JP2011249535A - Flexible wiring board, light-emitting module, manufacturing method of light-emitting module and manufacturing method of flexible wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible wiring board, a light-emitting module, manufacturing method of the light-emitting module and manufacturing method of the flexible wiring board so as to easily form a three-dimensional shape by flexure and to favorably and reliably ensure heat dissipation.SOLUTION: The flexible wiring board 2 includes a flexible circuit board 5 having an insulation resin layer and a wiring layer, a plastically deformable plate base material 4 on which the flexible circuit board 5 is laminated as to cover one surface of the plastically deformable plate base material 4, and electrode parts respectively disposed at a plurality of separated positions on the flexible circuit board 5 for mounting electronic components 3.

Description

  The present invention relates to a light emitting module that can be used as a light source device in a lighting device, a display device for displaying characters, images, and the like, a method for manufacturing the light emitting module, and a bendable wiring that can be used for manufacturing the light emitting module. The present invention relates to a substrate and a manufacturing method thereof.

In recent years, in display devices and lighting devices for displaying characters, images, etc., the use of LEDs (Light Emitting Diodes) as a light source with high efficiency and long life is rapidly spreading. .
An illumination device and a display device using LEDs as a light source have a simple structure in which, for example, an LED mounting surface side of a substrate with LEDs in which one or a plurality of LEDs are mounted on a rigid printed wiring board is covered with a light-transmitting cover. Therefore, the structure can be simplified and the size can be easily reduced as compared with the case where an incandescent bulb or a fluorescent lamp is used as a light source.

Further, for example, as in Patent Document 1, a light source device having a structure in which a substrate with LED is attached to an umbrella-shaped outer shell member integrated with an E-shaped base for a general incandescent bulb, or a spherical shape that covers a substrate with LED Light source device (hereinafter also referred to as a bulb-type LED light source device) having a cover (hereinafter also referred to as a bulb), a plastic cylindrical shape in which a light diffusion material such as silica particles is mixed (or a light diffusion film is formed) An elongated external appearance (hereinafter also referred to as an elongated LED light source device) having a configuration in which an elongated plate-like printed wiring board having a plurality of LEDs mounted therein is housed in a cover has been commercialized.
The above-described bulb-type LED light source device does not require gas to be sealed in the bulb as in a well-known incandescent bulb, and does not require the hermeticity of the bulb, can use a plastic bulb instead of a glass bulb, etc. Compared to incandescent bulbs, it is easier to manufacture and has better luminous efficiency.
Many elongated LED light source devices have the same length as standard straight tube fluorescent lamps, and are provided with the same base as the straight tube fluorescent lamps at both ends in the longitudinal direction. Compared to known fluorescent lamps, this elongated LED light source device is easy to manufacture because it does not require gas filling, and does not require special equipment such as a starter device or ballast required for lighting the fluorescent lamp. There are advantages.

However, as is well known, LEDs are highly directional point light sources. For this reason, in a lighting device that is required to emit light over a wide range, such as a lighting device for indoor lighting, a light diffusion material such as silica particles is mixed (or a light diffusion film is formed). Although the output light of the LED is diffused by the light transmission cover, the emission direction of the emitted light from the LED is limited to a fairly narrow range, so it is not easy to equalize the emitted light from the cover to the outside. The reality is that variations in brightness tend to occur. The same applies to the above-described light bulb-shaped and elongated LED light source devices.
Further, in view of this problem, for example, by the unevenness formed on the light transmission cover of the illumination device or the cover of the LED light source device (bulb of the light bulb-type light source device, cylindrical cover of the elongated light source device), Although it is conceivable to adopt a diffusion structure that diffuses the light emitted from the LED in a complicated manner, there is a problem that the light that is not emitted from the cover to the outside increases due to reflection inside the cover, leading to a decrease in luminous efficiency. .

Moreover, as an illuminating device or a display device using an LED as a light source, there are various types such as a bent plate shape such as an L-shaped plate shape and a U-shaped plate shape, and a polygonal cylindrical shape such as a triangular, quadrangular, pentagonal, and hexagonal shape. Development of products with various shapes is also expected.
In order to realize the above-mentioned bent plate-like or polygonal cylindrical device shape, a device such as a lighting device or a display device is usually assembled using a plurality of rigid printed wiring boards mounted with LEDs (for example, Patent Document 2).
However, an apparatus using a plurality of substrates with LEDs in this way requires fixing parts for fixing each substrate with LEDs in a predetermined direction, depending on the number of substrates with LEDs. There is a problem that it takes time to assemble. In addition, if there are a large number of boards with LEDs to be used, the wiring for power supply to each board with LEDs becomes complicated, and it takes time to connect the wiring, and the circuit wiring of the printed wiring board of the board with LEDs is electrically connected. The connected power supply line is likely to be an obstacle to the assembly work of the entire device, it may be necessary to secure a space for the power supply wiring in the device, and in some cases, the size of the device and product design may be affected. Problems also arise.

In view of this, for example, as disclosed in Patent Documents 3 and 4, there is also proposed a lighting device that is assembled by attaching a flexible printed wiring board (hereinafter also referred to as FPC) on which an LED is mounted to a member formed in a desired shape in advance. ing. As can be seen with reference to FIG. 1 and the like, the lighting device disclosed in Patent Document 3 is changed from a mounting base 8 to which a base 9 that can be mounted on a socket for a general white light bulb is fixed to the mounting base 8. It has a columnar core 5 protruding into a fixed external spherical transparent or translucent cap 12, and is formed in a radial shape (cross shape in FIG. 2) that is flat when deployed as shown in FIG. The FPC is bonded so as to cover the tip of the core 5. Further, FIGS. 5 to 7 of Patent Document 3 disclose an illuminating device in which a LED is mounted on a radial FPC that is flat when unfolded and bonded to the inner surface of the cylindrical portion 26 of the reflector 25. .
Patent Document 4 discloses an illumination device having a configuration in which an FPC having an LED mounted thereon is attached to the inner surface of an umbrella-shaped housing 4.

JP 2009-32466 A JP 2002-184207 A JP 2006-244725 A JP 2002-83506 A

  However, as in Patent Documents 3 and 4, in the configuration in which the FPC with the LED mounted thereon is pasted on a member formed in a desired shape in advance, the efficiency of the pasting work is poor, and the FPC is bent carelessly in the pasting work. There is a problem that inconveniences such as damage to the soldering part are likely to occur. That is, since FPC has high flexibility, it follows the shape of a member to be affixed (hereinafter also referred to as an affixing base material) well, but bends freely during the affixing operation. It is easy to damage the attachment part.

Also, when using adhesive fixing as a means to fix the FPC to the pasting substrate that has been formed in the desired shape, hold down the FPC so that it does not rise from the pasting substrate until the adhesive is cured. It is necessary to attach it. However, at this time, it is difficult to press the FPC evenly so as not to damage the LED mounted on the FPC or the wiring of the FPC.
For example, when pressing and selecting a part that does not have an LED or wiring, the FPC is likely to be lifted with respect to the base material for pasting, so that the adhesive fixing is insufficient and it is easy to peel off, such as aluminum The heat dissipation by sticking to the said base material for affixing with high heat dissipation is also not expectable. Instead of fixing using an adhesive, for example, a configuration may be adopted in which a plurality of locations on the outer periphery of the FCP are mechanically pressed by hooks or the like protruding from the pasting base material. It is difficult to mount the material so that the raised portion does not occur.

  Further, in the configuration as in Patent Documents 3 and 4, since the shape of the FPC is determined by the shape of the base material for pasting the FPC, when manufacturing a lighting device having a complicated shape, it is for pasting the complicated shape. Requires a substrate. For this reason, depending on the shape of the base material for pasting, a base material for pasting composed of a plurality of members may be required, which may increase the time and cost of assembly, and such pasting. Also, it takes time to apply the FPC to the base material.

  In view of the above-described problems, the present invention can be easily deformed into a three-dimensional shape by bending, and can bend and deform to ensure good and reliable heat dissipation, a light emitting module, a method for manufacturing a light emitting module, and bendable It aims at providing the manufacturing method of a wiring board.

In order to solve the above problems, the present invention provides the following configuration.
The bendable deformable wiring board of the present invention is laminated such that a flexible circuit board portion having an electrically insulating insulating resin layer and a wiring layer covers one side of a plastically deformable plate-like substrate, This is a wiring board capable of bending deformation in which electrode parts for mounting electronic components are provided at a plurality of locations separated from each other.
As the resin for forming the insulating resin layer of the flexible circuit board portion, a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer is preferable.
The plate-like substrate is preferably made of an aluminum plate or a copper plate, a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer.
In the bendable deformable wiring board of the present invention, in order to connect parts arranged adjacent to each other by bending and / or bending to a plate-like base material, an engaging protrusion protrudes from one of the parts. It can be set as the structure by which the latching | locking part which latches and the said protrusion for engagement is formed in the other of the said part is formed.

The light-emitting module of the present invention is a light-emitting module in which light-emitting elements are mounted at a plurality of locations on the bending deformable wiring board.
In the light emitting module of the present invention, a bent portion and / or a curved portion is formed on the bendable deformable wiring board, and the bent portions or the bent portions of the bendable deformable wiring board are separated from each other or the bent portions are separated from each other. It is preferable that light emitting elements are mounted at a plurality of locations.
It is preferable that a member for fixing the shape of the bendable deformable wiring board is provided on the back side of the plate-like substrate.
It is preferable that the bendable deformable wiring board has a portion that is bent and formed into a cylindrical shape or a bowl shape.

The light emitting module manufacturing method of the present invention includes a light emitting element mounting step of mounting light emitting elements at a plurality of locations of the flexible circuit board portion of the bendable deformable wiring board, and bending the bendable deformable wiring board into a three-dimensional shape. A bending process.
The method for manufacturing a light emitting module according to the present invention further includes a substrate shape fixing in which a shape fixing member for the bendable deformable wiring board is provided on the back side of the plate-like base material, and the shape of the bendable deformable wiring board is fixed. You may comprise the process.

The method for producing a bendable wiring board according to the present invention includes a single-sided copper-clad flexible board in which a copper foil is integrated only on one side of a thermoplastic resin film on one side of the plate base material. A flexible substrate bonding step in which a resin film is thermally welded and bonded, and a patterning step in which the copper foil is patterned to form a wiring pattern including the electrode portion after the flexible substrate bonding step.
The method for producing a bendable deformable wiring board according to the present invention includes a curable semi-cured resin layer, which is a semi-cured curable resin layer formed on one side of a copper foil, or a semi-cured curable resin. And a curable semi-cured resin sheet, which is a sheet formed separately from the plate-like base material, is heated and cured while being sandwiched between the copper foil and the plate-like base material. Forming a curable resin layer and integrating the copper foil with the plate-like base material, and after the flexible substrate forming process, patterning the copper foil and including the electrode portion And a patterning process for forming a pattern.
The method for producing a bendable deformable wiring board according to the present invention is a board in which a copper-clad flexible board in which copper foil is integrated on one side or both sides of a resin film is bonded to one side of the plate-like substrate using an adhesive. After the bonding step and this substrate bonding step, a copper foil located on the opposite side of the plate-like base material is patterned through the film of the copper-clad flexible substrate to form a wiring pattern including the electrode portion. And a patterning process.

In the method for producing a bending deformable wiring board according to the present invention, the steps up to the patterning step are performed on a plate-like plate base material having a size capable of cutting out one or a plurality of the plate-like substrates, A method of performing a wiring board cutting step for obtaining the bending deformable wiring board by cutting a laminated board with wiring having a configuration in which the flexible circuit board portion is integrated on one side of the plate-like base material after the patterning step It may be.
As a resin for forming a thermoplastic resin film on a single-sided copper-clad substrate, a resin for forming a curable semi-cured resin layer or a curable semi-cured resin sheet, and a resin for forming a resin film on a copper-clad substrate, the base resin is the base resin. It may be a filler-mixed resin mixed with a filler having a higher thermal conductivity than the material resin, or a liquid crystal polymer.

According to the present invention, since a plastically deformable plate-like substrate is used, light emitting modules having various shapes can be easily obtained. Since the plate-like substrate can be plastically deformed, the three-dimensional shape can be stably maintained.
Further, since the flexible circuit board portion is laminated on the plate-like base material before being bent, the light emitting element and the soldering portion are not damaged.
Furthermore, since the adhesiveness between the plate-like base material and the flexible circuit board portion can be ensured satisfactorily, the heat dissipation required when an LED or the like is mounted can be ensured favorably and reliably.
Moreover, the bending deformable wiring board can be configured to maintain a three-dimensional shape by itself by using a plate-like base material having sufficient rigidity.
That is, since the three-dimensional shape can be made autonomously (that is, without excessively depending on other support members), the structure can be simplified. Therefore, manufacturing can be facilitated and cost can be reduced. Furthermore, the durability of the bendable deformable wiring board can be enhanced.

Further, according to the manufacturing method of the present invention, the flexible circuit board is laminated on the plate-like base material before being bent, so that the plate-like base material is compared with the conventional method in which FPC is attached to a three-dimensional base material. The accuracy of positioning of the flexible circuit board portion with respect to the material can be increased.
Therefore, it is possible to prevent the electronic component or the soldered portion from reaching the folding position of the plate-like base material due to the displacement of the flexible circuit board portion, and to prevent damage to them.

1 is an overall perspective view of a light emitting module according to a first embodiment of the present invention. It is sectional drawing of the light emitting module of FIG. FIG. 2 is an enlarged partial cross-sectional view of the light emitting module of FIG. 1. FIG. 2 is an enlarged partial cross-sectional view of the light emitting module of FIG. 1. It is process drawing which shows the 1st manufacturing method of the wiring board which can be bent and deformed. It is a top view of the board | substrate base material used for manufacture of the bending deformable wiring board. It is process drawing which shows the 2nd manufacturing method of the wiring board which can be bent and deformed. It is a figure explaining the modification of the 2nd manufacturing method of a bending deformable wiring board, Comprising: Copper foil is made into a board base material using a thermosetting semi-hardened resin sheet separate from copper foil and a board base material It is sectional drawing which shows the flexible substrate part formation process integrated. It is process drawing which shows the 3rd manufacturing method of a bending deformation possible wiring board. It is sectional drawing of the modification of the light emitting module of 1st Embodiment of this invention. It is sectional drawing of the light emitting module of 2nd Embodiment of this invention. It is sectional drawing of the modification of the light emitting module of 2nd Embodiment of this invention. It is sectional drawing of the light emitting module of 3rd Embodiment of this invention. It is sectional drawing of the light emitting module of FIG. FIG. 14 is an enlarged partial cross-sectional view of the light emitting module of FIG. 13. It is a perspective view of the wiring board which can bend and deform | transform of the light emitting module of 4th Embodiment of this invention. It is a perspective view of the light emitting module of 4th Embodiment of this invention.

Hereinafter, a light emitting module using a bendable deformable wiring board according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a light emitting module 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the light emitting module 1. FIG. 3 is an enlarged cross-sectional view of a main part of the light emitting module 1.
As shown in FIG. 1, a light emitting module 1 is obtained by mounting a light emitting element 3 such as an LED as an electronic component on a bendable deformable wiring board 2 and bending the bendable deformable wiring board 2 into a three-dimensional shape. .

As shown in FIGS. 2 and 3, the bendable deformable wiring board 2 is configured such that the flexible circuit board portion 5 is laminated so as to cover one surface 4 a (one surface) of the plate-like substrate 4.
As the plate-like substrate 4, a metal plate such as an aluminum plate or a copper plate can be used. In addition, a resin plate made of a filler mixed resin in which a filler having a higher thermal conductivity than the base resin is mixed in the base resin, a liquid crystal polymer, or the like can be used.
Examples of the base resin include an epoxy resin and a urethane resin. As the filler, a material made of a high thermal conductive ceramic (Al ₂ O ₃ , SiC, etc.) can be used.
By using the metal or the resin as a constituent material of the plate-like substrate 4, the heat generated by the light emitting element 3 can be efficiently dissipated, so that the heat dissipation of the light emitting module 1 can be improved.

As shown in FIG. 1, the plate-like substrate 4 can be bent and deformed plastically.
In the example of illustration, it is formed in the substantially truncated-conical bottomed cylindrical shape which consists of the circular (or substantially circular) bottom plate part 6 and the cylindrical side plate part 12 extended from the peripheral part 6a while increasing in diameter. Yes.
The side plate portion 12 is plastically bent and deformed so that one surface 4a on which the flexible circuit board portion 5 is formed becomes the outer surface side (outer peripheral side), so that the cross section becomes circular (or substantially circular). It is curved.
The side plate portion 12 has a truncated cone shape that passes through the center of the bottom plate portion 6 and has a line perpendicular to the bottom plate portion 6 as an axis.
The bottom plate portion 6 is formed in a flat plate shape. The bottom plate portion 6 is connected to the inner edge portion 12a of the side plate portion 12 at a connecting portion 6b that is a part in the circumferential direction.
In the bendable deformable wiring board 2 in the illustrated example, the side plate portion 12 is formed to be curved. However, the bendable deformable wiring board 2 is not limited to a bendable structure as a whole, and part or all of the bendable deformable wiring board 2 is bent. And / or a configuration capable of bending.

The flexible circuit board portion 5 is provided over the entire outer surface 6 c of the bottom plate portion 6 and the outer surface 12 b of the side plate portion 12. The outer surface 6 c and the outer surface 12 b are one surface 4 a of the plate-like substrate 4.
In addition, although the flexible circuit board part 5 of the example of illustration is formed in the baseplate part 6 and the side-plate part 12, you may form only in the side-plate part 12. FIG.
The shape of the bendable deformable wiring board 2 is not limited to the truncated-conical bottomed cylindrical shape, but may be other shapes such as a cylindrical shape or a bowl shape. The bending deformable wiring board 2 of the illustrated example has a three-dimensional shape in which only a part (only the side plate portion 12) is curved in a truncated cone shape, but may be a curved shape as a whole.

As shown in FIG. 3, the flexible circuit board portion 5 has a configuration in which a wiring layer 14 for forming a wiring pattern is laminated on one surface 13 a (one surface) of an electrically insulating resin layer 13.
A surface 13 b (the other surface) opposite to the surface on which the wiring layer 14 is formed of the insulating resin layer 13 is laminated on one surface 4 a of the plate-like substrate 4.
In the illustrated light emitting module 1, a protective resin layer 17 (specifically, a solder resist in the illustrated example) is provided on the outer surface of the flexible circuit board portion 5 (the surface opposite to the plate-like substrate 4). .

The wiring pattern formed by the wiring layer 14 has a plurality of mounting portions 7 for mounting electronic components (light emitting elements 3). In the wiring layer 14, electrode portions 15 for mounting the light emitting elements 3 are formed corresponding to the respective mounting portions 7.
The electrode portion 15 is formed at a plurality of locations separated from each other in the flexible circuit board portion 5.
External circuit connection terminal portions 8 are formed at a plurality of locations on the flexible circuit board portion 5. In the illustrated example, external circuit connection terminal portions 8 are formed at two locations on the side plate portion 12, respectively.
The wiring pattern of the wiring layer 14 is formed so as to connect all the mounting portions 7 and the external circuit connection terminal portions 8, and the power supply lines 9 of the external circuit for power supply (see FIG. 1) are connected to the external circuit connection terminal portions 8. ) Can be fed to all the mounting parts 7.

Thereby, electric power can be supplied to all the electronic components (here, the light emitting element 3) mounted on the mounting portion 7. With this structure, an external power supply circuit for supplying power to a plurality of electronic components can be simplified. Further, it is possible to save labor for electrically connecting all the electronic components and the power supply external circuit.
The light emitting element 3 disposed in the mounting portion 7 is mounted on the mounting portion 7 by connecting the lead 3a to the electrode portion 15 with solder (not shown) or the like.
The wiring layer 14 is covered with a protective resin layer 17 laminated on the entire outer surface side (the side opposite to the plate-like substrate 4) of the flexible circuit board portion 5, avoiding the electrode portion 15 and the external circuit connection terminal portion 8. In addition, electrical insulation of the wiring layer 14 and adhesion of water droplets are prevented.
Here, the protective resin layer 17 is specifically a solder resist made of a coating film of a liquid resin material, but is not limited thereto, and may be an electrically insulating resin protective film or the like.

As the resin for forming the insulating resin layer 13, a thermoplastic resin, a thermosetting resin, or the like can be used. As the thermoplastic resin, a polyimide resin or the like can be used, and as the thermosetting resin, an epoxy resin, a so-called glass epoxy material (a glass fiber (for example, glass nonwoven fabric) mixed) or the like can be used.
In addition, as the resin for forming the insulating resin layer 13, it is possible to use a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer. Moreover, highly heat conductive resin can also be used.
The base resin includes the thermoplastic resin (polyimide resin, etc.), the thermosetting resin (epoxy resin, etc.), and the filler is made of a high thermal conductive ceramic (Al ₂ O ₃ , SiC, etc.). Can be used.
By using these materials (filler-mixed resin, liquid crystal polymer, etc.), it is possible to impart thermal conductivity to the flexible circuit board 5 and efficiently transmit the heat generated by the light emitting element 3 to the plate-like substrate 4. The heat dissipation effect can be enhanced.

Here, LEDs are employed as the light emitting elements 3. The light emitting element 3 is mounted on the outer surface side of the flexible circuit board portion 5 of the bottom plate portion 6 and the side plate portion 12.
In the illustrated example, the plurality of light emitting elements 3 provided on the side plate portion 12 are arranged in two rows along the circumferential direction. Adjacent light emitting elements 3 and 3 in one row are spaced apart from each other in the circumferential direction.

In the plate-like substrate 4, in order to connect the portions arranged so as to be adjacent to each other by bending and / or bending, an engaging protrusion is protruded from one of the portions, and the engagement is provided at the other of the portions. It is preferable that a locking portion for locking the joint protrusion is formed.
As shown in FIG. 1 and FIG. 4 (a), one end edge 12c of both side edges 12c and 12d of the side plate 12 that are adjacent to each other by curving the side plate 12 is used for engagement. A protrusion 12e is formed, and a locking portion 12f, which is a hole through which the engagement protrusion 12e is inserted and locked, is formed at the other end edge 12d, and the engagement protrusion 12e is locked. By engaging with the portion 12f, both edge portions 12c and 12d can be connected to each other.
Further, the peripheral edge portion 6a of the bottom plate portion 6 and the inner edge portion 12a of the side plate portion 12 are adjacent to each other by curving the side plate portion 12, and the peripheral protrusion portion 6a of the bottom plate portion 6 is engaged with the engaging protrusion. A piece 6d is formed, and an engaging portion 12g, which is a hole portion through which the engaging protruding piece 6d is inserted and locked, is formed on the inner edge portion 12a of the side plate portion 12, and the engaging protruding piece 6d is locked. By engaging with the portion 12g, the peripheral edge 6a of the bottom plate 6 and the inner edge 12a of the side plate 12 can be connected.

As shown in FIG. 10, the shape fixing member 11 for fixing the shape of the bending deformable wiring board 2 in a bent and / or curved state to the other surface 4 b (back surface) of the plate-like substrate 4. May be provided.
The shape fixing member 11 may be provided on the entire back surface side of the bendable deformable wiring board 2, but may be provided only on a portion arranged to be adjacent to each other by bending and / or bending. In the illustrated example, the shape is fixed so as to cover a portion where the bottom plate portion 6 and the side plate portion 12 are adjacent to each other, that is, an annular portion including the inner edge portion 12 a of the side plate portion 12 and an annular portion including the peripheral edge portion 6 a of the bottom plate portion 6. The member 11 can be formed.
The shape fixing member 11 is formed by applying a curable resin such as a semi-cured thermosetting resin (such as an epoxy resin), a moisture curable resin, or an ultraviolet curable resin to a necessary portion, and curing the resin after application. Can be formed.
By providing the shape fixing member 11, the three-dimensional shape of the bendable deformable wiring board 2 can be reliably maintained.
The shape fixing member is not limited to this, and may be a plate material (resin plate, metal plate, or the like) provided at a necessary location by adhesive fixing using an adhesive, welding fixing, assembly, or the like.

  The light emitting module 1 can be used as a light source for, for example, an indoor lighting device, an outdoor lighting device, an advertising light panel, and the like, similarly to a fluorescent lamp or a neon lamp, by being placed inside a light-transmitting cylindrical cover or the like. it can. Moreover, it can also be used as a lighting device as it is.

Next, a first manufacturing method of the bendable deformable wiring board 2 will be described with reference to FIGS.
In this manufacturing method, single-sided copper is used for one side of a flat plate base material 18 (plate-like base material base material) such as a metal plate (aluminum plate, copper plate, etc.), a resin plate (filler-containing resin, liquid crystal polymer, etc.) A flexible substrate bonding step for bonding the tension flexible substrate 22, a patterning step for patterning the copper foil 24 to form a wiring pattern to obtain a laminated board 25 with wiring, and cutting and bending the laminated board 25 with wiring into a predetermined shape Wiring board cutting-out process for obtaining the possible wiring board 2.

  As shown in FIG. 6, a plate base material 18 is prepared. The plate base material 18 is formed in a plate shape having a size capable of cutting out the plate-like base material 4 constituting the one or more bendable deformable wiring boards 2. In this embodiment, the plate base material 18 has a rectangular plate shape having an area including the plate-like base material 4 constituting the two bendable deformable wiring boards 2.

As shown in FIGS. 5A and 5B, in the flexible substrate bonding step, a copper foil 24 (metal layer) is integrated on one surface of an insulating (electrically insulating, the same applies below) thermoplastic resin film 23. The single-sided copper-clad flexible substrate 22 is brought into surface contact with one surface 18 a of the plate base material 18, and a thermoplastic resin film 23 is thermally welded to be joined to the plate base material 18.
Here, as the single-sided copper-clad flexible substrate 22, one formed in a planar shape that matches the flexible circuit board portion 5 of the bending deformable wiring board 2 to be manufactured is used.
The thermoplastic resin film 23 becomes the insulating resin layer 13 by heat welding to the plate base material 18.

  The thermoplastic resin film 23 forms the insulating resin layer 13 of the flexible circuit board portion 5, and a thermoplastic resin such as a polyimide resin or a liquid crystal polymer can be adopted as the material thereof. Further, as the thermoplastic resin film 23, a filler mixed resin obtained by mixing a filler having higher thermal conductivity than the base resin (polyimide resin, liquid crystal polymer, etc.) into the base resin can also be used.

In the patterning step, after the flexible substrate bonding step, the copper foil 24 is patterned to form a wiring pattern (FIG. 5C).
The patterning can be performed by various known methods such as a photolithography method using a photoresist, laser processing, an ion beam method, and the like.
The wiring pattern formed by patterning includes wiring that connects all the mounting portions 7 and electrode portions 15 corresponding to the mounting portions 7. By forming the wiring layer 14 having a desired wiring pattern by such patterning, the wiring in which the flexible circuit board portion 5 having the thermoplastic resin film 23 as the insulating resin layer 13 is integrated on one side of the plate base material 18 The laminated board 25 with attachment can be produced.
The protective resin layer 17 described above is provided on the surface on the wiring layer 14 side of the flexible circuit board portion 5 so as to cover the entire portion excluding the electrode portion 15 and the external circuit connection terminal portion 8 after the production of the laminated board 25 with wiring. It is done.

Next, a wiring board cutting process is performed.
The plate-like base material 4 constituting the bendable deformable wiring board 2 is cut out from the rectangular plate base material 18 shown in FIG. 6 by pressing or the like.
The cut plate-like base material 4 has a configuration in which the bottom plate portion 6 and the side plate portion 12 are connected.
Through the above steps, the bending deformable wiring board 2 in which the flexible circuit board portion 5 is laminated on the one surface 4a of the plate-like substrate 4 is obtained.

Next, the light emitting module 1 is manufactured using the bendable deformable wiring board 2.
The light emitting module 1 is manufactured by a light emitting element mounting process and a bending process. Here, the case where the bending molding process is performed after the light emitting element mounting process will be described, but either of these processes may be performed first, and the order thereof is a working environment such as a manufacturing apparatus or other processing. It is set appropriately according to.

As shown in FIG. 5E, the light emitting element mounting step is a step of mounting the light emitting element 3 as an electronic component on the bendable deformable wiring board 2. The light emitting element 3 is mounted on the mounting portion 7 formed on the bending deformable wiring board 2.
In mounting the light emitting element 3, the lead 3a of the light emitting element 3 is electrically connected to the electrode portion 15 by soldering or the like.

The bending process is a process in which the bending deformable wiring board 2 is formed into a three-dimensional shape by bending and / or bending.
In the illustrated example, the side plate portion 12 is bent into a truncated cone shape, and the connecting portion 6b is bent, whereby the substantially truncated cone shaped bottomed tubular light emitting module 1 shown in FIG. 1 is manufactured. it can.

  After the bending process, a substrate shape fixing process can be performed as necessary. In this step, as shown in FIG. 10, the shape fixing member 11 described above is provided on the back side opposite to the front side where the flexible circuit board portion 5 is provided. By providing the shape fixing member 11, the three-dimensional shape of the light emitting module 1 can be reliably maintained.

For the production of the bendable deformable wiring board 2, the following second production method can be employed.
Hereinafter, the second manufacturing method of the bending deformable wiring board 2 will be described with reference to FIG. In the following description, description of procedures common to the first manufacturing method is omitted or simplified.
As shown in FIGS. 7A and 7B, in the second manufacturing method, in the flexible substrate bonding step, a semi-cured thermosetting resin layer (thermosetting semi-cured resin) is formed on one surface of the copper foil 24. The semi-cured resin layer-attached copper foil 27 having a structure in which the layer 28) is integrated is joined to the plate member 18 described above, and the thermosetting semi-cured resin layer 28 is heat-cured to form the insulating resin layer 13.
Examples of the thermosetting semi-cured resin layer 28 include an uncured (semi-cured) epoxy resin, a so-called glass epoxy material in which glass fibers (may be a glass nonwoven fabric) are mixed into the epoxy resin (however, an epoxy resin is used). Semi-cured state) can be employed.
The thermosetting semi-cured resin layer 28 functions as an adhesive layer that joins the plate base material 18 and integrates the copper foil 24 with the plate base material 18. For this reason, the curable semi-cured resin layer 28 is cured to form the insulating resin layer 13, whereby the copper foil 24 is integrated with the plate base material 18 via the insulating resin layer 13.

As the copper foil 27 with a semi-cured resin layer, a copper foil 27 having a planar shape that matches the flexible circuit board portion 5 of the bending deformable wiring board 2 to be manufactured is used.
As the thermosetting semi-cured resin layer 28 of the copper foil 27 with the semi-cured resin layer, for example, a coating layer obtained by applying a liquid thermosetting resin material on one surface of the copper foil 24, or a semi-cured thermosetting resin. The thermosetting semi-cured resin sheet to be attached to one side of the copper foil 24 can be exemplified.
The copper foil 27 with the semi-cured resin layer is affixed until the heat curing of the thermosetting semi-cured resin layer 28 is completed on the plate base material 18 due to the adhesiveness of the thermosetting semi-cured resin layer 28. Can be kept stable, and misalignment with respect to the plate base material 18 hardly occurs. For this reason, the flexible board | substrate part formation process using the copper foil 27 with a semi-hardened resin layer can ensure high work efficiency, and is suitable at the point of the productivity improvement of the bending deformable wiring board 2. FIG.
Further, as the thermosetting semi-cured resin layer 28, a filler mixed resin obtained by mixing a filler having a high thermal conductivity with a base resin can be used, and thus the flexible circuit board portion 5 has a good thermal conductivity. Can be granted.

After the flexible substrate portion forming step, a patterning step and a wiring substrate cutting step are performed to obtain a bending deformable wiring substrate 2. The patterning step and the wiring board cutting-out step are the same as in the first manufacturing method.
By performing the light emitting element mounting process and the bending process similar to those of the first manufacturing method described above on the bendable deformable wiring board 2 manufactured in this manner, the substantially frustoconical existence shown in FIG. The bottom cylindrical light emitting module 1 can be produced. The order of the light emitting element mounting process and the bending process is appropriately set according to the working environment such as a manufacturing apparatus and other processes.

As shown in FIG. 8, in the method for manufacturing a bendable deformable wiring board according to the present invention, the flexible substrate portion forming step of the second manufacturing method is performed separately from the copper foil 24 and the plate base material 18. The thing changed into the structure performed using the semi-hardened resin sheet 29 is also included.
The thermosetting semi-cured resin sheet 29 is a sheet-like member made of a semi-cured thermosetting resin. As a forming material of the thermosetting semi-cured resin sheet 29, an epoxy resin, a glass epoxy material (however, an epoxy resin in a semi-cured state) or the like can be employed.
In the flexible substrate portion forming step, the thermosetting semi-cured resin sheet 29 is interposed between the copper foil 24 and the plate base material 18, and the copper foil 24 is inserted into the plate mother via the thermosetting semi-cured resin sheet 29. After being bonded to the material 18, the thermosetting semi-cured resin sheet 29 is heated and cured to form the insulating resin layer 13, whereby the copper foil 24 is integrated with the plate base material 18.
In the case of the flexible substrate forming process using the thermosetting semi-cured resin sheet 29, the state in which the copper foil 24 is adhered to the plate base material 18 by the adhesiveness of the thermosetting semi-cured resin sheet 29 is stably maintained. It is possible to prevent the displacement of the material 18.
In this specification, this manufacturing method is treated as a modification of the second manufacturing method.

FIG. 9 shows a manufacturing method according to the third embodiment of the present invention.
In the third manufacturing method, a copper-clad flexible board (in the illustrated example, a double-sided copper-clad flexible board 32) in which a copper foil 24 is integrated on one side or both sides of a resin film 31 is bonded to the plate described above using an adhesive 33. It includes a substrate bonding process (see FIGS. 9A and 9B) for bonding and integrating with the base material 18, a patterning process (see FIG. 9C), and a wiring board cutting process.
This third manufacturing method differs from the first manufacturing method in that it includes a substrate bonding step instead of the flexible substrate bonding step. The steps after the substrate bonding step are the same as in the first manufacturing method.

9A and 9B, in the substrate bonding step, a double-sided copper-clad flexible substrate 32 in which the copper foil 24 is integrated on both sides of the resin film 31 is attached to the plate base material 18 via an adhesive 33. Glue. An epoxy adhesive or the like can be used as the adhesive.
As the resin film 31 of the copper-clad flexible substrate 32, a filler mixed resin in which a filler having high thermal conductivity is mixed with a base resin, a liquid crystal polymer, or the like can be used. Thermal conductivity can be imparted.

  The light-emitting module 1 having a three-dimensional shape shown in FIG. 1 can be manufactured by performing the light-emitting element mounting process and the bending process similar to those of the above-described embodiment on the bendable deformable wiring board 2. Then, the solid shape of the light emitting module 1 can be reliably maintained by performing the substrate shape fixing step as necessary.

In the third manufacturing method and the manufacturing method using the flexible circuit board on which the wiring layer is already formed, the copper-clad flexible board or the flexible circuit board is bonded and fixed to the board base material using an adhesive. However, the first and second manufacturing methods (including the modified example of the second manufacturing method) do not use an adhesive, and the resin itself for forming the insulating resin layer 13 is directly covered on the plate base material. By forming the insulating resin layer 13 by attaching, the insulating resin layer 13 and the copper foil 24 can be integrated with the plate base material 18.
Therefore, there is no separate adhesive layer for bonding and fixing between the insulating resin layer 13 of the flexible circuit board portion 5 and the plate-like substrate 4, and the insulating resin layer 13 is directly covered on the plate-like substrate 4. An integrated structure can be obtained. For this reason, compared with the case where the adhesive layer for the adhesion fixation of a flexible circuit board part and the plate-shaped base material 4 exists separately, there exists an advantage that high heat dissipation (heat dissipation to a plate-shaped base material) can be ensured. is there.

Since the bendable deformable wiring board 2 uses the plastically deformable plate-like base material 4, the degree of freedom in design is high, and light emitting modules having various shapes can be easily obtained. Since the plate-like substrate 4 can be plastically deformed, the three-dimensional shape can be stably maintained.
Moreover, since the flexible circuit board part 5 is laminated | stacked on the plate-shaped base material 4 before bending molding, damage to the light emitting element 3 or a soldering part does not reach. In addition, the flexible circuit board portion 5 is less likely to be lifted with respect to the plate-like substrate 4.
For this reason, the adhesiveness of the plate-shaped base material 4 and the flexible circuit board part 5 is securable. Therefore, the heat transfer efficiency from the flexible circuit board part 5 to the plate-like base material 4 can be improved, and the heat dissipation required when the LED or the like is mounted can be ensured satisfactorily. Moreover, peeling and dropping off of the flexible circuit board portion 5 can be prevented.
Moreover, since the flexible circuit board part 5 is laminated | stacked on the plate-shaped base material 4 before bending shaping | molding, compared with the conventional product with which FPC is affixed on a complicated three-dimensional shaped base material, the flexible circuit board part 5 is easily plate-mounted. The substrate 4 can be laminated without a gap. Therefore, manufacture becomes easy and cost reduction becomes possible.

Since the bendable deformable wiring board 2 uses the plate-like base material 4 that can be plastically deformed, it can be configured to maintain a three-dimensional shape by itself.
That is, since the three-dimensional shape can be made autonomously (that is, without excessively depending on other support members), the structure can be simplified. Therefore, manufacturing can be facilitated and cost can be reduced. Furthermore, the durability of the bendable deformable wiring board 2 can be enhanced.

Moreover, in the manufacturing method of the said bending deformable wiring board 2, since the flexible circuit board part 5 is laminated | stacked on the plate-shaped base material 4 before bending-molding, it is the conventional method of sticking FPC to a solid-shaped base material. In comparison, the positioning accuracy of the flexible circuit board portion 5 with respect to the plate-like substrate 4 can be increased.
Therefore, it is possible to prevent the light emitting element 3 and the soldered portion from reaching the bent position of the plate-like base material 4 due to the positional deviation of the flexible circuit board portion 5 and prevent the light emitting element 3 and the soldered portion from being damaged.

FIG. 11 is a cross-sectional view of the light emitting module 31 of the second embodiment.
The light emitting module 31 is different from the light emitting module 1 of the first embodiment in that the bendable deformable wiring board 2 has a substantially truncated-conical bottomed cylindrical shape with the flexible circuit board portion 5 side inside.
In the light emitting module 31, the light emitting element 3 is provided on the inner surface side of the bending deformable wiring board 2.
As shown in FIG. 12, the shape of the bendable deformable wiring board 2 may be fixed by the shape fixing member 11 on the outer surface side of the bendable deformable wiring board 2.

FIGS. 13-15 shows the light emitting module 41 of 3rd Embodiment.
FIG. 13 is a perspective view of the light emitting module 41. FIG. 14 is a cross-sectional view of the light emitting module 41. FIG. 15 is an enlarged cross-sectional view of a main part of the light emitting module 41.
The plate-like substrate 4 is bent at a plurality of bent portions 10 such that one surface 4a on which the flexible circuit board portion 5 is formed is on the outer surface side (outer peripheral side), and an axis parallel to the forming direction of the bent portions 10 Is a bowl shape (in the example shown, a bowl shape having a C-shaped cross section).
The bendable deformable wiring board 42 in the illustrated example is a combination of twelve elongated plate-like plate-like portions 44 each composed of an elongated plate-like base plate piece 43 and a flexible circuit board portion 5 having the same shape. It has become a shape.

16 and 17 show the light emitting module 51 of the fifth embodiment.
FIG. 16 is a perspective view of the bendable deformable wiring board 52. 17 is a perspective view of the light emitting module 51. FIG.
As shown in FIG. 16, the bendable deformable wiring board 52 is formed in an elongated plate shape.
As shown in FIG. 17, in the light emitting module 51, the bendable deformable wiring board 52 is formed in a spiral shape so that one surface 4a on which the flexible circuit board portion 5 is formed is on the outer surface side (outer peripheral side). Therefore, the cylinder has a constant diameter.
External circuit connection terminal portions 8 are formed at two locations on the flexible circuit board portion 5, and the wiring pattern of the wiring layer 14 is connected to the external circuit connection terminal portion 8 with a power supply line 9 (see FIG. 1) of the external circuit for power supply. It is formed so that power can be supplied to all the mounting parts 7 by connecting them.

In addition, this invention is not limited to the above-mentioned embodiment.
The shape of the light emitting module is not limited to that of the above-described embodiment, and can be changed as appropriate.
The light emitting module according to the present invention can realize various shapes by bending a bendable wiring board. For example, the concave plate-like bending deformable wiring board and the light emitting module are not limited to those having a C-shaped cross section, and may be, for example, those having a square cross section or a U-shaped cross section.
Electronic components mounted on the bendable wiring board are not limited to light emitting elements such as LEDs. A light emitting element other than an LED, for example, an LD (semiconductor laser element; LD: Laser Diode) may be employed. In addition to the light emitting element, the electronic component may be provided with an IC chip for driving control such as blinking of the light emitting element.
Moreover, it is also possible to employ a light emitting element that outputs ultraviolet light or infrared light. In this case, the light source of the device for light irradiation to a photoresponsive material such as a photocurable resin material, food, It can be widely used as a light source for medical sterilization devices, a laser light source for medical laser irradiation devices, and the like.

DESCRIPTION OF SYMBOLS 1, 31, 41, 51 ... Light emitting module 2, 42, 52 ... Bendable deformable wiring board, 3 ... Light emitting element (electronic component), 4 ... Plate-like base material, 5 ... -Flexible circuit board part, 10 ... Bending part, 11 ... Shape fixing member, 13 ... Insulating resin layer, 14 ... Wiring layer, 15 ... Electrode part, 6d, 12e ... Engaging protrusions, 12f, 12g ... locking portions, 22 ... single-sided copper-clad flexible substrate, 23 ... plastic resin film, 24 ... copper foil, 25 ... laminate with wiring, 27 ... Copper foil with semi-cured resin layer, 28 ... Thermosetting semi-cured resin layer, 29 ... Thermosetting semi-cured resin layer, 31 ... Resin film, 32 ... Copper-clad flexible substrate 33 ... Adhesive.

Claims (15)

  A flexible circuit board portion having an electrically insulating insulating resin layer and a wiring layer is laminated so as to cover one side of a plastically deformable plate-like base material, and electronic components are placed at a plurality of spaced apart locations on the flexible circuit board portion. A wiring substrate capable of bending deformation, wherein an electrode part for mounting is provided.   The resin for forming the insulating resin layer of the flexible circuit board portion is a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer. The bendable deformable wiring board as described.   3. The plate-like base material is made of an aluminum plate or a copper plate, or a filler mixed resin in which a filler having a higher thermal conductivity than the base resin is mixed with a base resin, or a liquid crystal polymer. Bending deformable wiring board.   In order to connect the plate-like base members to each other so as to be adjacent to each other by bending and / or bending, an engaging protrusion protrudes from one of the portions, and the other of the portions The bendable deformable wiring board according to any one of claims 1 to 3, wherein a locking portion for locking the engaging protruding piece is formed.   A light emitting module, wherein light emitting elements are mounted at a plurality of locations of the bendable deformable wiring board according to claim 1.   6. The bending deformable wiring board of the light emitting module according to claim 5, wherein a bent portion and / or a curved portion is formed, and the bent portions or the curved portions of the bent deformable wiring substrate are separated from each other or the curved portions are mutually connected. A light emitting module, wherein light emitting elements are mounted at a plurality of spaced locations.   The light emitting module according to claim 6, wherein a member for fixing the shape of the bendable deformable wiring board is provided on the back side of the plate-like substrate.   The light emitting module according to any one of claims 5 to 7, wherein the bendable deformable wiring board has a portion that is bent and formed into a cylindrical shape or a bowl shape. A light emitting element mounting step of mounting light emitting elements at a plurality of locations of the flexible circuit board portion of the bending deformable wiring board according to any one of claims 1 to 4,
A method of manufacturing a light emitting module, comprising: a bending step of bending the bendable deformable wiring board into a three-dimensional shape.   The board shape fixing step of fixing the shape of the bendable deformable wiring board by providing a member for fixing the shape of the bendable deformable wiring board on the back side of the plate-like base material. The manufacturing method of the light emitting module of description. A method for producing a bendable deformable wiring board according to any one of claims 1 to 4,
A flexible substrate bonding step in which a single-sided copper-clad flexible substrate in which a copper foil is integrated only on one side of a thermoplastic resin film is bonded to one side of the plate-like base material by thermally welding the thermoplastic resin film. And a patterning step of patterning the copper foil to form a wiring pattern including the electrode portion after the flexible substrate bonding step. A method for producing a bendable deformable wiring board according to any one of claims 1 to 4,
A curable semi-cured resin layer, which is a semi-cured curable resin layer formed on one side of the copper foil, or separated from the copper foil and the plate-like substrate base material by a semi-cured curable resin. The curable semi-cured resin sheet, which is a formed sheet, is heated and cured in a state of being sandwiched between the copper foil and the plate-like base material, thereby forming the curable resin layer and the copper foil A flexible substrate forming step integrated with a plate-like base material, and a patterning step of patterning the copper foil to form a wiring pattern including the electrode portion after the flexible substrate forming step. A method for manufacturing a bendable deformable wiring board. A method for producing a bendable deformable wiring board according to any one of claims 1 to 4,
A substrate bonding step of bonding a copper-clad flexible substrate in which a copper foil is integrated on one side or both sides of a resin film using an adhesive to one side of the plate-like base material, and after this substrate bonding step, And a patterning step of patterning a copper foil located on the opposite side of the plate-like base material through the film of the copper-clad flexible substrate to form a wiring pattern including the electrode part. A method for manufacturing a bendable deformable wiring board. The process up to the patterning step is performed on a plate-like substrate base material of a size that can cut out one or a plurality of the plate-like substrates,
After the patterning step, a wiring substrate cutting step is performed in which the flexible printed circuit board portion is integrated on one side of the plate base material to cut the laminated board with wiring to obtain the bending deformable wiring substrate. The method for manufacturing a bending deformable wiring board according to any one of claims 11 to 13.   A resin for forming a thermoplastic resin film on a single-sided copper-clad substrate according to claim 11, a resin for forming a curable semi-cured resin layer or a curable semi-cured resin sheet according to claim 12, and a resin for a copper-clad substrate according to claim 13. The film-forming resin is a filler-mixed resin obtained by mixing a base resin with a filler having a higher thermal conductivity than the base resin, or a liquid crystal polymer, according to any one of claims 11 to 13. A method of manufacturing a bending deformable wiring board.

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