CN101570074A - Composite sheet - Google Patents
Composite sheet Download PDFInfo
- Publication number
- CN101570074A CN101570074A CNA2009101388333A CN200910138833A CN101570074A CN 101570074 A CN101570074 A CN 101570074A CN A2009101388333 A CNA2009101388333 A CN A2009101388333A CN 200910138833 A CN200910138833 A CN 200910138833A CN 101570074 A CN101570074 A CN 101570074A
- Authority
- CN
- China
- Prior art keywords
- composite sheet
- crimping
- weight portion
- sheet
- resistant resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A composite sheet used in the thermal pressing step as one step in the electronic equipment manufacturing process is characterized by including a heat resistant resin film and sheets formed on both sides of the heat resistant resin film and made from the silicon rubber composite. The silicon rubber composite includes 2-100 weight parts of silica powder, 0-200 weight parts of carbon blacks, 10-1000 weight parts of magnesia, 0-20 weight parts of ferric oxide, 0.1-0.5 weight parts of cerium oxide.
Description
Technical field
The present invention relates to as electronic equipment, flat-panel monitor (FPD) particularly more specifically is an employed composite sheet in the crimping process of one of manufacturing process of colored TFT Liquid Crystal Module or colored stn liquid crystal module plasma display (PDP), organic field emission display floater.
Background technology
At present, in the manufacturing process of electronic equipment, implement as Fig. 1～crimping process shown in Figure 3.Here, Fig. 1 is an overall diagram, Fig. 2 for the X of the section of the A part of amplifying presentation graphs 1 to view, Fig. 3 for the Y of the section of the B part of amplifying presentation graphs 1 to view.Wherein, Fig. 1 represents the state before the crimping, the state after Fig. 2, the 3 expression crimping.
Label 1 among the figure is illustrated in the glass substrate that top is formed with first electrode 2.One side end of flexible printed board (FPC) 3 is laminated in the end of described glass substrate 1 by thermo-compressed.Here, FPC3 comprises film 5 that is formed with drive IC 4 and second electrode 6 that is formed at a side of this film 5.The heater 8 that possesses release sheet 7 in the bottom is disposed on the thermo-compressed reservations of described glass substrate 1 and FPC3.The end side of FPC3 is stacked with PCB (printed circuit board (PCB), the printed circuit board) substrate 10 that is formed with third electrode 9 in the end by thermo-compressed.The heater 12 that possesses release sheet 11 in the bottom is disposed on the thermo-compressed reservations of PCB substrate 10 and FPC3.Also have label 13 expression anisotropic conductive film (ACF), label 14 expression encapsulants.In addition, the thickness setting of third electrode 9, second electrode 6, first electrode 2 is for reducing successively.
In the crimping process of Fig. 1, make ACF13 under the state of 6 at second electrode of first electrode 2 of glass substrate 1 and FPC3, make release sheet 7 between FPC3 on the ACF13 and heater 8, with heater 8 thermo-compressed, thereby carry out the electrical connection of second electrode 6 of first electrode 2 of glass substrate 1 and FPC3.In addition, make ACF13 under the state of 6 at second electrode of the third electrode 9 of PCB substrate 10 and FPC3, make release sheet 11 between FPC3 on the ACF13 and heater 12, with heater 12 thermo-compressed, thereby carry out the electrical connection of second electrode 6 of the third electrode 9 of PCB substrate 10 and FPC3.
In addition, for employed release sheet 7,11 in the crimping process, require to be used to the carrying out resiliency of uniform crimping and the release property of the ACF13 that exposes during for crimping.Particularly at the position that is connected (B part) of second electrode 6 of third electrode 9 that carries out PCB substrate 10 and FPC3, the release sheet that requires to use than glass substrate has bigger resiliency.In the past, proposed and adopted silicone rubber plate, have the fluororesin film of release property or the various materials such as composite sheet of silicon rubber and fluororesin film.
In the past, as the rubber composite sheet that has with the same purpose of above-mentioned release sheet, for example proposing had the Japan Patent spy to open the technical scheme of 2004-55687 communique.This rubber composite sheet is made of resin molding, the fluororesin layer of one side (flexible base, board side) that is formed at this resin molding and the rubber layer that is formed at the another side of this resin molding, deformability is strong, and has the formation that is used to guarantee with the release property of anisotropic conductive film.
Yet, in recent years, productivity is improved, the material of ACF turns to low temperature short time type, requires keeping and improving of connection reliability.In addition, use the crimping process of ACF that multiple use is also arranged, even the release sheet that is proposed at present also is difficult to provide gratifying stripping feature and reuses the life-span.
Summary of the invention
The objective of the invention is to comprise heat-resistant resin film and be formed at the constituting of the sheet that forms by the silicone rubber kinds composition on the two sides of this film by employing, and making described silicone rubber kinds composition is specific composition, thereby crimping process, repeated use life-span length that is suitable for various use anisotropic conductive film and the composite sheet with good stripping feature are provided.
If employing the present invention then can obtain to be suitable for the crimping process of various use anisotropic conductive film, the composite sheet that good stripping feature is grown and had to the repeated use life-span.
Description of drawings
Fig. 1 is to use release sheet to carry out the key diagram of situation of thermo-compressed of the conductive part of the electrode terminal section of circuit substrate and glass substrate, PCB substrate.
Fig. 2 amplifies the X of major part of presentation graphs 1 to view.
Fig. 3 amplifies the Y of major part of presentation graphs 1 to view.
Fig. 4 is the simple cutaway view of the composite sheet of the 1st kind of embodiment of the present invention.
Fig. 5 is the key diagram of experimental rig that is used to test the thickness slip of composite sheet of the present invention.
Fig. 6 is the key diagram of experimental rig that is used to test the crimping durability of composite sheet of the present invention.
Fig. 7 is the simple cutaway view of the composite sheet of the 9th kind of embodiment of the present invention.
Fig. 8 is the simple cutaway view of the composite sheet of the 10th kind of embodiment of the present invention.
The specific embodiment
Composite sheet of the present invention is an employed composite sheet in as the thermo-compressed operation of one of manufacturing process of electronic equipment, it is characterized in that, comprise heat-resistant resin film and be formed at the sheet that is formed by the silicone rubber kinds composition on the two sides of this heat-resistant resin film, described silicone rubber kinds composition comprises 2～100 parts of SiO 2 powders, 0～200 part of carbon black, 10～1000 parts of magnesia, 0～20 part of iron oxide, 0.1～0.5 part of cerium oxide in weight portion with respect to 100 parts of silicon rubber.
Among the present invention,, can exemplify the film that forms by any heat-resistant resin in polyimides, aromatic polyamide resin, polyether-ether-ketone resin, polyethersulfone resin, the poly-p-phenylene sulfide resin, be not particularly limited as described heat-resistant resin film.
Among the present invention, adopt 2～100 weight portion SiO 2 powders to be based on following reason with respect to 100 weight portion silicon rubber.That is, during SiO 2 powder less than 2 weight portions, rubber hardness is low, and permanent compression set is big.In addition, if SiO 2 powder surpasses 100 weight portions, then too high the and resiliency difference of rubber hardness the time, formability worsens.
Among the present invention, adopt the reason of 0～200 weight portion carbon black to be with respect to 100 weight portion silicon rubber, if carbon black surpasses 200 weight portions, when then not high and raising antistatic characteristic of electrical conductivity was few, formability worsened.
Among the present invention, adopt 10～1000 weight portion magnesia to be based on following reason with respect to 100 weight portion silicon rubber.That is, during magnesia less than 10 weight portions, heat conduction velocity is low, and intensification expends time in.In addition, if magnesia surpasses 1000 weight portions, then heat conduction velocity is high and when can't obtain increase corresponding effects with loading, formability worsens, and the rubber after the curing becomes fragile.
Among the present invention, adopt the reason of 0～20 weight portion iron oxide to be,, then can't suppress the low-molecular-weightization of the siloxane polymer under the high-temperature pressurizing, can't reduce permanent compression set if surpass 20 weight portions with respect to 100 weight portion silicon rubber.
Among the present invention, adopt 0.1～0.5 weight portion cerium oxide to be based on following reason with respect to 100 weight portion silicon rubber.That is, during cerium oxide less than 0.1 weight portion, the low-molecular-weightization of the siloxane polymer under the high-temperature pressurizing takes place, permanent compression set is big.In addition,, then can't suppress the low-molecular-weightization of the siloxane polymer under the high-temperature pressurizing, can't reduce permanent compression set if cerium oxide surpasses 0.5 weight portion.
Among the present invention, gross thickness better is 0.01～5mm.Here, during gross thickness deficiency 0.01mm, because undercapacity can't satisfy service life; If gross thickness surpasses 5mm, then heat conduction velocity is low, and crimping expends time in.
Below, with reference to accompanying drawing, the composite sheet of various embodiments of the present invention is described.Also have, following the 1st～8 kind of embodiment is the composite sheet that is used for the interelectrode crimping that the A of Fig. 1 partly locates.In addition, following the 9th, 10 kind of embodiment is the composite sheet that is used for the interelectrode crimping that the B of Fig. 1 partly locates.
(the 1st kind of embodiment)
With reference to Fig. 4.
The heat-resistant resin film (polyimide film) of the thick 50 μ m that label 21 expression among the figure is formed by polyimides.By Corona discharge Treatment the asperities change male and fomale(M﹠F) 21a, 21b is formed at the two sides of described polyimide film 21 respectively.The sheet 22a of the black that is formed by the silicone rubber kinds composition, 22b is formed at respectively and is formed with male and fomale(M﹠F) 21a, the two sides of the polyimide film 21 of 21b.Here, sheet 22a, 22b be the type siloxane composition is stacked, dry, be solidified to form, described type siloxane composition is to mix 12 weight portion SiO 2 powders, 42 weight portion carbon blacks, 260 weight portion magnesia, 2 weight portion iron oxide and 0.1 weight portion cerium oxide equably to form in 100 weight portion organopolysiloxanes (silicon rubber).
Below, the manufacture method of the composite sheet of Fig. 4 is described.
(1) at first, as base material, use the polyimide film of thick 50 μ m.For this polyimide film, use polyalkoxysilane, platinum compounds, tetraethoxysilane be dissolved in n-hexane and material be coated on the two sides as primer, at room temperature dry 10 minutes.At this moment weight per unit area is 2.0g/m
2In addition, in 100 weight portion organopolysiloxanes, mix 12 weight portion SiO 2 powders, 42 weight portion carbon blacks, 260 weight portion magnesia, 2 weight portion iron oxide and 0.1 weight portion cerium oxide equably by kneader, thereby obtain the silicone rubber kinds composition.
(2) then, described silicone rubber kinds composition dissolves in toluene solvant, is added the platinum vulcanizing agent again, make the rubber thickener.Then, after the one side of the polyimide film of having implemented the thick 50 μ m that described primary coat handles applies described rubber thickener, by the hot-air cure stove 170 ℃ of sulfurations 10 minutes down.Then, also repeat this processing, thereby be the core top and bottom symmetrical structure of polyimides in the middle of forming at the another side of polyimide film.Then, carried out post-cure in 4 hours by handling with 200 ℃ hot-air drying stove, obtaining gross thickness is the composite sheet of the rubber composition lining of 200 μ m.
If adopt the 1st kind of embodiment, then by having male and fomale(M﹠F) 21a, the polyimide film 21 of 21b and be formed at this polyimide film 21 the two sides by having the sheet 22a that silicone rubber kinds composition that regulation forms forms, 22b constitutes composite sheet 23.Therefore, composite sheet 23 of the present invention is suitable for the crimping process of various use anisotropic conductive film, and it is long to reuse the life-span, and has good stripping feature.
Reality uses testing machine as shown in Figure 5 to carry out the test of the thickness slip (%) of above-mentioned composite sheet.This test is following to be carried out: carrying composite sheet 32 on heater lower wall 31, pressurize with 33 pairs of these composite sheets 32 of dish on the warmed-up heater, and measure the ratio of the thickness minimizing of composite sheet 32.In addition, use testing machine as shown in Figure 6 to carry out the test of the crimping durability of above-mentioned composite sheet.This test is following to be carried out: be situated between successively with printed base plate 34a on warmed-up heater lower wall 31, anisotropic conductive film 35, the copper evaporation polyimide film 34b carrying composite sheet 32 of layout are pressurizeed by 33 pairs of these composite sheets 32 of dish on the warmed-up heater.
The thickness slip coils temperature with moulding pressure: 4MPa on the heater: 300 ℃, heater lower wall temperature: normal temperature, the pressurization retention time: 10 seconds, the pressurization interval: 5 seconds, the pressurization number of times: 80 times condition was tried to achieve.
The crimping durability is with moulding pressure: 3MPa, coil temperature on the heater: 280 ℃, heater lower wall temperature: 45 ℃, the pressurization retention time: 15 seconds, the pressurization number of times: the condition of 20,40,60,80 times (confirming the crimped status of ACF behind the number of times that respectively pressurizes by the conducting after the crimping test) was tried to achieve.
(the 2nd～8 kind embodiment and comparative example 1～3)
Except the composition proportion that changes the raw material combination thing, by obtaining composite sheet with above-mentioned the 1st kind of operation that embodiment is same.But comparative example 3 does not use polyimide film.
Following table 1 expression is for the investigation result of composition, thickness slip, programming rate, static electricity resistance, shaping processability and the crimping durability (20,40,60,80 times respectively) of the raw material combination thing of embodiment 1～8 and comparative example 1～3.In the table 1, for programming rate, static electricity resistance, shaping processability and crimping durability, best represents with concentric circles, and good represents with circle, and common represents with triangle, and bad represents with fork.Also have, in the table 1, the sheet 22a of embodiment 1～8 and comparative example 1,2, the thickness of 22b is respectively 75 μ m, and the thickness of the rubber layer of comparative example 3 is 200 μ m.
The investigation for the composite sheet of embodiment 1～8 and comparative example 1～3 based on above-mentioned table 1 is as follows.
Under the situation of the 1st kind of embodiment, can confirm that programming rate, static electricity resistance, shaping processability, the crimping durability as characteristic balancedly set, satisfy the desired characteristic of thermo-compressed sheet material of the crimping that is used for ACF.
Under the situation of the 2nd kind of embodiment, programming rate aspect, low heat conduction and shortening crimping time; The static electricity resistance aspect though electric conductivity is low, prevents static.But discovery is descended by the intensity of the coating that rubber composition forms, and can confirm to lack the crimping durability.
Under the situation of the 3rd kind of embodiment, programming rate aspect, the shortening deficiency of weak heat conduction and crimping time; The static electricity resistance aspect, high conduction and good.In addition, occur intensity slightly at the coating that forms by rubber composition and descend, can confirm crimping durability deficiency.
Under the situation of the 4th kind of embodiment, programming rate aspect, low heat conduction and shortening crimping time; The static electricity resistance aspect, high conduction and very good.But, occur intensity slightly at the coating that forms by rubber composition and descend, can confirm that the crimping durability is also not enough.
Under the situation of the 5th kind of embodiment, programming rate aspect, middle heat conduction and shorten the crimping time well; The static electricity resistance aspect, high conduction and very good.But, occur intensity slightly at the coating that forms by rubber composition and descend, can confirm that the crimping durability also has deficiency slightly.
Under the situation of the 6th kind of embodiment, programming rate aspect, middle heat conduction and shorten the crimping time very well; The static electricity resistance aspect though electric conductivity is low, prevents static.In addition, do not find that at the coating that forms by rubber composition intensity descends, and can confirm that the crimping durability is also abundant.
Under the situation of the 7th kind of embodiment, programming rate aspect, high heat conduction and shorten the crimping time very well; The static electricity resistance aspect, because of the low antistatic of electric conductivity bad.In addition, do not find that at the coating that forms by rubber composition intensity descends, and can confirm that the crimping durability is also abundant.
Under the situation of the 8th kind of embodiment, programming rate aspect, high heat conduction and shorten the crimping time very well; The static electricity resistance aspect is because of high conductivity and very good.But, find that at the coating that forms by rubber composition intensity descends, the crimping durability is also not enough.Also have, though formability is not produced obstacle, because the composition incorporation is many, so composite sheet shortage flexibility, can confirm residual uncertainty in perfect ACF crimping.
Under the situation of comparative example 1, programming rate aspect, the shortening deficiency of weak heat conduction and crimping time; The static electricity resistance aspect, because of antistatic a little less than the electric conductivity bad.In addition, the intensity of the coating that is formed by rubber composition significantly descends, so deflection is big, can confirm to carry out crimping repeatedly.
Under the situation of comparative example 2,, can confirm that the composition incorporation is many and can't be shaped as shaping processability.
Under the situation of comparative example 3, programming rate aspect, high heat conduction and shorten the crimping time very well; The static electricity resistance aspect, high conduction and very good.But the intensity of the coating that is formed by rubber composition significantly descends, so deflection is big, can confirm to carry out crimping repeatedly.
(the 9th kind of embodiment)
With reference to Fig. 7.Also have, under the situation of the composite sheet of the 9th kind of embodiment and the 10th kind of embodiment described later, because supposition uses in the concavo-convex big purposes of the terminal part of FPC, so first and second thickness forms enough thick.Here, among Fig. 7, composite sheet is provided with in the mode of heater side at ACF side, second 42b with first 42a.
The heat-resistant resin film (polyimide film) of the thick 25 μ m that label 41 expression among the figure is formed by polyimides.Be formed with asperities change respectively by Corona discharge Treatment on the two sides of this polyimide film 41 surface roughness (Ra) be 1.4 male and fomale(M﹠F) 41a, 41b.Be formed with male and fomale(M﹠F) 41a, second (thick 115 μ m) 42b of the grey that the two sides of the polyimide film 41 of 41b forms first (thick 210 μ m) 42a of the black that is formed by the silicone rubber kinds composition respectively, formed by the silicone rubber kinds composition.
Here, first 42a be the type siloxane composition is stacked, dry, be solidified to form, described type siloxane composition is to mix 12 weight portion SiO 2 powders, 42 weight portion carbon blacks, 262 weight portion magnesia, 2 weight portion iron oxide and 0.1 weight portion cerium oxide equably to form in the organopolysiloxane (silicon rubber) of 100 weight portion averages degree of polymerization 4000.Second 42b be the type siloxane composition is stacked, dry, be solidified to form, described type siloxane composition is to mix 31 weight portion SiO 2 powders, 698 weight portion magnesia, 6 weight portion iron oxide and 0.1 weight portion cerium oxide equably to form in the organopolysiloxane (silicon rubber) of 100 weight portion averages degree of polymerization 3700.The expression of following table 2 is for the investigation result of each proportion of raw materials in the 9th kind of embodiment and the 10th kind of embodiment described later, first and second thickness, thickness slip, programming rate, static electricity resistance, shaping processability and crimping durability (20,40,60,80 times respectively).In the table 2, for programming rate, static electricity resistance, shaping processability and crimping durability, best represents with concentric circles, and good represents with circle, and common represents with triangle, and bad represents with fork.
(table 2)
In the programming rate, ◎: expression high-termal conductivity and shorten the situation of crimping time very well.
In the static electricity resistance, ◎: expression high conductivity and prevent static very well, zero: electric conductivity and prevent static well in the expression.
In the shaping processability, zero: expression is shaped good.
In the crimping durability, zero: the expression conducting is good.
Below, the manufacture method of the composite sheet 43 of Fig. 7 is described.
(1) at first, as base material, use the polyimide film of thick 25 μ m.In addition, in 100 weight portion organopolysiloxanes, mix 12 weight portion SiO 2 powders, 42 weight portion carbon blacks, 262 weight portion magnesia, 2 weight portion iron oxide and 0.1 weight portion cerium oxide equably by kneader, thereby obtain the silicone rubber kinds composition.
(2) then, described silicone rubber kinds composition dissolves in toluene solvant, is added the platinum vulcanizing agent again, make the rubber thickener.Then, after the one side of the polyimide film of having implemented the thick 25 μ m that described primary coat handles applies described rubber thickener, by the hot-air cure stove 170 ℃ of sulfurations 10 minutes down.Then, also repeat this processing, thereby be the bilateral structure of the core of polyimides in the middle of forming at the another side of polyimide film.Then, carried out post-cure in 4 hours by handling with 200 ℃ hot-air drying stove, obtaining gross thickness is the composite sheet 43 of the rubber composition lining of 350 μ m.
If adopt the 9th kind of embodiment, then by having male and fomale(M﹠F) 41a, the polyimide film 41 of 41b, be formed at this polyimide film 41 one side by have first 42a that thickness that silicone rubber kinds composition that regulation forms forms is 210 μ m, be formed at this polyimide film 41 another side be that second 42b of 115 μ m constitutes composite sheet 43 by having thickness that silicone rubber kinds composition that regulation forms forms.Therefore, composite sheet 43 of the present invention except obtain with the 1st kind of effect that embodiment is same, also have following effect.
That is, the degree of the desired resiliency of composite sheet is according to purposes and difference.For example, for the purposes that must have resiliency, need be with the thickness thickening of sheet material.Here, if first of two sides and second thickness are thickeied, though can give resiliency, thermal conductivity is impaired.So,, reduce by the thickness of second 42b, thereby can under the situation that does not impair thermal conductivity, give resiliency by thickening the thickness of first 42a that contacts with workpiece (flexible base, board).Under the situation of above-mentioned the 9th kind of embodiment, the thickness of first 42a is made as 210 μ m, the thickness of second 42b is made as 115 μ m, so can give resiliency under the situation of the thermal conductivity that does not impair composite sheet 43.Also have, in the composite sheet 43 of Fig. 5, need first 42a, need second 42b in order to prevent warpage in order to bring into play functional.
In addition, if form the sheet of same color on the two sides of polyimide film, then can't be by perusal identification composite sheet 43 positive and negative.So, under the situation of above-mentioned the 9th kind of embodiment, the color of first 42a being made as black, the color of second 42b is made as grey, so can easily carry out the positive and negative identification of composite sheet 43.In addition, because the thickness of polyimide film is made as 25 μ m,, can improve thermal conductivity so compare with the 1st kind of embodiment.
As mentioned above, in the composite sheet of the 9th kind of embodiment, improve programming rate, static electricity resistance, shaping processability, crimping durability are balancedly set, and are more suitable in the purposes that requires resiliency than the 1st kind of embodiment.
(the 10th kind of embodiment)
With reference to Fig. 8.Wherein, the member identical with Fig. 7 is marked with same label, omits explanation.
Shown in above-mentioned table 2, the thickness of first 52a is 150 μ m, is black, and the thickness of second 52b is identical with first 52a with color.Therefore, first 52a is identical with the proportioning of second 52b.In addition, the preparation method of the composite sheet 53 of the 10th kind of embodiment is identical with the situation of the 9th kind of embodiment.
If adopt the 10th kind of embodiment, the programming rate that then can improve, static electricity resistance, shaping processability, crimping durability are set evenly, compare the improved slightly composite sheet of thickness slip and thermal conductivity with the 1st kind of embodiment.
Claims (3)
1. composite sheet, it is an employed composite sheet in as the thermo-compressed operation of one of manufacturing process of electronic equipment, it is characterized in that,
Comprise heat-resistant resin film and be formed at the sheet that forms by the silicone rubber kinds composition on the two sides of described heat-resistant resin film,
Described silicone rubber kinds composition comprises 2～100 parts of SiO 2 powders, 0～200 part of carbon black, 10～1000 parts of magnesia, 0～20 part of iron oxide, 0.1～0.5 part of cerium oxide in weight portion with respect to 100 parts of silicon rubber.
2. composite sheet as claimed in claim 1 is characterized in that, heat-resistant resin film is formed by any heat-resistant resin in polyimides, aromatic polyamide resin, polyether-ether-ketone resin, polyethersulfone resin, the poly-p-phenylene sulfide resin.
3. composite sheet as claimed in claim 1 or 2 is characterized in that, gross thickness is 0.01～5mm.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008118943 | 2008-04-30 | ||
| JP2008118943 | 2008-04-30 | ||
| JP2008-118943 | 2008-04-30 | ||
| JP2009-058434 | 2009-03-11 | ||
| JP2009058434 | 2009-03-11 | ||
| JP2009058434A JP5386200B2 (en) | 2008-04-30 | 2009-03-11 | Composite sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101570074A true CN101570074A (en) | 2009-11-04 |
| CN101570074B CN101570074B (en) | 2015-05-20 |
Family
ID=41556212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910138833.3A Expired - Fee Related CN101570074B (en) | 2008-04-30 | 2009-04-29 | Composite sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5386200B2 (en) |
| KR (1) | KR101498996B1 (en) |
| CN (1) | CN101570074B (en) |
| TW (1) | TWI498979B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610587A (en) * | 2011-06-29 | 2012-07-25 | 友达光电股份有限公司 | Buffer element and flip chip soft film jointing method using the same |
| CN105283037A (en) * | 2014-07-18 | 2016-01-27 | 松下知识产权经营株式会社 | Composite sheet, production method thereof and electronic apparatus using the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101078252B1 (en) | 2010-03-18 | 2011-10-31 | 유한회사 한국 타코닉 | Thermal conductive and release sheet used in bonding anisotropic conductive film |
| JP2015170690A (en) * | 2014-03-06 | 2015-09-28 | 信越化学工業株式会社 | Thermally conductive composite sheet for crimping led chip and method for manufacturing the same |
| JP6705329B2 (en) * | 2016-07-27 | 2020-06-03 | 日本ゼオン株式会社 | Composite sheet and thermocompression bonding method |
| KR20230087490A (en) * | 2020-10-19 | 2023-06-16 | 미쯔비시 케미컬 주식회사 | laminate |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| JP2649899B2 (en) * | 1994-09-21 | 1997-09-03 | ヤマウチ株式会社 | Cushion material for forming press |
| JP4301468B2 (en) * | 1999-07-07 | 2009-07-22 | 信越化学工業株式会社 | Heat-resistant and heat-conductive silicone rubber composite sheet and method for producing the same |
| JP3920611B2 (en) * | 2001-09-28 | 2007-05-30 | ヤマウチ株式会社 | Cushion material for heat press and method for producing the same |
| JP4210080B2 (en) * | 2002-07-17 | 2009-01-14 | 中興化成工業株式会社 | Rubber composite sheet |
| JP4572056B2 (en) * | 2002-10-04 | 2010-10-27 | 信越化学工業株式会社 | Thermally conductive silicone rubber composite sheet |
| JP3902558B2 (en) * | 2003-03-07 | 2007-04-11 | 信越化学工業株式会社 | Silicone rubber sheet for thermocompression bonding |
| JP2004311577A (en) * | 2003-04-03 | 2004-11-04 | Shin Etsu Chem Co Ltd | Thermally conductive composite sheet and method of manufacturing the same |
| CN1860181B (en) * | 2003-09-29 | 2011-08-24 | 迈图高新材料日本合同公司 | Heat-conductive silicone composition |
| JP2005297234A (en) * | 2004-04-07 | 2005-10-27 | Shin Etsu Chem Co Ltd | Silicone rubber sheet for thermocompression bonding and method for manufacturing the same |
-
2009
- 2009-03-11 JP JP2009058434A patent/JP5386200B2/en active Active
- 2009-04-22 KR KR1020090035044A patent/KR101498996B1/en active IP Right Grant
- 2009-04-22 TW TW098113325A patent/TWI498979B/en not_active IP Right Cessation
- 2009-04-29 CN CN200910138833.3A patent/CN101570074B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610587A (en) * | 2011-06-29 | 2012-07-25 | 友达光电股份有限公司 | Buffer element and flip chip soft film jointing method using the same |
| CN102610587B (en) * | 2011-06-29 | 2015-02-04 | 友达光电股份有限公司 | Buffer element and flip chip film bonding method using same |
| CN105283037A (en) * | 2014-07-18 | 2016-01-27 | 松下知识产权经营株式会社 | Composite sheet, production method thereof and electronic apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI498979B (en) | 2015-09-01 |
| KR101498996B1 (en) | 2015-03-05 |
| KR20090115053A (en) | 2009-11-04 |
| JP2009286114A (en) | 2009-12-10 |
| CN101570074B (en) | 2015-05-20 |
| JP5386200B2 (en) | 2014-01-15 |
| TW201009966A (en) | 2010-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101570074A (en) | Composite sheet | |
| EP1365479B1 (en) | Anisotropic conductive connector, its manufacture method and probe member | |
| JP4301468B2 (en) | Heat-resistant and heat-conductive silicone rubber composite sheet and method for producing the same | |
| CN100539061C (en) | Probe device is equipped with the wafer inspection equipment of this probe device and chip detection method | |
| US8124885B2 (en) | Anisotropically conductive connector and anisotropically conductive connector device | |
| TWI576236B (en) | Thermos viscous use of silicone rubber sheet | |
| TWI250600B (en) | Sheet-shape connector, its manufacturing method and application | |
| TWI276252B (en) | Anisotropic conductive plate and manufacturing method and applications thereof | |
| KR101010765B1 (en) | Silicone Rubber Sheets for Thermocompression | |
| KR102012762B1 (en) | Composite sheet with EMI shield and heat radiation and Manufacturing method thereof | |
| TWI302928B (en) | ||
| KR101557841B1 (en) | Anisotropic conductive film | |
| JP3900732B2 (en) | Anisotropic conductive sheet and manufacturing method thereof | |
| JP2001067942A (en) | Anisotropic conductive sheet | |
| KR102012275B1 (en) | Composite sheet with EMI shield and heat radiation and Manufacturing method thereof | |
| JP4470316B2 (en) | Anisotropic conductive sheet and electrical inspection device for circuit device | |
| CN115109223A (en) | Self-repairing and surface patterning cross-linked polyurethane elastomer | |
| US20060177971A1 (en) | Anisotropically conductive connector, production process thereof and application product thereof | |
| WO1990012683A1 (en) | Transfer fixture and process for printed circuit boards | |
| CN101665016A (en) | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg | |
| CN107662383B (en) | Thermally conductive composite sheet for thermocompression bonding and method for producing same | |
| JP4273982B2 (en) | Anisotropic conductive sheet manufacturing method and anisotropic conductive connector manufacturing method | |
| JP3873503B2 (en) | Anisotropic conductive sheet and manufacturing method thereof | |
| CN100413151C (en) | Anisotropic conductive sheet, manufacturing method thereof, and product using the same | |
| WO2006051878A1 (en) | Sheet-shaped probe, probe card and wafer inspecting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |