JP3783302B2 - IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC socket used for mounting and inspection of an IC package, and in particular, an IC socket configured such that a lead of an IC package to be loaded is sandwiched from above and below and contact with a contact pin is performed on both upper and lower surfaces of the lead About.
[0002]
[Prior art]
FIG. 5 is a front view in which the right half of an example of this type of conventional IC socket is cut away. In the figure, reference numeral 1 denotes a rectangular planar shape having a large number of contact pin mounting holes 1b drilled at equal intervals along the side facing the guide groove 1a (perpendicular to the paper surface) on the opposite side wall outer surface. The socket body 2 has a base 2a press-fitted into the mounting hole 1b, and an upper contact piece 2b and an actuating piece 2c through a spring portion curved upward, and a lower contact piece 2d protruding upward separately from this. The contact pins 3 formed with connecting terminals 2e projecting further downward are mounted on the socket body 1 so as to be movable up and down by fitting the pillar portion 3a into the guide groove 1a. A frame-shaped cover whose outer shape having a cam surface 3b that engages with the piece 2c is the same as the outer shape of the socket body 1, and 4 is a coil spring that gives the cover 3 a rising habit. Note that the upper movement of the cover 3 is restricted to the position shown in the figure by a locking means (not shown), and the upper contact piece 2b and the operating piece 2c of the contact pin 2 are displaced inward by a curved spring portion. Is granted.
[0003]
This IC socket operates as follows. When the cover 3 is pushed in the direction of the arrow at the illustrated position, the cam surface 3b first comes into contact with the tip of the operating piece 2c to displace the contact pin 2 outwardly against its behavior, and the upper contact piece 2b is moved to the operating piece. It is moved to the position shown with a broken line together with 2c. Therefore, it is possible to load the IC package P at a predetermined position in the socket body 1, but the lower contact piece 2d does not move, so the lead R of the loaded IC package P is connected to the lower contact piece 2d. Placed on top.
[0004]
When the pressure on the cover 3 is released after the IC package P is loaded, the cover 3 is moved up by the elasticity of the coil spring 4 to reach the position shown in the figure. The lead R is pressed from above and squeezed between the lower contact piece 2d. In this case, since the upper contact piece 2b enters the lead R from obliquely above, it moves while rubbing the upper surface of the lead R to reach the illustrated position. This operation is so-called wiping, and is important for ensuring the stability of electrical contact between the contact pin 2 and the lead R.
[0005]
[Problems to be solved by the invention]
By the way, since the displacement amount of the contact pin 2 for performing the wiping is actually very small and the area to be wiped is small, the lead R and / or the tip of the upper contact piece 2b are deformed, and they happen to remain burrs in the portion, there is a problem that not mentioned wiping was intent not sufficiently effective.
[0006]
The present invention has been made in view of such problems of conventional IC sockets, and the object of the present invention is to achieve more stable electrical contact by performing the above wiping evenly. This kind of IC socket is intended to be provided.
[0007]
[Means for Solving the Problems]
To achieve the above object, according to the invention described in claim 1, IC socket, press down the socket body for loading the IC package having a lead, it is vertically movable mounted in said socket body a cover capable of loading the IC package in place in the socket body when it is, the upper contact piece and a lower surface in contact with the upper surface of the lead tip are columns set along opposite sides of the socket body In the IC socket having a plurality of conductive contact pins formed with a lower contact piece that contacts the lower contact piece , the cover includes a first cam surface for displacing the upper contact piece, and the lower contact piece A second cam surface for displacing the piece is formed, and the two cam surfaces are formed to have different shapes, so that the upper contact piece and the lower contact piece When down the cover, the by both cam surfaces are caused to displace outwardly respectively individually, when releasing the depression of the cover, is displaced inward in contact with the lead by its behavior, further said socket body When displacing while wiping inward, both the contact pieces can be individually displaced .
[0009]
Further, according to the invention described in claim 3, IC sockets, the sliding contact and the other end the lower contact piece on the second cam surface at one end have been pivoted to said socket body is formed on the cover further comprising a locking combined crimped operation member, the lower contact piece, it is characterized in that is adapted to be caused to displace through the operating member with the pressing and pressing release of the cover.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described based on illustrated examples. 1 and 2 show a first embodiment of the present invention. FIG. 1 is a cross-sectional view of an essential part showing a state in which an IC package is not loaded and a cover is released. FIG. 2 is a wiping of a contact pin. It is an enlarged partial sectional view showing operation clearly. In the figure, members and portions that are substantially the same as those described in the prior art are denoted by the same reference numerals.
[0011]
FIG. 1 shows a first embodiment of the present invention, in which a mechanism for displacing the lower contact piece 2f by using the cam surface 3c of the cover 3 for wiping is used.
In this embodiment, an arm 2 f ′ extending obliquely downward is formed on the lower contact piece 2 f, and the tip of the arm 2 f ′ is in contact with a cam surface 3 c formed on the cover 3. When the cover 3 is pushed down, the cam surface 3c pushes the lower contact piece 2f outward. When the cover 3 is released and the cover 3 is lifted, the cam surface 3c releases the lower contact piece 2f. The side contact piece 2f is formed so as to return to the illustrated position due to its habit. Therefore, when the IC package P is loaded at a predetermined position and the cover 3 is released, the upper contact piece 2b and the lower contact piece 2f are moved from the broken line position to the solid line position as indicated by arrows in FIG. As a result, the upper and lower surfaces of the lead R are wiped together. At this time, the upper contact piece 2b is first contacted first, and then the lower contact piece 2f is contacted with a timing shift.
[0012]
If comprised in this way, since the lower side contact piece 2f can be displaced independently from the motion of the upper side contact piece 2b, the displacement of the lower side contact piece 2f can be set by arbitrarily setting the inclination angle of the cam surface 3c. There is an advantage that the amount can be set to a desired displacement amount regardless of the displacement amount of the upper contact piece 2b.
[0013]
FIG. 3 shows a second embodiment of the present invention. This embodiment is different from FIG. 1 in the mechanism for pushing the lower contact piece 2f outward when the cover 3 is pushed down.
In this embodiment, an operating member 7 having a projection 7a that abuts on the tip of the arm 2f 'and an L-shaped arm 7b and rotatably supported by the socket body 1 is provided. The tip of the arm 7b is brought into contact with a cam surface 3d formed adjacent to the cam surface 3b. When the cover 3 is pushed down, the cam surface 3d rotates the operating member 7 clockwise to push the lower contact piece 2f outward, and when the cover is released and the cover 3 is raised, the lower contact piece It is formed so that it can be pushed counterclockwise by the restoring force due to the behavior of 2f and return to the illustrated position. In this case, although not shown in the figure, the left turnability may be imparted using a weak spring. Therefore, also in this embodiment, when the IC package P is loaded at a predetermined position and the pressing of the cover 3 is released, the contact portion 2b and the lower contact piece 2f are as shown by arrows in FIG. Displacement from the broken line position to the solid line position causes the upper and lower surfaces of the lead R to be wiped simultaneously. In this embodiment, since the lever ratio of the projection 7a with respect to the arm 7b of the operating member 7 can be increased, the outward displacement of the lower contact piece 2f can be reliably performed with a relatively light force. There are advantages.
[0014]
FIG. 4 shows a third embodiment in which the configuration of the operation member 7 is slightly different from the embodiment shown in FIG. That is, in this embodiment, a part of the lower contact piece 2f is formed in a fork shape, and the projection 7a of the operating member 7 is held by the fork portion and is stretched between the arm 7b and the socket body 1. 3 is different from the embodiment shown in FIG. 3 in that the operating member 7 is imparted with the left turnability by the spring 8 that has been made. However, the operational effect is the same as that of the embodiment shown in FIG.
In the above embodiments, the case where the contact pins 2 are arranged along two opposite sides of the socket body 1 has been described. However, in the present invention, the contact pins are arranged along the four sides of the socket body. Needless to say, it can also be applied.
[0015]
【The invention's effect】
As described above, according to the present invention, the upper and lower surfaces of each lead of the loaded IC package can be wiped reliably and effectively in response to the cover pressing release operation. This kind of IC socket with increased stability and extremely high quality can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an essential part showing a state where an IC package is not loaded and a cover is released from pressing in a first embodiment of the present invention.
FIG. 2 is an enlarged partial sectional view clearly showing a wiping operation in the first embodiment.
FIG. 3 is a cross-sectional view of a main part showing a state in which an IC package loading operation is finished in a second embodiment of the present invention.
FIG. 4 is a cross-sectional view of a main part showing a state where an IC package loading operation is finished in a third embodiment of the present invention.
FIG. 5 is a front view of an example of a conventional IC socket with the right half cut away.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Socket body 1a Guide groove 1b Contact pin mounting hole 2 Contact pin 2a Base part 2b Upper contact piece 2b 'Curved part 2c Actuation piece 2d Lower contact piece 2e Connection terminal 2f Lower contact piece 2f' Arm 3 Cover 3a Pillar part 3b Cam Surface 3c Cam surface 3d Cam surface 4 Coil spring 7 Operation member 7a Projection 7b L-shaped arm 8 Spring P IC package R Lead

Claims (2)

A socket body for loading an IC package having leads ;
A cover capable of loading the IC package in place in the socket body when depressed optionally be vertically movable mounted on the socket body,
A large number of conductive contacts, which are arranged along opposite sides of the socket body, and are formed with an upper contact piece that contacts the upper surface of the lead and a lower contact piece that contacts the lower surface at the tip. In an IC socket with pins ,
The cover is formed with a first cam surface that displaces the upper contact piece and a second cam surface that displaces the lower contact piece,
The cam surfaces are formed to have different shapes from each other,
Said upper contact piece and the lower contact piece when depressed the cover, displacement wherein the both cam surfaces are caused to displace outwardly respectively individually, when releasing the depression of the cover, inwardly by their habit And when it is displaced while contacting the lead and further wiping inward of the socket body,
An IC socket characterized in that both the contact pieces can be individually displaced . Further comprising an operation member to which the other end in sliding contact with the second cam surface at one end have been pivoted to said socket body is formed on the cover is crimped engagement fit with the lower contact piece,
IC socket according to claim 1, wherein the lower contact piece, characterized in that is adapted to be caused to displace through the operating member with the pressing and pressing release of the cover.

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