KR100523547B1 - Mold Assembly for forming leadframe of semiconductor package - Google Patents

Abstract

The present invention relates to a mold for molding a lead frame of a semiconductor package, and is capable of disassembling and assembling a module of a mold into a holder housing very simply without requiring bolt fastening and releasing operations.

To this end, the present invention provides a master die, a module inserted into the master die horizontally, a rear support member for supporting the rear of the module after the module is inserted into the master die, and a clamping means for supporting the front of the module. The provided mold for forming a semiconductor package leadframe, wherein the clamping means includes a clamping member that moves to the module and the master die in a direction orthogonal to the moving direction of the module to prevent relative movement between the module and the master die. It provides a mold for forming a lead frame of a semiconductor package configured.

Description

Mold for forming leadframe of semiconductor package

The present invention relates to a mold for molding a lead frame of a semiconductor package, and more particularly, to a mold for performing a molding process by bending or cutting a lead frame of a semiconductor package into a predetermined shape using upper and lower mold modules. The present invention relates to a mold for forming a lead frame of a semiconductor package, so that a work of replacing a mold module according to a kind can be made very easily and quickly.

As is well known, semiconductor packages with integrated circuits (ICs) have recently been shifting from mass production of small quantities to small quantity production, and a semiconductor package manufacturing process capable of producing many kinds in a short time is required. In each process of manufacturing a semiconductor package, a number of improvements have been made in equipment and methods for performing the process to meet these needs.

In the process of molding the lead frame of the semiconductor package, according to the above requirements, the mold structure for forming the lead frame is improved to facilitate the replacement of the mold module according to the type of the semiconductor package and to shorten the replacement time. have.

Korean Utility Model Publication No. 94-5491 (August 13, 1999) and Korean Utility Model Publication No. 20-0264276 (August 19, 2002) disclose the upper and lower holder housings of the upper and lower modules of molds for forming lead frames. It is disclosed that the upper and lower modules can be easily replaced by fastening the clamp or locking plate made of a 'c'-shaped plate by bolts and then engaging with each other by a slide method.

However, the above molds for forming the leadframe have to be completely removed by removing the bolts holding the clamps or the locking plate when the upper and lower modules are disassembled from the mold holder housing, and then removing the module. There was a problem that takes a relatively long time to replace.

In order to solve this problem, the Republic of Korea Utility Model Publication No. 20-0218598 (Announcement of 2001.04.02) discloses a mold for forming a lead frame to improve the replacement of the upper and lower modules more easily. With reference to Figure 1 of the accompanying drawings will be described in more detail for the mold for forming the lead frame as follows.

As shown in FIG. 1, the lower mold of the mold includes a master die 10 including a die holder housing 12 fixed to an upper surface of a lower holder part 11, and a die backing plate inserted into and inserted into the die holder housing 12. It consists of a lower module 13 consisting of a 14 and the die holder 15, the lower module is slidably coupled to the die holder housing (12). Similarly, the upper die of the mold includes a master die 20 composed of a punch holder housing 22 fixed to a lower surface of the upper holder portion 21, a punch backing plate 24 and a punch inserted into and out of the punch holder housing 22. The upper module 23 is composed of a holder 25, the upper module 23 is slidably coupled to the punch holder housing (22).

On both sides of the die holder housing 12 and the punch holder housing 22, the lower module 13 and the upper module 23 are coupled to the die holder housing 12 and the punch holder housing 22 by sliding. The fixed block 30 supporting them in the state is pivotally fastened by the bolt 35.

Accordingly, when the lower module 13 and the upper module 23 are to be coupled to the die holder housing 12 and the punch holder housing 22, the lower module 13 and the upper module 23 may be connected to the die holder housing ( 12) and then fully pushed into the punch holder housing 22, the fixing block 30 is secured with the bolt 35 in a state that the lower block 13 and the upper module 23 is blocked, and the die Alternatively, when disassembling the lower module 13 and the upper module 23 for punch replacement, loosen the bolt 35 of the fixed block 30 to rotate the fixed block 30 downward, and then lower module. 13 and the upper module 23 may be removed by sliding the die holder housing 12 and the punch holder housing 22.

However, the mold for forming the leadframe as described above does not require the operation of completely removing and mounting the bolts, but the bolt 35 of the fixed block 30 is loosened and tightened with a separate tool when replacing the lower and upper modules. Operation must be carried out, and when the module is mounted, there is still a problem that the workability is deteriorated, such as the need to artificially adjust the position by rotating the fixing block so that the position of the fixing block becomes the module support position.

Accordingly, the present invention has been made in order to solve the above problems, semiconductor structure that can be easily disassembled and assembled module of the mold in the holder housing without the need for bolt fastening and release work by improving the structure of the mold The purpose is to provide a mold for forming a leadframe of a package.

In order to achieve the above object, a mold for forming a lead frame of a semiconductor package according to the present invention includes a master die, a module inserted and detached horizontally into the master die, and a rear of the module after the module is inserted into the master die. In a mold for forming a semiconductor package leadframe provided with a back support member for supporting and a clamping means for supporting the front of the module, the clamping means moves to the module and the master die in a direction orthogonal to the moving direction of the module. And a clamping member configured to prevent relative movement between the module and the master die.

According to the mold for forming a lead frame of the present invention, the module and the holder housing can be mutually fixed and released by the operation of the clamping member, and thus, the work of disassembling and remounting the module from the holder housing is very easy. Advantageous advantages can be obtained.

Hereinafter, exemplary embodiments of a mold for forming a lead frame of a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

For reference, the accompanying drawings are shown mainly on the structure of the lower mold of the mold, but the mold has a substantially symmetrical structure between the upper mold and the lower mold (see Utility Model Publication No. 94-5491, published August 13, 1994). Since the structure of the metal mold | die described below can be applied similarly or similarly to the upper mold | type of a metal mold | die, the illustration and description of an upper mold | type are abbreviate | omitted for convenience. In the case of the upper mold, the clamping means mounted on the lower mold described in detail below may be provided in place of the fixing cover described in the above utility model. Of course, by applying the clamping means according to the present invention instead of the locking plate disclosed in the above-mentioned Utility Model Publication No. 20-0264276 and the fixed block disclosed in Utility Model Publication No. 20-0218598 can easily implement the mold form according to the present invention It will be readily understood by those skilled in the art.

Figure 2 is a view showing an embodiment of a mold for forming a lead frame of a semiconductor package according to the present invention, Figures 3 and 4 is a longitudinal cross-sectional view illustrating the operation of the mold for forming the lead frame, Figures 5 and 6 2 is a longitudinal cross-sectional view illustrating a coupling structure between the module and the side plate of the lead frame molding die of FIG. 2, respectively. As shown in FIGS. 2 to 6, the lower mold has a holder part 111 and a die holder housing 112. ) And a module 115 inserted into and out of the master die 100.

The lower plate 113 is fixedly installed on an upper surface of the holder part 111 of the master die 100, and a pair of side plates 114 are installed at both ends of the lower plate 113 to face each other. Together with the lower plate 113 forms a die holder housing 112. Here, the side plate 114 is fixed to the lower plate 113 by a fastening means such as a bolt 127, but alternatively the side plate 114 and the lower plate 113 are integrally injected to form a die holder housing. It can also be configured.

In addition, a die backing plate 116 and a die holder fixed above the die backing plate 116 inside the lower plate 113 and the side plate 114 of the die holder housing 112. Module 115 consisting of 117 is configured to be coupled in a sliding manner. Although not shown in the drawing, a predetermined die (not shown) is formed on the die holder 117 to mold the semiconductor package into a predetermined shape.

In addition, a rear support plate 118 is installed at the rear portion of the die holder housing 112 to support the rear end of the module 115 when the module 115 is coupled to the die holder housing 112. The rear support plate 118 is fixed to the lower plate 113 of the die holder housing 112 by fastening means such as a bolt (not shown). Here, although not shown, the rear end of the module may be supported by forming a stopper protruding inwardly at the rear end of the side plate instead of the rear support plate 118 as a means of supporting the rear end of the lower module 115.

On the other hand, the master die 100 is provided with a lower module clamping means for preventing the module 115 from moving forward by releasably supporting the front portion of the lower module 115 inserted into the die holder housing 112 This lower module clamping means is configured as follows.

The first position fixing hole 113a is formed in the center of the front end of the die holder housing 112, and the center of the front end of the die backing plate 116 of the module 115 corresponds to the first position fixing hole 113a. The second position fixing hole 115a is formed.

As shown in FIGS. 3 and 4, in the first position fixing hole 113a and the second position fixing hole 115a, the clamp block 125 for fixing and releasing the front end of the module 115 is vertically located. It is installed to be movable, the clamp block 125 is coupled to the end of the operation rod 122 of the cylinder 121 is installed in the holder 111 to move up and down. The clamp block 125 has an inclined taper portion 125a formed at a surface in contact with the front end portion of the lower module 115 so that the lower module 115 comes into close contact with the rear support plate 118 when the clamp block is raised. do.

A support block 126 for supporting the clamp block 125 is disposed on the opposite side of the tapered portion 125a of the clamp block 125, and the support block 126 is fixed to the holder portion 111 to fix the clamp block 125. It prevents the 125 from being pushed forward due to the tapered portion 125a and serves to guide the lifting movement of the clamp block 125. Here, the support block 126 is formed at a height lower than the thickness of the lower plate 113 so as not to interfere with the sliding of the module 115.

Meanwhile, in the mold for forming a lead frame according to the present invention, each side plate 114 is formed in a 'c' shape so that the module 115 does not move up and down within the die holder housing 112 during a lead frame forming operation. And a bent portion 114a bent vertically inward at its upper end portion, and stepped portions 117a are formed at both upper end portions of the module 115 to be in contact with the bent portion 114a.

5 and 6, a protrusion 114b protruding downward is formed at a rear portion of the bent portion 114a, and a front portion of the stepped portion 117a of the module 115 is formed. The protrusion 117b protruding upward at the same height as the protrusion 114b is formed, and the protrusions 117a and the side plate 114 of the module 115 are bent by the protrusions 114b and 117b. The portions 114a are connected to each other only at the front and rear portions of the module 115, and play is generated at the middle portion.

This prevents the module 115 from moving up and down within the die holder housing 112, and at the end of the module 115 when the module 115 is drawn in and out while sliding inside the die holder housing 112. This is to minimize the friction and pinching between the jaw portion 117a and the bend portion 114a of the side plate 114 so that the module 115 can be smoothly drawn out and drawn out from the die holder housing 112.

In addition, each of the protrusions 114b and 117b is formed to be inclined toward the lower surface of the side plate 114 and the upper surface of the die holder 117 in the front-rear direction at each of the rear end and the front end thereof, so that the die 115 may be pulled in and out of the module 115. The rear upper end of the holder 117 and the front lower end of the side plate 114 can move smoothly without being caught by the protrusions 114b and 117b.

Module replacement operation according to the embodiment of the lead frame molding die configured as described above is made as follows.

First, as shown in FIG. 3, when the module 115 is coupled to the die holder housing 112, the clamp block 125 may include the first position fixing hole 113a and the second position fixing hole 115a. At the same time, the die backing plate 116 of the module 115 and the lower plate 113 of the die holder housing 112 are supported together by the clamp block 125 to fix the position.

When the module 115 is to be disassembled to replace the module, an operator manipulates a cylinder operation button (not shown) of a control unit (not shown) provided outside the mold to operate the operation rod 122 of the cylinder 121. As a result, as shown in FIG. 4, the clamp block 125 descends downward to be positioned outside the second position fixing hole 115a, and the die backing plate 116 of the module 115 is lowered. The fixed state between the lower plates 113 of the die holder housing 112 is released.

In this state, the operator can simply disassemble the module 115 by sliding the module 115 outward through the front portion of the die holder housing 112. At this time, as described above, the stepped portion 117a of the module 115 and the bent portion 114a of the side plate 114 have a state in which only the front portion and the rear portion are in contact with each other. Can be done.

If the new module 115 is to be mounted, the module 115 is slid into the die holder housing 112 in the reverse order as described above, and then a cylinder operation button (not shown) of a control unit (not shown) provided outside the mold is inserted. ) To raise the operating rod 122 of the cylinder 121.

The clamping block 125 is simultaneously positioned in the second position fixing hole 115a and the first position fixing hole 113a by the rising of the operation rod 122, and the die backing plate 116 and the die of the module 115 The lower plate 113 of the holder housing 112 is made to be fixed to each other, thereby completing the module mounting.

As described above, according to the mold for forming a lead frame according to the present invention, since the coupling between the module 115 and the die holder housing 112 is released by a simple operation of an operator pressing an external cylinder operation button (not shown), the module is replaced. This has the advantage that the work is very simple.

On the other hand, in the above-described embodiment of the mold for forming the lead frame, the second position fixing hole 115a is described as being formed only in the die backing plate 116. Alternatively, the upper die holder 117 may be formed. In this case, the clamp block 125 may be configured to rise up to a fixing hole formed in the die holder 117.

7 and 8 are views showing another embodiment of the lead frame molding die according to the present invention, the lower mold of the lead frame molding mold of this embodiment is the holder portion 111 and the holder like the lower mold of the above-described embodiment It consists of a master die 100 consisting of a die holder housing 112 fixed to an upper surface, and a module 115 consisting of a die backing plate 116 and a die holder 117 to be inserted into the die holder housing 112. do.

Here, the die holder housing 112 is composed of a lower plate 113 and a side plate 114, the module 115 is a rear support plate fixed to the lower plate 113 by a fastening means such as bolts ( 118) to limit movement backward.

The clapping means for releasably fixing the front part of the module 115 with the module 115 inserted into the die holder housing 112 is as follows. A first position fixing hole 113b having a circular cross section is formed in the center portion of the front portion of the lower plate 113 of the die holder housing 112, and the first position fixing hole is formed at the center of the front portion of the module 115. A second position fixing hole 115b having a circular cross section corresponding to 113b) is formed, and the second position fixing hole 115b penetrates from an upper end portion to a lower end portion of the module 115 to form the first position fixing hole 113b. It is designed to communicate with the unit.

In addition, a clamp pin 220 for inserting and fixing the module 115 to the die holder housing 112 is inserted into and coupled to the second position fixing hole 115b and the first position fixing hole 113b. The clamp pin 220 has a pin body 221 inserted into the second position fixing hole 115b and the first position fixing hole 113b, and a pin body 221 at an upper end of the pin body 221. The head portion 222 is formed to have a diameter larger than the diameter so as to be caught and supported outside the upper end of the second position fixing hole 115b.

Accordingly, when the module 115 is to be coupled to a mold, the module 115 is slid into the side plate 114 of the die holder housing 112 and then coupled to the mold 115. By inserting the clamp pin 220 through the two-position fixing hole 115b, the module 115 and the lower plate 113 of the die holder housing 112 are simply fixed.

When the module 115 is to be disassembled from the mold, the operator simply pulls out the clamp pin 220 and the fixed state between the module 115 and the lower plate 113 is simply released, and the operator dies the module 115. What is necessary is to just slide to the outer side of the holder housing 112, and to remove it.

When the lower mold of the mold for forming the lead frame configured as described above is to be applied to the upper mold, the lower mold of the mold of the above embodiment is configured symmetrically, but the clamp pin cannot be inserted from the lower side of the upper module. The module may be simply fixed and released by configuring the ramp pin to be inserted through the punch holder housing and the upper module in turn from above the holder portion of the upper die die.

On the other hand, the mold for forming the lead frame of the above-described embodiment is configured such that the head portion 222 of the clamp pin 220 is exposed to the outside of the module 115, alternatively, as shown in FIG. The receiving groove 117c having a diameter larger than the diameter of the head portion 322 of the clamp pin 320 is successively formed at an upper end thereof, such that the head portion 322 of the clamp pin 320 is accommodated in the receiving groove 117c. It may be concealed from the outside by being accommodated in the inside.

Here, the receiving groove 117c is preferably formed to a size sufficient to allow the operator to pick up the head portion 322 of the clamp pin 320 with a finger.

And, Figure 10 shows another embodiment of the lower mold of the lead frame molding mold according to the present invention, in this embodiment, the ball 423 so that a part of the body portion 421 of the clamp pin 420 protrudes outwards. ) Is installed, the spring 424 is installed to elastically support the ball 423 inside the body portion 421, and the second position fixing hole 113d communicating with the first position fixing hole 115d. The groove 113e is formed in such a manner that the ball 423 is correspondingly inserted into the inner circumferential surface thereof.

Accordingly, when the clamp pin 420 is inserted into the first and second position fixing holes 115d and 113d and the clamp pin 420 is slowly turned, the ball 423 and the groove 113e coincide with each other. The ball 423 is elastically inserted into the groove 113e by the elastic force of the spring 424, so that the clamp pin 420 is released in the first and second position fixing holes 115d and 113d. Can be fixed.

When the clamp pin 420 is to be removed from the first and second position fixing holes 115d and 113d, when the user applies a force to pull the head portion 422 of the clamp pin 420 to the outside, the ball 423 The pressing force is released from the groove 113e to release the clamping force of the clamp pin 420 can be easily released from the clamp pin.

In this embodiment, since the clamp pin 420 may be fixed while being inserted into the first and second position fixing holes 115d and 113d, the lower and upper structures are almost symmetrical unlike the second and third embodiments described above. The structure may be configured so that the clamp pin is inserted and fixed from the lower side of the upper module, and of course, the clamp pin may be inserted and fixed from the upper side of the holder portion of the master die as in the second and third embodiments.

The embodiments of the present invention described above are for illustrative purposes only, and those skilled in the art may make various changes and implementations without departing from the spirit of the invention set forth in the claims of the present invention.

As described above, according to the present invention, the module and the die holder housing can be fixed or released from each other in a very simple operation of operating a switch or removing and inserting a clamp pin without tightening or loosening a bolt or the like. Therefore, the module replacement workability is greatly improved, and the module replacement work time is shortened, thereby obtaining an effect of improving productivity.

1 is a front view showing an example of a mold for forming a lead frame of a conventional semiconductor package.

Figure 2 is a partially cut perspective view showing an embodiment of a mold for forming a lead frame of a semiconductor package according to the present invention

3 and 4 are longitudinal cross-sectional views for explaining the operation of the mold for forming the lead frame of FIG.

5 and 6 are longitudinal cross-sectional views illustrating a coupling structure between the module and the side plate of the mold for forming a lead frame of FIG.

Figure 7 is a partially cut perspective view showing another embodiment of a mold for forming a lead frame of a semiconductor package according to the present invention

8 is a longitudinal cross-sectional view of the mold for forming a lead frame of FIG.

9 is a longitudinal cross-sectional view of another modified embodiment of the mold for forming the lead frame of FIG. 7, corresponding to FIG. 8.

FIG. 10 is a longitudinal sectional view showing main parts of another embodiment of the mold for forming the lead frame of FIG. 7; FIG.

Explanation of symbols on the main parts of the drawings

111 holder portion 112 die holder housing

113: lower plate 114: side plate

115: module 116: die backing plate

117: die holder 118: rear support plate

121: cylinder 122: operating rod

125: clamp block 220: clamp pin

Claims (15)

A semiconductor package leadframe provided with a master die, a module inserted into the master die horizontally, a rear support member supporting the rear of the module after the module is inserted into the master die, and clamping means for supporting the front of the module. In the molding die, The clamping means is a mold for forming a lead package of a semiconductor package comprising a clamping member for moving to the module and the master die in a direction orthogonal to the moving direction of the module to prevent relative movement between the module and the master die. 2. The mold for forming a lead package of a semiconductor package according to claim 1, wherein the clamping member is movable up and down by a clamping unit lifting means installed in the master die. 3. The mold for forming a lead frame of a semiconductor package according to claim 2, wherein the elevating means is a pneumatic cylinder. 4. The semiconductor package of claim 3, wherein an inclined taper is formed at a rear surface of the clamping member such that the clamping member contacts the front end of the module and the module is brought into close contact with the rear support member when the clamping member moves to the module. Mold for molding leadframe. 5. The mold according to claim 4, wherein a clamp support for supporting the clamping member outside the front end of the clamping member is fixed to the master die. The method of claim 1, wherein a hole into which the clamping member is inserted is formed in the module and the master die; The clamping member is formed of a lead frame of a semiconductor package, characterized in that the pin is configured to fix and release the module with respect to the master die while being inserted into and removed from the hole in the master die or module direction in the outer direction of the module or master die. Dragon mold. delete The mold of claim 6, wherein the clamping member comprises a body portion inserted into the hole and a head portion supported on an outer surface of the module or master die on which the hole is formed. The lead of the semiconductor package according to claim 6, wherein the clamping member further comprises clamping member detachment preventing means for preventing the clamping member from being separated when the clamping member is inserted into the module and the master die. Frame forming mold. 10. The semiconductor device according to claim 9, wherein the clamping member detachment prevention means comprises a ball elastically installed in the body of the clamping member, and a recess formed in the inner circumference of the hole of the module or the master die so that the ball is correspondingly inserted. Mold for molding leadframe of package. The module of any one of claims 1 to 10, wherein the master die comprises a holder part, a base plate fixed to the holder part, and a pair of side plates fixedly fixed to both sides of the base plate. The mold for lead frame molding of a semiconductor package, characterized in that it comprises a holder housing which is inserted and removed while sliding between the space between the base plate and the side plate. 12. The leadframe molding of the semiconductor package according to claim 11, wherein each side plate of the holder housing is formed with a bent portion that is bent inwardly to support the upper and / or lower edges of both sides of the module to limit the vertical movement of the module. Dragon mold. The bent portion and / or a protrusion formed at a portion of an edge portion of the bent portion and / or the module such that the bent portion and the corner portion of the module corresponding to the bent portion are interconnected to each other and a gap is formed between the bent portion and the module at the remaining portion. Mold for molding leadframe of a semiconductor package, characterized in that. The lead frame of claim 13, wherein the protrusions are formed at the front and rear portions of the module, respectively, so that the modules and the bent portions are connected to each other at the front and rear, and a gap is formed at the middle portion. Mold for molding. 15. The mold for forming a lead frame of a semiconductor package according to claim 14, wherein each of the protrusions has an inclined tapered surface.