JP2008288440A - Integrated display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an extremely thin integrated display device having various display patterns integrated. <P>SOLUTION: The integrated display device is constituted by arraying many light emitting diodes and integrating various displays. The integrated display device has a design plate 210 which has a display pattern transmitting light from the light emitting diodes and a light shield part 210b shielding a region other than the display pattern and also has a wiring pattern 210c for supplying electricity to the light emitting diodes on a reverse surface, and is disposed on the front of the display device, the light emitting diodes 201 which are disposed on the reverse surface of the design plate 210 and connected to the wiring pattern, sealing resin 205 which seals the light emitting diodes 201 from the reverse surface of the design plate, and a reverse surface sheet 207 which is joined to the reverse surface of the sealing resin and the reverse surface of the design plate and has a reflecting member 206 formed in a region corresponding to at least the display pattern, a phosphor or light diffusing material being mixed in at least the region of the display pattern of the design plate or with the sealing resin. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a thin integrated display device in which a large number of various displays are integrated using one to a dozen light emitting diodes. The present invention relates to an integrated display device that displays power on / off or operation status of various devices and numerical values such as temperature, engine speed, and fuel consumption by switching between lighting and non-lighting. For example, in an instrument panel of a vehicle, it can be used for an integrated display device that displays various operating states of the vehicle, an operating state of an air conditioner, an operating state of an audio device, and the like.

Gallium nitride blue and green light emitting diodes are provided at a relatively low cost, and the three primary colors of light emitting diodes are aligned with gallium arsenide red light emitting diodes, and there are a variety of full color display matrices and full color display devices. Has been developed. For example, Patent Document 1 discloses a mobile phone display device using a plurality of light emitting diodes in which a light extraction region forms one character (symbol).
JP 2002-51135 A

  In Patent Document 1, a light emitting diode is provided on a circuit wiring board, and a partition wall is provided so that light emission does not leak to other display areas. With such a configuration, a sufficiently thin display device cannot be configured.

  Accordingly, the present inventors have conceived a sufficiently thin display device based on a completely new idea, and integrated various displays on a single design board, thereby completing a compact display device with a high mounting density.

  1st invention is the design which has a display pattern which permeate | transmits the light from a light emitting diode, and is arrange | positioned in the front surface of a display apparatus in the integrated display device which arranged many light emitting diodes and integrated various displays. A plate, a circuit board on which the light emitting diode is disposed, a sealing resin in which the light emitting diode is sealed and phosphor or a light diffusing material is mixed, and a light reflection disposed on the bottom surface of the light emitting diode mounting portion It is an integrated display device having a member and a black or dark light-shielding frame that is formed along the outline of the display pattern and encloses the sealing resin from the side.

  The design board needs not to be light-shielding in the display pattern, but a phosphor or a light diffusing material may be dispersed in the area of the display pattern. Further, the area of the display pattern is not necessarily highly transmissive to light. Further, the light-shielding portion other than the display pattern region includes not only the case where light is not completely transmitted, but also includes a translucent state in which the light transmittance is lower than that of the display pattern region. The light shielding part includes a light reflecting material and a light absorbing material. For example, when a light reflecting material is used for the light shielding portion, it is preferable to provide a light absorbing material on the viewing side (the surface side of the display device) from the viewpoint of vision. As the design plate, a so-called smoked or colored plate can be used for visual effect.

  The shape of the display pattern may be arbitrary. For example, the display pattern may be a side shape made of a rectangle or the like, and the one-digit numerical value may be displayed in an 8-character segment format or a dot shape. Further, one light emitting segment of the light emitting pattern may be displayed by light from a plurality of LEDs. In addition, these light emitting segments are not necessarily arranged in a matrix. Moreover, as a material of said light-shielding frame, the material with sufficiently low translucency is desirable, and it is desirable that the color is especially black or a color close to black as much as possible. The light reflecting member may be anything as long as it easily reflects light. For example, the light reflecting member may be composed of a white paint, a silver paint, or a fluorescent paint printed on the bottom surface. Moreover, you may comprise with a white reflective resist film, the metal thin film apply | coated or vapor-deposited, etc. Further, the light reflecting member may be configured in combination with a metal layer such as a wiring or an electrode formed on the circuit board, a metal plate for heat dissipation, or the like. Further, the bottom surface of the light emitting diode mounting portion is not necessarily a flat surface, and may be, for example, a concave shape that exhibits a reflection and condensing function. In addition, the circuit board on which the light emitting diode is mounted may be formed integrally with the circuit board by forming the circuit board itself from a white insulating board or a metal board. However, in these cases, it is desirable that the region other than the region corresponding to the display pattern on the circuit board is painted black or dark or covered with a black or dark sheet.

  Moreover, the sealing resin does not necessarily need to be highly permeable to light. For example, a phosphor is a substance that converts the light emission wavelength of a light emitting diode. It is assumed that the light of the light emission wavelength of the light emitting diode itself and the light of the light emission wavelength converted by the phosphor are combined and can be visually recognized in other colors. To do. The light diffusing material does not extract light from the light emitting diode only in the linear direction, but allows the display pattern to be visually recognized as emitting light from any direction. As a fluorescent substance to be used, a publicly known one used for illumination by a general light emitting diode, a display device, or the like can be used. The light diffusing material may be a known material used in liquid crystal display devices such as general televisions, personal computers, car navigation systems, and mobile phones. A light diffusion film or the like may be used instead of the light diffusion material. A method of connecting the configuration of the light emitting diode and the circuit wiring of the circuit board is arbitrary. In addition, the light-shielding part attaches a light-shielding film to the front and back surfaces of the design board, screen-prints a light-shielding paint, contains a light-shielding film inside the board, or mixes light-shielding particles in the board itself. , May be formed.

  According to a second aspect of the present invention, in an integrated display device in which a large number of light emitting diodes are arranged and various displays are integrated, a display pattern that transmits light from the light emitting diodes and a light shielding portion that shields areas other than the display patterns A wiring pattern for supplying power to the light emitting diode is formed on the back surface, a design plate disposed on the front surface of the display device, and a light emission disposed on the back surface of the design plate and connected to the wiring pattern A diode, a sealing resin that seals the light emitting diode from the back surface of the design plate, a back surface sheet that is joined to the back surface of the sealing resin and the back surface of the design plate, and at least a reflective member is formed in a region corresponding to the display pattern; And a phosphor or a light diffusing material is mixed in at least a display pattern region of the design plate or a sealing resin.

  About the structure of a design board, it is the same as that of 1st invention. In the present invention, a wiring pattern is formed on the back surface of the design board. Although it is desirable to use a transparent material for the wiring pattern, a metal film made of an opaque material may be used. When the phosphor or the light diffusing material is dispersed on the design plate, it may be dispersed not only in the display pattern region but also in the light shielding portion. The phosphor or light diffusing material is not limited to those in which the phosphor or light diffusing material is uniformly dispersed in the thickness direction of the design plate, but the phosphor or light diffusing material is dispersed on one side of the front or back side in the thickness direction. May be. Further, the design plate may be composed of a substrate and a film bonded to the substrate, and a phosphor or a light diffusing material may be mixed in the film. The phosphor and the light diffusing material are mixed in at least the display pattern region of the design plate or the sealing resin. Thereby, each segment of the display pattern can be displayed with uniform brightness irrespective of the point light emission of the light emitting diode. The reflecting member covers the light emitting diode and the sealing resin, and is formed at least in a region where the display pattern is formed. This is to improve the brightness of the display pattern by reflecting the light emitted from the light emitting diode toward the design plate by the reflecting member. Other configurations are the same as those of the first invention.

  According to a third aspect of the present invention, in an integrated display device in which a large number of light emitting diodes are arranged and various displays are integrated, a display pattern that transmits light from the light emitting diodes and a light shielding portion that shields areas other than the display patterns A wiring pattern for supplying power to the light emitting diode is formed on the back surface, a design plate disposed on the front surface of the display device, and a second wiring pattern disposed on the back surface of the design plate and connected to the wiring pattern. A light emitting diode, a substrate provided on the rear surface side with a predetermined distance from the rear surface of the design plate, and having a wiring pattern formed on the first surface, which is the surface on the design plate side; Filled between the second light-emitting diode provided on one surface and the design plate and the substrate, the first light-emitting diode and the second light-emitting diode are sealed, and phosphor or light diffusion material is mixed Sealing resin and sealing resin An integrated display device characterized by having a contracture Jisuru black or dark light-shielding frame member encloses laterally.

  The present invention has a structure in which the first invention and the second invention are combined, the first light emitting diode is disposed on the back surface of the design plate, and the second light emitting diode is parallel to the design plate. Is disposed on the substrate disposed on the substrate. Each configuration is the same as that described in the first and second inventions.

  According to a fourth invention, in the third invention, a phosphor or a light diffusion material is mixed in at least a display pattern region of the design board.

  In 1st invention, various displays can be integrated | stacked with the display pattern of a design board. Moreover, since the black or dark light-shielding frame is formed along the outline of the display pattern, interference between the display patterns (each display segment) can be prevented. That is, it is possible to prevent the non-display segment from being lit brightly due to light leakage by the light emitting diodes of the adjacent segments. In addition, since the phosphor or a light diffusing material is mixed in the sealing resin, even if the light emitting diode emits light in a dotted manner, the entire segments of the display pattern can be lit with uniform brightness. it can. Since the present invention employs such a configuration, a thin display device in which a large number of displays are integrated can be realized. Therefore, the integrated display device of the present invention can be disposed on an instrument panel, a console box, or the like of an automobile.

  In the second invention, since the light emitting diode is disposed on the back surface of the design plate, the integrated display device can be made extremely thin. When a light emitting diode is disposed on the back surface of the design plate and the front surface of the design plate is a light extraction surface, a very thin display device can be formed by adding the thickness of the light emitting diode and the thickness of the design plate. However, although the thickness of the display device is slightly increased by wire bonding the light emitting diode or by forming a sealing resin, the display device is still extremely thin.

  Even if the light emitting diode is disposed on one surface of the transparent plate, the point light emission of the light emitting diode itself is only visually recognized. Therefore, the phosphor or light diffusing material is dispersed in at least the display pattern area of the design plate (including a design plate in which a film in which the phosphor or light diffusing material is dispersed is bonded to the front or back surface of the transparent plate) or light emission. By dispersing the phosphor or light diffusing material in the sealing resin that seals the diode, the entire display pattern segment emits light uniformly or in a color tone that is different from the color of the light-emitting diode alone. Can emit light with a good color tone and brightness. Thereby, the display quality of a thin integrated display device can be improved.

  When a reflective film is provided so as to cover the light emitting diode, light leaking to the side opposite to the light extraction side can be guided to the light extraction side, and light emitted from the light emitting diode can be effectively used.

  The third invention is a combination of the first invention and the second invention, and in one integrated display device, the light emitting diodes can be arranged in two stages, and the degree of integration of the light emitting diodes. Can be improved.

Hereinafter, the present invention will be described based on specific examples.
However, the embodiments of the present invention are not limited to the following examples.

  FIG. 1 shows a configuration of an integrated display device 100 according to the first embodiment. (A) is the plane of the design board 30 seen from the front surface of the integrated display apparatus 100. FIG. The integrated display device 100 is a display device that shows the operating state of the air conditioner. On the surface of the design plate 30, display patterns 32-43 that transmit light are formed. The display patterns 32, 36, and 42 are 8-shaped segment display patterns that display numerical values of the blowing temperature, the outside temperature of the passenger compartment, and the blowing temperature. The display pattern 34 is a pattern showing the air volume as a bar graph, and the display patterns 33, 43, 35, 37, 39, 40, 41 are fixed patterns indicating the meaning of display. Further, the display pattern 38 is a pattern indicating a balloon direction. Further, the display pattern is composed of one or a plurality of segments which are one unit of lighting and extinguishing. For example, the display pattern 32 is composed of seven segments 32a, 32b and the like, and the display pattern 34 is composed of four segments 34a, 34b. Further, the display patterns 33, 43, 35, 44, 37, 38, 39, 40, and 41 are composed of one segment.

  FIG. 1B is a plan view of the circuit board 1 onto which the design pattern 30 is projected. FIG. 1C is a side view of the circuit board 1. FIG. 1D is a plan view of the circuit board 1. On the circuit board 1, a light shielding frame 4 is formed along the contour of each display pattern, that is, the contour of each segment. The light shielding frame 4 will be described in detail later. The outline of FIG. 1 (d) shows a light shielding frame. Further, light emitting diodes (hereinafter referred to as “LEDs”) 3 disposed in each segment are indicated by dots. As shown in FIG. 1C, the circuit board 1 is provided with connectors 46, 48, and 50 having lead pins 47, 49, and 51 for supplying power to the LEDs 3.

  Next, the configuration of the segment that is one component of the display pattern will be described in detail. 2 shows an 8-shaped segment as an example of one display pattern, FIG. 3 is a plan view showing one segment constituting the display pattern, and FIG. 4 shows a plurality of segments constituting the display pattern. Among them, cross-sectional views of two segments are shown.

  The circuit board 1 is obtained by performing printed wiring on an insulating substrate. However, the wiring pattern configuration of the printed wiring on the circuit board 1 is shown in FIGS. 3 and 4 and omitted in FIG. This integrated display device 100 is configured by arranging a total of three arithmetic numeral display units α, β, γ arranged in the shape of figure 8 or day, in order from the left. The light emitting segment 10 is composed of seven long and thin hexagons. Each light emitting segment 10 is provided with two LEDs 3 each. The two LEDs 3 used in one light emitting segment 10 are turned on and off at the same time, but each light emitting segment 10 is turned on and off. Drive control is performed independently of each other. Therefore, if this integrated display device 100 is used, an arbitrary integer of 1 digit, 2 digits, or 3 digits can be displayed as a display pattern.

The printed wirings 2 a and 2 b are formed from a thin plate-like copper foil printed on the circuit board 1. These printed wirings 2a and 2b are for securing a power feeding path for the two LEDs 3, but are also configured to serve as the light reflecting member of the present invention.
The black light-shielding frame 4 made of epoxy resin or silicon resin is printed on the circuit board 1, the printed wiring 2a or the printed wiring 2b. For example, screen printing and drying thereof are repeatedly repeated many times. Thus, the light-shielding frame 4 having a sufficient height and light-shielding action can be laminated on the circuit board 1. The light-shielding frame 4 is formed along the contour of the light emission pattern, that is, the contour of each segment.

  As shown in FIG. 4, the blue light emitting LED 3 is formed by laminating a semiconductor crystal layer 3b having a multilayer structure on a sapphire substrate 3a, and the semiconductor crystal layer 3b itself is made of a group III nitride compound semiconductor. It consists of multiple stacked crystal layers. The back surface of the sapphire substrate 3 a is bonded onto the printed wiring 2 b with solder 5. That is, the LED 3 is composed of a face-up blue light emitting semiconductor light emitting element, and an n electrode thereof is connected to the printed wiring 2b by the bonding wire 6. The p-electrode is connected to the printed wiring 2 a by another bonding wire 6.

  The black light-shielding frame 4 formed in a partition shape so as to surround the two LEDs 3 shown in FIG. 3 encloses the sealing resin 7 from the side along the outline of one light-emitting segment 10. It is arranged to do. The sealing resin 7 is made of a transparent epoxy resin or silicon resin, and a phosphor (YAG phosphor) that converts blue light into yellow light and a diffusing agent are mixed in the sealing resin 7. This sealing resin 7 is injected into the LED mounting portion (concave portion) by potting. For this reason, the blue light directly output from the LED 3 and the yellow light indirectly output after colliding with the phosphor and being converted to yellow are appropriately diffused by the diffusing agent and mixed into white to be a light emitting segment. 10 is output upward.

The bottom surface of the LED 3 mounting portion, that is, the upper surface of the circuit board 1 on which the printed wirings 2a and 2b are disposed in the frame of the light-shielding frame 4 is slightly in the frame so as to exhibit a light collecting action. You may form in a concave shape.
The color of the upper surface of the circuit board 1 immediately below the light-shielding frame 4 may be arbitrary, but the color of the upper surface of the circuit board 1 may be white or glossy in the frame of the light-shielding frame 4 (thereby reflecting light). It is desirable that the member is configured), and it is desirable that the color be black or dark outside the light-shielding frame 4. For example, the insulating coating f in FIG. 4 is made of a resin coating printed in black by screen printing. By disposing such an antireflection film outside the frame of the light-shielding frame 4, the visibility of the light emitting segment 10 is improved. Can be improved effectively.

  A design plate 30 is coupled to the upper part of the light shielding frame 4 and the upper part of the sealing resin 7. The design plate 30 includes a resin sheet 61 and a protection plate 60. The resin sheet is made of a transparent polycarbonate having a thickness of 0.3 mm, and a black paint is screen-printed on the light-shielding portion excluding the display pattern region on the surface thereof. Thus, a display pattern that transmits light is formed. The protective plate 60 is made of an acrylic plate having a thickness of 1 mm, and is subjected to smoke treatment so that light from the outside is incident and is not scattered inside. The smoke-protected protective plate 60 is sufficiently light-transmitting to the extent that it exhibits the optical action of a half mirror, and a light diffusing material is mixed therein.

  However, the smoked protective plate 60 may be a colored resin or a smoked glass plate. Further, instead of mixing the light diffusing material into the protective plate 60, a light diffusing film may be attached to the protective plate 60. For these light diffusion materials and light diffusion films, for example, well-known materials used in liquid crystal display devices can be used.

According to such a mounting form, when all the LEDs are turned off, the light emitting segment 10 is hidden by the protective plate 60 and cannot be seen, and when any one of the LEDs is turned on, only the turned on is a smoked protective plate. Since it appears to emerge from 60, the visibility of the display is good. Further, since the light-emitting display is appropriately diffused by the light diffusing material mixed in the protective plate 60, high visibility can be obtained even when the display is viewed obliquely. That is, it is easy to confirm the display contents even if the display unit is obliquely viewed.
In FIG. 4, there is no sealing material between the light-shielding frame bodies 4 adjacent to each other between the segments, but this region may be filled with a sealing resin.

If it follows the above structures, since the light emission from LED3 will become difficult to leak to the adjacent light emission segment 10, it can implement | achieve the favorable contrast whose visibility is higher than before. Further, part of the emitted light is reflected by the light reflecting member (copper printed wirings 2a and 2b) and output upward, so that high luminance can be realized at the same time.
Moreover, since the formation accuracy of such a light-shielding frame 4 is restricted only by the printing accuracy described above, it is possible to arrange the light emitting segments 10 at a very high density. Further, according to the configuration as described above, the LED 3 can be directly mounted (chip-on-board) on the circuit board 1 without the need for a lead frame or the like, so that the desired integrated display device can be effectively reduced in thickness. it can.
The bonding wires 6 in FIG. 4 are stretched in the horizontal direction (AA ′ cross-sectional direction) in FIG. 3, but they may be wired in the vertical direction in FIG. By optimizing these wiring layouts, the light emitting segment 10 can be further miniaturized.

  Although the light-shielding frame 4 is formed by screen printing, the light-shielding frame 8 may be made of a plate material as shown in FIG. This plate material (light-shielding frame 8) is made of acrylic or polycarbonate and is formed in a black flat plate shape. However, in order to form a mounting portion (concave portion) for the LED 3, a through hole 8a is formed in the plate material in a region where the LED 3 of each segment is mounted. In this integrated display device, the circuit board 1 may be formed of a white resin substrate (which constitutes a light reflecting member). Since the light-shielding frame 8 (plate material) can be formed from a black resin having a sufficient thickness, reflection of light on the front and back surfaces and transmission of light between the front and back surfaces hardly occur. By making the circuit board 1 a white board, the reflecting action of the light reflecting members (copper printed wirings 2a and 2b) can be supplemented from behind.

  Further, as the circuit substrate 1, a metal substrate having an insulating film laminated on the upper surface may be used. In this case, a high heat dissipation effect can be effectively ensured simultaneously with a high reflection effect. In this case, the metal substrate may be a copper plate, for example, and the insulating film may be laminated only under one of the copper printed wirings 2a and 2b. As a result, the other printed wiring and the metal substrate can be integrally formed, and the heat dissipation action is further improved by reducing the current density and improving the heat conduction efficiency.

  FIG. 6 is a cross-sectional view showing a main part of an integrated display device 200 according to a second specific example of the present invention. In FIG. 6, cross sections of two adjacent segments constituting the display pattern are displayed. The integrated display device 200 includes a design plate 210 composed of a substrate portion 210a, a circuit wiring 210c and a light shielding portion 210b in which a light diffusion material is dispersed, an LED 201 composed of a group III nitride compound semiconductor, and wire bonding 203n and 203p. Become. The light shielding part 210b is formed by screen printing a black paint on the surface of the substrate part 210a. The light-shielding part 210b may be formed by adhering a film on the surface of the substrate part 210a in which the light-transmitting area of the display pattern is transparent and the other light-shielding parts are opaque. The LED 201 made of a group III nitride compound semiconductor has an insulating substrate 220, an n-type group III nitride compound semiconductor region 221n, and a p-type group III nitride compound semiconductor region 222p in this order. In FIG. 6, the light emitting region is indicated by a thick line A sandwiched between the n-type group III nitride compound semiconductor region 221n and the p-type group III nitride compound semiconductor region 222p. The light emitting region A can be a light emitting layer having a single layer, a single quantum well structure, or a multiple quantum well structure in addition to the pn interface, and is simply shown. Although omitted in FIG. 6, an n-electrode is provided between the n-type group III nitride compound semiconductor region 221n and the wire bonding 203n, and an n-type electrode is provided between the p-type group III nitride compound semiconductor region 222p and the wire bonding 203p. Is formed with a p-electrode. In FIG. 6, the circuit wiring 210c is described as if it covers the majority of the area where the group III nitride compound semiconductor light-emitting element 201 is not disposed on the back surface of the substrate portion 210a. The group nitride compound semiconductor light emitting element 201 may be formed so that it can be energized.

  The LED 201 is sealed by potting the sealing resin 205. The sealing resin 205 is mixed with a light diffusing material. Further, a back sheet 207 on which a reflective member 206 made of a highly reflective metal is deposited is attached to the front surface of the sealing resin 205 and the back surface of the design plate 210 other than the sealing resin 205. The reflection member 206 may be formed uniformly on the entire surface of the back sheet 207, or may be formed only in a region corresponding to the light transmitting portion B of the display pattern.

  In the integrated display device 200 of FIG. 6, when the light emitted from the light emitting region (thick line) A of the LED 201 reaches the substrate part 210 a of the design plate 210, the light diffusion material dispersed in the substrate part 210 a causes light to be emitted. Will spread. As a result, an extremely wide area of the substrate portion 210a of the design plate 210 becomes the same state as a secondary light source. The progress of this light is indicated by thick arrows in FIG. That is, the light from the light emitting region (thick line) A diffuses in various directions within the substrate portion 210a. Thus, finally, the entire light transmission region B of the display pattern that is not covered by the light shielding member 210b is visually recognized as if it is emitting light. As described above, in the integrated display device 200 of FIG. 6, the light emission of the LED 201 made of a group III nitride compound semiconductor, which is a point light source, is emitted from the substrate part 210a in which the light diffusion material is dispersed. It can be visually recognized as light emission from the whole. It passes through in the upward direction in the figure.

  On the other hand, when the light emitted from the light emitting region (thick line) A reaches the light diffusion material mixed in the sealing resin 205 after being reflected directly or by the reflection member 206 made of a highly reflective metal, this light diffusion is performed. Light diffuses depending on the material. As a result, the extremely large area below the design plate 210 becomes the same state as a secondary light source. This is indicated by thick arrows in FIG. That is, light from the light emitting region (thick line) A diffuses in various directions within the sealing resin 205. Thus, finally, the entire light transmission region B of the light emission pattern that is not covered by the light shielding portion 210b is visually recognized as if it is emitting light.

  As described above, the integrated display device 200 of FIG. 6 emits light from the LED 201 that is a point light source by the sealing resin 205 in which the light diffusion material is dispersed and the substrate portion 210a of the design plate 210 in which the light diffusion material is dispersed. However, it can be visually recognized as light emission from the entire light transmission region B which is a light transmission part of the display pattern. Therefore, by forming the light-shielding portion 210b in a desired shape, it is possible to provide an integrated display device of the light transmission region B that is shaped into a desired shape.

  In the above embodiment, the light diffusing material is dispersed in both the substrate portion 210a of the design plate 210 and the sealing resin 205, but the light diffusing material may be dispersed in either one of them. . Further, in place of the light diffusing material, the phosphor may be dispersed in at least one of them, or both the light diffusing material and the phosphor may be dispersed in at least one of them. The circuit wiring 210c is wired to the periphery of the design plate 210, and an external terminal is connected to the periphery.

  FIG. 7 is a cross-sectional view showing the main part of an integrated display device 300 according to a specific third embodiment of the present invention. The integrated display device 300 uses the same design plate 310 as the integrated display device 200 of FIG. 6 for the design plate 310 including the substrate portion 310a, the circuit wiring 310c, and the light shielding portion 310b in which the light diffusion material is dispersed. On the other hand, in the integrated display device 300 of FIG. 7, the LED 302 made of a group III nitride compound semiconductor is formed by flip chip, and the bump electrode is connected to the circuit wiring 310c. That is, the LED 302 used in the integrated display device 300 of FIG. 7 is basically the same as the LED 201 made of the group III nitride compound semiconductor of FIG. 6 and the insulating substrate 320 and the n-type group III nitride compound semiconductor. It has a region 321n and a p-type group III nitride compound semiconductor region 322p in this order, and is sandwiched between the n-type group III nitride compound semiconductor region 321n and the p-type group III nitride compound semiconductor region 322p. Light emitting region (thick line) A. The p-type group III nitride compound semiconductor region 322p is connected to the circuit wiring 310c via a p electrode (not shown), and the n-type group III nitride compound semiconductor region 321n is a circuit via an n electrode (not shown) and a bump 303b. It is connected to the wiring 310c. Note that a p-electrode (not shown) is a translucent thin film electrode.

  The LED 302 is sealed by potting the sealing resin 305. The sealing resin 305 is mixed with a light diffusing material. Further, a back sheet 307 on which a reflective member 306 made of a highly reflective metal is vapor-deposited is attached to the front surface of the sealing resin 305 and the back surface of the design plate 310 other than the sealing resin 305. The reflection member 306 may be formed uniformly on the entire surface of the back sheet 307, but may be formed only in a region corresponding to the light transmitting portion B of the display pattern.

  In the apparatus of the present embodiment, light reflection, light scattering by the light diffusing material mixed in the sealing resin 305, and light scattering by the light diffusing material mixed in the substrate portion 310a are the same as those in the second embodiment in FIG. Mechanism. Also in this example, as in Example 2, the light diffusing material was dispersed in both the substrate portion 310a of the design plate 310 and the sealing resin 305, but the light diffusing material was applied to either one. It may be dispersed. Further, in place of the light diffusing material, the phosphor may be dispersed in at least one of them, or both the light diffusing material and the phosphor may be dispersed in at least one of them. The circuit wiring 310c is wired to the periphery of the design plate 310, and an external terminal is connected to the periphery.

[Modification Example of Substrate Part in Examples 2 and 3]
When a phosphor is used instead of the light diffusing material dispersed in the substrate portions 210a and 310a of FIGS. 6 and 7, light having a wavelength different from the emission wavelength of the LEDs 201 and 302 made of a group III nitride compound semiconductor is concerned. It is possible to emit light from the phosphor. For example, if the emission wavelength of the LEDs 201 and 302 made of a group III nitride compound semiconductor is set to a blue region and a phosphor that emits yellow fluorescence by absorbing light of this emission wavelength is used, white light is emitted from the light transmission region B. It is also possible to obtain. Alternatively, it is also possible to obtain light emission of any color from the light transmission region B by using a phosphor that emits light of any color by absorbing light of this light emission wavelength in the ultraviolet region of the LEDs 201 and 302. . At this time, if phosphors having different fluorescent colors are mixed, the color tone can be adjusted more easily. Furthermore, if a colored plate is used as the substrate portions 210a and 310a in FIGS. 6 and 7, the color tone of the LED can be changed.

[Modification of light shielding part]
The light shielding portions 210b and 310b are not directly provided on the substrate portion 210a or 310a, but are provided on a thin film (film) made of a transparent material by, for example, printing, and then the light shielding portions 210b and 310b are provided on the substrate portion 210a or 310a. It is good also as adhere | attaching the thin film (film) which consists of a transparent material provided.

  Alternatively, a design plate having a light diffusing material on the surface may be formed by bonding a thin film (film) having a light diffusing material to the substrate portions 210a and 310a made of a transparent material. At this time, the side to which the thin film (film) having the light diffusing material is bonded may be the light extraction side for forming the light shielding portions 210b and 310b, and conversely the side for forming the circuit wirings 210c and 310c. In either case, the light shielding portions 210b and 310b and the circuit wirings 210c and 310c may be formed after bonding a thin film (film) having a light diffusing material to the substrate portions 210b and 310b made of a transparent material. A thin film (film) having a light diffusing material may be adhered after the light shielding portions 210b and 310b and the circuit wirings 210c and 310c are formed. Treatment such as drilling for conduction is arbitrarily performed.

This embodiment is an integrated display device in which the display device of the structure of Embodiment 1 and the structure of Embodiment 2 or 3 are integrated for each display pattern or each segment.
FIG. 8 shows the configuration. The design plate 30 includes a resin sheet 61 and a protection plate 60. The circuit board 1 is provided facing the design body 30 and in parallel therewith. Resin sheet 61, protective plate 60, circuit board 1, LED 3 (second light-emitting diode) electrically connected to printed wirings 2a and 2b on circuit board 1, light-shielding frame 4, and light diffusion material are mixed. The configuration of the sealing resin 7 is the same as that of the first embodiment. Further, circuit wiring 210c is formed on the back surface of the design plate 30, that is, the back surface of the resin sheet 61, and the LED 201 (first light emitting diode) is electrically joined to the circuit wiring 210c. The LED 201 is sealed with a sealing resin 205. This sealing resin 205 is mixed with a light diffusing material. The configurations of the circuit wiring 210c, the LED 201, and the sealing resin 205 are the same as those in the second embodiment.

  In the present embodiment, a circuit board 1 on which the LED 3, the light-shielding frame 4 and the sealing resin 7 are arranged, and a design board 30 on which the LED 201 and the sealing resin 205 are arranged are prepared, and the circuit board 1 and the design board 30 are prepared. Manufactured by bonding. In this embodiment, a segment in which LEDs are provided on the back surface of the design board 30 and a segment in which LEDs are provided on the circuit board 1 are mixed according to the characteristics of the display pattern. For this reason, the integration density of the segments can be improved, and display with brightness according to the display pattern can be realized.

  The present invention is not limited to the above embodiments. On the basis of the configuration described in the embodiment, it can be appropriately changed using any available member. For example, the light emitting element is not limited to an LED made of a group III nitride compound semiconductor, and red to yellow-green GaAs or InP light emitting elements may be used. When an element using a conductive chip substrate is connected to circuit wiring, this conductive substrate may be directly connected to circuit wiring. In the present invention, it is only necessary to visually recognize as if the light transmission region B composed of the region where the light shielding member is not formed is finally shining, and the circuit wiring, the light emitting element, and the wire, solder, bump, etc. for conducting them. It is not always necessary to use a translucent material. The light diffusing material may be dispersed in both the substrate portion of the design plate and the sealing resin, and a thin film (light diffusing sheet) having the light diffusing material may be stacked on the light extraction side. Naturally, the combined use of the light diffusing material and the phosphor is included in the present invention.

  The present invention can be used for a display device in which various display patterns are integrated. For example, it is optimal for use as a display device for various devices of a vehicle.

1 is a development view illustrating a configuration of an integrated display device 100 according to a specific example 1 of the present invention. FIG. 3 is a plan view showing one display pattern of the integrated display device 100 according to the first embodiment. FIG. 3 is a plan view showing light-emitting segments constituting a display pattern of the integrated display device 100 according to the first embodiment. 1 is a cross-sectional view of an integrated display device 100 according to a first embodiment. 2 is a cross-sectional view of a light emitting segment of the integrated display device of Example 1. FIG. Sectional drawing of the integrated display apparatus concerning the specific Example 2 of this invention. Sectional drawing of the light emission segment of the integrated display apparatus concerning the specific Example 3 of this invention. Sectional drawing of the integrated display apparatus which concerns on concrete Example 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Circuit board 4, 8 ... Light-shielding frame 7,205,305 ... Sealing resin 30,210,310 ... Design board 10 ... Light emitting segment 100,200,300,400 ... Integrated display device 60 ... Protection board 61 ... Resin sheet 3 ... LED
210a, 310a ... substrate part 210b, 310b ... light shielding part 210c, 310c ... circuit wiring 206, 306 ... reflection member 207, 307 ... back sheet B ... light transmission region

Claims (4)

In an integrated display device in which a large number of light emitting diodes are arranged to integrate various displays,
A design plate having a display pattern that transmits light from the light emitting diodes and disposed on the front surface of the display device;
A circuit board on which the light emitting diode is disposed;
A sealing resin that seals the light emitting diode and is mixed with a phosphor or a light diffusion material;
A light reflecting member disposed on a bottom surface of the light emitting diode mounting portion;
Surrounding the sealing resin from the side, a black or dark shade frame formed along the outline of the display pattern,
An integrated display device. In an integrated display device in which a large number of light emitting diodes are arranged to integrate various displays,
A display pattern that transmits light from the light emitting diode and a light shielding portion that shields a region other than the display pattern, and a wiring pattern for supplying power to the light emitting diode is formed on the back surface; A design board arranged in
The light emitting diodes disposed on the back surface of the design plate and connected to the wiring pattern;
Sealing resin for sealing the light emitting diode from the back surface of the design plate;
Joining the back surface of the sealing resin and the back surface of the design plate, and having a back sheet on which a reflective member is formed at least in a region corresponding to the display pattern, or at least the region of the display pattern of the design plate, or An integrated display device, wherein a phosphor or a light diffusing material is mixed in the sealing resin. In an integrated display device in which a large number of light emitting diodes are arranged to integrate various displays,
A display pattern that transmits light from the light emitting diode and a light shielding portion that shields a region other than the display pattern, and a wiring pattern for supplying power to the light emitting diode is formed on the back surface; A design board arranged in
A first light emitting diode disposed on the back surface of the design plate and connected to the wiring pattern;
A substrate having a wiring pattern formed on the first surface, which is a surface on the design plate side, provided on the back surface side at a predetermined interval with respect to the back surface of the design plate;
A second light emitting diode provided on the first surface on the substrate;
Filled between the design plate and the substrate, sealing the first light emitting diode and the second light emitting diode, and a sealing resin mixed with a phosphor or a light diffusion material;
A black or dark shade frame that encloses and holds the sealing resin from the side; and
An integrated display device comprising:   4. The integrated display device according to claim 3, wherein a phosphor or a light diffusing material is mixed in at least the region of the display pattern of the design plate.

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