CN100407415C - Heat conduction composite chip and its mfg. method - Google Patents
Heat conduction composite chip and its mfg. method Download PDFInfo
- Publication number
- CN100407415C CN100407415C CN2004100300290A CN200410030029A CN100407415C CN 100407415 C CN100407415 C CN 100407415C CN 2004100300290 A CN2004100300290 A CN 2004100300290A CN 200410030029 A CN200410030029 A CN 200410030029A CN 100407415 C CN100407415 C CN 100407415C
- Authority
- CN
- China
- Prior art keywords
- heat conductivity
- layer
- silastic
- heat
- nature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C9/00—Stools for specified purposes
- A47C9/02—Office stools not provided for in main groups A47C1/00, A47C3/00 or A47C7/00; Workshop stools
- A47C9/027—Stools for work at ground level
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C3/00—Chairs characterised by structural features; Chairs or stools with rotatable or vertically-adjustable seats
- A47C3/20—Chairs or stools with vertically-adjustable seats
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C7/00—Parts, details, or accessories of chairs or stools
- A47C7/62—Accessories for chairs
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Provided are thermal conductive composite sheets to improve the thermal conductivity and rework simultaneously by the three-layer structure of a thermal conductive silicon rubber layer, a thermoplastic thermal conductive layer and a thermal conductive layer, and the process of preparing the same. The thermal conductive composite sheets have the laminated structure comprising (a) a thermal conductive silicon rubber layer consisting of silicon rubbers containing thermal conductive fillers, (b) a adhesive thermoplastic thermal conductive layer containing silicon resins and thermal conductive fillers, and (c) a thermal conductive layer of which thermal conductivity in direction of pane is 20 to 500 W/(m.k) in the sequence. The composite sheets further include (d) the second adhesive thermoplastic thermal conductive layer containing silicon resins and thermal conductive fillers upon the thermal conductive layer.
Description
Technical field
The present invention relates to heat conductivity composite sheet and manufacture method thereof as the heat release sheet of heat generation electronic unit etc.
Background technology
Along with the miniaturization of electronic equipments such as TV, computer, communicator, the integrated level of the circuit that carries in them increases.Be installed on integrated circuit packages such as the electronic unit of this integrated circuit, particularly CPU and reduce,, use heat that constitute by metallic plate etc., conduction integrated circuit package etc., and be released to outside fin therefore as measure at heat release because of the heating performance.
Have, in order to improve the pyroconductivity between integrated circuit package and the fin, what carried out since the past is that between clamps the good lubricating grease of heat conductivity, silicone rubber plate etc. again.; heat conductivity lubricating grease is except polluting parts and oil seepage (separating fuel-displaced); viscosity rises; with by adhesive face driving fit securely; when processing once more (taking down the situation of thermal conductive member such as fin in order to repair, change electronic unit etc.), exist electronic unit with shortcomings such as fin come off.In addition, in the occasion that clamps the heat conductivity silicone rubber plate, when improving hardness, processability improves once more, but reduce with the tracing ability of electronic unit, it is big that interface resistance becomes, the exothermicity deterioration, on the other hand, when hardness was low, the installation that exists on the electronic equipment became difficult shortcoming.
Set out by such situation, the resin sheet of the thermal softening utilized is arranged, the tracing ability of raising and electronic unit, thereby the report (for example with reference to TOHKEMY 2002-329989 communique) that improves the technology of exothermicity.Again, as the thickness direction that not only improves sheet, and improve heat conductivity in the face direction, thereby the measure that further improves exothermicity has the report (for example with reference to Japan special fair 3-51302 communique) of use in the technology of the good graphite flake of the heat conductivity of face direction.
, in the technology of above-mentioned TOHKEMY 2002-329989 communique record, because the resin sheet surface is a thermal softening, therefore processability is insufficient once more.And in the technology of the special fair 3-51302 communique record of Japan, though the heat conductivity of face direction is improved, but in graphite linings coating rubber constituent, give the tack to electronic unit (adaptation) by this rubber layer, therefore working procedure of coating bothers very much, and processability can not be said so fully once more.
On the other hand, above-mentioned variety of issue, promptly to improve simultaneously sheet the face direction heat conductivity and with the processability once more of electronic unit laminated a plurality of the time, the heat conductivity of the thickness direction of sheet reduces significantly, exothermicity is deterioration also.Therefore, only merely make up existing heat release sheet, can not be satisfied the exothermicity and the sheet of processability once more simultaneously.
Summary of the invention
The inventor carries out various researchs for addressing the above problem, found that in order to ensure processability once more, utilization is provided with silastic-layer outer field at least one side, at internal layer the three-decker that improves with the intermediate layer of the thermal softening of the tracing ability of object is set, has successfully improved heat conductivity and processability once more thus simultaneously.In addition, the inventor finds that also as this intermediate layer, when use did not contain the material of heat conductivity filler, exothermicity reduced terrifically.Therefore, the present invention finishes for addressing the above problem, and its objective is to provide to improve heat conductivity and the heat conductivity composite sheet and the manufacture method thereof of processability once more simultaneously.
In order to achieve the above object, the invention provides a kind of heat conductivity composite sheet, it is characterized in that, the structure that has had by following sequential cascade following layer: (a) heat conductivity silastic-layer, (b) that is made of the silicon rubber that contains the heat conductivity filler (silicone gum) contains organic siliconresin (silicone resin) and heat conductivity filler, and adhesive thermal softening conducting shell hot in nature is arranged and (c) is the heat conduction layer of 20-500W/ (mK) in the pyroconductivity of face direction.
Like this, have once more the heat conductivity silastic-layer of excellent processability in outer layer side, its heat is by the heat conduction layer heat release expeditiously from opposition side of thermal softening heat conduction layer, therefore can satisfy heat conductivity, exothermicity and processability once more simultaneously.
On above-mentioned heat conduction layer surface, can also further be provided with (d) and contain organic siliconresin and heat conductivity filler, and adhesive second thermal softening conducting shell hot in nature is arranged.
Like this, make driving fits such as second thermal softening conducting shell hot in nature and fin by thermal softening, therefore hot to the conduction of high efficiency such as fin ground from heat conduction layer, exothermicity further improves.
In addition, the present invention provides a kind of heat conductivity composite sheet again, it is characterized in that, the structure that has had by following sequential cascade following layer: (a) the heat conductivity silastic-layer that is made of the silicon rubber that contains the heat conductivity filler, (b) contain organic siliconresin and heat conductivity filler, and adhesive thermal softening conducting shell hot in nature is arranged and (e) constitute, and the second low heat conductivity silastic-layer of the above-mentioned heat conductivity silastic-layer of hardness ratio by the silicon rubber that contains the heat conductivity filler.
Like this, because all there is once more the heat conductivity silastic-layer of excellent processability in the outer layer side in table, therefore processability improves significantly once more.In addition, the heat of a side outer layer side is by the outer heat release of thermal softening conducting shell hot in nature from opposition side, so heat conductivity is also good.
Have again, the present invention also provides a kind of method of making the heat conductivity composite sheet, it is characterized in that, under the state that has stacked gradually above-mentioned heat conductivity silastic-layer, above-mentioned thermal softening conducting shell hot in nature and above-mentioned heat conduction layer or the above-mentioned second heat conductivity silastic-layer, carry out room temperature pressing or hot pressing.
Embodiment
Below describe with regard to the embodiment of heat conductivity composite sheet of the present invention and manufacture method thereof.
1. first embodiment
[heat conductivity silastic-layer]
The heat conductivity silastic-layer is positioned at the outer layer side of heat conductivity composite sheet of the present invention and contacts with heat release object (electronic unit etc.), be to conduct its heat, in order to give once more processability (rework)) in, improve shape stability, guarantee the productivity ratio when sheet is made, and the hardness of regulation is arranged.In addition, in order to give heat conductivity, contain the heat conductivity filler in the heat conductivity silastic-layer.As silicon rubber, its kind is not particularly limited, and for example can use the polysiloxane that contains (A) and contain 2 above alkenyls in 1 molecule, (B) has the hydrogen atom that combines with silicon atom more than 2 in 1 molecule poly-organohydrogensiloxanes (Port リ オ Le ガ ノ Ha イ De ロ ジ エ Application シ ロ キ サ Application), the silicon rubber of (C) platinum group catalyst.In addition, as the heat conductivity filler, can use metal nitride powder, artificial diamond's stone powders such as metal oxide powders such as metal dusts such as copper, silver, aluminium, aluminium oxide, silica, magnesium oxide, zinc oxide, aluminium nitride, silicon nitride, boron nitride.Containing of heat conductivity filler is proportional, for example with respect to heat conductivity silastic-layer integral body, can be 70-97 weight %, and ideal situation can be 85-95 weight %.When the amount of heat conductivity filler after a little while, the heat conductivity of heat conductivity silastic-layer reduces, when amount for a long time, can not obtain uniform thermal conducting silicon rubber.
The hardness of heat conductivity silastic-layer, operability, shape retention when guaranteeing that sheet is produced, preferred ASKER C hardness is 10-60, more preferably ASKER C hardness is 20-50.At this, so-called ASKER C hardness is based on SRIS 0101 (Japan rubber association criterion) and JIS-S6050, the hardness of using spring hardness tester ASKER C type to measure.The ASKER C hardness of heat conductivity silastic-layer was less than 10 o'clock, and sheet is too soft, kept the shape difficulty, and reinforcement is insufficient, and productivity ratio reduces.On the contrary, when hardness is excessive, reduce with the adaptation of electronic unit etc., tracing ability is bad, causes exothermicity and reduces.In addition, be the occasion of index with the Shore A type hardness tester of stipulating among the JIS-K6253, be preferably 30-100, more preferably 40-90.Moreover general ASKER C hardness is to measure the index of the hardness of the soft material that is difficult to usefulness Shore A type hardness tester mensuration.
As the commercially available heat conductivity silicone rubber plate that can be used for the heat conductivity silastic-layer, can list TC-50THS (ASKER C hardness 20, Shin-Etsu Chemial Co., Ltd's system; Trade name), TC-50TXS (ASKER C hardness 40, Shin-Etsu Chemial Co., Ltd's system; Trade name) TC-20BG (Shore A type hardness tester 85, Shin-Etsu Chemial Co., Ltd's system; Trade name), TC-45BG (Shore A type hardness tester 85, Shin-Etsu Chemial Co., Ltd's system; Trade name), TC-30EG (Shore A type hardness tester 90, Shin-Etsu Chemial Co., Ltd's system; Trade name), TC-45EG (Shore A type hardness tester 90, Shin-Etsu Chemial Co., Ltd's system; Trade name).
[thermal softening conducting shell hot in nature]
Thermal softening conducting shell hot in nature disperses the heat conductivity filler and constitutes in the organic siliconresin matrix.In addition, this layer constitutes the intermediate layer of heat conductivity composite sheet of the present invention, has when utilizing its adherence to engage outer field function, utilizes the heat conductivity filler to guarantee good heat conductivity, and the heat conductivity of sheet integral body is improved.Organic siliconresin so long as the resin that adhesive thermal softening arranged just, its kind is not particularly limited, and for example can be to form in accordance with regulations to contain the D body (2 functionality construction unit) represented with following formula and the material of T body (3 functionality construction unit).
D
1 mT
pD
2 m
At this, D
1Expression dimethyl siloxane units (i.e. (CH
3)
2SiO), T represents phenyl siloxane unit (i.e. (C
6H
5)
2SiO
3/2), D
2Expression methyl vinyl siloxane unit (i.e. (CH
3) (CH
2=CH) SiO).In addition, the relation that has (m+n)/p=0.25-4.0 (mol ratio), (m+n)/m=1.0-4.0.If the constituent of representing with following formula then presents adherence.
At this, thermal softening is meant Yin Re and causes lowering viscousity, thermal softening or fusion, by thermal softening conducting shell liquidation hot in nature, follows and driving fit with the face of being attached, thereby reduces interface resistance.Secondly, usually also can with 40-100 ℃, particularly carry out lowering viscousity, thermal softening or fusion 40-90 ℃ temperature range, thereby the material of Surface runoffization is decided to be and has " thermal softening ".
As the heat conductivity filler that is scattered in organic siliconresin, can use and the same material of described heat conductivity filler that is used for above-mentioned heat conductivity silastic-layer.In addition, containing of heat conductivity filler is proportional, for example with respect to thermal softening conductive layer integral body hot in nature, can be 70-97 weight %, preferably is decided to be 85-95 weight %.The reason of the content of regulation heat conductivity filler, same with the situation of above-mentioned heat conductivity silastic-layer.
As the commercially available thermal softening that can be used for thermal softening conducting shell hot in nature conductibility sheet hot in nature, can list PCS-TC-10, PCS-TC-11, PCS-TC-20 (is Shin-Etsu Chemial Co., Ltd's system; Trade name).
[heat conduction layer]
Heat conduction layer is positioned at the skin of the opposition side of sheet, contacts with heat release member such as fin etc., has the function of emitting the heat of being conducted by the intermediate layer, simultaneously because the heat conductivity height of face direction, so exothermicity uprises.Secondly, the pyroconductivity of the face direction by making heat conduction layer is 20-500W/ (mK), thereby thermal capacitance is easily conducted to the face direction.When heat conductivity during less than 20W/ (mK), the heat conductivity of face direction is not fully, even surpass 500W/ (mK), the effect of heat conductivity is also saturated.Can use graphite flake, aluminium foil etc. as heat conduction layer.
As the commercially available graphite flake that can be used for heat conduction layer, can list MACFOIL (Japanese マ テ Star Network ス Co., Ltd. system; Trade name), PGS graphite flake (Panasonic Electric Equipment Industrial Co.,Ltd's system; Trade name).As aluminium foil, for example can list the aluminium foil of Nippon Light Metal Co., Ltd's system.
Secondly, by laminated above-mentioned heat conductivity silastic-layer, thermal softening conducting shell hot in nature and heat conduction layer successively, constituted the heat conductivity composite sheet of first embodiment.Utilize such formation, the good heat conductivity silastic-layer of release (release property) is an outermost layer, owing to contact with heat release object such as electronic unit, so can improve said processability once more.Secondly, because the good heat conduction layer of heat conductivity of face direction is positioned at the skin of opposition side, therefore promoted from the heat release of heat conduction layer to the outside.Have again, utilize the thermal softening conducting shell hot in nature that becomes the intermediate layer, the heat from the heat conductivity silastic-layer can be conducted to heat conduction layer expeditiously, so exothermic character improves significantly.In addition, by thermal softening conducting shell thermal softening hot in nature, outer field heat conductivity silastic-layer also with the driving fit of heat release object, the heat of conducting the heat release object easily.
2. second embodiment
This heat conductivity composite sheet is the composite sheet that second thermal softening conducting shell hot in nature further is set on above-mentioned heat conduction layer surface.Second thermal softening conducting shell hot in nature and above-mentioned thermal softening conducting shell hot in nature are same, disperse the heat conductivity filler and constitute in the organic siliconresin matrix.The used organic siliconresin of second thermal softening conducting shell hot in nature, heat conductivity filler, with and contain ratio, can among the explanation of carrying out with regard to above-mentioned thermal softening conducting shell hot in nature, select, in addition, can use resin and the heat conductivity filler identical, also can use the resin of other kinds etc. with above-mentioned thermal softening conducting shell hot in nature.
Be positioned at skin by second thermal softening conducting shell hot in nature, the Surface runoffization of this layer, thereby face (fin etc.) is followed, driving fit with being attached, therefore and be attached and do not produce the space between the face, interface resistance reduces, the heat of heat conduction layer can be transmitted to fin etc. expeditiously, exothermic character improves significantly.
3. the 3rd embodiment
This heat conductivity composite sheet is provided with the heat conduction layer of the second heat conductivity silastic-layer with the heat conductivity composite sheet that replaces above-mentioned first embodiment.The used silicon rubber of the described second heat conductivity silastic-layer, heat conductivity filler, with and contain ratio and can among the explanation of carrying out with regard to above-mentioned heat conductivity silastic-layer, select.In addition, can use silicon rubber and the heat conductivity filler identical, also can use the resin of other kinds etc. with above-mentioned heat conductivity silastic-layer.
The second heat conductivity silastic-layer and above-mentioned heat conductivity silastic-layer ratio reduce hardness.Its reason be because, above-mentioned heat conductivity silastic-layer has in order to improve shape stability than higher hardness, therefore there is no need to improve the hardness of the second heat conductivity silastic-layer, the adaptation, the tracing ability that make and be attached face (electronic unit or fin etc.) this moment improve, and improve exothermic character.
Moreover, heat conductivity composite sheet for the 3rd embodiment, make with the good second heat conductivity silastic-layer side of the tracing ability of object to contact, make hard slightly heat conductivity silastic-layer side contacts outside (fin etc.) for well with heat release object (electronic unit etc.).
Be positioned at skin by second thermal softening conducting shell hot in nature, the surface of this layer easily be attached that face (electronic unit or fin etc.) is followed, driving fit, therefore and be attached and do not produce the space between the face, interface resistance reduces, exothermic character improves as a result.In addition, do not appear at skin, so the operability of sheet, processability also becomes good once more as the intermediate layer of adhesive thermal softening resin.
Secondly, the method with regard to manufacturing heat conductivity composite sheet of the present invention describes.Manufacture method of the present invention is that heat conductivity silastic-layer, thermal softening conducting shell hot in nature and heat conduction layer or the second heat conductivity silastic-layer are passed through room temperature pressing or the incompatible manufacturing heat conductivity of hot pressing composite sheet.
In the occasion of carrying out the room temperature pressing, for example between the heat conductivity silicone rubber plate and graphite flake of band shape, supply has been pasted on the surface through the banded thermal softening of the polymer film of release processing conductibility sheet hot in nature, behind the polymer-stripping film, with laminated successively laminated of heat conductivity silicone rubber plate, graphite flake and thermal softening conductibility sheet hot in nature, be passed between two rollers of room temperature, carry out pressing.In the occasion of carrying out hot pressing, above-mentioned pair of roller is heated to more than the thermal softening temperature of thermal softening conductibility sheet hot in nature (for example 80-120 ℃) pressing similarly.Moreover pressing can also be used hot press compacting etc. except using the roller method.In addition, in the occasion of the heat conductivity composite sheet of making above-mentioned second embodiment, supply with the thermal softening conductibility sheet hot in nature with above-mentioned same band shape in the outside of graphite flake, pressing is whole to get final product.
Enumerate embodiment below and further describe the present invention, but the present invention is not limited to these embodiment.
[embodiment]
1. the preparation of each material
Prepared following sheet and sticker.
[heat conductivity silicone rubber plate]
A-1:TC-50TXS (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 500 μ m, ASKER C hardness 40)
A-2:TC-50THS (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 500 μ m, ASKER C hardness 20)
A-3:TC-45BG (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 450 μ m, Shore A type hardness tester 85)
A-4:TC-45EG (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 450 μ m, Shore A type hardness tester 90)
[thermal softening conductibility sheet hot in nature]
B-1:PCS-TC-20-G-10 (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 100 μ m)
B-2:PCS-TC-11-G-13 (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 130 μ m)
[heat conductivity sheet]
C-1:MACFOIL (the pyroconductivity 150W/ (mK) of Japanese マ テ Star Network ス Co., Ltd. system, thickness 130 μ m, face direction)
C-2: aluminium foil (the pyroconductivity 237W/ (mK) of Nippon Light Metal Co., Ltd's system, thickness 50 μ m, face direction)
[thermal softening conductibility sheet hot in nature]
D-1:PCS-TC-20-G-20 (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 200 μ m)
[heat conductivity silicone rubber plate]
E-1:TC-20BG (trade name; Shin-Etsu Chemial Co., Ltd's system, thickness 200 μ m, Shore A type hardness tester 85)
[siloxanes sticker]
B-3:KR-101-10 (trade name; Shin-Etsu Chemial Co., Ltd's system)
2. the manufacturing of heat conductivity composite sheet
The above-mentioned heat conductivity silicone rubber plate of suitable combination, thermal softening conductibility sheet hot in nature, heat conductivity sheet are passed between two rollers of room temperature, carry out pressing, make the heat conductivity composite sheet.In the occasion of carrying out hot pressing, above-mentioned pair of roller is heated to 100 ℃, pressing similarly.Moreover, for the sample of a part, use the siloxanes sticker to replace thermal softening conductibility sheet hot in nature, this siloxanes sticker is coated after above-mentioned heat conductivity silicone rubber plate or the heat conductivity sheet, use above-mentioned pair of roller pressing similarly.
3. estimate
Each the heat conductivity composite sheet that obtains is cut into 5 * 5cm, this test film is estimated following characteristic.
(1) sheet thickness
Use micrometer (ミ of Co., Ltd. Star ト ヨ system, model: M820-25VA) measure.
(2) thermal resistance
In transistor (Fuji Electrical Machinery Co., Ltd.'s system; Trade name 2SD923) and between the fin (オ of Co., Ltd.-エ ス system, trade name FBA-150-PS) clamp each test film, with the load of compression-loaded 345kPa.Fin is put into Water Tank with Temp.-controlled in advance, 65 ℃ of insulations, takes out the installation test sheet from thermostat in the experiment beginning.Then, supply with the electricity of 10V, 3A, measure through the temperature of transistor T after 5 minutes to transistor
1, and be embedded to the temperature T of the thermocouple of fin
2, calculate the thermal resistance R of sample by following formula
S(℃/W).
R
S＝(T
1-T
2)/30
(3) processability once more
Between 2 standard aluminium sheets, sandwich each test film, after the load with compression-loaded 490kPa, in 150 ℃ baking oven, placed 96 hours.After the placement, to the direction reinforcing that is pulled away from aluminium sheet, judge the easy extent of exfoliation between aluminium sheet and the test film with hand.
Estimate A: peel off easily
Estimate B: the power that applies a little is just peeled off
Estimate C: difficulty is peeled off
Estimate D: very difficulty is peeled off, and causes splitting easily
The formation and the evaluation result of the heat conductivity composite sheet that obtains are shown in Table 1.Moreover, in table 1, press each sheet of sequential laminating (or sticker) of ground floor, the second layer, and make ground floor side contacts transistor, make the outer contact heat spreader side of opposition side.
Table 1
As can be seen from Table 1, the equal thermal resistance of each embodiment low (0.5 ℃/W is following), exothermicity is good, and processability is also good once more simultaneously.Moreover embodiment 3,4 is owing to be arranged on outer layer side with the silicon rubber of high rigidity as the heat conductivity silicone rubber plate, so thermal resistance uprises a little, but practically no problemly, and processability improves significantly once more.In addition, be arranged among embodiment 1,2, the 5-7 and 9 of outer layer side at the heat conduction layer that the heat conductivity of face direction is good, thermal resistance is extremely low, for about 0.3 ℃/below the W.
On the other hand, used as the intermediate layer among the comparative example 1-3 of siloxanes sticker, because the reduction of the heat conductivity in this intermediate layer, so thermal resistance has all surpassed 0.5 ℃/W.In addition, make in the comparative example 4,5 of 2 layers of structure, outer and outside driving fit causes splitting.Be provided with in the comparative example 6 of adhesive thermal softening conducting shell hot in nature in outer layer side, because the adherence on sheet surface uprises, therefore processability worsens once more.
As described above, heat conductivity composite sheet of the present invention, heat conductivity and processability is all good once more is suitable as the heat release, the used radiator structure of cooling that are used for heat generation electronic unit etc.
Claims (4)
1. heat conductivity composite sheet, the thermal resistance of its thickness direction be 0.5 ℃/below the W, and the excellent processability once more of heat conductivity silastic-layer and heat release object is characterized in that, has had by following sequential cascade following layer and the overall structure that forms:
(a) the described heat conductivity silastic-layer that constitutes by the silicon rubber that contains the heat conductivity filler, the ASKER C hardness of this silastic-layer is that 10-60 or Shore A type hardness tester are 30-100;
(b) contain organic siliconresin and heat conductivity filler and adhesive thermal softening conducting shell hot in nature is arranged, wherein aforementioned hot conductibility filler to contain proportional be 70～97 weight %; With
(c) pyroconductivity in the face direction is the heat conduction layer of 20-500W/ (mK).
2. the heat conductivity composite sheet of putting down in writing according to claim 1 is characterized in that, also further is provided with (d) on described heat conduction layer surface and contains organic siliconresin and heat conductivity filler, and adhesive second thermal softening conducting shell hot in nature is arranged.
3. a heat conductivity composite sheet is characterized in that, has had by following sequential cascade the structure of following layer:
(a) the heat conductivity silastic-layer that constitutes by the silicon rubber that contains the heat conductivity filler;
(b) contain organic siliconresin and heat conductivity filler and adhesive thermal softening conducting shell hot in nature is arranged; With
(e) constitute by the silicon rubber that contains the heat conductivity filler, and the second low heat conductivity silastic-layer of the described heat conductivity silastic-layer of hardness ratio.
4. method of making each heat conductivity composite sheet of putting down in writing of claim 1-3, it is characterized in that, under the state that has stacked gradually described heat conductivity silastic-layer, described thermal softening conducting shell hot in nature and described heat conduction layer or the described second heat conductivity silastic-layer, carry out room temperature pressing or hot pressing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003100416A JP2004311577A (en) | 2003-04-03 | 2003-04-03 | Thermally conductive composite sheet and method of manufacturing the same |
| JP2003100416 | 2003-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1536653A CN1536653A (en) | 2004-10-13 |
| CN100407415C true CN100407415C (en) | 2008-07-30 |
Family
ID=33464559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004100300290A Expired - Fee Related CN100407415C (en) | 2003-04-03 | 2004-03-17 | Heat conduction composite chip and its mfg. method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004311577A (en) |
| KR (1) | KR20040086802A (en) |
| CN (1) | CN100407415C (en) |
| TW (1) | TW200502288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102384697A (en) * | 2010-07-05 | 2012-03-21 | 栗村化学株式会社 | Heat radiation tape and manufacturing method thereof |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126582A1 (en) * | 2005-05-24 | 2006-11-30 | Nitto Denko Corporation | Thermally conductive composite sheet and method for manufacturing electronic component assembly using same |
| JP4843419B2 (en) * | 2005-10-13 | 2011-12-21 | ポリマテック株式会社 | Key sheet |
| JP5386200B2 (en) * | 2008-04-30 | 2014-01-15 | 中興化成工業株式会社 | Composite sheet |
| JP4966915B2 (en) * | 2008-05-09 | 2012-07-04 | 株式会社タイカ | Thermally conductive sheet, thermal conductive sheet laminate and method for producing the same |
| JP5058938B2 (en) * | 2008-10-22 | 2012-10-24 | 信越化学工業株式会社 | Silicone rubber sheet for thermocompression bonding |
| JP5538739B2 (en) * | 2009-03-17 | 2014-07-02 | 信越化学工業株式会社 | Thermally conductive composite sheet and method for producing the same |
| US8340482B2 (en) * | 2009-03-31 | 2012-12-25 | Furukawa Electric Co., Ltd. | Optical fiber holding apparatus |
| JP5193111B2 (en) * | 2009-03-31 | 2013-05-08 | 古河電気工業株式会社 | Optical fiber holding structure |
| JP2011138857A (en) * | 2009-12-28 | 2011-07-14 | Shin-Etsu Chemical Co Ltd | Method of manufacturing electronic device with excellent heat dissipation and rework properties, and electronic device |
| KR101151599B1 (en) * | 2010-03-26 | 2012-05-31 | 율촌화학 주식회사 | Heat radiation tape and manufacturing method thereof |
| KR20110132210A (en) * | 2010-05-31 | 2011-12-07 | 스미토모 게이 긴조쿠 고교 가부시키가이샤 | Led bulb member and method for manufacturing the same |
| CN102529230B (en) * | 2010-10-19 | 2015-04-22 | 信越化学工业株式会社 | Silicon rubber sheet for thermal compression and method for joining electrical and/or electronic device members |
| JP5699556B2 (en) * | 2010-11-15 | 2015-04-15 | 日立化成株式会社 | HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE SHEET MANUFACTURING METHOD, AND HEAT DISSIPATION |
| CN102555341B (en) * | 2011-02-25 | 2015-03-18 | 北京国科世纪激光技术有限公司 | Thermal conductive interface device |
| JP2013086433A (en) * | 2011-10-20 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | Thermally conductive silicone composite sheet |
| KR101335528B1 (en) * | 2012-05-02 | 2013-12-03 | 김선기 | Thermal Conductive sheet having self adhesive force |
| JP2014003141A (en) * | 2012-06-18 | 2014-01-09 | Shin Etsu Chem Co Ltd | Thermally conductive sheet, and electronic apparatus |
| JP6136952B2 (en) * | 2013-02-28 | 2017-05-31 | 信越化学工業株式会社 | Thermally conductive composite silicone rubber sheet |
| JP6032359B2 (en) * | 2013-06-07 | 2016-11-24 | 信越化学工業株式会社 | Thermally conductive composite sheet and heat dissipation structure |
| CN104875467B (en) * | 2014-02-28 | 2017-09-22 | 湖北航天化学技术研究所 | A kind of resin base premix thermosetting binder method synchronous with rocket engine cast |
| JP6194939B2 (en) * | 2015-09-17 | 2017-09-13 | 東洋インキＳｃホールディングス株式会社 | Laminated body for electromagnetic wave shield, electromagnetic wave shield laminated body, electronic device and manufacturing method thereof |
| JP6187568B2 (en) * | 2015-09-17 | 2017-08-30 | 東洋インキＳｃホールディングス株式会社 | Laminated body for electromagnetic wave shield, electromagnetic wave shield laminated body, electronic device and manufacturing method thereof |
| JP7131016B2 (en) * | 2018-03-27 | 2022-09-06 | 三菱ケミカル株式会社 | SILICONE RUBBER COMPOSITE AND METHOD FOR MANUFACTURING MOLDED PRODUCT USING IT |
| JP7149229B2 (en) * | 2019-06-19 | 2022-10-06 | 信越化学工業株式会社 | Thermal conductive composite silicone rubber sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB817074A (en) * | 1957-03-22 | 1959-07-22 | John Cockbain Briggs | Insulating material |
| JPS5588357A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Resin mold semiconductor device |
| JP2001212909A (en) * | 2000-02-01 | 2001-08-07 | Tokai Rubber Ind Ltd | Heat conductive rubber member, mounting pressure bonding sheet using the same and method for attaching film carrier |
| JP2002329989A (en) * | 2001-05-02 | 2002-11-15 | Shin Etsu Chem Co Ltd | Thermosoftening radiation sheet |
-
2003
- 2003-04-03 JP JP2003100416A patent/JP2004311577A/en active Pending
-
2004
- 2004-03-17 CN CN2004100300290A patent/CN100407415C/en not_active Expired - Fee Related
- 2004-04-02 KR KR1020040022783A patent/KR20040086802A/en not_active Application Discontinuation
- 2004-04-02 TW TW093109250A patent/TW200502288A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB817074A (en) * | 1957-03-22 | 1959-07-22 | John Cockbain Briggs | Insulating material |
| JPS5588357A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Resin mold semiconductor device |
| JP2001212909A (en) * | 2000-02-01 | 2001-08-07 | Tokai Rubber Ind Ltd | Heat conductive rubber member, mounting pressure bonding sheet using the same and method for attaching film carrier |
| JP2002329989A (en) * | 2001-05-02 | 2002-11-15 | Shin Etsu Chem Co Ltd | Thermosoftening radiation sheet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102384697A (en) * | 2010-07-05 | 2012-03-21 | 栗村化学株式会社 | Heat radiation tape and manufacturing method thereof |
| CN102384697B (en) * | 2010-07-05 | 2014-06-25 | 栗村化学株式会社 | Heat radiation tape and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1536653A (en) | 2004-10-13 |
| KR20040086802A (en) | 2004-10-12 |
| TW200502288A (en) | 2005-01-16 |
| JP2004311577A (en) | 2004-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100407415C (en) | Heat conduction composite chip and its mfg. method | |
| TWI278392B (en) | Thermally conductive composite sheet and manufacturing method thereof | |
| CN104015433B (en) | Heat conductivity is combined silicone rubber sheet | |
| CN102029752B (en) | thermal conductive silicone rubber composite sheet | |
| CN101544089B (en) | Heat-conductive laminated material and manufacturing method thereof | |
| JP6194861B2 (en) | Thermally conductive silicone composition and thermally conductive silicone molding | |
| JP3712943B2 (en) | Thermal softening heat dissipation sheet and heat dissipation sheet using the same | |
| JP6202475B2 (en) | Thermally conductive composite silicone rubber sheet | |
| TW200906975A (en) | Heat-conductive cured material and method for producing the same | |
| JP6314915B2 (en) | Heat dissipation putty sheet | |
| JP3928943B2 (en) | Heat dissipating member, manufacturing method thereof and laying method thereof | |
| EP3747953B1 (en) | Thermally conductive composition and thermally conductive molded body | |
| CN103507353A (en) | Thermal conduction sheet and electronic device | |
| TW201505852A (en) | Thermally conductive composite sheet and heat dissipation structure | |
| JP2012102264A (en) | Member for countermeasure against heat | |
| JP2000327917A (en) | Heat conductive and electrical insulating silicone composition | |
| JP2011016923A (en) | Thermally conductive silicone composition and thermally conductive silicone molding using the same | |
| CN109318561A (en) | A kind of soft or hard combination heat-conducting pad and preparation method thereof | |
| WO2021095507A1 (en) | Thermally conductive silicone composition, and thermally conductive silicone sheet | |
| JP4149846B2 (en) | Heat dissipation sheet | |
| US20040106717A1 (en) | Heat conductive silicone composition and shaped article | |
| JP2016219732A (en) | Thermal conducive composite silicone rubber sheet | |
| JP3762675B2 (en) | Thermal softening sheet | |
| JP5972731B2 (en) | Thermally conductive sheet | |
| TWI724156B (en) | Thermally conductive composite sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20140317 |