JP2003123925A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase a spring constant toward the inner side for increasing the resiliency of a fixed elastic contact piece, to apply a preload toward the outside, to form a fixed elastic contact piece contact part in an shape less sticky than a movable elastic contact piece contact part, and to facilitate and improve open-close operation of a contact. SOLUTION: This IC socket has pinching action contacts for forming the electric connection by inserting an IC package, and has a vertically movable operation member having a cam mechanism, a guide member horizontally moving by the cam mechanism of the operation member, the contacts having the fixed elastic contact pieces and movable elastic contact pieces, a socket body for fixing the contacts, and a moving member for open-close the contacts, and is characterized by increasing the spring constant of the fixed elastic contact piece of the contact toward the inner side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention opens and closes contacts of a socket body and external contacts of an IC package.
The present invention relates to a C socket, and more particularly to an IC socket in which a moving elastic contact piece and a fixed elastic contact piece of a contact are applied so as to sandwich and connect an external contact of an IC package.

[0002]

2. Description of the Related Art Conventionally, an IC package or the like as an electric component is mounted on a socket body of an IC socket, and a movable plate having an inclined cam is laterally moved through the inclined cam by pressing an operating member. Sockets are known.

[0003]

In such a conventional IC socket, when the operating plate descends, the movable plate is laterally moved in one direction via an appropriate cam mechanism so as to be provided on the movable plate. The moving elastic contact piece is opened by the pressing portion, the external contact of the IC package can be stored, and the contact is opened. Further, when the operating member rises, the moving plate laterally moves in the other direction due to the recovery force of the moving elastic contact piece, and the moving elastic contact piece and the fixed elastic contact piece sandwich the external contact of the IC package and make contact with each other. The mated state is achieved.

As described above, in the conventional IC socket, the moving elastic contact piece of the contact of the socket body is displaced in one direction against the elasticity to form a contact release state between the contact and the external contact. The moving plate is moved in the other direction by the displacement in the other direction due to the restoring force of the moving elastic contact piece, and the moving elastic contact piece is brought into contact with the side surface of the external contact to form a contact state between the contact and the external contact. The contacts are configured.

However, in such an IC socket, there are cases in which sticking between the external contact and the contact contact portion occurs due to high temperature contact between the external contact and the contact contact portion. At that time, the movable elastic contact piece may be peeled off by the pressing portion of the movable plate and the guide member when the contact is opened. However, the fixed elastic contact piece generally has to rely on the repulsive force due to the spring constant of the contact itself, which is troublesome. In addition, if there is a clearance between the fixed elastic contact piece and the wall of the socket body, the spring constant becomes low, the repulsive force becomes small, and peeling becomes difficult. If this repulsive force is less than the force with which the external contact and the contact contact portion are stuck together, there is a possibility that the IC package cannot be taken out from the socket without being peeled off even in the contact open state.

Therefore, an object of the present invention is to increase the spring constant inward or to preload outward in order to increase the repulsive force of the fixed elastic contact piece in order to solve the problems in the prior art. Another object of the present invention is to provide an IC socket in which the fixed elastic contact piece contact portion is formed in a shape that is more difficult to stick than the movable elastic contact piece contact portion, and the opening and closing operation of the contact can be performed easily and satisfactorily. .

[0007]

In order to achieve the above-mentioned object, an IC socket of the present invention is an IC socket having a pinch contact for inserting an IC package to form an electrical connection. A movable operating member, a guide member laterally moved by a cam mechanism of the operating member, a contact having a fixed elastic contact piece and a moving elastic contact piece, and a socket body in which the contact is fixedly mounted.
A moving member for opening and closing the contact, and increasing a spring constant of the contact toward the inside of the fixed elastic contact piece.

The IC socket of the present invention is characterized in that a dowel is provided inside the fixed elastic contact piece.

Further, the IC socket of the present invention is characterized in that a mold projection is provided inside the fixed elastic contact piece.

Furthermore, the IC socket of the present invention is characterized in that the mold portion inside the fixed elastic contact piece is raised.

The IC socket of the present invention is characterized in that a bent portion is provided inside the fixed elastic contact piece.

The IC socket of the present invention is characterized in that a long dowel is provided inside the fixed elastic contact piece.

Further, the IC socket of the present invention is an IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a cam mechanism of the operation member. A contact member having a fixed elastic contact piece and a movable elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact. It is characterized in that a preload is applied to the outside of the elastic contact piece.

Furthermore, the IC socket of the present invention is characterized in that the fixed elastic contact piece is inclined outward to apply a preload to the outside.

The IC socket of the present invention is characterized in that a bent portion is provided inside the fixed elastic contact piece to preload the fixed elastic contact piece and at the same time, the spring constant is increased.

Further, the IC socket of the present invention is an IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a cam mechanism of the operation member. A contact member having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact. The elastic contact piece is provided in a contact shape in which an external contact of the IC package is easily attached, and the fixed elastic contact piece is provided in a shape less likely to be attached than the movable elastic contact piece.

Further, the IC socket of the present invention is characterized in that the fixed elastic contact piece and the movable elastic contact piece have different tip angles.

Furthermore, the IC socket of the present invention is characterized in that the fixed elastic contact piece and the movable elastic contact piece have different tip lengths.

The IC socket of the present invention is characterized in that the number of taper tips of the fixed elastic contact piece and the movable elastic contact piece is changed.

Further, the IC socket of the present invention is characterized in that the angles of the tip end side surfaces of the fixed elastic contact piece and the movable elastic contact piece are changed.

Furthermore, the IC socket of the present invention is characterized in that the number of surfaces of the tips of the fixed elastic contact piece and the movable elastic contact piece that bite into the external contact of the IC package is changed.

Furthermore, the IC socket of the present invention is characterized in that various different undercuts are provided at the tip contact portions of the fixed elastic contact piece and the movable elastic contact piece, respectively.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIGS. 1 to 8 are a schematic vertical sectional view showing a central part of an IC socket according to a first embodiment of the present invention and a partial sectional view of a contact. FIG. Fig. 2 is a diagram when the contact is open, Fig. 3 is a diagram when the IC package is mated, Fig. 4 is a vertical sectional view of the IC socket in the contact open state, and Fig. 5 is an open state. FIG. 6 is an enlarged partial view of one contact portion in FIG. 6, FIG. 6 is a similar enlarged partial view in the fitted state of the IC package, and FIGS. 7 and 8 are enlarged partial views in the contact open state.

As shown in FIG. 1, the IC socket 1 of the present invention is of a type I having a sandwich type contact 5 for mounting an IC package 10 to form an electrical connection.
The C socket 1. Such an IC socket 1 of the present invention has a fixed socket body 2, an operation member 3 which is vertically movable with respect to the fixed socket body 2 and has a cam mechanism (not shown), and the operation member 3. Guide member 4 which is moved in the lateral direction by the cam mechanism, and a plurality of contacts 5 having fixed elastic contact pieces 6 and movable elastic contact pieces 7.
And a moving member 8 for opening and closing the fixed elastic contact piece 6 of the contact 5 and the moving elastic contact piece 7, and further increasing the spring constant of the contact 5 toward the inside of the fixed elastic contact piece 6. The repulsive force of the fixed elastic contact piece 6 is increased.

As shown in the figure, in the IC socket 1 of the present invention, the socket body 2 has a substantially quadrangular shape, and a plurality of contacts 5 are fixedly provided in the central portion thereof. It is fixed to the fixed member. Further, a movable plate 8 is accommodated in the upper portion of the socket body 2 so as to be movable in the lateral direction, and a guide member 4 is similarly provided on the movable plate 8 so as to be movable in the lateral direction. The member 3 is arranged so as to be vertically movable. It should be noted that the socket body 2 is not limited to a quadrangle, but can be configured to have another shape such as a rectangle.
It can be appropriately formed corresponding to the shape of the C package 10.

Further, the operating member 3 is formed in a substantially quadrangular frame shape or a tubular shape, and is provided so as to be movable in the vertical direction, and via an appropriate cam mechanism such as an inclined cam or an uneven cam. The guide member 4 is formed so as to move laterally.

The guide member 4 is in the shape of a substantially quadrangular container, and an IC package mounting portion 12 having a shape corresponding to the shape of the IC package 10 is provided on the inside thereof. An opening 14 is provided directly below 12 and is formed so that the external contact 11 of the IC package 10 mounted in the IC package mounting portion 12 and the upper end contact portion of the contact 5 are positioned. A protrusion 15 that engages with the socket body 2 and a protrusion 16 that engages with the moving plate 8. The protrusion 15 acts as a stopper for the socket body 2, and the protrusion 16 moves further. It is formed so as to act as an actuating member that comes into contact with and presses against 8.

The contact 5 is fixed to the socket main body 2, and a pair of fixed elastic contact pieces 6 and moving elastic contact pieces 7 are provided on the fixed upper contact portion, and the contact plate 5 has a movable plate 8. The lattice-shaped pressing portion 9 formed on the upper portion is arranged so as to be sandwiched between the fixed elastic contact piece 6 and the moving elastic contact piece 7. Therefore, when the moving plate 8 moves in the lateral direction, the pressing portion 9
The moving elastic contact piece 7 is moved so as to move away from or come close to the fixed elastic contact piece 6 of the contact 5, and the external contact 11 of the IC package 10 is fitted between the fixed elastic contact piece 6 and the moving elastic contact piece 7. It is formed so as to be sandwiched so as to be in contact with each other and can be brought into contact. In particular, in this embodiment, in order to increase the repulsive force of the fixed elastic contact piece 6, it is preferable that the fixed elastic contact piece 6 is made to have a high spring constant inward.

In FIG. 1, the IC socket 1 is in a free state, and the fixed elastic contact piece 6 and the movable elastic contact piece 7 of the contact 5 are in a free closed state.

Further, in this embodiment, a ball grid type IC package is used as the IC package 10 and has a hemispherical or ball-shaped external contact 11. External contact 1
1 is sandwiched between the fixed elastic contact piece 6 and the moving elastic contact piece 7 of the contact 5 so as to be in contact with each other.

In the IC socket 1 of the present invention thus constructed, in the free state shown in FIG. 1, the movable plate 8, the contact 5, the guide member 4, the operating member 3, etc. are free on the socket body 2. The fixed elastic contact piece 6 and the movable elastic contact piece 7 of the contact 5 are located in a closed state. From such a free state, I
When the operating member 3 of the C socket 1 is pressed and lowered, the movable plate 8 is laterally moved by the guide member 4 via an appropriate cam mechanism, and the moving elastic contact piece 7 of the contact 5 is pressed by the pressing portion 9 of the movable plate 8. Is pushed open, and the contact open state (full stroke state of the operating member 3) of FIG. 2 is reached in which the external contact 11 of the IC package 10 can be fitted.

In the contact open state of FIG. 2 (full stroke state of the operating member), when the IC package 10 is mounted on the IC package mounting portion 12 of the guide member 4 and the operating member 3 is raised, the contact 5 moves. The movable plate 8 is laterally moved in the other direction by the elastic recovery force of the elastic contact piece 7, and the moving elastic contact piece 7 of the contact 5 and the fixed elastic contact piece 6 sandwich the external contact 11 of the IC package 10 and contact each other. The IC package 3 is in a fitted state. At this time, the center of the IC package 10 is displaced from the center at the time of opening in FIG. 2 and the center deviation of the IC package 10 occurs, so that the guide member 4 becomes free with respect to the moving plate 8 and the socket body 2. , IC package 10
The center deviation is absorbed and the operating member 3 is actuated to position the IC package 10 near the center by the guide member 4, resulting in a contact open state as shown in FIG. Positioned in the center. It should be noted that the contact open state and the IC package mating state are as shown in FIGS.
, Partially enlarged and shown in detail.

Further, in the IC socket 1 of the present invention, in the above-mentioned contact open state, as shown in FIG. 7, the moving elastic contact piece 7 of the contact 5 has the pressing portion 9 of the moving plate 8.
Even if the moving elastic contact piece 7 of the contact 5 is stuck to the external contact 11 of the IC package 10, it has a peeling effect such as being suitably peeled from the external contact 11. Further, in the IC socket 1 according to the present invention, the fixed elastic contact piece 6 of the contact 5 is
Since the inward spring constant is high and the repulsive force of the fixed elastic contact piece 6 is large, even if the fixed elastic contact piece 6 is stuck to the external contact 11 as shown in FIG. It has a peeling effect such that it is peeled off from the external contact 11 favorably.

Furthermore, in such an IC socket 1 of the present invention, the IC package 10 is replaced by the IC socket 1
When taking out from the IC package, it is preferable to lower the operation plate 3 again and take out the IC package 10 by using a vacuum or the like. At this time, since the IC package 10 is positioned near the contact open center by the guide member 4 or the like, when the IC package 10 is inserted into the guide member 4, the IC package 10 is removed by a robot, other means, or manually. When it is taken out and pulled up, as shown in FIG. 2, the elastic force of the moving elastic contact pieces 7 of the many contacts 5 causes the lattice-shaped pressing portion 9 of the moving plate 8 to move.
Since the movable plate 8 is moved by pressing it to the right in the figure via the, the IC socket 1 with the contact 5 closed can be brought into a free state (FIG. 1).

As described above, in the IC socket of the present invention, the fixed socket body 2, the vertically movable operation member 3 having the cam mechanism, and the guide member 4 laterally moved by the cam mechanism of the operation member 3. A contact 5 having a fixed elastic contact piece 6 and a moving elastic contact piece 7, and a moving member 7 for opening and closing the contact 5, and increasing the spring constant of the contact 5 to the inside of the fixed elastic contact piece 6. The repulsive force of the fixed elastic contact piece 6 can be increased, and the external contact 11 of the IC package 10 is fitted so as to be sandwiched between the fixed elastic contact piece 6 and the moving elastic contact piece 7 of each contact 5. Good contact, and the opening / closing operation of the contact 5 can be easily and favorably performed.

In the IC socket to which the present invention having the above-mentioned structure is applied, the contacts can be easily opened and closed, the contacts can be satisfactorily contacted with each other, and high temperature contact between the external contact of the IC package and the contact contact portion causes the contact. The occurrence of sticking can be prevented, and the pressing portion of the moving plate and the guide member at the time of contact opening can be peeled off to facilitate the removal of the IC package.

As described above, in the IC socket of the present invention, the work of inserting the IC package into the IC socket can be suitably performed by an automatic machine such as a robot or manually, and the IC package is mounted on the IC socket. Work efficiency can be improved and improved.

(Embodiment 2) As described above, I of the present invention
In the first embodiment of the C socket, the spring constant of the contact 5 toward the inside of the fixed elastic contact piece 6 is increased to increase the repulsive force. The same effect is obtained by providing the dowels 20 such as the parts and the projections.

That is, as shown in FIG. 9, in the IC socket of the present invention, the dowel 2 is provided inside the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2.
0 is provided. Such a dowel 20 in the second embodiment is provided in the middle of the fixed elastic contact piece 6 of the contact 5 as shown in the drawing, whereby the fixed elastic contact piece 6 is provided.
Since the repulsive force of the fixed elastic contact piece 6 itself can be increased by increasing the spring constant inward of the IC, it is possible to favorably prevent the fixed elastic contact piece 6 from sticking to the external contact of the IC package. Is similarly obtained.

(Embodiment 3) As shown in FIG. 10, in the IC socket of the present invention, the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2 is molded with respect to the middle inner surface thereof. A protrusion 25 is provided. The mold protrusion 25 according to the third embodiment of the present invention is provided so as to abut and press the inner middle of the fixed elastic contact piece 6 of the contact 5 as shown in the figure, whereby the fixed elastic contact piece 6 is pressed. Since the spring constant to the inside of the contact piece 6 can be increased to increase the repulsive force in the fixed elastic contact piece 6 itself, therefore, the fixed elastic contact piece 6 is attached to the external contact of the IC package by high temperature contact or the like. The same effect can be obtained in that the above can be effectively prevented.

(Embodiment 4) As shown in FIG. 11, in the IC socket of the present invention, with respect to the inner surface of the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2,
A mold protrusion 30 is provided. The mold protrusion 30 of the third embodiment is provided so as to extend along the inner side surface of the fixed elastic contact piece 6 of the contact 5 as shown in the drawing so as to extend upward to the intermediate portion. By increasing the inward spring constant of the fixed elastic contact piece 6, the repulsive force in the fixed elastic contact piece 6 can be increased.
It is possible to effectively prevent the fixed elastic contact piece 6 from sticking to the external contact of the C package due to high temperature contact or the like.

(Embodiment 5) As shown in FIG. 12, in the IC socket of the present invention, a bent portion 35 is provided in the middle of the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2. Has been. Such a bent portion 35 in the fifth embodiment increases the spring constant of the fixed elastic contact piece 6 itself of the contact 5 toward the inside of the fixed elastic contact piece 6 to increase the repulsive force of the fixed elastic contact piece 6. Can
It is possible to prevent sticking of the fixed elastic contact piece 6 to the external contact of the IC package due to high temperature contact or the like.

(Embodiment 6) As shown in FIG. 13, in the IC socket of the present invention, a long dowel is provided from the middle to the upper side of the fixed elastic contact piece 6 of the contact 5 fixedly mounted on the socket body 2. 40 is provided. Such a long dowel 40 in the present embodiment is provided so as to extend upward to near the tip in the middle of the inside of the fixed elastic contact piece 6 of the contact 5, and thereby to the inside of the fixed elastic contact piece 6. Since the spring constant can be increased to increase the repulsive force in the fixed elastic contact piece 6 itself, it is possible to favorably prevent the fixed elastic contact piece 6 from sticking to the external contact of the IC package.

(Embodiment 7) As shown in FIG. 14, in the IC socket of the present invention, in this embodiment 7, the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2 is preloaded. The preload is applied to incline the fixed elastic contact piece 6 to the state shown by the dotted line in the figure, and is operated so as to be displaced outward from the mounting position by the displacement amount S. Is preferred.

As described above, in this embodiment, the fixed elastic contact piece 6 is preloaded outward so that the repulsive force of the fixed elastic contact piece 6 is increased, so that the IC package of Fixed elastic contact piece 6 for external contact
It is possible to obtain the effect of satisfactorily preventing sticking due to high temperature contact or the like.

(Embodiment 8) FIG. 15 shows I of the present invention.
8 shows an eighth embodiment of the C socket. In this embodiment, the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2 is preloaded, and the lower portion of the fixed elastic contact piece 6 is inside. The bent portion 45 is provided by being bent. The preload is applied so as to incline the fixed elastic contact piece 6 to the outside, and together with the outward bending by the bending portion 45 as shown by the dotted line in the figure, the total amount of displacement S to the outside of the mounting position is S. It is preferred that it is acted upon only by displacement.

As described above, in this embodiment, the fixed elastic contact piece 6 is preloaded outward and the bent portion 45 is provided so that the repulsive force of the fixed elastic contact piece 6 is increased. Therefore, it is possible to favorably prevent sticking of the fixed elastic contact piece 6 to the external contact of the IC package due to high temperature contact or the like.

(Embodiment 9) FIGS. 16 and 17 show Embodiment 9 of the IC socket according to the present invention. In this embodiment, the contact 5 fixed to the socket body 2 is fixed.
The fixed elastic contact piece 6 and the movable elastic contact piece 7 are provided with notches 50 and 51 at their tip ends. These notches 5
0 and 51 are notch angles A and B as shown in FIG.
As described above, the magnitudes of the angles are different from each other, so that the external contact 11 is provided in a contact shape that is easier to stick to the movable elastic contact piece 7 than the fixed elastic contact piece 6. 6 is provided in a contact shape that is less likely to stick than the movable elastic contact piece 7.

In this case, the relationship between the tip angle of the contact portion of the contact 5 and the sticking force is as follows. That is,
The force F1 acting on the external contact 11 by the contact 5,
F2 is F1 <F2, and when A> B, F1 = 2 · R1 · sin (A / 2) F2 = 2 · R2 · sin (B / 2). However, R1 = R2. In addition, the standard of the difference in the tip angle in this case is AB = 10 ° or more.

Therefore, the notches 50 and 51 having different angles are thus formed at the tip end in the fixed elastic contact piece 6 and the movable elastic contact piece 7.
By being provided in and, it is possible to favorably separate the IC package from the external contact 11, and it is possible to suitably prevent sticking due to high temperature contact or the like.

Further, with respect to the force P of the fixed elastic contact piece 6 being welded to the external contact 11, it is set so that the displacement amount δ required for the fixed elastic contact piece 6 to reach this welding force P is not less than δ. Is preferred.

(Embodiment 10) FIGS. 18 and 19 show Embodiment 10 of an IC socket according to the present invention. In this embodiment, a fixed elastic contact piece for the contact 5 fixedly mounted on the socket body 2 is used. 6 are formed so that the lengths A and B of the tip portions 55 and 56 provided at the tips of the movable elastic contact piece 7 and the movable elastic contact piece 7 are different from each other. That is, the tip portion 55 formed on the fixed elastic contact piece 6 has a length A, and the tip portion 56 formed on the moving elastic contact piece 7 has a length B, as shown in the figure. The length A of the tip 55 of 6 is shorter than the length B of the tip 56 of the movable elastic contact piece 7,
The lengths A and B of 5, 56 are different as shown in the figure, whereby the external contact 11 is provided in a contact shape that is easier to stick to the movable elastic contact piece 7 than the fixed elastic contact piece 6. Therefore, the fixed elastic contact piece 6 is provided with a contact shape that is more difficult to stick than the moving elastic contact piece 7. Therefore, the tip portions 5 having different lengths A and B are thus obtained.
By providing the fixed elastic contact piece 6 and the movable elastic contact piece 7 with 5, 56, the detachment of the IC package from the external contact 11 can be favorably performed, and sticking due to high temperature contact or the like can be preferably prevented.

(Embodiment 11) FIGS. 20 and 21 show Embodiment 11 of an IC socket according to the present invention. In this embodiment, a fixed elastic contact piece of a contact 5 fixed to a socket body 2 is provided. 6 and the movable elastic contact piece 7 are different in the number of taper portions 60 and 61 provided at the tips thereof. That is, the taper portion 6 formed on the fixed elastic contact piece 6
0 is two sets, and the taper portion 61 formed on the movable elastic contact piece 7 is one set.
The number of the taper portions 60 formed at the tip of the moving elastic contact piece 7 is different from the number of the taper portions 61 formed at the tip of the movable elastic contact piece 7, as shown in the figure. Therefore, such tapered portions 60, 6
Due to the difference in the number of 1
Is provided in a contact shape that is easier to stick than the fixed elastic contact piece 6, and is provided in a contact shape that is less likely to stick to the fixed elastic contact piece 6 than the moving elastic contact piece 7. Therefore, by providing the fixed elastic contact piece 6 and the movable elastic contact piece 7 in which the numbers of the taper portions 60 and 61 are different from each other in this manner, the detachment from the external contact 11 of the IC package is made good, and the sticking due to high temperature contact or the like is performed. Can be preferably prevented.

(Embodiment 12) FIGS. 22 and 23 show Embodiment 12 of the IC socket according to the present invention. In this embodiment, the fixed elastic contact piece 6 of the contact 5 fixed to the socket body 2 is fixed. And the tip 65 of the movable elastic contact piece 7,
Angles A and B between the upper surface and the lower surface of 66 are different from each other. That is, the tip 6 formed on the fixed elastic contact piece 6
The angle A in 5 is larger than the angle B of the tip portion 66 formed on the movable elastic contact piece 7, and the angles A and B are different from each other. Therefore, due to the difference in the angles A and B of the tip portions 65 and 66, the external contact 11 is provided in a contact shape that is more easily attached to the moving elastic contact piece 7 than the fixed elastic contact piece 6. The fixed elastic contact piece 6 is provided with a contact shape that is more difficult to stick than the movable elastic contact piece 7, and the tip end portions 65 and 66 move with the fixed elastic contact piece 6 having different angles A and B. By providing the elastic contact piece 7, it is possible to favorably separate the IC package from the external contact 11, and it is possible to preferably prevent sticking due to high temperature contact or the like.

(Embodiment 13) FIGS. 24 and 25 show Embodiment 13 of the IC socket according to the present invention. In this embodiment, a fixed elastic contact piece for the contact 5 fixed to the socket body 2 is provided. 6 and the movable elastic contact piece 7
The number of surfaces of 0 and 71 that bite into the external contact 11 is different. That is, the surface of the tip end portion 70 formed on the fixed elastic contact piece 6 is larger than the surface of the tip end portion 71 formed on the moving elastic contact piece 7, and the size of the surface in the height direction of both the tip end portions 70, 71. Are different. Therefore, due to the difference in the height direction of the surfaces of the tip portions 70 and 71, the external contact 11 is formed in a contact shape that is more easily attached to the moving elastic contact piece 7 than the fixed elastic contact piece 6. The fixed elastic contact piece 6 is formed in a contact shape that is more difficult to stick to the movable elastic contact piece 7 than the moving elastic contact piece 7, and the fixed elastic contact piece 6 is fixed so that the sizes of the surfaces of the tip portions 70 and 71 are different from each other. By providing the tip portions 70 and 71 of the elastic contact piece 6 and the movable elastic contact piece 7, separation of the IC package from the external contact 11 can be favorably performed, and sticking due to high temperature contact or the like can be preferably prevented.

(Embodiment 14) FIGS. 26 and 27 show Embodiment 14 of the IC socket according to the present invention. In this embodiment, the fixed elastic contact of the contact 5 fixed to the socket body 2 is fixed. The difference is that a notch 75 is provided at the tip of the piece 6 and an undercut portion 76 is provided at the tip of the movable elastic contact piece 7. That is, the notch 75 is provided at the tip of the fixed elastic contact piece 6, while the undercut portion 76 is provided at the tip of the moving elastic contact piece 7.
Are provided, and the shapes of the tips are different from each other. Therefore, due to the difference in shape between the notch 75 and the undercut portion 76 at the tip portion, the external contact 11 has a contact shape that is more easily attached to the moving elastic contact piece 7 than the fixed elastic contact piece 6. The fixed elastic contact piece 6 is formed in a contact shape that is less likely to stick to the movable elastic contact piece 7 than the movable elastic contact piece 7, and the shape of the notch 75 and the undercut portion 76 at the tip end portion is formed. By providing the tip portions of the fixed elastic contact piece 6 and the movable elastic contact piece 7 so that they are different from each other, the fixed elastic contact piece 6 and the movable elastic contact piece 7 can be favorably separated from the external contact 11 of the IC package. Adhesion due to high temperature contact or the like can be preferably prevented.

(Embodiment 15) FIGS. 28 and 29 show Embodiment 15 of the IC socket according to the present invention. In this embodiment, the fixed elastic contact of the contact 5 fixedly mounted on the socket body 2 is fixed. A notch 80 is provided at the tip of the piece 6, and an undercut portion 81 is provided at the tip of the movable elastic contact piece 7, so that the tip portions have different shapes. That is, the notch 80 is provided at the tip of the fixed elastic contact piece 6, while the undercut portion 81 is provided at the tip of the movable elastic contact piece 7, which is different from the above. Notch 80 in such a tip portion
Due to the difference in shape between the undercut portion 81 and the undercut portion 81, the external contact 11 is formed in a contact shape that is easier to stick to the moving elastic contact piece 7 than the fixed elastic contact piece 6, and Is formed in a contact shape that is less likely to stick than the movable elastic contact piece 7, and the fixed elastic contact piece is formed so that the notch 80 and the undercut portion 81 of the tip end portion having different shapes are formed. By providing the tip portions of the piece 6 and the movable elastic contact piece 7, separation of the IC package from the external contact 11 can be favorably performed, and sticking due to high temperature contact or the like can be preferably prevented.

(Embodiment 16) FIGS. 30 and 31 show Embodiment 16 of the IC socket according to the present invention. In this embodiment, the fixed elastic contact of the contact 5 fixedly mounted on the socket body 2 is fixed. The difference is that a notch 85 is provided at the tip of the piece 6 and an undercut portion 86 is provided at the tip of the movable elastic contact piece 7. That is, the notch 85 is provided at the tip of the fixed elastic contact piece 6, while the undercut portion 86 is provided at the tip of the moving elastic contact piece 7.
Is provided differently. Therefore, the notch 85 and the undercut portion 8 in such a tip portion are formed.
The external contact 11 is formed in a contact shape that is easier to stick to the movable elastic contact piece 7 than the fixed elastic contact piece 6 due to the formation of a shape different from that of the fixed elastic contact piece 6. The fixed elastic contact piece 6 and the movable elastic contact piece 6 are formed in a contact shape that is more difficult to stick than the movable elastic contact piece 7, and the notch 85 and the undercut portion 86 of the tip end portion are different in shape. By providing the tip part of 7,
It is possible to favorably separate the IC package from the external contact point 11 and suitably prevent sticking due to high temperature contact or the like.

[0060]

As described above, according to the first aspect of the present invention.
The described IC socket is an IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a guide which is laterally moved by the cam mechanism of the operation member. A member, a contact having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact, and the inside of the fixed elastic contact piece of the contact Since the spring constant of is increased, the repulsive force of the fixed elastic contact piece can be increased, and the external contact of the IC package can be fitted so as to be sandwiched between the movable elastic contact piece portions of the respective contacts to make good contact, The opening and closing operation of contacts can be performed easily and satisfactorily.

The IC socket according to claim 2 of the present invention is
Since the dowel is provided inside the fixed elastic contact piece, the spring constant inward can be increased and the repulsive force of the fixed elastic contact piece can be increased.

The IC socket according to claim 3 of the present invention is
Since the mold protrusion is provided inside the fixed elastic contact piece,
Similarly, the inward spring constant can be increased to increase the repulsive force of the fixed elastic contact piece.

The IC socket according to claim 4 of the present invention is
Since the mold part inside the fixed elastic contact piece is raised,
The inward spring constant can be increased to increase the repulsive force of the fixed elastic contact piece.

The IC socket according to claim 5 of the present invention is
Since the bent portion is provided inside the fixed elastic contact piece, the spring constant inward can be similarly increased to increase the repulsive force of the fixed elastic contact piece.

The IC socket according to claim 6 of the present invention is
Since the long dowel is provided inside the fixed elastic contact piece, the spring constant inward can be increased to similarly increase the repulsive force of the fixed elastic contact piece.

The IC socket according to claim 7 of the present invention is
In an IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, a vertically movable operating member having a cam mechanism, a guide member laterally moved by the cam mechanism of the operating member, and a fixed elastic contact. A contact having a piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact, and a preload is applied to the outside of the fixed elastic contact piece of the contact. The repulsive force of the elastic contact piece can be increased, and the external contact of the IC package is fitted so as to be sandwiched between the movable elastic contact piece portions of the contacts to make good contact, and the opening and closing operation of the contact can be easily and favorably performed. it can.

The IC socket according to claim 8 of the present invention is
Since the fixed elastic contact piece is inclined outward and a preload is applied to the outer side, the repulsive force of the fixed elastic contact piece can be increased, and the opening / closing operation of the contact can be easily and favorably performed.

The IC socket according to claim 9 of the present invention is
A bent portion is provided inside the fixed elastic contact piece, and a preload is applied to the outer side, and at the same time, the spring constant is increased, so that the repulsive force of the fixed elastic contact piece can be increased, and opening / closing operation of the contact is easy, and It can be done well.

An IC socket according to a tenth aspect of the present invention is an IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operating member having a cam mechanism, and the operating member. A guide member that is laterally moved by the cam mechanism, a contact having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member that opens and closes the contact, Replace the moving elastic contact piece of the contact with I
Since the external contact of the C package is provided in a contact shape that is easily attached and the fixed elastic contact piece is provided in a shape that is less likely to be attached than the moving elastic contact piece, the repulsive force of the fixed elastic contact piece can be increased, and the IC The external contacts of the package are fitted so as to be sandwiched between the movable elastic contact pieces of the respective contacts so that good contact can be made, and the opening / closing operation of the contacts can be performed easily and satisfactorily.

In the IC socket according to the eleventh aspect of the present invention, since the tip angles of the fixed elastic contact piece and the movable elastic contact piece are respectively changed, the detachment of the IC package from the external contact point is improved by the difference in the angle of the tip parts. Therefore, sticking due to high temperature contact or the like can be suitably prevented.

In the IC socket according to the twelfth aspect of the present invention, since the tip lengths of the fixed elastic contact piece and the movable elastic contact piece are changed respectively, the detachment of the IC package from the external contact is favorably performed, and the IC package is contacted at high temperature. Adhesion can be preferably prevented.

In the IC socket according to the thirteenth aspect of the present invention, the number of the tip taper of the fixed elastic contact piece and the movable elastic contact piece is changed, so that the IC package is favorably detached from the external contact and the sticking is prevented. can do.

In the IC socket according to the fourteenth aspect of the present invention, since the angles of the tip end side surfaces of the fixed elastic contact piece and the movable elastic contact piece are respectively changed, the detachment of the IC package from the external contact is favorably performed, and the attachment is preferable. Can be prevented.

According to a fifteenth aspect of the present invention, in the IC socket, the I of the fixed elastic contact piece and the movable elastic contact piece are provided.
Since the number of faces that bite into the external contact of the C package is changed, it is possible to favorably separate the IC package from the external contact and prevent sticking.

In the IC socket according to the sixteenth aspect of the present invention, since various different undercut portions are provided at the tip contact portions of the fixed elastic contact piece and the movable elastic contact piece, respectively, the notch and the undercut portion of the tip portion are provided. Since the shapes of and are different, separation of the IC package from the external contact can be favorably performed, and sticking due to high temperature contact or the like can be preferably prevented.

[Brief description of drawings]

FIG. 1 is a schematic vertical cross-sectional view showing a first embodiment of an IC socket according to the present invention in a free state.

FIG. 2 is a schematic vertical sectional view showing the IC socket of the present invention in FIG. 1 in a contact open state.

FIG. 3 is a central vertical cross-sectional schematic view showing the IC socket of the present invention in FIG. 1 in an IC package fitted state.

FIG. 4 is a central longitudinal sectional view of the IC socket of the present invention in a contact open state.

FIG. 5 is an enlarged partial view of one contact portion in the open state of the IC socket of the present invention.

FIG. 6 is a similar enlarged partial view of the IC socket of the present invention in a fitted state of an IC package.

FIG. 7 is an enlarged partial view of the contact open state, showing the moving elastic contact piece being peeled off.

FIG. 8 is an enlarged partial view of the contact open state, showing the fixed elastic contact piece being peeled off.

FIG. 9 is an enlarged partial view of a tip portion of a contact in the second embodiment of the IC socket of the present invention.

FIG. 10 is a similar enlarged partial view of the tip end portion of the contact in the third embodiment of the IC socket of the present invention.

FIG. 11 is an enlarged partial view of a tip portion of a contact in the fourth embodiment of the IC socket of the present invention.

FIG. 12 is a similar enlarged partial view of a tip end portion of a contact in Example 5 of the IC socket of the present invention.

FIG. 13 is an enlarged partial view of a tip end portion of a contact in Example 6 of the IC socket of the present invention.

FIG. 14 is a similar enlarged partial view of the tip end portion of the contact in the embodiment 7 of the IC socket of the present invention.

FIG. 15 is an enlarged partial view of a tip end portion of a contact in Example 8 of the IC socket of the present invention.

FIG. 16 is an enlarged partial plan view of a tip portion of a contact in Example 9 of the IC socket of the present invention.

FIG. 17 is an enlarged partial side view of the tip portion of the contact of FIG.

FIG. 18 is an enlarged partial plan view of the tip end portion of the contact in Example 10 of the IC socket of the present invention.

FIG. 19 is an enlarged partial side view of the tip portion of the contact of FIG.

FIG. 20 is an enlarged partial plan view of a tip portion of a contact in Example 11 of the IC socket of the present invention.

FIG. 21 is an enlarged partial side view of the tip portion of the contact of FIG. 20.

FIG. 22 is an enlarged partial plan view of a tip portion of a contact in Example 12 of the IC socket of the present invention.

FIG. 23 is an enlarged partial side view of the tip portion of the contact of FIG. 22.

FIG. 24 is an enlarged partial plan view of the tip portion of the contact in Example 13 of the IC socket of the present invention.

FIG. 25 is an enlarged partial side view of the tip portion of the contact of FIG. 24.

FIG. 26 is an enlarged partial plan view of the tip end portion of the contact in Embodiment 14 of the IC socket of the present invention.

27 is an enlarged partial side view of the tip portion of the contact shown in FIG. 26.

FIG. 28 is an enlarged partial plan view of the tip end portion of the contact in Embodiment 15 of the IC socket of the present invention.

FIG. 29 is an enlarged partial side view of the tip portion of the contact of FIG. 28.

FIG. 30 is an enlarged partial plan view of the tip of the contact in the sixteenth embodiment of the IC socket of the present invention.

31 is an enlarged partial side view of the tip portion of the contact of FIG. 30. FIG.

[Explanation of symbols]

1 IC socket 2 socket body 3 operation members 4 Guide member 5 contacts 6 Fixed elastic contact piece 7 Moving elastic contact piece 8 moving plates 9 Pressing part 10 IC package 11 External contact 12 IC package mounting part 14 openings 15 Projection 16 Projection 20 Dowel 25 Mold protrusion 30 Mold protrusion 35 Bend 40 long dowel 45 Bend 50 notches 51 notches 55 Tip 56 Tip 60 taper 61 Tapered part 65 Tip 66 Tip 70 Tip 71 Tip 75 cutout 76 Undercut part 80 notches 81 Undercut part 85 notches 86 Undercut part

Claims (16)

[Claims] 1. An IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a guide member laterally moved by the cam mechanism of the operation member. A contact having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact, and the contact to the inside of the fixed elastic contact piece. An IC socket characterized by having a high spring constant. 2. The IC socket according to claim 1, wherein a dowel is provided inside the fixed elastic contact piece. 3. The IC socket according to claim 1, wherein a mold protrusion is provided inside the fixed elastic contact piece. 4. The IC socket according to claim 1, wherein a mold portion inside the fixed elastic contact piece is raised. 5. The IC socket according to claim 1, wherein a bent portion is provided inside the fixed elastic contact piece. 6. The IC socket according to claim 1, wherein a long dowel is provided inside the fixed elastic contact piece. 7. An IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a guide member laterally moved by the cam mechanism of the operation member. A contact having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member for opening and closing the contact, and a preload on the outside of the fixed elastic contact piece of the contact. An IC socket characterized by hanging. 8. The I according to claim 7, wherein the fixed elastic contact piece is tilted outward and preloaded outward.
C socket. 9. The IC socket according to claim 7, wherein a bent portion is provided inside the fixed elastic contact piece, and a spring constant is increased at the same time when a preload is applied to the outside. 10. An IC socket having a sandwiching contact for inserting an IC package to form an electrical connection, and a vertically movable operation member having a cam mechanism, and a guide member laterally moved by the cam mechanism of the operation member. A contact having a fixed elastic contact piece and a moving elastic contact piece, a socket body to which the contact is fixedly mounted, and a moving member that opens and closes the contact, and the moving elastic contact piece of the contact is an IC package. The external contact is provided in a contact shape that allows easy sticking, and the fixed elastic contact piece is provided in a shape that is more difficult to stick than the movable elastic contact piece. 11. The IC socket according to claim 10, wherein tip angles of the fixed elastic contact piece and the movable elastic contact piece are changed respectively. 12. The IC socket according to claim 10, wherein the fixed elastic contact piece and the movable elastic contact piece have different tip lengths. 13. The IC socket according to claim 10, wherein the fixed elastic contact piece and the movable elastic contact piece have different numbers of taper tips. 14. The IC socket according to claim 10, wherein the angles of the tip side surfaces of the fixed elastic contact piece and the movable elastic contact piece are changed. 15. The IC socket according to claim 10, wherein the number of surfaces of the tips of the fixed elastic contact piece and the movable elastic contact piece that bit into the external contact of the IC package is changed. 16. The IC socket according to claim 10, wherein various different undercuts are provided at the tip contact portions of the fixed elastic contact piece and the movable elastic contact piece, respectively.