JPH04112473A - Ic socket - Google Patents

Abstract

PURPOSE:To lower the impedance and accomplish an IC socket admitting flow of a large current by forming a terminal, which is to fix the IC socket to a printed circuit board etc., separately from a terminal which is to generate electrical connection to the outside. CONSTITUTION:When a guide member 21 is fitted in a guide groove 11 in a lower lid 1 and a fixing terminal 24 is fitted by pressure in a terminal hole 12, a contacting piece 2 is fixed to the lower lid 1. This fixing terminal 24 is so arranged as to protrude at the under-wall of the lower lid 1, while a connection terminal 22 is so arranged as to protrude at the outer side wall of the lower lid 1. Soldering the fixing terminal 24 to a through hole 51 completes securing of IC socket 6 to a printed circuit board 5. Soldering the connection terminal 22 to a pad 52 through a connection board 53, on the other hand, generates external connection of the contacting piece 2 to the printed circuit board 5.

Description

[Detailed Description of the Invention] [Summary] Regarding IC sockets used in the inspection process of semiconductor devices and when mounting them on printed circuit boards, etc., the impedance is low so as not to impair the original electrical characteristics of the semiconductor devices. The purpose is to allow a large current to flow through the contact, and it has a lower cover and a contact, and the lower cover is used to insert a semiconductor device, and is carved from the center of the upper surface toward the outer wall. It has a plurality of guide grooves and a terminal hole penetrating the bottom of the guide groove to the lower outer wall, and is made of an insulating material, and the contactor is connected to the leads of a semiconductor device placed above the lower cover. A guide member that is in contact with the guide member and has a wide width in the vertical direction; a connection terminal that is formed from one end of the guide member; and a contact that projects in a box shape from the middle part of the upper surface of the guide member and is elastically biased upward. , has a fixed terminal protruding downward from the middle part of the lower surface of the guide member, and is made of a spring material, and the contactor is arranged such that the guide member is fitted into the guide groove and the fixed terminal is inserted through the terminal hole. The connecting terminal is configured so that it protrudes from the outer wall of the lower cover when it is press-fitted.

[Industrial application field]

The present invention relates to an IC socket, and more particularly to an IC socket that allows a large current to flow therethrough without damaging electrical characteristics when used in an inspection process or mounted on a printed board.

In recent years, monolithic and hybrid integrated circuits (I
The degree of integration of semiconductor devices consisting of (C) has been increasing rapidly and the functions thereof have become more sophisticated, and products that operate at higher speeds and can handle large currents are being developed.

By the way, in general, even if electronic devices such as semiconductor devices are appropriately designed and the manufacturing process is well controlled, it is inevitable that some defective products will be mixed in.

Therefore, product inspection performed after the assembly process of semiconductor devices is an important process to ensure the reliability of each product.

In addition, in the case of semiconductor devices where reliability is particularly important, a quality inspection called screening is an essential process after product inspection in order to stabilize characteristics and remove defective products for quality assurance purposes. . During this screening, an inspection called burn-in is generally performed on all products.

For testing such semiconductor devices, IC sockets that can be easily inserted and removed are generally used. Although not necessarily common, IC sockets are also used when mounting semiconductor devices on printed circuit boards. Such IC sockets are required to have performance that does not impair electrical characteristics in response to the increasingly sophisticated functions of semiconductor devices.

[Conventional technology]

2. Description of the Related Art Semiconductor devices are generally used while being enclosed in a package due to the need to protect the chip, mount it on a substrate, and facilitate handling.

Semiconductor devices are mounted in various packages depending on the number of leads pulled out from the package, how they are mounted on a printed board, and so on.

When there are few leads derived from the package, S
IP (Single In-1ine Pack
(age) and Z I P (Zigzag I P) are often used, and for medium scale, D I P (Du
al I P) or SOJ (Small 0utl)
ine J-1ead P), etc. are used. Furthermore, as the number of leads increases, it is not enough to pull them out from two sides of the package, and they are pulled out from the four sides.
Packages such as Leadless Chip Carrier (Leadless Chip Carrier) and QF P (Quad F lat P) are used.

There is also a trend toward more surface-mounted packages, from conventional DIP to PLCC, QFP, and S.
A shift towards OP (Small Outline P) is underway.

For such a wide variety of packages, each package is made to suit each package, such as inspection equipment for product inspection, burn-in boards for burn-in, and printed boards when actually used as a product. A dedicated IC socket is used.

FIG. 5 is a configuration diagram of an example of a conventional IC socket, and FIG. 6 is a cross-sectional perspective view of the main part of FIG.

In the figure, 1 is a lower cover, 2 is a contact, 23 is a contact, 25 is a terminal, 3 is an upper cover, 4 is a semiconductor device, 41 is a lead, 5 is a printed board, 51 is a through hole, and 6 is an IC socket.

In FIG. 5, for the semiconductor device 4, a plastic package is often used, for example, in which a chip on which a semiconductor element is formed is transfer-molded with a low-pressure molding resin such as epoxy resin. There are also ceramic packages in which a chip is mounted on a ceramic substrate in consideration of heat dissipation. In any case, a plurality of leads 41 protrude from the outer wall of the package of the semiconductor device.

Even for the same chip, various paracane configurations are adopted in order to meet the various mounting configurations of customers, and various IC sockets 6 are available that combine various lead pitches and low spaces. There is.

The basic structure of the IC socket 6 into which the semiconductor device 4 is inserted is a lower cover I made of an insulator and a contact 2 made of a spring material.

If the package of the semiconductor device 4 has a hard lead 41 such as a DIP with its tip protruding downward, the lead 4
1 into the contact 2 of the lower cover I, the semiconductor device 4 is supported.

However, in the case of a so-called flat package, such as SOP or QFP, in which the leads 41 protrude in the horizontal direction, it is not possible to insert the leads 41 into the contacts 2 of the lower lid l and support them. In other words, the contact 2 of the lower lid 1 and the upper lid 3
It is necessary to support the lead 41 by sandwiching it between the pressing portion 31 and the pressing portion 31 . Therefore, the contactor 2 is configured to have a curved shape and to be biased upward so as to come into elastic contact with the lead 41.

When the IC socket 6 is attached to an inspection device and used, the upper lid is separated as shown in FIG. It is inserted and soldered, and the printed board 5 is incorporated into a device and used. Then, the upper lid 3 moves up and down from above facing the lower lid 1, and the pressing part 3
1 presses down the IJ-1'' 41 so that it comes into elastic contact with the contact 23.

In addition, in the case of an IC socket 6 used for burn-in, etc., the upper lid is integrated as shown in FIG. The other ends are configured to be locked together when the top cover 3 is closed.

In FIG. 6, guide grooves 11 are cut in the lower cover 1 at intervals matching the pitch of the leads pulled out from the outer wall of the package of the semiconductor device, and the guide grooves 11 are formed in low spaces where the leads are facing away from each other. According to the 2 opposing sides or 4
They are placed side by side.

A contact 2 is fitted into the guide groove 11 and is made of a spring material such as phosphor bronze and beryllium copper plated with Au.

One upper end of the contactor 2 fitted in the guide groove 11 is a contact point 23, which is urged upward and fitted so as to be vertically movable.

Further, the intermediate portion has a curved shape and applies an upward bias to the contact point 23.

Furthermore, the other end faces vertically downward and is press-fitted into a terminal hole 12 provided at the bottom of the guide groove 11 and passes through it, and the tip becomes a terminal 25 and is inserted into a through hole of a printed board such as a burn-in board. For example, it is soldered.

The manner in which such IC sockets are used remains basically the same, even if the package formats vary.

[Problem to be solved by the invention]

In this way, IC sockets used in the testing process of semiconductor devices and when mounting printed circuit boards are made to match the form of the package, that is, the dimensions of the lead pitch and low space.

However, as the functionality of semiconductor devices becomes more sophisticated, the number of leads increases, and in order to meet the demand for smaller packages, the leads tend to become thinner and the pitch narrower. Along with this, the contactors of IC sockets are also becoming thinner, and it is inevitable that the terminals that connect externally to printed circuit boards, in particular, will become thinner.

Therefore, the impedance of contacts corresponding to terminals that handle large currents such as power lines and ground lines (GND) increases,
Delays in signal transmission speed and generation of GND noise are likely to occur.

As a result, there was a problem in that the original electrical characteristics of the semiconductor device were impaired.

Therefore, the present invention has a contactor that can lower the impedance and allow a large current to flow, so as not to impair the original electrical characteristics of the semiconductor device even if the lead pitch of the package of the semiconductor device becomes narrow. The purpose is to provide an IC socket with the following characteristics.

[Means to solve the problem]

The above-mentioned problem is that the lower cover, into which a semiconductor device is inserted, has a plurality of guide grooves dug from the center of the upper surface toward the outer wall;
The bottom surface of the guide groove has a terminal hole penetrating to the lower outer wall, and is made of an insulating material. a guide member having a wide width in the direction, a connection terminal protruding downward from one end of the guide member, a contact point protruding in a box shape from the middle part of the upper surface of the guide member and biased upward; The contact has a fixed terminal projecting downward from the middle part of the lower surface of the member, and is made of a spring material, and the contact is configured so that the guide member is fitted into the guide groove and the fixed terminal is inserted into the terminal hole. The solution is provided by an IC socket configured such that the connection terminals protrude from the outer wall of the lower cover when pressed into the IC socket.

[For production]

With changes in the form of semiconductor device packages, the thickness of IC socket contacts has also become thinner, and the impedance of externally connected terminals has become high (as opposed to conventional IC sockets, which are no longer able to flow a sufficiently large current). Therefore, in the present invention, a large current can be passed regardless of the fineness of the lead pitch.

In other words, in conventional IC sockets, one terminal is used to both fix the socket itself and make electrical connection, whereas in the present invention, one terminal is used to fix the IC socket to a printed board, etc., and the other is used for electrical connection. Therefore, the terminals for external connection are separated.

The fixed terminals that are fixed to a printed board or the like are soldered to through-holes in the printed board, so they are made to protrude downward from the bottom cover as before.

On the other hand, the connection terminal that connects electrically to the outside is the IC
It is made to protrude laterally from the outer wall of the socket. Although the wall thickness (plate thickness) of the connection terminal is regulated by the lead pitch, there is no restriction on the vertical thickness.

In this way, when mounting the IC socket on a printed board, etc., the fixing to the printed board is done by inserting a fixed terminal into the through hole and soldering as before, and the electrical connection is made using a connecting terminal that can flow a large current. conduct. Then, if you adjust the thickness of the connection terminal appropriately according to the current value you want to flow,
Semiconductor devices can be inserted without damaging electrical characteristics.
You can get a C socket.

〔Example〕

FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a perspective view of the first embodiment of the present invention.
FIG. 3 is a perspective view of a second embodiment of the present invention, and FIG. 4 is a cross-sectional view of a third embodiment of the present invention.

In the figure, ■ is the lower cover, 11 is the guide groove, I2 is the terminal hole, 2 is the contact, 21 is the guide member, 22 is the connection terminal, 23 is the contact,
24 is a fixed terminal, 3 is a top cover, 31 is a pressing part, 4 is a semiconductor device, 41 is a lead, 5 is a printed board, and 6 is an IC socket.

Embodiment: l In FIGS. 1 and 2, the lower cover l is made by molding an insulating engineering plastic such as PBT.

The lower lid 1 is provided with a plurality of guide grooves 11 extending from the center of the upper surface toward the outer wall.

This guide groove 11 is formed into a lead 4 of a semiconductor device 4 to be inserted.
According to the number and pitch of 1, for example, if it is an SOP, it is dug on two opposing sides, and if it is a QFP shown here, it is dug on four sides. Further, a terminal hole 12 is bored through the lower cover I at the bottom of the guide groove 11.

The contact 2 is made by pressing a spring material such as phosphor bronze, and its thickness is determined by the thickness and pitch of the glue 41 of the semiconductor device 4. A guide member 21 having a large width in the vertical direction and a connecting terminal 22 formed from one end of the guide member 21 protrude. In addition, the guide member 2
A contact point 23 protrudes from the middle part of the top surface of the semiconductor device 4 while being curved in a box shape. A fixed terminal 24 is configured to protrude from the middle part of the lower surface of 2I. When the guide member 21 is fitted into the guide groove 117 of the lower cover 1 and the fixed terminal 24 is press-fitted into the terminal hole 12, the contact 2 or the lower cover l
Fixed. This fixed terminal 24 is designed to protrude from the lower wall of the lower cover 1. In addition, the connection terminal 22 is connected to the lower cover I.
It protrudes from the outer wall of the The lower surface of the connection terminal 22 is exactly flush with the lower surface of the lower lid 1.

In this way, the IC socket 6 according to the present invention is completed.

On the other hand, taking as an example the case where this IC socket 6 is attached to, for example, a testing device for semiconductor devices 4, the printed board 5 for attaching the IC socket 6 is provided with a through hole 5I and a pad 52. .

The through hole 51 is for fixing the IC socket 6, and when the fixing terminal 24 is inserted into the through hole 51, the connecting terminal 22 is positioned directly above the pad 52. Then, by soldering the fixed terminal 24 to the through hole 51, the IC socket 6 is fixed to the printed board 5. Further, by soldering the connecting terminal 22 to the pad 52 via the connecting plate 53, the contactor 2 is externally connected to the printed board 5.

Embodiment 2 In FIG. 3, the lower lid l is made up of one end of the guide member 21.
A connecting terminal 22 protruding from the outer wall of the housing is curved downward, and the lower surface of the connecting terminal 22 is flush with the lower wall surface of the lower lid 1.

In this way, when the IC socket 6 is mounted on the printed circuit board 5, the connection terminals 22 are placed directly on the pads 52, making it easy to connect without soldering.

Embodiment 3 In FIG. 4, the upper lid 3, like the lower lid 1, is made by molding engineering plastic. One end of the upper lid 3 is pivotally supported to one end of the lower lid 1 so as to be openable and closable, and the other end is locked to the other end of the lower lid 1. - When fishing from a boat, the upper lid 3 is always biased to the open state.

A suppressing portion 31 is provided on the lower surface of the upper lid 3, and when the upper lid 3 is closed, the leads 41 of the semiconductor device 4 are pushed down, so that the leads 41 come into elastic contact with the contacts 23 of the contacts 2. There is.

The IC socket 6 having the structure with the upper cover 3 is useful when being attached to a burn-in hoard or the like having the same structure as the printed board 5 described in the first embodiment and performing a burn-in test.

In this case, the fixed terminal 24 of the contactor 2 was used only for fixing the IC socket 6, but the conductor pattern of the printed board 5 to which the IC socket 6 is attached was wired so that it could also be electrically connected to the fixed terminal 24. I don't mind.

Further, the vertical width of the guide member 21 of the contactor 2 and the connection terminal 22 depends on the current value required by the semiconductor device 4.
Various variations are possible.

〔Effect of the invention〕

With the advancement of semiconductor device functions and advances in packaging technology,
As leads become thinner (and the lead pitch becomes narrower), it becomes necessary to pass large currents, and with this, it is also required that large currents be able to pass through the contacts of IC sockets in which semiconductor devices are inserted. It has been done.

In the present invention, the terminals of a conventional IC socket are used to fix the socket itself, and a connecting terminal is provided separately to allow a large current to flow.

As a result, the IC socket of the present invention does not impair the electrical characteristics of the semiconductor device during product inspections performed in the semiconductor device inspection process, reliability inspections such as burn-in, or when used mounted on a printed board. It can be used without Therefore, the present invention greatly contributes to improving the performance of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a perspective view of the first embodiment of the present invention.
3 is a perspective view of the second embodiment of the present invention, and FIG. 4 is a sectional view of the third embodiment of the present invention. In the figures, 1 is a lower lid; 11 is a guide groove, 2 is a contact, 21 is a guide member, 23 is a contact, 3 is an upper cover, and 4 is a semiconductor device. 12 is a terminal hole, 22 is a connecting terminal, 24 is a fixing terminal, 41 is a lead, and the main part of the first embodiment of the present invention is 7 Third embodiment of the present invention Suction view ￥iJ 3 Cross-sectional view of the third embodiment of Kouaki Akane No. fA) 11 minutes short hair (B) 1 Example of an IC socket with a lid-shaped secondary end Prayer J & Diagram

Claims (1)

[Scope of Claims] 1) It has a lower lid (1) and a contactor (2), and the lower lid (1) has a semiconductor device (4) inserted therein, and the lower lid (1) has a central portion on its upper surface. It has a plurality of guide grooves (11) dug in the direction of the outer wall from the bottom, and a terminal hole (12) penetrating the bottom of the guide groove (11) to the lower outer wall, and is made of an insulating material, and is made of an insulating material. The contactor (2) comes into elastic contact with the lead (41) of the semiconductor device (4) placed above the lower lid (1), and has a vertically wide guide member (21). , a connection terminal (22) formed from one end of the guide member (21), and a contact (23) projecting in a box shape from the middle part of the upper surface of the guide member (21) and biased upward; A fixed terminal (
24), and is made of a spring material, and the contactor (2) has a guide member (21) in the guide groove (
11) and the fixed terminal (24) is fitted into the terminal hole (1).
When the connection terminal (22) is press-fitted through the
An IC socket, characterized in that: protrudes from an outer wall of the lower cover (1). 2) The contactor (2) has a connecting terminal (22) protruding from the outer wall of the lower lid (1), and a lower surface of the connecting terminal (22) flush with the lower wall surface of the lower lid (1). 2. The IC socket according to claim 1, wherein the IC socket has the following characteristics. 3) It has an upper lid (3), and the upper lid (3) has a lead (41) of the semiconductor device (4).
, one end is pivotally supported to one end of the lower lid (1) so as to be openable and closable, and the other end is locked to the other end of the lower lid (1). 2. The IC socket according to claim 1, which is made of an insulating material.