JP2003031854A - Seven segment led figure indicating unit and its manufacturing method - Google Patents

Seven segment led figure indicating unit and its manufacturing method

Info

Publication number
JP2003031854A
JP2003031854A JP2001214325A JP2001214325A JP2003031854A JP 2003031854 A JP2003031854 A JP 2003031854A JP 2001214325 A JP2001214325 A JP 2001214325A JP 2001214325 A JP2001214325 A JP 2001214325A JP 2003031854 A JP2003031854 A JP 2003031854A
Authority
JP
Japan
Prior art keywords
segment
light
manufacturing
led
segments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001214325A
Other languages
Japanese (ja)
Other versions
JP4785021B2 (en
Inventor
Akihiko Hanya
明彦 半谷
Kazuyuki Iwasaki
和行 岩崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2001214325A priority Critical patent/JP4785021B2/en
Publication of JP2003031854A publication Critical patent/JP2003031854A/en
Application granted granted Critical
Publication of JP4785021B2 publication Critical patent/JP4785021B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a figure indicating unit is reduced in quality and reliability due that various troubles such as damage to an LED chip, entrainment of air bubbles and the like occur when a lamp house is built in, where the lamp house is required to be built in a conventional method of manufacturing this kind of a figure indicating units. SOLUTION: A combination of LED chips 2 forming seven segments is arranged on a board 1, a transparent part 3 of transparent epoxy resin is formed on the board 1 through a primary transfer molding process so as to cover the segments, light shading grooves 3a each having an optional width are provided to the transparent part 3 so as to isolate the segments from each other, segment demarcating parts 4 of opaque epoxy resin are each provided in the light shading grooves 3a through a secondary transfer molding process, and then a seven segment LED figure indicating unit is capable of indicating the number of optional-numbered figures by optionally dividing the transparent part 3 in this manufacturing method. A lamp house assembly operation damaging an LED chip can be dispersed with, so that the problem can be solved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は7セグメント数字表
示器と称され、略長方形のセグメントの7個を8字状に
組合せて1桁の表示器とし、数字を表示するときには前
記セグメントの内の所定のものを点灯させることで0か
ら9までの数字を表示可能とするものであり、詳細には
前記セグメントの光源としてLEDランプが採用されて
いる数字表示器に係る。尚、上記の7個のセグメントに
加えて小数点を表す略円状のセグメントが追加されたも
のも存在するが、本発明ではこれを含めて7セグメント
数字表示器と称するものとする。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is referred to as a 7-segment numeral display, and seven substantially rectangular segments are combined into an eight-character shape to form a one-digit display. A number from 0 to 9 can be displayed by turning on a predetermined object, and more specifically, it relates to a number display device using an LED lamp as a light source of the segment. In addition to the above seven segments, there is also a segment in which a substantially circular segment representing a decimal point is added, but in the present invention, the segment is also referred to as a 7-segment numeral display.

【0002】[0002]

【従来の技術】従来のこの種の7セグメントLED数字
表示器(以下、数字表示器と略称する)の製造方法の例
を示すものが図7および図8であり、まず、図7に示す
数字表示器90の製造方法においては、1桁分のLED
チップ92、即ち、7個もしくは8個のLEDチップ9
2が所定位置として搭載された基板91にはセグメント
93a部分を空洞とされたランプハウス93が接着など
で所定位置に取付け(図7(A)参照)られ、そして、
前記セグメント93a内には図7(B)に示すように透
明エポキシ樹脂など熱硬化性の樹脂94が注入され、硬
化が行われて図7(C)に示すように数字表示器90と
して完成される。
2. Description of the Related Art FIGS. 7 and 8 show an example of a method of manufacturing a conventional 7-segment LED numeral display device of this kind (hereinafter, abbreviated as a numeral display device). First, the numerals shown in FIG. In the manufacturing method of the display device 90, one digit of LED
Chip 92, ie 7 or 8 LED chips 9
A lamp house 93 having a hollow segment 93a is attached to a predetermined position by adhesion or the like (see FIG. 7 (A)) on a substrate 91 on which 2 is mounted as a predetermined position, and
A thermosetting resin 94 such as a transparent epoxy resin is injected into the segment 93a as shown in FIG. 7 (B) and cured to complete a numeral display 90 as shown in FIG. 7 (C). It

【0003】また、図8に示す数字表示器80の製造方
法においては、まず、図8(A)に示すようにランプハ
ウス83をテープ85上に裏向きに所定間隔として貼着
しておき、液状の透明エポキシ樹脂など熱硬化性の樹脂
84の適宜量を充填する。そして、図8(B)に示すよ
うに、前記樹脂84が液状の状態の時点でLEDチップ
82の所定数を所定位置として保持するリードフレーム
81をディピングする。そして、前記樹脂84が硬化し
た時点で、図8(C)に示すように前記リードフレーム
81の整形と切断とを行い、個別に分離させれば図8
(D)に示すように数字表示器80が得られるものとな
る。尚、図8に示した製造方法においてはリードフレー
ム81に換えて図7に示したのとほぼ同様な形状とした
基板が採用されることもある。
Further, in the method of manufacturing the numeral display device 80 shown in FIG. 8, first, as shown in FIG. 8A, the lamp house 83 is pasted on the tape 85 with a predetermined space facing down, An appropriate amount of thermosetting resin 84 such as liquid transparent epoxy resin is filled. Then, as shown in FIG. 8B, the lead frame 81 holding a predetermined number of the LED chips 82 at a predetermined position when the resin 84 is in a liquid state is dipped. Then, when the resin 84 is hardened, the lead frame 81 is shaped and cut as shown in FIG.
As shown in (D), the numerical display 80 can be obtained. In the manufacturing method shown in FIG. 8, the lead frame 81 may be replaced with a substrate having a shape substantially similar to that shown in FIG.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前記し
た従来の製造方法において、図7に示した製造方法で
は、前記基板91にランプハウス93を接着する工程に
おいて、未だ露出状態であるLEDチップ92、或い
は、図示は省略するが前記LEDチップ92に行われて
いる配線用のボンディングワイヤにランプハウス93を
当接させ破損させる可能性が高く、よって、慎重な作業
が要求され生産効率が低下する問題点を生じている。
However, in the above-mentioned conventional manufacturing method shown in FIG. 7, in the step of adhering the lamp house 93 to the substrate 91, the LED chip 92 which is still in an exposed state, Alternatively, although not shown, there is a high possibility that the lamp house 93 will be brought into contact with and damaged by the bonding wire for wiring that is performed on the LED chip 92, and therefore careful work is required and the production efficiency is reduced. Giving rise to points.

【0005】更に、前記セグメント93a内に樹脂94
を注入する際には、注入量の過不足を生じやすく、点灯
時の指向特性にバラツキを生じたり、或いは、輝度ムラ
を生じるなど表示性能が低下する問題点を生じると共
に、外観も損なわれ商品価値も低下する問題点を生じて
いる。
Further, a resin 94 is placed in the segment 93a.
When injecting, the injection amount is likely to be excessive or insufficient, the directional characteristics at the time of lighting may be varied, or the display performance may be deteriorated such as uneven brightness, and the appearance may be deteriorated. There is a problem that the value is reduced.

【0006】また、図8に示した製造方法では、テープ
85によりランプハウス83の前面を面一として塞いだ
状態で背面から樹脂84を注入するものであるので、樹
脂84の過不足は確かに表示面側には表れないものとな
る。しかしながら、既に注入されている樹脂84中にリ
ードフレーム81を押し込むものであるので、樹脂84
中に空気を巻き込み気泡を生じやすく、この気泡が表示
面から見え表示品位を損なうと共に、特に気泡がLED
チップ82の近傍に位置すると、このLEDチップ82
の劣化が促進されて信頼性が低下する問題点も生じるも
のとなる。
Further, in the manufacturing method shown in FIG. 8, the resin 84 is injected from the rear surface in a state where the front surface of the lamp house 83 is covered with the tape 85 so that the front surface is flush with the tape 85. It does not appear on the display surface side. However, since the lead frame 81 is pushed into the already injected resin 84, the resin 84
It is easy for air bubbles to be trapped in the air bubbles, which can be seen from the display surface and impair the display quality.
When located near the chip 82, the LED chip 82
However, there is a problem in that the deterioration of the device is promoted and the reliability is lowered.

【0007】[0007]

【課題を解決するための手段】本発明は、上記した従来
の課題を解決するための具体的手段として、7セグメン
トを構成するLEDチップの組合せの複数組が配置され
た基板に、少なくともセグメント部分を覆うように透明
エポキシ樹脂による一次トランスファーモールドを所定
厚として行い透光部を形成し、ついで前記透光部にセグ
メントのそれぞれを独立させるようにこの透光部の厚み
の範囲内で適宜な溝幅とする遮光溝を形成し、前記遮光
溝内に不透明エポキシ樹脂による二次トランスファーモ
ールドを行いセグメント区画部を形成し、しかる後に任
意の桁数で分割されることを特徴とする7セグメントL
ED数字表示器の製造方法、および、この製造方法によ
り製造される7セグメントLED数字表示器を提供する
ことで課題を解決するものである。
As a concrete means for solving the above-mentioned conventional problems, the present invention provides at least a segment portion on a substrate on which a plurality of combinations of LED chips constituting 7 segments are arranged. A transparent epoxy resin to a predetermined thickness to form a light-transmitting portion so that each of the segments can be independently formed in the light-transmitting portion. A 7-segment L characterized in that a light-shielding groove having a width is formed, and a secondary transfer molding with an opaque epoxy resin is performed in the light-shielding groove to form a segment partition portion, which is thereafter divided into an arbitrary number of digits.
The problem is solved by providing a method of manufacturing an ED numeral display and a 7-segment LED numeral display manufactured by this manufacturing method.

【0008】[0008]

【発明の実施の形態】つぎに、本発明を図に示す実施形
態に基づいて詳細に説明する。図1〜図4は本発明に係
る7セグメントLED数字表示器10(以下、数字表示
器10と略称)の製造方法を工程の順に示すものであ
り、まず、図1に示すように、電気回路、端子などが所
定の形状として形成されたプリント配線基板1上にLE
Dチップ2の7個もしくは8個(小数点付きの場合)を
マウントし、必要に応じて金ワイヤなどによる配線を行
う。このときに、本発明では前記プリント配線基板1に
は複数の数字表示器10に対応する配線が成され、基本
的には最終工程で1桁毎に切断して数字表示器10とす
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail based on the embodiments shown in the drawings. 1 to 4 show a method of manufacturing a 7-segment LED numeric display 10 (hereinafter abbreviated as numeric display 10) according to the present invention in the order of steps. First, as shown in FIG. LE on the printed wiring board 1 on which terminals, terminals, etc. are formed in a predetermined shape.
Seven or eight D chips 2 (in the case of having a decimal point) are mounted, and if necessary, wiring with a gold wire or the like is performed. At this time, according to the present invention, the printed wiring board 1 is provided with wirings corresponding to the plurality of numeral displays 10, and basically, the numeral display 10 is obtained by cutting every digit in the final step.

【0009】図2は、本発明に係るLED数字表示器1
0の製造方法における一次トランスファーモールド工程
を示すものであり、この一次トランスファーモールド工
程では、前記LEDチップ2を覆うように透明エポキシ
樹脂により透光部3が形成される。尚、透光部3の形成
に当たっては、少なくとも数字表示器10としてのセグ
メント11(図5を参照)となる部分、即ち、LEDチ
ップ2が配置された近傍には透光部3が形成されている
ものとする。
FIG. 2 shows an LED numeral display 1 according to the present invention.
2 shows a primary transfer molding step in the manufacturing method of No. 0. In this primary transfer molding step, the transparent portion 3 is formed of transparent epoxy resin so as to cover the LED chip 2. In forming the light-transmitting portion 3, the light-transmitting portion 3 is formed at least in a portion to be the segment 11 (see FIG. 5) as the numeral display 10, that is, in the vicinity of the LED chip 2. Be present.

【0010】尚、前記透明エポキシ樹脂は必ずしも無色
透明である必要はなく、例えばLEDチップ2が赤色発
光のものでれば、赤色透明とするなどの発光色と同系の
色のものであっても良い。また、例えば白色粉体の適宜
量を混和して前記LEDチップ2からの光を適宜に拡散
しセグメント11全体が均一な明るさとして輝くように
図っても良いものである。
The transparent epoxy resin does not necessarily have to be colorless and transparent. For example, if the LED chip 2 emits red light, it may have the same color as the emission color such as red transparent. good. Further, for example, a suitable amount of white powder may be mixed to appropriately diffuse the light from the LED chip 2 so that the entire segment 11 shines as a uniform brightness.

【0011】図3は同じく本発明に係る製造方法におけ
るダイシング工程を示すものであり、このダイシング工
程においては上記で説明した透光部3に、例えば半導体
切断用のカッターなどにより、前記数字表示器10のそ
れぞれのセグメント11を独立させるように遮光溝3a
を形成する。
FIG. 3 also shows a dicing step in the manufacturing method according to the present invention. In the dicing step, the numeral display is provided on the translucent portion 3 described above by, for example, a semiconductor cutting cutter. Light-shielding groove 3a so that each of the 10 segments 11 is made independent
To form.

【0012】尚、前記遮光溝3aの形成に当たっては、
続く工程で注入が行われる不透明エポキシ樹脂により必
要充分な遮光性などを確保可能とする適宜な溝幅として
設定が行われると共に、前記遮光溝3aにより前記プリ
ント配線基板1上に敷設された配線、或いは、搭載され
た部品などを破損させることのない適宜な溝の深さとし
て設定が行われている。
When forming the light shielding groove 3a,
The opaque epoxy resin that is injected in the subsequent step is set as an appropriate groove width that can ensure necessary and sufficient light-shielding properties, and the wiring laid on the printed wiring board 1 by the light-shielding groove 3a, Alternatively, the depth is set as an appropriate groove depth that does not damage mounted components.

【0013】図4は同じく本発明に係る製造方法におけ
る二次トランスファーモールド工程を示すものであり、
先の工程で形成された遮光溝3aにエポキシ樹脂に顔料
などを混和し不透明とした不透明エポキシ樹脂を注入し
てセグメント区画部4を形成し、1つのセグメント11
を点灯したときに、他のセグメント11も点灯状態とし
て見えることのないように、それぞれのセグメント11
間を遮光する目的として行われる工程である。
FIG. 4 also shows a secondary transfer molding step in the manufacturing method according to the present invention.
A segment partition 4 is formed by injecting an opaque epoxy resin, which is made by mixing a pigment and the like into an epoxy resin, into the light-shielding groove 3a formed in the previous step to form one segment 11
When each segment is turned on, the other segments 11 will not appear to be turned on.
This is a process performed for the purpose of shielding the space.

【0014】このようにしたことで、それぞれのセグメ
ント11は4面を不透明樹脂で形成されたセグメント区
画部4で囲まれるものとなるので、1つのLEDチップ
2の点灯は、そのLEDチップ2が属するセグメントの
みを明るく照射するものとなり、目的とする数字が明確
に表示されるものと成る。尚、二次トランスファーモー
ルド工程においては、前記不透明エポキシ樹脂の注入は
透光部3を形成したときと同じ厚さの金型を用いて行い
透光部3上にセグメント区画部4がはみ出すなどを生じ
ないように留意する。
By doing so, each segment 11 is surrounded on four sides by the segment partition portion 4 formed of the opaque resin, so that when one LED chip 2 is turned on, that LED chip 2 is turned on. Only the segment to which it belongs will be illuminated brightly, and the target number will be clearly displayed. In the secondary transfer molding step, the injection of the opaque epoxy resin is performed by using a mold having the same thickness as that when the transparent portion 3 is formed, and the segment partition portion 4 is projected on the transparent portion 3. Be careful not to cause this.

【0015】ここで、前記エポキシ樹脂に混和する顔料
などの色は、例えば遮光効果が高い黒色など濃色系とす
れば前記遮光溝3aの溝幅を狭く設定することが可能と
なるが、その反面で遮光溝3aに注入されて形成された
セグメント区画部4は光を反射することがほとんどな
く、よって、LEDチップ2には光量の大きいものを採
用するなどの対応が必要となる。また、この黒色など濃
色とした場合、前記透光部3とのコントラストが高いデ
ザインとすることが容易である。
Here, if the color of the pigment or the like mixed with the epoxy resin is a dark color system such as black, which has a high light shielding effect, the groove width of the light shielding groove 3a can be set to be narrow. On the other hand, the segment partitioning portion 4 formed by being injected into the light shielding groove 3a hardly reflects light, and therefore, it is necessary to adopt a measure such as adopting a large amount of light for the LED chip 2. Further, when the color is dark such as black, it is easy to design the high contrast with the light transmitting portion 3.

【0016】また、光に対する反射光かが高い白色など
淡色系とすれば、このセグメント区画部4はセグメント
11内に向けて光を反射するものとなり、セグメント1
1全体を明るくすることが可能となるが、その反面でセ
グメント区画部4は遮光効果が劣るものとなり勝ちであ
るので、上記の黒色とした場合より遮光溝3aの溝幅を
広くするなどの対策が必要となる。また、デザイン的に
は前記透光部3とのコントラストは低い傾向となる。よ
って、セグメント区画部4を濃色系とするか淡色系とす
るかは、点灯時の明るさ、或いは、要求されるデザイン
などにより何れかを選択すればよい。
If a light-colored system such as white, which has a high reflected light with respect to the light, the segment partitioning portion 4 reflects the light toward the inside of the segment 11 and the segment 1
Although it is possible to lighten the whole 1, on the other hand, the segment partitioning portion 4 tends to be inferior in the light shielding effect on the other hand, and therefore, the width of the light shielding groove 3a is widened as compared with the above black case. Is required. Further, in terms of design, the contrast with the transparent portion 3 tends to be low. Therefore, whether the segment partition section 4 is a dark color system or a light color system may be selected depending on the brightness at the time of lighting, the required design, or the like.

【0017】以上のようにして透光部3とセグメント区
画部4とが形成されたプリント配線基板1は、図5に示
すように切断が行われて個別に分割され、これにより本
発明に係る数字表示器10が得られるものとなる。尚、
必要に応じては図6に示すように2個、或いは、それ以
上の数が連接している状態に分割し、任意桁の多桁数字
表示器20としても良いものである。
The printed wiring board 1 on which the light transmitting portion 3 and the segment partition portion 4 are formed as described above is cut and individually divided as shown in FIG. 5, whereby the present invention is realized. The numerical display 10 is obtained. still,
If necessary, as shown in FIG. 6, it may be divided into a state in which two or more numbers are connected, and the multi-digit numeral display 20 of arbitrary digits may be used.

【0018】次いで、上記の構成とした本発明の数字表
示器10の作用及び効果について説明する。まず、遮光
溝3aを透光部3に形成し、その遮光溝3aに二次トラ
ンスファーモールド工程によりセグメント区画部4を形
成するものとしたことにより、従来例の手作業によるポ
ッティングモールドでは生じていた注入量の不足或いは
過剰によるセグメント面における光ムラの発生を防止す
る。また、同時に透光部3とセグメント区画部4とが必
ず同一面で揃うものとして見栄えも向上させることが可
能となる。
Next, the operation and effect of the numeral display device 10 of the present invention having the above structure will be described. First, the light-shielding groove 3a is formed in the light-transmitting portion 3, and the segment partitioning portion 4 is formed in the light-shielding groove 3a by the secondary transfer molding process. This is caused by the conventional manual potting mold. The occurrence of light unevenness on the segment surface due to insufficient or excessive injection amount is prevented. Further, at the same time, it is possible to improve the appearance as the translucent portion 3 and the segment partition portion 4 are always aligned on the same surface.

【0019】また、透光部3、セグメント区画部4が共
にトランスファーモールドで形成可能となったことで、
モールド時に気泡などの巻き込みも生ずることがなく、
乱れのない光の放散が可能となると共に、LEDチップ
の耐湿性も向上し信頼性の向上が可能となる。
Further, since both the transparent portion 3 and the segment partition portion 4 can be formed by transfer molding,
No entrapment of bubbles during molding
It is possible to diffuse the light without any disturbance, and it is possible to improve the moisture resistance of the LED chip and improve the reliability.

【0020】更には、透光部3に遮光溝3aを形成し、
この遮光溝3aに従来例ではランプハウスに相当するセ
グメント区画部4を形成する製造方法としたことで、従
来例では取付時に接触しLEDチップなどの破損の要因
となるので細心の注意を必要とし煩雑なものとなってい
たランプハウスの取付け工程を不要とし、生産性の向上
を可能とする。
Further, a light shielding groove 3a is formed in the light transmitting portion 3,
In the conventional method, the segment partitioning portion 4 corresponding to the lamp house is formed in the light-shielding groove 3a. In the conventional example, the LED chips and the like may be damaged when they are attached, so that careful attention is required. Eliminating the complicated lamp house installation process makes it possible to improve productivity.

【0021】[0021]

【発明の効果】以上に説明したように本発明により、7
セグメントを構成するLEDチップの組合せの複数組が
配置された基板に、少なくともセグメント部分を覆うよ
うに透明エポキシ樹脂による一次トランスファーモール
ドを所定厚として行い透光部を形成し、ついで前記透光
部にセグメントのそれぞれを独立させるようにこの透光
部の厚みの範囲内で適宜な溝幅とする遮光溝を形成し、
前記遮光溝内に不透明エポキシ樹脂による二次トランス
ファーモールドを行いセグメント区画部を形成し、しか
る後に任意の桁数で分割される7セグメントLED数字
表示器の製造方法としたことで、LEDチップの破損の
要因となるランプハウスの取付け作業を不要として生産
性の向上に極めて優れた効果を奏すると共に、封止樹脂
に気泡の混入を防止して表示品位を向上させ性能向上に
も極めて優れた効果を奏するものとなる。また気泡混入
の防止によりLEDチップの耐湿性も向上し信頼性の向
上にも極めて優れた効果を奏するものとなる。
As described above, according to the present invention, 7
On a substrate on which a plurality of combinations of LED chips constituting a segment are arranged, a transparent transfer resin is formed to a predetermined thickness so as to cover at least the segment portion to form a transparent portion, and then the transparent portion is formed on the transparent portion. Forming a light-shielding groove having an appropriate groove width within the range of the thickness of the light-transmitting portion so that each of the segments is independent,
Damage to the LED chip is achieved by forming a segment partition by performing secondary transfer molding with an opaque epoxy resin in the light-shielding groove, and then forming a 7-segment LED numeral display that is divided by an arbitrary number of digits. It is extremely effective in improving productivity by eliminating the need to install the lamp house, which is a factor of, and also in improving the display quality by preventing air bubbles from being mixed into the encapsulating resin. It will play. In addition, the prevention of the inclusion of air bubbles also improves the moisture resistance of the LED chip and has an extremely excellent effect on the improvement of reliability.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係る7セグメントLED数字表示器
の製造方法の第一工程を示す説明図である。
FIG. 1 is an explanatory view showing a first step of a method for manufacturing a 7-segment LED numeral display device according to the present invention.

【図2】 同じく本発明に係る7セグメントLED数字
表示器の製造方法の第二工程を示す説明図である。
FIG. 2 is an explanatory view showing a second step of the method for manufacturing the 7-segment LED numeral display device according to the present invention.

【図3】 同じく本発明に係る7セグメントLED数字
表示器の製造方法の第三工程を示す説明図である。
FIG. 3 is an explanatory view showing a third step of the method of manufacturing the 7-segment LED numeral display device according to the present invention.

【図4】 同じく本発明に係る7セグメントLED数字
表示器の製造方法の第四工程を示す説明図である。
FIG. 4 is an explanatory view showing a fourth step of the method of manufacturing the 7-segment LED numeral display device according to the present invention.

【図5】 本発明に係る製造方法により形成された7セ
グメントLED数字表示器を示す斜視図である。
FIG. 5 is a perspective view showing a 7-segment LED numeric display formed by the manufacturing method according to the present invention.

【図6】 同じく本発明に係る製造方法により形成され
た7セグメントLED数字表示器の別の形態を示す斜視
図である。
FIG. 6 is a perspective view showing another form of a 7-segment LED numeral display device similarly formed by the manufacturing method according to the present invention.

【図7】 従来例における製造方法を示す説明図であ
る。
FIG. 7 is an explanatory diagram showing a manufacturing method in a conventional example.

【図8】 従来例における別の製造方法を示す説明図で
ある。
FIG. 8 is an explanatory view showing another manufacturing method in the conventional example.

【符号の説明】[Explanation of symbols]

1……プリント配線基板 2……LEDチップ 3……透光部 3a……遮光溝 4……セグメント区画部 10……7セグメントLED数字表示器 11……セグメント 20……多桁7セグメントLED数字表示器 1 ... Printed wiring board 2 ... LED chip 3 ... Translucent part 3a ... Shading groove 4 segment segment 10 …… 7-segment LED number display 11 …… Segment 20 ... Multi-digit 7-segment LED number display

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5C094 AA42 AA43 BA26 CA16 ED15 GB01 5F041 AA43 DA13 DA20 DA44 DA57 DA92 DB05    ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5C094 AA42 AA43 BA26 CA16 ED15                       GB01                 5F041 AA43 DA13 DA20 DA44 DA57                       DA92 DB05

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 7セグメントを構成するLEDチップの
組合せの複数組が配置された基板に、少なくともセグメ
ント部分を覆うように透明エポキシ樹脂による一次トラ
ンスファーモールドを所定厚として行い透光部を形成
し、ついで前記透光部にセグメントのそれぞれを独立さ
せるようにこの透光部の厚みの範囲内で適宜な溝幅とす
る遮光溝を形成し、前記遮光溝内に不透明エポキシ樹脂
による二次トランスファーモールドを行いセグメント区
画部を形成し、しかる後に任意の桁数で分割されること
を特徴とする7セグメントLED数字表示器の製造方
法。
1. A light-transmitting portion is formed on a substrate on which a plurality of combinations of LED chips constituting 7 segments are arranged by performing a primary transfer molding with a transparent epoxy resin to a predetermined thickness so as to cover at least the segment portion, Then, a light-shielding groove having an appropriate groove width within the range of the thickness of the light-transmitting portion is formed in the light-transmitting portion so that each of the segments is independent, and a secondary transfer mold made of an opaque epoxy resin is formed in the light-shielding groove. A method for manufacturing a 7-segment LED numerical display, characterized in that a segment partition portion is formed by performing the step and then divided into an arbitrary number of digits.
【請求項2】 上記請求項1記載の製造方法により製造
されたことを特徴とする7セグメントLED数字表示
器。
2. A 7-segment LED numeric display manufactured by the manufacturing method according to claim 1.
JP2001214325A 2001-07-13 2001-07-13 7-segment LED numeric display and manufacturing method thereof Expired - Fee Related JP4785021B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001214325A JP4785021B2 (en) 2001-07-13 2001-07-13 7-segment LED numeric display and manufacturing method thereof

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Application Number Priority Date Filing Date Title
JP2001214325A JP4785021B2 (en) 2001-07-13 2001-07-13 7-segment LED numeric display and manufacturing method thereof

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Country Link
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JP2007156228A (en) * 2005-12-07 2007-06-21 Rohm Co Ltd Led display unit
JP2008091234A (en) * 2006-10-03 2008-04-17 Sanyo Electric Co Ltd Electronic equipment
US20100117103A1 (en) * 2007-03-07 2010-05-13 Jan Marfeld Light-Emitting Module and Method of Manufacture for a Light-Emitting Module
US7998763B2 (en) 2008-11-17 2011-08-16 Stanley Electric Co., Ltd. Method for manufacturing semiconductor apparatus and mold assembly for the same
WO2012092808A1 (en) * 2011-01-05 2012-07-12 深圳市众明半导体照明有限公司 Led module and illumination device
JP2013004807A (en) * 2011-06-17 2013-01-07 Toshiba Corp Semiconductor light-emitting device and manufacturing method thereof
US9224915B2 (en) 2010-09-17 2015-12-29 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
JP2017208568A (en) * 2017-08-01 2017-11-24 日亜化学工業株式会社 Method for manufacturing light-emitting device
CN108320673A (en) * 2018-01-31 2018-07-24 昆山国显光电有限公司 Shield body structure, display screen preparation method, display device and scraping device
WO2020042529A1 (en) * 2018-08-27 2020-03-05 深圳市洲明科技股份有限公司 Led display screen mask and led display screen

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JPH11224063A (en) * 1998-02-06 1999-08-17 Rohm Co Ltd Resin molding type display device and its manufacture
JP2001118865A (en) * 1999-10-19 2001-04-27 Japan Rec Co Ltd Manufacturing method of photoelectric part

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JPH11224063A (en) * 1998-02-06 1999-08-17 Rohm Co Ltd Resin molding type display device and its manufacture
JP2001118865A (en) * 1999-10-19 2001-04-27 Japan Rec Co Ltd Manufacturing method of photoelectric part

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WO2007024069A1 (en) * 2005-08-26 2007-03-01 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode
US7704761B2 (en) 2005-08-26 2010-04-27 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode
KR100621154B1 (en) 2005-08-26 2006-09-07 서울반도체 주식회사 Manufacturing method of light emitting diode
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US8053259B2 (en) 2005-08-26 2011-11-08 Seoul Semiconductor Co., Ltd. Manufacturing method of light emitting diode
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US20100117103A1 (en) * 2007-03-07 2010-05-13 Jan Marfeld Light-Emitting Module and Method of Manufacture for a Light-Emitting Module
US8546826B2 (en) * 2007-03-07 2013-10-01 Osram Opto Semiconductors Gmbh Light-emitting module and method of manufacture for a light-emitting module
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US7998763B2 (en) 2008-11-17 2011-08-16 Stanley Electric Co., Ltd. Method for manufacturing semiconductor apparatus and mold assembly for the same
US9224915B2 (en) 2010-09-17 2015-12-29 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
US9608187B2 (en) 2010-09-17 2017-03-28 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
US10593846B2 (en) 2010-09-17 2020-03-17 Rohm Co., Ltd. Semiconductor light-emitting device, method for producing same, and display device
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JP2017208568A (en) * 2017-08-01 2017-11-24 日亜化学工業株式会社 Method for manufacturing light-emitting device
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