JPH05326757A - Ic socket - Google Patents

Abstract

PURPOSE:To obtain an IC socket which prevents the leads of a package from being deformed and can be used in common without mounting/dismounting component members by a method wherein a package is positioned on the basis of a mold body guide, and a mold table is made to stop at a prescribed position by a mold table stopping means. CONSTITUTION:An IC socket is equipped with a socket main body 2, contact pins 4, a mold table 6, a mold table stopping member 7, springs 8, and a lead pressing member 10. A recess 2a is provided to the center of the socket, main body 2, and the contact pins 4 are arranged around the recess 2a. A mold body guide 6a is provided to the mold table 6 for positioning a semiconductor package when it is placed on the mold table 6. The mold table 6 is engaged with the socket main body 2 by the springs 8 and displaceable in the depthwise direction of the recess 2a. The mold table stopping member 7 is rotatable to the socket main body 2 and the mold table 6 but not displaceable in the depthwise direction of the recess 2a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to a socket unit for burn-in board and IC test handler.

[0002]

2. Description of the Related Art A conventional IC socket is shown in FIG. This IC socket is used in a bend lead type semiconductor package, for example, a QFP (Quad Flat Package) 80, and has a detachable lead guide 63 attached to a socket substrate 62. Also, the socket substrate 62
A plurality of contact pins 64 and a frame guide 6
6 is provided. When the QFP80 is inserted into the IC socket shown in FIG. 5 for positioning, the QFP80 is inserted in the direction of arrow A shown in FIG. 5B, and the end face of the lead guide 63 and the corner side lead 85 of the QFP80 are used for positioning. Then, the lead 85 of the QFP 80 and the contact pin 64 of the IC socket are brought into contact with each other to make a contact.

On the other hand, a straight lead type QFP9
In the case of 0, the lead guide 63 is removed and used as shown in FIG. In this case, the QFP90 is shown in FIG. 6 (b).
Insert in the direction of the arrow A shown in, and position the frame guide 66 and the frame 95 to make contact.

[0004]

Such a conventional IC
For socket, bend lead type QFP80
In the case of, since the lead 85 on the corner side of the QFP 80 and the end surface of the lead guide 63 are positioned,
The lead 85 of the QFP 80 may be deformed. In addition, the lead guide 63 is attached to or removed from the socket substrate 62 so that the bend lead type and the straight lead type QFP are used in common.
When the lead guide 63 is removed, the lead guide 63
There was a risk of losing. Further, in the lead guide technique which will be developed in the future and which uses a lead guide for a QFP having a fine pitch, there is a problem that the mechanical strength of the lead is further weakened and the lead is more easily deformed.

The present invention has been made in consideration of the above problems, and prevents a lead from deforming even in a fine pitch semiconductor package and provides a bend lead and a straight lead type semiconductor package. It is an object of the present invention to provide an IC socket that can also be used in common.

[0006]

SUMMARY OF THE INVENTION An IC socket according to the present invention has a socket body having a rectangular recess in the center, a plurality of contact pins arranged around the recess of the socket body, and a semiconductor package. A mold pedestal having a molded body guide serving as a guide for the mold body, on which the mold body is placed, and a spring means for supporting the mold pedestal so that the mold pedestal can be displaced in the depth direction of the recess of the socket body, A mold pedestal stationary means capable of stationary the mold pedestal at a predetermined position in the depth direction of the recess of the socket body, and a lead pressing means for pressing the lead of the semiconductor package to make contact with a corresponding contact pin. Characterize.

[0007]

According to the IC socket of the present invention thus constructed, the semiconductor package is positioned with reference to the mold body guide, and the mold pedestal stopping means is used to stop the mold pedestal at a predetermined position. As a result, the leads of the semiconductor package can be prevented from being deformed, and the leads can be commonly used for bend lead type and straight lead type semiconductor packages.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC socket according to the present invention will be described with reference to the drawings. FIG. 1 shows a cross section of an embodiment of an IC socket of the present invention. The IC socket of this embodiment includes a socket body 2, a plurality of contact pins 4, a mold pedestal 6, a mold pedestal stationary member 7, a spring 8 and a lead pressing member 10. The socket body 2 has a recess 2a at the center. A plurality of contact pins 4 are arranged around the recess 2a. The contact pin 4 comes into contact with a lead 85 of a semiconductor package, for example, a bend lead type QFP 80, and supplies power or a control signal for testing transmitted from the outside to the QFP 80.
Tell.

The mold pedestal 6 is for mounting a semiconductor package, for example, the mold body 82 of the QFP 80,
A mold body guide 6a for positioning the semiconductor package when it is placed is provided on the edge (see FIGS. 1 and 3). The mold pedestal 6 is engaged with the socket body by a spring 8 and is supported so as to be displaceable in the depth direction of the recess 2 a of the socket body 2. A hole 6b is provided in the center of the mold pedestal 6 so as to engage with the mold pedestal stationary member 7 (see FIG. 3). The mold pedestal stationary member 7 is rotatable with respect to the socket body 2 and the mold pedestal 6,
It is attached to the socket body 2 so that it cannot be displaced in the depth direction of the recess 2a of the socket body 2.

In a normal state, that is, a state in which a bend lead type QFP 80 is tested, the mold pedestal 6 is stationary at a position supported only by the spring force of the spring 8, as shown in FIG. When testing the straight lead type QFP 90, the mold pedestal 6 is pushed downward without placing the semiconductor package, that is, in the depth direction of the recess 2 a of the socket body 2, and the mold pedestal stationary member 7 is moved at a predetermined angle. By rotating the mold pedestal 6 at a position suitable for testing the straight lead type QFP 90 as shown in FIG.

Specific examples of the mold pedestal 6 and the mold pedestal stationary member 7 are shown in FIGS. 3 and 4, respectively. In the state shown in FIG. 1, the groove 6 provided at the bottom of the mold pedestal 6
f, 6g, 6h, the convex portion 7f of the mold pedestal stationary member 7,
7g and 7h are in a mated state. When the mold pedestal 6 is pushed downward in this state and the mold pedestal stationary member 7 is rotated clockwise when viewed from above, the convex portions 7f,
7g and 7h are bottoms 6c, 6d and 6 of the mold pedestal 6, respectively.
It is possible to prevent the mold pedestal 6 from moving downward due to the spring force of the spring 8 when it is placed on e. That is, the mold pedestal 6 stands still at a position suitable for testing the straight lead type QFP 90 as shown in FIG. Incidentally, by rotating the mold base stationary member 7 are in contact with ledge portion 6c ₁ of the bottom 6c of the protrusions 7c and the mold base 6 so as not to rotate a predetermined angle or more.

In the normal state, the QFP80 is molded into the pedestal 6
(See FIG. 1) and a state in which the QFP 90 is placed with the mold pedestal 6 stationary at a predetermined position (see FIG. 2).
2), the leads 85 and 95 of the semiconductor package do not come into contact with the contact pins 4 and lead 8
There is a slight gap between 5, 95 and the contact pin 4. For this reason, when performing the test, the leads 85, 95 are pressed from above by the lead pressing member 10 and
It is necessary to bring the contact pin 4 into contact with the contact pin 4.

It should be noted that a comb-shaped projection (not shown) made of an insulating member is provided on the edge of the mold pedestal 6 so as to extend outward, and the comb-shaped projection is provided between adjacent contact pins. It is used to prevent contact.

As described above, according to this embodiment, since the mold body guide is used as a reference for positioning the semiconductor package, the lead is deformed even in the semiconductor package having the fine pitch leads. Can be prevented, and members can be attached to straight lead type and bend lead type semiconductor packages,
Can be shared without removing.

[0015]

According to the present invention, it is possible to prevent the deformation of leads even in a semiconductor package having leads with a fine pitch, and at the same time, bend lead type and straight lead type semiconductor packages. It can be shared without attaching or detaching the member.

[Brief description of drawings]

FIG. 1 is a sectional view when an IC socket of the present invention is applied to a bend lead type semiconductor package.

FIG. 2 is a sectional view when the IC socket of the present invention is applied to a straight lead type semiconductor package.

FIG. 3 is an explanatory view showing a specific example of a mold pedestal according to the present invention.

FIG. 4 is an explanatory view showing a mold base stationary member according to the present invention.

FIG. 5 is an explanatory view showing a conventional IC socket.

FIG. 6 is an explanatory view showing a conventional IC socket.

[Explanation of symbols]

 2 Socket body 2a Convex part 4 Contact pin 6 Mold pedestal 6a Mold body guide 7 Mold pedestal stationary member 8 Spring 10 Lead holding member 80 QFP 82 Mold body 85 Lead

Claims (1)

[Claims] 1. A socket main body having a rectangular recess in the center, a plurality of contact pins arranged around the recess of the socket main body, and a molded body guide serving as a guide for a mold body of a semiconductor package. And a mold pedestal on which the mold body is placed,
Spring means for supporting the mold pedestal so that the mold pedestal can be displaced in the depth direction of the recess of the socket body; and the mold pedestal being stationary at a predetermined position in the depth direction of the recess of the socket body. An IC socket comprising: a mold pedestal stationary means that can be used; and a lead pressing means that presses a lead of the semiconductor package to make contact with the corresponding contact pin.