JP2009176925A - Electric bulb type light emitting diode lighting fixture - Google Patents

Electric bulb type light emitting diode lighting fixture Download PDF

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JP2009176925A
JP2009176925A JP2008013656A JP2008013656A JP2009176925A JP 2009176925 A JP2009176925 A JP 2009176925A JP 2008013656 A JP2008013656 A JP 2008013656A JP 2008013656 A JP2008013656 A JP 2008013656A JP 2009176925 A JP2009176925 A JP 2009176925A
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emitting diode
light
circuit board
illuminating device
light emitting
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Toshiya Iwakiri
敏哉 岩切
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Hotalux Ltd
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NEC Lighting Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric bulb type light emitting diode lighting fixture of excellent emission efficiency and long life. <P>SOLUTION: The electric bulb type light emitting diode lighting fixture comprises a heat radiation plate 2 on which light emitting diode elements 1 are mounted, a circuit board 3 on which electronic components are mounted, and a cover member 4 which houses the heat radiation plate 2 and the circuit board 3, and a part of which is made from a translucent member through which the light emitted from the light emitting diode elements 1 transmits. The circuit board 3 is arranged away from the heat radiation plate 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電球型発光ダイオード照明装置に関する。   The present invention relates to a light bulb type light emitting diode illumination device.

発光ダイオード(LED:Light Emitting Diode)素子は、フィラメント電球に比べて長寿命、低消費電力、軽量などの特長を有しており、近年、フィラメント電球に代替して用いることができる発光ダイオード素子を用いた電球型の照明装置が注目されている。   A light emitting diode (LED) element has features such as long life, low power consumption, and light weight compared to a filament light bulb. In recent years, a light emitting diode element that can be used in place of a filament light bulb is used. The bulb-type lighting device used has attracted attention.

発光ダイオード素子は、発光時に熱を発することにより温度が上昇するが、一般に、温度の上昇に伴い発光効率が低下するという特性を有している。また、発光ダイオード素子は、高温になることにより損傷を受けると短寿命化する。そのため、発光ダイオード素子を用いた照明装置では、発光時に発光ダイオード素子の温度の上昇が抑制されるように構成されている必要がある。   The light-emitting diode element has a characteristic that the temperature rises by emitting heat at the time of light emission, but generally the light-emitting efficiency decreases as the temperature rises. In addition, the life of the light-emitting diode element is shortened when it is damaged by high temperature. For this reason, an illuminating device using a light emitting diode element needs to be configured to suppress an increase in temperature of the light emitting diode element during light emission.

発光時に発光ダイオード素子の温度の上昇が抑制されるように構成されている電球型発光ダイオード照明装置が特許文献1に開示されている。   Patent Document 1 discloses a light bulb-type light-emitting diode illuminating device configured to suppress an increase in temperature of a light-emitting diode element during light emission.

また、電球型発光ダイオード照明装置は、内部に回路基板が配置されることにより、明るさや色彩などを自在に制御されることが可能であり、フィラメント電球に比べて多彩な機能を発揮することができる点においてもメリットがある。   In addition, the bulb-type light-emitting diode illuminating device can freely control brightness, color, etc. by arranging a circuit board inside, and can exhibit various functions compared to filament bulbs. There is a merit in the point that can be done.

図3は、本発明に関連する電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。この電球型発光ダイオード照明装置は、カバー部材104の内部に、発光ダイオード素子101が発光時に発する熱を放出する放熱板102と、放熱板102に当接して配置された回路基板103と、を有している。
特開2001−243809号公報
FIG. 3 is a cross-sectional view showing the inside of the cover member of the light bulb type light emitting diode illuminating device related to the present invention. This bulb-type light-emitting diode illuminating device has a heat radiating plate 102 that emits heat generated when the light-emitting diode element 101 emits light, and a circuit board 103 disposed in contact with the heat radiating plate 102 inside the cover member 104. is doing.
Japanese Patent Laid-Open No. 2001-243809

図3に示した電球型発光ダイオード照明装置では、回路基板103が放熱板102に当接しているため、発光ダイオード素子101が発光時に発する熱により回路基板103に実装された電子部品等が損傷を受けることにより短寿命化することがある。またそれと同時に、回路基板103によって、発光ダイオード素子101の、放熱板102による放熱が妨げられることにもなるため、発光ダイオード素子101の発光効率の低下および短寿命化にもつながる。   In the light bulb type light emitting diode illuminating device shown in FIG. 3, since the circuit board 103 is in contact with the heat sink 102, the electronic components mounted on the circuit board 103 are damaged by the heat generated by the light emitting diode element 101 during light emission. The life may be shortened by receiving. At the same time, the circuit board 103 prevents the heat dissipation of the light emitting diode element 101 by the heat dissipation plate 102, leading to a decrease in the light emission efficiency of the light emitting diode element 101 and a shortened life.

そこで、本発明は、発光効率に優れ、かつ長寿命の電球型発光ダイオード照明装置を提供することを目的とする。   Then, an object of this invention is to provide the light-emitting diode illuminating device which is excellent in luminous efficiency and has a long lifetime.

上記目的を達成するため、本発明の電球型発光ダイオード照明装置は、発光ダイオード素子が実装された放熱板と、電子部品が実装された回路基板と、前記放熱板および前記回路基板を内部に収容し、少なくとも一部が前記発光ダイオード素子から発せられる光を透過させる透光部材で構成されたカバー部材と、を有する電球型発光ダイオード照明装置において、前記回路基板は、前記放熱板から離間した位置に配置されている。   In order to achieve the above object, a light bulb type light emitting diode illuminating device of the present invention includes a heat sink on which a light emitting diode element is mounted, a circuit board on which an electronic component is mounted, and the heat sink and the circuit board accommodated therein. A light-emitting diode illuminating device having at least a portion made of a translucent member that transmits light emitted from the light-emitting diode element, wherein the circuit board is positioned away from the heat sink Is arranged.

本発明によれば、発光効率に優れ、かつ長寿命の電球型発光ダイオード照明装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, it is excellent in luminous efficiency and can provide the light-emitting diode illuminating device with a long lifetime.

次に、本発明の実施形態について図面を参照して説明する。
(第1の実施形態)
図1は本発明の第1の実施形態に係る電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。本実施形態に係る電球型発光ダイオード照明装置は、通電されることにより発光する発光ダイオード素子1と、発光ダイオード素子1が実装され、発光ダイオード素子1が発光時に発する熱を放出する放熱板2と、発光ダイオード素子1を制御する電子部品(不図示)等が実装された回路基板3と、発光ダイオード素子1と放熱板2と回路基板3とを内部に収容したカバー部材4と、を有している。カバー部材4は、回路基板3の外周部を保持する保持部材5を内部に備えている。
Next, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a cross-sectional view showing the inside of a cover member of a light bulb type light emitting diode illuminating device according to a first embodiment of the present invention. The bulb-type light-emitting diode illuminating device according to the present embodiment includes a light-emitting diode element 1 that emits light when energized, a heat-radiating plate 2 that is mounted with the light-emitting diode element 1 and emits heat generated when the light-emitting diode element 1 emits light. A circuit board 3 on which electronic components (not shown) for controlling the light emitting diode element 1 are mounted, and a cover member 4 in which the light emitting diode element 1, the heat sink 2 and the circuit board 3 are housed. ing. The cover member 4 includes a holding member 5 that holds the outer peripheral portion of the circuit board 3 therein.

カバー部材4は、前部4aと中間部4bと後部4cとによって構成されている。前部4aおよび後部4cは略半球形に形成されており、中間部4bは略円筒形に形成されている。前部4aの少なくとも一部は、発光ダイオード素子1から発せられる光を透過させる透光部材で構成されている。中間部4bおよび後部4cは、例えば、放熱性に優れた金属材料で形成される。中間部4bの前部4a側の端部には放熱板2が配置されており、中間部4bの後部4c側の端部には回路基板3が配置されている。後部4cの後端部には口金6が取り付けられている。   The cover member 4 includes a front part 4a, an intermediate part 4b, and a rear part 4c. The front part 4a and the rear part 4c are formed in a substantially hemispherical shape, and the intermediate part 4b is formed in a substantially cylindrical shape. At least a part of the front portion 4a is made of a translucent member that transmits light emitted from the light emitting diode element 1. The intermediate part 4b and the rear part 4c are made of, for example, a metal material having excellent heat dissipation. The heat radiating plate 2 is disposed at the end of the intermediate portion 4b on the front portion 4a side, and the circuit board 3 is disposed at the end of the intermediate portion 4b on the rear portion 4c side. A base 6 is attached to the rear end of the rear portion 4c.

放熱板2の、カバー部材4の前部4a側の面には、発光ダイオード素子1が実装されており、発光ダイオード素子1は外部電源(不図示)からの電力が回路基板3を通じて供給されると発光する。   The light emitting diode element 1 is mounted on the surface of the heat radiating plate 2 on the front portion 4a side of the cover member 4, and the light emitting diode element 1 is supplied with electric power from an external power source (not shown) through the circuit board 3. Flashes.

この電球型発光ダイオード照明装置では、カバー部材4の中間部4bの両端部にそれぞれ放熱板2および回路基板3が配置されており、回路基板3は、放熱板2の、カバー部材4の後部4c側の面から離間しているので、発光ダイオード素子1が発光時に発する熱が回路基板3に伝わることが抑制されている。このように、回路基板3に実装された電子部品等が損傷を受けることにより短寿命化することが防止されている。またそれと同時に、回路基板3によって、発光ダイオード素子1の、放熱板2による放熱が妨げられないため、発光ダイオード素子1が高温になることによる発光効率の低下および短寿命化が防止されている。   In this bulb-type light-emitting diode illuminating device, the heat sink 2 and the circuit board 3 are respectively arranged at both ends of the intermediate part 4b of the cover member 4, and the circuit board 3 is arranged on the rear part 4c of the cover member 4 of the heat sink 2. Since the light-emitting diode element 1 is separated from the side surface, the heat generated by the light-emitting diode element 1 during light emission is suppressed from being transmitted to the circuit board 3. In this way, it is possible to prevent the life of the electronic component mounted on the circuit board 3 from being shortened due to damage. At the same time, the circuit board 3 does not hinder the heat radiation of the light emitting diode element 1 by the heat radiating plate 2, so that the light emitting diode element 1 is prevented from decreasing in luminous efficiency and shortening its life due to high temperature.

また、この電球型発光ダイオード照明装置では、放熱板2が、カバー部材4の内部空間の断面積が実質的に最大である中間部4bに配置されており、中間部4bの内部空間の断面積と実質的に等しい面積を有している。これにより、発光ダイオード素子1が実装されることができる発光面が広く設けられているため、高輝度化等の高性能化や多様な照明設計がなされることが可能である。   Further, in this bulb-type light-emitting diode illuminating device, the heat radiating plate 2 is disposed in the intermediate portion 4b where the cross-sectional area of the internal space of the cover member 4 is substantially maximum, and the cross-sectional area of the internal space of the intermediate portion 4b. And substantially the same area. Thereby, since the light emitting surface on which the light emitting diode element 1 can be mounted is widely provided, high performance such as high luminance and various illumination designs can be made.

また、電球型発光ダイオード照明装置では、多彩な機能が実現されるためにそれぞれの機能に対応する電子部品等が回路基板に実装される必要がある。一方、電球型発光ダイオード照明装置のカバー部材の内部空間は狭いため、配置させることができる回路基板は基板面の面積が小さいものに限られる。したがって、実装可能な電子部品等の個数や大きさは制限されるので、その分、発揮させられる機能も制限される。そのため、電球型発光ダイオード照明装置の回路基板の基板面の面積はできるだけ大きいことが望ましい。   Moreover, in the light bulb type light emitting diode illuminating device, since various functions are realized, it is necessary to mount electronic components and the like corresponding to the respective functions on the circuit board. On the other hand, since the internal space of the cover member of the light-emitting diode illuminating device is narrow, the circuit boards that can be arranged are limited to those having a small board surface area. Accordingly, since the number and size of electronic components that can be mounted are limited, the functions that can be exhibited are limited accordingly. Therefore, it is desirable that the area of the substrate surface of the circuit board of the light bulb type light emitting diode illuminating device is as large as possible.

本実施形態に係る電球型発光ダイオード照明装置では、カバー部材4の中間部4bが略円筒形に形成されており、かつ、回路基板3の外周部が中間部4bの後端部に設けられた保持部材5に直接保持されていることにより、回路基板3の基板面は放熱板2の発光面と同様に大面積を有している。これにより、回路基板3には多くの電子部品等が実装可能であるため、より高機能化を図ることができる。また、回路基板3が放熱板2から離間した位置に配置されていることにより、回路基板3の、口金6側の面のみならず、放熱板2側の面にも電子部品等が実装可能であるため、さらに高機能化を図ることができる。
(第2の実施形態)
図2は本発明の第2の実施形態に係る電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。
In the light bulb type light emitting diode illuminating device according to the present embodiment, the intermediate portion 4b of the cover member 4 is formed in a substantially cylindrical shape, and the outer peripheral portion of the circuit board 3 is provided at the rear end portion of the intermediate portion 4b. By being directly held by the holding member 5, the board surface of the circuit board 3 has a large area like the light emitting surface of the heat sink 2. Thereby, since many electronic components etc. can be mounted on the circuit board 3, higher functionality can be achieved. Further, since the circuit board 3 is arranged at a position separated from the heat sink 2, electronic components can be mounted not only on the face of the circuit board 3 on the base 6 side but also on the face of the heat sink 2. Therefore, further enhancement of functionality can be achieved.
(Second Embodiment)
FIG. 2 is a cross-sectional view showing the inside of a cover member of a light bulb type light emitting diode illuminating device according to a second embodiment of the present invention.

本実施形態に係る電球型発光ダイオード照明装置は、通電されることにより発光する発光ダイオード素子11と、発光ダイオード素子11が実装され、発光ダイオード素子11が発光時に発する熱を放出する放熱板12と、発光ダイオード素子11を制御する電子部品等が実装された回路基板13と、発光ダイオード素子11と放熱板12と回路基板13とを内部に収容したカバー部材14と、を有している。なお、本実施形態に係る電球型発光ダイオード照明装置は、以下に示す構成以外は第1の実施形態に係る電球型発光ダイオード照明装置と同様に構成されている。   The light-emitting diode illuminating device according to this embodiment includes a light-emitting diode element 11 that emits light when energized, a heat-radiating plate 12 that is mounted with the light-emitting diode element 11 and that emits heat generated when the light-emitting diode element 11 emits light. And a circuit board 13 on which electronic components for controlling the light emitting diode element 11 and the like are mounted, and a cover member 14 in which the light emitting diode element 11, the heat radiating plate 12, and the circuit board 13 are accommodated. The bulb-type light-emitting diode illuminating device according to the present embodiment is configured in the same manner as the bulb-type light-emitting diode illuminating device according to the first embodiment except for the configuration described below.

カバー部材14は、略球形に形成されており、前部14aおよび後部14cによって構成されている。カバー部材14の、前部14aと後部14cとの境界の部分には放熱板12が配置されており、後部14cの、放熱板12から離間した位置には回路基板13が配置されている。カバー部材14は、回路基板13の外周部を保持する保持部材15を内部に備えている。   The cover member 14 is formed in a substantially spherical shape, and includes a front portion 14a and a rear portion 14c. The heat radiating plate 12 is disposed at the boundary between the front portion 14a and the rear portion 14c of the cover member 14, and the circuit board 13 is disposed at a position away from the heat radiating plate 12 in the rear portion 14c. The cover member 14 includes a holding member 15 that holds the outer peripheral portion of the circuit board 13 therein.

この電球型発光ダイオード照明装置は、放熱板12および回路基板13が離間して配置されていることにより、電子部品等が損傷を受けることによる短寿命化、および発光ダイオード素子11が高温になることによる発光効率の低下および短寿命化が防止されている。   In this bulb-type light-emitting diode illuminating device, the heat dissipation plate 12 and the circuit board 13 are arranged apart from each other, thereby shortening the life due to damage to electronic components and the like, and the light-emitting diode element 11 becomes high temperature. This prevents the light emission efficiency from being lowered and the life from being shortened.

また、この電球型発光ダイオード照明装置は、放熱板12が、カバー部材14の内部空間の断面積が実質的に最大である、前部14aと後部14cとの境界の部分に配置されていることにより、発光ダイオード素子11の実装されることができる発光面が広く設けられている。   Further, in this bulb-type light-emitting diode illuminating device, the heat radiating plate 12 is disposed at a boundary portion between the front portion 14a and the rear portion 14c where the cross-sectional area of the internal space of the cover member 14 is substantially maximum. Accordingly, a light emitting surface on which the light emitting diode element 11 can be mounted is widely provided.

また、この電球型発光ダイオード照明装置は、第1の実施形態に係る電球型発光ダイオード照明装置のようにカバー部材に中間部を有していないが、回路基板13がカバー部材14に設けられた保持部材15に直接保持されていることにより、回路基板13の基板面は、カバー部材14の内部の回路基板13が配置されている部分において、実質的に、設置可能な最大の面積を有している。   Further, the light bulb type light emitting diode illuminating device does not have an intermediate portion in the cover member unlike the light bulb type light emitting diode illuminating device according to the first embodiment, but the circuit board 13 is provided on the cover member 14. By being directly held by the holding member 15, the board surface of the circuit board 13 has a substantially maximum installable area in the portion where the circuit board 13 is disposed inside the cover member 14. ing.

本発明の第1の実施形態に係る電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。It is sectional drawing which shows the inside of the cover member of the lightbulb type light emitting diode illuminating device which concerns on the 1st Embodiment of this invention. 本発明の第2の実施形態に係る電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。It is sectional drawing which shows the inside of the cover member of the light bulb type light emitting diode illuminating device which concerns on the 2nd Embodiment of this invention. 本発明に関連する電球型発光ダイオード照明装置のカバー部材の内部を示す断面図である。It is sectional drawing which shows the inside of the cover member of the lightbulb type light emitting diode illuminating device relevant to this invention.

符号の説明Explanation of symbols

1,11 発光ダイオード素子
2,12 放熱板
3,13 回路基板
4,14 カバー部材
4a,14a 前部
4b 中間部
4c,14c 後部
5,15 保持部材
6 口金
DESCRIPTION OF SYMBOLS 1,11 Light emitting diode element 2,12 Heat sink 3,13 Circuit board 4,14 Cover member 4a, 14a Front part 4b Intermediate | middle part 4c, 14c Rear part 5,15 Holding member 6 Cap

Claims (8)

発光ダイオード素子が実装された放熱板と、電子部品が実装された回路基板と、前記放熱板および前記回路基板を内部に収容し、少なくとも一部が前記発光ダイオード素子から発せられる光を透過させる透光部材で構成されたカバー部材と、を有する電球型発光ダイオード照明装置において、
前記回路基板は、前記放熱板から離間した位置に配置されていることを特徴とする電球型発光ダイオード照明装置。
A heat dissipation plate on which the light emitting diode element is mounted, a circuit board on which electronic components are mounted, the heat dissipation plate and the circuit board are accommodated therein, and at least a part of the transparent plate transmits light emitted from the light emitting diode element. In a light bulb type light emitting diode illuminating device having a cover member composed of a light member,
The light bulb type light emitting diode illuminating device, wherein the circuit board is disposed at a position separated from the heat radiating plate.
前記回路基板の外周部が、前記カバー部材に当接して保持されている、請求項1に記載の電球型発光ダイオード照明装置。   The bulb-type light-emitting diode illuminating device according to claim 1, wherein an outer peripheral portion of the circuit board is held in contact with the cover member. 前記カバー部材は、前記回路基板の外周部を保持する保持部材を内部に備えている、請求項1または2に記載の電球型発光ダイオード照明装置。   The bulb-type light-emitting diode illuminating device according to claim 1, wherein the cover member includes a holding member that holds an outer peripheral portion of the circuit board. 前記放熱板は、前記カバー部材の内部空間の断面積が実質的に最大である位置に配置され、前記放熱板の前記発光ダイオード素子が実装されている面が前記断面積と実質的に等しい面積を有している、請求項1から3のいずれか1項に記載の電球型発光ダイオード照明装置。   The heat sink is disposed at a position where the cross-sectional area of the internal space of the cover member is substantially maximum, and the surface of the heat sink on which the light emitting diode element is mounted is substantially equal to the cross-sectional area. The bulb-type light-emitting diode illuminating device according to claim 1, comprising: 前記カバー部材は、前記断面積を有する円筒部を備えており、前記放熱板および前記回路基板は前記円筒部に配置されている、請求項4に記載の電球型発光ダイオード照明装置。   The bulb-type light-emitting diode illuminating device according to claim 4, wherein the cover member includes a cylindrical portion having the cross-sectional area, and the heat sink and the circuit board are disposed in the cylindrical portion. 前記放熱板は、前記円筒部の、前記回路基板の前記放熱板に対向する面側の端部に配置されている、請求項5に記載の電球型発光ダイオード照明装置。   The light-emitting diode illuminating device according to claim 5, wherein the heat radiating plate is disposed at an end portion of the cylindrical portion on a surface side facing the heat radiating plate of the circuit board. 前記回路基板は、前記円筒部の、前記放熱板の前記回路基板に対向する面側の端部に配置されている、請求項5または6に記載の電球型発光ダイオード照明装置。   The light bulb-type light-emitting diode illuminating device according to claim 5 or 6, wherein the circuit board is disposed at an end of the cylindrical portion on a surface side of the heat radiating plate facing the circuit board. 前記回路基板の両面に前記電子部品が実装されている、請求項1から7のいずれか1項に記載の電球型発光ダイオード照明装置。   The light bulb-type light-emitting diode illuminating device according to any one of claims 1 to 7, wherein the electronic components are mounted on both surfaces of the circuit board.
JP2008013656A 2008-01-24 2008-01-24 Electric bulb type light emitting diode lighting fixture Pending JP2009176925A (en)

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WO2011096165A1 (en) 2010-02-04 2011-08-11 パナソニック株式会社 Lamp
JP2011210380A (en) * 2010-03-29 2011-10-20 Sharp Corp Lighting system
EP2390553A2 (en) 2010-05-24 2011-11-30 TRENTA Co., Ltd LED illuminating apparatus
JP2012123947A (en) * 2010-12-06 2012-06-28 Eye Lighting Syst Corp Lighting fixture
JP2013521608A (en) * 2010-03-03 2013-06-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light bulb with reflector for transferring heat from the light source
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JP2006156187A (en) * 2004-11-30 2006-06-15 Mitsubishi Electric Corp Led light source device and led electric bulb

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Publication number Priority date Publication date Assignee Title
WO2011096165A1 (en) 2010-02-04 2011-08-11 パナソニック株式会社 Lamp
US8928224B2 (en) 2010-02-04 2015-01-06 Panasonic Intellectual Property Management Co., Ltd. Lamp
JP2013521608A (en) * 2010-03-03 2013-06-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Light bulb with reflector for transferring heat from the light source
US9383081B2 (en) 2010-03-03 2016-07-05 Koninklijke Philips N.V. Electric lamp having reflector for transferring heat from light source
JP2011210380A (en) * 2010-03-29 2011-10-20 Sharp Corp Lighting system
EP2390553A2 (en) 2010-05-24 2011-11-30 TRENTA Co., Ltd LED illuminating apparatus
JP2012123947A (en) * 2010-12-06 2012-06-28 Eye Lighting Syst Corp Lighting fixture
WO2013179687A1 (en) * 2012-05-30 2013-12-05 株式会社 東芝 Illuminating apparatus

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