JP2003297514A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance a contact reliability of a contact by enabling a wiping operation with angles set at a contact part of a tip of the contact. <P>SOLUTION: The IC socket forming an electric connection with an IC package mounted is provided with a plurality of contacts of a pinching type formed from a pair of elastic contact pieces, of which, a contact part at the tip is set with angles to allow a wiping operation. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component socket for opening and closing a contact of a socket body and an external terminal of an IC package, and more particularly to an IC socket. The present invention relates to an IC socket applied so as to sandwich an external terminal for connection.

[0002]

2. Description of the Related Art Conventionally, an electronic component package as an electrical component, particularly an IC package or the like, is mounted on a socket body of an IC socket, and a moving plate having an inclined cam is laterally moved through the inclined cam by pressing an operating member. There is known an IC socket which moves in the direction and opens and closes the sandwiching contact to connect with the IC package.

In such a conventional IC socket, a sandwiching contact is formed by arranging a fixed elastic contact piece and a movable elastic contact piece so as to extend substantially parallel to each other, and the external contact of the IC package is sandwiched by such contact. Configured to connect with.

An example of such a conventional IC socket is shown in FIG. 4 and FIG.
The semi-spherical or spherical solder balls that are the external terminals of the C package are shown.

As shown in the figure, such an IC socket 100 in the related art is a type of IC socket having a plurality of contacts 103 of a sandwich type for mounting an IC package 110 to form an electrical connection. Shows only the tip of one contact 103. In such a conventional IC socket 100, the movable elastic contact piece 104 of the contact 103 is replaced by the grid-shaped moving member 1.
It is configured to be pressed and released by the pressing unit 102 of No. 01. The contact 103 is fixed to a fixed socket body so as to stand substantially parallel to the upper side, and the movable elastic contact piece 1 of the contact 103 is fixed by the pressing portion 102 of the grid-like moving member 101 that moves in the horizontal direction.
It is formed so that 04 is pushed and opened.

Therefore, such a conventional IC socket 1
In 00, when the operating member (not shown) descends, the grid-like moving plate 101 is laterally moved in one direction via an appropriate cam mechanism, whereby the pressing portion 102 of the moving plate 101 causes the contact 103 of the contact 103 to move. Movable elastic contact piece 10
4 is opened, the external terminal 111 of the IC package 110 can be stored, and the contact is opened. When the operating member rises, the movable plate 101 is laterally moved in the opposite direction, and the elastic force of the movable elastic contact piece 104 causes the movable elastic contact piece 104 and the fixed elastic contact piece 105 to move the external terminal 111 of the IC package 110. Sandwich and contact, IC
The package 110 is fitted.

As described above, in the conventional IC socket 100, the movable elastic contact piece 104 of the contact 103 is displaced in one direction against the elasticity so that the contact 103 comes into contact with the external terminal 111 of the IC package 110. An open state is formed, and the movable plate 101 is laterally moved in the other direction by the displacement of the movable elastic contact piece 104 in the other direction by the elastic restoring force of the movable elastic contact piece 104. The contact 103 is configured so that the contact 103 and the external terminal 111 of the IC package 110 are in contact with each other.

[0008]

However, such a conventional IC socket 100 is not suitable for the IC package 11.
There are often cases where sticking between the external terminal 111 and the contact portion of the contact 103 occurs due to high temperature contact between the external terminal 111 of 0 and the contact portion of the contact 103. At that time, the movable elastic contact piece 104 is fixed to the contact 10
3 may be peeled off by the pressing portion 102 of the moving plate 101 when opened. However, the fixed elastic contact piece 105 generally has to rely on the repulsive force due to the spring constant of the contact 103 itself, which is troublesome. If there is a clearance between the fixed elastic contact piece 105 and the wall of the socket body, the contact 10
The spring constant of 3 becomes low, the repulsive force becomes small, and it becomes difficult to peel off. If this repulsive force is less than the force of the external terminal 111 and the contact portion of the contact 103 being stuck together, the IC package 110 will not be peeled off even in the contact open state, and the IC package 110 will not be removed.
There is a possibility that it cannot be taken out from 0. For this reason, solder or the like is often transferred to the contact, and the tip of the contact is contaminated.

Therefore, an object of the present invention is to provide an IC socket in which, in order to solve such a problem in the related art, a self-cleaning effect of a contact contact portion is obtained by wiping and an increase in solder transfer is prevented. is there.

Another object of the present invention is to prevent contact sticking and increase contact reliability by allowing the contact portion at the tip of the contact to be angled for wiping operation. The purpose is to provide the IC socket.

[0011]

To achieve the above object, the IC socket of the present invention is formed from a pair of elastic contact pieces in an IC socket in which an IC package is mounted to form an electrical connection. It is characterized in that it has a plurality of contacts of a sandwiching type, and the contact portion at the tip of the contacts is provided at an angle to perform the wiping operation.

Further, the IC socket of the present invention is characterized in that the contact portion at the tip of the contact has a horizontal edge with an acute angle.

Furthermore, the IC socket of the present invention is characterized in that the contact portion at the tip of the contact wipes the surface of the external terminal of the IC package inward in the cutting line direction.

Furthermore, in the IC socket of the present invention, the contact is a ball grid type IC.
It is characterized in that the wiping operation is inward in the cutting line direction and the opening / closing operation is in the radial direction with respect to the external terminals of the package.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment) FIGS. 1 to 3 are views showing an embodiment of an IC socket of the present invention. FIG. 1 is a state in which one contact in the IC socket of the present invention is free and open. 2 is a schematic plan view of the central longitudinal section shown in FIG. 2, FIG. 2 is a plan partial view showing the tip end portion of the contact of FIG. 1 of the IC socket of the present invention, and the external terminal of the IC package, and FIG.
3 is a partial side cross-sectional view showing a tip portion of the contact and an external terminal of the IC package. FIG.

As shown in FIG. 1, the IC socket 1 of the present invention is an IC socket of a type having a plurality of interposing contacts 5 for mounting an IC package 10 to form an electrical connection. Has one contact 3
Only shown. Such an IC socket 1 of the present invention comprises a fixed socket body 2, a grid-like moving member 3 that moves in the horizontal direction, and a plurality of contacts 5 fixed to the socket body 2. .

As shown in the figure, in the IC socket 1 of the present invention, the socket main body 2 has a rectangular shape or a quadrangular shape, and a plurality of contacts 5 are inserted into the central portion from below to form a base end portion 8. The terminal pins projecting downward are fixed to an appropriate fixing member (not shown) such as a circuit board. Further, a grid-like moving member 3 is provided on the upper portion of the socket body 2 so as to be movable in the horizontal direction, and the movable portion 6 of the contact 5 is pressed by the pressing portion 4 by its lateral movement. The contact 5 is thereby opened.

Further, the socket body 2 is not limited to a rectangle or a quadrangle, but can be formed in any other similar or arbitrary shape.
It can be appropriately formed corresponding to the shape of 0.

In this embodiment, the ball grid type IC package 10 having the external terminals 11 made of hemispherical or spherical solder is used.
The IC package 10 has a ball grid
Of course, the type is not limited, and other similar IC packages such as pin grid type can be applied.

In such an IC socket of the present invention, the contact portion at the tip portion of the contact, which is a feature of the present invention, is clearly shown in FIGS. 2 and 3.

As shown in the figure, the contact 5 in the IC socket 1 of the present invention has a movable elastic contact piece 6 and a fixed elastic contact piece 7 formed of a pair of elastic contact pieces.
It is integrally fixed at the base end portion 8 of the contact 5, extends upward from the base end portion 8 substantially in parallel, and contact portions 9a and 9a are provided at the respective tip end portions 9 and 9, The IC package 10 is configured so as to sandwich and contact the hemispherical or spherical external terminal 11 with each other.

In particular, as clearly shown in FIG. 2, the distal end portions 9 and 9 of the movable elastic contact piece 6 and the fixed elastic contact piece 7 of the contact 5, respectively.
Is formed at an acute angle with respect to the external terminal 11 of the IC package 10 with respect to the cutting line direction, and is operated in the arrow direction in the figure when the contact 5 is closed. External terminal 1 of IC package 10
1 is wiped.

Therefore, when the contact 5 is opened,
When the tip ends 9, 9 of the movable elastic contact piece 6 and the fixed elastic contact piece 7 of the contact 5 are actuated in the diametrical direction with respect to the external terminal 11 of the IC package 10, the tip end portion 9, of the contact 5.
Since the angled contact portions 9a, 9a of 9 can be satisfactorily separated from the external terminal 11 of the IC package 10, the self-cleaning effect of the contact contact portion can be obtained by wiping, and the solder transfer to the contact is caused. Can prevent pollution. In addition, by doing so, the reliability is improved and the IC package 10 is sufficiently opened without sticking to the external terminals 11 which are the solder balls.

Furthermore, in such an IC socket 1 of the present invention, the IC package 10 is replaced with the IC socket 1
When taking out from the IC package 10, it is preferable to move the moving member 4 laterally to open the contact 3 and take out the IC package 10 by using vacuum or other appropriate means.
At this time, the IC package 10 may be taken out by the robot or other means, or manually, and pulled up.

Further, in the IC socket 1 of the present invention,
When mounting the IC package 10, the IC package 10 is mounted in the IC socket 1 with the contact 5 opened by the moving member 3 as described above.
When the moving member 4 is laterally moved in the direction opposite to the above, the movable elastic contact piece 6 and the fixed elastic contact piece 7 of the contact 5 return to the closing direction due to the elastic recovery force thereof. The external terminals 11 of the IC package 10 are sandwiched between the tips 9 of the contact piece 7 and come into contact with each other. In this case, the movable elastic contact piece 6 of the contact 5 and the tip end portions 9 of the fixed elastic contact piece 7 contact the external terminal 11 toward the center of the external terminal 11 of the IC package 10.
Since the movable elastic contact piece 6 of the contact 5 and the contact portions 9a, 9a of the tip portions 9, 9 of the fixed elastic contact piece 7 are angled, the movable elastic contact piece 6 and the fixed elastic contact piece 7 of the contact 5 are formed.
As shown in FIG. 2, the contact portions 9a, 9a of the tip portions 9, 9 of the external terminal 11 of the IC package 10 in the direction of the arrow
Since it is operated so as to wipe the surface of the contact 5, the tip portions 9 of the contact 5 are in good contact with the external terminal 11, are firmly connected, and the contact reliability is improved. It is needless to say that the wiping can obtain a self-cleaning effect on the contact portion of the contact and prevent contamination due to transfer of solder to the contact.

As described above, in the IC socket 1 of the present invention, the fixed socket body 2 and the grid-shaped moving member 3 are provided.
And a contact 5 including a movable elastic contact piece 6 formed of a pair of elastic contact pieces and a fixed elastic contact piece 7, and the contact 5 is integrally fixed to the socket body 2 at the base end portion 8. Further, the movable elastic contact piece 6 and the fixed elastic contact piece 7 of the contact 5 extend upwardly from the base end portion 8 substantially in parallel, and the tip end portions 9 and 9 have angled contact portions 9a. , 9a are provided, and the hemispherical or spherical external terminals 11 of the IC package 10 are sandwiched and contacted and connected.

Therefore, the movable elastic contact piece 6 of the contact 5 of the IC socket 1 according to the present invention can be opened and closed by the moving member 3 and the wiping operation.
And the external terminal 11 of the IC package 10 is the contact 5
The movable elastic contact piece 6 and the fixed elastic contact piece 7 are fitted so as to be sandwiched so as to be in good contact with each other, the opening and closing operation of the contact 3 can be performed easily and satisfactorily, and the contact 5 causes the contact 5 to be an IC package. 10 external terminals 11
It is well contacted and connected to, and the contact property is further improved. It is needless to say that the wiping can obtain a self-cleaning effect on the contact portion of the contact and prevent contamination due to transfer of solder to the contact.

In the IC socket to which the present invention having the above-mentioned structure is applied, the opening / closing operation of the contact can be facilitated by the moving member as the operating member, and
The contact can be satisfactorily wiped by simply making an angle at the contact portion at the tip of the contact, and the contact property is improved by the wiping operation between the external terminal of the IC package and the contact portion at the tip of the contact when the contact is closed. You can

Furthermore, in the IC socket of the present invention, the work of inserting the IC package into the IC socket can be suitably performed by an automatic machine such as a robot or manually, and the IC package is mounted on the IC socket. Work efficiency can be improved and improved.

[0031]

As described above, according to the first aspect of the present invention.
The described IC socket is an IC socket in which an IC package is mounted to form an electrical connection, and has a plurality of sandwich-type contacts formed of a pair of elastic contact pieces, and a contact portion at a tip of the contact is Since the wiping operation is performed with an angle, the self-cleaning effect of the contact portion of the contact is obtained by the wiping, and the solder transfer to the contact is prevented. Further, in the IC socket according to the first aspect of the present invention, it is possible to suitably perform the wiping operation by the contact portion at the tip of the angled contact to enhance the contact reliability of the contact.

The IC socket according to claim 2 of the present invention is
Since the horizontal edge of the contact portion at the tip of the contact forms an acute angle, the wiping operation can be suitably performed by a simple means of only making an angle at the contact portion at the tip of the contact. It is needless to say that the reliability of the contact at the time of contact can be improved, and the self-cleaning effect of the contact contact portion can be obtained by wiping to prevent the solder transfer to the contact.

The IC socket according to claim 3 of the present invention is
Since the contact portion at the tip of the contact wipes the surface of the external terminal of the IC package inward in the cutting line direction, the opening / closing operation and the wiping operation of the contact can be reliably performed, and the contact of the contact to the external terminal of the IC package can be ensured. Good detachment, suitable prevention of sticking due to high temperature contact, etc., and improved contact reliability, and wiping provides a self-cleaning effect on the contact area of the contact, preventing solder transfer to the contact. It goes without saying that it is one.

The IC socket according to claim 4 of the present invention is
The contact is the ball grid type I
With respect to the external terminal of the C package, the wiping operation is inward in the cutting line direction and the opening / closing operation is in the diametrical direction, so that the contact and separation can be performed well, and the reliability of the contact can be improved. It is needless to say that the self-cleaning effect of the contact portion of the contact is obtained by this, and the transfer of solder to the contact is prevented.

[Brief description of drawings]

FIG. 1 is a central vertical cross-sectional schematic view showing one contact in a free open state in one embodiment of an IC socket of the present invention.

FIG. 2 is a partial plan view showing a tip of a contact and a solder ball which is an external terminal of an IC package in the IC socket of the present invention shown in FIG.

FIG. 3 is a partial side sectional view showing a tip portion of the contact of FIG. 2 and an external terminal of an IC package.

FIG. 4 is a diagram showing the contact tip of a conventional IC socket and I.
It is a plane partial view showing an external terminal of a C package.

5 is a partial side cross-sectional view showing a tip portion of a contact and an external terminal of an IC package in the conventional IC socket of FIG.

[Explanation of symbols]

1 IC socket 2 socket body 3 moving members 4 Pressing part 5 contacts 6 Movable elastic contact piece 7 Moving elastic contact piece 8 base end 9 Tip 10 IC package 11 External terminal

Claims (4)

[Claims] 1. An IC socket, in which an IC package is mounted to form an electrical connection, has a plurality of interposing contacts formed of a pair of elastic contact pieces, and a contact portion at a tip of the contact has an angle. An IC socket characterized in that it is provided with and is operated by wiping. 2. The IC socket according to claim 1, wherein a horizontal edge of the contact portion at the tip of the contact forms an acute angle. 3. The contact portion at the tip of the contact is an IC
3. The IC socket according to claim 2, wherein the surface of the external terminal of the package is wiped inward in the cutting line direction. 4. The contact comprises a ball grid,
2. The IC socket according to claim 1, wherein the wiping operation is inward in the cutting line direction and the opening / closing operation is in the diametrical direction with respect to the external terminals of the IC package of the type.