JPH04162755A - Ic socket - Google Patents

Abstract

PURPOSE:To prevent the electrical characteristics of a semiconductor from being damaged due to the length of a contact by fixing a contact on an upper lid, providing elastic contact means moving up and down elastically on an upper lid and independently pressing down each lead overlaid on the contact point of the contact. CONSTITUTION:A contact point 2a of a contact 2 is adhered to the top surface of the bottom wall of a lower lid 1; elastic contact means 4 energized downward is attached to the lower face of an upper lid 3; and a pressing piece 4a is provided at the tip of said elastic contact means for pressing down a lead 5a pressed to the contact point 2a thereby elastically connecting the contact point 2a to the lead 5a and pressing down the lead 5a while insulating them independently one by one. Therefore, even though there are slight ups and downs in the arrangement of the leads 5a in up-and-down direction or in the height of the contact 2a, a stable contact can be maintained between the contact 2a and lead 5a, and the contact 2 can have the length similar the thickness of bottom wall of the lower lid 1. By doing this, the electric characteristics of the semiconductor will not be degraded due to length of the contact.

Description

[Detailed Description of the Invention] [Summary] Regarding IC sockets used in the testing process and mounting of semiconductor devices, it is particularly important to shorten the length of the contact so that the electrical characteristics are not impaired. The object of the present invention is to have a lower cover, a contact, an upper cover, and an elastic contact means, and the lower cover is into which a package of a semiconductor device is inserted, and the bottom cover faces the leads of the package. The contactor is fixed to the wall,
The contact includes a contact point on the bottom wall of the lower cover that is in close contact with the top surface;
The terminal has a terminal protruding from the lower surface, the upper lid is supported so as to be vertically movable facing the lower lid, and the upper end of the elastic contact means is fixed to the lower surface of the upper lid. , and the lower end is biased downward and has a pusher at the tip, and the pusher is configured to press down each lead placed on the contact point independently and insulated. do.

(Industrial Field of Application) The present invention relates to IC sockets, and particularly relates to IC sockets, in which the length of the contact is kept as short as possible so as not to impair the electrical characteristics of the semiconductor device, especially during the inspection process or when used after mounting. Regarding IC sockets.

In recent years, the degree of integration of semiconductor devices consisting of semiconductor integrated circuits (IC') has increased rapidly, and the functions thereof have become more sophisticated.
The operating speed is also becoming faster and faster. On the other hand, so-called flat packaging, which is a smaller and thinner package, is also being actively promoted.

By the way, in general, electronic device products such as semiconductor devices, even if the design is appropriate and the manufacturing process is well controlled,
It is inevitable that some defective products will be mixed in.

Therefore, product inspection performed after the assembly process of semiconductor devices has become an important process in ensuring the reliability of each product.

In addition, in the case of semiconductor devices where reliability is particularly important, a quality inspection called screening is an essential process after product inspection in order to stabilize characteristics and remove defective products for quality assurance purposes. . During this screening, an inspection called burn-in is generally performed on all products.

In this manner, IC sockets that can be easily inserted and removed are generally used for testing semiconductor devices. Furthermore, in some cases, IC sockets are also used when mounting semiconductor devices on printed circuit boards.

Such IC sockets are required to have the ability to efficiently support packages of semiconductor devices, which are becoming smaller and smaller, while not impairing their advanced electrical characteristics.

[Conventional technology]

2. Description of the Related Art Semiconductor devices are generally used while being enclosed in a package due to the need to protect the chip, mount it on a substrate, and facilitate handling.

Semiconductor devices are mounted in various packages depending on the number of leads pulled out from the package, how they are mounted on a printed board, and so on.

There is an increasing trend towards surface mount type packages, and the conventional DIP (Dual IP)
For example, there is a shift toward QFP (Quad Flat P) and SOP (Small Outline P).

These small packages are manufactured to suit the form of each package, such as inspection equipment for product inspection, burn-in boards for burn-in, and printed circuit boards for mounting on electronic equipment. A dedicated IC socket is used.

FIG. 7 is a sectional view of an example of a conventional IC socket.

In the figure, l is a lower cover, 2 is a contact, 2a is a contact, 2b is a terminal, 3 is an upper cover, 3a is a pressing part, 5 is a package, 5a is a lead, 6 is a printed board, and 6b is a through hole.

In the figure, for a package 5 of a semiconductor device, a plastic package is often used, for example, in which a chip on which a semiconductor element is formed is transfer-molded with a low-pressure molding resin such as epoxy resin. Also, considering heat dissipation, etc.
There are also ceramic packages in which chips are mounted on ceramic substrates.

In any case, in the case of a flat package, a large number of leads 5a protrude laterally from the side wall of the package 5.

Even for the same chip, various package formats are adopted to meet customers' various mounting formats, and a variety of IC sockets are available that combine various lead pitches and low spaces. .

The basic structure of the IC socket into which the package 5 is inserted is a lower cover l made of an insulator made of polyether resin such as PBT, and a lower cover l made of a material such as phosphor bronze or beryllium copper fixed to the lower cover l. These are two contacts 2 made of a spring material plated with Au.

If the package 5 is a DIP and the tips of the hard leads 5a protrude downward, the leads 5a are attached to the bottom cover 1.
For example, conduction can be established simply by inserting it into the cylindrical contact 2.

On the other hand, in the case of a so-called flat package, such as an SOP or a QFP, in which thin and bendable leads 5a protrude laterally, a method is adopted in which the leads 5a are brought into elastic contact with the contacts 2 and supported.

In other words, the contact 2 has a curved shape with the tip serving as a contact point 2a, the lower end is press-fitted into the bottom wall of the lower lid l, and the terminal 2b protrudes from the bottom wall. . The contacts 2 are arranged on two opposing sides or on four surrounding sides in accordance with the arrangement of the leads 5a of the package 5, and are biased upward, and the leads 5a are pressed against the pressing part 3a provided on the top cover 3. Support is done elastically by pinching them.

When the IC socket is attached to an inspection device and used, the top lid is separated as shown in FIG. The printed board 6 is soldered
is incorporated into the device and used as a measuring jig. When the upper lid 3 moves up and down in opposition to the upper lid 3 and descends, the hard pressing portion 3a presses down the lead 5a and comes into elastic contact with the contact 2a.

In addition, in the case of IC sockets used for burn-in etc., as shown in the same figure (B), the upper lid type is used, and the lower lid type is
One end of the top lid 3 is always urged in the open direction by a spring or the like and pivoted, and the other ends are configured to be locked together when the top lid 3 is closed. When the upper lid 3 is closed to the lower lid 1, the hard pressing part 3a is pressed against the lead 5a.
When pressed down, it comes into elastic contact with the contact point 2a.

As described above, the usage pattern of conventional IC sockets remains basically the same even if the package forms vary.

[Problem to be solved by the invention]

As described above, the conventional IC socket used in the testing process of semiconductor devices or the mounting of printed circuit boards has a contactor which is biased upwardly provided on the lower cover. The shape of this contactor is such that the lead pulled out from the package comes into elastic contact with the contact part, which is once curved and biased, and then fixed to the bottom wall of the IC socket, and then the part that protrudes from the bottom wall. It serves as a terminal and is fixed to a printed circuit board, etc. Therefore, the distance from the contact point to the terminal is long. Moreover, as packages have become smaller and lead pitches have become narrower, the spacing between contacts has become commensurately narrower.

However, as the functions of semiconductor devices become more sophisticated, their operating speeds become faster (
Therefore, in IC sockets that use contacts with long distances from the contact point to the terminal, for example, stray capacitance increases, resulting in poor frequency characteristics and noise induction, which may cause damage to the semiconductor device. There was a problem that the electrical characteristics, especially the high frequency characteristics, could not be sufficiently followed.

Therefore, the present invention provides an IC socket in which the distance from the contact point of the contactor to the terminal is made as short as possible so that the electrical characteristics of the semiconductor device are not impaired, and elastic contact between the lead and the contact point is made by the top cover. It is intended to.

[Means to solve the problem]

The above-mentioned problem includes a lower cover, a contact, an upper cover, and an elastic contact means, the lower cover is into which a package of a semiconductor device is inserted, and the lower cover faces the leads of the package. A contactor is fixed to the bottom wall of the lower cover, and the contactor is attached to the bottom wall of the lower cover.
It has a contact close to the upper surface and a terminal protruding from the lower surface, the upper lid is supported so as to be movable up and down opposite to the lower lid, and the elastic contact means has an upper end that is connected to the upper lid. Each of the leads is fixed to the lower surface of the lead, whose lower end is urged downward, has a pusher at the tip, and whose pusher is superimposed on the contact point.
The solution is an IC socket that is configured to be independently and insulably compressible.

[For production]

In conventional IC sockets, the contact provided on the bottom cover has a curved shape to apply bias, so the distance from the contact point of the contact to the terminal becomes long. In the present invention, the contactor is not biased and is made as short as possible.

That is, the contact point of the contactor is brought into close contact with the upper surface of the bottom wall of the lower cover.

An elastic contact means biased downward is provided on the lower surface of the upper cover, and a presser is provided at the tip of the elastic contact means to push down the lead superimposed on the contact so that the contact and the lead come into elastic contact.

Moreover, this pusher is designed to press down the leads one by one in an independently insulated state.

In this way, stable contact between the contact and the lead can be maintained even if there are some irregularities in the height of the contact or the vertical arrangement of the leads, and the length of the contact can be made equal to the thickness of the bottom wall of the lower cover. I can do it. In addition, it is possible to prevent the electrical characteristics of the semiconductor device from being impaired due to the length of the contact.

〔Example〕

Fig. 1 is an exploded perspective view of the first embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a structural sectional view of the second embodiment of the invention, and Fig. 4 is a main A cross-sectional view of the configuration of a third embodiment of the invention,
FIG. 5 is a perspective view of a main part of a fourth embodiment of the invention, and FIG. 6 is a perspective view of a main part of a fifth embodiment of the invention.

In the figure, l is the lower lid, 2 is the contact, 2a is the contact, 2b is the terminal, 3 is the upper lid, 4 is the elastic contact means, 4a is the presser, 5 is the package, 5a is the lead, 6 is the printed board, 6a is a conductor pattern.

Example: l In FIGS. 1 and 2, the lower lid 1 and the upper lid 3 are, for example, P
It is made by molding engineering plastics such as BT and PPS. A contact 2 is press-fitted into the bottom wall of the lower lid 1.

The contact 2 is a lead 5a pulled out from the package 5.
A contact point 2a is provided in close contact with the upper surface of the bottom wall of the lower lid I, and a terminal 2b protrudes from the lower surface of the bottom wall. This contactor 2 particularly needs to have spring properties (for example, it is constructed by press-forming a brass material and then applying Au plating to it.

The upper lid 3 is disposed opposite to the lower lid 1 so as to be movable up and down. An elastic contact means 4 made of a spring material such as phosphor bronze or beryllium copper is provided on the lower surface of the upper lid 3.
is hung.

This elastic contact means 4 has a curved shape and is biased downward. Further, the tip portion is a presser 4a, which corresponds to each lead 5a of the package 5. When the upper lid 3 is closed to the lower lid I, the leads 5a of the package 5 superimposed on the contacts 2a are pressed down elastically.

The IC socket having this configuration is particularly suitable for use as a jig for holding a semiconductor device in a semiconductor device testing process.

Embodiment 2 In FIG. 3, the lower lid l is composed of a printed board 6. In FIG. The contacts 2a are conductive patterns 6a provided on the printed board 6 in correspondence with the leads 5a of the package 5.

The upper cover 3, on which the elastic contact means 4 is suspended, is disposed on the printed board 6 and is movable up and down.

Align the leads 5a of the package 5 with the conductor pattern 6a of the printed board 6 and place them on top of each other, and close the top cover 3 to release the presser 4a.
is adapted to elastically press down the lead 5a.

The IC socket having this configuration is particularly suitable for use as a jig for holding a semiconductor device in a semiconductor device testing process.

Example; 3 In FIG. 4, one end of the upper lid 3 is connected to one end of the lower lid 1,
It is pivoted so that it can be opened and closed by being biased to the open state. Also,
The other end can be locked to the other end of the lower lid l.

The IC socket having this configuration is particularly advantageous when used in burn-in tests of semiconductor devices or when mounting semiconductor devices on printed circuit boards.

Embodiment 4 In FIG. 5, the elastic contact means 4 is made of a spring material such as phosphor bronze or beryllium copper as in Embodiment 1, and the upper end is an integral structure, but the lower end is a comb. It is divided into teeth and corresponds to each lead. Since it is necessary to press down while the leads are insulated, the pusher 4a at the tip is formed by insert molding, for example, insulating plastic.

When the elastic contact means 4 is integrally configured in this way, the presser 4a
Not only can it be processed in advance to precisely match the lead pitch, but it is also easy to attach it to the top lid.

Example 5 In FIG. 6, the elastic contact means 4 is made of a spring material such as phosphor bronze or beryllium copper, as in Example 1, and has a curved integral structure as a whole. Then, an insulating material having rubber elasticity, such as silicone rubber, is adhered to the lower end to form the presser 4a.

In the elastic contacting means 4 having this structure, when pressing down the lead 5a, the entire elastic contacting means 4 can perform a coarse movement, and the rubber elastic body forming the presser 4a can perform fine movement to follow fine irregularities.

Therefore, if the low space is the same, the leads 5a having different lead pitches can be used in common.

〔Effect of the invention〕

As described above, in the present invention, the lower cover is provided with a fixed contact, the upper cover is provided with an elastic contact means that moves up and down elastically, and one lead superimposed on the contact of the contact is provided. Each button is pressed independently.

In this way, the length of the contact can be shortened to the thickness of the bottom wall of the lower lid. As a result, when inspecting or mounting semiconductor devices using an IC socket, not only can the contacts and leads be in stable elastic contact (but also the electrical It is possible to prevent the characteristics from being damaged.

Therefore, the present invention contributes to the prevention of failures during the inspection process and when mounting and using flat package semiconductor devices, where packages are becoming smaller and thinner and have more advanced characteristics. It's large.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view of the first embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a structural sectional view of the second embodiment of the invention, and Fig. 4 is the main 5 is a perspective view of the main parts of the fourth embodiment of the invention, FIG. 6 is a perspective view of the main parts of the fifth embodiment of the invention, FIG. 7 is a cross-sectional view of an example of a conventional IC socket. In the figure, ■ is the lower cover, 2 is the contact, 2a is the contact, 2b is the terminal, 3 is the upper cover, 4 is the elastic contact means, 4a is the pusher, 5 is the package, 5a is the lead, 6 is the printed board, 6a
is a conductor pattern. Fig. 1 Cross-sectional view of Fig. 1\J 2 Fig. J bottom, history Go'6a! (Non-note board) To the children of the sun and the moon, to the circulation of the second wishing light. Figure 3, Figure 4, Figure 5. A) YoJ
Diagram (Uke no 1) (B) Top! Unity No. 77 (Part 2)

Claims (1)

[Claims] 1) It has a lower lid (1), a contact (2), an upper lid (3), and an elastic contact means (4), and the lower lid (1) is a semiconductor device package. (5) is inserted into the lead (5) of the package (5).
5a), the contact (2) is fixed to the bottom wall, and the contact (2) is the contact (2) that is closely attached to the top surface of the bottom wall of the lower lid (1). 2a) and a terminal protruding from the bottom surface (2b
), the upper lid (3) is supported so as to be movable up and down opposite the lower lid (1), and the elastic contact means (4) has an upper end that is connected to the upper lid. (3) is fixed to the lower surface of the contact point (3), and has a pusher (4a) at its tip with a lower end urged downward, and the pusher (4a) is superimposed on the contact (2a). An IC socket characterized in that each of the leads (5a) can be pressed down independently and insulated. 2) The lower cover (1) is made of a printed board (6), and the contact (2) is made of a conductive pattern (6a) provided on the printed board (6). IC socket. 3) One end of the upper lid (3) is pivoted to be openable and closable by being biased to an open state by one end of the lower lid (1), and the other end is connected to the other end of the lower lid (1). The IC socket according to claim 1, wherein the IC socket is latched to an IC socket. 4) The elastic contact means (4) is made of a springy metal material with a lower end portion divided into comb-teeth shapes, and
2. The IC socket of claim 1, wherein 4a) is made of an insulating material. 5) The IC socket according to claim 1, wherein the elastic contact means (4) has a presser (4a) made of an insulating material having rubber elasticity.