JP5386200B2 - Composite sheet - Google Patents

Description

  The present invention relates to a crimping process, which is one of the manufacturing processes of electronic devices, particularly flat panel displays (FPD), more specifically color TFT liquid crystal modules, color STN liquid crystal module plasma display panels (PDP), and organic electroluminescence display panels. It relates to the composite sheet used.

  Conventionally, in a manufacturing process of an electronic device, a crimping process as shown in FIGS. 1 to 3 is performed. Here, FIG. 1 is an overall view, FIG. 2 is an enlarged view of the A portion of FIG. 1 and shows a cross section, and FIG. 3 is an enlarged view of the B portion of FIG. . However, FIG. 1 shows a state before pressure bonding, and FIGS. 2 and 3 show a state after pressure bonding.

  Reference numeral 1 in the drawing indicates a glass substrate on which a first electrode 2 is formed. One end of a flexible printed circuit board (FPC) 3 is laminated on the end of the glass substrate 1 by thermocompression bonding. Here, the FPC 3 has a film 5 on which a driver IC 4 is formed, and a second electrode 6 formed on one side of the film 5. A heater 8 having a release sheet 7 at the lower end portion is disposed on the thermocompression-bonded portion between the glass substrate 1 and the FPC 3. The other end of the FPC 3 is laminated by thermocompression bonding with a printed circuit board (PCB) substrate 10 on which the third electrode 9 is formed at the end. A heater 12 having a release sheet 11 at the lower end is disposed on the portion to be thermocompression bonded between the PCB substrate 10 and the FPC 3. Reference numeral 13 denotes an anisotropic conductive film (ACF), and reference numeral 14 denotes a sealing material. Further, the thicknesses are set to be thinner in the order of the third electrode 9, the second electrode 6, and the first electrode 2.

  In the crimping process of FIG. 1, with the ACF 13 interposed between the first electrode 2 of the glass substrate 1 and the second electrode 6 of the FPC 3, the release sheet 7 is interposed between the FPC 3 on the ACF 13 and the heater 8. Then, the first electrode 2 of the glass substrate 1 and the second electrode 6 of the FPC 3 are electrically connected by thermocompression bonding with the heater 8. Further, in the state where the ACF 13 is interposed between the third electrode 9 of the PCB substrate 10 and the second electrode 6 of the FPC 3, heat is generated by the heater 12 via the release sheet 11 between the FPC 3 on the ACF 13 and the heater 12. The third electrode 9 of the PCB substrate 10 and the second electrode 6 of the FPC 3 are electrically connected by pressure bonding.

  By the way, the release sheets 7 and 11 used in the press-bonding process are required to have a release property with respect to the ACF 13 protruding during the press-bonding as well as a cushioning property for performing the uniform press-bonding. In particular, the B portion where the third electrode 9 of the PCB substrate is connected to the second electrode 6 of the FPC 3 is required to have a larger cushioning property than the release sheet for the glass substrate. Conventionally, various proposals and uses have been made of silicone rubber sheets, fluororesin films having releasability, or composite sheets of silicone rubber and fluororesin films.

  Conventionally, for example, Patent Document 1 has been proposed as a rubber composite sheet having the same purpose as the release sheet. This rubber composite sheet is composed of a resin film, a fluororesin layer formed on one surface (flexible substrate side) of the resin film, and a rubber layer formed on the other surface of the resin film. It has a structure that is strong and ensures releasability from the anisotropic conductive film.

  However, in recent years, in order to shorten the crimping cycle and improve the productivity, the ACF material is changed to the low temperature short time type, and it is required to maintain and improve the connection reliability. In addition, the crimping process using ACF is diverse in terms of applications, and it is difficult to say that even the proposed release sheet provides satisfactory release characteristics and repeated service life.

JP 2004-55687 A

  The present invention has been made in consideration of such circumstances, and has a structure including a heat-resistant resin film and a sheet made of a silicone rubber composition formed on both surfaces of the film, and the silicone rubber system of the sheet. It is an object of the present invention to provide a composite sheet having a long repetitive service life and good release characteristics suitable for a crimping process using various anisotropic conductive films by making the composition into a specific composition. To do.

The composite sheet of the present invention is a composite sheet used in a thermocompression bonding process, which is one of electronic device manufacturing processes, and a heat-resistant resin film and a silicone rubber composition formed on both surfaces of the heat-resistant resin film. The two sheets have different thicknesses, and the silicone rubber-based compositions of the two sheets are each in parts by weight of silica powder: 2 to 2 with respect to the silicone rubber 100. 100, carbon black: 0 to 200, magnesium oxide: 10 to 1000, iron oxide: 0 to 20, cerium oxide: 0.1 to 0.5.

  ADVANTAGE OF THE INVENTION According to this invention, the composite sheet which is suitable for the crimping | compression-bonding process which uses various anisotropic conductive films, has a long repeated use lifetime, and has a favorable mold release characteristic is obtained.

Explanatory drawing in the case of performing thermocompression bonding with the electrode terminal part of a circuit board, a glass substrate, and the electroconductive part of a PCB board | substrate using a release sheet. FIG. 3 is an X arrow view showing an enlarged main part of FIG. 1. FIG. 3 is an enlarged view of the main part of FIG. 1 is a schematic cross-sectional view of a composite sheet according to Example 1 of the present invention. Explanatory drawing of the test apparatus for testing the thickness reduction rate of the composite sheet of this invention. Explanatory drawing of the testing apparatus for testing the crimping | compression-bonding durability of the composite sheet of this invention. FIG. 10 is a schematic cross-sectional view of a composite sheet according to Example 9 of the present invention. FIG. 10 is a schematic cross-sectional view of a composite sheet according to Example 10 of the present invention.

Hereinafter, the present invention will be described in more detail.
In the present invention, examples of the heat-resistant resin film include a film made of a heat-resistant resin of any one of a polyimide resin, an aromatic polyamide resin, a polyether ether ketone resin, a polyether sulfone resin, and a polyphenylene sulfide resin. There is no particular limitation.

  In the present invention, the reason why the silica powder is 2 to 100 parts by weight with respect to 100 parts by weight of the silicone rubber is as follows. That is, when the silica powder is less than 2 parts by weight, the rubber hardness is lowered and the residual compressive strain is increased. On the other hand, when the silica powder exceeds 100 parts by weight, the rubber hardness becomes too high, the cushioning property is inferior, and the moldability is deteriorated.

  In the present invention, the carbon black is 0 to 200 parts by weight with respect to 100 parts by weight of the silicone rubber. When the carbon black exceeds 200 parts by weight, the electrical conductivity is not increased and the improvement of the antistatic property is small. This is because moldability deteriorates.

  In the present invention, the reason why the magnesium oxide is 10 to 1000 parts by weight with respect to 100 parts by weight of the silicone rubber is as follows. That is, when the magnesium oxide is less than 10 parts by weight, the heat conduction rate is low and it takes time to raise the temperature. On the other hand, if the magnesium oxide exceeds 1000 parts by weight, the heat conduction speed is not increased and the effect of increasing the filling amount cannot be obtained, and the moldability is deteriorated and the cured rubber becomes brittle.

  In the present invention, the amount of iron oxide is 0 to 20 parts by weight with respect to 100 parts by weight of the silicone rubber. If the amount exceeds 20 parts by weight, the low molecular weight of the silicone polymer under high temperature and pressure cannot be suppressed, and the residual compression This is because the distortion cannot be reduced.

  In the present invention, the reason why the cerium oxide is 0.1 to 0.5 parts by weight with respect to 100 parts by weight of the silicone rubber is as follows. That is, when the cerium oxide is less than 0.1 part by weight, the molecular weight of the silicone polymer is reduced under high temperature and pressure, and the residual compressive strain is large. On the other hand, if the cerium oxide exceeds 0.5 parts by weight, the molecular weight of the silicone polymer under high temperature and pressure cannot be suppressed, and the residual compressive strain cannot be reduced.

  In the present invention, the total thickness is preferably 0.01 to 5 mm. Here, when the total thickness is less than 0.01 mm, the service life is not satisfied due to insufficient strength, and when the total thickness exceeds 5 mm, the heat conduction speed is low and it takes a long time for pressure bonding.

  Hereinafter, the composite sheet according to each embodiment of the present invention will be described with reference to the drawings. In addition, the following Examples 1-8 are composite sheets used for the crimping | compression-bonding between the electrodes in A part of FIG. Moreover, the following Examples 9 and 10 relate to a composite sheet used for pressure bonding between electrodes at a portion B in FIG.

Example 1
Please refer to FIG.
Reference numeral 21 in the figure indicates a heat-resistant resin film (polyimide film) made of polyimide and having a thickness of 50 μm. On both surfaces of the polyimide film 21, uneven surfaces 21a and 21b roughened by corona discharge treatment are formed. Black sheets 22a and 22b made of a silicone rubber composition are formed on both surfaces of the polyimide film 21 on which the uneven surfaces 21a and 21b are formed. Here, the sheets 22a and 22b are composed of 100 parts by weight of organopolysiloxane (silicone rubber), 12 parts by weight of silica powder, 42 parts by weight of carbon black, 260 parts by weight of magnesium oxide, 2 parts by weight of iron oxide and 0.1% of cerium oxide. It is formed by laminating, drying and curing a silicone composition obtained by uniformly mixing parts by weight.

Next, the manufacturing method of the composite sheet of FIG. 4 will be described.
(1) First, a polyimide film having a thickness of 50 μm was used as a base material. This polyimide film was coated on both sides using a polyalkoxysilane, platinum compound, and tetraethoxysilane dissolved in n-hexane as a primer, and dried at room temperature for 10 minutes. The basis weight at this time was 2.0 g / m ² on one side. Separately, 100 parts by weight of organopolysiloxane, 12 parts by weight of silica powder, 42 parts by weight of carbon black, 260 parts by weight of magnesium oxide, 2 parts by weight of iron oxide and 0.1 part by weight of cerium oxide were mixed in a kneader. By uniformly mixing, a silicone rubber composition was obtained.

  (2) Next, the silicone rubber composition was dissolved in a toluene solvent, and a platinum vulcanizing agent was further added to prepare a rubber paste. Subsequently, the rubber paste was coated on one side of a 50 μm-thick polyimide film subjected to the primer treatment, and then vulcanized at 170 ° C. for 10 minutes in a hot air vulcanization furnace. Subsequently, this treatment was repeated on the other surface of the polyimide film, so that the upper and lower surfaces were symmetrical with the polyimide core material in the middle. Furthermore, secondary vulcanization was carried out by treating in a hot air drying oven at 200 ° C. for 4 hours to obtain a composite sheet coated with a silicone rubber composition having a total thickness of 200 μm.

  According to Example 1, a composite sheet is composed of a polyimide film 21 having uneven surfaces 21a and 21b and sheets 22a and 22b formed on both surfaces of the polyimide film 21 and made of a silicone rubber composition having a predetermined composition. 23 is configured. Therefore, the composite sheet 23 of the present invention has a long repeated use life and good release characteristics suitable for the crimping process using various anisotropic conductive films.

  In fact, the thickness reduction rate (%) of the composite sheet was tested using a testing machine as shown in FIG. This test was performed by placing the composite sheet 32 on the heater lower plate 31, pressing the composite sheet 32 with the heated heater upper plate 33, and measuring the rate of thickness reduction of the composite sheet 32. Moreover, the test of the crimping durability of the composite sheet was performed using a testing machine as shown in FIG. In this test, a composite sheet 32 is placed on a heated heater lower plate 31 through a printed board 34a, an anisotropic conductive film 35, and a copper vapor-deposited polyimide film 34b having no pattern designed in this order. Was performed by pressing with a heated heater upper plate 33.

The thickness reduction rate was determined as follows: press pressure: 4 MPa, heater upper panel temperature: 300 ° C., heater lower panel temperature: room temperature, press holding time: 10 sec, press interval: 5 sec, number of presses: 80 times.
Bonding durability is as follows: press pressure: 3 MPa, heater upper panel temperature: 280 ° C., heater lower panel temperature: 45 ° C., press holding time: 15 sec, number of presses: 20, 40, 60, 80 times (after each press number of ACF The crimping state was determined as (confirmed by conduction after the crimping test).

(Examples 2-8 and Comparative Examples 1-3)
A composite sheet was obtained in the same manner as in Example 1 except that the blending ratio of the components of the raw material composition was changed. However, no polyimide film is used for Comparative Example 3.
Table 1 below shows the composition of the raw material compositions of Examples 1 to 8 and Comparative Examples 1 to 3, thickness reduction rate, rate of temperature increase, antistatic property, molding processability and pressurization durability (20 times and 40 times, respectively). , 60 times, 80 times). However, in Table 1, the heating rate, antistatic property, molding processability, and crimping durability are best for double circles, good for single circles, normal for triangles, and poor for poor ones. Is represented by a cross. In Table 1, the thicknesses of the sheets 22a and 22b of Examples 1 to 8 and Comparative Examples 1 and 2 are each 75 μm, and the thickness of the rubber layer of Comparative Example 3 is 200 μm.

  The consideration about the composite sheet | seat of Examples 1-8 based on the said Table 1 and Comparative Examples 1-3 is as follows.

In the case of Example 1, the temperature rising speed, antistatic property, molding processability, and crimping durability as properties are set in a well-balanced manner and satisfy the properties required for the thermocompression bonding sheet used for ACF crimping. Was confirmed.
In the case of Example 2, the rate of temperature increase is low thermal conduction and the pressure bonding time is shortened, and the antistatic property prevents charging although it has low conductivity. However, the strength of the coating layer made of the silicone rubber composition was reduced, and it was confirmed that the pressure bonding durability was poor.

In the case of Example 3, the rate of temperature increase is weak heat conduction, the shortening of the pressure bonding time is insufficient, and the antistatic property is high and good. Further, a slight decrease in strength was observed in the coating layer made of the silicone rubber composition, and it was confirmed that the pressure bonding durability was insufficient.
In the case of Example 4, the temperature rising rate is low thermal conductivity and the press-bonding time is shortened, and the antistatic property is high conductivity and very good. However, it was confirmed that the coating layer made of the silicone rubber composition had a slight decrease in strength, and the crimping durability was insufficient.

In the case of Example 5, the rate of temperature increase is medium heat conduction, the pressure bonding time is shortened well, and the antistatic property is extremely high and highly conductive. However, it was confirmed that the coating layer made of the silicone rubber composition had a slight decrease in strength and that the durability against pressure bonding was slightly insufficient.
In the case of Example 6, the rate of temperature increase is medium heat conduction, and the pressure bonding time is shortened very well, and the antistatic property is low conductivity but prevents charging. In addition, it was confirmed that the coating layer made of the silicone rubber composition did not show a decrease in strength and had sufficient crimp durability.

In the case of Example 7, the rate of temperature rise is high heat conduction, the pressure-bonding time is shortened very well, and the antistatic property is low because of low conductivity. In addition, it was confirmed that the coating layer made of the silicone rubber composition did not show a decrease in strength and had sufficient crimp durability.
In the case of Example 8, the rate of temperature rise is high heat conduction, the pressure bonding time is shortened very well, and the antistatic property is very conductive and very good. However, the coating layer made of the silicone rubber composition shows a decrease in strength, and the pressure bonding durability is insufficient. Although there was no hindrance in moldability, it was confirmed that the composite sheet lacks flexibility and uncertainties remain in sound ACF pressure bonding because of the large amount of components.

In the case of Comparative Example 1, the rate of temperature increase is weak heat conduction, the shortening of the pressure bonding time is insufficient, and the antistatic property is weakly antistatic because it is weakly conductive. Moreover, since the strength of the coating layer made of the silicone rubber composition was significantly reduced, it was confirmed that the amount of deformation was large and repeated pressing could not be performed.
In the case of Comparative Example 2, it was confirmed that the compounding amount was large as the moldability and the molding was impossible.
In the case of Comparative Example 3, the rate of temperature increase is high heat conduction, and the pressure-bonding time is shortened very well, and the antistatic property is highly conductive and very good. However, since the strength of the coating layer made of the silicone rubber composition was remarkably reduced, it was confirmed that the amount of deformation was large and repeated pressing could not be performed.

Example 9
Please refer to FIG. In the case of the composite sheet of Example 9 and Example 10 to be described later, since it is assumed that the FPC terminal portion has a large unevenness, the first and second sheets are sufficiently thick. ing. Here, in FIG. 7, the composite sheet is set so that the first sheet 42a is on the ACF side and the second sheet 42b is on the heater side.

  Reference numeral 41 in the figure indicates a heat-resistant resin film (polyimide film) made of polyimide and having a thickness of 25 μm. On both surfaces of the polyimide film 41, concave and convex surfaces 41a and 41b having a surface roughness (Ra) of 1.4 roughened by corona discharge treatment are formed. A black first sheet (thickness 210 μm) 42a made of a silicone rubber composition and a gray second sheet made of a silicone rubber composition are formed on both surfaces of the polyimide film 41 on which the uneven surfaces 41a and 41b are formed. (Thickness 115 μm) 42b is formed.

Here, the first sheet 42a is composed of 100 parts by weight of organopolysiloxane (silicone rubber) having an average degree of polymerization of 4000, 12 parts by weight of silica powder, 42 parts by weight of carbon black, 262 parts by weight of magnesium oxide, and 2 parts by weight of iron oxide. In addition, a silicone composition obtained by uniformly mixing 0.1 parts by weight of cerium oxide is laminated, dried and cured. The second sheet 42b has 31 parts by weight of silica powder, 698 parts by weight of magnesium oxide, 6 parts by weight of iron oxide and 0.1 part by weight of cerium oxide in 100 parts by weight of organopolysiloxane (silicone rubber) having an average degree of polymerization of 3700. It is formed by laminating, drying and curing a silicone composition that is uniformly mixed. Table 2 below shows the blending ratio of each raw material in Example 9 and Example 10 to be described later, the thicknesses of the first and second sheets, the rate of decrease in thickness, the rate of temperature rise, the antistatic property, the molding processability, and the crimping durability. The results of investigation on (20 times, 40 times, 60 times, 80 times, respectively) are shown. However, in Table 2, the best temperature rise rate, antistatic property, moldability and crimping durability are double circles for the best, single circles for the good, triangles for the normal ones, and poor ones for the normal ones. Is represented by a cross.

Next, the manufacturing method of the composite sheet 43 of FIG. 7 is demonstrated.
(1) First, a polyimide film having a thickness of 25 μm was used as a substrate. Further, 12 parts by weight of silica powder, 42 parts by weight of carbon black, 262 parts by weight of magnesium oxide, 2 parts by weight of iron oxide and 0.1 part by weight of cerium oxide are uniformly mixed with 100 parts by weight of organopolysiloxane using a kneader. Thus, a silicone rubber composition was obtained.

(2) Next, the silicone rubber composition was dissolved in a toluene solvent, and a platinum vulcanizing agent was further added to prepare a rubber paste. Subsequently, the rubber paste was coated on one side of a 25 μm-thick polyimide film subjected to the primer treatment, and then vulcanized at 170 ° C. for 10 minutes in a hot air vulcanization furnace. Subsequently, this process was repeated on the other surface of the polyimide film to obtain a double-sided structure with the polyimide core material in the middle. Further, secondary vulcanization was carried out by treating in a hot air drying oven at 200 ° C. for 4 hours to obtain a composite sheet 43 covered with a silicone rubber composition having a total thickness of 350 μm.
According to Example 9, each of the polyimide film 41 having the uneven surfaces 41a and 41b and the silicone rubber composition having a predetermined composition formed on one surface of the polyimide film 41 has a thickness of 210 μm. The composite sheet 43 is composed of a first sheet 42a and a second sheet 42b formed on the other surface of the polyimide film 41 and made of a silicone rubber composition having a predetermined composition and having a thickness of 115 μm. . Therefore, the composite sheet 43 of the present invention has the effects described below in addition to the same effects as those of the first embodiment.

  That is, the degree of cushioning required for the composite sheet varies depending on the application. For example, for applications that require cushioning, it is necessary to increase the thickness of the sheet. Here, if the thickness of the first and second sheets on both sides is increased, cushioning can be imparted. , The thermal conductivity is impaired. Therefore, by increasing the thickness of the first sheet 42a in contact with the workpiece (flexible substrate) and decreasing the thickness of the second sheet 42b, cushioning can be imparted without impairing thermal conductivity. In the case of Example 9, since the thickness of the first sheet 42a is 210 μm and the thickness of the second sheet 42b is 115 μm, the cushioning property can be imparted without impairing the thermal conductivity of the composite sheet 43. it can. In the composite sheet 43 of FIG. 5, the first sheet 42 a is necessary for functional expression, and the second sheet 42 b is necessary for preventing warpage.

Moreover, when the same color sheet is formed on both surfaces of the polyimide film, the front and back of the composite sheet 43 cannot be visually recognized. Therefore, in the case of Example 9, the color of the first sheet 42a is black and the color of the second sheet 42b is gray, so that the front and back of the composite sheet 43 can be easily identified. Furthermore, since the thickness of the polyimide film is 25 μm, the thermal conductivity can be improved as compared with Example 1.
As described above, the composite sheet of Example 9 improves the rate of temperature rise, and the antistatic property, molding processability, and crimping durability are set in a well-balanced manner, and more cushioning is required than in Example 1. Suitable for applications.

(Example 10)
Please refer to FIG. However, the same members as those of FIG.
As shown in Table 2 above, the first sheet 52a has a thickness of 150 μm and is black, and the second sheet 52b has the same thickness and color as the first sheet 52a. Accordingly, the blending ratio of the first sheet 51a and the second sheet 52b is the same. Further, the manufacturing method of the composite sheet 53 according to the tenth embodiment is the same as that in the ninth embodiment.

  According to Example 10, the rate of temperature rise is improved, and antistatic property, molding processability, and crimping durability are set in a well-balanced manner, and the thickness reduction rate and thermal conductivity are slightly improved as compared with Example 1. A composite sheet is obtained.

Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine the component covering different embodiment suitably.
The invention described in the original claims is appended below.
[1]
In the composite sheet used in the thermocompression bonding process, which is one of the manufacturing processes of electronic devices,
A sheet comprising a heat-resistant resin film and a silicone rubber-based composition formed on both surfaces of the heat-resistant resin film;
The silicone rubber composition of the sheet is in parts by weight, with respect to the silicone rubber 100, silica powder: 2 to 100, carbon black: 0 to 200, magnesium oxide: 10 to 1000, iron oxide: 0 to 20, cerium oxide. : A composite sheet comprising 0.1 to 0.5.
[2]
[1] The composite sheet according to [1], wherein the heat-resistant resin film is made of any one of a heat-resistant resin selected from a polyimide resin, an aromatic polyamide resin, a polyether ether ketone resin, a polyether sulfone resin, and a polyphenylene sulfide resin. .
[3]
The composite sheet according to [1] or [2], wherein the total thickness is 0.01 to 5 mm.

  21, 41 ... polyimide film (heat-resistant resin film), 21 a, 21 b, 41 a, 41 b ... uneven surface, 22 a, 22 b ... sheet made of silicone rubber composition, 31 ... heater lower plate, 23, 32, 43, 53 ... Composite sheet, 33 ... Heater upper board, 34a ... Printed circuit board, 34b ... Copper-deposited polyimide film without pattern design, 35 ... Anisotropic conductive film, 42a, 52a ... First sheet, 42b, 52b ... Second Sheet.

Claims (5)

In the composite sheet used in the thermocompression bonding process, which is one of the manufacturing processes of electronic devices,
A heat-resistant resin film, and two sheets made of a silicone rubber-based composition formed on both surfaces of the heat-resistant resin film,
The thicknesses of the two sheets are different from each other,
Each of the silicone rubber compositions of the two sheets is, by weight, silica powder: 2 to 100, carbon black: 0 to 200, magnesium oxide: 10 to 1000, iron oxide: 0 to 0 with respect to the silicone rubber 100. 20. A composite sheet comprising cerium oxide: 0.1 to 0.5. The composite sheet according to claim 1, wherein the two sheets have different compositions. One of the two sheets of the silicone rubber-based composition is by weight, with respect to the silicone rubber 100, silica powder: 12, carbon black: 42, magnesium oxide: 262, iron oxide: 2, cerium oxide: 0.1. Including
The other of the silicone rubber compositions of the two sheets is in parts by weight, with respect to the silicone rubber 100, silica powder: 31, carbon black: 0, magnesium oxide: 698, iron oxide: 6, cerium oxide: 0.1. The composite sheet according to claim 2, comprising: Heat-resistant resin film, any polyimide resin, aromatic polyamide resin, polyether ether ketone resins, polyether sulfone resins, claim 1, characterized in that it consists of one of the heat-resistant resin of the polyphenylene sulfide resin of 3 A composite sheet according to claim 1 . The composite sheet according to any one of claims 1 to 4, wherein the total thickness is 0.01 to 5 mm.

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