より好ましくは０．７５重量部以上、更に好ましくは１重量部以上であり、好ましくは２５重量部未満、より好ましくは２２重量部以下、更に好ましくは１５重量部以下、特に好ましくは１０重量部以下、最も好ましくは５重量部以下である。 (Adhesive layer)
In the pressure-sensitive adhesive layer, the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive. From the viewpoint of improving the electrical properties, adhesiveness, and repulsion resistance in a balanced manner, the content of the metal particles in the pressure-sensitive adhesive layer is preferably 0.1 weight with respect to 100 parts by weight of the pressure-sensitive adhesive. Part or more, more preferably 0.75 part by weight or more, further preferably 1 part by weight or more, preferably 22 parts by weight or less, more preferably 15 parts by weight or less, still more preferably 10 parts by weight or less, particularly preferably 5 parts by weight. Less than parts by weight. From the viewpoint of improving the electrical properties, adhesiveness, and repulsion resistance in a well-balanced manner, the adhesive layer contains the metal particles with respect to 100 parts by weight of the component excluding the solvent and the metal particles in the adhesive layer. The amount is preferably 0.1 parts by weight or more, more preferably 0.75 parts by weight or more, further preferably 1 part by weight or more, preferably less than 25 parts by weight, more preferably 22 parts by weight or less, still more preferably 15 parts by weight. The amount is not more than parts by weight, particularly preferably not more than 10 parts by weight, most preferably not more than 5 parts by weight.
　特に、上記感圧粘着剤１００重量部に対して、上記金属粒子の含有量が１０重量部以下であると、耐反発性がより一層高くなる。上記粘着剤層の溶剤及び上記金属粒子を除く成分１００重量部に対して、上記金属粒子の含有量が１０重量部以下であると、耐反発性がより一層高くなる。 In particular, when the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the pressure-sensitive adhesive, the resilience resistance is further enhanced. When the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the component excluding the solvent of the pressure-sensitive adhesive layer and the metal particles, the resilience resistance is further increased.
　上記粘着剤層の平均厚みは、５μｍ以上、２０μｍ以下である。上記粘着剤層の平均厚みは、好ましくは７μｍ以上、より好ましくは８μｍ以上であり、好ましくは２０μｍ以下、より好ましくは１５μｍ以下、更に好ましくは１０μｍ以下である。上記粘着剤層の平均厚みが上記下限以上であると、粘着性及び耐反発性がより一層高くなる。上記粘着剤層の平均厚みが上記上限以下であると、電気特性がより一層高くなる。また、本発明では、上記粘着剤層の平均厚みが上記上限以下であっても、粘着性及び耐反発性を十分に高めることができる。 The average thickness of the pressure-sensitive adhesive layer is 5 μm or more and 20 μm or less. The average thickness of the pressure-sensitive adhesive layer is preferably 7 μm or more, more preferably 8 μm or more, preferably 20 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less. When the average thickness of the pressure-sensitive adhesive layer is not less than the above lower limit, the pressure-sensitive adhesiveness and repulsion resistance are further enhanced. When the average thickness of the pressure-sensitive adhesive layer is not more than the above upper limit, the electrical characteristics are further enhanced. Moreover, in this invention, even if the average thickness of the said adhesive layer is below the said upper limit, adhesiveness and resilience can be fully improved.
　上記粘着剤層の平均厚みに対する上記金属粒子の平均粒子径の比（平均粒子径／平均厚み）は、０．５以上、２．５以下である。耐反発性と電気特性とをより一層高いレベルで両立させる観点から、上記比（平均粒子径／平均厚み）は、好ましくは０．６以上、より好ましくは０．７以上であり、好ましくは２．０以下、より好ましくは１．８以下、更に好ましくは１．５以下、特に好ましくは１．２以下である。 The ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer (average particle diameter / average thickness) is 0.5 or more and 2.5 or less. From the viewpoint of achieving both higher resilience and electrical properties at a higher level, the above ratio (average particle diameter / average thickness) is preferably 0.6 or more, more preferably 0.7 or more, preferably 2 0.0 or less, more preferably 1.8 or less, still more preferably 1.5 or less, and particularly preferably 1.2 or less.
　上記平均粒子径は、平均体積粒子径のことをいい、レーザー回折・散乱式の粒子径分布測定装置により測定することができる。なお、後述する実施例においては、粒子径分布測定装置（島津製作所社製、品番「ＳＡＬＤ－３１００」）により平均体積粒子径を測定した。 The average particle diameter means an average volume particle diameter, and can be measured by a laser diffraction / scattering particle diameter distribution measuring apparatus. In Examples described later, the average volume particle size was measured with a particle size distribution measuring device (manufactured by Shimadzu Corporation, product number “SALD-3100”).
　上記粘着剤層は、上記感圧粘着剤及び上記金属粒子とは別に、溶剤を含んでいてもよい。上記溶剤は、例えば、１００℃以上の加熱により、揮発によって除去可能である。 The pressure-sensitive adhesive layer may contain a solvent separately from the pressure-sensitive pressure-sensitive adhesive and the metal particles. The solvent can be removed by volatilization, for example, by heating at 100 ° C. or higher.
　感圧粘着剤：
　上記感圧粘着剤としては、（メタ）アクリル系粘着剤、ゴム系粘着剤、ウレタン系接着剤、エポキシ系接着剤及びシリコーン系粘着剤等が挙げられる。高温下での粘着力の過度な上昇を抑制する観点から、上記感圧粘着剤は、（メタ）アクリル系粘着剤であることが好ましい。 Pressure sensitive adhesive:
Examples of the pressure sensitive adhesive include (meth) acrylic adhesives, rubber adhesives, urethane adhesives, epoxy adhesives, and silicone adhesives. From the viewpoint of suppressing an excessive increase in adhesive strength at high temperatures, the pressure-sensitive adhesive is preferably a (meth) acrylic adhesive.
　上記（メタ）アクリル系粘着剤は、（メタ）アクリル重合体に、必要に応じて架橋剤、粘着付与樹脂及び各種安定剤などを添加した粘着剤である。 The above (meth) acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive obtained by adding a crosslinking agent, a tackifying resin, various stabilizers and the like to a (meth) acrylic polymer as necessary.
　上記（メタ）アクリル重合体は、特に限定されないが、（メタ）アクリル酸エステルモノマーと、他の共重合可能な重合性モノマーとを含む混合モノマーの共重合により得られる（メタ）アクリル共重合体であることが好ましい。 The (meth) acrylic polymer is not particularly limited, but a (meth) acrylic copolymer obtained by copolymerization of a mixed monomer containing a (meth) acrylic acid ester monomer and another copolymerizable monomer. It is preferable that
　上記（メタ）アクリル酸エステルモノマーとしては、特に限定されないが、アルキル基の炭素数が１～１２の１級又は２級のアルキルアルコールと、（メタ）アクリル酸とのエステル化反応物である（メタ）アクリル酸エステルモノマーが好ましい。上記（メタ）アクリル酸エステルモノマーとしては、具体的には、（メタ）アクリル酸エチル、（メタ）アクリル酸ブチル、（メタ）アクリル酸－２－エチルヘキシル等が挙げられる。上記（メタ）アクリル酸エステルモノマーは、１種のみが用いられてもよく、２種以上が併用されてもよい。 The (meth) acrylic acid ester monomer is not particularly limited, but is an esterification reaction product of a primary or secondary alkyl alcohol having 1 to 12 carbon atoms in the alkyl group and (meth) acrylic acid ( A meth) acrylic acid ester monomer is preferred. Specific examples of the (meth) acrylic acid ester monomer include ethyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. As for the said (meth) acrylic acid ester monomer, only 1 type may be used and 2 or more types may be used together.
　上記他の共重合可能な重合性モノマーとしては、例えば、（メタ）アクリル酸２－ヒドロキシエチル、（メタ）アクリル酸ヒドロキシプロピル、（メタ）アクリル酸ヒドロキシブチル等の（メタ）アクリル酸ヒドロキシアルキル；（メタ）アクリル酸イソボルニル、（メタ）アクリル酸ヒドロキシアルキル、グリセリンジメタクリレート、（メタ）アクリル酸グリシジル、２－メタクリロイルオキシエチルイソシアネート、（メタ）アクリル酸、イタコン酸、無水マレイン酸、クロトン酸、マレイン酸及びフマル酸等の官能性モノマーが挙げられる。上記他の共重合可能な重合性モノマーは、１種のみが用いられてもよく、２種以上が併用されてもよい。 Examples of the other copolymerizable polymerizable monomer include hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate; Isobornyl (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, malein Examples thereof include functional monomers such as acid and fumaric acid. As the other copolymerizable polymerizable monomer, only one kind may be used, or two or more kinds may be used in combination.
　上記架橋剤としては、特に限定されず、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤、過酸化物系架橋剤、尿素系架橋剤、金属アルコキシド系架橋剤、金属キレート系架橋剤、金属塩系架橋剤、カルボジイミド系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、アミン系架橋剤、及び多官能アクリレート等が挙げられる。上記架橋剤は、１種のみが用いられてもよく、２種以上が併用されてもよい。 The crosslinking agent is not particularly limited, and for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent. Agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents, and polyfunctional acrylates. As for the said crosslinking agent, only 1 type may be used and 2 or more types may be used together.
　上記粘着付与樹脂としては、特に限定されないが、例えば、脂肪族系共重合体、芳香族系共重合体、脂肪族・芳香族系共重合体及び脂環式系共重合体等の石油系樹脂；クマロン－インデン系樹脂；テルペン系樹脂；テルペンフェノール系樹脂；重合ロジン等のロジン系樹脂；フェノール系樹脂；キシレン系樹脂等が挙げられる。上記粘着付与樹脂は、水素添加された樹脂であってもよい。上記粘着付与樹脂は、１種のみが用いられてもよく、２種以上が併用されてもよい。 The tackifying resin is not particularly limited, and examples thereof include petroleum resins such as aliphatic copolymers, aromatic copolymers, aliphatic / aromatic copolymers, and alicyclic copolymers. Coumarone-indene resin; terpene resin; terpene phenol resin; rosin resin such as polymerized rosin; phenol resin; xylene resin. The tackifying resin may be a hydrogenated resin. As for the said tackifier resin, only 1 type may be used and 2 or more types may be used together.
　金属粒子：
　上記金属粒子を構成する金属としては、例えば、金、銀、パラジウム、銅、白金、亜鉛、鉄、錫、鉛、アルミニウム、コバルト、インジウム、ニッケル、クロム、チタン、アンチモン、ビスマス、タリウム、ゲルマニウム、カドミウム、タングステン、モリブデン、ケイ素及びこれらの合金等が挙げられる。また、上記金属としては、錫ドープ酸化インジウム（ＩＴＯ）及びはんだ等が挙げられる。電気特性を効果的に高める観点からは、錫を含む合金、ニッケル、パラジウム、銅又は金が好ましく、ニッケル又はパラジウムがより好ましく、ニッケルが更に好ましい。また、上記金属粒子は、金属粒子本体が他の金属で被覆された金属粒子であってもよい。 Metal particles:
Examples of the metal constituting the metal particles include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, Examples thereof include cadmium, tungsten, molybdenum, silicon, and alloys thereof. Examples of the metal include tin-doped indium oxide (ITO) and solder. From the viewpoint of effectively improving the electrical characteristics, an alloy containing tin, nickel, palladium, copper or gold is preferable, nickel or palladium is more preferable, and nickel is further preferable. The metal particles may be metal particles whose metal particle body is coated with another metal.
　上記金属粒子の平均粒子径は、好ましくは１μｍ以上、より好ましくは３μｍ以上であり、好ましくは４０μｍ以下、より好ましくは１５μｍ以下、更に好ましくは１０μｍ以下である。上記金属粒子の平均粒子径が上記下限以上であると、電気特性がより一層高くなる。上記金属粒子の平均粒子径が上記上限以下であると、粘着性及び耐反発性がより一層高くなる。 The average particle diameter of the metal particles is preferably 1 μm or more, more preferably 3 μm or more, preferably 40 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less. When the average particle diameter of the metal particles is not less than the above lower limit, the electrical characteristics are further enhanced. When the average particle diameter of the metal particles is not more than the above upper limit, the adhesiveness and repulsion resistance are further enhanced.
　以下、実施例及び比較例を挙げて、本発明を具体的に説明する。本発明は、以下の実施例のみに限定されない。 Hereinafter, the present invention will be specifically described with reference to examples and comparative examples. The present invention is not limited only to the following examples.
　まず、以下の材料を用意した。 First, the following materials were prepared.
　（基材）
　銅箔（１）（平均厚み１２μｍ） (Base material)
Copper foil (1) (average thickness 12μm)
　（粘着剤層の材料）
　粘着剤溶液（１）：温度計、攪拌機及び冷却管を備えた反応器に、ブチルアクリレート６０重量部、２－エチルヘキシルアクリレート３６．９重量部、アクリル酸３重量部、２－ヒドロキシエチルアクリレート０．１重量部、及び、酢酸エチル８０重量部を加え、窒素置換した後、反応器を加熱して還流を開始した。続いて、上記反応器内に、重合開始剤としてアゾビスイソブチロニトリル０．１重量部を添加した。５時間還流させて、アクリル共重合体（ａ）の溶液を得た。得られたアクリル共重合体（ａ）について、カラムとしてＷａｔｅｒ社製「２６９０　Ｓｅｐａｒａｔｉｏｎｓ　Ｍｏｄｅｌ」を用いてＧＰＣ法により測定された重量平均分子量は、１４０万であった。 (Adhesive layer material)
Adhesive solution (1): In a reactor equipped with a thermometer, a stirrer and a condenser, butyl acrylate 60 parts by weight, 2-ethylhexyl acrylate 36.9 parts by weight, acrylic acid 3 parts by weight, 2-hydroxyethyl acrylate 0. After 1 part by weight and 80 parts by weight of ethyl acetate were added and the atmosphere was replaced with nitrogen, the reactor was heated to start refluxing. Subsequently, 0.1 part by weight of azobisisobutyronitrile was added as a polymerization initiator in the reactor. The solution was refluxed for 5 hours to obtain a solution of the acrylic copolymer (a). About the obtained acrylic copolymer (a), the weight average molecular weight measured by GPC method using "2690 Separations Model" made from Water as a column was 1.4 million.
　得られたアクリル共重合体（ａ）の溶液に含まれるアクリル共重合体（ａ）の固形分１００重量部に対して、重合ロジンエステル（軟化点１５０℃）１５重量部、ロジンエステル（軟化点１００℃）１０重量部、テルペンフェノール（軟化点１５０℃）１０重量部、酢酸エチル（不二化学薬品社製）３４４重量部、及び、イソシアネート系架橋剤（日本ポリウレタン社製「コロネートＬ４５」）１重量部を添加し、攪拌して、金属粒子を含まない粘着剤溶液（１）（感圧粘着剤と溶剤とを含む液）を得た。 15 parts by weight of polymerized rosin ester (softening point 150 ° C.), rosin ester (softening point) with respect to 100 parts by weight of the solid content of acrylic copolymer (a) contained in the resulting solution of acrylic copolymer (a) 10 parts by weight of 100 ° C.), 10 parts by weight of terpene phenol (softening point 150 ° C.), 344 parts by weight of ethyl acetate (Fuji Chemical Co., Ltd.), and isocyanate crosslinking agent (“Coronate L45” manufactured by Nippon Polyurethane) Part by weight was added and stirred to obtain an adhesive solution (1) containing no metal particles (a liquid containing a pressure-sensitive adhesive and a solvent).
　金属粒子（１）：ニッケル粒子、平均粒子径１０．９μｍ、インコリミテッド社製、商品名「ＮＩ１２３」
　金属粒子（２）：ニッケル粒子、平均粒子径１１．４μｍ、福田金属箔粉工業社製、商品名「Ｎｉ１２３Ｔ」
　金属粒子（３）：ニッケル粒子、平均粒子径６．７μｍ、福田金属箔粉工業社製、商品名「Ｎｉ１２３Ｊ」
　金属粒子（４）：ニッケル粒子、平均粒子径２０．１μｍ、インコリミテッド社製、商品名「ＮＩ２５５」 Metal particles (1): Nickel particles, average particle size 10.9 μm, manufactured by Incori Ltd., trade name “NI123”
Metal particles (2): Nickel particles, average particle size 11.4 μm, manufactured by Fukuda Metal Foil Powder Industry Co., Ltd., trade name “Ni123T”
Metal particles (3): Nickel particles, average particle diameter 6.7 μm, manufactured by Fukuda Metal Foil Powder Industry Co., Ltd., trade name “Ni123J”
Metal particles (4): Nickel particles, average particle size 20.1 μm, manufactured by Incori Ltd., trade name “NI255”
　（実施例１～８及び比較例１～４）
　下記の表１，２に示す粘着剤溶液に、表１，２に示す金属粒子を配合し、配合物を得た。なお、金属粒子の配合量は、得られる粘着剤層において、感圧粘着剤１００重量部に対して、金属粒子の含有量が表１，２に示す量となる配合量である。 (Examples 1 to 8 and Comparative Examples 1 to 4)
The metal particles shown in Tables 1 and 2 were blended with the adhesive solutions shown in Tables 1 and 2 to obtain blends. In addition, the compounding quantity of a metal particle is a compounding quantity from which the content of a metal particle turns into the quantity shown in Tables 1 and 2 with respect to 100 weight part of pressure sensitive adhesives in the adhesive layer obtained.
　厚み２５μｍのＰＥＴセパレーターを用意し、このセパレーターの離型処理面に配合物を塗布し、１００℃で３分間乾燥させることにより、粘着剤層を形成した。この粘着剤層を、表１，２に示す基材と貼り合わせることで、表１，２に示す平均厚みの粘着剤層が形成された導電性粘着テープを得た。なお、粘着剤層の平均厚みに対する金属粒子の平均粒子径の比（平均粒子径／平均厚み）は、表１，２に示す値であった。 A PET separator having a thickness of 25 μm was prepared, the compound was applied to the release-treated surface of this separator, and dried at 100 ° C. for 3 minutes to form an adhesive layer. By bonding this pressure-sensitive adhesive layer to the base materials shown in Tables 1 and 2, a conductive pressure-sensitive adhesive tape in which the pressure-sensitive adhesive layer having the average thickness shown in Tables 1 and 2 was formed was obtained. The ratio of the average particle diameter of the metal particles to the average thickness of the pressure-sensitive adhesive layer (average particle diameter / average thickness) was a value shown in Tables 1 and 2.
　（評価）
　（１）粘着力
　ＪＩＳ　Ｚ０２３７に準拠して、得られた導電性粘着テープの１８０度剥離粘着力を測定した。具体的には、導電性粘着テープを２５ｍｍ×１００ｍｍに裁断し、セパレーターを剥離して導電性粘着テープ片を得た。導電性粘着テープ片を、被着体であるＪＩＳ　Ｇ４３０５に準拠して２８０番研磨のＳＵＳ板に、温度２３℃及び湿度５０％ＲＨ試験室において２ｋｇゴムローラーを１往復させ圧着し、貼り付けた。同様の環境下にて２０分放置した後、引張速度３００ｍｍ／ｍｉｎにて、導電性粘着テープ片をＳＵＳ板から１８０度方向に引き剥がし、その引き剥がしに要する力を測定することで、粘着力を評価した。粘着力を下記の基準で判定した。 (Evaluation)
(1) Adhesive strength Based on JIS Z0237, the 180 degree | times peeling adhesive force of the obtained electroconductive adhesive tape was measured. Specifically, the conductive adhesive tape was cut into 25 mm × 100 mm, and the separator was peeled off to obtain a conductive adhesive tape piece. The conductive adhesive tape piece was attached to an SUS plate polished to No. 280 in accordance with JIS G4305, which is an adherend, by reciprocating a 2 kg rubber roller once in a test chamber at a temperature of 23 ° C. and a humidity of 50% RH. . After leaving for 20 minutes in the same environment, the conductive adhesive tape piece is peeled off 180 degrees from the SUS plate at a pulling speed of 300 mm / min, and the force required for the peeling is measured. Evaluated. The adhesive strength was determined according to the following criteria.
　［粘着力の判定基準］
　○：粘着力が、１３Ｎ／２５ｍｍ以上
　×：粘着力が、１３Ｎ／２５ｍｍ未満 [Adhesion criteria]
○: Adhesive strength is 13 N / 25 mm or more ×: Adhesive strength is less than 13 N / 25 mm
　（２）抵抗値（Ω）（電気特性）
　得られた導電性粘着テープを、１０ｍｍ×１０ｍｍのサイズに裁断し、セパレーターを剥離して導電性粘着テープ片を得た。幅１ｍｍの２枚のアルミニウム板電極に３ｋｇ／ｃｍ２の加圧を５秒間かけて導電性粘着テープ片を貼り付けた。各電極への貼り付け面積を１ｍｍ×１０ｍｍとした。その後、温度２３℃及び湿度５０％ＲＨ試験室において、圧開放後の抵抗値を５秒毎に６０回読み取り平均化することで、抵抗値を評価した。抵抗値を下記の基準で判定した。なお、抵抗値が低いほど、電気特性に優れている。抵抗値の「Ｏ．Ｌ．」は測定限界（１ＧΩ）を超え、抵抗値が測定できない状態を意味する。 (2) Resistance value (Ω) (Electrical characteristics)
The obtained conductive adhesive tape was cut into a size of 10 mm × 10 mm, and the separator was peeled off to obtain a conductive adhesive tape piece. A piece of conductive adhesive tape was attached to two aluminum plate electrodes having a width of 1 mm by applying a pressure of 3 kg / cm 2 for 5 seconds. The affixing area to each electrode was 1 mm × 10 mm. Thereafter, in the temperature 23 ° C. and humidity 50% RH test chamber, the resistance value after the pressure release was read 60 times every 5 seconds and averaged to evaluate the resistance value. The resistance value was determined according to the following criteria. In addition, it is excellent in the electrical property, so that resistance value is low. The resistance value “OL” means a state where the measurement value exceeds the measurement limit (1 GΩ) and the resistance value cannot be measured.
　［抵抗値の判定基準］
　○：抵抗値が１Ω以下
　△：抵抗値が１Ωを超え、３．１Ω以下
　×：抵抗値が３．１Ωを超える [Criteria of resistance value]
○: Resistance value is 1Ω or less △: Resistance value exceeds 1Ω, 3.1Ω or less ×: Resistance value exceeds 3.1Ω
　（３）耐反発性（高温及び高湿下での浮き及び剥離の発生）
　得られた導電性粘着テープを、２０ｍｍ×２０ｍｍのサイズに裁断し、セパレーターを剥離して導電性粘着テープ片を得た。導電性粘着テープ片の粘着剤層側から、平面視において貼り付け起点から貼り付け終点まで右に５ｍｍ、直角に曲げ下に２ｍｍ、直角に曲げ左に１３ｍｍ、ガラス板（厚さ２ｍｍ）に貼り付けて、積層体を得た。２０ｍｍ×２０ｍｍの貼り付け面を１ｍｍもしくは１．５ｍｍ幅×２０ｍｍとなるよう裁断し、裁断した不必要な部分は剥ぎ取り、評価サンプルを得た。１ｍｍもしくは１．５ｍｍ幅×２０ｍｍの貼り付け面を、２ｋｇゴムローラーを１往復させ圧着した。圧着後、２０分放置した後、得られた積層体を温度６０℃及び湿度９０％ＲＨの条件で７２時間放置した。放置後に、導電性粘着テープの浮き及び剥離を観察し、耐反発性を下記の基準で判定した。 (3) Resilience resistance (occurrence of lifting and peeling under high temperature and high humidity)
The obtained conductive adhesive tape was cut into a size of 20 mm × 20 mm, and the separator was peeled off to obtain a conductive adhesive tape piece. From the adhesive layer side of the conductive adhesive tape piece, 5mm to the right from the sticking start point to the sticking end point in plan view, 2mm to bend at a right angle, 13mm to the left bend at a right angle, and stick to a glass plate (thickness 2mm) As a result, a laminate was obtained. A pasting surface of 20 mm × 20 mm was cut to be 1 mm or 1.5 mm width × 20 mm, and unnecessary portions cut were peeled off to obtain evaluation samples. The 1 mm or 1.5 mm width × 20 mm pasting surface was crimped by reciprocating a 2 kg rubber roller once. After crimping, the laminate was allowed to stand for 20 minutes, and the resulting laminate was left for 72 hours under conditions of a temperature of 60 ° C. and a humidity of 90% RH. After leaving, the floating and peeling of the conductive adhesive tape were observed, and the resilience resistance was judged according to the following criteria.
　［耐反発性の判定基準］
　○：１ｍｍ幅貼り付けで浮き及び剥離の双方が発生しない。
　△：１．５ｍｍ幅貼り付けで浮き及び剥離の双方が発生しないが、１ｍｍ幅貼り付けで浮き又は剥離が発生する。
　×：１ｍｍ幅もしくは１．５ｍｍ幅貼り付けで浮き及び剥離の双方が発生し、貼り付け面が１．５ｍｍを超える幅となるようさらに作成した評価サンプルにおいても剥離が発生する。 [Judgment criteria for rebound resistance]
○: Neither floating nor peeling occurs when 1mm width is applied.
Δ: Both floating and peeling do not occur when 1.5 mm width is applied, but floating or peeling occurs when 1 mm width is applied.
X: Both floating and peeling occur when 1 mm width or 1.5 mm width is pasted, and peeling occurs even in an evaluation sample further prepared so that the pasting surface has a width exceeding 1.5 mm.
　詳細及び結果を下記の表１，２に示す。 Details and results are shown in Tables 1 and 2 below.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　１…導電性粘着テープ
　１１…基材
　１２…粘着剤層
　２１…感圧粘着剤
　２２…金属粒子 DESCRIPTION OF SYMBOLS 1 ... Conductive adhesive tape 11 ... Base material 12 ... Adhesive layer 21 ... Pressure sensitive adhesive 22 ... Metal particle

Claims (6)

  1. 　導電性を有する基材と、
    　前記基材の表面上に配置された粘着剤層とを備え、
    　前記粘着剤層は、感圧粘着剤と、金属粒子とを含み、
    　前記粘着剤層において、前記感圧粘着剤１００重量部に対して、前記金属粒子の含有量が２５重量部未満であり、
    　前記粘着剤層の平均厚みが、５μｍ以上、２０μｍ以下であり、
    　前記粘着剤層の平均厚みに対する前記金属粒子の平均粒子径の比が、０．５以上、２．５以下である、導電性粘着テープ。     A conductive substrate;
    An adhesive layer disposed on the surface of the substrate;
    The pressure-sensitive adhesive layer includes a pressure-sensitive pressure-sensitive adhesive and metal particles,
    In the pressure-sensitive adhesive layer, the content of the metal particles is less than 25 parts by weight with respect to 100 parts by weight of the pressure-sensitive pressure-sensitive adhesive.
    The average thickness of the pressure-sensitive adhesive layer is 5 μm or more and 20 μm or less,
    The electrically conductive adhesive tape whose ratio of the average particle diameter of the said metal particle with respect to the average thickness of the said adhesive layer is 0.5 or more and 2.5 or less.
  2. 　前記粘着剤層において、前記感圧粘着剤１００重量部に対して、前記金属粒子の含有量が１０重量部以下である、請求項１に記載の導電性粘着テープ。 The conductive adhesive tape according to claim 1, wherein in the adhesive layer, the content of the metal particles is 10 parts by weight or less with respect to 100 parts by weight of the pressure-sensitive adhesive.
  3. 　前記感圧粘着剤が、（メタ）アクリル系粘着剤である、請求項１又は２に記載の導電性粘着テープ。 The conductive pressure-sensitive adhesive tape according to claim 1 or 2, wherein the pressure-sensitive pressure-sensitive adhesive is a (meth) acrylic pressure-sensitive adhesive.
  4. 　前記金属粒子が、ニッケル粒子である、請求項１～３のいずれか１項に記載の導電性粘着テープ。 The conductive adhesive tape according to any one of claims 1 to 3, wherein the metal particles are nickel particles.
  5. 　前記基材が、金属箔である、請求項１～４のいずれか１項に記載の導電性粘着テープ。 The conductive adhesive tape according to any one of claims 1 to 4, wherein the substrate is a metal foil.
  6. 　ＥＳＤから電子機器を保護するための保護材、グランディング用導通材又は電磁波シールド材に用いられる、請求項１～５のいずれか１項に記載の導電性粘着テープ。 The conductive adhesive tape according to any one of claims 1 to 5, which is used as a protective material for protecting an electronic device from ESD, a grounding conductive material or an electromagnetic wave shielding material.
PCT/JP2017/012342 2016-03-30 2017-03-27 Electroconductive adhesive tape WO2017170371A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017518180A JPWO2017170371A1 (en) 2016-03-30 2017-03-27 Conductive adhesive tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-068362 2016-03-30
JP2016068362 2016-03-30

Publications (1)

Publication Number Publication Date
WO2017170371A1 true WO2017170371A1 (en) 2017-10-05

Family

ID=59965675

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/012342 WO2017170371A1 (en) 2016-03-30 2017-03-27 Electroconductive adhesive tape

Country Status (2)

Country Link
JP (1) JPWO2017170371A1 (en)
WO (1) WO2017170371A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019001909A (en) * 2017-06-15 2019-01-10 Dic株式会社 Conductive adhesive sheet
WO2022158594A1 (en) * 2021-01-25 2022-07-28 昭和電工マテリアルズ株式会社 Film-like adhesive and method for manufacturing connection structure

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09217047A (en) * 1996-02-08 1997-08-19 Hitachi Chem Co Ltd Conducting tape with tacky agent
JP2009079127A (en) * 2007-09-26 2009-04-16 Nitto Denko Corp Conductive pressure-sensitive adhesive tape
JP2010138317A (en) * 2008-12-12 2010-06-24 Lintec Corp Electroconductive pressure-sensitive adhesive sheet and method for producing the same
JP2014001297A (en) * 2012-06-18 2014-01-09 Dic Corp Conductive adhesive tape
JP2014136778A (en) * 2013-01-18 2014-07-28 Dic Corp Conductive adhesive sheet
WO2014171387A1 (en) * 2013-04-19 2014-10-23 Dic株式会社 Conductive adhesive sheet, method for manufacturing same and electronic terminal obtained by using same
WO2015076174A1 (en) * 2013-11-20 2015-05-28 Dic株式会社 Conductive adhesive sheet and electronic device
WO2015119221A1 (en) * 2014-02-05 2015-08-13 積水テクノ商事西日本株式会社 Electrically conductive adhesive tape
JP2015178595A (en) * 2014-02-28 2015-10-08 日東電工株式会社 Conductive adhesive tape, and display device with conductive adhesive tape
JP2016000786A (en) * 2014-06-12 2016-01-07 Dic株式会社 Adhesive sheet, production method thereof and article
CN105542673A (en) * 2015-12-22 2016-05-04 宁波大榭开发区综研化学有限公司 Shading conductive adhesive and adhesive tape with strong shielding performance, and preparation methods thereof

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09217047A (en) * 1996-02-08 1997-08-19 Hitachi Chem Co Ltd Conducting tape with tacky agent
JP2009079127A (en) * 2007-09-26 2009-04-16 Nitto Denko Corp Conductive pressure-sensitive adhesive tape
JP2010138317A (en) * 2008-12-12 2010-06-24 Lintec Corp Electroconductive pressure-sensitive adhesive sheet and method for producing the same
JP2014001297A (en) * 2012-06-18 2014-01-09 Dic Corp Conductive adhesive tape
JP2014136778A (en) * 2013-01-18 2014-07-28 Dic Corp Conductive adhesive sheet
WO2014171387A1 (en) * 2013-04-19 2014-10-23 Dic株式会社 Conductive adhesive sheet, method for manufacturing same and electronic terminal obtained by using same
WO2015076174A1 (en) * 2013-11-20 2015-05-28 Dic株式会社 Conductive adhesive sheet and electronic device
WO2015119221A1 (en) * 2014-02-05 2015-08-13 積水テクノ商事西日本株式会社 Electrically conductive adhesive tape
JP2015178595A (en) * 2014-02-28 2015-10-08 日東電工株式会社 Conductive adhesive tape, and display device with conductive adhesive tape
JP2016000786A (en) * 2014-06-12 2016-01-07 Dic株式会社 Adhesive sheet, production method thereof and article
CN105542673A (en) * 2015-12-22 2016-05-04 宁波大榭开发区综研化学有限公司 Shading conductive adhesive and adhesive tape with strong shielding performance, and preparation methods thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019001909A (en) * 2017-06-15 2019-01-10 Dic株式会社 Conductive adhesive sheet
JP2021183698A (en) * 2017-06-15 2021-12-02 Dic株式会社 Conductive adhesive sheet and portable electronic device
JP7363864B2 (en) 2017-06-15 2023-10-18 Dic株式会社 Conductive adhesive sheets and portable electronic devices
WO2022158594A1 (en) * 2021-01-25 2022-07-28 昭和電工マテリアルズ株式会社 Film-like adhesive and method for manufacturing connection structure

Also Published As

Publication number Publication date
JPWO2017170371A1 (en) 2019-02-07

Similar Documents

Publication Publication Date Title
JP4403360B2 (en) Conductive adhesive sheet
WO2011024551A1 (en) Electrically peelable pressure-sensitive adhesive article and method for peeling off same
KR102034941B1 (en) Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape
KR101819529B1 (en) Conductive adhesive sheet and electronic device
JP2014234444A (en) Electroconductive double-sided adhesive tape
JP2015178595A (en) Conductive adhesive tape, and display device with conductive adhesive tape
JP5572433B2 (en) Conductive film surface adhesive and conductive film surface adhesive sheet
CN108300371B (en) Conductive pressure-sensitive adhesive tape
WO2017170371A1 (en) Electroconductive adhesive tape
WO2017104665A1 (en) Conductive adhesive tape
JP2015010109A (en) Conductive adhesive tape
CN111164175B (en) Conductive adhesive tape
CN109415608B (en) Conductive adhesive composition and conductive adhesive tape
JP2017014458A (en) Conductive adhesive tape for display device
WO2019171504A1 (en) Temporary protective film for electronic components
WO2019239955A1 (en) Electrically conductive adhesive sheet
WO2018110285A1 (en) Electroconductive adhesive tape
JP2021091802A (en) Conductive adhesive sheet
JP2021091801A (en) Conductive adhesive sheet
KR20100121913A (en) Antistatic pressure-sensitive adhesive film and composition for manufacturing of pressure-sensitive adhesive film

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2017518180

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17774908

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17774908

Country of ref document: EP

Kind code of ref document: A1