JPH07159486A - Integrated circuit testing device - Google Patents

Abstract

PURPOSE:To provide an integrated circuit testing device which can test various kinds of integrated circuits, in which power supply terminals and grounding terminals are arranged at different positions, by using the same testing board. CONSTITUTION:A plurality of socket terminals 13 are provided on the upper surface of a socket main body 12a composed of an insulator and each socket terminal 13 is connected to each terminal pin 31 of an LSI 30. Power supply conductors 20 and grounding conductors 21 which are insulated form each other and respectively connected to the VDD terminals and GND terminals of a testing board 11 are arranged on the four side faces of the main body 12a. The wiring relation between a plurality of the terminals of the board 11 and a plurality of the socket terminals 13 on the upper surface of the socket 12 can be changed by changing the inserting positions of power supply jumper wires 17 inserted to a plurality of first and second connecting holes 26 and 27 formed on the side face of the main body 12a and grounding jumper wires 18 inserted into first connecting holes 26 and third connecting holes 28.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit test apparatus, and more particularly to an integrated circuit test apparatus for performing a test using a test board having a socket.

[0002]

2. Description of the Related Art Conventionally, when a large-scale integrated circuit (hereinafter referred to as an LSI) is measured by using a test device, for example, an LSI logic tester, a test board (test board) is used as a relay for transmitting a signal of the LSI logic tester to the LSI. Is widely used. FIG. 4 shows a conventional test board 1, an IC (integrated circuit) socket 2 is fixed to the upper surface of the test board 1, and an LSI to be measured (not shown) is attached to the IC socket 2. It is installed.

The test board 1 is provided with a signal terminal 3 which receives a signal from an LSI logic tester (not shown), a VDD terminal 4 to which a power source is connected, and a GND terminal 5 which is grounded.

On the other hand, a plurality of socket terminals 6 are provided on the upper surface of the IC socket 2, and each of these socket terminals 6, the signal terminal 3, the VDD terminal 4, and the GND terminal 5 are predetermined lead wires. It is connected with 6, 7, 8 etc. Then, an LSI (not shown) is mounted on the IC socket 2, and the terminal pins of the LSI and the IC socket 2 are mounted.
The socket terminals 6 are brought into contact with each other and fixed by using a fixture (not shown) so as not to move relative to each other.

In the above-described IC socket 2, which of the plurality of socket terminals 6 is connected to the signal terminal 3, the VDD terminal 4, and the GND terminal 5 on the test board 1 is the lead wire 6. It is determined in advance via 7 and 8. Therefore, a dedicated test board 1 is prepared every time the arrangement positions of the power supply terminal pins and the grounding terminal pins provided in the LSI differ depending on the type of the LSI.

[0006]

In the conventional integrated circuit test apparatus, since the wiring relationship between the terminals of the test board and each socket terminal of the IC socket is fixed, even if the same package is used for the power supply of the LSI. If the terminals and the grounding terminals are arranged at different positions, the positional relationship between the terminals and the respective socket terminals on the upper surface of the IC socket to be connected to the terminals deviates. Therefore, in the same test board, L
The SI power supply terminal and the grounding terminal cannot be connected to the power supply terminal and the grounding terminal of the test board, and it is necessary to prepare a test board for each type of LSI. Therefore, the number of test boards is large. However, there was a problem that the cost was high.

It is an object of the present invention to provide an integrated circuit testing device that solves the above problems.

[0008]

In order to achieve the above object, the present invention provides a socket on the upper surface of a test board and tests an integrated circuit under test mounted in the socket through the test board. In the integrated circuit test device adapted to be electrically connected to the board, the socket has a plurality of connection conductors provided so that one end is connected to a terminal of the test board and the other end is connected to a terminal of the integrated circuit. Provided on a side surface portion of the socket body, which is formed on a side surface of the socket body and is connected to a plurality of first connection holes each of which is electrically connected to a connection conductor and a power supply terminal of the test board. A power supply conductor and a grounding conductor that is connected to the grounding terminal of the test board and is provided on the side surface of the socket body substantially parallel to the powering conductor. Parallel to the hole A plurality of second connection holes formed in the side surface portion of the socket body, and a plurality of third connection holes each formed in the side surface portion of the socket body that are connected to the grounding conductor and are substantially parallel to the second connection hole. It is characterized by having and.

It is preferable that the power supply conductor and the grounding conductor are connected to each other by a capacitor through connection terminals that can be inserted into the first connection hole and the second connection hole, respectively.

[0010]

According to the structure of the present invention, a connecting conductor such as a jumper wire is inserted into the desired first connection hole and second connection hole provided in the socket, or the connection conductor is inserted into the first connection hole and the third connection hole. By inserting the above-mentioned connecting conductor, even if the arrangement positions of the power supply terminal and the ground terminal of the integrated circuit are changed, these terminals can be connected to the power supply terminal and the ground terminal on the test board. As described above, in the present invention, the test board has versatility, and when measuring a plurality of types of integrated circuits in which the power supply terminal and the ground terminal are arranged at different positions, one test board can be used.

Further, by connecting the power supply connection conductor and the ground connection conductor with a capacitor by utilizing the second connection hole and the third connection hole, this functions as a bypass capacitor, and a stable power supply is secured. It

[0012]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 shows an IC socket and an LSI according to an embodiment.
2 is a cross-sectional view in which an LSI is mounted on an IC socket, and FIG. 3 is a front view of a test board on which the above-mentioned IC socket is arranged.

As shown in FIGS. 1 and 2, in the IC socket 12 according to this embodiment, the socket body 12a has a predetermined thickness, and is formed of an insulating material such as a quadrangular plastic when viewed from above. A plurality of socket terminals (connection conductors) 13 are provided on the upper surface of the socket body 12a along the four sides thereof. Both ends of the socket terminal 13 are bent downward, and one bent portion 13a is inserted into the insertion hole 14 of the socket body 12a and protrudes to the lower surface thereof. This bent portion 13a is the IC socket 1
2 is connected via a lead wire 16 to a signal terminal 15 (shown in FIG. 3) of the test board 11 on which it is arranged.

The other bent portion 13 of the socket terminal 13
b is embedded in the socket body 12a, and the bent portion 13b is provided with a jumper wire (communication conductor) 17 for power supply and a jumper wire (communication conductor) for grounding by means described later.
18 can be connected.

On the four side surfaces of the quadrangular socket body 12a, a power source conductor 20 and a grounding conductor 21, which are, for example, elongated strip-shaped conductive plates, are vertically spaced apart from each other so as to surround the side surfaces. Are insulated from each other. A connection terminal 20a provided integrally with the power supply conductor 20 and a connection terminal 21a provided integrally with the grounding conductor 20 respectively pass through the inside of the socket body 12a and project to the lower surface thereof.

The connecting conductor 20 for power supply and grounding
a, 21a is the test substrate 11 via the lead wires 22, 23
Are connected to the VDD terminal 24 and the GND terminal 25, respectively.

A plurality of first connection holes 26 are formed on the side surface of the socket body 12a located between the power supply conductor 20 and the grounding conductor 21, and the socket terminals 13 are formed at the inner part of the first connection holes 26. The other bent portion 13b is located. Therefore, the first connection holes 26 are provided in the same number as the socket terminals 13. In addition, the plurality of first connection holes 26
Are insulated from each other by the socket body 12a being formed of an insulator.

The power supply conductor 20 has a second connection hole 27.
And a third connection hole 28 is formed in the grounding conductor 21. The second connection hole 27 and the third connection hole 28 are
Similar to the first connection holes 26, the same number as the first connection holes 26 is provided corresponding to the socket terminals 13. Then, the bent portions 17a and 17b at both ends of the power supply jumper wire 17, which is a substantially U-shaped hard metal wire when viewed from the side, are inserted into the first connection hole 26 and the second connection hole 27 as power supply connection conductors.

At this time, the tip of one bent portion 17b of the power jumper wire 17 is connected to one bent portion 13b of the socket terminal 13 at the inner part of the first connection hole 26, and the other bent portion 13a is , Is in contact with the inner peripheral edge of the second connection hole 27 and connected to the power supply conductor 20.

Bent portion 17a of power supply jumper wire 17
The first connection hole 26 different from the connection hole into which the is inserted, and the third connection hole 28 are formed as the grounding connection conductors 21 and have the same shape as the power supply jumper wire 17 described above.
The bent portions 18a and 18b at both ends of 8 are inserted. At this time, one bent portion 18 of the grounding jumper wire 18
The tip of b is connected to one bent portion 13b of the socket terminal 13 in the inner part of the first connection hole 26, and the other bent portion 18a is connected to the grounding conductor 21a.

As shown in FIG. 2, the IC socket 12
An LSI 30 is mounted on the upper part of the IC 30, and each terminal pin 31 of this LSI 30 is connected to each socket terminal 13 of the IC socket 12.
Is placed on the upper surface of and both are electrically connected to each other.
At this time, the LSI 30 does not move and the terminal pin 3
The fixing frame 32 covers the IC socket 12 so that the connection between the IC socket terminal 1 and the IC socket terminal 13 is maintained.

The fixed frame 32 has, for example, a lid shape, and by fitting the inner peripheral edge 32a of the opening to the outer peripheral edge of the upper portion of the socket body 12a, the fixed frame 32 becomes the IC socket 1.
Fixed to 2. At this time, the pressing surface 32b formed on the lower inside of the fixed frame 32 presses the terminal pin 31 of the LSI 30 from above, whereby the terminal pin 31 and the socket terminal 13 are electrically and firmly connected.

According to this embodiment, the IC socket 12 has an L
By mounting the SI 30 and connecting the terminal pin 31 and the socket terminal 13, the LSI 30 is connected to the LSI logic tester via the bent portion 13a of the socket terminal 13, the lead wire 16, and the signal terminal 15 of the test board 11. (Not shown).

Also, the type of package has changed, and the LSI3
Even when the arrangement positions of the power supply terminal pin 31a and the grounding terminal pin 31b among the plurality of 0 terminals do not need to be replaced, the IC socket 12 does not need to be replaced, and the connection relationship with the socket terminal 13 may be the same as before.

In this case, first, the power supply jumper wire 17 is temporarily pulled out from the first connection hole 26 and the second connection hole 27 which have been inserted until then, and the power supply jumper wire 17 different from these connection holes is used. A first connection hole 26 communicating with the bent portion 13b of the socket terminal 13 in contact with the terminal pin 31a;
The power supply conductor 20 is inserted into the second connection hole 27.

As a result, the power supply terminal pin 31a and the power supply conductor 20 are connected via the power supply jumper wire 17,
The power supply terminal pin 31 a of the LSI 30 can be connected to the VDD terminal 24 of the test board 11 via the connection conductor 20 a and the lead wire 23.

Next, the grounding jumper wire 18 is inserted into the first connecting hole 26 and the third connecting hole 28 by the same operation as described above. Thereby, the grounding conductor 21 is connected, and the grounding terminal pin 31b of the LSI 30 can be connected to the GND terminal 25 of the test board 11 via the connection conductor 21a and the lead wire 23.

In FIG. 2, the signal terminal 15 connected via the lead wire 15 to the socket terminal 13 in which the power supply terminal pin 31a and the ground terminal pin 31b of the LSI 30 are in contact with each other is the LSI logic tester. It is better to leave it open on the side.

Both terminals of a capacitor (not shown) are inserted into the empty second connecting hole 27 of the power source conductor 20 and the empty third connecting hole 28 of the grounding conductor 21, and both conductors are inserted. The above-mentioned capacitor may be inserted as a bypass capacitor in between, whereby a stable power supply can be secured and measurement can be performed.

The present invention is not limited to the embodiments and may be modified as necessary. For example, the structure for contacting the power jumper wire 17 with the socket terminal 13 via the first connection hole 26 may be other than the illustrated example. That is, a plurality of first
The connection holes 26 are insulated from each other, and the first connection holes 26
By inserting the bent portion 17b of the power supply jumper wire 17 into the bent portion 17a and the socket terminal 13,
Any structure other than the illustrated structure may be used as long as it is a structure in which one of the bent portions 13b is electrically connected. The shapes and sizes of the power jumper wire 17 and the ground jumper wire 18 are not limited to those shown in the drawings. Further, the power supply conductor 20 and the grounding conductor 21 can be formed so as to be embedded in the side surface portion of the socket body 12a and not exposed to the surface.

[0032]

As described above, according to the present invention, by changing the insertion positions of the power supply connection conductor and the ground connection conductor into the first connection hole, the second connection hole, and the third connection hole. Since the wiring relationship between each terminal of the integrated circuit mounted in the socket and the signal terminal, VDD terminal, and GND terminal of the test board can be easily changed, the same test board can be used for the power supply terminal and the ground terminal. It is possible to test various types of integrated circuits having different terminal arrangement positions. As a result, the cost required to create the test board and its storage space are small,
Equipment costs can be reduced and testing can be facilitated.

Further, according to the present invention, a capacitor for ensuring a stable power supply can be connected to the power supply terminal and the ground terminal on the socket by a simple connecting means. Further, the power supply terminal and the grounding terminal of the integrated circuit are connected to the power supply conductor and the grounding terminal, which are respectively arranged on the side surface of the socket body, through a plurality of conductors, which is the most conceivable. It has a simple structure, and the time and effort for creating it can be saved as much as possible.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC socket and an LSI according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state in which an LSI is mounted on the socket of FIG. 1 and is held by a fixing frame.

FIG. 3 is a front view of a test board having the socket of FIG. 1 arranged on the upper surface.

FIG. 4 is a front view of a conventional test board having a conventional socket arranged on the upper surface.

[Explanation of symbols]

11 ... Test board, 12 ... IC socket, 12a ... Socket body, 13 ... Socket terminal, 13a, 13b ... Bent part, 17 ... Power jumper wire, 18 ... Ground jumper wire, 20 ... Power supply conductor, 20a ... Connection Conductor, 21 ... Grounding conductor, 21a ... Connection conductor, 24 ... VDD terminal, 25 ...
GND terminal, 26 ... First connection hole, 27 ... Second connection hole, 2
8 ... Third connection hole, 30 ... LSI, 31 ... Terminal pin.

Claims (2)

[Claims] 1. An integrated circuit test apparatus in which a socket is provided on an upper surface of a test board, and an integrated circuit under test mounted in the socket is electrically connected to a test apparatus via the test board. The socket has a plurality of connection conductors, one end of which is connected to a terminal of the test board and the other end of which is connected to a terminal of the integrated circuit. A plurality of first connection holes electrically connected to a conductor; a power supply conductor connected to a power supply terminal of the test board and provided on a side surface of the socket body; and a grounding of the test board. A grounding conductor connected to the power supply terminal and provided on the side surface of the socket body substantially parallel to the power supply conductor, and each grounding conductor connected to the power supply conductor and substantially parallel to the first connection hole. The salmon A plurality of second connection holes formed in a side surface portion of the socket body, and a plurality of second connection holes each connected to the grounding conductor and formed in a side surface portion of the socket body substantially parallel to the second connection hole. An integrated circuit testing device comprising: 3 connection holes; 2. A configuration in which a capacitor is connected between the power supply conductor and the grounding conductor via a connection terminal that can be inserted into the second connection hole and the third connection hole. Integrated circuit test equipment.