CN109318561A - A kind of soft or hard combination heat-conducting pad and preparation method thereof - Google Patents
A kind of soft or hard combination heat-conducting pad and preparation method thereof Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
A kind of soft or hard combination heat-conducting pad and preparation method thereof, wherein, thermally conductive sheet main body and thermal conductive material layer, the hardness of the thermal conductive material layer is softer than thermally conductive sheet main body, thermal conductive material layer is at least covered on a surface of thermally conductive sheet main body, to form the softer chill bar at least one surface, soft or hard combination heat-conducting pad of the present invention and preparation method thereof, since heat-conducting pad is two layers or three-decker, wherein softer thermal conductive material layer with electronic device for fitting, heat transfer face contact is firm, and wear resistance is strong, therefore, the structure of the soft or hard combination heat-conducting pad of the present invention can take into account heat dissipation and rub resistance dual property.
Description
Technical field
The present invention relates to Heat Conduction Material fields, and in particular to a kind of soft or hard combination heat-conducting pad and preparation method thereof.
Background technique
Currently, the common heat-conducting interface material of chip cooling has heat-conducting pad, answered by organic silicon substrate and ceramic powders
It closes, for hardness generally between ShoreOO 15~70, heat-conducting system is 0.5~8W/k.m, and such heat-conducting pad is only
One layer of laminated structure has the shortcomings that hardness is lower, not rub resistance, the environment being generally not suitable under high vibration.Due to
Not rub resistance often improves its hardness and strength, but too hard material causes to promote the anti-friction performance of heat-conducting pad
Surface poor contact, interface resistance can be high, cause system is thermally conductive to be unsatisfactory for requiring.
The heat-conducting pad used in electronics and communication product needs heat-conducting pad to have lesser hardness (generally less than
Shore OO 60)；In this way, using when compression stress it is lower, improve the service life of electronic component.But new-energy automobile electricity consumption
Sub- product, such as radiating requirements of automatically controlled, motor and battery, under high vibration conditions, soft heat-conducting pad are easy friction breakage, make
It can be led at insulation risk if surface cannot contact well with heating device and radiator using hardness higher heat conductive pad
Cause heating conduction bad.
Patent CN106833367A mentions the heat-conducting insulation material of sandwich structure, that is, relies on insulating materials tack or adopt
Cohesive insulation material layer is distinguished in heat-conducting interface material two sides with indirect binding material, forms the insulated type with sandwich structure
Interface chill bar material.But the patent is only referred to the insulation performance of material, is not distinctly claimed to the hardness of material, and adds
Multi-step is used in work, technique is more complex, low efficiency.
Summary of the invention
The present invention in order to solve the above problems existing in the present technology, provides a kind of soft or hard combination heat-conducting pad and its system
Preparation Method, existing heat-conducting pad hardness is lower, not rub resistance to solve, and can not be applied to the technical problems such as high vibration environment.
To achieve the above object, the present invention provides a kind of soft or hard combination heat-conducting pad, including thermally conductive sheet main body and thermally conductive
The hardness of material layer, the thermal conductive material layer is softer than thermally conductive sheet main body, and thermal conductive material layer is at least covered on the one of thermally conductive sheet main body
On a surface, to form the softer chill bar at least one surface.
As present invention further optimization technical solution, the hardness Shore OO of the thermally conductive sheet main body is greater than 60, leads
Hot coefficient is greater than 0.5W/k.m, with a thickness of 0.3~2mm；Less than 50, thermal coefficient is greater than the hardness Shore OO of thermal conductive material layer
0.5W/k.m, with a thickness of 0.3~2mm.
As present invention further optimization technical solution, the thermally conductive sheet main body and thermal conductive material layer are by organosilicon height
Molecule and ceramic packing composition, the mass percentage of the ceramic packing are 60~95%, the quality hundred of organosilicon macromolecule
Dividing content is 5~40%.
As present invention further optimization technical solution, the ceramic packing include aluminium oxide, magnesia, zinc oxide,
Boron nitride, aluminium nitride it is one or more.
As present invention further optimization technical solution, each component and mass percentage of the organosilicon macromolecule
Are as follows:
Wherein, base polymer is vinyl silicone oil, and modified silicon oil is alkyl silicone oil, and silane coupling agent is with vinyl
Or the long chain silane of epoxy group, crosslinking agent are containing hydrogen silicone oil, catalyst is platinum catalyst, and inhibitor is acetenyl hexamethylene
Alcohol.
According to another aspect of the present invention, the present invention also provides a kind of preparation methods of soft or hard combination heat-conducting pad, should
Method the following steps are included:
S1, organosilicon macromolecule and ceramic packing are added in batch mixer by setting ratio, vacuumize and stir, makes respectively
Obtain thermally conductive sheet main body slurry and thermal conductive material layer slurry；
S2, the thermally conductive sheet main body that at least one table is covered with thermal conductive material layer is made, the thermally conductive sheet main body is by thermally conductive sheet
The production of main body slurry and baking molding, the thermal conductive material layer is by the production of thermal conductive material layer slurry and baking molding.
As present invention further optimization technical solution, in the step S2, crosslinking agent is in thermally conductive sheet main body slurry
The 1~6% of base polymer, crosslinking agent is 8% of base polymer or more in thermal conductive material layer slurry.
As present invention further optimization technical solution, in the step S2, make at least one table be covered with it is thermally conductive
The thermally conductive sheet main body of material layer, the thermally conductive sheet main body is by the production of thermally conductive sheet main body slurry and baking molding, the Heat Conduction Material
Layer is by the production of thermal conductive material layer slurry and baking molding specifically includes:
By the double-deck calendering technology or extrusion process, by thermally conductive sheet main body slurry and thermal conductive material layer slurry in same film carrier
Above while it being extruded as the double-layer structure being bonded to each other, then baking molding, is covered with leading for thermal conductive material layer to obtain a table
Heat spreader body；
Alternatively, by calendering technology, first thermally conductive sheet main body slurry is squeezed out and is toasted as the thermally conductive of coiled material or sheet structure
Piece main body, then thermal conductive material layer slurry is coated in thermally conductive sheet main body, then baking molding, with obtain a table be covered with it is thermally conductive
The thermally conductive sheet main body of material layer；
Alternatively, by calendering technology, first thermal conductive material layer slurry is squeezed out and is toasted as the thermally conductive of coiled material or sheet structure
Material layer, then thermally conductive sheet main body slurry is coated on thermal conductive material layer, then baking molding, with obtain a table be covered with it is thermally conductive
The thermally conductive sheet main body of material layer.
As present invention further optimization technical solution, obtain table is covered with to the thermally conductive sheet of thermal conductive material layer
The another side of main body is coated with thermal conductive material layer slurry, and then baking molding, is all covered with thermal conductive material layer to obtain two tables
Thermally conductive sheet main body.
As present invention further optimization technical solution, the baking temperature is 100~150 degree, baking time for 2~
4 hours.
Soft or hard combination heat-conducting pad of the invention and preparation method thereof can achieve it is following the utility model has the advantages that
Soft or hard combination heat-conducting pad of the invention and preparation method thereof, heat-conducting pad include thermally conductive sheet main body and heat conduction material
The hardness of the bed of material, the thermal conductive material layer is softer than thermally conductive sheet main body, and thermal conductive material layer is at least covered on one of thermally conductive sheet main body
On surface, to form the softer chill bar at least one surface, which is two layers or three-decker, wherein softer
Thermal conductive material layer with electronic device for fitting, and heat transfer face contact is firm, and wear resistance is strong, the structure can take into account heat dissipation and
Rub resistance dual property.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is the structural schematic diagram for the example that the soft or hard combination heat-conducting pad of the present invention provides；
Fig. 2 is the structural schematic diagram for another example that the soft or hard combination heat-conducting pad of the present invention provides；
Fig. 3 is the method flow diagram for the example that the preparation method of the soft or hard combination heat-conducting pad of the present invention provides.
In figure: A, thermal conductive material layer, B, thermally conductive sheet main body.
The object of the invention is realized, the embodiments will be further described with reference to the accompanying drawings for functional characteristics and advantage.
Specific embodiment
Below in conjunction with attached drawing and specific embodiment, the present invention is described further.Drawn in preferred embodiment
Such as "upper", "lower", "left", "right", " centre " and " one " term, only being illustrated convenient for narration, rather than to limit
The enforceable range of the present invention, relativeness are altered or modified, under the content of no substantial changes in technology, when being also considered as this hair
Bright enforceable scope.
As depicted in figs. 1 and 2, soft or hard combination heat-conducting pad includes thermally conductive sheet main body B and thermal conductive material layer A, described thermally conductive
The hardness of material layer A is softer than thermally conductive sheet main body B, and thermal conductive material layer A is at least covered on a surface of thermally conductive sheet main body B, with
Form the softer chill bar at least one surface.
In specific implementation, the hardness Shore OO of the thermally conductive sheet main body B is greater than 60, and thermal coefficient is greater than 0.5W/k.m,
With a thickness of 0.3~2mm；The hardness Shore OO of thermal conductive material layer A is less than 50, and thermal coefficient is greater than 0.5W/k.m, with a thickness of 0.3
~2mm.
In specific implementation, the thermally conductive sheet main body B and thermal conductive material layer A are by organosilicon macromolecule and ceramic packing group
At the mass percentage of the ceramic packing is 60~95%, and the mass percentage of organosilicon macromolecule is 5~40%.
In specific implementation, the ceramic packing include aluminium oxide, magnesia, zinc oxide, boron nitride, aluminium nitride one kind or
It is a variety of.
In specific implementation, each component and mass percentage of the organosilicon macromolecule are as follows:
Wherein, base polymer is vinyl silicone oil, and modified silicon oil is alkyl silicone oil, and silane coupling agent is with vinyl
Or the long chain silane of epoxy group, crosslinking agent are containing hydrogen silicone oil, catalyst is platinum catalyst, and inhibitor is acetenyl hexamethylene
Alcohol, the hardness of thermally conductive sheet main body B and thermal conductive material layer A pass through the ratio for adjusting crosslinking agent and base polymer in heat-conducting pad
To realize.
According to the thermally conductive principle of heat-conducting pad: the hardness of material has large effect, identical thermally conductive system to interface resistance
Several materials, material hardness is lower, closer with interface cohesion, and system thermal resistance is lower, and heat-conducting pad of the invention is by thermally conductive boundary
Plane materiel material is made into double-layer structure or three-decker, and in double-layer structure or three-decker, each layer is goods and materials of the same race, but its is soft or hard
Characteristic is different, to reach different using effects, and closely bonds between each layer connected.Wherein, as shown in Figure 1, two layers of knot
The one side (thermally conductive sheet main body B) of structure is harder, and another side (thermal conductive material layer A) is relatively soft；As shown in Fig. 2, in three-decker
Firmly, two sides (thermal conductive material layer A) is softer for interbed (thermally conductive sheet main body B), and softer one side makes for fitting with electronic device
It is firm to obtain heat transfer face contact, and wear resistance is strong, takes into account heat dissipation and rub resistance dual property.
As shown in figure 3, this method includes following the present invention also provides a kind of preparation method of soft or hard combination heat-conducting pad
Step:
Step S1, organosilicon macromolecule and ceramic packing are added in batch mixer by setting ratio, vacuumize and stirs, point
It Zhi get not thermally conductive sheet main body B slurry and thermal conductive material layer A slurry；
Step S2, make at least one table be covered with thermally conductive sheet the main body B, the thermally conductive sheet main body B of thermal conductive material layer A by
The production of thermally conductive sheet main body B slurry and baking molding, the thermal conductive material layer A is by the production of thermal conductive material layer A slurry and baking molding.
In specific implementation, in the step S2, crosslinking agent is the 1~6% of base polymer in thermally conductive sheet main body B slurry,
Crosslinking agent is 8% of base polymer or more in thermal conductive material layer A slurry.
In specific implementation, in the step S2, the thermally conductive sheet main body B that at least one table is covered with thermal conductive material layer A is made,
The thermally conductive sheet main body B is by the production of thermally conductive sheet main body B slurry and baking molding, the thermal conductive material layer A are starched by thermal conductive material layer A
Simultaneously baking molding specifically includes for material production:
By the double-deck calendering technology or extrusion process, by thermally conductive sheet main body B slurry and thermal conductive material layer A slurry in same load
It is extruded as the double-layer structure being bonded to each other simultaneously on film, then baking molding, is covered with thermal conductive material layer A's to obtain a table
Thermally conductive sheet main body B；
Alternatively, by calendering technology, first thermally conductive sheet main body B slurry is squeezed out and is toasted as the thermally conductive of coiled material or sheet structure
Piece main body B, then thermal conductive material layer A slurry is coated on thermally conductive sheet main body B, then baking molding, is covered with obtaining a table
The thermally conductive sheet main body B of thermal conductive material layer A；
Alternatively, by calendering technology, first thermal conductive material layer A slurry is squeezed out and is toasted as the thermally conductive of coiled material or sheet structure
Material layer A, then thermally conductive sheet main body B slurry is coated on thermal conductive material layer A, then baking molding, is covered with obtaining a table
The thermally conductive sheet main body B of thermal conductive material layer A.
By the step, the heat-conducting pad of soft or hard combination double-layer structure can be made, softer on one side, another side is harder.
In specific implementation, the another side coating that obtain table is covered with the thermally conductive sheet main body B of thermal conductive material layer A is led
Hot material layer A slurry, then baking molding, to obtain the thermally conductive sheet main body B that two tables are all covered with thermal conductive material layer A.Pass through
The heat-conducting pad of soft or hard combination three-decker can be made in the step, and intermediate hard, two sides are softer.
In specific implementation, the baking temperature is 100~150 degree, and baking time is 2~4 hours.
In order to allow those skilled in the art to further appreciate that production method of the invention, list citing illustrates different performance
Heat-conducting pad production method, in following table, A is thermal conductive material layer A, and B is thermally conductive sheet main body B.
Table one
The hardness of thermally conductive sheet main body B and thermal conductive material layer A, which pass through, in heat-conducting pad adjusts crosslinking agent and base polymer
Ratio realize that in the table one, different thermally conductive sheet main body B or different thermal conductive material layer A pass through and adjust crosslinking agent and base
Different hardness has can be obtained in the ratio of plinth polymer, same material, to meet different use demands.
Table two
The structure of AB-1, AB-2 and AB-3 are as shown in Figure 1, the structure of ABA-1, ABA-2 and ABA-3 are as shown in Figure 2.It will not
Thermally conductive sheet main body B and thermal conductive material layer A with hardness are combined, so that the heat-conducting pad with different thermal resistances is obtained, the heat
Gasket is double-layer structure or three-decker, wherein the one side of double-layer structure is harder, and another side is relatively soft；And three-decker
Middle layer is hard, and two sides are softer, and softer one side with electronic device for fitting, so that heat transfer face contact is firm, and resistance to
Rubbing property is strong, takes into account heat dissipation and rub resistance dual property.
Although specific embodiments of the present invention have been described above, those skilled in the art should be appreciated that this
It is merely illustrative of, various changes or modifications can be made to present embodiment, without departing from the principle and substance of the present invention,
Protection scope of the present invention is only limited by the claims that follow.
Claims (10)
1. a kind of soft or hard combination heat-conducting pad, which is characterized in that including thermally conductive sheet main body and thermal conductive material layer, the Heat Conduction Material
The hardness of layer is softer than thermally conductive sheet main body, and thermal conductive material layer is at least covered on a surface of thermally conductive sheet main body, to be formed at least
The softer chill bar in one surface.
2. soft or hard combination heat-conducting pad according to claim 1, which is characterized in that the hardness of the thermally conductive sheet main body
Shore OO is greater than 60, and thermal coefficient is greater than 0.5W/k.m, with a thickness of 0.3~2mm；The hardness Shore OO of thermal conductive material layer is small
In 50, thermal coefficient is greater than 0.5W/k.m, with a thickness of 0.3~2mm.
3. soft or hard combination heat-conducting pad according to claim 2, which is characterized in that the thermally conductive sheet main body and Heat Conduction Material
Layer is made of organosilicon macromolecule and ceramic packing, and the mass percentage of the ceramic packing is 60~95%, organosilicon
High molecular mass percentage is 5~40%.
4. soft or hard combination heat-conducting pad according to claim 3, which is characterized in that the ceramic packing include aluminium oxide,
Magnesia, zinc oxide, boron nitride, aluminium nitride it is one or more.
5. soft or hard combination heat-conducting pad according to claim 4, which is characterized in that each component of the organosilicon macromolecule
And mass percentage are as follows:
Wherein, base polymer is vinyl silicone oil, and modified silicon oil is alkyl silicone oil, and silane coupling agent is with vinyl or ring
The long chain silane of oxygen groups, crosslinking agent are containing hydrogen silicone oil, and catalyst is platinum catalyst, and inhibitor is acetylene basic ring alcohol.
6. a kind of preparation method of soft or hard combination heat-conducting pad, which comprises the following steps:
S1, organosilicon macromolecule and ceramic packing are added in batch mixer by setting ratio, vacuumize and stir, is made leads respectively
Heat spreader body slurry and thermal conductive material layer slurry；
S2, the thermally conductive sheet main body that at least one table is covered with thermal conductive material layer is made, the thermally conductive sheet main body is by thermally conductive sheet main body
Slurry production and baking molding, the thermal conductive material layer is by the production of thermal conductive material layer slurry and baking molding.
7. the preparation method of soft or hard combination heat-conducting pad according to claim 6, which is characterized in that in the step S2,
Crosslinking agent is the 1~6% of base polymer in thermally conductive sheet main body slurry, and crosslinking agent is base polymer in thermal conductive material layer slurry
8% or more.
8. the preparation method of soft or hard combination heat-conducting pad according to claim 7, which is characterized in that in the step S2,
The thermally conductive sheet main body that at least one table is covered with thermal conductive material layer is made, the thermally conductive sheet main body is made by thermally conductive sheet main body slurry
And baking molding, the thermal conductive material layer is by the production of thermal conductive material layer slurry and baking molding specifically includes:
It is by the double-deck calendering technology or extrusion process, thermally conductive sheet main body slurry and thermal conductive material layer slurry is same on same film carrier
When be extruded as the double-layer structure being bonded to each other, then baking molding, to obtain the thermally conductive sheet that a table is covered with thermal conductive material layer
Main body；
Alternatively, first thermally conductive sheet main body slurry is squeezed out and toasts the thermally conductive sheet master for coiled material or sheet structure by calendering technology
Body, then thermal conductive material layer slurry is coated in thermally conductive sheet main body, then baking molding, is covered with Heat Conduction Material to obtain a table
The thermally conductive sheet main body of layer；
Alternatively, first thermal conductive material layer slurry is squeezed out and toasts the Heat Conduction Material for coiled material or sheet structure by calendering technology
Layer, then thermally conductive sheet main body slurry is coated on thermal conductive material layer, then baking molding, is covered with Heat Conduction Material to obtain a table
The thermally conductive sheet main body of layer.
9. the preparation method of soft or hard combination heat-conducting pad according to claim 8, which is characterized in that by obtain table
It is covered with the another side coating thermal conductive material layer slurry of the thermally conductive sheet main body of thermal conductive material layer, then baking molding, to obtain two
A table is all covered with the thermally conductive sheet main body of thermal conductive material layer.
10. the preparation method of soft or hard combination heat-conducting pad according to claim 9, which is characterized in that the baking temperature
It is 100~150 degree, baking time is 2~4 hours.
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| CN111675880A (en) * | 2019-11-28 | 2020-09-18 | 哈尔滨理工大学 | Novel soft insulating heat conducting pad |
| CN111873580A (en) * | 2020-07-23 | 2020-11-03 | 东莞市中瑞高分子材料有限公司 | Composite material of silicone rubber and reticular polyurethane, preparation method and application |
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| CN111675880A (en) * | 2019-11-28 | 2020-09-18 | 哈尔滨理工大学 | Novel soft insulating heat conducting pad |
| CN111303758A (en) * | 2020-02-24 | 2020-06-19 | 太仓斯迪克新材料科技有限公司 | Heat conducting layer and heat conducting gasket |
| CN111873580A (en) * | 2020-07-23 | 2020-11-03 | 东莞市中瑞高分子材料有限公司 | Composite material of silicone rubber and reticular polyurethane, preparation method and application |
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Application publication date: 20190212 |