CN113299680B

CN113299680B - Display device

Info

Publication number: CN113299680B
Application number: CN202110570609.2A
Authority: CN
Inventors: 刘仲展; 刘品妙
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2020-06-05
Filing date: 2021-05-25
Publication date: 2023-05-12
Anticipated expiration: 2041-05-25
Also published as: CN113299680A

Abstract

The invention provides a display device. The display device comprises a driving substrate, a first light emitting diode element, a first connecting element, a second connecting element, a first insulating pattern and a reflecting pattern. The driving substrate is provided with a first connecting pad, a second connecting pad, a third connecting pad and a connecting area. The first connecting element is electrically connected to the first electrode of the first light emitting diode element and the first connecting pad of the driving substrate. The second connecting element is electrically connected to the second electrode of the first light emitting diode element and the second connecting pad of the driving substrate. The first insulating pattern is arranged on the first light emitting diode element, the first connecting element and the second connecting element. The reflective pattern is disposed on the first insulating pattern.

Description

Display device

Technical Field

The present invention relates to a display device.

Background

With the evolution of display technology, display devices with high resolution and thin profile are popular in the mainstream market. In recent years, due to the breakthrough of the process technology of Light-Emitting Diode (LED) devices, micro-LED display devices (Micro-LED display) or millimeter-sized LED display devices, etc., which can be manufactured by arranging the LED devices in an array, have been developed, and the thickness of the display device can be further reduced without providing a Liquid crystal layer (Liquid crystal) and a Color filter (Color filter). In addition, compared with the organic light emitting diode display device, the micro light emitting diode display device has the advantages of more power saving and longer service life.

In the current manufacturing process of the micro light emitting diode display device, a large number of light emitting diode elements are transferred onto another substrate through Mass transfer (Mass transfer). However, the present display device generally has many millions of pixels, and the size of the led device is small and it is difficult to accurately pick up and align the led device, which is easy to cause the problem that the led device cannot be accurately placed at a predetermined position due to an alignment error, and thus the led device cannot be normally driven. That is, the manufacturing yield of the current micro light emitting diode display device is low, and repair is required.

Disclosure of Invention

The invention aims to provide a display device with good performance and easy repair.

The display device of an embodiment of the invention comprises a driving substrate, a first light emitting diode element, a first connecting element, a second connecting element, a first insulating pattern and a reflecting pattern. The driving substrate is provided with a first connecting pad, a second connecting pad, a third connecting pad and a connecting area, wherein the first connecting pad and the second connecting pad are oppositely arranged, the third connecting pad and the connecting area are oppositely arranged, and the third connecting pad is electrically connected to one of the first connecting pad and the second connecting pad. The first light emitting diode element is arranged on the driving substrate and provided with a first electrode and a second electrode. The first connecting element and the second connecting element are arranged on the side wall of the first light-emitting diode element, the first connecting element is electrically connected to the first electrode of the first light-emitting diode element and the first connecting pad of the driving substrate, and the second connecting element is electrically connected to the second electrode of the first light-emitting diode element and the second connecting pad of the driving substrate. The first insulating pattern is arranged on the first light emitting diode element, the first connecting element and the second connecting element, and one of the first connecting element and the second connecting element is electrically connected to the third connecting pad. The reflective pattern is disposed on the first insulating pattern. The reflective pattern comprises a first portion and a first portion, wherein the first portion is electrically connected to the other of the first connecting element and the second connecting element and extends from the upper side of the first light emitting diode element to the connecting region of the driving substrate, and the second portion is electrically connected to the third connecting pad of the driving substrate and is structurally separated from the first portion of the reflective pattern.

In an embodiment of the invention, the first portion of the reflective pattern has an opening, and the second portion of the reflective pattern is disposed in the opening of the first portion.

In an embodiment of the invention, the driving substrate further has a connection line, the one of the first pad and the second pad is electrically connected to the third pad through the connection line, the reflective pattern overlaps the connection line of the driving substrate, and the first insulating pattern is disposed on the connection line.

In an embodiment of the invention, the display device further includes a first adhesion pattern. The first adhesion pattern is arranged on the driving substrate, wherein the first light emitting diode element is arranged on the first adhesion pattern. The driving substrate is also provided with a connecting wire, one of the first connecting pad and the second connecting pad is electrically connected to the third connecting pad through the connecting wire, the reflecting pattern is overlapped on the connecting wire of the driving substrate, and the first adhesion pattern is arranged on the connecting wire.

In an embodiment of the invention, the display device further includes a second light emitting diode element disposed on the driving substrate. The second light emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light emitting diode element.

In an embodiment of the invention, the second portion of the reflective pattern is electrically connected to the other of the first electrode and the second electrode of the second light emitting diode element and the third pad of the driving substrate.

In an embodiment of the invention, the light emitting efficiency of the second light emitting diode element is higher than that of the first light emitting diode element.

In an embodiment of the invention, the display device further includes a second insulating pattern disposed on the driving substrate. The second insulating pattern is provided with a first end and a second end which are opposite, the first end of the second insulating pattern is arranged on the connecting area of the driving substrate, the first part of the reflecting pattern is arranged on the first end of the second insulating pattern, and the second part of the reflecting pattern is arranged on the second end of the second insulating pattern.

In an embodiment of the invention, a material of the second insulating pattern is the same as a material of the first insulating pattern.

In an embodiment of the invention, the display device further includes a second light emitting diode element disposed on the second insulating pattern. The second light emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light emitting diode element.

In an embodiment of the invention, the display device further includes a second light emitting diode element disposed on the second insulating pattern. The second light emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light emitting diode element. The refractive index of the second insulating pattern is between the refractive index of a portion of the second light emitting diode element and the refractive index of a portion of the driving substrate.

In an embodiment of the invention, the display device further includes a second light emitting diode element disposed on the second insulating pattern. The second light emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light emitting diode element. The distance between the second light emitting diode element and the base of the driving substrate is greater than that between the first light emitting diode element and the base of the driving substrate, and the distance between the second part of the reflective pattern on the other one of the first electrode and the second electrode of the second light emitting diode element and the base of the driving substrate is smaller than that between the first part of the reflective pattern on the upper surface of the first insulating pattern and the base of the driving substrate, wherein the upper surface of the first insulating pattern faces away from the base of the driving substrate.

In an embodiment of the invention, a film thickness of the reflective pattern is greater than a film thickness of at least one of the first connection element and the second connection element.

In an embodiment of the invention, the first insulating pattern has an upper surface facing away from the driving substrate, and the upper surface of the first insulating pattern is a substantially flat surface.

In an embodiment of the invention, the first connection element and the second connection element have a first gap on the first light emitting diode element, the first portion of the reflective pattern and the second portion of the reflective pattern have a second gap on the connection region, the first gap and the second gap have a first width and a second width in a same direction, respectively, and the second width is smaller than the first width.

In an embodiment of the invention, the first light emitting diode element has an upper surface opposite to the driving substrate, an area of the upper surface is located between the first connection element and the second connection element, and the reflective pattern overlaps the area of the upper surface of the first light emitting diode element, the first connection element and the second connection element.

The display device of an embodiment of the invention comprises a driving substrate, a first light emitting diode element, a first connecting element, a second connecting element, a first insulating pattern and a reflecting pattern. The driving substrate is provided with a first connecting pad, a second connecting pad, a third connecting pad and a connecting area, wherein the first connecting pad and the second connecting pad are oppositely arranged, the third connecting pad and the connecting area are oppositely arranged, and the third connecting pad is electrically connected to one of the first connecting pad and the second connecting pad. The first light emitting diode element is arranged on the driving substrate and provided with a first electrode and a second electrode. The first connecting element and the second connecting element are arranged on the side wall of the first light-emitting diode element, wherein the first connecting element is electrically connected to the first electrode of the first light-emitting diode element and the first connecting pad of the driving substrate, and the second connecting element is electrically connected to the second electrode of the first light-emitting diode element and the second connecting pad of the driving substrate. The first insulating pattern is arranged on the first light emitting diode element, the first connecting element and the second connecting element. The reflective pattern is disposed on the first insulating pattern. The first light-emitting diode element is provided with an upper surface opposite to the driving substrate, a region of the upper surface is positioned between the first connecting element and the second connecting element, and the reflecting pattern is overlapped on the region of the upper surface of the first light-emitting diode element, the first connecting element and the second connecting element.

Drawings

Fig. 1A to 1F are schematic side and perspective views illustrating a manufacturing process of a display device according to an embodiment of the invention.

Fig. 2 is a schematic top view and a perspective view of a display device according to an embodiment of the invention.

Fig. 3 schematically depicts an equivalent circuit of a pixel driving circuit according to an embodiment of the present invention.

Fig. 4A to 4F are schematic side and perspective views illustrating a manufacturing process of a display device according to an embodiment of the invention.

Fig. 5 is a schematic top view and a perspective view of a display device according to an embodiment of the invention.

Fig. 6 is a schematic diagram of a display device according to an embodiment of the invention.

Fig. 7 is a schematic top view and a perspective view of a display device according to an embodiment of the invention.

Fig. 8 is a schematic diagram of a display device according to an embodiment of the invention.

Fig. 9 is a schematic diagram of a display device according to an embodiment of the invention.

Fig. 10A to 10E are schematic side and perspective views illustrating a manufacturing process of a display device according to an embodiment of the invention.

Fig. 11 is a schematic top view and a perspective view of a display device according to an embodiment of the invention.

Fig. 12 is a schematic top view and a perspective view of a display device according to an embodiment of the invention.

The reference numerals are as follows:

10. 10A, 10B, 10C', 10D, 10E, 10F: display device

110 substrate

121 first connecting element

122 second connecting element

130 insulating layer

131 first insulating pattern

131a contact window

131s upper surface

132 second insulating pattern

132a, 142a first end

132b, 142b second end

141 first adhesive pattern

142 second adhesive pattern

150 reflective layer

151 reflective pattern

151a first portion

151b second portion

151c opening

160 flat layer

170 dielectric layer

A: active layer

C. C' connecting line

C1 capacitance

D1, D2, D1, D2 distance

DS drive substrate

DL data line

E1 first electrode

E2:second electrode

G1 first gap

G2 second gap

GL scan line

Direction k

LED1 first light emitting diode element

LED1s upper surface

LED1sa area

LED2 second light emitting diode element

LED2s upper surface

LED2sa area

P1 first pad

P2:second connecting pad

P3:third connecting pad

R is pixel region

R1:first subregion

R2 second subregion

r-connecting region

S side wall

SE1 first semiconductor layer

SE2 second semiconductor layer

SPC pixel driving circuit

T, t1 film thickness t2

T1 first transistor

T1a, T2a first end

T1b, T2b second end

T1c, T2c control end

T2 second transistor

VDD power line

VSS common line

W1 first width

W2 second width

Detailed Description

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between the two elements.

As used herein, "about," "approximately," or "substantially" includes both the values and average values within an acceptable deviation of the particular values as determined by one of ordinary skill in the art, taking into account the particular number of measurements and errors associated with the measurements in question (i.e., limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the values, or within ±30%, ±20%, ±10%, ±5%. Further, as used herein, "about," "approximately," or "substantially" may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etching, or other properties, and may not be used with one standard deviation for all properties.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Fig. 1A to 1F are schematic side and perspective views illustrating a manufacturing process of a display device 10 according to an embodiment of the invention.

Fig. 2 is a schematic top view and a perspective view of a display device 10 according to an embodiment of the invention.

Fig. 2 depicts the first pads P1, the second pads P2, the third pads P3, the connecting lines C, the first light emitting diode elements LED1, the first insulating patterns 131, the contact windows 131a, the second adhesive patterns 142, a second light emitting diode element LED2 and the reflective patterns 151 of fig. 1F, and other components of fig. 1F are omitted.

Fig. 3 schematically depicts an equivalent circuit of one pixel driving circuit SPC according to an embodiment of the invention.

The following describes a manufacturing process and a structure of the display device 10 according to an embodiment of the invention with reference to fig. 1A to 1F, fig. 2 and fig. 3.

Referring to fig. 1A and 2, first, a driving substrate DS is provided. The driving substrate DS has a plurality of pixel regions R. Each pixel region R of the driving substrate DS includes a first sub-region R1 and a second sub-region R2 adjacent to each other, the first sub-region R1 has a first pad P1 and a second pad P2 disposed opposite to each other, the second sub-region R2 has a third pad P3 and a connection region R disposed opposite to each other, the first sub-region R1 is configured for a first LED1 to be transposed for the first time, and the second sub-region R2 is configured for a second LED2 to be used for repairing.

The third pad P3 of each pixel region R is electrically connected to one of the first pad P1 and the second pad P2 of the pixel region R. For example, in the present embodiment, the third pad P3 of each pixel region R is selectively electrically connected to the first pad P1 of the pixel region R, but the invention is not limited thereto.

Referring to fig. 1A and fig. 3, in the present embodiment, the driving substrate DS further includes a base 110 and a plurality of pixel driving circuits SPC disposed on the base 110, wherein a first pad P1, a second pad P2 and a third pad P3 of each pixel region R are electrically connected to a corresponding one of the pixel driving circuits SPC.

In the present embodiment, the display device 10 is a bottom-emitting display, and the substrate 110 of the driving substrate DS is transparent. For example, in the present embodiment, the substrate 110 may be made of glass, quartz, organic polymer, or other suitable materials.

In this embodiment, each pixel driving circuit SPC includes a data line DL, a scan line GL, a power line VDD, a common line VSS, a first transistor T1, a second transistor T2 and a capacitor C1, wherein the first end T1a of the first transistor T1 is electrically connected to the data line DL, the control end T1C of the first transistor T1 is electrically connected to the scan line GL, the second end T1b of the first transistor T1 is electrically connected to the control end T2C of the second transistor T2, the first end T2a of the second transistor T2 is electrically connected to the power line VDD, and the capacitor C1 is electrically connected to the second end T1b of the first transistor T1 and the first end T2a of the second transistor T2.

In the present embodiment, a first pad P1 and a second pad P2 of each pixel region R may be electrically connected to the second terminal T2b of the second transistor T2 of the corresponding pixel driving circuit SPC and the common line VSS, respectively, and a third pad P3 of each pixel region R may be electrically connected to the second terminal T2b of the second transistor T2 of the corresponding pixel driving circuit SPC or the common line VSS. For example, in the present embodiment, a third pad P3 of each pixel region R is electrically connected to the second terminal T2b of the second transistor T2 of the corresponding pixel driving circuit SPC, but the invention is not limited thereto.

In the present embodiment, one pixel driving circuit SPC may selectively include two transistors (a first transistor T1 and a second transistor T2) and one capacitor C1. That is, in the present embodiment, the pixel driving circuit SPC can selectively employ the 2T1C architecture. However, the invention is not limited thereto, and in other embodiments, the pixel driving circuit SPC may also employ other architectures such as, but not limited to, 1T1C architecture, 3T2C architecture, 4T1C architecture, 4T2C architecture, 5T1C architecture, 5T2C architecture, 6T1C architecture, 6T2C architecture, 7T2C architecture, or any other possible architecture.

Referring to fig. 1B, next, the plurality of first light emitting diode elements LED1 are transposed on the plurality of first sub-areas R1 of the plurality of pixel areas R of the driving substrate DS. Each first light emitting diode element LED1 is disposed on the driving substrate DS and has a first electrode E1 and a second electrode E2. The first electrode E1 of the first light emitting diode element LED1 and the second electrode E2 of the first light emitting diode element LED1 are electrically connected to the first type semiconductor layer SE1 of the first light emitting diode element LED1 and the second type semiconductor layer SE2 of the first light emitting diode element LED1, respectively, and the active layer a of the first light emitting diode element LED1 is disposed between the first type semiconductor layer SE1 and the second type semiconductor layer SE 2.

For example, in the present embodiment, each of the first light emitting diode elements LED1 may be fixed on the driving substrate DS by a first adhesive pattern (not shown) disposed on the bottom surface thereof, but the invention is not limited thereto.

Referring to fig. 1B, a plurality of first connection elements 121 and a plurality of second connection elements 122 are formed, so that a plurality of first light emitting diode elements LED1 are electrically connected to a plurality of first pads P1 and a plurality of second pads P2 of the plurality of pixel regions R, respectively. Each first connecting element 121 and a corresponding second connecting element 122 are disposed on the sidewall S of the same first light emitting diode element LED1, wherein the first connecting element 121 and the second connecting element 122 are electrically connected to the first electrode E1 and the second electrode E2 of the same first light emitting diode element LED1, the first connecting element 121 and the second connecting element 122 are also electrically connected to a first pad P1 and a second pad P2 of the same pixel region R, respectively, and one of the first connecting element 121 and the second connecting element 122 is electrically connected to a third pad P3 of the same pixel region R. For example, in the present embodiment, the first connection element 121 may be selectively electrically connected to the third pad P3, but the invention is not limited thereto.

Referring to fig. 1C and fig. 2, an insulating layer 130 is formed on the first light emitting diode elements LED1, the first connecting elements 121 and the second connecting elements 122. The insulating layer 130 includes a plurality of first insulating patterns 131, where each first insulating pattern 131 is disposed on a corresponding one of the first light emitting diode elements LED1, one of the first connecting elements 121, and one of the second connecting elements 122.

In this embodiment, each of the first insulating patterns 131 may optionally have a contact 131a, where the contact 131a overlaps one of the first connection element 121 and the second connection element 122 on the same first light emitting diode element LED 1. For example, in the present embodiment, the contact hole 131a of the first insulating pattern 131 may be selectively overlapped with the second connecting element 122, but the invention is not limited thereto.

In this embodiment, the material of the insulating layer 130 may be an inorganic material, such as, but not limited to: silicon oxide, silicon nitride, silicon oxynitride, or a stack of at least two of the foregoing materials. However, the present invention is not limited thereto, and in other embodiments, the material of the insulating layer 130 may be an organic material, or a combination of an organic material and an inorganic material.

Referring to fig. 1C and 2, whether the first light emitting diode elements LED1 can be driven by the driving substrate DS to emit light normally is detected. If it is found that a first Light Emitting Diode (LED) 1 on a pixel region R cannot be driven by a driving substrate DS to normally emit light, a repairing operation is performed on a second sub-region R2 of the pixel region R.

Referring to fig. 1D and fig. 2, for example, in the present embodiment, a plurality of second adhesion patterns 142 may be formed by selectively using a photolithography process, wherein the plurality of second adhesion patterns 142 are disposed on the plurality of second sub-regions R2 of the plurality of pixel regions R, respectively.

In this embodiment, a layer of adhesive material (not shown) is patterned using a pre-designed photomask to form a plurality of second adhesive patterns 142. Therefore, no matter whether the pixel region R needs to be repaired, the second adhesion patterns 142 are disposed on the second sub-regions R2 of all the pixel regions R. However, the present invention is not limited thereto, and in other embodiments, the second adhesion patterns 142 may be formed in other manners, and the second sub-region R2 of each pixel region R is not necessarily provided with the second adhesion patterns 142.

Referring to fig. 1D and fig. 2, in the present embodiment, the second light emitting diode device LED2 is then transposed on the second adhesive pattern 142. The first electrode E1 of the second light emitting diode element LED2 and the second electrode E2 of the second light emitting diode element LED2 are electrically connected to the first type semiconductor layer SE1 of the second light emitting diode element LED2 and the second type semiconductor layer SE2 of the second light emitting diode element LED2, respectively, and the active layer a of the second light emitting diode element LED2 is disposed between the first type semiconductor layer SE1 and the second type semiconductor layer SE 2.

Referring to fig. 1E and fig. 2, a reflective layer 150 is formed on the insulating layer 130. The reflective layer 150 includes a plurality of reflective patterns 151 disposed in the plurality of pixel regions R, respectively. Each of the reflective patterns 151 is disposed on a corresponding one of the first insulating patterns 131. Each of the reflective patterns 151 includes a first portion 151a and a second portion 151b, one of the first connection element 121 and the second connection element 122 (e.g., without limitation, the first connection element 121) is electrically connected to the third connection pad P3 through the connection line C, the other of the first connection element 121 and the second connection element 122 (e.g., without limitation, the second connection element 122) is not electrically connected to the third connection pad P3 through the connection line C, the first portion 151a of the reflective pattern 151 is electrically connected to the other of the first connection element 121 and the second connection element 122 (e.g., without limitation, the second connection element 122) and extends from above the first light emitting diode element LED1 onto the connection region r of the driving substrate DS, and the second portion 151b of the reflective pattern 151 is electrically connected to the third connection pad P3 of the driving substrate DS and structurally separated from the first portion 151a of the reflective pattern 151.

In the present embodiment, the first portion 151a of the reflective pattern 151 has an opening 151c, and the second portion 151b of the reflective pattern 151 is disposed in the opening 151c of the first portion 151 a. In the present embodiment, the opening 151c of the reflective pattern 151 is, for example, a closed opening, but the invention is not limited thereto.

Referring to fig. 1E and 2, in the repaired pixel region R (e.g., a pixel region R on the left side of fig. 1E and a pixel region R on the upper left corner of fig. 2), one of the first electrode E1 and the second electrode E2 (e.g., but not limited to the second electrode E2) of the second light emitting diode element LED2 is disposed on the connection region R of the driving substrate DS, the first portion 151a of the reflective pattern 151 is electrically connected to the one of the first electrode E1 and the second electrode E2 (e.g., but not limited to the second electrode E2) of the second light emitting diode element LED2, and the second portion 151b of the reflective pattern 151 is electrically connected to the other of the first electrode E1 and the second electrode E2 (e.g., but not limited to the first electrode E1) of the second light emitting diode element LED2 and the third pad P3 of the driving substrate DS.

That is, in the repaired pixel region R, the first portion 151a of the reflective pattern 151 is used to reflect the light beams (not shown) emitted by the first light emitting diode element LED1 and the second light emitting diode element LED2, and also serves as an electrode (such as but not limited to the second electrode E2) of the second light emitting diode element LED2 to be electrically connected to the conductive path of the driving substrate DS; the second portion 151b of the reflective pattern 151, in addition to reflecting the light beam (not shown) emitted from the second light emitting diode element LED2, can also serve as another electrode (e.g., without limitation, the first electrode E1) of the second light emitting diode element LED2 electrically connected to the conductive path of the driving substrate DS.

In the present embodiment, in the pixel region R that is not repaired (e.g., a pixel region R on the right side of fig. 1E and a pixel region R on the upper right corner of fig. 2), the first portion 151a of the reflective pattern 151 extends from the first insulating pattern 131 to the first end 142a of the second adhesive pattern 142, and the second portion 151b of the reflective pattern 151 may be disposed on the second end 142b of the second adhesive pattern 142, but the invention is not limited thereto.

Referring to fig. 1E and fig. 2, a planarization layer 160 is formed on the reflective layer 150 to cover the first light emitting diode element LED1 and the second light emitting diode element LED2 on the plurality of pixel regions R. In this way, the display device 10 is completed.

It should be noted that the following embodiments use the element numbers and part of the content of the foregoing embodiments, where the same numbers are used to denote the same or similar elements, and descriptions of the same technical content are omitted. Reference is made to the foregoing embodiments for an explanation of omitted parts, which will not be repeated.

Fig. 4A to 4F are schematic side and perspective views illustrating a manufacturing process of the display device 10A according to an embodiment of the invention.

Fig. 5 is a schematic top view and a perspective view of a display device 10A according to an embodiment of the invention.

Fig. 5 illustrates the first pads P1, the second pads P2, the third pads P3, the connecting lines C, the first light emitting diode devices LED1, the first insulating patterns 131, the contact windows 131a, a second adhesive pattern 142, a second light emitting diode device LED2 and the reflective patterns 151 of fig. 4F, and other components of fig. 4F are omitted.

Referring to fig. 4A to 4F and fig. 5, the manufacturing process and the structure of the display device 10A of the present embodiment are similar to those of the display device 10 described above, and the difference between them is that: the repair method of the display device 10A is slightly different from that of the display device 10, and the difference in repair method also causes the structure of the display device 10A to be slightly different from that of the display device 10.

Referring to fig. 4D and fig. 5, in the present embodiment, a dispenser or an inkjet (dispenser or inkjet) is used to dispose the second adhesive pattern 142 on the second sub-region R2 of the pixel region R to be repaired. Therefore, the second adhesion pattern 142 is disposed on the second sub-region R2 of the repaired pixel region R, and the second adhesion pattern 142 is not disposed on the second sub-region R2 of the non-repaired (or not-repaired) pixel region R.

Referring to fig. 4E, in the pixel region R that is not repaired (e.g., a pixel region R on the right side of fig. 4E and a pixel region R on the upper right corner of fig. 5), the first portion 151a of the reflective pattern 151 extends from the first insulating pattern 131 to the connection region R of the driving substrate DS and directly contacts the connection region R of the driving substrate DS, and the second portion 151b of the reflective pattern 151 may directly contact the third pad P3 of the driving substrate DS.

Fig. 6 is a schematic diagram of a display device 10B according to an embodiment of the invention.

Fig. 7 is a schematic top view and a perspective view of a display device 10B according to an embodiment of the invention.

Fig. 7 illustrates the first pads P1, the second pads P2, the third pads P3, the connecting lines C, the first light emitting diode elements LED1, the first insulating patterns 131, the contact windows 131a, a second adhesive pattern 142, a second light emitting diode element LED2 and the reflective patterns 151 of fig. 6, and other components of fig. 6 are omitted.

Referring to fig. 6 and 7, the manufacturing process and the structure of the display device 10B of the present embodiment are similar to those of the display device 10 described above, and the following description refers to the same or similar differences.

In the embodiment of fig. 1F and 2, the third pad P3 is electrically connected to the first pad P1, and the first portion 151a of the reflective pattern 151 is electrically connected to the second electrode E2 of the first light emitting diode device LED1 and the second pad P2. That is, in the embodiment of fig. 1F and 2, the first portion 151a of the reflective pattern 151 can be regarded as a Cathode (Cathode) on the pixel region R. In the embodiment of fig. 1F and fig. 2, since the first portion 151a of each reflective pattern 151 is a cathode, the first portions 151a of the reflective patterns 151 respectively located in the pixel regions R can be directly connected, but the invention is not limited thereto.

In the embodiment of fig. 6 and 7, the third pad P3 is electrically connected to the second pad P2, and the first portion 151a of the reflective pattern 151 is electrically connected to the first electrode E1 and the first pad P1 of the first light emitting diode device LED 1. That is, in the embodiment of fig. 6 and 7, the first portion 151a of the reflective pattern 151 can be regarded as an Anode (Anode) on the pixel region R. In the embodiment of fig. 6 and 7, since the first portion 151a of each reflective pattern 151 is an anode, the first portions 151a of the reflective patterns 151 respectively located in the pixel regions R are separated from each other. In addition, in the embodiment of fig. 6 and 7, the opening 151c of the reflective pattern 151 may be an open opening, but the invention is not limited thereto.

Fig. 8 is a schematic diagram of a display device 10C according to an embodiment of the invention.

Referring to fig. 8, the display device 10C of the present embodiment is similar to the display device 10 of fig. 1F, and the following description refers to the foregoing description for the differences.

One difference between the display device 10C of fig. 8 and the display device 10 of fig. 1F is that the film thickness T of the first insulating pattern 131 of the display device 10C of fig. 8 is greater than the film thickness T of the first insulating pattern 131 of the display device 10 of fig. 1F. For example, the film thickness T of the first insulating pattern 131 of the display device 10C of fig. 8 may be greater than or equal to 1 μm, and the film thickness T of the first insulating pattern 131 of the display device 10 of fig. 1F may be less than or equal to

However, the present invention is not limited thereto. In addition, in the embodiment of fig. 8, the material of the first insulating pattern 131 may be an organic material or a polymer, but the invention is not limited thereto. />

Referring to fig. 8, the thicker first insulating pattern 131 may make the reflective pattern 151 disposed on the first insulating pattern 131 not conformal to the first light emitting diode element LED1. In the present embodiment, the first insulating pattern 131 has an upper surface 131s facing away from the driving substrate DS, and the upper surface 131s of the first insulating pattern 131 is a substantially flat surface. The shape of the reflective pattern 151 disposed on the first insulating pattern 131 may be not limited to the shape of the first light emitting diode element LED1 by the thicker first insulating pattern 131. That is, the shape of the reflective pattern 151 can be designed according to practical requirements, so as to improve the optical performance of the display device 10C.

Another difference between the display device 10C of fig. 8 and the display device 10 of fig. 1F is that the first insulating pattern 131 of fig. 8 may not have the contact window 131a of the first insulating pattern 131 of fig. 1F. Referring to fig. 8, in the present embodiment, the first insulating pattern 131 may be disposed on a portion of the first connection element 121, the first light emitting diode element LED1 and the second connection element 122, and the first insulating pattern 131 may not overlap another portion of the second connection element 122 located on the second pad P2.

Fig. 9 is a schematic diagram of a display device 10C' according to an embodiment of the invention.

Referring to fig. 9, the display device 10C' of the present embodiment is similar to the display device 10C of fig. 8, and the following description refers to the foregoing description for the differences.

The display device 10C' of fig. 9 differs from the display device 10C of fig. 8 in that: in the embodiment of fig. 8, the third pad P3 is electrically connected to the first pad P1, and the first portion 151a of the reflective pattern 151 is electrically connected to the second electrode E2 of the first light emitting diode device LED1 and the second pad P2; that is, in the embodiment of fig. 8, the first portion 151a of the reflective pattern 151 can be regarded as a Cathode (Cathode) on the pixel region R; in the embodiment of fig. 9, the third pad P3 is electrically connected to the second pad P2, and the first portion 151a of the reflective pattern 151 is electrically connected to the first electrode E1 of the first light emitting diode device LED1 and the first pad P1; that is, in the embodiment of fig. 9, the first portion 151a of the reflective pattern 151 can be regarded as an Anode (Anode) on the pixel region R.

Fig. 10A to 10E are schematic side and perspective views illustrating a manufacturing process of the display device 10D according to an embodiment of the invention.

The manufacturing flow and the configuration of the display device 10D of fig. 10A to 10E are similar to those of the display device 10 of fig. 1A to 1F, and the difference between them is that: the repair method of the display device 10D is slightly different from that of the display device 10, and the difference in repair method also causes the structure of the display device 10D to be slightly different from that of the display device 10.

The following describes the manufacturing flow and the configuration of the display device 10D of the present embodiment in conjunction with fig. 10A to 10E, which are different from those of the display device 10D of the foregoing embodiment.

Referring to fig. 10A, first, a driving substrate DS is provided. Referring to fig. 10B, next, the plurality of first light emitting diode elements LED1 are transposed on the plurality of first sub-areas R1 of the plurality of pixel areas R of the driving substrate DS 2. Referring to fig. 1B, a plurality of first connection elements 121 and a plurality of second connection elements 122 are formed, so that a plurality of first light emitting diode elements LED1 are electrically connected to a plurality of first pads P1 and a plurality of second pads P2 of the plurality of pixel regions R, respectively.

Referring to fig. 10C, an insulating layer 130 is formed. Unlike the display device 10, in the present embodiment, the insulating layer 130 includes a plurality of second insulating patterns 132 disposed on a plurality of second sub-regions R2 of the plurality of pixel regions R in addition to a plurality of first insulating patterns 131 disposed on a plurality of first sub-regions R1 of the plurality of pixel regions R, respectively. The first insulating pattern 131 and the second insulating pattern 132 belong to the same insulating layer 130, and the material of the second insulating pattern 132 is the same as that of the first insulating pattern 131.

Referring to fig. 10C, next, whether the plurality of first light emitting diode elements LED1 can be driven by the driving substrate DS to emit light normally is detected. If it is found that a first Light Emitting Diode (LED) 1 of a pixel region R cannot be driven by the driving substrate DS to normally emit light, a repairing operation is performed on the second sub-region R2 of the pixel region R.

Referring to fig. 10C and 10D, unlike the display device 10, in the present embodiment, a second light emitting diode element LED2 is disposed on the second insulating pattern 132 of the pixel region R to be repaired. That is, in the present embodiment, the second insulating pattern 132 of the insulating layer 130 is used as an adhesive pattern for fixing the second light emitting diode element LED 2.

Referring to fig. 10E, a reflective layer 150 is formed on the insulating layer 130. Finally, a planarization layer 160 is formed on the reflective layer 150. In this way, the display device 10D of the present embodiment is completed.

The display device 10D of fig. 10E differs from the display device 10 of fig. 1F in configuration in that: in the embodiment of fig. 10E, the display device 10D does not include the second adhesive pattern 142 of the display device 10 of fig. 1F, but replaces the second adhesive pattern 142 of the display device 10 of fig. 1F with the second insulating pattern 132 of the insulating layer 130.

Referring to fig. 10E, in the repaired pixel region R (e.g., a pixel region R on the left side of fig. 10E), the second light emitting diode element LED2 is disposed on the second insulating pattern 132, the second light emitting diode element LED2 has a first electrode E1 and a second electrode E2, one of the first electrode E1 and the second electrode E2 (e.g., but not limited to, the second electrode E2) of the second light emitting diode element LED2 is disposed on the connection region R of the driving substrate DS, and the first portion 151a of the reflective pattern 151 is electrically connected to the one of the first electrode E1 and the second electrode E2 (e.g., but not limited to, the second electrode E2) of the second light emitting diode element LED 2.

In the present embodiment, the distance D2 between the second light emitting diode element LED2 and the base 110 of the driving substrate DS is greater than the distance D1 between the first light emitting diode element LED1 and the driving substrate DS, and the distance D2 between the second portion 151b of the reflective pattern 151 on one of the first electrode E1 and the second electrode E2 (e.g., the first electrode E1) of the second light emitting diode element LED2 and the base 110 of the driving substrate DS is smaller than the distance D1 between the first portion 151a of the reflective pattern 151 on the upper surface 131s of the first insulating pattern 131 and the base 110 of the driving substrate DS, wherein the upper surface 131s of the first insulating pattern 131 faces away from the base 110 of the driving substrate DS.

In short, in the present embodiment, the position of the second light emitting diode element LED2 is higher than the position of the first light emitting diode element LED1, but the package height of the second light emitting diode element LED2 is smaller than the package height of the first light emitting diode element LED 1.

Referring to fig. 10E, in the pixel region R that is not repaired (e.g., a pixel region R on the right side of fig. 10E), the second insulating pattern 132 is disposed on the driving substrate DS, the second insulating pattern 132 has a first end 132a and a second end 132b opposite to each other, the first end 132a of the second insulating pattern 132 is disposed on the connection region R of the driving substrate DS, the first portion 151a of the reflective pattern 151 is disposed on the first end 132a of the second insulating pattern 132, and the second portion 151b of the reflective pattern 151 is disposed on the second end 132b of the second insulating pattern 132.

Referring to fig. 10E, in each pixel region R, the first connecting element 121 and the second connecting element 122 have a first gap G1 on the first light emitting diode element LED1, the first portion 151a of the reflective pattern 151 and the second portion 151b of the reflective pattern 151 have a second gap G2 on the connecting region R, and the first gap G1 and the second gap G2 have a first width W1 and a second width W2 in the same direction k, respectively; the second width W2 is smaller than the first width W1 in either the unrepaired pixel region R or the repaired pixel region R. For example, in the present embodiment, W1++x) μm, W2++2μm, where x >0 μm, but the invention is not limited thereto.

In the repaired pixel region R, the first portion 151a of the reflective pattern 151 and the second portion 151b of the reflective pattern 151 cannot be connected to each other but can be as close as possible, so as to reduce a loss caused by light beams (not shown) emitted from the second light emitting diode element LED2 exiting from the second gap G2.

In the present embodiment, the first light emitting diode element LED1 has an upper surface LED1s facing away from the driving substrate DS, a region LED1sa of the upper surface LED1s is located between the first connecting element 121 and the second connecting element 122, and the reflective pattern 151 overlaps the region LED1sa of the upper surface LED1s of the first light emitting diode element LED1 except for overlapping the first connecting element 121 and the second connecting element 122; the second light emitting diode element LED2 has an upper surface LED2s facing away from the driving substrate DS, and a region LED2sa of the upper surface LED2s is located between the first electrode E1 and the second electrode E2, and the opening 151c of the reflective pattern 151 overlaps the region LED2sa of the upper surface LED2s of the second light emitting diode element LED 2.

In short, in the present embodiment, the reflective layer 150 completely covers the first light emitting diode element LED1, but the reflective layer 150 does not completely cover the second light emitting diode element LED2, and the reflective effect of the reflective layer 150 on the second light emitting diode element LED2 is lower than the reflective effect of the reflective layer 150 on the first light emitting diode element LED 1.

However, in order to make the optical performance of the second sub-region R2 of the repaired pixel region R close to or equal to the optical performance of the first sub-region R1 of the non-repaired pixel region R, in an embodiment, the light emitting efficiency of the second light emitting diode element LED2 located on the second sub-region R2 of the repaired pixel region R may be made higher than the light emitting efficiency of the first light emitting diode element LED1 located on the first sub-region R1 of the non-repaired pixel region R.

However, the present invention is not limited thereto, and in other embodiments, other methods or a combination of the above methods and other methods may be used to make the optical performance of the second sub-region R2 of the repaired pixel region R approximate to or equal to the optical performance of the first sub-region R1 of the non-repaired pixel region R. For example, in one embodiment, a film thickness t2 of the reflective pattern 151 may be greater than a film thickness t1 of at least one of the first connection element 121 and the second connection element 122; therefore, the resistance of the conductive element (i.e. the reflective pattern 151) between the second light emitting diode element LED2 and the driving substrate DS in the repaired pixel region R is smaller than the resistance of the conductive element (i.e. the first connecting element 121 and the second connecting element 122) between the first light emitting diode element LED1 and the driving substrate DS in the non-repaired pixel region R; in this way, when the driving signal of the pixel driving circuit SPC of the repaired pixel region R is the same as the driving signal of the pixel driving circuit SPC of the non-repaired pixel region R, the light emitting brightness of the second light emitting diode element LED2 on the repaired pixel region R is greater than the light emitting brightness of the first light emitting diode element LED1 on the non-repaired pixel region R, so that the optical performance of the second sub-region R2 of the repaired pixel region R is close to or equal to the optical performance of the first sub-region R1 of the non-repaired pixel region R.

In addition, in one embodiment, the refractive index of the second insulating pattern 132 may be between the refractive index of a portion of the second light emitting diode element LED2 (e.g., a semiconductor layer of the second light emitting diode element LED2 near the second insulating pattern 132) and the refractive index of a portion of the driving substrate DS (e.g., a dielectric layer 170 between the third pad P3 and the pixel driving circuit SPC). Thereby, the light extraction (light extraction) efficiency of the second light emitting diode element LED2 on the second sub-region R2 of the repaired pixel region R can be improved.

Fig. 11 is a schematic top view and a perspective view of a display device 10E according to an embodiment of the invention.

The display device 10E of fig. 11 is similar to the display device 10 of fig. 1F and 2, and the differences are the same or similar, and are not repeated herein with reference to the previous description.

Referring to fig. 1F, 2 and 11, the connection line C is electrically connected to one of the first pad P1 and the second pad P2 (e.g., but not limited to, the first pad P1) and the third pad P3.

In the embodiment of fig. 1F and 2, the connection line C, the first pad P1, the second pad P2, and the third pad P3 are not coplanar. The film layer to which the connection line C belongs is different from the film layers to which the first to third pads P1 to P3 belong.

In the embodiment of fig. 11, the connection lines C', the first pad P1, the second pad P2, and the third pad P3 may be coplanar; the connecting line C', the first pad P1, the second pad P2, and the third pad P3 may belong to the same layer.

In the embodiment of fig. 11, the reflective pattern 151 is overlapped with the connection line C 'of the driving substrate DS, and the first insulating pattern 131 is disposed on the connection line C'. That is, when the connection line C ' is disposed on the surface of the driving substrate DS, the first insulation pattern 131 may be disposed on the overlapping portion of the connection line C ' and the reflective pattern 151 to avoid the connection line C ' from being shorted with the reflective pattern 151. However, the present invention is not limited thereto, and in other embodiments, other members may be used as the insulating pattern between the connection line C' and the reflective pattern 151, as will be illustrated below with reference to fig. 12.

Fig. 12 is a schematic top view and a perspective view of a display device 10F according to an embodiment of the invention.

The display device 10F of fig. 12 is similar to the display device 10 of fig. 1F and 2, and the following description is omitted for brevity.

Referring to fig. 12, the display device 10F further includes a first adhesive pattern 141 disposed on the driving substrate DS, wherein the first light emitting diode element LED1 is disposed on the first adhesive pattern 141. The driving substrate DS further has a connection line C ', the connection line C' is electrically connected to one of the first pad P1 and the second pad P2 and the third pad P3, the reflective pattern 151 is overlapped with the connection line C 'of the driving substrate DS, and the first adhesive pattern 141 is disposed on the connection line C'.

When the connection line C ' is disposed on the surface of the driving substrate DS, the first adhesive pattern 141 under the first light emitting diode element LED1 may also be used as an insulating pattern between the connection line C ' and the reflective pattern 151 to avoid the connection line C ' from being shorted with the reflective pattern 151.

Claims

1. A display device, comprising:

the driving substrate is provided with a first connecting pad, a second connecting pad, a third connecting pad and a connecting area, wherein the first connecting pad is arranged opposite to the second connecting pad, the third connecting pad is arranged opposite to the connecting area, and the third connecting pad is electrically connected to one of the first connecting pad and the second connecting pad;

the first light-emitting diode element is arranged on the driving substrate and is provided with a first electrode and a second electrode;

the first connecting element is electrically connected to the first electrode of the first light-emitting diode element and the first connecting pad of the driving substrate, and the second connecting element is electrically connected to the second electrode of the first light-emitting diode element and the second connecting pad of the driving substrate;

a first insulating pattern disposed on the first led element, the first connection element and the second connection element, wherein one of the first connection element and the second connection element is electrically connected to the third pad; and

A reflective pattern disposed on the first insulating pattern, wherein the reflective pattern comprises:

a first portion electrically connected to the other of the first connection element and the second connection element and extending from above the first led element to the connection region of the driving substrate; and

a second portion electrically connected to the third pad of the driving substrate and structurally separated from the first portion of the reflective pattern.

2. The display device of claim 1, wherein the first portion of the reflective pattern has an opening, and the second portion of the reflective pattern is disposed in the opening of the first portion.

3. The display device of claim 1, wherein the driving substrate further has a connection line, the one of the first and second pads is electrically connected to the third pad through the connection line, the reflective pattern overlaps the connection line of the driving substrate, and the first insulating pattern is disposed on the connection line.

4. The display device of claim 1, further comprising:

a first adhesion pattern disposed on the driving substrate, wherein the first light emitting diode element is disposed on the first adhesion pattern;

The driving substrate is also provided with a connecting wire, one of the first connecting pad and the second connecting pad is electrically connected to the third connecting pad through the connecting wire, the reflecting pattern is overlapped with the connecting wire of the driving substrate, and the first adhesion pattern is arranged on the connecting wire.

5. The display device of claim 1, further comprising:

the second light-emitting diode element is arranged on the driving substrate, wherein the second light-emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light-emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflection pattern is electrically connected to the one of the first electrode and the second electrode of the second light-emitting diode element.

6. The display device of claim 5, wherein the second portion of the reflective pattern is electrically connected to the other of the first electrode and the second electrode of the second light emitting diode element and the third pad of the driving substrate.

7. The display device according to claim 5, wherein the second light emitting diode element has a higher luminous efficiency than the first light emitting diode element.

8. The display device of claim 1, further comprising:

the second insulation pattern is arranged on the driving substrate, wherein the second insulation pattern is provided with a first end and a second end which are opposite, the first end of the second insulation pattern is arranged on the connecting area of the driving substrate, the first part of the reflection pattern is arranged on the first end of the second insulation pattern, and the second part of the reflection pattern is arranged on the second end of the second insulation pattern.

9. The display device of claim 8, wherein the material of the second insulating pattern is the same as the material of the first insulating pattern.

10. The display device of claim 8, further comprising:

the second light-emitting diode element is arranged on the second insulating pattern, wherein the second light-emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light-emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light-emitting diode element.

11. The display device of claim 8, further comprising:

The second light-emitting diode element is arranged on the second insulating pattern, wherein the second light-emitting diode element is provided with a first electrode and a second electrode, one of the first electrode and the second electrode of the second light-emitting diode element is arranged on the connecting area of the driving substrate, and the first part of the reflecting pattern is electrically connected to the one of the first electrode and the second electrode of the second light-emitting diode element;

the second insulating pattern has a refractive index between a refractive index of a portion of the second light emitting diode element and a refractive index of a portion of the driving substrate.

12. The display device of claim 8, further comprising:

The distance between the second light emitting diode element and a base of the driving substrate is greater than that between the first light emitting diode element and the base of the driving substrate, and the distance between the second part of the reflective pattern on the other of the first electrode and the second electrode of the second light emitting diode element and the base of the driving substrate is smaller than that between the first part of the reflective pattern on the upper surface of the first insulating pattern and a base of the driving substrate, wherein the upper surface of the first insulating pattern faces away from the base of the driving substrate.

13. The display device of claim 1, wherein a film thickness of the reflective pattern is greater than a film thickness of at least one of the first connection element and the second connection element.

14. The display device of claim 1, wherein the first insulating pattern has an upper surface facing away from the driving substrate, and the upper surface of the first insulating pattern is a substantially flat surface.

15. The display device of claim 1, wherein the first connecting element and the second connecting element have a first gap on the first light emitting diode element, the first portion of the reflective pattern and the second portion of the reflective pattern have a second gap on the connecting region, the first gap and the second gap have a first width and a second width, respectively, in the same direction, and the second width is smaller than the first width.

16. The display device of claim 1, wherein the first light emitting diode element has an upper surface facing away from the driving substrate, a region of the upper surface is located between the first connection element and the second connection element, and the reflective pattern overlaps the region of the upper surface of the first light emitting diode element, the first connection element and the second connection element.

17. A display device, comprising:

a driving substrate having a first pad and a second pad;

a first insulating pattern disposed on the first LED element, the first connecting element and the second connecting element; and

The first light-emitting diode element is provided with an upper surface opposite to the driving substrate, a region of the upper surface is positioned between the first connecting element and the second connecting element, and the reflecting pattern is overlapped with the region of the upper surface of the first light-emitting diode element, the first connecting element and the second connecting element, the first electrode of the first light-emitting diode element and the second electrode of the first light-emitting diode element.