JP2003223964A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket in which the socket main body can be fixed and retained firmly and accurately positioned without any backlash to a test board and a printed-circuit board, and in which loading characteristics are improved by making the head part of a positioning pin as conical, hemispherical or spherical to make a mechanism vertically movable. <P>SOLUTION: In the IC socket having the socket main body, a plurality of Y-shaped or probe pin-shaped contacts arranged at the socket main body and a cover for pressing IC package, this has a positioning means for the purpose of accurately positioning in mounting the socket main body on the test board or printed-circuit board. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket having a positioning means for accurately positioning the socket body when mounting it on a test board or a printed board, and more particularly to a conical or spherical positioning pin. The present invention relates to an IC socket including a positioning means having

[0002]

2. Description of the Related Art Conventionally, in an IC package having an IC element as an electric component, the IC package is mounted on an IC socket formed by attaching a socket body to a test board or a printed board for various tests of the IC package. IC sockets such as high-frequency test sockets are known.

[0003]

A conventional IC as described above.
An example of the socket is shown in FIG. 3, which is a central longitudinal cross-sectional view when the conventional IC socket is attached to the test board, half of which is shown.

As shown in the figure, a conventional IC socket 100 includes a socket body 101 and a plurality of Y-shaped or probe pin-shaped contacts 102 arranged on the socket body 101 and pressed by an elastic pressing member 105. Pedestal 104 arranged on the socket body 101
IC package holding cover 103 for pressing the IC package 110 mounted on the IC package mounting portion 106 of
And a positioning pin 108 for positioning when the socket body 101 is attached to the test board 107 or a printed board, and the positioning pin 108 is positioned through the through hole 109 of the test board 107.

Such a conventional IC socket 100 is
It has a plurality of contacts 102 arranged in a socket body 101 made of an insulating material, and these contacts 102 are attached to a holder 112 by fixing screws 113 via an elastic member 105 such as rubber. Has been.

The contact 102 is formed, for example, in a substantially Y shape from an elastic metal plate by press working such as stamping and die cutting, and the upper side is divided into left and right parts and an arm-shaped contact portion 114.
And the lower end is projected to form the terminal portion 115.
Elastic member 105 such as rubber or the like.
It is pressed by and is brought into contact with the test board 107 and the electrode pad portion 116 of the printed board.

Therefore, for such a test as the IC socket 100, for example, as shown in the figure,
When the socket body 101 is attached to the test board 107 or the printed board, the positioning pin 108 for positioning is provided in the through hole 109 of the test board 107.
It is inserted, positioned and attached, and fixed with screws or the like.

However, in such a conventional IC socket 100, there is a gap between the positioning pin 108 and the through hole 109 due to the accuracy of the positioning pin 108 and the through hole 109 of the test board 107. The test board 107 has moved laterally as shown by the arrow with respect to the main body 101, and the contact portion 114 of the contact 102 and the test board 1
There is a problem that a gap occurs between the electrode 07 and the electrode pad portion 116, positioning is not accurately performed, and a contact failure or the like occurs.

Therefore, in order to solve the above-mentioned problems in the prior art, the object of the present invention is to make the head of the positioning pin a conical shape, a spherical shape, or a hemispherical shape so as to be movable in the vertical direction. An object of the present invention is to provide an IC socket such as a high-frequency test socket in which the main body can be firmly and accurately positioned and firmly fixed to a test board or a printed board without any rattling, and which has improved mountability.

[0010]

To achieve the above object, an IC socket of the present invention comprises a socket body, a plurality of Y-shaped or probe pin-shaped contacts arranged in the socket body, and an IC. An IC socket having a package pressing cover is characterized by having positioning means for accurately positioning the socket body when mounting the socket body on a test board or a printed board.

In the IC socket of the present invention, the positioning means has a positioning pin, and the positioning pin is vertically movably mounted on the socket body and is pressed by a spring member as an elastic member. Is characterized by.

Further, the IC socket of the present invention is characterized in that the positioning pin has a conical head portion and is pressed by the spring member.

Furthermore, in the IC socket of the present invention, the positioning pin has a hemispherical or spherical head portion,
It is characterized in that it is pressed by the spring member.

The IC socket of the present invention is characterized in that the contact is pressed by an elastic pressing member to exert a pressing force for contacting the test board or the printed board.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION (Example 1) IC according to the present invention
Embodiment 1 of the socket is shown in FIG. 1, with half of the central longitudinal section shown.

As shown in the drawings, the IC socket 1 according to the first embodiment of the present invention includes a socket body 2 and a plurality of Y-shaped or probes arranged in the socket body 2 and pressed by an elastic pressing member 4. The pin-shaped contact 3, the IC package holding cover 5 that presses the IC package 10 mounted on the IC package mounting portion 7 of the pedestal 6 arranged in the socket body 2, and the socket body 2 to the test board 8 or the printed board. It has a positioning means 9 for positioning it when it is mounted on. The positioning means 9 in the present invention has a positioning pin 12 and a spring member 13 for pressing the positioning pin 12, and the head of the positioning pin 12 is engaged with the through hole 14 of the test board 8 for positioning. Is configured to.

The IC socket 1 of the present invention as described above has a plurality of contacts 3 arranged in a socket body 2 made of an insulating material.
The holder 15 is held by being attached by a fixing screw 16 via an elastic pressing member 4 such as rubber.

The contact 3 is formed, for example, in a substantially Y shape from an elastic metal plate material by pressing such as embossing and die cutting, and forms a pair of arm-shaped contact portions 18 whose upper side is divided into left and right, The lower end is projected and formed as a terminal portion 19, is pressed by an elastic pressing member 4 such as rubber, and is brought into contact with the test board 8 and the electrode pad portion 17 of the printed board.

Further, in the IC socket 1 of the present invention, the positioning means 9 includes the positioning pin 12 elastically pressed by the spring member 13 such as a coil spring.
It is mounted so as to be movable in the vertical direction in the drawing and is pressed by the spring member 13 in a hole that is opened downward in the socket body 2 and that is closed at the top. In the present embodiment, the head of the positioning pin 12 is formed in a conical shape as shown.

Therefore, when the socket body 2 is attached to the test board 8 or the printed board as shown in the figure for the purpose of testing the IC socket 1 as described above, it serves as the positioning means 9 for positioning. The positioning pin 12 is positioned by engaging with the hole opening portion of the through hole 14 of the test board 8, and then the socket body 2 is fixed to the test board 8 by an appropriate mounting screw or the like.

In this case, since the conical head of the positioning pin 12 of the positioning means 9 is brought into close contact with the hole opening portion of the through hole 14 and engaged therewith, there is no rattling. The positioning pin 12 is firmly and accurately positioned and mounted.

(Embodiment 2) FIG. 2 shows an IC according to the present invention.
The Example 2 of a socket is shown and the half of a center longitudinal cross-sectional view is shown.

As shown in the figure, the IC socket 20 according to the second embodiment of the present invention has substantially the same structure as that of the above-mentioned first embodiment, and only the shape of the head of the positioning pin in the positioning means is different. Unlike the above embodiment, the head of the positioning pin is hemispherical in this embodiment.

That is, the IC according to the second embodiment of the present invention.
The socket 20 includes a socket body 22 and a plurality of Y-shaped or probe pin-shaped contacts 23 arranged on the socket body 22 and pressed by an elastic pressing member 24.
And an IC package holding cover 25 for pressing the IC package 10 mounted on the IC package mounting portion 27 of the pedestal 26 arranged in the socket body 22, and positioning when the socket body 22 is attached to the test board 28 or a printed board. Positioning means 29 for

The positioning means 29 according to the second embodiment of the present invention has a positioning pin 32 and a spring member 33 for pressing the positioning pin 12, and the positioning pin is provided in the through hole 34 of the test board 28. It is configured to engage and position 32 heads.

The IC socket 20 of the present invention as described above is
It has a plurality of contacts 23 arranged in a socket body 22 made of an insulating material, and these contacts 23 are held by a holder 35 by a fixing screw 36 via an elastic pressing member 24 such as rubber. It is held by being attached.

The contact 23 is made of an elastic metal plate material by press working such as stamping and stamping, similarly to the contact of the first embodiment, and has a pair of arm-shaped contact portions 38 formed on the upper side, Terminal part 3 with lower end protruding
It is formed as 9, and is pressed by an elastic pressing member 24 such as rubber, and comes into contact with the test board 28 and the electrode pad portion 37 of the printed board.

Further, in the IC socket 20 of the second embodiment of the present invention, the positioning means 29 has a positioning pin 32 elastically pressed by a spring member 33 such as a coil spring, and the socket body A hole that is open downward and is closed at the top is provided in 22 so as to be movable in the vertical direction in the figure, and is pressed by a spring member 33. Further, in this embodiment, the head of the positioning pin 32 is formed in a hemispherical shape as shown in the drawing. In addition, such a positioning pin 3
The head of 2 is not limited to the hemispherical shape as shown, but may be spherical, and if the horizontal cross-sectional shape is circular, it may be oval-shaped like a cocoon or any other shape. It goes without saying that any shape may be used as long as it has a shape that fits snugly and satisfactorily into the opening of the circular through hole 34. Therefore, the shape of the head of the positioning pin 32 can be formed in a regular polygonal shape such as a regular triangle shape or a regular square shape in addition to the hemispherical shape and the spherical shape.

Therefore, when the socket body 22 is attached to a test board 28 or a printed board as shown in the figure for the purpose of a test or the like in such an IC socket 20, the same as in the case of the first embodiment. A positioning pin 32 as a positioning means 29 for positioning
Is positioned by being engaged with the hole opening portion of the through hole 34 of the test board 28, and then the socket body 22 is fixed to the test board 28 with a mounting screw or the like.

In this case, since the hemispherical head of the positioning pin 32 of the positioning means 29 is brought into close contact with the hole opening portion of the through hole 34 to be engaged therewith, there is no rattling. Firmly and accurately the locating pins 32 are engaged, positioned and mounted.

[0032]

As described above, the IC socket according to claim 1 of the present invention includes a socket body, a plurality of Y-shaped or probe pin-shaped contacts arranged in the socket body, and an IC. An IC socket having a package pressing cover has a positioning means for accurately positioning when mounting the socket body on a test board or a printed board.
Since the head is a positioning pin of an appropriate shape such as a conical shape, a hemispherical shape, or a spherical shape, it is brought into close contact with the hole portion of the through hole of the test board to be engaged, so that there is no rattling. Firmly and accurately the locating pins are engaged and positioned for mounting.

The IC socket according to claim 2 of the present invention is
Since the positioning means has a positioning pin, and the positioning pin is mounted on the socket body so as to be vertically movable and is pressed by a spring member as an elastic member, the positioning pin can be moved in the vertical direction, and the spring member By appropriately pressing, it is possible to satisfactorily engage with a hole such as a through hole of a corresponding test board or the like, and it is possible to position accurately and without rattling.

The IC socket according to claim 3 of the present invention is
Since the positioning pin has a conical shape and is pressed by the spring member, the head of the positioning pin fits exactly into the hole of the through hole of the test board, the printed board, or the like, and there is no rattling. It can be accurately engaged without being engaged, and the wearability is improved.

The IC socket according to claim 4 of the present invention is
Since the positioning pin has a hemispherical shape or a spherical shape and is pressed by the spring member, the head of the positioning pin fits perfectly into the through hole of the through hole of the test board, the printed board, or the like without any gap. It can be engaged accurately without any rattling and can be accurately positioned, and can be easily manufactured.

In the IC socket according to the fifth aspect of the present invention, since the contact is pressed by the elastic pressing member to contact the test board or the print board, the contact is pressed. The force is well applied to the contact and the test board so that the contact can make good surface contact with the electrode pad portion and can be firmly held.

[Brief description of drawings]

FIG. 1 is a central longitudinal sectional view of an IC socket according to a first embodiment of the present invention, half of which is shown.

FIG. 2 is a central longitudinal sectional view of an IC socket according to a second embodiment of the present invention, half of which is shown.

FIG. 3 is a central longitudinal sectional view showing a positioning pin in a conventional IC socket, half of which is shown.

[Explanation of symbols]

1 IC socket 2 socket body 3 contacts 4 Elastic pressing member 5 Presser cover 6 pedestals 7 IC package mount 8 test board 9 Positioning means 10 IC package 11 IC lead 12 Positioning pin 13 Spring member 14 through holes 15 holder 16 Fixing screw 17 Electrode pad 18 Contact part 19 Terminal part 20 IC socket 22 Socket body 23 contacts 24 Elastic pressing member 25 Presser cover 26 pedestal 27 IC package mount 28 test boards 29 Positioning means 30 IC package 31 IC lead 32 Positioning pin 33 Spring member 34 through hole 35 holder 36 Fixing screw 37 Electrode pad 38 Contact part 39 terminal

Claims (5)

[Claims] 1. An IC socket having a socket body, a plurality of Y-shaped or probe pin-shaped contacts arranged in the socket body, and an IC package holding cover, wherein the socket body is a test board or a printed board. An IC socket characterized by having positioning means for accurately positioning when mounting. 2. The positioning means has a positioning pin, and the positioning pin is mounted on the socket body so as to be vertically movable and is pressed by a spring member as an elastic member. IC socket described in 1. 3. The IC socket according to claim 2, wherein the positioning pin has a conical head portion and is pressed by the spring member. 4. The IC socket according to claim 2, wherein a head of the positioning pin has a hemispherical shape or a spherical shape, and is pressed by the spring member. 5. The IC socket according to claim 1, wherein the contact is pressed by an elastic pressing member to exert a pressing force for contacting the test board or the printed board.