JP2008112833A - Light emitting display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve visibility with a smaller size, relating to a light-emitting display in which a plurality of light-emitting segments of LED light emission are arrayed in two dimension to constitute a display part. <P>SOLUTION: Printed wirings 2a and 2b are formed of a thin copper foil printed on a printed wiring board 1. These wirings act as a light reflecting member of this invention as well. A black light shielding frame 4 of resin is printed. By screen printing and drying it repeatedly, many times, for example, a light shielding material having sufficient height and light shielding performance is stacked on the printed wiring board 1. The light shielding frame 4 that is so formed, as a barrier wall, to enclose two LEDs 3 of blue light emission is arranged so as to enclose and hold a sealing resin 7 from the side. The sealing resin 7 contains a dispersing agent and a fluorescence agent (YAG system phosphor) which converts blue light to yellow light, and the output light from the sealing resin 7 is white. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting display device in which a display unit is configured by two-dimensionally arranging a plurality of light emitting segments configured using LEDs.

  As a light emitting display device in which a display unit is configured by two-dimensionally arranging a plurality of LEDs, for example, those described in Patent Documents 1 to 5 below are known. By using these illumination displays, a two-dimensional array (that is, a character or a symbol) that is meaningful in the arrangement relationship is configured and displayed by selecting and combining each segment (light emitting dot) that is selected to emit light. be able to. In addition, since the LED emits light by itself, it is easy to achieve high brightness and high contrast when using the LED, and high visibility is obtained even when ambient light is irradiated on the display surface of the device. It is advantageous in that it is easily made.

In particular, the prior art described in Patent Document 5 below is characterized in that a semiconductor light emitting element (LED body) is directly mounted on a wiring board (chip-on-board). According to such a mounting form, it is considered that a certain effect can be obtained in reducing the thickness and size and weight of the target display device. Further, this patent document 5 is also characterized in that contrast is improved by using a light shielding sheet (light shielding layer) or the like.
JP 2000-68563 A JP 2003-173149 A JP 2005-301163 A JP2006-162889 JP 2006-145682

However, in Patent Document 5 described above, since the light shielding layer is formed on the light shielding sheet or the light diffusing sheet that is horizontally disposed, no light shielding material is interposed between the semiconductor light emitting element (LED body) and the semiconductor light emitting element. Never do. For this reason, a sufficient light shielding effect is not always obtained between adjacent light emitting elements or light emitting segments. Therefore, in this prior art, when trying to further reduce the size of the light emitting display device, the target two-dimensional array display becomes blurred as the arrangement interval of the light emitting elements or light emitting segments decreases. As a result, there arises a problem that visibility regarding display is not excellent.
Further, in the LED light-emitting display device that displays two-dimensionally while composing a pattern such as characters and symbols by selecting and combining a large number of light-emitting segments that are close to each other, this problem of light extraction is particularly important and inevitable. For this reason, this problem is a major factor that hinders simultaneous resolution of the two problems of further miniaturization of these light emitting display devices and ensuring sufficient visibility.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to visually recognize a light-emitting display device in which a display unit is configured by two-dimensionally arranging a plurality of LED light-emitting segments. Improvement of size and downsizing at the same time.

In order to solve the above problems, the following means are effective.
That is, the first means of the present invention seals the LED in the light emitting segment in the light emitting display device in which the display unit is configured by two-dimensionally arranging a plurality of light emitting segments configured using the LED. A sealing resin and a black or dark light-shielding frame that encloses and holds the sealing resin from the side; a light reflecting member is disposed on the bottom surface of the LED mounting portion; and It is to mix a fluorescent agent or a light diffusing agent into the sealing resin.

However, the shape of the light emitting segments may be arbitrary, and may be, for example, a side shape made of a rectangle or the like or a dot shape. Moreover, you may use several LED in comprising one light emission segment.
In addition, these light emitting segments are not necessarily arranged in a matrix.
Moreover, as a material of said light-shielding frame, the material with sufficiently low translucency is desirable, and it is desirable that the color is especially black or a color close to black as much as possible.
The light reflecting member may be anything as long as it easily reflects light. For example, the light reflecting member may be composed of a white paint, a silver paint, or a fluorescent paint printed on the bottom surface. Moreover, you may comprise with a white reflective resist film, the metal thin film apply | coated or vapor-deposited, etc.

Moreover, as a fluorescent agent to be used, the well-known thing etc. which are used for general LED lighting, the conventional LED light emission display apparatus, etc. can be used.
In addition, as the light diffusing agent, known ones used for liquid crystal display devices such as general televisions, personal computers, car navigation systems, and mobile phones can be used. Moreover, you may use a light-diffusion film etc. instead of a light-diffusion agent.

The second means of the present invention is to form the light-shielding frame body from the resin applied to the upper surface of the wiring board and cured in a partition shape in the first means.
However, any means for applying the resin to the upper surface of the wiring board may be used. For example, a printing machine or a dispenser that performs screen printing may be used.

  According to a third means of the present invention, in the first means described above, the LED mounting portion is formed from the internal space of the recess formed on the upper surface of the wiring board, and the light shielding property is provided from the side wall portion of the recess. It is to construct a frame.

According to a fourth means of the present invention, in the first means described above, an LED mounting portion is formed from the internal space of the through-hole formed in the flat substrate, and the above-mentioned base is formed by stacking them in a stacked manner. The upper surface of the wiring board to which the material is bonded constitutes the bottom surface of the mounting portion, and the light shielding frame is composed of the side wall portion of the through hole.
However, as the above-mentioned base material, in addition to the resin material, for example, ceramics, glass, or a metal plate having an insulating film can be used.

  According to a fifth means of the present invention, in any one of the second to fourth means, the wiring board is configured in a multilayer structure in which the wiring circuit is formed in a plurality of layers. It is. However, the number of layers in the multilayer structure may be two, three, or four or more.

According to a sixth means of the present invention, in any one of the first to fifth means, the display portion is covered with a flat, light-transmitting colored resin, a colored film, or smoked glass. It is.
However, a light diffusing agent may be mixed or a light diffusing film may be attached to these flat light transmissive members covering the display portion of the light emitting display device of the present invention.

  According to a seventh means of the present invention, in any one of the first to sixth means, the LED is a blue light emitting LED, and a fluorescent agent that converts blue light to yellow light is sealed. It is mixed in the stop resin.

However, the combination regarding the light emission wavelength and fluorescent agent of LED in this invention may be arbitrary. As other combinations in the present invention, for example, an LED is formed from a group III nitride compound semiconductor that emits ultraviolet rays, and as a fluorescent agent, ultraviolet rays are converted into red light, green light, and blue light, respectively. A total of three types may be used simultaneously. Further, a fluorescent agent that emits a complementary color of these primary colors may be used. However, when an LED emitting ultraviolet light is used, it is more desirable to attach a UV cut film or the like to the display surface of the display unit of the light emitting display device. Further, the color of the luminescent display is not necessarily white, and any color can be used as long as it is a mixed color with high luminance and visibility.
By the above means of the present invention, the above-mentioned problem can be effectively or rationally solved.

The effects obtained by the above-described means of the present invention are as follows.
That is, according to the first means of the present invention, the light-shielding frame is interposed between the light-emitting segments configured using the LEDs, so that the other light-emitting segments adjacent to the light emitted from the LEDs are provided. No longer diffuses toward For this reason, the mutual influence based on the light leakage of the light emission operation between the respective light emitting segments is eliminated and the contrast of each light emitting segment is improved, so that the visibility of the light emitting display is improved. Furthermore, since the high-brightness can be achieved more effectively than before by the reflecting action of the light reflecting member, the synergistic effect on the improvement in visibility is great.
These configurations are particularly suitable for light-emitting display devices in which semiconductor light-emitting elements (LED bodies) are mounted directly on a wiring board (chip-on-board), so that the arrangement pitch of the light-emitting segments can be reduced or thin. It is easy to effectively promote the downsizing of the light emitting display device, and it becomes easy to reduce the size of the light emitting display device at the same time.

  Moreover, since the shape of said sealing resin can also be arbitrarily comprised by the shape setting of said light-shielding frame, the shape of each light emission segment which is a light emission site | part can be formed arbitrarily by this. In addition, since the LED can be securely fixed by injecting the sealing resin into the frame of the light-shielding frame, the possibility that the power supply wiring may be cut off due to the vibration of the LED can be surely wiped off. As a result, the lifetime and reliability of the display device can be sufficiently secured.

  Moreover, if a light diffusing agent is mixed in the sealing resin, uneven light emission and uneven color are improved, and the entire segments can emit light uniformly.

  Further, according to the second means of the present invention, a resin having a high viscosity is applied around one or a plurality of LEDs in a ring shape by using a dispenser, or a ring having a low viscosity around a LED. A desired light-shielding frame can be accurately and easily formed on the wiring board by printing the resin, repeating the printing process and the drying process, and stacking the resin layers highly in a multilayer structure.

  Further, according to the third means of the present invention, the LED can be arranged in the recessed space formed in the wiring board, and thus the light shielding frame can be configured by using a part of the wiring board. Thinning of the display portion of the apparatus can be achieved more effectively.

  Further, according to the fourth means of the present invention, for example, a through hole is formed in a black or dark plate-like base material, and the LED is disposed in each hole with the internal space of the hole as an LED mounting portion. Thus, the light-shielding frame can be formed accurately and easily. Further, if the entire upper surface of the wiring substrate is uniformly colored with, for example, white paint in advance, the above-mentioned light reflecting member can be obtained by simply laminating and joining the above-mentioned plate-like base material on the surface. It can also be configured.

In addition, according to the fifth means of the present invention, since the degree of freedom of the wiring pattern is improved, it becomes easy to arrange the light emitting segments more complicatedly or more two-dimensionally. In addition, other circuits such as an LED drive circuit and a light emission pattern control circuit are also improved in mountability. Furthermore, any other electric circuit may be assembled on the same wiring board. By these means, a more compact composite apparatus can be configured.
In particular, when the third means described above is used, the wiring of the middle layer of the plurality of wiring circuits is exposed on the bottom surface of the LED mounting portion based on the fifth means of the present invention. By doing so, the power supply wiring to the LED can be easily formed.

Further, according to the sixth means of the present invention, portions other than the light emitting portion of the light emitting segment (e.g., a light shielding frame) are difficult to see with the above colored resin, colored film, or smoked glass. For example, the light-shielding frame is originally not so conspicuous because it is formed in black or dark color, but further, the light incident on the light-shielding frame from the outside by these light-transmitting colored plate materials Both of the reflected lights from the light-shielding frame are effectively reduced. For this reason, these parts are hardly visible from the outside. That is, since only the luminance of the light emitting portion of the light emitting segment or the surrounding sealing resin relatively increases, the visibility of the target two-dimensional display expressed by the light emitting pattern of the light emitting segment is effectively improved. Therefore, according to the sixth means of the present invention, it is possible to provide only a desired light emitting display to the user by the action of the half mirror as described above, which is produced by the colored resin, the colored film, or the smoked glass. .
Further, if a light diffusing agent is mixed into these flat light-transmitting members that cover the display portion of the light-emitting display device of the present invention or a light diffusion film is attached, the light diffusion of the light-transmitting member is performed. Due to the action, it is possible to improve the visibility when the display unit is obliquely viewed.

  Further, according to the seventh means of the present invention, the yellow light wavelength-converted by the fluorescent agent and the blue light directly output from the LED are mixed to become white light, so that only a single color light emitting LED is used. Thus, white display can be realized.

For example, the light reflecting member may be configured in combination with a metal layer such as a wiring or an electrode formed on a wiring board or a metal plate for heat dissipation.
Further, the bottom surface of the LED mounting portion does not necessarily have to be a flat surface, and may be, for example, a concave shape that exhibits a reflective and condensing function.
Further, the light reflecting member may be integrated with the wiring board by forming the wiring board on which the LED is mounted from a white insulating board or a metal board. However, in these cases, it is desirable that the region other than the bottom surface of the LED mounting portion on the display surface side of the display portion is painted black or dark or covered with a black or dark sheet.

Hereinafter, the present invention will be described based on specific examples.
However, the embodiments of the present invention are not limited to the following examples.

  FIG. 1 is a plan view of the light emitting display device 100 according to the first embodiment. The printed wiring board 1 is obtained by performing printed wiring on an insulating substrate. However, the wiring pattern configuration of the printed wiring on the printed wiring board 1 is shown in FIGS. 2-A and -B and omitted in FIG. This light emitting display device 100 is configured by arranging a total of three arithmetic numeral display units α, β, γ, which are configured in an 8-character shape or a Japanese character shape, in order from the left. The light emitting segment 10 is composed of seven long and thin hexagons. Each light emitting segment 10 is provided with two LEDs 3 each. The two LEDs 3 used in one light emitting segment 10 are turned on and off at the same time, but each light emitting segment 10 is turned on and off. Drive control is performed independently of each other. For this reason, if this light emitting display device 100 is used, an arbitrary integer of one digit, two digits, or three digits can be displayed on the display unit.

2A and 2B are a plan view and a cross-sectional view of the light emitting segment 10 of the light emitting display device 100, respectively. However, FIG. 2-B shows an AA ′ cross section of FIG. 2-A. The printed wirings 2 a and 2 b are formed from a thin plate-like copper foil printed on the printed wiring board 1. These wirings (printed wirings 2a and 2b) are for securing a power feeding path for the two LEDs 3, but are also configured to serve as the light reflecting member of the present invention.
The black light-shielding frame 4 made of an epoxy resin or a silicon resin is printed on the printed wiring board 1, the printed wiring 2a, or the printed wiring 2b. For example, screen printing and drying thereof are repeatedly repeated many times. As a result, the light-shielding frame 4 having a sufficient height and a light-shielding effect can be laminated on the printed wiring board 1.

  As shown in FIG. 2B, the blue light emitting LED 3 is obtained by laminating a semiconductor crystal layer 3b having a multilayer structure on a sapphire substrate 3a, and the semiconductor crystal layer 3b itself is a group III nitride compound. It consists of multiple crystal layers of semiconductors. The back surface of the sapphire substrate 3 a is bonded onto the printed wiring 2 b with solder 5. That is, the LED 3 is composed of a face-up blue light emitting semiconductor light emitting element, and an n electrode thereof is connected to the printed wiring 2b by the bonding wire 6. The p-electrode is connected to the printed wiring 2 a by another bonding wire 6.

  The black light-shielding frame 4 formed in a partition shape so as to surround the two LEDs 3 is arranged so as to surround and hold the sealing resin 7 from the side. The sealing resin 7 is made of a transparent epoxy resin or silicon resin, and a fluorescent agent (YAG phosphor) that converts blue light into yellow light and a diffusing agent are mixed in the sealing resin 7. This sealing resin 7 is injected into the LED mounting portion (concave portion) by potting. For this reason, the blue light directly output from the LED 3 and the yellow light indirectly output after colliding with the fluorescent agent and converted to yellow are appropriately diffused by the diffusing agent and mixed into white to be a light emitting segment. 10 is output upward.

The bottom surface of the LED 3 mounting portion, that is, the upper surface of the printed wiring board 1 on which the printed wirings 2a and 2b are disposed in the frame of the light-shielding frame 4 is placed in the frame so as to exhibit a light collecting action. You may form in a slightly concave shape.
The color of the upper surface of the printed wiring board 1 immediately below the light shielding frame 4 may be arbitrary, but the color of the upper surface of the printed wiring board 1 is white or glossy within the frame of the light shielding frame 4. It is desirable that it is black or dark outside the light-shielding frame 4. For example, the insulating film f in FIG. 2B is made of a resin film printed in black by screen printing. By disposing such an antireflection film outside the frame of the light-shielding frame body 4, Visibility can be improved effectively.

If it follows the above structures, since the light emission from LED3 will become difficult to leak to the adjacent light emission segment 10, it can implement | achieve the favorable contrast whose visibility is higher than before. Further, part of the emitted light is reflected by the light reflecting member (copper printed wirings 2a and 2b) and output upward, so that high luminance can be realized at the same time.
Moreover, since the formation accuracy of such a light-shielding frame 4 is restricted only by the printing accuracy described above, it is possible to arrange the light emitting segments 10 at a very high density. Further, according to the above configuration, the LED 3 can be directly mounted on the printed wiring board 1 (chip-on-board) without the need for a lead frame or the like, so that the desired light-emitting display device can be effectively reduced in thickness. Can do.
The bonding wires 6 in FIG. 2B are stretched in the horizontal direction (AA ′ cross-sectional direction) in FIG. 2-A, but these may be wired in the vertical direction in FIG. . By optimizing these wiring layouts, the light emitting segment 10 can be further miniaturized.

  FIG. 3 shows a cross-sectional view of the light emitting segment 20 of the second embodiment. This light emitting segment 20 is a modification of the light emitting segment 10 of Example 1, and parts having the same configuration are denoted by the same reference numerals. That is, the light emitting segment 20 is characterized in that the light shielding frame 8 is made of a plate material. This plate material (light-shielding frame 8) is made of acrylic or polycarbonate and is formed in a black flat plate shape. However, in order to form the mounting portion (recessed portion) of the LED 3, through holes 8a are formed in the plate material as shown in FIG.

FIG. 4-A is a plan view of the light emitting display device 200 of Example 2 having the light emitting segment 20 configured as described above. By arranging a total of 21 of these light emitting segments 20, a total of three numerical display units are constructed and arranged in the same manner as in the first embodiment.
FIG. 4-B illustrates a mounting form of the light emitting display device 200. The smoke glass 201 is disposed in parallel with the display surface of the display unit, approaching the light emitting display device 200 upward. The smoked glass 201 is sufficiently light-transmitting to the extent that it exhibits the optical action of a half mirror, and a light diffusing agent is mixed therein.

  However, instead of the smoked glass 201, a plate-like colored resin or the like may be used. Further, instead of mixing the light diffusing agent into the smoked glass 201, a light diffusing film may be attached to the smoked glass 201. For these light diffusing agents and light diffusing films, well-known materials used in, for example, liquid crystal display devices can be used.

  According to such a mounting form, when all the LEDs are turned off, the light emitting segment 20 is hidden by the smoke glass 201 and cannot be seen. The visibility of the display is good because it is visible. In addition, since the light emission display is appropriately diffused by the light diffusing agent mixed in the smoke glass 201, high visibility can be obtained even when the display is viewed obliquely. That is, it is easy to confirm the display contents even if the display unit is obliquely viewed.

In the light emitting display device 200 according to the second embodiment, the printed wiring board 1 may be composed of a white resin substrate. Since the light-shielding frame 8 (plate material) can be formed from a black resin having a sufficient thickness, reflection of light on the front and back surfaces and transmission of light between the front and back surfaces hardly occur. By making the printed wiring board 1 a white board, the reflection effect of the light reflecting members (copper printed wirings 2a and 2b) can be compensated from behind.
Further, in the light emitting display device 200 of the second embodiment, a metal substrate having an insulating film laminated on the upper surface may be used instead of the printed wiring board 1. In this case, a high heat dissipation effect can be effectively ensured simultaneously with a high reflection effect. In this case, the metal substrate may be a copper plate, for example, and the insulating film may be laminated only under one of the copper printed wirings 2a and 2b. As a result, the other printed wiring and the metal substrate can be integrally formed, and the heat dissipation action is further improved by reducing the current density and improving the heat conduction efficiency.

  FIG. 5 is a cross-sectional view of the light emitting segment 30 of the third embodiment. The light-emitting segment 30 is a further modification of the light-emitting segment 20 of the second embodiment, and is characterized in that it is configured using a printed wiring board having a multilayer structure. The multilayer wiring board is formed by stacking and joining a black resin substrate 12 and a white resin substrate 11 in layers, and the intermediate wiring layers 2a and 2b interposed between the two resin substrates. And a lower surface wiring layer 2 c laminated on the lower surface of the resin substrate 11 and an upper surface wiring layer 2 d laminated on the upper surface of the resin substrate 12. Further, in this light emitting segment 30, the side wall portion of the recess (hole 12 a) formed in the resin substrate 12 constitutes a light shielding frame that holds the sealing resin 7.

The crystal growth substrate 3a ′ of the LED 3 ′ is made of a bulk n-type GaN crystal to which silicon (Si) is added at a high concentration, and has sufficient conductivity to cause the LED 3 ′ to emit light with high brightness. . Further, the semiconductor crystal layer 3b 'of the LED 3' is formed in substantially the same manner as the semiconductor crystal layer 3b of Example 1, but the light emitting layer, the p-type layer, and the like are formed on the entire surface in the horizontal direction. Based on these configurations, the bonding wire 6 is connected only to the p-electrode side, and has a power feeding structure in which the light emission driving current of the LED 3 ′ is supplied via the solder 5 and the crystal growth substrate 3a ′. . For this reason, based on the omission of the bonding wire on one side, it is possible to more effectively narrow the width of the hole 12a in the horizontal direction of the drawing.
The solder 5 filling the via hole 12b formed in the resin substrate 12 connects the middle wiring layer 2b and the upper wiring layer 2d, and the solder 5 filling the via hole 11a formed in the resin substrate 11 is The surface wiring layer 2a and the lower surface wiring layer 2c are connected.

According to these configurations, since the LED 3 ′ and the sealing resin 7 are embedded in the recess (hole 12 a), a desired light emitting display device can be formed very thin. Further, since three wiring layers are secured in three dimensions, the degree of freedom of wiring is improved, and this makes it easy to arrange the light emitting segments 30 more two-dimensionally or more two-dimensionally. It becomes. Also, other circuits such as an LED drive circuit and a light emission pattern control circuit can be mounted on the same printed circuit board. Furthermore, any other electric circuit may be assembled on the same printed wiring board. By these means, a more compact composite apparatus can be configured.
In addition, you may form the resin substrate 11 from a translucent resin substrate or a transparent film. In this case, the light reflecting member in the present invention can be configured by the lower surface wiring layer 2c in addition to the copper printed wirings 2a and 2b.

[Other variations]
The embodiment of the present invention is not limited to the above-described embodiment, and other modifications as exemplified below may be made. Even with such modifications and applications, the effects of the present invention can be obtained based on the functions of the present invention.

(Modification 1)
For example, in Example 1 described above, the black light-shielding frame 4 is formed on the printed wiring board 1 by screen printing. Instead, the black light-shielding frame is printed on the printed wiring board using a dispenser. 1 may be formed. By applying and depositing a thermosetting resin (eg, silicon, epoxy, etc.) with a high viscosity using a dispenser and curing it, a light-shielding frame having a sufficient height can be formed on the printed wiring board. An arbitrary shape can be formed easily and with high accuracy.
The sealing resin 7 and the light-shielding frame 4 are preferably formed of the same type of resin. Thereby, peeling of the sealing resin 7 from the light-shielding frame 4 can be effectively prevented, and it is advantageous from the viewpoints of production cost and manufacturing efficiency. Moreover, in order to raise the viscosity of said thermosetting resin, it is good to mix a thixotropic agent etc., for example.
In addition, when performing screen printing, a mask (screen mold) must be created. For example, when applying a thermosetting resin on a wiring board using a dispenser as described above, Since it is not necessary, it is particularly advantageous in terms of cost.

(Modification 2)
6A to 6E illustrate other modified examples of the light emitting segment.
In Example 1 described above, the light-shielding frame 4 is formed in the shape of an elongated hexagonal partition as shown in FIG. 2-A, but the inner wall surface of the light-shielding frame of the present invention (the sealing resin 7 is in contact therewith). The plane shape formed by the surface 4a) may be arbitrary, for example, a square as illustrated in FIG. 6A, a circle as illustrated in FIG. 6B, or a star as illustrated in FIG. 6C. It may be in shape. Further, the number of LEDs 3 arranged in the frame may be arbitrary. For example, three LEDs may be arranged as illustrated in FIG. 6D, or 10 LEDs as illustrated in FIG. 6E. LEDs may be arranged.
Further, the inner wall surface of the light-shielding frame of the present invention is not necessarily formed from a vertical surface, and may be formed from inclined surfaces (4a, 8a) as exemplified in FIGS. Good. Further, the inclination angle may be arbitrary as long as light leakage to the adjacent light-emitting segments hardly occurs.
Moreover, the inner wall surface of the light-shielding frame constituting one light-emitting segment does not necessarily have to be connected in series. For example, from a series of two surfaces (4a, 4b) as illustrated in FIG. It may be configured. That is, in this case, the planar view shape of the light emitting segment is a ring shape.

(Modification 3)
7A and 7B illustrate a modified example of the smoked glass 201 (FIG. 4-B). A hatched portion (S) in FIG. 7-A shows a diffusing agent-containing region newly provided in the smoked glass 201. The diffusing agent-containing region S is limitedly provided immediately above the light emitting segment, and this region is formed to be slightly narrower than the area of the region surrounded by the light-shielding frame 4 on the upper surface of the printed wiring board. Yes. For example, as described above, by providing the diffusing agent-containing region S in the smoke glass 201 in a limited manner, the contrast of the light emitting display and the visibility when viewed in perspective can be effectively ensured at the same time.
In FIG. 7-B, a light shielding film f ′ made of a black resin film is partially formed on the back surface of the smoked glass 201 ′ provided with the diffusing agent-containing region S over the entire surface. It is. The portion (window) where the light shielding film f ′ is not formed is formed slightly narrower than the area of the region surrounded by the light shielding frame 4 on the printed wiring board 1 immediately above the light emitting segment. Even with such a configuration, the contrast of the light emitting display and the visibility when viewed from the perspective can be effectively ensured at the same time as in the above case (FIG. 7A).

(Modification 4)
In the above embodiment, the two-dimensional array of the type in which the light emitting segments 10, 20 or 30 of the rod-like seven sides are arranged in the shape of figure 8 or the shape of the sun is illustrated. Since it may be formed in a dot shape like 6-A, a matrix display light-emitting display device can be configured by arranging it in a grid pattern or a honeycomb pattern. That is, according to the means of the present invention, even in a matrix display light emitting display device, it is possible to obtain operations and effects equivalent to those of the above embodiments.

(Modification 5)
Further, the LED to be used may be a face-up type or a face-down type, and it is not always necessary to supply power by wire bonding. Further, the crystal growth substrate of the LED is not necessarily a sapphire substrate. For example, as exemplified in Example 3, a conductive substrate made of GaN bulk crystal doped with impurities may be used. If these modifications are arbitrarily combined, the power feeding path can be arbitrarily secured, which is particularly advantageous when the device is further downsized.

(Modification 6)
Note that, for example, a full color pattern or symbol may be printed on the back surface of the smoked glass. Or you may affix a transparent film-like seal | sticker etc. which such a printing was given to colored resin etc. According to such means, nothing is displayed when the LED is turned off, and a special symbol or pattern can be raised on the display unit of the apparatus only when the LED is turned on.

  INDUSTRIAL APPLICABILITY The present invention can be used for any display application that can be realized by a two-dimensional array of light-emitting segments, and is used, for example, for a display device on a front panel of a vehicle, a digital display watch, a display unit for home appliances, and the like. be able to.

The top view of the light emission display apparatus 100 of Example 1. FIG. The top view of the light emission segment 10 of the light emission display apparatus 100 Sectional drawing of the light emission segment 10 of the light emission display apparatus 100 Sectional drawing of the light emitting segment 20 of Example 2 The top view of the light emission display apparatus 200 of Example 2. FIG. Schematic side view illustrating the mounting form of the light emitting display device 200 of Example 2 Sectional drawing of the light emitting segment 30 of Example 3 The top view which illustrates the other modification of a light emitting segment The top view which illustrates the other modification of a light emitting segment The top view which illustrates the other modification of a light emitting segment The top view which illustrates the other modification of a light emitting segment The top view which illustrates the other modification of a light emitting segment Sectional drawing which illustrates the modification of the smoked glass 201 of FIG. 4-B. Sectional drawing which illustrates the modification of the smoked glass 201 of FIG. 4-B.

Explanation of symbols

10, 20, 30: Light-emitting segment 100, 200: Light-emitting display device
201: smoked glass
1: Printed circuit board
3: LED (semiconductor light emitting element)
4, 8: Shading frame
7: Sealing resin

Claims (7)

In a light-emitting display device in which a display unit is configured by two-dimensionally arranging a plurality of light-emitting segments configured using LEDs,
The luminous segment is
A sealing resin for sealing the LED;
A light reflecting member disposed on the bottom surface of the LED mounting portion;
A black or dark shade frame that encloses and holds the sealing resin from the side, and
In the sealing resin,
A light-emitting display device in which a fluorescent agent or a light diffusing agent is mixed. The light-shielding frame is
The light-emitting display device according to claim 1, wherein the light-emitting display device is formed from a resin that is applied to the upper surface of the wiring substrate and hardened in a partition shape. The mounting portion of the LED is
It consists of the internal space of the recess formed on the upper surface of the wiring board,
The light-shielding frame is
The light emitting display device according to claim 1, wherein the light emitting display device includes a side wall portion of the concave portion. The mounting portion of the LED is
It consists of the internal space of the through-hole formed in the flat substrate,
The bottom surface of the mounting portion is
It consists of the upper surface of a wiring board in which the base material is bonded in a stacked manner,
The light-shielding frame is
The light emitting display device according to claim 1, comprising a side wall portion of the through hole. The wiring board is
5. The light-emitting display device according to claim 2, wherein the wiring circuit has a multi-layer structure formed over a plurality of layers. The display unit
The light emitting display device according to any one of claims 1 to 5, wherein the light emitting display device is covered with a flat, translucent colored resin, a colored film, or smoked glass. The LED is
A blue light emitting LED,
In the sealing resin,
The light emitting display device according to any one of claims 1 to 6, wherein a fluorescent agent that converts blue light into yellow light is mixed therein.

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