KR101922293B1 - A display device including patterned connected member and the method for the display device - Google Patents

Abstract

According to an embodiment of the present invention, there is provided a semiconductor device, comprising: a first connected member including a pattern having alternately a convex specific electrode portion and a concave electrode portion; A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And an anisotropic conductive adhesive layer disposed between the concave electrode portion and the convex electrode portion and electrically connecting the concave electrode portion and the convex electrode portion, wherein the concave electrode portion and the convex electrode portion are matched with each other, And a display device in which the pole portion and the concave non-polarized portion are matched with each other. Thus, the connection resistance and the occurrence of electric short can be improved.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device including a patterned connected member,

The present invention relates to a display device including a patterned connected member and a method of manufacturing the same.

Anisotropic conductive film (ACF) generally refers to a film-like adhesive in which conductive particles are dispersed in a resin such as an epoxy resin. The film is an electrically conductive film having electrical conductivity in the film thickness direction and insulating property in the surface direction Means a polymer membrane having anisotropy and adhesion. When the film is placed between the circuit to be connected with the anisotropic conductive film and subjected to a heating and pressing process under a certain condition, the circuit terminals are electrically connected by the conductive particles, and an insulating adhesive resin And the conductive particles are filled independently of each other, thereby providing high insulating properties.

In recent years, as the resolution of displays becomes higher, the number of electrodes requiring electrical connection increases, and the electrode area becomes smaller. Thus, although there is a method of increasing the number of conductive particles in the anisotropic conductive film, a shortage occurs between adjacent electrodes due to the enlarged conductive particles, thereby causing a problem that the insulation resistance is increased.

In order to prevent this, a method of covering the surface of the conductive particle with an insulating film is used (Korean Patent Application Publication No. 2006-0041090). However, there is a problem that the connection resistance between the terminals is increased due to the insulating material although the inter-electrode short circuit can be partially prevented by the insulating film. Also, even with such a technique, it is difficult to completely eliminate a short between terminals due to the fluidity of the film.

Korean Patent Application Publication No. 2006-0041090 (published on May 11, 2006)

It is an object of the present invention to provide a display device capable of preventing a short between adjacent electrodes.

It is still another object of the present invention to provide a display device capable of preventing misalignment of electrodes of the first to-be-connected members and electrodes of the second to-be-connected members.

According to an embodiment of the present invention, a first connected member including a pattern alternately having a convex specific electrode portion and a concave electrode portion; A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And an anisotropic conductive adhesive layer disposed between the concave electrode portion and the convex electrode portion and electrically connecting the concave electrode portion and the convex electrode portion, wherein the concave electrode portion and the convex electrode portion are matched with each other, A display device in which a pole portion and the concave non-polarizing portion are matched with each other is provided.

According to still another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first connected member including a pattern having alternately a convex specific electrode portion and a concave electrode portion; A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And an anisotropic conductive adhesive layer disposed between the first connected member and the second connected member and electrically connecting the concave electrode portion and the convex electrode portion, wherein the concave electrode portion and the convex electrode portion are aligned with each other , And the convex non-polarized portion and the concave non-polarized portion are matched with each other.

According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a first member to be connected including a pattern having alternately a convex specific electrode portion and a concave electrode portion; Preparing a second member to be connected including a pattern having alternately a concave non-polarized portion and a convex electrode portion; Wherein an anisotropic conductive adhesive layer is formed on the concave electrode portion, the convex electrode portion, or the concave electrode portion and the convex electrode portion, or an anisotropic conductive adhesive layer is provided between the first to- ; And pressing and bonding the concave electrode portion and the convex electrode portion to each other so that the convex specific portion and the concave nonconductive portion are matched with each other and the concave electrode portion and the convex electrode portion are electrically connected by the anisotropic conductive adhesive layer A method of manufacturing a display device is provided.

The display device according to an exemplary embodiment of the present invention can improve the connection resistance and the occurrence of electric short because the conductive particles can be concentratedly disposed between the first wiring layer and the second wiring layer. Furthermore, since the first connected member surface morphology and the second connected member surface morphology can be matched with each other, a phenomenon in which the first connected member and the second connected member are displaced can be prevented.

1 and 2 are sectional views of a display device 400 according to an embodiment of the present invention. The display device 400 includes a first connection member 100 including a first base 110 and a first wiring layer 120, a second connection member 100 including a second base 210 and a second wiring layer 220, A connection member 200, and an anisotropic conductive adhesive layer 300. According to another expression, the first connected member 100 includes the convex specific electrode portion 101 and the concave electrode portion 102, and the second connected member 200 includes the concave nonconductive portion 201 and the convex electrode portion 102. [ (202).
3 is a cross-sectional view of a conventional display device 500 used as a comparative example.

According to an embodiment of the present invention, there is provided a semiconductor device, comprising: a first connected member including a pattern having alternately a convex specific electrode portion and a concave electrode portion; A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And an anisotropic conductive adhesive layer disposed between the concave electrode portion and the convex electrode portion and electrically connecting the concave electrode portion and the convex electrode portion, wherein the concave electrode portion and the convex electrode portion are matched with each other, And a display device in which the pole portion and the concave non-polarized portion are matched with each other.

The first and second connected members may be a TCP (Tape Carrier Package), a PCB (Printed Circuit Board), or a COF (Chip On Film). For example, the first connected member may be a TCP, and the second connected member may be a PCB. However, the present invention is not necessarily limited to this, and connected members other than the above-described types may be used.

Referring to FIG. 1, the first connected member 100 may include a first base 110 and a first wiring layer 120.

The first base 110 may serve to support the first wiring layer 120. The first base 110 may include an insulating material to prevent a short circuit between the first wiring layers 120 to be supported. For example, the first base 110 may be a PET (polyethylene phthalate) resin, a PI (polyimide), or an epoxy resin, but is not limited thereto.

 At least one surface of the first base 110 may include a concavo-convex pattern, and concretely, it may include concave surfaces. The plurality of concave surfaces may be a plurality of concave surfaces, and a protruding surface relatively protruding from the concave surface may be disposed between the concave surfaces.

The concave surfaces may be arranged in a stripe shape, but are not limited thereto. Alternatively, the concave surfaces may be arranged in a lattice form.

The first interconnection layer 120 may serve to enable electrical connection with the second connected member 200. The first wiring layer 120 may be a metallic material such as Cu or Ag. However, the first wiring layer 120 may include ITO (indium tin oxide), ZnO, SnO ₂ , or the like. The thickness of the first wiring layer 120 may be 10 탆 to 45 탆, and may be specifically 15 탆 to 40 탆.

The first wiring layer 120 may be disposed on the first base 110 and the first wiring layer 120 may be disposed on the concave surface of the first base 110.

Referring to FIG. 1 again, the first connected member 100 including the first base 110 and the first wiring layer 120 is formed by alternately arranging the convex specific electrode portion 101 and the concave electrode portion 102 The branch may be represented as including a pattern. Specifically, the convex specific electrode portion 101 refers to a protruding portion including the protruding surface of the first base 110, and the concave electrode portion 102 includes a concave surface of the first base 110 And the like. The convex specific electrode portion 101 and the concave electrode portion 102 may be arranged alternately.

The second connected member 200 may include a second base 210 and a second wiring layer 220.

The second base 210 may serve to support the second wiring layer 220. The second base 210 may include an insulating material to prevent a short circuit between the second wiring layers 220 that support the second base 210. For example, the second base 210 may be a PET (polyethylene phthalate) resin, a PI (polyimide), or an epoxy resin, but is not limited thereto. One surface of the second base 210 may be opposed to the first connected member 100.

The second wiring layer 220 may serve to enable electrical connection with the first connected member 100. The second wiring layer 220 may be a metallic material such as Cu or Ag. However, the second wiring layer 220 may include ITO (indium tin oxide), ZnO, SnO ₂ , or the like. The thickness of the second wiring layer 220 may be 15 탆 or less, specifically 5 탆 to 10 탆.

The second wiring layer 220 may be disposed on the first surface opposite to the first connected member 100. Specifically, the second wiring layer 220 may be disposed opposite to the concave surface of the first connected member 100. [

Referring to FIG. 1 again, the second connected member 200 including the second base 210 and the second wiring layer 220 includes a concave non-polarized portion 201 and a convex electrode portion 202 alternately The branch may be represented as including a pattern. The convex electrode part 202 may include the second wiring layer 220 disposed on the second base 210. The concave nonconductive part 201 may include the convex electrode part 202, And may include one surface of the second base 210. [0033] The concave non-polarized portion 201 and the convex electrode portion 202 may be alternately arranged.

The concave electrode portion 102 and the convex electrode portion 202 are matched with each other and the convex specific electrode portion 101 and the concave specific electrode portion 201 can be matched with each other. That is, the morphology of each of the first and second connected members 100 and 200 can be interdigitated with each other. Thus, the phenomenon that the first connected member 100 and the second connected member 200 are displaced from each other can be improved.

The width 102W of the concave electrode portion 102 may be larger than the width 202W of the convex electrode portion 202. [ Specifically, the width 102W of the concave electrode portion 102 may be 1 to 10 mu m larger than the width 202W of the convex electrode portion 202. In this case, the first connected member 100 and the second connected member 200 can be prevented from being damaged by the expansion of the electrode due to the temperature rise.

The anisotropic conductive adhesive layer 300 may be disposed between the convex specific electrodes 101. Specifically, the anisotropic conductive adhesive layer 300 may be disposed between the convex specific non-conductive portions 101, and more specifically, may be disposed between the convex specific non- In the present embodiment. Furthermore, the anisotropically conductive adhesive layer may not be disposed between the convex non-conducting portion and the concave non-conducting portion. Thus, since the anisotropic conductive adhesive layer 300 disposed on the concave electrode portion 102 can not contact the adjacent trough electrode portion 102, shorting between the first wiring layers 120 spaced apart from each other can be effectively prevented . At the same time, due to the above structure, a short between the second wiring layers 220 spaced apart from each other can also be effectively prevented.

The sum of the thickness 202T of the convex electrode part 202 and the thickness 300T of the anisotropically conductive adhesive layer 300 may be equal to or greater than the thickness 101T of the convex specific electrode part 101. [ The thickness of the anisotropically conductive adhesive layer 300 is set to be the same as the thickness of the anisotropically conductive adhesive layer 300 in the state of the display device 400, that is, in the state where the first and second to-be- ) Thickness. According to the above conditions, the contact between the convex specific non-conducting portion 101 and the concave non-conducting portion 201 can prevent the electrical connection between the first wiring layer 120 and the second wiring layer 220 from being degraded .

Wherein the anisotropic conductive adhesive layer comprises a binder resin; Curable compounds; A curing initiator; Conductive particles.

Non-limiting examples of the binder resin include polyimide resin, polyamide resin, phenoxy resin, polymethacrylate resin, polyacrylate resin, polyurethane resin, polyester resin, polyester urethane resin, polyvinyl butyral resin , Styrene-butylene-styrene (SBS) resins and epoxy modified products, styrene-ethylene-butylene-styrene (SEBS) resins and modified products thereof, acrylonitrile butadiene rubber (NBR) And combinations thereof. Specifically, a phenoxy resin can be used as the binder resin, and more specifically, a fluorene-based phenoxy resin can be used. The fluorene-based phenoxy resin can be used without limitation as long as it is a phenoxy resin containing a fluorene structure.

The curable compound and the curing initiator may be respectively a radically polymerizable compound and a radical polymerization initiator, or may be a cationic polymerizable compound and a cationic polymerization initiator, respectively.

Non-limiting examples of the radically polymerizable compound include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, , 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n- lauryl (meth) acrylates, C ₁₂ -C ₁₅ alkyl (meth) acrylate, n- stearyl (meth) acrylate (meth) acrylate, n-butoxy ethyl (meth) acrylate, butoxy ethyleneglycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl Hydroxypropyl (meth) acrylate, benzyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobonyl Acrylate, 2-hydroxybutyl (meth) (Meth) acrylate, (meth) acrylic acid, 2- (meth) acryloyloxyethyl succinic acid, diethylaminoethyl (meth) acrylate, Acrylate, 2- (meth) acryloyloxyethyl hexahydrophthalate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycidyl (meth) (Meth) acrylate, ethyleneglycol di (meth) acrylate, diethyleneglycol di (meth) acrylate, triethyleneglycol di (Meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, Hydroxy-3-acryloyloxypropyl (meth) acrylate, (Meth) acrylate, perfluorooctylethyl (meth) acrylate, isoamyl acrylate, lauroyl acrylate, bisphenol A ethylene (meth) acrylate, (Meth) acrylate, pentaerythritol tri (meth) acrylate and the like, which can be used singly or in combination of two or more selected from the group consisting of di (meth) acrylate of bisphenol A Or a mixture of two or more thereof.

The radical polymerization initiator is not particularly limited and a radical polymerization initiator commonly used in the art can be used. The radical polymerization initiator used in the present invention acts as a curing agent that generates free radicals by heating or light, and organic peroxides can be preferably applied.

The organic peroxide is not particularly limited and various kinds of ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxy ester, peroxycarbonate and the like can be used. And a plurality of peroxides may be used in combination.

In particular, it is preferable to use the organic peroxide having a half-life temperature of from 40 to 100 for 5 to 15 hours. There is no problem in room temperature storage property in the above range, and it is suitable for fast curing type.

As the cationic polymerizable compound, an epoxy resin, specifically, a thermosetting epoxy resin can be used. For example, an epoxy resin having an epoxy equivalent of about 90 to 5000 g / eq and having two or more epoxy groups in the molecule can be used have. More specifically, it may include at least one epoxy resin selected from the group consisting of hydrogenated, bisphenol-type, novolak-type, glycidyl-type, aliphatic and alicyclic epoxy resins. For example, a naphthalene-based epoxy resin can be used. The cationic polymerizable compound may be 10 wt% to 55 wt%, specifically 15 wt% to 45 wt%, more specifically 15 wt% to 35 wt%, based on the total weight of the anisotropic conductive adhesive layer.

More specifically, a hydrogenated epoxy resin or a propylene oxide-based epoxy resin can be used. Use of a hydrogenated epoxy resin or a propylene oxide-based epoxy resin enables rapid curing at a low temperature and secures good stability.

The hydrogenated epoxy resin is specifically an alicyclic hydrogenated epoxy resin such as a hydrogenated bisphenol A type epoxy resin or a cycloaliphatic system. As the cycloaliphatic epoxy resin, resins having a structure such as alicyclic diepoxyacetal, alicyclic diepoxy adipate, alicyclic diepoxy carboxyate, or vinylcyclohexene dioxide may be used. The hydrogenated bisphenol A type epoxy resin is generally obtained by using a hydrogenated bisphenol A derivative and epichlorohydrin, and may be a structure in which a double bond in a bisphenol A molecular structure is substituted with a hydrogen molecule.

Specifically, the hydrogenated epoxy resin may have an epoxy equivalent of 150 g / eq to 1,200 g / eq and a viscosity of 900 cps / 25 ° C to 12,000 cps / 25 ° C.

The cationic polymerization initiator is not limited as long as it can catalyze the curing of the epoxy resin, and for example, sulfone, imidazole, isocyanate, amine, amide, phenol or acid anhydride curing agents can be used These may be used alone or in combination of two or more.

The conductive particles are not particularly limited and conductive particles conventionally used in the art can be used. Non-limiting examples of the conductive particles usable in the present invention include metal particles including Au, Ag, Ni, Cu, solder and the like; carbon; Particles comprising a resin including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol or the like and particles of the modified resin coated with a metal such as Au, Ag, Ni or the like; And conductive particles coated with insulating particles further coated with insulating particles thereon. The size of the conductive particles may be in the range of, for example, 5 탆 to 25 탆, specifically, 6 탆 to 23 탆, depending on the pitch of the applied circuit.

The anisotropic conductive adhesive layer may further include organic particles in addition to a binder resin, a curable compound, a curing initiator, and conductive particles.

The organic particles serve to compensate for the excessive flow of the composition due to the ethylene-vinyl acetate copolymer. In addition, stress can be relaxed under heat shrinkage accompanied by curing by organic particles, thermal deformation due to shrinkage and expansion can be lowered, and adhesion reliability can be imparted to the film under high temperature and high humidity conditions.

The organic particles may be selected from the group consisting of styrene-divinyl benzene, chlorinated polyethylene, dimethyl polysiloxane, methyl methacrylate-butyl acrylate-dimethylsiloxane copolymer (Methylmethacrylate-Butylacrylate-Dimethylsiloxane copolymer Butadiene-styrene block copolymers, styrene-butadiene thermoplastic elastomers, butadiene rubbers, styrene-butadiene rubbers (styrene-butadiene-styrene block copolymers) ), And ethylene glycidyl methacrylate. [0033] The term " anionic surfactant "

The diameter of the organic particles of the present invention is not particularly limited and may be 0.1 to 10 탆, preferably 0.3 to 5 탆. When the size of the organic particles is within the above range, dispersion of the organic particles is good and the conductivity characteristics of the conductive particles are not hindered by the organic particles.

The anisotropic conductive adhesive layer may further include additives such as a binder resin, a curing compound, a curing initiator, and conductive particles as well as a polymerization inhibitor, an antioxidant, and a heat stabilizer, thereby providing additional physical properties without impairing basic properties. The additive is not particularly limited, but may be contained in an amount of 0.01 to 10% by weight based on the total weight of the anisotropic conductive adhesive layer.

FIG. 2 is a perspective view of a display device according to another embodiment of the present invention, wherein the display device includes: a first connected member including a pattern having alternating convex and concave electrode portions; A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And an anisotropic conductive adhesive layer disposed between the first connected member and the second connected member and electrically connecting the concave electrode portion and the convex electrode portion, wherein the concave electrode portion and the convex electrode portion are aligned with each other , And the convex non-polarized portion and the concave non-polarized portion are matched with each other. The display device according to FIG. 2 is similar to the display device according to FIG. 1 described above, but differs in the structure and arrangement of the anisotropic conductive adhesive layer. Hereinafter, the difference will be mainly described.

Referring to FIG. 2, the anisotropic conductive adhesive layer 300 may not be disposed between the convex portions 101. Specifically, the anisotropically conductive adhesive layer 300 may be disposed on one surface of the convex specific electrode portion 101 opposite to the second connected member 200. More specifically, the anisotropically conductive adhesive layer 300 may extend on the concave electrode portion 102 and be disposed on the concave electrode portion 102, passing over one convex specific electrode portion 101. In this case, since a single anisotropic conductive adhesive layer can be used, the step of forming the anisotropic conductive adhesive layer can be simplified. Further, since the anisotropically conductive adhesive layer can be disposed between the convex electrode portion and the convex specific portion, the adhesion area between the first and second connected members can be increased, thereby improving the reliability of the display device .

According to still another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: preparing a first connected member including a pattern alternately having a convex specific electrode portion and a concave electrode portion; Preparing a second member to be connected including a pattern having alternately a concave non-polarized portion and a convex electrode portion; Wherein an anisotropic conductive adhesive layer is formed on the concave electrode portion, the convex electrode portion, or the concave electrode portion and the convex electrode portion, or an anisotropic conductive adhesive layer is provided between the first to- ; And pressing and bonding the concave electrode portion and the convex electrode portion to each other so that the convex specific portion and the concave nonconductive portion are matched with each other and the concave electrode portion and the convex electrode portion are electrically connected by the anisotropic conductive adhesive layer And a method of manufacturing the display device.

The first connected member including the pattern having the convex specific electrode portion and the concave electrode portion alternately can be formed by, for example, the following method. As described above, the first connected member includes the first base and the first wiring layer. The mold may be filled with a material of a first base, for example, PI, and then cured by applying heat to form the first base. In this case, the mold may include a convex portion corresponding to the concave surface so as to form a concave surface on at least one surface of the first base. The first wiring layer may be formed on the concave surface of the manufactured first base. The first wiring layer may be formed by chemical vapor deposition (CVD) or sputtering, but is not limited thereto.

Alternatively, a mask may be formed on a surface of the first base, which does not include a pattern, except for a region where the concave electrode portion is to be formed. Thereafter, the region exposed by the mask is partially etched through dry etching or wet etching to form a concave surface, and then the mask is removed. Thereafter, a first wiring layer is formed on the concave surface.

Alternatively, the first base of the liquid phase may be pressed and hardened through the substrate (or the stamp) having the concavo-convex pattern, and the substrate may be removed to form a pattern including alternately the convex specific electrode portion and the concave electrode portion The first connected member may be formed. However, it is not limited to the two methods described above.

Next, the first wiring layer may be formed on the concave surface. For example, a mask may be formed on a region of the first base except for the concave surface, and a material constituting the first wiring layer, for example, Cu, may be coated on the concave surface. Thereafter, the mask is removed to form the first wiring layer. Alternatively, the method may further comprise removing an adhesive layer, a seed layer, or a copper foil layer with or without mask removal after forming an adhesive layer, a seed layer, or a copper foil layer on one side of the first base before forming the mask .

Alternatively, the first wiring layer may be formed by performing super-water-repellent treatment on one surface of the first base. Specifically, one surface of the first base including the concave surface is subjected to fluorination treatment, and ultraviolet rays are irradiated only to the concave surface so that the concave surface is hydrophilic and the other area is super-water-repellent. Thus, the material constituting the first wiring layer can be arranged more easily and accurately on the concave surface, so that the first wiring layer can be formed.

As another method, an ion exchange method can be used. For example, after a potassium hydroxide solution is applied on the concave surface, the first base is immersed in a copper sulfate solution to perform ion exchange between copper sulfate and potassium hydroxide, so that copper ions are formed on the concave surface . Thus, the material constituting the first wiring layer can be arranged more easily and accurately on the concave surface, so that the first wiring layer can be formed.

The material constituting the anisotropic conductive adhesive layer may be arranged on the concave electrode portion in an area smaller than the area of the first wiring layer. As the first to-be-connected members and the second to-be-connected members are matched with each other, the anisotropic conductive adhesive layer is formed while the substances forming the anisotropic conductive adhesive layer are squeezed and expanded in the horizontal direction. Therefore, under the above conditions, the anisotropic conductive adhesive layer disposed on one concave electrode portion may not contact the anisotropic conductive adhesive layer disposed on the concave electrode portion.

And the anisotropic conductive adhesive layer may be formed by press-bonding and final pressing between the first connected member and the second connected member. For example, the pressurization and final compression conditions may be as follows.

Pressing condition: 50 to 70 DEG C, 1 to 3 seconds, 1 to 3 MPa

The present pressing conditions are: 130 to 170 DEG C, 5 to 7 seconds, 2 to 5 MPa

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

The contents not described here are sufficiently technically inferior to those skilled in the art, and a description thereof will be omitted.

Example  And Comparative Example

Example  One

1st The  Produce

After the PI (Polyimide) in the mold including the concave-convex pattern was filled, it was cured at 250 DEG C for one hour to prepare a first base having concave portions including concave surfaces. At this time, the width (short axis length) of the concave surface was 100 mu m, the major axis length of the concave surface was 3 mm, the depth of the concave portion was 30 mu m, and the interval between the concave portions was 100 mu m. Cu was deposited on the concave surface by a sputtering method to form a first wiring layer having a thickness of 20 mu m and a width of 100 mu m to produce a first member to be connected.

Second The  Produce

Cu was deposited on one side of the PI substrate of 1000 mu m by a sputtering method to form a convex portion including a convex surface. A second wiring layer having a width (short axis length) of 90 mu m, a length of 3 mm, a thickness of convex portion of 10 mu m and a convex portion spacing of 110 mu m was formed on the convex surface to produce a second member to be connected.

Anisotropic conductivity Paste (for forming the anisotropic conductive adhesive layer)  Produce

70% by weight of urethane resin (weight average molecular weight 20,000 to 35,000 g / mol, Tg: 10 캜), 20% by weight of 2-hydroxy-3-phenoxypropyl acrylate, 3% by weight of organic peroxide, Toluene as a solvent was added to a revolving mixer, dissolved and dispersed, and then the solvent was dried for 5 minutes in a hot air circulating oven heated at 60 캜 to form an anisotropic conductive paste.

Manufacture of display devices

Through the dispenser, the anisotropic conductive paste was confined to each concave surface of the first connected member. At this time, the anisotropic conductive paste was disposed so as to occupy a smaller area than the width of the upper surface of the first wiring layer. Thereafter, the anisotropic conductive paste was brought into contact with the Cu of the second member to be connected, followed by compression bonding at 160 DEG C for 6 seconds under the condition of 3 MPa. Through this, a display device having a first connected member and a second connected member engaged with each other and having an anisotropic conductive adhesive layer with a thickness of 3 mu m was manufactured.

Example  2

1st The  Produce

PEI (Polyethyleneimine) in a mold containing a concave-convex pattern was filled and then cured at 250 DEG C for 1 hour to prepare a first base having a concave portion including a concave surface. At this time, the width (short axis length) of the concave surface was 100 mu m, the major axis length of the concave surface was 3 mm, the depth of the concave portion was 30 mu m, and the interval between the concave portions was 100 mu m. Thereafter, Cu was vapor-deposited on the concave surface through a sputtering method to form a first wiring layer having a thickness of 20 mu m and a width of 100 mu m to prepare a first member to be connected.

Second The  Produce

Cu was deposited on one side of the PI substrate of 1000 mu m by a sputtering method to form a convex portion including a convex surface. A second wiring layer having a width (short axis length) of 90 mu m, a length of 3 mm, a thickness of convex portion of 10 mu m and a convex portion spacing of 110 mu m was formed on the convex surface to produce a second member to be connected.

Production of anisotropically conductive film (for forming anisotropically conductive adhesive layer)

70% by weight of urethane resin (weight average molecular weight 20,000 to 35,000 g / mol, Tg: 10 캜), 20% by weight of 2-hydroxy-3-phenoxypropyl acrylate, 3% by weight of organic peroxide, The solvent, toluene, was added to a revolving mixer, dissolved and dispersed, and then applied on a peeled polyethylene terephthalate film (release film). The solvent was then dried in a hot-air circulating oven heated at 60 ° C for 5 minutes, Thereby forming an anisotropic conductive film.

Manufacture of display devices

And the anisotropic conductive film was disposed on the first connected member. At this time, the anisotropic conductive film was disposed so as to cover not only the first wiring layer of the first connected member but also the first base layer between the first wiring layers. Thereafter, the film was pressure-bonded under the conditions of 50 DEG C, 1 second and 1 MPa, and then the release film was removed. Subsequently, the first and second connected members were pressed and bonded at 160 DEG C for 6 seconds under a condition of 3 MPa to prepare a display device having an anisotropic conductive adhesive layer with a thickness of 3 mu m. (See Fig. 2)

Example  3

1st The  Produce

PEI (Polyethyleneimine) in a mold containing a concave-convex pattern was filled and then cured at 250 DEG C for 1 hour to prepare a first base having a concave portion including a concave surface. At this time, the width (short axis length) of the concave surface is 100 mu m, the major axis length of the concave surface is 3 mm, the depth of the concave portion is 30 mu m, and the interval between the concave portions is 100 mu m. Thereafter, the prepared first base was adhered to the substrate in the vacuum apparatus, and one side of the first base including the concave surface was plasma-etched by applying a voltage with flowing oxygen containing moisture. Thereafter, CHF ₃ gas was flowed and a voltage was applied thereto to fluorine the one surface. Using a mask, fluorine was decomposed by irradiating ultraviolet light having a wavelength of 254 nm only on the concave surface of the fluorine-treated one surface to perform hydrophilic patterning. A water-based ink containing Cu particles was formed on the concave surface that was hydrophilic-patterned to form a first wiring layer having a thickness of 20 mu m and a width of 100 mu m to produce a first member to be connected.

Second The  Produce

Cu was deposited on one side of the PI substrate of 1000 mu m by a sputtering method to form a convex portion including a convex surface. A second wiring layer having a width (short axis length) of 90 mu m, a length of 3 mm, a thickness of convex portion of 10 mu m and a convex portion spacing of 110 mu m was formed on the convex surface to produce a second member to be connected.

Anisotropic conductivity Paste (for forming the anisotropic conductive adhesive layer)  Produce

70% by weight of urethane resin (weight average molecular weight 20,000 to 35,000 g / mol, Tg: 10 캜), 20% by weight of 2-hydroxy-3-phenoxypropyl acrylate, 3% by weight of organic peroxide, Toluene as a solvent was added to a revolving mixer, dissolved and dispersed, and then the solvent was dried for 5 minutes in a hot air circulating oven heated at 60 캜 to form an anisotropic conductive paste.

Manufacture of display devices

Through the dispenser, the anisotropic conductive paste was confined to each concave surface of the first connected member. At this time, the anisotropic conductive paste was disposed so as to occupy a smaller area than the width of the upper surface of the first wiring layer. Thereafter, the anisotropic conductive paste was brought into contact with the Cu of the second member to be connected, followed by compression bonding at 160 DEG C for 6 seconds under the condition of 3 MPa. Through this, a display device having a first connected member and a second connected member engaged with each other and having an anisotropic conductive adhesive layer with a thickness of 3 mu m was manufactured.

Comparative Example  One

1st The  Produce

Cu was deposited on one surface of a 1000 mu m PEI substrate by a sputtering method to form a first wiring layer having a thickness of 100 mu m (short axis length), a length of a major axis of a concave surface of 3 mm, a thickness of 20 mu m, To thereby produce a first connected member.

Second The  Produce

Cu was deposited on one surface of a 1000 mu m PEI substrate by a sputtering method to form a convex portion including a convex surface. A second wiring layer having a width (short axis length) of 90 mu m, a length of 3 mm, a thickness of convex portion of 10 mu m and a convex portion spacing of 110 mu m was formed on the convex surface to produce a second member to be connected.

Preparation of anisotropic conductive adhesive layer

70% by weight of urethane resin (weight average molecular weight 20,000 to 35,000 g / mol, Tg: 10 캜), 20% by weight of 2-hydroxy-3-phenoxypropyl acrylate, 3% by weight of organic peroxide, The solvent, toluene, was added to a revolving mixer and dissolved and dispersed. The mixture was applied on a peeled polyethylene terephthalate (PET) film (release film) and dried in a hot air circulating oven heated at 60 ° C for 5 minutes to give a thickness of 10 Mu m of an anisotropic conductive adhesive layer.

Manufacture of display devices

After the anisotropic conductive adhesive layer is placed on the first member to be connected and press-fitted under the following conditions, the release film is removed, and the first and second members to be connected are sandwiched by the anisotropically conductive adhesive layer therebetween Under the following conditions, a display device was manufactured. (See Fig. 3)

1) Pressure-bonding condition: 50 DEG C, 1 second, 1 MPa

2) Squeezing condition: 160 DEG C for 6 seconds, 3 MPa

The components of the anisotropic conductive adhesive layer used in Examples 1 to 3 and Comparative Example 1 are as follows:

1) Binder resin (urethane resin)

, 60 wt% of polyol (polytetramethylene glycol), 13.53 wt% of 1,4-butanediol, 26.14 wt% of toluene diisocyanate, 0.3 wt% of hydroxyethyl methacrylate and 0.03 wt% of dibutyltin dilaurate used as a catalyst, Lt; / RTI > First, a polyol, 1,4-butadiol and toluene diisocyanate are reacted to synthesize a prepolymer having an isocyanate group at the terminal. The prepolymer having an isocyanate group at the terminal thus synthesized was further reacted with hydroxyethyl methacrylate to prepare a polyurethane acrylate resin. At this time, a molar ratio of the hydroxyethyl methacrylate / prepolymer having an isocyanate group at the terminal = 0.5 ' Respectively. Specific reaction conditions were polymerization reaction using dibutyltin dilaurate as a catalyst at a temperature of 90 ° C, a pressure of 1 atm and a reaction time of 5 hours to obtain a polyurethane acrylate having a weight average molecular weight of 20,000 to 35,000 g / mol Tg: 10 占 폚).

2) Curable compound

2-hydroxy-3-phenoxypropyl acrylate (KARAYAD R-128H, Japanese explosive)

3) Curing initiator

Benzoyl peroxide (Hansol)

4) Conductive particles

10 mu m-sized conductive particles (13GNR10MX NCI)

The display devices manufactured in Examples 1 to 3 and Comparative Example 1 were tested in the following manner, and the results are shown in Table 2 below.

Experimental Example

Connection resistance measurement

The connection resistance was measured for each of the display devices manufactured in Examples 1 to 3 and Comparative Examples 1 and 2 five times using a four-terminal measuring method (according to ASTM F34-64T method), and the average value thereof was calculated. (Using Keithley, 2000 Multimeter)

Judging poor shot

After a DC voltage of 100 V was applied to each of the display devices manufactured in Examples 1 to 3 and Comparative Examples 1 and 2, the insulation resistance was measured using a 4-terminal measurement method. (Using HIOKI, SM8215) Insulation was 'good' when the measured insulation resistance was 1.0E + 10 or less, and 'Insufficient' when the measured insulation resistance was more than 1.0E + 10.

Example 1 Example 2 Example 3 Comparative Example 1 Connection resistance (Ω) 0.15 0.20 0.18 0.32 Judging poor shot Good Good Good Bad

As shown in Table 1, the display device according to Examples 1 and 3 has a low connection resistance since the anisotropic conductive adhesive layer can be confined only between the first wiring layer and the second wiring layer. Further, the adjacent anisotropically conductive adhesive layers can be surely spaced apart, so that defects due to shorts can be reduced.

In the case of the display device according to the second embodiment, since the path of the anisotropic conductive adhesive layer positioned between the adjacent first wiring layers can be long, the occurrence of short circuit can be reduced.

On the other hand, in the display device according to Comparative Example 1, since the conductive particles of the anisotropic conductive film are unnecessarily located in addition to the interconnection layers, the connection resistance becomes relatively high. Also, since the conductive particles are positioned between adjacent first wiring layers or adjacent second wiring layers, the probability of occurrence of short circuit is relatively high, and defects are likely to occur.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that such detail is solved by the person skilled in the art without departing from the scope of the invention. will be. Accordingly, the actual scope of the present invention will be defined by the appended claims and their equivalents.

Claims (13)

A first connected member including a pattern alternately having a convex specific electrode portion and a concave electrode portion;
A second connected member including a pattern having alternately a concave non-polarized portion and a convex electrode portion; And
And an anisotropic conductive adhesive layer disposed between the concave electrode portion and the convex electrode portion and electrically connecting the concave electrode portion and the convex electrode portion,
Wherein the concave electrode portion and the convex electrode portion are matched with each other, and the convex specific electrode portion and the concave non-
The width of the concave electrode portion is larger than the width of the convex electrode portion,
And the anisotropic conductive adhesive layer is not disposed between the convex nonconductive portion and the concave nonconductive portion.
delete The method according to claim 1,
Wherein the sum of the thickness of the convex electrode portion and the thickness of the anisotropically conductive adhesive layer is equal to or greater than the thickness of the convex specific electrode portion.
The method according to claim 1,
And the concave electrode portion includes a first wiring layer disposed to face the convex electrode portion.
The method of claim 4,
And the thickness of the first wiring layer is 10 占 퐉 to 45 占 퐉.
delete delete delete Preparing a first member to be connected including a pattern having alternately a convex specific electrode portion and a concave electrode portion;
Preparing a second member to be connected including a pattern having alternately a concave non-polarized portion and a convex electrode portion;
Wherein an anisotropic conductive adhesive layer is formed on the concave electrode portion, the convex electrode portion, or the concave electrode portion and the convex electrode portion, or an anisotropic conductive adhesive layer is provided between the first to- ; And
Wherein the concave electrode portion and the convex electrode portion are matched with each other and the convex specific electrode portion and the concave nonconductive portion are matched with each other and the concave electrode portion and the convex electrode portion are electrically connected by the anisotropically conductive adhesive layer A method of manufacturing a display device,
The width of the concave electrode portion is larger than the width of the convex electrode portion,
Wherein the anisotropic conductive adhesive layer is not disposed between the convex nonconductive portion and the concave nonconductive portion.
The method of claim 9,
The first connected member includes:
A first base including a concave surface on one side; And
And a first wiring layer disposed on the concave side of the first base.
The method of claim 10,
The step of preparing the first connected member including the pattern having the convex specific electrode portion and the concave electrode portion alternately includes:
And forming the first wiring layer on the concave side of the first base.
The method of claim 11,
Wherein forming the first wiring layer on the concave surface comprises:
Performing an ultra water repellent treatment on an area of the one surface of the first base excluding the concave surface, or using ion exchange for the concave surface.
The method of claim 11,
Wherein the step of positioning the anisotropic conductive adhesive layer on the concave electrode portion comprises:
And disposing a material constituting the anisotropic conductive adhesive layer on the concave electrode portion at an area smaller than the area of the first wiring layer.

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