CN201121864Y - lighting module - Google Patents

Abstract

The lighting module of the utility model is composed of a carrier plate and at least one light emitting diode; the carrier plate is made of a flexible bottom layer as a base material, and a heat conducting insulating layer and a conducting layer are sequentially arranged on the flexible bottom layer, and each light emitting diode is arranged on the conducting layer of the carrier plate and is conducted with a power supply through the conducting layer, so that the lighting module which has a better heat dissipation effect and can be matched with a lampshade, a lamp bracket and other bent structures is formed.

Description

lighting module

technical field

The utility model relates to the improvement of the lighting module using light-emitting diodes, especially for the improvement of the carrier board structure in the lighting module, and aims to provide a lighting module with better heat dissipation effect and can be bent with structures such as lamp shades and lamp stands. .

Background technique

Light Emitting Diode (LED) is a semiconductor component that uses the combination of electron holes to release energy in the form of light. Because it is luminescent, it has small size, long life, low power consumption, and fast reaction rate. , Excellent shock resistance and other advantages, in addition to being used as a light-emitting component of electrical products, it can also be widely used as a light-emitting component of lighting fixtures, information billboards and other lighting devices.

Therefore, there are many light-emitting diode lighting modules used in lighting fixtures, information boards and other devices in the market; similar lighting modules are mainly constructed with a plurality of light-emitting diodes as light-emitting components on a carrier board with a conductive function, and The carrier boards are mostly composed of general RF4 printed circuit boards.

Since the general RF-4 printed circuit board is inflexible, the applicability of the overall lighting module is low. Therefore, there is another lighting module with LEDs 10 built on the flexible circuit board 20 as shown in FIG. 1 . The flexible circuit board 20 can improve the applicability of the overall lighting module.

However, the flexible printed circuit board 20 in the conventional lighting module shown in FIG. 1 does not have any heat dissipation mechanism, and cannot cooperate to release the heat source generated by the light emitting diodes 10, resulting in overheating of the overall lighting module, and even worse. The application range of the lighting module is limited.

Utility model content

In view of this, the technical problem solved by the utility model is to improve the structure of the carrier board in the lighting module, aiming to provide a lighting with better heat dissipation performance and can be bent with structures such as lamp shades and lamp stands. module.

In order to achieve the above-mentioned purpose, the technical solution of the utility model is that the overall lighting module basically consists of a carrier board and at least one light-emitting diode; The bottom layer is provided with a heat-conducting insulating layer and a conductive layer in sequence. Each light-emitting diode is constructed on the conductive layer of the carrier board, and is connected to the power supply through the conductive layer. Therefore, the overall lighting module can use a flexible carrier board to cooperate with In addition to better applicability due to bending of lampshades and lamp holders, the overall lighting module can release the heat generated by the LEDs through the heat-conducting insulating layer of the carrier board, so it has better heat dissipation performance.

One of the beneficial effects of the utility model is that the soft carrier board can be used to cooperate with structures such as lamp shades and lamp stands to be bent, so it has better applicability.

The second beneficial effect of the present invention is that the heat source generated by the light-emitting diode can be released through the heat-conducting insulating layer of the carrier board, so it has better heat dissipation performance.

Description of drawings

FIG. 1 is a schematic structural diagram of a conventional lighting module;

Fig. 2 is a schematic structural diagram of the lighting module of the first embodiment of the present invention;

Fig. 3 is a schematic diagram of the usage state of the lighting module of the present invention;

Fig. 4 is a schematic structural diagram of the lighting module of the second embodiment of the present invention.

【Description of figure number】

10 light-emitting diodes 11 wires

20 flexible circuit boards 30 carrier boards

31 Flexible bottom layer 32 Conductive layer

321 Line 322 Insulation Department

33 thermal insulation layer 35 solder layer

40 structures 41 storage slots

Detailed ways

The features of the utility model can be clearly understood by referring to the detailed description of the drawings and the embodiments.

As shown in Figure 2, the lighting module of the present utility model basically consists of a carrier board 30 and at least one light emitting diode 10; The carrier board structure is flexible, and a thermally conductive insulating layer 33 and a conductive layer 32 are sequentially provided on the flexible bottom layer 31, and each light emitting diode 10 is constructed on the conductive layer 32 of the carrier board 30; during implementation, it can The flexible bottom layer 31 can be a flexible structure made of metal materials such as aluminum, copper, iron, stainless steel, etc., and the thickness of the flexible bottom layer 31 is less than or equal to 0.2mm.

The above-mentioned conductive layer 32 can be fully or partially covered on the thermally conductive insulating layer 33, which has copper-based lines 321, and an insulating part 322 made of insulating material is provided between the lines 321 for the light-emitting diodes 10 to be fixed and emit light. The wire 11 of the diode 10 is matched and connected to the line 321 of the conductive layer 32 to form an electrical connection with the line 321 so as to conduct with the power supply through the conductive layer 32 .

Furthermore, the thermally conductive insulating layer 33 can be thermally conductive adhesive or thermally conductive film, and can form the combination of the flexible bottom layer 31 and the conductive layer 32, and the thermally conductive adhesive can be made of double-sided adhesive tape, and the thermally conductive insulating layer 33 constitutes the conductive layer. 32 is combined with the flexible bottom layer 31; accordingly, the overall lighting module can be bent by using the flexible carrier plate 30 and the structures 40 such as the lampshade and the lamp stand as shown in FIG. 3 .

For example, the structure 40 in FIG. 3 is a light steel frame commonly known as T-BAR. The structure 40 is provided with a number of accommodating grooves 41 for placing light-emitting components. The overall lighting module can follow the shape of the accommodating grooves 41. Bending, so that each light-emitting diode 10 can be assembled in the corresponding accommodating groove 41, and has better applicability, in particular, the heat source generated by the light-emitting diode 10 can be released through the heat-conducting insulating layer 31 of the carrier board 30, so It has better heat dissipation performance; of course, as shown in FIG. 4 , a solder layer 35 can be further laid on the substrate 30 relative to the flexible bottom layer 31 to facilitate the direct adhesion of the overall lighting module to the structure of related lighting equipment.

With the above-mentioned carrier structure design based on the flexible bottom layer, it is possible to use the flexible carrier to bend structures such as lampshades and lamp holders, and release the heat generated by the light-emitting diodes through the heat-conducting insulating layer of the carrier. , indeed provide a lighting module with wide applicability and better heat dissipation performance, and submit an application for a new patent according to law.

The technical content and technical characteristics of the present utility model have been disclosed above, but those who are familiar with the technology may still make various replacements and modifications based on the disclosure of the utility model without departing from the spirit of the utility model of the present case. Therefore, the protection scope of the present utility model should not be limited to those disclosed in the embodiments, but should include various replacements and modifications that do not deviate from the present utility model, and are covered by the scope of the following patent applications.

Claims (8)

1. A lighting module, characterized in that it includes: A carrier board, with a flexible bottom layer as the base material, a thermally conductive insulating layer and a conductive layer are sequentially arranged above the bottom layer, the thermally conductive insulating layer forms the combination of the bottom layer and the conductive layer, and the conductive layer is provided with a plurality of circuits; At least one light emitting diode is constructed on the conductive layer and is electrically connected with the circuit. 2. The lighting module according to claim 1, wherein an insulating part made of insulating material is provided between the lines for positioning the light-emitting diodes. 3. The lighting module according to claim 1, wherein the thermally conductive insulating layer is thermally conductive adhesive or thermally conductive film, and constitutes a combination of the bottom layer and the conductive layer. 4. The lighting module according to claim 3, wherein the thermally conductive adhesive is made of double-sided adhesive. 5. The lighting module according to claim 1, wherein the flexible bottom layer is a structure made of metal material. 6. The lighting module according to claim 5, wherein the metal material is aluminum, copper, iron or stainless steel. 7. The lighting module according to claim 1, wherein the thickness of the flexible bottom layer is less than or equal to 0.2mm. 8. The lighting module according to claim 1, wherein a solder layer is laid on the carrier board relative to the bottom layer.

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