JP6700690B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket that has a socket body that is detachably accommodated in an electrical component and is arranged and fixed on a wiring substrate, and that electrically connects the electrical component and the wiring substrate.

  Conventionally, as an electric component socket, an IC socket that performs a performance test such as a burn-in test of an IC (Integrated Circuit) package that is an electric component is known (for example, refer to Patent Document 1).

  In the socket body of such an IC socket, a floating plate that is a first plate that is movable toward the wiring board while accommodating the IC package, and a floating plate and a wiring board that are arranged and fixed between the floating plate and the wiring board A contact pin plate which is a second plate facing the contact pin plate, a fixing portion penetratingly fixed to the contact pin plate, one end portion penetrating the floating plate and contacting the IC package, the other end portion connected to the wiring board, and fixing. And a contact pin having a spring portion that is elastically deformable between the end portion and the one end portion.

JP, 2005-109138, A

  However, the IC package is more likely to warp as it becomes larger due to various factors such as manufacturing conditions. When the IC package in which warpage has occurred is housed in the IC socket, the IC package is partially removed from the housing surface of the IC socket. It may be floating.

  Therefore, even if a terminal provided on a portion of the bottom surface of the IC package that floats from the accommodation surface of the IC socket comes into contact with the corresponding contact pin, the compression stroke of the contact pin may be insufficient. The contact resistance may increase due to a decrease in contact pressure of the contact pin with respect to the contact pin, which may cause poor contact.

  On the other hand, according to the terminals of the floating portion of the IC package, the contact pins are individually arranged at positions close to the IC package, and the compression stroke of the contact pins is adjusted so that the IC package is not warped. Although it may be possible to set the same level as that in the case of housing, it may reduce the manufacturing efficiency of the IC socket and eventually increase the manufacturing cost.

  Therefore, an object of the present invention is to provide a socket for an electric component, which addresses such a problem and easily improves the contact stability of a contact pin with respect to an IC package having a warp.

In order to solve the above-mentioned problems, an electric component socket according to the present invention has a socket body that is arranged and fixed on a wiring board while accommodating the electric component, and electrically connects the electric component and the wiring board. A socket for components, wherein the socket body includes a first plate movable toward the wiring board while accommodating the electric component, and the first plate so as to face the first plate and the wiring board. A flexible second plate arranged and fixed to the socket body at a predetermined distance from the wiring board between the plate and the wiring board; a fixing portion penetratingly fixed to the second plate; One end portion penetrating the first plate in a relatively movable manner so as to come into contact with the electric component housed in the first plate when the plate moves toward the wiring substrate, and is connected to the wiring board. And a contact pin having a spring portion elastically deformable between the fixed portion and the one end portion. The second pin protrudes from the second plate toward the wiring board and abuts against the wiring board. projecting members are provided at least one, the projecting amount of the projecting member, the electrical component on the assumption that certain warped, if the first of the electrical component in which the constant warped It is characterized in that a gap amount predicted to occur between the first plate and the electric component when it is housed in the plate is determined by adding to the predetermined distance .

The protrusion amount of the protruding member is a plan view when the electric component having the constant warp is temporarily accommodated in the first plate on the assumption that the electric component has a constant warp. in said gap amount that is expected to occur between the protruding member is provided position with your stomach the first plate in the same position as the electrical component, it may be determined by adding the predetermined distance.

  The protruding member may be a convex portion integrally formed on the wiring board side of the second plate.

The second plate may further Bei forte frame body for fixing the peripheral portion.

  The second plate is formed with a contact pin plate that penetrates and fixes the contact pin, and an insertion hole into which the other end of the contact pin is inserted, and the contact pin is inserted into the insertion hole. A locator plate configured to be movable between the contact pin plate and the other end portion may be included, and the projecting member may project from a side of the locator plate opposite to the contact pin plate. Here, a first locking portion that penetrates the contact pin plate and the locator plate and locks from the first plate side of the contact pin plate, and a side of the locator plate opposite to the contact pin plate. And a second locking portion that locks the locator plate, and the protruding member may be the second locking portion of the locking member. Alternatively, the protruding member may be a convex portion integrally formed on the wiring board side of the locator plate.

  According to the socket for electric parts of the present invention, the positions of the contact pins are collectively shifted toward the IC package in accordance with the warpage of the IC package, thereby suppressing the shortage of the compression stroke of the contact pin. It is possible to easily improve the contact stability of the contact pin with respect to the IC package in which the occurrence has occurred.

It is a perspective view showing an example of an IC socket of an opened state concerning an embodiment of the present invention. It is a perspective view showing an example of an IC socket in a closed state concerning the embodiment. It is a top view which shows an example of the IC socket of the closed state which concerns on the same embodiment. It is a bottom view showing an example of an IC socket concerning the embodiment. It is sectional drawing in the AA line of FIG. 3 which concerns on the same embodiment. It is a perspective view showing an example of a standoff pin concerning the embodiment. It is a front view showing an example of a standoff pin concerning the embodiment. FIG. 6 is a partial cross-sectional view showing a state in which an IC package is housed in the IC socket of FIG. 5 according to the same embodiment and attached to a wiring board. It is a fragmentary sectional view explaining the contact state in the conventional IC socket. The change point of the standoff pin which concerns on the embodiment is shown, (a) is a front view before a change, (b) is a front view after a change. It is a fragmentary sectional view explaining the contact state in the IC socket which concerns on the same embodiment. It is a fragmentary sectional view explaining the contact state in the IC socket of another example concerning the embodiment. An example of the IC package which concerns on the same embodiment is shown, (a) top view, (b) front view, (c) bottom view.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.
1 to 5 show an example of an electrical component socket according to the present embodiment.

  The socket for electric parts has a socket body that is removably accommodated in an electric part such as an IC package and fixed and arranged on the wiring board, and electrically connects the electric part and the wiring board. It is an IC socket for performing a performance test of an IC package such as a burn-in test.

  As shown in FIGS. 13A to 13C, the IC package 2 housed in the IC socket 1 has a large number of planar electrode pads 2c arranged in a grid pattern on the bottom surface 2b of the rectangular package body 2a in plan view. It is an LGA (Land Grid Array) type IC package. The IC package 2 housed in the IC socket 1 may be a BGA (Ball Grid Array) type in which solder balls are arranged in a grid pattern instead of the flat electrode pads 2c.

  The IC socket 1 includes a socket body 10, and the socket body 10 has a frame body 20 having a substantially rectangular frame shape. The socket body 10 is arranged and fixed to the wiring board 100 with the bottom surface 20 a (see FIGS. 4 and 5) of the frame body 20 in contact with the wiring board 100. Further, the socket body 10 is provided with an accommodating portion C for accommodating the IC package 2 in the upper portion of the frame body 20 inside the frame.

  The socket body 10 is provided with a pair of socket covers 11a and 11b which are pivotally supported by the frame body 20 to open and close in a double-door shape and which covers the housing portion C in a closed state (closed state). The socket covers 11a and 11b are constantly biased by a biasing member (not shown) so as to be in a closed state. Inside the socket covers 11a, 11b, a pair of pressing members 12a, 12b for pressing the IC package 2 housed in the housing C from above are provided. The socket covers 11a and 11b and the pressing members 12a and 12b use the urging force that constantly urges the socket covers 11a and 11b to be in the closed state, so that the accommodated IC package 2 is directed toward the floating plate described below. A pressing mechanism for pressing is configured. The pressing force applied to the IC package 2 by the pressing mechanism is a mechanical stress within the range where the IC package 2 does not break down.

  On the outer periphery of the socket body 10, an operation member 13 having a substantially rectangular frame shape for opening and closing the pair of socket covers 11a and 11b is movable from the accommodating portion C side toward the wiring board 100 side (moves up and down in the drawing). Is possible). The operating member 13 is connected to the socket covers 11a and 11b by a link mechanism 14, and the vertical movement of the operating member 13 causes the socket covers 11a and 11b to interlock with each other to open and close.

  As shown in FIG. 5, in the socket body 10, in the frame of the frame body 20, from the top to the bottom, that is, from the accommodating portion C of the IC package 2 toward the wiring substrate 100 side, the socket body 10 is sequentially arranged. A floating plate 30 that is one plate, a contact pin plate 40 that is one of the second plates, and a locator plate 50 that is the other of the second plates are provided.

  The floating plate 30 has an upper surface 30a (see FIGS. 1 and 5) and a guide pin 30b (see FIGS. 1 and 5) that defines the accommodation position of the IC package 2 on the upper surface 30a. A plurality of through holes 30c (see FIGS. 3 and 5) through which contact pins to be described later penetrate are formed corresponding to the positions of the plane electrode pads 2c arranged on the bottom surface 2b of the IC package 2 to form the portion C. There is. Further, the floating plate 30 is formed so as to be able to move substantially in parallel (movable up and down in FIG. 5) toward the wiring substrate 100 on which the socket body 10 is arranged and fixed, and is provided in the frame body 20 of the socket body 10. A coil spring (not shown) constantly urges the contact pin plate 40 away from the contact pin plate 40.

  The contact pin plate 40 is disposed on the side opposite to the housing portion C with respect to the floating plate 30 so as to face the floating plate 30 substantially in parallel, and is fixed to the frame body 20 of the socket body 10 at the peripheral edge portion 40a. In other words, the contact pin plate 40 is floating in the frame 20 of the socket body 10 so as to face the floating plate 30 and the wiring board 100 substantially in parallel when the socket body 10 is arranged and fixed on the wiring board 100. The peripheral portion 40a is arranged and fixed between the plate 30 and the wiring board 100.

  The contact pin plate 40 is provided with a plurality of contact pins 60 corresponding to the positions of the planar electrode pads 2c in the IC package 2 housed in the housing portion C. Each contact pin 60 has a fixed portion 60 a that is fixed through the contact pin plate 40 and one end portion that penetrates the through hole 30 c of the floating plate 30 and contacts the flat electrode pads 2 c arranged on the bottom surface 2 b of the IC package 2. 60b, the other end portion 60c electrically connected to the wiring board 100, and a spring portion 60d elastically deformable between the fixed portion 60a and the one end portion 60b.

  The spring portion 60d is shallowly curved in an arc shape. In the spring portion 60d, the floating plate 30 accommodating the IC package 2 moves downward due to the pressing force of the pressing mechanism, the planar electrode pad 2c and the one end portion 60b come into contact with each other, and the fixed portion 60a and the one end portion 60b are connected. When a compressive force is applied between them, a compressing stroke occurs in which the bending radius is elastically deformed to a small value and the length between the fixed portion 60a and the one end portion 60b of the contact pin 60 is shortened. At the same time, the spring portion 60d generates a reaction force that tends to extend the contact pin 60 upward, that is, toward the housed IC package 2 in accordance with the compression stroke. This reaction force becomes the contact pressure between the one end portion 60b of the contact pin 60 and the planar electrode pad 2c of the IC package 2. Each contact pin 60 is arranged so that the distance from the contact pin plate 40 to the one end 60b is constant so that a uniform and constant compression stroke can be ensured.

  The locator plate 50 is formed with an insertion hole 50a into which the other end portion 60c of the contact pin 60 is inserted. The locator plate 50 contacts the contact pin plate 40 with the contact pin 60 in the insertion hole 50a. The pin 60 is configured to be vertically movable between the other end 60c.

  When the locator plate 50 moves to the contact pin plate 40, the socket body 10 is arranged so that the locator plate 50 retracts inwardly of the socket body 10 with respect to the bottom surface 20 a of the frame body 20 that contacts the wiring board 100. Has been formed.

  Specifically, the vertical movement of the locator plate 50 is a standoff as a "locking member" that is locked to the contact pin plate 40 and the locator plate 50 at at least one position so as not to interfere with the contact pin 60. It is regulated by 70 (see FIGS. 4 and 5).

6 and 7 show details of the standoff 70.
The standoff 70 penetrates the contact pin plate 40 and the locator plate 50 and locks from the floating plate 30 side (upper side) of the contact pin plate 40, and the contact pin of the locator plate 50. The second locking portion 70b that locks from the opposite side (lower side) of the plate 40. In the standoff 70, the locator plate 50 moves from the contact pin plate 40 to the other end portion 60c of the contact pin 60 by appropriately setting the distance from the first locking portion 70a to the second locking portion 70b. Alternatively, it is regulated so as not to exceed the other end portion 60c.

  The second locking portion 70b forms a protruding member having a protruding amount P1 protruding from the side of the locator plate 50 opposite to the contact pin plate 40. The protrusion amount P1 is a retreat amount by which the locator plate 50 retracts inward of the socket body 10 with respect to the bottom surface 20a of the frame body 20 that contacts the wiring board 100 when the locator plate 50 moves to the contact pin plate 40. Is set to the same value as.

  By lowering the locator plate 50 to the other end portion 60c of the contact pin 60 (see FIG. 5), for example, when the IC socket 1 is transported, before the socket body 10 is arranged and fixed to the wiring board 100, the contact pin 10 is fixed. Damage to the other end portion 60c of 60 such as bending deformation is suppressed.

  On the other hand, as shown in FIG. 8, when socket body 10 is arranged and fixed to wiring board 100, locator plate 50 moves to contact pin plate 40 together with standoff 70. Then, the second locking portion 70b of the locator plate 50 protruding from the side opposite to the contact pin plate 40 abuts the wiring board 100, and the locator plate 50 and the wiring board 100 are substantially parallel to each other, and the second locking portion 70b. The protrusion amount P1 of 70b is arranged at the same distance. Thus, when the socket body 10 is arranged and fixed on the wiring board 100, a gap S is formed between the locator plate 50 and the wiring board 100, and the gap S and the bottom surface 20 a of the frame body 20 are formed. A fluid such as a cleaning liquid can be passed through the groove 20b (see FIG. 4) after a test such as a burn-in test.

  Here, as shown in FIG. 9, the IC package 2 is more likely to warp as it becomes larger due to various factors such as manufacturing conditions, and the IC package 2 in which warpage has occurred is a floating region that defines the housing portion C. When accommodated in the plate 30, the bottom surface 2b of the IC package 2 partially floats from the upper surface 30a of the floating plate 30, and a gap amount G may occur between the floating plate 30 and the IC package 2.

  On the other hand, even when the IC package 2 is pressed by the pressing mechanism and the floating plate 30 is lowered, it corresponds to the planar electrode pad 2c provided in a portion of the IC package 2 which is floating from the upper surface 30a of the floating plate 30. The one end portion 60b of the contact pin 60 may not come into contact with the contact pin 60, or even if it comes into contact with the one end portion 60b, the compression stroke of the contact pin 60 may be insufficient. For this reason, the contact resistance may increase due to a decrease in contact pressure of the contact pin 60 with respect to the planar electrode pad 2c of the IC package 2, which may cause contact failure. This means that it becomes difficult to normally carry out a performance test (for example, burn-in test) of the IC package 2.

  Therefore, in the present embodiment, assuming that the warpage occurring in the IC package 2 is constant, the gap amount G generated between the floating plate 30 and the IC package 2 is measured by, for example, a three-dimensional measuring device or the like. Using the measurement result, at least one point on the bottom surface 2b of the IC package 2 is calculated in advance. Then, as shown in FIG. 10, according to the calculated gap amount G, the protrusion amount P1 of the second locking portion 70b protruding from the side of the locator plate 50 opposite to the contact pin plate 40 is increased to the protrusion amount P2. It is set. For example, the gap amount G is added to the protrusion amount P1 of the second locking portion 70b to increase the protrusion amount P2 (=P1+G). Further, the contact pin plate 40 and the locator plate 50 are formed to be flexible.

  When the IC socket 1 is configured in this way, as shown in FIG. 11, the socket body 10 is arranged and fixed on the wiring board 100 in which bending deformation is suppressed, and the wiring board 100 and the locator plate 50 form the second locking portion. When 70b is sandwiched, a load is applied upwardly from the wiring board 100 to the locator plate 50 via the second locking portion 70b, so that the locator plate 50 and the contact pin plate 40 move to the second locking portion 70b. In the upper part, bending deformation occurs with a bending amount corresponding to the gap amount G.

  Therefore, by appropriately changing the positions of the standoffs 70 on the locator plate 50, the number of the standoffs 70, the protrusion amount of the second locking portion 70b, and the like, the contact pin plate can be adjusted according to the bottom surface 2b of the IC package 2 in which the warp occurs. Bending deformation can occur in 40.

  Since the contact pin 60 is fixed to the contact pin plate 40, not only the contact pin 60 in the vicinity of the second locking portion 70b with the increased protrusion amount but also the contact pin 60 in the periphery thereof According to the bending deformation of 40, the vertical position can be collectively moved toward the bottom surface 2b of the IC package 2.

  Therefore, according to the IC socket 1 of the present embodiment, the one end portion 60b of the contact pin 60 is brought into contact with the bottom surface 2b of the IC package 2 in which warpage has occurred so as to suppress the shortage of the compression stroke of each contact pin 60. Therefore, the contact stability of the contact pin 60 with respect to the warped IC package 2 can be easily improved.

Next, a method of using such an IC socket 1 will be described.
First, the wiring board 100 for disposing and fixing the socket body 10 of the IC socket 1 is fixed on a rigid body (for example, a stainless steel plate) in order to suppress bending deformation of the wiring board 100. Then, the bottom surface 20a of the frame body 20 is brought into contact with the wiring board 100 fixed on the rigid body as the contact surface, and the IC socket 1 is arranged and fixed on the wiring board 100. Here, in the IC socket 1, the gap amount G generated between the floating plate 30 and the IC package 2 is calculated in advance so as to accommodate the IC package 2 in which a certain warp has occurred, and the second locking of the standoff 70 is performed. The protrusion amount P2 in the portion 70b is set to be increased in accordance with the gap amount G with respect to the protrusion amount P1 set as a separation distance for separating the locator plate 50 and the wiring board 100 in parallel (see FIG. 10). .

  Then, the second locking portion 70b having the protrusion amount P2 is sandwiched between the wiring substrate 100 and the locator plate 50, so that the contact pin plate 40 is aligned with the bottom surface 2b of the IC package 2 in which warpage has occurred. Bending deformation occurs, and in accordance with this bending deformation, the positions of the contact pins 60 collectively move upward toward the bottom surface 2b of the IC package 2.

  Next, as shown in FIG. 1, the operating member 13 is lowered against the urging force of an urging member (not shown) that urges the socket covers 11a and 11b to the open state, so that the socket covers 11a and 11b. Is opened and the IC package 2 is housed in the housing portion C of the socket body 10.

  After housing the IC package 2, the operation member 13 is raised to close the socket covers 11a and 11b, and the IC cover 2 is pressed from the upper surface 2d by the pressing mechanism of the socket covers 11a and 11b and the pressing members 12a and 12b. The floating plate 30 descends toward the wiring board 100 against the biasing force of a coil spring (not shown).

  As shown in FIG. 11, when the floating plate 30 is lowered, the spring portion 60d of the contact pin 60 starts elastically deforming to generate a compression stroke, and in accordance with this compression stroke, the one end portion 60b of the contact pin 60 and the IC package. A contact pressure is generated between the two flat electrode pads 2c. However, since each contact pin 60 moves upward toward the bottom surface 2b of the IC package 2 according to the bending deformation of the contact pin plate 40 that is caused in accordance with the bottom surface 2b of the IC package 2 in which warpage has occurred, An almost uniform constant compression stroke is generated in each contact pin 60, and the one end portion 60b of the contact pin 60 and each corresponding flat electrode pad 2c are brought into contact with each other with a required contact pressure.

  In this state, a current is passed through the IC package 2 to perform a performance test of the IC package 2, such as a burn-in test.

  In addition, in the above-described embodiment, the protrusion amount P2 of the second locking portion 70b is generated between the floating plate 30 and the IC package 2 at the same position as the position where the standoff 70 is locked in a plan view. It may be set according to the gap amount G that is present. In particular, at the same position in plan view as the position where the maximum gap amount Gmax is generated, the contact pin plate 40 and the locator plate 50 have the second locking portion 70b having the protrusion amount P2 corresponding to the gap amount Gmax. The standoff 70 may be locked.

  In the above-described embodiment, when the socket body 10 is arranged and fixed to the wiring board 100 and the second locking portion 70b is sandwiched between the wiring board 100, the locator plate 50 and the contact pin plate 40, the wiring board 100 is not bent. The rigidity of the wiring board 100 may be higher than the rigidity of the locator plate 50 and the contact pin plate 40 so that the flexure of the locator plate 50 and the contact pin plate 40 can be ignored. By doing so, a rigid body for fixing the wiring board 100 becomes unnecessary.

  In the above-described embodiment, the position where the contact pin plate 40 is fixed to the frame body 20 is the peripheral edge portion 40a of the contact pin plate 40, but the present invention is not limited to this, and may be changed according to the warpage of the IC package 2. You can For example, when a gap amount G is generated in the peripheral portion between the floating plate 30 and the IC package 2 due to the warp generated in the IC package 2, the contact pin plate 40 does not interfere with the contact pin 60. May be fixed to the frame body 20 at the central portion. As a result, the standoff 70 is locked to the peripheral portion 40a of the locator plate 50 and the contact pin plate 40, and the contact pin plate 40 is bent and deformed at the peripheral portion 40a by the second locking portion 70b having a different protrusion amount. You may do it.

  In the above-described embodiment, as shown in FIG. 12, instead of the second locking portion 70b, or in addition to the above-described second locking portion 70b, it occurs between the floating plate 30 and the IC package 2. Depending on the gap amount G, the protrusion 80 protruding from the side of the locator plate 50 opposite to the contact pin plate 40 may be integrally formed with the locator plate 50. The protrusion amount P2 of the convex portion 80 may be a value obtained by adding the gap amount G to the separation distance P1 between the locator plate 50 and the wiring substrate 100 before bending deformation. In short, when the IC package 2 is warped, the protrusion that protrudes from the opposite side of the locator plate 50 to the contact pin plate 40 according to the gap amount G generated between the floating plate 30 and the IC package 2. It suffices if at least one member is provided.

  Unlike the above-described embodiment, in the configuration in which the IC socket 1 does not include the locator plate 50 and the standoff 70 and only the contact pin plate 40 serves as the second plate, when the IC package 2 is warped, the floating state occurs. At least one protruding member that protrudes from the contact pin plate 40 toward the wiring board 100 may be provided according to the gap amount G generated between the plate 30 and the IC package 2. The protruding member may be, for example, a convex portion of the contact pin plate 40 integrally formed on the wiring substrate 100 side.

  Further, in the configuration in which only the contact pin plate 40 is the second plate, the protrusion amount of the protrusion member protruding from the contact pin plate 40 toward the wiring board 100 is the same as the position where the protrusion member is provided in plan view. It may be set according to the gap amount G generated between the floating plate 30 and the IC package 2.

  Further, in the configuration in which only the contact pin plate 40 is the second plate, when the socket body 10 is arranged and fixed to the wiring board 100 and the second locking portion 70b is sandwiched between the wiring board 100 and the contact pin plate 40, The rigidity of the wiring board 100 may be higher than the rigidity of the contact pin plate 40 so that the flexure of the wiring board 100 can be ignored with respect to the flexure of the contact pin plate 40. By doing so, a rigid body for fixing the wiring board 100 becomes unnecessary.

  In the above-described embodiment, the contact pin 60 has the arcuately shallowly curved spring portion 60d, but the contact pin 60 is elastically deformed so as to be between the fixed portion 60a and the one end portion 60b of the contact pin 60. It suffices as long as a compression stroke that shortens the length is generated. For example, a probe pin or the like may be used.

  In the above-described embodiment, the present invention is applied to the IC socket 1 that houses the IC package 2 as a socket for electric parts, but the present invention is not limited to this, and is also applicable to a device that houses other electric parts.

1 IC socket 2 IC package 10 Socket body 30 Floating plate 30a Upper surface 30c Through hole 40 Contact pin plate 40a Peripheral part 50 Locator plate 50a Insertion hole 60 Contact pin 60a Fixed part 60b One end part 60c Other end part 60d Spring part 70 Standoff 70a First locking part 70b Second locking part 80 Convex part 100 Wiring board C Housing part G Gap amount P1 Projection amount P2 Projection amount (=P1+G)
S gap

Claims (7)

A socket for an electric component, which has a socket body arranged and fixed on a wiring board while accommodating an electric component, wherein the electric body and the wiring board are electrically connected to each other.
A first plate that is movable toward the wiring board while accommodating the electric component;
A flexible second plate that is arranged and fixed to the socket body so as to face the first plate and the wiring board and is separated from the wiring board by a predetermined distance between the first plate and the wiring board. When,
The first plate is fixed to the second plate so as to come into contact with the electric component housed in the first plate when the first plate moves toward the wiring board. A contact pin having one end penetrating so as to be relatively movable, the other end connected to the wiring board, and a spring part elastically deformable between the fixed part and the one end;
Is composed of
The protruding toward the second plate to the wiring board contact projecting member is provided at least one, the projecting amount of the projecting member, on the assumption that certain warped to the electrical component, The amount of gap predicted to occur between the first plate and the electric component when the electric component having the constant warp is accommodated in the first plate is added to the predetermined distance. A socket for electric parts, characterized by being specified by The protrusion amount of the protruding member is a plan view when the electric component having the constant warp is temporarily accommodated in the first plate on the assumption that the electric component has the constant warp. 6. The amount of gap predicted to occur between the first plate and the electric component at the same position as the position where the protruding member is provided is determined by adding to the predetermined distance. The socket for electric parts according to item 1.   The socket for electrical parts according to claim 1 or 2, wherein the projecting member is a convex portion integrally formed on the wiring board side of the second plate. Socket for electrical parts according to any one of claims 1 to 3, further comprising a frame for fixing the second plate at the periphery. The second plate is
A contact pin plate through which the contact pin is fixed,
An insertion hole into which the other end portion of the contact pin is inserted is formed, and is formed to be movable between the contact pin plate and the other end portion in a state where the contact pin is inserted into the insertion hole. Locator plate and
Is composed of
The electrical component socket according to any one of claims 1 to 4, wherein the projecting member projects from a side of the locator plate opposite to the contact pin plate. A first locking portion that penetrates the contact pin plate and the locator plate and locks from the first plate side of the contact pin plate, and locks from the opposite side of the locator plate to the contact pin plate. And a second locking portion for controlling the movement of the locator plate.
The socket for electrical parts according to claim 5, wherein the protruding member is the second locking portion of the locking member. The socket for electrical parts according to claim 5, wherein the projecting member is a convex part integrally formed on a side of the locator plate opposite to the contact pin plate.