JP2017174828A - Lighting device, heat sink and light-emitting element substrate - Google Patents

Lighting device, heat sink and light-emitting element substrate Download PDF

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JP2017174828A
JP2017174828A JP2017118227A JP2017118227A JP2017174828A JP 2017174828 A JP2017174828 A JP 2017174828A JP 2017118227 A JP2017118227 A JP 2017118227A JP 2017118227 A JP2017118227 A JP 2017118227A JP 2017174828 A JP2017174828 A JP 2017174828A
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emitting element
heat sink
light emitting
substrate
lighting device
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JP6726643B2 (en
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克行 沖村
Katsuyuki Okimura
克行 沖村
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Hotalux Ltd
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NEC Lighting Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting device that can suppress an increase in the whole length while acquiring sufficient heat radiation effect.SOLUTION: A lighting device 10 includes: a light-emitting element substrate 2; a heat sink 1; and a blower 3. The light-emitting element substrate 2 is implemented with a light-emitting element 21. The heat sink 1 has a cylindrical shape having an opening at each end thereof. The light-emitting element substrate 2 is disposed on at least an outside surface of the heat sink 1. The blower 3 is capable of blowing air from one opening to the other opening of the heat sink 1.SELECTED DRAWING: Figure 4

Description

本発明は、照明装置、ヒートシンク及び発光素子基板に関する。   The present invention relates to a lighting device, a heat sink, and a light emitting element substrate.

近年、従来の白熱電球及び蛍光ランプを代替する照明装置として、発光ダイオード(LED)を用いた電球が、種々開発されている。このようなLED電球では、従来の照明装置との置き換えを考慮する必要があるため、その大きさに制限がある場合が多い。このため、前記LED電球では、その性能を満足させるための放熱を、決められた大きさの中で行う必要がある。   In recent years, various light bulbs using light emitting diodes (LEDs) have been developed as illumination devices that replace conventional incandescent bulbs and fluorescent lamps. In such an LED bulb, since it is necessary to consider replacement with a conventional lighting device, the size of the LED bulb is often limited. For this reason, in the said LED bulb | ball, it is necessary to perform the thermal radiation for satisfying the performance in the determined magnitude | size.

特に、白熱電球代替用のLED電球の場合、置き換える白熱電球の大きさは規定されている上、置き換えた際の違和感を抑えるために発光面積を増大させる必要があり、放熱に使用できる面積が限られている。   In particular, in the case of an LED bulb for replacing an incandescent bulb, the size of the incandescent bulb to be replaced is specified, and it is necessary to increase the light emitting area in order to suppress the uncomfortable feeling at the time of replacement. It has been.

この放熱の問題を解決するものとして、ヒートシンクと送風装置を組み合わせた効率的なLED冷却手段を備えた照明装置が提案されている(特許文献1)。   As a solution to the problem of heat dissipation, an illuminating device including an efficient LED cooling means in which a heat sink and a blower are combined has been proposed (Patent Document 1).

特開2012−199181号公報JP 2012-199181 A

しかしながら、特許文献1に記載の照明装置では、放熱効果は充分であるものの、長手方向の寸法が増大する。   However, in the lighting device described in Patent Document 1, although the heat dissipation effect is sufficient, the dimension in the longitudinal direction increases.

そこで、本発明は、充分な放熱効果を得ながら、全長の増大を抑制可能な照明装置、並びにそれに用いられるヒートシンク及び発光素子基板を提供することを目的とする。   Accordingly, an object of the present invention is to provide a lighting device that can suppress an increase in the total length while obtaining a sufficient heat dissipation effect, and a heat sink and a light emitting element substrate used therefor.

前記目的を達成するために、本発明の照明装置は、
発光素子基板と、ヒートシンクと、送風機とを含み、
前記発光素子基板には、発光素子が実装され、
前記ヒートシンクは、両端に開口を備えた筒状であり、
前記ヒートシンクの少なくとも外側面に、前記発光素子基板が配置され、
前記送風機により、前記ヒートシンクの一方の開口から他方の開口に送風可能とされている
ことを特徴とする。
In order to achieve the above object, the lighting device of the present invention comprises:
Including a light emitting element substrate, a heat sink, and a blower;
A light emitting element is mounted on the light emitting element substrate,
The heat sink is cylindrical with openings at both ends,
The light emitting element substrate is disposed on at least an outer surface of the heat sink,
The air blower can blow air from one opening of the heat sink to the other opening.

本発明のヒートシンクは、
前記本発明の照明装置に用いられ、
両端に開口部を備えた筒状である
ことを特徴とする。
The heat sink of the present invention is
Used in the illumination device of the present invention,
It has a cylindrical shape with openings at both ends.

本発明の発光素子基板は、
発光素子、電極及び基板を含み、
前記基板は、複数の発光素子配置部及び電極配置部を含み、
前記発光素子及び前記電極は、回路で接続され、
前記複数の発光素子配置部は、並列的に隣同士が連結した状態で配置され、
前記発光素子配置部の並列的に配置された方向の両端を接近させることで、前記基板を両端が開口した略筒状に湾曲可能である
ことを特徴とする。
The light emitting device substrate of the present invention is
Including a light emitting element, an electrode and a substrate,
The substrate includes a plurality of light emitting element arrangement portions and electrode arrangement portions,
The light emitting element and the electrode are connected by a circuit,
The plurality of light emitting element arrangement portions are arranged in a state where the neighbors are connected in parallel,
The substrate can be bent into a substantially cylindrical shape with both ends opened by bringing both ends of the light emitting element arrangement portion in the parallel arrangement direction close to each other.

本発明によれば、充分な放熱効果を得ながら、全長の増大を抑制可能な照明装置、並びにそれに用いられるヒートシンク及び発光素子基板を提供することができる。   According to the present invention, it is possible to provide an illumination device capable of suppressing an increase in the total length while obtaining a sufficient heat dissipation effect, and a heat sink and a light emitting element substrate used therefor.

図1(A)は、本発明のヒートシンクの一例を示す上方向から見た斜視図であり、図1(B)は、本発明のヒートシンクの一例を示す下方向から見た斜視図である。FIG. 1A is a perspective view of an example of the heat sink of the present invention as viewed from above, and FIG. 1B is a perspective view of an example of the heat sink of the present invention as viewed from below. 図2(A)〜(C)は、本発明のヒートシンクのその他の例を示す上方向から見た斜視図である。2A to 2C are perspective views of another example of the heat sink of the present invention as seen from above. 図3(A)は、本発明の発光素子基板の一例の略筒状に湾曲する前の状態を示す概略平面図であり、図3(B)は、図3(A)に示す発光素子基板を図1(A)及び(B)に示すヒートシンクに取付けた状態を示す上方向から見た斜視図である。FIG. 3A is a schematic plan view showing a state before an approximately cylindrical shape of an example of the light emitting element substrate of the present invention, and FIG. 3B is a light emitting element substrate shown in FIG. It is the perspective view seen from the upper direction which shows the state attached to the heat sink shown to FIG. 1 (A) and (B). 図4(A)は、本発明の照明装置の構成の一例を示す分解側面図であり、図4(B)は、図4(A)に示す照明装置のI−I方向から見た断面図である。4A is an exploded side view showing an example of the structure of the lighting device of the present invention, and FIG. 4B is a cross-sectional view of the lighting device shown in FIG. It is.

以下、本発明の照明装置、ヒートシンク及び発光素子基板について、図面を参照して詳細に説明する。ただし、本発明は、以下の説明に限定されない。なお、以下の図1から図4において、同一部分には、同一符号を付し、その説明を省略する場合がある。また、図面においては、説明の便宜上、各部の構造は適宜簡略化して示す場合があり、各部の寸法比等は、実際とは異なり、模式的に示す場合がある。   Hereinafter, a lighting device, a heat sink, and a light emitting element substrate of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. In addition, in the following FIGS. 1-4, the same code | symbol is attached | subjected to the same part and the description may be abbreviate | omitted. In the drawings, for convenience of explanation, the structure of each part may be simplified as appropriate, and the dimensional ratio of each part may be schematically shown, unlike the actual case.

[ヒートシンク]
まず、本発明のヒートシンクについて説明する。本発明のヒートシンクは、後述の本発明の照明装置に用いられる。図1(A)は、本発明のヒートシンクの一例を示す上方向から見た斜視図である。図1(B)は、本発明のヒートシンクの一例を示す下方向から見た斜視図である。図1(A)及び(B)に示すように、このヒートシンク1は、両端に開口を備えた筒状である。本発明のヒートシンク1は、両端に開口を備えた筒状であることで、一方(図1(A)及び(B)において、上方又は下方)の開口からヒートシンク1内部に外気を取り込み、他方(図1(A)及び(B)において、下方又は上方)の開口から排気することができ、放熱効果に優れる。
[heatsink]
First, the heat sink of the present invention will be described. The heat sink of this invention is used for the illuminating device of this invention mentioned later. FIG. 1A is a perspective view showing an example of the heat sink of the present invention as viewed from above. FIG. 1B is a perspective view showing an example of the heat sink of the present invention as seen from below. As shown in FIGS. 1A and 1B, the heat sink 1 has a cylindrical shape with openings at both ends. The heat sink 1 of the present invention has a cylindrical shape with openings at both ends, so that outside air is taken into the heat sink 1 from one (upper or lower in FIGS. 1A and 1B) and the other ( In FIGS. 1A and 1B, the air can be exhausted from the opening in the lower or upper direction, and the heat dissipation effect is excellent.

ヒートシンク1の形成材料としては、例えば、アルミニウム及びその合金、マグネシウム及びその合金、鉄及びその合金、銅及びその合金、チタン及びその合金等があげられる。マグネシウム及びその合金を用いれば、より軽量化することが可能となる。鉄及びその合金を用いれば、製造コストをより低減可能となる。銅及びその合金を用いれば、放熱特性をより向上可能となる。チタン及びその合金を用いれば、強度をより向上可能となる。また、ヒートシンク1の形成材料は、例えば、熱伝導性フィラーを含有させた樹脂でもよい。前記樹脂としては、例えば、ポリブチレンテレフタレート(PBT)、ポリエチレンテレフタレート(PET)、ポリカーボネート(PC)、ポリアミド(PA),ポリフェニレンサルファイド(PPS)、ポリメタクリル酸メチル(PMMA)等があげられる。   Examples of the material for forming the heat sink 1 include aluminum and its alloys, magnesium and its alloys, iron and its alloys, copper and its alloys, titanium and its alloys, and the like. If magnesium and its alloy are used, the weight can be further reduced. If iron and its alloy are used, manufacturing cost can be further reduced. If copper and its alloy are used, the heat dissipation characteristics can be further improved. If titanium and its alloy are used, the strength can be further improved. Further, the material for forming the heat sink 1 may be, for example, a resin containing a heat conductive filler. Examples of the resin include polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polycarbonate (PC), polyamide (PA), polyphenylene sulfide (PPS), polymethyl methacrylate (PMMA), and the like.

本発明のヒートシンク1は、図1(B)に示すように、側面の少なくとも一部が、傾斜しており、前記傾斜した側面の内壁から突出した熱拡散部材1aを有することが好ましい。熱拡散部材1aを有することで、ヒートシンク1の表面積が増大し、放熱効果により優れる。図1(B)では、熱拡散部材1aとして複数のピン部材を示しているが、熱拡散部材1aは、フィン(羽)部材等であってもよい。また、本発明のヒートシンク1は、後述の本発明の照明装置に用いられ、両端に開口を備えた筒状でありさえすればよく、図2(A)に示す円筒形であってもよいし、図2(B)に示す円筒と円錐の一部とを組み合わせた形状であってもよいし、図2(C)に示す多面体状であってもよい。   As shown in FIG. 1B, the heat sink 1 of the present invention preferably has a thermal diffusion member 1a that is inclined at least partially on the side surface and protrudes from the inner wall of the inclined side surface. By having the heat diffusing member 1a, the surface area of the heat sink 1 is increased, and the heat dissipation effect is excellent. In FIG. 1B, a plurality of pin members are shown as the heat diffusing member 1a, but the heat diffusing member 1a may be a fin (feather) member or the like. Further, the heat sink 1 of the present invention may be used in the lighting device of the present invention described later, and only needs to have a cylindrical shape having openings at both ends, and may have a cylindrical shape shown in FIG. 2B may be a combination of a cylinder and a part of a cone, or may be a polyhedron shown in FIG.

[発光素子基板]
つぎに、図3を参照して、本発明の発光素子基板について説明する。図3(A)は、本発明の発光素子基板の一例の略筒状に湾曲する前の状態を示す概略平面図である。図3(B)は、図3(A)に示す発光素子基板を図1(A)及び(B)に示すヒートシンク1に取付けた状態を示す上方向から見た斜視図である。
[Light Emitting Element Substrate]
Next, the light-emitting element substrate of the present invention will be described with reference to FIG. FIG. 3 (A) is a schematic plan view showing a state before being bent into a substantially cylindrical shape as an example of the light emitting element substrate of the present invention. 3B is a perspective view seen from above showing a state in which the light emitting element substrate shown in FIG. 3A is attached to the heat sink 1 shown in FIGS. 1A and 1B.

図3(A)に示すように、この発光素子基板2は、発光素子21と、電極(陽極22及び陰極23)と、基板24とを含む。基板24は、8つの発光素子配置部25a〜25h並びに2つの電極配置部26a及び26bを含む。発光素子21及び前記電極は、回路で接続されている(図示省略)。8つの発光素子配置部25a〜25hは、並列的に隣同士が連結した状態で配置されている。電極配置部26a及び26bの形成箇所は、特に制限されないが、図3(A)に示すように、基板24の中央部であることが好ましい。本発明の発光素子基板において、発光素子配置部及び電極配置部の数は、図3(A)に示す例に限定されない。図3(A)に示す例では、陽極22及び陰極23が、それぞれ独立した電極配置部26a及び26bに配置されているが、陽極22及び陰極23は、一つの電極配置部にまとめて配置されていてもよい。   As shown in FIG. 3A, the light emitting element substrate 2 includes a light emitting element 21, electrodes (anode 22 and cathode 23), and a substrate 24. The substrate 24 includes eight light emitting element arrangement portions 25a to 25h and two electrode arrangement portions 26a and 26b. The light emitting element 21 and the electrode are connected by a circuit (not shown). Eight light emitting element arrangement | positioning parts 25a-25h are arrange | positioned in the state in which the adjoining mutually connected in parallel. The location where the electrode placement portions 26a and 26b are formed is not particularly limited, but is preferably the central portion of the substrate 24 as shown in FIG. In the light-emitting element substrate of the present invention, the number of light-emitting element arrangement portions and electrode arrangement portions is not limited to the example illustrated in FIG. In the example shown in FIG. 3A, the anode 22 and the cathode 23 are arranged in independent electrode arrangement portions 26a and 26b, respectively, but the anode 22 and the cathode 23 are arranged together in one electrode arrangement portion. It may be.

基板24は、後述のように、両端が開口した略筒状に湾曲可能であれば、いかなる材料を用いて形成してもよい。基板24の形成材料としては、例えば、ポリイミド、シリコーン等があげられ、ポリイミドであることが特に好ましい。   As will be described later, the substrate 24 may be formed using any material as long as it can be bent into a substantially cylindrical shape with both ends opened. Examples of the material for forming the substrate 24 include polyimide and silicone, and polyimide is particularly preferable.

発光素子21としては、例えば、LED、有機EL、無機EL等があげられ、LEDであることが好ましい。LEDは、特に限定されず、従来公知のものを使用できるが、白色LEDであることが好ましい。発光素子21は、熱伝導性に優れた基板24に形成された配線パターン上に実装されている。発光素子基板2では、発光素子21が、例えば、シリコーン樹脂等に内包され、前記シリコーン樹脂中に蛍光体が分散されていてもよい。このような態様においては、例えば、発光素子21を、青色LEDとし、前記蛍光体を、黄色蛍光体又は赤・緑蛍光体の組み合わせとすることで、白色光を得ることができる。また、発光素子21を、近紫外LED(UV−LED)とし、前記蛍光体を、赤・緑・青蛍光体の組み合わせ(RGB蛍光体)とすることでも、白色光を得ることができる。   Examples of the light emitting element 21 include an LED, an organic EL, an inorganic EL, and the like, and an LED is preferable. Although LED is not specifically limited, A conventionally well-known thing can be used, but it is preferable that it is white LED. The light emitting element 21 is mounted on a wiring pattern formed on the substrate 24 excellent in thermal conductivity. In the light emitting element substrate 2, the light emitting element 21 may be included in, for example, a silicone resin, and a phosphor may be dispersed in the silicone resin. In such an embodiment, for example, white light can be obtained by using the light emitting element 21 as a blue LED and the phosphor as a combination of a yellow phosphor or a red / green phosphor. Moreover, white light can also be obtained by using the light emitting element 21 as a near-ultraviolet LED (UV-LED) and the phosphor as a combination of red, green, and blue phosphors (RGB phosphor).

本発明の発光素子基板2は、発光素子配置部の並列的に配置された方向の両端を接近させることで、図3(B)に示すように、両端が開口した略筒状に湾曲して、図1(A)及び(B)に示すヒートシンク1に取付け可能である。発光素子基板2のヒートシンク1への取付け方法は、特に限定されず、例えば、両面テープ、接着剤等を用いて取付け可能である。例えば、発光素子基板1の裏面に発光素子基板1と略同形状の両面テープを貼りつけておき、ヒートシンク1に巻きつけることで、容易に取付け可能である。   The light emitting element substrate 2 of the present invention is bent into a substantially cylindrical shape with both ends opened as shown in FIG. 3 (B) by bringing both ends of the light emitting element arrangement portion in the parallel arrangement direction close to each other. The heat sink 1 shown in FIGS. 1A and 1B can be attached. The method for attaching the light emitting element substrate 2 to the heat sink 1 is not particularly limited, and for example, the light emitting element substrate 2 can be attached using a double-sided tape, an adhesive, or the like. For example, by attaching a double-sided tape having substantially the same shape as the light emitting element substrate 1 on the back surface of the light emitting element substrate 1 and winding it around the heat sink 1, it can be easily attached.

[照明装置]
つぎに、図4を参照して、図3(B)に示す発光素子基板2が取付けられたヒートシンク1(以下、「ヒートシンク1」と言う。)を用いた場合を例にとり、本発明の照明装置について説明する。図4(A)は、本発明の照明装置の構成の一例を示す分解側面図である。図4(B)は、図4(A)に示す照明装置のI−I方向から見た断面図である。図4(A)及び(B)に示すように、この照明装置10は、筐体(口金6、電力供給用部材カバー5及び光学カバー7)と、ヒートシンク1と、送風機3と、電力供給用部材4とを含む。前記筐体及び電力供給用部材4は任意の構成部材であり、照明装置10に含まれなくてもよいが、含まれることが好ましい。
[Lighting device]
Next, referring to FIG. 4, the case of using the heat sink 1 (hereinafter referred to as “heat sink 1”) to which the light emitting element substrate 2 shown in FIG. The apparatus will be described. FIG. 4A is an exploded side view showing an example of the configuration of the lighting device of the present invention. FIG. 4B is a cross-sectional view of the lighting device illustrated in FIG. As shown in FIGS. 4A and 4B, the lighting device 10 includes a housing (a base 6, a power supply member cover 5 and an optical cover 7), a heat sink 1, a blower 3, and a power supply. Member 4. The casing and the power supply member 4 are arbitrary constituent members and may not be included in the lighting device 10, but are preferably included.

前記筐体は、口金6、電力供給用部材カバー5及び光学カバー7がこの順で配置されることで構成されている。電力供給用部材カバー5の一端(図4(A)及び(B)においては、下端)は、口金6に嵌合している。電力供給用部材カバー5の他端(図4(A)及び(B)においては、上端)は、光学カバー7の一端(図4(A)及び(B)においては、下端)と嵌合している。光学カバー7は、光透過性材料を用いて形成されている。電力供給用部材カバー5は、光透過性材料を用いて形成されていてもよいし、光透過性材料以外の材料を用いて形成されていてもよい。光学カバー7及び電力供給用部材カバー5は、光透過性材料を用いて一部材として形成されていてもよい。光学カバー7、電力供給用部材カバー5及び口金6としては、公知の照明装置用のカバー及び口金を用いてよい。   The housing is configured by arranging a base 6, a power supply member cover 5 and an optical cover 7 in this order. One end of the power supply member cover 5 (the lower end in FIGS. 4A and 4B) is fitted to the base 6. The other end of the power supply member cover 5 (the upper end in FIGS. 4A and 4B) is engaged with one end of the optical cover 7 (the lower end in FIGS. 4A and 4B). ing. The optical cover 7 is formed using a light transmissive material. The power supply member cover 5 may be formed using a light transmissive material, or may be formed using a material other than the light transmissive material. The optical cover 7 and the power supply member cover 5 may be formed as one member using a light transmissive material. As the optical cover 7, the power supply member cover 5, and the base 6, known covers and bases for lighting devices may be used.

電力供給用部材カバー5の内部には、口金6側(図4(A)及び(B)においては、下側)から順に、電力供給用部材4及びヒートシンク1の一端側(図4(A)及び(B)においては、下側)の一部が配置され、送風機3が、ヒートシンク1の一端側(図4(A)及び(B)においては、下側)内部に配置されている。ヒートシンク1の他端側(図4(A)及び(B)においては、上側)は、電力供給用部材カバー5の口金6と反対側(図4(A)及び(B)においては、上側)に突出している。この電力供給用部材カバー5から突出したヒートシンク1の他端側(図4(A)及び(B)においては、上側)を覆うように光学カバー7が配置されることで、照明装置10が構成されている。ただし、送風機3は、ヒートシンク1の一方の開口から他方の開口に送風可能であれば前記筐体内部のいかなる箇所に配置してもよく、例えば、ヒートシンク1の口金6と反対側(図4(A)及び(B)においては、上側)に配置してもよい。   Within the power supply member cover 5, one end side of the power supply member 4 and the heat sink 1 is sequentially formed from the base 6 side (the lower side in FIGS. 4A and 4B) (FIG. 4A). And in (B), a part of lower side is arrange | positioned, and the air blower 3 is arrange | positioned inside the one end side (lower side in FIG. 4 (A) and (B)) of the heat sink 1. FIG. The other end of the heat sink 1 (the upper side in FIGS. 4A and 4B) is the opposite side of the base 6 of the power supply member cover 5 (the upper side in FIGS. 4A and 4B). Protruding. The illumination device 10 is configured by arranging the optical cover 7 so as to cover the other end side of the heat sink 1 protruding from the power supply member cover 5 (the upper side in FIGS. 4A and 4B). Has been. However, the blower 3 may be arranged at any location inside the housing as long as it can blow air from one opening of the heat sink 1 to the other opening. In A) and (B), it may be arranged on the upper side).

電力供給用部材4は、照明装置10の外部から口金6に供給された電力を発光素子21及び送風機3に供給するための部材であり、公知の照明装置用の電力供給用部材を用いてよい。前述のとおり、電力供給用部材4は、任意の構成部材であり、照明装置10の外部から供給された電力を口金6から発光素子21及び送風機3に直接供給する場合には、本発明の照明装置に含まれなくともよい。送風機3については、後述する。   The power supply member 4 is a member for supplying the power supplied to the base 6 from the outside of the illumination device 10 to the light emitting element 21 and the blower 3, and a known power supply member for the illumination device may be used. . As described above, the power supply member 4 is an arbitrary component, and when the power supplied from the outside of the illumination device 10 is directly supplied from the base 6 to the light emitting element 21 and the blower 3, the illumination according to the present invention. It does not have to be included in the device. The blower 3 will be described later.

電力供給用カバー5は、口金6と反対側(図4(A)及び(B)においては、上側)の側壁に周方向に並んだ複数の開口51を有し、かつ、口金6側(図4(A)及び(B)においては、下側)の側壁に周方向に並んだ複数の開口52を有する。図4(A)及び(B)に示す照明装置10において、送風機3を動作させて口金6側(図4(A)及び(B)においては、下側)に送風すると、図4(B)に矢印で示すように、照明装置10外部の大気が開口51から照明装置10内部へと流入し、それにより、光学カバー7内部の気体がヒートシンク1の口金6と反対側(図4(A)及び(B)においては、上側)の開口からヒートシンク1内部へと送り込まれる。ヒートシンク1の内部に送り込まれた前記気体は、熱拡散部材1aにより放熱された発光素子の発した熱により温められ、ヒートシンク1の口金6側(図4(A)及び(B)においては、下側)の開口から送風機3へと送られる。送風機3に送られた前記気体は、電力供給用部材4を通過して、開口52から照明装置10外部へと排出される。   The power supply cover 5 has a plurality of openings 51 arranged in the circumferential direction on the side wall opposite to the base 6 (the upper side in FIGS. 4A and 4B), and the base 6 side (FIG. 4 (A) and 4 (B) have a plurality of openings 52 arranged in the circumferential direction on the lower side wall. In the illuminating device 10 shown in FIGS. 4A and 4B, when the blower 3 is operated to blow air to the base 6 side (lower side in FIGS. 4A and 4B), FIG. As shown by the arrows in FIG. 4, the atmosphere outside the lighting device 10 flows into the lighting device 10 from the opening 51, whereby the gas inside the optical cover 7 is opposite to the base 6 of the heat sink 1 (FIG. 4A). And in (B), it is sent into the inside of the heat sink 1 from the opening on the upper side. The gas sent into the heat sink 1 is warmed by the heat generated by the light emitting element radiated by the heat diffusing member 1a, and the bottom of the heat sink 1 on the base 6 side (in FIGS. 4 (A) and 4 (B)) Side) opening to the blower 3. The gas sent to the blower 3 passes through the power supply member 4 and is discharged from the opening 52 to the outside of the lighting device 10.

図4(A)及び(B)に示すように、前記筐体の側壁が、ヒートシンク1内部と連通する二箇所以上の開口51及び52を有することが、放熱効果がより高まることから好ましい。ただし、前記筐体側壁の開口は、照明装置10内部の気体と照明装置10外部の大気とを入れ替え可能であることから、一つでもよい。   As shown to FIG. 4 (A) and (B), it is preferable that the side wall of the said housing | casing has two or more openings 51 and 52 connected with the inside of the heat sink 1 from the heat dissipation effect improving more. However, the number of openings in the side wall of the housing may be one because the gas inside the lighting device 10 and the atmosphere outside the lighting device 10 can be interchanged.

送風機3としては、例えば、市販品を用いてよい。送風機3は、一定時間毎に送風方向を逆向きにできるものであることが好ましい。このような送風機3を用いることで、図4(B)に矢印で示すのと逆向きの気流を生じさせることができ、これにより、電力供給用部材カバー5内部の口金6側(図4(A)及び(B)においては、下側)に塵埃が堆積するのを抑制できる。   As the blower 3, for example, a commercially available product may be used. It is preferable that the blower 3 can reverse the blowing direction at regular intervals. By using such a blower 3, an airflow in the direction opposite to that shown by the arrow in FIG. 4 (B) can be generated, whereby the base 6 side inside the power supply member cover 5 (FIG. 4 ( In A) and (B), dust can be prevented from accumulating on the lower side.

ヒートシンク1及び送風機3を用いた本発明の照明装置によれば、充分な放熱効果を得ながら、全長の増大を抑制することが可能である。例えば、図4(A)及び(B)に示す照明装置10では、全長を、市販の75形ミニクリプトンランプの全長81mmよりも短い77mmとし、全光束を75形ミニクリプトンランプと同等の1000lmとすることが可能である。   According to the illumination device of the present invention using the heat sink 1 and the blower 3, it is possible to suppress an increase in the total length while obtaining a sufficient heat dissipation effect. For example, in the illumination device 10 shown in FIGS. 4A and 4B, the total length is 77 mm shorter than the total length 81 mm of a commercially available 75-type mini-krypton lamp, and the total luminous flux is 1000 lm, which is equivalent to the 75-type mini-krypton lamp. Is possible.

以上、実施形態を参照して本発明を説明したが、本発明は、上記実施形態に限定されるものではない。本発明の構成や詳細には、本発明のスコープ内で当業者が理解しうる様々な変更をすることができる。   The present invention has been described above with reference to the embodiments. However, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

本発明によれば、充分な放熱効果を得ながら、全長の増大を抑制可能な照明装置を提供することができる。本発明の照明装置は、幅広い用途に用いることが可能である。   According to the present invention, it is possible to provide an illumination device capable of suppressing an increase in the total length while obtaining a sufficient heat dissipation effect. The lighting device of the present invention can be used for a wide range of applications.

1 ヒートシンク
1a 熱拡散部材
2 発光素子基板
3 送風機
4 電力供給用部材
5 電力供給用部材カバー
6 口金
7 光学カバー
10 照明装置
21 発光素子
22、23 電極
24 基板
25a〜26h 発光素子配置部
26a、26b 電極配置部
DESCRIPTION OF SYMBOLS 1 Heat sink 1a Thermal diffusion member 2 Light emitting element substrate 3 Blower 4 Power supply member 5 Power supply member cover 6 Base 7 Optical cover 10 Illuminating device 21 Light emitting element 22, 23 Electrode 24 Substrate 25a-26h Light emitting element arrangement | positioning part 26a, 26b Electrode placement section

Claims (11)

発光素子基板と、ヒートシンクと、送風機とを含み、
前記発光素子基板には、発光素子が実装され、
前記ヒートシンクは、両端に開口部を備えた筒状であり、
前記ヒートシンクの少なくとも外側面に、前記発光素子基板が配置され、
前記送風機により、前記ヒートシンクの一方の開口から他方の開口に送風可能とされている
ことを特徴とする照明装置。
Including a light emitting element substrate, a heat sink, and a blower;
A light emitting element is mounted on the light emitting element substrate,
The heat sink is cylindrical with openings at both ends,
The light emitting element substrate is disposed on at least an outer surface of the heat sink,
The lighting device, wherein the blower can blow air from one opening of the heat sink to the other opening.
前記ヒートシンクの側面の一部又は全部が、傾斜しており、
前記ヒートシンクが、前記傾斜した側面の内壁から突出した熱拡散部材を有する、
請求項1記載の照明装置。
A part or all of the side surface of the heat sink is inclined,
The heat sink has a heat diffusion member protruding from an inner wall of the inclined side surface.
The lighting device according to claim 1.
さらに、筐体を含み、
前記筐体は、一端に口金を備え、かつ、側壁に開口を有し、
前記筐体内部に、少なくとも外側面に前記発光素子基板が配置された前記ヒートシンク、及び前記送風機が配置され、
前記ヒートシンクの一方の開口が前記筐体の口金と反対側に位置し、かつ、前記ヒートシンクの他方の開口が前記筐体の口金側に位置する、
請求項1又は2記載の照明装置。
Furthermore, including a housing,
The housing includes a base at one end, and an opening on the side wall,
Inside the housing, the heat sink in which the light emitting element substrate is arranged at least on the outer surface, and the blower are arranged,
One opening of the heat sink is located on the opposite side of the base of the housing, and the other opening of the heat sink is located on the base side of the housing;
The lighting device according to claim 1.
前記筐体の側壁が、前記ヒートシンクの内部と連通する二箇所以上に開口を有する、
請求項3記載の照明装置。
The side wall of the housing has openings at two or more places communicating with the inside of the heat sink.
The lighting device according to claim 3.
前記送風機により、前記ヒートシンクの他方の開口から一方の開口へも送風可能とされている、
請求項1から4のいずれか一項に記載の照明装置。
By the blower, it is possible to blow air from the other opening of the heat sink to one opening,
The illumination device according to any one of claims 1 to 4.
前記発光素子が、LEDである、
請求項1から5のいずれか一項に記載の照明装置。
The light emitting element is an LED;
The illumination device according to any one of claims 1 to 5.
請求項1から6のいずれか一項に記載の照明装置に用いられ、
両端に開口部を備えた筒状である
ことを特徴とするヒートシンク。
It is used for the lighting device according to any one of claims 1 to 6,
A heat sink characterized by being cylindrical with openings at both ends.
側面の一部又は全部が、傾斜しており、
前記傾斜した側面の内壁から突出した熱拡散部材を有する、
請求項7記載のヒートシンク。
A part or all of the side surface is inclined,
A heat diffusion member protruding from the inner wall of the inclined side surface,
The heat sink according to claim 7.
発光素子、電極及び基板を含み、
前記基板は、複数の発光素子配置部及び電極配置部を含み、
前記発光素子及び前記電極は、回路で接続され、
前記複数の発光素子配置部は、並列的に隣同士が連結した状態で配置され、
前記発光素子配置部の並列的に配置された方向の両端を接近させることで、前記基板を両端が開口した略筒状に湾曲可能である
ことを特徴とする発光素子基板。
Including a light emitting element, an electrode and a substrate,
The substrate includes a plurality of light emitting element arrangement portions and electrode arrangement portions,
The light emitting element and the electrode are connected by a circuit,
The plurality of light emitting element arrangement portions are arranged in a state where the neighbors are connected in parallel,
A light emitting element substrate characterized in that the substrate can be bent into a substantially cylindrical shape with both ends opened by bringing both ends of the light emitting element arrangement portion in a parallel arrangement direction close to each other.
前記電極配置部が、前記基板の中央部に形成されている、
請求項9記載の発光素子基板。
The electrode placement portion is formed in the central portion of the substrate,
The light emitting device substrate according to claim 9.
前記発光素子が、LEDである、
請求項9又は10記載の発光素子基板。
The light emitting element is an LED;
The light emitting element substrate according to claim 9 or 10.
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JP2002184209A (en) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd Lighting system
JP2005037465A (en) * 2003-07-16 2005-02-10 Matsushita Electric Ind Co Ltd Light emitting display device
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