KR102524142B1 - Data driver and display apparatus including the same - Google Patents

Abstract

The data driver comprises a circuit board including a first surface on which a plurality of grooves are defined and a second surface opposite to the first surface, an element layer disposed on the second surface of the circuit board, and a circuit board disposed on the grooves. It includes a plurality of flexible layers, and the flexible layers include a polymer material having flexibility.

Description

Data driver and display device including the same {DATA DRIVER AND DISPLAY APPARATUS INCLUDING THE SAME}

The present invention relates to a data driver and a display device including the same, and more particularly, to a data driver having flexibility and a display device including the same.

Display devices such as monitors, iPads, smart phones, and tablet PCs that provide images to users include display panels that display images. As a display panel, various display panels such as a liquid crystal display panel, an organic light emitting display panel, an electrowetting display panel, and an electrophoretic display panel this is being developed

Recently, display devices having a flexible display panel that can be folded or rolled and a stretchable display panel that is stretchable in at least one direction have been developed along with the technological development of display devices. Such display devices have an advantage in that they can be deformed into a preset shape or deformed into various shapes according to a user's request.

A flexible display panel includes a plastic substrate having flexibility and a plurality of electronic devices disposed on the substrate. Electronic elements include a plurality of pixels for displaying an image. A data driver for driving pixels may be disposed on the flexible display panel. The data driver may be formed as an integrated circuit chip and mounted on the flexible display panel. The data driver is of a rigid type that is not easily bent unlike a flexible display panel having flexibility.

An object of the present invention is to provide a data driver having flexibility and a display device including the same.

The data driver according to an embodiment of the present invention includes a circuit board including a first surface on which a plurality of grooves are defined and a second surface opposite to the first surface, and an element layer disposed on the second surface of the circuit board. , and a plurality of flexible layers disposed in the grooves, wherein the flexible layers include a polymer material having flexibility.

The grooves extend in a first direction and are arranged in the second direction crossing the first direction.

The grooves are arranged at equal intervals in the second direction.

The grooves extend to an end of the circuit board in the first direction.

In the second direction, a width of each of the grooves and a width of the circuit board between grooves adjacent to each other are the same.

The circuit board is a silicon substrate.

The flexible layers include polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), polyethersulfone (PES), or polymethyl methacrylate (PMMA).

The circuit board may include first substrate portions in which the grooves are defined when looking at the first surface of the circuit board and second substrate portions between the first substrate portions when looking at the first surface of the circuit board. comprising substrate portions, wherein each of the first substrate portions has a first thickness, each of the second substrate portions has a second thickness, and the device layer has a third thickness; The sum of the third thickness is less than or equal to 200 micrometers and greater than or equal to 30 micrometers, and the sum of the second thickness and the third thickness is greater than 200 micrometers.

The first thickness is less than or equal to 180 micrometers and greater than or equal to 10 micrometers.

A display device according to an exemplary embodiment of the present invention includes a display panel including a plurality of pixels connected to a plurality of gate lines, a plurality of data lines, and a plurality of emission lines, generating scan signals and outputting scan signals to the gate lines. a scan driver that is connected, a data driver that generates data voltages and is connected to the data lines, and a light-emitting driver that generates light-emitting signals and that is connected to the light-emitting lines, wherein the data driver includes a plurality of grooves in which a plurality of grooves are defined. A circuit board including a first surface and a second surface opposite to the first surface and facing the display panel, disposed on the second surface of the circuit board to generate the data voltages, and connected to the data lines. An element layer and a plurality of flexible layers disposed in the grooves, wherein the flexible layers include a polymer material having flexibility.

The data driver of the display device according to an exemplary embodiment of the present invention may have flexibility by forming a plurality of grooves on a rear surface of a circuit board of the data driver and disposing flexible layers in the grooves.

1 is a plan view of a display device according to an exemplary embodiment of the present invention.
FIG. 2 is an equivalent circuit diagram of one of pixels disposed in the display panel shown in FIG. 1 .
FIG. 3 is a side view of the data driver shown in FIG. 1 viewed from a first direction.
FIG. 4 is an upper plan view of the data driver shown in FIG. 1 viewed from the top of the data driver.
FIG. 5 is a cross-sectional view along the line II′ shown in FIG. 4 .
FIG. 6 is a diagram illustrating a bent state of the data driver shown in FIG. 5 .
7 to 9 are diagrams illustrating a configuration of a data driver of a display device according to various embodiments of the present disclosure.

Advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only the present embodiments make the disclosure of the present invention complete, and those skilled in the art in the art to which the present invention belongs It is provided to fully inform the person of the scope of the invention, and the invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

When an element or layer is referred to as being "on" or "on" another element or layer, it is not only directly on the other element or layer, but also when another layer or other element is intervening therebetween. All inclusive. On the other hand, when an element is referred to as “directly on” or “directly on”, it indicates that another element or layer is not intervened. “And/or” includes each and every combination of one or more of the recited items.

The spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe the correlation between elements or components and other elements or components. Spatially relative terms should be understood as encompassing different orientations of elements in use or operation in addition to the orientations shown in the figures. Like reference numbers designate like elements throughout the specification.

Although first, second, etc. are used to describe various elements, components and/or sections, it is needless to say that these elements, components and/or sections are not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Accordingly, it goes without saying that the first element, first element, or first section referred to below may also be a second element, second element, or second section within the spirit of the present invention.

Embodiments described herein will be described with reference to plan and cross-sectional views, which are ideal schematic diagrams of the present invention. Accordingly, the shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes. Accordingly, the regions illustrated in the drawings have schematic properties, and the shapes of the regions illustrated in the drawings are intended to illustrate a specific shape of a region of a device and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a plan view of a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , a display device 100 according to an exemplary embodiment of the present invention includes a display panel 110, a scan driver 120, a data driver 130, and a light emitting driver 140. ) (emission driver).

The display panel 110 may be a flexible display panel having flexibility. For example, the display panel 110 may include a substrate made of a flexible plastic material and a plurality of electronic devices disposed on the substrate. The display panel 110 may have a long side in the first direction DR1 and a short side in the second direction DR2 .

The scan driver 120 , the data driver 130 , and the light emitting driver 140 may be defined as drivers that drive the display panel 110 . The display panel 110 may be driven by a driving unit to display an image.

The flat area of the display panel 110 includes a display area DA and a non-display area NDA disposed around the display area DA. The display area DA is an area displaying an image, and the non-display area NDA may be defined as an area not displaying an image.

The display panel 110 includes a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, and a plurality of emission lines EL1 to ELm. . m and n are natural numbers. Although one pixel PX is shown in FIG. 1 for convenience of explanation, a plurality of pixels PX are substantially disposed on the display panel 110 .

The pixels PX are disposed in the display area DA of the display panel 110 . The pixels PX are arranged in a matrix form and are connected to scan lines SL1 to SLm, data lines DL1 to DLn, and emission lines EL1 to ELm. The scan driver 120 , the data driver 130 , and the light emitting driver 140 are disposed in the non-display area NDA of the display panel 110 .

The scan lines SL1 to SLm extend in the second direction DR2 and are connected to the scan driver 120 . The scan lines SL1 to SLm receive scan signals from the scan driver 120 .

The data lines DL1 to DLn extend in the first direction DR1 and are connected to the data driver 130 . The data lines DL1 to DLn receive data voltages from the data driver 130 .

The light emitting lines EL1 to ELm extend in the second direction DR2 and are connected to the light emitting driver 140 . The light emitting lines EL1 to ELm receive light emitting signals from the light emitting driver 140 .

The scan driver 120 may be disposed in the non-display area NDA adjacent to the left side of the display area DA. The scan driver 120 generates a plurality of scan signals, and the scan signals are applied to the pixels PX through the scan lines SL1 to SLm. Scan signals may be sequentially applied to the pixels PX.

The data driver 130 may be disposed in the non-display area NDA adjacent to the upper side of the display area DA. The data driver 130 generates a plurality of data voltages, and the data voltages are applied to the pixels PX through the data lines DL1 to DLn.

The data driver 130 may be manufactured in the form of an integrated circuit chip and disposed on the display panel 110 . The data driver 130 may be defined as a source driver IC (source driver IC). The data driver 130 has flexibility, and this configuration will be described in detail with reference to FIGS. 5 and 6 hereinafter.

The light emitting driver 140 may be disposed in the non-display area NDA adjacent to the right side of the display area DA. The light emitting driver 140 generates a plurality of light emitting signals, and the light emitting signals are applied to the pixels PX through the light emitting lines EL1 to ELm.

Although not shown, the display device 100 includes a timing controller for controlling operations of the scan driver 120 , the data driver 130 , and the light emitting driver 140 . The timing controller generates a scan control signal, a data control signal, and an emission control signal in response to control signals received from the outside. Also, the timing controller receives video signals from the outside and converts the data format of the video signals to meet interface specifications with the data driver 130 .

The scan driver 120 generates scan signals in response to the scan control signal, and the light emitting driver 140 generates light emitting signals in response to the light emission control signal. The data driver 130 receives the image signals whose data format is converted, and generates data voltages corresponding to the image signals in response to a data control signal.

The pixels PX receive data voltages in response to scan signals. The pixels PX may display an image by generating light having luminance corresponding to the data voltages. The emission time of the pixels PX may be controlled by emission signals.

FIG. 2 is an equivalent circuit diagram of one of pixels disposed in the display panel shown in FIG. 1 .

Although the configuration of only one pixel PX is shown in FIG. 2 , the pixels PX disposed on the display panel 110 have the same configuration as the pixel PX shown in FIG. 2 .

Referring to FIG. 2 , the pixel PX includes a corresponding scan line SLi among scan lines SL1 to SLm, a corresponding data line DLj among data lines DL1 to DLn, and emission lines ( EL1 to ELm) are connected to corresponding emission lines ELi. i is a natural number less than or equal to m, and j is a natural number less than or equal to n.

The pixel PX includes a light emitting element OLED, a driving transistor T1 , a capacitance element Cst, a switching transistor T2 , and an emission control transistor T3 . The light emitting device OLED may be defined as an organic light emitting diode.

The source terminal of the driving transistor T1 receives the first voltage ELVDD, and the drain terminal of the driving transistor T1 is connected to the source terminal of the emission control transistor T3. A gate terminal of the driving transistor T1 is connected to a drain terminal of the switching transistor T2.

A gate terminal of the switching transistor T2 is connected to the scan line SLi, and a source terminal of the switching transistor T2 is connected to the data line DLj. A first electrode of the capacitance element Cst is connected to the source terminal of the driving transistor T1, and a second electrode of the capacitance element Cst is connected to the gate terminal of the driving transistor T1.

A gate terminal of the light emitting control transistor T3 is connected to the light emitting line ELi, and a drain terminal of the light emitting control transistor T3 is connected to the anode electrode of the light emitting element OLED. The cathode electrode of the light emitting element OLED receives the second voltage ELVSS. The second voltage ELVSS may have a lower level than the first voltage ELVDD.

The switching transistor T2 is turned on in response to the scan signal SCAN provided through the scan line SLi. The turned-on switching transistor T2 applies the data voltage DATA received through the data line DLj to the gate terminal of the driving transistor T1. The capacitance element Cst charges the data voltage DATA applied to the gate terminal of the driving transistor T1 and maintains it even after the switching transistor T2 is turned off.

A gate terminal of the light emitting control transistor T3 is turned on in response to the light emitting signal EM provided through the light emitting line ELi. The turned-on light emitting control transistor T3 serves to provide the current Ioled flowing through the driving transistor T1 to the organic light emitting diode OLED. The pixel PX may emit light while the emission signal EM is applied. The light emitting element OLED emits light with different intensity according to the amount of current Ioled received.

For example, the transistors T1 to T3 of the pixel PX are PMOS transistors, but are not limited thereto, and the transistors T1 to T3 of the pixel PX may be NMOS transistors.

FIG. 3 is a side view of the data driving unit shown in FIG. 1 viewed from a second direction. FIG. 4 is an upper plan view of the data driver shown in FIG. 1 viewed from the top of the data driver. FIG. 5 is a cross-sectional view along the line II′ shown in FIG. 4 .

Referring to FIG. 3 , the data driver 130 includes a circuit board SUB and a device layer DY disposed under the circuit board SUB. The circuit board SUB may be a silicon substrate. The data driver 130 may be a semiconductor chip made of a silicon wafer.

The circuit board SUB includes a first surface BS and a second surface FS opposite to the first surface BS, and the second surface FS of the circuit board SUB is the display panel 110 . ) face to face. The device layer DY may be disposed on the second surface FS of the circuit board SUB. Hereinafter, the first surface BS of the circuit board SUB is referred to as the rear surface BS of the circuit board SUB, and the second surface FS of the circuit board SUB is referred to as the front surface FS of the circuit board SUB. ) is called

Although not shown, the device layer DY may include a plurality of transistors and is connected to the display panel 110 through the bump electrodes BE. Substantially, the device layer DY may be electrically connected to the data lines DL1 to DLn through the bump electrodes BE and generate data voltages.

Referring to FIGS. 4 and 5 , the data driver 130 may have a rectangular shape having a long side in the second direction DR2 and a short side in the first direction DR1 . The data driver 130 includes a plurality of flexible layers 10 disposed in a plurality of grooves G1 defined on the rear surface BS of the circuit board SUB.

The grooves G1 are formed by being depressed from a predetermined area of the back surface BS of the circuit board SUB toward the front surface FS of the circuit board SUB by a predetermined depth. The grooves G1 extend in the first direction DR1, are arranged in the second direction DR2, and may extend to an end of the circuit board SUB in the first direction DR1. Accordingly, the flexible layers 10 disposed in the grooves G1 also extend in the first direction DR1 and are arranged in the second direction DR2, and extend to the end of the circuit board SUB in the first direction DR1. It can be.

The grooves G1 may be arranged at equal intervals in the second direction DR2, but are not limited thereto, and the grooves G1 may be arranged at uneven intervals in the second direction DR2. Accordingly, the flexible layers 10 disposed in the grooves G1 may also be arranged at equal intervals or at uneven intervals in the second direction DR2 .

The flexible layers 10 disposed in the grooves G1 have flexibility. The flexible layers 10 may include a polymer having a flexible characteristic. For example, the flexible layers 10 may include flexible polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), polyethersulfone (PES), or polymethyl methacrylate (PMMA). can include

Although not shown, during the manufacturing process of the data driver 130, the circuit board SUB may be etched to a predetermined depth to form grooves G1. After a flexible polymer material is applied to the grooves G1 , the polymer material is cured to form the flexible layers 10 .

Hereinafter, the areas of the data driver 130 overlapping the grooves G1 when looking at the rear surface BS of the circuit board SUB are defined as first areas A1, and between the first areas A1 Areas of the data driver 130 of are defined as second areas A2.

The circuit board SUB includes first substrate parts SP1, which are parts of the circuit board SUB disposed in the first areas A1, and parts of the circuit board SUB disposed in the second areas A2. It includes second substrate portions SP2 that are drawn in. The first substrate parts SP1 are parts of the circuit board SUB in which grooves G1 are defined when looking at the rear surface BS of the circuit board SUB, and the second substrate parts SP2 are the first substrate parts SP2. These are parts of the circuit board SUB between the substrate parts SP1.

The device layer DY includes first device portions DP1 that are portions of the device layer DY disposed in the first regions A1 and portions of the device layer DY disposed in the second regions A2. and second element parts DP2. Hereinafter, the thickness of each component of the present invention will be described based on a direction perpendicular to a plane parallel to the first and second directions DR1 and DR2.

The first width W1 defined as the width of each of the grooves G1 in the second direction DR2 and the second width W2 defined as the width of the circuit board SUB between the grooves G1 adjacent to each other are can be the same However, it is not limited thereto, and the first width W1 and the second width W2 may be different from each other.

Each of the first substrate parts SP1 of the circuit board SUB has a first thickness T1, and each of the second substrate parts SP2 of the circuit board SUB has a thickness thicker than the first thickness T1. 2 thickness T2. The device layer DY has a third thickness T3, and each of the flexible layers 10 has a fourth thickness T4. The depth of each of the grooves G1 has the same value as the fourth thickness T4. The sum of the first thickness T1 of each of the first substrate portions SP1 and the fourth thickness T4 of each of the flexible layers 10 may be equal to the second thickness T2.

The first areas A1 of the data driver 130 have flexibility, and the second areas A2 of the data driver 130 have rigid characteristics. For example, in a portion of the data driver 130 excluding the flexible layers 10, when the thickness of the data driver 130 is less than or equal to 200 micrometers, the data driver 130 may have flexibility, When the thickness of the data driver 130 is greater than 200 micrometers, the data driver 130 has rigid characteristics.

In each first region A1, the ratio between the first thickness T1 of the first substrate part SP1 of the circuit board SUB and the third thickness T3 of the first element part DP1 of the device layer DY The sum may be less than or equal to 200 microns and greater than or equal to 30 microns. In each second region A2, the second thickness T2 of the second substrate part SP2 of the circuit board SUB and the third thickness T3 of the second element part DP2 of the device layer DY The sum may be greater than 200 micrometers.

For example, the thickness of the device layer DY may be set to 20 micrometers. The device layer DY can be stably disposed on the silicon substrate only when it is disposed on the silicon substrate having a predetermined thickness or more. The thickness of the silicon substrate for stably disposing the device layer DY should be greater than or equal to 10 micrometers.

When the sum of the first thickness T1 and the third thickness T3 is less than or equal to 200 micrometers and the thickness of the device layer DY is 20 micrometers, the first thickness T1 is less than 180 micrometers. is equal to or greater than or equal to 10 micrometers.

As the grooves G1 are formed in the first areas A1 of the circuit board SUB, the first areas A1 of the data driver 130 may have flexibility. As the first regions A1 of the data driver 130 are bent, the data driver 130 may be bent as a whole even if the second regions A2 have rigid characteristics.

Since the thickness of the circuit board SUB disposed in the first areas A1 is smaller than that of the second areas A2, the first substrate parts SP1 of the circuit board SUB are less likely to be weakened by external impact. can Therefore, cracks or the like may be generated in the first substrate parts SP1 of the circuit board SUB due to an external impact.

In an embodiment of the present invention, since the flexible layers 10 having flexibility are disposed in the grooves G1 to absorb external impact, damage to the first substrate parts SP1 of the circuit board SUB is prevented. this can be prevented. In addition, when the first substrate portions SP1 of the circuit board SUB are bent, the flexible layers 10 having flexibility may also be bent.

FIG. 6 is a diagram illustrating a bent state of the data driver shown in FIG. 5 .

Referring to FIG. 6 , since the first substrate parts SP1 and the first element parts DP1 disposed in the first areas A1 of the data driver 130 may be bent, the data driver 130 may bend as a whole. When the flexible display panel 110 is bent, the data driver 130 may be bent together with the display panel 110 .

As a result, the data driver 130 of the display device 100 according to the embodiment of the present invention forms a plurality of grooves G1 on the rear surface BS of the circuit board SUB, and the grooves G1 have flexibility. Flexibility can be obtained by disposing the flexible layers 10 having .

7 to 9 are diagrams illustrating a configuration of a data driver of a display device according to various embodiments of the present disclosure.

Except for the shape of the grooves G1, G2, G3, and G4 being different, the data driving units 130_1, 130_2, and 130_3 shown in FIGS. 7 to 9 are substantially the same as the data driving unit 130 shown in FIG. has the same configuration as Accordingly, a configuration different from that of the data driver 130 shown in FIG. 1 will be described with reference to FIGS. 7 to 9 .

7 to 9 illustrate plan views of the data drivers 130_1, 130_2, and 130_3 for convenience of description.

Referring to FIG. 7 , the data driver 130_1 includes a plurality of flexible layers 20 disposed in a plurality of grooves G2 defined on the rear surface BS of the data driver 130_1 .

The grooves G2 extend in the second direction DR2 and are arranged in the first direction DR1. The grooves G2 may extend to an end of the circuit board SUB in the second direction DR2 . The grooves G2 may be arranged at equal intervals in the first direction DR1, but are not limited thereto, and the grooves G2 may be arranged unevenly at various intervals in the first direction DR1. there is.

Although not shown, the depth of the grooves G2 is the same as that of the grooves G1 shown in FIGS. 4 and 5, and the flexible layers 20 disposed in the grooves G2 are shown in FIGS. 4 and 5. It includes the same material as the flexible layers 10 . The flexible layers 20 disposed in the grooves G2 have flexibility, and regions of the data driver 130_1 overlapping the grooves G2 have flexibility. As a result, the data driver 130_1 may be bent as a whole.

Referring to FIG. 8 , the data driver 130_2 includes a plurality of flexible layers 10 and 20 disposed in a plurality of grooves G1 and G2 defined on the rear surface BS of the data driver 130_2 .

The grooves G1 and G2 extend in the first direction DR1 and include a plurality of first grooves G1 arranged in the second direction DR2 and extending in the second direction DR2 and extending in the first direction DR1. A plurality of second grooves G2 are arranged. The first grooves G1 are substantially the same as the grooves G1 shown in FIGS. 4 and 5 , and the second grooves G2 are substantially the same as the grooves G2 shown in FIG. 7 . The first grooves G1 and the second grooves G2 are formed to cross each other, and the depths of the first and second grooves G1 and G2 are the same as those of the grooves G1 shown in FIGS. 4 and 5 . .

The flexible layers 10 and 20 include a plurality of first flexible layers 10 disposed in the first grooves G1 and a plurality of second flexible layers 20 disposed in the second grooves G2 . The first flexible layers 10 are the same as the flexible layers 10 shown in FIGS. 4 and 5 , and the second flexible layers 20 are the same as the flexible layers 20 shown in FIG. 7 . The first flexible layers 10 and the second flexible layers 20 cross each other, and the first and second flexible layers 10 and 20 are made of the same material as the flexible layers 10 shown in FIGS. 4 and 5. include

The first and second flexible layers 10 and 20 disposed in the first and second grooves G1 and G2 have flexibility and overlap the first and second grooves G1 and G2. ) have flexibility. As a result, the data driver 130_2 may be bent as a whole.

Referring to FIG. 9 , the data driver 130_3 includes a plurality of flexible layers 30 and 40 disposed in a plurality of grooves G3 and G4 defined on the rear surface BS of the data driver 130_3.

The grooves G3 and G4 are disposed adjacent to the boundary of the circuit board SUB on a plane, and extend in the third groove G3 having a rectangular frame shape and in the first direction DR1 and extending in the second direction DR2. It includes a plurality of fourth grooves (G4) arranged in the. The fourth grooves G4 are disposed within the rectangular area defined by the third groove G3 and extend to the third groove G3 in the second direction DR2. The third and fourth grooves G3 and G4 have the same depth as the grooves G1 shown in FIGS. 4 and 5 .

The flexible layers 30 and 40 include a third flexible layer 30 disposed in the third groove G3 and a plurality of fourth flexible layers 40 disposed in the fourth grooves G4 . The third and fourth flexible layers 30 and 40 include the same material as the flexible layers 10 shown in FIGS. 4 and 5 .

The third and fourth flexible layers 30 and 40 disposed in the third and fourth grooves G3 and G4 have flexibility and overlap the third and fourth grooves G3 and G4. The data driver 130_3 ) have flexibility. As a result, the data driver 130_3 may be bent as a whole.

Although described with reference to the above embodiments, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the present invention described in the claims below. You will be able to. In addition, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, and all technical ideas within the scope of the following claims and their equivalents should be construed as being included in the scope of the present invention. .

100: display device 110: display panel
120: scan driver 130,130_1,130_2,130_3: data driver
140: light emitting driver 10, 20, 30, 40: flexible layer
SUB: circuit board DY: element layer
G1, G2, G3, G4: Groove SP1, SP2: First and second board parts
DP1, DP2: first and second element parts

Claims (20)

a circuit board including a first surface on which a plurality of grooves are defined and a second surface opposite to the first surface;
an element layer disposed on the second surface of the circuit board; and
Including a plurality of flexible layers disposed in the grooves,
The data driver of claim 1 , wherein the flexible layers include a polymer material having flexibility. According to claim 1,
The grooves extend in a first direction and are arranged in a second direction crossing the first direction. According to claim 2,
The grooves are arranged at equal intervals in the second direction. According to claim 2,
The grooves extend to an end of the circuit board in the first direction. According to claim 2,
The data driver of claim 1 , wherein a width of each of the grooves and a width of the circuit board between grooves adjacent to each other are the same in the second direction. According to claim 1,
The circuit board is a data driver comprising a silicon substrate. According to claim 1,
The flexible layers include polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), polyethersulfone (PES), or polymethyl methacrylate (PMMA). According to claim 1,
The circuit board,
first substrate portions in which the grooves are defined when looking at the first surface of the circuit board; and
including second substrate portions between the first substrate portions when looking at the first surface of the circuit board;
Each of the first substrate portions has a first thickness, each of the second substrate portions has a second thickness, and the device layer has a third thickness;
The sum of the first thickness and the third thickness is less than or equal to 200 micrometers and greater than or equal to 30 micrometers, and the sum of the second thickness and the third thickness is greater than 200 micrometers. According to claim 8,
The first thickness is less than or equal to 180 micrometers and greater than or equal to 10 micrometers. According to claim 1,
The grooves are arranged in a first direction and extend in a second direction crossing the first direction. According to claim 1,
The flexible layers,
a plurality of first flexible layers extending in a first direction among the grooves, arranged in a second direction crossing the first direction, and disposed in the plurality of first grooves defined on the first surface of the circuit board; and
and a plurality of second flexible layers extending in the second direction among the grooves and disposed in a plurality of second grooves arranged in the first direction and defined on the first surface of the circuit board. According to claim 1,
The flexible layers,
a third flexible layer disposed adjacent to a boundary of the circuit board among the grooves, having a rectangular frame shape, and disposed in a third groove defined on the first surface of the circuit board; and
a plurality of fourth flexible layers extending in a first direction and arranged in a second direction crossing the first direction and disposed in a plurality of fourth grooves defined in the first surface of the circuit board;
The fourth groove is disposed within a rectangular area defined by the third groove and extends to the third groove in the first direction. a display panel including a plurality of pixels connected to a plurality of gate lines, a plurality of data lines, and a plurality of emission lines;
a scan driver generating scan signals and connected to the gate lines;
a data driver generating data voltages and connected to the data lines; and
A light emitting driver that generates light emitting signals and is connected to the light emitting lines;
The data driver,
a circuit board including a first surface on which a plurality of grooves are defined and a second surface facing the display panel and opposite to the first surface;
an element layer disposed on the second surface of the circuit board to generate the data voltages and connected to the data lines; and
Including a plurality of flexible layers disposed in the grooves,
The flexible layers include a flexible polymer material. According to claim 13,
The grooves extend in a first direction to an end of the circuit board and are evenly arranged in a second direction crossing the first direction. 15. The method of claim 14,
The display device of claim 1 , wherein a width of each of the grooves and a width of the circuit board between grooves adjacent to each other are the same in the second direction. According to claim 13,
When looking at the first surface of the circuit board, first regions of the data driver overlapping the grooves are flexible, and second regions of the data driver between the first regions are rigid. According to claim 13,
The circuit board is a silicon substrate, and the display panel is flexible. According to claim 13,
The flexible layers include polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), polyethersulfone (PES), or polymethyl methacrylate (PMMA). According to claim 13,
The circuit board,
first substrate portions in which the grooves are defined when looking at the first surface of the circuit board; and
including second substrate portions between the first substrate portions when looking at the first surface of the circuit board;
Each of the first substrate portions has a first thickness, each of the second substrate portions has a second thickness, and the device layer has a third thickness;
The display device of claim 1 , wherein the sum of the first thickness and the third thickness is less than or equal to 200 micrometers and greater than or equal to 30 micrometers, and the sum of the second thickness and the third thickness is greater than 200 micrometers. According to claim 19,
The first thickness is less than or equal to 180 micrometers and greater than or equal to 10 micrometers.

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