JP2005268574A - Contact sheet, lsi packaging structure and lsi packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact sheet, an LSI packaging structure and an LSI packaging method for packaging an LSI package on a printed substrate properly at a low cost. <P>SOLUTION: The contact sheet 5 of the LSI packaging structure 1 is formed of an insulator to a plane shape of a prescribed thickness. A solder bump receptacle 5a to allow a solder bump 13 of the LSI package 10 to enter is formed in the upper surface side of the plane. A conductive pat adapter 5b which comes into contact with the solder bump 13 entering the solder bump receptacle 5a and comes into contact with a foot pattern 21 of a printed substrate 20 is formed in the lower surface side of the plane. The solder bump 13 of the LSI package 10 which is inserted between the printed substrate 20 and the LSI package 10 and packaged on the printed substrate 20 is brought into contact with the pat adapter 5b while being held by the solder bump receptacle 5a, and the solder bump 13 is brought into contact with the foot pattern 21 of the printed substrate 20 via the pat adapter 5b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a contact sheet, an LSI mounting structure, and an LSI mounting method, and more particularly, to a contact sheet, an LSI mounting structure, and an LSI mounting method for mounting an LSI package on a printed board inexpensively and appropriately.

  As the functionality of the system increases, the need for multi-pin module parts, such as multi-pin LSI (Large Scale Integration) and MCM (Multi Chip Module), is increasing. It has changed from Quad Flat Package) to BGA (Ball Grid Array) structure.

  Today, as an LSI mounting method for mounting a surface-mount LSI on a printed circuit board in a replaceable manner, solder balls are formed in an array at the position of the printed circuit board corresponding to the electrode terminals of the area array component, and the electrodes of the area array component Soldering method for soldering terminals, and converting to another shape such as lead terminals such as connectors and sockets described in Patent Document 1, Patent Document 2 and Patent Document 3, etc. The LSI mounting method is adopted.

  Conventionally, an integrated circuit package having a through opening is superposed on a substrate having an opening corresponding to the opening in the integrated circuit package so that the opening of the integrated circuit package and the opening of the substrate are opposed to each other. An integrated circuit package mounting method is proposed in which a fixing member is detachably inserted into the opening of the integrated circuit package and the opening of the substrate, and the integrated circuit package and the substrate are fixed by crimping and electrically connected. (See Patent Document 4).

  That is, in this integrated circuit package mounting method, a surface opening LSI package is provided with a through opening, and the through opening is fixedly mounted on a printed board using a screw.

JP-A-7-273422 JP-A-8-37255 JP-A-9-219267 JP 11-233923 A

  However, in the above prior art, the LSI printed circuit board and the socket mounting printed circuit board can be shared in the conventional technique for socket mounting the LSI using the printed circuit board foot pattern as it is. However, once the socket is mounted, the printed circuit board cannot be directly mounted on the LSI, and there is a problem that the usability is poor.

  In addition, in the conventional technology for manufacturing a printed circuit board exclusively for sockets from the beginning, it is necessary to manufacture it separately from the printed circuit board on which LSI is directly mounted, which increases the development cost and the price. There was a problem that management was also necessary.

  Furthermore, in the prior art described in Patent Document 3, it is necessary to use a special package different from a normal package and mount it using a tool, which is not versatile and requires a special tool for work. As a result, there is a problem that the unit price of work is also increased.

  Accordingly, the invention according to claim 1 is formed in a planar shape having a predetermined thickness with an insulator, and a concave solder bump receiver into which a solder bump of the LSI package can enter is provided on the upper surface side of the planar surface. A conductive pad adapter that is in contact with the solder bump that has entered the solder bump receiver and is in contact with the foot pattern of the printed circuit board is formed on the lower surface side of the plane, and the foot pattern is formed. Solder bumps that contact the printed circuit board and the foot pattern are formed on the lower surface and inserted between the LSI package mounted on the printed circuit board, and the solder bumps of the LSI package mounted on the printed circuit board are held by the solder bump receiver While making contact with the pad adapter, By bringing the solder bumps into contact with the printed circuit board foot pattern via the stopper, the solder bumps of the LSI package are stably brought into contact with the printed circuit board foot pattern through the pad adapter while minimizing the processing to the printed circuit board. An object of the present invention is to provide a contact sheet that has versatility and allows an LSI package to be mounted on a printed circuit board at a low cost and appropriately.

  The invention according to claim 2 is formed by forming a slit in the solder bump receiver in a state where the solder bump receiver is opened and opened in response to the entry of the solder bump to hold and fix the solder bump in the solder bump receiver. Provided is a contact sheet for securely mounting a solder bump of an LSI package on a printed circuit board via a pad adapter while stably holding the solder bump of the LSI package, and mounting the LSI package on the printed circuit board more inexpensively. The purpose is that.

  According to a third aspect of the present invention, an LSI package in which solder bumps are formed and a holding biasing member that biases the LSI package in the solder bump direction while holding the LSI package are faced to the outside from the opening. The mounting cover is housed in the mounting cover, the solder bump of the LSI package is aligned with the foot pattern of the printed circuit board, the mounting cover is fixed to the printed circuit board with a fixing member, and the LSI package is mounted with the holding biasing member. When mounting the LSI package on the printed circuit board by urging it in the direction of the printed circuit board, it is formed into a planar shape with a predetermined thickness with an insulator, and a concave shape into which the solder bumps of the LSI package can enter on the upper surface side. The solder bump receiver corresponds to the solder bump of the LSI package. A conductive pad adapter is formed on the lower surface side of the LSI package so as to be in contact with the solder bump that has entered the solder bump receiver and to be in contact with the foot pattern of the printed circuit board, while holding the solder bump of the LSI package with the solder bump receiver. A contact sheet that contacts the pad adapter and contacts the solder bumps to the foot pattern of the printed circuit board via the pad adapter is interposed between the LSI package and the printed circuit board, thereby minimizing the processing to the printed circuit board. Provided is an LSI mounting structure that stably contacts a solder bump of an LSI package with a foot pattern of a printed circuit board through a contact sheet, has versatility, and mounts the LSI package on the printed circuit board inexpensively and appropriately. For the purpose That.

  According to a fourth aspect of the present invention, an LSI package in which solder bumps are formed and a holding urging member that urges the LSI package in the solder bump direction while holding the LSI package are in a state where the solder bumps of the LSI package face each other from the opening. The mounting cover is housed in the mounting cover, the solder bump of the LSI package is aligned with the foot pattern of the printed circuit board, the mounting cover is fixed to the printed circuit board with a fixing member, and the LSI package is mounted with the holding biasing member. When mounting the LSI package on the printed circuit board by urging it in the direction of the printed circuit board, it is formed into a planar shape with a predetermined thickness with an insulator, and a concave shape into which the solder bumps of the LSI package can enter on the upper surface side. The solder bump receiver corresponds to the solder bump of the LSI package. A conductive pad adapter is formed on the lower surface side of the LSI package so as to be in contact with the solder bump that has entered the solder bump receiver and to be in contact with the foot pattern of the printed circuit board, while holding the solder bump of the LSI package with the solder bump receiver. A contact sheet that contacts the pad adapter and contacts the solder bumps to the foot pattern of the printed circuit board via the pad adapter is interposed between the LSI package and the printed circuit board, thereby minimizing the processing to the printed circuit board. Provided is an LSI mounting method in which a solder bump of an LSI package is stably brought into contact with a foot pattern of a printed circuit board through a contact sheet, and has versatility, and the LSI package is mounted on the printed circuit board at low cost and appropriately. For the purpose That.

  According to the fifth aspect of the present invention, the fixing member is formed on the outer peripheral lower surface of the mounting cover so as to protrude toward the printed circuit board, and enters a locking hole formed in the printed circuit board around the foot pattern to be engaged with the printed circuit board. By using the locking legs to stop, the processing on the printed circuit board is further reduced, and the mounting cover is fixed to the printed circuit board easily and reliably, and the LSI package is mounted on the printed circuit board more inexpensively and appropriately. An object is to provide an LSI mounting structure and an LSI mounting method.

  The invention according to claim 6 is characterized in that the holding biasing member is inserted between the supporter and the mounting cover, and a spring for biasing the supporter in the direction of the LSI package. The solder bumps of the LSI package are more easily and appropriately brought into contact with the foot pattern of the printed circuit board through the contact sheet, and the LSI package is mounted on the printed circuit board more inexpensively and appropriately. An object is to provide an LSI mounting structure and an LSI mounting method.

  According to a first aspect of the present invention, there is provided a printed sheet having a printed circuit board on which a foot pattern is formed, and a solder bump that is in contact with the foot pattern on a lower surface. A contact sheet inserted between the LSI package mounted on the substrate, and a concave solder bump receiver into which the solder bump of the LSI package can enter is provided on the upper surface side of the contact sheet. A conductive pad adapter that is formed at a position corresponding to the solder bump and is in contact with the solder bump that has entered the solder bump receiver and is in contact with the foot pattern of the printed circuit board is formed on the lower surface side of the contact sheet. The solder bump of the LSI package mounted on a printed circuit board Wherein while maintaining at solder bumps receiving into contact with the pad adapter, by contacting the solder bumps to the foot pattern of the printed circuit board through the pad adapters have achieved the above objects.

  In this case, for example, as described in claim 2, the contact sheet opens to the solder bump receiver in response to the entry of the solder bump in the state where the solder bump receiver is opened, and opens the solder bump to the solder bump. A slit that is held and fixed in the receiver may be formed.

  According to a third aspect of the present invention, there is provided an LSI mounting structure, wherein an LSI package in which solder bumps are formed and a holding biasing member that biases the LSI package in the solder bump direction while holding the LSI package are opened from the opening to the solder bumps of the LSI package. The LSI package is housed in the mounting cover in a state of facing, and the mounting cover is fixed to the printed board with a fixing member in a state where the solder bumps of the LSI package are aligned with the foot pattern of the printed board. An LSI mounting structure in which the LSI package is mounted on the printed board by being biased in the direction of the printed board by a holding biasing member, and is formed in a planar shape with a predetermined thickness with an insulator. A concave-shaped solder bump receiver, into which the solder bump of the LSI package can enter, is applied. A conductive pad adapter that is formed at a position corresponding to the solder bump of the LSI package and is in contact with the solder bump that has entered the solder bump receiver and is in contact with the foot pattern of the printed circuit board is formed on the lower surface side thereof. A contact sheet for holding the solder bump of the LSI package in contact with the pad adapter while holding the solder bump by the solder bump receiver, and contacting the solder bump with the foot pattern of the printed board through the pad adapter, the LSI package and the printed board The above-mentioned purpose is achieved by interposing between.

  According to a fourth aspect of the present invention, there is provided an LSI mounting method comprising: an LSI package in which solder bumps are formed; a holding biasing member that biases the LSI package in the solder bump direction while holding the LSI package; The LSI package is housed in the mounting cover in a state of facing, and the mounting cover is fixed to the printed board with a fixing member in a state where the solder bumps of the LSI package are aligned with the foot pattern of the printed board. An LSI mounting method of mounting the LSI package on the printed circuit board by urging the printed circuit board by a holding biasing member, which is formed in a planar shape with a predetermined thickness with an insulator, A concave-shaped solder bump receiver, into which the solder bump of the LSI package can enter, is applied. A conductive pad adapter that is formed at a position corresponding to the solder bump of the LSI package and is in contact with the solder bump that has entered the solder bump receiver and is in contact with the foot pattern of the printed circuit board is formed on the lower surface side thereof. A contact sheet for holding the solder bump of the LSI package in contact with the pad adapter while holding the solder bump by the solder bump receiver, and contacting the solder bump with the foot pattern of the printed board through the pad adapter, the LSI package and the printed board The above-mentioned purpose is achieved by interposing between.

  In the case of claim 3 or claim 4, for example, as described in claim 5, the fixing member is formed on the outer peripheral lower surface of the mounting cover so as to protrude toward the printed circuit board, and the periphery of the foot pattern is It may be a locking leg that enters a locking hole formed in the printed board and locks to the printed board.

  For example, as described in claim 6, the holding biasing member is inserted between a supporter that holds an upper surface portion of the LSI package and the supporter and the mounting cover, and the supporter is inserted into the supporter. And a spring urging in the direction of the LSI package.

  According to the contact sheet of the first aspect of the present invention, a concave solder bump receiver that is formed in a planar shape with a predetermined thickness with an insulator and into which a solder bump of the LSI package can enter is provided on the upper surface side of the planar surface. A conductive pad adapter is formed on the lower surface side of the plane, and is in contact with the solder bump that has entered the solder bump receiver and is in contact with the foot pattern of the printed circuit board. Solder bumps that are in contact with the formed printed circuit board and the foot pattern are formed on the lower surface and inserted between the LSI package mounted on the printed circuit board, and the solder bumps of the LSI package mounted on the printed circuit board are solder bumps. While holding it with a receiver, touch the pad adapter Since the solder bump is brought into contact with the foot pattern of the printed circuit board through the pad adapter, the solder bump of the LSI package can be stably brought into contact with the foot pattern of the printed circuit board through the pad adapter while minimizing the processing to the printed circuit board. In addition, the LSI package can be provided with versatility, and the LSI package can be appropriately and inexpensively mounted on the printed board.

  According to the contact sheet of the second aspect of the present invention, a slit for holding and fixing the solder bump in the solder bump receiver by opening the solder bump receiver in the state where the solder bump receiver is opened in the state where the solder bump receiver is opened. Since it is formed, the solder bumps of the LSI package can be held in a more stable manner, and can be reliably brought into contact with the foot pattern of the printed circuit board via the pad adapter. Can be implemented on top.

  According to the LSI mounting structure of the third aspect of the present invention, the LSI package in which the solder bump is formed and the holding biasing member that biases the LSI package in the solder bump direction while holding the LSI package are opened from the opening to the solder bump of the LSI package. The LSI package is housed in the mounting cover in a state of facing, and the mounting cover is fixed to the printed board with a fixing member in a state where the solder bumps of the LSI package are aligned with the foot pattern of the printed board. When the LSI package is mounted on the printed circuit board by being urged in the direction of the printed circuit board by the holding urging member, it is formed in a planar shape with a predetermined thickness with an insulator, and the solder bump of the LSI package is formed on the upper surface side thereof. A concave solder bump receiver that can enter the LSI package A conductive pad adapter that is formed at a position corresponding to the solder bump and is in contact with the solder bump that has entered the solder bump receiver and in contact with the foot pattern of the printed circuit board is formed on the lower surface side of the solder bump. Since the contact sheet for contacting the solder bump with the foot pattern of the printed circuit board through the pad adapter is interposed between the LSI package and the printed circuit board, the printed circuit board is attached to the printed circuit board. The LSI package solder bumps can be brought into contact with the foot pattern of the printed circuit board via the contact sheet stably while minimizing the processing, and can be made versatile, and the LSI package can be printed at low cost and appropriately. Mounted on board Rukoto can.

  According to the LSI mounting method of the invention described in claim 4, the LSI package in which the solder bumps are formed and the holding biasing member that biases the LSI package in the solder bump direction while holding the LSI package are opened from the opening to the solder bump of the LSI package. The LSI package is housed in the mounting cover in a state of facing, and the mounting cover is fixed to the printed board with a fixing member in a state where the solder bumps of the LSI package are aligned with the foot pattern of the printed board. When the LSI package is mounted on the printed circuit board by being urged in the direction of the printed circuit board by the holding urging member, it is formed in a planar shape with a predetermined thickness with an insulator, and the solder bump of the LSI package is formed on the upper surface side thereof. A concave solder bump receiver that can enter the LSI package A conductive pad adapter that is formed at a position corresponding to the solder bump and is in contact with the solder bump that has entered the solder bump receiver and in contact with the foot pattern of the printed circuit board is formed on the lower surface side of the solder bump. Since the contact sheet for contacting the solder bump with the foot pattern of the printed circuit board through the pad adapter is interposed between the LSI package and the printed circuit board, the printed circuit board is attached to the printed circuit board. The LSI package solder bumps can be brought into contact with the foot pattern of the printed circuit board via the contact sheet stably while minimizing the processing, and can be made versatile, and the LSI package can be printed at low cost and appropriately. Mounted on board Rukoto can.

  According to the LSI mounting structure and the LSI mounting method of the invention described in claim 5, the fixing member is formed on the outer peripheral lower surface of the mounting cover so as to protrude toward the printed circuit board, and is formed on the printed circuit board around the foot pattern. Since it is a locking leg that enters the hole and locks to the printed circuit board, the processing to the printed circuit board can be further reduced, and the mounting cover can be fixed to the printed circuit board easily and reliably, It is possible to mount the LSI package on the printed circuit board more inexpensively and appropriately.

  According to the LSI mounting structure and the LSI mounting method of the invention described in claim 6, the support biasing member is inserted between the supporter for holding the upper surface portion of the LSI package and the supporter and the mounting cover, and the supporter And a spring for biasing the LSI package in the direction of the LSI package, the solder bumps of the LSI package can be more easily and appropriately brought into contact with the foot pattern of the printed circuit board via the contact sheet. It can be mounted on the printed circuit board at a lower cost and appropriately.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, since the Example described below is a suitable Example of this invention, various technically preferable restrictions are attached | subjected, However, The scope of the present invention limits this invention especially in the following description. As long as there is no description of the effect, it is not restricted to these aspects.

  1 to 9 are diagrams showing an embodiment of the contact sheet, LSI mounting structure, and LSI mounting method of the present invention, and FIG. 1 is an embodiment of the contact sheet, LSI mounting structure, and LSI mounting method of the present invention. It is a perspective view of LSI mounting structure 1 to which an example is applied.

  In FIG. 1, an LSI mounting structure 1 is for mounting a BGA type LSI package 10 on a BGA printed circuit board (printed circuit board) 20, and as shown in FIG. 2, a BGA cover (mounting cover) 2, a spring 3. , BGA supporter (supporter) 4 and BGA contact sheet (contact sheet) 5 are provided.

  The BGA printed circuit board 20 is formed with a BGA foot pattern (foot pattern) 21 and four BGA cover fixing holes (locking holes) 22 a to 22 d. The BGA foot pattern 21 is formed on the LSI package 10. It is formed at a position corresponding to each of the plurality of solder bumps 13 (see FIGS. 2 and 3), and comes into contact with the solder bump 13 during mounting. The BGA cover fixing holes 22 a to 22 d are formed at the positions of the four corners of the outer periphery of the BGA foot pattern 21.

  As shown in FIGS. 2 and 3, the BGA type LSI package 10 has an LSI main body 12 mounted on a substrate 11 and solder bumps 13 as lead terminals formed on the lower portion of the substrate 11. .

  2 to 4, the BGA contact sheet 5 is formed into a sheet shape having a predetermined thickness and approximately the same size as the substrate 11 of the LSI package 10 by insulating rubber (insulator). Solder bump receptacles 5a and pad adapters 5b are formed on the front and back surfaces of the printed circuit board 20 for BGA and the positions corresponding to the solder bumps 13 of the LSI package 10, respectively.

  The solder bump receiver 5a has an inverted conical shape as shown in FIG. 5 depicting only the shapes of the solder bump receiver 5a and the pad adapter 5b in FIGS. In addition, a slit 5c is formed on the side surface in the conical vertical direction.

  The solder bump receiver 5 a has such a shape that when the solder bump 13 of the LSI package 10 is received, the solder bump 13 receives a force pressed against the solder bump receiver 5 a portion of the BGA contact sheet 5, so that the slit 5 c opens naturally and holds the solder bump 13. Become. That is, as shown in FIG. 6, the solder bump 13 is placed on the solder bump receiver 5a, and further pressed as shown in FIG. 7, so that the slit 5c is solidified with insulating rubber. For this reason, the solder bumps 13 are not opened more than necessary, and when the pressure is applied to the solder bumps 13, the solder bumps 5 a itself are opened as shown in FIG. 7 due to the stress of the solder bump receiver 5 a itself and the elasticity of the insulating rubber of the BGA contact sheet 5. Then, the solder bump 13 is received and fixed.

  The solder bump receiver 5a is formed such that the bottom surface thereof communicates with the conductive pad adapter 5b, which is an upward conical terminal metal, and the solder bump 13 is placed and pressed into the solder bump receiver 5a. As a result, the slit 5c of the solder bump receiver 5a is opened by the pressing force, and the solder bump receiver 5a is securely received and is pressed against and contacted with the upper end of the pad adapter 5b.

  The pad adapter 5b is arranged in accordance with the position of the BGA foot pattern 21 of the BGA printed circuit board 20, and the solder bump 13 in the solder bump receiver 5a is pressed toward the BGA printed circuit board 20 while being in contact with the BGA printed circuit board 20. Pressed against the foot pattern 21 for holding, the contact between the LSI package 10 and the BGA foot pattern 21 is maintained.

  As shown in FIGS. 2 and 3, the BGA supporter 4 is formed in a cap shape with a substantially flat upper surface, and is arranged in contact with the upper surface of the LSI package 10. In the BGA supporter 4, a recess 4 a for storing the LSI main body 12 of the LSI package 10 is formed on the lower surface, which is the surface of the LSI package 10, and the LSI main body 12 is mounted on the substrate 11 of the LSI package 10. Covered in the stowed state. The BGA supporter 4 has a protrusion 4b formed on its upper surface (the surface opposite to the LSI package 10), and the protrusion 3b fixes the spring 3 placed on the upper surface of the BGA supporter 4. The BGA supporter 4 stores the LSI package 10 in the recess 4a on the lower surface thereof, thereby appropriately fixing the position of the BGA package LSI package 10 with respect to the BGA foot pattern 21 and the BGA printed circuit board 20, and the spring 3 The BGA package LSI package 10 is made to work with a constant repulsive force. Therefore, the spring 3 and the BGA supporter 4 function as holding and biasing means as a whole.

  The BGA cover 2 is formed in a substantially rectangular cap shape, and has a size and depth that can accommodate the BGA package LSI package 10, the BGA supporter 4, and the spring 3. The BGA cover 2 has a protrusion 2i protruding inward (downward) on the upper surface of the inside, and the spring 3 is positioned and fixed by the protrusion 2i. Further, the BGA cover 2 has nail insertion legs (locking legs) 2a to 2b inserted into the BGA cover fixing holes (locking holes) 22a to 22d formed in the BGA printed circuit board 20 in the lower square. 2d is formed, and the nail-like protrusions 2e projecting inwardly engaging with the BGA printed circuit board 20 when entering the BGA cover fixing holes 22a to 22d are inserted into the insertion legs 2a to 2d with claws. ~ 2h are formed.

  The spring 3 is a compression spring, and is housed between the BGA cover 2 and the BGA foot supporter 4, and is fitted and fixed to the protrusion 2 i of the BGA cover 2 and the protrusion 4 b of the BGA foot supporter 4. The spring 3 urges the BGA cover 2 and the BGA foot supporter 4 in the direction of separating them by the repulsive force, and the insertion legs 2a to 2d with claws of the BGA cover 2 fix the BGA cover of the BGA printed circuit board 20. When inserted and fixed in the holes 22a to 22d, the LSI package 10 and the BGA contact sheet 5 are urged toward the BGA printed circuit board 20 via the BGA supporter 4, and the solder bumps 13 of the LSI package 10 are moved to the BGA. The BGA contact sheet 5 is securely held on the solder bump receiver 5a of the contact sheet 5 and the solder bump 13 of the LSI package 10 is brought into contact with the pad adapter 5b pressed against the BGA print pattern 21 of the BGA printed circuit board 20. The solder bumps 13 of the LSI package 10 are attached to the BGA printed circuit board 2 via It is connected to each of the BGA printed pattern 21.

  Next, the operation of this embodiment will be described. In the LSI mounting structure 1 of this embodiment, when the LSI package 10 is surface-mounted on the BGA printed circuit board 20, first, the BGA contact is formed on the BGA printed pattern 21 of the BGA printed circuit board 20 on which the LSI package 10 is surface mounted. The sheet 5 is arranged, and the pad adapter 5b of the BGA contact sheet 5 and the BGA print pattern 21 are aligned.

  Next, the BGA supporter 4 is placed in a state where the LSI main body 12 of the LSI package 10 is housed in the recess 4a on the lower surface, the spring 3 is fixed to the protrusion 4b on the upper surface of the BGA supporter 4, and the BGA The cover 2 is covered in a state where the spring 3 is fixed by the protrusion 2 i on the inner upper surface of the BGA cover 2.

  On the other hand, the BGA contact sheet 5 is placed on the BGA printed circuit board 20 by aligning the pad adapter 5b of the BGA contact sheet 5 and the BGA printed pattern 21 of the BGA printed circuit board 20.

  The BGA cover 2 containing the LSI package 10, the BGA supporter 4 and the spring 3 is positioned and placed on the BGA contact sheet 5 on the BGA printed circuit board 20, as shown in FIG. At this time, the solder bump 13 of the LSI package 10 is aligned with the solder bump receiver 5a of the BGA contact sheet 5, and the BGA cover 2 is placed in a state where the solder bump 13 is accommodated in the solder bump receiver 5a.

  Next, the BGA cover 2 is pressed in the direction of the BGA printed circuit board 20 as indicated by an arrow in FIG. 8, and the insertion legs 2 a to 2 d with claws are connected to the BGA printed circuit board 20 as shown in FIG. 9. Are inserted into the BGA cover fixing holes 22a to 22d, and the protrusions 2e to 2h of the insertion legs 2a to 2d with claws are engaged with and fixed to the BGA printed circuit board 20.

  When the BGA cover 2 is fixed to the BGA printed circuit board 20, the spring 3 in the BGA cover 2 urges the LSI package 10 and the BGA contact sheet 5 toward the BGA printed circuit board 20 via the BGA supporter 4. Thus, the solder bump 13 of the LSI package 10 is securely held on the solder bump receiver 5a of the BGA contact sheet 5, and the solder bump 13 of the LSI package 10 is pressed against the BGA print pattern 21 of the BGA printed circuit board 20. Then, each solder bump 13 of the LSI package 10 is connected to each BGA print pattern 21 of the BGA printed circuit board 20 through the BGA contact sheet 5.

  As described above, the contact sheet 5 of the LSI mounting structure 1 according to the present embodiment is formed in a planar shape with a predetermined thickness with an insulator, and a concave shape into which the solder bumps 13 of the LSI package 10 can enter on the upper surface side of the plane. The solder bump receiver 5a is formed at a position corresponding to the solder bump 13 of the LSI package 10, and is in contact with the solder bump 13 entering the solder bump receiver 5a and in contact with the foot pattern 21 of the printed circuit board 20 on the lower surface side of the plane. The pad adapter 5b is formed, and the printed circuit board 20 on which the foot pattern 21 is formed and the solder bump 13 in contact with the foot pattern 21 are formed on the lower surface and inserted between the LSI package 10 mounted on the printed circuit board 20. Of the LSI package 10 mounted on the printed circuit board 20 Pump 13 is brought into contact with the pad adapter 5b while holding in the solder bump receiving 5a and are brought into contact with solder bumps 13 through the pad adapter 5b the foot pattern 21 of the printed circuit board 20.

  Therefore, the solder bump 13 of the LSI package 10 can be stably brought into contact with the foot pattern 21 of the printed circuit board 20 through the pad adapter 5b while minimizing the processing on the printed circuit board 20, and versatility can be provided. The LSI package 10 can be mounted on the printed circuit board 20 at a low cost and appropriately.

  Further, the contact sheet 5 of the LSI mounting structure 1 of the present embodiment is opened in response to the entry of the solder bump 13 in the state where the solder bump receiver 5a is opened at the portion where the solder bump receiver 5a is formed. A slit 5c is formed to be held and fixed.

  Accordingly, the solder bump 13 of the LSI package 10 can be reliably brought into contact with the foot pattern 21 of the printed circuit board 20 via the pad adapter 5b while holding the solder bump 13 more stably, and the LSI package 10 can be made more inexpensively and more appropriately. It can be mounted on the printed circuit board 20.

  Further, the LSI mounting structure 1 and the LSI mounting method according to the present embodiment include an LSI package 10 on which solder bumps 13 are formed and a spring 3 as a holding biasing member that holds the LSI package 10 and biases it toward the solder bump 13. And the BGA supporter 4 are accommodated in the mounting cover 2 with the solder bumps 13 of the LSI package 10 facing the outside through the openings, and the solder bumps 13 of the LSI package 10 are aligned with the foot patterns 21 of the printed circuit board 20. The mounting cover 20 is fixed to the printed circuit board 20 by the insertion legs 2a to 2d with claws formed with the protrusions 2e to 2h which are fixing members, and the LSI 3 is supported by the spring 3 which is a holding biasing member and the BGA supporter 4 to bias the LSI package 10 on the printed circuit board 20 At the time of mounting, it is formed in a planar shape with a predetermined thickness with an insulator, and on its upper surface side, a concave solder bump receiver 5a into which the solder bump 13 of the LSI package 10 can enter is located at a position corresponding to the solder bump 13 of the LSI package 10. A conductive pad adapter 5b that is in contact with the solder bump 13 that has entered the solder bump receiver 5a and that is in contact with the foot pattern 21 of the printed circuit board 20 is formed on the lower surface side of the solder bump receiver 5a. The contact sheet 5 for contacting the solder bump 13 with the foot pattern 21 of the printed circuit board 20 through the pad adapter 5b is interposed between the LSI package 10 and the printed circuit board 20 while being held in contact with the pad adapter 5b. Yes.

  Therefore, the solder bump 13 of the LSI package 10 can be stably brought into contact with the foot pattern 21 of the printed circuit board 20 through the contact sheet 5 while minimizing the processing on the printed circuit board 20 and has versatility. The LSI package 10 can be mounted on the printed circuit board 20 at a low cost and appropriately.

  In addition, the LSI mounting structure 1 and the LSI mounting method of the present embodiment are formed on the printed circuit board 20 around the foot pattern 21 as a fixing member, protruding from the outer peripheral lower surface of the mounting cover 2 toward the printed circuit board 20. It is set as the insertion leg 2a-2d with a nail | claw which penetrates into the BGA cover fixing holes 22a-22d which are locking holes, and latches to the printed circuit board 20.

  Therefore, the processing on the printed circuit board 20 can be further reduced, the mounting cover 2 can be fixed to the printed circuit board 20 easily and reliably, and the LSI package 10 can be more appropriately and inexpensively printed. Can be implemented on top.

  Further, in the LSI mounting structure 1 and the LSI mounting method of the present embodiment, the BGA foot supporter 4 that holds the upper surface portion of the LSI package 10 as a holding biasing member, and the BGA foot supporter 4 and the mounting cover 2 are provided. And a spring 3 that urges the BGA foot supporter 4 toward the LSI package 10.

  Therefore, the solder bump 13 of the LSI package 10 can be more easily and appropriately brought into contact with the foot pattern 21 of the printed circuit board 20 via the contact sheet 5, and the LSI package 10 can be more appropriately and cheaply mounted on the printed circuit board 20. Can be implemented.

  The invention made by the present inventor has been specifically described based on the preferred embodiments. However, the present invention is not limited to the above, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The LSI can be applied to a BGA contact sheet, an LSI mounting structure, and an LSI mounting method that are surface-mounted on a printed board at a low cost and appropriately in a state of general versatility.

1 is an exploded perspective view of an LSI mounting structure to which one embodiment of a contact sheet, an LSI mounting structure and an LSI mounting method of the present invention are applied. FIG. 2 is a front sectional view of the LSI mounting structure of FIG. 1. The exploded front view of the LSI mounting structure of FIG. FIG. 3 is an enlarged front sectional view of a solder bump receiver and a pad adapter portion of the BGA contact sheet of FIG. 1. Explanatory drawing of the solder bump receiver and pad adapter of FIG. FIG. 5 is an enlarged perspective view of a solder bump receiver and a pad adapter in a state where the solder bump is placed on the solder bump receiver of FIG. 4. FIG. 7 is an enlarged perspective view of a state in which the solder bump of FIG. 6 is placed on and pressed against a solder bump receiver. FIG. 2 is a front view showing a state in which it is aligned with a printed circuit board for BGA having the LSI mounting structure of FIG. 1. FIG. 9 is a front view of a state in which the BGA cover having the LSI mounting structure of FIG. 8 is mounted by being engaged with a BGA printed board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LSI mounting structure 2 BGA cover 2a-2d Insertion leg with nail | claw 2i Protrusion 3 Spring 4 BGA supporter 4a Dimple 4b Protrusion 5 BGA contact sheet 5a Solder bump receiving 5b Put adapter 5c Slit 10 LSI package 11 Substrate 12 LSI main body 13 Solder bump 20 Printed circuit board for BGA 21 Foot pattern for BGA 22a-22d BGA cover fixing hole

Claims (6)

  A printed circuit board that is formed in a planar shape with a predetermined thickness with an insulator and has a foot pattern formed thereon, and an LSI package that is mounted on the printed circuit board with solder bumps that contact the foot pattern formed on the lower surface. A contact sheet inserted in between, and on the upper surface side of the contact sheet, a concave solder bump receiver into which the solder bump of the LSI package can enter is formed at a position corresponding to the solder bump of the LSI package, On the lower surface side of the contact sheet, a conductive pad adapter that contacts the solder bump that has entered the solder bump receiver and contacts the foot pattern of the printed circuit board is formed, and the LSI package mounted on the printed circuit board. While holding the solder bump with the solder bump receiver Contact sheets serial contacting the pad adapter, and wherein the contacting the solder bump through the pad adapter to the foot pattern of the printed circuit board.   The contact sheet is formed with a slit in the solder bump receptacle forming portion that is opened to the solder bump receptacle and opens in response to the entry of the solder bump to hold and fix the solder bump in the solder bump receptacle. The contact sheet according to claim 1, wherein   An LSI package in which solder bumps are formed and a holding urging member that urges the LSI package in the solder bump direction while holding the LSI package are housed in the mounting cover with the solder bumps of the LSI package facing outside from the opening. The mounting cover is fixed to the printed board with a fixing member in a state where the solder bump of the LSI package is aligned with the foot pattern of the printed board, and the LSI package is biased toward the printed board with the holding biasing member. An LSI mounting structure for mounting the LSI package on the printed circuit board, which is formed into a planar shape with a predetermined thickness with an insulator, and has a concave shape into which the solder bumps of the LSI package can enter on the upper surface side. Solder bump receiver on the solder bump of the LSI package A conductive pad adapter is formed on the lower surface side of the LSI package so as to be in contact with the solder bump that has entered the solder bump receiver and in contact with the foot pattern of the printed circuit board. A contact sheet that is brought into contact with the pad adapter while being held by the solder bump receiver and that makes the solder bump contact with the foot pattern of the printed board through the pad adapter is interposed between the LSI package and the printed board. An LSI mounting structure characterized in that   An LSI package in which solder bumps are formed and a holding urging member that urges the LSI package in the solder bump direction while holding the LSI package are housed in the mounting cover with the solder bumps of the LSI package facing outside from the opening. The mounting cover is fixed to the printed board with a fixing member in a state where the solder bump of the LSI package is aligned with the foot pattern of the printed board, and the LSI package is biased toward the printed board with the holding biasing member. An LSI mounting method for mounting the LSI package on the printed circuit board, which is formed in a planar shape with a predetermined thickness with an insulator, and has a concave shape into which the solder bumps of the LSI package can enter the upper surface side. Solder bump receiver on the solder bump of the LSI package A conductive pad adapter is formed on the lower surface side of the LSI package so as to be in contact with the solder bump that has entered the solder bump receiver and in contact with the foot pattern of the printed circuit board. A contact sheet that is brought into contact with the pad adapter while being held by the solder bump receiver and that makes the solder bump contact with the foot pattern of the printed board through the pad adapter is interposed between the LSI package and the printed board. An LSI mounting method characterized by:   The fixing member is formed on the lower surface of the outer periphery of the mounting cover so as to protrude toward the printed circuit board, and enters the engagement hole formed in the printed circuit board around the foot pattern to be engaged with the printed circuit board. The LSI mounting structure according to claim 3 or the LSI mounting method according to claim 4, wherein the LSI mounting structure is a stop leg. The holding biasing member includes a supporter that holds the upper surface portion of the LSI package, and a spring that is inserted between the supporter and the mounting cover and biases the supporter in the direction of the LSI package. 6. The LSI mounting structure or the LSI mounting method according to claim 3, wherein the LSI mounting structure is an LSI mounting structure.

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